TW201930536A - Sealing agent for displays - Google Patents
Sealing agent for displays Download PDFInfo
- Publication number
- TW201930536A TW201930536A TW107140398A TW107140398A TW201930536A TW 201930536 A TW201930536 A TW 201930536A TW 107140398 A TW107140398 A TW 107140398A TW 107140398 A TW107140398 A TW 107140398A TW 201930536 A TW201930536 A TW 201930536A
- Authority
- TW
- Taiwan
- Prior art keywords
- component
- encapsulant
- display
- compound
- liquid crystal
- Prior art date
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- 238000007789 sealing Methods 0.000 title claims abstract description 24
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 66
- 150000001875 compounds Chemical class 0.000 claims abstract description 51
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 30
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 22
- 125000003118 aryl group Chemical group 0.000 claims abstract description 12
- -1 acrylic compound Chemical class 0.000 claims description 50
- 239000008393 encapsulating agent Substances 0.000 claims description 43
- 239000004593 Epoxy Substances 0.000 claims description 31
- 239000011256 inorganic filler Substances 0.000 claims description 13
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 13
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 10
- 239000003054 catalyst Substances 0.000 claims description 7
- 239000007870 radical polymerization initiator Substances 0.000 claims description 7
- 239000012766 organic filler Substances 0.000 claims description 6
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 239000003505 polymerization initiator Substances 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 5
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 238000011109 contamination Methods 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 8
- 238000012360 testing method Methods 0.000 abstract description 6
- 230000004044 response Effects 0.000 abstract description 2
- 230000006866 deterioration Effects 0.000 abstract 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 33
- 239000000565 sealant Substances 0.000 description 32
- 239000000758 substrate Substances 0.000 description 25
- 239000012948 isocyanate Substances 0.000 description 20
- 150000002513 isocyanates Chemical class 0.000 description 20
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 19
- 239000010419 fine particle Substances 0.000 description 15
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 14
- 239000011521 glass Substances 0.000 description 13
- 125000001424 substituent group Chemical group 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- 241000208340 Araliaceae Species 0.000 description 11
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 11
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 11
- 235000003140 Panax quinquefolius Nutrition 0.000 description 11
- 235000008434 ginseng Nutrition 0.000 description 11
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 10
- 239000003822 epoxy resin Substances 0.000 description 10
- 229920000647 polyepoxide Polymers 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 8
- 239000013638 trimer Substances 0.000 description 8
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 7
- 238000001723 curing Methods 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 230000009257 reactivity Effects 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 125000003917 carbamoyl group Chemical group [H]N([H])C(*)=O 0.000 description 6
- 125000005843 halogen group Chemical group 0.000 description 6
- 125000006850 spacer group Chemical group 0.000 description 6
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 5
- 239000003365 glass fiber Substances 0.000 description 5
- 230000009477 glass transition Effects 0.000 description 5
- 239000003112 inhibitor Substances 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- 239000004843 novolac epoxy resin Substances 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 238000010526 radical polymerization reaction Methods 0.000 description 5
- 150000003254 radicals Chemical class 0.000 description 5
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 4
- UUODQIKUTGWMPT-UHFFFAOYSA-N 2-fluoro-5-(trifluoromethyl)pyridine Chemical compound FC1=CC=C(C(F)(F)F)C=N1 UUODQIKUTGWMPT-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 125000004397 aminosulfonyl group Chemical group NS(=O)(=O)* 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 125000000623 heterocyclic group Chemical group 0.000 description 4
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 4
- 229940091173 hydantoin Drugs 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- CSFWPUWCSPOLJW-UHFFFAOYSA-N lawsone Chemical compound C1=CC=C2C(=O)C(O)=CC(=O)C2=C1 CSFWPUWCSPOLJW-UHFFFAOYSA-N 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 230000035699 permeability Effects 0.000 description 4
- 229960003742 phenol Drugs 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-L Malonate Chemical compound [O-]C(=O)CC([O-])=O OFOBLEOULBTSOW-UHFFFAOYSA-L 0.000 description 3
- 229930192627 Naphthoquinone Natural products 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 description 3
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 3
- 150000002460 imidazoles Chemical class 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 230000014759 maintenance of location Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 150000002791 naphthoquinones Chemical class 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 125000000018 nitroso group Chemical group N(=O)* 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 3
- 239000004848 polyfunctional curative Substances 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 239000004945 silicone rubber Substances 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 3
- 239000000454 talc Substances 0.000 description 3
- 229910052623 talc Inorganic materials 0.000 description 3
- DHBZRQXIRAEMRO-UHFFFAOYSA-N 1,1,2,2-tetramethylhydrazine Chemical compound CN(C)N(C)C DHBZRQXIRAEMRO-UHFFFAOYSA-N 0.000 description 2
- MFEWNFVBWPABCX-UHFFFAOYSA-N 1,1,2,2-tetraphenylethane-1,2-diol Chemical compound C=1C=CC=CC=1C(C(O)(C=1C=CC=CC=1)C=1C=CC=CC=1)(O)C1=CC=CC=C1 MFEWNFVBWPABCX-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- LQXUHZHVMDYBNA-UHFFFAOYSA-N 2-(2-prop-1-enoxyethyl)-3a,4,5,6,7,7a-hexahydroisoindole-1,3-dione Chemical compound C(=CC)OCCN1C(C2C(C1=O)CCCC2)=O LQXUHZHVMDYBNA-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- PTJWCLYPVFJWMP-UHFFFAOYSA-N 2-[[3-hydroxy-2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)COCC(CO)(CO)CO PTJWCLYPVFJWMP-UHFFFAOYSA-N 0.000 description 2
- OBGBGHKYJAOXRR-UHFFFAOYSA-N 2-methoxy-1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C(OC)=CC(=O)C2=C1 OBGBGHKYJAOXRR-UHFFFAOYSA-N 0.000 description 2
- LAQYHRQFABOIFD-UHFFFAOYSA-N 2-methoxyhydroquinone Chemical compound COC1=CC(O)=CC=C1O LAQYHRQFABOIFD-UHFFFAOYSA-N 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- LARNQUAWIRVQPK-UHFFFAOYSA-N 2-methyloxiran-2-amine Chemical compound NC1(CO1)C LARNQUAWIRVQPK-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 2
- RDFQSFOGKVZWKF-UHFFFAOYSA-N 3-hydroxy-2,2-dimethylpropanoic acid Chemical compound OCC(C)(C)C(O)=O RDFQSFOGKVZWKF-UHFFFAOYSA-N 0.000 description 2
- ALYNCZNDIQEVRV-UHFFFAOYSA-N 4-aminobenzoic acid Chemical compound NC1=CC=C(C(O)=O)C=C1 ALYNCZNDIQEVRV-UHFFFAOYSA-N 0.000 description 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- CSGQJHQYWJLPKY-UHFFFAOYSA-N CITRAZINIC ACID Chemical compound OC(=O)C=1C=C(O)NC(=O)C=1 CSGQJHQYWJLPKY-UHFFFAOYSA-N 0.000 description 2
- GUUVPOWQJOLRAS-UHFFFAOYSA-N Diphenyl disulfide Chemical compound C=1C=CC=CC=1SSC1=CC=CC=C1 GUUVPOWQJOLRAS-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- MJVAVZPDRWSRRC-UHFFFAOYSA-N Menadione Chemical compound C1=CC=C2C(=O)C(C)=CC(=O)C2=C1 MJVAVZPDRWSRRC-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical group C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 2
- 229920000800 acrylic rubber Polymers 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
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- 239000002131 composite material Substances 0.000 description 2
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- 229930003836 cresol Natural products 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 125000004386 diacrylate group Chemical group 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 150000004678 hydrides Chemical class 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-L isophthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC(C([O-])=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-L 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
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- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 235000010292 orthophenyl phenol Nutrition 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
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- 238000003825 pressing Methods 0.000 description 2
- 125000003226 pyrazolyl group Chemical group 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- NOBYOEQUFMGXBP-UHFFFAOYSA-N (4-tert-butylcyclohexyl) (4-tert-butylcyclohexyl)oxycarbonyloxy carbonate Chemical compound C1CC(C(C)(C)C)CCC1OC(=O)OOC(=O)OC1CCC(C(C)(C)C)CC1 NOBYOEQUFMGXBP-UHFFFAOYSA-N 0.000 description 1
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 1
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 description 1
- UGUHFDPGDQDVGX-UHFFFAOYSA-N 1,2,3-thiadiazole Chemical group C1=CSN=N1 UGUHFDPGDQDVGX-UHFFFAOYSA-N 0.000 description 1
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 description 1
- XZKLXPPYISZJCV-UHFFFAOYSA-N 1-benzyl-2-phenylimidazole Chemical compound C1=CN=C(C=2C=CC=CC=2)N1CC1=CC=CC=C1 XZKLXPPYISZJCV-UHFFFAOYSA-N 0.000 description 1
- LAGBNUOYSZDXFB-UHFFFAOYSA-N 1-hydroxy-2,2,6,6-tetramethyl-4-phenoxypiperidine Chemical compound C1C(C)(C)N(O)C(C)(C)CC1OC1=CC=CC=C1 LAGBNUOYSZDXFB-UHFFFAOYSA-N 0.000 description 1
- CSGAUKGQUCHWDP-UHFFFAOYSA-N 1-hydroxy-2,2,6,6-tetramethylpiperidin-4-ol Chemical compound CC1(C)CC(O)CC(C)(C)N1O CSGAUKGQUCHWDP-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- RVWUHFFPEOKYLB-UHFFFAOYSA-N 2,2,6,6-tetramethyl-1-oxidopiperidin-1-ium Chemical compound CC1(C)CCCC(C)(C)[NH+]1[O-] RVWUHFFPEOKYLB-UHFFFAOYSA-N 0.000 description 1
- GHPDWAAGDJPBLL-UHFFFAOYSA-N 2,3-dihydroxybutanedioic acid;hydrazine Chemical compound NN.OC(=O)C(O)C(O)C(O)=O GHPDWAAGDJPBLL-UHFFFAOYSA-N 0.000 description 1
- BVUXDWXKPROUDO-UHFFFAOYSA-N 2,6-di-tert-butyl-4-ethylphenol Chemical compound CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 BVUXDWXKPROUDO-UHFFFAOYSA-N 0.000 description 1
- SKHBJDDIGYYYMJ-UHFFFAOYSA-N 2,6-ditert-butyl-6-methylcyclohexa-1,3-dien-1-ol Chemical compound CC(C)(C)C1=C(O)C(C)(C(C)(C)C)CC=C1 SKHBJDDIGYYYMJ-UHFFFAOYSA-N 0.000 description 1
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- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
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- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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Abstract
Description
本發明係有關一種顯示器用密封劑,其因熱所致之反應快速,通過步驟對液晶之汙染性極低,且對定向膜等有機膜之接著性亦為優異,並且由耐濕可靠性試驗所致之性能劣化少。 The invention relates to a sealant for a display, which has a fast response due to heat, has extremely low pollution to liquid crystals through steps, and has excellent adhesion to an organic film such as an alignment film. The resulting degradation is small.
顯示器用密封劑係可列舉例如:液晶顯示器用封裝劑、有機EL顯示器用封裝劑及觸控面板用接著劑等。該等材料之共同點在於:具有優異之硬化性,且不論黏附體為何均具有高接著性,並且必須具有優異之耐濕熱可靠性。 Examples of the display sealant system include a sealant for a liquid crystal display, a sealant for an organic EL display, and an adhesive for a touch panel. What these materials have in common is that they have excellent hardenability, high adhesion regardless of the adherend, and must have excellent humidity and heat resistance.
例如以液晶密封劑為例進行以下說明。 For example, a liquid crystal sealant will be described below.
近年來,隨著液晶顯示元件之小型化,會由於液晶顯示元件的陣列基板的金屬配線部分及濾色器基板的黑矩陣部分,而在液晶密封劑形成照不到光的遮光部,使得封裝處附近之顯示不良的問題較以往更為嚴重。亦即,由於遮光部的存在,使得藉由光進行的一次硬化變得不充分,而在液晶密封劑中殘留較多未硬化成分。在此狀態下,若藉由加熱進行二次硬化步驟,會因為加熱而導致促進該未硬 化成分溶解至液晶中的結果,而引起封裝處附近的顯示不良。 In recent years, with the miniaturization of liquid crystal display elements, the metal wiring portion of the array substrate of the liquid crystal display element and the black matrix portion of the color filter substrate will form a light-shielding portion in the liquid crystal sealant that does not illuminate the light, making the package The problem of poor display around is more serious than ever. That is, due to the presence of the light-shielding portion, the primary hardening by light becomes insufficient, and many unhardened components remain in the liquid crystal sealant. In this state, if the secondary hardening step is performed by heating, the dissolution of the unhardened component into the liquid crystal will be promoted by the heating, which will cause display failure near the package.
為了解決該課題,對改善熱反應性進行各種檢討。而有嘗試是在上述遮光部中,使沒有因為光而充分硬化的液晶密封劑由低溫迅速地反應,以抑制液晶汙染。例如在專利文獻1、2中揭示使用熱自由基起始劑之方法。而且,在專利文獻3至5中揭示使用多元羧酸作為硬化促進劑之方法。 In order to solve this problem, various reviews have been made to improve thermal reactivity. In the light-shielding portion, an attempt has been made to rapidly react a liquid crystal sealant that has not been sufficiently hardened by light at a low temperature to suppress liquid crystal contamination. For example, Patent Documents 1 and 2 disclose a method using a thermal radical initiator. Furthermore, Patent Documents 3 to 5 disclose methods using a polycarboxylic acid as a hardening accelerator.
但是,該等方法雖然提升熱反應性,但所使用之熱自由基起始劑和硬化促進劑本身會溶出至液晶,而有引起顯示不良之問題。而且,在使用羧酸作為硬化促進劑時,沒有參與硬化系之羧酸會以原本狀態殘留,致使產生耐濕可靠性降低之問題。 However, although these methods improve thermal reactivity, the thermal radical initiator and hardening accelerator used will elute to the liquid crystal and cause a problem of poor display. Moreover, when a carboxylic acid is used as a hardening accelerator, the carboxylic acid which has not participated in the hardening system remains in its original state, causing a problem that the moisture resistance reliability is lowered.
另外,近年來由於液晶面板的邊框變窄,液晶密封劑被描繪在定向膜上之情形變多,而會由於液晶密封劑與定向膜之間的接著性差而產生液晶面板剝離的問題。以往所使用之摩擦處理式的定向膜係有如由於在摩擦處理時產生的摩擦而產生異物、液晶定向不均的問題,而在近年來正由摩擦處理式的定向膜往光定向處理式的定向膜進行變更,然而,光定向處理式的定向膜與液晶密封劑之接著性通常較弱,而液晶面板剝離的問題更為明顯。 In addition, in recent years, as the bezel of a liquid crystal panel is narrowed, a liquid crystal sealant is often drawn on an alignment film, and a problem of peeling of the liquid crystal panel may occur due to poor adhesion between the liquid crystal sealant and the alignment film. The conventionally used rubbing-type alignment film has problems such as foreign matter and uneven orientation of liquid crystal due to friction generated during the rubbing treatment. In recent years, the rubbing-type alignment film has been oriented toward the light-alignment type. The film is changed. However, the adhesion between the light-alignment-type alignment film and the liquid crystal sealant is usually weak, and the problem of peeling of the liquid crystal panel is more obvious.
為了解決液晶密封劑與定向膜之接著性的課題,係有各種技術提案。例如:在專利文獻6提出一種不使用無機填充劑的密封劑,惟並未提及光定向處理式的定向膜。在 專利文獻7中提出一種密封材,係含有:1分子中具有3個以上環氧基的脂肪族環氧化合物等者,惟並未提及光定向處理式的定向膜。 In order to solve the problem of adhesiveness between a liquid crystal sealant and an alignment film, various technical proposals have been made. For example, Patent Document 6 proposes a sealant that does not use an inorganic filler, but does not mention a photo-alignment-oriented alignment film. Patent Document 7 proposes a sealing material containing an aliphatic epoxy compound having three or more epoxy groups in one molecule, but does not mention an alignment film of a photo-alignment type.
上述硬化性、耐濕可靠性、對不同黏附體的接著性之課題,並不限於液晶密封劑,而是被認之為顯示器用封裝劑之課題。 The problems of the above-mentioned hardenability, moisture resistance reliability, and adhesiveness to different adherends are not limited to liquid crystal sealants, but are considered to be problems of encapsulants for displays.
[專利文獻1]日本特開2004-126211號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2004-126211
[專利文獻2]日本特開2009-8754號公報 [Patent Document 2] Japanese Patent Laid-Open No. 2009-8754
[專利文獻3]國際公開2007/138870 [Patent Document 3] International Publication 2007/138870
[專利文獻4]日本特開2008-15155號公報 [Patent Document 4] Japanese Patent Laid-Open No. 2008-15155
[專利文獻5]日本特開2009-139922號公報 [Patent Document 5] Japanese Patent Laid-Open No. 2009-139922
[專利文獻6]日本特開2010-85712號公報 [Patent Document 6] Japanese Patent Laid-Open No. 2010-85712
[專利文獻7]日本特開2010-170069號公報 [Patent Document 7] Japanese Patent Laid-Open No. 2010-170069
本發明提出一種顯示器用封裝劑,係因熱所致之反應快速,通過步驟對液晶之汙染性極低,且對定向膜等有機膜之接著性亦為優異,並且由耐濕可靠性試驗所致之性能劣化少者。 The present invention provides a display encapsulant, which is fast in response to heat, has extremely low pollution to liquid crystals through steps, and has excellent adhesion to an organic film such as an alignment film. Caused by less performance degradation.
本發明者等專心致志進行檢討之結果,發現 一種含有分子內具有與芳香環鍵結之羧基的化合物之顯示器用封裝劑,其熱反應性優異,而其結果為可抑制液晶汙染性,且接著性及耐濕熱可靠性亦為優異,遂而完成本發明。 As a result of intensive review by the inventors, it was found that a sealing agent for a display containing a compound having a carboxyl group bonded to an aromatic ring in the molecule is excellent in thermal reactivity, and as a result, the liquid crystal contamination can be suppressed, and adhesion And the humidity and heat resistance is also excellent, and the present invention has been completed.
而且,本說明書中的「(甲基)丙烯酸」係「丙烯酸」及/或「甲基丙烯酸」之意。 In addition, "(meth) acrylic acid" in this specification means "acrylic acid" and / or "methacrylic acid."
亦即,本發明係有關下述者:[1]一種顯示器用封裝劑,係含有成分(A)及成分(B),該成分(A)為分子內具有與芳香環鍵結之羧基的化合物,該成分(B)為硬化性化合物;[2]如上述[1]所述之顯示器用封裝劑,其中,上述成分(A)為更具有羧基、羥基、氫硫基之化合物;[3]如上述[1]或[2]所述之顯示器用封裝劑,其中,上述成分(B)為成分(B-1)(甲基)丙烯酸化合物;[4]如上述[1]至[3]中任一項所述之顯示器用封裝劑,其中,上述成分(B)為成分(B-1)與成分(B-2)之混合物,該成分(B-1)為(甲基)丙烯酸化合物,該成分(B-2)為環氧化合物;[5]如上述[1]至[4]中任一項所述之顯示器用封裝劑,更含有成分(C),該成分(C)為有機填料;[6]如上述[1]至[5]中任一項所述之顯示器用封裝劑,更含有成分(D),該成分(D)為無機填料;[7]如上述[1]至[6]中任一項所述之顯示器用封裝劑,更含有成分(E),該成分(E)為矽烷偶合劑;[8]如上述[1]至[7]中任一項所述之顯示器用封裝劑,更含 有成分(F),該成分(F)為熱硬化觸媒;[9]如上述[8]所述之顯示器用封裝劑,其中,上述成分(F)為咪唑化合物;[10]如上述[1]至[9]中任一項所述之顯示器用封裝劑,更含有成分(G),該成分(G)為光自由基聚合起始劑;[11]如上述[1]至[10]中任一項所述之顯示器用封裝劑,更含有成分(H),該成分(H)為熱自由基聚合起始劑;[12]一種液晶顯示器,係由[1]至[11]中任一項所述之顯示器用封裝劑所密封。 That is, the present invention relates to the following: [1] An encapsulant for a display, which contains a component (A) and a component (B), and the component (A) is a compound having a carboxyl group bonded to an aromatic ring in the molecule. This component (B) is a hardening compound; [2] The encapsulant for a display as described in [1] above, wherein the component (A) is a compound having a carboxyl group, a hydroxyl group, and a hydrogen sulfide group; [3] The encapsulant for a display according to the above [1] or [2], wherein the component (B) is the component (B-1) (meth) acrylic compound; [4] as described in the above [1] to [3] The encapsulant for a display according to any one of the above, wherein the component (B) is a mixture of the component (B-1) and the component (B-2), and the component (B-1) is a (meth) acrylic compound [5] The component (B-2) is an epoxy compound; [5] The encapsulant for a display according to any one of [1] to [4] above, further containing a component (C), and the component (C) is Organic filler; [6] The encapsulant for a display according to any one of [1] to [5], further comprising a component (D), which is an inorganic filler; [7] as described in [1] ] The encapsulant for a display according to any one of [6], further containing component (E), which (E) is a silane coupling agent; [8] The encapsulant for a display according to any one of [1] to [7] above, further comprising a component (F), which is a thermosetting catalyst [9] The packaging agent for a display according to the above [8], wherein the component (F) is an imidazole compound; [10] The packaging for a display according to any one of the above [1] to [9] The agent further contains a component (G), which is a photoradical polymerization initiator; [11] The encapsulant for a display according to any one of [1] to [10] above, further containing a component (H), the component (H) is a thermal radical polymerization initiator; [12] a liquid crystal display, which is sealed with a sealing agent for a display according to any one of [1] to [11].
本發明之顯示器用封裝劑係在熱硬化時之反應速度快速,因此即使在難以照到光的配線下亦具有充分的硬化性,因而可以確保面板的配線設計的自由度,可容易地製造高可靠性的顯示面板。此外,由於對於不同黏附體的接著性及耐濕熱可靠性也優異,因此亦為有助於顯示器的長期可靠性者。 The encapsulant for a display of the present invention has a fast reaction speed during heat curing, and therefore has sufficient hardening even under wiring that is difficult to illuminate light. Therefore, it is possible to ensure the degree of freedom in wiring design of the panel and easily manufacture high Reliable display panel. In addition, since it has excellent adhesion to different adherends and high humidity and heat resistance, it also contributes to the long-term reliability of the display.
本發明之顯示器用封裝劑係含有(A)分子內具有與芳香環鍵結之羧基的化合物(以下亦簡稱為「成分(A)」)。因為該化合物與環氧基會快速地反應,因此不是作為硬化促 進劑發揮作用,而是作為硬化劑發揮作用。因此,羧基不會殘留在反應系中,並且不會對耐濕可靠性造成不良影響。而且,由於其反應性高,硬化物之交聯密度高且耐熱性優異,因此長期可靠性優異。 The encapsulant for a display of the present invention contains (A) a compound having a carboxyl group bonded to an aromatic ring in the molecule (hereinafter also simply referred to as "component (A)"). Since this compound reacts quickly with an epoxy group, it does not function as a hardening accelerator, but functions as a hardener. Therefore, the carboxyl group does not remain in the reaction system and does not adversely affect the humidity resistance reliability. In addition, because of its high reactivity, the crosslinked density of the cured product is high, and its heat resistance is excellent, so it has excellent long-term reliability.
而且,當與適當的硬化觸媒合併使用時,亦會與丙烯酸基反應。藉此,可使在配線遮光下無法光硬化的丙烯酸成分熱硬化,並成為耐液晶汙染性優異的封裝劑。 Moreover, when used in combination with a suitable hardening catalyst, it will also react with acrylic groups. Thereby, an acrylic component which cannot be light-cured under the light-shielding of the wiring can be thermally cured, and an encapsulant having excellent resistance to liquid crystal contamination can be obtained.
對於成分(A),係指羧基直接與芳香環鍵結者。此處,芳香環係指苯環、萘環、蒽環、菲環等,或噻吩環、呋喃環、吡咯環、噻唑環、唑環、吡唑環、咪唑環、異噻唑環、異唑環、吡唑環、噻二唑環、二唑環、三唑環、吡啶環、嗒環、嘧啶環以及吡環等雜環。從反應性之觀點來看,芳香環係以苯環為佳。 Component (A) means a group in which a carboxyl group is directly bonded to an aromatic ring. Here, the aromatic ring means a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, or the like, or a thiophene ring, a furan ring, a pyrrole ring, a thiazole ring, Azole ring, pyrazole ring, imidazole ring, isothiazole ring, iso Azole ring, pyrazole ring, thiadiazole ring, Diazole ring, triazole ring, pyridine ring, da Ring, pyrimidine ring, and pyridine Rings and other heterocyclic rings. From the viewpoint of reactivity, the aromatic ring system is preferably a benzene ring.
而且,該芳香環可具有上述羧基以外的取代基。該取代基可列舉例如:鹵原子、其他的羧基、胺甲醯基、磺基、胺磺醯基、羥基、氫硫基、胺基、氰基、二氧磷基、膦基、膦基氧基、膦基胺基、硝基、矽基、醯基、C1至C6烷基(可經1個或2個以上之選自鹵原子、羥基、羧基、胺甲醯基、磺基以及胺磺醯基的取代基取代)、C1至C6烷氧基(可經1個或2個以上之選自鹵原子、羥基、羧基、胺甲醯基、磺基以及胺磺醯基的取代基取代)、C1至C6磺基烷基(可經1個或2個以上之選自鹵原子、羥基、羧基、胺甲醯基、磺基以及胺磺醯基的取代基取代)、C1至C6烷基硫基(可經1個或2個以上之選自鹵原子、羥基、羧基、胺甲醯基、磺 基以及胺磺醯基的取代基取代)、C1至C6烷基胺基(可經1個或2個以上之選自鹵原子、羥基、羧基、胺甲醯基、磺基以及胺磺醯基的取代基取代)、或醯基胺基、芳基氧基、雜環基、雜環基氧基、芳基硫基、雜環基硫基、芳基胺基、雜環基胺基、芳基磺醯基、雜環基磺醯基等。 The aromatic ring may have a substituent other than the carboxyl group. Examples of the substituent include a halogen atom, another carboxyl group, a carbamoyl group, a sulfo group, an aminesulfonyl group, a hydroxyl group, a hydrogen thio group, an amine group, a cyano group, a dioxo group, a phosphine group, and a phosphino group Group, phosphinoamino group, nitro group, silyl group, fluorenyl group, C1 to C6 alkyl group (may be selected from one or more than one halogen atom, hydroxyl group, carboxyl group, carbamoyl group, sulfo group, and sulfamo group Fluorenyl substituents), C1 to C6 alkoxy (can be substituted with 1 or 2 or more substituents selected from halogen atom, hydroxyl, carboxyl, carbamoyl, sulfo, and sulfamoyl) C1 to C6 sulfoalkyl (may be substituted by 1 or 2 or more substituents selected from halogen atom, hydroxyl, carboxyl, carbamoyl, sulfo and sulfamoyl), C1 to C6 alkyl Thio (can be substituted with one or more substituents selected from halogen atom, hydroxyl, carboxyl, carbamoyl, sulfo, and sulfamoyl), C1 to C6 alkylamino (can be substituted by 1 2 or more substituents selected from halogen atom, hydroxyl group, carboxyl group, carbamoyl group, sulfo group, and sulfamoyl group), or fluorenylamino group, aryloxy group, heterocyclic group, heterocyclic ring Aryloxy, arylsulfur , A heterocyclic thio group, an aryl group, a heterocyclic amino group, a sulfo group aryl acyl, a heterocyclic acyl group sulfo and the like.
該等取代基之中,以具有羧基、羥基、氫硫基之情況為佳,以該等取代基與芳香族直接鍵結者為更佳。此係因為該等取代基會與環氧基(在某些情況亦與(甲基)丙烯酸基)反應,而能夠提高硬化物的交聯密度之故。而且,從保存安定性之觀點來看,以羥基為佳。 Among these substituents, those having a carboxyl group, a hydroxyl group, and a hydrogenthio group are more preferable, and those in which these substituents are directly bonded to an aromatic group are more preferable. This is because these substituents can react with an epoxy group (and in some cases, a (meth) acrylic group), thereby increasing the crosslinking density of the hardened material. Furthermore, from the viewpoint of storage stability, a hydroxyl group is preferred.
羧基以外的取代基為1個時,其取代位置係以羧基的鄰位或對位為佳,以對位為更佳。羧基以外的取代基為2個時,其取代位置係以2,4-位為佳。特佳係羧基以外的取代基為1個取代基,且其取代位置為對位。 When there is only one substituent other than the carboxyl group, the substitution position is preferably the ortho or para position of the carboxyl group, and more preferably the para position. When there are two substituents other than the carboxyl group, the substitution position is preferably at the 2,4-position. The substituent other than the carboxyl group is particularly preferably one substituent, and its substitution position is para.
另外,本發明之顯示器用封裝劑中,就成分(A)之調配量而言,一般係顯示器用封裝劑之總量中的0.1至20質量%,以0.1至10質量%為佳,以0.5至5質量%為特佳。 In addition, in the encapsulant for a display of the present invention, the compounding amount of the component (A) is generally 0.1 to 20% by mass, preferably 0.1 to 10% by mass, and 0.5 It is particularly good to 5 mass%.
成分(A)可例示表1所示之化合物。 Examples of the component (A) include the compounds shown in Table 1.
本發明之顯示器用封裝劑係含有作為成分(B)之硬化性化合物(以下亦簡稱為「成分(B)」)。 The sealing compound for a display of the present invention contains a curable compound (hereinafter also simply referred to as "component (B)") as a component (B).
成分(B)如為藉由光或熱等而硬化之化合物,即無特別限定,惟以成分(B-1)(甲基)丙烯酸化合物(以下亦簡稱為「成分(B-1)」)的情況為佳。 The component (B) is not particularly limited as long as it is a compound that is hardened by light or heat, but the component (B-1) (meth) acrylic compound (hereinafter also referred to as "component (B-1)") The situation is better.
此處,「(甲基)丙烯酸」係「丙烯酸」及/或「甲基丙烯酸」之意(以下亦同理)。成分(B-1)可列舉例如:(甲基)丙烯酸酯化合物、(甲基)丙烯酸環氧酯化合物等。 Here, "(meth) acrylic acid" means "acrylic acid" and / or "methacrylic acid" (the same shall apply hereinafter). Examples of the component (B-1) include (meth) acrylate compounds and (meth) acrylate epoxy compounds.
(甲基)丙烯酸酯化合物之具體例可列舉如:N-丙烯醯基氧基乙基六氫鄰苯二甲醯亞胺、丙烯醯基嗎啉、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、環己烷-1,4-二甲醇單(甲基)丙烯酸酯、(甲基)丙烯酸四氫糠酯、(甲基)丙烯酸苯氧基乙酯、(甲基)丙烯酸苯基聚乙氧酯、(甲基)丙烯酸2-羥基-3-苯基氧基丙酯、鄰苯基酚單乙氧基(甲基)丙烯酸酯、鄰苯基酚聚乙氧基(甲基)丙烯酸酯、(甲基)丙烯酸對異丙苯基苯氧基乙酯、(甲基)丙烯酸異莰酯、(甲基)丙烯酸三溴苯基氧基乙酯、(甲基)丙烯酸二環戊酯、(甲基)丙烯酸二環戊烯酯、(甲基)丙烯酸二環戊烯基氧基乙酯、1,4-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、三環癸烷二甲醇(甲基)丙烯酸酯、雙酚A聚乙氧基二(甲基)丙烯酸酯、雙酚A聚丙氧基二(甲基)丙烯酸酯、雙酚F聚乙氧基二(甲基)丙烯酸酯、乙二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、參(丙烯醯氧基乙基)三聚異氰酸酯、新戊四醇四(甲基)丙烯酸酯、二新戊四醇六(甲基)丙烯酸酯、二新戊四醇五(甲基)丙烯酸酯、三新戊四醇六(甲基)丙烯酸酯、三新戊四醇五(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、三羥甲基丙烷聚乙氧基三(甲基)丙烯酸酯、雙三羥甲基丙烷四(甲基)丙烯酸酯、新戊二醇與羥基三甲基乙酸之酯二丙烯酸酯及新戊二醇與羥基三甲基乙酸之酯的ε-己內酯加成物之二丙烯酸酯等單體類。較佳者係可列舉如:N-丙烯醯基氧 基乙基六氫鄰苯二甲醯亞胺、(甲基)丙烯酸苯氧基乙酯、(甲基)丙烯酸二環戊烯基氧基乙酯。 Specific examples of the (meth) acrylate compound include N-propenyloxyethylhexahydrophthalimide, propenylmorpholine, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, cyclohexane-1,4-dimethanol mono (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, phenoxyethyl (meth) acrylate, Phenyl polyethoxylate (meth) acrylate, 2-hydroxy-3-phenyloxypropyl (meth) acrylate, o-phenylphenol monoethoxy (meth) acrylate, o-phenylphenol poly Ethoxy (meth) acrylate, p-cumylphenoxyethyl (meth) acrylate, isoamyl (meth) acrylate, tribromophenyloxyethyl (meth) acrylate, ( Dicyclopentyl methacrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, tricyclodecanedimethanol (meth) acrylate, bisphenol A polyethoxy Di (meth) acrylate, bisphenol A polypropoxy di (meth) acrylate, bisphenol F polyethylene Di (meth) acrylate, ethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, ginsyl (propyleneoxyethyl) trimeric isocyanate, neopentyl tetraol (Meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol penta (meth) acrylate, tripentaerythritol hexa (meth) acrylate, tripentaerythritol Alcohol penta (meth) acrylate, trimethylolpropane tri (meth) acrylate, trimethylolpropane polyethoxytri (meth) acrylate, bistrimethylolpropane tetra (methyl) Monomers such as acrylic acid esters, diacrylates of neopentyl glycol and hydroxytrimethylacetate, and diacrylates of ε-caprolactone adducts of neopentyl glycol and hydroxytrimethylacetate. Preferred examples include N-propenyloxyethylhexahydrophthalimide, phenoxyethyl (meth) acrylate, and dicyclopentenyloxy (meth) acrylate. Ethyl ester.
(甲基)丙烯酸環氧酯化合物係可藉由環氧化合物與(甲基)丙烯酸之反應並通過習知方法而得。成為原料之環氧化合物並無特別限定,惟以2官能以上之環氧化合物為佳,可列舉例如:間苯二酚二環氧丙基醚、雙酚A型環氧化合物、雙酚F型環氧化合物、雙酚S型環氧化合物、酚酚醛清漆型環氧化合物、甲酚酚醛清漆型環氧化合物、雙酚A酚醛清漆型環氧化合物、雙酚F酚醛清漆型環氧化合物、脂環式環氧化合物、脂肪族鏈狀環氧化合物、環氧丙基酯型環氧化合物、環氧丙基胺型環氧化合物、乙內醯脲型環氧化合物、三聚異氰酸酯型環氧化合物、具有三酚甲烷骨架之酚酚醛清漆型環氧化合物、其他如兒茶酚(catechol)、間苯二酚等二官能酚類之二環氧丙基醚化物、二官能醇類之二環氧丙基醚化物及該等之鹵化物、氫化物等。此等化合物之中,從液晶汙染性之觀點來看,以雙酚A型環氧化合物、間苯二酚二環氧丙基醚為佳。而且,環氧基與(甲基)丙烯醯基之比率並無限定,能夠由工程適用性之觀點來適當地選擇。又,可適合使用部分的環氧基經丙烯酸酯化之部分(甲基)丙烯酸環氧酯。此時之丙烯酸化的比例係以30至70%左右為佳。 The (meth) acrylic epoxy ester compound can be obtained by a conventional method by reacting an epoxy compound with (meth) acrylic acid. The epoxy compound used as a raw material is not particularly limited, but an epoxy compound having two or more functions is preferred, and examples thereof include resorcinol diglycidyl ether, bisphenol A type epoxy compound, and bisphenol F type Epoxy compounds, bisphenol S epoxy compounds, phenol novolac epoxy compounds, cresol novolac epoxy compounds, bisphenol A novolac epoxy compounds, bisphenol F novolac epoxy compounds, grease Cyclic epoxy compounds, aliphatic chain epoxy compounds, epoxypropyl ester epoxy compounds, epoxypropylamine epoxy compounds, hydantoin epoxy compounds, trimeric isocyanate epoxy compounds Phenol novolak epoxy compounds with a triphenol methane skeleton, other difunctional propyl ethers of difunctional phenols such as catechol, resorcinol, etc., and diepoxys of difunctional alcohols Propyl etherate and halides, hydrides and the like. Among these compounds, a bisphenol A epoxy compound and resorcinol diglycidyl ether are preferred from the viewpoint of liquid crystal contamination. The ratio of the epoxy group to the (meth) acrylfluorenyl group is not limited, and can be appropriately selected from the viewpoint of engineering applicability. In addition, a partially methacrylated (meth) acrylic epoxy ester can be suitably used. The proportion of acrylated at this time is preferably about 30 to 70%.
成分(B-1)可單獨使用,亦可混合2種以上。本發明之顯示器用封裝劑中使用成分(B-1)時,其於顯示器用封裝劑總量中一般係5至50質量%,以5至30質量%為佳。 The component (B-1) may be used alone or as a mixture of two or more. When the component (B-1) is used in the display encapsulant of the present invention, it is generally 5 to 50% by mass, and preferably 5 to 30% by mass in the total amount of the display encapsulant.
就本發明之樣態而言,以上述成分(B)中更含有成分(B-2)環氧化合物(以下亦簡稱為成分(B-2))的情況為更佳。 In the aspect of the present invention, it is more preferable that the above-mentioned component (B) further contains the component (B-2) epoxy compound (hereinafter also simply referred to as the component (B-2)).
環氧化合物並無特別限定,惟以2官能以上之環氧化合物為佳,可列舉例如:間苯二酚二環氧丙基醚、雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、酚酚醛清漆型環氧樹脂、甲酚酚醛清漆型環氧樹脂、雙酚A酚醛清漆型環氧樹脂、雙酚F酚醛清漆型環氧樹脂、脂環式環氧樹脂、脂肪族鏈狀環氧樹脂、環氧丙基酯型環氧樹脂、環氧丙基胺型環氧樹脂、乙內醯脲型環氧樹脂、三聚異氰酸酯型環氧樹脂、具有三酚甲烷骨架之酚酚醛清漆型環氧樹脂、其他如兒茶酚、間苯二酚等二官能酚類之二環氧丙基醚化物、二官能醇類之二環氧丙基醚化物,以及該等之鹵化物、氫化物等。從液晶汙染性之觀點來看,該等之中係以雙酚A型環氧樹脂、間苯二酚二環氧丙基醚為佳。 The epoxy compound is not particularly limited, but an epoxy compound having two or more functions is preferred, and examples thereof include resorcinol diglycidyl ether, bisphenol A type epoxy resin, and bisphenol F type epoxy resin. Bisphenol S epoxy resin, phenol novolac epoxy resin, cresol novolac epoxy resin, bisphenol A novolac epoxy resin, bisphenol F novolac epoxy resin, alicyclic ring Oxygen resin, aliphatic chain epoxy resin, epoxy propyl ester epoxy resin, epoxy propyl amine epoxy resin, hydantoin type epoxy resin, trimer isocyanate type epoxy resin, Phenol novolac epoxy resin of phenol methane skeleton, other difunctional phenol ethers of difunctional phenols such as catechol, resorcinol, etc. These halides, hydrides, etc. From the viewpoint of liquid crystal contamination, among these, bisphenol A type epoxy resin and resorcinol diglycidyl ether are preferred.
成分(B-2)可單獨使用,亦可混合2種以上。本發明之顯示器用封裝劑中,在使用成分(B-2)時,其於顯示器用封裝劑總量中一般係5至50質量%,以5至30質量%為佳。 The component (B-2) may be used alone or as a mixture of two or more. In the display sealing agent of the present invention, when the component (B-2) is used, it is generally 5 to 50% by mass, and preferably 5 to 30% by mass in the total amount of the display sealing agent.
此外,本發明之顯示器用封裝劑中,成分(B)之調配量一般為顯示器用封裝劑中的10至80質量%,以20至70質量%為佳。 In addition, in the encapsulant for a display of the present invention, the blending amount of the component (B) is generally 10 to 80% by mass, and preferably 20 to 70% by mass of the encapsulant for a display.
本發明之顯示器用封裝劑可含有作為成分(C)之有機填料(以下亦簡稱為「成分(C)」)。上述有機填料可列舉例如:胺甲酸乙酯微粒子、丙烯酸微粒子、苯乙烯微粒子、苯乙烯烯烴微粒子以及聚矽氧微粒子。而且,聚矽氧微粒子較佳為KMP-594、KMP-597、KMP-598(信越化學工業製造);Trefil RTME-5500、9701、EP-2001(Dow Corning Toray公司製造);胺甲酸乙酯微粒子較佳為JB-800T、HB-800BK(根上工業股份有限公司);苯乙烯微粒子較佳為RabalonRTMT320C、T331C、SJ4400、SJ5400、SJ6400、SJ4300C、SJ5300C、SJ6300C(三菱化學製造);苯乙烯烯烴微粒子較佳為SeptonRTMSEPS2004、SEPS2063。 The display sealing agent of the present invention may contain an organic filler (hereinafter also simply referred to as "component (C)") as the component (C). Examples of the organic filler include urethane fine particles, acrylic fine particles, styrene fine particles, styrene olefin fine particles, and polysiloxane fine particles. Further, the polysiloxane particles are preferably KMP-594, KMP-597, KMP-598 (made by Shin-Etsu Chemical Industry); Trefil RTM E-5500, 9701, EP-2001 (made by Dow Corning Toray); urethane The fine particles are preferably JB-800T, HB-800BK (Gensang Industrial Co., Ltd.); the styrene fine particles are preferably Rabalon RTM T320C, T331C, SJ4400, SJ5400, SJ6400, SJ4300C, SJ5300C, SJ6300C (manufactured by Mitsubishi Chemical); styrene The olefin fine particles are preferably Septon RTM SEPS2004 and SEPS2063.
該等有機填料可單獨使用,亦可併用2種以上。還可以使用2種以上作成核殼(core shell)結構。該等之中,較佳為丙烯酸微粒子、聚矽氧微粒子。 These organic fillers may be used alone or in combination of two or more. It is also possible to use two or more core shell structures. Among these, acrylic fine particles and polysiloxane fine particles are preferred.
在使用上述丙烯酸微粒子時,以包含2種丙烯酸橡膠之核殼結構的丙烯酸橡膠之情形為佳,以核層為丙烯酸正丁酯且殼層為甲基丙烯酸甲酯者為特佳。此係作為ZefiacRTMF-351而由Aica工業股份有限公司販售。 When the above-mentioned acrylic fine particles are used, an acrylic rubber having a core-shell structure containing two types of acrylic rubber is preferred, and a core layer of n-butyl acrylate and a shell layer of methyl methacrylate are particularly preferred. This is sold by Aica Industries Co., Ltd. as Zefiac RTM F-351.
而且,上述聚矽氧微粒子可列舉如:有機聚矽氧烷交聯物粉體、直鏈的二甲基聚矽氧烷交聯物粉體等。而且,複合聚矽氧橡膠可列舉如:在上述聚矽氧橡膠之表面被覆有聚矽氧樹脂(例如:聚有機矽倍半氧烷樹脂)者。該等微粒子之中,特佳者係直鏈的二甲基聚矽氧烷交聯粉末之聚 矽氧橡膠或被覆聚矽氧樹脂之直鏈二甲基聚矽氧烷交聯粉末的複合聚矽氧橡膠微粒子。該等微粒子可單獨使用,亦可併用2種以上。而且,較佳者係橡膠粉末的形狀以添加後之黏度的增黏少的球狀為佳。本發明之顯示器用封裝劑中使用成分(C)時,其在顯示器用封裝劑之總量中一般係5至50質量%,以5至40質量%為佳。 Examples of the polysiloxane fine particles include organic polysiloxane crosslinked powder, linear dimethyl polysiloxane crosslinked powder, and the like. In addition, examples of the composite silicone rubber include those in which a surface of the silicone rubber is coated with a silicone resin (for example, a polyorganosilicon silsesquioxane resin). Among these fine particles, particularly preferred is a silicone polymer of a linear dimethylpolysiloxane crosslinked powder or a composite polymer of a linear dimethylpolysiloxane crosslinked powder coated with a silicone resin. Particles of silicone rubber. These fine particles may be used alone or in combination of two or more. In addition, the shape of the rubber powder is preferably a spherical shape with little viscosity increase after the addition. When the component (C) is used in the display encapsulant of the present invention, it is generally 5 to 50% by mass, preferably 5 to 40% by mass, based on the total amount of the display encapsulant.
本發明之顯示器用封裝劑可含有作為成分(D)之無機填料(以下亦簡稱為「成分(D)」)。本發明所含的無機填料可列舉如:二氧化矽(silica)、碳化矽(silicon carbide)、氮化矽、氮化硼、碳酸鈣、碳酸鎂、硫酸鋇、硫酸鈣、雲母、滑石、黏土、氧化鋁、氧化鎂、氧化鋯、氫氧化鋁、氫氧化鎂、矽酸鈣、矽酸鋁、矽酸鋰鋁、矽酸鋯、鈦酸鋇、玻璃纖維、碳纖維、二硫化鉬、石棉等;較佳者係可列舉如:熔融二氧化矽、結晶二氧化矽、氮化矽、氮化硼、碳酸鈣、硫酸鋇、硫酸鈣、雲母、滑石、黏土、氧化鋁、氫氧化鋁、矽酸鈣、矽酸鋁;以二氧化矽、氧化鋁、滑石為佳。該等無機填料可以是將2種以上混合使用。 The sealing agent for a display of the present invention may contain an inorganic filler (hereinafter also simply referred to as "component (D)") as the component (D). Examples of the inorganic fillers included in the present invention include: silicon dioxide, silicon carbide, silicon nitride, boron nitride, calcium carbonate, magnesium carbonate, barium sulfate, calcium sulfate, mica, talc, clay , Aluminum oxide, magnesium oxide, zirconia, aluminum hydroxide, magnesium hydroxide, calcium silicate, aluminum silicate, lithium aluminum silicate, zirconium silicate, barium titanate, glass fiber, carbon fiber, molybdenum disulfide, asbestos, etc. ; The preferred ones can be listed as: fused silica, crystalline silica, silicon nitride, boron nitride, calcium carbonate, barium sulfate, calcium sulfate, mica, talc, clay, alumina, aluminum hydroxide, silicon Calcium acid, aluminum silicate; silicon dioxide, aluminum oxide and talc are preferred. These inorganic fillers may be used by mixing two or more kinds.
無機填料之平均粒徑若是過大,則在製造窄間隙(narrow gap)的液晶顯示單元時,會成為貼合上下玻璃基板時無法良好地形成間隙等的不良因素,故以2000nm以下為合適,以1000nm以下為佳,以300nm以下為更佳。而且,較佳的下限為10nm左右,以100nm左右為更佳。粒 徑可藉由雷射繞射/散射式粒度分佈測定器(乾式)(Seishin Enterprise公司製造;LMS-30)進行測定。 If the average particle diameter of the inorganic filler is too large, when manufacturing a narrow gap liquid crystal display unit, it will become a bad factor such as that the gap cannot be formed well when the upper and lower glass substrates are bonded. 1000 nm or less is preferable, and 300 nm or less is more preferable. The preferable lower limit is about 10 nm, and more preferably about 100 nm. The particle diameter can be measured with a laser diffraction / scattering type particle size distribution measuring device (dry type) (manufactured by Seishin Enterprise; LMS-30).
本發明之顯示器用封裝劑中使用無機填料時,在顯示器用封裝劑之總量中,無機填料一般係5至50質量%,以5至40質量%為佳。無機填料之含量低於5質量%時,由於對玻璃基板之接著強度低,且耐濕可靠性亦差,因此會有吸濕後之接著強度也大為降低之情形。而且,無機填料之含量多於50質量%時,由於無機填料之含量過多,而有變得難以塌陷且無法形成液晶單元之間隙的情形。 When an inorganic filler is used in the display encapsulant of the present invention, the inorganic filler is generally 5 to 50% by mass, and preferably 5 to 40% by mass in the total amount of the display encapsulant. When the content of the inorganic filler is less than 5% by mass, the adhesion strength to the glass substrate is low and the moisture resistance reliability is also poor. Therefore, the adhesion strength after moisture absorption may be greatly reduced. In addition, when the content of the inorganic filler is more than 50% by mass, the content of the inorganic filler may be excessive, and it may become difficult to collapse and the gap of the liquid crystal cell may not be formed.
本發明之顯示器用封裝劑可添加作為成分(E)之矽烷偶合劑(以下亦簡稱為「成分(E)」)以謀求接著強度及耐濕性之提升。 The display sealing agent of the present invention may be added with a silane coupling agent (hereinafter also simply referred to as "ingredient (E)") as the component (E) to improve the adhesion strength and moisture resistance.
成分(E)可列舉如:3-環氧丙氧基丙基三甲氧基矽烷、3-環氧丙氧基丙基甲基二甲氧基矽烷、3-環氧丙氧基丙基甲基二乙氧基矽烷、2-(3,4-環氧基環己基)乙基三甲氧基矽烷、N-苯基-γ-胺基丙基三甲氧基矽烷、N-(2-胺基乙基)-3-胺基丙基甲基二甲氧基矽烷、N-(2-胺基乙基)-3-胺基丙基甲基三甲氧基矽烷、3-胺基丙基三乙氧基矽烷、3-巰基丙基三甲氧基矽烷、乙烯基三甲氧基矽烷、N-(2-(乙烯基苄基胺基)乙基)3-胺基丙基三甲氧基矽烷鹽酸鹽、3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-氯丙基甲基二甲氧基矽烷、3-氯丙基三甲氧基矽烷等。該等矽烷偶合劑已作為KBM系 列、KBE系列等而由信越化學工業股份公司等販售,故可容易地從市面取得。本發明之顯示器用封裝劑中使用成分(E)時,其在顯示器用封裝劑之總量中係以0.05至3質量%為佳。 Examples of the component (E) include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, and 3-glycidoxypropylmethyl Diethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, N- (2-aminoethyl Group) -3-aminopropylmethyldimethoxysilane, N- (2-aminoethyl) -3-aminopropylmethyltrimethoxysilane, 3-aminopropyltriethoxy Silane, 3-mercaptopropyltrimethoxysilane, vinyltrimethoxysilane, N- (2- (vinylbenzylamino) ethyl) 3-aminopropyltrimethoxysilane hydrochloride, 3-methacryl methoxypropyltrimethoxysilane, 3-chloropropylmethyldimethoxysilane, 3-chloropropyltrimethoxysilane, and the like. These silane coupling agents have been sold by the Shin-Etsu Chemical Industry Co., Ltd. as KBM series, KBE series, etc., so they can be easily obtained from the market. When the component (E) is used in the display sealing agent of the present invention, it is preferably 0.05 to 3% by mass based on the total amount of the display sealing agent.
本發明之顯示器用封裝劑係可添加作為成分(F)之硬化觸媒(以下亦簡稱為「成分(F)」),以謀求反應性之提升。如上所述,成分(A)亦可藉由使用硬化觸媒而與丙烯酸基反應。因此,丙烯酸成分在未光硬化之情況下,係發揮特別重要的作用。 The display sealing agent of the present invention can be added with a hardening catalyst (hereinafter also simply referred to as "ingredient (F)") as a component (F) to improve the reactivity. As described above, the component (A) can also react with an acrylic group by using a hardening catalyst. Therefore, the acrylic component plays a particularly important role when it is not light-cured.
硬化觸媒可列舉胺類及咪唑類,而以咪唑類為特別合適。咪唑類可列舉如:2-甲基咪唑、2-苯基咪唑、2-十一基咪唑、2-十七基咪唑、2-苯基-4-甲基咪唑、1-苄基-2-苯基咪唑、1-苄基-2-甲基咪唑、1-氰基乙基-2-甲基咪唑、1-氰基乙基-2-苯基咪唑、1-氰基乙基-2-十一基咪唑、2,4-二胺基-6-(2'-甲基咪唑(1'))乙基-均三、2,4-二胺基-6-(2'-十一基咪唑(1'))乙基-均三、2,4-二胺基-6-(2'-乙基-4-甲基咪唑(1'))乙基-均三、2,4-二胺基-6-(2'-甲基咪唑基(1'))乙基-均三/三聚異氰酸加成物、2-甲基咪唑/三聚異氰酸之2:3加成物、2-苯基咪唑三聚異氰酸加成物、2-苯基-3,5-二羥基甲基咪唑、2-苯基-4-羥基甲基-5-甲基咪唑、1-氰基乙基-2-苯基-3,5-二氰基乙氧基甲基咪唑等。該等之中,較佳係2,4-二胺基-6-(2'-甲基咪唑基(1'))乙基-均三/三聚異氰酸 加成物。 Examples of the curing catalyst include amines and imidazoles, and imidazoles are particularly suitable. Examples of imidazoles include 2-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2- Phenyl imidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2- Undecyl imidazole, 2,4-diamino-6- (2'-methylimidazole (1 ')) ethyl-mesanthine , 2,4-diamino-6- (2'-undecylimidazole (1 ')) ethyl-mesanthine , 2,4-diamino-6- (2'-ethyl-4-methylimidazole (1 ')) ethyl-mesanthine , 2,4-diamino-6- (2'-methylimidazolyl (1 ')) ethyl-mesanthine / Trimeric isocyanate adduct, 2-methylimidazole / trimeric isocyanate 2: 3 adduct, 2-phenylimidazole trimeric isocyanate adduct, 2-phenyl-3, 5-dihydroxymethylimidazole, 2-phenyl-4-hydroxymethyl-5-methylimidazole, 1-cyanoethyl-2-phenyl-3,5-dicyanoethoxymethylimidazole Wait. Among these, 2,4-diamino-6- (2'-methylimidazolyl (1 ')) ethyl-mesantriol is preferred / Trimeric isocyanate adduct.
本發明之顯示器用封裝劑可含有作為成分(G)之光自由基聚合起始劑(以下亦簡稱為「成分(G)」)。光自由基聚合起始劑如為因照射紫外線或可見光產生自由基或酸而引發鏈聚合反應的化合物,則無特別限定,可列舉例如:苯甲基二甲基縮酮、1-羥基環己基苯基酮、二乙基硫雜蒽酮、二苯基酮、2-乙基蒽醌、2-羥基-2-甲基苯丙酮(2-hydroxy-2-methyl propiophenone)、2-甲基-[4-(甲基硫基)苯基]-2-嗎啉基-1-丙烷、2,4,6-三甲基苄醯基二苯基膦氧化物、樟腦醌(camphorquinone)、9-茀酮、二苯基二硫化物等。具體而言,可列舉如:IRGACURERTM 651、184、2959、127、907、369、379EG、819、784、754、500、OXE01、OXE02、DAROCURERTM 1173、LUCIRINRTM TPO(以上均為BASF公司製造);SEIKUOLRTM Z、BZ、BEE、BIP、BBI(以上均為精工化學股份有限公司製造)等。 The encapsulant for a display of the present invention may contain a photoradical polymerization initiator (hereinafter also simply referred to as "component (G)") as a component (G). The photoradical polymerization initiator is not particularly limited as long as it is a compound that initiates a chain polymerization reaction due to the generation of a radical or an acid by irradiation with ultraviolet or visible light, and examples thereof include benzyldimethylketal and 1-hydroxycyclohexyl Phenylketone, diethylthiaxanthone, diphenylketone, 2-ethylanthraquinone, 2-hydroxy-2-methyl propiophenone, 2-methyl- [4- (methylthio) phenyl] -2-morpholinyl-1-propane, 2,4,6-trimethylbenzylfluorenyldiphenylphosphine oxide, camphorquinone, 9- Fluorenone, diphenyl disulfide, etc. Specific examples include: IRGACURE RTM 651, 184, 2959, 127, 907, 369, 379EG, 819, 784, 754, 500, OXE01, OXE02, DAROCURE RTM 1173, LUCIRIN RTM TPO (all of which are manufactured by BASF Corporation) ); SEIKUOL RTM Z, BZ, BEE, BIP, BBI (the above are all manufactured by Seiko Chemical Co., Ltd.) and so on.
而且,從液晶汙染性之觀點來看,以使用分子內具有(甲基)丙烯酸基者為佳,例如可適合使用2-甲基丙烯醯基氧基乙基異氰酸酯與1-[4-(2-羥基乙氧基)-苯基]-2-羥基-2-甲基-1-丙烷-1-酮之反應生成物。該化合物可以國際公開第2006/027982號記載之方法製得。 From the viewpoint of liquid crystal contamination, it is preferable to use a (meth) acrylic group in the molecule. For example, 2-methacrylfluorenyloxyethyl isocyanate and 1- [4- (2 -Hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl-1-propane-1-one reaction product. This compound can be produced by the method described in International Publication No. 2006/027982.
本發明之顯示器用封裝劑中使用成分(G)時,在顯示器用封裝劑總量中一般係0.001至3質量%,以0.002至2質 量%為佳。 When the component (G) is used in the display encapsulant of the present invention, the total amount of the display encapsulant is generally 0.001 to 3% by mass, and preferably 0.002 to 2% by mass.
本發明之顯示器用封裝劑可含有(H)熱自由基聚合起始劑(以下亦簡稱為「成分(H)」),以提升硬化速度、硬化性。 The encapsulant for a display of the present invention may contain (H) a thermal radical polymerization initiator (hereinafter also referred to simply as "component (H)") to improve the curing speed and hardenability.
熱自由基聚合起始劑如為藉由加熱產生自由基而引發鏈聚合反應之化合物,則無特別限定,惟可列舉如:有機過氧化物、偶氮化合物、苯偶姻化合物、苯偶姻醚化合物、苯乙酮化合物、苯并頻哪醇(benzopinacol)等,而適合使用苯并頻哪醇。例如就有機過氧化物而言,可取得市售品如:KayamekRTM A、M、R、L、LH、SP-30C;Perkadox CH-50L、BC-FF;Kadox B-40ES;Perkadox 14;TrigonoxRTM 22-70E、23-C70、121、121-50E、121-LS50E、21-LS50E、42、42LS;KayaesterRTM P-70、TMPO-70、CND-C70、OO-50E、AN;KayabutylRTM B;Perkadox 16;KayacarbonRTM BIC-75、AIC-75(KAYAKU Akzo股份有限公司製造);PermekRTM N、H、S、F、D、G;PerhexaRTM H、HC、TMH、C、V、22、MC;PercureRTM AH、AL、HB;PerbutylRTM H、C、ND、L;PercumylRTM H、D;PeroylRTM IB、IPP;PeroctaRTM ND(日油股份有限公司製造)等。 The thermal radical polymerization initiator is not particularly limited as long as it is a compound that initiates a chain polymerization reaction by generating free radicals by heating, but examples thereof include organic peroxides, azo compounds, benzoin compounds, and benzoin Ether compounds, acetophenone compounds, benzopinacol and the like, and benzopinacol is suitably used. For example, for organic peroxides, commercially available products such as: Kayamek RTM A, M, R, L, LH, SP-30C; Perkadox CH-50L, BC-FF; Kadox B-40ES; Perkadox 14; Trigonox RTM 22-70E, 23-C70, 121, 121-50E, 121-LS50E, 21-LS50E, 42, 42LS; Kayaester RTM P-70, TMPO-70, CND-C70, OO-50E, AN; Kayabutyl RTM B ; Perkadox 16; Kayacarbon RTM BIC-75, AIC-75 (manufactured by KAYAKU Akzo Co., Ltd.); Permek RTM N, H, S, F, D, G; Perhexa RTM H, HC, TMH, C, V, 22, MC; Percure RTM AH, AL, HB; Perbutyl RTM H, C, ND, L; Percumyl RTM H, D; Peroyl RTM IB, IPP; Perocta RTM ND (manufactured by Nippon Oil Corporation) and the like.
而且,偶氮化合物可取得市售品如VA-044、086、V-070、VPE-0201、VSP-1001(和光純藥工業股份有限公司製造)等。 Furthermore, commercially available products such as VA-044, 086, V-070, VPE-0201, VSP-1001 (manufactured by Wako Pure Chemical Industries, Ltd.) and the like are available for the azo compound.
成分(H)之含量以本發明之顯示器用封裝劑總量中的0.0001至10質量%為佳,以0.0005至5質量%為更佳,以0.001至3質量%為特佳。 The content of the component (H) is preferably 0.0001 to 10% by mass, more preferably 0.0005 to 5% by mass, and particularly preferably 0.001 to 3% by mass in the total display encapsulant for display of the present invention.
本發明之顯示器用封裝劑中,可視所需而進一步調配自由基聚合抑制劑、成分(A)以外之熱硬化劑、顏料、調平劑、消泡劑、溶劑等添加劑。 In the sealing agent for a display of the present invention, additives such as a radical polymerization inhibitor, a thermosetting agent other than the component (A), a pigment, a leveling agent, an antifoaming agent, and a solvent may be further blended as necessary.
上述自由基聚合抑制劑如為與光自由基聚合起始劑或熱自由基聚合起始劑等產生之自由基進行反應而防止聚合的化合物,則無特別限定,可使用醌系、哌啶系、受阻酚系、亞硝基系等。具體上可列舉如:萘醌、2-羥基萘醌、2-甲基萘醌、2-甲氧基萘醌、2,2,6,6-四甲基哌啶-1-氧化物、2,2,6,6-四甲基-4-羥基哌啶-1-氧化物、2,2,6,6-四甲基-4-甲氧基哌啶-1-氧化物、2,2,6,6-四甲基-4-苯氧基哌啶-1-氧化物、氫醌、2-甲基氫醌、2-甲氧基氫醌、對苯醌、丁基羥基苯甲醚、2,6-二-三級丁基-4-乙基酚、2,6-二-三級丁基甲酚、硬脂基β-(3,5-二-三級丁基-4-羥基苯基)丙酸酯、2,2'-亞甲基雙(4-乙基-6-三級丁基酚)、4,4'-硫代雙(3-甲基-6-三級丁基酚)、4,4'-亞丁基雙(3-甲基-6-三級丁基酚)、3,9-雙[1,1-二甲基-2-[β-(3-三級丁基-4-羥基-5-甲基苯基)丙醯基氧基]乙基]-2,4,8,10-四氧雜螺[5,5]十一烷、肆-[亞甲基-3-(3',5'-二-三級丁基-4'-羥基苯基)丙酸酯]甲烷、1,3,5-參(3',5'-二-三級丁基-4'-羥基苄基)-二級三-2,4,6-(1H,3H,5H) 三酮、對甲氧基酚、4-甲氧基-1-萘酚、硫二苯胺、N-亞硝基苯基羥基胺之鋁鹽、商品名ADK STAB LA-81、商品名ADK STAB LA-82(Adeka股份有限公司製造)等,惟不僅限於該等。該等之中,以萘醌系、氫醌系、亞硝基系、哌系之自由基聚合抑制劑為佳,以萘醌、2-羥基萘醌、氫醌、2,6-二-三級丁基-對甲酚、Polystop 7300P(伯東股份有限公司製造)為更佳,以Polystop 7300P(伯東股份有限公司製造)為最佳。 The above-mentioned radical polymerization inhibitor is not particularly limited as long as it is a compound that reacts with a radical generated by a photoradical polymerization initiator or a thermal radical polymerization initiator to prevent polymerization, and a quinone-based or piperidine-based compound can be used. , Hindered phenols, nitrosos and so on. Specific examples include naphthoquinone, 2-hydroxynaphthoquinone, 2-methylnaphthoquinone, 2-methoxynaphthoquinone, 2,2,6,6-tetramethylpiperidine-1-oxide, 2 , 2,6,6-tetramethyl-4-hydroxypiperidine-1-oxide, 2,2,6,6-tetramethyl-4-methoxypiperidine-1-oxide, 2,2 , 6,6-tetramethyl-4-phenoxypiperidine-1-oxide, hydroquinone, 2-methylhydroquinone, 2-methoxyhydroquinone, p-benzoquinone, butylhydroxyanisole , 2,6-di-tertiary-butyl-4-ethylphenol, 2,6-di-tertiary-butylcresol, stearyl β- (3,5-di-tertiary-butyl-4-hydroxybenzene Propyl) propionate, 2,2'-methylenebis (4-ethyl-6-tert-butylphenol), 4,4'-thiobis (3-methyl-6-tert-butyl) Phenol), 4,4'-butylene bis (3-methyl-6-tertiary butylphenol), 3,9-bis [1,1-dimethyl-2- [β- (3-tertiary Butyl-4-hydroxy-5-methylphenyl) propanyloxy] ethyl] -2,4,8,10-tetraoxaspiro [5,5] undecane, methane- [methylene 3- (3 ', 5'-di-tertiary-butyl-4'-hydroxyphenyl) propionate] methane, 1,3,5-ginseno (3', 5'-di-tertiary-butyl -4'-hydroxybenzyl)-secondary tris -2,4,6- (1H, 3H, 5H) triketone, p-methoxyphenol, 4-methoxy-1-naphthol, thiodiphenylamine, N-nitrosophenylhydroxylamine aluminum salt , Trade name ADK STAB LA-81, trade name ADK STAB LA-82 (manufactured by Adeka Co., Ltd.), etc., but are not limited to these. Among these, naphthoquinone, hydroquinone, nitroso, and piperidine A radical polymerization inhibitor is preferred, and naphthoquinone, 2-hydroxynaphthoquinone, hydroquinone, 2,6-di-tert-butyl-p-cresol, and Polystop 7300P (manufactured by Bodong Co., Ltd.) are more preferred. , Polystop 7300P (made by Bodong Co., Ltd.) is the best.
自由基聚合抑制劑之含量係以本發明之顯示器用封裝劑總量中的0.0001至1質量%為佳,以0.001至0.5質量%為更佳,以0.01至0.2質量%為特佳。 The content of the radical polymerization inhibitor is preferably 0.0001 to 1% by mass, more preferably 0.001 to 0.5% by mass, and particularly preferably 0.01 to 0.2% by mass in the total encapsulant for a display of the present invention.
成分(A)以外之熱硬化劑係藉由非共價電子對或分子內的陰離子進行親核反應者,可列舉例如:多胺類、多酚類、有機醯肼化合物等,惟不限於該等。可列舉例如:屬於芳香族醯肼的對苯二甲酸二醯肼、間苯二甲酸二醯肼、2,6-萘甲酸二醯肼、2,6-吡啶二醯肼、1,2,4-苯三醯肼、1,4,5,8-萘甲酸四醯肼、均苯四甲酸四醯肼等。而且,如為脂肪族醯肼化合物,可列舉例如:甲醯肼、乙醯肼、丙酸醯肼、草酸二醯肼、丙二酸二醯肼、丁二酸二醯肼、戊二酸二醯肼、己二酸二醯肼、庚二酸二醯肼、癸二酸二醯肼、1,4-環己烷二醯肼、二羥丁二酸二醯肼、羥丁二酸二醯肼、亞胺基二乙酸二醯肼、N,N'-六亞甲基雙半卡肼、檸檬酸三 醯肼、氮基乙酸三醯肼、環己烷三羧酸三醯肼、1,3-雙(肼基碳乙基)-5-異丙基乙內醯脲等乙內醯脲骨架,較佳可列舉如:具有纈胺酸乙內醯脲骨架(乙內醯脲環之碳原子經異丙基取代的骨架)之二醯肼化合物、參(1-肼基羰基甲基)三聚異氰酸酯、參(2-肼基羰基乙基)三聚異氰酸酯、參(1-肼基羰基乙基)三聚異氰酸酯、參(3-肼基羰基丙基)三聚異氰酸酯、雙(2-肼基羰基乙基)三聚異氰酸酯等。就硬化反應性與潛在性之平衡而言,較佳為間苯二甲酸二醯肼、丙二酸二醯肼、己二酸二醯肼、參(1-肼基羰基甲基)三聚異氰酸酯、參(1-肼基羰基乙基)三聚異氰酸酯、參(2-肼基羰基乙基)三聚異氰酸酯、參(3-肼基羰基丙基)三聚異氰酸酯,特佳者係參(2-肼基羰基乙基)三聚異氰酸酯。 The thermosetting agent other than the component (A) is a nucleophilic reaction by a non-covalent electron pair or an anion in the molecule, and examples thereof include, but are not limited to, polyamines, polyphenols, and organic hydrazine compounds. . Examples include: dihydrazine terephthalate, dihydrazine isophthalate, dihydrazine 2,6-naphthoate, 2,6-pyridinedihydrazine, 1, 2, 4 -Pyrotrimethylene hydrazine, 1,4,5,8-naphthoic acid tetramethylhydrazine, pyromellitic acid tetramethylhydrazine and the like. Moreover, if it is an aliphatic hydrazine compound, for example, formamidine, hydrazine, hydrazine propionate, dihydrazine oxalate, dihydrazine malonate, dihydrazine succinate, and glutaric acid dihydrate Hydrazine, dihydrazine adipate, dihydrazide pimelate, dihydrazide sebacate, 1,4-cyclohexanedihydrazine, dihydrazide dihydroxysuccinate, dihydrazone dihydroxysuccinate Hydrazine, iminodiacetic acid, dihydrazine, N, N'-hexamethylenebishemipalazine, trimethylhydrazine citrate, trimethylhydrazine nitroacetate, trimethylhydrazine cyclohexanetricarboxylic acid, Hydantoin skeletons such as 3-bis (hydrazinocarbethyl) -5-isopropylhydantoin and the like, and preferred examples thereof include a hydantoin valinate skeleton (carbon of hydantoin ring) Isopropyl substituted skeleton skeleton) bishydrazine compound, ginseng (1-hydrazinocarbonylmethyl) trimer isocyanate, ginseng (2-hydrazinocarbonylethyl) trimer isocyanate, ginseng (1-hydrazinocarbonyl) Ethyl) trimeric isocyanate, ginseng (3-hydrazinocarbonylpropyl) trimeric isocyanate, bis (2-hydrazinocarbonylethyl) trimeric isocyanate, and the like. In terms of the balance between curing reactivity and latentity, diisohydrazine isophthalate, dihydrazine malonate, dihydrazine adipate, and ginseng (1-hydrazinocarbonylmethyl) trimer isocyanate are preferred. , Ginseng (1-hydrazinocarbonylethyl) trimer isocyanate, ginseng (2-hydrazinocarbonylethyl) trimer isocyanate, ginseng (3-hydrazinocarbonylpropyl) trimer isocyanate, the best ones are ginseng (2 -Hydrazinocarbonylethyl) trimeric isocyanate.
成分(A)以外之熱硬化劑可單獨使用,亦可混合2種以上。本發明之顯示器用封裝劑中,在使用成分(A)以外之熱硬化劑時,其於顯示器用封裝劑總量中一般係0.1至10質量%,以0.1至5質量%為佳。 The heat curing agent other than the component (A) may be used alone, or two or more kinds may be mixed. In the display sealing agent of the present invention, when a thermosetting agent other than the component (A) is used, it is generally 0.1 to 10% by mass and preferably 0.1 to 5% by mass in the total display sealing agent.
另外,本發明之顯示器用封裝劑中,不含醯肼系之硬化劑者亦為較佳型態之一。在此情況下,醯肼系之硬化劑的含量比率係以顯示器用封裝劑總量中的1.0質量%以下為佳,以實質上不含有的情況為更佳。 In addition, among the encapsulants for displays of the present invention, those without a hydrazine-based hardener are also one of the preferred types. In this case, the content ratio of the hydrazine-based curing agent is preferably 1.0% by mass or less of the total amount of the display sealing agent, and more preferably, it is substantially not contained.
作為獲得本發明之光硬化性樹脂組成物的方法之一例,係有以下所示之方法。首先,視所需而將成分(G)加熱溶解在成分(B)中。接著,冷卻至室溫後,添加成分(A)、視所需之成分(C)、(D)、(E)、(F)、(H)、消泡劑、 調平劑以及溶劑等,藉由習知的混合裝置,例如三輥研磨機、砂磨機、球磨機等均勻混合,並以金屬篩網過濾,即可製造本發明之顯示器用封裝劑。 As an example of a method for obtaining the photocurable resin composition of the present invention, the following method is used. First, the component (G) is heated and dissolved in the component (B) as necessary. Next, after cooling to room temperature, add component (A), optional components (C), (D), (E), (F), (H), defoamer, leveling agent, solvent, etc., By using a conventional mixing device, such as a three-roll mill, a sand mill, a ball mill and the like, uniformly mixing and filtering through a metal screen, the sealing agent for a display of the present invention can be manufactured.
而且,本發明之顯示器用封裝劑非常適合作為液晶顯示單元用接著劑,特別是非常適合作為液晶密封劑。使用本發明之顯示器用封裝劑作為液晶密封劑時,液晶顯示單元之例呈示如下。 Furthermore, the encapsulant for a display of the present invention is very suitable as an adhesive for a liquid crystal display unit, and particularly suitable as a liquid crystal sealant. When the sealing compound for a display of the present invention is used as a liquid crystal sealant, an example of a liquid crystal display unit is shown below.
使用本發明之液晶顯示單元用接著劑所製造之液晶顯示單元,係將已在基板形成有預定電極的一對基板以預定間隔彼此相對配置,並於周圍使用本發明的液晶密封劑予以密封,而於該間隙中封入有液晶者。被封入的液晶之種類並無特別限定。其中,基板是指由包含玻璃、石英、塑膠、矽等的至少一者具有透光性的組合之基板所構成。其製法係在本發明之液晶密封劑中添加玻璃纖維等間隔物(間隙控制材料)後,使用分注器或網版印刷裝置等而將該液晶密封劑塗佈在該一對基板的一者,之後視需要而在80至120℃進行準硬化。然後,將液晶滴至該液晶密封劑之堰的內側,在真空中疊合另一個玻璃基板並形成間隙。形成間隙後,藉由在90至130℃下硬化30分鐘至2小時,即可得到本發明之液晶顯示單元。而且,在作為光熱併用型使用時,是藉由紫外線照射機將紫外線照射到液晶密封劑部而使其光硬化。紫外線照射量係以500至6000mJ/cm2之照射量為佳,以1000至4000mJ/cm2之照射量為更佳。然後,視需要而藉由在90至130℃下硬化30分 鐘至2小時,即可得到本發明之液晶顯示單元。如此操作所得之本發明的液晶顯示單元並無因液晶汙染所導致的顯示不良,係接著性、耐濕可靠性優異者。間隔物可列舉例如:玻璃纖維、二氧化矽珠粒、聚合物珠粒等。其直徑因目的而有所不同,一般為2至8μm,以4至7μm為佳。相對於本發明之液晶密封劑100質量份,其使用量一般為0.1至4質量份,以0.5至2質量份為佳,以0.9至1.5質量份左右為更佳。 A liquid crystal display unit manufactured by using the adhesive for a liquid crystal display unit of the present invention is configured by arranging a pair of substrates having predetermined electrodes formed on the substrate at a predetermined interval from each other, and sealing the liquid crystal sealant of the present invention around the substrate. A liquid crystal is sealed in the gap. The type of the enclosed liquid crystal is not particularly limited. The substrate refers to a substrate made of a combination of at least one of glass, quartz, plastic, and silicon that has translucency. The method is to add a spacer such as glass fiber (gap control material) to the liquid crystal sealant of the present invention, and then apply the liquid crystal sealant to one of the pair of substrates using a dispenser or a screen printing device. After that, quasi-hardening is performed at 80 to 120 ° C if necessary. Then, the liquid crystal is dropped to the inside of the weir of the liquid crystal sealant, and another glass substrate is laminated in a vacuum to form a gap. After the gap is formed, the liquid crystal display unit of the present invention can be obtained by curing at 90 to 130 ° C for 30 minutes to 2 hours. When used as a photothermal combination type, ultraviolet light is irradiated to the liquid crystal sealant portion by an ultraviolet irradiator to harden the light. Based ultraviolet irradiation amount of 500 to 6000 mJ / cm 2 irradiation amount of preferably, at / cm 2 irradiation amount of 4000 mJ to 1000 is more preferred. Then, if necessary, by hardening at 90 to 130 ° C for 30 minutes to 2 hours, the liquid crystal display unit of the present invention can be obtained. The liquid crystal display unit of the present invention obtained in this way does not exhibit poor display due to liquid crystal contamination, and is one having excellent adhesion and humidity resistance reliability. Examples of the spacer include glass fibers, silica beads, and polymer beads. The diameter varies depending on the purpose, but is generally 2 to 8 μm, and preferably 4 to 7 μm. With respect to 100 parts by mass of the liquid crystal sealant of the present invention, its usage amount is generally 0.1 to 4 parts by mass, preferably 0.5 to 2 parts by mass, and more preferably about 0.9 to 1.5 parts by mass.
本發明之顯示器用封裝劑非常適合使用於要求硬化性、對不同黏附體的接著性、耐濕熱可靠性的領域之接著劑用途。例如液晶密封劑、有機EL用封裝劑、觸控面板用接著劑。 The encapsulant for a display of the present invention is very suitable for use in adhesive applications in the fields that require hardenability, adhesion to different adherends, and reliability in moisture and heat resistance. Examples include a liquid crystal sealant, an organic EL encapsulant, and a touch panel adhesive.
以下,由實施例以更詳細地說明本發明,惟本發明並不受實施例所限定。另外,如無特別記載,本文中之「份」及「%」均為質量基準。 Hereinafter, the present invention will be described in more detail by examples, but the present invention is not limited by the examples. In addition, "part" and "%" in this article are based on quality unless otherwise noted.
以下述表1所示之比例用90℃使成分(B)、(G)在加熱溶解後,冷卻至室溫,添加成分(A)、(C)、(D)、(E)、(F)、(H),經攪拌後,以三輥研磨機使其分散,並以金屬篩網(635篩孔)過濾,調製成光硬化性樹脂組成物之實施例1至5。另外,以成分(O-4)取代成分(A),調製比較例1。 After dissolving the components (B) and (G) by heating at 90 ° C in the proportion shown in Table 1 below, the components were cooled to room temperature, and the components (A), (C), (D), (E), and (F) were added. ), (H), after being stirred, dispersed with a three-roll mill, and filtered with a metal screen (635 mesh) to prepare Examples 1 to 5 of a photocurable resin composition. In addition, component (O-4) was used in place of component (A) to prepare Comparative Example 1.
在實施例及比較例所製造之液晶密封劑100g中添加作為間隔物的5μm之玻璃纖維1g,進行混合攪拌。在玻璃基板上,將該液晶密封劑以重現1cm×1cmm的角(corner)部的形式塗佈,將相對向的玻璃基板貼合並以UV照射機照射3000mJ/cm2的紫外線後,投入至烘箱使在120℃硬化1小時。用黏合測試儀(bond tester)(西進商事股份有限公司製造:SS-30WD)以按壓角部的形式測定該玻璃基板的剝離接著強度。將強度示於表2。 To 100 g of the liquid crystal sealant produced in the examples and comparative examples, 1 g of 5 μm glass fiber as a spacer was added, and the mixture was stirred. This liquid crystal sealant was applied on a glass substrate in a manner to reproduce a corner portion of 1 cm × 1 cm, and the opposite glass substrate was bonded together and irradiated with 3000 mJ / cm 2 of ultraviolet light by a UV irradiator, and then poured into the glass substrate. The oven was hardened at 120 ° C for 1 hour. A peel tester (bond tester) (manufactured by Nishijin Co., Ltd .: SS-30WD) was used to measure the peeling adhesion strength of the glass substrate by pressing the corners. The intensity is shown in Table 2.
將定向膜液(日產化學工業股份有限公司製造:RN2880)旋塗在玻璃基板上,以80℃的熱板預燒3分鐘,並在230℃的烘箱中煅燒30分鐘。再者,將該附定向膜之基板以UV照射機照射500mJ/cm2(測定波長:254nm)之紫外線,並進一步在230℃的烘箱中煅燒30分鐘。 The orientation film liquid (manufactured by Nissan Chemical Industry Co., Ltd .: RN2880) was spin-coated on a glass substrate, pre-fired with a hot plate at 80 ° C for 3 minutes, and fired in an oven at 230 ° C for 30 minutes. Furthermore, this substrate with an orientation film was irradiated with 500 mJ / cm 2 (measurement wavelength: 254 nm) of ultraviolet rays by a UV irradiator, and was further calcined in an oven at 230 ° C. for 30 minutes.
在實施例及比較例所製造之液晶密封劑100g中添加作為間隔物的5μm之玻璃纖維1g並進行混合攪拌。在塗佈有定向膜之玻璃基板上,將該液晶密封劑以重現1cm×1cm的角部的形式塗佈,將相對向的定向膜塗佈玻璃基板貼合,並以UV照射機照射3000mJ/cm2的紫外線後,投入烘箱使在120℃熱硬化1小時。用黏合測試儀(西進商事股份有限公司製造:SS-30WD),以按壓角部的形式測定該定 向膜塗佈玻璃基板的剝離接著強度。強度如表2所示。 To 100 g of the liquid crystal sealant produced in the examples and comparative examples, 1 g of 5 μm glass fiber as a spacer was added and mixed and stirred. The liquid crystal sealant was coated on a glass substrate coated with an alignment film so as to reproduce a corner of 1 cm × 1 cm. The opposite alignment film was coated with a glass substrate and bonded, and irradiated with 3000 mJ by a UV irradiator. After the ultraviolet ray / cm 2 , it was put into an oven and heat-cured at 120 ° C. for 1 hour. The peeling adhesion strength of the oriented film-coated glass substrate was measured with a pressure tester (manufactured by Nishijin Co., Ltd .: SS-30WD) by pressing the corners. The intensity is shown in Table 2.
在上述定向膜塗佈基板上塗佈液晶密封劑,並對經硬化之試驗片進行PCT試驗(條件:溫度121℃、濕度100%、氣壓2atm、試驗時間12小時),同樣地測定接著強度。強度如表2所示。 A liquid crystal sealant was coated on the alignment film-coated substrate, and a PCT test (condition: temperature 121 ° C., humidity 100%, air pressure 2 atm, test time 12 hours) was performed on the cured test piece, and the adhesion strength was measured in the same manner. The intensity is shown in Table 2.
將實施例、比較例所製造之液晶密封劑夾在聚對苯二甲酸乙二酯(PET)薄膜之間作成厚度100μm之薄膜,將該薄膜藉由UV照射機照射3000mJ/cm2的紫外線後,投入至烘箱,以120℃使熱硬化1小時。硬化後,將PET膜剝離,而得到密封劑硬化膜,然後將之裁切成50mm×50mm之短籤狀,製成試樣片。將該試樣片用動態黏彈性測定裝置(DMS-6100:SII NanoTechnology公司製造)之拉伸模式中,在頻率為10Hz、升溫溫度為3℃/分鐘的條件下測定,將損耗係數Tan δ以及Tan δ曲線中獲得最大值的溫度作為玻璃轉移溫度之結果。結果如表2所示。 The liquid crystal sealants manufactured in the examples and comparative examples were sandwiched between polyethylene terephthalate (PET) films to form a film having a thickness of 100 μm, and the film was irradiated with 3000 mJ / cm 2 of ultraviolet light by a UV irradiator. , Put into an oven, and heat-cured at 120 ° C for 1 hour. After curing, the PET film was peeled off to obtain a sealant cured film, which was then cut into a 50 mm x 50 mm short note shape to make a sample piece. This sample piece was measured in a tensile mode of a dynamic viscoelasticity measuring device (DMS-6100: manufactured by SII NanoTechnology) under the conditions of a frequency of 10 Hz and a temperature rise temperature of 3 ° C / min. The loss coefficient Tan δ and The temperature at which the maximum value was obtained in the Tan δ curve was taken as a result of the glass transition temperature. The results are shown in Table 2.
將實施例、比較例所製造之液晶密封劑夾在聚對苯二甲酸乙二酯(PET)薄膜之間作成厚度100μm之薄膜,將該薄膜藉由UV照射機照射3000mJ/cm2的紫外線後,投入至烘箱,以120℃使熱硬化1小時,硬化後將PET膜剝離而製成試樣。試樣在60℃、90%下的透濕度係以透濕度測定機(Lessy公司製造:L80-5000)測定。結果如表2所示。 The liquid crystal sealants manufactured in the examples and comparative examples were sandwiched between polyethylene terephthalate (PET) films to form a film having a thickness of 100 μm, and the film was irradiated with 3000 mJ / cm 2 of ultraviolet light by a UV irradiator. , Put into an oven, heat-cured at 120 ° C for 1 hour, peeled the PET film after curing, and made a sample. The moisture permeability of the sample at 60 ° C and 90% was measured with a moisture permeability measuring machine (manufactured by Lessy: L80-5000). The results are shown in Table 2.
在附透明電極之基板上塗佈定向膜液(日產化學股份有限公司製造:NRB)並進行煅燒,實施UV定向處理。在該基板以將所得之液晶密封劑貼合後之線寬成為0.6mm之方式分注為主封框與輔助封框(dummy seal),接著將液晶(JC-5015LA;JNC股份有限公司製造)的微細滴液滴在密封圖案之框內。再於另一片經摩擦處理的基板散佈面內間隔物(Naotco股份有限公司製造的Naotco Spacer KSEB-525F;貼合後之間隙寬度為5μm)進行熱固定,使用貼合裝置在真空中貼合先前已經滴入液晶的基板。開放大氣形成間隙之後,僅將密封圖案框內遮住,並以UV照射機照射100mJ/cm2之紫外線後,投入至烘箱,使在120℃下熱硬化1小時,作成評估用液晶試驗單元。 An orientation film liquid (NRB, manufactured by Nissan Chemical Co., Ltd.) was coated on a substrate with a transparent electrode, and calcined, and UV orientation treatment was performed. The substrate is dispensed so that the line width of the obtained liquid crystal sealant is 0.6 mm after bonding, and the liquid crystal (JC-5015LA; manufactured by JNC Co., Ltd.) is then divided into a main seal and a dummy seal. Fine droplets of liquid within the sealed pattern frame. Then, the in-plane spacers (Naotco Spacer KSEB-525F manufactured by Naotco Co., Ltd .; the gap width after bonding was 5 μm) were spread on another substrate subjected to friction treatment, and the bonding was performed in a vacuum using a bonding device. The substrate where the liquid crystal has been dropped. After opening the atmosphere to form a gap, only the inside of the sealed pattern frame was shielded, and 100 mJ / cm 2 of ultraviolet rays were irradiated with a UV irradiator, and then placed in an oven and cured at 120 ° C. for 1 hour to prepare a liquid crystal test unit for evaluation.
將所作成之評估用液晶試驗單元用液晶物性評估系統(Toyo Technica股份有限公司製造:6254型)測定之在5V、1Hz、60℃之條件下的電壓保持率之結果示於表2。 Table 2 shows the results of the voltage retention ratios measured under the conditions of 5 V, 1 Hz, and 60 ° C. for the liquid crystal physical property evaluation system (manufactured by Toyo Technica Co., Ltd .: Model 6254) for the evaluation liquid crystal test unit.
A-1:4-羥基苯甲酸 A-1: 4-hydroxybenzoic acid
A-2:硫代水楊酸 A-2: thiosalicylic acid
A-3:對苯二甲酸 A-3: Terephthalic acid
A-4:2,6-二羥異菸鹼酸(citrazinic acid) A-4: 2,6-dihydroxyisonicotinic acid (citrazinic acid)
A-5:4-胺基苯甲酸 A-5: 4-aminobenzoic acid
A-6:4-(胺基甲基)苯甲酸 A-6: 4- (aminomethyl) benzoic acid
A-7:2-巰基菸鹼酸 A-7: 2-mercaptonicotinic acid
B-1:雙酚A型丙烯酸環氧酯 B-1: Bisphenol A acrylic epoxy ester
(以一般合成方法合成例如日本特開2016-24243號公報) (Synthesis by a general synthesis method, for example, Japanese Patent Laid-Open No. 2016-24243)
B-2:雙酚A型部分丙烯酸環氧酯 B-2: Bisphenol A partially acrylic epoxy ester
(以一般合成方法合成例如日本特開2016-24243號公報中以50%當量反應) (Synthesized by a general synthetic method, for example, in Japanese Patent Application Laid-Open No. 2016-24243, with 50% equivalent reaction)
B-3:EB3702 B-3: EB3702
(Daicel-Allnex股份有限公司製造) (Made by Daicel-Allnex Co., Ltd.)
B-4:EB3708 B-4: EB3708
(Daicel-Allnex股份有限公司製造) (Made by Daicel-Allnex Co., Ltd.)
B-5:雙酚A型環氧樹脂 B-5: Bisphenol A epoxy resin
(RE310S:日本化藥製造) (RE310S: manufactured by Nippon Kayaku)
B-6:雙酚S型環氧樹脂 B-6: Bisphenol S epoxy resin
(RE203:日本化藥製造) (RE203: manufactured by Nippon Kayaku)
C-1:聚甲基丙烯酸酯系有機微粒子 C-1: Polymethacrylate-based organic fine particles
(Aica工業股份有限公司製造:F-351S) (Manufactured by Aica Industrial Co., Ltd .: F-351S)
D-1:球狀二氧化矽 D-1: spherical silica
(德山股份有限公司製造:Sansil SSP-07M) (Manufactured by Tokuyama Corporation: Sansil SSP-07M)
E-1:3-環氧丙氧基丙基三甲氧基矽烷 E-1: 3-glycidoxypropyltrimethoxysilane
(JNC股份有限公司製造:Si1a-Ace S-510) (Made by JNC Corporation: Si1a-Ace S-510)
F-1:2,4-二胺基-6-(2'-甲基咪唑基(1'))乙基-均三/三聚異氰酸加成物 F-1: 2,4-diamino-6- (2'-methylimidazolyl (1 ')) ethyl-mesanthine / Trimeric isocyanate adduct
(四國化成公司製造:2MAOK-PW) (Manufactured by Shikoku Chemical Co., Ltd .: 2MAOK-PW)
G-1:OXE04 G-1: OXE04
(BASF公司製造) (Made by BASF company)
H-1:1,2-雙(三甲基矽氧基)-1,1,2,2-四苯基乙烷 H-1: 1,2-bis (trimethylsiloxy) -1,1,2,2-tetraphenylethane
(粉碎成平均粒徑1.9μm) (Pulverized to an average particle size of 1.9 μm)
O-1:亞硝基系哌啶衍生物 O-1: Nitroso-based piperidine derivative
(伯東股份有限公司製造:Polystop 7300P) (Made by Bo Dong Co., Ltd .: Polystop 7300P)
O-2:參(2-肼基羰基乙基)三聚異氰酸酯微粉碎品 O-2: Ginseng (2-hydrazinocarbonylethyl) trimeric isocyanate finely pulverized product
O-3:丙二酸二醯肼(大塚化學製造) O-3: Dihydrazine malonate (manufactured by Otsuka Chemical)
O-4:參(3-羧基乙基)三聚異氰酸酯 O-4: Ginseng (3-carboxyethyl) trimer isocyanate
(四國化成工業股份有限公司製造:CIC酸,以噴射粉碎機(jet mill)微粉碎成平均粒徑1.5μm者) (Made by Shikoku Chemical Industry Co., Ltd .: CIC acid, which is finely pulverized by a jet mill to an average particle diameter of 1.5 μm)
由表1之結果可知,以往所使用之醯肼的硬化系之比較例1,其電壓保持率、玻璃轉移溫度、接著強度均為低,PCT後接著強度低至初始值的一半。另一方面,確認到使用成分(A)之實施例1至9,其接著強度、玻璃轉移溫度、透濕度、電壓保持率之任一者均為優異。特別是,玻璃轉移溫度與電壓保持率均明顯較比較例1良好,而能確認成分(A)為反應性高。 From the results in Table 1, it can be seen that in Comparative Example 1 of the conventionally used hydrazine hardening system, the voltage retention rate, glass transition temperature, and bonding strength were all low, and the bonding strength after PCT was as low as half of the initial value. On the other hand, Examples 1 to 9 using the component (A) were confirmed to have excellent adhesion strength, glass transition temperature, moisture permeability, and voltage retention ratio. In particular, both the glass transition temperature and the voltage holding ratio were significantly better than those of Comparative Example 1, and it was confirmed that the component (A) was highly reactive.
由以上能確認使用成分(A)之本發明的顯示器用封裝劑對有機膜的接著強度強,且可實現高可靠性。 From the above, it can be confirmed that the display encapsulant of the present invention using the component (A) has strong bonding strength to an organic film and can achieve high reliability.
本發明的顯示器用封裝劑因為處理性優異,故可穩定地生產液晶顯示單元,而且亦有助於確保液晶顯示單元的長期可靠性。 The sealing agent for a display of the present invention is excellent in handleability, can stably produce a liquid crystal display unit, and also contributes to ensuring long-term reliability of the liquid crystal display unit.
Claims (12)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017240875A JP2019108432A (en) | 2017-12-15 | 2017-12-15 | Sealing agent for display |
| JP2017-240875 | 2017-12-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201930536A true TW201930536A (en) | 2019-08-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107140398A TW201930536A (en) | 2017-12-15 | 2018-11-14 | Sealing agent for displays |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2019108432A (en) |
| KR (1) | KR20190072434A (en) |
| CN (1) | CN109988536A (en) |
| TW (1) | TW201930536A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3984584A4 (en) | 2019-06-11 | 2023-07-26 | Kaneka Corporation | Balloon for balloon catheter and method of manufacturing balloon catheter |
| JP7413511B2 (en) * | 2020-03-30 | 2024-01-15 | 三井化学株式会社 | Sealant for liquid crystal dripping method, manufacturing method of liquid crystal display panel, and liquid crystal display panel |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004126211A (en) | 2002-10-02 | 2004-04-22 | Mitsui Chemicals Inc | Resin composition for sealing liquid crystal, and method of manufacturing liquid crystal display panel |
| JP4852992B2 (en) | 2005-11-21 | 2012-01-11 | トヨタ自動車株式会社 | Control device for internal combustion engine |
| JP5268235B2 (en) | 2006-07-05 | 2013-08-21 | 日本化薬株式会社 | Liquid crystal sealant and liquid crystal display cell using the same |
| JP5139735B2 (en) | 2007-06-26 | 2013-02-06 | 積水化学工業株式会社 | Sealant for liquid crystal dropping method, vertical conduction material, and liquid crystal display element |
| JP5388091B2 (en) | 2007-11-16 | 2014-01-15 | 日本化薬株式会社 | Liquid crystal sealant and liquid crystal display cell using the same |
| JP5493422B2 (en) | 2008-05-16 | 2014-05-14 | Jsr株式会社 | Curable composition for liquid crystal sealant and liquid crystal display element |
| JP5249698B2 (en) | 2008-09-30 | 2013-07-31 | 積水化学工業株式会社 | Sealant for liquid crystal display element and liquid crystal display element |
-
2017
- 2017-12-15 JP JP2017240875A patent/JP2019108432A/en active Pending
-
2018
- 2018-11-14 TW TW107140398A patent/TW201930536A/en unknown
- 2018-12-11 KR KR1020180158968A patent/KR20190072434A/en not_active Withdrawn
- 2018-12-13 CN CN201811523517.3A patent/CN109988536A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN109988536A (en) | 2019-07-09 |
| JP2019108432A (en) | 2019-07-04 |
| KR20190072434A (en) | 2019-06-25 |
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