TW201918810A - Intelligent environmental and security monitoring method and monitoring system - Google Patents

Abstract

Disclosed is a method and a system for monitoring of environment and security in a fabrication facility. In one embodiment, a method comprising: transporting an automated material handling system (AMHS) vehicle from a first position to a second position; and detecting at least one parameter using at least one sensor located on the AMHS vehicle to determine at least one environmental or security condition between the first and second positions.

Description

 Intelligent environment and security monitoring system  

The quality, consistency and cost of processed products depend on a complex combination of processing steps and the performance of the equipment. The manufacture of complex high-value products often requires lengthy trial and error processes, and material characteristics and/or inconsistencies and/or uncertainties in the behavior of the manufacturing equipment under different processing conditions result in wasted resources. These inconsistencies and uncertainties are caused, at least in part, by adverse effects caused by environmental conditions, such as contaminants introduced or produced during the manufacturing process. In addition, contaminants such as micro/nano suspensions (less than 100 nanometers to a few microns) may also increase the health risks of workers in manufacturing facilities.

In a typical semiconductor manufacturing facility, contaminants can be produced in the form of gases, chemical vapors, micro/nano-level aerosols, and gaseous molecular contaminants. In clean rooms, micron/nano-sized aerosols containing various ion species may come from multiple sources, including human behavior (eg, hygiene, clothing, etc.), clean room airflow, equipment, materials, and nanomaterial synthesis. Process, etc. Micron/nano suspensions can be released directly or formed during atmospheric chemical reactions, such as evaporation of heated chemicals/solvents, gases leaking/released from membranes or their processing equipment. In addition to micron/nano-sized aerosols, gaseous molecular contaminants (AMC) are equally worrying in semiconductor processes. This organic contaminant can adversely affect production tools and therefore increase the cost of manufacturing facility operators. In a clean room environment, the level of AMC is mainly generated from internal solvents and sources of acetic acid, secondary inhalation of gases, aromatic compounds and material outgassing. In addition, spills, leaks, and improper handling can occur, resulting in significant costs in wafer loss and tool downtime.

An ideal non-polluting manufacturing environment can be achieved by combining filtration solutions and source control/monitoring in air handling systems. Continuous, on-line and immediate monitoring of contaminant levels helps identify sources, stabilize production, and avoids unexpectedly shortened filter unit life. However, in a semiconductor manufacturing facility environment, traditional environmental monitoring is expensive and time consuming, sample collection relies on manual deployment, and measurement/characterization depends on dedicated instruments. In addition, traditional monitoring techniques do not provide continuous, immediate monitoring, which means that the status of semiconductor manufacturing facilities may have changed when the results of the equivalent measurements are provided for review.

In addition to monitoring clean room contaminants (eg, type, level, etc.), it is also necessary to pay close attention to and observe the operators and other personnel entering and leaving the semiconductor manufacturing facility, including visitors and third-party contractors. Conventional observing methods are typically implemented using a fixed camera located at a predetermined location within the facility, however, installing a large number of cameras to achieve adequate coverage can be very expensive. In addition, this traditional method can detect unauthorized people or activities, but does not provide an opportunity to detect unauthorized communications, such as video/picture recording, voice communication, and file upload/download.

Therefore, there is a need for a simpler, faster, and cheaper technology to achieve immediate monitoring of environmental pollutant levels and safety in semiconductor manufacturing facilities.

100‧‧‧Semiconductor manufacturing facilities

102‧‧‧Automatic Material Handling System (AMHS) Vehicle

104‧‧‧ Equipment

106‧‧‧Process area

108‧‧‧ storage station

110‧‧‧Transportation track

112‧‧‧Host computer

114‧‧‧Wireless Router

116‧‧‧Wireless communication signals

118‧‧‧Wired communication network

200‧‧‧Monitoring system

201‧‧‧Host computer

202‧‧‧Communication interface

203‧‧‧ Data Processing Unit

204‧‧‧Transportation Vehicle Unit

205‧‧‧ Wafer Processing Unit

206‧‧‧Monitoring Control Unit

207‧‧‧ Vehicle Control Unit

208‧‧‧Automatic Material Handling System (AMHS) Vehicle

209‧‧‧Front open wafer transfer box (FOUP)

210‧‧‧ Platform

212‧‧‧ processor

213‧‧‧ memory

214‧‧‧Input/Output (I/O) interface

215‧‧‧Communication interface

216‧‧‧System Bus

230‧‧‧Sensor and detector

231‧‧‧ Temperature Sensor

232‧‧‧Humidity Sensor

233‧‧‧Magnetic field detector

234‧‧‧Ion detector

235‧‧‧Gaseous Molecular Contaminant (AMC) Detector

236‧‧‧Image sensor

237‧‧‧RF detector

300‧‧‧Monitoring method

302~310‧‧‧Steps

The various aspects of the present disclosure can be understood from the following detailed description. It is noted that the various features are not drawn to scale. In fact, the dimensions and geometry of the features can be arbitrarily increased or decreased for clarity of discussion.

1 is a schematic diagram of a semiconductor fabrication facility in accordance with some embodiments of the present disclosure. The semiconductor manufacturing facility is equipped with a number of automated material handling system (AMHS) carriers configured to transport wafers between wafer processing and/or metrology equipment while carrying various sensors for monitoring environmental and safety parameters. With the detector.

2A is a block diagram showing an exemplary configuration of a monitoring system integrated into an AMHS system in a semiconductor manufacturing facility, in accordance with some embodiments of the present disclosure.

2B is a block diagram of a controller used in the monitoring system shown in FIG. 2A in accordance with some embodiments of the present disclosure.

3 is a flow chart showing an environmental and safety monitoring method for use in a semiconductor fabrication facility in accordance with some embodiments of the present disclosure.

The following disclosure provides many different exemplary embodiments for implementing different features of the subject matter provided. Specific examples of components and arrangements are described below to simplify the disclosure. These are of course only examples and are not intended to be limiting. For example, it will be understood that when an element is referred to as being connected or coupled to another element, the element can be directly connected or coupled to the other element, or one or more intermediate elements may be present.

The description of the exemplary embodiments is set forth to be understood in conjunction with the drawings of the drawings, which are considered as part of the entire written description. In this paper, such as "lower", "upper", "horizontal", "upright", "above", "under", "up", "down", "top" The relative terms such as "bottom" and its derivatives (eg horizontally, vertically, upwardly, etc.) should be interpreted as the direction of the subsequent description or the direction shown in the schema in question. These relative terms are for ease of description and do not require that the device be constructed or operated in a particular orientation.

The present disclosure provides many different monitoring of environmental parameters in semiconductor manufacturing facilities (eg, micro/nano-level aerosols and types/levels of gaseous molecular contaminants, temperature, humidity, magnetic fields) and safety (eg, unauthorized personnel and activities) , including unauthorised wireless communication) monitoring methods and implementation methods of the monitoring system. In the fabrication of semiconductor components, the semiconductor wafer is subjected to a plurality of processing steps performed by different processing equipment. Manufacturing facilities typically include an automated material handling system (AMHS) for transporting wafers between different processing equipment or between processing equipment and measuring equipment. In some embodiments, one or more AMHS carriers incorporate an instant continuous monitoring system that allows for monitoring of environmental contaminant levels and other one or more physical parameters. Therefore, environmental and/or safety parameters in the manufacturing facility can be measured without introducing expensive large equipment. In addition to existing fixed security surveillance systems (eg, identification cards, CCTV cameras) at scheduled locations, by detecting AMHS carriers equipped with environmental/security monitoring systems in manufacturing facilities to detect unauthorized personnel or activities (eg, for unauthorized communications, access, and data/file transfers outside the facility, such as on mobile devices or other electronic communication devices), supplemental patrols may be provided. Therefore, the above environmental and safety issues can be effectively avoided.

1 is a schematic diagram of a semiconductor fabrication facility 100 in accordance with some embodiments of the present disclosure. The semiconductor fabrication facility 100 is equipped with a plurality of AMHS carriers 102 for transporting wafers between wafer processing and/or metrology devices 104, while carrying a plurality of sensors and detections for monitoring environmental and safety conditions. Device. In semiconductor manufacturing facility 100, similarly functioning devices 104 are typically gathered in the same process area 106. A process area 106 typically includes at least one storage station 108 and is located at one end of the process area 106. The automated wafer container transport across the processing zones performed by the AMHS carrier 102 between the storage stations 108 of the various process zones 106 can be directed over the elevated transport track 110. In a particular embodiment, each storage station 108 includes a plurality of vertically stacked storage bins for holding semiconductor wafers or wafer containers. According to some embodiments, the AMHS carrier can be wafered in the form of overhead hoisting transport (OHT), overhead shuttle (OS), automated guided vehicle (AGV), rail guided vehicle (RGV), conveyor system, or combinations thereof. And transportation of wafer containers.

The wafers are processed and measured on separate devices 104. Traditionally, when a wafer is processed or measured, the operator can manually unload the wafer from device 104 and store it in a wafer container (not shown), such as a front-open wafer transfer cassette (FOUP). And a front open wafer transfer box (FOSB), which is then shipped to the storage station 108 of the process area 106. In some embodiments, a manual mechanical transport mechanism can be substituted for manual operation. In some embodiments, the dedicated process zone and process area AMHS carrier 102 can transport wafer containers on the transport track 110. Specifically, according to some embodiments, the process interval AMHS carrier 102 moves the wafer container between the storage stations 108 of the different process areas 106, and the AMHS carrier 102 in the process area is in the same processing area 106. The wafer container is moved between 104 or different devices 104.

In some embodiments, in accordance with some embodiments, the AMHS carrier 102 in the process area extracts a FOUP from the first storage station 108 and transports it on the transport track 110 to the same process area 106 or another process area 106. Two storage stations 108 where the next processing or measurement step is performed. The wafer within the FOUP stays at the second storage station 108, awaiting the next processing or measurement step, and then the operator of the second storage station 108 has to manually load the wafer to the corresponding device 104. In some embodiments, the AMHS carrier 102 can automatically extract the FOUP, transport it on the transport track 110, and load the wafer to the device 104 corresponding to the next processing or measurement step. Once all required wafer processing steps are completed, the wafers are stored back to the FOUP and shipped to the destination, such as a test facility or packaging facility, on the transport track 110 with the same or different AMHS carriers 102. Each time the FOUP is transported from one location to another, a bar code reader (e.g., radio frequency identification) on the FOUP is scanned along the transport track 110 or a bar code reader within the storage station 108. The wafer transport within the FOUP is recorded on a computer system responsible for manipulating the AMHS carrier 102. When a device completes a wafer processing step, host computer 112 determines if the wafer should be sent to one of storage stations 108. For example, if the adjacent first storage station 108 is full, the wafer may be sent to another adjacent storage station 108 located in the same or different process area 106. As another example, according to some embodiments, when the next wafer processing step can be performed immediately, the wafer can be sent directly to the destination device.

When operating on the transport track 110 between the same process area 106 or between the devices 104 of the different process areas 106, the plurality of sensors on the AMHS carrier 102 can provide immediate monitoring of environmental parameters, such as in a semiconductor manufacturing facility environment. Temperature, humidity, magnetic field, pollutant levels (eg micro/nano particles and AMC). In some embodiments, a plurality of detectors for security monitoring (eg, surveillance cameras and RF signal detectors) may also be integrated into the AMHS carrier 102, in addition to existing fixed security monitoring systems at predetermined locations. In addition, supplemental patrols are provided in semiconductor manufacturing facilities. Each type of sensor and detector is described in more detail below with reference to Figure 2A. The AMHS carrier 102 can communicate directly with nearby wireless routers 114 via wireless communication signals 116. The signal containing the measurement data from the plurality of sensors and detectors can be transmitted by the wireless router 114 to the host computer 112 via the high speed wired communication network 118 for data recording and analysis.

In accordance with some embodiments of the present disclosure, FIG. 2A depicts a block diagram showing an exemplary configuration of a monitoring system integrated into an AMHS system in a semiconductor manufacturing facility. The monitoring system 200 includes a host computer 201, a communication interface 202, a data processing unit 203, a transport carrier unit 204, and a wafer processing unit 205. The host computer 201 is used for real-time measurement control and data display, wherein the data is the measurement result of a plurality of sensors and detectors on the AMHS carrier for transporting the wafer container on the transport track in the semiconductor manufacturing facility (as above) Said). In some embodiments, the host computer 201 can also be used for centralized real-time monitoring of Internet of Things devices and systems. The transport vehicle unit 204 includes a supervisory control unit 206 and a vehicle control unit 207. The vehicle control unit 207 controls and manipulates the AMHS carrier 208 to transport the FOUP 209 (e.g., transported between the stations 210). In some embodiments, the AMHS carrier 208 is configured to provide the functionality of the station 210 loading, unloading, and racking wafers in different process zones. In some embodiments, each AMHS carrier 208 includes a robotic arm and/or crane that provides horizontal and vertical movement to be mechanically coupled to the FOUP 209. According to some embodiments, station 210 includes equipment for semiconductor processing or metrology including, but not limited to, cleaning, cleaning, polishing, photolithography, development, deposition, etching, electrical measurement equipment, optical measurement equipment, and the like. In some embodiments, station 210 can be a storage station.

According to some embodiments, the AMHS carrier 208 carries a plurality of sensors and detectors 230, including one or more of the following: a temperature sensor 231, a humidity sensor 232, a magnetic field detector 233, and ion detection. The device 234 and the AMC detector 235 are used for environmental monitoring. In some embodiments, the plurality of sensors and detectors 230 can provide temperature, humidity, magnetic field strength/direction, inorganic ion type/concentration in micro/nano-level suspended particles, organic contaminant concentration, particle concentration, etc. Instant continuous monitoring of environmental parameters. In some embodiments, the plurality of sensors and detectors 230 on the AMHS carrier 208 also include image sensors (such as cameras) 236 and RF detectors 237 for security monitoring, which can detect semiconductors. Unauthorized device operation, unauthorized personnel or activities in the manufacturing facility, including unauthorized wireless communications.

In some embodiments, different types of temperature sensors 231 can be implemented depending on different performance requirements, such as detection range, sensitivity, accuracy, reaction time, repeatability, size, power consumption, cost, and the like. Includes contact and non-contact temperature sensors. In some embodiments, the contact temperature sensor can be a thermostat comprising two metals (eg, nickel, copper, tungsten, aluminum, etc.), typically comprising a ceramic material (eg, oxides of nickel, manganese, cobalt, etc.) Thermistor, a thin film resistance sensor usually comprising a thin high-purity conductive metal (such as platinum, copper, nickel, etc.), comprising two different metals (such as copper, iron, various metal alloys, etc.) and two connection points Thermocouples, semiconductor junction sensors, fiber optic sensors including semiconductor crystals with transmission spectra that vary with temperature, such as gallium arsenide, and the like. In some embodiments, the non-contact temperature sensor can be a pyrometer that typically includes a light sensor (eg, an infrared radiation sensor) that is responsive to a particular spectral band.

In some embodiments, the humidity sensor 232 can select one of the following: a capacitive sensor comprising a polymer or metal oxide sandwiched between two conductive electrodes, a moisture absorbing medium, and a noble metal electrode (eg, a polymer) a resistive sensor of a salt, a treated substrate, etc., and a thermal conductivity sensor comprising two thermistors and at least one resistive heater. According to some embodiments, the selection of a suitable humidity sensor can be determined by accuracy, repeatability, long term stability, resistance to chemical contaminants, size, cost, longevity, and the like.

Depending on the strength of the magnetic field, different magnetic field detectors 233 may be selected, such as: low field (less than 1 milligauss), midfield (1 milligauss to 10 gauss), and high field (greater than 10 Gauss). The magnetic field detector 233 can be, but not limited to, a superconducting quantum interference device (SQUID) sensor, a fiber optic sensor, a photoexcited sensor, a nuclear precession sensor, a detection coil sensor, and an isotropic Magnetoresistive sensor, fluxgate sensor, magneto-sensitive diode sensor, magnetocrystalline sensor, magneto-optical sensor, giant magnetoresistance (GMR) sensor, reed switch, Lauren Force devices, Hall effect sensors, microelectrochemical (MEMS) sensors, and the like.

In some embodiments, the ion detector 234 can be used to detect contaminants in the air in a semiconductor manufacturing facility, including ion species in the form of micro/nano-level aerosols, such as F ^- , Cl ^- , NO ₃ ^- , PO ₄ ^3- , SO ₄ ^2- , NH ₄ ⁺ and NO ₂ ^- . In some other embodiments, the AMC detector 235 can detect organic species such as acetone/isopropanol, propylene glycol methyl ether (PGME), toluene, and propylene glycol methyl ether acetate (PGMEA). In some embodiments, the level of contaminants of these ions and organic species can range from a few ppm to tens of ppm in a typical semiconductor fabrication facility. In some embodiments, the ideal ion detector 234 and the AMC detector 235 for detecting the level of contaminants should have the following properties, including: low drift and noise levels, high sensitivity, short response time, and wide linear dynamics. Range, low void volume, insensitive to measurement conditions (such as solvent, flow and temperature), simple operation, high reliability, small size/light weight and low power consumption.

In some embodiments, at least one of the following ion detectors 234 can be used, such as a conductivity detector, an amperometric detector, and a mass spectrometer. In some embodiments, ion detector 234 can be an electrochemical sensor in which a gas sample, such as an air sample from a semiconductor fabrication facility environment, can create bubbles in an aqueous solution. According to some embodiments, the ions can be oxidized and returned to the solution at the characteristic voltage, especially by applying a reduction voltage to the cations that are reduced at the electrodes of the electrochemical sensor, and the concentration can be measured by measuring the current density. .

In some embodiments, ion detector 234 can be a chromatograph. Chromatography and mass spectrometry can be used to provide detailed analysis of contaminant species and their concentrations. Qualitative and quantitative analysis of common ions in different forms and detection of matrix traces and ultra-trace concentrations of matrix. In some embodiments, chromatograms that can be used include liquid phase and/or gas chromatography. Chromatographic instruments typically include: pumps, syringes, columns, suppression tubes, detectors, and recorders or data systems. All materials used in the system must not react with many organic solvents or aqueous solutions with extreme pH values. In some embodiments, containers and dispensing systems (eg, tubing, valves, pumps, columns, sampling devices, and detectors) that may be in contact with the solution may be made of plastic, such as polyetheretherketone (PEEK) or glass. In some embodiments, the vacuum can be achieved within the vessel and helium purge can be used to eliminate noise from the tiny bubbles in the solution. In some embodiments, depending on the flow rate and the type of flow, various types of pumps can be selected to flow the liquid to the detector, such as a constant flow pump, a reciprocating piston pump, a dual piston pump, and the like. In some embodiments, the cations can be separated on a cation exchange column and the anions can be separated on an anion exchange column. In some embodiments, the composition of the eluent can be adjusted to adjust the detection limit and separation time.

In certain embodiments, the chromatographic instrument can be a thermal desorption (TD) instrument plus a gas chromatography-mass spectrometry (GC-MS) instrument. This TD-GCMS instrument can be used as an AMC detector to detect volatile AMC contaminants. The sorbent tubes were heated to volatilize the collected organics using a TD-GCMS instrument and then analyzed by GC-MS instrumentation. In some embodiments, the AMC detector 235 can be a thermal conductivity sensor based on detecting different thermal conductivities of the gas and its concentration in air. In some embodiments, to monitor trace contaminants in the air, the air sample can be concentrated using an impact collector or sorbent tube, wherein the impact collector is a water filled tube that creates bubbles in the tube. According to certain embodiments, air pollutants accumulate in the water and can be analyzed thereafter.

In another embodiment, Resonant Cavity Oscillation Attenuation Spectroscopy (CDRS) and Ion Mobility Spectroscopy (IMS) with short reaction times can be used for continuous contaminants in ion detector 234 and/or AMC detector 235. monitor. CDRS has been developed as a sensitive and fast gas detector (eg ammonia) with accuracy and sensitivity below one part per billion (ppb) in seconds to minutes. Generally, the CDRS measurement can effectively extend the light absorption in the mirror cavity of the optical path. According to some embodiments, IMS can be used to detect ions and organic species with short reaction times, but the ability to identify compounds is limited depending on the application.

In some embodiments, the ion detector 234 and the AMC detector 235 can be: a flame ionization detector (FID), a combustible gas indicator (CGI), a portable infrared (IR) spectrophotometer, and ultraviolet ( UV) optical free detector (PID), gas chromatography and nitrogen/phosphorus detector (GC/NPD), inductively coupled plasma atomic emission spectrometry (ICP-AES), gas phase using thermal energy analyzer Chromatography (GC-TEA), gas chromatography using a conductivity detector (GC-ECD), and the like. In some embodiments, a plurality of ion detectors, AMC detectors, and combinations thereof can be used depending on the type of contaminant and its concentration.

The sampling medium in the form of a filter or adsorbent (not shown) depends primarily on the type of contaminant. For example, charcoal can be used to absorb organic matter (such as AMC), while anionic materials (negatively charged ions) can be absorbed on prewashed silicone/beads and mixed cellulose ester filters (MCEF). Depending on the implementation, passive air collection or pumps that actively draw air through the filter or adsorbent may be used depending on the concentration of the contaminant and the measurement requirements. In some embodiments, it is more efficient to use a pump for active sample collection at a flow rate that is large enough to concentrate contaminants on the adsorbent and reduce detection time compared to passive sample collection.

In some embodiments, monitoring of the facility is performed by an image sensor (ie, camera) 236 that can be integrated into the AMHS carrier to detect unauthorized personnel and/or activities. According to some embodiments, the visible light based image sensor 236 can be a semiconductor charge coupled device (CCD), an active pixel sensor in a complementary metal oxide semiconductor (CMOS), or an optical signal based on a detected wavelength different from visible light. Sensor. Functions such as camera control (moving, recording, zooming, moving left and right, etc.) and motion/face detection can be provided by a control software based on a predefined algorithm. According to some embodiments, an algorithm for processing video data acquired from an image sensor may be implemented in an on-board computer and/or processor, or the video material may be transmitted through a communication interface 202 (eg, wired or wireless or The combination is transmitted to the host computer 201 for processing.

In some embodiments, the radio frequency (RF) detector 237 can also be integrated into the AMHS carrier for use with, but not limited to, mobile network signals, GPS signals, Wi-Fi signals, Bluetooth signals, radio signals, and/or Or any other type of modulated wireless signal to detect any unauthorized wireless communication at a semiconductor manufacturing facility. The RF detector can be one of the following sensors, including but not limited to: CMOS (Complementary Metal Oxide Semiconductor) Schottky diode, MOSFET (Metal Oxide Semiconductor Field Effect Transistor) diode, etc. Polar body sensor. In some embodiments, the RF detector 237 can be: a thermal RF sensor including at least one temperature sensor, including a series of processes such as an attenuator, a mixer, an amplifier, a filter, an analog/digital converter, and the like. Receiver type detector for circuits. The selection of the RF detector 237 is based on the detection frequency, power consumption, and the like.

In addition to the plurality of sensors and detectors on the AMHS carrier, in a data processing unit 203 including a filter, an operational amplifier, a signal conditioner, etc., a monolithic signal conditioning circuit is typically required for implementation including scaling. , amplification, linearization and analog/digital conversion functions.

In accordance with some embodiments of the present disclosure, FIG. 2B is a block diagram of the data processing unit 203, the transport carrier unit 204, and the wafer processing unit 205 of the monitoring system 200 shown in FIG. 2A. The data processing unit 203, the transport vehicle unit 204, and the wafer processing unit 205 in the monitoring system 200 may each include: a processor, a memory, an input/output interface (hereinafter referred to as an I/O interface), a communication interface, and a system. Bus bar. In some embodiments, components of data processing unit 203, transport carrier unit 204, and wafer processing unit 205 in monitoring system 200 can be combined or omitted, such as without a communication interface. In some embodiments, the data processing unit 203, the transport carrier unit 204, and the wafer processing unit 205 of the monitoring system 200 may include other components not shown in FIG. 2B, for example, the data processing unit 203 of the monitoring system 200, and transportation. Carrier unit 204 and wafer processing unit 205 may also include a power subsystem that provides power to the light source. In other embodiments, the data processing unit 203, the transport carrier unit 204, and the wafer processing unit 205 of the monitoring system 200 may include a number of components shown in FIG. 2B.

Processor 212 may include any processing circuitry for controlling the operation and performance of data processing unit 203, transport carrier unit 204, and wafer processing unit 205 of monitoring system 200. In some aspects, processor 212 may be implemented as: general purpose processor, single chip multiprocessor (CMP), dedicated processor, embedded processor, digital signal processor (DSP), network processor, Input/Output (I/O) processor, Media Access Control (MAC) processor, radio baseband processor, coprocessor, such as Complex Instruction Set Computing (CISC) microprocessor, Reduced Instruction Set Computing (RISC) A microprocessor or other processing device for a microprocessor and/or a very long instruction word (VLIW) microprocessor. The processor subsystem can also be implemented by a controller, a microcontroller, an application specific integrated circuit (ASIC), a field programmable logic gate array (FPGA), a programmable logic device (PLD), or the like.

In some aspects, processor 212 can be arranged to run an operating system (OS) and some applications. Examples of operating systems include, for example, an operating system that typically uses the Apple operating system, the Microsoft Windows operating system, the Android operating system, and any other proprietary or open source operating system. Examples of applications include: phone applications, camera (such as digital cameras, cameras) applications, browser applications, multimedia player applications, game applications, communication software (such as e-mail, newsletters, multimedia), view Application, etc.

In some embodiments, at least one non-transitory computer readable storage medium storing computer executable instructions is provided. Wherein, when executed by at least one processor, the computer executable instructions cause at least one processor to perform the method described. The computer readable storage medium can be implemented in the memory 213.

In some embodiments, memory 213 may comprise any machine readable or computer readable medium capable of storing material, including volatile/nonvolatile memory and removable/non-removable memory. Memory 213 may contain at least one non-volatile memory unit. A non-volatile memory unit is capable of storing one or more software programs. Software programs may include applications, user profiles, device profiles, and/or configuration materials, or combinations thereof. The software program may include instructions that may be executed by components of data processing unit 203, transport carrier unit 204, and wafer processing unit 205 of monitoring system 200.

For example, the memory 213 may include read only memory (ROM), random access memory (RAM), dynamic random access memory (DRAM), double data rate dynamic random access memory (DDR-RAM). Synchronous Dynamic Random Access Memory (SDRAM), Static Random Access Memory (SRAM), Programmable Read Only Memory (PROM), Erasable Regulated Read Only Memory (EPROM), Electronic erasable rewritable read-only memory (EEPROM), flash memory (such as NOR or NAND flash memory), combined memory (CAM), polymer memory (such as ferroelectric polymer memory), phase Change memory (such as two-way memory), ferroelectric memory, 矽-oxide-nitride-oxide-矽 (SONOS) memory, disk memory (such as soft disk, hard disk, CD, disk) , card (such as magnetic card, optical card) or any other type of medium suitable for storing messages.

In an embodiment, memory 213 may include a set of instructions in the form of a file to perform a method of generating one or more timing libraries as described herein. The set of instructions may be stored in machine readable instructions in any acceptable form, including source code or various suitable programming languages. Some examples of programming languages that can be used to store instruction sets include, but are not limited to, Java, C, C++, C#, Python, Objective-C, Visual Basic, or .NET programming. In some embodiments, a compiler or interpreter is included to convert the set of instructions into machine executable code for execution by processor 212.

In some embodiments, I/O interface 214 may include any suitable mechanism or component, at least for the user to provide input to data processing unit 203, transport carrier unit 204, and wafer processing unit 205, while data processing unit 203 The transport carrier unit 204 and the wafer processing unit 205 are capable of providing an output to the user. For example, I/O interface 214 may include any suitable input mechanism, including but not limited to: buttons, keypads, keyboards, click wheels, touch screens, or motion sensors. In some embodiments, the I/O interface 214 may include a capacitive sensing mechanism or a multi-touch capacitive sensing mechanism (such as a touch screen).

In some embodiments, the I/O interface 214 may include a visual peripheral output device for providing a user-visible display. For example, the visual peripheral output device may include a screen coupled to a data processing unit 203 of the monitoring system 200, a transport carrier unit 204, and a liquid crystal display (LCD) in the wafer processing unit 205. In another example, the visual peripheral output device may include a movable display or projection for providing content display on the surface of the data processing unit 203, the transport carrier unit 204, and the wafer processing unit 205 remote from the monitoring system 200. system. In some embodiments, the visual peripheral output device can include an encoder/decoder, also referred to as a codec, that converts the digital media data into analog signals. For example, the visual peripheral output device may include: a video codec, an audio codec, or any other suitable type of codec.

The visual peripheral output device may also include a display driver, circuitry for driving the display driver, or both. The visual peripheral output device can display the content under the direction of the processor 212. For example, the visual peripheral output device can play media playback information, the data processing unit 203 of the topology scanning system (monitoring system 200), the transport vehicle unit 204, and the image of the application implemented on the wafer processing unit 205, regarding the ongoing Information about communication operations, information about incoming communication requests, or device operation screens.

In some embodiments, the communication interface 215 may include any capable of coupling the data processing unit 203, the transport carrier unit 204, and the wafer processing unit 205 of the monitoring system 200 to one or more networks and/or additional devices ( For example, a suitable hardware, software or combination of hardware and security sensors and detectors 230, AMHS carriers 208, front open wafer transfer boxes 209 and stations 210). Communication interface 215 may be arranged to operate in any suitable technique for controlling information signals using a set of ideal communication protocols, services or operating procedures. The communication interface 215 may include appropriate physical connectors to connect to the corresponding communication medium, whether wired or wireless.

According to some embodiments, a network routing communication system and method consists of. In some aspects, the network may include regional networks (LANs) and wide area networks (WANs), including but not limited to: Internet, wired channels, wireless channels, communication devices including telephones and computers, wires, radios, Light or other electromagnetic channels and combinations thereof, including other devices and/or components capable of transmitting/receiving data. For example, the communication environment includes intra-body communication, various devices, and various communication modes such as wireless communication, wired communication, and combinations thereof.

The wireless communication mode includes any communication mode between points (e.g., nodes) that utilizes at least a portion of the wireless technology, and the wireless technology includes a combination of various protocols and protocols related to wireless transmission, data, and devices. These include: wireless devices such as wireless headsets, audio and multimedia devices and devices such as audio players and multimedia players, telephones including mobile phones and wireless phones, and computer and computer related devices and components, such as: A watch machine, a networked machine such as a circuit generation system, and/or any other suitable device or third party device.

The wired communication mode includes any inter-point communication mode that utilizes wired technology, and the wired technology includes a combination of various protocols and agreements related to wired transmission, data, and devices. These include: audio and multimedia devices and devices such as audio players and multimedia players, phones containing mobile phones and wireless phones, and computer and computer related devices and components such as printers, networked machines and/or Or any other suitable device or third party device. In some implementations, the wired communication module can communicate according to several wired protocols. Examples of wired protocols may include: Universal Serial Bus (USB) communication, RS-232, RS-422, RS-423, RS-485 sequence protocol, FireWire, Ethernet, Fibre Channel, MIDI, ATA, SATA, PCI Express, T-1 (and its variants), industry standard architecture (ISA) parallel communication, small computer system interface (SCSI) communication, or peripheral component interconnect (PCI) communication.

Therefore, in some aspects, the communication interface 215 may include one or more interfaces, such as a wireless communication interface, a wired communication interface, a network interface, a transmission interface, a receiving interface, a media interface, a system interface, a component interface, and a switching interface. , wafer interface, controller, etc. For example, when the communication interface 215 is implemented by a wireless device or is located in a wireless system, it may include a wireless communication interface including one or more antennas, transmitters, receivers, transceivers, amplifiers, Filters, control logic, etc.

In some aspects, communication interface 215 may provide voice and/or data communication functionality in accordance with a number of wireless protocols. Examples of wireless protocols may include various wireless local area network (WLAN) protocols, including the Institute of Electrical and Electronics Engineers (IEEE) 802.xx family of protocols, such as IEEE 802.11a/b/g/n, IEEE 802.16, IEEE 802.20, and the like. Other examples of wireless protocols may include various wireless wide area network (WWAN) protocols such as GSM mobile radiotelephone system protocols using GPRS, CDMA mobile radiotelephone communications systems using 1 x RTT, EDGE systems, EV-DO systems, EV- DV system, HSDPA system, etc. Further examples of wireless protocols may include wireless personal area network (PAN) protocols, such as infrared protocols, protocols from the Bluetooth Technology Alliance (SIG) series of protocols, including Bluetooth specification versions v1.0, v1.1, V1.2, v2 .0, v2.0 with enhanced data rate (EDR) and one or more Bluetooth specifications. Another example of a wireless protocol may include near field communication technologies and protocols such as electromagnetic induction (EMI) technology. Examples of EMI technology may include active or passive radio frequency identification (RFID) protocols and devices. Other suitable agreements may include Ultra Wideband (UWB), Digital Office (DO), Digital Home, Trusted Platform Module (TPM), ZigBee, and more.

In some embodiments, the data processing unit 203, the transport carrier unit 204, and the wafer processing unit 205 of the monitoring system 200 may include a system bus 216 coupled to the processor 212, the memory 213, and the I/O interface 214. Various system components. System bus 216 can be any of the following bus structures, including a memory bus or memory controller, a peripheral bus or external bus, and/or a regional bus using various available bus architectures, including But not limited to: 9-bit bus, industry standard architecture (ISA), micro channel architecture (MSA), extended industry standard architecture (EISA), intelligent electronic driver (IDE), VESA regional bus (VLB), international PC Memory Card Association (PCMCIA) bus, small computer system interface (SCSI) or other dedicated bus and any custom bus for computing device applications.

In accordance with some embodiments of the present disclosure, FIG. 3 is a flow chart showing a method 300 for monitoring environmental and safety monitoring of a monitoring system shown in the present disclosure for use in an AMHS carrier for use in a semiconductor manufacturing facility. The monitoring method 300 begins at step 302, in which the host computer selects, controls, and transports an AMHS carrier to a first loading location, such as a loading port of a storage station, a wafer processing and measurement device within the processing area. Next, the monitoring method 300 continues to step 304 where the AMHS carrier is operated to mechanically couple with a FOUP at the first loading location based on the location information of the FOUP in the storage station. In some embodiments, a driver can be used to determine the position of the FOUP on the rack and remove the FOUP from the corresponding location. In some implementations, the driver can also determine the destination of the FOUP. In some embodiments, the host computer can send a command to the AMHS carrier to pick up the FOUP from a first location (eg, a first processing station, a first measurement station, or a first storage station). The monitoring method 300 continues to step 306 where the AMHS carrier is transported on a transport track to a second location (eg, a second processing station, a second measurement station, or a second storage station). If the device is not occupied, the FOUP can be shipped directly to the device to perform the next processing or measurement step; if the device is in use, the FOUP can be shipped to the storage station in the corresponding processing area of the device; or, FOUP also It may be shipped outside the manufacturing facility. The monitoring method 300 further proceeds to step 308, in which the host computer triggers a plurality of sensors and detectors for continuous, immediate environmental and security monitoring in the semiconductor manufacturing facility (eg, in different process areas) At a certain station, etc.). According to some embodiments, data from a plurality of sensors and detectors can be transmitted back to the host computer for processing via a nearby wireless router. In some embodiments, depending on the type of measurement, the reaction time of the detector, and the concentration of contaminants, the AMHS carrier may be stopped during transport on the transport track to collect air samples for measurement. In some embodiments, the AMHS carrier may be stopped multiple times along the way for sample collection and data measurement. Finally, the monitoring method 300 continues with step 310 in which the AMHS carrier is transported and the FOUP is then transported to the second location. In some embodiments, the second location can be a second processing or metrology station, a second storage station to temporarily store wafers, or an off-site (eg, package).

In one embodiment, a method of monitoring environmental and safety in a manufacturing facility includes transporting an automated material handling system (AMHS) carrier from a first location to a second location, and using at least one sensing on the AMHS carrier The device detects at least one parameter to determine at least one environmental or safety condition between the first location and the second location.

In one embodiment, a monitoring system that monitors the environment and safety in a manufacturing facility includes a carrier. The vehicle is configured to automatically load, unload, and transport at least one wafer. The carrier is configured to carry at least one sensor. At least one sensor is configured to determine at least one environmental or safety condition when the carrier is transported in a manufacturing facility.

In another embodiment, a monitoring system for monitoring environmental and safety in a manufacturing facility includes: an automated carrier, at least one contaminant sensor coupled to the automated carrier, and at least one security sense coupled to the automated carrier Detector.

Although the present disclosure has been described in terms of exemplary embodiments, the present disclosure is not limited thereto. Rather, the scope of the appended claims is to be construed as being construed as being limited by the scope of the invention .

Claims (20)

 A monitoring method for monitoring environment and safety within a manufacturing facility, the method comprising: transporting an automated material handling system carrier from a first location to a second location; and using the automated material handling system The at least one sensor detects at least one parameter to determine at least one environmental or safety condition between the first location and the second location.    The monitoring method of claim 1, wherein the automated material handling system carrier is transported on an overhead transport track.    The monitoring method of claim 1, wherein the automated material handling system carrier is configured to load, unload, and transport a plurality of wafers from the first location to the second location.    The monitoring method of claim 1, wherein the at least one sensor comprises at least one of: a humidity sensor, a temperature sensor, a magnetic field sensor, an ion contaminant detector, and a Organic pollutant detector, a camera and an RF signal detector.    The monitoring method of claim 1, wherein the at least one environmental or safety condition comprises at least one of: temperature, humidity, magnetic field strength/direction, degree of contamination/type of ion species in the air, degree of contamination of organic species in the air /Type, unauthorized personnel/activities and unauthorized wireless communications.   The monitoring method according to claim 5, wherein the ionic species in the air comprise NH ₄ ⁺ , Fe ²⁺ , Fe ³⁺ , Na ⁺ , F ⁻ , Cl ⁻ , NO ₃ ⁻ , PO ₄ ^3- , SO ₄ ^{2 -} and NO ₂ ^- .  The monitoring method of claim 5, wherein the organic species in the air comprises acetone/isopropanol, propylene glycol methyl ether (PGME), toluene, and propylene glycol methyl ether acetate (PGMEA).    The monitoring method of claim 5, wherein the unauthorized wireless communication comprises communication using a mobile network signal, a GPS signal, a Wi-Fi signal, a Bluetooth signal, and a radio signal.    The monitoring method of claim 1, further comprising: transmitting the detected at least one parameter to a host computer via a wireless communication network.    A monitoring system for monitoring environment and safety within a manufacturing facility, the monitoring system comprising: a carrier configured to automatically load, unload, and transport at least one wafer, wherein the carrier is configured to carry at least one sensing The at least one sensor is configured to determine at least one environmental or safety condition when the carrier is transported in a manufacturing facility.    The monitoring system of claim 10, wherein the carrier is an automated material handling system (AMHS) transport vehicle.    The monitoring system of claim 10, wherein the at least one sensor comprises at least one of: a humidity sensor, a temperature sensor, a magnetic field sensor, an ion contaminant detector, and a Organic pollutant detector, a camera and an RF signal detector.    The monitoring system of claim 10, wherein the at least one environmental or safety condition comprises at least one of: temperature, humidity, magnetic field strength/direction, degree of contamination/type of ion species in the air, degree of contamination of organic species in the air /Type, unauthorized personnel/activities and unauthorized wireless communications.   The monitoring system of claim 13, wherein the ion species in the air comprise NH ₄ ⁺ , Fe ²⁺ , Fe ³⁺ , Na ⁺ , F ⁻ , Cl ⁻ , NO ₃ ⁻ , PO ₄ ^3- , SO ₄ ^{2 -} and NO ₂ ^- .  The monitoring system of claim 13, wherein the organic species in the air comprises acetone/isopropanol, propylene glycol methyl ether (PGME), toluene, and propylene glycol methyl ether acetate (PGMEA).    The monitoring system of claim 13, wherein the unauthorized wireless communication comprises communication using a mobile network signal, a GPS signal, a Wi-Fi signal, a Bluetooth signal, and a radio signal.    The monitoring system of claim 10, further comprising: a control unit configured to control the vehicle and the at least one sensor; a data processing unit configured to receive data from the at least one sensor; A host computer.    A monitoring system for monitoring environment and safety within a manufacturing facility, the monitoring system comprising: an automated carrier; at least one pollutant sensor coupled to the automated carrier; and at least one safety sensor, Coupled to the automated carrier.    The monitoring system of claim 18, wherein the at least one contaminant sensor is configured to detect at least one inorganic and organic contaminant in the air in a manufacturing facility.    The monitoring system of claim 18, wherein the at least one security sensor is configured to detect at least one security parameter, the at least one security parameter comprising an unauthorized person and wireless communication.