TW201916210A - Chip transfer device and method for transferring chip using the same which do not need to set any suction device - Google Patents

Abstract

A grain transfer device is suitable for transferring a plurality of grains on a first carrier sheet to a second carrier sheet, and includes a mobile carrier device and a top contact device. The mobile bearing device includes two oppositely spaced and relatively translatable bearing portions, and the bearing portions are respectively used for setting the first bearing piece and the second bearing piece, and the crystal grains on the first bearing piece are located at Between the first carrier sheet and the second carrier sheet. The top contact device includes a top contact member on a side of the first carrier sheet opposite to the grains, and the top contact member can contact the first carrier sheet to transfer the corresponding die to the second carrier. a. In addition, the present invention also provides a method for transferring grains using the aforementioned grain transfer equipment.

Description

Grain transfer equipment and method for transferring grain using the equipment

The present invention relates to a grain transfer device and a method for transferring grains, and particularly to a grain transfer device and a method for transferring grains without using a nozzle device.

In the semiconductor manufacturing process, a plurality of dies that have been cut are sorted according to their appearance, quality, or characteristics through a die picking device. The grain picking device mainly includes a base, a load bearing device provided on the base and having two spaced apart load bearing portions, and a thimble device provided on the base and located under the load device and having a thimble piece. A suction device arranged on the base and juxtaposed on the bearing device, and an image capture device arranged on the base and positioned on the bearing part.

When the grain picking is to be performed, a first carrier sheet having a plurality of grains is set on one of the carrier parts, and at the same time, a second carrier sheet that can be used for bonding the grains after picking It is arranged on another one of the bearing parts, and the image capturing device is first located on the die to determine the appearance quality of the die and confirm the position, and then the ejector piece of the ejector device is pressed against the first bearing. Sheet, so that one of the crystal grains on the first carrier sheet is raised, and then the raised crystal grains are sucked by a suction head of the suction device. Finally, the suction device will move the crystal grains by vertical movement, translation, or rotation. The crystal grains are sucked and transferred to the second supporting sheet.

It can be known from the foregoing description that the existing grain picking equipment needs to additionally provide the suction device in order to perform grain picking and transfer, which not only increases the cost of the equipment, but also requires that the grains be transferred through the suction device for transfer. Moving back and forth between the first carrier sheet and the second carrier sheet results in poor grain transfer efficiency and reduces the overall process rate.

Therefore, it is an object of the present invention to provide a grain transfer device that does not require a suction device.

Therefore, the grain transfer device of the present invention is suitable for transferring a plurality of grains on a first carrier sheet to a second carrier sheet. The grain transfer device includes a mobile carrier device and a top contact device.

The mobile bearing device includes two oppositely spaced and relatively translatable bearing portions, and the bearing portions are respectively used for setting the first bearing piece and the second bearing piece, and the crystal grains on the first bearing piece are located at Between the first carrier sheet and the second carrier sheet.

The top contact device includes a top contact member on a side of the first carrier sheet opposite to the grains, and the top contact member can contact the first carrier sheet to transfer the corresponding die to the second carrier. a.

In addition, the invention also provides a method for transferring grains.

The method for transferring grains is suitable for transferring a plurality of grains on a first carrier sheet to a second carrier sheet. The method for transferring grains includes a preparation step, a setting step, a moving step, and a contact. Transfer steps.

The preparing step is to prepare the grain transfer equipment, the grains, the first carrier sheet, and the second carrier sheet as described above.

The setting step is to respectively set the first carrier sheet and the second carrier sheet carrying the crystal grains on the carrier parts, and let the crystal grains be located on the first carrier sheet and the second carrier sheet. between.

The moving step is to translate the bearing portions, so that the crystal grains on the first bearing piece are correspondingly moved to the axis of the top contact piece.

The top contact transfer step is to allow the top contact member to contact the first carrier sheet and transfer the corresponding die to the second carrier sheet.

The effect of the present invention is that, in the present invention, the suction device in the existing grain picking equipment is omitted, and the first carrier sheet and the second carrier sheet are spaced apart from each other so that the crystal grains are located on the first carrier sheet. And the second carrier sheet, and directly contacting the first carrier sheet through the top contact member to directly transfer the corresponding crystal grains to the setting surface of the second carrier sheet without the need for an additional suction device, Not only can effectively reduce equipment costs, but also improve grain transfer efficiency.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are represented by the same numbers.

1 to 3, a first embodiment of a grain transfer device 2 according to the present invention includes a base 20, a mobile carrying device 21 connected to the base 20, and a base 20 and connected to the base 20. A top contact device 22 spaced apart from the mobile bearing device 21, an abutment member 23 disposed on the base 20 and correspondingly located on the opposite side of the top contact device 22 and spaced apart from the mobile load bearing device 21, and a base member disposed on the base The base 20 is an image capturing device 24 spaced from the mobile carrying device 21.

The grain transfer device 2 is suitable for placing a first carrier sheet 31 and a second carrier sheet 32 on the mobile carrier device 21, and through the top contact device 22, the abutment member 23, and the image capture. The device 24 transfers the plurality of dies 4 on the first carrier sheet 31 to the second carrier sheet 32.

Specifically, the mobile bearing device 21 includes two bearing portions 211 spaced apart from each other and capable of being relatively translated. The bearing portions 211 are respectively used for setting the first bearing piece 31 and the second bearing piece 32. A carrier sheet 31 has a bearing surface 311 for carrying the crystal grains 4, and the second carrier sheet 32 has a setting surface 321 for the crystal grains 4 to be disposed after the chip 4 is transferred. When the first carrier sheet 31 and the second carrier sheet 32 are disposed on the carrier portions 211, the crystal grains 4 on the first carrier sheet 31 are located on the first carrier sheet 31 and the second carrier sheet 211. Between a set surface 321 of the carrier sheet 32.

The top contact device 22 is located on the side of the first carrier sheet 31 opposite to the die 4 corresponding to the die 4, and the top contact device 22 includes an outer ring sleeve 221 and an outer ring sleeve 221. The top contact member 222 can protrude from the outer ring sleeve 221 to contact the first carrier sheet 31 and directly transfer the corresponding die 4 to the setting surface of the second carrier sheet 32. 321 on.

The abutting member 23 is located on the side of the second carrier sheet 32 opposite to the setting surface 321 corresponding to an axis of the top contact member 22 to abut the second carrier sheet 32, that is, the first carrier The sheet 31 and the second supporting sheet 32 are located between the top contact device 22 and the abutting member 23. The abutting member 23 has a pipe wall 231 defining a through hole 232 along the axis, and a through hole The tube wall 231 defines a groove 233 that communicates with the through hole 232.

The arrangement of the image capturing device 24 is not particularly limited, as long as it is arranged corresponding to the crystal grains 4 and can irradiate the crystal grains 4, in the first embodiment, it is an axis corresponding to the abutting member 23. The abutting member 23 is disposed on the abutting member 23 such that the abutting member 23 is located between the second carrier sheet 32 and the image capturing device 24.

In detail, in the first embodiment, the first carrier sheet 31 and the second carrier sheet 32 are based on a blue tape, and the crystal grains 4 are light emitting diode crystal grains. As an example, the first carrier sheet 31 and the second carrier sheet 32, which are both blue films and have the crystal grains 4, are provided on the crystal grain transfer device 2 of the first embodiment. That is, a grain sorting process capable of sorting and sorting these grains 4 according to their appearance, quality or characteristics. Before the top contact member 222 touches the first carrier sheet 31, the crystal grain 4 to be jacked up is irradiated through the image capturing device 24 to detect the appearance or quality of the crystal grain 4. While the contact member 222 abuts against the first carrier sheet 31 so that the die 4 is lifted up and directly transferred to the second carrier sheet 32, the abutment member 23 can abut against the second carrier sheet. 32, for controlling the force with which the crystal grains 4 are transferred to the second carrier sheet 32.

It should be noted that the appearance of the abutment member 23 is not particularly limited, as long as it can abut the second carrier sheet 32 and assist the detection and transfer of the crystal grains 4, in the first embodiment As an example, the abutting member 23 is a rigid straight pipe with a groove 233 on the side. In detail, the image capturing device 24 is coaxially disposed with the abutting member 23, and therefore, the image capturing device 24 can irradiate the crystal grains 4 through the through hole 232 of the abutting member 23 located on the axis for inspection. Preferably, the groove 233 communicating with the through hole 232 is further formed on the tube wall 231 of the abutting member 23, and a lateral lighting can be used to help enhance the clearer imaging of the image capturing device 24 to More accurate detection of each crystal grain 4.

Since the present invention omits the suction device in the existing grain picking equipment, but directly contacts the first carrier sheet 31 through the top contact member 222 of the top contact device 22, so that the corresponding die 4 is directly lifted up. Transfer to the second carrier sheet 32, therefore, in order to avoid that the top contact member 222 needs an excessive distance to contact the die 4 from the first carrier sheet 31 to the second carrier sheet 32 and cause the top The contact member 222 penetrates the first carrier sheet 31. Preferably, a distance between the first carrier sheet 31 and the second carrier sheet 32 is between 0.5 mm and 4 mm. In addition, by making the viscosity of the setting surface 321 of the second carrier sheet 32 greater than that of the carrier surface 311 of the first carrier sheet 31, it is easier for the crystal grains 4 to be jacked by the top contact member 222. The first supporting sheet 31 is separated from the second supporting sheet 32 by the abutment member 23 to more firmly adhere the die 4 to the second supporting sheet 32.

Referring to FIGS. 4 to 6, a second embodiment of the grain transfer device 2 of the present invention is substantially the same as the first embodiment, except that the top contact device 22 and the first bearing of the second embodiment are the same. The positions of the sheet 31 and the second supporting sheet 32 are opposite to those of the first embodiment, and the abutting member 23 is not provided. In detail, in the second embodiment, the die-bonding process of the crystal grains 4 is mainly performed. Therefore, the first carrier sheet 31 is still a blue film with the crystal grains 4, and the second carrier The sheet 32 is replaced with a package holder having a die-casting adhesive, and in order to prevent the die-bond on the packaging holder from flowing, the second carrier sheet 32 is placed under the first carrier sheet 31 and the top contacts The device 22 is disposed above the first carrier sheet 31, so that the top contact piece 222 of the top-contacting device 22 can contact the first carrier sheet 31 from above to downward, so as to transfer the grains 4 to the lower part. The die-bonding process is completed on the die-bonding adhesive of the second carrier sheet 32.

In order to explain the foregoing grain transfer device 2 of the present invention more clearly, a method for transferring grains using the aforementioned grain transfer device 2 will be described below.

Referring to FIG. 7 and FIG. 3, a first embodiment of the method for transferring grains according to the present invention is described. When the grain transfer device 2 shown in FIG. 1 is used for the grain picking process, the present invention transfers grains. An embodiment of the method includes a preparation step 51, a pre-processing step 52, a setting step 53, a moving step 54, and a touch transfer step 55.

The preparing step 51 is to prepare the grain transfer device 2, the grains 4, the first carrier sheet 31, and the second carrier sheet 32. In this embodiment, the grains 4 are light-emitting diodes. The bulk grain is taken as an example, and in the preparation step 51, the grains 4 are set on an initial carrier sheet (not shown), and the first carrier sheet 31 and the second carrier sheet 32 are crystallized by a blue film. Grain picking is taken as an example.

The pre-processing step 52 is to adhere an exposed light-emitting surface 41 of each of the crystal grains 4 on the initial carrier sheet toward the carrier surface 311 of the first carrier sheet 31, and attach the initial carrier sheet from the crystals. The particles 4 are peeled off, so that the light emitting surfaces 41 of the crystal grains 4 are adhered to the bearing surface 311 of the first bearing sheet 31. The method for peeling the initial carrier sheet can heat or stretch the initial carrier sheet to expand the initial carrier sheet to reduce its viscosity and facilitate peeling.

In the setting step 53, the first carrier sheet 31 and the second carrier sheet 32 provided with the crystal grains 4 are respectively disposed on the carrier portions 21, and the crystal grains 4 are located on the first carrier sheet 31 and When the first carrier sheet 31 is disposed on one of the carrier parts 211 between the second carrier sheets 32, the periphery of the first carrier sheet 31 is stretched by an expansion ring, so that the The first carrier sheet 31 expands to reduce its viscosity, so as to facilitate subsequent transfer of the crystal grains 4.

The moving step 54 translates the bearing portions 211, so that the crystal grains 4 on the first carrier sheet 31 are correspondingly moved to the axis of the top contact piece 222, and the crystal grains 4 are detected by the image capturing device 24. .

The top contact transfer step 55 allows the top contact member 222 to abut against the first carrier sheet 31 and jack up the corresponding die 4 and directly transfer and stick to the setting surface 321 of the second carrier sheet 32 to complete Die picking process.

It should be particularly noted here that when the light-emitting surface 41 of each of the crystal grains 4 is covered on the bearing surface 311 of the first bearing sheet 31 through the assistance of the initial bearing sheet of the pre-processing step 52, When the crystal grains 4 are transferred from the first carrier sheet 31 to the second carrier sheet 32, the light emitting surfaces 41 of the crystal grains 4 can be reversed to the setting surface 321 of the second carrier sheet 32 to be exposed. . In addition, since the light emitting surfaces 41 of the crystal grains 4 are first placed on the first carrier sheet 31 in reverse, the positions of the crystal grains 4 in the first carrier sheet 31 are relatively The position on the initial carrier sheet is also correspondingly reversed. Therefore, before the transfer of the grains 4 is performed, the position of the grains 4 that has been inverted is adjusted and the corresponding control software is used to perform the position inversion process.

With reference to FIG. 6 and FIG. 7, a second embodiment of the method for transferring grains according to the present invention is described. When the solid crystals of the grains 4 are to be solidified, the grain transfer equipment 2 shown in FIG. 4 is used. Each step of the method for transferring grains in the second embodiment is substantially the same as the process of selecting grains in the first embodiment, except that the preparation step 51 and the setting step are performed. 53. Specifically, when the die-bonding process is to be performed, the second carrier sheet 32 prepared in the preparation step 51 is to prepare a packaging rack with a die-bond adhesive. In the setting step 53, the first carrier sheet 31 is prepared. The supporting portion 211 is disposed on the upper side, and the supporting portion 211 is disposed on the lower supporting portion 32 to prevent the cement glue from flowing, and the top contact member 222 is disposed on the first supporting plate 31 from above. Each of the crystal grains 4 of the first carrier sheet 31 is pressed downward to directly fix the crystal grains on the second carrier sheet 32 (package frame).

Referring to FIG. 8, a third embodiment of the method for transferring grains according to the present invention is described. The method for transferring grains in the third embodiment is substantially the same as the first embodiment, except that the third embodiment does not have The pre-processing step 52 includes an inversion step 56 implemented after the top-touch transfer step 55. Specifically, when the pre-processing step 52 as in the first embodiment is not performed, the crystal grains 4 are still disposed on the first carrier sheet 31 with their light emitting surfaces 41 facing away from the carrier surface 311, and When the top contact transfer step 55 is performed, the top contact member 222 touches the back surface of the crystal grains 4, so that the light emitting surfaces 41 of the crystal grains 4 are directly transferred and adhered to the second carrier sheet 32. On the setting surface 321, at this time, the inversion step 56 is further performed to adhere the back surface of each die 4 on the second carrier sheet 32 toward a third carrier sheet (not shown), so that each of the die 4 The light-emitting surface 41 is exposed away from the third carrier sheet.

In summary, the grain transfer equipment 2 of the present invention omits the suction device in the existing grain picking equipment, and is not only suitable for the grain picking process, but also for the solid crystal process (as long as one of the carrier sheets is Replace it with a package holder with die-casting glue), so that the first carrier sheet 31 and the second carrier sheet 32 are spaced from each other so that the crystal grains 4 are located on the first carrier sheet 31 and the second carrier sheet. 32, and directly contact the first carrier sheet 31 through the top contact member 222 to allow the corresponding die 4 to be directly transferred to the setting surface 321 of the second carrier sheet 32. No additional suction device is required. It can effectively reduce the equipment cost and improve the grain transfer efficiency, so it can indeed achieve the purpose of cost invention.

However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited by this, any simple equivalent changes and modifications made according to the scope of the patent application and the contents of the patent specification of the present invention are still Within the scope of the invention patent.

2‧‧‧ Grain transfer equipment

31‧‧‧The first carrier sheet

20‧‧‧ base

311‧‧‧bearing surface

21‧‧‧ Mobile bearing device

32‧‧‧Second carrier sheet

211‧‧‧bearing department

321‧‧‧Setting surface

22‧‧‧ Top contact device

4‧‧‧ Grain

221‧‧‧ Outer ring sleeve

41‧‧‧Emitting surface

222‧‧‧Top contact

51‧‧‧Preparation steps

23‧‧‧ abutment

52‧‧‧Pre-processing steps

231‧‧‧pipe wall

53‧‧‧Setting steps

232‧‧‧through hole

54‧‧‧ Move steps

233‧‧‧groove

55‧‧‧ Top touch transfer steps

24‧‧‧Image capture device

56‧‧‧ Flip steps

Other features and effects of the present invention will be clearly presented in the embodiment with reference to the drawings, in which: FIG. 1 is a partial perspective view illustrating a first embodiment of a grain transfer device of the present invention; FIG. 2 is a view along the line A schematic partial cross-sectional view taken along line II-II of 1 is provided to help explain the first embodiment of the grain transfer device; FIG. 3 is a schematic partial cross-sectional view illustrating a first load-bearing sheet and a second load-bearing sheet of the first embodiment , A contact device, and the relationship between a plurality of grains; FIG. 4 is a partial perspective view illustrating a second embodiment of the grain transfer device of the present invention; FIG. 5 is a schematic partial cross-sectional view taken along a line VV of FIG. 4 To help explain the second embodiment of the grain transfer device; FIG. 6 is a schematic partial cross-sectional view illustrating the first carrier sheet, the second carrier sheet, the top contact device, and the grains of the second embodiment; FIG. 7 is a schematic flowchart illustrating a first embodiment and a second embodiment of a method for transferring crystal grains using the crystal grain transfer equipment of FIG. 1 and FIG. 4; and FIG. 8 is a schematic flowchart of a process , Illustrated with Figure 1 A third method for transferring the transfer device grain grains embodiment.

Claims (12)

A grain transfer device is suitable for transferring a plurality of grains on a first carrier sheet to a second carrier sheet. The grain transfer device includes: a mobile carrier device including two oppositely spaced and relatively translatable carrier parts The load-bearing portions are respectively provided for the first load-bearing piece and the second load-bearing piece, and the crystal grains on the first load-bearing piece are located between the first load-bearing piece and the second load-bearing piece; and A top contact device includes a top contact member located on a side of the first carrier sheet opposite to the grains. The top contact member can contact the first carrier sheet to transfer the corresponding die to the second carrier. Carry on-chip. The grain transfer device as claimed in claim 1, further comprising a pair of abutting members on an axis of the second carrier sheet which is located on a side of the second carrier sheet opposite to the grains. The grain transfer device according to claim 2, further comprising a pair of image capturing devices disposed on an axis of the abutting member, the abutting member being located between the second carrier sheet and the image capturing device, the The abutting member has a tube wall defining a through hole along the axis, and a groove passing through the tube wall and communicating with the through hole. The grain transfer device according to claim 1, wherein the first carrier sheet and the second carrier sheet are both blue films. The grain transfer device according to claim 4, wherein the first carrier sheet has a bearing surface for carrying the grains, and the second carrier sheet has a setting surface for setting the grains, and the setting surface The viscosity is greater than the bearing surface. The grain transfer device according to claim 5, wherein the grains are light-emitting diode grains, and a light-emitting surface of each of the grains is disposed facing the load-bearing surface of the first load-bearing sheet. The grain transfer device according to claim 1, wherein the first carrier sheet is a blue film, and the second carrier sheet is a packaging rack having a die-casting glue. A method for transferring grains, which is suitable for transferring a plurality of grains on a first carrier sheet to a second carrier sheet. The method for transferring grains includes: a preparation step, preparing the items as described in claims 1 to 6 Grain transfer equipment, the grains, the first carrier sheet, and the second carrier sheet; a setting step, setting the first carrier sheet carrying the grains and the second carrier sheet to the On the bearing part, and let the grains be located between the first bearing sheet and the second bearing sheet; a moving step, translating the bearing parts, so that the grains on the first bearing sheet are moved to the correspondingly On the axis of the top contact member; and a top contact transfer step, the top contact member touches the first carrier sheet to transfer the corresponding die to the second carrier sheet. The method for transferring grains according to claim 8, wherein the grains prepared in the preparation step are light-emitting diode grains provided on an initial carrier sheet, and the method for transferring grains further includes an In the pre-processing step before the setting step, an exposed light-emitting surface of each of the crystal grains on the initial carrier sheet is adhered toward the first carrier sheet, and the initial carrier sheet is peeled off. The method for transferring grains according to claim 8, wherein the first carrier sheet and the second carrier sheet are blue films, and in the setting step, the first carrier sheet is disposed on one of the carrier portions and pulled. Extend the first carrier sheet. The method for transferring dies according to claim 8, wherein the second carrier sheet is a packaging frame having a die-bonding glue. The method for transferring grains according to claim 8, further comprising a reversing step performed after the top-contact transfer step, adhering the grains on the second carrier sheet toward a third carrier sheet, so that each of the crystals A light-emitting surface of the pellet is exposed away from the third carrier sheet.