TW201436062A - Grain selection method and die selection device for implementing the method - Google Patents

Abstract

A die selection device and method, the device comprising a flexible film for bonding a plurality of crystal grains, a viscous film which is opposite to the flexible film and transparent to light, and capable of being photographed through the viscous film An image capturing device for the die, and a pushing device capable of pushing the respective die through the flexible film; the method firstly positioning the die by using the image capturing device, and then using the pushing The device pushes the die to be adhered to the die of the adhesive film via the flexible film, so that the pushed die contacts the adhesive film, and the image picking device is used to detect the topped crystal. Whether the granule adheres to the viscous film; thereby, the die selecting device and method can instantly detect the grain transfer error, so as to perform the transfer operation again.

Description

Grain selection method and die selection device for implementing the method

The present invention relates to a die selection process, and more particularly to a die selection method for picking out defective grains or selecting grains according to a grain classification level, and a die selection device for implementing the foregoing method.

In the bad die selection or sorting process of the die, the wafer is first adhered to a soft film commonly known as blue tape, and then cut into a plurality of die. Then, in the case of the bad crystal selection operation, the image capturing device (for example, a CCD camera) can be used to detect the appearance of the crystal grain to perform the grain good judgment and the position confirmation, and then the defective product is removed from the soft film, and finally, The remaining grains are simultaneously removed from the flexible film for further processing such as packaging. Secondly, in the case of the die sorting operation, the image picking device can be used to confirm the position of the classified crystal grains, and the picking-and-place arm is used to select the crystal grains according to the specifications or Levels are removed and sorted separately.

Please refer to our new patent No. M386595, which provides a semiconductor die detection and detachment structure for performing the above-described process of detecting and picking up defective products. In detail, after detecting the crystal grains by the image capturing device, the structure uses a thimble unit to raise the die defect product from bottom to top through a soft film, and utilizes a paste disposed above the die. The film is adhered to the top of the grain, and an auxiliary thimble can be used to abut the die through the viscous film to make the grain more reliably adhere to the viscous film.

However, after the above structure is subjected to the topping and the transfer of the crystal grains, the crystal grains may still adhere to the soft film instead of the adhesive film, but the structure cannot immediately detect the transfer failure, and the softness needs to be waited for. After all the crystal grains on the film to be bonded to the adhesive film have been transferred, the soft film can be moved under the other image capturing device to detect whether the soft film is unsuccessfully transferred to the film. If the crystal grains of the viscous film are detected to have untransformed crystal grains, the grain must be transferred again, which is quite complicated and time consuming.

In view of the above-mentioned deficiencies, the main object of the present invention is to provide a method for selecting a crystal grain, which can perform on-the-spot detection on whether or not the crystal grain is transferred.

In order to achieve the above object, the method for selecting a crystal grain provided by the present invention comprises the following steps: a) providing a flexible film with a plurality of crystal grains, a viscous film opposite to the flexible film, and capable of transmitting light; An image capturing device for capturing the crystal grains through the adhesive film, and a pushing device capable of pushing each of the crystal grains through the flexible film; b) using the image capturing device for the crystal grains Positioning; c) pushing the die to be adhered to the viscous film through the soft film by using one of the pushing devices, so that the pushed die contacts the adhesive film And d) using the image capturing device to detect whether the die pushed in step c) adheres to the adhesive film.

Since the viscous film is permeable to light, the image capturing device can capture the dies through the viscous film. Therefore, it is not necessary to wait until all the dies to be transferred have completed the transfer operation. Whether the soft film remains sticky The grain of the mistake. In other words, the die selection device and method can perform on-the-spot detection on whether the die is transferred or not, so that the die that has been transferred to the wrong film is re-adhesively moved when the adhesive film is still opposite to the flexible film.

Another object of the present invention is to provide a die selection apparatus for implementing the above-described die selection method.

The die selection device provided by the present invention comprises a flexible film, a viscous film, an image capturing device, and a pushing device. The flexible film has a first surface facing the opposite direction and a second surface, wherein the first surface is used to adhere a plurality of crystal grains; the adhesive film is light transmissive and has an adhesive surface, the adhesive surface is a first surface of the flexible film; the image capturing device is disposed at a position where the crystal grains can be imaged through the adhesive film; the pushing device has a top opposite to the second surface of the flexible film The pushing member is configured to push the die by pushing the die through the soft film, thereby adhering the pushed die to the adhesive surface of the adhesive film.

Detailed construction, features, assembly or use of the die selection apparatus and method provided by the present invention will be described in the detailed description of the subsequent embodiments. However, it should be understood by those of ordinary skill in the art that the present invention is not limited by the scope of the invention.

The Applicant firstly stipulates in the following embodiments and the drawings, wherein the same reference numerals indicate the same or similar elements or structural features thereof, and the X, Y, and Z axis systems are perpendicular to each other.

Referring to the first to fourth figures, the first figure is a schematic diagram of a die selection device and a plurality of dies provided by a first preferred embodiment of the present invention, which is a state in which the die selection device is to be selected. The second figure is similar to the first figure, but shows the aspect of the die selection device provided by the first preferred embodiment of the present invention in the form of a transfer die; the third figure is similar to the first figure. The first embodiment of the present invention is similar to the third embodiment, but the first preferred embodiment of the present invention is provided. The die selection device is in the form of instant detection.

Referring to the first embodiment, a die selection device 10 according to a first preferred embodiment of the present invention mainly includes a flexible film 14, a viscous film 16, a pushing device 18, an image capturing device 20, and A support device 22.

The flexible film 14 and the adhesive film 16 may be a conventional blue tape having a first surface 141 and a second surface 142 facing in opposite directions, the first surface 141 being used for The plurality of crystal grains 30 are adhered; the adhesive film 16 has an adhesive surface 161 facing the opposite direction and an abutting surface 162. The adhesive surface 161 is fixed to the first surface 141 of the flexible film 14 at a fixed distance.

In fact, the flexible film 14 is driven by a displacement device (not shown) capable of generating a biaxial (X, Y-axis) reciprocating displacement action, thereby simultaneously driving the displacement of the crystal grains 30. The adhesive film 16 The flexible film 14 can be relatively fixed and displaced in synchronization, and can also be rolled by a scroll mechanism (not shown). However, the aforementioned displacement device and scrolling mechanism belong to the prior art It is not the technical features of the present invention, and therefore the applicant does not repeat the detailed structure and hide it in the drawings.

The pushing device 18 includes a driving unit 182 (such as a pneumatic cylinder or a hydraulic cylinder) and a pushing member 184 (for example, a thimble) opposite to the second surface 142 of the flexible film 14, and the pushing member 184 can be driven by the driving device 184. The unit 182 is driven to move along the Z axis, thereby pushing the die 30 through the soft film 14 to adhere the die 30 to the adhesive surface 161 of the adhesive film 16 (as shown in the second figure). Shown). It is worth mentioning that the pushing member 184 can also be fixed, and the two films 14, 16 are synchronously moved along the Z axis to achieve the aforementioned pushing and transferring the die 30.

The image capture device 20 can be a conventional CCD camera or other type of camera. In this embodiment, the image capturing device 20 is disposed at a position corresponding to the pushing member 184, and is photographed in the direction of the pushing member 184, and the two films 14, 16 are located in the image capturing device. Between the device 20 and the pushing member 184; however, the position of the image capturing device 20 is not limited thereto, as long as it is disposed at a position where the crystal grains 30 can be imaged through the adhesive film 16. For example, the image capturing device 20 can be disposed opposite the supporting device 22 and indirectly in the direction of the pushing device 18 by the beam splitting mirror.

It should be noted that the flexible film 14 and the adhesive film 16 are not limited to the blue film, and the flexible film 14 can be elastically deformed if the die 30 is adhered and can be pushed by the push. The adhesive film 16 is viscous and permeable to the adhesive surface 161 so that the image capturing device 20 can capture It is sufficient to the die 30.

The support device 22 includes a seat body 222 that can move along the Z axis, a swing arm 224 that is disposed on the seat body 222 and swings about the Z axis, and is disposed on the swing arm 224 and can be driven by the swing arm 224. To a support member 226 at a position P1. In fact, the seat body 222 is driven by a displacement device (not shown) that generates a uniaxial (Z-axis) linear reciprocating displacement action, and the swing arm 224 is provided by a motor disposed on the seat body 222. (not shown), however, the aforementioned displacement device and motor are common in general automation machinery and are not the technical features of the present invention, so the applicant will not repeat the detailed structure and hide it in the drawing. .

As shown in the first figure, the supporting member 226 is located at the working position P1 opposite to the abutting surface 162 of the adhesive film 16 and corresponds to the pushing member 184. At this time, the seat body 222 can drive the pendulum. The arm 224 and the support member 226 are moved toward the adhesive film 16 until the support member 226 contacts the abutting surface 162 (as shown in the second figure), so that the die 30 pushed by the pushing member 184 can The viscous film 16 is abutted against the support member 226, and the die 30 is more reliably adhered to the adhesive surface 161 of the adhesive film 16. The support member 226 has a soft portion 226a, which is mainly made of silicone or rubber. The die 30 pushed by the pushing member 184 abuts against the soft portion 226a via the adhesive film 16 to avoid the The support member 226 damages the surface of the die 30, and the soft portion 226a preferably has a hardness of A50 to A70, but is not limited thereto.

In addition, the support member 226 may be coupled to a vacuum channel of a vacuum pressure source, and the vacuum channel extends to the flexible portion 226a to When the soft portion 226a comes into contact with the abutting surface 162, the viscous film 16 is fixed by a vacuum suction method.

Hereinafter, the die selection device 10 will be taken as an example to illustrate the die selection method provided by the present invention, and the operation mode of the die selection device will be further described. The die selection method includes the following steps:

a) providing a flexible film 14 having a plurality of crystal grains 30 adhered thereto, an adhesive film 16 which is transparent to the flexible film 14 and capable of transmitting light, and an image capturing film capable of capturing the crystal grains 30 via the adhesive film 16 The device 20, and the pushing device 18 capable of pushing each of the crystal grains 30 across the flexible film 14. In the present embodiment, this step further provides the support device 22, but the support device 22 is used to assist in the transfer of the die 30, rather than the necessary technical features of the present invention.

b) Positioning the dies 30 by the image capture device 20. Since the viscous film 16 is permeable to light, the image capturing device 20 can image the dies 30 by interposing the dies 30 through the viscous film 16. In this embodiment, the support member 226 is swung by the swing arm 224 to an inactive position P2 between the image capturing device 20 and the die 30 during the step (for example, the third figure). The position shown) to avoid obstructing the image capture device 20 from capturing the dies 30.

c) using the pushing device 18 to push the die 30 to be bonded to the adhesive film 16 via the flexible film 14 so that the pushed die 30 contacts the adhesive film 16 (eg, Figure 2). In this embodiment, the support member 226 is swung by the swing arm 224 to the active position P1 during the step, so that the pushed die 30 is separated by the adhesive film 16 . The viscous film 16 is more reliably adhered to the support member 226.

It should be noted that the die selection device and method provided by the present invention are mainly used to remove the die 30 on the flexible film 14 which is detected as a defective product. In this case, the foregoing is to be rotated. The crystal grains 30 adhered to the adhesive film 16 are the crystal grains 30 judged to be defective. However, the die selection apparatus and method provided by the present invention can also be used to classify the die 30 that are inspected according to their specifications or grades. In this case, the die 30 that has passed the detection are all to be bonded to The crystal grains 30 of the adhesive film 16 and the types of the crystal grains 30 determine the order in which they are transferred and are transferred to the position of the adhesive film 16. In other words, the crystal grains 30 adhered to the flexible film 14 in the step a) may all be the crystal grains to be transferred to the adhesive film 16, and only one or a few of the crystal grains 30 may be to be transferred. To the viscous film 16.

d) Using the image capturing device 20 to detect whether the die 30 pushed in the step c) adheres to the adhesive film 16. Since the adhesive film 16 is transparent to light, the image capturing device 20 can detect the pushed die 30 via the adhesive film 16 . As shown in the fourth figure, in the embodiment, the support member 226 is again swung by the swing arm 224 to the inactive position P2 during the step to prevent the image capturing device 20 from capturing the die 30.

It is to be noted that the image capturing device 20 can determine that the die 30 is adhered to the flexible film 14 or the adhesive film 16 by the image color difference of the die 30. The die selection device 10 can further be provided with a lighting device 24 opposite to the second surface 142 of the flexible film 14, so that the die 30 is at this step. The step d) is easier to recognize when it is performed, and in this case, the flexible film 14 must be transparent.

After the step d), if the crystal grains 30 adhered to the flexible film 14 still have to be transferred to the crystal grains of the adhesive film 16, the soft film 14 is synchronously opposed to the crystal grains 30. The device 18 is displaced such that a die 30 to be bonded to the adhesive film 16 is located at a position corresponding to the pushing member 184, and the adhesive film 16 is also displaced relative to the pushing device 18, so that The pushing member 184 corresponds to the block in which the adhesive film 16 is not adhered by the die 30, and then the steps c) and d) are repeated one more time.

In other words, after performing a transposition process as in step c) on a die 30, the detection process as in step d) is performed immediately, and then the other die 30 is transferred and detected; thus, When the occurrence of the viscous error is detected, the viscous action can be performed again when the unbonded successful die 30 still corresponds to the ejector 184, which is compared with the conventional die selection device. And methods are quite simple and time-saving.

Referring to FIG. 5 to FIG. 10 , FIG. 5 is a schematic diagram of a die selection device and a plurality of dies according to a second preferred embodiment of the present invention, showing a state in which the die selection device is to be selected. The sixth figure is similar to the fifth figure, but shows the aspect of the die-selecting device provided by the second preferred embodiment of the present invention in the case of the transfer-adhesive grain; the seventh figure is similar to the sixth figure. However, the die selection device provided by the second preferred embodiment of the present invention is in the form of instant detection; and the eighth to tenth views are the die selection provided by the second preferred embodiment of the present invention. A schematic diagram of the process of transferring a die adhered by a viscous film to a transfer film.

Referring to FIG. 5, the die selection device 40 provided by the second preferred embodiment of the present invention is different from the die selection device 10 described above in that the abutment surface of the adhesive film 16 of the die selection device 40 is The 162 is fixed to a support base 42 and, as shown in FIG. 6 , the die 30 pushed up by the pushing device 18 via the flexible film 14 is abutted against the support by the adhesive film 16 . The seat 42 is thereby more firmly adhered to the adhesive surface 161 of the adhesive film 16.

In detail, the support base 42 includes a body 422 and a cushion 424 disposed between the base 422 and the adhesive film 16. The adhesive film 16 can be fixed to the base 422 by vacuum suction, electromagnet or other suitable means, so that the adhesive film 16 is relatively flat, and the effect of the adhesive die 30 is better. The seat body 422 can be made of transparent acrylic, quartz glass, or other material that is transparent and harder. The cushion 424 can be made of silicone, rubber, or other materials that are transparent and elastic. The preferred hardness is the Shore hardness A50~A70, but not limited thereto; thereby, the support base 42 can not only be used for the pushed-up die 30, but also provides a buffering effect to avoid damage to the die 30. . However, if the die selection device 40 of the present embodiment is used to select a defective die, the support pad 42 may not be provided with the aforementioned pad 424. Secondly, more importantly, the body 422 and the cushion 424 are transparent, so that the image capturing device 20 can image the crystal grains 30 through the support base 42 and the adhesive film 16 to It is detected whether the die 30 is successfully transferred to the viscous film (as shown in the seventh figure).

In addition, when the foregoing die selection device 40 is used to pass the detection When the crystal grains 30 are classified, the detection procedure after the classification of the crystal grains 30 is further facilitated. In detail, after the dies 30 are classified by the above-described die selection method, electrical detection is required, but the detection surface of the die 30 is adhered to the viscous film 16, and thus, After the step d) of the die selection method, if the die 30 adhered to the flexible film 14 has not been transferred to the die of the adhesive film 16, a transfer film 44 and the adhesive film can be used. 16 is adjacent to each other, and the die 30 adhered to the adhesive film 16 is transferred to the transfer film 44 (as shown in the eighth to the tenth drawings), whereby the crystal grains 30 are originally adhered to the adhesive film. The surface of 16 is revealed for subsequent testing procedures.

The adhesive film 16 of the die selecting device 40 can be directly displaced together with the support base 42 to a position corresponding to the transfer film 44, so that the die 30 is secured by the support and buffering effect of the support base 42. And the adhesive film 44 and the adhesive film 16 can be located between the transfer film 44 and the other image capturing device 46. Thus, the image capturing device The spacers 42 and the adhesive film 16 can be used to detect whether the crystal grains 30 are all adhered to the transfer film 44. Furthermore, the adhesive film 16 and the support base 42 can be reused to transfer the crystal grains 30 on the other flexible film 14.

Finally, it is to be noted that the constituent elements disclosed in the foregoing embodiments are merely illustrative and are not intended to limit the scope of the present invention, and alternative or variations of other equivalent elements should also be the scope of the patent application of the present application. Covered.

10‧‧‧ die selection equipment

14‧‧‧Soft film

141‧‧‧ first surface

142‧‧‧ second surface

16‧‧‧Adhesive film

161‧‧‧Adhesive surface

162‧‧‧Abutment

18‧‧‧Pushing device

182‧‧‧ drive unit

184‧‧‧Pushing pieces

20‧‧‧Image capture device

22‧‧‧Support device

222‧‧‧ body

224‧‧‧ swing arm

226‧‧‧Support

226a‧‧‧Soft Department

P1‧‧‧ position

P2‧‧‧Inactive position

24‧‧‧Lighting device

30‧‧‧ grain

40‧‧‧ die selection equipment

42‧‧‧ Support

422‧‧‧ body

424‧‧‧A cushion

44‧‧‧Transfer film

46‧‧‧Image capture device

The first figure is a schematic diagram of a die selection device and a plurality of dies provided by a first preferred embodiment of the present invention, which shows a state in which the die selection device is to be selected; the second figure is similar to the first 1 is a view showing the aspect of the die-removing die provided by the first preferred embodiment of the present invention in the form of a transfer die; the third figure is similar to the first figure, but shows the first preferred embodiment of the present invention. The die selection device provided by the embodiment is in the position of positioning; the fourth figure is similar to the third figure, but the die selection device provided by the first preferred embodiment of the present invention is in the instant detection. The fifth figure is a schematic diagram of a die selection device and a plurality of dies provided by a second preferred embodiment of the present invention, showing a state in which the die selection device is to be selected; Similar to the fifth figure, the second embodiment of the present invention is shown in the aspect of the transfer die. The seventh figure is similar to the sixth figure, but shows the first aspect of the present invention. The die selection device provided by the second preferred embodiment is in the form of instant detection; FIG eighth to tenth picture shows the second preferred die according to the present invention is provided by selecting embodiment schematic view of one die adhesive film adhesion process to posted in a posted film of the device.

10‧‧‧ die selection equipment

14‧‧‧Soft film

141‧‧‧ first surface

142‧‧‧ second surface

16‧‧‧Adhesive film

161‧‧‧Adhesive surface

162‧‧‧Abutment

18‧‧‧Pushing device

182‧‧‧ drive unit

184‧‧‧Pushing pieces

20‧‧‧Image capture device

22‧‧‧Support device

222‧‧‧ body

224‧‧‧ swing arm

226‧‧‧Support

226a‧‧‧Soft Department

P1‧‧‧ position

24‧‧‧Lighting device

30‧‧‧ grain

Claims (16)

A method for selecting a crystal grain comprises the steps of: a) providing a flexible film with a plurality of crystal grains, a viscous film which is opposite to the flexible film and transparent to light, and capable of being photographed through the viscous film An image capturing device for the dies, and a pushing device capable of pushing each of the dies through the flexible film; b) positioning the dies by the image capturing device; c) utilizing the top Pushing a pushing device through the soft film to push the die to be bonded to the die of the adhesive film, so that the pushed die contacts the adhesive film; and d) using the image The picking device detects whether the die pushed in step c) adheres to the adhesive film. The method for selecting a crystal according to claim 1, wherein after the step d), if the crystal grains adhered to the soft film still have to be transferred to the crystal grains of the adhesive film, the soft film is used. Displaced relative to the ejector device in synchronization with the dies, such that a die to be transferred to the viscous film is located at a position corresponding to the urging member, and the viscous film is also pushed against the ejector The device is displaced such that the pushing member corresponds to the block in which the adhesive film is not subjected to die adhesion, and then steps c) and d) are repeated one more time. The method for selecting a die according to claim 1, wherein the step a) further provides a supporting device, the supporting device has a swinging arm, and a support member disposed on the swing arm; the support When the step c) is performed, the piece is swung to a position corresponding to the pushing member, and the pushed die is abutted against the supporting member via the adhesive film; the supporting member is at When the step b) and the step d) are performed, the device is swung to a position not between the image capturing device and the dies to prevent the image capturing device from capturing the dies. The method for selecting a die according to the first aspect of the invention, wherein the step a) further provides a light-permeable support, the adhesive film is fixed to the support, and the image capturing device is separated by the The support base captures the crystal grains; when the step c) is performed, the pushed-up crystal grains are abutted against the support base via the adhesive film. The method for selecting a crystal according to claim 4, wherein the adhesive film is fixed to the support by vacuum suction. The method for selecting a crystal grain according to claim 1, wherein the crystal grains are classified and transferred to the adhesive film. The method for selecting a crystal grain according to claim 1, wherein after the step d), the method further comprises: bringing a transfer film and the adhesive film closer to each other, and then transferring the die adhered to the adhesive film to the die The step of transferring the film. A die selection device for performing the die selection method according to claim 1, comprising: a flexible film having a first surface facing the opposite direction and a second surface, the first surface The utility model is characterized in that a plurality of crystal grains are adhered; a viscous film is permeable to light and has an adhesive surface facing the first surface of the soft film; an image capturing device is disposed at a distance The viscous film and the position of the crystal grains; and a pushing device having a pushing member opposite to the second surface of the flexible film for pushing the die through the soft film by the pushing member, thereby pushing the topped die Adhesive to the adhesive surface of the adhesive film. The die selection device of claim 8, wherein the flexible film and the adhesive film are spaced apart from each other in a relatively fixed manner. The die selection device of claim 9, further comprising a support device having a swingable swing arm, and a swing arm disposed on the swing arm and capable of being driven to the active position by the swing arm a support member, the support member is located at the active position opposite to an abutting surface of the adhesive film opposite to the adhesive surface and corresponding to the pushing member, thereby being pushed by the pushing member The die abuts against the support member via the viscous film. The die selection device of claim 10, wherein the support member has a soft portion, and the soft portion is made of silicone or rubber. The die selection device of claim 8, wherein the flexible film and the adhesive film are spaced apart from each other in a relatively movable manner. The die selection device of claim 8 or 12, further comprising a permeable support, the adhesive film having an abutting surface opposite to the adhesive surface, the abutting surface Fixed to the support base, so that the die pushed by the pusher abuts against the support through the adhesive film. The die selection device of claim 13, wherein the support base comprises a body, and a cushion disposed between the base body and the adhesive film, wherein the seat of the support base The material is transparent acrylic or quartz glass, and the cushion of the support is made of silicone or rubber. The die selection device of claim 8, further comprising an illumination device opposite to the second surface of the flexible film, wherein the flexible film is transparent. The die selection device of claim 10, wherein the support member has a vacuum passage connected to a vacuum pressure source.