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TW201840805A - 研磨液、研磨液套組、添加液及研磨方法 - Google Patents

研磨液、研磨液套組、添加液及研磨方法 Download PDF

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Publication number
TW201840805A
TW201840805A TW107109300A TW107109300A TW201840805A TW 201840805 A TW201840805 A TW 201840805A TW 107109300 A TW107109300 A TW 107109300A TW 107109300 A TW107109300 A TW 107109300A TW 201840805 A TW201840805 A TW 201840805A
Authority
TW
Taiwan
Prior art keywords
polishing
liquid
polishing liquid
mass
cerium
Prior art date
Application number
TW107109300A
Other languages
English (en)
Chinese (zh)
Inventor
岩野友洋
Original Assignee
日商日立化成股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日立化成股份有限公司 filed Critical 日商日立化成股份有限公司
Publication of TW201840805A publication Critical patent/TW201840805A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H10P52/00—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW107109300A 2017-03-27 2018-03-19 研磨液、研磨液套組、添加液及研磨方法 TW201840805A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2017/012424 WO2018179062A1 (ja) 2017-03-27 2017-03-27 研磨液、研磨液セット、添加液及び研磨方法
??PCT/JP2017/012424 2017-03-27

Publications (1)

Publication Number Publication Date
TW201840805A true TW201840805A (zh) 2018-11-16

Family

ID=63674542

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107109300A TW201840805A (zh) 2017-03-27 2018-03-19 研磨液、研磨液套組、添加液及研磨方法

Country Status (3)

Country Link
JP (1) JP6753518B2 (ja)
TW (1) TW201840805A (ja)
WO (1) WO2018179062A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113122139B (zh) * 2019-12-30 2024-04-05 安集微电子科技（上海）股份有限公司 一种化学机械抛光液及其使用方法
JPWO2023080014A1 (ja) * 2021-11-04 2023-05-11

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2604443A1 (fr) * 1986-09-26 1988-04-01 Rhone Poulenc Chimie Composition de polissage a base de cerium destinee au polissage des verres organiques
JP3933121B2 (ja) * 1996-02-07 2007-06-20 日立化成工業株式会社 酸化セリウム研磨剤、半導体チップおよび半導体装置、それらの製造法、ならびに、基板の研磨法
JP4277243B2 (ja) * 1999-05-17 2009-06-10 日立化成工業株式会社 セリウム化合物研磨剤及び基板の研磨法
JP2001284296A (ja) * 2000-03-02 2001-10-12 Eternal Chemical Co Ltd 研磨性スラリー及びその使用
US6589100B2 (en) * 2001-09-24 2003-07-08 Cabot Microelectronics Corporation Rare earth salt/oxidizer-based CMP method
JP5326492B2 (ja) * 2008-02-12 2013-10-30 日立化成株式会社 Ｃｍｐ用研磨液、基板の研磨方法及び電子部品

Also Published As

Publication number Publication date
JPWO2018179062A1 (ja) 2019-12-26
JP6753518B2 (ja) 2020-09-09
WO2018179062A1 (ja) 2018-10-04

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