TW201836811A - Molding die, resin molding device, resin molding method, and method of manufacturing resin molded article - Google Patents

Abstract

The present invention provides a molding die capable of efficiently resin-molding a thick resin molded product using a functional film. In order to achieve the object, the molding die 10 of the present invention includes an upper die 100 and a lower die 200. The lower die 200 has a side member and a bottom member 202. As for the lower die 200, the side member and the bottom member 202 can be moved up and down, respectively. The side member includes an inner side member 201A and an outer side member 201B. The inner side member 201A is disposed so as to surround the bottom face member 202. The outer side member 201B is disposed so as to surround at least a part of the inner side member 201A. The space surrounded by the members forms a model cavity 203, which can attract functions from the gap 205 between the inner side member 201A and the outer side member 201B and the gap 204 between the bottom member 202 and the inner side member 201A to the inner direction of each gap. Sex film.

Description

   Mold, resin molding device, resin molding method, and method for manufacturing resin molded product   

The present invention relates to a molding die, a resin molding apparatus, a resin molding method, and a method for manufacturing a resin molded product.

In the field of resin molding, for example, there is a method of performing a resin mold (resin molding) on a molded article such as a substrate on which a plurality of semiconductor wafers are mounted, and a semiconductor wafer using a resin mold (resin molding mold). Among such resin molding methods, there is a method using a release film (release film), which is disclosed, for example, in Patent Document 1 (refer to paragraphs [0002], [0015] to [0016] of the same document, drawings 1 etc.). Hereinafter, a resin mold (resin molding) method described in the same document will be described with reference to Patent Document 1. First, when a molded product is clamped by a resin mold and the resin is molded, the mold release film 40 is disposed so as to cover the cavity recessed portion 25, and the resin 50 is supplied to the cavity recessed portion 25 covered by the mold release film 40. And started the resin mold operation. At this time, the release film 40 having the required flexibility and heat resistance is sucked by suction and set on the holder 26. Then, by sucking air from the bottom surface side of the cavity recessed portion 25, the release film 40 can be adsorbed along the inner surface shape of the cavity recessed portion 25.

[Prior technical literature]

[Patent Literature]

Patent Document 1: Japanese Patent Application Laid-Open No. 2005-088395.

In recent years, the necessity of increasing the thickness of resin has appeared in resin molded products. Specifically, for example, as a circuit component manufactured by resin-sealing a substrate on which a semiconductor wafer is mounted, circuit components having a thick packaging resin are increasing.

However, in the method described in Patent Document 1, the cavity recessed portion 25 becomes deeper corresponding to the thick encapsulating resin. When the cavity recess 25 is deep, when the mold release film 40 is sucked, the mold is released near the inner corner of the holder 26 (the uppermost part of the inner surface of the holder 26) or below the corner. The film 40 may be broken. When the release film 40 is cracked, the sealing resin is in close contact with the mold surface (inner side surface of the holder 26) of the cavity recessed portion 25 in the cracked portion. Therefore, it is difficult for the molded product after resin sealing to be released from the inner surface of the holder 26. Therefore, it is possible to reduce the productivity of circuit components.

When using a functional film such as a release film for resin molding as described above, it is difficult to efficiently perform resin molding of a resin molded product having a large thickness.

Accordingly, it is an object of the present invention to provide a molding die, a resin molding apparatus, a resin molding method, and a method for manufacturing a resin molded product that use a functional film and can efficiently resin-mold a resin molded product having a large thickness.

In order to achieve the object, the forming die of the present invention is characterized by having an upper die and a lower die; one of the upper die and the lower die has a side member and a bottom member; as for the one die, The side member and the bottom member can be moved up and down, respectively; the side member has an inner side member and an outer side member; the inner side member is arranged to surround the bottom member; and the outer side member surrounds the The at least a part of the inner side member is arranged; a mold cavity is formed by a space surrounded by the bottom member and the side member; a gap between the inner side member and the outer side member; and the The gaps between the bottom surface member and the inner side surface member respectively suck the functional film in the inner direction of the gaps.

A resin molding apparatus of the present invention includes the molding die of the present invention.

The resin molding method of the present invention includes: a molding die preparation step, preparing a molding die; the molding die has an upper die and a lower die; and one of the upper die and the lower die has a side member and a bottom surface. For the one mold, the side member and the bottom member can be moved up and down, respectively; the side member has an inner side member and an outer side member; and the inner side member surrounds the bottom member Disposition; the outer side member is disposed so as to surround at least a portion of the inner side member; a model cavity is formed by a space surrounded by the bottom member and the side member; The gap between the outer surface members and the gap between the bottom surface member and the inner surface member respectively attract a functional film to an inner direction of each of the gaps; the functional film supplying step is performed on a mold surface of the mold cavity. Supplying a functional film; a first functional film suction step, sucking the functional film from a gap between the inner side member and the outer side member; Two functional film suction steps, which suck the functional film from a gap between the bottom surface member and the inner side surface member; a resin material supply step, which supplies a resin material to the functional film; and a resin molding step, In a state where the upper mold and the lower mold are closed, a cured resin is molded by curing the resin material in the mold cavity, and a resin molded body is manufactured.

The method for manufacturing a resin molded article of the present invention is characterized in that a resin is molded by the resin molding method according to the present invention.

According to the present invention, it is possible to provide a molding die, a resin molding apparatus, a resin molding method, and a method for manufacturing a resin molded product that efficiently encapsulate a resin molded product having a large thickness using a functional film.

1‧‧‧ substrate

2‧‧‧Chip

10‧‧‧Forming Mould

20a‧‧‧ granular resin (resin material)

20b‧‧‧ molten resin (fluid resin)

20‧‧‧cured resin (sealing resin)

30‧‧‧Resin molding (resin molding)

100‧‧‧ Upper mold

101‧‧‧ through hole of upper die

200‧‧‧ lower mold

201A‧‧‧Inner side member (inner side member of lower mold)

201B‧‧‧Outer side member (lower mold outer side member)

202‧‧‧ bottom surface member (lower mold bottom surface member)

203‧‧‧model cavity (lower model cavity)

204‧‧‧ Gap between inner side member 201A and bottom member 202

205‧‧‧Gap between outer side member 201B and inner side member 201A

206A‧‧‧Second suction hole

206B‧‧‧Second suction slot

207A‧‧‧First suction hole

207B‧‧‧First suction tank

208‧‧‧Elastomer (second elastic member)

209‧‧‧Elastomer (first elastic member)

210‧‧‧ Outer side member (lower mold outer side member) 201B through hole

300‧‧‧functional membrane holding mechanism

301‧‧‧functional membrane holding member

302‧‧‧functional membrane holding member

1000‧‧‧ functional film (release film)

2000‧‧‧ base (bottom plate)

X1‧‧‧up arrow indicating the moving direction of the lower mold 200 (die closing direction)

X2‧‧‧ a down arrow indicating the moving direction (die opening direction) of the lower mold 200

Y1‧‧‧ is a downward arrow indicating the direction of the force applied by the functional film holding mechanism 300 (mold opening direction)

V1 ~ V2 ‧‧‧ arrows indicating the suction direction by the suction mechanism

v2 ~ v4‧‧‧ On-off valve

P2 ~ P4‧‧‧‧attraction channel

FIG. 1 is a cross-sectional view schematically showing an example of a molding die structure of the present invention.

FIG. 2 is a plan view schematically showing an example of a lower mold structure of the molding die of FIG. 1.

FIG. 3 is a plan view schematically showing another example of a lower mold structure of the molding die of FIG. 1.

FIG. 4 is a plan view schematically showing an example of an upper mold structure of the molding die of FIG. 1.

FIG. 5 is a plan view schematically showing an example of a structure of a substrate fixed to an upper mold of the molding mold of FIG. 1.

6 is a cross-sectional view schematically showing one step of an example of a resin molding method of the present invention using the molding die of FIG. 1.

FIG. 7 is a cross-sectional view schematically showing another step of the resin molding method of FIG. 6.

FIG. 8 is a cross-sectional view schematically showing still another step of the resin molding method of FIG. 6.

FIG. 9 is a cross-sectional view schematically showing still another step of the resin molding method of FIG. 6.

FIG. 10 is a cross-sectional view schematically showing still another step of the resin molding method of FIG. 6.

FIG. 11 is a cross-sectional view schematically showing still another step of the resin molding method of FIG. 6.

FIG. 12 is a cross-sectional view schematically showing still another step of the resin molding method of FIG. 6.

FIG. 13 is a cross-sectional view schematically showing still another step of the resin molding method of FIG. 6.

14 is a cross-sectional view schematically showing another example of a molding die structure of the present invention and an example of a resin molding method using the same.

15 is a cross-sectional view schematically showing still another example of a molding die structure of the present invention and an example of a resin molding method using the same.

16 is a cross-sectional view schematically showing another example of the structure of the resin molding apparatus of the present invention and an example of a resin molding method using the same.

Next, the present invention will be described in further detail by way of example. However, the present invention is not limited to the following description.

With regard to the upper mold and the lower mold of the molding mold of the present invention, for example, the lower mold may be the one mold (a mold having a side member and a bottom member), and the upper mold may also be the one mold (having a side surface). Of the component and the bottom component). In other words, the mold cavity can be set in the lower mold or the upper mold. When the mold cavity is provided in the upper mold, for example, powdered resin, fluid resin, or the like can be supplied to a substrate fixed to the lower mold.

In the molding die of the present invention, for example, the one die may be a lower die, the side member may be a lower die side member, the bottom member may be a lower die bottom member, and the inner side member may be a lower die. A side member, the outer side member may be a lower die outer side member. In addition, the one mold may be an upper mold, the side member may be an upper mold side member, the bottom member may be an upper mold bottom member, the inner side member may be an upper mold inner side member, and the outer side The member may be an outer side member of the upper mold. Among the upper mold and the lower mold, another mold (a mold other than the one mold) is not particularly limited. The other mold may be, for example, a mold capable of fixing a substrate. More specifically, for example, among the upper mold and the lower mold, a substrate may be fixed on a surface of the other mold that is opposite to the one mold.

With the molding die of the present invention, for example, in the side member of the one die, a boundary portion between a surface opposing the other die and a surface contacting the mold cavity may be chamfered. Specifically, for example, the boundary portion may be a plane (inclined surface) where both the surface opposing the other mold and the surface in contact with the mold cavity constitute an obtuse angle. In this case, the boundary portion will be C-chamfered. The boundary portion may be a curved surface. In this case, the boundary portion will be R-chamfered. By chamfering the boundary portion, for example, it is possible to suppress or prevent the force applied to the functional film from becoming excessive at the edges or corners of the boundary portion, so that the function of the functional film at the boundary portion can be suppressed or prevented. damaged.

In the molding die of the present invention, for example, by moving the bottom surface member in the direction of the mold cavity, the depth of the mold cavity can be made equal to the resin thickness of the resin molded body molded by the molding die.

In the molding die of the present invention, for example, at least one of the inner side member and the outer side member is supported by an elastic body, and at the same time, it can be moved up and down by expansion and contraction of the elastic body. In this case, for example, both the inner side member and the outer side member may be supported by an elastic body. And, in this case, for example, the elastic modulus of the elastic body supporting the outer side member may be smaller than the elastic modulus of the elastic body supporting the inner side member.

In the molding die of the present invention, for example, a suction hole may be provided on the upper surface of the outer side member, and a functional film may be sucked toward the inside of the suction hole. In this case, for example, the suction hole is divided into a first suction hole and a second suction hole, and the second suction hole may be provided inside the first suction hole.

The resin molding apparatus of the present invention may further include, for example, a mold closing mechanism for closing the upper mold and the lower mold.

The resin molding apparatus of the present invention may further include, for example, a first suction mechanism that sucks the functional film from a gap between the inner side member and the outer side member, and the bottom member and the bottom member. A second suction mechanism for the functional film is sucked by the gap between the inner side members, and the functional film is sucked in the inner direction of each gap by the suction mechanism. Thereby, for example, the functional film can be held along the mold surface of the mold cavity.

The resin molding apparatus of the present invention may further include, for example, a suction selection mechanism for selectively using the suction by the first suction mechanism and the suction by the second suction mechanism.

In the resin molding apparatus of the present invention, for example, as described above, a suction hole may be provided on the upper surface of the outer side member of the molding die, and a functional film may be suctioned toward the inside of the suction hole. In this case, for example, the resin molding apparatus of the present invention may further include a third suction mechanism that suctions the functional film from the suction hole. And in this case, for example, the first suction mechanism may double as the third suction mechanism.

The resin molding apparatus of the present invention may further include a functional film holding mechanism for holding the functional film, and the functional film holding mechanism may hold the functional film to the functional film while holding the functional film. The functional film exerts a tensile force. By doing so, for example, the functional film can be held along the mold surface of the mold cavity.

The resin molding apparatus of the present invention may further include, for example, a drive source for moving the side member up and down and a drive source for moving the bottom member up and down. In this case, for example, the drive source for moving the side member up and down and the drive source for moving the bottom member up and down may be different drive sources.

The resin molding apparatus of the present invention may further include a control unit that controls at least a part of the operation of the resin molding apparatus.

The resin molding apparatus of the present invention may be, for example, a compression molding apparatus. The resin molding apparatus of the present invention may be, for example, a transfer molding apparatus or an injection molding apparatus.

In addition, in the present invention, the “resin molding” is not particularly limited. For example, a component such as a wafer may be resin-encapsulated, but the resin may not be encapsulated and only the resin may be molded. Similarly, in the present invention, the “resin molded product” is not particularly limited. For example, it may be a resin-sealed product (finished product or semi-finished product) in which components such as wafers are resin-encapsulated. However, the resin may not be resin-encapsulated. Only finished or semi-finished resin. In the present invention, the "resin molded body" may be the resin molded product (finished product or semi-finished product) itself, or may be a resin molded product in the middle of the resin molded product manufacturing method. For example, the "resin molded body" may be a resin molded body after the resin molding step is performed and before the demolding step is performed. Further, in the present invention, the "side surface" of the resin molded body is a surface where the resin molded body contacts the side member of the one mold when the resin molded body is molded. In the present invention, the "bottom surface" of the resin molded body is a surface where the resin molded body contacts the bottom surface member of the one mold when the resin molded body is molded.

Moreover, in the present invention, in terms of "resin molding" or "resin encapsulation", resin molding or resin encapsulation may be performed on one surface or both surfaces of the substrate. However, the present invention is not limited to this. For example, it is possible to perform resin molding or resin sealing without using a substrate. In addition, for example, a component such as a wafer fixed to one or both surfaces of the substrate may be resin-sealed, but the component may not be resin-sealed, and only one surface or both surfaces of the substrate may be resin-resin Molded or resin encapsulated.

In the present invention, the method of "resin molding" or "resin encapsulation" is not particularly limited, and may be, for example, compression molding, but may be, for example, transfer molding, injection molding, or the like.

The "resin package" in the present invention refers to a state in which the resin is cured (cured) and molded into a cured resin, for example. The hardness of the cured resin may be, for example, a degree necessary for protecting a resin-encapsulated wafer or the like, and does not involve the hardness.

In addition, in the present invention, "mounting" includes "fixed".

In addition, in general, the "electronic accessory" includes a case where the wafer is resin-sealed and a state in which the wafer has been resin-sealed. However, in the present invention, unless otherwise specified, unless otherwise specified, It refers only to an electronic accessory in which the wafer is encapsulated by a resin (an electronic accessory as a finished product). Specifically, the "wafer" of the present invention includes, for example, wafers of passive elements such as resistors, capacitors, and inductors, semiconductor wafers such as diodes, transistors, integrated circuits (ICs), and semiconductor elements for power control. , Sensors, filters, etc. In addition, in the present invention, the resin-encapsulated components are not limited to wafers, and may include at least one of a wafer, a lead, a bump, an electrode, a wiring pattern, and the like, and may include non-wafer-shaped components.

In addition, the substrate (also referred to as a frame or an interposer) which is resin-molded or resin-encapsulated by the resin molding apparatus or resin molding method of the present invention is not particularly limited, and may be, for example, a semiconductor wafer such as a lead frame, a wiring substrate, a silicon wafer, The ceramic substrate or the like may be, for example, a circuit board such as a printed circuit board. In the present invention, for example, only one surface of the substrate may be resin-sealed, or both surfaces may be resin-sealed. The substrate may be, for example, a mounting substrate having a wafer mounted on one or both surfaces thereof. The method for mounting the wafer is not particularly limited, and examples thereof include wire bonding, flip chip bonding, and the like. In the present invention, for example, one or both surfaces of the mounting substrate may be resin-sealed to manufacture an electronic component in which the wafer is resin-sealed.

In addition, the use of the substrate molded or resin-encapsulated by the resin molding apparatus or the resin molding method of the present invention is not particularly limited. Examples of the use of the substrate include a power control module substrate, a high-frequency module substrate for a mobile communication terminal, an engine control substrate for a transportation machine, a motor control substrate, and a drive system control substrate. In the present invention, the "substrate" may be, for example, a lead frame or a silicon wafer. In addition, the shape of the substrate may be any shape and shape as long as it can be molded. For example, a substrate that is regarded as a rectangle and a circle in a plane can be used.

In the present invention, the “resin molded product” or “resin packaged product” is not particularly limited, and may be, for example, an electronic component in which a wafer is resin-molded by compression molding or the like. In addition, the "resin molded product" or "resin packaged product" of the present invention may be, for example, an intermediate product for manufacturing a single or a plurality of electronic accessories such as a semiconductor product and a circuit module. The "resin molded product" or "resin-encapsulated product" of the present invention is not limited to electronic parts and intermediate products in which the wafer is resin-encapsulated, and may be other resin-encapsulated products or the like.

The molding die used in the resin molding method of the present invention may be, for example, the molding die of the present invention. The resin molding method of the present invention can be performed using, for example, the resin molding apparatus of the present invention.

The resin molding method of the present invention may include, for example, a mold closing step of closing the upper mold and the lower mold, and then moving the bottom member in a direction of the mold cavity to make the mold A step in which the depth of the cavity is equal to the resin thickness of the resin molded body formed by the molding die.

In the resin molding method of the present invention, the functional film supply step may include, for example, a functional film transportation step of transporting the functional film to a position of the mold cavity by a functional film transportation mechanism.

In the resin molding method of the present invention, by performing the first functional film suction step and the second functional film suction step, for example, the functional film can be held along a mold surface of the mold cavity.

The order of performing the first functional film suction step and the second functional film suction step is not particularly limited. For example, the second functional film suction step may be performed after the first functional film suction step is performed. In addition, for example, the first functional film suction step may be performed after the second functional film suction step is performed. In addition, for example, the first functional film suction step and the second functional film suction step may be performed simultaneously.

In the resin molding method of the present invention, in the first functional film suction step, for example, the first suction of the functional film may be suctioned from a gap between the inner side member and the outer side member. Institutions. The second functional film suction step may be performed using, for example, the second suction mechanism that suctions the functional film from a gap between the bottom surface member and the inner surface member.

The resin molding method of the present invention may further have, for example, a third function of attracting a functional film from the suction hole provided on the upper surface of the outer side member of the molding die toward the inside of the suction hole. Membrane suction step. The third functional film suction step may be performed using, for example, a third suction mechanism that suctions the functional film from the suction hole. In a case where the suction hole is divided into a first suction hole and a second suction hole, the third functional film suction step may be, for example, divided into a step of suctioning the functional film from the first suction hole and And a step of sucking the functional film from the second suction hole.

In the resin material supplying step of the resin molding method of the present invention, for example, after a functional film is supplied into a mold cavity, a resin material may be supplied into the mold cavity covered by the functional film, or After the functional film is placed with the resin material, both the functional film and the resin material are transported, and the model cavity is covered with the functional film, while the inside of the model cavity covered by the functional film is carried. The resin material is supplied.

In addition, in the present invention, the material used for resin molding or resin encapsulation is not particularly limited, and may be, for example, a thermosetting resin such as an epoxy resin and a silicone resin, or a thermoplastic resin. Furthermore, it may be a composite material partially containing a thermosetting resin or a thermoplastic resin. In the present invention, the form of the resin material to be supplied to the molding die is not particularly limited, but examples thereof include solid resins such as powder resins, granular resins, sheet resins, and plate resins, fluid resins, and gel-like resins. Resin, etc.

In the present invention, the "flowable resin" is not particularly limited as long as it is a resin having flowability, and examples thereof include a liquid resin, a molten resin, and the like. In addition, in the present invention, "liquid" means fluidity at normal temperature (room temperature), and flows by the action force, which does not involve the level of fluidity, in other words, does not involve the degree of viscosity. That is, in the present invention, the "liquid resin" refers to a resin that has fluidity at normal temperature (room temperature) and flows by an applied force. In addition, in the present invention, the "molten resin" means a resin that is in a liquid state or has a fluid state by melting, for example. The form of the molten resin is not particularly limited, and may be, for example, a form that can be supplied to a cavity or a groove of a molding die.

In the resin material supplying step of the resin molding method of the present invention, as described above, the resin material may be in any form such as a particulate resin, a fluid resin, and the like. For example, in the resin material supplying step, a resin material having no fluid form such as a particulate resin may be supplied. The resin which does not have the said fluid form can be melt | dissolved into a fluid resin later, for example. In addition, for example, in the resin material supplying step, a resin material that is a fluid resin (for example, a liquid resin or a molten resin) may be supplied.

In the resin molding method of the present invention, the mold closing step may be performed using, for example, the mold closing mechanism that closes the upper mold and the lower mold.

The resin molding method of the present invention may further include, for example, a functional film holding step of applying a tensile force to the functional film while holding the functional film. Thereby, for example, the functional film can be held along the mold surface of the mold cavity. The functional film holding step may be performed using, for example, the functional film holding mechanism that holds the functional film.

In the resin molding method of the present invention, for example, in the mold closing step and the mold opening step, the side member and the bottom member are moved up and down. This up-and-down movement can be performed using the said drive source, for example.

In the resin molding method of the present invention, for example, at least a part of all the steps may be controlled using the control unit of the resin molding apparatus.

The resin molding method of the present invention is not particularly limited, and as described above, it may be compression molding, for example, transfer molding or injection molding.

In addition, in the resin molding method and the method for manufacturing a resin molded product of the present invention, the order of performing each step is not particularly limited, and may be arbitrary. In other words, in the resin molding method and the method for manufacturing a resin molded product of the present invention, each step may be performed in any order as long as it is feasible. For example, each step can be performed from any step, for example, any number of steps can be performed simultaneously or in parallel.

Hereinafter, specific embodiments of the present invention will be described based on the drawings. Each drawing is appropriately omitted, exaggerated, etc. and described schematically for the convenience of explanation.

[Example 1]

In this embodiment, an example of a resin molding apparatus of the present invention and an example of a resin molding method of the present invention using the same will be described.

The cross-sectional view of FIG. 1 schematically illustrates the structure of a molding die of the resin molding apparatus of this embodiment. As shown in the figure, the molding die 10 includes an upper die 100 and a lower die 200. The lower mold 200 is the one mold (a mold having a side member and a bottom member). In addition, in each of the following examples (Examples 1 to 4) including this example, a release film was used as the functional film.

The lower mold 200 includes a bottom member (lower mold bottom member) 202 and a side member (lower mold side member) arranged to surround the bottom member 202. The lower mold side member includes an inner side member 201A and an outer side member 201B. The inner side member 201A is arranged so as to surround the bottom member 202. The outer side member 201B is arranged so as to surround the inner peripheral portion of the inner side member 201A. The mold cavity 203 is formed by a space surrounded by the upper surface (upper end surface) of the bottom surface member 202 and the inner surface of the inner surface member 201A. For example, as described below, an encapsulating resin made of a cured resin can be formed by curing the fluid resin supplied to the mold cavity 203.

In the molding die 10 of this embodiment, the lower die bottom surface member 202 and the inner side member 201A are disposed on the lower die bottom plate (base) 2000, respectively. The lower mold bottom surface member 202 is directly fixed to the upper surface of the base 2000. The inner side member 201A is connected to the upper surface of the base 2000 via an elastic body (first elastic member) 209. The outer side member 201B is connected to the upper surface of the inner side member 201A by an elastic body (second elastic member) 208 at a position above the first elastic member 209. The second elastic member 208 has a smaller elastic modulus than the first elastic member 209. The inner peripheral member 201A has an inner peripheral portion protruding upward, and is arranged so as to be sandwiched between the lower mold bottom member 202 and the outer member 201B as viewed from above. The outer side member 201B is arranged so as to surround the inner peripheral portion of the inner side member 201A when viewed from above.

By the expansion and contraction of the first elastic member 209, the inner side surface member 201A and the lower mold bottom surface member 202 can move up and down, respectively. In addition, by the expansion and contraction of the second elastic member 208, the outer side member 201B, the lower mold bottom member 202, and the inner side member 201A can move up and down, respectively. That is, in the lower mold 200, the side member and the bottom member 202 can be moved up and down, respectively.

Inside the inner side member 201A, in a boundary portion (corner) between the surface opposite to the upper mold 100 and the surface contacting the mold cavity 203, a surface opposite to the other mold and a surface contacting the mold cavity are formed. Both sides constitute an obtuse plane (chamfered portion forming a C chamfer). Therefore, as described above, since the force applied to the functional film at the boundary portion (corner portion) can be suppressed or prevented from becoming excessive, it is possible to suppress or prevent the functional film from being damaged at the boundary portion. In addition, in the present invention, the boundary portion may be, for example, a plane (chamfered portion formed by C chamfering) as shown in the figure, but as described above, it may be a curved surface (chamfered portion formed by R chamfering). ).

A first suction groove 207B is provided on the upper surface (upper end surface) of the outer side member 201B, and a first suction hole 207A is provided inside the first suction groove 207B. A second suction groove 206B is provided inside the first suction groove 207B, and a second suction hole 206A is provided inside the second suction groove 206B. Further, the outer surface member 201B is provided with a through hole 210 that penetrates from the inner surface to the outer surface. The through hole 210 is connected to the second suction hole 206A. The through hole 210 is connected to a gap 205 between the outer side member 201B and the inner side member 201A.

Further, the resin molding apparatus of this embodiment includes a first suction mechanism (not shown) that sucks a functional film from the gap 205 between the inner side member 201A and the outer side member 201B, and the bottom member 202 and the inner side member 201A. The gap 204 between them sucks a second suction mechanism (not shown) of the functional film. As shown in FIG. 1, an on-off valve v3 is provided in the suction passage P3 that connects the gap 205 between the inner side member 201A and the outer side member 201B. The first suction mechanism sucks from the gap 205 between the inner side member 201A and the outer side member 201B through the opening and closing valve v3 and the suction channel P3 in the direction of the arrow V3 (facing the outside of the lower mold 200). An on-off valve v4 is provided in the suction passage P4 connected to the gap 204 between the bottom surface member 202 and the inner surface member 201A. The second suction mechanism sucks from the gap 204 between the bottom surface member 202 and the inner surface member 201A through the opening and closing valve v4 and the suction channel P4 in the direction of the arrow V4 (toward the outside of the lower mold 200). In this way, the functional film can be sucked by the first suction mechanism and the second suction mechanism toward the inner direction of the gaps (toward the outside of the lower film 200). In addition, in FIGS. 6 to 16 to be described later, the illustration of the on-off valves v3 and v4 is omitted to simplify the illustration.

Further, the resin molding apparatus of this embodiment has a third suction mechanism (not shown) that suctions the functional film from the first suction hole 207A and the second suction hole 206A provided on the upper surface (upper end surface) of the outer side member 201B. ). In this embodiment, actually, the third suction mechanism is only connected to the first suction hole 207A, and sucks the functional film from the first suction hole 207A. Specifically, as shown in FIG. 1, a switching valve v2 is provided in a suction channel P2 connected to the first suction hole 207A. The third suction mechanism sucks in the direction of the arrow V2 (toward the outside of the lower mold 200) from the first suction hole through the opening and closing valve v2 and the suction channel P2. In addition, in FIGS. 6 to 16 to be described later, the illustration of the on-off valve v2 is omitted to simplify the illustration. As described above, the second suction hole 206A and the through hole 210 are connected. Then, through the first suction mechanism, the functional film can be suctioned from the gap 205 between the inner side member 201A and the outer side member 201B and the second suction hole 206A. That is, the first suction mechanism doubles as a part of the function of the third suction mechanism that suctions the functional film from the suction hole provided on the upper surface (upper end surface) of the outer side member 201B. Moreover, in the resin molding apparatus of this embodiment, the first suction mechanism, the second suction mechanism, and the third suction mechanism may operate independently. By opening and closing the on-off valves v2, v3, and v4 independently, one to three suction mechanisms can be selected among the first suction mechanism, the second suction mechanism, and the third suction mechanism.

Further, as shown in the figure, the upper die 100 of the molding die 10 is provided with a through hole 101 penetrating from the upper surface to the lower surface. The through hole 101 is connected to a fourth suction mechanism (not shown). Thereby, as described below, the substrate can be sucked and fixed on the lower surface of the upper mold 100. “Inhaling and fixing the substrate on the lower surface of the upper mold 100” means “by holding the substrate, the substrate is closely adhered and fixed on the lower surface of the upper mold 100”.

In the present invention, the "suction mechanism" is not particularly limited, and may be, for example, a vacuum pump, a decompression tank (preferably a large capacity), or the like.

FIG. 2 is an example of a plan view (upper surface view) of the lower mold 200 of FIG. 1. As described above, the lower mold bottom surface member 202, the inner side surface member 201A, and the outer side surface member 201B are provided on the base 2000, respectively. Further, as shown in FIG. 2, the inner side member 201A is arranged so as to surround the lower die bottom member 202 when viewed from above, and the outer side member 201B is arranged so as to surround the inner peripheral portion of the inner side member 201A when viewed from above. The first suction groove 207B is disposed outside the second suction groove 206B. Inside the first suction groove 207B and the second suction groove 206B, a first suction hole 207A and a second suction hole 206A are arranged, respectively. The first suction hole 207A and the second suction hole 206A are each circular when viewed from above. The first suction groove 207B and the first suction hole 207A are included in an outer suction system. The second suction groove 206B and the second suction hole 206A are included in an inside suction system.

FIG. 3 is another example of a plan view (upper surface view) of the lower mold 200 of FIG. 1. As shown in the figure, the example of FIG. 3 is the same as FIG. 2 except that the first suction hole 207A is not circular but elongated. In FIG. 3, four first suction grooves 207B and four first suction holes 207A are shown. However, it is not limited thereto, and may be formed on the lower mold 200 such that one first suction groove 207B and one first suction hole 207A surround the second suction groove 206B, respectively. The case where the number of suction grooves and the number of suction holes may be one is also applicable to the second suction groove 206B and the second suction hole 206A.

FIG. 4 is an example of a plan view of the upper mold 100 of FIG. 1. As shown in the figure, a dot-shaped through hole 101 is provided in the upper mold 100. FIG. 5 is an example of a plan view of a substrate adsorbed on the upper mold 100. As shown, the substrate 1 has a wafer 2 fixed to one surface thereof. As described above, the wafer 2 is not particularly limited, but may be, for example, a semiconductor wafer or the like. As shown in FIGS. 4 and 5, the through-hole 101 of the upper mold 100 is provided at a position corresponding to the wafer 2.

An example of the resin molding method (the manufacturing method of a resin molded product) using the molding die 10 (resin molding apparatus) of FIG. 1 is shown in FIG. 6 thru | or FIG. First, as shown in FIG. 6, the molding die 10 shown in FIG. 1 is prepared (molding die preparation step). At this time, in order to make the distance in the height direction between the upper end surface of the outer side member 201B and the upper end surface of the bottom member 202 greater than the encapsulating resin 20 (refer to FIG. 12) included in the resin molded product (packaged substrate) described later And FIG. 13), the inner side member 201A and the bottom member 202 are lowered in advance.

Next, as shown in FIG. 6, the surface of the substrate 1 opposite to the side on which the wafer 2 is fixed is fixed to the lower surface of the upper mold 100. Specifically, the substrate 1 is attracted and fixed to the lower surface of the upper mold 100 by being sucked from the through hole 101 in the direction of the arrow V1 (upward) by the fourth suction mechanism (not shown). In each step of FIGS. 6 to 13, the state where the substrate 1 is adsorbed and fixed to the lower surface of the upper mold 100 is maintained. The substrate 1 may be fixed to the lower surface of the upper mold 100 using a mechanism such as a clamp instead of the suction mechanism.

In addition, as shown in FIGS. 6 to 9, a release film 1000 as a functional film is supplied to the mold surface of the mold cavity 203 (functional film supply step). This step of this embodiment is as follows, including the first functional film suction step and the second functional film suction step.

First, the release film 1000 is transferred to the position of the mold cavity 203 (functional film transfer step). In this step, for example, as described above, a functional film transport mechanism may be used. In the state shown in FIG. 6, a resin material can be supplied to the release film 1000 (resin material supply step).

Next, as shown in FIG. 6, the release film 1000 is passed through the third suction mechanism (not shown) from the first suction hole 207A, through the on-off valve v2 and the suction channel P2 (see FIG. 1) to the arrow V2. The direction (toward the outside of the lower mold 200) attracts. Thereby, the release film 1000 is made to adsorb | suck along the 1st suction hole 207A and the 1st suction groove 207B. In each step of FIG. 6 to FIG. 13, the state of suction by the suction in the direction of the arrow V2 is maintained.

Next, as shown in FIG. 7, through the gap 205 between the inner side member 201A and the outer side member 201B through the first suction mechanism (not shown), the release film 1000 is passed through the on-off valve v3 and the suction channel P3 (Refer to FIG. 1), suction is performed in the direction of the arrow V3 (toward the outside of the lower mold 200) (first functional film suction step). As described above, the gap 205 between the inner side member 201A and the outer side member 201B is connected to the through hole 210 of the outer side member 201B. In addition, the second suction groove 206B and the second suction hole 206A are connected to the through hole 210 of the outer side member 201B. Therefore, the release film 1000 is attracted by the longitudinal direction (downward in FIG. 7) in the second suction groove 206B. The release film 1000 is sucked by the first suction mechanism in the direction of arrow V3, and is sucked in the lateral direction (leftward in FIG. 7) in the through hole 210, and is sucked downward in the gap 205. Thereby, as shown in FIG. 7, the release film 1000 can be fixed along the upper surface of the inner side surface member 201A and the outer side surface member 201B (lower mold side surface member). In each of the steps of FIG. 7 to FIG. 13, the sucking and sucking state in the direction of the arrow V3 is maintained.

Further, as shown in FIG. 8, through the gap 204 between the bottom surface member 202 and the inner surface member 201A through the second suction mechanism (not shown), the release film 1000 is passed through the switching valve v4 and the suction passage P4 (see Fig. 1), suction in the direction of the arrow V4 (toward the outside of the lower mold 200) (second functional film suction step). That is, the release film 1000 is sucked in the order from the outer suction system to the inner suction system of the molding die 10 as viewed along the mold opening direction. In this way, as shown in FIG. 8, the release film 1000 can be fixed along the mold surface (inner side surface and inner bottom surface) of the mold cavity 203 by suction in the directions of the arrows V2 to V4. In each of the steps of FIGS. 8 to 13, the suction (fixed) state of the suction in the directions of the arrows V2 to V4 is maintained. In addition, in the period from when the lower mold 200 and the upper mold 100 are closed to immediately before the mold is opened, the suction in the directions of the arrows V2 to V4 can be stopped.

Next, as shown in FIG. 9, pellet resin (resin material) 20 a is supplied (mounted) into the mold cavity 203 covered by the release film 1000 (resin material supply step). At this time, before supplying the particulate resin 20a, the entire lower mold 200 may be heated in advance by a heating mechanism (not shown). The method for supplying the granular resin 20 a is not particularly limited, and for example, a granular material 20 a previously measured to an appropriate amount can be transferred using a transfer mechanism (not shown) or the like and supplied to a position of the lower mold cavity 203. In addition, for example, a metering mechanism (not shown) may be used to supply the inside of the lower mold cavity 203 while measuring an appropriate amount of the particulate resin 20a.

In addition, although the resin material 20a is a particulate resin in the drawing, as described above, it is not limited to this, and may be arbitrary. The particulate resin 20a may be, for example, a solid resin material such as powder, granule, or plate, or may be a liquid resin or the like as described above. In addition, the resin material 20a may be, for example, a thermosetting resin such as an epoxy resin, a silicone resin, or a thermoplastic resin, and may further include an additive or the like.

In addition, in FIGS. 6 to 9, after the release film 1000 is supplied into the mold cavity 203, the resin material 20a is supplied into the mold cavity 203 covered with the release film 1000. However, the present invention is not limited to this. For example, as described above, after the resin material 20a is placed (supplied) on the release film 1000, the release film 1000 and the resin material 20a may be transported and the mold cavity 203 may be covered with the release film 1000. Accordingly, the resin material 20 a can be supplied into the mold cavity 203 covered by the release film 1000. In addition, when the resin material 20a is placed on the release film 1000 other than the mold cavity 203, the resin material 20a is preferably a liquid resin, a plate-shaped resin, or the like, for example, so that the resin material 20a does not spill.

Next, as shown in FIG. 10, the resin material 20a is heated to a molten resin (fluid resin) 20b by the heat of the lower mold 200 heated by a heating mechanism (heater, not shown).

Thereafter, as shown in FIG. 11, the lower mold 200 is raised in the direction of arrow X1 by a driving mechanism (not shown) provided on the lower mold 200, and the lower mold 200 and the upper mold 100 are closed. After the upper end surface of the outer side member 201B contacts the upper mold 100, if the lower mold 200 is further raised, the elastic members (elastic bodies) 208 and 209 will shrink. Thereby, the outer side surface member 201B and the inner side surface member 201A are relatively depressed with respect to the lower mold bottom surface member 202. In this step, the semiconductor wafer 2 and the mounting surface mounted on the mounting surface of the substrate 1 are immersed in the fluid resin 20b. Then, the bottom surface member 202 is raised by a driving mechanism provided below the lower mold 200. Then, as shown in FIG. 11, when the distance in the height direction between the upper end surface of the outer surface member 201B and the upper end surface of the bottom surface member 202 is equal to the resin thickness of the resin molded product, the bottom surface member 202 is stopped from rising.

Then, in the state shown in FIG. 11 (the mold-closing state), the necessary time and the mold-closing state required for curing the fluid resin 20b are maintained. Thereby, as shown in FIG. 12, the fluid resin 20 b is cured into a cured resin (encapsulating resin) 20. The method of curing the fluid resin 20b is not particularly limited. For example, when the flowable resin 20b is a thermosetting resin, the flowable resin 20b may be continuously heated and cured (cured). In addition, for example, when the fluid resin 20b is a thermoplastic resin, curing can be performed by stopping heating of the fluid resin 20b and leaving it to stand for a period of time. In the above manner, a resin molded body (resin molded product, denoted by reference numeral 30 in FIG. 13) in which the wafer 2 on the substrate 1 is sealed with the curing resin (encapsulating resin) 20 can be manufactured.

Thereafter, as shown in FIG. 13, the lower mold 200 and the upper mold 100 are opened by lowering the entire lower mold 200 in the direction of arrow X2. A resin molded body (resin molded product) 30 sealed with a curing resin (encapsulating resin) 20 is taken out from the lower mold 200. After that, the suction in the direction of the arrow V1 of the upper mold 100 is released to take out the resin molded product from the upper mold 100. In this way, a resin molded product 30 in which the wafer 2 on the substrate 1 is sealed with a curing resin (sealing resin) 20 can be manufactured. In this embodiment, the resin molded body 30 manufactured by the resin molding step is used as it is as a resin molded product. However, the present invention is not limited to this, and may include a step of further processing the resin molded body produced by the resin molding step to become a resin molded article. For example, in a molding process such as transfer molding, when a resin molded body contains unnecessary resin, burrs, and the like, unnecessary resin, burrs, and the like can be removed from the resin molded body to become a resin molded product.

In the above manner, a resin molding method using the resin molding apparatus of FIG. 1 can be performed. This resin molding method is a method of manufacturing a resin molded product including a substrate 1, a wafer 2, and an encapsulating resin 20. The resin molded article is an electronic component in which the wafer 2 fixed to one surface of the substrate 1 is resin-encapsulated with the encapsulating resin 20.

According to this embodiment, for example, the following effects can be obtained. First, in this embodiment, as described with reference to FIGS. 6 to 8, the operation of suctioning the release film 1000 is divided into three times (suction V2 to V4). Then, as illustrated in FIG. 7 and FIG. 8, the release film 1000 is stretched downward in two times by the suction of the last two of the three times. In the cavity of the same depth, dividing the step of stretching the release film in two steps can shorten the distance of stretching the release film during one suction more than in one step of stretching the release film. Therefore, it is possible to suppress or prevent damage to the release film. That is, according to the present invention, by dividing the side member of the one mold having the side member and the bottom member into an inner side member and an outer side member, it is possible to suppress or prevent the occurrence of a functional film such as a release film. damaged.

After the lower mold 200 and the upper mold 100 are closed, when the molds having the side members and the bottom members are raised, the boundary portions of the upper end faces of the outer side member 201B and the inner side member 201A The release film 1000 at the boundary between the inner side surface member 201A and the upper end surface of the bottom surface member 202 applies an upward force (see FIGS. 10 to 11). As a result, wrinkles may appear on the release film 1000. When the side member is integrally divided into an inner side member and an outer side member, for example, wrinkles may occur only at one portion of a boundary portion between the side member and the bottom member. On the other hand, when the side member is divided into an inner side member 201A and an outer side member 201B, for example, a boundary portion between the outer side member 201B and the upper end face of the inner side member 201A and the inner side Wrinkles appear at two positions of the boundary portion of the side member 201A and the upper end surface of the bottom member 202. When the cavity depth is the same, compared with the one wrinkle that occurs when the integrated side member is lowered, the two that appear when the side member is divided into the inner side member 201A and the outer side member 201B Each fold has a shorter length. That is, according to the present invention, the side member of the one mold having the side member and the bottom member is divided into the inner side member 201A and the outer side member 201B, and the creases of the release film 1000 are taken into the sealing resin (cured resin). ) Becomes shorter. Therefore, according to the present invention, it is possible to suppress or prevent the occurrence of poor mold release caused by the wrinkles of the functional film 1000 ingesting the encapsulating resin (cured resin).

This embodiment shows an example in which the lower mold is the one mold (a mold having a side member and a bottom member). However, the present invention is not limited to this. As described above, the upper mold may be the one mold (a mold having a side member and a bottom member). In this case, for example, the substrate may be supplied to the lower mold, and the resin material may be supplied onto the substrate fixed to the lower mold. In addition, the substrate and the resin material can be simultaneously supplied to the lower mold while the resin material is placed on the substrate. In addition, when a resin material is supplied on a substrate, for example, in order to prevent the resin material from being spilled from the substrate, the resin material is more preferably a liquid resin than a particulate resin.

In this embodiment, an example in which the side member of the one mold is divided into two inner side members and an outer side member is shown. However, the present invention is not limited to this, and the side members may be divided into any number of three or more. More specifically, for example, in the side member, one or two or more members may be arranged between the inner side member and the outer side member, and the outer member may be compared with the surrounding member. We arrange as inner member.

[Example 2]

14 is a cross-sectional view schematically showing another example of the structure of a molding die (resin molding device) according to the present invention, and an example of a resin molding method using the same. The same figure is a diagram showing the same steps as in FIG. 8 of the first embodiment in the resin molding method. The molding die 10 of FIG. 14 is the same as that of FIGS. 1 to 4 and 6 to FIG. 6 except that the outer side member 201B does not have the second suction groove 206B, the second suction hole 206A, and the through hole 210 shown in FIG. The molding die 10 shown in 13 is the same. That is, the resin molding apparatus including the molding die 10 of FIG. 14 uses the first suction mechanism (not shown) to direct the release film 1000 from the gap 205 between the inner side member 201A and the outer side member 201B. When suctioning in the direction of the arrow V3 (toward the outside of the lower die 200), suction through the second suction groove 206B, the second suction hole 206A, and the through hole 210 shown in FIG. 7 and FIG. 8 is not performed. In addition, the resin molding method (manufacturing method of a resin molded product) using the resin molding apparatus of FIG. 14 may be the same as the resin molding method (manufacturing method of a resin molded product) shown in Example 1 (FIGS. 6 to 13). Proceed in the same way.

In the resin molding apparatus of this embodiment (FIG. 14), the side member of the one mold having the side member and the bottom member may be divided into an inner side member and an outer side member in the same manner as in Example 1. Prevent or prevent damage to the release film. In addition, it is also possible to suppress or prevent the occurrence of mold release defects caused by the wrinkles of the mold release film caused by ingestion of the sealing resin (cured resin).

In addition, according to the resin molding apparatus of this embodiment (FIG. 14), for example, when a release film having low flexibility is used, the release film can be closely adhered to the lower mold surface including the mold surface of the mold cavity. In addition, the structure of the outer side member 201B can be simplified by not including the second suction groove 206B, the second suction hole 206A, and the through hole 210 shown in FIGS. 7 and 8.

[Example 3]

FIG. 15 is a cross-sectional view schematically showing still another example of the structure of a molding die (resin molding device) according to the present invention and an example of a resin molding method using the same. The same figure is a view showing a resin molding method, which is the same as the step shown in FIG. 8 of the first embodiment. In the molding die 10 of FIG. 15, the outer side member 201B does not include the second suction groove 206B, the second suction hole 206A, and the through hole 210. Moreover, in this molding die 10, the outer side member 201B does not have the first suction groove 207B and the first suction hole 207A. Otherwise, the molding die of FIG. 15 is the same as the molding die 10 shown in FIGS. 1 to 4 and 6 to 13. That is, in the resin molding apparatus of FIG. 15, the release film 1000 is directed in the direction of the arrow V3 (downward from the gap 205 between the inner side member 201A and the outer side member 201B by the first suction mechanism (not shown)). The outside of the die 200) is not sucked through the two systems of suction through the first suction groove 207B and the through hole 210 shown in Figs. 7 and 8. In addition, the resin molding method (manufacturing method of a resin molded article) using the resin molding apparatus of FIG. 15 can be the same as the resin molding method (manufacturing method of a resin molded article) shown in Example 1 (FIGS. 6 to 13). Do the same.

In the resin molding apparatus of this embodiment (FIG. 15), the side member of the one mold having the side member and the bottom member may be divided into an inner side member and an outer side member in the same manner as in the first embodiment. Prevent or prevent damage to the release film. In addition, it is possible to similarly suppress or prevent the occurrence of mold release defects caused by the wrinkles of the mold release film ingesting the sealing resin (cured resin).

In addition, according to the resin molding apparatus of this embodiment (FIG. 15), for example, when a release film having small flexibility is used, the release film can be closely adhered to the lower mold surface including the mold surface of the mold cavity. In addition, the structure of the outer side member 201B can be further simplified by not having the first suction groove 207B, the first suction hole 207A, the second suction groove 206B, the second suction hole 206A, and the through hole 210.

[Example 4]

FIG. 16 is a cross-sectional view schematically showing still another example of the structure of a molding die (resin molding device) according to the present invention, and an example of a resin molding method using the same. The same figure is a diagram showing the same steps as those in FIG. 8 of Embodiment 1 or FIG. 15 of Embodiment 3 in a resin molding method. The molding die 10 of FIG. 16 is the same as the molding die 10 of FIG. 15 in the third embodiment. As shown in the figure, the resin molding apparatus of FIG. 16 further includes a functional film holding mechanism 300 that holds the functional film 1000. The functional film holding mechanism 300 includes functional film holding members 301 and 302, and as shown in the figure, the release film 1000 can be held and held by the functional film holding members 301 and 302 while being opened to the molding die 10. The die direction (the direction of the downward arrow Y1 in FIG. 16) is stretched. Accordingly, a tensile force can be applied to the release film 1000. Other than that, the resin molding apparatus of FIG. 16 is the same as that of Example 3 (FIG. 15). The resin molding method using the resin molding apparatus of Fig. 16 can be performed in the same manner as in Example 3 (Fig. 15), except that the functional film holding mechanism 300 is used as described above.

In the resin molding apparatus of this embodiment (FIG. 16), the side member of the one mold having the side member and the bottom member may be divided into an inner side member and an outer side member in the same manner as in the first embodiment. Prevent or prevent damage to the release film. In addition, it is also possible to suppress or prevent the occurrence of mold release defects caused by the wrinkles of the mold release film caused by ingestion of the sealing resin (cured resin).

Furthermore, according to the resin molding apparatus of this embodiment (FIG. 16), as described above, the release film 1000 can be held and held by the functional film holding mechanism 300 while being stretched in the mold opening direction of the molding die 10. Thereby, for example, wrinkles, slack, and peeling from the mold surface of the mold cavity 203 can be suppressed or prevented. In addition, for example, when a release film having a small flexibility is used, the release film can be closely adhered to the lower mold surface including the mold surface of the mold cavity. In addition to this, as in the case of the third embodiment, the structure of the outer side member 201B can be further simplified.

In Examples 1 to 4 (FIGS. 1 to 16), the case where the functional film is a release film has been described. The release film is contained in a functional film. However, in the present invention, the functional film is not limited to a release film, and may be arbitrary. That is, the present invention is applicable even when a functional film other than a release film is used. The functional film other than the release film is not particularly limited, and examples thereof include a transfer film for transferring a pattern, a color layer, a conductive layer, a metal foil, an uneven shape, and the like formed on the film to a molded article. . Both the conductive layer and the metal foil function as a heat dissipation member or an electromagnetic shielding member. A transfer film for transferring a pattern, a color layer, or the like to a molded article is called a decorative film.

Further, the present invention is not limited to the above-mentioned embodiments, and may be arbitrarily and appropriately combined, changed, or selected for use as needed without departing from the scope of the present invention.

This application claims priority based on Japanese application Japanese Patent Application No. 2017-065862 filed on March 29, 2017, and the disclosure thereof is incorporated in this specification.

Claims (16)

    A molding die has an upper die and a lower die; one of the upper die and the lower die has a side member and a bottom member; with respect to the one die, the side member and the bottom member can move up and down, respectively; the side The member has an inner side member and an outer side member; the inner side member is disposed so as to surround the bottom face member; the outer side member is disposed so as to surround at least a part of the inner side member; and is surrounded by the bottom face member and the side member The resulting space forms a model cavity; the functional film can be attracted from the gap between the inner side member and the outer side member and the gap between the bottom member and the inner side member to the inner direction of each of the gaps.         The molding die according to claim 1, wherein the aforementioned one mold is a lower mold; the aforementioned side member is a lower die side member; the aforementioned bottom member is a lower die bottom member; the aforementioned inner side member is a lower die inner side member; the aforementioned outer side face The component is a lower mold outer side component.         The mold according to claim 1 or 2, wherein the depth of the mold cavity is made equal to the resin thickness of the resin molded body molded by the mold by moving the bottom surface member in the direction of the mold cavity.         The molding die according to claim 1 or 2, wherein at least one of the inner side member and the outer side member is supported by an elastic body and can be moved up and down by expansion and contraction of the elastic body.         The molding die according to claim 1 or 2, wherein a suction hole is provided on the upper surface of the outer side member, and the functional film can be sucked toward the inside of the suction hole.         The molding die according to claim 5, wherein the suction hole is divided into a first suction hole and a second suction hole, and the second suction hole is provided inside the first suction hole.         A resin molding apparatus having a molding die according to any one of claims 1 to 6.         The resin molding device according to claim 7, further comprising a first suction mechanism that sucks the functional film from a gap between the inner surface member and the outer surface member; and a first suction mechanism that draws the functional film from the gap between the bottom surface member and the inner surface member. The second suction mechanism for the functional film is sucked by the gap between the functional films; the functional film can be sucked in the inner direction of each gap by the suction mechanism.         The resin molding device according to claim 8, further comprising a suction selection mechanism for selectively using the suction by the first suction mechanism and the suction by the second suction mechanism.         The resin molding apparatus according to claim 8 or 9, wherein the molding die is the molding die according to claim 5 or 6, and further includes a third suction mechanism that sucks the functional film through the suction hole.         The resin molding device according to any one of claims 7 to 9, further comprising a functional film holding mechanism that holds the functional film; and the functional film holding mechanism can hold the functional film to the functional film while holding the functional film. The functional film applies a tensile force.         A resin molding method has the following steps: a molding mold preparation step, preparing a molding mold; the molding mold has an upper mold and a lower mold; one of the upper mold and the lower mold has a side member and a bottom member; In other words, the side member and the bottom member can be moved up and down, respectively; the side member has an inner side member and an outer side member; the inner side member is arranged to surround the bottom member; the outer side member surrounds the inner side member Form at least a part of the space; form a cavity between the bottom surface member and the side surface member; form a cavity between the inner surface member and the outer surface member; and between the bottom surface member and the inner surface member The gaps attract the functional films to the inner direction of the gaps respectively; the functional film supplying step supplies the functional films to the mold surface of the mold cavity; the first functional film attracting step from the inner side member and the outer side The gap between the members attracts the aforementioned functional film; the second function A sexual film suction step that sucks the functional film from a gap between the bottom surface member and the inner side member; a resin material supply step that supplies a resin material to the functional film; and a resin molding step that is performed on the upper mold and the In a state in which the lower mold is closed, the resin material is cured by curing the resin material in the mold cavity to produce a resin molded body.         The resin molding method according to claim 12, wherein the second functional film suction step is performed after the first functional film suction step is performed.         The resin molding method according to claim 12 or 13, wherein the molding die is the molding die according to any one of claims 1 to 6.         The resin molding method according to claim 14, which is performed using the resin molding device according to any one of claims 7 to 11.         A method for manufacturing a resin molded article, which is formed by molding a resin using the resin molding method according to any one of claims 12 to 15.