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TW201835182A - Heat transfer sheet - Google Patents

Heat transfer sheet Download PDF

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TW201835182A
TW201835182A TW106124997A TW106124997A TW201835182A TW 201835182 A TW201835182 A TW 201835182A TW 106124997 A TW106124997 A TW 106124997A TW 106124997 A TW106124997 A TW 106124997A TW 201835182 A TW201835182 A TW 201835182A
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Taiwan
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conductive sheet
thermally conductive
resin
heat
carbon material
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TW106124997A
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TWI799384B (en
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內海大介
村上康之
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日本瑞翁股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/04Carbon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H10W40/10
    • H10W40/25

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本發明之熱傳導片材包括多個熱傳導片材半成品。熱傳導片材半成品含有粒子狀碳材料及一種樹脂或多種樹脂之複合物。多個熱傳導片材半成品相對於熱傳導片材的厚度方向而在橫斷方向堆疊。全部樹脂成分之慕尼黏度(Mooney viscosity)為90(ML1+4,100℃)以下。The thermally conductive sheet of the present invention includes a plurality of semi-finished thermally conductive sheets. The semi-finished thermally conductive sheet contains a particulate carbon material and a resin or a composite of multiple resins. A plurality of semi-finished thermally conductive sheets are stacked in the transverse direction with respect to the thickness direction of the thermally conductive sheets. The Mooney viscosity of all resin components is below 90 (ML 1 + 4 , 100 ° C).

Description

熱傳導片材Heat conductive sheet

本發明係關於一種熱傳導片材。The present invention relates to a heat conductive sheet.

近年來,電漿顯示器(PDP)或積體電路(IC)晶片等電子零件隨著高性能化而發熱量增大。其結果,使用電子零件之電子機器,開始需要針對電子零件的溫度上升所致之功能異常尋求對策。In recent years, electronic components such as plasma display (PDP) and integrated circuit (IC) wafers have generated more heat with higher performance. As a result, electronic devices using electronic parts are beginning to seek countermeasures against malfunctions caused by the temperature rise of the electronic parts.

電子零件的溫度上升所致之功能異常的對策,一般是採取以下方法:在電子零件等發熱體上,裝設金屬製的散熱器、散熱板、散熱鰭片等散熱體,藉此促進散熱。並且,於使用散熱體時,為了將熱有效率地從發熱體往散熱體傳導,故使發熱體與散熱體隔著發揮良好熱傳導性的片狀部件(熱傳導片材)而緊密貼附。而且,配置於發熱體與散熱體之間的熱傳導片材,則被要求具備厚度方向的高熱傳導率。The countermeasures for abnormal functions caused by the temperature rise of electronic parts are generally to adopt the following methods: install heat sinks such as metal radiators, heat sinks, and heat dissipation fins on heat generating bodies such as electronic parts to promote heat dissipation. In addition, when the heat dissipation body is used, in order to efficiently conduct heat from the heat generating body to the heat dissipating body, the heat generating body and the heat dissipating body are closely adhered via a sheet member (heat conductive sheet) exhibiting good thermal conductivity. In addition, the heat conductive sheet disposed between the heat generating body and the heat dissipating body is required to have a high thermal conductivity in the thickness direction.

於此,熱傳導片材通常採用使用複合混合物而成形的片材,此複合混合物混合有樹脂與發揮熱傳導性之成分等。近年來,為了提升熱傳導片材的熱傳導率,而針對熱傳導片材的構成成分進行許多研究。Here, as the heat conductive sheet, a sheet formed by using a compound mixture is usually used, and the compound mixture is mixed with a resin, a component exhibiting heat conductivity, and the like. In recent years, in order to improve the thermal conductivity of the thermally conductive sheet, many studies have been conducted on the constituent components of the thermally conductive sheet.

具體而言,以往提案有一種包含特定橡膠成分及配向於一定方向之各向異性石墨的散熱片材(亦即「熱傳導片材」)(例如,參照專利文獻1:日本專利第4743344號)。於專利文獻1揭示有一種使用組成物所製造的散熱片,其中此組成物係藉由在樹脂成分中摻合各向異性石墨而得,且此樹脂成分包含熱塑性橡膠成分、熱固性橡膠成分以及可交聯於此熱固性橡膠成分之熱固性橡膠硬化劑。於製造熱傳導片材時,首先於二片薄膜之間夾入調製所得之組成物且進行壓延,並將各向異性石墨配向於大略平行於壓延片材之主面的方向,進而作成初級片材。接下來,將此初級片材於指定方向捲繞而獲得成形體,且於指定方向切片此成形體以製成熱傳導片材。Specifically, in the past, there has been proposed a heat dissipation sheet (that is, "thermally conductive sheet") containing a specific rubber component and anisotropic graphite oriented in a certain direction (for example, refer to Patent Document 1: Japanese Patent No. 4743344). Patent Document 1 discloses a heat sink manufactured using a composition, wherein the composition is obtained by blending anisotropic graphite in a resin component, and the resin component includes a thermoplastic rubber component, a thermosetting rubber component, and a A thermosetting rubber hardener cross-linked to this thermosetting rubber component. When manufacturing a thermally conductive sheet, the prepared composition is sandwiched between two films and rolled, and the anisotropic graphite is oriented in a direction roughly parallel to the main surface of the rolled sheet to make a primary sheet . Next, this primary sheet is wound in a specified direction to obtain a shaped body, and this shaped body is sliced in a specified direction to make a thermally conductive sheet.

然而,專利文獻1所揭示之熱傳導片材在提升熱傳導性上尚有改善的空間。However, the thermally conductive sheet disclosed in Patent Document 1 has room for improvement in improving thermal conductivity.

因此,本發明之目的在於提供一種厚度方向的熱傳導性優異之熱傳導片材。Therefore, an object of the present invention is to provide a thermally conductive sheet excellent in thermal conductivity in the thickness direction.

本發明人等為了達成上述目的而進行了專心致志的研究。而且,本發明人等新發現到熱傳導片材所含有之樹脂成分的慕尼黏度(Mooney viscosity)會對熱傳導片材的熱傳導性造成極大影響,進而完成本發明。In order to achieve the above object, the inventors of the present invention conducted intensive research. Furthermore, the present inventors have newly discovered that the Mooney viscosity of the resin component contained in the thermally conductive sheet greatly affects the thermal conductivity of the thermally conductive sheet, and completed the present invention.

亦即,本發明之目的在於有效地解決上述課題。本發明之熱傳導片材的特徵在於:相對於前述熱傳導片材的厚度方向而在橫斷方向堆疊多層熱傳導片材半成品而成,其中此熱傳導片材半成品,包含粒子狀碳材料及一種樹脂或多種樹脂之複合物。由前述一種樹脂或多種樹脂之複合物而成之全部樹脂成分的慕尼黏度為90(ML1+4 ,100℃)以下。全部樹脂成分的慕尼黏度為90(ML1+4 ,100℃)以下之指定構造的熱傳導片材,其厚度方向的熱傳導性優異。That is, the object of the present invention is to effectively solve the above-mentioned problems. The thermally conductive sheet of the present invention is characterized by stacking a plurality of semi-finished thermally conductive sheets in a transverse direction with respect to the thickness direction of the thermally conductive sheet, wherein the semi-finished thermally conductive sheet includes a particulate carbon material and a resin or multiple types Compound of resin. The Mooney viscosity of all resin components made of the aforementioned resin or a combination of resins is 90 (ML 1 + 4 , 100 ° C) or less. The heat conduction sheet of the specified structure whose Mooney viscosity of all resin components is 90 (ML 1 + 4 , 100 ° C) or less has excellent heat conductivity in the thickness direction.

此外,本說明書中所述之「慕尼黏度(ML1+4 ,100℃) 」,可根據JIS K6300於100℃進行量測。In addition, the "Muni viscosity (ML 1 + 4 , 100 ° C)" described in this specification can be measured at 100 ° C according to JIS K6300.

於此,在將前述全部樹脂成分的慕尼黏度設為X且將前述熱傳導片材的厚度方向的熱傳導率設為Y的情況中,本發明之熱傳導片材以滿足Y>(-0.2X+25)之關係式為佳。滿足上述特定關係式之熱傳導片材,由於容易選擇製造時所使用的樹脂而製造效率優異。Here, in the case where the Mooney viscosity of all the resin components is X and the thermal conductivity in the thickness direction of the thermally conductive sheet is Y, the thermally conductive sheet of the present invention satisfies Y> (-0.2X + 25) The relationship is better. The heat conductive sheet satisfying the above-mentioned specific relational expression is excellent in manufacturing efficiency because it is easy to select the resin used in manufacturing.

此外,在本說明書中,可依據實施例所記載之方法量測熱傳導片材的「厚度方向的熱傳導率」。In addition, in this specification, the "thermal conductivity in the thickness direction" of the heat conductive sheet can be measured according to the method described in the embodiment.

並且,本發明之熱傳導片材以ASKER C硬度為45以上為佳。熱傳導片材之ASKER C硬度為45以上時,熱傳導片材之處理性優異。In addition, the heat conductive sheet of the present invention preferably has an ASKER C hardness of 45 or more. When the ASKER C hardness of the heat conductive sheet is 45 or more, the heat conductive sheet has excellent handleability.

於此,「ASKER C硬度」可根據日本橡膠協會標準規格(SRIS)之ASKER C硬度法,於23℃下使用硬度計量測。Here, "ASKER C hardness" can be measured using the hardness measurement at 23 ° C according to the ASKER C hardness method of the Japan Rubber Association Standard Specification (SRIS).

而且,本發明之熱傳導片材以前述粒子狀碳材料的含有比例為35體積%以上為佳。含有35體積%以上之粒子狀碳材料的熱傳導片材,其熱傳導性更加優異。Furthermore, the thermally conductive sheet of the present invention preferably has a content ratio of the particulate carbon material of 35% by volume or more. A thermally conductive sheet containing more than 35% by volume of particulate carbon material has more excellent thermal conductivity.

根據本發明,可提供厚度方向的熱傳導性優異之熱傳導片材。According to the present invention, it is possible to provide a thermally conductive sheet excellent in thermal conductivity in the thickness direction.

以下,根據本發明之實施形態詳細地對本發明進行例示說明。Hereinafter, the present invention will be described in detail based on the embodiments of the present invention.

本發明的熱傳導片材,可直接附著於發熱體而使用,亦可在將散熱體裝設至發熱體上時夾入發熱體與散熱體之間而使用。此時,熱傳導片材可單獨使用一片,亦可併用多片。並且,本發明的熱傳導片材,亦可與發熱體以及散熱器、散熱板、散熱鰭片等散熱體一起構成散熱裝置。The heat conductive sheet of the present invention can be used by directly attaching to a heating body, or can be used by being sandwiched between a heating body and a cooling body when the cooling body is mounted on the heating body. At this time, one heat conductive sheet may be used alone, or a plurality of sheets may be used in combination. In addition, the heat conductive sheet of the present invention may constitute a heat dissipation device together with a heat dissipation body such as a heat generating body, a heat sink, a heat dissipation plate, and a heat dissipation fin.

以下將說明熱傳導片材。The heat conductive sheet will be explained below.

本發明的熱傳導片材係相對於熱傳導片材的厚度方向而在橫斷方向堆疊多層熱傳導片材半成品而成。相對於熱傳導片材的厚度方向而在橫斷方向堆疊多層熱傳導片材半成品而成之熱傳導片材,其厚度方向的熱傳導性優異。再者,構成本發明之熱傳導片材的熱傳導片材半成品,包含粒子狀碳材料及做為全部樹脂成分之一種樹脂或多種樹脂之複合物。於熱傳導片材半成品不含有粒子狀碳材料的情形中,熱傳導片材的熱傳導率變得不足。並且,於熱傳導片材半成品不含有樹脂成分的情形中,熱傳導片材的柔軟性變得不足。而且,於本發明之熱傳導片材中,全部樹脂成分的慕尼黏度為90(ML1+4 ,100℃)以下。熱傳導片材的母材之全部樹脂成分(以下亦稱為「母材樹脂」) 若不是慕尼黏度為90(ML1+4 ,100℃)以下的樹脂時,便無法充分提高熱傳導片材的熱傳導性。The heat conductive sheet of the present invention is formed by stacking a plurality of semi-finished heat conductive sheets in a transverse direction with respect to the thickness direction of the heat conductive sheet. The thermally conductive sheet formed by stacking multiple semi-finished thermally conductive sheets in the transverse direction with respect to the thickness direction of the thermally conductive sheet has excellent thermal conductivity in the thickness direction. Furthermore, the semi-finished product of the thermal conductive sheet constituting the thermal conductive sheet of the present invention includes a particulate carbon material and a resin or a composite of multiple resins as the entire resin component. In the case where the semi-finished product of the thermally conductive sheet does not contain particulate carbon material, the thermal conductivity of the thermally conductive sheet becomes insufficient. In addition, in the case where the semi-finished heat conductive sheet does not contain a resin component, the flexibility of the heat conductive sheet becomes insufficient. Moreover, in the heat conductive sheet of the present invention, the Mooney viscosity of all resin components is 90 (ML 1 + 4 , 100 ° C.) or less. The total resin content of the base material of the heat conductive sheet (hereinafter also referred to as "base resin") If it is not a resin with a Mooney viscosity of 90 (ML 1 + 4 , 100 ° C) or less, the heat conductive sheet cannot be sufficiently improved Thermal conductivity.

此外,本發明之熱傳導片材,因是包含熱傳導片材半成品的堆疊構造而成,故熱傳導片材半成品的含有成分理所當然地會全部被包含在熱傳導片材中。並且,多片熱傳導片材半成品彼此直接附著,或者較佳為隔著極薄的附著層而附著,其中此附著層係由與熱傳導片材的母材樹脂相同組成之樹脂或雙面膠帶所形成。因此,「構成本發明之熱傳導片材的熱傳導片材半成品」所含有的成分及其比率,也全部適用於「本發明之熱傳導片材」。In addition, since the heat conductive sheet of the present invention is formed by stacking the semi-finished products of the heat conductive sheet, the components of the semi-finished products of the heat conductive sheet are naturally included in the heat conductive sheet as a matter of course. Moreover, a plurality of semi-finished products of thermally conductive sheets are directly attached to each other, or preferably are attached via an extremely thin adhesive layer, wherein the adhesive layer is formed of resin or double-sided tape having the same composition as the base material resin of the thermally conductive sheet . Therefore, all the components and their ratios contained in the "heat conductive sheet semi-finished product constituting the heat conductive sheet of the present invention" are also applicable to the "heat conductive sheet of the present invention".

<組成><Composition>

﹝粒子狀碳材料﹞﹝ Particulate carbon material ﹞

於此,作為粒子狀碳材料並未特別限制。舉例而言,可使用人造石墨、鱗片狀石墨、薄片化石墨、天然石墨、酸處理石墨、膨脹性石墨、膨脹化石墨等之石墨;碳黑等。於此等材料中,可單獨使用一種,亦可併用二種以上。Here, the particulate carbon material is not particularly limited. For example, graphite such as artificial graphite, flake graphite, exfoliated graphite, natural graphite, acid-treated graphite, expandable graphite, expanded graphite, etc .; carbon black, etc. can be used. Among these materials, one kind may be used alone, or two or more kinds may be used in combination.

其中,以使用膨脹化石墨做為粒子狀碳材料為佳。其原因在於,若使用膨脹化石墨,則能夠提升熱傳導片材的熱傳導性。Among them, it is preferable to use expanded graphite as the particulate carbon material. The reason is that if expanded graphite is used, the thermal conductivity of the thermally conductive sheet can be improved.

-膨脹化石墨--Expanded graphite-

於此,可適當地使用做為粒子狀碳材料的膨脹化石墨,例如可藉由使用硫酸等將鱗片狀石墨等之石墨進行化學處理而得到膨脹性石墨,再將此膨脹性石墨進行熱處理令其膨脹後,進行細微化而得。而膨脹化石墨,可舉出例如伊藤黑鉛工業股份有限公司製之EC1500、EC1000、EC500、EC300、EC100、EC50(皆為商品名)等。Here, expanded graphite as a particulate carbon material can be suitably used. For example, expanded graphite can be obtained by chemically treating graphite such as flake graphite with sulfuric acid, and then subjecting the expanded graphite to heat treatment After expansion, it is refined. Examples of expanded graphite include EC1500, EC1000, EC500, EC300, EC100, and EC50 (all are trade names) manufactured by Ito Black Lead Industry Co., Ltd.

-粒子狀碳材料的性質與狀態--Properties and states of particulate carbon materials-

於此,粒子狀碳材料的粒徑以體積基準眾數直徑(mode diameter)為100μm以上為佳, 以150μm以上為較佳,且以300μm以下為佳,以250μm以下為較佳。其原因在於,若粒子狀碳材料的粒徑為上述下限以上,則於熱傳導片材中,粒子狀碳材料彼此接觸而形成良好的傳熱路徑,因此可使熱傳導片材發揮更高的熱傳導性。並且,若粒子狀碳材料的粒徑為上述上限以下,則可賦予熱傳導片材更高的柔軟性,且與發熱體相接時可更良好地從發熱體往熱傳導片材進行傳熱。Here, the particle size of the particulate carbon material is preferably a volume-based mode diameter of 100 μm or more, preferably 150 μm or more, and preferably 300 μm or less, and preferably 250 μm or less. The reason is that if the particle size of the particulate carbon material is more than the above lower limit, the particulate carbon materials are in contact with each other to form a good heat transfer path in the thermally conductive sheet, so that the thermally conductive sheet can exhibit higher thermal conductivity . In addition, if the particle size of the particulate carbon material is equal to or less than the above upper limit, the thermally conductive sheet can be provided with higher flexibility, and when contacting the heating element, heat can be more favorably transferred from the heating element to the thermally conductive sheet.

並且,本發明之熱傳導片材所含之粒子狀碳材料的縱橫比(長徑/短徑),以1以上且10以下為佳,以1以上且5以下為較佳。In addition, the aspect ratio (long axis / short axis) of the particulate carbon material contained in the heat conductive sheet of the present invention is preferably 1 or more and 10 or less, and preferably 1 or more and 5 or less.

此外,本發明中,「體積基準眾數直徑」可使用雷射繞射⁄散射式粒徑分布量測裝置,並依據本發明說明書的實施例所記載之方法而求得。In addition, in the present invention, the "volume-based mode diameter" can be obtained using a laser diffraction / scattering type particle size distribution measuring device and according to the method described in the embodiments of the present specification.

並且,本發明中,「粒子狀碳材料的縱橫比」可藉由以下方法求得:於溶劑中溶解並去除熱傳導片材中之樹脂,利用SEM (掃描式電子顯微鏡)觀察所得之粒子狀碳材料,對任意的50個粒子狀碳材料量測其最大直徑(長徑)及與最大直徑正交之方向的粒徑(短徑),並算出長徑與短徑的比值(長徑/短徑)之平均值。In addition, in the present invention, the "aspect ratio of the particulate carbon material" can be obtained by dissolving and removing the resin in the heat conductive sheet in a solvent, and observing the obtained particulate carbon by SEM (scanning electron microscope) For any 50 particulate carbon materials, measure the maximum diameter (long diameter) and the particle diameter (short diameter) in the direction orthogonal to the maximum diameter, and calculate the ratio of long diameter to short diameter (long diameter / short diameter) Diameter).

-粒子狀碳材料的含有比例--Content ratio of particulate carbon material-

本發明之熱傳導片材中的粒子狀碳材料之含有比例以35體積%以上為佳,以45體積%以上為較佳,以50體積%以上為更佳,通常為70體積%以下。若熱傳導片材中的粒子狀碳材料之含有比例為上述下限以上,則在熱傳導片材中,粒子狀碳材料彼此變得易於接觸,而易形成良好的傳熱路徑。其結果,可令熱傳導片材於厚度方向發揮更高的熱傳導性。再者,若熱傳導片材中的粒子狀碳材料之含有比例為上述範圍內,則此複合粒子變得容易接受到輥壓延等之加壓所致的力,結果在熱傳導片材中可令粒子狀碳材料更良好地在所期望的方向上配向。The content ratio of the particulate carbon material in the heat conductive sheet of the present invention is preferably 35% by volume or more, preferably 45% by volume or more, more preferably 50% by volume or more, and usually 70% by volume or less. If the content ratio of the particulate carbon material in the thermally conductive sheet is greater than or equal to the above lower limit, the particulate carbon materials in the thermally conductive sheet can easily come into contact with each other, and a good heat transfer path can be easily formed. As a result, the thermally conductive sheet can exhibit higher thermal conductivity in the thickness direction. Furthermore, if the content ratio of the particulate carbon material in the thermally conductive sheet is within the above-mentioned range, the composite particles can easily receive the force due to pressure such as roll calendering. As a result, the particles in the thermally conductive sheet The carbon-like material is better aligned in the desired direction.

此外,於本發明,「含有比例(體積%)」能夠根據本說明書之實施例所記載的方法而求得理論值。In addition, in the present invention, the "content ratio (volume%)" can be obtained from the theoretical value according to the method described in the examples of the present specification.

﹝纖維狀碳材料﹞﹝ Fibrous carbon material ﹞

本發明的熱傳導片材可進一步含有任意的纖維狀碳材料。含有任意的纖維狀碳材料並沒有特別限制,可使用例如奈米碳管、氣相成長碳纖維、將有機纖維碳化所得之碳纖維以及此等材料之切斷物等。此等材料可單獨使用一種,亦可併用二種以上。The heat conductive sheet of the present invention may further contain any fibrous carbon material. The inclusion of any fibrous carbon material is not particularly limited, and for example, nano carbon tubes, vapor-grown carbon fibers, carbon fibers obtained by carbonizing organic fibers, and cuts of these materials can be used. These materials can be used alone or in combination of two or more.

而且,若令本發明之熱傳導片材含有纖維狀碳材料,則可更進一步提升熱傳導片材的熱傳導性,同時可防止粒子狀碳材料的掉粉。此外,藉由摻合纖維狀碳材料而可防止粒子狀碳材料的掉粉的理由雖未明確,但推測是因為纖維狀碳材料形成三維網格結構,藉此提高熱傳導性及強度,同時防止粒子狀碳材料的脫離。Furthermore, if the thermally conductive sheet of the present invention contains a fibrous carbon material, the thermal conductivity of the thermally conductive sheet can be further improved, and at the same time, the particulate carbon material can be prevented from being dusted. In addition, although the reason why the powdered carbon material can be prevented from being powdered by blending the fibrous carbon material is not clear, it is presumed that the fibrous carbon material forms a three-dimensional grid structure, thereby improving thermal conductivity and strength while preventing Particulate carbon material detachment.

於上述中,以使用奈米碳管等之纖維狀的碳奈米結構體做為纖維狀碳材料為佳,以使用含奈米碳管之纖維狀的碳奈米結構體做為纖維狀碳材料為較佳。其原因在於,若使用奈米碳管等之纖維狀的碳奈米結構體,則可令使用熱傳導片材而得之熱傳導片材的熱傳導性及強度能夠更進一步提升。In the above, it is better to use fibrous carbon nanostructures such as nanotubes as fibrous carbon materials, and use fibrous carbon nanostructures containing nanotubes as fibrous carbon The material is better. The reason for this is that if a fibrous carbon nanostructure such as a carbon nanotube is used, the thermal conductivity and strength of the thermally conductive sheet obtained by using the thermally conductive sheet can be further improved.

-含奈米碳管之纖維狀的碳奈米結構體--Fibrous carbon nanostructures containing carbon nanotubes-

於此,含奈米碳管之纖維狀的碳奈米結構體可適當地使用做為纖維狀碳材料,且可僅由奈米碳管(以下亦稱為「CNT」)所形成,亦可為CNT與CNT以外的纖維狀的碳奈米結構體之混合物。Here, the fibrous carbon nanostructures containing carbon nanotubes can be suitably used as fibrous carbon materials, and can be formed of only nanotubes (hereinafter also referred to as "CNT") or A mixture of CNT and fibrous carbon nanostructures other than CNT.

此外,纖維狀的碳奈米結構體中的CNT並沒有特別限定,可使用單層奈米碳管及⁄或多層奈米碳管,但CNT以單層至五層的奈米碳管為佳,以單層奈米碳管為較佳。其原因在於,若使用單層奈米碳管,則與使用多層奈米碳管的情況相比之下,可令使用熱傳導片材而得之熱傳導片材的熱傳導性及強度進一步提升。In addition, the CNT in the fibrous carbon nanostructure is not particularly limited, and single-layer nanotubes and ⁄ or multi-layer nanotubes can be used, but CNTs are preferably single-layer to five-layer nanotubes , Single-walled carbon nanotubes are preferred. The reason for this is that if a single-layer carbon nanotube is used, the thermal conductivity and strength of the thermally conductive sheet obtained by using the thermally conductive sheet can be further improved compared to the case of using a multilayered carbon nanotube.

含CNT之纖維狀的碳奈米結構體,以使用3σ/Av超過0.20且未滿0.60之碳奈米結構體為佳,以使用3σ/Av超過0.25之碳奈米結構體為較佳,以使用3σ/Av超過0.50之碳奈米結構體為更佳;其中,3σ為將直徑的標準偏差σ乘以3所得之值, 3σ/Av為3σ對於平均直徑Av之比值。其原因在於,若使用3σ/Av超過0.20且未滿0.60的含CNT之 纖維狀的碳奈米結構體,則即使碳奈米結構體的摻合量為少量,亦可充分提高使用熱傳導片材而得之熱傳導片材的熱傳導性及強度。因此,可抑制熱傳導片材的硬度因摻合含CNT之纖維狀的碳奈米結構體而變得過高(亦即柔軟度降低)的狀況,且可充分兼具優良的熱傳導片材的熱傳導性及柔軟性。For the fibrous carbon nanostructures containing CNTs, it is better to use carbon nanostructures with 3σ / Av exceeding 0.20 and less than 0.60, and it is better to use carbon nanostructures with 3σ / Av exceeding 0.25. It is better to use a carbon nanostructure with a 3σ / Av exceeding 0.50; where 3σ is the value obtained by multiplying the standard deviation σ of the diameter by 3, and 3σ / Av is the ratio of 3σ to the average diameter Av. The reason for this is that if a 3CNT / Av exceeding 0.20 and less than 0.60 CNT-containing fibrous carbon nanostructure is used, even if the amount of the carbon nanostructure is small, the heat conductive sheet can be sufficiently used The resulting thermal conductivity and strength of the thermally conductive sheet. Therefore, the situation that the hardness of the heat conductive sheet becomes excessively high due to the blending of the CNT-containing fibrous carbon nanostructure (that is, the softness is reduced) can be suppressed, and the heat conduction of the excellent heat conductive sheet can be sufficiently combined Sex and softness.

此外,「纖維狀的碳奈米結構體之平均直徑(Av)」及「纖維狀的碳奈米結構體之直徑的標準偏差(σ:樣本標準偏差)」,可分別使用穿透式電子顯微鏡量測隨機選取的100根纖維狀的碳奈米結構體的直徑(外徑)而求得。而且,含CNT之纖維狀的碳奈米結構體之平均直徑(Av)及標準偏差(σ),亦可藉由變更含CNT之纖維狀的碳奈米結構體的製造方法或製造條件而進行調整,亦可藉由組合多種以不同製造方法所製得之含CNT之纖維狀的碳奈米結構體而進行調整。In addition, the "average diameter of the fibrous carbon nanostructure (Av)" and "the standard deviation of the diameter of the fibrous carbon nanostructure (σ: sample standard deviation)" can be used for transmission electron microscopy It was obtained by measuring the diameter (outer diameter) of 100 randomly selected fibrous carbon nanostructures. Moreover, the average diameter (Av) and standard deviation (σ) of the CNT-containing fibrous carbon nanostructure can also be performed by changing the manufacturing method or manufacturing conditions of the CNT-containing fibrous carbon nanostructure Adjustments can also be made by combining a variety of CNT-containing fibrous carbon nanostructures made by different manufacturing methods.

並且,通常使用下述者做為含CNT之纖維狀的碳奈米結構體:以如前述般所測得之直徑做為橫軸且以其頻率做為縱軸進行製圖(plot),於進行高斯(Gaussian)近似時呈常態分布者。In addition, the following is generally used as a CNT-containing fibrous carbon nanostructure: the diameter measured as described above is used as the horizontal axis and the frequency is used as the vertical axis for plotting. Gaussian (Gaussian) is normally distributed when approximate.

再者,於使用拉曼(Raman)光譜法評價含CNT之纖維狀的碳奈米結構體時,以具有徑向呼吸模式(Radial Breathing Mode, RBM)之峰值(peak)為佳。此外,若纖維狀的碳奈米結構體僅包含三層以上之多層奈米碳管,則於其拉曼光譜中不存在RBM。Furthermore, when using Raman spectroscopy to evaluate CNT-containing fibrous carbon nanostructures, the peak with a radial breathing mode (Radial Breathing Mode, RBM) is preferred. In addition, if the fibrous carbon nanostructure includes only three or more multilayer carbon nanotubes, there is no RBM in its Raman spectrum.

並且,含CNT之纖維狀的碳奈米結構體之平均直徑(Av)以0.5nm以上為佳,以1nm以上為更佳,且以15nm以下為佳,以10nm以下為更佳。其原因在於,若纖維狀的碳奈米結構體的平均直徑(Av)為0.5nm以上,則可抑制纖維狀的碳奈米結構體之凝集,且能夠提高碳奈米結構體的分散性。並且,若纖維狀的碳奈米結構體的平均直徑(Av)為15nm以下,則可充分地提高使用熱傳導片材而得之熱傳導片材的熱傳導性及強度。In addition, the average diameter (Av) of the CNT-containing fibrous carbon nanostructure is preferably 0.5 nm or more, more preferably 1 nm or more, and preferably 15 nm or less, and more preferably 10 nm or less. The reason is that if the average diameter (Av) of the fibrous carbon nanostructure is 0.5 nm or more, the aggregation of the fibrous carbon nanostructure can be suppressed, and the dispersibility of the carbon nanostructure can be improved. In addition, if the average diameter (Av) of the fibrous carbon nanostructure is 15 nm or less, the thermal conductivity and strength of the thermally conductive sheet obtained by using the thermally conductive sheet can be sufficiently improved.

再者,含CNT之纖維狀的碳奈米結構體之BET比表面積以600m2 /g以上為佳,以800m2 /g以上為較佳,且以2500m2 /g以下為佳,以1200m2 /g以下為較佳。再者,於纖維狀的碳奈米結構體中的CNT主要為經開口化的CNT時,以BET比表面積為1300m2 /g以上為佳。其原因在於,若含CNT之纖維狀的碳奈米結構體之BET比表面積為600m2 /g以上,則可充分提高使用熱傳導片材而得之熱傳導片材的熱傳導性及強度。並且,若含CNT之纖維狀的碳奈米結構體之BET比表面積為2500m2 /g以下,則可抑制纖維狀的碳奈米結構體之凝集,且可提高熱傳導片材中之CNT的分散性。Further, a BET of carbon nano structure of the CNT-containing fibrous to 600m 2 / g or more preferably to 800m 2 / g or more is preferred specific surface area, and to 2500m 2 / g or less preferably to 1200m 2 / g or less is preferable. Furthermore, when the CNTs in the fibrous carbon nanostructure are mainly CNTs that have been opened, the BET specific surface area is preferably 1300 m 2 / g or more. The reason is that if the BET specific surface area of the CNT-containing fibrous carbon nanostructure is 600 m 2 / g or more, the thermal conductivity and strength of the thermally conductive sheet obtained by using the thermally conductive sheet can be sufficiently improved. In addition, if the BET specific surface area of the CNT-containing fibrous carbon nanostructure is 2500 m 2 / g or less, the aggregation of the fibrous carbon nanostructure can be suppressed and the dispersion of CNTs in the thermally conductive sheet can be improved Sex.

而於本發明中,所謂的「BET比表面積」,係指使用BET法所量測之氮吸附比表面積。In the present invention, the "BET specific surface area" refers to the nitrogen adsorption specific surface area measured by the BET method.

並且,可根據如以下的方法,而有效率地製造具有上述性質與狀態之含CNT之纖維狀的碳奈米結構體:在表面具有奈米碳管製造用的觸媒層之基材上,供給原料化合物及載體氣體(carrier gas),藉由化學氣相沉積(Chemical Vapor Deposition, CVD)法合成CNT,此時藉由在系統內存在微量的氧化劑(活化觸媒物質),而令觸媒層的觸媒活性大幅度地提升(超級成長法,Super-Growth法;參照國際公開第2006/011655號)。此外,以下亦將藉由超級成長法所製得的奈米碳管稱為「SGCNT」。Furthermore, a CNT-containing fibrous carbon nanostructure having the above-mentioned properties and conditions can be efficiently manufactured according to the following method: on a substrate having a catalyst layer for manufacturing carbon nanotubes on the surface, Supply raw material compounds and carrier gas to synthesize CNT by chemical vapor deposition (CVD) method. At this time, the catalyst is activated by trace oxidant (activation catalyst substance) in the system. The catalytic activity of the layer is greatly improved (Super Growth Method, Super-Growth Method; refer to International Publication No. 2006/011655). In addition, the carbon nanotubes produced by the super growth method are also referred to as "SGCNT" below.

於此,藉由超級成長法所製造之含CNT之纖維狀的碳奈米結構體,可僅由SGCNT構成,也可除了SGCNT以外亦包含例如非圓筒形狀的碳奈米結構體等之其它碳奈米結構體。Here, the CNT-containing fibrous carbon nanostructure manufactured by the super growth method may be composed of SGCNT alone, or may include other non-cylindrical carbon nanostructures in addition to SGCNT Carbon nanostructures.

-纖維狀碳材料的性質與狀態--Properties and states of fibrous carbon materials-

而熱傳導片材中可含之纖維狀碳材料的平均纖維直徑,以1nm以上為佳,以3nm以上為較佳,且以2μm以下為佳,以1μm以下為較佳。其原因在於,若纖維狀碳材料的平均纖維直徑在上述範圍內,則可令所得之熱傳導片材,充分兼具優越之熱傳導片材的熱傳導性、柔軟性及強度。The average fiber diameter of the fibrous carbon material that can be contained in the heat conductive sheet is preferably 1 nm or more, preferably 3 nm or more, and preferably 2 μm or less, and preferably 1 μm or less. The reason for this is that if the average fiber diameter of the fibrous carbon material is within the above range, the resulting thermally conductive sheet can sufficiently have excellent thermal conductivity, flexibility and strength of the thermally conductive sheet.

於此,纖維狀碳材料的縱橫比以超過10為佳。Here, the aspect ratio of the fibrous carbon material is preferably more than 10.

此外,於本發明中,「平均纖維直徑」可藉由以下方法求得:在溶劑中溶解並去除熱傳導片材中的樹脂,利用SEM (掃描式電子顯微鏡)或TEM (穿透式電子顯微鏡) 觀察所得之纖維狀碳材料,並針對任意的50個纖維狀碳材料量測纖維直徑,且算出所量測之纖維直徑的數量平均值。尤其,在纖維直徑小的情形,就相同的斷面而言,較適合利用TEM (穿透式電子顯微鏡)進行觀察。In addition, in the present invention, the "average fiber diameter" can be obtained by dissolving and removing the resin in the heat conductive sheet in a solvent, using SEM (scanning electron microscope) or TEM (transmission electron microscope) Observe the obtained fibrous carbon material, and measure the fiber diameter for any 50 fibrous carbon materials, and calculate the average number of the measured fiber diameters. In particular, when the fiber diameter is small, it is more suitable for observation by TEM (transmission electron microscope) for the same cross section.

並且,於本發明中,「纖維狀碳材料的縱橫比」可藉由以下方法求出:溶解並去除熱傳導片材中的樹脂,利用TEM(穿透式電子顯微鏡)觀察所得之纖維狀碳材料,並針對任意的50個纖維狀碳材料量測最大直徑(長徑)及與最大直徑正交之方向的粒徑(短徑),且算出長徑與短徑的比值(長徑/短徑)之平均值。In addition, in the present invention, the "aspect ratio of the fibrous carbon material" can be obtained by dissolving and removing the resin in the thermally conductive sheet, and observing the obtained fibrous carbon material with a TEM (transmission electron microscope) , And measure the maximum diameter (long diameter) and the particle diameter (short diameter) in the direction orthogonal to the maximum diameter for any 50 fibrous carbon materials, and calculate the ratio of long diameter to short diameter (long diameter / short diameter) ) Average.

﹝樹脂﹞﹝ Resin ﹞

於此,構成本發明之熱傳導片材的母材樹脂必須為慕尼黏度為90(ML1+4 ,100℃)以下之樹脂。此母材樹脂只要慕尼黏度為90(ML1+4 ,100℃)以下,則並未特別限定,可使用於製造熱傳導片材時可使用之已知的一種樹脂或多種樹脂之複合物。而且,並未特別限定之慕尼黏度為90(ML1+4 ,100℃)以下的母材樹脂,可為未硫化的樹脂。此外,於本說明書中,「樹脂」包含橡膠及彈性體(elastomer)。並且,於本說明書中,「未硫化」係指無論樹脂或成為樹脂材料之樹脂組成物中是否含有硫化劑(交聯劑),對於此樹脂或樹脂組成物加熱等都不發生交聯反應之狀態。Here, the base material resin constituting the heat conductive sheet of the present invention must be a resin having a Mooney viscosity of 90 (ML 1 + 4 , 100 ° C.) or less. This base material resin is not particularly limited as long as the Mooney viscosity is 90 (ML 1 + 4 , 100 ° C.) or less, and it can be a known resin or a composite of multiple resins that can be used when manufacturing a thermally conductive sheet. Moreover, the base material resin whose Mooney viscosity is not particularly limited to 90 (ML 1 + 4 , 100 ° C) or less may be an unvulcanized resin. In addition, in this specification, "resin" includes rubber and an elastomer (elastomer). In addition, in this specification, "uncured" means that no crosslinking reaction occurs when the resin or resin composition contains a vulcanizing agent (crosslinking agent), and the resin or resin composition is heated. status.

再者,母材樹脂以具有熱塑性之樹脂為佳。於本說明書中,所謂的「熱塑性」,意指藉由加熱而軟化,成為可成形的狀態,再進一步藉由冷卻而硬化的特性。再者,樹脂為「熱塑性」的情形中,硬化狀態之樹脂的聚合物結構內通常不含有交聯結構。於此,一般而言,樹脂被大致區分為「熱塑性樹脂」與「熱固性樹脂」。然而,即使一般是可被分類為「熱固性樹脂」的樹脂,若在不存在交聯劑的狀態下進行硬化,也會有在聚合物結構內未形成交聯結構的狀況。因此,於本說明書中,無論一般是被分類為熱塑性樹脂或被分類為熱固性樹脂,將具有上述定義之「熱塑性」的樹脂統稱為「具熱塑性之樹脂」。Furthermore, the base material resin is preferably a thermoplastic resin. In this specification, the so-called "thermoplastic" means a characteristic that it is softened by heating and becomes a formable state, and further hardened by cooling. Furthermore, in the case where the resin is "thermoplastic", the polymer structure of the resin in the cured state usually does not contain a cross-linked structure. Here, in general, resins are roughly classified into "thermoplastic resins" and "thermosetting resins". However, even if it is generally a resin that can be classified as a "thermosetting resin", if it is cured in the absence of a crosslinking agent, there may be a case where no crosslinking structure is formed in the polymer structure. Therefore, in this specification, regardless of whether they are generally classified as thermoplastic resins or thermosetting resins, resins having the above-defined "thermoplastic" are collectively referred to as "thermoplastic resins".

而且,若於熱傳導片材中摻合「具熱塑性之樹脂」,則可提升熱傳導片材與發熱體或散熱體等部件間的密著性。其原因在於,「具熱塑性之樹脂」於使用熱傳導片材時(散熱時)的高溫環境下,可提高熱傳導片材的柔軟性。In addition, if the "thermoplastic resin" is blended into the thermally conductive sheet, the adhesion between the thermally conductive sheet and the heating element, heat sink, etc. can be improved. The reason is that the "thermoplastic resin" can improve the flexibility of the thermally conductive sheet in the high temperature environment when the thermally conductive sheet is used (at the time of heat dissipation).

此外,用以做為母材樹脂的「具熱塑性之樹脂」,於常溫常壓下為固態。若用以做為母材樹脂的樹脂於常溫常壓下為固態,則於使用時(散熱時)的高溫環境下,能夠更加提升熱傳導片材的柔軟性以及令熱傳導片材與散熱體更加良好地密著,並且於裝設時等的常溫環境下能夠提高熱傳導片材的處理(handling)性。此外,於本說明書中,「常溫」係指23℃,且「常壓」係指1大氣壓(絕對壓力)。In addition, the "thermoplastic resin" used as the base material resin is solid at normal temperature and pressure. If the resin used as the base material resin is solid at normal temperature and pressure, it can improve the flexibility of the heat conductive sheet and make the heat conductive sheet and the heat sink better under the high temperature environment during use (during heat dissipation) The ground is tightly sealed, and the handling property of the heat conductive sheet can be improved under normal temperature environment such as installation. In addition, in this specification, "normal temperature" means 23 degreeC, and "normal pressure" means 1 atmospheric pressure (absolute pressure).

並且,如上所述,母體樹脂可包含一種樹脂而成,亦可為混合二種以上的樹脂所得之複合物。於使用複合物做為母材樹脂的情形中,構成複合物之各種樹脂於常溫常壓下可為固態的樹脂,亦可為液態的樹脂,但於形成複合物的情況下,此複合物必須於常溫常壓下成為固態。In addition, as described above, the matrix resin may contain one kind of resin, or may be a composite obtained by mixing two or more kinds of resins. In the case of using the composite as the base material resin, various resins constituting the composite may be solid resins or liquid resins at normal temperature and pressure, but in the case of forming a composite, the composite must It becomes solid at normal temperature and pressure.

-具熱塑性之樹脂--Thermoplastic resin-

(1)於常溫常壓下為固態的具熱塑性之樹脂(1) Thermoplastic resin that is solid at normal temperature and pressure

以下列舉可使用做為母材樹脂的具熱塑性之樹脂,其等為於常溫常壓下為固態的樹酯:聚(丙烯酸2-乙基己酯)、丙烯酸與丙烯酸2-乙基己酯之共聚物、聚甲基丙烯酸或其酯、聚丙烯酸或其酯等之丙烯酸樹脂;矽氧樹脂;氟樹脂;聚乙烯;聚丙烯;乙烯-丙烯共聚物;聚甲基戊烯;聚氯乙烯;聚偏二氯乙烯;聚乙酸乙烯酯;乙烯-乙酸乙烯共聚物;聚乙烯醇;聚縮醛;聚對苯二甲酸乙二酯(polyethylene terephthalate);聚對苯二甲酸丁二酯(polybutylene terephthalate);聚萘二甲酸乙二酯(polyethylene naphthalate);聚苯乙烯;聚丙烯腈;苯乙烯-丙烯腈共聚物;丙烯腈-丁二烯共聚物(腈橡膠);丙烯腈-丁二烯-苯乙烯共聚物(ABS樹脂);苯乙烯-丁二烯嵌段共聚物或其氫化物;苯乙烯-異戊二烯嵌段共聚物或其氫化物;聚苯醚(polyphenylene ether)、改質聚苯醚;脂肪族聚醯胺類;芳香族聚醯胺類;聚醯胺醯亞胺(polyamideimide);聚碳酸酯;聚苯硫;聚碸;聚醚碸;聚醚腈(polyether nitrile);聚醚酮;聚酮(polyketone);聚胺酯(polyurethane);液晶聚合物;離子聚合物等。此些樹脂可單獨使用一種,亦可併用二種以上。The following are examples of resins with thermoplastic properties that can be used as base material resins, which are resins that are solid at room temperature and pressure: poly (2-ethylhexyl acrylate), acrylic acid and 2-ethylhexyl acrylate Acrylic resins such as copolymers, polymethacrylic acid or its esters, polyacrylic acid or its esters; silicone resins; fluororesins; polyethylene; polypropylene; ethylene-propylene copolymers; polymethylpentene; polyvinyl chloride; Polyvinylidene chloride; polyvinyl acetate; ethylene-vinyl acetate copolymer; polyvinyl alcohol; polyacetal; polyethylene terephthalate; polyethylene terephthalate; polybutylene terephthalate ); Polyethylene naphthalate; polystyrene; polyacrylonitrile; styrene-acrylonitrile copolymer; acrylonitrile-butadiene copolymer (nitrile rubber); acrylonitrile-butadiene- Styrene copolymer (ABS resin); styrene-butadiene block copolymer or its hydride; styrene-isoprene block copolymer or its hydride; polyphenylene ether (polyphenylene ether), modified Polyphenylene ether; Aliphatic polyamides; Aromatic polyamides; Polyamideimide; Polycarbonate; Polyphenylene sulfide; Polysulfide; Polyether sulfide; Polyether nitrile ; Polyether ketone; Polyketone; Polyurethane; Liquid crystal polymer; Ionic polymer and so on. These resins may be used alone or in combination of two or more.

再者,使用做為母材樹脂之於常溫常壓下為固態的「具熱塑性之樹脂」,以氟樹脂為佳。其原因在於,若母材樹脂為氟樹脂,則能夠提升熱傳導片材的耐熱性、耐油性及耐化學性。具體而言,可列舉偏二氟乙烯系氟樹脂、四氟乙烯-丙烯系氟樹脂、四氟乙烯-全氟乙烯基醚(tetrafluoroethylene-perfluorovinylether)系氟樹脂等之聚合含氟單體而得之彈性體等。更具體而言,可列舉聚四氟乙烯、四氟乙烯-全氟烷基乙烯基醚共聚物(tetrafluoroethylene-perfluoroalkylvinyl ether copolymer)、四氟乙烯-六氟丙烯共聚物、四氟乙烯-乙烯共聚物、聚偏二氟乙烯、聚三氟氯乙烯、乙烯-氯氟乙烯共聚物(ethylene-chlorofluoroethylene copolymer)、四氟乙烯-全氟間二氧雜環戊烯共聚物(tetrafluoroethylene-perfluorodioxole copolymer)、聚氟乙烯、四氟乙烯-丙烯共聚物、偏二氟乙烯-六氟丙烯共聚物、偏二氟乙烯-六氟丙烯-四氟乙烯共聚物、聚四氟乙烯之丙烯酸改質物、聚四氟乙烯之酯改質物、聚四氟乙烯之環氧改質物及聚四氟乙烯之矽烷改質物。於此等之中,就加工性的觀點而言,以聚四氟乙烯、聚四氟乙烯之丙烯酸改質物、四氟乙烯-全氟烷基乙烯基醚共聚物、偏二氟乙烯-六氟丙烯共聚物及偏二氟乙烯-六氟丙烯-四氟乙烯共聚物為佳。Furthermore, it is preferable to use a "thermoplastic resin" that is a solid base material at room temperature and pressure, preferably a fluororesin. The reason is that if the base material resin is a fluororesin, the heat resistance, oil resistance, and chemical resistance of the heat conductive sheet can be improved. Specific examples include polymerized fluorine-containing monomers such as vinylidene fluoride-based fluororesins, tetrafluoroethylene-propylene-based fluororesins, tetrafluoroethylene-perfluorovinylether (tetrafluoroethylene-perfluorovinylether) fluororesins, etc. Elastomers, etc. More specifically, polytetrafluoroethylene, tetrafluoroethylene-perfluoroalkylvinyl ether copolymer, tetrafluoroethylene-hexafluoropropylene copolymer, tetrafluoroethylene-ethylene copolymer , Polyvinylidene fluoride, polytrifluorochloroethylene, ethylene-chlorofluoroethylene copolymer (ethylene-chlorofluoroethylene copolymer), tetrafluoroethylene-perfluorodioxole copolymer (tetrafluoroethylene-perfluorodioxole copolymer), poly Ethylene fluoride, tetrafluoroethylene-propylene copolymer, vinylidene fluoride-hexafluoropropylene copolymer, vinylidene fluoride-hexafluoropropylene-tetrafluoroethylene copolymer, polytetrafluoroethylene acrylic modified, polytetrafluoroethylene Ester modified products, epoxy modified products of polytetrafluoroethylene and silane modified products of polytetrafluoroethylene. Among these, from the viewpoint of processability, polytetrafluoroethylene, acrylic modification of polytetrafluoroethylene, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, vinylidene fluoride-hexafluoro Propylene copolymers and vinylidene fluoride-hexafluoropropylene-tetrafluoroethylene copolymers are preferred.

並且,市售之於常溫常壓下為固態且具有熱塑性的氟樹脂,可列舉例如DAIKIN工業股份有限公司製之DAI-EL(註冊商標) G-300系列/G-700系列/G-7000系列(偏二氟乙烯-六氟丙烯之二元系共聚物)、DAI-EL G-550系列/G-600系列(偏二氟乙烯-六氟丙烯-四氟乙烯之三元系共聚物)、DAI-EL G-800系列(偏二氟乙烯-六氟丙烯之二元系共聚物)、DAI-EL G-900系列(偏二氟乙烯-六氟丙烯-四氟乙烯之三元系共聚物);ALKEMA公司製之KYNAR(註冊商標)系列(偏二氟乙烯系氟樹脂)、KYNAR FLEX(註冊商標)系列(偏二氟乙烯-六氟丙烯-四氟乙烯之三元系共聚物);Chemours公司製之A-100(偏二氟乙烯-六氟丙烯之二元系共聚物);3M Japan公司製之Dyneon E-20575(註冊商標) (偏二氟乙烯-六氟丙烯之二元系共聚物)等。In addition, commercially available fluororesins that are solid and thermoplastic at room temperature and pressure include, for example, DAI-EL (registered trademark) manufactured by DAIKIN Industries Co., Ltd. G-300 series / G-700 series / G-7000 series (Binary copolymer of vinylidene fluoride-hexafluoropropylene), DAI-EL G-550 series / G-600 series (ternary copolymer of vinylidene fluoride-hexafluoropropylene-tetrafluoroethylene), DAI-EL G-800 series (binary copolymer of vinylidene fluoride-hexafluoropropylene), DAI-EL G-900 series (ternary copolymer of vinylidene fluoride-hexafluoropropylene-tetrafluoroethylene ); KYNAR (registered trademark) series (vinylidene fluoride-based fluororesin) and KYNAR FLEX (registered trademark) series (ternary copolymer of vinylidene fluoride-hexafluoropropylene-tetrafluoroethylene) manufactured by ALKEMA; A-100 manufactured by Chemours (binary copolymer of vinylidene fluoride-hexafluoropropylene); Dyneon E-20575 (registered trademark) manufactured by 3M Japan (registered binary system of vinylidene fluoride-hexafluoropropylene) Copolymer) etc.

(2)於常溫常壓下為液態的具熱塑性之樹脂(2) Thermoplastic resin that is liquid at normal temperature and pressure

並且,如上所述,當複合物於常溫常壓下成為固態且並未顯著損及本發明效果的前提下,亦可於常溫常壓下為固態的具熱塑性之樹脂中結合於常溫常壓下為液態的具有熱塑性之樹脂而使用。作為於常溫常壓下為液態的具熱塑性之樹脂,例如,可列舉除了符合上述(1)的樹脂以外的樹脂之丙烯酸樹脂、環氧樹脂、矽氧樹脂及氟樹脂等。此等樹脂可單獨使用一種,亦可併用二種以上。Moreover, as described above, when the composite becomes solid at normal temperature and pressure and does not significantly impair the effects of the present invention, it can also be combined at room temperature and normal pressure with a thermoplastic resin that is solid at normal temperature and pressure Used as a liquid thermoplastic resin. Examples of thermoplastic resins that are liquid at normal temperature and pressure include acrylic resins, epoxy resins, silicone resins, and fluororesins that are resins other than those that satisfy the above (1). These resins may be used alone or in combination of two or more.

雖並未特別限定於常溫常壓下為液態的具有熱塑性之樹脂的黏度,但就混練性、流動性、交聯反應性良好以及成形性亦優異的觀點而言,此樹脂於105℃時的黏度以500mPa•s~30,000 mPa•s為佳,以550mPa•s~25,000 mPa•s為較佳。Although it is not particularly limited to the viscosity of a thermoplastic resin that is liquid at normal temperature and pressure, in view of good kneadability, fluidity, crosslinking reactivity, and excellent moldability, this resin has a temperature of 105 ° C. The viscosity is preferably 500 mPa · s ~ 30,000 mPa · s, preferably 550 mPa · s ~ 25,000 mPa · s.

-其它樹脂--Other resin-

在未顯著損及本發明效果的前提下,熱傳導片材中亦可含有上述樹脂以外的其它樹脂。The thermally conductive sheet may contain resins other than the above-mentioned resins without significantly impairing the effects of the present invention.

其它樹脂可舉出一般可被分類為熱固性樹脂的各種樹脂,例如天然橡膠;丁二烯橡膠;異戊二烯橡膠;氫化腈橡膠;氯丁二烯橡膠;乙烯丙烯橡膠;氯化聚乙烯;氯磺化聚乙烯;丁基橡膠;鹵化丁基橡膠;聚異丁烯橡膠;環氧樹脂;聚醯亞胺樹脂;雙馬來亞醯胺樹脂;苯環丁烯樹脂;酚樹脂;不飽和聚酯;苯二甲酸二烯丙酯樹脂(diallyl phthalate resin);聚醯亞胺矽氧樹脂(polyimide silicone resin);聚胺酯;熱固型聚苯醚;熱固型改質聚苯醚等。此等樹脂可單獨使用一種,亦可併用二種以上。Other resins include various resins that can be generally classified as thermosetting resins, such as natural rubber; butadiene rubber; isoprene rubber; hydrogenated nitrile rubber; chloroprene rubber; ethylene propylene rubber; chlorinated polyethylene; Chlorosulfonated polyethylene; butyl rubber; halogenated butyl rubber; polyisobutylene rubber; epoxy resin; polyimide resin; bismaleimide resin; phenylcyclobutene resin; phenol resin; unsaturated polyester ; Diallyl phthalate resin (diallyl phthalate resin); polyimide silicone resin (polyimide silicone resin); polyurethane; thermosetting polyphenylene ether; thermosetting modified polyphenylene ether, etc. These resins may be used alone or in combination of two or more.

-慕尼黏度--Muni viscosity-

此外,母材樹脂的慕尼黏度(ML1+4 ,100℃)必須為90(ML1+4 ,100℃)以下,且以65(ML1+4 ,100℃)以下為佳,以36(ML1+4 ,100℃)以下為較佳。通常為3(ML1+4 ,100℃)以上。若熱傳導片材所含有之母材樹脂的慕尼黏度為上述上限值以下,則可提高熱傳導片材的熱傳導性。In addition, the Mooney viscosity (ML 1 + 4 , 100 ° C) of the base material resin must be 90 (ML 1 + 4 , 100 ° C) or less, and preferably 65 (ML 1 + 4 , 100 ° C) or less, with 36 (ML 1 + 4 , 100 ° C) The following is preferred. Usually above 3 (ML 1 + 4 , 100 ℃). If the Mooney viscosity of the base material resin contained in the thermally conductive sheet is equal to or less than the above upper limit, the thermal conductivity of the thermally conductive sheet can be improved.

此外,熱傳導片材中所含有之母材樹脂的慕尼黏度可藉由以下步驟求得:將熱傳導片材溶解於可溶解母材樹脂的溶劑中之後,單獨分離出母材樹脂且調製出慕尼黏度量測用試料,再根據JIS-K6300量測所得之試料的慕尼黏度(ML1+4 ,100℃)。並且,根據如上述方法所求得之慕尼黏度值,原則上與材料階段之母材樹脂的慕尼黏度值略為相同。In addition, the Mooney viscosity of the base material resin contained in the heat conductive sheet can be obtained by the following steps: after dissolving the heat conductive sheet in a solvent that can dissolve the base material resin, the base material resin is separately separated and the mu The sample for measurement of Ni Viscosity, and then the Mooney viscosity (ML 1 + 4 , 100 ℃) of the sample measured according to JIS-K6300. In addition, the Mooney viscosity value obtained by the above method is in principle slightly the same as the Mooney viscosity value of the base material resin in the material stage.

-樹脂的含有比例--Resin content-

接下來在本發明中,在將熱傳導片材的總體積設為100體積%時,熱傳導片材中之全部樹脂成分的含有比例以65體積%以下為佳,以55體積%以下為較佳,以50體積%以下為更佳,且通常為30體積%以上。若熱傳導片材中之全部樹脂成分的含有比例為上述上限值以下,則可令熱傳導片材發揮更高的熱傳導性。並且,若熱傳導片材中的全部樹脂成分的含有比例為上述下限值以上,則可賦予熱傳導片材更高的柔軟性,且與發熱體相接時可更良好地從發熱體往熱傳導片材進行傳熱。Next, in the present invention, when the total volume of the heat conductive sheet is set to 100% by volume, the content ratio of all resin components in the heat conductive sheet is preferably 65% by volume or less, preferably 55% by volume or less, It is more preferably 50% by volume or less, and usually 30% by volume or more. If the content ratio of all resin components in the thermally conductive sheet is equal to or less than the above upper limit, the thermally conductive sheet can exhibit higher thermal conductivity. In addition, if the content ratio of all resin components in the thermally conductive sheet is equal to or higher than the above lower limit, the thermally conductive sheet can be provided with higher flexibility, and when it is in contact with the heating element, it can be transferred from the heating element to the thermal conductive sheet more favorably Heat transfer.

﹝添加劑﹞﹝additive﹞

本發明之熱傳導片材中,視需要能摻合製造熱傳導片材時可使用之已知的添加劑。而可摻合在熱傳導片材中的添加劑並沒有特別限制,可列舉例如脂肪酸酯等塑化劑;紅磷系阻燃劑、磷酸酯系阻燃劑等阻燃劑;如氟素油 (fluorine oil,DAIKIN工業股份有限公司製之Demnum系列)之塑化劑兼阻燃劑的添加劑;胺基甲酸酯丙烯酸酯(urethane acrylate)等之增韌劑;氧化鈣、氧化鎂等吸濕劑;矽烷偶合劑、鈦偶合劑、酸酐等之附著力增進劑;非離子系界面活性劑、氟系界面活性劑等之可濕性增進劑;無機離子交換體等之離子捕捉劑等。The thermally conductive sheet of the present invention can optionally be blended with known additives that can be used when manufacturing the thermally conductive sheet. The additives that can be blended in the heat conductive sheet are not particularly limited, and examples include plasticizers such as fatty acid esters; flame retardants such as red phosphorus flame retardants and phosphate ester flame retardants; such as fluorine oil (fluorine oil, Demnum series manufactured by Daikin Industries Co., Ltd.) plasticizer and flame retardant additive; urethane acrylate and other toughening agents; calcium oxide, magnesium oxide and other hygroscopic agents; Adhesion promoters for silane coupling agents, titanium coupling agents, acid anhydrides, etc .; wettability promoters for non-ionic surfactants, fluorine-based surfactants; ion trapping agents for inorganic ion exchangers, etc.

<性質與狀態><Nature and State>

﹝ASKER C硬度﹞﹝ ASKER C hardness ﹞

本發明之熱傳導片材以ASKER C硬度為45以上為佳,以55以上為較佳,以超過60為更佳。其原因在於,若熱傳導片材的ASKER C硬度為上述下限值以上,則可提高熱傳導片材的處理性。可藉由選擇熱傳導片材中所摻合的粒子狀碳材的含有比例或所使用的樹脂成分,而調整熱傳導片材的ASKER C硬度值。The heat conductive sheet of the present invention preferably has an ASKER C hardness of 45 or more, more preferably 55 or more, and even more than 60. The reason for this is that if the ASKER C hardness of the thermally conductive sheet is equal to or greater than the above lower limit, the handleability of the thermally conductive sheet can be improved. The ASKER C hardness value of the heat conductive sheet can be adjusted by selecting the content ratio of the particulate carbon material blended in the heat conductive sheet or the resin component used.

以往,用於提高熱傳導片材本身的熱傳導性,一般選擇的手段為提高粒子狀碳材等的熱傳導性材料的含有比例。若熱傳導性材料的含有比例高,則有熱傳導片材變硬的傾向。而在過去,以熱傳導片材硬度會影響熱傳導片材與裝設有熱傳導片材的其他部件(例如發熱體或散熱體)之間的界面阻抗(以下亦稱為「部件間界面阻抗」)為前提下,使用ASKER C硬度做為硬度指標。而且,為了在能提高熱傳導片材本身的熱傳導率以及抑制ASKER C硬度過度變高之間取得平衡,針對提升熱傳導片材的熱傳導性之方法進行各種研究。然而,經本發明人等重新研究之下,明確得知熱傳導片材的ASKER C硬度與部件間界面阻抗之間並無關聯性。而且,經進一步研究之結果,本發明人等新發現到藉由摻合慕尼黏度為指定值以下的母材樹脂,亦能有利於抑制部件間界面阻抗。此外更明確得知,當熱傳導片材含有慕尼黏度為指定值以下的母材樹脂,則此熱傳導片材具有適當的ASKER C硬度值,且此熱傳導片材的熱傳導率高於根據以往之熱傳導率與ASKER C硬度之關係所假定之值。Conventionally, in order to improve the thermal conductivity of the thermally conductive sheet itself, a generally selected method is to increase the content ratio of thermally conductive materials such as particulate carbon materials. If the content of the heat conductive material is high, the heat conductive sheet tends to become hard. In the past, the hardness of the thermally conductive sheet affected the interface impedance between the thermally conductive sheet and other components (such as heating elements or heat sinks) equipped with the thermally conductive sheet (hereinafter also referred to as "interfacial impedance between components") as Under the premise, ASKER C hardness is used as the hardness index. In addition, in order to achieve a balance between improving the thermal conductivity of the thermally conductive sheet itself and suppressing the excessive increase of the ASKER C hardness, various studies have been conducted on methods for improving the thermal conductivity of the thermally conductive sheet. However, after re-examination by the present inventors, it was clearly found that there is no correlation between the ASKER C hardness of the heat conductive sheet and the interface impedance between the parts. Furthermore, as a result of further research, the present inventors have newly discovered that by blending a base material resin having a Mooney viscosity of less than a specified value, it is also beneficial to suppress the interfacial impedance between components. In addition, it is more clearly known that when the thermally conductive sheet contains a base material resin whose Mooney viscosity is below a specified value, the thermally conductive sheet has an appropriate ASKER C hardness value, and the thermal conductivity of the thermally conductive sheet is higher than the conventional thermal conductivity The value assumed by the relationship between the rate and ASKER C hardness.

﹝熱傳導率﹞﹝Thermal conductivity﹞

在將母材樹脂的慕尼黏度設為X(ML1+4 ,100℃)且將熱傳導片材的厚度方向之熱傳導率設為Y的情況中,本發明之熱傳導片材以滿足Y>(-2.6X+25)之關係式為佳,以滿足Y>(-2.6X+42)之關係式為較佳,以滿足Y>(-2.6X+120)之關係式為更佳。以此關係式為指標,由做為熱傳導片材的目的之熱傳導率反算,而可容易地選擇使用做為母材樹脂的樹脂材料,且可提升熱傳導片材的製造效率。反之,因可由預定使用之母材樹脂推算所得之熱傳導片材的熱傳導率,而可提升熱傳導片材的設計效率。In the case where the Mooney viscosity of the base material resin is X (ML 1 + 4 , 100 ° C.) and the thermal conductivity in the thickness direction of the thermally conductive sheet is Y, the thermally conductive sheet of the present invention satisfies Y> ( The relationship of -2.6X + 25) is better. The relationship of Y> (-2.6X + 42) is better, and the relationship of Y> (-2.6X + 120) is better. Using this relationship as an index, the resin material used as the base material resin can be easily selected and used, and the manufacturing efficiency of the heat conductive sheet can be improved by inversely calculating the heat conductivity as the purpose of the heat conductive sheet. On the contrary, since the thermal conductivity of the thermally conductive sheet can be estimated from the base material resin to be used, the design efficiency of the thermally conductive sheet can be improved.

更具體而言,熱傳導片材的熱傳導率以19W/m•K以上為佳,以25 W/m•K以上為較佳,且以35 W/m•K以上為更佳。其原因在於,若熱傳導片材的熱傳導率為上述下限以上,則例如於令熱傳導片材與發熱體密著而使用的情況中,可令熱有效率地從發熱體發散。More specifically, the thermal conductivity of the thermally conductive sheet is preferably 19 W / m · K or more, preferably 25 W / m · K or more, and more preferably 35 W / m · K or more. The reason for this is that if the thermal conductivity of the thermally conductive sheet is equal to or higher than the above lower limit, for example, when the thermally conductive sheet is used in close contact with the heating element, heat can be efficiently dissipated from the heating element.

﹝慕尼黏度﹞﹝ Muni Viscosity ﹞

本發明之熱傳導片材的慕尼黏度(ML1+4 ,100℃)以50(ML1+4 ,100℃)以下為佳,以30(ML1+4 ,100℃)以下為較佳,通常為2(ML1+4 ,100℃)以上。於此認為若熱傳導片材的慕尼黏度為上述上限值以下,則於高溫條件下使用熱傳導片材的情形中,可提升熱傳導片材與發熱體或散熱體等之裝設有熱傳導片材的部件之間的密著性,且能夠提高散熱效率。The Mooney viscosity (ML 1 + 4 , 100 ° C) of the heat conductive sheet of the present invention is preferably 50 (ML 1 + 4 , 100 ° C) or less, and preferably 30 (ML 1 + 4 , 100 ° C) or less, Usually above 2 (ML 1 + 4 , 100 ℃). It is considered here that if the Mooney viscosity of the thermally conductive sheet is below the above upper limit, in the case of using the thermally conductive sheet under high temperature conditions, the thermally conductive sheet and the heating element, heat sink, etc. can be improved The adhesion between the components, and can improve the heat dissipation efficiency.

﹝構造﹞﹝structure﹞

本發明之熱傳導片材具有以下構造:相對於熱傳導片材的厚度方向而在橫斷方向堆疊多層熱傳導片材半成品而成之構造,且此熱傳導片材半成品包含粒子狀碳材料、樹脂成分及任意添加劑等。再者,於熱傳導片材半成品內,粒子狀碳材料以沿著熱傳導片材半成品的面方向(相對於熱傳導片材半成品的厚度方向而在橫斷方向)配向為佳。其原因在於,若粒子狀碳材料沿著熱傳導片材半成品的面方向配向,則可提高熱傳導片材的厚度方向之熱傳導率。而「熱傳導片材係堆疊多片熱傳導片材半成品於面方向並進行切片所得」之證據,例如可使用以顯微鏡觀察熱傳導片材的厚度方向斷面的方法,或使用判斷平面方向之熱傳導性是否具有各向異性的方法,而進行綜合判斷。The thermally conductive sheet of the present invention has the following structure: a structure formed by stacking multiple semi-finished thermally conductive sheets in a transverse direction with respect to the thickness direction of the thermally conductive sheet, and the semi-finished thermally conductive sheet contains a particulate carbon material, a resin component, and any Additives, etc. Furthermore, in the semi-finished thermally conductive sheet, the particulate carbon material is preferably aligned along the surface direction of the semi-finished thermally conductive sheet (transversely with respect to the thickness direction of the semi-finished thermally conductive sheet). The reason for this is that if the particulate carbon material is aligned along the surface direction of the semi-finished product of the thermally conductive sheet, the thermal conductivity in the thickness direction of the thermally conductive sheet can be improved. The evidence of "the thermally conductive sheet is obtained by stacking and slicing a plurality of semi-finished thermally conductive sheets in the plane direction", for example, a method of observing the thickness direction of the thermally conductive sheet with a microscope or using a method to determine whether the thermal conductivity in the planar direction There is an anisotropic method to make a comprehensive judgment.

﹝厚度﹞﹝thickness﹞

熱傳導片材的厚度並未特別限定,例如可為0.05mm以上且10mm以下。其原因在於,一般而言,若熱傳導片材的厚度過厚,則熱傳導片材的熱阻升高,故熱傳導性會降低,並且,當熱傳導片材的厚度過小時,則變得無法充分活用熱傳導片材所具有的熱傳導率。The thickness of the heat conductive sheet is not particularly limited, and may be 0.05 mm or more and 10 mm or less, for example. The reason for this is that, in general, if the thickness of the thermally conductive sheet is too thick, the thermal resistance of the thermally conductive sheet increases, so the thermal conductivity decreases, and when the thickness of the thermally conductive sheet is too small, it becomes impossible to fully utilize The thermal conductivity of the thermally conductive sheet.

再者,也可在厚度方向重疊多片具有一定厚度的熱傳導片材,藉由靜置指定時間而令其一體化,再將此一體化之物使用做為熱傳導片材。於根據如上述所得之熱傳導片材內,可推測粒子狀碳材料及任意的纖維狀碳材料維持配向於熱傳導片材的厚度方向上。因此,令多片薄的熱傳導片材在厚度方向堆疊而得之厚(厚度x)的熱傳導片材的熱傳導性,被認為具有與相同厚度(厚度x)的單片熱傳導片材約略相同的熱傳導率。因此,不需準備各種厚度的熱傳導片材,只要準備多片指定厚度的(薄的)熱傳導片材,便可得到一種熱傳導片材,其厚度因應欲適用熱傳導片材之部位的厚度。Furthermore, a plurality of thermally conductive sheets with a certain thickness can be stacked in the thickness direction, and they can be integrated by standing for a specified time, and then use the integrated object as a thermally conductive sheet. In the thermally conductive sheet obtained as described above, it can be presumed that the particulate carbon material and any fibrous carbon material maintain alignment in the thickness direction of the thermally conductive sheet. Therefore, the thermal conductivity of a thick (thickness x) thermally conductive sheet obtained by stacking multiple thin thermally conductive sheets in the thickness direction is considered to have approximately the same thermal conductivity as a single thermally conductive sheet of the same thickness (thickness x) rate. Therefore, there is no need to prepare heat conductive sheets of various thicknesses, as long as multiple (thin) heat conductive sheets of specified thickness are prepared, a heat conductive sheet can be obtained, the thickness of which depends on the thickness of the portion where the heat conductive sheet is to be applied.

以下將說明熱傳導片材之製造方法。The method of manufacturing the heat conductive sheet will be described below.

用於製造本發明之熱傳導片材之製造方法並未特別限定,可採用在製造熱傳導片材時可利用的製造方法,此熱傳導片材係於面方向上堆疊多層熱傳導片材半成品而成。此製造方法,可舉出例如包含以下步驟之製造方法:準備複合混合物的步驟,此複合混合物含有粒子狀碳材料及慕尼黏度90(ML1+4 ,100℃)以下的母材樹脂;加壓複合粒子以製得熱傳導片材半成品的步驟;得到熱傳導片材半成品之堆疊體的步驟;以及切片步驟。The manufacturing method for manufacturing the thermally conductive sheet of the present invention is not particularly limited, and a manufacturing method that can be used when manufacturing the thermally conductive sheet can be adopted. The thermally conductive sheet is formed by stacking multiple semi-finished thermally conductive sheets in the plane direction. This manufacturing method may include, for example, a manufacturing method including the following steps: a step of preparing a composite mixture containing a particulate carbon material and a base material resin having a Mooney viscosity of 90 (ML 1 + 4 , 100 ° C) or less; plus The step of pressing the composite particles to produce a semi-finished thermally conductive sheet; the step of obtaining a stack of semi-finished thermally conductive sheets; and the slicing step.

<準備複合混合物的步驟><Procedure for preparing compound mixture>

於準備複合混合物的步驟中,準備含有粒子狀碳材料及樹脂之複合混合物。具體而言,在準備複合混合物的步驟並未特別限制,可利用已知的手法,令粒子狀碳材料及慕尼黏度90(ML1+4 ,100℃)以下的母材樹脂複合任意的纖維狀碳材料及∕或添加劑,藉此準備複合混合物。並且,於準備複合混合物的步驟中,亦可購入含有粒子狀碳材料及慕尼黏度90(ML1+4 ,100℃)以下的母材樹脂之市售複合混合物,藉此準備複合混合物。於藉由上述複合動作而準備複合混合物的情形中,更具體而言,可使用例如下述(I)~(III)的方法。In the step of preparing the composite mixture, the composite mixture containing the particulate carbon material and the resin is prepared. Specifically, the step of preparing the composite mixture is not particularly limited, and a known technique can be used to compose arbitrary fibers with a particulate carbon material and a base material resin with a Mooney viscosity of 90 (ML 1 + 4 , 100 ° C) or less Carbon material and / or additives to prepare a compound mixture. In addition, in the step of preparing the composite mixture, a commercially available composite mixture containing a particulate carbon material and a base material resin having a Mooney viscosity of 90 (ML 1 + 4 , 100 ° C.) or lower may be purchased to prepare a composite mixture. In the case of preparing a compound mixture by the above compounding operation, more specifically, for example, the following methods (I) to (III) can be used.

(I)將粒子狀碳材料、慕尼黏度90(ML1+4 ,100℃)以下的母材樹脂以及任意的纖維狀碳材料及∕或添加劑加以混合、混練而得到複合混合物。(I) Mix and knead a particulate carbon material, a base material resin with a Mooney viscosity of 90 (ML 1 + 4 , 100 ° C) or less, and any fibrous carbon material and / or additives to obtain a composite mixture.

(II)將含有粒子狀碳材料、慕尼黏度90(ML1+4 ,100℃)以下的母材樹脂以及任意的纖維狀碳材料及∕或添加劑之分散液加以乾燥造粒而得到複合混合物。(II) Drying and granulating a dispersion containing a particulate carbon material, a base material resin with a Mooney viscosity of less than 90 (ML 1 + 4 , 100 ° C) and any fibrous carbon material and / or additives to obtain a composite mixture .

(III)將慕尼黏度90(ML1+4 ,100℃)以下的母材樹脂等噴霧在粒子狀碳材料以及任意的纖維狀碳材料上而得到複合混合物。(III) The base material resin having a Mooney viscosity of 90 (ML 1 + 4 , 100 ° C.) or less is sprayed on the particulate carbon material and any fibrous carbon material to obtain a composite mixture.

其中,就作業容易性的觀點而言,較佳為使用(I)的方法。Among them, the method using (I) is preferred from the viewpoint of ease of work.

此外,於此準備複合混合物的步驟所使用的粒子狀碳材料、慕尼黏度90(ML1+4 ,100℃)以下之母材樹脂以及任意的纖維狀碳材料及∕或添加劑,能使用與上述熱傳導片材可含有之粒子狀碳材料、慕尼黏度90(ML1+4 ,100℃)以下的母材樹脂、任意的纖維狀碳材料及/或添加劑相同的成分,且較佳的含有比例也可設定為相同。In addition, the particulate carbon material used in the step of preparing the composite mixture, the base material resin with a Mooney viscosity below 90 (ML 1 + 4 , 100 ° C), and any fibrous carbon material and / or additives can be used with The above-mentioned thermally conductive sheet may contain the particulate carbon material, the base material resin having a Mooney viscosity of 90 (ML 1 + 4 , 100 ° C) or less, any fibrous carbon material and / or additives having the same components, and preferably containing The ratio can also be set to the same.

﹝混合、混練方法﹞﹝ Mixing and mixing methods ﹞

混合、混練方法並未特別限制,可使用捏合機(kneader)、輥、亨舍爾混合機(Henschel mixer)、及荷巴特混合機(Hobart mixer)等已知的混合裝置進行。而混合、混練時間可設為例如5分鐘以上且6小時以下。並且,混合、混練溫度可設為例如5℃以上且150℃以下。The method of mixing and kneading is not particularly limited, and it can be performed using a known mixing device such as a kneader, roller, Henschel mixer, and Hobart mixer. The mixing and kneading time can be, for example, 5 minutes or more and 6 hours or less. In addition, the mixing and kneading temperature can be set to, for example, 5 ° C or higher and 150 ° C or lower.

於此,雖可於乙酸乙酯等溶劑的存在下進行混合、混練,但在混合、混練時有使用溶劑的情形中,以進行後述複合混合物的壓碎∕粉碎之前先去除溶劑為佳。可使用已知的乾燥方法去除溶劑,亦可在任意地將複合混合物消泡的同時去除溶劑。舉例而言,若使用真空消泡以進行消泡,則也可在消泡時的同時去除溶劑。Here, although mixing and kneading may be performed in the presence of a solvent such as ethyl acetate, in the case where a solvent is used during mixing or kneading, it is preferable to remove the solvent before crushing / pulverizing the composite mixture described later. The solvent can be removed using a known drying method, or the solvent can be removed while defoaming the composite mixture at will. For example, if vacuum defoaming is used for defoaming, the solvent can also be removed while defoaming.

﹝複合混合物﹞﹝ Composite mixture ﹞

而所得之複合混合物包含粒子狀碳材料及慕尼黏度90(ML1+4 ,100℃)以下的母材樹脂,且更包含任意的纖維狀碳材料及添加劑。並且,複合混合物通常為直徑1mm~200mm左右的塊狀體。The resulting composite mixture contains particulate carbon material and base material resin with a Mooney viscosity of 90 (ML 1 + 4 , 100 ° C) or less, and further includes any fibrous carbon material and additives. In addition, the composite mixture is generally a block having a diameter of about 1 mm to 200 mm.

亦可任意地實施粉碎步驟以將複合混合物粉碎成粒子狀。在此情形下,於粉碎步驟中,以任意方法將所得之複合混合物粉碎而得到複合粒子。此外,於得到複合粒子的步驟中,亦可在粉碎所得之複合混合物後,以任意方法進行分級而得到複合粒子。The pulverization step may be arbitrarily performed to pulverize the composite mixture into particles. In this case, in the pulverization step, the resulting composite mixture is pulverized by any method to obtain composite particles. In addition, in the step of obtaining composite particles, after the resulting composite mixture is pulverized, it may be classified by any method to obtain composite particles.

複合混合物的粉碎,只要所得之複合粒子不是呈現複合混合物的塊狀體而是成為粉流體,則無特別限制,可使用已知的方法進行。並且,亦可於進行粉碎之前先將塊狀體壓碎散開。而且,複合混合物之壓碎∕粉碎,可使用例如利用剪切作用或磨碎作用之已知的壓碎∕粉碎機,或攪拌式之已知的壓碎∕粉碎機等進行。上述已知的壓碎∕粉碎機,可列舉例如鎚式壓碎機(hammer crusher)、切割式研磨機、鎚磨機、珠磨機(bead mill)、振動研磨機、行星式球磨機、砂磨機、球磨機、輥磨機、三輥磨機、噴射磨機、高速旋轉式粉碎機、微粉碎機/壓碎分粒機、奈米噴射粉碎機(Nano Jetmizer)等。The pulverization of the composite mixture is not particularly limited as long as the resulting composite particles do not form a block of the composite mixture but become a powder fluid, and can be carried out by a known method. Also, the bulk can be crushed and dispersed before crushing. Furthermore, the crushing / pulverization of the composite mixture can be performed using, for example, a known crushing / pulverizing machine using shearing or grinding action, or a known crushing / pulverizing machine of stirring type. Examples of the above-mentioned known crusher / crusher include hammer crusher, cutting mill, hammer mill, bead mill, vibration mill, planetary ball mill, and sand mill. Machines, ball mills, roller mills, three-roll mills, jet mills, high-speed rotary mills, micro-mills / crushing and classifiers, nano jet mills (Nano Jetmizer), etc.

此等壓碎機∕粉碎機的種類、壓碎∕粉碎時的能量、時間等條件,只要配合複合混合物的塊狀物之狀態、複合粒子的粒徑等所期望的粉狀流體狀態進行適當選擇、調整即可。The type of crusher / crusher, energy and time during crushing / crushing, etc., can be selected as long as the desired state of the powdered fluid such as the state of the lumps of the composite mixture, the particle size of the composite particles, etc. is selected And adjustment.

於此,複合混合物並未特別限制,以粉碎至篩分級為未滿1000μm的粒徑為佳。Here, the composite mixture is not particularly limited, and it is preferably crushed to a particle size of less than 1000 μm classified by a sieve.

<製得熱傳導片材半成品的步驟><Procedure for preparing semi-finished thermally conductive sheet>

於製得熱傳導片材半成品的步驟中,將前步驟所製得的複合混合物或複合粒子以任意方法加壓而成形為片狀。In the step of producing the semi-finished product of the thermally conductive sheet, the composite mixture or composite particles prepared in the previous step are pressed into a sheet by any method.

﹝加壓方法﹞﹝ Pressure method ﹞

熱傳導片材半成品的加壓方法,只要是負荷壓力之成形方法則無特別限制。熱傳導片材半成品可使用例如沖壓(press)成形、壓延成形或擠出成形等已知的成形方法而成形為片狀。其中,熱傳導片材以藉由壓延成形而成形為片狀為佳,以夾在保護薄膜中之狀態下通過輥間而成形為片狀為較佳。此外,保護薄膜並未特別限制,可使用經施以噴砂處理的聚對苯二甲酸乙二酯(PET)薄膜等。並且,輥溫度可設為5℃以上且150℃以下。The method of pressing the heat conductive sheet semi-finished product is not particularly limited as long as it is a load pressure forming method. The heat conductive sheet semi-finished product can be formed into a sheet shape using known forming methods such as press forming, calender forming, or extrusion forming. Among them, the heat conductive sheet is preferably formed into a sheet shape by calendering, and is preferably formed into a sheet shape by passing between rolls in a state of being sandwiched between protective films. In addition, the protective film is not particularly limited, and polyethylene terephthalate (PET) film subjected to sand blasting treatment or the like can be used. In addition, the roller temperature can be set to 5 ° C or higher and 150 ° C or lower.

此外,熱傳導片材半成品的厚度並未特別限制,可設為例如0.05mm以上且2mm以下。並且,就提高熱傳導片材半成品的熱傳導性而令熱傳導片材的熱傳導性提升的觀點而言,熱傳導片材半成品的厚度,以粒子狀碳材料的平均粒徑之5000倍以下為佳。In addition, the thickness of the semi-finished thermally conductive sheet is not particularly limited, and may be set to, for example, 0.05 mm or more and 2 mm or less. In addition, from the viewpoint of improving the thermal conductivity of the semi-finished thermally conductive sheet and improving the thermal conductivity of the thermally conductive sheet, the thickness of the semi-finished thermally conductive sheet is preferably 5,000 times or less the average particle diameter of the particulate carbon material.

<得到堆疊體的步驟><Steps to get the stack>

在得到堆疊體的步驟中,於熱傳導片材半成品的厚度方向堆疊多片由前步驟所得之熱傳導片材半成品,或者折疊或捲繞由前步驟所得之熱傳導片材半成品,藉此形成堆疊體。In the step of obtaining a stacked body, a plurality of semi-finished thermally conductive sheets obtained in the previous step are stacked in the thickness direction of the semi-finished thermally conductive sheet, or the semi-finished products of the thermally conductive sheet obtained in the previous step are folded or wound, thereby forming a stacked body.

﹝堆疊方法﹞﹝ Stacking method ﹞

堆疊熱傳導片材半成品所致之堆疊體的形成並未特別限制,可使用堆疊裝置進行,亦可利用手工操作進行。並且,折疊熱傳導片材半成品所致之堆疊體的形成並未特別限制,可藉由使用折疊機將熱傳導初級片材(primary sheet)以一定寬度進行折疊而進行。再者,捲繞熱傳導片材半成品所致之堆疊體的形成並未特別限制,可藉由繞平行於熱傳導片材半成品的短邊方向或長邊方向之軸捲繞熱傳導片材半成品而進行。The formation of the stacked body due to the stacking of the semi-finished thermally conductive sheets is not particularly limited, and it can be performed using a stacking device or manually. In addition, the formation of the stacked body due to the folding of the semi-finished thermally conductive sheet is not particularly limited, and can be performed by folding the thermally conductive primary sheet with a certain width using a folding machine. Furthermore, the formation of the stack due to the winding of the semi-finished thermally conductive sheet is not particularly limited, and it can be performed by winding the semi-finished thermally conductive sheet around an axis parallel to the short side direction or the long side direction of the semi-finished thermally conductive sheet.

於此,在製得堆疊體的步驟中,通常可藉由堆疊熱傳導片材半成品時的壓力、或者進行折疊或捲繞熱傳導片材半成品時的壓力,而充分獲得熱傳導片材半成品的表面彼此之附著力。然而,在附著力不足的情況或必須充分抑制堆疊體的層間剝離之情況中,也可利用溶解劑令熱傳導片材半成品的表面些許溶解的狀態下形成堆疊體,亦可於熱傳導片材半成品的表面已塗布接著劑之狀態下或熱傳導片材半成品的表面設置有附著層之狀態下形成堆疊體。Here, in the step of producing the stacked body, the surfaces of the semi-finished thermally conductive sheets can be fully obtained by the pressure when stacking the semi-finished thermally conductive sheets or the pressure when folding or winding the semifinished thermally conductive sheets. Adhesion. However, in the case of insufficient adhesion or when it is necessary to sufficiently suppress the delamination of the stack, the dissolution agent can also be used to form the stack in a state where the surface of the semi-finished thermally conductive sheet is slightly dissolved, or it can be The stacked body is formed in a state where an adhesive is applied on the surface or an adhesion layer is provided on the surface of the semi-finished heat conductive sheet.

此外,於溶解熱傳導片材半成品表面時所使用的溶解劑並未特別限制,能使用可溶解熱傳導片材半成品中所含有之樹脂成分的已知溶解劑。In addition, the dissolving agent used when dissolving the surface of the semi-finished thermally conductive sheet is not particularly limited, and a known dissolving agent that can dissolve the resin component contained in the semi-finished thermally conductive sheet can be used.

並且,塗布於熱傳導片材半成品表面的接著劑並未特別限制,可使用市售的接著劑或粘著性的樹脂。其中,接著劑以使用與熱傳導片材半成品中所含有之樹脂成分為相同組成的樹脂為佳。而塗布於熱傳導片材半成品表面的接著劑之厚度,則可設為例如10μm以上且1000μm以下。In addition, the adhesive applied to the surface of the semi-finished heat conductive sheet is not particularly limited, and a commercially available adhesive or adhesive resin can be used. Among them, it is preferable to use a resin having the same composition as the resin component contained in the semi-finished product of the thermally conductive sheet. The thickness of the adhesive applied to the surface of the semi-finished thermally conductive sheet can be, for example, 10 μm or more and 1000 μm or less.

再者,於熱傳導片材半成品的表面所設置之附著層並未特別限定,可使用雙面膠帶等。In addition, the adhesion layer provided on the surface of the semi-finished thermally conductive sheet is not particularly limited, and double-sided tape or the like can be used.

此外,就抑制層間剝離的觀點而言,所得之堆疊體以於堆疊方向上施加0.05MPa以上且1.0 MPa以下之壓力的同時,於20℃以上且150℃以下持續擠壓1分鐘以上且30分鐘以下為佳。In addition, from the viewpoint of suppressing delamination, the resulting stacked body is continuously pressed at 20 ° C. or more and 150 ° C. or less for 1 minute or more and 30 minutes while applying a pressure of 0.05 MPa or more and 1.0 MPa or less in the stacking direction. The following is better.

此外,於堆疊、折疊或捲繞熱傳導片材半成品所得的堆疊體中,推測粒子狀碳材料及任意的纖維狀碳材料配向於約略正交於堆疊方向的方向上。In addition, in the stack obtained by stacking, folding, or winding the semi-finished thermally conductive sheets, it is presumed that the particulate carbon material and any fibrous carbon material are aligned in a direction approximately orthogonal to the stacking direction.

<切片步驟><Slicing step>

並且,在切片步驟中,將上述步驟所得之堆疊體,以相對於堆疊方向為45∘以下的角度進行切片,藉此得到由堆疊體的切片而成之熱傳導片材。In addition, in the slicing step, the stacked body obtained in the above step is sliced at an angle of 45 ∘ or less with respect to the stacking direction, thereby obtaining a heat conductive sheet formed by slicing the stacked body.

﹝切片方法﹞﹝ Slicing method ﹞

將堆疊體進行切片的方法並未特別限定,可列舉例如多刀片 法(multi-blade method)、雷射加工法、水刀法、刀(knife)加工法等。其中,就容易令熱傳導片材的厚度均勻的觀點而言,以刀加工法為佳。並且,將堆疊體進行切片時的切斷工具並未特別限定,可使用具有平滑盤面及刃部的切片部件(例如,具備銳利刀刃的刨刀或切片機),其中此平滑盤面具有狹縫,此刃部較此狹縫部更為突出。The method of slicing the stacked body is not particularly limited, and examples thereof include a multi-blade method, a laser processing method, a water jet method, and a knife processing method. Among them, the knife processing method is preferred from the viewpoint of easily making the thickness of the heat conductive sheet uniform. Moreover, the cutting tool when slicing the stacked body is not particularly limited, and a slicing member having a smooth disk surface and a blade portion (for example, a planer or a slicer with a sharp blade) can be used, wherein the smooth disk surface has a slit, which The blade part is more protruding than this slit part.

此外,就提高熱傳導片材的熱傳導性的觀點而言,將堆疊體進行切片的角度,以相對於堆疊方向為30∘以下為佳,以相對於堆疊方向為15∘以下為較佳,以相對於堆疊方向為約略0∘(亦即,沿著堆疊方向的方向)為更佳。In addition, from the viewpoint of improving the thermal conductivity of the thermally conductive sheet, the angle at which the stacked body is sliced is preferably 30 ∘ or less with respect to the stacking direction, and preferably 15 ∘ or less with respect to the stacking direction. It is better if the stacking direction is approximately 0∘ (that is, the direction along the stacking direction).

並且,就容易將堆疊體進行切片的觀點而言,切片時的堆疊體溫度以設為–20℃以上且40℃以下為佳,以設為10℃以上且30℃以下為較佳。再者,因相同的理由,進行切片的堆疊體,以在與堆疊方向垂直的方向上負荷壓力的同時進行切片為佳,以在與堆疊方向垂直的方向上負荷0.1MPa以上且0.5MPa以下之壓力的同時進行切片為較佳。In addition, from the viewpoint of easily slicing the stacked body, the stacked body temperature during slicing is preferably -20 ° C or higher and 40 ° C or lower, and preferably 10 ° C or higher and 30 ° C or lower. In addition, for the same reason, it is better to perform slicing of the stacked body in a direction perpendicular to the stacking direction while carrying out slicing, in a direction perpendicular to the stacking direction of 0.1 MPa or more and 0.5 MPa or less. It is better to slice while pressing.

而根據上述製造方法所得之熱傳導片材,係經過得到堆疊體的步驟以及切片步驟而成形,故可推測粒子狀碳材料及任意的纖維狀碳材料會配向於熱傳導片材的厚度方向。因此,例如藉由令散熱體與熱傳導片材良好地附著,而可令散熱體所產生的熱有效率地往熱傳導片材的厚度方向發散。Since the heat conductive sheet obtained by the above manufacturing method is formed through the step of obtaining the stack and the slicing step, it can be presumed that the particulate carbon material and any fibrous carbon material will be aligned in the thickness direction of the heat conductive sheet. Therefore, for example, by allowing the heat sink to adhere well to the heat conductive sheet, the heat generated by the heat sink can be efficiently dissipated in the thickness direction of the heat conductive sheet.

以下將說明熱傳導片材之用途。The purpose of the heat conductive sheet will be explained below.

而根據本發明之製造方法所得的熱傳導片材,其熱傳導性優異,且其強度及導電性通常亦優異。因此,此熱傳導片材適用於例如在各種設備及裝置等之中所使用的散熱材料、散熱元件、冷卻元件、溫度調節元件、電磁波屏蔽部件、電磁波吸收部件、於將被壓接物進行加熱壓接時夾在被壓接物及加熱壓接裝置之間的熱壓接用橡膠片。On the other hand, the thermally conductive sheet obtained by the manufacturing method of the present invention has excellent thermal conductivity, and generally has excellent strength and electrical conductivity. Therefore, this thermally conductive sheet is suitable for, for example, heat dissipation materials, heat dissipation elements, cooling elements, temperature adjustment elements, electromagnetic wave shielding members, electromagnetic wave absorption members, etc. used in various equipment and devices, etc. A rubber sheet for thermal compression bonding that is sandwiched between the object to be bonded and the thermal compression bonding device during connection.

於此,各種設備及裝置等並未特別限定,可列舉伺服器、伺服器用電腦、桌上型電腦等電子設備;筆記型電腦、電子字典、PDA、行動電話、可攜式音樂播放器(portable music player)等之攜帶式電子設備;液晶顯示器(包含背光源)、電漿顯示器、LED、有機EL、無機EL、液晶投影機、鐘錶等顯示設備;噴墨印表機(噴墨頭)、電子照相裝置(electrophotography device) (顯影裝置、定影裝置、加熱輥(heat roll)、加熱帶(heat belt))等圖像形成裝置;半導體元件、半導體封裝件、半導體密封外殼、半導體固晶(die-bonding)、CPU、記憶體、功率電晶體、功率電晶體外殼等半導體相關元件;硬式電路板、軟式電路板、陶瓷電路板、增層(build-up)電路板、多層基板等電路基板(電路板中亦包含印刷電路板等);真空處理裝置、半導體製造裝置、顯示設備製造裝置等製造裝置;絕熱材、真空絕熱材、輻射絕熱材等絕熱裝置;DVD(光學讀頭、雷射產生裝置、雷射光接收裝置)、硬式磁碟機等資訊記錄設備;相機、錄影攝影機、數位相機、數位錄影攝影機、顯微鏡、CCD等影像記錄裝置;充電裝置、鋰離子電池、燃料電池等電池設備等。Here, various devices and devices are not particularly limited, and examples include electronic devices such as servers, server computers, and desktop computers; notebook computers, electronic dictionaries, PDAs, mobile phones, and portable music players ( Portable electronic devices such as portable music players; liquid crystal displays (including backlights), plasma displays, LEDs, organic EL, inorganic EL, liquid crystal projectors, clocks and other display devices; inkjet printers (inkjet heads) , Electrophotography device (electrophotography device) (developing device, fixing device, heat roll (heat roll), heat belt (heat belt)) and other image forming devices; semiconductor elements, semiconductor packages, semiconductor sealed enclosures, semiconductor solid crystal ( die-bonding), CPU, memory, power transistors, power transistor housings and other semiconductor-related components; hard circuit boards, flexible circuit boards, ceramic circuit boards, build-up circuit boards, multilayer substrates and other circuit boards (The circuit board also includes printed circuit boards, etc.); vacuum processing equipment, semiconductor manufacturing equipment, display equipment manufacturing equipment and other manufacturing equipment; thermal insulation materials, vacuum thermal insulation materials, radiation thermal insulation materials and other thermal insulation devices; DVD (optical reading head, laser Generating device, laser light receiving device), hard disk drive and other information recording equipment; camera, video camera, digital camera, digital video camera, microscope, CCD and other image recording devices; charging device, lithium ion battery, fuel cell and other battery equipment Wait.

以下將說明實施例。The embodiments will be described below.

以下雖根據實施例具體說明本發明,但本發明並非限於此等實施例。此外,於以下說明中,表示量的「份」,若未特別指定,係以質量為基準。Although the present invention will be specifically described below based on examples, the present invention is not limited to these examples. In addition, in the following description, "parts" indicating the amount, unless otherwise specified, are based on quality.

而於實施例與比較例中,母材樹脂的慕尼黏度及熱傳導片材的慕尼黏度、熱傳導片材中的粒子狀碳材料之含有比例及體積基準眾數直徑、熱傳導片材的ASKER C硬度、熱傳導片材的熱傳導率,將各別使用以下方法量測、算出。In the examples and comparative examples, the Mooney viscosity of the base material resin and the Mooney viscosity of the heat conductive sheet, the content ratio of the particulate carbon material in the heat conductive sheet and the volume-based mode diameter, the ASKER C of the heat conductive sheet The hardness and the thermal conductivity of the thermally conductive sheet are each measured and calculated using the following method.

<慕尼黏度>< Muni viscosity】

製造熱傳導片材所使用之母材樹脂的慕尼黏度,係自母材樹脂切出切片後,使用慕尼黏度計(島津製作所製,「MOONEY VISCOMETER SMV-202」) ,依據JIS-K6300而量測(ML1+4 ,100℃)。The Mooney viscosity of the base material resin used in the manufacture of thermally conductive sheets is based on the base material resin cut and sliced, using a Mooney viscosity meter (Shimadzu Corporation, "MOONEY VISCOMETER SMV-202") based on JIS-K6300 Measure (ML 1 + 4 , 100 ℃).

針對所得之熱傳導片材,亦切出相同的切片,並同樣地進行量測。With respect to the obtained heat conductive sheet, the same slice was also cut out and measured in the same way.

<粒子狀碳材料的含有比例><Content ratio of particulate carbon material>

熱傳導片材中的粒子狀碳材料之含有比例,係使用體積分率求出的理論值。具體而言,針對熱傳導片材所含有的粒子狀碳材料、樹脂、以及任意的纖維狀碳材料及添加劑之各成分,從密度(g/cm3 )與摻合量(g)算出體積(cm3 )後,以體積分率(體積%)求得熱傳導片材中的粒子狀碳材料之含有比例。The content ratio of the particulate carbon material in the heat conductive sheet is a theoretical value obtained using the volume fraction. Specifically, the volume (cm) is calculated from the density (g / cm 3 ) and the blending amount (g) for each component of the particulate carbon material, resin, and arbitrary fibrous carbon material and additives contained in the heat conductive sheet 3 ) After that, the content ratio of the particulate carbon material in the thermally conductive sheet is determined by the volume fraction (vol%).

<熱傳導片材中的粒子狀碳材料之體積基準眾數直徑><Volume-based mode diameter of the particulate carbon material in the thermally conductive sheet>

可藉由以下步驟求得熱傳導片材中的粒子狀碳材料之體積基準眾數直徑:藉由將1g的熱傳導片材加入甲基乙基酮溶劑中以溶解樹脂成分,而得到懸浮液,此懸浮液將粒子狀碳材料分離且分散;接下來,將所得之懸浮液做為試料,使用雷射繞射⁄散射式粒徑分布量測裝置(堀場製作所製,型號「LA960」),量測懸浮液所含有的粒子狀碳材料之粒徑;之後,以所測得的粒徑為橫軸、以粒子狀碳材料的體積為縱軸,繪製粒徑分布曲線,並取粒徑分布曲線的極大值之粒徑做為體積基準眾數直徑(μm)。The volume-based mode diameter of the particulate carbon material in the thermally conductive sheet can be determined by the following steps: by adding 1 g of the thermally conductive sheet to the methyl ethyl ketone solvent to dissolve the resin component, a suspension is obtained, which The suspension separates and disperses the particulate carbon material; next, using the resulting suspension as a sample, a laser diffraction / scattering particle size distribution measurement device (made by HORIBA, model "LA960") is used for measurement The particle size of the particulate carbon material contained in the suspension; after that, the particle size distribution curve is drawn with the measured particle size as the horizontal axis and the volume of the particulate carbon material as the vertical axis, and the particle size distribution curve is taken The particle size of the maximum value is taken as the volume-based mode diameter (μm).

<熱傳導片材的ASKER C硬度>< ASKER C hardness of heat conductive sheet >

根據日本橡膠協會標準規格(SRIS)之ASKER C法,使用硬度計(高分子計器公司製,商品名「ASKER CL-150LJ」),以溫度23℃進行量測。According to the ASKER C method of the Japan Rubber Association Standard Specification (SRIS), a hardness tester (manufactured by Macrometer Co., Ltd., trade name "ASKER CL-150LJ") was used to measure at a temperature of 23 ° C.

具體而言,將6片熱傳導片材的試驗片重疊,此等試驗片的大小已調整為寬度30mm×長度60mm×厚度1.0mm,並於保持在23℃的恆溫室內將此些試驗片靜置48小時以上,將此物做為試料,量測ASKER C硬度。之後,以指針成為95~98之方式調整阻尼器高度,量測試料與阻尼器碰撞起20秒鐘後的硬度,進行此量測5次,並取其平均值做為試料的ASKER C硬度。Specifically, 6 test pieces of thermally conductive sheets were superimposed. The size of these test pieces was adjusted to 30 mm in width × 60 mm in length × 1.0 mm in thickness, and the test pieces were allowed to stand in a constant temperature room maintained at 23 ° C. For more than 48 hours, use this material as a sample and measure the ASKER C hardness. After that, adjust the height of the damper so that the pointer becomes 95 to 98, measure the hardness of the test material and the damper after 20 seconds from the collision, perform this measurement 5 times, and take the average value as the ASKER C hardness of the sample.

<熱傳導片材的熱傳導率><Thermal conductivity of the thermally conductive sheet>

於計算熱傳導片材的熱傳導率時,先使用樹脂材料熱阻測試器(Hitachi Technologies and Services製,商品名「C47108」)量測熱阻值。於量測時,將熱傳導片材切成邊長1cm的四方形,做為量測試料。接下來,量測於測試溫度為50℃且壓力為0.50MPa的條件下的量測試料之熱阻值R。熱阻值R愈小,表示熱傳導性愈優異,在做為隔在發熱體與散熱體之間的散熱裝置時的散熱特性愈優異。When calculating the thermal conductivity of the thermally conductive sheet, first use a resin material thermal resistance tester (manufactured by Hitachi Technologies and Services, trade name "C47108") to measure the thermal resistance value. During the measurement, the heat conductive sheet is cut into squares with a side length of 1 cm and used as the measurement material. Next, the thermal resistance value R of the test material under the condition that the test temperature is 50 ° C. and the pressure is 0.50 MPa is measured. The smaller the thermal resistance value R, the better the thermal conductivity, and the more excellent the heat dissipation characteristics when used as a heat dissipation device between the heating body and the heat dissipation body.

並且,根據下式(I),從所測得的熱阻值R與加壓後的熱傳導片材的厚度d算出熱傳導率。Then, based on the following formula (I), the thermal conductivity is calculated from the measured thermal resistance value R and the thickness d of the thermally conductive sheet after pressing.

熱傳導率(W/m.K)= 熱傳導片材的厚度d(m)/熱阻值R(m2 .K/W)…(I)Thermal conductivity (W / m.K) = thickness of thermally conductive sheet d (m) / thermal resistance value R (m 2 .K / W) ... (I)

以下將說明實施例1。Embodiment 1 will be described below.

<製備含CNT之纖維狀的碳奈米結構體><Preparation of fibrous carbon nanostructures containing CNTs>

根據國際公開第2006/011655號的記載,藉由超級成長法而得到含SGCNT之纖維狀的碳奈米結構體。According to the description of International Publication No. 2006/011655, a fibrous carbon nanostructure containing SGCNT is obtained by the super growth method.

所得之纖維狀的碳奈米結構體之BET比表面積為800m2 /g。並且,使用穿透式電子顯微鏡量測隨機選取的100根纖維狀的碳奈米結構體之直徑,結果平均直徑(Av)為3.3nm,且將直徑的樣本標準差(σ)乘以三所得之值(3σ)為1.9nm,此等之比值(3σ/Av )為0.58。並且,所得之纖維狀的碳奈米結構體,主要由單層CNT(亦稱為「SGCNT」)所構成。The BET specific surface area of the obtained fibrous carbon nanostructure was 800 m 2 / g. Furthermore, the diameter of 100 randomly selected fibrous carbon nanostructures was measured using a transmission electron microscope. The average diameter (Av) was 3.3 nm, and the sample standard deviation (σ) of the diameter was multiplied by three The value (3σ) is 1.9nm, and the ratio (3σ / Av) is 0.58. Furthermore, the resulting fibrous carbon nanostructure is mainly composed of a single layer of CNT (also known as "SGCNT").

<製備纖維狀的碳奈米結構體之易分散性聚集體><Preparation of easily dispersible aggregates of fibrous carbon nanostructures>

﹝分散液的調製﹞﹝ Modulation of dispersion liquid ﹞

量取400mg之上述所得之纖維狀的碳奈米結構體做為纖維狀碳材料,將其混合於做為溶劑之2L的甲基乙基酮中,利用均質機持續攪拌2分鐘,得到粗分散液。接下來,使用濕式噴射磨機 (常光股份有限公司製,製品名「JN-20」),令所得之粗分散液於100MPa的壓力下通過濕式噴射磨機的0.5mm的流路進行2循環,令纖維狀的碳奈米結構體分散於甲基乙基酮中。接下來,得到固體成分濃度為0.20質量%的分散液。Measure 400 mg of the fibrous carbon nanostructure obtained above as a fibrous carbon material, mix it with 2 L of methyl ethyl ketone as a solvent, and continue stirring for 2 minutes using a homogenizer to obtain a coarse dispersion liquid. Next, using a wet jet mill (manufactured by Changguang Co., Ltd., product name "JN-20"), the obtained crude dispersion liquid was passed through a 0.5 mm flow path of the wet jet mill at a pressure of 100 MPa 2 Circulate to disperse the fibrous carbon nanostructures in methyl ethyl ketone. Next, a dispersion liquid having a solid content concentration of 0.20% by mass was obtained.

﹝溶劑的去除﹞﹝ Removal of solvent ﹞

之後,使用桐山濾紙(No.5A)將上述所得的分散液進行減壓過濾,得到片狀的易分散性聚集體。After that, the dispersion liquid obtained above was filtered under reduced pressure using Tongshan filter paper (No. 5A) to obtain a sheet-shaped easily dispersible aggregate.

<熱傳導片材的製造><Manufacture of heat conductive sheet>

﹝準備複合混合物的步驟﹞﹝ Steps to prepare compound mixture ﹞

使用捏合機(井上製造所製)將粒子狀碳材料、纖維狀碳材料、為全部樹脂成分之母材樹脂以及阻燃劑在攪拌15分鐘的同時進行混合及混練,以得到含有粒子狀碳材料、母材樹脂、纖維狀碳材料及阻燃劑的複合混合物。其中,此複合混合物之各組成材料及其質量份分別為:粒子狀碳材料為130份的膨脹化石墨(伊藤黑鉛工業公司製,商品名「EC-50」,平均粒徑:250μm),纖維狀碳材料為0.1份的碳奈米結構體之易分散性聚集體(於表中,標示為「SGCNT」),為全部樹脂成分之母材樹脂為80份的在常溫常壓下為固態的熱塑性氟樹脂(3M Japan公司製,商品名「Dyneon(註冊商標) E-20575」,慕尼黏度:3.5ML1+4 ,100℃),以及阻燃劑為10份的磷酸酯 (大八化學工業公司製,商品名「PX-110」)。Using a kneader (manufactured by Inoue Manufacturing Co., Ltd.), the particulate carbon material, fibrous carbon material, base resin and flame retardant which are all resin components are mixed and kneaded while stirring for 15 minutes to obtain a particulate carbon material. , Base material resin, fibrous carbon material and flame retardant compound mixture. Among them, the constituent materials of the composite mixture and their parts by mass are as follows: the particulate carbon material is 130 parts of expanded graphite (manufactured by Ito Black Lead Industry Co., Ltd., trade name "EC-50", average particle diameter: 250 μm), The fibrous carbon material is 0.1 parts of easily dispersible aggregates of carbon nanostructures (in the table, marked as "SGCNT"), the base material of all resin components is 80 parts of the solid resin at room temperature and pressure is solid Thermoplastic fluororesin (manufactured by 3M Japan, trade name "Dyneon (registered trademark) E-20575", Mooney viscosity: 3.5ML 1 + 4 , 100 ° C), and 10 parts of phosphate ester as flame retardant (Big Eight Made by Chemical Industry Corporation, trade name "PX-110").

﹝製得複合粒子的步驟﹞﹝ Steps to prepare composite particles ﹞

接下來,將由上述所製得的複合混合物投入粉碎機(三庄工業公司製,製品名「HAMMER CRUSHER HN34S」)且進行粉碎60秒鐘,藉此得到含有粒子狀碳材料、母材樹脂、纖維狀碳材料及阻燃劑的複合粒子。Next, the composite mixture prepared as described above was put into a pulverizer (manufactured by Sanzhuang Industry Co., Ltd., product name "HAMMER CRUSHER HN34S") and pulverized for 60 seconds, thereby obtaining a particulate carbon material, base material resin, and fiber Composite particles of carbon material and flame retardant.

﹝製得熱傳導片材半成品的步驟﹞﹝ Steps to make semi-finished thermally conductive sheet ﹞

接下來,利用經施以噴砂處理且厚度為50μm的PET薄膜(保護薄膜)夾住由上述步驟所得的複合粒子5g,在輥間隙為550μm、輥溫度為50℃、輥線壓為50kg/cm、輥速度為1m/分鐘的條件下進行壓延成形,藉此製得厚度0.5mm的熱傳導片材半成品。Next, 5 g of the composite particles obtained by the above steps were sandwiched with a PET film (protective film) subjected to sandblasting and having a thickness of 50 μm at a roll gap of 550 μm, a roll temperature of 50 ° C., and a roll linear pressure of 50 kg / cm. 1. Roll forming is performed under the condition of a roller speed of 1 m / min, thereby producing a semi-finished heat conductive sheet with a thickness of 0.5 mm.

﹝得到堆疊體的步驟﹞﹝ Steps to get stacks ﹞

並且,將由上述所得之熱傳導片材半成品裁切成縱高6cm×橫寬6cm×厚度0.5mm,並透過作為附著層的雙面膠帶,於厚度方向堆疊120片,而得到厚度為約6cm的堆疊體。Furthermore, the semi-finished thermally conductive sheet obtained above was cut into a height of 6 cm × a width of 6 cm × a thickness of 0.5 mm, and 120 sheets were stacked in the thickness direction through a double-sided tape as an adhesive layer to obtain a stack of approximately 6 cm in thickness body.

﹝切片步驟﹞﹝ Slicing procedure ﹞

接下來,於上述堆疊體的堆疊斷面,以0.3MPa的壓力進行加壓的同時,使用木工用切片機(丸仲鐵工所製,商品名「SUPER SURFACERS SUPER MECA-S,超精加工刨床 SUPER MECA-S」)以相對於堆疊方向為0度的角度進行切片 (換言之,於所堆疊之熱傳導初級片材的主面的法線方向進行切片),得到縱高6cm×橫寬6cm×厚度150μm的熱傳導片材。於此,木工用切片機的刀所使用的二片刃如下。二片刃為2片的單刃,其切刃的相反側彼此接觸,表側刃的刀尖最前端配置成比內側刃的刀尖最前段高0.5mm並且自狹縫部的突出長度為0.11mm,且表側刃的刃角為22∘。Next, on the stacking section of the above-mentioned stack, pressurize with a pressure of 0.3 MPa, and use a woodworking slicer (made by Marukaka Iron Works, trade name "SUPER SURFACERS SUPER MECA-S, super-precision planer SUPER MECA-S ") sliced at an angle of 0 degrees relative to the stacking direction (in other words, sliced in the normal direction of the main surface of the stacked thermally conductive primary sheets) to obtain 6cm in height × 6cm in width × thickness 150μm heat conductive sheet. Here, the two blades used for the blade of the woodworking slicer are as follows. The two blades are two single blades, and the opposite sides of the cutting blades are in contact with each other. The front edge of the blade edge of the front blade is arranged 0.5 mm higher than the front edge of the blade edge of the inner blade and the protruding length from the slit is 0.11 mm The edge angle of the front blade is 22∘.

針對所得之熱傳導片材,使用上述方法量測慕尼黏度、粒子狀碳材料的體積基準眾數直徑、ASKER C硬度及熱傳導率。結果如表1-1所示。With respect to the obtained thermally conductive sheet, Mooney viscosity, volume-based mode diameter of the particulate carbon material, ASKER C hardness, and thermal conductivity were measured using the above method. The results are shown in Table 1-1.

以下將說明實施例2。Embodiment 2 will be described below.

在準備複合混合物的步驟中,除了將母材樹脂變更為與實施例1不同種類的在常溫常壓下為固態的熱塑性氟樹脂(Chemours公司製,商品名「A-100」,慕尼黏度:30.2ML1+4 ,100℃)之外,與實施例1同樣地進行而製造熱傳導片材。接下來,進行與實施例1相同的各種量測。結果如表1-1所示。In the step of preparing the composite mixture, except that the base material resin was changed to a different type of thermoplastic fluororesin solid at room temperature and pressure (made by Chemours Co., Ltd., trade name "A-100"), the Mooney viscosity Except 30.2ML 1 + 4 , 100 degreeC), it carried out similarly to Example 1, and produced the heat conductive sheet. Next, various measurements similar to those in Example 1 were performed. The results are shown in Table 1-1.

以下將說明實施例3。Embodiment 3 will be described below.

在準備複合混合物的步驟中,將做為粒子狀碳材料的膨脹化石墨之摻合量變更為100份。並且,將母材樹脂變更為與實施例1不同種類的在常溫常壓下為固態的熱塑性氟樹脂(Chemours公司製,商品名「A-100」,慕尼黏度:30.2ML1+4 ,100℃),除此之外,與實施例1同樣地進行而製造熱傳導片材。接下來,進行與實施例1相同的各種量測。結果如表1-1所示。In the step of preparing the composite mixture, the blending amount of the expanded graphite as the particulate carbon material was changed to 100 parts. In addition, the base material resin was changed to a different type of thermoplastic fluororesin solid at room temperature and pressure (made by Chemours Co., Ltd., trade name "A-100", Mooney viscosity: 30.2ML 1 + 4 , 100 ° C), except for this, it carried out similarly to Example 1, and produced the heat conductive sheet. Next, various measurements similar to those in Example 1 were performed. The results are shown in Table 1-1.

以下將說明實施例4。Embodiment 4 will be described below.

在準備複合混合物的步驟中,除了將母材樹脂變更為與實施例1不同種類的在常溫常壓下為固態的熱塑性氟樹脂(DAIKIN工業公司製,商品名「DAI-EL(註冊商標) G-704BP」,慕尼黏度:62.4ML1+4 ,100℃)之外,與實施例1同樣地進行而製造熱傳導片材。接下來,進行與實施例1相同的各種量測。結果如表1-2所示。In the step of preparing the composite mixture, except that the base material resin was changed to a different type of thermoplastic fluororesin solid at room temperature and pressure (made by DAIKIN Industries, under the trade name "DAI-EL (registered trademark) G -704BP ", except for Mooney viscosity: 62.4ML 1 + 4 , 100 ° C), a thermally conductive sheet was produced in the same manner as in Example 1. Next, various measurements similar to those in Example 1 were performed. The results are shown in Table 1-2.

以下將說明實施例5。Embodiment 5 will be described below.

在準備複合混合物的步驟中,除了將母材樹脂變更為與實施例1不同種類的在常溫常壓下為固態的熱塑性氟樹脂(DAIKIN工業公司製,商品名「DAI-EL(註冊商標) G-912」,慕尼黏度:87.6ML1+4 ,100℃)之外,與實施例1同樣地進行而製造熱傳導片材。接下來,進行與實施例1相同的各種量測。結果如表1-2所示。In the step of preparing the composite mixture, except that the base material resin was changed to a different type of thermoplastic fluororesin solid at room temperature and pressure (made by DAIKIN Industries, under the trade name "DAI-EL (registered trademark) G -912 ", except for the Mooney viscosity: 87.6ML 1 + 4 , 100 ° C), a thermally conductive sheet was produced in the same manner as in Example 1. Next, various measurements similar to those in Example 1 were performed. The results are shown in Table 1-2.

以下將說明實施例6。Embodiment 6 will be described below.

在準備複合混合物的步驟中,將做為粒子狀碳材料的膨脹化石墨之摻合量變更為160份。並且,將母材樹脂變更為在常溫常壓下為固態的熱塑性矽氧樹脂(信越化學工業製,商品名「KE-931-U」,慕尼黏度:18.0ML1+4 ,100℃),除此之外,與實施例1同樣地進行而製造熱傳導片材。之後進行與實施例1相同的各種量測。結果如表1-2所示。In the step of preparing the composite mixture, the blending amount of the expanded graphite as the particulate carbon material was changed to 160 parts. In addition, the base material resin was changed to a thermoplastic silicone resin that was solid at normal temperature and pressure (manufactured by Shin-Etsu Chemical Co., Ltd., trade name "KE-931-U", Mooney viscosity: 18.0ML 1 + 4 , 100 ° C), Except this, it carried out similarly to Example 1, and produced the heat conductive sheet. Thereafter, the same various measurements as in Example 1 were performed. The results are shown in Table 1-2.

以下將說明實施例7。Embodiment 7 will be described below.

在準備複合混合物的步驟中,將做為粒子狀碳材料的膨脹化石墨之摻合量變更為220份。並且,將母材樹脂變更為在常溫常壓下為固態的熱塑性腈橡膠 (日本瑞翁公司製,商品名:「Nipol(註冊商標) DN3335」,慕尼黏度:35.0ML1+4 ,100℃),除此之外,與實施例1同樣地進行而製造熱傳導片材。之後進行與實施例1相同的各種量測。結果如表1-3所示。In the step of preparing the composite mixture, the blending amount of the expanded graphite as the particulate carbon material was changed to 220 parts. In addition, the base material resin was changed to a thermoplastic nitrile rubber (manufactured by Ruion Corporation, trade name: "Nipol (registered trademark) DN3335" at room temperature and pressure), Mooney viscosity: 35.0ML 1 + 4 , 100 ° C ) Except for this, a thermally conductive sheet was produced in the same manner as in Example 1. Thereafter, the same various measurements as in Example 1 were performed. The results are shown in Table 1-3.

以下將說明實施例8。Embodiment 8 will be described below.

在準備複合混合物的步驟中,將做為粒子狀碳材料的膨脹化石墨之摻合量變更為210份。並且,將母材樹脂變更為在常溫常壓下為固態的熱塑性丙烯酸樹脂 (日本瑞翁公司製,商品名:「AR-12」,慕尼黏度:33.0ML1+4 ,100℃),除此之外,與實施例1同樣地進行而製造熱傳導片材。之後進行與實施例1相同的各種量測。結果如表1-3所示。In the step of preparing the composite mixture, the blending amount of the expanded graphite as the particulate carbon material was changed to 210 parts. In addition, the base material resin was changed to a thermoplastic acrylic resin that was solid at normal temperature and pressure (manufactured by Ruion Corporation, trade name: "AR-12", Mooney viscosity: 33.0ML 1 + 4 , 100 ° C), except Except this, it carried out similarly to Example 1, and produced the heat conductive sheet. Thereafter, the same various measurements as in Example 1 were performed. The results are shown in Table 1-3.

以下將說明實施例9。Embodiment 9 will be described below.

在準備複合混合物的步驟中,將做為粒子狀碳材料的膨脹化石墨的摻合量變更為70份。並且,將母材樹脂變更為與實施例1不同種類的在常溫常壓下為固態的熱塑性氟樹脂(Chemours公司製,商品名「A-100」,慕尼黏度:30.2ML1+4 ,100℃),除此之外,與實施例1同樣地進行而製造熱傳導片材。接下來,進行與實施例1相同的各種量測。結果如表1-3所示。In the step of preparing the composite mixture, the blending amount of the expanded graphite as the particulate carbon material was changed to 70 parts. In addition, the base material resin was changed to a different type of thermoplastic fluororesin solid at room temperature and pressure (made by Chemours Co., Ltd., trade name "A-100", Mooney viscosity: 30.2ML 1 + 4 , 100 ° C), except for this, it carried out similarly to Example 1, and produced the heat conductive sheet. Next, various measurements similar to those in Example 1 were performed. The results are shown in Table 1-3.

表1-1 表1-2 表1-3 Table 1-1 Table 1-2 Table 1-3

根據表1-1、表1-2及表1-3可知,相對於厚度方向而在橫斷方向堆疊多層熱傳導片材半成品而成之熱傳導片材,其厚度方向的熱傳導性優異。其中,此些熱傳導片材半成品包含粒子狀碳材料及慕尼黏度為90(ML1+4 ,100℃)以下的樹脂成分。From Table 1-1, Table 1-2, and Table 1-3, it can be seen that a thermally conductive sheet formed by stacking multiple semi-finished thermally conductive sheets in the transverse direction with respect to the thickness direction has excellent thermal conductivity in the thickness direction. Among them, the semi-finished products of these heat conductive sheets include a particulate carbon material and a resin component having a Mooney viscosity of 90 (ML 1 + 4 , 100 ° C) or less.

根據本發明,可提供厚度方向的熱傳導性優異之熱傳導片材。According to the present invention, it is possible to provide a thermally conductive sheet excellent in thermal conductivity in the thickness direction.

無。no.

無。no.

Claims (4)

一種熱傳導片材,包括:多個熱傳導片材半成品,該些熱傳導片材半成品包含一粒子狀碳材料以及一種樹脂或多種樹脂之複合物,該些熱傳導片材半成品相對於該熱傳導片材的厚度方向而在橫斷方向堆疊,其中由該一種樹脂或多種樹脂之複合物而成之一全部樹脂成分的慕尼黏度(Mooney viscosity)為90(ML1+4 ,100℃)以下。A heat-conducting sheet includes: a plurality of semi-finished products of heat-conducting sheets, the semi-finished products of heat-conducting sheets include a granular carbon material and a resin or a composite of resins, and the thickness of the semi-finished products of the heat-conducting sheets relative to the heat-conducting sheets It is stacked in the transverse direction, and the Mooney viscosity of all the resin components made of the resin or the composite of multiple resins is less than 90 (ML 1 + 4 , 100 ° C). 如請求項1所述之熱傳導片材,其中在將該全部樹脂成分的慕尼黏度設為X、且將該熱傳導片材的厚度方向之熱傳導率設為Y的情況中,滿足關係式:Y>(-0.2X+25)。The thermally conductive sheet according to claim 1, wherein when the Mooney viscosity of all the resin components is X and the thermal conductivity in the thickness direction of the thermally conductive sheet is Y, the relational expression is satisfied: Y > (-0.2X + 25). 如請求項1或2所述之熱傳導片材,其中ASKER C硬度為45以上。The heat conductive sheet according to claim 1 or 2, wherein the ASKER C hardness is 45 or more. 如請求項1所述之熱傳導片材,其中該粒子狀碳材料之含有比例為35體積%以上。The thermally conductive sheet according to claim 1, wherein the content ratio of the particulate carbon material is 35% by volume or more.
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