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TWI799384B - Heat conduction sheet - Google Patents

Heat conduction sheet Download PDF

Info

Publication number
TWI799384B
TWI799384B TW106124997A TW106124997A TWI799384B TW I799384 B TWI799384 B TW I799384B TW 106124997 A TW106124997 A TW 106124997A TW 106124997 A TW106124997 A TW 106124997A TW I799384 B TWI799384 B TW I799384B
Authority
TW
Taiwan
Prior art keywords
heat conduction
conduction sheet
sheet
heat
conduction
Prior art date
Application number
TW106124997A
Other languages
Chinese (zh)
Other versions
TW201835182A (en
Inventor
內海大介
村上康之
Original Assignee
日商日本瑞翁股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日本瑞翁股份有限公司 filed Critical 日商日本瑞翁股份有限公司
Publication of TW201835182A publication Critical patent/TW201835182A/en
Application granted granted Critical
Publication of TWI799384B publication Critical patent/TWI799384B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H10W40/10—
    • H10W40/25—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW106124997A 2016-08-03 2017-07-26 Heat conduction sheet TWI799384B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-152991 2016-08-03
JP2016152991 2016-08-03

Publications (2)

Publication Number Publication Date
TW201835182A TW201835182A (en) 2018-10-01
TWI799384B true TWI799384B (en) 2023-04-21

Family

ID=61072805

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106124997A TWI799384B (en) 2016-08-03 2017-07-26 Heat conduction sheet

Country Status (3)

Country Link
JP (1) JPWO2018025587A1 (en)
TW (1) TWI799384B (en)
WO (1) WO2018025587A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019171987A1 (en) * 2018-03-07 2019-09-12 日本ゼオン株式会社 Conductive structure, composite body, method for producing conductive structure, and method for producing composite body
JP7234560B2 (en) * 2018-09-28 2023-03-08 日本ゼオン株式会社 Heat-conducting sheet and manufacturing method thereof
KR20230008015A (en) * 2019-07-30 2023-01-13 헨켈 아게 운트 코. 카게아아 thermal interface material

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW591068B (en) * 2001-08-06 2004-06-11 Showa Denko Kk Conductive curable resin composition

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101550083B1 (en) * 2008-05-23 2015-09-03 히타치가세이가부시끼가이샤 Heat radiation sheet and heat radiation device
MY164019A (en) * 2010-06-17 2017-11-15 Hitachi Chemical Co Ltd Thermal conductive sheet, method of producing thermal conductive sheet and heat releasing device
JP6152030B2 (en) * 2013-03-29 2017-06-21 積水化学工業株式会社 Thermally conductive foam sheet for electronic equipment

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW591068B (en) * 2001-08-06 2004-06-11 Showa Denko Kk Conductive curable resin composition

Also Published As

Publication number Publication date
TW201835182A (en) 2018-10-01
WO2018025587A1 (en) 2018-02-08
JPWO2018025587A1 (en) 2019-05-30

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