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TW201829587A - Light reflector, substrate, light emitting device and method of manufacturing substrate - Google Patents

Light reflector, substrate, light emitting device and method of manufacturing substrate Download PDF

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TW201829587A
TW201829587A TW106122349A TW106122349A TW201829587A TW 201829587 A TW201829587 A TW 201829587A TW 106122349 A TW106122349 A TW 106122349A TW 106122349 A TW106122349 A TW 106122349A TW 201829587 A TW201829587 A TW 201829587A
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light reflector
light
less
reflector
molding material
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TW106122349A
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TWI723193B (en
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山下太輔
棚橋靖詔
鈴木貴英
下田大輔
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松下知識產權經營股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00Processes of treating or compounding macromolecular substances
    • C08J3/12Powdering or granulating
    • C08J3/126Polymer particles coated by polymer, e.g. core shell structures
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • C08K7/04Fibres or whiskers inorganic
    • C08K7/10Silicon-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/04Ingredients treated with organic substances
    • C08K9/06Ingredients treated with organic substances with silicon-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00Compositions of unspecified rubbers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04Condensation polymers of aldehydes or ketones with phenols only
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/06Unsaturated polyesters
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • H10H20/856Reflecting means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/857Interconnections, e.g. lead-frames, bond wires or solder balls
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/016Additives defined by their aspect ratio

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  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)

Abstract

本發明課題在於提供一種可製造儘管玻璃纖維含量少或不含玻璃纖維也具高強度且高韌性,而且耐熱變色性及光反射性良好的光反射體。本發明之光反射體具備周壁及被周壁包圍之凹處。周壁包含厚度100μm以下之部分。光反射體1含有光反射體用成形材料之硬化物。光反射體用成形材料含有熱硬化性樹脂及白色纖維材。An object of the present invention is to provide a light reflector which can produce high strength and high toughness even in the absence of glass fiber content or glass fiber, and which is excellent in heat discoloration resistance and light reflectivity. The light reflector of the present invention includes a peripheral wall and a recess surrounded by the peripheral wall. The peripheral wall includes a portion having a thickness of 100 μm or less. The light reflector 1 contains a cured product of a molding material for a light reflector. The molding material for a light reflector contains a thermosetting resin and a white fiber material.

Description

光反射體、基體、發光裝置及基體之製造方法Light reflector, substrate, light emitting device and method of manufacturing substrate

本發明一般而言涉及光反射體、基體、發光裝置及基體之製造方法。較詳細來說,本發明涉及一種尤其適合用來製造側視型發光裝置之光反射體、基體、發光裝置及基體之製造方法。The present invention generally relates to a light reflector, a substrate, a light emitting device, and a method of manufacturing a substrate. More particularly, the present invention relates to a method of fabricating a light reflector, a substrate, a light-emitting device, and a substrate that are particularly suitable for use in fabricating a side-view type of light-emitting device.

發明背景 近年,快速擴大運用發光二極體作為螢光燈及白熾燈的替代光源。舉例來說,譬如有將具備發光二極體等發光元件及構成為可反射從發光元件發出之光之樹脂製光反射體(反光件)的發光裝置用於照明用途等。而現在的課題在於,如何才能使這種安裝有發光二極體的發光裝置長效維持初始亮度。BACKGROUND OF THE INVENTION In recent years, the use of light-emitting diodes as an alternative source of fluorescent and incandescent lamps has rapidly expanded. For example, a light-emitting device including a light-emitting element such as a light-emitting diode and a resin-made light reflector (reflector) that can reflect light emitted from the light-emitting element can be used for illumination purposes. The current problem is how to make such a light-emitting device with a light-emitting diode long-lasting to maintain the initial brightness.

發光裝置之亮度降低的主因之一為光反射體因熱而變色,造成光反射率降低。所以,吾等認為,如能以熱變色較少之素材來製造光反射體,便可延長發光裝置的壽命。One of the main causes of the decrease in the brightness of the light-emitting device is that the light reflector is discolored by heat, resulting in a decrease in light reflectance. Therefore, we believe that if the light reflector can be manufactured with less thermal discoloration, the life of the light-emitting device can be extended.

譬如,周知陶瓷係耐熱變色性良好的素材。然而,陶瓷於加工精度有其極限,容易脆性裂斷且價格高,所以缺乏通用性,不適合作為光反射體的素材。For example, Zhouzhi Ceramics is a material with good heat and discoloration properties. However, ceramics have their limits in processing precision, are easy to be brittle, and are expensive, so they lack versatility and are not suitable as materials for light reflectors.

相對地,一般稱為尼龍的聚醯胺樹脂具優異的耐藥性、耐熱性、耐摩耗性及韌性,且比陶瓷低廉,所以常廣泛運用在照明用途上。然而,尼龍製的光反射體熱變色嚴重,無法如預期延續發光裝置的壽命。In contrast, polyamide resin, generally referred to as nylon, has excellent chemical resistance, heat resistance, abrasion resistance, and toughness, and is inexpensiver than ceramics, and is therefore widely used for lighting applications. However, the nylon light-reflecting body is highly discolored and cannot sustain the life of the light-emitting device as expected.

爰此,有研究提議以不飽和聚酯樹脂及環氧樹脂等熱硬化性樹脂來製造光反射體(譬如可參照日本專利第4844699號公報、日本專利第5153952號公報及日本特開2014-019747號公報)。以熱硬化性樹脂做成的光反射體具有耐熱變色性良好的優點。In view of the above, it has been proposed to produce a light-reflecting body by using a thermosetting resin such as an unsaturated polyester resin or an epoxy resin (for example, Japanese Patent No. 4844699, Japanese Patent No. 5153952, and Japanese Patent Laid-Open No. 2014-019747 Bulletin). The light reflector made of a thermosetting resin has an advantage of being excellent in heat discoloration resistance.

然而,以不飽和聚酯樹脂及環氧樹脂等熱硬化性樹脂很難取得足以匹敵尼龍的高韌性及高強度。一般會使光反射體含有玻璃纖維以賦予光反射體高強度,但要賦予高韌性極難。However, it is difficult to obtain high toughness and high strength comparable to nylon with a thermosetting resin such as an unsaturated polyester resin or an epoxy resin. Generally, the light reflector contains glass fibers to impart high strength to the light reflector, but it is extremely difficult to impart high toughness.

又,近年隨著發光元件與光反射體間之距離縮短、發光裝置小型化,也逐漸縮小光反射體的厚度。譬如,側視型光反射體具有厚度非常小的部分。光反射體含有玻璃纖維時,光反射體若具有厚度小的部分,到達光反射體之光可能無法被充分反射。列舉其原因之一,係因玻璃纖維被配置成橫切光反射體內,而玻璃纖維會形成可使光通過光反射體內的光通道,以致光容易穿透光反射體。再舉其他原因,則是進入光反射體內之光直接被密封在光反射體內。吾等認為,實際上係光被光反射體吸收等而衰減。所以,尤其是小型的光反射體很難具有高光反射率。另一方面,光反射體若不含玻璃纖維,光反射體便很難具有充分的強度。Moreover, in recent years, as the distance between the light-emitting element and the light reflector is shortened and the light-emitting device is downsized, the thickness of the light reflector is gradually reduced. For example, a side view type light reflector has a portion having a very small thickness. When the light reflector contains glass fibers, if the light reflector has a small thickness, the light reaching the light reflector may not be sufficiently reflected. One of the reasons cited is that the glass fibers are arranged to cross the light reflecting body, and the glass fibers form a light passage that allows light to pass through the light reflecting body, so that the light easily penetrates the light reflecting body. For other reasons, the light entering the light reflector is directly sealed in the light reflector. We believe that the light is actually attenuated by absorption by the light reflector or the like. Therefore, especially small light reflectors are difficult to have high light reflectance. On the other hand, if the light reflector does not contain glass fibers, it is difficult for the light reflector to have sufficient strength.

發明概要 本發明目的在於提供一種即使具有厚度較小的部分,儘管玻璃纖維含量少或不含玻璃纖維也具高強度且高韌性,而且耐熱變色性及光反射性良好的光反射體及其製造方法以及發光裝置。SUMMARY OF THE INVENTION An object of the present invention is to provide a light reflector which has high strength and high toughness, and has excellent heat discoloration resistance and light reflectivity, even if it has a small thickness portion, has a small glass fiber content or contains no glass fiber, and has excellent heat resistance and light reflectivity. Method and illuminating device.

本發明一態樣之光反射體含有光反射體用成形材料之硬化物。前述光反射體具備周壁及被前述周壁包圍之凹處。前述周壁含有厚度100μm以下之部分。前述光反射體用成形材料含有熱硬化性樹脂及白色纖維材。The light reflector of one aspect of the present invention contains a cured product of a molding material for a light reflector. The light reflector has a peripheral wall and a recess surrounded by the peripheral wall. The peripheral wall includes a portion having a thickness of 100 μm or less. The molding material for a light reflector contains a thermosetting resin and a white fiber material.

本發明一態樣之基體具備前述光反射體及埋入前述光反射體的引線。前述引線具有在前述凹處之內面露出的內部端子及從前述光反射體之外面突出的外部端子。A substrate according to an aspect of the present invention includes the light reflector and a lead buried in the light reflector. The lead wire has an internal terminal exposed on the inner surface of the recess and an external terminal protruding from the outer surface of the light reflector.

本發明一態樣之發光裝置具備前述基體及發光元件。前述發光元件與前述引線之前述內部端子電連接且搭載在前述光反射體之前述凹處的內部。A light-emitting device according to an aspect of the invention includes the substrate and the light-emitting element. The light-emitting element is electrically connected to the internal terminal of the lead wire and mounted inside the recess of the light reflector.

本發明一態樣之基體之製造方法包含下述製程:將光反射體用成形材料成形製作光反射體,並於製作前述光反射體時,以前述引線部分從前述光反射體突出的方式使前述光反射體與引線一體化。A method for producing a substrate according to an aspect of the present invention includes a process of forming a light reflector by molding a light reflector, and forming the light reflector so that the lead portion protrudes from the light reflector The light reflector is integrated with the lead.

用以實施發明之形態 以下說明本發明之實施形態。另,在本說明書及圖式中,針對實質上相同的構成要素係賦予同一符號以省略重複說明。MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described. In the present specification and the drawings, the same components are denoted by the same reference numerals, and the description thereof will not be repeated.

光反射體用成形材料 本實施形態之光反射體用成形材料很適合用來製造光反射體1(反光件)。光反射體用成形材料含有熱硬化性樹脂及白色纖維材。譬如,光反射體用成形材料含有熱硬化性樹脂、聚合引發劑、充填材、脫模劑及白色纖維材。光反射體用成形材料宜更含有橡膠粒子13。光反射體用成形材料在30℃以下宜為固體。光反射體用成形材料可藉由粉碎加工或擠製造粒加工而加工成粒狀。Molding material for light reflector The molding material for a light reflector of the present embodiment is suitably used for producing a light reflector 1 (reflector). The molding material for a light reflector contains a thermosetting resin and a white fiber material. For example, the molding material for a light reflector contains a thermosetting resin, a polymerization initiator, a filler, a release agent, and a white fiber material. The molding material for a light reflector preferably further contains rubber particles 13. The molding material for a light reflector is preferably a solid at 30 ° C or lower. The molding material for a light reflector can be processed into a pellet by pulverization processing or extrusion processing.

本實施形態中,藉由構成光反射體用成形材料之成分的加乘效果,可製造即使玻璃纖維含量少或不含玻璃纖維也具高強度且高韌性,而且耐熱變色性良好的光反射體。In the present embodiment, by the additive effect of the components constituting the molding material for a light reflector, it is possible to produce a light reflector having high strength and high toughness even if the glass fiber content is small or glass fiber is not contained, and the heat discoloration resistance is good. .

亦即,因為光反射體用成形材料含有白色纖維材,所以成形時可抑制硬化收縮,同時光反射體1可具有高強度及高度的尺寸穩定性。此外,由於白色纖維材不易透光,所以即使光反射體1具有厚度較小的部分,白色纖維材也不易阻礙光反射體1的光反射性。因此,光反射體1就算是小型或薄型,也能確保光反射體1的高強度及高光反射性。In other words, since the molding material for the light reflector contains the white fiber material, the curing shrinkage can be suppressed at the time of molding, and the light reflector 1 can have high strength and high dimensional stability. Further, since the white fiber material is less likely to transmit light, even if the light reflector 1 has a small thickness portion, the white fiber material does not easily hinder the light reflectivity of the light reflector 1. Therefore, even if the light reflector 1 is small or thin, the high intensity and high light reflectivity of the light reflector 1 can be ensured.

又,光反射體用成形材料含有內核外殼型的橡膠粒子13時,可使光反射體1厚度較小的部分變柔軟,以抑制其變脆,從而可確保高韌性。Further, when the molding material for a light reflector contains the core-shell type rubber particles 13, the portion having a small thickness of the light reflector 1 can be made soft, and the brittleness can be suppressed, thereby ensuring high toughness.

又,光反射體用成形材料含有熱硬化性樹脂,所以光反射體1之耐熱變色性良好。Moreover, since the molding material for a light reflector contains a thermosetting resin, the heat reflection property of the light reflector 1 is favorable.

該光反射體用成形材料具備周壁10及被周壁10包圍之凹處11,周壁10對於用來製造包含厚度100μm以下部分的光反射體1(對照圖1、圖2A及圖2B)相當適宜。關於該光反射體1的詳細構成容後說明。具有這種形狀及尺寸的光反射體1若含有本實施形態之光反射體用成形材料之硬化物,則即使具有厚度較小的部分,儘管玻璃纖維含量少或不含玻璃纖維也具高強度且高韌性,而且耐熱變色性及光反射性良好。The molding material for a light reflector includes a peripheral wall 10 and a recess 11 surrounded by the peripheral wall 10. The peripheral wall 10 is suitable for producing a light reflector 1 having a thickness of 100 μm or less (refer to Figs. 1, 2A and 2B). The detailed configuration of the light reflector 1 will be described later. When the light-reflecting body 1 having such a shape and size contains the cured product of the molding material for a light-reflecting body of the present embodiment, even if it has a small thickness portion, it has high strength even if it has a small glass fiber content or contains no glass fiber. It has high toughness and good heat discoloration and light reflectivity.

另,亦可從本實施形態之光反射體用成形材料製作上述光反射體1以外的光反射體。不論尺寸及形狀,含有光反射體用成形材料之硬化物的光反射體儘管玻璃纖維含量少或不含玻璃纖維也具高強度且高韌性,而且耐熱變色性及光反射性良好。In addition, a light reflector other than the light reflector 1 described above can be produced from the molding material for a light reflector of the present embodiment. Regardless of the size and shape, the light reflector containing the cured product of the molding material for a light reflector has high strength and high toughness even when the glass fiber content is small or contains no glass fiber, and is excellent in heat discoloration resistance and light reflectivity.

以下首先說明光反射體用成形材料之構成成分。 (熱硬化性樹脂)Hereinafter, the constituent components of the molding material for a light reflector will be described first. (thermosetting resin)

熱硬化性樹脂中所含成分可為單體及寡聚物(預聚物)中之任一者。熱硬化性樹脂宜具有選自於由乙烯基、丙烯醯基、羧基、羥基及環氧基所構成群組中之至少1種官能基。該官能基在成形光反射體用成形材料時會涉及交聯反應等反應。The component contained in the thermosetting resin may be any of a monomer and an oligomer (prepolymer). The thermosetting resin preferably has at least one functional group selected from the group consisting of a vinyl group, an acryl group, a carboxyl group, a hydroxyl group, and an epoxy group. This functional group involves a reaction such as a crosslinking reaction when forming a molding material for a light reflector.

然而,如後述圖2A及圖2B所示,發光裝置6具備光反射體1及發光元件3。假設,光反射體1係由熱可塑性樹脂所形成,當發光元件3發熱時,光反射體1有因熱而變形之虞。但,光反射體1若以含有熱硬化性樹脂之光反射體用成形材料來製作,即使發光元件3發熱,也能抑制光反射體1因熱而變形的情況。However, as shown in FIG. 2A and FIG. 2B described later, the light-emitting device 6 includes the light reflector 1 and the light-emitting element 3. It is assumed that the light reflector 1 is formed of a thermoplastic resin, and when the light-emitting element 3 generates heat, the light reflector 1 is deformed by heat. However, the light reflector 1 is produced by using a molding material for a light reflector containing a thermosetting resin, and even if the light-emitting element 3 generates heat, the light reflector 1 can be prevented from being deformed by heat.

熱硬化性樹脂宜含有選自於由不飽和聚酯樹脂、環氧樹脂及苯酚樹脂所構成群組中之1種以上成分。此時,光反射體用成形材料的成形性良好。此外,在此情況下,光反射體也能具有高耐熱變色性及高強度。The thermosetting resin preferably contains one or more components selected from the group consisting of unsaturated polyester resins, epoxy resins, and phenol resins. At this time, the moldability of the molding material for a light reflector is good. Further, in this case, the light reflector can also have high heat discoloration resistance and high strength.

尤其,熱硬化性樹脂宜含有不飽和聚酯樹脂及環氧樹脂中之任一者或兩者。比起苯酚樹脂,不飽和聚酯樹脂及環氧樹脂能賦予光反射體1較高的耐熱變色性,即使在高溫下,光反射體1也不易變色。In particular, the thermosetting resin preferably contains either or both of an unsaturated polyester resin and an epoxy resin. Compared with the phenol resin, the unsaturated polyester resin and the epoxy resin can impart high heat discoloration resistance to the light reflector 1, and the light reflector 1 is less likely to be discolored even at a high temperature.

此外,熱硬化性樹脂宜含有不飽和聚酯樹脂。比起環氧樹脂,不飽和聚酯樹脂能賦予光反射體1更高的耐熱變色性。其理由是因為光反射體用成形材料若含有不飽和聚酯樹脂,為變色原因之未反應的官能基就不易殘留在光反射體1內部。亦即,不飽和聚酯樹脂的聚合速度快,所以即使製造光反射體1時的成形週期短,也不易殘留未反應的官能基。Further, the thermosetting resin preferably contains an unsaturated polyester resin. The unsaturated polyester resin imparts higher heat discoloration resistance to the light reflector 1 than the epoxy resin. The reason for this is that if the molding material for a light reflector contains an unsaturated polyester resin, the unreacted functional group which is a cause of discoloration does not easily remain inside the light reflector 1 . That is, since the polymerization speed of the unsaturated polyester resin is fast, even if the molding cycle when the light reflector 1 is produced is short, unreacted functional groups are hardly left.

不飽和聚酯樹脂含有譬如不飽和醇酸樹脂及交聯劑(共聚性化合物)。不飽和醇酸樹脂會在譬如30℃以上且宜為50℃以上開始軟化。The unsaturated polyester resin contains, for example, an unsaturated alkyd resin and a crosslinking agent (copolymerizable compound). The unsaturated alkyd resin will start to soften at, for example, 30 ° C or higher and preferably 50 ° C or higher.

不飽和醇酸樹脂可使多元酸類及甘醇類脫水縮合而獲得。多元酸類宜含有不飽和多元酸類。多元酸類更可含有飽和多元酸類。The unsaturated alkyd resin can be obtained by dehydrating and condensing polybasic acids and glycols. The polybasic acid preferably contains an unsaturated polybasic acid. The polybasic acid may further contain a saturated polybasic acid.

不飽和多元酸類含有譬如選自於由馬來酸酐、延胡索酸、伊康酸、檸康酸所構成群組中之1種以上成分。The unsaturated polybasic acid contains, for example, one or more components selected from the group consisting of maleic anhydride, fumaric acid, itaconic acid, and citraconic acid.

飽和多元酸類含有譬如選自於由酞酸酐、異酞酸、對酞酸、己二酸、癸二酸、1,4-環己烷二羧酸、四氫酞酸酐、甲基四氫酞酸酐、內亞甲四氫酞酐、氯橋酸(HET acid)及四溴酞酸酐所構成群組中之1種以上。The saturated polybasic acid is, for example, selected from the group consisting of phthalic anhydride, isophthalic acid, p-citric acid, adipic acid, sebacic acid, 1,4-cyclohexanedicarboxylic acid, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride And one or more selected from the group consisting of tetramethylene phthalic anhydride, HET acid, and tetrabromophthalic anhydride.

甘醇類含有譬如選自於由乙二醇、丙二醇、二乙二醇、二丙二醇、新戊二醇、1,3-丁二醇、1,6-己二醇、1,4-環己烷二甲醇、氫化雙酚A、雙酚A環氧丙烷化合物及二溴新戊二醇所構成群組中之1種以上。The glycols are, for example, selected from the group consisting of ethylene glycol, propylene glycol, diethylene glycol, dipropylene glycol, neopentyl glycol, 1,3-butylene glycol, 1,6-hexanediol, and 1,4-cyclohexane. One or more of the group consisting of alkane dimethanol, hydrogenated bisphenol A, bisphenol A propylene oxide compound, and dibromo neopentyl glycol.

不飽和醇酸樹脂之熔融黏度宜在0.1Pa・s以上且10Pa・s以下之範圍內。為此,不飽和醇酸樹脂宜為異酞酸系不飽和醇酸樹脂及對酞酸系不飽和醇酸樹脂中之任一者或兩者。不飽和醇酸樹脂若具有上述熔融黏度,光反射體用成形材料便能具有高成形性,且光反射體1能具有高耐熱變色性。The melt viscosity of the unsaturated alkyd resin is preferably in the range of 0.1 Pa·s or more and 10 Pa·s or less. For this reason, the unsaturated alkyd resin is preferably either or both of an isophthalic acid unsaturated alkyd resin and a p-citric acid unsaturated alkyd resin. When the unsaturated alkyd resin has the above-mentioned melt viscosity, the molding material for a light reflector can have high formability, and the light reflector 1 can have high heat discoloration resistance.

交聯劑含有譬如選自於由苯乙烯、乙烯基甲苯、二乙烯苯、α-甲基苯乙烯、甲基丙烯酸甲酯及乙酸乙烯酯所構成群組中之1種以上乙烯基系共聚性單體。交聯劑亦可含有譬如選自於由酞酸二烯丙酯、三聚氰酸三烯丙酯、四溴酞酸二烯丙酯、丙烯酸苯氧乙酯、丙烯酸2-羥乙酯及1,6-己二醇二丙烯酸酯所構成群組中之1種以上共聚性單體。交聯劑亦可含有上述所列舉之單體中至少1種以上聚合而成的預聚物。尤其,交聯劑宜含有選自於由酞酸二烯丙酯預聚物、酞酸二烯丙酯單體及苯乙烯單體所構成群組中之1種以上成分。The crosslinking agent contains, for example, one or more kinds of vinyl copolymerization selected from the group consisting of styrene, vinyl toluene, divinylbenzene, α-methylstyrene, methyl methacrylate, and vinyl acetate. monomer. The crosslinking agent may also contain, for example, from diallyl phthalate, triallyl cyanurate, diallyl tetrabromide, phenoxyethyl acrylate, 2-hydroxyethyl acrylate and 1 One or more kinds of copolymerizable monomers in the group consisting of 6-hexanediol diacrylate. The crosslinking agent may also contain a prepolymer obtained by polymerizing at least one of the above-exemplified monomers. In particular, the crosslinking agent preferably contains one or more components selected from the group consisting of diallyl phthalate prepolymers, diallyl phthalate monomers, and styrene monomers.

不飽和聚酯樹脂中不飽和醇酸樹脂與交聯劑之質量比宜在99:1~50:50之範圍內。交聯劑含有單體時,單體含量愈多,光反射體用成形材料愈不易在常溫下變固體,所以相對於不飽和聚酯樹脂100質量份,單體含量宜在10質量份以下。The mass ratio of the unsaturated alkyd resin to the crosslinking agent in the unsaturated polyester resin is preferably in the range of 99:1 to 50:50. When the crosslinking agent contains a monomer, the more the monomer content, the more difficult the molding material for the light reflector becomes solid at room temperature, so the monomer content is preferably 10 parts by mass or less based on 100 parts by mass of the unsaturated polyester resin.

環氧樹脂只要是1分子中具有2個以上環氧基(環氧乙烷環)之樹脂即無特別限定。環氧樹脂可含有選自於由多酚型環氧樹脂、環氧丙基醚型環氧樹脂、環氧丙基酯型環氧樹脂、環氧丙基胺型環氧樹脂及脂環式環氧樹脂所構成群組中之1種以上成分。環氧樹脂亦可含有具有三吖骨架之環氧樹脂。具有三吖 骨架之環氧樹脂的具體例可舉如三聚異氰酸三環氧丙酯。The epoxy resin is not particularly limited as long as it is a resin having two or more epoxy groups (ethylene oxide rings) in one molecule. The epoxy resin may be selected from the group consisting of polyphenol type epoxy resins, epoxy propyl ether type epoxy resins, epoxy propyl ester type epoxy resins, epoxy propyl amine type epoxy resins, and alicyclic rings. One or more components selected from the group consisting of oxygen resins. Epoxy resin can also contain three bismuth Skeleton epoxy resin. With three Specific examples of the epoxy resin of the skeleton include tris-propyl isocyanate.

苯酚樹脂係由酚類及甲醛合成之熱硬化性樹脂。苯酚樹脂含有譬如酚醛型苯酚樹脂及可熔酚醛型苯酚樹脂中之任一者或兩者。酚醛型苯酚樹脂可以酸性觸媒使酚類與甲醛縮合而獲得。於酚醛型苯酚樹脂加入六亞甲四胺並予以加熱使其硬化。另一方面,可熔酚醛型苯酚樹脂可以鹼性觸媒使酚類與甲醛縮合而獲得。將可熔酚醛型苯酚樹脂加熱便可使其脫水交聯而硬化。The phenol resin is a thermosetting resin synthesized from phenols and formaldehyde. The phenol resin contains either or both of a novolac type phenol resin and a resol type phenol resin. The phenolic phenol resin can be obtained by condensing a phenol with formaldehyde by an acidic catalyst. The phenolic phenol resin is added with hexamethylenetetramine and heated to harden it. On the other hand, a resol type phenol resin can be obtained by condensing a phenol with formaldehyde by a basic catalyst. When the resol type phenol resin is heated, it can be dehydrated and crosslinked to be hardened.

相對於光反射體用成形材料整體量,熱硬化性樹脂含量宜在14質量%以上且40質量%以下之範圍內,16質量%以上且34質量%以下之範圍內較佳,20質量%以上且28質量%以下之範圍內更佳。熱硬化性樹脂含量若在14質量%以上,可抑制光反射體1的光反射性降低。熱硬化性樹脂含量若在40質量%以下,可抑制光反射體1的強度降低。 (聚合引發劑)The content of the thermosetting resin is preferably in the range of 14% by mass or more and 40% by mass or less, more preferably 16% by mass or more and 34% by mass or less, and more preferably 20% by mass or more, based on the total amount of the molding material for the light reflector. More preferably, it is in the range of 28% by mass or less. When the content of the thermosetting resin is 14% by mass or more, the light reflectance of the light reflector 1 can be suppressed from being lowered. When the content of the thermosetting resin is 40% by mass or less, the decrease in strength of the light reflector 1 can be suppressed. (polymerization initiator)

光反射體用成形材料可含有聚合引發劑。熱硬化性樹脂具有自由基聚合反應性時,光反射體用成形材料宜含有熱自由基聚合引發劑作為聚合引發劑。聚合引發劑並無特別限定,可舉如加熱分解型的有機過氧化物。有機過氧化物含有譬如選自於由三級丁基過氧基-2-乙基己基單碳酸酯、1,1-二(三級己基過氧基)環己烷、1,1-二(三級丁基過氧基)-3,3,5-三甲基環己烷、過氧辛酸三級丁酯、過氧化苯甲醯、過氧化甲基乙基酮、過氧化乙醯丙酮、過氧苯甲酸三級丁酯及過氧化二異丙苯基所構成群組中之1種以上成分。尤其,聚合引發劑宜含有像過氧化二異丙苯基,10小時半衰期溫度為100℃以上的有機過氧化物。基於預防火災及爆炸觀點,聚合引發劑亦可業經母粒(masterbatch)化以進一步提高安全性。The molding material for a light reflector may contain a polymerization initiator. When the thermosetting resin has radical polymerization reactivity, the molding material for a light reflector preferably contains a thermal radical polymerization initiator as a polymerization initiator. The polymerization initiator is not particularly limited, and examples thereof include a heat-decomposable organic peroxide. The organic peroxide contains, for example, selected from the group consisting of tert-butylperoxy-2-ethylhexylmonocarbonate, 1,1-di(tri-hexylperoxy)cyclohexane, 1,1-di ( Tertiary butylperoxy)-3,3,5-trimethylcyclohexane, butyl peroxyoctanoate, benzammonium peroxide, methyl ethyl ketone peroxide, acetamidine peroxide, One or more components selected from the group consisting of tertiary butyl peroxybenzoate and dicumyl peroxide. In particular, the polymerization initiator preferably contains an organic peroxide having a 10-hour half-life temperature of 100 ° C or higher, such as dicumyl peroxide. Based on the prevention of fire and explosion, the polymerization initiator can also be masterbatch to further improve safety.

光反射體用成形材料亦可含有硬化劑。可添加硬化劑來促進熱硬化性樹脂硬化。譬如,熱硬化性樹脂含有環氧樹脂時,光反射體用成形材料含有譬如六氫酞酸酐作為硬化劑。熱硬化性樹脂含有苯酚樹脂時,光反射體用成形材料含有譬如六亞甲四胺作為硬化劑。 (充填材)The molding material for the light reflector may also contain a curing agent. A hardener may be added to promote hardening of the thermosetting resin. For example, when the thermosetting resin contains an epoxy resin, the molding material for a light reflector contains, for example, hexahydrophthalic anhydride as a curing agent. When the thermosetting resin contains a phenol resin, the molding material for a light reflector contains, for example, hexamethylenetetramine as a curing agent. (filling material)

光反射體用成形材料可含有充填材。充填材含有譬如無機充填材及白色顏料中之任一者或兩者。亦即,光反射體用成形材料可含有無機充填材。又,光反射體用成形材料可含有白色顏料。The molding material for a light reflector may contain a filler. The filling material contains either or both of an inorganic filler and a white pigment. That is, the molding material for the light reflector may contain an inorganic filler. Further, the molding material for the light reflector may contain a white pigment.

無機充填材含有譬如二氧化矽及氫氧化鋁中之任一者或兩者。尤其,無機充填材宜含有二氧化矽。二氧化矽含有譬如選自於由熔融二氧化矽粉末、球狀二氧化矽粉末、破碎二氧化矽粉末、結晶二氧化矽粉末所構成群組中之1種以上成分。只要不損及本實施形態之光反射體用成形材料所致之效果,無機充填材亦可含有上述所舉之物以外的氧化物、水合物、無機發泡粒子、二氧化矽中空球體等中空粒子。The inorganic filler material contains either or both of cerium oxide and aluminum hydroxide. In particular, the inorganic filler material preferably contains cerium oxide. The cerium oxide contains, for example, one or more components selected from the group consisting of molten cerium oxide powder, spherical cerium oxide powder, crushed cerium oxide powder, and crystalline cerium oxide powder. The inorganic filler may contain hollow oxides, hydrates, inorganic foaming particles, cerium oxide hollow spheres or the like other than the above-mentioned materials, as long as the effect of the molding material for a light reflector of the present embodiment is not impaired. particle.

無機充填材之平均粒徑宜為250μm以下,較宜在0.05μm以上且100μm以下之範圍內,更宜在0.1μm以上且10μm以下之範圍內。光反射體用成形材料中若含有這類平均粒徑的無機充填材,便可提升光反射體用成形材料之成形性,此外也能提升光反射體1之光反射性及耐濕性。另,在後述圖2A及圖2B所示發光裝置6,從發光元件3發出之光L即使未被反射面23(內周面12等)反射而進入周壁10(上壁部18、下壁部19及2邊側壁部20)內,於該等內部依舊可如上述藉由微小的無機充填材來增加光L的折射次數。其結果可抑制光L穿透周壁10,從而可提高光隱蔽性。另,本說明書中平均粒徑意指利用雷射繞射散射法求得之粒度分布中累積值50%的粒徑(中值粒徑(D50))。雷射繞射散射法可利用米氏(Mie)散射,亦可不利用。此時的粒度分布形狀無特別限定。The average particle diameter of the inorganic filler is preferably 250 μm or less, more preferably 0.05 μm or more and 100 μm or less, and more preferably 0.1 μm or more and 10 μm or less. When the inorganic filler having such an average particle diameter is contained in the molding material for a light reflector, the moldability of the molding material for a light reflector can be improved, and the light reflectivity and moisture resistance of the light reflector 1 can be improved. In the light-emitting device 6 shown in FIG. 2A and FIG. 2B, the light L emitted from the light-emitting element 3 is reflected by the reflection surface 23 (the inner circumferential surface 12 or the like) and enters the peripheral wall 10 (the upper wall portion 18 and the lower wall portion). In the 19 and 2 side wall portions 20), the number of refractions of the light L can be increased by the fine inorganic filler as described above. As a result, it is possible to suppress the light L from penetrating the peripheral wall 10, thereby improving light concealability. Further, the average particle diameter in the present specification means a particle diameter (median diameter (D50)) of 50% of the cumulative value in the particle size distribution obtained by the laser diffraction scattering method. The laser diffraction scattering method can utilize Mie scattering or not. The shape of the particle size distribution at this time is not particularly limited.

相對於熱硬化性樹脂100質量份,無機充填材含量宜為32質量份以上,較宜在50質量份以上且250質量份以下之範圍內。在此情況下,可提升光反射體用成形材料之成形性,更能提升光反射體1之耐熱變色性,也能提高光反射率。此外,此時在後述圖2A及圖2B所示發光裝置6,於周壁10內部可如上述藉由多量存在的無機充填材來增加光L的折射次數。其結果可抑制光L穿透周壁10,從而可提高周壁10之光隱蔽性。The content of the inorganic filler is preferably 32 parts by mass or more, and more preferably 50 parts by mass or more and 250 parts by mass or less with respect to 100 parts by mass of the thermosetting resin. In this case, the moldability of the molding material for the light reflector can be improved, the heat discoloration resistance of the light reflector 1 can be improved, and the light reflectance can be improved. Further, at this time, in the light-emitting device 6 shown in FIG. 2A and FIG. 2B, which will be described later, the number of times of refraction of the light L can be increased inside the peripheral wall 10 by a large amount of the inorganic filler. As a result, it is possible to suppress the light L from penetrating the peripheral wall 10, so that the light concealing property of the peripheral wall 10 can be improved.

白色顏料含有譬如選自於由氧化鈦、鈦酸鋇、鈦酸鍶、氧化鋁、氧化鎂、氧化鋅及碳酸鋇所構成群組中之1種以上成分。尤其,白色顏料宜含有選自於由氧化鈦、氧化鋁及鈦酸鋇所構成群組中之1種以上成分。氧化鈦可含有譬如選自於由銳鈦礦型氧化鈦、金紅石型氧化鈦及板鈦礦型氧化鈦所構成群組中之1種以上成分。氧化鈦宜含有熱穩定性優異的金紅石型氧化鈦。The white pigment contains, for example, one or more components selected from the group consisting of titanium oxide, barium titanate, barium titanate, alumina, magnesia, zinc oxide, and barium carbonate. In particular, the white pigment preferably contains one or more components selected from the group consisting of titanium oxide, aluminum oxide, and barium titanate. The titanium oxide may contain, for example, one or more components selected from the group consisting of anatase-type titanium oxide, rutile-type titanium oxide, and brookite-type titanium oxide. The titanium oxide preferably contains rutile-type titanium oxide excellent in thermal stability.

白色顏料之平均粒徑宜為2μm以下,較宜在0.1μm以上且1μm以下之範圍內、更宜在0.2μm以上且0.7μm以下之範圍內。此時亦與無機充填材之情況同樣地,在後述圖2A及圖2B所示發光裝置6中,可如上述於周壁10內部藉由比無機充填材更微小的白色顏料來增加光L的折射次數。其結果可抑制光L穿透周壁10,從而可提高光隱蔽性。The average particle diameter of the white pigment is preferably 2 μm or less, more preferably 0.1 μm or more and 1 μm or less, more preferably 0.2 μm or more and 0.7 μm or less. At this time, similarly to the case of the inorganic filler, in the light-emitting device 6 shown in FIG. 2A and FIG. 2B, which will be described later, the number of refractions of the light L can be increased by the white pigment which is smaller than the inorganic filler in the peripheral wall 10 as described above. . As a result, it is possible to suppress the light L from penetrating the peripheral wall 10, thereby improving light concealability.

相對於熱硬化性樹脂100質量份,白色顏料含量宜為100質量份以上,較宜在100質量份以上且300質量份以下之範圍內。白色顏料含量若在100質量份以上,即可提高光反射體1之光反射率。此外,此時在後述圖2A及圖2B所示發光裝置6中,也能如上述於周壁10內部藉由存在比無機充填材更多量的白色顏料來增加光L的折射次數。其結果可抑制光L穿透周壁10,從而可提高周壁10之光隱蔽性。白色顏料含量若在300質量份以下,即可提高光反射體用成形材料的薄壁充填性,更能提高光反射體1之彎曲強度。The white pigment content is preferably 100 parts by mass or more, and more preferably 100 parts by mass or more and 300 parts by mass or less, based on 100 parts by mass of the thermosetting resin. When the content of the white pigment is 100 parts by mass or more, the light reflectance of the light reflector 1 can be improved. Further, at this time, in the light-emitting device 6 shown in FIGS. 2A and 2B described later, the number of times of refraction of the light L can be increased by the presence of a larger amount of white pigment than the inorganic filler in the peripheral wall 10 as described above. As a result, it is possible to suppress the light L from penetrating the peripheral wall 10, so that the light concealing property of the peripheral wall 10 can be improved. When the content of the white pigment is 300 parts by mass or less, the thin-wall filling property of the molding material for a light reflector can be improved, and the bending strength of the light reflector 1 can be further improved.

相對於光反射體用成形材料整體量,無機充填材及白色顏料的含量合計宜在33質量%以上且74質量%以下之範圍內,較宜在50質量%以上且72質量%以下之範圍內。The total content of the inorganic filler and the white pigment is preferably in the range of 33% by mass or more and 74% by mass or less, and more preferably in the range of 50% by mass or more and 72% by mass or less, based on the total amount of the molding material for the light reflector. .

相對於熱硬化性樹脂100質量份,無機充填材及白色顏料的含量合計宜為500質量份以下,較宜在100質量份以上且400質量份以下之範圍內。此時,可提高光反射體用成形材料於成形時的流動性,提升成形性。The total content of the inorganic filler and the white pigment is preferably 500 parts by mass or less, and more preferably 100 parts by mass or more and 400 parts by mass or less based on 100 parts by mass of the thermosetting resin. In this case, the fluidity of the molding material for a light reflector can be improved at the time of molding, and the moldability can be improved.

無機充填材及白色顏料的粒徑愈小,愈容易產生凝聚或吸油現象,而不易在光反射體用成形材料中均勻分散。爰此,為了提升無機充填材及白色顏料在光反射體用成形材料中的分散性,無機充填材及白色顏料宜業經脂肪酸及耦合劑中之任一者或兩者施行表面處理。 (脫模劑)The smaller the particle size of the inorganic filler and the white pigment, the more likely the aggregation or oil absorption phenomenon occurs, and it is not easy to be uniformly dispersed in the molding material for the light reflector. Accordingly, in order to improve the dispersibility of the inorganic filler and the white pigment in the molding material for a light reflector, the inorganic filler and the white pigment are preferably subjected to a surface treatment by either or both of a fatty acid and a coupling agent. (release agent)

光反射體用成形材料可含有脫模劑。脫模劑含有譬如選自於由脂肪酸系蠟、脂肪酸金屬鹽系蠟及礦物系蠟所構成群組中之1種以上之蠟。尤其,脫模劑宜含有耐熱變色性優異的脂肪酸系蠟及脂肪酸金屬鹽系蠟中之任一者或兩者。較具體而言,脫模劑含有譬如選自於由硬脂酸、硬脂酸鋅、硬脂酸鋁及硬脂酸鈣所構成群組中之1種以上之蠟。The molding material for a light reflector may contain a mold release agent. The release agent contains, for example, one or more selected from the group consisting of a fatty acid wax, a fatty acid metal salt wax, and a mineral wax. In particular, the release agent preferably contains either or both of a fatty acid wax and a fatty acid metal salt wax which are excellent in heat discoloration resistance. More specifically, the release agent contains, for example, one or more selected from the group consisting of stearic acid, zinc stearate, aluminum stearate, and calcium stearate.

相對於熱硬化性樹脂100質量份,脫模劑含量宜在4質量份以上且15質量份以下之範圍內。此時,光反射體1具有從模具脫模的良好脫模性,也具有優異的外觀,並可具有特別高的光反射性。 (橡膠粒子)The content of the releasing agent is preferably in the range of 4 parts by mass or more and 15 parts by mass or less based on 100 parts by mass of the thermosetting resin. At this time, the light reflector 1 has a good mold release property from the mold, and also has an excellent appearance and can have particularly high light reflectivity. (rubber particles)

光反射體用成形材料可含有橡膠粒子13。如圖8示意顯示,橡膠粒子13具有內核外殼結構。亦即,橡膠粒子13具備內核部14及外殼部15。內核部14及外殼部15中之任一者或兩者具有彈性即可。換言之,可以是內核部14及外殼部15兩者由可彈性變形之樹脂形成,也可以是內核部14由可彈性變形之樹脂形成且外殼部15由可塑性變形之樹脂形成,或可以是內核部14由可塑性變形之樹脂形成且外殼部15由可彈性變形之樹脂形成。光反射體1若是以這種含有內核外殼型橡膠粒子13之光反射體用成形材料製作而成,光反射體1便可被低彈性化,從而可具有高韌性。The molding material for a light reflector may contain rubber particles 13. As schematically shown in Fig. 8, the rubber particles 13 have a core outer shell structure. That is, the rubber particles 13 include the core portion 14 and the outer shell portion 15. Either or both of the core portion 14 and the outer casing portion 15 may have elasticity. In other words, both the core portion 14 and the outer casing portion 15 may be formed of an elastically deformable resin, or the core portion 14 may be formed of an elastically deformable resin and the outer casing portion 15 may be formed of a plastically deformable resin, or may be a core portion. 14 is formed of a plastically deformable resin and the outer casing portion 15 is formed of an elastically deformable resin. When the light reflector 1 is made of the molding material for the light reflector containing the core-shell type rubber particles 13, the light reflector 1 can be made low in elasticity and can have high toughness.

亦可以是內核部14由可塑性變形之樹脂形成且外殼部15由可彈性變形之樹脂形成。理想係內核部14由可彈性變形之樹脂形成。藉此可進一步提高光反射體1之抗衝擊性及韌性,進而可抑制光反射體1上產生裂痕。可彈性變形之樹脂的具體例可舉如具有三維交聯結構或二維交聯結構之樹脂。具有三維交聯結構之樹脂的具體例可舉如:於熱硬化性樹脂加入交聯劑及因應需求之充填材進行交聯反應而成的聚合物。具有二維交聯結構之樹脂的具體例可舉如:於熱可塑性樹脂加入成核劑及因應需求之充填材進行交聯反應而成的聚合物。較理想係內核部14及外殼部15兩者皆具彈性。It is also possible that the core portion 14 is formed of a plastically deformable resin and the outer casing portion 15 is formed of an elastically deformable resin. The ideal core portion 14 is formed of an elastically deformable resin. Thereby, the impact resistance and toughness of the light reflector 1 can be further improved, and cracks in the light reflector 1 can be suppressed. Specific examples of the elastically deformable resin include a resin having a three-dimensional crosslinked structure or a two-dimensional crosslinked structure. Specific examples of the resin having a three-dimensional crosslinked structure include a polymer obtained by adding a crosslinking agent to a thermosetting resin and crosslinking reaction according to a desired filling material. Specific examples of the resin having a two-dimensional crosslinked structure include a polymer obtained by adding a nucleating agent to a thermoplastic resin and crosslinking reaction according to a desired filler. More preferably, both the core portion 14 and the outer casing portion 15 are flexible.

理想係內核部14為粒狀橡膠。內核部14宜含有選自於由聚矽氧橡膠、丙烯酸橡膠及丁二烯橡膠所構成群組中之1種以上成分。尤其,內核部14含有聚矽氧橡膠時,也會提高光反射體1之耐候性及抗衝擊性。又,內核部14含有丙烯酸橡膠時,可提高光反射體用成形材料於成形時之流動性,又能提高光反射體1之耐藥性。另,內核部14含有丁二烯橡膠時,也會提高光反射體1的抗衝擊性。The ideal core portion 14 is a granular rubber. The core portion 14 preferably contains one or more components selected from the group consisting of polyoxyxene rubber, acrylic rubber, and butadiene rubber. In particular, when the core portion 14 contains polyoxyxene rubber, the weather resistance and impact resistance of the light reflector 1 are also improved. Further, when the core portion 14 contains acrylic rubber, the fluidity of the molding material for a light reflector can be improved at the time of molding, and the chemical resistance of the light reflector 1 can be improved. Further, when the core portion 14 contains butadiene rubber, the impact resistance of the light reflector 1 is also improved.

外殼部15覆蓋著內核部14。外殼部15宜具有官能基。外殼部15宜由多個具有官能基之接枝鏈16構成。各接枝鏈16之其一端部鍵結於內核部14表面。官能基宜位於接枝鏈16中之未鍵結於內核部14之側的端部。外殼部15宜對熱硬化性樹脂具有反應性。亦即,外殼部15宜可與熱硬化性樹脂起反應進行化學鍵結。此時,若使光反射體用成形材料硬化來製作光反射體1,外殼部15會和熱硬化性樹脂起反應而進行化學鍵結。使光反射體用成形材料硬化時,即使外殼部15不與熱硬化性樹脂起反應,外殼部15也和熱硬化性樹脂具有高親和性。所以,橡膠粒子13在光反射體1內會透過與熱硬化性樹脂硬化所形成之樹脂相行化學鍵結或是與該樹脂相之高親和性而密著。因此,樹脂相與橡膠粒子13間之應力容易被分散,且不易在樹脂相與橡膠粒子13之界面發生剝離。因此可提高光反射體1之抗衝擊性。因為外殼部15對熱硬化性樹脂具有反應性,所以外殼部15具有之官能基宜對熱硬化性樹脂具有反應性,也就是宜能與熱硬化性樹脂起反應進行化學鍵結。官能基可含有譬如選自於由甲基丙烯醯基、丙烯醯基、乙烯基、環氧基、胺基、脲基(carbamide)、脲基(ureide)、巰基、異氰酸酯基及羧基所構成群組中之1種以上之基。熱硬化性樹脂為不飽和聚酯樹脂時,官能基宜對不飽和聚酯樹脂中之不飽和雙鍵具有反應性,尤其宜含有甲基丙烯醯基及丙烯醯基中之任一者或兩者。熱硬化性樹脂為環氧樹脂時,官能基宜對環氧基具有反應性,尤其宜含有羧基及胺基中之任一者或兩者。The outer casing portion 15 covers the inner core portion 14. The outer casing portion 15 preferably has a functional group. The outer casing portion 15 is preferably composed of a plurality of graft chains 16 having functional groups. One end portion of each of the graft chains 16 is bonded to the surface of the core portion 14. The functional group is preferably located at the end of the graft chain 16 that is not bonded to the side of the core portion 14. The outer shell portion 15 is preferably reactive with a thermosetting resin. That is, the outer casing portion 15 is preferably reactive with the thermosetting resin for chemical bonding. At this time, when the light reflector is cured by the molding material to form the light reflector 1, the outer shell portion 15 reacts with the thermosetting resin to perform chemical bonding. When the light reflector is cured by the molding material, the outer shell portion 15 has high affinity with the thermosetting resin even if the outer shell portion 15 does not react with the thermosetting resin. Therefore, the rubber particles 13 are chemically bonded to the resin formed by curing the thermosetting resin in the light reflecting body 1 or adhered to the resin phase with high affinity. Therefore, the stress between the resin phase and the rubber particles 13 is easily dispersed, and peeling at the interface between the resin phase and the rubber particles 13 is less likely to occur. Therefore, the impact resistance of the light reflector 1 can be improved. Since the outer shell portion 15 is reactive with the thermosetting resin, the functional group of the outer shell portion 15 is preferably reactive with the thermosetting resin, that is, it is preferably reactive with the thermosetting resin for chemical bonding. The functional group may contain, for example, a group selected from the group consisting of methacryloyl fluorenyl, acryl fluorenyl, vinyl, epoxy, amine, carbamide, ureide, sulfhydryl, isocyanate, and carboxyl groups. One or more groups in the group. When the thermosetting resin is an unsaturated polyester resin, the functional group is preferably reactive with an unsaturated double bond in the unsaturated polyester resin, and particularly preferably contains either or both of a methacryl fluorenyl group and an acryl fluorenyl group. By. When the thermosetting resin is an epoxy resin, the functional group is preferably reactive with an epoxy group, and it is particularly preferred to contain either or both of a carboxyl group and an amine group.

橡膠粒子13之平均粒徑宜在0.1μm以上且1mm以下之範圍內。橡膠粒子13之平均粒徑若為0.1μm以上,便能進一步提高光反射體1之抗衝擊性。橡膠粒子13之平均粒徑若為1mm以下,橡膠粒子13在光反射體用成形材料中便可輕易地均勻分散,在光反射體1中也容易均勻分散。The average particle diameter of the rubber particles 13 is preferably in the range of 0.1 μm or more and 1 mm or less. When the average particle diameter of the rubber particles 13 is 0.1 μm or more, the impact resistance of the light reflector 1 can be further improved. When the average particle diameter of the rubber particles 13 is 1 mm or less, the rubber particles 13 can be easily and uniformly dispersed in the molding material for a light reflector, and the light reflector 1 can be easily dispersed uniformly.

相對於光反射體用成形材料總量,橡膠粒子13含量宜在0.1質量%以上且30質量%以下之範圍內,較宜在0.1質量%以上且低於22質量%之範圍內。藉此,即使光反射體1有厚度較小的部分,也不易在成形時因未充填而發生不良情況。亦即,可提高光反射體用成形材料之薄壁充填性。此外,藉由橡膠粒子13含量在上述範圍內,可獲得耐熱變色性良好且高韌性的光反射體1。The content of the rubber particles 13 is preferably in the range of 0.1% by mass or more and 30% by mass or less, and more preferably 0.1% by mass or more and less than 22% by mass, based on the total amount of the molding material for the light reflector. Thereby, even if the light reflector 1 has a small thickness portion, it is difficult to cause a defect due to the unfilling at the time of molding. That is, the thin wall filling property of the molding material for a light reflector can be improved. Further, by the content of the rubber particles 13 being in the above range, the light reflector 1 having excellent heat discoloration resistance and high toughness can be obtained.

理想係橡膠粒子13在25℃下之彈性模數為1GPa以下。藉此可進一步提高光反射體1之韌性。另,橡膠粒子13在25℃下之彈性模數可利用JIS K 6254中規定之方法來測定。The elastic modulus of the ideal rubber particles 13 at 25 ° C is 1 GPa or less. Thereby, the toughness of the light reflector 1 can be further improved. Further, the elastic modulus of the rubber particles 13 at 25 ° C can be measured by the method specified in JIS K 6254.

此外,光反射體1中有無橡膠粒子13譬如可以氣相層析質量分析法(GC/MS)及傅立葉轉換紅外光譜法(FT-IR)中之任一方法或將該等方法加以組合來進行確認。橡膠粒子13之內核部14含有聚矽氧橡膠時,利用熱脫附之環狀矽氧烷的定性及定量分析較為有效。亦即,譬如在250℃下將光反射體1之試料加熱3分鐘並將所產生之氣體注入氣相層析質量分析裝置後,分析所檢測之環狀矽氧烷的定性及進行甲苯換算的半定量。藉此可輕易確認內核部14有無含有聚矽氧橡膠的橡膠粒子13。內核部14含有丙烯酸橡膠或丁二烯橡膠時,則可利用紅外線光譜法(IR)確認橡膠粒子13之有無。 (白色纖維材)Further, the presence or absence of the rubber particles 13 in the light reflector 1 may be performed by any one of gas chromatography mass spectrometry (GC/MS) and Fourier transform infrared spectroscopy (FT-IR) or a combination of the methods. confirm. When the core portion 14 of the rubber particles 13 contains polyoxyxene rubber, qualitative and quantitative analysis using a thermally desorbed cyclic siloxane is effective. That is, for example, after heating the sample of the light reflector 1 at 250 ° C for 3 minutes and injecting the generated gas into the gas chromatography mass spectrometer, the qualitative analysis of the detected cyclic oxirane and the conversion to toluene are performed. Semiquantitative. Thereby, it can be easily confirmed whether or not the core portion 14 has the rubber particles 13 containing the polyoxyethylene rubber. When the core portion 14 contains acrylic rubber or butadiene rubber, the presence or absence of the rubber particles 13 can be confirmed by infrared spectroscopy (IR). (white fiber)

如上述,光反射體用成形材料含有白色纖維材。纖維材為白色意指纖維材不會在可見光波長區域之400nm以上且700nm以下之範圍內,選擇性地吸收或反射特定波長區域之光。具體上,白色纖維材在波長區域400nm以上且700nm以下之分光反射率的變化率宜為20%以下,10%以下較佳。分光反射率的變化率係從波長區域400nm以上且700nm以下之分光反射率的最高反射率之值「A(%)」及最低反射率之值「B(%)」,利用{(A-B)/A}×100(%)算式算出之值。另,白色纖維材宜為矽灰石等天然物或礦物,而非玻璃纖維等人工製品。這類的天然物及礦物因其表面複雜,而比起玻璃纖維形成有較細微的凹凸,所以更容易使入射光在其表面無規擴散(也就是看起來比玻璃纖維更白)。As described above, the molding material for a light reflector contains a white fiber material. The fact that the fiber material is white means that the fiber material does not selectively absorb or reflect light of a specific wavelength region in the range of 400 nm or more and 700 nm or less in the visible light wavelength region. Specifically, the rate of change of the spectral reflectance of the white fiber material in the wavelength region of 400 nm or more and 700 nm or less is preferably 20% or less, and preferably 10% or less. The rate of change of the spectral reflectance is the value of the highest reflectance "A (%)" and the minimum reflectance "B (%)" of the spectral reflectance from 400 nm to 700 nm in the wavelength region, and {(AB)/ A} × 100 (%) Calculated value. In addition, the white fiber material is preferably a natural product or mineral such as ash stone, not an artificial product such as glass fiber. Such natural materials and minerals are more likely to cause incident light to spread randomly on the surface (i.e., appear whiter than glass fibers) because of its complex surface and finer concavities and convexities than glass fibers.

比起以人為方法形成為纖維狀之玻璃纖維的人工製品,藉由使用由天然物或礦物所構成之纖維狀材料,可大幅減低光反射體1的漏光現象。此乃因為天然物或礦物表面具有複雜的凹凸形狀,所以光不易通過天然物或礦物內部所致。By using an artificial material formed of a fibrous glass fiber by an artificial method, by using a fibrous material composed of a natural material or a mineral, light leakage of the light reflecting body 1 can be greatly reduced. This is because the surface of the natural or mineral has a complex concave and convex shape, so the light is not easily caused by the natural or mineral interior.

白色纖維材之平均纖維徑長宜在0.1μm以上且30μm以下之範圍內,0.3μm以上且20μm以下之範圍內較佳。白色纖維材之平均纖維長度宜在5μm以上且400μm以下之範圍內,50μm以上且150μm以下之範圍內較佳。白色纖維材之平均纖維長度會影響光反射體1的強度,所以與光反射體1尺寸相符者更佳。亦即,白色纖維材之平均纖維長度的理想範圍,以光反射體1之第1成形部101大小為可容置於如圖2A及圖2B所示X101 (0.3~0.4mm)×Y1 (2.8~3.2mm)×Z1 (0.25~0.40mm)之空間內之程度大小的情況特別有效。另,白色纖維材的平均纖維徑長及平均纖維長度分別係將白色纖維材之電子顯微鏡照片進行影像處理所得纖維徑長及纖維長度的算術平均值。The average fiber diameter of the white fiber material is preferably in the range of 0.1 μm or more and 30 μm or less, and preferably 0.3 μm or more and 20 μm or less. The average fiber length of the white fiber material is preferably in the range of 5 μm or more and 400 μm or less, and preferably in the range of 50 μm or more and 150 μm or less. The average fiber length of the white fiber material affects the strength of the light reflector 1, so that it is more suitable for the size of the light reflector 1. That is, the ideal range of the average fiber length of the white fiber material is such that the size of the first forming portion 101 of the light reflecting body 1 can be accommodated as shown in FIG. 2A and FIG. 2B as X 101 (0.3 to 0.4 mm) × Y 1 The degree of the space in (2.8~3.2mm) × Z 1 (0.25~0.40mm) is particularly effective. Further, the average fiber diameter and the average fiber length of the white fiber material are the arithmetic mean values of the fiber diameter and the fiber length obtained by subjecting the electron microscope photograph of the white fiber material to image processing.

白色纖維材之長寬比係以平均纖維長度相對於平均纖維徑長之比值為定義。白色纖維材之長寬比宜在3以上且500以下之範圍內,較宜在3以上且20以下之範圍內。此時,可有效提升光反射體1的強度,且能有效抑制去毛邊處理後之光反射體1的表面粗糙。The aspect ratio of the white fiber material is defined by the ratio of the average fiber length to the average fiber diameter. The aspect ratio of the white fiber material is preferably in the range of 3 or more and 500 or less, and more preferably in the range of 3 or more and 20 or less. At this time, the strength of the light reflector 1 can be effectively improved, and the surface roughness of the light reflector 1 after the burring treatment can be effectively suppressed.

白色纖維材宜含有矽灰石。此時,光反射體1的光反射性及強度會變得特別高。矽灰石係以化學式CaSiO3 表示,亦稱偏矽酸鈣。矽灰石之平均纖維徑長宜在1μm以上且125μm以下之範圍內。矽灰石之平均纖維長度宜在20μm以上且500μm以下之範圍內。矽灰石之長寬比宜在3以上且20以下之範圍內。The white fiber material preferably contains limestone. At this time, the light reflectivity and strength of the light reflector 1 are extremely high. The ash stone is represented by the chemical formula CaSiO 3 , also known as calcium metasilicate. The average fiber diameter of the limestone is preferably in the range of 1 μm or more and 125 μm or less. The average fiber length of the limestone is preferably in the range of 20 μm or more and 500 μm or less. The aspect ratio of the limestone is preferably in the range of 3 or more and 20 or less.

白色纖維材亦可含有矽灰石以外之成分。矽灰石以外之成分包含矽灰石以外之無機系或電絕緣性的纖維及晶鬚。這類的纖維及晶鬚即使添加量少,也能有效提高光反射體1的強度。The white fiber material may also contain components other than the limestone. The components other than the ash stone include inorganic or electrically insulating fibers and whiskers other than ash. Such fibers and whiskers can effectively increase the strength of the light reflector 1 even when the amount of addition is small.

譬如,白色纖維材可含有鈦酸鉀。鈦酸鉀之平均纖維徑長宜在0.1μm以上且1μm以下之範圍內,較宜在0.3μm以上且0.6μm以下之範圍內。鈦酸鉀之平均纖維長度宜在5μm以上且100μm以下之範圍內,較宜在10μm以上且20μm以下之範圍內。鈦酸鉀之平均纖維徑長在0.3μm以上且0.6μm以下之範圍內且平均纖維長度在10μm以上且20μm以下之範圍內時,光反射體用成形材料可具有特別良好的成形性。For example, the white fiber material may contain potassium titanate. The average fiber diameter of potassium titanate is preferably in the range of 0.1 μm or more and 1 μm or less, and more preferably in the range of 0.3 μm or more and 0.6 μm or less. The average fiber length of potassium titanate is preferably in the range of 5 μm or more and 100 μm or less, and more preferably in the range of 10 μm or more and 20 μm or less. When the average fiber diameter of potassium titanate is in the range of 0.3 μm or more and 0.6 μm or less and the average fiber length is in the range of 10 μm or more and 20 μm or less, the molding material for a light reflector can have particularly excellent formability.

白色纖維材亦可含有氧化鋁系填料。氧化鋁系填料含針狀軟水鋁石。針狀軟水鋁石之平均纖維徑長宜在0.1μm以上且10μm以下之範圍內,較宜在0.4μm以上且2μm以下之範圍內。針狀軟水鋁石之平均纖維長度宜在1μm以上且20μm以下之範圍內,較宜在2μm以上且10μm以下之範圍內。針狀軟水鋁石之長寬比宜在10以上且100以下之範圍內,較宜在30以上且50以下之範圍內。針狀軟水鋁石之平均纖維徑長在0.4μm以上且2μm以下之範圍內且長寬比在30以上且50以下之範圍內時,光反射體用成形材料可具有特別良好的成形性。The white fibrous material may also contain an alumina-based filler. The alumina-based filler contains acicular boehmite. The average fiber diameter of the acicular boehmite is preferably in the range of 0.1 μm or more and 10 μm or less, and more preferably in the range of 0.4 μm or more and 2 μm or less. The average fiber length of the acicular boehmite is preferably in the range of 1 μm or more and 20 μm or less, and more preferably in the range of 2 μm or more and 10 μm or less. The aspect ratio of the acicular boehmite is preferably in the range of 10 or more and 100 or less, more preferably in the range of 30 or more and 50 or less. When the average fiber diameter of the acicular boehmite is in the range of 0.4 μm or more and 2 μm or less and the aspect ratio is in the range of 30 or more and 50 or less, the molding material for a light reflector can have particularly excellent moldability.

白色纖維材亦可含有碳化矽晶鬚。光反射體1若含有碳化矽晶鬚,即可具有高導熱性及放熱性。碳化矽晶鬚之平均纖維徑長宜在0.2μm以上且2μm以下之範圍內。碳化矽晶鬚之平均纖維長度宜在2μm以上且200μm以下之範圍內。尤其當碳化矽晶鬚之平均纖維徑長在0.45μm以上且0.6μm以下之範圍內且長寬比在30以上且50以下之範圍內時,光反射體用成形材料可具有特別良好的成形性。The white fiber material may also contain strontium carbide whiskers. When the light reflector 1 contains strontium carbide whiskers, it has high thermal conductivity and heat dissipation. The average fiber diameter of the niobium carbide whisker is preferably in the range of 0.2 μm or more and 2 μm or less. The average fiber length of the strontium carbide whiskers is preferably in the range of 2 μm or more and 200 μm or less. In particular, when the average fiber diameter of the cerium carbide whisker is in the range of 0.45 μm or more and 0.6 μm or less and the aspect ratio is in the range of 30 or more and 50 or less, the forming material for the light reflecting body can have particularly good formability. .

纖維材亦可含有選自於由氮化矽晶鬚、高鋁紅柱石、高鋁紅柱石・δ氧化鋁(Al2 O3 :SiO2 =72:28)及α・δ氧化鋁(Al2 O3 :SiO2 =95:5)所構成群組中之1種以上。氮化矽晶鬚之平均纖維徑長宜在0.1μm以上且1.6μm以下之範圍內。氮化矽晶鬚之平均纖維長度宜在5μm以上且200μm以下之範圍內。高鋁紅柱石之平均纖維徑長宜在0.1μm以上且10μm以下之範圍內。高鋁紅柱石之平均纖維長度宜在10μm以上且100μm以下之範圍內。高鋁紅柱石・δ氧化鋁之平均纖維徑長宜在2μm以上且10μm以下之範圍內。高鋁紅柱石・δ氧化鋁之平均纖維長度宜在10μm以上且100μm以下之範圍內。α・δ氧化鋁之平均纖維徑長宜在2μm以上且10μm以下之範圍內。α・δ氧化鋁之平均纖維長度宜在10μm以上且100μm以下之範圍內。The fibrous material may also be selected from the group consisting of cerium nitride whiskers, mullite, mullite, δ alumina (Al 2 O 3 : SiO 2 = 72: 28), and α δ alumina (Al 2 O 3 : SiO 2 = 95: 5) One or more of the groups formed. The average fiber diameter of the tantalum nitride whisker is preferably in the range of 0.1 μm or more and 1.6 μm or less. The average fiber length of the tantalum nitride whisker is preferably in the range of 5 μm or more and 200 μm or less. The average fiber diameter of the mullite is preferably in the range of 0.1 μm or more and 10 μm or less. The average fiber length of the mullite is preferably in the range of 10 μm or more and 100 μm or less. The average fiber diameter of the mullite and the δ alumina is preferably in the range of 2 μm or more and 10 μm or less. The average fiber length of the mullite and the δ alumina is preferably in the range of 10 μm or more and 100 μm or less. The average fiber diameter of α·δ alumina is preferably in the range of 2 μm or more and 10 μm or less. The average fiber length of the α·δ alumina is preferably in the range of 10 μm or more and 100 μm or less.

白色纖維材亦可含有鹼性硫酸鎂及碳酸鈣中之至少一者。尤其是碳酸鈣具有良好的耐鹼性,且可以低成本取得。鹼性硫酸鎂之平均纖維徑長宜在0.5μm以上且1μm以下之範圍內。鹼性硫酸鎂之平均纖維長度宜在10μm以上且30μm以下之範圍內。碳酸鈣之平均纖維徑長宜在0.5μm以上且1μm以下之範圍內。碳酸鈣之平均纖維長度宜在10μm以上且30μm以下之範圍內。The white fibrous material may also contain at least one of basic magnesium sulfate and calcium carbonate. In particular, calcium carbonate has good alkali resistance and can be obtained at low cost. The average fiber diameter of the alkaline magnesium sulfate is preferably in the range of 0.5 μm or more and 1 μm or less. The average fiber length of the alkaline magnesium sulfate is preferably in the range of 10 μm or more and 30 μm or less. The average fiber diameter of the calcium carbonate is preferably in the range of 0.5 μm or more and 1 μm or less. The average fiber length of the calcium carbonate is preferably in the range of 10 μm or more and 30 μm or less.

白色纖維材亦可含有AMTEC Co.,Ltd.製造稱為Pana-Tetra(註冊商標)的Tetrapod(四腳,註冊商標)狀氧化鋅。該Tetrapod(四腳,註冊商標)狀氧化鋅之針狀部分的平均纖維長度宜在10μm以上且20μm以下之範圍內。The white fiber material may also contain a Tetrapod (four-legged, registered trademark)-like zinc oxide called Pana-Tetra (registered trademark) manufactured by AMTEC Co., Ltd. The average fiber length of the acicular portion of the Tetrapod (four-legged, registered trademark)-like zinc oxide is preferably in the range of 10 μm or more and 20 μm or less.

白色纖維材亦可含有水合矽酸鎂、鈦酸鉀纖維等各種陶瓷纖維。The white fiber material may also contain various ceramic fibers such as hydrated magnesium silicate or potassium titanate fiber.

白色纖維材可僅含有上述列舉之多種成分中之1種成分,亦可含有2種以上成分。白色纖維材若含有2種以上成分,可善加組合成分彼此的特性。The white fiber material may contain only one of the above-exemplified components, and may contain two or more components. When the white fiber material contains two or more kinds of components, the characteristics of the components can be combined well.

白色纖維材宜業經矽烷耦合劑處理。以矽烷耦合劑處理白色纖維材表面之方法具體例可舉如乾式法、濕式法。根據乾式法,可在短時間內大量獲得業經矽烷耦合劑處理的白色纖維材,生產性變高。根據濕式法,則可以矽烷耦合劑均勻地處理白色纖維材表面。The white fiber material is treated with a decane coupling agent. Specific examples of the method of treating the surface of the white fibrous material with a decane coupling agent include a dry method and a wet method. According to the dry method, a large amount of white fiber material treated with a decane coupling agent can be obtained in a short time, and productivity is high. According to the wet method, the surface of the white fiber material can be uniformly treated with a decane coupling agent.

針對矽烷耦合劑之具體例,分成熱硬化性樹脂含有不飽和聚酯樹脂之情況及熱硬化性樹脂含有環氧樹脂之情況來加以說明。Specific examples of the decane coupling agent will be described in the case where the thermosetting resin contains an unsaturated polyester resin and the case where the thermosetting resin contains an epoxy resin.

熱硬化性樹脂含有不飽和聚酯樹脂時,矽烷耦合劑宜含有選自於由環氧基矽烷、乙烯基矽烷、甲基丙烯醯基矽烷、三甲基矽烷、丙烯醯基矽烷及胺基矽烷所構成群組中之1種以上成分。該等中,矽烷耦合劑尤宜含有甲基丙烯醯基矽烷及丙烯醯基矽烷中之至少一者。較具體而言,矽烷耦合劑宜含有3-甲基丙烯醯氧基丙基三甲氧基矽烷及3-丙烯醯氧基丙基三甲氧基矽烷中之至少一者。此時,光反射體1可具有特別高的強度。When the thermosetting resin contains an unsaturated polyester resin, the decane coupling agent preferably contains a solvent selected from the group consisting of epoxy decane, vinyl decane, methacryl decyl decane, trimethyl decane, acryl decyl decane and amino decane. One or more components in the group. Among these, the decane coupling agent particularly preferably contains at least one of methacryl decyl decane and acryl decyl decane. More specifically, the decane coupling agent preferably contains at least one of 3-methacryloxypropyltrimethoxydecane and 3-propenyloxypropyltrimethoxydecane. At this time, the light reflector 1 can have a particularly high strength.

熱硬化性樹脂含有環氧樹脂時,矽烷耦合劑宜含有選自於由環氧基矽烷、胺基矽烷、異氰酸酯及巰基矽烷所構成群組中之1種以上成分。矽烷耦合劑尤宜含有3-胺丙基三甲氧基矽烷。此時,光反射體1可具有特別高的強度。When the thermosetting resin contains an epoxy resin, the decane coupling agent preferably contains one or more components selected from the group consisting of epoxy decane, amino decane, isocyanate, and decyl decane. The decane coupling agent particularly preferably contains 3-aminopropyltrimethoxydecane. At this time, the light reflector 1 can have a particularly high strength.

相對於熱硬化性樹脂100質量份,光反射體用成形材料中之白色纖維材含量宜在10質量份以上且240質量份以下之範圍內。白色纖維材含量若在10質量份以上,光反射體1即可具有特別高的強度。尤其,不飽和聚酯樹脂於硬化時的收縮很大,所以光反射體用成形材料中含有不飽和聚酯樹脂時,藉由含有10質量份以上之白色纖維材,可抑制硬化收縮。白色纖維材含量若在240質量份以下,可抑制成形品之薄壁充填性降低。白色纖維材含量在50質量份以上且100質量份以下之範圍內較佳。The content of the white fiber material in the molding material for a light reflector is preferably in the range of 10 parts by mass or more and 240 parts by mass or less based on 100 parts by mass of the thermosetting resin. When the content of the white fiber material is 10 parts by mass or more, the light reflector 1 can have a particularly high strength. In particular, when the unsaturated polyester resin is contained in the molding material for the light reflector, the unsaturated polyester resin contains 10 parts by mass or more of the white fiber material, whereby the hardening shrinkage can be suppressed. When the content of the white fiber material is 240 parts by mass or less, the decrease in the thin wall filling property of the molded article can be suppressed. The content of the white fiber material is preferably in the range of 50 parts by mass or more and 100 parts by mass or less.

白色纖維材有無業經矽烷耦合劑處理可利用紅外線光譜法(IR)確認。此外,截斷光反射體1之試料後,可利用掃描型電子顯微鏡(SEM)等觀察斷裂面來確認白色纖維材有無業經矽烷耦合劑處理。 (其他成分)Whether the white fiber material is treated with a decane coupling agent can be confirmed by infrared spectroscopy (IR). Further, after the sample of the light reflector 1 is cut off, the fracture surface can be observed by a scanning electron microscope (SEM) or the like to confirm whether or not the white fiber material is treated with a decane coupling agent. (other ingredients)

光反射體用成形材料可含有白色纖維材以外之纖維狀充填材(補強材),亦可不含補強材。另,補強材係不含於上述充填材中之成分。光反射體用成形材料含有補強材時,相對於熱硬化性樹脂100質量份,補強材含量宜在3質量份以上且50質量份以下之範圍內。The molding material for a light reflector may contain a fibrous filler (reinforcing material) other than a white fiber material, or may not contain a reinforcing material. In addition, the reinforcing material is not contained in the above filler. When the molding material for a light reflector contains a reinforcing material, the content of the reinforcing material is preferably in the range of 3 parts by mass or more and 50 parts by mass or less based on 100 parts by mass of the thermosetting resin.

補強材之平均纖維徑長宜在5μm以上且15μm以下之範圍內,6μm以上且13μm以下之範圍內較佳。此時,光反射體1之強度會變得特別高。補強材之平均纖維長度愈小愈佳,如0.5mm以下、0.2mm以下、0.1mm以下、0.05mm以下。平均纖維長度較長的補強材具優異的處置性,所以譬如就起始原料而言,亦可使用平均纖維長度在0.5mm以上且3mm以下之補強材。此時,即使是平均纖維長度為0.5mm以上且3mm以下之補強材,亦可藉由在捏合步驟(後述)中予以切斷,而將平均纖維長度縮短至0.5mm以下、0.2mm以下、0.1mm以下、0.05mm以下中之任一者。而且,在捏合步驟中可利用熱硬化性樹脂來濕濡補強材之切斷面,來提高補強材與熱硬化性樹脂之密著強度。如此一來,在捏合步驟中藉由纖維狀充填材之平均纖維長度短至0.5mm以下,可特別提高光反射體1之強度,且可特別提升光反射體1之光反射率。補強材之平均纖維徑長及平均纖維長度皆係將補強材之電子顯微鏡照片進行影像處理而取得的纖維徑長及纖維長度之算術平均值。The average fiber diameter of the reinforcing material is preferably in the range of 5 μm or more and 15 μm or less, and preferably in the range of 6 μm or more and 13 μm or less. At this time, the intensity of the light reflector 1 becomes extremely high. The smaller the average fiber length of the reinforcing material, the better, such as 0.5 mm or less, 0.2 mm or less, 0.1 mm or less, and 0.05 mm or less. The reinforcing material having a long average fiber length has excellent handleability. Therefore, for the starting material, for example, a reinforcing material having an average fiber length of 0.5 mm or more and 3 mm or less may be used. In this case, even if the reinforcing material has an average fiber length of 0.5 mm or more and 3 mm or less, the average fiber length can be shortened to 0.5 mm or less, 0.2 mm or less, or 0.1 by cutting in a kneading step (described later). Any of mm or less and 0.05 mm or less. Further, in the kneading step, the thermosetting resin can be used to wet the cut surface of the reinforcing material to improve the adhesion strength between the reinforcing material and the thermosetting resin. In this way, in the kneading step, the average fiber length of the fibrous filler is as short as 0.5 mm or less, whereby the strength of the light reflector 1 can be particularly enhanced, and the light reflectance of the light reflector 1 can be particularly enhanced. The average fiber diameter and the average fiber length of the reinforcing material are the arithmetic mean values of the fiber diameter and the fiber length obtained by image processing the electron micrograph of the reinforcing material.

補強材亦可含有用於製造纖維強化塑膠(FRP)的材料。纖維強化塑膠之具體例可舉如塊狀模料(BMC)及片狀模料(SMC)。譬如,補強材含有選自於由玻璃纖維、維尼綸纖維、芳醯胺纖維及聚酯纖維所構成群組中之1種以上成分。The reinforcing material may also contain materials for the manufacture of fiber reinforced plastic (FRP). Specific examples of the fiber-reinforced plastics include a bulk molding compound (BMC) and a sheet molding material (SMC). For example, the reinforcing material contains one or more components selected from the group consisting of glass fibers, vinylon fibers, linalyl fibers, and polyester fibers.

光反射體用成形材料尤宜不含玻璃纖維。即使光反射體用成形材料含有玻璃纖維,相對於光反射體用成形材料總量,玻璃纖維含量也宜在10質量%以下。此時,藉由大幅減少玻璃纖維可能形成之光通道,可特別提升光反射體1之光反射性,所以即使光反射體1具有厚度較小的部分,光反射體1也能具有高度的光反射性。The forming material for the light reflector is particularly preferably free of glass fibers. Even if the molding material for a light reflector contains glass fibers, the glass fiber content is preferably 10% by mass or less based on the total amount of the molding materials for the light reflector. In this case, the light reflectivity of the light reflector 1 can be particularly improved by greatly reducing the light path that the glass fiber may form. Therefore, even if the light reflector 1 has a small thickness portion, the light reflector 1 can have a high degree of light. Reflective.

除了上述成分以外,光反射體用成形材料亦可含有聚合抑制劑、著色劑、增黏劑、阻燃劑、可撓性賦予劑等適宜的添加劑。 (光反射體用成形材料之彎曲特性)In addition to the above components, the molding material for a light reflector may contain a suitable additive such as a polymerization inhibitor, a colorant, a tackifier, a flame retardant, and a flexibility imparting agent. (Bending characteristics of a molding material for a light reflector)

光反射體用成形材料之硬化物在25℃下之彎曲強度宜為70MPa以上。利用白色纖維材且宜利用業經矽烷耦合劑處理的白色纖維材,較容易獲得這麼大的彎曲強度。藉此,可進一步提高光反射體1之強度。The cured product of the molding material for a light reflector preferably has a bending strength at 25 ° C of 70 MPa or more. It is easier to obtain such a large bending strength by using a white fiber material and using a white fiber material which is treated with a decane coupling agent. Thereby, the strength of the light reflector 1 can be further improved.

光反射體用成形材料之硬化物在25℃下之彎曲彈性模數宜在4GPa以上且15GPa以下之範圍內。光反射體用成形材料含有具備內核部14及外殼部15之橡膠粒子13時,藉其可輕易獲得上述範圍內之彎曲彈性模數。藉此,可進一步提高光反射體1之韌性。The cured elastic modulus of the molded material for a light reflector at 25 ° C is preferably in the range of 4 GPa or more and 15 GPa or less. When the molding material for a light reflector contains the rubber particles 13 including the core portion 14 and the outer shell portion 15, the bending elastic modulus in the above range can be easily obtained. Thereby, the toughness of the light reflector 1 can be further improved.

較宜係光反射體用成形材料之硬化物在25℃下之彎曲強度為70MPa以上,且光反射體用成形材料之硬化物在25℃下之彎曲彈性模數在4GPa以上且15GPa以下之範圍內。光反射體用成形材料同時含有白色纖維材(宜為業經矽烷耦合劑處理之白色纖維材)及具備內核部14及外殼部15之橡膠粒子13時,藉此可輕易獲得大的彎曲強度及上述範圍內之彎曲彈性模數。藉此,可進一步提高光反射體1之強度及韌性。It is preferable that the cured product of the molding material for a light reflector has a bending strength at 25 ° C of 70 MPa or more, and the cured product of the molded material for a light reflector has a bending elastic modulus at 25 ° C of 4 GPa or more and 15 GPa or less. Inside. When the molding material for a light reflector contains a white fiber material (preferably a white fiber material treated with a decane coupling agent) and rubber particles 13 having the core portion 14 and the outer shell portion 15, a large bending strength and the above can be easily obtained. The flexural modulus of elasticity in the range. Thereby, the strength and toughness of the light reflector 1 can be further improved.

光反射體用成形材料之製造方法 光反射體用成形材料之製造方法譬如包含下述製程:將含有熱硬化性樹脂及橡膠粒子13之混合物,在60℃以上且160℃以下範圍內之溫度加熱並同時予以捏合後,加工成粉狀、粒狀或顆粒狀。Method for Producing a Forming Material for a Light Reflector A method for producing a material for a light reflector includes, for example, a process in which a mixture containing a thermosetting resin and rubber particles 13 is heated at a temperature in a range of 60 ° C or more and 160 ° C or less. At the same time, it is kneaded and processed into powder, granules or granules.

較具體上,光反射體用成形材料之製造方法包含譬如以下步驟A1~步驟C1。More specifically, the manufacturing method of the molding material for a light reflector includes, for example, the following steps A1 to C1.

步驟A1係將上述熱硬化性樹脂及白色纖維材以及因應需求之聚合引發劑、充填材、脫模劑、橡膠粒子13等,分別以預定比率加以混合而獲得混合物。如上述,橡膠粒子13具備內核部14及覆蓋內核部14之外殼部15。混合譬如可使用混合器及攪拌機等混合機來進行。In the step A1, the thermosetting resin, the white fiber material, and the polymerization initiator, the filler, the release agent, the rubber particles 13, and the like are required to be mixed at a predetermined ratio to obtain a mixture. As described above, the rubber particles 13 include the core portion 14 and the outer shell portion 15 that covers the core portion 14. The mixing can be carried out, for example, using a mixer such as a mixer or a mixer.

步驟B1係將步驟A1中所得混合物在60℃以上且160℃以下範圍內之溫度下加熱並同時予以捏合。加熱溫度若低於60℃,步驟A1中所得混合物就會變固體狀或黏度非常高的液狀,恐對捏合作業性帶來不良影響。加熱溫度若超過160℃,步驟A1中所得混合物恐在捏合步驟中即引發熱聚合反應。捏合譬如可使用加壓捏揉機、加熱輥機、擠壓機等捏合機來進行。In the step B1, the mixture obtained in the step A1 is heated at a temperature in the range of 60 ° C or more and 160 ° C or less while kneading. When the heating temperature is lower than 60 ° C, the mixture obtained in the step A1 becomes a solid or a liquid having a very high viscosity, which may adversely affect the kneading property. If the heating temperature exceeds 160 ° C, the mixture obtained in the step A1 may cause thermal polymerization in the kneading step. The kneading can be carried out, for example, using a kneading machine such as a pressure kneader, a heating roll machine, or an extruder.

在步驟C1係將步驟B1中製得之加熱捏合後的混合物,加工成選自於由粉狀、粒狀及顆粒狀所構成群組中之1種以上形狀。該加工可使用適宜的造粒機、整粒機、製粒機等來進行。In the step C1, the heat-kneaded mixture obtained in the step B1 is processed into one or more shapes selected from the group consisting of powder, granules and granules. This processing can be carried out using a suitable granulator, granulator, granulator or the like.

光反射體 光反射體1含有光反射體用成形材料之硬化物。光反射體1具備周壁10及被周壁10包圍之凹處11。周壁10包含厚度100μm以下之部分。如上述,光反射體用成形材料含有熱硬化性樹脂及白色纖維材。如上述,光反射體1含有光反射體用成形材料之硬化物,且該光反射體用成形材料含有熱硬化性樹脂及白色纖維材。所以,即使光反射體1具有厚度較小的部分,儘管玻璃纖維含量少或不含玻璃纖維,也具高強度且高韌性。此外,光反射體1之耐熱變色性及光反射性良好。Light Reflector The light reflector 1 contains a cured product of a molded material for a light reflector. The light reflector 1 includes a peripheral wall 10 and a recess 11 surrounded by the peripheral wall 10. The peripheral wall 10 includes a portion having a thickness of 100 μm or less. As described above, the molding material for a light reflector contains a thermosetting resin and a white fiber material. As described above, the light reflector 1 contains a cured product of a molding material for a light reflector, and the molding material for the light reflector contains a thermosetting resin and a white fiber material. Therefore, even if the light reflector 1 has a portion having a small thickness, it has high strength and high toughness despite a small amount of glass fiber or no glass fiber. Further, the light reflector 1 has good heat discoloration resistance and light reflectivity.

圖1、圖2A及圖2B中展示光反射體1之例。圖1、圖2A及圖2B中,以X、Y及Z箭頭表示之方向指相互正交之方向。以下,X箭頭表示之方向稱作X軸方向,Y箭頭表示之方向稱作Y軸方向,Z箭頭表示之方向稱作Z軸方向。An example of the light reflector 1 is shown in Figs. 1, 2A and 2B. In FIGS. 1, 2A, and 2B, the directions indicated by the X, Y, and Z arrows refer to directions orthogonal to each other. Hereinafter, the direction indicated by the X arrow is referred to as the X-axis direction, the direction indicated by the Y arrow is referred to as the Y-axis direction, and the direction indicated by the Z-arrow is referred to as the Z-axis direction.

光反射體1譬如為LED反光件、雷射反光件等。光反射體1譬如圖2A及圖2B所示,係可容置在X1 (0.8~1.2mm)×Y1 (2.8~3.2mm)×Z1 (0.25~0.40mm)之空間亦即一方形體之空間內的大小,該方形體於X軸方向之尺寸X1 在0.8mm以上且1.2mm以下之範圍內、Y軸方向之尺寸Y1 在2.8mm以上且3.2mm以下之範圍內並且Z軸方向之尺寸Z1 在0.25mm以上且0.40mm以下之範圍內,惟不限於此大小。光反射體1含有上述光反射體用成形材料之硬化物。光反射體1係使上述光反射體用成形材料硬化而製得。理想係利用壓縮成形、轉注成形或射出成形,將光反射體用成形材料成形硬化來製作光反射體1。The light reflector 1 is, for example, an LED reflector, a laser reflector, or the like. As shown in FIG. 2A and FIG. 2B, the light reflector 1 can be accommodated in a space of X 1 (0.8~1.2 mm)×Y 1 (2.8~3.2 mm)×Z 1 (0.25~0.40 mm), that is, a square body. In the space, the size X 1 of the square body in the X-axis direction is in the range of 0.8 mm or more and 1.2 mm or less, and the dimension Y 1 in the Y-axis direction is in the range of 2.8 mm or more and 3.2 mm or less and the Z-axis The dimension Z 1 of the direction is in the range of 0.25 mm or more and 0.40 mm or less, but is not limited to this size. The light reflector 1 contains a cured product of the above-described molding material for a light reflector. The light reflector 1 is obtained by curing the above-mentioned light reflector with a molding material. Ideally, the light reflector 1 is formed by compression molding, transfer molding, or injection molding, and the light reflector is molded and cured.

基體40具備光反射體1及引線2。引線2係埋入光反射體1中。引線2具有內部端子211、221及外部端子212、222。The base 40 includes a light reflector 1 and a lead 2 . The lead 2 is buried in the light reflector 1. The lead 2 has internal terminals 211, 221 and external terminals 212, 222.

引線2為導電性。引線2通常為金屬製。引線2譬如可將一邊10cm以上且50cm以下之範圍內且厚度0.05mm以上且1.00mm以下之範圍內的銅板加工成預定形狀後,進行鍍錫、鍍鎳、鍍銀等表面處理而製得。內部端子211、221在光反射體1之凹處11之內面8呈露出狀態(對照圖2A)。外部端子212、222則呈現從光反射體1之外面9突出的狀態(對照圖1)。The lead 2 is electrically conductive. The lead 2 is usually made of metal. The lead wire 2 can be obtained by processing a copper plate having a thickness of, for example, 10 cm or more and 50 cm or less and a thickness of 0.05 mm or more and 1.00 mm or less into a predetermined shape, followed by surface treatment such as tin plating, nickel plating, or silver plating. The inner terminals 211, 221 are exposed in the inner surface 8 of the recess 11 of the light reflector 1 (refer to Fig. 2A). The external terminals 212 and 222 are in a state of protruding from the outer surface 9 of the light reflecting body 1 (refer to FIG. 1).

如圖2A及圖2B所示,光反射體1具備周壁10及凹處11。周壁10為筒狀壁。凹處11被周壁10包圍。詳而言之,光反射體1具有第1成形部101及第2成形部102。該等中,第1成形部101包含周壁10及凹處11。第2成形部102及第1成形部101係依序於X軸方向層疊而一體化,且於第2成形部102及第1成形部101之間夾有引線2。如上述,光反射體1之第1成形部101具有凹處11。凹處11係朝X軸方向開口。換言之,凹處11開口之方向即X軸方向。周壁10係由與Z軸方向相對向之上壁部18及下壁部19、及與Y軸方向相對向之2邊側壁部20所構成。周壁10之前端部分(距離凹處11之底面17較遠的部分)之厚度Y2 譬如宜為25μm以上且宜為100μm以下。周壁10包含譬如厚度100μm以下之部分。本實施形態中,尤其包含上壁部18及下壁部19之前端部分為厚度100μm以下的薄壁部分。如圖3A所示,凹處11被上壁部18及下壁部19以及2邊側壁部20包圍。如圖3A等所示,從與X軸方向相反之方向觀看時,凹處11之開口形狀呈凸形,惟不限於該形狀。如圖2A所示,引線2在凹處11之內面8(尤其是底面17)呈露出狀態。凹處11之內面8係由底面17及內周面12構成。凹處11之內面8含反射面23,且至少內周面12含有反射面23。凹處11之深度係從凹處11之底面17起至開口間之X軸方向的距離X101 。X101 譬如在0.3mm以上且0.4mm以下之範圍內。引線2具備第一引線21及第二引線22。第一引線21具備在凹處11之底面17露出之內部端子211及從光反射體1之外面9朝光反射體1外部突出之外部端子212。第二引線22亦具備在凹處11之底面17露出之內部端子221及從光反射體1之外面9朝光反射體1外部突出之外部端子222。如圖3A所示,二個外部端子212、222朝同方向(Z軸方向)突出。二個外部端子212、222可朝與凹處11開口朝向之方向(X軸方向)正交的方向突出,亦可朝與凹處11開口朝向之方向(X軸方向)斜向突出。As shown in FIGS. 2A and 2B, the light reflector 1 is provided with a peripheral wall 10 and a recess 11. The peripheral wall 10 is a cylindrical wall. The recess 11 is surrounded by the peripheral wall 10. In detail, the light reflector 1 has the first molded portion 101 and the second molded portion 102. In the above, the first molded portion 101 includes the peripheral wall 10 and the recess 11 . The second molding portion 102 and the first molding portion 101 are laminated and integrated in the X-axis direction, and the lead wires 2 are interposed between the second molding portion 102 and the first molding portion 101. As described above, the first molded portion 101 of the light reflector 1 has the recess 11. The recess 11 is opened in the X-axis direction. In other words, the direction in which the recess 11 opens is the X-axis direction. The peripheral wall 10 is composed of the upper wall portion 18 and the lower wall portion 19 facing the Z-axis direction and the two side wall portions 20 facing the Y-axis direction. The thickness Y 2 of the front end portion of the peripheral wall 10 (the portion farther from the bottom surface 17 of the recess 11) is preferably 25 μm or more and preferably 100 μm or less. The peripheral wall 10 includes, for example, a portion having a thickness of 100 μm or less. In the present embodiment, in particular, the front end portion of the upper wall portion 18 and the lower wall portion 19 is a thin portion having a thickness of 100 μm or less. As shown in FIG. 3A, the recess 11 is surrounded by the upper wall portion 18 and the lower wall portion 19 and the two side wall portions 20. As shown in FIG. 3A and the like, the opening shape of the recess 11 is convex when viewed from the direction opposite to the X-axis direction, but is not limited to this shape. As shown in Fig. 2A, the lead 2 is exposed in the inner face 8 (especially the bottom face 17) of the recess 11. The inner surface 8 of the recess 11 is composed of a bottom surface 17 and an inner circumferential surface 12. The inner surface 8 of the recess 11 includes a reflecting surface 23, and at least the inner peripheral surface 12 includes a reflecting surface 23. The depth of the recess 11 is the distance X 101 from the bottom surface 17 of the recess 11 to the X-axis direction between the openings. X 101 is, for example, in the range of 0.3 mm or more and 0.4 mm or less. The lead 2 is provided with a first lead 21 and a second lead 22. The first lead 21 includes an internal terminal 211 that is exposed at the bottom surface 17 of the recess 11 and an external terminal 212 that protrudes from the outer surface 9 of the light reflector 1 toward the outside of the light reflector 1 . The second lead 22 also includes an internal terminal 221 that is exposed at the bottom surface 17 of the recess 11 and an external terminal 222 that protrudes from the outer surface 9 of the light reflector 1 toward the outside of the light reflector 1 . As shown in FIG. 3A, the two external terminals 212, 222 protrude in the same direction (Z-axis direction). The two external terminals 212 and 222 may protrude in a direction orthogonal to the direction in which the opening of the recess 11 faces (the X-axis direction), or may protrude obliquely in a direction (X-axis direction) in which the opening of the recess 11 faces.

上述光反射體1中,第1成形部101之體積(凹處11之容積除外)比第2成形部102之體積小。又,第1成形部101中,上壁部18及下壁部19之體積比側壁部20之體積小。尤其,上壁部18及下壁部19為厚度較小的部分,所以成形時光反射體用成形材料中所含白色纖維材便容易朝X軸方向配向而產生各向異性。比起含有熱可塑性樹脂之成形材料,含有熱硬化性樹脂之光反射體用成形材料於成形時的黏度會變得非常低,所以在厚度較小的部分白色纖維材即容易配向。如上述因為產生各向異性,所以即使像上壁部18及下壁部19等厚度較小的部分(譬如,厚度100μm以下、甚至50μm以下的部分)也能具有高強度。雖然比起上壁部18及下壁部19,側壁部20較不易產生各向異性,但因為側壁部20之體積較大,所以即使為各向同性也能具有高強度。又,雖然比起第1成形部101,第2成形部102較不易產生各向異性,但因為第2成形部102之體積較大,所以即使為各向同性也能具有高強度。In the light reflector 1 described above, the volume of the first molded portion 101 (excluding the volume of the recess 11) is smaller than the volume of the second molded portion 102. Further, in the first molded portion 101, the volume of the upper wall portion 18 and the lower wall portion 19 is smaller than the volume of the side wall portion 20. In particular, since the upper wall portion 18 and the lower wall portion 19 are portions having a small thickness, the white fiber material contained in the molding material for a light reflector at the time of molding tends to be aligned in the X-axis direction to cause anisotropy. The viscosity of the molding material for a light reflector containing a thermosetting resin at the time of molding is extremely low compared to a molding material containing a thermoplastic resin. Therefore, the white fiber material is easily aligned in a portion having a small thickness. Since the anisotropy is generated as described above, even a portion having a small thickness such as the upper wall portion 18 and the lower wall portion 19 (for example, a portion having a thickness of 100 μm or less or even 50 μm or less) can have high strength. Although the side wall portion 20 is less likely to generate anisotropy than the upper wall portion 18 and the lower wall portion 19, since the side wall portion 20 has a large volume, it can have high strength even if it is isotropic. Further, although the second molded portion 102 is less likely to generate anisotropy than the first molded portion 101, the second molded portion 102 has a large volume, so that it can have high strength even if it is isotropic.

各向異性之有無譬如可藉由熱機械分析(TMA)測定成形時光反射體用成形材料的流動方向及與其呈垂直之方向上的硬化物之線膨脹係數來確認。譬如,圖2B中流動方向為X軸方向,垂直方向為Y軸方向。The presence or absence of anisotropy can be confirmed by thermomechanical analysis (TMA) by measuring the flow direction of the molding material for the light reflector during molding and the linear expansion coefficient of the cured product in the direction perpendicular thereto. For example, in FIG. 2B, the flow direction is the X-axis direction, and the vertical direction is the Y-axis direction.

光反射體及基體之製造方法 光反射體1及基體40之製造方法包含譬如將光反射體用成形材料成形來製作光反射體1的製程。成形方法譬如為壓縮成形、轉注成形或射出成形。製作該光反射體1時,以引線2之一部分從光反射體1突出的方式使光反射體1與引線2一體化。Method for Producing Light Reflector and Substrate The method for producing the light reflector 1 and the substrate 40 includes, for example, a process of forming a light reflector 1 by molding a light reflector. The forming method is, for example, compression molding, transfer molding or injection molding. When the light reflector 1 is produced, the light reflector 1 and the lead 2 are integrated such that one of the leads 2 protrudes from the light reflector 1.

本實施形態之製造方法亦可包含下述製程:在製作光反射體1時,係使用具備框170及連結框170之引線2的引線框架200,並於製作光反射體1後將引線2從框170切離。關於引線框架200之構成容後詳細說明。The manufacturing method of the present embodiment may include a process in which the lead frame 200 including the lead wires 2 of the frame 170 and the connection frame 170 is used in the production of the light reflector 1, and the lead 2 is formed after the light reflector 1 is fabricated. Block 170 is cut away. The configuration of the lead frame 200 will be described in detail later.

本實施形態之製造方法亦可包含在製作光反射體後將引線2彎折之製程。The manufacturing method of this embodiment may include a process of bending the lead 2 after fabricating the light reflector.

本實施型態中,即使光反射體1如上述具有厚度較小的部分,儘管玻璃纖維含量少或不含玻璃纖維,也具高強度且高韌性。因此,光反射體1及基體40之製造方法藉由包含從框170切離引線2及將引線2彎折等製程,則即使對光反射體1施加壓力,也不易於光反射體1產生裂痕、斷裂等破損。In the present embodiment, even if the light reflector 1 has a portion having a small thickness as described above, it has high strength and high toughness although the glass fiber content is small or glass fiber is not contained. Therefore, the method of manufacturing the light reflector 1 and the substrate 40 includes a process of cutting the lead 2 from the frame 170 and bending the lead 2, so that even if pressure is applied to the light reflector 1, the light reflector 1 is not easily cracked. Breakage, etc.

具體上,光反射體1之製造方法包含譬如以下步驟A2及步驟B2。另,以下將針對圖1、圖2A及圖2B所示光反射體1之製造方法具體說明,惟光反射體1不限於圖1、圖2A及圖2B所示之物。Specifically, the method of manufacturing the light reflector 1 includes, for example, the following steps A2 and B2. In the following, a method of manufacturing the light reflector 1 shown in Figs. 1, 2A, and 2B will be specifically described, but the light reflector 1 is not limited to the one shown in Figs. 1, 2A, and 2B.

步驟A2係準備上述光反射體用成形材料。光反射體用成形材料可以上述方式製造。In the step A2, the above-mentioned molding material for a light reflector is prepared. The molding material for the light reflector can be produced in the above manner.

步驟B2係利用壓縮成形、轉注成形或射出成形,使步驟A2中所準備之光反射體用成形材料硬化而與引線2一體化,且使引線2之一部分從光反射體用成形材料之硬化物突出。Step B2 is a method of compression molding, transfer molding, or injection molding, whereby the light reflector prepared in the step A2 is cured by the molding material to be integrated with the lead 2, and a part of the lead 2 is cured from the molding material for the light reflector. protruding.

於圖5A展示引線框架200之一例。引線框架200可用來製造光反射體1及基體40。引線框架200為導電性,通常為金屬製。圖5A所示引線框架200係多腔用,具有具備多個格子之框170及多個連結框170之引線2。圖5A中,框170具有20個格子。1個格子為最小單位。每一格子設有一引線2。各引線2具有第一引線21及第二引線22。第一引線21具有內部端子211及外部端子212。第二引線22具有內部端子221及外部端子222。An example of the lead frame 200 is shown in FIG. 5A. The lead frame 200 can be used to manufacture the light reflector 1 and the substrate 40. The lead frame 200 is electrically conductive and is usually made of metal. The lead frame 200 shown in FIG. 5A is used for a multi-cavity, and has a frame 170 having a plurality of lattices and leads 2 of a plurality of connection frames 170. In Figure 5A, block 170 has 20 grids. One grid is the smallest unit. Each grid is provided with a lead 2. Each lead 2 has a first lead 21 and a second lead 22. The first lead 21 has an internal terminal 211 and an external terminal 212. The second lead 22 has an internal terminal 221 and an external terminal 222.

壓縮成形係將引線框架200及光反射體用成形材料設置於已加熱至適溫之模具中,合閉模具後進行加熱、加壓的成形方法。In the compression molding, the lead frame 200 and the light-reflecting body molding material are placed in a mold that has been heated to a suitable temperature, and the mold is closed and then heated and pressurized.

轉注成形係將引線框架200設置於已加熱至適溫之模具中,將已饋入稱為坩堝(pot)之部分的光反射體用成形材料加壓並透過注入口流入模具內,並予以加熱、加壓的成形方法。In the transfer molding system, the lead frame 200 is placed in a mold that has been heated to a suitable temperature, and a light reflector that has been fed into a portion called a pot is pressurized with a molding material and flows into the mold through the injection port, and is heated. Pressurized forming method.

射出成形係先將引線框架200設置於已加熱至適溫之模具中,再使用射出成形機將光反射體用成形材料加壓注入模具內的成形方法。這時的成形條件譬如滾筒溫度在70℃以上且90℃以下之範圍內,射出壓力在5MPa以上且70MPa以下之範圍內,且模具溫度在150℃以上且170℃以下之範圍內。亦可因應需求施行後硬化處理。In the injection molding system, the lead frame 200 is first placed in a mold that has been heated to a suitable temperature, and the optical reflector is pressed into the mold by a molding material using an injection molding machine. The molding conditions at this time are, for example, a drum temperature of 70 ° C or more and 90 ° C or less, an injection pressure of 5 MPa or more and 70 MPa or less, and a mold temperature of 150 ° C or more and 170 ° C or less. It can also be post-hardened according to the demand.

另,射出成形係JIS工業用語大辭典(第3版)中所記述。射出成形為成形熱可塑性樹脂及熱硬化性樹脂之方法之一,係使成形材料在射出滾筒中加熱熔融後,將呈流動化之成形材料以壓力注入經射出柱塞或螺桿而緊閉之模具中來進行成形的技術。(JIS K 6900)。In addition, the injection molding system JIS industrial terminology dictionary (third edition) is described. One of the methods of injection molding into a thermoplastic resin and a thermosetting resin is a method in which a molding material is heated and melted in an injection drum, and a fluidized molding material is pressure-injected into a mold which is closed by an injection plunger or a screw. The technology used to form the mold. (JIS K 6900).

然後,藉由壓縮成形、轉注成形或射出成形在模具內使光反射體用成形材料成形硬化,即可如圖5B所示製造出多個光反射體1分別與引線框架200中之多個引線2各自呈一體化之狀態。於每一個引線框架200之框170所具有之格子中,製作含有光反射體用成形材料之硬化物的光反射體1,且引線2之一部分的外部端子212、222係從該光反射體1突出。習知之成形材料容易於光反射體1產生毛邊、裂痕、斷裂,但若為本實施形態之光反射體用成形材料,則可抑制光反射體1之毛邊、裂痕及斷裂產生。Then, the light reflector is molded and hardened by compression molding, transfer molding or injection molding in a mold, and a plurality of light reflectors 1 and a plurality of leads in the lead frame 200 can be respectively manufactured as shown in FIG. 5B. 2 Each is in an integrated state. In the grid of the frame 170 of each of the lead frames 200, a light reflector 1 containing a cured product of a molding material for a light reflector is formed, and the external terminals 212, 222 of one portion of the leads 2 are from the light reflector 1 protruding. The conventional molding material is likely to cause burrs, cracks, and breakage in the light reflector 1. However, in the case of the molding material for a light reflector of the present embodiment, generation of burrs, cracks, and breakage of the light reflector 1 can be suppressed.

光反射體用成形材料成形硬化後,將光反射體1及引線框架200從模具中取出,並在圖5B所示虛線位置切斷引線框架200,即可將引線2從框170切離。藉此可製得如圖3A所示多個與彎折加工前之引線2組合的光反射體1。After the light reflector is molded and cured by the molding material, the light reflector 1 and the lead frame 200 are taken out from the mold, and the lead frame 200 is cut at the position shown by a broken line in FIG. 5B, whereby the lead 2 can be cut away from the frame 170. Thereby, a plurality of light reflectors 1 combined with the lead wires 2 before the bending process as shown in Fig. 3A can be obtained.

宜對光反射體1施行去毛邊處理。去毛邊處理包含譬如選自於由濕式噴砂處理、鹼性電解處理及鹼性溶液處理所構成群組中之1種以上處理。濕式噴砂處理可使用濕式噴砂裝置以公知方法進行。鹼性電解處理可使用電解去毛邊機以公知方法進行。鹼性溶液處理譬如可以氫氧化鉀水溶液、氫氧化鈉水溶液等鹼性溶液處理光反射體1表面來進行。It is preferable to perform deburring treatment on the light reflector 1. The deburring treatment includes, for example, one or more treatments selected from the group consisting of wet blasting, alkaline electrolysis, and alkaline solution treatment. The wet blasting treatment can be carried out by a known method using a wet blasting device. The alkaline electrolytic treatment can be carried out by a known method using an electrolytic deburring machine. The alkaline solution treatment can be carried out by, for example, treating the surface of the light reflector 1 with an alkaline solution such as an aqueous potassium hydroxide solution or an aqueous sodium hydroxide solution.

白色纖維材業經矽烷耦合劑處理時,則即使對光反射體1施行去毛邊處理,白色纖維材也不易從光反射體1表面飛散且不易脫落,所以可抑制光反射體1的表面粗糙。所以,可輕易保持光反射體1表面平滑,故而可高度維持光反射體1的光反射性。When the white fiber material is treated with a decane coupling agent, even if the glazing treatment is performed on the light reflector 1, the white fiber material is less likely to scatter from the surface of the light reflector 1 and is less likely to fall off, so that the surface roughness of the light reflector 1 can be suppressed. Therefore, the surface of the light reflector 1 can be easily kept smooth, so that the light reflectivity of the light reflector 1 can be highly maintained.

圖6A展示另一實施形態之引線框架200及與該引線框架200一體形成的光反射體1。該引線框架200具有框170、連結框170之引線2及一對連結框170之支桿180。FIG. 6A shows a lead frame 200 according to another embodiment and a light reflector 1 integrally formed with the lead frame 200. The lead frame 200 has a frame 170, a lead 2 of the connecting frame 170, and a strut 180 of the pair of connecting frames 170.

各支桿180皆朝光反射體1之側壁部20突出。各支桿180在第1成形部101與第2成形部102之邊界附近,有稍微穿入光反射體1(對照圖6B)。將圖6A之α部分擴大顯示於圖6F。如圖6F所示,支桿180中穿入光反射體1之部分的支桿180沿突出方向之尺寸D2譬如在70μm以上且80μm以下之範圍內。Each of the stays 180 protrudes toward the side wall portion 20 of the light reflector 1. Each of the stays 180 slightly penetrates the light reflector 1 in the vicinity of the boundary between the first molded portion 101 and the second molded portion 102 (refer to FIG. 6B). The enlargement of the α portion of Fig. 6A is shown in Fig. 6F. As shown in Fig. 6F, the length 180 of the strut 180 that penetrates the portion of the light reflector 1 in the strut 180 in the protruding direction is, for example, in the range of 70 μm or more and 80 μm or less.

另,圖7A係顯示使用具備支桿180之引線框架200來製造圖1之光反射體1時,光反射體1與支桿180之關係的一例,展示與圖6F相同之模樣。惟,在圖7A中省略了外部端子222之圖示。又,像這樣以具備支桿180之引線框架200來製造與圖1同樣之光反射體1時,於光反射體1上在支桿180穿入的位置會形成孔部。圖1、圖2A、圖3A~圖3C、圖4A~圖4C皆展示使用不具支桿180之引線框架200而製成的光反射體1,所以未標示出支桿180穿入所形成的孔部。In addition, FIG. 7A shows an example of the relationship between the light reflector 1 and the strut 180 when the light reflector 1 of FIG. 1 is manufactured using the lead frame 200 having the strut 180, and the same pattern as that of FIG. 6F is shown. However, the illustration of the external terminal 222 is omitted in FIG. 7A. Further, when the light reflector 1 similar to that of FIG. 1 is manufactured by the lead frame 200 including the support bar 180 as described above, a hole portion is formed in the light reflector 1 at a position where the stay 180 penetrates. 1, 2A, 3A to 3C, and 4A to 4C each show a light reflector 1 made using a lead frame 200 having no struts 180, so that the hole formed by the struts 180 is not marked. .

支桿180之側面與光反射體1之側面間的距離D3(對照圖6F及圖7B)譬如在30μm以上且40μm以下之範圍內。另,圖7B係與圖1之光反射體1相對應,展示與圖6F相同之模樣。The distance D3 between the side surface of the strut 180 and the side surface of the light reflector 1 (refer to FIGS. 6F and 7B) is, for example, in the range of 30 μm or more and 40 μm or less. In addition, FIG. 7B corresponds to the light reflector 1 of FIG. 1, and shows the same appearance as that of FIG. 6F.

光反射體1若係以習知的成形材料形成,則在拔去支桿180時,圖7B中之γ部分容易產生裂痕等。When the light reflector 1 is formed of a conventional molding material, when the struts 180 are removed, the γ portion in FIG. 7B is likely to be cracked or the like.

若是使用具備支桿180之引線框架200來製作光反射體1,光反射體1便係由一對支桿180懸吊。可在此狀態下對光反射體1施行去毛邊處理。去毛邊處理後,藉由在圖6A及圖6C所示虛線之位置切斷引線框架200,即可將引線2從框170切離,從光反射體1拔去支桿180。藉此可製得與彎折加工前之引線2組合的光反射體1。習知之成形材料在拔去支桿180時容易於光反射體1產生裂痕、斷裂,但若為本實施形態之光反射體用成形材料,則可抑制光反射體1之裂痕、斷裂產生。另,圖6C中,符號30為澆口痕(gate mark)。澆口痕30係以澆口痕跡形成於光反射體1的突起,該澆口即為樹脂注入模具模槽內的注入口。When the light reflector 1 is fabricated using the lead frame 200 having the struts 180, the light reflector 1 is suspended by a pair of struts 180. The light reflector 1 can be subjected to deburring in this state. After the burr processing, the lead frame 200 is cut away from the frame 170 by the position of the broken line shown in FIGS. 6A and 6C, and the struts 180 can be removed from the light reflector 1. Thereby, the light reflector 1 combined with the lead 2 before the bending process can be obtained. The conventional molding material is likely to cause cracks and breakage of the light reflector 1 when the struts 180 are removed. However, in the case of the molding material for a light reflector of the present embodiment, cracks and breakage of the light reflector 1 can be suppressed. In addition, in Fig. 6C, reference numeral 30 is a gate mark. The gate mark 30 is a protrusion formed on the light reflector 1 by a gate mark, and the gate is an injection port into which the resin is injected into the mold cavity.

光反射體1之製造方法更可包含下述步驟C2。The method of manufacturing the light reflector 1 may further include the following step C2.

步驟C2係將從光反射體用成形材料之硬化物的光反射體1突出的引線2之一部分切斷或彎折。切斷包含切斷為上述多腔時的引線框架200。以下針對步驟C2之彎折步驟亦即端子彎曲步驟加以說明。In step C2, one of the leads 2 protruding from the light reflector 1 of the cured product of the molding material is cut or bent. The lead frame 200 including the cutting of the plurality of cavities is cut. The bending step of step C2, that is, the terminal bending step, will be described below.

如圖3A所示,為引線2一部分的外部端子212、222係從光反射體1突出。以如圖3B及圖3C所示方式將該外部端子212、222彎折使其配置成與光反射體1表面相對向。圖3B及圖3C中之箭頭表示彎折引線2之外部端子212、222的方向。如此一來,藉由對引線2之外部端子212、222施行彎折加工,可獲得彎折加工後之引線2及與其組合的光反射體1。另,於彎折加工時,亦可以如圖4A~圖4C所示方式對引線2之外部端子212、222施行彎折加工。As shown in FIG. 3A, the external terminals 212, 222 which are a part of the lead 2 protrude from the light reflecting body 1. The external terminals 212, 222 are bent so as to be opposed to the surface of the light reflector 1 in a manner as shown in FIGS. 3B and 3C. The arrows in Figures 3B and 3C indicate the direction in which the external terminals 212, 222 of the lead 2 are bent. In this manner, by bending the external terminals 212 and 222 of the lead 2, the lead 2 after the bending process and the light reflector 1 combined therewith can be obtained. Further, in the bending process, the outer terminals 212, 222 of the lead 2 may be bent as shown in Figs. 4A to 4C.

若如上述將與光反射體1呈一體化狀態的引線框架200切斷、或是對與光反射體1呈一體化狀態之引線2施行彎折加工,會對光反射體1施予巨大的荷重。而如果光反射體1係以習知成形材料製作,則在引線框架200之切斷或彎折加工時,容易於光反射體1產生毛邊、裂痕、斷裂等破損。尤其容易在圖3B中之β部分產生裂痕等。相對地,如果光反射體1係從本實施形態之光反射體用成形材料製作而成,因為光反射體1具有高韌性及高強度,所以能在引線框架200之切斷或彎折加工時抑制於光反射體1產生毛邊、裂痕、斷裂等破損。尤其即使光反射體1具有厚度較小的部分,也因為光反射體1具有適度的彈性及高強度,所以引線框架200之切斷或端子彎曲時,光反射體1不易破損。可使用這種光反射體1來製造發光裝置6。When the lead frame 200 that is integrated with the light reflector 1 is cut as described above, or the lead 2 that is integrated with the light reflector 1 is bent, the light reflector 1 is given a large amount. Load. On the other hand, when the light reflector 1 is made of a conventional molding material, it is easy to cause damage to the light reflector 1 such as burrs, cracks, and breakage during the cutting or bending of the lead frame 200. It is particularly easy to generate cracks and the like in the ? portion in Fig. 3B. In contrast, when the light reflector 1 is formed from the molding material for a light reflector of the present embodiment, the light reflector 1 has high toughness and high strength, so that the lead frame 200 can be cut or bent. The light reflector 1 is suppressed from being damaged by burrs, cracks, breaks, and the like. In particular, even if the light reflector 1 has a small thickness portion, since the light reflector 1 has moderate elasticity and high strength, the light reflector 1 is less likely to be broken when the lead frame 200 is cut or the terminal is bent. The light-emitting device 6 can be manufactured using such a light reflector 1.

光反射體1之製造方法亦可包含下述步驟C3來替代步驟C2。The method of manufacturing the light reflector 1 may also include the following step C3 instead of the step C2.

步驟C3係同時將從光反射體用成形材料之硬化物的光反射體1突出的引線2進行切斷及彎折。切斷包含切斷為上述多腔時的引線框架200。並且在與此切斷之同時,以如圖3B及圖3C之箭頭所示方式,將從光反射體1突出之外部端子212、222彎折使其配置成與光反射體1表面相對向。如此一來,藉由對引線2之外部端子212、222施行彎折加工,可獲得與彎折加工後之引線2組合成的光反射體1。In the step C3, the lead 2 protruding from the light reflector 1 of the cured product of the light-reflecting material is cut and bent. The lead frame 200 including the cutting of the plurality of cavities is cut. At the same time as the cutting, the external terminals 212 and 222 protruding from the light reflecting body 1 are bent so as to be opposed to the surface of the light reflecting body 1 as shown by the arrows in FIGS. 3B and 3C. In this way, by bending the outer terminals 212 and 222 of the lead 2, the light reflector 1 combined with the lead 2 after the bending process can be obtained.

若如上述將與光反射體1呈一體化狀態之引線框架200切斷的同時,對與光反射體1呈一體化狀態之引線2施行彎折加工,會對光反射體1施予巨大的荷重。而如果光反射體1係以習知成形材料形成,切斷及彎折若同時進行,便容易於光反射體1產生毛邊、裂痕、斷裂等破損。相對地,如果光反射體1係以本實施形態之光反射體用成形材料形成,因為光反射體1具有高韌性及高強度,所以能抑制於光反射體1產生毛邊、裂痕、斷裂等破損。尤其即使光反射體1具有厚度較小的部分,也因為光反射體1具有適度的彈性及高強度,所以在同時進行引線框架200之切斷及端子彎曲時,光反射體1不易破損。可使用這種光反射體1來製造發光裝置6。When the lead frame 200 that is integrated with the light reflector 1 is cut as described above, the lead wire 2 that is integrated with the light reflector 1 is subjected to bending processing, and the light reflector 1 is given a large amount. Load. On the other hand, if the light reflector 1 is formed of a conventional molding material, the cutting and bending are performed at the same time, and the light reflector 1 is likely to be damaged by burrs, cracks, breakage, or the like. In contrast, when the light reflector 1 is formed of the molding material for a light reflector of the present embodiment, the light reflector 1 has high toughness and high strength, so that damage to the light reflector 1 such as burrs, cracks, and breakage can be suppressed. . In particular, even if the light reflector 1 has a small thickness portion, since the light reflector 1 has moderate elasticity and high strength, the light reflector 1 is less likely to be broken when the lead frame 200 is cut and the terminal is bent at the same time. The light-emitting device 6 can be manufactured using such a light reflector 1.

發光裝置 發光裝置6具備光反射體1及發光元件3。圖1、圖2A及圖2B中展示具備光反射體1之發光裝置6之例。該發光裝置6具備光反射體1、發光元件3以及引線2。本例中,係以引線2埋入在光反射體1中的方式組合光反射體1及引線2。由本實施形態之光反射體用成形材料製造之光反射體1、基體40及發光裝置6的結構不侷限於本例。Light Emitting Device The light emitting device 6 includes a light reflecting body 1 and a light emitting element 3. An example of the light-emitting device 6 including the light reflector 1 is shown in Figs. 1, 2A and 2B. The light-emitting device 6 includes a light reflector 1, a light-emitting element 3, and a lead 2. In this example, the light reflector 1 and the lead 2 are combined such that the lead 2 is buried in the light reflector 1. The configuration of the light reflector 1, the base 40, and the light-emitting device 6 manufactured by the molding material for a light reflector of the present embodiment is not limited to this example.

發光元件3譬如為發光二極體(LED)或雷射二極體(LD),惟不受此限。如圖2A及圖2B所示,發光元件3係與在凹處11之底面17露出之內部端子221電連接且搭載於光反射體1之凹處11的內部。具體上,發光元件3係以金屬線41與第一引線21之內部端子211電連接。The light-emitting element 3 is, for example, a light-emitting diode (LED) or a laser diode (LD), but is not limited thereto. As shown in FIGS. 2A and 2B, the light-emitting element 3 is electrically connected to the internal terminal 221 exposed at the bottom surface 17 of the recess 11 and is mounted inside the recess 11 of the light reflector 1. Specifically, the light-emitting element 3 is electrically connected to the internal terminal 211 of the first lead 21 by the metal wire 41.

亦即,發光裝置6具備基體40及發光元件3,且發光元件3與引線2之內部端子221電連接並搭載於光反射體1之凹處11內部。圖2A及圖2B所示光反射體1為側視型(側面發光型),比起俯視型(上面發光型),其從發光元件3到凹處11之內周面12間之距離D1短很多。譬如,距離D1在0.01mm以上且0.15mm以下(10μm以上且150μm以下)之範圍內。如所述若距離D1很短,譬如周壁10係以習知成形材料形成時,便容易因發光元件3發出之光L而劣化。再加上周壁10之厚度一小,發光元件3發出之光L便容易穿透周壁10而洩漏至外部。在本實施形態得以解決這種光反射體1因光L而劣化及漏光等課題。That is, the light-emitting device 6 includes the base 40 and the light-emitting element 3, and the light-emitting element 3 is electrically connected to the internal terminal 221 of the lead 2 and mounted inside the recess 11 of the light reflector 1. The light reflector 1 shown in Figs. 2A and 2B is of a side view type (sidelight type), and has a shorter distance D1 from the light-emitting element 3 to the inner peripheral surface 12 of the recess 11 than the plan view type (upper light-emitting type). a lot of. For example, the distance D1 is in the range of 0.01 mm or more and 0.15 mm or less (10 μm or more and 150 μm or less). As described above, if the distance D1 is short, for example, when the peripheral wall 10 is formed of a conventional molding material, it is likely to be deteriorated by the light L emitted from the light-emitting element 3. Further, when the thickness of the peripheral wall 10 is small, the light L emitted from the light-emitting element 3 easily penetrates the peripheral wall 10 and leaks to the outside. In the present embodiment, the problem that the light reflector 1 is deteriorated by light L and light leakage is solved is solved.

亦即,在本實施形態因為光反射體用成形材料含有熱硬化性樹脂,所以即使距離D1如上述非常短如具體上從發光元件3至凹處11之內周面12間之最短距離為0.15mm以下,也能抑制周壁10因光L而劣化。換言之,發光元件3至凹處11之內周面12間的最短距離宜為0.15mm以下。此時可將光反射體1小型化,而且即使像這樣將之小型化,在本實施形態中依舊可抑制光反射體1因光L而劣化。此外,光反射體用成形材料含有熱硬化性樹脂時,相對地增加充填材含量即可減少熱硬化性樹脂含量,所以更能抑制周壁10因光L而劣化。又,相對於光反射體用成形材料總量,玻璃纖維含量在0質量%以上且10質量%以下時,可大幅減少玻璃纖維可能形成之光通道,藉此即使光反射體1具有厚度較小的部分,也能抑制漏光,光反射體1便可具有高光反射性。In other words, in the present embodiment, since the molding material for a light reflector contains a thermosetting resin, the shortest distance between the light-emitting element 3 and the inner peripheral surface 12 of the recess 11 is 0.15 as long as the distance D1 is as described above. Below mm, it is also possible to suppress deterioration of the peripheral wall 10 due to the light L. In other words, the shortest distance between the light-emitting elements 3 to the inner peripheral surface 12 of the recess 11 is preferably 0.15 mm or less. In this case, the light reflector 1 can be downsized, and even if it is miniaturized in this manner, the light reflector 1 can be prevented from being deteriorated by the light L in the present embodiment. Further, when the molding material for a light reflector contains a thermosetting resin, the content of the filler material can be relatively increased to reduce the content of the thermosetting resin. Therefore, deterioration of the peripheral wall 10 by the light L can be further suppressed. Further, when the glass fiber content is 0% by mass or more and 10% by mass or less based on the total amount of the molding material for the light reflector, the light passage which the glass fiber can form can be greatly reduced, whereby the light reflector 1 has a small thickness. The portion of the light reflector 1 can also suppress light leakage, and the light reflector 1 can have high light reflectivity.

如圖2A及圖2B所示,凹處11之內周面12至少一部係以朝向凹處11之開口側的方式對凹處11之底面17呈傾斜。亦即,凹處11之內周面12的一部分或全部可作為反射面23發揮功能,也就是使從發光元件3發出之光L朝凹處11之開口側反射。所以,從發光元件3發出之光L容易在光反射體1之凹處11的內周面12反射。其結果可提高來自發光裝置6之光L的擷取效率。另,凹處11之底面17亦能作為反射面23發揮功能。As shown in FIGS. 2A and 2B, at least one portion of the inner peripheral surface 12 of the recess 11 is inclined toward the bottom surface 17 of the recess 11 so as to face the opening side of the recess 11. That is, a part or all of the inner peripheral surface 12 of the recess 11 can function as the reflecting surface 23, that is, the light L emitted from the light-emitting element 3 is reflected toward the opening side of the recess 11. Therefore, the light L emitted from the light-emitting element 3 is easily reflected on the inner peripheral surface 12 of the recess 11 of the light reflector 1. As a result, the extraction efficiency of the light L from the light-emitting device 6 can be improved. Further, the bottom surface 17 of the recess 11 can also function as the reflecting surface 23.

亦可藉由於發光裝置6之凹處11內充填密封材5,以密封材5來密封發光元件3。此時,可以密封材5保護發光元件3免受外部氣體等。The light-emitting element 3 can also be sealed with the sealing material 5 by filling the sealing material 5 in the recess 11 of the light-emitting device 6. At this time, the sealing member 5 can protect the light-emitting element 3 from external gas or the like.

密封材5可從譬如密封用樹脂組成物製作。密封用樹脂組成物譬如可含有選自於由環氧樹脂、改質環氧樹脂、聚矽氧樹脂、改質聚矽氧樹脂、丙烯酸酯樹脂及胺甲酸乙酯樹脂所構成群組中之1種以上樹脂作為熱硬化性樹脂。The sealing material 5 can be produced, for example, from a resin composition for sealing. The resin composition for sealing may, for example, contain one selected from the group consisting of epoxy resins, modified epoxy resins, polyoxyxylene resins, modified polyoxyxylene resins, acrylate resins, and urethane resins. The above resins are used as thermosetting resins.

密封材5亦可視需求含有螢光物質。亦即,密封用樹脂組成物亦可含有螢光物質。此時,可以螢光物質控制從發光裝置6發出之光L的色調。The sealing material 5 may also contain a fluorescent substance as needed. That is, the resin composition for sealing may also contain a fluorescent substance. At this time, the hue of the light L emitted from the light-emitting device 6 can be controlled by the fluorescent substance.

本實施形態之光反射體1如圖1所示,可搭載於譬如基板7上。此時,譬如光反射體1之外部端子212、222可以焊接等連接於位在基板7之一面73上的端子71、72。藉此,光反射體1可被基板7支撐,且同時能與基板7電連接。圖1所示光反射體1為側視型(側面發光型)。亦即,光反射體1若搭載於基板7上,光反射體1之凹處11的開口便會朝向沿著基板7支撐光反射體1之面73的方向,從光反射體1朝沿著面73之方向發光。As shown in FIG. 1, the light reflector 1 of the present embodiment can be mounted on a substrate 7, for example. At this time, for example, the external terminals 212, 222 of the light reflector 1 may be soldered or the like to be connected to the terminals 71, 72 located on one surface 73 of the substrate 7. Thereby, the light reflector 1 can be supported by the substrate 7 while being electrically connected to the substrate 7. The light reflector 1 shown in Fig. 1 is of a side view type (sidelight type). That is, when the light reflector 1 is mounted on the substrate 7, the opening of the recess 11 of the light reflector 1 faces the direction of the surface 73 supporting the light reflector 1 along the substrate 7, from the light reflector 1 toward The direction of the face 73 is illuminated.

在此,本發明人等獲得下述見解。光反射率係視光反射體1中光到達處之厚度而定。該厚度變大時,光反射率即增高;該厚度變小時,光反射率則降低。實際上,發明人等使用本實施形態之光反射體用成形材料及習知的成形材料(尼龍等)製作成各種厚度的試料來進行實驗。結果查明,厚度變小時,以400μm左右為界,以習知成形材料做成的試料光反射率會急遽降低。相對地,以本實施形態之光反射體用成形材料做成的試料則可高度維持光反射率。此外亦查明玻璃纖維所造成之擦痕為光反射率降低之原因。擦痕係玻璃纖維與模具接觸時產生的汙痕。由此觀點來看,同樣以光反射體用成形材料不含玻璃纖維為宜。即使光反射體用成形材料含有玻璃纖維,相對於光反射體用成形材料總量,玻璃纖維含量也宜在10質量%以下。此時,不僅能減少玻璃纖維可能形成之光通道,也能抑制玻璃纖維所致之擦痕(尤其是反射面23的汙痕)生成,從而可提升光反射體1之光反射性。所以,即使光反射體1具有厚度較小的部分,光反射體1也能具有高度的光反射性。Here, the inventors obtained the following findings. The light reflectance is determined by the thickness of the light reflecting body 1 where the light reaches. When the thickness is increased, the light reflectance is increased, and when the thickness is small, the light reflectance is lowered. In fact, the inventors conducted experiments using the molding materials for light reflectors of the present embodiment and known molding materials (nylon or the like) to prepare samples having various thicknesses. As a result, it was found that the thickness of the sample was reduced to about 400 μm, and the light reflectance of the sample made of the conventional molding material was drastically lowered. On the other hand, the sample made of the molding material for a light reflector of the present embodiment can maintain the light reflectance at a high level. In addition, the scratches caused by the glass fibers were also found to be the cause of the decrease in light reflectance. The scratch is a stain generated when the glass fiber comes into contact with the mold. From this point of view, it is preferable that the molding material for the light reflector does not contain glass fibers. Even if the molding material for a light reflector contains glass fibers, the glass fiber content is preferably 10% by mass or less based on the total amount of the molding materials for the light reflector. At this time, not only the light passage which the glass fiber may form can be reduced, but also the generation of scratches due to the glass fiber (especially the stain of the reflecting surface 23) can be suppressed, and the light reflectivity of the light reflector 1 can be improved. Therefore, even if the light reflector 1 has a portion having a small thickness, the light reflector 1 can have a high degree of light reflectivity.

尤其,如圖1、圖2A及圖2B所示之側視型光反射體1講求小型化、薄型化。譬如,在光反射體1之凹處11的開口附近,上壁部18及下壁部19之厚度非常小。如此一來,儘管光反射體1為小型且具有厚度較小的部分,在本實施形態中因為光反射體1含有白色纖維材(宜為業經矽烷耦合劑處理的白色纖維材),所以該白色纖維材可抑制光穿透並可同時提升光反射體1的強度。此外,尤其當光反射體1含有內核外殼型橡膠粒子13時,該橡膠粒子13大大地有利於低彈性化,可進一步提升光反射體1之韌性。In particular, the side view type light reflector 1 shown in FIGS. 1 , 2A, and 2B is reduced in size and thickness. For example, in the vicinity of the opening of the recess 11 of the light reflector 1, the thickness of the upper wall portion 18 and the lower wall portion 19 is extremely small. In this manner, although the light reflector 1 is small and has a small thickness portion, in the present embodiment, since the light reflector 1 contains a white fiber material (preferably a white fiber material treated with a decane coupling agent), the white The fibrous material can suppress light penetration and simultaneously increase the strength of the light reflector 1. Further, especially when the light reflector 1 contains the core outer shell type rubber particles 13, the rubber particles 13 greatly contribute to low elasticity, and the toughness of the light reflector 1 can be further improved.

譬如,光反射體1中包圍凹處11之周壁10的最小厚度可在30μm以上且200μm以下之範圍內,甚至可在100μm以下。尤其,周壁10中之上壁部18及下壁部19的前端部分(距離凹處11之底面17較遠的部分)厚度可在20μm以上60μm以下之範圍內,更可在25μm以上且50μm以下之範圍內;上壁部18及下壁部19的根部(距離凹處11之底面17較近的部分)厚度可在40μm以上且70μm以下之範圍內,更可在45μm以上60μm以下之範圍內。像這般即使光反射體1具有厚度較小的部分,在本實施形態中光反射體1也能具有高韌性及高強度並同時具有高光反射性。For example, the minimum thickness of the peripheral wall 10 surrounding the recess 11 in the light reflector 1 may be in the range of 30 μm or more and 200 μm or less, or may be 100 μm or less. In particular, the thickness of the front end portion of the upper wall portion 18 and the lower wall portion 19 of the peripheral wall 10 (the portion farther from the bottom surface 17 of the recess 11) may be in the range of 20 μm or more and 60 μm or less, and more preferably 25 μm or more and 50 μm or less. The thickness of the root portion of the upper wall portion 18 and the lower wall portion 19 (the portion closer to the bottom surface 17 of the recess 11) may be in the range of 40 μm or more and 70 μm or less, and may be in the range of 45 μm or more and 60 μm or less. . As described above, even if the light reflector 1 has a small thickness portion, the light reflector 1 can have high toughness and high strength and high light reflectivity at the same time.

實施例 以下藉由實施例來具體說明本發明。惟,本發明不受以下實施例限定。 <製造光反射體用成形材料> 作為光反射體用成形材料之構成成分使用下列物質。EXAMPLES Hereinafter, the present invention will be specifically described by way of examples. However, the invention is not limited by the following examples. <Molding Material for Manufacturing Light Reflector> The following materials were used as constituent components of the molding material for a light reflector.

(1)熱硬化性樹脂 (1-1)不飽和聚酯樹脂 (1-1-1)不飽和醇酸樹脂 ・對酞酸系不飽和醇酸樹脂(Japan U-Pica Co., Ltd.製「U-Pica 8552」) (1-1-2)交聯劑 ・酞酸二烯丙酯預聚物(OSAKA SODA CO., LTD.製「DAP Polymer」) (1-2)環氧樹脂 ・三聚異氰酸三環氧丙酯(日產化學工業股份有限公司製「TEPIC-S」、環氧當量100g/eq) (1-3)苯酚樹脂 ・酚醛型苯酚樹脂(Panasonic股份有限公司製「PDR」)、重量平均分子量4000~5000 上述熱硬化性樹脂皆具有雙鍵。(1) Thermosetting Resin (1-1) Unsaturated Polyester Resin (1-1-1) Unsaturated Alkyd Resin and p-Toluene-Based Unsaturated Alkyd Resin (manufactured by Japan U-Pica Co., Ltd.) "U-Pica 8552") (1-1-2) Crosslinking agent and diallyl citrate prepolymer ("DAP Polymer" manufactured by OSAKA SODA CO., LTD.) (1-2) Epoxy resin Tripolyglycidyl isocyanate ("TEPIC-S" manufactured by Nissan Chemical Industries, Ltd., epoxy equivalent 100 g/eq) (1-3) Phenol resin / phenolic phenol resin ("Manufactured by Panasonic Co., Ltd." PDR"), weight average molecular weight 4000 to 5000 The above thermosetting resins all have double bonds.

(2)聚合引發劑 ・聚合引發劑1:過氧化二異丙苯基(日油股份有限公司製「Percumyl D-40」、40%母粒) ・聚合引發劑2:六氫酞酸酐(新日本理化股份有限公司製「RIKACID HH」) ・聚合引發劑3:六亞甲四胺(MITSUBISHI GAS CHEMICAL COMPANY, INC.製)(2) Polymerization initiator ・Polymerization initiator 1: Dicumyl peroxide (Percumyl D-40, manufactured by Nippon Oil Co., Ltd., 40% masterbatch) ・Polymerization initiator 2: hexahydrophthalic anhydride (new "RIKACID HH" manufactured by Nippon Chemical and Chemical Co., Ltd.) ・Polymerization initiator 3: hexamethylenetetramine (manufactured by MITSUBISHI GAS CHEMICAL COMPANY, INC.)

(3)充填材 (3-1)無機充填材 ・二氧化矽(Denka Co., Ltd.製「FB-820」、熔融二氧化矽、平均粒徑25μm) (3-2)白色顏料 ・氧化鈦(Tioxide Japan K.K.製「Tioxide R-TC30」、金紅石型氧化鈦、平均粒徑0.4μm)(3) Filling material (3-1) Inorganic filler and cerium oxide ("FB-820" manufactured by Denka Co., Ltd., fused cerium oxide, average particle size 25 μm) (3-2) White pigment, oxidation Titanium (Tioxide R-TC30, rutile type titanium oxide, average particle size 0.4 μm made by Tioxide Japan KK)

(4)脫模劑 硬脂酸鋅(堺化學工業股份有限公司製「SZ-P」)(4) Release agent Zinc stearate ("SZ-P" manufactured by Suga Chemical Industry Co., Ltd.)

(5)橡膠粒子 ・橡膠粒子1:Mitsubishi Rayon Co., Ltd.製「S2001」、內核部:聚矽氧橡膠、外殼部:丙烯酸橡膠、平均粒徑200μm、25℃下之彈性模數0.1GPa ・橡膠粒子2:Mitsubishi Rayon Co., Ltd.製「S2200」、內核部:聚矽氧橡膠、外殼部:環氧樹脂、平均粒徑200μm、25℃下之彈性模數0.5GPa ・橡膠粒子3:Mitsubishi Rayon Co., Ltd.製「C-223A」、內核部:丁二烯橡膠、外殼部:丙烯酸橡膠、平均粒徑200μm、25℃下之彈性模數0.2GPa ・橡膠粒子4:Mitsubishi Rayon Co., Ltd.製「W-377」、內核部:丙烯酸橡膠、外殼部:丙烯酸橡膠、平均粒徑200μm、25℃下之彈性模數0.8GPa ・橡膠粒子5:The Dow Chemical Company製「EXL-2311」、內核部:丙烯酸橡膠、外殼部:苯乙烯、平均粒徑200μm、25℃下之彈性模數1.0GPa 上述橡膠粒子皆具有內核外殼結構。(5) Rubber particles and rubber particles 1: "S2001" manufactured by Mitsubishi Rayon Co., Ltd., core portion: polyoxyxene rubber, outer shell portion: acrylic rubber, average particle diameter 200 μm, elastic modulus at 25 ° C 0.1 GPa・Rubber particle 2: "S2200" manufactured by Mitsubishi Rayon Co., Ltd., core part: polyoxyxene rubber, outer shell: epoxy resin, average particle diameter of 200 μm, elastic modulus at 25 ° C, 0.5 GPa, rubber particle 3 : "C-223A" manufactured by Mitsubishi Rayon Co., Ltd., core portion: butadiene rubber, outer shell portion: acrylic rubber, average particle diameter: 200 μm, elastic modulus at 25 ° C, 0.2 GPa, rubber particle 4: Mitsubishi Rayon "W-377" manufactured by Co., Ltd., core portion: acrylic rubber, outer casing: acrylic rubber, average particle diameter: 200 μm, elastic modulus at 25 ° C, 0.8 GPa, rubber particle 5: "EXL, The Dow Chemical Company" -2311", core portion: acrylic rubber, outer shell portion: styrene, average particle diameter 200 μm, elastic modulus at 25 ° C 1.0 GPa The above rubber particles all have a core outer shell structure.

(6)纖維材 ・纖維材1:對矽灰石(KINSEI MATEC CO.,LTD.製「SH800」、平均纖維長度130μm、平均纖維徑長6.5μm、長寬比20)以甲基丙烯醯基矽烷施行表面處理所得的纖維材 ・纖維材2:對矽灰石(KINSEI MATEC CO.,LTD.製「SH800」、平均纖維長度130μm、平均纖維徑長6.5μm、長寬比20)以丙烯醯基矽烷施行表面處理所得的纖維材 ・纖維材3:業以甲基丙烯醯基矽烷施行表面處理的矽灰石(KINSEI MATEC CO.,LTD.製「FPW #800」、平均纖維長度12μm、平均纖維徑長4μm、長寬比3) ・纖維材4:業以甲基丙烯醯基矽烷施行表面處理的晶鬚(大塚化學股份有限公司製「Tismo N」、平均纖維長度20μm、平均纖維徑長0.6μm、長寬比33) ・纖維材5:未經表面處理的針狀氧化鋁(河合石灰工業股份有限公司製「Serra-sur BMI」、平均纖維長度6μm、平均纖維徑長1μm、長寬比6) ・纖維材6:業以甲基丙烯醯基矽烷施行表面處理的針狀氧化鋁(河合石灰工業股份有限公司製「Serra-sur BMI」、平均纖維長度6μm、平均纖維徑長1μm、長寬比6) ・纖維材7:業以甲基丙烯醯基矽烷進行處理的鱗片狀氧化鋁(河合石灰工業股份有限公司製「Serra-sur BMT」、平均纖維長度9μm、平均纖維徑長0.3μm、長寬比30)(6) Fibrous material and fiber material 1: 矽 矽 ( (“SH800” manufactured by KINSEI MATEC CO., LTD., average fiber length 130 μm, average fiber diameter 6.5 μm, aspect ratio 20) The fiber material and the fiber material 2 obtained by the surface treatment of decane: 矽 矽 ( (SH800, manufactured by KINSEI MATEC CO., LTD., average fiber length 130 μm, average fiber diameter 6.5 μm, aspect ratio 20) The fiber material and the fiber material 3 obtained by the surface treatment of the decyl hydride. The ash stone (the FPW #800, manufactured by KINSEI MATEC CO., LTD.) having an average surface length of 12 μm and an average Fiber diameter: 4 μm, length to width ratio 3) ・Fiber material 4: Whisker which is surface-treated with methacrylonitrile-based decane (Tismo N, manufactured by Otsuka Chemical Co., Ltd., average fiber length 20 μm, average fiber diameter) 0.6 μm, aspect ratio 33) ・Fiber material 5: Needle-shaped alumina without surface treatment (Serra-sur BMI, manufactured by Hohhot Lime Industry Co., Ltd.), average fiber length 6 μm, average fiber diameter 1 μm, length and width Than 6) ・Fiber 6: Benzene decyl decane Needle-shaped alumina (Serra-sur BMI, manufactured by Hohhot Lime Industry Co., Ltd., average fiber length 6 μm, average fiber diameter 1 μm, aspect ratio 6) ・Fiber material 7: methacrylic acid-based A scaly alumina treated with decane ("Serra-sur BMT" manufactured by Kahe Lime Industrial Co., Ltd., average fiber length 9 μm, average fiber diameter 0.3 μm, aspect ratio 30)

(7)補強材 ・玻璃纖維(日東紡績股份有限公司製「CS 3J-261S」) 使用混合器將表1~表4之組成欄所示原料,按該表1~表4所示摻合量予以混合而獲得混合物。(7) Reinforcing material and glass fiber ("CS 3J-261S" manufactured by Nitto Bose Co., Ltd.) The materials shown in the column of Tables 1 to 4 are mixed using a mixer, and the amounts are as shown in Tables 1 to 4. Mix to obtain a mixture.

接著使用加壓捏揉機將混合物在60℃以上且160℃以下範圍內之溫度下加熱並同時進行捏合。Next, the mixture was heated at a temperature of 60 ° C or more and 160 ° C or less using a pressure kneader while kneading.

接下來,使用製粒機將加熱捏合後之混合物加工成顆粒狀而獲得光反射體用成形材料。 <評估方法> (彎曲強度及彎曲彈性模數)Next, the mixture obtained by heating and kneading was processed into pellets using a granulator to obtain a molding material for a light reflector. <Evaluation method> (bending strength and flexural modulus)

使用光反射體用成形材料,利用射出成形製作遵照JIS K 6911之試驗片。成形條件係設為滾筒溫度80℃、射出壓力40MPa、模具溫度160℃、保持時間180秒。遵照JIS K 6911,測定所得試驗片在25℃下之彎曲強度及彎曲彈性模數。 (初始光反射率)A test piece according to JIS K 6911 was produced by injection molding using a molding material for a light reflector. The molding conditions were a drum temperature of 80 ° C, an injection pressure of 40 MPa, a mold temperature of 160 ° C, and a holding time of 180 seconds. The bending strength and flexural modulus of the obtained test piece at 25 ° C were measured in accordance with JIS K 6911. (initial light reflectance)

利用射出成形在射出壓力20MPa、模具溫度150℃、保持時間120秒之條件下將光反射體用成形材料成形,製作出厚度1mm之試驗片。以反射率測定器(日本電色工業股份有限公司製分光色彩計)測定所得試驗片在波長460nm下的初始光反射率。 (耐熱變色性)The light-reflecting body molding material was molded by injection molding under the conditions of an injection pressure of 20 MPa, a mold temperature of 150 ° C, and a holding time of 120 seconds to prepare a test piece having a thickness of 1 mm. The initial light reflectance of the obtained test piece at a wavelength of 460 nm was measured by a reflectance measuring instrument (a spectrophotometer manufactured by Nippon Denshoku Industries Co., Ltd.). (heat resistant discoloration)

將測出上述初始光反射率之試驗片在150℃下加熱1000小時後,再次以反射率測定器(日本電色工業股份有限公司製分光色彩計)測定該試驗片之光反射率。測定結果按以下基準做判定。 「◎」:光反射率為85%以上 「○」:光反射率為80%以上且低於85% 「△」:光反射率為75%以上且低於80% 「×」:光反射率低於75% (光隱蔽性)After the test piece in which the initial light reflectance was measured was heated at 150 ° C for 1,000 hours, the light reflectance of the test piece was measured again by a reflectance measuring instrument (Spectrophotometer manufactured by Nippon Denshoku Industries Co., Ltd.). The measurement results were judged on the basis of the following criteria. "◎": light reflectance is 85% or more "○": light reflectance is 80% or more and less than 85% "△": light reflectance is 75% or more and less than 80% "×": light reflectance Less than 75% (light concealment)

利用射出成形在射出壓力30MPa、模具溫度150℃、保持時間90秒之條件下將光反射體用成形材料成形,製作出厚度100μm之試驗片。以反射率測定器(日本電色工業股份有限公司製分光色彩計)測定所得試驗片在波長460nm下的透光率。測定結果按以下基準做判定。另,透光率愈低,以光反射體用成形材料製造出光反射體時,光就愈不易在厚度較小之部分穿透,於是可判斷光反射性愈不易隨光反射體小型・薄型化而降低。 「◎」:透光率低於1.5% 「○」:透光率為1.5%以上且低於2.0% 「△」:透光率為2.0%以上且低於3.0% 「×」:透光率為3.0%以上 (薄壁充填性)The light-reflecting body molding material was molded by injection molding under the conditions of an injection pressure of 30 MPa, a mold temperature of 150 ° C, and a holding time of 90 seconds to prepare a test piece having a thickness of 100 μm. The light transmittance of the obtained test piece at a wavelength of 460 nm was measured by a reflectance measuring instrument (a spectrophotometer manufactured by Nippon Denshoku Industries Co., Ltd.). The measurement results were judged on the basis of the following criteria. Further, the lower the light transmittance, the more the light is penetrated into the portion having a small thickness when the light reflector is formed from the molding material for the light reflector, so that the light reflectance is less likely to be smaller and thinner with the light reflector. And lower. "◎": light transmittance is less than 1.5% "○": light transmittance is 1.5% or more and less than 2.0% "△": light transmittance is 2.0% or more and less than 3.0% "×": light transmittance 3.0% or more (thin wall filling)

準備圖5A所示引線框架,並在該引線框架裝設於模具之狀態下,利用射出成形在射出壓力10MPa、模具溫度150℃、保持時間120秒之條件下將光反射體用成形材料成形。藉此,可如圖5B所示製造出光反射體的同時使光反射體與引線框架一體化。將光反射體及引線框架從模具取出,並在圖5B所示虛線位置切斷引線框架,將引線從引線框架之框切離。光反射體中厚度最小部分的厚度為30μm。確認該光反射體有無未充填。從其結果以下述方式評估薄壁充填性。The lead frame shown in FIG. 5A was prepared, and the light-reflecting body molding material was molded by injection molding under the conditions of an injection pressure of 10 MPa, a mold temperature of 150 ° C, and a holding time of 120 seconds while the lead frame was mounted on a mold. Thereby, the light reflector can be manufactured as shown in FIG. 5B while the light reflector is integrated with the lead frame. The light reflector and the lead frame are taken out from the mold, and the lead frame is cut at a position shown by a broken line in Fig. 5B, and the lead is cut away from the frame of the lead frame. The thickness of the smallest portion of the light reflector is 30 μm. Confirm whether or not the light reflector is not filled. From the results, the thin wall filling property was evaluated in the following manner.

「◎」:未發現光反射體未充填。"◎": No light reflector was found to be filled.

「○」:在光反射體之厚度40μm以下的部分發現未充填,厚度大於40μm的部分則未發現未充填。"○": The portion of the light reflector having a thickness of 40 μm or less was found to be unfilled, and the portion having a thickness of more than 40 μm was not found to be unfilled.

「△」:在光反射體之厚度大於40μm且60μm以下的部分發現未充填,厚度大於60μm的部分則未發現未充填。"△": The portion where the thickness of the light reflector is larger than 40 μm and 60 μm or less is not filled, and the portion having a thickness of more than 60 μm is not found to be unfilled.

「×」:在光反射體之厚度大於60μm且0.1mm以下的部分發現未充填,厚度大於0.1mm的部分則未發現未充填。 (纖維配向性)"X": The portion where the thickness of the light reflector is larger than 60 μm and 0.1 mm or less is not filled, and the portion having a thickness of more than 0.1 mm is not found to be unfilled. (fiber alignment)

在沿著製作光反射體時光反射體用成形材料流動方向之面切斷光反射體後,以掃描型電子顯微鏡觀察所形成之截面。並且,亦在製作光反射體時與光反射體用成形材料流動方向正交之面切斷光反射體後,以掃描型電子顯微鏡觀察所形成之截面。根據該等結果確認光反射體中之纖維材有無配向。其結果,纖維配向性在發現有配向之情況評估為「有」,未發現配向之情況則評估為「無」。 (引線彎曲耐性)The light reflector was cut along the surface in which the light reflector was flowed in the direction in which the light reflector was formed, and the formed cross section was observed by a scanning electron microscope. Further, when the light reflector is produced, the light reflector is cut on the surface orthogonal to the flow direction of the light reflector for the molding material, and the formed cross section is observed by a scanning electron microscope. Based on these results, it was confirmed whether or not the fiber material in the light reflector was aligned. As a result, the fiber alignment was evaluated as "having" when the alignment was found, and "none" was found when the alignment was not found. (lead bending resistance)

使用具有480個格子之引線框架,來製作具備光反射體及引線的480個試樣。針對各試樣,在光反射體已固定之狀態下以如圖3A~圖3C所示方式對引線施行彎折加工後,以顯微鏡觀察光反射體,確認有無裂痕。從其結果以下述方式評估引線彎曲耐性。A 480 sample having a light reflector and a lead was produced using a lead frame having 480 grids. For each sample, the lead was bent in a state where the light reflector was fixed, as shown in FIGS. 3A to 3C, and the light reflector was observed under a microscope to confirm the presence or absence of cracks. From the results, the lead bending resistance was evaluated in the following manner.

「◎」:所有試樣皆未於光反射體發現裂痕。"◎": All samples were not found to have cracks in the light reflector.

「○」:有1個以上且5個以下之試樣於光反射體發現裂痕。"○": One or more and five or less samples were found to have cracks in the light reflector.

「△」:有6個以上且10個以下之試樣於光反射體發現裂痕。"△": Six or more and ten or less samples were found to have cracks in the light reflector.

「×」:有11個以上試樣於光反射體發現裂痕。"X": More than 11 samples were found to have cracks in the light reflector.

[表1] [Table 1]

[表2] [Table 2]

[表3] [table 3]

[表4] [Table 4]

1‧‧‧光反射體1‧‧‧Light reflector

2‧‧‧引線2‧‧‧ lead

3‧‧‧發光元件3‧‧‧Lighting elements

5‧‧‧密封材5‧‧‧ Sealing material

6‧‧‧發光裝置6‧‧‧Lighting device

7‧‧‧基板7‧‧‧Substrate

8‧‧‧內面8‧‧‧ inside

9‧‧‧外面9‧‧‧ outside

10‧‧‧周壁10‧‧‧Wall

11‧‧‧凹處11‧‧‧ recess

12‧‧‧內周面12‧‧‧ inner circumference

13‧‧‧橡膠粒子13‧‧‧ rubber particles

14‧‧‧內核部14‧‧‧ Kernel Department

15‧‧‧外殼部15‧‧‧ Shell Department

16‧‧‧接枝鏈16‧‧‧Graft chain

17‧‧‧底面17‧‧‧ bottom

18‧‧‧上壁部18‧‧‧Upper wall

19‧‧‧下壁部19‧‧‧ Lower Wall

20‧‧‧側壁部20‧‧‧ Sidewall

21‧‧‧第一引線21‧‧‧First lead

22‧‧‧第二引線22‧‧‧second lead

23‧‧‧反射面23‧‧‧reflecting surface

30‧‧‧澆口痕30‧‧‧Spot mark

40‧‧‧基體40‧‧‧ base

41‧‧‧金屬線41‧‧‧Metal wire

71、72‧‧‧端子71, 72‧‧‧ terminals

73‧‧‧面73‧‧‧ Face

101‧‧‧第1成形部101‧‧‧1st forming department

102‧‧‧第2成形部102‧‧‧2nd forming department

170‧‧‧框170‧‧‧ box

180‧‧‧支桿180‧‧‧ pole

200‧‧‧引線框架200‧‧‧ lead frame

211‧‧‧內部端子211‧‧‧Internal terminals

212‧‧‧外部端子212‧‧‧External terminals

221‧‧‧內部端子221‧‧‧Internal terminals

222‧‧‧外部端子222‧‧‧External terminals

D1、D3‧‧‧距離D1, D3‧‧‧ distance

D2‧‧‧尺寸D2‧‧‧ size

L‧‧‧光L‧‧‧Light

X101‧‧‧距離X101‧‧‧ distance

X1‧‧‧尺寸X1‧‧‧ size

Y1‧‧‧尺寸Y1‧‧‧ size

Z1‧‧‧尺寸Z1‧‧‧ size

圖1係顯示本發明一實施形態中具備光反射體之發光裝置及基板的立體圖。圖1中,X軸、Y軸及Z軸表示相互正交之方向。 圖2中,圖2A為圖1之發光裝置的A-A截面圖。圖2B為圖1之發光裝置的B-B截面圖。圖2A及圖2B中,X軸、Y軸及Z軸表示相互正交之方向。 圖3中,圖3A~圖3B係顯示對已與光反射體組合之引線施行彎折加工之一連串樣貌一例的立體圖。圖3A~圖3C中,X軸、Y軸及Z軸表示相互正交之方向。 圖4中,圖4A~圖4B係顯示對已與光反射體組合之引線施行彎折加工之一連串樣貌之另一例的立體圖。圖4A~圖4C中,X軸、Y軸及Z軸表示相互正交之方向。 圖5中,圖5A係顯示引線框架一例的俯視圖。圖5B係顯示圖5A之引線框架及與該引線框架一體形成之光反射體的俯視圖。 圖6中,圖6A係顯示本發明之另一實施形態中引線框架及與該引線框架一體形成之光反射體的俯視圖。圖6B係圖6A之C-C截面圖。圖6C係圖6A之仰視圖。圖6D係圖6A之側視圖。圖6E係圖6A之D-D截面圖。圖6F係圖6A中之α部分的擴大圖。 圖7中,圖7A係顯示被支桿垂吊之光反射體的俯視圖。圖7B係顯示被支桿垂吊之光反射體的立體圖。 圖8係橡膠粒子的示意截面圖。Fig. 1 is a perspective view showing a light-emitting device and a substrate including a light reflector according to an embodiment of the present invention. In Fig. 1, the X-axis, the Y-axis, and the Z-axis indicate directions orthogonal to each other. 2, FIG. 2A is a cross-sectional view taken along line A-A of the light-emitting device of FIG. 1. 2B is a cross-sectional view taken along line B-B of the light-emitting device of FIG. 1. In FIGS. 2A and 2B, the X axis, the Y axis, and the Z axis indicate directions orthogonal to each other. In Fig. 3, Figs. 3A to 3B are perspective views showing an example of a series of appearances of a bending process of a lead wire combined with a light reflector. In FIGS. 3A to 3C, the X axis, the Y axis, and the Z axis indicate directions orthogonal to each other. In Fig. 4, Figs. 4A to 4B are perspective views showing another example of a series of appearances of bending of a lead which has been combined with a light reflector. In FIGS. 4A to 4C, the X-axis, the Y-axis, and the Z-axis indicate directions orthogonal to each other. In Fig. 5, Fig. 5A is a plan view showing an example of a lead frame. Fig. 5B is a plan view showing the lead frame of Fig. 5A and a light reflector integrally formed with the lead frame. Fig. 6 is a plan view showing a lead frame and a light reflector integrally formed with the lead frame according to another embodiment of the present invention. Figure 6B is a cross-sectional view taken along line C-C of Figure 6A. Figure 6C is a bottom view of Figure 6A. Figure 6D is a side view of Figure 6A. Figure 6E is a cross-sectional view taken along line D-D of Figure 6A. Fig. 6F is an enlarged view of the α portion in Fig. 6A. In Fig. 7, Fig. 7A is a plan view showing a light reflector suspended by a strut. Fig. 7B is a perspective view showing a light reflector suspended by a strut. Fig. 8 is a schematic cross-sectional view of rubber particles.

Claims (22)

一種光反射體,含有光反射體用成形材料之硬化物,且具備周壁及被前述周壁包圍之凹處; 前述周壁包含厚度為100μm以下的部分, 前述光反射體用成形材料含有熱硬化性樹脂及白色纖維材。A light reflector comprising a cured product of a molding material for a light reflector, and includes a peripheral wall and a recess surrounded by the peripheral wall; the peripheral wall includes a portion having a thickness of 100 μm or less, and the molding material for the light reflector contains a thermosetting resin And white fiber. 如請求項1之光反射體,其中前述白色纖維材含有矽灰石。The light reflector of claim 1, wherein the white fiber material comprises a limestone. 如請求項1或2之光反射體,其中前述白色纖維材之長寬比在3以上且500以下之範圍內。The light reflector of claim 1 or 2, wherein the white fiber material has an aspect ratio in the range of 3 or more and 500 or less. 如請求項1或2之光反射體,其中相對於前述熱硬化性樹脂100質量份,前述光反射體用成形材料中之前述白色纖維材的含量在10質量份以上且240質量份以下之範圍內。The light reflector of claim 1 or 2, wherein the content of the white fiber material in the molding material for a light reflector is in the range of 10 parts by mass or more and 240 parts by mass or less with respect to 100 parts by mass of the thermosetting resin. Inside. 如請求項1或2之光反射體,其中前述光反射體用成形材料不含玻璃纖維,或是含有玻璃纖維且相對於前述光反射體用成形材料總量,前述玻璃纖維之含量為10質量%以下。The light reflector of claim 1 or 2, wherein the forming material for the light reflector does not contain glass fibers or contains glass fibers and the total amount of the glass fibers is 10 masses with respect to the total amount of the forming materials for the light reflectors. %the following. 如請求項1或2之光反射體,其中前述白色纖維材業經矽烷耦合劑處理。A light reflector according to claim 1 or 2, wherein the aforementioned white fiber material is treated with a decane coupling agent. 如請求項1或2之光反射體,其中前述光反射體用成形材料更含有橡膠粒子,且前述橡膠粒子具備內核部及覆蓋前述內核部之外殼部。The light reflector of claim 1 or 2, wherein the light reflector molding material further contains rubber particles, and the rubber particles have an inner core portion and an outer shell portion covering the inner core portion. 如請求項7之光反射體,其中前述外殼部對前述熱硬化性樹脂具反應性。The light reflector of claim 7, wherein the outer shell portion is reactive with the thermosetting resin. 如請求項7之光反射體,其中相對於前述光反射體用成形材料總量,前述光反射體用成形材料中之前述橡膠粒子之含量在0.1質量%以上且30質量%以下之範圍內。The light reflector of claim 7, wherein the content of the rubber particles in the molding material for a light reflector is in a range of 0.1% by mass or more and 30% by mass or less based on the total amount of the molding material for the light reflector. 如請求項7之光反射體,其中前述橡膠粒子之平均粒徑在0.1μm以上且1mm以下之範圍內。The light reflector of claim 7, wherein the rubber particles have an average particle diameter in a range of 0.1 μm or more and 1 mm or less. 如請求項7之光反射體,其中前述內核部含有選自於由聚矽氧橡膠、丙烯酸橡膠及丁二烯橡膠所構成群組中之1種以上成分。The light reflector of claim 7, wherein the core portion contains one or more components selected from the group consisting of polyoxyxene rubber, acrylic rubber, and butadiene rubber. 如請求項7之光反射體,其中前述橡膠粒子在25℃下之彈性模數為1GPa以下。The light reflector of claim 7, wherein the rubber particles have an elastic modulus of 1 GPa or less at 25 °C. 如請求項1或2之光反射體,其中前述光反射體用成形材料之硬化物在25℃下之彎曲強度為70MPa以上。The light reflector of claim 1 or 2, wherein the cured product of the molding material for the light reflector has a bending strength at 25 ° C of 70 MPa or more. 如請求項1或2之光反射體,其中前述光反射體用成形材料之硬化物在25℃下之彎曲彈性模數在4~15GPa之範圍內。The light reflector of claim 1 or 2, wherein the cured product of the shaped material for the light reflector has a flexural modulus at 25 ° C in the range of 4 to 15 GPa. 如請求項1或2之光反射體,其中前述熱硬化性樹脂含有選自於由不飽和聚酯樹脂、環氧樹脂及苯酚樹脂所構成群組中之1種以上成分。The light-reflecting body of claim 1 or 2, wherein the thermosetting resin contains one or more components selected from the group consisting of unsaturated polyester resins, epoxy resins, and phenol resins. 如請求項1或2之光反射體,其中前述凹處之深度在0.3mm以上且0.4mm以下之範圍內。The light reflector of claim 1 or 2, wherein the depth of the recess is in a range of 0.3 mm or more and 0.4 mm or less. 一種基體,具備如請求項1至16中任一項之光反射體及埋入前述光反射體之引線,並且,前述引線具備在前述凹處之內面露出的內部端子及從前述光反射體之外面突出的外部端子。A substrate comprising: a light reflector according to any one of claims 1 to 16; and a lead embedded in the light reflector; wherein the lead has an internal terminal exposed on an inner surface of the recess and the light reflector External terminals protruding outside. 一種發光裝置,具備如請求項17之基體及發光元件,並且,前述發光元件與前述引線之前述內部端子電連接並搭載在前述光反射體之前述凹處的內部。A light-emitting device comprising the substrate of claim 17 and a light-emitting element, wherein the light-emitting element is electrically connected to the internal terminal of the lead and mounted inside the recess of the light reflector. 如請求項18之發光裝置,其中前述發光元件至前述周壁之內周面間的最短距離為0.15mm以下。The light-emitting device of claim 18, wherein the shortest distance between the light-emitting elements and the inner peripheral surface of the peripheral wall is 0.15 mm or less. 一種基體之製造方法,係製造如請求項17之基體的製造方法,其包含將光反射體用成形材料予以成形來製作光反射體的製程,並且,在製作前述光反射體時,以前述引線部分從前述光反射體突出的方式,使前述光反射體與引線一體化。A method for producing a substrate, comprising the method for producing a substrate according to claim 17, comprising the steps of: forming a light reflector by forming a light reflector, and forming the light reflector, and forming the light reflector The light reflector is partially integrated with the lead wire so as to protrude from the light reflector. 如請求項20之基體之製造方法,其包含下述製程:在製作前述光反射體時使用引線框架,且該引線框架具備框及與前述框相連之前述引線,並於製作前述光反射體後,將前述引線從前述框切離。A method of manufacturing a substrate according to claim 20, comprising: a lead frame used in the production of the light reflector, wherein the lead frame has a frame and the lead connected to the frame, and after the light reflector is fabricated The aforementioned lead wires are cut away from the aforementioned frame. 如請求項20或21之基體之製造方法,其還包含於製作前述光反射體後,將前述引線彎折的製程。The method for producing a substrate according to claim 20 or 21, further comprising the step of bending the lead wire after the light reflector is fabricated.
TW106122349A 2016-07-19 2017-07-04 Reflector, base body, light emitting device and method of manufacturing the base body TWI723193B (en)

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