TW201828406A - Holder for substrates - Google Patents
Holder for substrates Download PDFInfo
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- TW201828406A TW201828406A TW106141693A TW106141693A TW201828406A TW 201828406 A TW201828406 A TW 201828406A TW 106141693 A TW106141693 A TW 106141693A TW 106141693 A TW106141693 A TW 106141693A TW 201828406 A TW201828406 A TW 201828406A
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- holder
- substrate
- groove
- carrier
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- 239000000758 substrate Substances 0.000 title claims abstract description 139
- 239000000463 material Substances 0.000 claims abstract description 48
- 238000000034 method Methods 0.000 claims description 21
- 239000011521 glass Substances 0.000 description 42
- 238000000151 deposition Methods 0.000 description 40
- 230000008021 deposition Effects 0.000 description 38
- 238000012545 processing Methods 0.000 description 18
- 239000002245 particle Substances 0.000 description 9
- 238000005240 physical vapour deposition Methods 0.000 description 7
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 238000005137 deposition process Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 150000004767 nitrides Chemical class 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 230000009351 contact transmission Effects 0.000 description 2
- -1 etc.) Substances 0.000 description 2
- 238000005339 levitation Methods 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/001—General methods for coating; Devices therefor
- C03C17/002—General methods for coating; Devices therefor for flat glass, e.g. float glass
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4587—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially vertically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/02—Controlled or contamination-free environments or clean space conditions
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
本揭露的實施例是有關於一種用於在處理(例如,用於層沉積)期間固持基板的固持件。本揭露的實施例特別是有關於一種配置成附接到載具的載具本體的固持件,用於在真空層沉積期間固持基板。具體而言,本揭露的實施例是有關於一種配置成附接到用於固持基板的載具的載具本體的固持件、一種用於固持一個或多個基板的載具以及一種用於將基板固定在具有載具主體的載具中的方法。Embodiments of the present disclosure relate to a holder for holding a substrate during processing (eg, for layer deposition). Embodiments of the present disclosure are particularly related to a holder configured to be attached to a carrier body of a carrier for holding a substrate during vacuum layer deposition. Specifically, embodiments of the present disclosure relate to a holder configured to be attached to a carrier body for holding a substrate for a substrate, a holder for holding one or more substrates, and a device for Method for fixing a substrate in a carrier having a carrier body.
已知用於在基板上沉積材料的數種方法。例如,可以藉由物理氣相沉積(PVD)處理,化學氣相沉積(CVD)處理,電漿增強化學氣相沉積(PECVD)處理等來塗覆基板。通常,該處理在處理設備或處理腔室中執行,待塗覆的基板位於該處。在設備中提供一沉積材料。多種材料以及其氧化物、氮化物或碳化物可以用於沉積在基板上。此外,可以在處理室中進行其他處理動作,例如蝕刻、構造、退火等。Several methods are known for depositing materials on a substrate. For example, the substrate may be coated by a physical vapor deposition (PVD) process, a chemical vapor deposition (CVD) process, a plasma enhanced chemical vapor deposition (PECVD) process, or the like. Usually, the processing is performed in a processing equipment or processing chamber, where the substrate to be coated is located. A deposition material is provided in the apparatus. A variety of materials and their oxides, nitrides, or carbides can be used for deposition on a substrate. In addition, other processing operations such as etching, structuring, and annealing can be performed in the processing chamber.
塗層材料可用於數種應用和數個技術領域。例如,應用在微電子領域,例如生成半導體元件。此外,用於顯示器的基板通常藉由物理氣相沉積(PVD)處理被塗覆。其他應用包括絕緣板,有機發光二極體(OLED)面板,具有薄膜電晶體(TFT)的基板、彩色濾光片等。Coating materials can be used in several applications and in several technical fields. For example, it is used in the field of microelectronics, such as generating semiconductor elements. In addition, substrates for displays are usually coated by a physical vapor deposition (PVD) process. Other applications include insulating plates, organic light emitting diode (OLED) panels, substrates with thin film transistors (TFTs), color filters, and more.
通常,玻璃基板可在其處理期間被支撐在載具上。載具支撐玻璃或基板並藉由處理機器驅動。也就是說,載具驅動玻璃或基板。載具通常形成一框架或一板子,其沿著基板周邊支撐基板,或者在後者的情況下支撐基板表面。Generally, the glass substrate may be supported on a carrier during its processing. The carrier supports the glass or substrate and is driven by a processing machine. That is, the carrier drives glass or a substrate. The carrier usually forms a frame or a plate that supports the substrate along the periphery of the substrate, or in the latter case, the surface of the substrate.
為了將基板固定在載具中,存在不同的固持裝置,例如玻璃固持件。由於增加的顆粒要求,例如對於薄膜電晶體(TFT)應用來說,避免產生粒子變得更重要。側面沉積在載具和固持件上,例如夾具,以及固持件內的玻璃運動,例如玻璃夾,是靠近玻璃表面的主要顆粒發生器。In order to fix the substrate in the carrier, there are different holding devices, such as a glass holder. Due to increased particle requirements, for example for thin-film transistor (TFT) applications, avoiding particle generation becomes even more important. Sides are deposited on carriers and holders, such as clamps, and glass movements within the holder, such as glass clamps, are the main particle generators near the glass surface.
鑑於上述,提供一種固持件,特別是配置成附接到用於固持基板的載具的固持件是有益的,其克服了本領域中的至少一些問題。In view of the foregoing, it would be beneficial to provide a holder, particularly a holder configured to be attached to a carrier for holding a substrate, which overcomes at least some of the problems in the art.
鑑於上述,提供一種配置成附接到用於固持基板的載具的載具本體的固持件、一種載具以及一種用於將基板固定在載具中的方法。本揭露的其它方面、優點和特徵從附屬項、說明書和所附圖式中顯而易見。In view of the above, there are provided a holder configured to be attached to a carrier body for holding a substrate, a carrier, and a method for fixing a substrate in the carrier. Other aspects, advantages, and features of the disclosure are apparent from the appended claims, the description, and the drawings.
根據一個實施例,提供一種配置成附接到載具主體以用於固持基板的固持件。固持件包括配置成面對材料源或遮罩的一前部以及配置成背離材料源的一後部,其中後部包括具有傾斜表面的一斜面部分以及用於接收設置在前部和後部之間的基板的一凹槽。According to one embodiment, a holder configured to be attached to a carrier body for holding a substrate is provided. The holder includes a front portion configured to face the source of material or a shield, and a rear portion configured to face away from the source of material, wherein the rear portion includes an inclined portion having an inclined surface and a substrate for receiving between the front portion and the rear portion. A groove.
根據另一方面,提供一種包括至少一固持件的載具。至少一固持件包括配置成面對材料源或遮罩的一前部以及配置成背離材料源的一後部,其中後部包括具有傾斜表面的一斜面部分以及用於接收設置在前部和後部之間的基板的一凹槽。According to another aspect, a carrier including at least one holder is provided. The at least one retaining member includes a front portion configured to face the source of material or a mask, and a rear portion configured to face away from the source of material, wherein the rear portion includes a sloped portion having an inclined surface and is configured to receive a portion disposed between the front and rear A groove in the substrate.
根據又一方面,提供一種用於將基板固定在具有載具本體的載具中的方法。該方法包括將基板裝載在載具上;使至少一固持件相對於載具主體朝向基板移動,所述至少一固持件包括斜面部分;以及利用斜面部分在槽的第一部分中引導基板。According to yet another aspect, a method for fixing a substrate in a carrier having a carrier body is provided. The method includes loading a substrate on a carrier; moving at least one holder toward the substrate relative to the carrier body, the at least one holder including an inclined surface portion; and using the inclined surface portion to guide the substrate in a first portion of the groove.
為了能夠詳細理解本揭露的上述特徵的方式,可以藉由參考實施例來提供上面發明內容揭露的更具體的描述。所附圖式關於本揭露的實施例,並且描述如下:In order to be able to understand the manner of the above features of the present disclosure in detail, a more specific description of the above disclosure may be provided by referring to the embodiments. The attached drawings are related to the embodiments of the present disclosure and are described as follows:
現在將詳細參考本揭露的各種實施例,其中的一個或多個示例在圖式中描述。在圖式的以下描述中,相同的元件符號指示相同的組件。通常,僅描述關於各個實施例的差異。每個示例是藉由對本揭露的解釋來提供的,並不意味著對本揭露的限制。此外,做為一個實施例的一部分闡述或描述的特徵可以用在其他實施例上或與其他實施例結合使用,以產生又一個實施例。這意味著描述包括這樣的修改和變化。Reference will now be made in detail to various embodiments of the present disclosure, one or more examples of which are illustrated in the drawings. In the following description of the drawings, the same element symbols indicate the same components. Generally, only the differences with respect to the various embodiments are described. Each example is provided by way of explanation of this disclosure and is not meant to be a limitation on this disclosure. In addition, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet another embodiment. This means that the description includes such modifications and changes.
根據本文描述的實施例,提供一種包括至少一個固持件的載具。所述至少一個固持件配置成固持或夾持基板。固持件包括斜面部分,以在具有小間隙(例如0.5mm或更小的間隙,例如大約0.1mm)的另一個凹槽部分中形成引導基板的凹槽的一部分。According to embodiments described herein, a carrier is provided that includes at least one holder. The at least one holding member is configured to hold or clamp the substrate. The holder includes a chamfered portion to form a part of a groove of the guide substrate in another groove portion having a small gap (for example, a gap of 0.5 mm or less, for example, about 0.1 mm).
根據可與本文所述的其他實施例組合的一些實施例,基板厚度可為0.1至1.8mm,並且固持件可適用於這種基板厚度。當基板厚度約為0.9mm或更小時,例如0.7mm或0.5mm或0.3mm,並且固持件特別適用於這種基板厚度時,這可能是特別有利的。固持件也可以適用於更小或更大的基板厚度。根據可以與本文描述的其他實施例組合的一些實施例,包括至少一個固持件的固持件或載具可以適用於特定的玻璃厚度。與特定玻璃厚度相比具有較小厚度的玻璃基板也可以由固持件或包括固持件的載具支撐。According to some embodiments that may be combined with other embodiments described herein, the substrate thickness may be 0.1 to 1.8 mm, and the holder may be suitable for such a substrate thickness. This may be particularly advantageous when the substrate thickness is about 0.9 mm or less, such as 0.7 mm or 0.5 mm or 0.3 mm, and the holder is particularly suitable for such a substrate thickness. The holder can also be adapted for smaller or larger substrate thicknesses. According to some embodiments that may be combined with other embodiments described herein, a holder or carrier including at least one holder may be adapted for a particular glass thickness. A glass substrate having a smaller thickness than a specific glass thickness may also be supported by a holder or a carrier including the holder.
根據可與本文所述的其它實施例結合的一些實施例,大面積基板可具有至少0.174m2 的尺寸。尺寸可以是約1.375m2 至約10m2 ,更通常是約2m2 至約11m2 或甚至高達12m2 。通常,提供根據本文所述的實施例的遮罩結構、設備和方法的矩形基板是如本文所述的大面積基板。例如,大面積基板可以是第5代其對應於約1.4m2 基板(1.1m×1.3m)、第7代其對應於約4.39m2 基板(1.95m×2.25m)、第8.5代其對應於約5.5m2 的基板(2.2m×2.5m),甚至是第10代其對應於約8.7m2 的基板(2.85m×3.05m)。甚至更大的世代例如第11代和第12代以及相對應的基板面積可類似地實現。然而,本領域具有通常知識者可以理解,固持件可以用於任何基板尺寸,即甚至比以上概述的更小或更大的基板尺寸。According to some embodiments that may be combined with other embodiments described herein, the large-area substrate may have a size of at least 0.174 m 2 . The size can be from about 1.375m 2 to about 10m 2 , more usually from about 2m 2 to about 11m 2 or even up to 12m 2 . Generally, a rectangular substrate that provides a mask structure, apparatus, and method according to embodiments described herein is a large area substrate as described herein. For example, a large-area substrate may be the fifth generation corresponding to a substrate of about 1.4m 2 (1.1m × 1.3m), the seventh generation corresponding to a substrate of about 4.39m 2 (1.95m × 2.25m), and the corresponding generation of 8.5 On the substrate of about 5.5m 2 (2.2m × 2.5m), even the 10th generation substrate corresponding to about 8.7m 2 (2.85m × 3.05m). Even larger generations such as the 11th and 12th generations and corresponding substrate areas can be similarly implemented. However, those of ordinary skill in the art will understand that the holder can be used for any substrate size, that is, even smaller or larger substrate sizes than outlined above.
通常,基板可以由適合於材料沉積的任何材料製成。例如,基板可以由選自玻璃(例如鈉鈣玻璃,硼矽酸鹽玻璃等)、金屬、聚合物、陶瓷、複合材料、碳纖維材料或任何其他材料或可以藉由沉積處理而被塗覆的材料的組合。Generally, the substrate can be made of any material suitable for material deposition. For example, the substrate may be selected from glass (e.g., soda lime glass, borosilicate glass, etc.), metal, polymer, ceramic, composite material, carbon fiber material, or any other material or material that may be coated by a deposition process The combination.
第1圖繪示根據本文描述的實施例的載具100,並且具有至少一個固持件200。載具100配置成用於支撐基板101。如第1圖所示,基板101是設置在載具100內的一位置處,特別是在處理室中進行處理時。載具100包括一框架或一載具本體160。例如,載具本體可以定義一窗口或一開孔。根據典型的實施方式,載具本體160提供一基板接收表面。FIG. 1 illustrates a carrier 100 according to an embodiment described herein and has at least one holder 200. The carrier 100 is configured to support the substrate 101. As shown in FIG. 1, the substrate 101 is disposed at a position in the carrier 100, particularly when processing is performed in a processing chamber. The carrier 100 includes a frame or a carrier body 160. For example, the vehicle body may define a window or an opening. According to a typical embodiment, the carrier body 160 provides a substrate receiving surface.
第1圖進一步繪示可以配置在載具100的下部的導桿162,例如是一桿件。在操作期間,導桿162可以設置在載具本體160的下方。導桿可配置成與傳輸系統(例如滾輪裝置)接觸。載具100還可以包括上部導向裝置164。上部導向裝置164可以配置成用於支撐載具100與傳輸系統的上部的位置。FIG. 1 further illustrates a guide rod 162 that can be disposed at the lower portion of the carrier 100, such as a rod member. During operation, the guide bar 162 may be disposed below the carrier body 160. The guide can be configured to contact a transfer system, such as a roller device. The carrier 100 may further include an upper guide 164. The upper guide 164 may be configured to support the position of the carrier 100 and the upper portion of the transport system.
根據另外的實施例,載具可配置用於非接觸式傳輸,例如利用磁懸浮系統。用於非接觸式傳輸的載具的裝置可以在載具的上部具有磁性元件,該磁性元件是配置為與磁懸浮系統相互作用。載具的下部可以配置成用於載具的橫向穩定,或者載具本體160可以懸掛在非接觸式傳輸裝置中。According to further embodiments, the vehicle may be configured for non-contact transmission, such as using a magnetic levitation system. The device for a contactless transmission vehicle may have a magnetic element on the upper portion of the vehicle, the magnetic element being configured to interact with a magnetic levitation system. The lower part of the vehicle may be configured for lateral stability of the vehicle, or the vehicle body 160 may be suspended in a non-contact transmission device.
根據可以與本文所述的其他實施例組合的一些實施例,多個固持件200可以是可移動的,特別是可以在垂直於或基本上垂直於載具本體的邊緣的方向上移動。例如,載具的邊緣可以是由載具形成的開孔的邊緣。固持件可以在垂直於或基本上垂直於由固持件支撐的基板的各別邊緣的方向上移動。在第1圖中,固持件的移動由箭頭201表示。根據一些實施例,在載具本體的一側(左側或右側)的固持件200和在載具本體的頂側或底側的固持件200,特別是如第1圖所示在載具的頂側,可以移動。載具本體160包括第一側、第二側、第三側和第四側。在此,在第一側、第二側、第三側和第四側的每一側上可以設置至少八個固持件,特別是至少24個固持件,第四側至少八個固持件中的至少兩個相對應的固持件被安裝。固持件的至少兩個相對應的固持件可移動地安裝在第一側、第二側、第三側和第四側的兩個相鄰位置上。According to some embodiments that may be combined with other embodiments described herein, the plurality of holders 200 may be movable, and in particular may be moved in a direction perpendicular to or substantially perpendicular to an edge of the carrier body. For example, the edge of the vehicle may be the edge of an opening formed by the vehicle. The holders can be moved in a direction perpendicular to or substantially perpendicular to the respective edges of the substrate supported by the holders. In FIG. 1, the movement of the holder is indicated by an arrow 201. According to some embodiments, the holder 200 on one side (left or right) of the vehicle body and the holder 200 on the top or bottom side of the vehicle body, particularly on the top of the vehicle as shown in FIG. 1 Side can be moved. The carrier body 160 includes a first side, a second side, a third side, and a fourth side. Here, at least eight holding members may be provided on each of the first side, the second side, the third side, and the fourth side, in particular at least 24 holding members, At least two corresponding holders are installed. At least two corresponding holders of the holder are movably mounted on two adjacent positions of the first side, the second side, the third side, and the fourth side.
固持件可以在載具的兩個相鄰的側面上移動,例如第1圖中的右側和頂側。移動固持件允許縮回固持件200。固持件200可以縮回以將玻璃基板裝載或卸載到載具本體中。藉由如第1圖中的箭頭201所示的那樣縮回固持件,分別由載具本體或固持件200形成的開孔增大。增加的開孔尺寸為玻璃基板的裝載或卸載提供了足夠的空間。The holder can be moved on two adjacent sides of the carrier, such as the right side and the top side in FIG. 1. Moving the holder allows the holder 200 to be retracted. The holder 200 can be retracted to load or unload the glass substrate into the carrier body. By retracting the holder as shown by arrow 201 in FIG. 1, the openings formed by the carrier body or the holder 200 are increased, respectively. The increased opening size provides sufficient space for loading or unloading the glass substrate.
根據可與本文所述的其他實施例組合的一些實施例,載具本體160可由鋁、鋁合金、鈦、鈦鋁合金、不銹鋼等製成。對於比較小的大面積基板,例如第5代或以下,載具本體160可以由單件製成,即框架是一體成形的。然而,根據可與本文所述的其他實施例組合的一些實施例,載具本體160可包括兩個或更多個元件,例如頂桿,側桿和底桿。特別是對於非常大面積的基板,載具或載具本體可以製造成具有多個部分。載具本體的這些部分被組裝以提供用於支撐基板101的載具本體160。載具本體160是特別配置用於接收基板區域中的基板101。基板區域例如是載具的開孔。According to some embodiments that may be combined with other embodiments described herein, the carrier body 160 may be made of aluminum, aluminum alloy, titanium, titanium aluminum alloy, stainless steel, or the like. For relatively small large-area substrates, such as the fifth generation or below, the carrier body 160 may be made of a single piece, that is, the frame is integrally formed. However, according to some embodiments that may be combined with other embodiments described herein, the carrier body 160 may include two or more elements, such as a top post, a side post, and a bottom post. Especially for very large area substrates, the carrier or carrier body can be manufactured with multiple parts. These parts of the carrier body are assembled to provide a carrier body 160 for supporting the substrate 101. The carrier body 160 is a substrate 101 specifically configured to receive a substrate region. The substrate region is, for example, an opening of a carrier.
第2圖繪示固持件20,其可以與普通的夾具相比較。固持件或夾具具有矩形剖面的基板接收部分或凹槽30,即矩形凹槽。固持件20具有後部216、前部和中間部分212。中間部分212連接前部214和後部216。前部214面向沉積材料或材料源。材料沉積的方向由箭頭25表示。後部216遠離沉積材料,使得在沉積材料和後部216之間提供基板101。FIG. 2 shows the holding member 20, which can be compared with a general jig. The holder or jig has a substrate receiving portion or groove 30 having a rectangular cross-section, that is, a rectangular groove. The holder 20 has a rear portion 216, a front portion, and a middle portion 212. The middle portion 212 connects the front portion 214 and the rear portion 216. The front portion 214 faces the deposited material or material source. The direction of material deposition is indicated by arrow 25. The rear portion 216 is remote from the deposition material so that a substrate 101 is provided between the deposition material and the rear portion 216.
對於具有矩形基板接收部分30的固持件或夾具,在固持件或夾具與玻璃之間可存在相對較大的間隙,以便使玻璃容易進入固持件或夾具。例如,第2圖繪示後部216與基板101的玻璃之間的後部間隙21以及前部214與基板101的玻璃之間的前部間隙23。該間隙允許課程在固持件的凹槽內移動,即專利申請範圍。For a holder or jig having a rectangular substrate receiving portion 30, there may be a relatively large gap between the holder or the jig and the glass so that the glass can easily enter the holder or the jig. For example, FIG. 2 illustrates a rear gap 21 between the rear portion 216 and the glass of the substrate 101 and a front gap 23 between the front portion 214 and the glass of the substrate 101. This gap allows the course to move within the groove of the holder, which is the scope of the patent application.
如第2圖所示,沿著由箭頭25所示的方向沉積到基板101上的材料可能導致側面沉積50,即,在固持件20上不希望材料的沉積。側面沉積50可以特別蔓延到前部間隙23中。基板101和固持件之間的摩擦可能導致顆粒產生。玻璃遮罩間的間隙26例如由前部間隙23、在前部214處的固持件的寬度以及遮罩固持件間的間隙27提供。由於夾具內部的不確定的玻璃位置,玻璃遮罩間的間隙26可能相對較大,例如導致較大的前部間隙23。前部間隙23相對於固持件設置在固持件和玻璃之間。固持件或夾具可以彼此分離地設置,進而產生例如在固持件和遮罩70之間的遮罩固持件間的間隙27。由於固持件或夾持器不能以與遮罩70(例如去邊緣遮罩)相距不確定的距離被適當地覆蓋,所以積累了相當大量的側面沉積在固持件或夾具上。如第2圖所示,可能的是,側面沉積進入夾具的凹槽,即前部214和基板101之間的間隙。固持件內的玻璃運動使側面沉積鬆散,這進一步增加了顆粒的產生。As shown in FIG. 2, the material deposited on the substrate 101 in the direction indicated by the arrow 25 may cause side deposition 50, that is, undesired material deposition on the holder 20. The lateral deposits 50 can particularly spread into the front gap 23. Friction between the substrate 101 and the holder may cause particles to be generated. The gap 26 between the glass masks is provided by, for example, the front gap 23, the width of the holder at the front portion 214, and the gap 27 between the mask holders. Due to the uncertain glass position inside the fixture, the gap 26 between the glass masks may be relatively large, such as leading to a larger front gap 23. The front gap 23 is provided between the holder and the glass with respect to the holder. The holders or clamps may be provided separately from each other, thereby creating, for example, a gap 27 between the mask holders between the holder and the mask 70. Since the holder or holder cannot be properly covered at an indeterminate distance from the mask 70 (such as a de-edge mask), a considerable amount of side deposits accumulate on the holder or clamp. As shown in FIG. 2, it is possible that the side is deposited into the groove of the jig, that is, the gap between the front portion 214 and the substrate 101. The glass movement inside the holder loosens the side deposits, which further increases the generation of particles.
第3圖繪示根據本文描述的實施例的固持件200。固持件200包括前部214和後部216。可配置成用於將基板101插入固持件200中的凹槽300包括具有傾斜表面的斜面部分220。斜面部分220提供半V形固持器或夾具,即用於基板的凹槽的一側是V形的。用於基板的凹槽的另一側可以不是V形,即可以是直的。半V型夾具設計解決了上面已經描述的一些或全部缺點。中間部分212可連接前部和後部。FIG. 3 illustrates a holder 200 according to an embodiment described herein. The holder 200 includes a front portion 214 and a rear portion 216. The groove 300 that can be configured for inserting the substrate 101 into the holder 200 includes an inclined surface portion 220 having an inclined surface. The beveled portion 220 provides a half-V-shaped holder or clamp, that is, one side of the groove for the substrate is V-shaped. The other side of the groove for the substrate may not be V-shaped, that is, it may be straight. The half-V fixture design addresses some or all of the disadvantages already described above. The middle portion 212 may connect the front and rear portions.
在一方面,基板的裝載或進給藉由大的固持件開口放到後部玻璃的後側。另一方面,固持件內部的玻璃移動受限於例如0.1 mm的小的間隙。具有小間隙的凹槽部分形成凹槽的第一部分。具有大的固持件開口的凹槽部分,即傾斜部分或半V形部分形成凹槽的第二部分。根據本揭露的實施例,可以提供具有形狀不同的第一凹槽部分和第二凹槽部分的固持件。In one aspect, the loading or feeding of the substrate is placed on the rear side of the rear glass through a large holder opening. On the other hand, glass movement inside the holder is limited by a small gap of, for example, 0.1 mm. A groove portion having a small gap forms a first portion of the groove. A groove portion having a large holder opening, that is, an inclined portion or a half-V-shaped portion forms a second portion of the groove. According to the embodiment of the present disclosure, a holder having a first groove portion and a second groove portion having different shapes may be provided.
根據一些實施例,固持件或夾具可以根據使用的玻璃厚度定制,以具有小間隙的全部或大部分好處。或者,可以在處理系統中使用數個玻璃厚度,而無需更換載具的固持件,其中可以使用用於在處理系統中被處理的最厚的玻璃的固持件或夾具,甚至用於更薄的玻璃。According to some embodiments, the holder or fixture can be customized according to the thickness of the glass used to have all or most of the benefits of a small gap. Alternatively, several glass thicknesses can be used in the processing system without changing the holder of the carrier, where holders or clamps for the thickest glass to be processed in the processing system can be used, even for thinner glass.
根據可與本文所述的其他實施例組合的本揭露的實施例,凹槽300可具有第一部分,例如第3圖中的下部。凹槽的第一部分可以具有基本上平行的表面,例如前部214的內表面和後部216的內表面。第一部分可以是平行部分。例如,第一部分可以在前部和後部的相對表面之間具有5°或更小,尤其是0°的第一角度。由於斜面部分220,凹槽300具有在相對表面之間具有大於第一角度的第二角度的第二部分。第二角度可以設置在斜面部分220的傾斜表面與前部的內表面之間。第二角度可以是10°或更大,例如大約15°。形成第一角度的前部214的內表面和形成第二角度的前部214的內表面可以是相同的內表面,即一個平坦表面。According to an embodiment of the present disclosure that may be combined with other embodiments described herein, the groove 300 may have a first portion, such as a lower portion in FIG. 3. The first portion of the groove may have substantially parallel surfaces, such as the inner surface of the front portion 214 and the inner surface of the rear portion 216. The first part may be a parallel part. For example, the first portion may have a first angle of 5 ° or less, especially 0 °, between the opposing surfaces of the front and rear portions. Due to the beveled portion 220, the groove 300 has a second portion having a second angle greater than the first angle between the opposing surfaces. The second angle may be set between the inclined surface of the beveled portion 220 and the inner surface of the front portion. The second angle may be 10 ° or more, such as about 15 °. The inner surface of the front portion 214 forming the first angle and the inner surface of the front portion 214 forming the second angle may be the same inner surface, that is, one flat surface.
根據本揭露的實施例,特別是在第一部分,例如凹槽300的底部(即在與中間部分212相鄰的凹槽部分處),小間隙可以進一步導致基板101的更好或更平直的玻璃邊緣。這也使得基板101的玻璃表面和遮罩70(例如去邊緣遮罩)具有較小間隙。玻璃和遮罩之間的較小間隙增加了均勻性並減少了在固持件或夾具上的側面沉積。此外,藉由夾具內被限定的玻璃位置,夾具的內部更好地防止側面沉積。玻璃遮罩間的間隙326由例如小的前間隙、在前部214處的固持件的寬度以及遮罩固持件間的間隙27提供。由於夾具內的玻璃位置,玻璃遮罩間的間隙326可以減小,例如導致一個小的前間隙。在第3圖中,與第2圖中的側面沉積50相比,來自沿著箭頭25沉積的材料的側面沉積250減少了。第3圖進一步繪示在材料沉積期間濺射目標材料期間可以如箭頭335所示可旋轉或旋轉陰極330。根據其他實施例,可以使用用於材料沉積的平面陰極或其他來源。According to the embodiment of the present disclosure, particularly at the first portion, such as the bottom of the groove 300 (ie, at the groove portion adjacent to the middle portion 212), the small gap may further lead to a better or flatter substrate 101 Glass edges. This also results in a small gap between the glass surface of the substrate 101 and the mask 70 (such as a de-edge mask). The smaller gap between the glass and the mask increases uniformity and reduces lateral deposition on the holder or fixture. In addition, by limiting the glass position inside the fixture, the inside of the fixture better prevents side deposition. The gap 326 between the glass masks is provided by, for example, a small front gap, the width of the holder at the front portion 214, and the gap 27 between the mask holders. Due to the position of the glass within the fixture, the gap 326 between the glass masks can be reduced, resulting in a small front gap, for example. In FIG. 3, the side deposition 250 from the material deposited along the arrow 25 is reduced compared to the side deposition 50 in FIG. 2. FIG. 3 further illustrates that the cathode 330 can be rotated or rotated during sputtering of the target material during material deposition as indicated by arrow 335. According to other embodiments, a planar cathode or other source for material deposition may be used.
第4A圖至第5B圖繪示固持件200的另外的實施例。第4A圖和第5A圖繪示從前部214側面的側視圖。第4B圖和第5B圖繪示與第2圖和第3圖類似的側視圖。第4A圖和第4B圖繪示根據一個示例的固持件200,其可用來闡述可以與本揭露的實施例結合的修改。固持件具有後部216。例如,後部可以具有20至40mm的高度,例如約30mm。前部214沿著固持件200的長度延伸。根據一些實施例,長度(第4A圖中所示的從左到右的尺寸)可以是30到60mm,例如大約40mm。中間部分212可以具有5mm至15mm的寬度(第4B圖中所示的從左至右的尺寸),例如約7mm。凹槽300在第一部分412處具有寬度,例如,第4A圖至第5B圖中的底部,在凹槽300處,即在面對中間部分212的凹槽部分處。在固持件安裝在載具的頂側的情況下,第4A圖至第5B圖中的底部可以是凹槽的頂部。第一部分412的寬度對應於基板的厚度。通常,第一部分412的寬度可以比基板的厚度大0.05至0.2mm。例如,第一部分的寬度可以是0.6mm、0.7mm、0.8mm或1mm。根據可與本文所述的其它實施例組合的實施例,斜面部分220可具有10°至25°的傾斜角度,例如約13°或約15°。根據可與本文描述的其他實施例組合的一些實施例,斜面部分220或傾斜表面的高度可分別使得斜面部分的寬度為1.5 mm至5 mm,例如大約3 mm。斜面部分的寬度對應於凹槽的第二部分處的凹槽的寬度增加。4A to 5B illustrate another embodiment of the holder 200. 4A and 5A illustrate side views from the side of the front portion 214. Figures 4B and 5B show side views similar to Figures 2 and 3. 4A and 4B illustrate a holder 200 according to an example, which can be used to illustrate modifications that can be combined with the embodiments of the present disclosure. The holder has a rear portion 216. For example, the rear portion may have a height of 20 to 40 mm, such as about 30 mm. The front portion 214 extends along the length of the holder 200. According to some embodiments, the length (the left-to-right size shown in Figure 4A) may be 30 to 60 mm, such as about 40 mm. The middle portion 212 may have a width of 5 mm to 15 mm (the left-to-right size shown in FIG. 4B), for example, about 7 mm. The groove 300 has a width at the first portion 412, for example, the bottoms in FIGS. 4A to 5B, at the groove 300, that is, at the groove portion facing the middle portion 212. In the case where the holder is mounted on the top side of the carrier, the bottom in FIGS. 4A to 5B may be the top of the groove. The width of the first portion 412 corresponds to the thickness of the substrate. Generally, the width of the first portion 412 may be 0.05 to 0.2 mm larger than the thickness of the substrate. For example, the width of the first portion may be 0.6 mm, 0.7 mm, 0.8 mm, or 1 mm. According to an embodiment that can be combined with other embodiments described herein, the beveled portion 220 may have an inclined angle of 10 ° to 25 °, such as about 13 ° or about 15 °. According to some embodiments that may be combined with other embodiments described herein, the height of the beveled portion 220 or the inclined surface may be such that the width of the beveled portion is 1.5 mm to 5 mm, such as about 3 mm. The width of the beveled portion increases corresponding to the width of the groove at the second portion of the groove.
此外,第4A圖所示的固持件包括開口416。開口416配置成將固持件200安裝到載具。例如,開口416可以包括用於接收螺絲等的螺紋。開口416配置成將固持件200安裝到載具上。固持件可以如箭頭417所示的那樣可樞轉地安裝到固持件上。固持件的樞轉安裝具有的優點是固持件可以旋轉例如25°或更小,以使玻璃與凹槽的第一部分412完全接觸。可以在凹槽的地面上提供玻璃沿玻璃邊緣的完全接觸。這可以減少玻璃邊緣的應力。根據一些實施例,凹槽300的第一部分412可以在其側部彎曲。這對於輕輕地將基板裝載到固持件200中可能是有益的。彎曲曲線可以具有2 mm或更大的半徑。In addition, the holder shown in FIG. 4A includes an opening 416. The opening 416 is configured to mount the holder 200 to the carrier. For example, the opening 416 may include threads for receiving a screw or the like. The opening 416 is configured to mount the holder 200 to the carrier. The holder can be pivotably mounted to the holder as shown by arrow 417. The pivotal mounting of the holder has the advantage that the holder can be rotated, for example, 25 ° or less, so that the glass makes full contact with the first portion 412 of the groove. Full contact of the glass along the edge of the glass can be provided on the floor of the groove. This reduces stress on the glass edges. According to some embodiments, the first portion 412 of the groove 300 may be bent at its side. This may be beneficial for gently loading the substrate into the holder 200. The curved curve may have a radius of 2 mm or more.
第5A圖和第5B圖繪示根據一個示例的固持件200,其可以用於闡述可以與本揭露的實施例結合的修改。與第4A圖和第4B圖所示的固持件200相比,第5A圖和第5B圖中一個示例的固持件200可以具有例如7 mm至15 mm的高度減小的後部216。根據另外的或可替換的修改,前部214可以是具有兩個前部分段的前部分組件。在兩個前部分段之間可以存在間隙,使得當從前部的一側(即材料沉積側)看時,斜面部分220被暴露。考慮到後部216的高度減小而不是開口,提供盲孔516以將固持件200安裝到載具或載具本體上。5A and 5B illustrate a holder 200 according to an example, which can be used to illustrate modifications that can be combined with the embodiments of the present disclosure. Compared to the holder 200 shown in FIGS. 4A and 4B, the example holder 200 in FIGS. 5A and 5B may have a rear portion 216 having a height reduction of, for example, 7 mm to 15 mm. According to additional or alternative modifications, the front portion 214 may be a front portion assembly having two front portion segments. There may be a gap between the two front section segments so that the beveled portion 220 is exposed when viewed from one side of the front (ie, the material deposition side). Considering that the height of the rear portion 216 is reduced instead of being opened, a blind hole 516 is provided to mount the holder 200 to the vehicle or the vehicle body.
第6圖繪示在裝載臂602(例如機器人手臂)的裝載操作期間的載具100。如第6圖所示,載具本體160的四個側面中的第一側和第二側上的固持件200移動到縮回位置。示例性地,第6圖中的頂側和右側的固持件顯示處於縮回位置。由於固持件的移動而提供縮回位置,如第1圖中的箭頭201所示。例如,進入縮回位置和縮回位置之外的運動可以垂直於由固持件支撐的矩形基板101的邊緣。FIG. 6 illustrates the carrier 100 during a loading operation of a loading arm 602 (eg, a robot arm). As shown in FIG. 6, the holders 200 on the first and second sides of the four sides of the carrier body 160 are moved to the retracted positions. Exemplarily, the holders on the top and right sides in FIG. 6 are shown in the retracted position. The retracted position is provided due to the movement of the holder, as indicated by arrow 201 in FIG. 1. For example, the movement into and out of the retracted position may be perpendicular to the edge of the rectangular substrate 101 supported by the holder.
隨著固持件200在頂側和右側的縮回位置,裝載臂602可以使基板101在固持件之間的區域中移動,因為固持件之間的基板接收區域被擴大。基板可以如箭頭603所示地移動,進而被支撐在例如第6圖中的下側和左側的固持件200中。根據可與本文所述的其他實施例組合的一些實施例,載具本體的兩個相鄰側上的固持件200可以是固定的,並且載具本體的四個側的其餘兩側上的固持件可以是可移動的。其餘兩側也可以是載具本體的相鄰側。With the retracted positions of the holder 200 on the top and right sides, the loading arm 602 can move the substrate 101 in the area between the holders because the substrate receiving area between the holders is enlarged. The substrate can be moved as shown by an arrow 603, and is further supported by, for example, the lower and left holders 200 in FIG. 6. According to some embodiments that can be combined with other embodiments described herein, the holders 200 on two adjacent sides of the carrier body may be fixed, and the holders on the remaining two sides of the four sides of the carrier body may be fixed. The pieces can be removable. The remaining two sides may also be adjacent sides of the vehicle body.
如上所述,固持件中的凹槽可以具有用於基板的第一部分,第一部分具有可比較小的間隙。第一部分鄰近固持件的中間部分。例如,第一部分可以是在載具本體160的底側上的固持件的凹槽的底部部分,並且可以是在載具本體的頂側上的固持件的凹槽的頂部部分。此外,固持件中的凹槽可以具有包括斜面部分的第二部分。斜面部分將固持件開口的尺寸增加到固持件的後側,即例如在基板上材料的沉積期間遠離材料源的一側。As described above, the groove in the holder may have a first portion for the substrate, and the first portion has a relatively small gap. The first part is adjacent to the middle part of the holder. For example, the first portion may be a bottom portion of the groove of the holder on the bottom side of the carrier body 160, and may be a top portion of the groove of the holder on the top side of the carrier body 160. Further, the groove in the holder may have a second portion including a beveled portion. The beveled portion increases the size of the holder opening to the rear side of the holder, ie, for example, the side away from the source of material during the deposition of material on the substrate.
為了將基板101裝載到載具100中,如箭頭603所示移動基板。包括斜面部分的溝槽的第二部分將基板引導到凹槽中。第二部分處的凹槽的增加的厚度允許基板順利地插入到固持件中。在沿著箭頭603移動之後,基板101被支撐在溝槽的第一部分中,其中第一部分為基板提供了與第二部分中的間隙相比更小的間隙。用於將基板固持在最終位置的減小的間隙減少了固持件處的側面沉積,為支撐位置中的玻璃基板提供了穩定性,和/或允許例如利用去邊緣遮罩進行遮蔽而具有減小的基板與遮罩距離。減小的基板與遮罩距離進一步減少了側面沉積。減少的側面沉積和增加的能力減少了在處理基板期間的顆粒產生。To load the substrate 101 into the carrier 100, the substrate is moved as shown by an arrow 603. A second portion of the groove including the beveled portion guides the substrate into the groove. The increased thickness of the groove at the second part allows the substrate to be smoothly inserted into the holder. After moving along arrow 603, the substrate 101 is supported in the first portion of the trench, where the first portion provides the substrate with a smaller gap compared to the gap in the second portion. The reduced gap for holding the substrate in the final position reduces lateral deposition at the holder, provides stability to the glass substrate in the support position, and / or allows for reductions such as masking with de-edge masking Distance between the substrate and the mask. The reduced substrate-to-mask distance further reduces side deposition. Reduced side deposition and increased ability reduce particle generation during substrate processing.
在基板沿著箭頭603移動之後,第6圖中的頂側和右側的固持件200可以沿著箭頭603從縮回位置移動到未縮回位置。而且在固持件的移動期間,固持件的凹槽的第二部分將基板引導到正確的位置,並且固持件的凹槽的第一部分提供增加的穩定性並減少固持件的最終位置中的側面沉積。After the substrate is moved along the arrow 603, the top and right holders 200 in FIG. 6 may be moved from the retracted position to the unretracted position along the arrow 603. And during the movement of the holder, the second part of the groove of the holder guides the substrate to the correct position, and the first part of the groove of the holder provides increased stability and reduces side deposition in the final position of the holder .
根據不同的實施例,載具100可以用於物理氣相沉積處理,化學氣相沉積處理、基板結構化磨邊、加熱(例如退火)或任何類型的基板處理。如本文所述的載具的實施例和利用這種載具的方法,對於靜止的,即非連續的基板處理特別有用。通常,載具是設置用於處理垂直方向的大面積玻璃基板。According to various embodiments, the carrier 100 may be used in a physical vapor deposition process, a chemical vapor deposition process, a structured edging of a substrate, heating (eg, annealing), or any type of substrate processing. Embodiments of the carrier as described herein and methods of using such carriers are particularly useful for stationary, ie discontinuous substrate processing. Generally, a carrier is a large-area glass substrate provided for processing a vertical direction.
第7圖繪示根據本文描述的實施例的用於將基板101固定在具有載具本體160的載具100中的方法80的流程圖。在方框81中,基板101是裝載在載具100上。在方框82中,至少一個固持件200相對於載具本體160朝向裝載的基板101移動。至少一個固持件200包括斜面部分220,例如是固持件的凹槽300的第二部分的斜面部分。在方框83中,基板101在具有斜面部分的凹槽(即凹槽的第二部分的傾斜表面)的一部分中被引導。FIG. 7 illustrates a flowchart of a method 80 for fixing a substrate 101 in a carrier 100 having a carrier body 160 according to an embodiment described herein. In block 81, the substrate 101 is loaded on the carrier 100. In block 82, at least one holder 200 is moved relative to the carrier body 160 toward the loaded substrate 101. At least one holder 200 includes a beveled portion 220, such as a beveled portion of the second portion of the groove 300 of the holder. In block 83, the substrate 101 is guided in a portion of a groove having a beveled portion (ie, an inclined surface of a second portion of the groove).
具有直的內表面的固持件的前部部分允許減少固持件的側面沉積。凹槽的斜面部分的傾斜表面(即凹槽的第二部分)允許將基板順利地插入固持件中。與凹槽的第二部分相比,凹槽的第一部分中的基板的較小間隙允許減少顆粒產生。特別地,半V形,即單側V形允許這樣的優點的組合。The front portion of the holder with a straight inner surface allows reducing lateral deposition of the holder. The inclined surface of the beveled portion of the groove (ie, the second portion of the groove) allows the substrate to be smoothly inserted into the holder. The smaller gap of the substrate in the first part of the groove allows reduced particle generation compared to the second part of the groove. In particular, a semi-V shape, ie a single-sided V shape, allows a combination of such advantages.
第8圖繪示根據本文描述的實施例的沉積室600的示意圖。沉積室600適用於沉積處理,例如物理氣相沉積(PVD)或化學氣相沉積(CVD)處理。基板101是繪示位於基板傳送裝置620上的載具100內或其上。用於沉積材料的材料源630設置在腔室612中,面向待塗覆的基板101的側面。材料源630提供待沉積在基板101上的沉積材料。FIG. 8 illustrates a schematic diagram of a deposition chamber 600 according to the embodiments described herein. The deposition chamber 600 is suitable for a deposition process, such as a physical vapor deposition (PVD) or a chemical vapor deposition (CVD) process. The substrate 101 is shown in or on the carrier 100 on the substrate transfer device 620. A material source 630 for depositing a material is disposed in the chamber 612 and faces the side of the substrate 101 to be coated. The material source 630 provides a deposition material to be deposited on the substrate 101.
在第8圖中,材料源630可以是其上具有沉積材料的靶材或允許材料被釋放以沉積在基板101上的任何其他配置。通常,材料源630可以是可旋轉的靶材,即旋轉靶材。根據一些實施例,材料源630可以是可移動的以便定位和/或替換源。根據其他實施例,材料源可以是平面靶材。In FIG. 8, the material source 630 may be a target with a deposition material thereon or any other configuration that allows the material to be released for deposition on the substrate 101. Generally, the material source 630 may be a rotatable target, ie, a rotating target. According to some embodiments, the source of material 630 may be movable in order to locate and / or replace the source. According to other embodiments, the material source may be a planar target.
根據一些實施例,沉積材料可以根據沉積處理和塗覆基板的稍後應用來選擇。例如,源的沉積材料可以是選自由諸如鋁、鉬、鈦、銅等的金屬、矽、氧化銦錫以及其他透明導電氧化物組成的群組中的一材料。通常,可以包括這樣的材料的氧化物層、氮化物層或碳化物層,這些材料可以藉由從源提供材料或藉由反應性沉積來沉積,即來自源的材料與來自氧、氮化物或來自一種處理氣體的碳。According to some embodiments, the deposition material may be selected according to a later application of the deposition process and the coated substrate. For example, the source deposition material may be a material selected from the group consisting of a metal such as aluminum, molybdenum, titanium, copper, etc., silicon, indium tin oxide, and other transparent conductive oxides. Generally, an oxide, nitride, or carbide layer of a material may be included, which may be deposited by supplying the material from a source or by reactive deposition, i.e., the material from the source and the material from oxygen, nitride, or Carbon from a process gas.
通常,基板101設置在載具100內或載具100上。載具或載具組件還可以用作或包括去邊緣遮罩,特別是用於非靜止的沉積處理。虛線665示例性地繪示在沉積室600的操作期間沉積材料的路徑。根據可與本文所述的其它實施例組合的其它實施例,遮罩可由單獨的去邊緣遮罩提供,根據本文描述的實施例的載具對於靜止處理和非靜止處理可以是有利的。Generally, the substrate 101 is disposed in or on the carrier 100. The vehicle or vehicle assembly can also be used as or include a de-edge mask, especially for non-stationary deposition processes. The dashed line 665 exemplarily illustrates the path of the deposition material during operation of the deposition chamber 600. According to other embodiments that may be combined with other embodiments described herein, the mask may be provided by a separate de-edge mask, and a vehicle according to embodiments described herein may be advantageous for stationary processing and non-static processing.
根據可與本文所述的其他實施例結合的實施例,為了更容易地繪製圖式,固持件200是設置為沒有斜面部分,即半V形形狀,進而牢固地固持基板101的邊緣特別是在沉積過程中。實施例可以提供增加的基板穩定性並且因此減少基板破裂,特別是鑑於基板的長度和高度變大的事實。此外,特別是在基板附近的顆粒產生可以減少。According to an embodiment that can be combined with other embodiments described herein, in order to draw a drawing more easily, the holder 200 is provided without a beveled portion, that is, a semi-V shape, and thereby firmly holds the edge of the substrate 101, especially During deposition. Embodiments can provide increased substrate stability and therefore reduce substrate cracking, especially in view of the fact that the length and height of the substrate become larger. In addition, the generation of particles, especially near the substrate, can be reduced.
根據本文所述的可與本文所述的其他實施方式組合的實施例,可以在沉積過程中以垂直的方向(即基本上垂直的方向)提供基板和載具。當提及基板方向時,基本上垂直地被理解為允許從垂直的方向偏離20°或更低,例如10°或更低。可以提供例如這種偏差,因為與垂直方向有一些偏差的基板支撐可能導致更穩定的基板位置。或者,在相反方向上的偏離(基板朝下)可能導致基板上的顆粒數量減少。According to embodiments described herein that can be combined with other embodiments described herein, the substrate and carrier can be provided in a vertical direction (ie, a substantially vertical direction) during the deposition process. When referring to the substrate direction, substantially vertical is understood to allow deviation from the vertical direction by 20 ° or less, such as 10 ° or less. This deviation can be provided, for example, because substrate support with some deviation from the vertical direction may result in a more stable substrate position. Alternatively, a deviation in the opposite direction (substrate facing down) may cause a reduction in the number of particles on the substrate.
雖然前述內容針對本揭露的實施例,但是可以在不脫離本揭露的基本範圍的情況下設計本揭露的其他和進一步的實施例,並且其範圍由隨後的申請專利範圍確定。Although the foregoing is directed to the embodiments of the present disclosure, other and further embodiments of the present disclosure can be designed without departing from the basic scope of the present disclosure, and its scope is determined by the scope of subsequent patent applications.
21‧‧‧後部間隙21‧‧‧ rear clearance
23‧‧‧前部間隙23‧‧‧Front clearance
25‧‧‧箭頭25‧‧‧ Arrow
26、326‧‧‧玻璃遮罩間的間隙26, 326‧‧‧Gap between glass masks
27‧‧‧遮罩固持件間的間隙27‧‧‧ Gap between mask holders
30‧‧‧凹槽30‧‧‧ groove
50‧‧‧側面沉積50‧‧‧ lateral deposition
70‧‧‧遮罩70‧‧‧Mask
80‧‧‧方法80‧‧‧method
81、82、83‧‧‧方框Boxes 81, 82, 83‧‧‧‧
100‧‧‧載具100‧‧‧ Vehicle
101‧‧‧基板101‧‧‧ substrate
160‧‧‧載具本體160‧‧‧ Vehicle body
162‧‧‧導桿162‧‧‧Guide
164‧‧‧上部導向裝置164‧‧‧ Upper guide
200‧‧‧固持件200‧‧‧ holding parts
201‧‧‧箭頭201‧‧‧ Arrow
212‧‧‧中間部分212‧‧‧ middle section
214‧‧‧前部214‧‧‧Front
216‧‧‧後部216‧‧‧ rear
220‧‧‧斜面部分220‧‧‧ bevel
250‧‧‧側面沉積250‧‧‧ lateral deposition
300‧‧‧凹槽300‧‧‧ groove
330‧‧‧旋轉陰極330‧‧‧Rotary cathode
335‧‧‧箭頭335‧‧‧arrow
412‧‧‧第一部分412‧‧‧Part I
416‧‧‧開口416‧‧‧ opening
417‧‧‧箭頭417‧‧‧arrow
600‧‧‧沉積室600‧‧‧ Deposition chamber
602‧‧‧裝載臂602‧‧‧Loading arm
603‧‧‧箭頭603‧‧‧arrow
665‧‧‧線條665‧‧‧line
第1圖繪示根據本文描述的實施例的載具並具有至少一個固持件的示意圖。 第2圖繪示用於說明本揭露的實施例的改進的固持件的示意圖。 第3圖繪示根據本文描述的實施例的固持件的示意圖。 第4A圖和第4B圖繪示根據本文描述的實施例的另一固持件的不同視圖。 第5A圖和5B繪示根據本文描述的實施例的另一固持件的不同視圖。 第6圖繪示根據本文描述的實施例的具有固持件的載具具並且繪示以機器人手臂裝載的示意圖。 第7圖繪示根據本文描述的實施例的用於將基板固定在具有載具本體的載具中的方法的流程圖。 第8圖繪示根據本文描述的實施例的沉積室的示意圖。FIG. 1 shows a schematic diagram of a carrier according to embodiments described herein and having at least one holder. FIG. 2 is a schematic diagram illustrating an improved retaining member according to the embodiment of the present disclosure. FIG. 3 illustrates a schematic view of a holder according to the embodiments described herein. 4A and 4B illustrate different views of another holder according to the embodiments described herein. 5A and 5B illustrate different views of another holder according to embodiments described herein. FIG. 6 illustrates a carrier with a holder and a schematic diagram of loading with a robot arm according to an embodiment described herein. FIG. 7 shows a flowchart of a method for fixing a substrate in a carrier having a carrier body according to an embodiment described herein. FIG. 8 illustrates a schematic view of a deposition chamber according to embodiments described herein.
Claims (20)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ??PCT/EP2017/051328 | 2017-01-23 | ||
| PCT/EP2017/051328 WO2018133952A1 (en) | 2017-01-23 | 2017-01-23 | Holder for substrates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201828406A true TW201828406A (en) | 2018-08-01 |
| TWI657532B TWI657532B (en) | 2019-04-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106141693A TWI657532B (en) | 2017-01-23 | 2017-11-29 | Holder for substrates |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2020505513A (en) |
| KR (1) | KR102353238B1 (en) |
| CN (1) | CN110168131B (en) |
| TW (1) | TWI657532B (en) |
| WO (1) | WO2018133952A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4335604A3 (en) * | 2022-09-09 | 2024-07-17 | Denver S.p.A. | Device for supporting and referencing sheets in a vertical position and system |
| DE102023133038A1 (en) * | 2023-11-27 | 2025-05-28 | Element 3-5 Gmbh | Device and method for treating surfaces |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3411208C2 (en) * | 1984-03-27 | 1987-01-29 | Leybold-Heraeus GmbH, 5000 Köln | Holding device for substrates, especially in vacuum coating systems |
| DE9206635U1 (en) * | 1992-05-15 | 1992-09-10 | Balzers und Leybold Deutschland Holding AG, 63450 Hanau | Device for holding substrates |
| JP2000124297A (en) | 1998-10-20 | 2000-04-28 | Dainippon Screen Mfg Co Ltd | Board holder |
| WO2006054663A1 (en) * | 2004-11-22 | 2006-05-26 | Sharp Kabushiki Kaisha | Substrate holding apparatus, substrate processing apparatus and liquid crystal display device |
| US7918940B2 (en) * | 2005-02-07 | 2011-04-05 | Semes Co., Ltd. | Apparatus for processing substrate |
| DE102008015982B3 (en) * | 2008-03-27 | 2009-07-30 | Grenzebach Maschinenbau Gmbh | Method and device for fixing and further transporting impact-sensitive plates in sputter coating systems, computer program for carrying out the method and machine-readable carrier for this purpose |
| JP5457043B2 (en) * | 2009-01-30 | 2014-04-02 | 東洋炭素株式会社 | CVD method |
| JP5429796B2 (en) * | 2009-08-25 | 2014-02-26 | キヤノンアネルバ株式会社 | Mask alignment mechanism, mask alignment method, and vacuum processing apparatus |
| US8402628B2 (en) * | 2010-07-22 | 2013-03-26 | Primestar Solar, Inc. | Apparatus, carrier, and method for securing an article for coating processes |
| US20160053361A1 (en) | 2013-03-15 | 2016-02-25 | Applied Materials, Inc. | Carrier for a substrate and method for carrying a substrate |
| CN106164331B (en) * | 2013-09-20 | 2018-11-23 | 应用材料公司 | Substrate Carrier with Integral Electrostatic Chuck |
| CN206872945U (en) | 2014-05-15 | 2018-01-12 | 应用材料公司 | Substrate edges mask system |
| CN107873062B (en) * | 2015-05-08 | 2020-10-30 | 应用材料公司 | Method and support for holding a substrate |
| CN107810288A (en) * | 2015-07-01 | 2018-03-16 | 应用材料公司 | Self-locking retainer for substrate |
-
2017
- 2017-01-23 KR KR1020197024661A patent/KR102353238B1/en active Active
- 2017-01-23 JP JP2019539770A patent/JP2020505513A/en active Pending
- 2017-01-23 WO PCT/EP2017/051328 patent/WO2018133952A1/en not_active Ceased
- 2017-01-23 CN CN201780082726.6A patent/CN110168131B/en active Active
- 2017-11-29 TW TW106141693A patent/TWI657532B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2020505513A (en) | 2020-02-20 |
| KR102353238B1 (en) | 2022-01-18 |
| TWI657532B (en) | 2019-04-21 |
| CN110168131A (en) | 2019-08-23 |
| KR20190110593A (en) | 2019-09-30 |
| WO2018133952A1 (en) | 2018-07-26 |
| CN110168131B (en) | 2022-06-07 |
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