TW201812955A - Support separation device and support separation method - Google Patents

Abstract

[Problem] In the present invention, when the support is separated from the laminate, the substrate and the support are smoothly separated in a short time without damaging the substrate and the support. [Solution] A support separation device (10) according to one aspect of the present invention is formed by holding a chamfered portion (2a) of a support plate (2) by a clamp (23) to form a gap (7). 7) In a state maintained by the adsorption pad (22), a gas is ejected from a gas ejection unit (24) integrated with the jig (23).

Description

Support body separation device and support body separation method

[0001] The present invention relates to a support separation device and a support separation method.

[0002] In recent years, thinning, miniaturization, and weight reduction of electronic devices such as IC cards and mobile phones have been required. In order to satisfy these requirements, a thin semiconductor wafer must also be used for the mounted semiconductor wafer. Therefore, the thickness (film thickness) of a wafer substrate that is the basis of a semiconductor wafer is currently 125 μm to 150 μm. However, the next-generation wafer system must be 25 μm to 50 μm. Therefore, in order to obtain the wafer substrate having the above-mentioned film thickness, a thinning step of the wafer substrate is necessary. [0003] Since the wafer substrate is thinned and its strength is reduced, in order to prevent the thinned wafer substrate from being damaged, the wafer substrate is automatically transported in a state where the wafer substrate is bonded to the support plate during the manufacturing process, and at the same time, the wafer substrate Structures such as mounting circuits. Then, after the manufacturing process, the wafer substrate and the support plate are separated. Therefore, various methods have heretofore been used to peel the support from the wafer. [0004] Patent Document 1 describes a peeling device that has a cutout mechanism inserted into a joint surface of a processing substrate and a support substrate from a side of a polymer substrate, a cutting mechanism having a fine tip, and A fluid supply mechanism that laterally supplies fluid to a bonding surface of a substrate to be processed and a supporting substrate. [Prior Art Document] [Patent Document] [0005] [Patent Document 1] Japanese Patent Laid-Open No. 2013-219328 (published on October 24, 2013)

[Problems to be Solved by the Invention] [0006] However, in the method of the peeling device described in Patent Document 1, the adhesive layer is dissolved by the solvent supplied from the fluid supply mechanism, and the laminate is separated and supported by the cutting mechanism. The bulk method has a problem that it takes a long time to separate the substrate. [0007] In addition, when the peeling device described in Patent Document 1 uses a cutting mechanism to separate the support from the laminate, there is a concern that the support is damaged. [0008] The invention of the present application is made in view of the above-mentioned problems, and the purpose is to provide a support separation device and the related technology, which can separate the support and the substrate in a short time when the support is separated from the laminated body. Smooth separation. [Means for Solving the Problems] [0009] In order to solve the above-mentioned problems, the support separation device of the present invention is a laminated body formed by attaching a substrate and a support supporting the substrate through an adhesive layer, and separating the above. A support separating device for a support is characterized in that it includes a mounting table on which the laminate is fixed on a substrate side, a holding section holding the support, a lifting section for raising and lowering the holding section with respect to the mounting table, and the holding section is It is provided with at least one gripping portion that grips the outer peripheral end portion of the support, forms a gap between the substrate and the support, and an adsorption portion that is configured to use the gap between the support and the support. The back surface of the formed surface adsorbs and holds the support and lifts up to maintain the gap. The holding portion is provided with a ejection portion that faces from the gap maintained by the adsorption portion toward the inside of the laminate. Spray fluid. [0010] A support separation method according to the present invention is a method for separating a support from a laminated body formed by attaching a substrate and a support supporting the substrate via an adhesive layer, and the method includes: A gap forming step is to fix the substrate, hold the outer peripheral end portion of the support by at least one holding portion, form a gap between the substrate and the support, and a gap maintaining step, which is performed by The support is lifted on the back surface of the surface formed by the gap, and the gap is maintained. A separation step is performed after the gap maintaining step, from the gap to the inside of the laminated body, by the holding portion. The ejection part provided ejects a fluid, and separates the said support body from the said laminated body. [Effects of the invention] [0011] With the present invention, it is possible to provide a support separation device and the effect of the related technology. When the support is separated from the laminate, the substrate and the support can be broken in a short time. Smooth separation. [Brief Description of the Drawings] [0012] FIG. 1 is a diagram illustrating a schematic configuration of a support separation device according to an embodiment of the present invention.第 [Fig. 2] A plan view showing a state of a laminated body having a support separated by a support separating device shown in Fig. 1 after irradiation with light. [Fig. 3] A diagram showing a configuration of a gas ejection section provided in the support separation layer shown in Fig. 1 and configured to hold a jig of a support and an adjacent jig. [Fig. 4] A diagram showing a configuration of a gas ejection section provided in the support separation layer shown in Fig. 1. [Fig. [Fig. 5] A diagram illustrating a support separation operation of the support separation layer shown in Fig. 1. [Fig. 6] A diagram showing a state in which a gas is ejected from a gas ejection section in a support separation operation of the support separation layer shown in Fig. 1. [FIG. 7] A diagram illustrating another aspect of the present invention. [FIG. 8] A diagram illustrating another aspect of the present invention.

[0011] [Embodiment 1] (1) An aspect of the support separation device and the support separation method according to the present invention will be described below. [0014] <1. Structure of Support Separator> FIG. 1 is a view showing the structure of a special part of the support separator of the first embodiment, and FIG. 1 (a) is a partial plan view, and FIG. (b) The figure is taken along the arrow AA 'line in Figure 1 (a). In addition, Fig. 1 (a) and Fig. 1 (b) also show the XYZ coordinate system in which the XY plane is a horizontal plane. [0015] The support separation device 10 according to the first embodiment is the same as the prior art. The wafer substrate on which a structure such as a circuit is mounted is in a state of forming a laminate together with the support plate, and is used to peel off and support the laminate. Device. However, the present invention is not limited to a laminated body in which a wafer substrate has been laminated, and it can be used for peeling off the laminated body with respect to the laminated body of all types of laminated boards at the outermost layer. In the following, the wafer substrate will be described only as a substrate. [0016] Here, details are described later, but the laminated body 100 in which the support plate is separated by the support separation device 10 of the first embodiment is as shown in FIG. 1 (b). The substrate 1 and light transmittance The support plate 2 (support) is attached via the adhesive layer 3, and further, a laminated body of the separation layer 4 which is deteriorated by light irradiation is provided between the adhesive layer 3 and the support plate 2. In FIG. 1 (b), the laminated body 100 is adhered to the dicing tape 5 including the dicing frame 6 on the substrate 1 side. [0017] The support separating device 10 according to the first embodiment in which such a laminate 100 is targeted is provided in the form shown in FIG. 1 (b), and includes a platform 50 (mounting table), a light irradiation unit 40, and a lift部 30 、 挂 部 20。 30, the holding portion 20. [0018] (1.1) Platform 50 The platform 50 is a stage on which the laminated body 100 is placed. A porous portion 51 having a porous portion is provided on the upper surface of the platform 50, and a non-illustrated decompression portion is connected to the porous portion 51. Through this, the layered body 100 placed on the platform 50 is fixed on the plane of the substrate 1 side by the porous portion 51. [0019] (1.2) Light Irradiation Unit 40 The light irradiation unit 40 irradiates light through the light-transmitting support plate 2 to the separation layer 4 in the laminate 100. [0020] Specifically, the light irradiating unit 40 scans the laminated body 100 while simultaneously supporting the peripheral portion (area) of the separation layer 4 formed on the laminated body 100 having a circular shape in a plan view through the support plate 2. 4a) The portion is deteriorated by irradiation with light. [0021] Here, the second diagram is a diagram showing a region 4a that has been deteriorated by light irradiation through the light irradiation unit 40 on the separation layer 4 that is circular in plan view. As shown in FIG. 2, the width W1 of the region 4 a is from the outer peripheral end portion of the separation layer 4 toward the inside, and is preferably in a range of 0.5 mm to 8 mm, and more preferably in a range of 1.5 mm to 8 mm. If the width W1 is 6 mm or more, a gap is formed between the substrate 1 and the support plate 2 of the separation layer 4 laminated in the region 4a, and the fluid is ejected from the gap toward the inside of the laminated body 100, which can smoothly pass The laminated body 100 separates the support plate 2. In addition, if the width W1 is 2 mm or less, the area of the region 4a where the light is irradiated on the separation layer 4 can be made smaller, so the area where the substrate 1 is irradiated with light can be made smaller. [0022] In this specification, the term "deterioration" of the separation layer means a state where the separation layer can be broken by a slight external force, or a state where the adhesion force of the layer contacting the separation layer is low. phenomenon. As a result of the deterioration of the separation layer caused by the absorption of light, the separation layer loses its strength or adhesiveness before receiving light irradiation. In short, by absorbing light, the separation layer becomes brittle. The so-called metamorphism of the separation layer may be the decomposition of the separation layer due to the energy of the absorbed light, the change in the spatial arrangement, or the dissociation of the functional groups. The deterioration of the separation layer occurs as a result of absorbing light. [0023] Therefore, for example, the support plate and the substrate can be easily separated by deteriorating the separation layer only by lifting the support plate and destroying the separation layer. More specifically, for example, one of the substrate and the support plate of the laminate is fixed to the mounting table by a support separation device or the like, and is lifted by holding the other by an adsorption pad (holding means) having an adsorption means. Separate the support plate from the substrate, or the chamfered portion of the end portion of the peripheral portion of the support plate is held by a separation plate provided with a clamp (claw) and the like to apply force, and the substrate and the support plate may be separated. In addition, for example, the support plate may be peeled from the substrate of the laminate by a support separation device having a peeling means for supplying a peeling solution for peeling an adhesive. A peeling solution is supplied to at least a part of the peripheral end portion of the adhesive layer of the laminated body by this peeling means, and the adhesive layer of the laminated body is dissolved, so that the adhesive layer can be dissolved in the separation layer to concentrate the force. , Apply force to the base plate and the support plate. Therefore, the substrate and the support plate can be appropriately separated. [0024] Still, the force applied to the laminated body may be appropriately adjusted by the size of the laminated body, etc., and is not limited. For example, if the area is 40,000 to 70,000 mm² The left and right laminated bodies can appropriately separate the substrate and the support plate by applying a force of about 0.1 to 5 kgf. [0025] If the area 4a of the separation layer 4 is deteriorated by the light irradiation of the light irradiation portion 40, the chamfered portion 2a (Fig. 3 (b)) at the end of the peripheral portion of the support plate 2 is transmitted through the clamp Holding 23, a gap can be formed between the chamfered portion 2a and the region 4a. Preferably, the chamfered portion 2a (FIG. 3 (b)) is lifted by being held by the gripper 23 to form a gap between the chamfered portion 2a and the region 4a. The details will be described later, but this gap can be used as an opportunity to separate the substrate 1 and the support plate 2. [0026] The light system that the light irradiation section 40 irradiates the separation layer 4 may be appropriately selected in accordance with the wavelength absorbed by the separation layer 4. Examples of lasers that emit light irradiating the separation layer 4 include YAG lasers, ruby lasers, glass lasers, and YVOs.₄ Solid lasers such as lasers, LD lasers, fiber lasers, liquid lasers such as pigment lasers, CO₂ Gas lasers such as lasers, excimer lasers, Ar lasers, He-Ne lasers, lasers such as semiconductor lasers, free electron lasers, or non-laser lasers. The laser system that emits light irradiating the separation layer 4 can be appropriately selected according to the material constituting the separation layer 4, and a laser that can irradiate light of a wavelength that deteriorates the material constituting the separation layer 4 may be selected. [0027] Here, in the substrate 1, an area arranged so as to be opposed to the separation layer 4 in the area 4a is a non-circuit forming area as a structure in which a integrated circuit or the like is not formed. In addition, in the substrate 1, a structure other than a region arranged so as to be opposed to the region 4 a is a structure (circuit formation region) such as an integrated circuit. Therefore, by deteriorating only the separation layer 4 in the region 4 a, it is possible to avoid irradiating light to a region other than the region arranged relative to the region 4 a, that is, to the circuit formation region of the substrate 1. Therefore, the separation layer 4 in the region 4 a can be modified while avoiding irradiating the light with the light irradiating unit 40 in the circuit formation region of the substrate 1 and damage to the circuit formation region of the substrate 1 due to the light. [0028] (1. 3) Lifting section 30 The lifting section 30 is connected to the central portion fixed on the upper surface side of the flat plate portion 21 having a circular shape in a plan view as shown in FIG. 1 (b), and follows the first (a ) And the Z axis shown in FIG. 1 and FIG. 1 (b) to raise and lower the holding portion 20. [0029] In the first embodiment, the lifting portion 30 is connected and fixed to the flat plate portion 21, but the present invention is not limited to this aspect. For example, a floating joint and a stopper may be provided in the lifting portion 30. For example, the floating joint may be disposed at a center portion of the upper surface side of the flat plate portion 21 having a circular shape in a plan view of the holding portion 20. In this case, the flat plate portion 21 is connected to the lifting portion 30 via a floating joint, is rotatable, and the surface provided on the suction pad 22 of the flat plate portion 21 is opposite to the laminate 100 fixed to the platform 50. In the plane, it is movable in an inclined manner. Then, the stopper is provided as a locking means for preventing the flat plate portion 21 from being tilted more than necessary. When the flat plate portion 21 is intended to be tilted more than necessary, the stopper contacts the upper surface portion of the flat plate portion 21 and the flat plate portion 21 is not tilted more than this. (2) With such floating joints and stoppers, the inclination of the flat plate portion 21 can also be adjusted, and the support plate 2 can be configured to be sucked and held by the suction pad 22. [0030] (1. 4) Holding section 20 The holding section 20 includes a flat plate section 21, an adsorption pad 22 (adsorption section), a clamp 23 (holding section), a gas ejection section 24 (ejection section), a slide driving section 25 (driving section), and a level block 26 (abutment portion). [0031] (1. 4. 1) Flat plate portion 21 The flat plate portion 21 is connected to the lifting portion 30. The flat plate portion 21 is a substantially circular structure arranged on the platform 50 in a plan view. For convenience of explanation, the center point C of the flat plate portion 21 is shown in FIG. 1 (a). [0032] (1. 4. 2) Suction pad 22 The adsorption pad 22 is disposed on a surface of the flat plate portion 21 opposite to the platform 50. More specifically, as shown in FIG. 1 (a), the suction pad 22 is held in two places opposite to each other at the center point C of the flat plate portion 21 having a circular shape in a plan view, and along an imaginary line connecting these. Lines and lines that intersect at the center point C in total, 4 locations in the two opposite locations that hold the center point C are each disposed inside (closer to the center point C) than the peripheral end portion of the flat plate portion 21. [0033] The adsorption pad 22 is a region that can be abutted on the opposite side of the region 4a of the surface (also described as the upper surface of the laminated body 100) of the laminated body 100 placed on the platform 50. [0034] The suction pad 22 is capable of holding the support plate 2 by vacuum suction, and examples thereof include a bellows pad. The suction pad 22 is vacuum-adsorbed in the state of abutting the support plate 2 at the above position. For example, the suction pad 22 is moved along the Z axis from the direction away from the platform 50 by the lifting portion 30, and can be lifted and supported. Board 2. [0035] (1. 4. 3) Jig 23 The jig 23 has a structure in which the laminated body 100 mounted on the platform 50 can be held (held) by being connected to the flat plate portion 21 via the slide driving portion 25 near each suction pad 22. [0036] More specifically, as shown in FIG. 1 (a), the jig 23 is connected to two places opposite to each other while being held at the center point C of the flat plate portion 21 having a circular shape in plan view, The imaginary line of the two places and the line orthogonal to the center point C are respectively located outside the peripheral end portion of the flat plate portion 21 (apart from the center point C) at the four places totaling the two places opposing the center point C. side). [0037] Here, in FIG. 1 (a), a line along the X-axis direction and a line along the Y-axis direction corresponding to the imaginary line are shown. In the same place, one suction pad 22 and one jig 23 Departments are on the same line. Then, the clamps 23 of the four places are arranged at equal intervals along the outer periphery of the flat plate portion 21, and therefore, when holding (holding) the laminated body 100 placed on the platform 50, a force can be applied to the laminated body 100 evenly. This is particularly the case where the support plate 2 of the laminate 100 is a thin layer (e.g., 0. In the case of a glass layer (about 4 mm), it is helpful to separate the support plate 2 without breaking it. [0038] The jig 23 is a cross-sectional view shown in FIG. 1 (b) and holds the flat plate portion 21 on both sides. The upper end portion of each clamp 23 is connected to the slide driving portion 25 provided on the upper surface of the flat plate portion 21, and the lower end portion is located lower than the lower surface of the flat plate portion 21 (the arrangement surface of the adsorption pad 22). The slide driving unit 25 is provided with a mechanism for adjusting the height of each jig 23, and the position of each jig 23 can be adjusted along the Z-axis direction. As shown in FIG. 1 (b), when the laminated body 100 is placed on the platform 50 and the holding portion 20 is lowered, the lower end portion of the jig 23 is located near the outer peripheral area of the laminated body 100. 1 (b) is for convenience of explanation. The light irradiating part 40 is between the laminated body 100 and the holding part 20 on the platform 50. However, when the holding part 20 is holding the laminated body 100, it is a light irradiating part. 40 is located away from this position. [0039] The material for forming the jig 23 may be appropriately selected according to the material of the support plate 2 to be held. Therefore, as a material for forming the jig 23, a metal such as stainless steel or aluminum, an engineering plastic, or the like can be used. In addition, when the material of the support plate 2 is glass, it is an engineering plastic and is preferably formed by using aromatic polyether ketone. Among the aromatic polyether ketones, polyether ether ketone (PEEK) having an aromatic group is used. Polyether ketone ketone (PEKK) having an aromatic group and polyether ether ketone ketone (PEEKK) having an aromatic group are preferable, and PEEK is the most preferable. Accordingly, when the outer peripheral end portion of the support plate 2 made of glass is held by the clamp 23, the support plate 2 can be prevented from being damaged. [0040] Hereinafter, the fixture 23 will be described in detail using FIG. 3. Figures 3 (a) to 3 (c) are enlarged cross-sectional views of the space enclosed by a dotted circle in Figure 1 (b). FIG. 3 (a) is a cross-sectional view of the jig 23, and FIG. 3 (b) is a diagram illustrating a state where the inclined surface 23b of the jig 23 abuts on the chamfered portion 2a of the support plate 2 of the laminated body 100. 3 (c) is a view showing a state before the inclined surface 23b is locked at the outer peripheral end portion of the support plate 2 of the laminated body 100 in the arrowed cross section taken along the line BB 'in FIG. 3 (b), and is captured. [0041] As shown in FIG. 3 (a), the jig 23 includes an opposing surface 23a and an inclined surface 23b (locking surface). [0042] The opposite surface 23a is opposed to the outer peripheral end portion of the support plate 2. Here, the opposing surface 23 a is a surface perpendicular to the plane portion of the support plate 2 of the laminated body 100 fixed to the platform 50, and has an arc of the same size as the arc at the outer peripheral end portion of the support plate 2, or That is, a surface that is curved such that a larger arc is drawn than an arc that the outer peripheral end portion has. [0043] The inclined surface 23b is a surface formed at the lower end portion of the jig 23 and along the lower end (bottom edge) of the opposite surface 23a, and faces the center point C of the flat plate portion 21. That is, the inclined surface 23b is inclined with respect to the YZ plane. In other words, in FIG. 1 (b), the inclined surfaces 23b of the jigs 23 that are held on both sides while holding the flat plate portion 21 are inclined downward in a direction in which the distance between them becomes closer as they go downward. As a result, the inclined surface 23b is attached to the outer peripheral end portion of the support plate 2 and abuts on the chamfered portion 2a located on the back side of the surface facing the flat plate portion 21, so that the chamfered portion 2a can be locked. [0044] More specifically, the inclined surface 23b has an inclination within a range of 30 ° or more and less than 90 ° with respect to the XZ plane. Accordingly, the chamfered portion 2a of the support plate 2 can prevent an excessive force from being applied by the inclined surface 23b. In addition, in a state where the lower surface of the level block 26 disposed below the flat plate portion 21 abuts the upper surface of the support plate 2, the inclination of the inclined surface 23 b is relative to the inclination of the chamfered portion 2 a of the support plate 2. It is provided in a parallel manner, and it is most preferable because the excessive force is not concentrated on the end of the chamfered portion 2a during the contact. [0045] The inclined surface 23b is provided along the lower end of the opposite surface 23a of the plurality of jigs 23. The plurality of jigs 23 are in a state in which the lower part of the level block 26 disposed below the flat plate part 21 abuts the upper surface of the support plate 2 and surrounds the outer peripheral end portion of the support plate 2, and each is provided at the inclination of the plurality of jigs 23 The surface 23b approaches the outer peripheral end portion of the support plate 2 at the same speed at the same time by the slide driving portion 25. Therefore, by such inclined surfaces 23b, the laminated body 100 can be induced while the center point C of the support plate 2 of the laminate 100 and the center point C of the flat plate portion 21 overlap, and the outer periphery of the support plate 2 can be locked at the same time End. Therefore, the support separating device 10 can hold the outer peripheral end portion of the support plate 2 in a state where the support plate 2 is brought into close contact with each other by the inclined surfaces 23 b of the plurality of jigs 23 arranged at equal intervals so as to surround the flat plate portion 21. Therefore, the force for holding the support plate 2 can be evenly applied from the inclined surfaces 23 b of the plurality of jigs 23. When the flat plate portion 21 has been lifted, it is possible to appropriately prevent the support plates from abutting the inclined surfaces 23 b of the plurality of jigs 23. 2 The outer peripheral end portion is separated by the inclined surface 23b. [0046] Here, two inclined surfaces 23b are provided in each fixture 23, and these are arranged side by side along the opposite surface 23a as shown in FIG. 3 (c). Each of the inclined surfaces 23b arranged side by side can have a width L of about 5 to 10 mm. However, an arc parallel to the opposite surface 23a is drawn near the end of the support plate 2 on each of the inclined surfaces 23b. [0047] Then, the inclined surface 23b and the inclined surface 23b arranged side by side are separated from each other, and the separated portion is configured as an ejection port 27 (opening) that is a gas ejection portion 24 that ejects gas. Specifically, a groove is formed on the lower end (bottom) of the clamp 23 from the inner side (the flat plate portion 21 side) to the opposite side, and the end on the flat plate portion 21 side of the groove is a separation portion corresponding to the above. . On the opposite side of the groove, that is, on the opposite side of the inside of the clamp 23 (the flat plate portion 21 side), a gas ejection portion 24 is provided, and the nozzle end communicates with the gas to be supplied to the groove. [0048] As described above, by providing the ejection port 27 between the inclined surface 23b and the inclined surface 23b in each of the jigs 23, the gas emitted from the ejection port 27 can be effectively sprayed until the inclined surface 23b abuts against the inverted surface. The corner portion 2a is below the outer peripheral end portion of the support plate 2 lifted. Alternatively, the two inclined surfaces 23b provided in each jig 23 may be used as one inclined surface. In this case, the ejection port 27 may be provided in one of the locking surfaces. [0049] (1. 4. 4) Gas ejection section 24 The gas ejection section 24 integrally constitutes each of the jigs 23. Specifically, as shown in FIG. 1 (a), it is held at two points opposite to the center point C of the flat plate portion 21 having a circular shape in a plan view, and is located at the center point along an imaginary line connecting the two. Lines orthogonal to C are located at a total of 4 places in the two opposite places holding the center point C, and each is located outside the center 23 (away from the center point C). That is, regarding a line along the X-axis direction and a line along the Y-axis direction corresponding to the aforementioned imaginary line shown in FIG. 1 (a), one suction pad 22, one jig 23, One gas ejection portion 24 is located on the same line, and is arranged in this order along a direction away from the center point C. [0050] The gas ejection portion 24 is configured by a gas ejection nozzle, and one end portion is arranged at the lower end portion of the jig 23 and the other end portion is connected to a gas supply device (not shown). [0051] The gas ejection unit 24 is such that the ejection direction of the ejected gas is inclined downward. Specifically, as shown in FIG. 4, the ejection direction of the ejected gas is an inclined angle of 0 to 45 ° with respect to the plane portion (XY plane) of the separation layer 4 (T˚ in FIG. 4). In this way, a gas ejection nozzle is provided. The gap formed by the gas system having this inclination angle is held at the outer peripheral end portion of the support plate 2 so as to be held by the inclined surface 23 b, and is sprayed on the plane of the support plate 2 side of the separation layer 4. This makes it easy to separate the support plate 2 by the separation layer 4. [0052] The gas ejection portions 24 arranged at equal intervals along the outer peripheral end portion of the flat plate portion 21 can independently control the ejection. That is, the gas may not be ejected from a certain gas ejection section 24, and the gas may be ejected from only a specific gas ejection section 24. Still, as the amount of gas sprayed on the plane of the support plate 2 side of the separation layer 4 can be 0. 3 to 0. 5 MPa, set to 100 to 300 L / min. [0053] The gas system ejected from the gas ejection unit 24 does not affect the support plate 2 and the separation layer 4, and may be a type of gas that does not hinder the separation of the support plate 2. Examples include air, dry air, At least one group selected from nitrogen and argon is selected. [0054] As shown in FIG. 3 (b), the lower end of the inclined surface 23b and the lower end of the gas ejection portion 24 are arranged on the same plane as the surface of the support plate 2 on the side opposite to the substrate 1. Thereby, the lower end of the inclined surface 23b and the gas ejection portion 24 can be prevented from being caught on the substrate 1 and the bonding layer 3, and the like. Therefore, the inclined surface 23 b is brought into contact with only the support plate 2, and the support plate 2 can be smoothly held by the jig 23. [0055] Although the gas ejection unit 24 is not shown in the figure, it can also be a moving mechanism that can move up and down along the Z axis direction together with the jig 23 as described above. Thereby, the position from which the gas is ejected toward the inside of the laminated body 100 can be appropriately adjusted from the gas ejection section 24. [0056] (1. 4. 5) Slide driving section 25 The slide driving section 25 is disposed near each of the clamps 23 on the upper surface of the flat plate section 21. Each of the slide driving units 25 slides the gripper 23 located nearby in the direction of the XY plane so as to approach or move away from the outer peripheral end portion of the flat plate portion 21 (Figures 3 (b) and (c)). The slide driving unit 25 slides each clamp 23 toward the outer peripheral end portion of the support plate 2 at the same speed at the same time. Accordingly, the outer peripheral end portion of the support plate 2 can be surrounded and held by the jig 23. [0057] As the sliding driving unit 25, a sliding mechanism using a pneumatic cylinder can be used. An adjuster (not shown) is provided in the sliding drive section 25. By adjusting the drive pressure of the pneumatic cylinder by the adjuster, the holding force of the support plate 2 caused by the clamp 23 can be changed. [0058] As described above, the slide driving unit 25 has a mechanism that moves the jig 23 and the gas ejection unit 24 up and down along the Z-axis direction. [0059] (1. 4. 6) Level block 26 The level block 26 is disposed on the inner side (closer to the center point C) of each adsorption pad 22 below the flat plate portion 21 (the surface on the opposite side of the platform 50) and has a downward protrusion. Structure. As will be described later, the protruding end portion (lower end) of the level block 26 is provided with an abutment surface 26 a that abuts on the upper surface (flat surface portion) of the support plate 2, and can be prevented from being adsorbed on the adsorption pad 22 when the support plate 2 is separated. The support plate 2 is skewed inappropriately. Therefore, the length (protruding length) in the Z direction of the level block 26 is slightly shorter than the length in the Z direction of the suction pad 22. The difference in height between the protruding end (lower end) of the level block 26 and the lower end of the jig 23 is designed in a specific manner in accordance with the thickness of the separated support plate 2. However, since it has a height adjustment mechanism, it can Adjust the height. [0060] The material used to form the level block 26 may be appropriately selected according to the material of the supporting plate 2 in contact, for example, resin (engineering plastic, etc.) may be used. The level block 26 is an engineering plastic, and is preferably formed using an aromatic polyether ketone. Among the aromatic polyether ketones, polyether ether ketone (PEEK) having an aromatic group and polyether ketone having an aromatic group Ketones (PEKK) and polyetheretherketone ketones (PEEKK) having an aromatic group are preferred, and PEEK is most preferred. Thus, for example, when the contact with the upper surface of the support plate 2 made of glass is prevented, the support plate 2 can be prevented from being damaged. In addition, the level block 26 can be reduced in weight, and the load on the lifting portion 30 can be reduced. [0061] (1. 5) Other Structures The support separation device 10 according to the first embodiment includes structures other than the above-mentioned structures. For example, it includes a position sensor (not shown) that detects each position of the jig 23 moved by the slide driving unit 25. [0062] The position sensor is configured by a magnetic sensor, and includes two sensors that are fixed to the clamp 23 and two sensing heads that detect the displacement of the magnet that moves together with the sliding movement of the clamp 23. For example, the two sensor heads use their respective positions as a reference, and the distance between the two sensor heads is calibrated, for example, by a value from 0 to 100. For example, if the distance between the two sensor heads is set to about several mm, the position of the jig 23 can be determined on the order of μm. Based on this calibration value, the two sensing heads determine the position of the magnet. Thereby, the position of the jig 23 which moves the same distance as the magnet at the same time can be accurately determined. More specifically, depending on the range of the calibration value, it is determined whether the jig 23 is disposed at a position before the outer peripheral end portion of the support plate 2 is held, or the jig 23 holds the outer peripheral end portion of the support plate 2 or the jig 23 The outer peripheral end portion of the support plate 2 is damaged. For example, when it can be determined that a value in the range of 0 to 100 indicates a value greater than 60, the clamp 23 is disposed at a position before holding the outer peripheral end portion of the support plate 2 and indicates a value greater than 10 and a value of 60 or less. At this time, the jig 23 is disposed at a position where the outer peripheral end portion of the support plate 2 can be held. When a value of 0 or more and 10 or less is indicated, the jig 23 is disposed at a position where the outer peripheral end portion of the support plate 2 can be held. Say more inside. [0063] The support separation device 10 of the first embodiment further includes a control unit that controls the ejection of the gas from the gas ejection unit 24, controls the elevating unit 30, or the slide driving unit 25. [0064] In the first embodiment, the number of the arrangement of the jig 23 and the gas ejection portion 24 is four locations along the outer periphery of the flat plate portion 21. However, the present invention is not limited to this arrangement number. The supporting plate 2 of the lifting laminate 100 may be held, and the jig 23 may be provided with only one space on the outer periphery of the flat plate portion 21. In the case where they are arranged in a plurality of spaces, these are ideally arranged at regular intervals along the outer periphery of the flat plate portion 21. [0065] In addition, in the first embodiment, two inclined surfaces 23b are provided on each jig, but even when only one inclined surface 23b is provided, the outer peripheral portion of the support plate 2 can be lifted. [0066] ＜ 2. Support separation method> A method of separating the support plate 2 from the laminate 100 using the support separation device 10 having the above configuration (support separation method) will be described. [0067] The method for separating a support body according to the first embodiment includes a gap forming step of fixing a substrate and holding the outer peripheral end portion of the support plate 2 by at least one holding portion to lift the substrate. A gap is formed between the plates 2 and a gap maintaining step is performed by sucking and holding the support plate 2 from the back surface of the surface formed by the gap 7 and maintaining the gap 7 and a separating step is performed after the gap maintaining step. From the gap 7 toward the inside of the laminated body 100, a gas is ejected from a gas ejection portion 24 provided in the jig 23, and the support plate 2 is separated from the laminated body 100. [0068] FIGS. 5 (a) to 5 (e) are diagrams illustrating a method for separating a support according to the first embodiment. It is to be noted that Figs. 5 (a) to 5 (e) are sectional views viewed from the same direction as Fig. 1 (b). 5 (a) to 5 (e) are not shown. [0069] FIG. 5 (a) shows the laminated body 100 as the light irradiation step by forming the region 4a of the outer peripheral end of the separation layer 4 through the light irradiation part 40 shown in FIG. 1 (b). A state in which the porous portion 51 is attracted to the stage 50. In this state, the position of the holding portion 20 is adjusted so that the jig 23 and the gas ejection portion 24 are positioned outside the outer peripheral end portion of the laminated body 100. Still, in this state, the level block 26 is also abutted on the support plate 2, and the suction pad 22 is sucked and held on the support plate 2. [0070] Next, as shown in FIG. 5 (b), the clamp 23 and the gas ejection portion 24 slide to move closer to the laminated body 100 by the slide driving portion 25, and the inclined surface 23b of the clamp 23 is in contact with The lower side (area 4a side) of the chamfered portion 2a of the outer peripheral end portion of the support plate 2. [0071] Then, from the state shown in FIG. 5 (b), the clamp 23 and the gas ejection portion 24 are further slid to move. As shown in FIG. 5 (c), the chamfered portion 2a of the support plate 2 is The inclined surface 23b is lifted from a direction away from the area 4a. In this state, a gap 7 is formed between the region (including the chamfered portion 2a) and the region 4a with respect to the region 4a of the support plate 2 (a gap forming step). In the state shown in FIG. 5 (c), the jig 23 not only slides and moves, but also can form a gap 7 by being slightly raised. [0072] Next, as shown in FIG. 5 (d), the jig 23 and the gas ejection portion 24 slide and move in a direction away from the laminated body 100 in response to the driving by the slide driving portion 25. In this state, even if the inclined surface 23b of the clamp 23 is separated from the chamfered portion 2a of the support plate 2, the chamfered portion 2a of the support plate 2 is maintained in a raised state because the suction pad 22 is continuously adsorbed, and the gap 7 can be maintained. (Gap maintenance step). [0073] Next, as shown in FIG. 5 (e), the flat plate portion 21 is raised, and the positions of the suction pad 22, the jig 23, and the gas ejection portion 24 are raised. Accordingly, the outer peripheral end portion of the support plate 2 adsorbed by the adsorption pad 22 is further lifted. When adjusted to this position, the gas is ejected from the gas ejection unit 24 (separation step). As described above, the gas system ejected from the gas ejection section 24 (the ejection port 27) is ejected in an obliquely downward direction. Therefore, before the gas is ejected, the gas is ejected near the area of the support plate 2 that is in contact with the separation layer 4, and the support plate 2 can be peeled off and separated by the separation layer 4. If separated, the adsorption to the platform 50 of the laminate 100 caused by the porous portion 51 is stopped, and a series of support separation methods are ended. [0074] FIG. 6 is a diagram showing a state where gas is ejected from the gas ejection unit 24 in a plan view of the laminate 100. For convenience of explanation, the configuration of the flat plate portion 21 and the like is not shown. [0075] FIG. 6 shows a state in which the gap 7 is expanded toward the inside of the laminate 100 through the gas ejected from each of the gas ejection sections 24 provided in four places. As shown in FIG. 6, the gaps 7 at the four places along the outer peripheral end portion of the laminate 100 are enlarged, so that the support plate 2 is not taped as compared with the case where the support plate 2 is separated by only the suction pad 22. Excessive stress is applied, and the support plate 2 can be separated by the separation layer 4. This is advantageous in the case where the support plate 2 is thin and structurally brittle, because the support plate 2 is not damaged and can be smoothly separated in a short time, which is very advantageous. [0076] One of the above-mentioned series of operations is realized by the lifting unit 30, the slide driving unit 25, and the gas ejection unit 24 being controlled by a control unit (not shown). [0077] For example, the control unit first lowers the suction pad 22 and the clamp 23 to a specific height by controlling the lifting portion 30, and at the same time turns ON the suction of the porous portion 51 of the platform 50. Next, the control unit controls the slide driving unit 25 to slide the jig 23 toward the inside (or further raise the jig 23) to form a gap. Then, the adsorption by the adsorption pad 22 is started. Next, by controlling the slide driving unit 25, the jig 23 is slid to the outside and moved to a position separated from the chamfered portion 2a of the support plate 2. Next, the control unit controls the gas ejection unit 24 to start the gas ejection in a state where the adsorption by the adsorption pad 22 is continued, and at the same time, controls the lifting unit 30 to raise the adsorption pad 22 to a specific height. [0078] Such processing can be performed according to a timing chart set in advance, or the height of the flat plate portion 21, the position of the clamp 23, or the position of the suction pad 22 can be sensed, and the position can be detected and controlled at the same time. At this time, the aforementioned position sensor can also be used. [0079] ＜ 3. Laminated body> As shown in (a) of FIG. 1, the laminated body 100 of the supporting plate 2 is separated by the supporting body separating device 10 according to the present embodiment and described in detail. The laminated body 100 is formed by laminating a substrate 1, a layer 3, a separation layer 4 that is deteriorated by absorbing light, and a support plate 2 made of a material that transmits light, in this order. [0080] (3. 1) Substrate 1 Substrate 1 is attached to a support plate 2 on which a separation layer 4 is provided via an adhesive layer 3. Then, the substrate 1 is supported by the support plate 2 and can be used for processes such as thinning and mounting. The substrate 1 is not limited to a silicon wafer substrate, and any substrate such as a ceramic substrate, a thin film substrate, or a flexible substrate can be used. [0081] Still, structures such as integrated circuits, metal bumps, etc. can also be mounted on the surface of the substrate. [0082] (3. 2) Support plate 2 The support plate 2 is a support that supports the substrate 1 and is attached to the substrate 1 through an adhesive layer 3. Therefore, when the support plate 2 is used in the process of thinning, transporting, and mounting the substrate 1, it is sufficient to have the necessary strength in order to prevent the substrate 1 from being damaged or deformed. In addition, it is only necessary to pass light for the purpose of allowing the separation layer to deteriorate. From the above viewpoints, examples of the support plate 2 include glass, silicon, and acrylic resin. [0083] Still, the support plate 2 can be used with a thickness of 300 to 1000 μm. According to the method for separating a support body according to this embodiment, even if the support plate 2 (support body) is so thin, the support plate 2 can be prevented from being damaged, and at the same time, it can be appropriately separated from the laminate. [0084] (3. 3) Adhesive layer 3 Adhesive layer 3 is used to attach the substrate 1 and the support plate 2. [0085] As the adhesive for forming the adhesive layer 3, for example, acrylic, phenolic, naphthoquinone, hydrocarbon, polyimide, elastomer, polyfluorene, etc. are generally known in the art. For various adhesives, polyfluorene-based resins, hydrocarbon resins, acrylic-styrene resins, maleimide-based resins, elastomer resins, and the like can be preferably used or a combination thereof. [0086] The thickness of the next layer 3 may be appropriately set according to the type of the substrate 1 and the support plate 2 to be attached, the treatment applied to the substrate 1 after the attachment, and the like, but it is within a range of 10 to 150 μm. Ideally, it is more preferable to be in the range of 15 to 100 μm. [0087] The next layer 3 is used for attaching the substrate 1 and the support plate 2. The adhesive layer 3 can be formed by applying an adhesive by a method such as spin coating, dipping method, roll doctor method, spray coating, slit coating, or the like. The adhesive layer 3 may be formed by, for example, directly applying the adhesive to the substrate 1 instead of applying the adhesive to the substrate 1 in advance, and applying the adhesive to both surfaces of the film (that is, a dry film). [0088] The adhesive layer 3 is a layer formed by an adhesive used to attach the substrate 1 and the support plate 2. [0089] As the adhesive, for example, various adhesives generally known in the art such as acrylic, phenolic, naphthoquinone, hydrocarbon, polyimide, and elastomer can be used. [0090] Hereinafter, the composition of the resin contained in the adhesive layer 3 will be described. [0091] As long as the resin system contained in the adhesive layer 3 has adhesiveness, for example, hydrocarbon resin, acrylic-styrene resin, maleimide resin, elastomer resin, polyfluorene resin, etc. Or combine this and so on. [0092] (Hydrocarbon Resin) A hydrocarbon resin is a resin having a hydrocarbon skeleton and polymerizing a monomer composition. Examples of the hydrocarbon resin include cycloolefin-based polymers (hereinafter referred to as "resin (A)"), and at least one resin selected from the group consisting of terpene resin, rosin-based resin, and petroleum resin ( Hereinafter, it is referred to as "resin (B)") and the like, but is not limited thereto. [0093] The resin (A) may be a resin obtained by polymerizing a monomer component containing a cycloolefin-based monomer. Specifically, Specific examples include ring-opening (co) polymers containing monomer components containing cycloolefin-based monomers, and resins for addition (co) polymerization of monomer components containing cycloolefin-based monomers. Examples of the cycloolefin-based monomer included in the monomer component constituting the resin (A) include, for example, bicyclic compounds such as norbornene, norbornadiene, dicyclopentadiene, and hydroxydicyclopentadiene. Tricyclics, tetracyclic dodecenes and the like, pentacyclics such as cyclopentadiene terpolymers, heptanes and the like of tetracyclopentadiene, or alkyl groups of these polycyclics ( (Methyl, ethyl, propyl, butyl, etc.) substitutes, alkenyl (vinyl, etc.) substitutes, alkylene (ethylene, etc.) substitutes, aryl (phenyl, tolyl, naphthalene) Group, etc.). Among them, norbornene-based monomers selected from the group consisting of norbornene, tetracyclododecene, or these alkyl substituents are preferred. [0095] The monomer component system constituting the resin (A) may also contain other monomers copolymerizable with the above-mentioned cycloolefin-based monomer, and for example, an olefin monomer is preferred. Examples of the olefin monomer system include ethylene. , Propylene, 1-butene, isobutylene, 1-hexene, α-olefin, etc. The olefinic single system may be linear or branched. [0096] In addition, as a unit constituting the resin (A) The composition contains the cycloolefin monomer from the viewpoint of high heat resistance (low thermal decomposition and thermal weight reduction). The proportion of the cycloolefin monomer in the entire monomer component constituting the resin (A) is desirable. It is preferably 5 mole% or more, more preferably 10 mole% or more, and more preferably 20 mole% or more. The proportion of the cyclic olefin monomer in the entire monomer component constituting the resin (A) is not particularly limited, but is determined by solubility The viewpoint of stability over time in the solution is preferably 80 mole% or less, and 70 mole% or less. 。 [0097] In addition, as the monomer component constituting the resin (A), a linear or branched olefin monomer may be contained. The proportion of the olefin monomer to the entire monomer component constituting the resin (A) From the viewpoint of solubility and flexibility, 10 to 90 mole% is preferable, 20 to 85 mole% is more preferable, and 30 to 80 mole% is more preferable. [0098] In addition, the resin (A) is, for example, a cycloolefin type The method of polymerizing a monomer component composed of a monomer and an olefin monomer is a resin having no polar group, and is ideal for suppressing gas generation at a high temperature. [0099] Polymerization when polymerizing monomer components The method, polymerization conditions, and the like are not particularly limited, and may be appropriately set in accordance with a general method. [0100] Examples of commercially available products that can be used as the resin (A) include "TOPAS" manufactured by POLYPLASTICS, "APEL" manufactured by Mitsui Chemicals, "ZEONOR" and "ZEONEX" manufactured by ZEON of Japan, "ARTON" made by JSR Corporation. [0101] The glass transition temperature (Tg) of the resin (A) is preferably 60 ° C or higher, and particularly preferably 70 ° C or higher. If the glass transition temperature of the resin (A) is 60 ° C. or higher, softening of the adhesive layer 3 can be further suppressed when the laminate is exposed to a high-temperature environment. [0102] The resin (B) is a resin selected from the group consisting of terpene-based resins, rosin-based resins, and petroleum resins. Specific examples of the terpene-based resins include terpene resins, terpene phenol resins, modified terpene resins, hydrogenated terpene resins, and hydrogenated terpene phenol resins. Examples of the rosin-based resin system include rosin, rosin ester, hydrogenated rosin, hydrogenated rosin ester, polymerized rosin, polymerized rosin ester, and modified rosin. Examples of petroleum resins include aliphatic or aromatic petroleum resins, hydrogenated petroleum resins, modified petroleum resins, alicyclic petroleum resins, coumarone · indene petroleum resins, and the like. Among these, hydrogenated terpene resins and hydrogenated petroleum resins are preferred. [0103] The softening point of the resin (B) is not particularly limited, but is preferably 80 to 160 ° C. When the softening point of the resin (B) is 80 to 160 ° C, the laminate can be suppressed from being softened when exposed to a high-temperature environment, and adhesion failure is not caused. [0104] The weight average molecular weight of the resin (B) is not particularly limited, but is preferably 300 to 3,000. When the weight average molecular weight of the resin (B) is 300 or more, the heat resistance is sufficient, and the amount of exhaust gas is reduced in a high-temperature environment. On the other hand, if the weight average molecular weight of the resin (B) is 3,000 or less, the rate of dissolution into the adhesive layer of the hydrocarbon-based solvent is good. Therefore, the residue of the adhesive layer on the substrate after the support is separated can be quickly dissolved and removed. The weight average molecular weight of the resin (B) in the present embodiment means a molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC). [0105] As the resin, a mixed resin (A) and a resin (B) may also be used. The heat resistance is good by mixing. For example, the mixing ratio of the resin (A) and the resin (B) is (A): (B) = 80:20 to 55:45 (mass ratio), and is preferable because it has excellent heat resistance and flexibility in a high-temperature environment. (0106) (Acrylic-Styrenic Resin) As the acrylic-styrene-based resin, for example, a resin polymerized by using styrene or a derivative of styrene and a (meth) acrylate as a monomer is used. [0107] Examples of the (meth) acrylic acid ester system include an alkyl (meth) acrylate having a chain structure, a (meth) acrylate having an aliphatic ring, and a (formaldehyde) having an aromatic ring. Based) acrylate. Examples of the (meth) acrylic acid alkyl esters having a chain structure include acrylic long alkyl esters having an alkyl group having 15 to 20 carbon atoms, and acrylic alkanes having an alkyl group having 1 to 14 carbon atoms. Esters and the like. Examples of the acrylic long alkyl esters include n-pentadecyl, n-hexadecyl, n-heptadecyl, n-octadecyl, n-nonadecyl, An alkyl ester of acrylic acid or methacrylic acid such as n-icosyl. The alkyl group may be branched. [0108] Examples of the acrylic alkyl esters having an alkyl group having 1 to 14 carbon atoms include commonly known acrylic alkyl esters used in acrylic adhesives that are currently available. Examples of the alkyl group include methyl, ethyl, propyl, butyl, 2-ethylhexyl, isooctyl, isononyl, isodecyl, dodecyl, lauryl, and tridecyl Alkyl esters of acrylic acid or methacrylic acid. [0109] Examples of the (meth) acrylate having an aliphatic ring include cyclohexyl (meth) acrylate, cyclopentyl (meth) acrylate, 1-adamantyl (meth) acrylate, Norbornyl (meth) acrylate, isofluorenyl (meth) acrylate, tricyclodecyl (meth) acrylate, tetracyclododecyl (meth) acrylate, dicyclopentyl (methyl Group) acrylate, etc., but isofluorenyl methacrylate and dicyclopentyl (meth) acrylate are preferred. [0110] The (meth) acrylate system having an aromatic ring is not particularly limited, but examples of the aromatic ring system include a phenyl group, a benzyl group, a tolyl group, a stub group, a biphenyl group, a naphthyl group, and an anthracene. Group, phenoxymethyl, phenoxyethyl and the like. The aromatic ring system may have a linear or branched alkyl group having 1 to 5 carbon atoms. Specifically, a phenoxyethyl acrylate is preferable. (Malaysium imine-based resin) As the maleimide-imide-based resin, for example, as a monomer, N-methylmaleimide, N-ethylmaleimide, Nn -Propylmaleimide, N-isopropylmaleimide, Nn-butylmaleimide, N-isobutylmaleimide, N-sec-butylmaleimide Imine, N-third butylmaleimide, Nn-pentylmaleimide, Nn-hexylmaleimide, Nn-heptylmaleimide, Nn-octylmaleimide N-imide, N-lauryl maleimide, N-stearyl maleimide and other maleimide having alkyl groups, N-cyclopropyl maleimide, N- Cyclobutylmaleimide, N-cyclopentylmaleimide, N-cyclohexylmaleimide, N-cycloheptylmaleimide, N-cyclooctylmaleimide Maleimide having an aliphatic hydrocarbon group such as amine, N-phenylmaleimide, Nm-methylphenylmaleimide, No-methylphenylmaleimide, Np- A resin obtained by polymerizing an aromatic maleimide having an aryl group such as methylphenylmaleimide. [0112] For example, a cycloolefin copolymer of a copolymer having a repeating unit represented by the following chemical formula (1) and a repeating unit represented by the following chemical formula (2) can be used as a resin for the connection component.(In the chemical formula (2), n is an integer of 0 or 1 to 3.) As such a cycloolefin copolymer system, APL 8008T, APL 8009T, and APL 6013T (all manufactured by Mitsui Chemicals) can be used. [0113] (Elastomer) It is ideal that the elastic system contains a styrene unit as a constituent unit of the main chain, and the "styrene unit" may have a substituent. Examples of the substituent group include an alkyl group having 1 to 5 carbons, an alkoxy group having 1 to 5 carbons, an alkoxyalkyl group having 1 to 5 carbons, ethoxyl, carboxyl, and the like. The content of the styrene unit is preferably within a range from 14% by weight to 50% by weight. Furthermore, it is preferable that the weight average molecular weight of an elastic system is the range of 10,000 or more and 200,000 or less. [0114] If the content of the styrene unit is in the range of 14% by weight or more and 50% by weight or less, and the weight average molecular weight of the elastomer is in the range of 10,000 or more and 200,000 or less, it is easily dissolved in a hydrocarbon system described later. Solvent, so the adhesive layer can be removed easily and quickly. In addition, when the content of the styrene unit and the weight average molecular weight are within the above-mentioned ranges, the wafer is a resist solvent (for example, PGMEA, PGME, etc.) and an acid (hydrofluoric acid) exposed during the resist lithography step. Etc.) and alkali (TMAH, etc.) exhibit excellent resistance. [0115] The (meth) acrylic acid ester may be further mixed with the elastomer. [0116] The content of the styrene unit is preferably 17% by weight or more, and more preferably 40% by weight or less. [0117] The more preferable range of the weight average molecular weight is 20,000 or more, and the more preferable range is 150,000 or less. [0118] As the elastic system, if the content of the styrene unit is in the range of 14% by weight or more and 50% by weight or less, and the weight average molecular weight of the elastomer is in the range of 10,000 or more and 200,000 or less, various kinds of materials can be used. Elastomer. Examples include polystyrene-poly (ethylene / propylene) block copolymer (SEP), styrene-isoprene-styrene block copolymer (SIS), and styrene-butadiene-styrene Block copolymers (SBS), styrene-butadiene-butene-styrene block copolymers (SBBS), and, among others, hydrides, styrene-ethylene-butene-styrene block copolymers (SEBS), styrene-ethylene-propylene-styrene block copolymer (styrene-isoprene-styrene block copolymer) (SEPS), styrene-ethylene-ethylene-propylene-styrene block Copolymer (SEEPS), styrene block is a styrene-ethylene-ethylene-propylene-styrene block copolymer (SeptonV9461 (made by Kuraray), SeptonV9475 (made by Kuraray)), a styrene block copolymer Segments are reactive cross-linked styrene-ethylene-butene-styrene block copolymers (Septon V9827 (reactive polystyrene-based hard block) produced by Kuraray), polystyrene-poly (ethylene- Ethylene / propylene) block-polystyrene block copolymer (SEEPS-OH: terminal hydroxyl group modification) and the like. As the content of the styrene unit and the weight average molecular weight of the elastomer, those within the above ranges can be used. [0119] In addition, hydrides are also preferred in elastomers. In the case of a hydride, stability to heat is improved, and deterioration such as decomposition or polymerization is unlikely to occur. Further, from the viewpoint of solubility in a hydrocarbon-based solvent and resistance to a resistive solvent, it is also preferable. [0120] In addition, a block polymer having styrene at both ends in the elastomer is also preferable. Since styrene having high thermal stability is blocked at both ends, it exhibits higher heat resistance. 012 [0121] More specifically, the hydride of a block copolymer of an elastic system styrene and a conjugated diene is preferable. The stability to heat is improved, and it is difficult to cause degradation such as decomposition or polymerization. In addition, a styrene block having high thermal stability is provided at both ends to exhibit higher heat resistance. Furthermore, from the viewpoint of solubility in a hydrocarbon-based solvent and resistance to a resistive solvent, it is also preferable. [0122] Examples of commercially available products used as the elastomer included in the adhesive constituting the adhesive layer 3 include "Septon (trade name)" manufactured by Kuraray, "HYBRAR (trade name)" manufactured by Kuraray, and Asahi Kasei "Tuftec (trade name)" made by the company, "DYNARON (trade name)" made by the JSR company, etc. The content of the elastomer included in the adhesive constituting the adhesive layer 3 is, for example, 100 parts by weight of the entire amount of the adhesive composition, preferably 50 to 99 parts by weight, and 60 weight. It is more preferable to be in a range of not less than 99 parts by weight, and most preferably to be in the range of not less than 70 parts by weight and not more than 95 parts by weight. By setting it as such a range, a wafer and a support can be bonded suitably while maintaining heat resistance. [0124] In addition, plural types of elastomers may be mixed. In short, the adhesive constituting the adhesive layer 3 may contain a plurality of types of elastomers. At least one of the plurality of types of elastomers may include a styrene unit as a constituent unit of the main chain. In addition, at least one of the plurality of types of elastomers is such that the content of styrene units is in the range of 14% by weight or more and 50% by weight or the weight average molecular weight is in the range of 10,000 or more and 200,000 or less. It is within the scope of the present invention. In addition, in the case where the adhesive constituting the adhesive layer 3 contains a plurality of types of elastomers, they may be mixed, and the content of the styrene unit may be adjusted so as to fall within the above range. For example, if the content of styrene units is 30% by weight of Sepon 4033 manufactured by Kuraray Corporation, and the content of Septon 2063 by 13% by weight of styrene units is Septon 2063 in a weight ratio of 1: 1 When mixed, the styrene content of the entire elastomer contained in the adhesive is 21 to 22% by weight, and thus 14% by weight or more. In addition, for example, when the styrene unit is 10% by weight and 60% by weight is mixed with a weight ratio of 1: 1, the ratio becomes 35% by weight, which is within the above range. The present invention may also have such a form. In addition, all of the plural kinds of elastic systems included in the adhesive constituting the adhesive layer 3 contain a styrene unit within the above-mentioned range, and the weight average molecular weight within the above-mentioned range is most preferable. [0125] It is preferable to form the adhesive layer 3 using a resin other than a photocurable resin (for example, a UV curable resin). By using a resin other than the photocurable resin, it is possible to prevent residues from being left around the minute unevenness of the substrate 1 after the adhesive layer 3 is peeled off or removed. In particular, it is preferable that the adhesive system constituting the adhesive layer 3 is not dissolved in all solvents, but is dissolved in a specific solvent. This is because a physical force is not applied to the substrate 1, but it can be removed by dissolving the adhesive layer 3 in a solvent. When the adhesive layer 3 is removed, even if the substrate 1 has a low strength, the adhesive layer 3 can be easily removed without breaking or deforming the substrate 1. [0126] (Polyfluorene-based resin) The adhesive used to form the adhesive layer 3 may also contain a polyfluorene-based resin. By forming the adhesive layer 3 with a polyfluorene-based resin, it is possible to produce a laminate in which the adhesive layer can be dissolved in a later step and the support plate can be peeled off from the substrate even if the laminate is processed at a high temperature. If the adhesive layer 3 contains a polyfluorene resin, for example, the laminate can be suitably used even in a high-temperature process in which the laminate is subjected to a high temperature of 300 ° C. or higher by annealing or the like. [0127] The polyfluorene-based resin has a structure constituted by at least one constituent unit among the constituent units represented by the following general formula (3) and the general unit (4). .(Here, R of the general formula (3)¹ , R² And R³ And R in the general formula (4)¹ And R² They are each independently selected from the group consisting of phenylene, naphthyl and anthracenyl, and X 'is an alkylene having 1 to 3 carbon atoms. ) The poly (fluorene) resin is a laminated body having at least one of a polyfluorene constituent unit represented by the formula (3) and a polyether fluorene constituent unit represented by the formula (4). After the substrate 1 and the support plate 2 are processed, even if the substrate 1 is processed under high temperature conditions, it is possible to prevent the adhesive layer 3 from becoming insoluble due to decomposition and polymerization. In addition, if the polyfluorene-based resin is a polyfluorene resin composed of a polyfluorene constituent unit represented by the above formula (3), it is stable even when heated to a higher temperature. Therefore, it is possible to prevent the residue caused by the adhesion layer from being generated on the substrate 1 after cleaning. [0128] The weight average molecular weight (Mw) of the polyfluorene resin is preferably in the range of 30,000 to 70,000, and more preferably in the range of 30,000 to 50,000. If the weight average molecular weight (Mw) of the polyfluorene resin is in the range of 30,000 or more, for example, an adhesive composition that can be used at a high temperature of 300 ° C or more can be obtained. In addition, if the weight average molecular weight (Mw) of the polyfluorene resin is in the range of 70,000 or less, it can be appropriately dissolved depending on the solvent. That is, an adhesive composition which can be appropriately removed by a solvent can be obtained. (Diluent solvent) (i) Examples of the diluent solvent used when forming the adhesive layer 3 include hexane, heptane, octane, nonane, isononane, methyloctane, decane, undecane, Dodecane, tridecane, etc. linear hydrocarbons, branched hydrocarbons with 4 to 15 carbons, for example, cyclohexane, cycloheptane, cyclooctane, naphthalene, decahydronaphthalene, tetrahydronaphthalene And other cyclic hydrocarbons, p-menthane, o-menthane, m-menthane, diphenylmenthane, 1,4-terpenediol, 1,8-terpenediol, pinane, norbornane, pinane, Thujane, pinane, longifolene, geraniol, nerol, linalool, citral, citronellol, menthol, isomenthol, neomenthol, alpha-terpineol, beta-terpineol Alcohol, γ-terpineol, terpinen-1-ol, terpinen-4-ol, dihydroterpineol acetate, 1,4-eucalyptol, 1,8-eucalyptol, 莰Terpenes based solvents such as alcohol, carvone, ionone, thujone, camphor, d-limonene, l-limonene, dipentene, etc .; lactones such as γ-butyrolactone; acetone, methyl ethyl Ketone, cyclohexanone (CH), methyl-n-pentyl ketone, methyl isoamyl ketone, 2-heptanone, etc. Ketones; Polyvalent alcohols such as ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol; ethylene glycol monoacetate, diethylene glycol monoacetate, propylene glycol monoacetate, or dipropylene glycol mono Monomethyl ethers, monoethyl ethers, monopropyl ethers, monobutyl ethers, etc. of compounds having an ester bond such as acetate, monomethyl ethers, monoethyl ethers, monopropyl ethers, or monobutyl ethers of the compounds having the aforementioned polyvalent alcohols or the aforementioned ester bonds Derivatives of polyvalent alcohols such as compounds having an ether bond, such as monophenyl ether (preferably propylene glycol monomethyl ether acetate (PGMEA), propylene glycol monomethyl ether (PGME)) ; Cyclic ethers like dioxane, or methyl lactate, ethyl lactate (EL), methyl acetate, ethyl acetate, butyl acetate, butyl methoxyacetate, methyl pyruvate, pyruvate Ester of ethyl ester, methyl methoxypropionate, ethyl ethoxypropionate, etc .; anisole, ethyl benzyl ether, cresyl methyl ether, diphenyl ether, dibenzyl ether, Aromatic organic solvents such as phenyl ether and butylphenyl ether. [0130] (Other components) 的 The adhesive constituting the adhesive layer 3 is in a range that does not impair essential characteristics, and may further include other substances that are miscible. For example, various additives conventionally used such as additional resins, plasticizers, adhesives, stabilizers, colorants, thermal polymerization inhibitors, and surfactants to improve the performance of the adhesive can be used. [0131] (3.4) Separation Layer 4 Next, the separation layer 4 is a layer formed of a material that is deteriorated by absorbing light irradiated through the support plate 2. As shown in FIG. 5 (e), when a fluid is sprayed into the laminate 100 from a gap provided between the substrate 1 and the support plate 2, the separation layer 4 in a region other than the region 4a is also destroyed. [0132] The thickness of the separation layer 4 is, for example, preferably in a range of 0.05 μm or more and 50 μm or less, and more preferably in a range of 0.3 μm or more and 1 μm or less. If the thickness of the separation layer 4 is in a range of 0.05 μm or more and 50 μm or less, the short-term light irradiation and low-energy light irradiation can cause the separation layer 4 to have desired deterioration. The thickness of the separation layer 4 is particularly desirable from the viewpoint of productivity, and it is included in a range of 1 μm or less. [0133] In the laminate 100, another layer may be formed between the separation layer 4 and the support plate 2. In this case, the other layers may be made of a material that transmits light. This makes it possible to appropriately add a layer having desired properties and the like to the laminated body 100 without impeding the incidence of light into the separation layer 4. The wavelength of light that can be used differs depending on the type of material constituting the separation layer 4. Therefore, the material constituting the other layers does not need to transmit all the light, and the material constituting the separation layer 4 can be appropriately selected from a material having a wavelength at which light is deteriorated. [0134] The separation layer 4 is preferably formed only of a material having a structure that absorbs light, but may be formed by adding a material that does not have a structure that absorbs light within a range that does not impair the essential characteristics of the present invention. Separation layer 4. In addition, it is desirable that the side of the separation layer 4 facing the adhesion layer 3 is flat (unevenness is not formed), so that the formation of the separation layer 4 can be easily performed, and it can be evenly attached during the attachment. . [0135] (Fluorocarbon) The rhenium separation layer 4 may be made of fluorocarbon. The separation layer 4 is made of fluorocarbon, and absorbs light to cause deterioration. As a result, the separation layer 4 loses its strength or adhesiveness before receiving light. Therefore, by applying a slight external force (for example, lifting the support plate 2 and the like), the separation layer 4 can be broken, and the support plate 2 and the substrate 1 can be easily separated. The fluorocarbon system constituting the separation layer 4 can be appropriately formed by a plasma CVD (chemical vapor deposition) method. [0136] Fluorocarbon absorbs light having a wavelength in a specific range depending on the type. By irradiating the separation layer with light having a wavelength in a range in which the fluorocarbon is absorbed by the separation layer 4, the fluorocarbon can be appropriately modified. The light absorption rate in the separation layer 4 is preferably 80% or more. [0137] The light irradiated to the separation layer 4 conforms to a wavelength that can be absorbed by fluorocarbon. For example, a YAG laser, a ruby laser, a glass laser, and YVO are suitably used.₄ Solid lasers such as lasers, LD lasers, fiber lasers, liquid lasers such as pigment lasers, CO₂ Gas lasers such as lasers, excimer lasers, Ar lasers, He-Ne lasers, lasers such as semiconductor lasers, free electron lasers, or non-laser lasers are sufficient. The wavelength range in which the fluorocarbon can be modified is not limited here. For example, a wavelength range of 600 nm or less can be used. [0138] (Polymer containing a structure having light absorption in the repeating unit) The separation layer 4 may contain a polymer containing a structure having light absorption in the repeating unit. This polymer is deteriorated by irradiation with light. The deterioration of the polymer is generated by absorbing and irradiating the light having the above structure. As a result of the deterioration of the polymer, the separation layer 4 loses its strength or adhesiveness before receiving light irradiation. Therefore, by applying a slight external force (for example, lifting the support plate 2 and the like), the separation layer 4 can be broken, and the support plate 2 and the substrate 1 can be easily separated. [0139] The above-mentioned structure having light absorption is a chemical structure that absorbs light and deteriorates a polymer containing the structure as a repeating unit. This structural system contains, for example, an atomic group of a conjugated π-electron system composed of a substituted or unsubstituted benzene, a condensed ring, or a heterocyclic ring. More specifically, the structure may be a cardo structure, or a diphenyl ketone structure, a diphenylfluorene structure, a diphenylfluorene structure (bisphenylfluorene structure), Diphenyl structure or diphenylamine structure. [0140] When the above-mentioned structure is present in the side chain of the polymer, the structure can be represented by the following formula.(Wherein R is an independent alkyl, aryl, halogen, hydroxyl, keto, fluorenylene, sulfo or N (R⁴ ) (R⁵ ) (Here, R⁴ And R⁵ Are independent hydrogen atoms or 1 to 5 carbon atoms), Z is absent or -CO-, -SO₂ -, -SO- or -NH-, n is an integer of 0 or 1 to 5. ) In addition, the polymer is contained in the following formula, for example, a repeating unit represented by any of (a) to (d), or (e), or a structure of (f) is included in the main unit. chain.(In the formula, l is an integer of 1 or more, m is an integer of 0 or 1 to 2, and X is any one of the formulas shown in (a) to (e) above "Chemical 3", Either one of the formulas shown in "Chemical 3" above, or does not exist, Y₁ And Y₂ Independent -CO- or SO₂ -. l is preferably an integer of 10 or less. ) As examples of the benzene ring, condensed ring, and heterocyclic ring represented by the above-mentioned "Chemical 3", phenyl, substituted phenyl, benzyl, substituted benzyl, naphthalene, substituted naphthalene, anthracene, substituted anthracene, and anthracene Quinone, substituted anthraquinone, acridine, substituted acridine, azobenzene, substituted azobenzene, fluoramine, substituted fluoramine, fluorone, substituted fluorone, carbazole, substituted carbazole, N-alkane Carbazole, dibenzofuran, substituted dibenzofuran, phenanthrene, substituted phenanthrene, fluorene, and substituted fluorene. In the case where the exemplified substituents have more substituents, the substituents are, for example, alkyl, aryl, halogen atom, alkoxy, nitro, aldehyde, cyano, amidine, and dialkylamino groups. , Sulfonamide, amidine, carboxylic acid, carboxylic acid ester, sulfonic acid, sulfonic acid ester, alkylamine and arylamine. [0141] Among the substituents represented by "Chemical 3" above, the fifth substituent having two phenyl groups is Z as -SO₂ Examples of the case of-include bis (2,4-dihydroxyphenyl) fluorene, bis (3,4-dihydroxyphenyl) fluorene, bis (3,5-dihydroxyphenyl) fluorene, and bis ( 3,6-dihydroxyphenyl) fluorene, bis (4-hydroxyphenyl) fluorene, bis (3-hydroxyphenyl) fluorene, bis (2-hydroxyphenyl) fluorene, and bis (3,5-dimethylformamide) 4-hydroxyphenyl) fluorene and the like. [0142] Among the substituents represented by the above “Chemical Formula 3”, the fifth substituent having two phenyl groups is exemplified in the case where Z is —SO—. Dihydroxyphenyl) fluorene, bis (5-chloro-2,3-dihydroxyphenyl) fluorene, bis (2,4-dihydroxyphenyl) fluorene, bis (2,4-dihydroxy-6) -Methylphenyl) fluorene, bis (5-chloro-2,4-dihydroxyphenyl) fluorene, bis (2,5-dihydroxyphenyl) fluorene, bis (3,4-dihydroxybenzene) Yl) fluorene, bis (3,5-dihydroxyphenyl) fluorene, bis (2,3,4-trihydroxyphenyl) fluorene, bis (2,3,4-trihydroxy-6-methyl) Phenyl) fluorene, bis (5-chloro-2,3,4-trihydroxyphenyl) fluorene, bis (2,4,6-trihydroxyphenyl) fluorene, bis (5-chloro-2, 4,6-trihydroxyphenyl) fluorene and the like. [0143] Among the substituents represented by the above-mentioned “Chem. 3”, the fifth substituent having two phenyl groups is exemplified in the case where Z is -C (= O)-, 4-dihydroxybenzophenone, 2,3,4-trihydroxybenzophenone, 2,2 ', 4,4'-tetrahydroxybenzophenone, 2,2', 5,6'-tetrakis Hydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-octyloxybenzophenone, 2-hydroxy-4-dodecylbenzophenone, 2 2,2'-dihydroxy-4-methoxybenzophenone, 2,6-dihydroxy-4-methoxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxy Benzophenone, 4-amino-2'-hydroxybenzophenone, 4-dimethylamino-2'-hydroxybenzophenone, 4-diethylamino-2'-hydroxydione Benzophenone, 4-dimethylamino-4'-methoxy-2'-hydroxybenzophenone, 4-dimethylamino-2 ', 4'-dihydroxybenzophenone, and 4-dimethylamino-3 ', 4'-dihydroxybenzophenone and the like. [0144] When the structure is present in the side chain of the polymer, the proportion of the polymer containing repeating units including the structure is such that the light transmittance of the separation layer 4 is 0.001% to 10% In the range. When the polymer is prepared such that the ratio is included in such a range, the separation layer 4 can absorb light sufficiently and can be surely and rapidly deteriorated. That is, removal of the support plate 2 of the laminated body 100 is easy, and the irradiation time of the light necessary for this removal can be shortened. [0145] The above structure is capable of absorbing light having a wavelength in a desired range by selection of the kind. For example, the wavelength of the light that can be absorbed by the above structure is preferably in a range of 100 nm to 2,000 nm. Within this range, the wavelength of light that can be absorbed by the structure is on the shorter wavelength side, and is, for example, within a range of 100 nm or more and 500 nm or less. For example, it is desirable that the structure described above is capable of deteriorating a polymer containing the structure by absorbing ultraviolet light having a wavelength in a range of approximately 300 nm to 370 nm. [0146] The light system capable of absorbing the above structure is, for example, a high-pressure mercury lamp (wavelength: 254 nm or more and 436 nm or less), KrF excimer laser (wavelength: 248 nm), ArF excimer laser (wavelength: 193 nm), F2 excimer laser (Wavelength: 157nm), XeCl laser (wavelength: 308nm), XeF laser (wavelength: 351nm) or solid UV laser (wavelength: 355nm), or g-line (wavelength: 436nm), h-line (Wavelength: 405 nm) or i-line (wavelength: 365 nm). [0147] The separation layer 4 described above contains a polymer containing the above-mentioned structure as a repeating unit. However, the separation layer 4 further includes a component other than the polymer described above. Examples of the component system include a filler, a plasticizer, and a component capable of improving the peelability of the support plate 2. These components may be appropriately selected from previously generally known substances or materials that do not hinder or promote the absorption of light according to the above-mentioned structure and the deterioration of the polymer. (0148) (Inorganic matter) The rhenium separation layer 4 may be made of an inorganic matter. The separation layer 4 is made of an inorganic substance, and deteriorates by absorbing light. As a result, the strength or adhesiveness before receiving light is lost. Therefore, by applying a slight external force (for example, lifting the support plate 2 and the like), the separation layer 4 can be broken, and the support plate 2 and the substrate 1 can be easily separated. [0149] The inorganic substance may have a structure that is deteriorated by absorbing light. For example, one or more inorganic substances selected from the group consisting of a metal, a metal compound, and carbon may be suitably used. The metal compound refers to a compound containing a metal atom, and may be, for example, a metal oxide or a metal nitride. Examples of such inorganic substances are not limited thereto, and examples thereof include gold, silver, copper, iron, nickel, aluminum, titanium, chromium, and SiO.₂ , SiN, Si₃ N₄ In the group consisting of Ti, TiN and carbon, one or more inorganic substances are selected. However, the so-called carbon system may also include the concept of allotrope of carbon, for example, diamond, fullerene, diamond-like carbon, nano carbon tube, and the like. [0150] The inorganic substance absorbs light having a wavelength in a specific range depending on the type. By irradiating the separation layer with light having a wavelength in a range in which the inorganic substance used in the separation layer 4 absorbs, the inorganic substance can be appropriately deteriorated. [0151] As a light system irradiating the separation layer 4 made of an inorganic substance, in accordance with the wavelength that the inorganic substance can absorb, for example, a YAG laser, a ruby laser, a glass laser, and YVO are suitably used.₄ Solid lasers such as lasers, LD lasers, fiber lasers, liquid lasers such as pigment lasers, CO₂ Gas lasers such as lasers, excimer lasers, Ar lasers, He-Ne lasers, lasers such as semiconductor lasers, free electron lasers, or non-laser lasers are sufficient. [0152] The separation layer 4 made of an inorganic substance can be formed on the support plate 2 by a generally known technique such as sputtering, chemical vapor deposition (CVD), plating, plasma CVD, and spin coating. The thickness of the separation layer 4 made of an inorganic substance is not particularly limited, and may be a film thickness that can sufficiently absorb the light used, and for example, a film thickness in the range of 0.05 μm to 10 μm is preferable. In addition, an adhesive may be applied in advance to both surfaces or one surface of an inorganic film (for example, a metal film) composed of an inorganic substance constituting the separation layer 4 and attached to the support plate 2 and the substrate 1. [0153] In the case where a metal film is used as the separation layer 4, the conditions such as the film quality of the separation layer 4, the type of laser light source, and the laser output are such that laser reflection can be generated or charged to the film. Therefore, it is desirable to provide an anti-reflection film or an anti-charge film on or under the separation layer 4 or any of them, and it is desirable to take such measures. [0154] (Compound having structure with infrared absorption property) The separation layer 4 can also be formed from a compound having structure with infrared absorption property. This compound deteriorates by absorbing infrared rays. The separation layer 4 is a result of deterioration of the compound, and loses its strength or adhesiveness before receiving infrared radiation. Therefore, by applying a slight external force (for example, lifting a support, etc.), the separation layer 4 can be broken, and the support plate 2 and the substrate 1 can be easily separated. The compound system having a structure having infrared absorption or containing a structure having infrared absorption can be, for example, an alkane, an olefin (vinyl, trans, cis, vinylidene, tri-substituted, tetra-substituted, conjugated) , Accumulated polyenes, cyclic), alkynes (mono-, di-substituted), monocyclic aromatics (benzene, mono-, di-, tri-substituted), alcohols and phenols (OH radicals, intramolecular hydrogen bonding) , Intermolecular hydrogen bonding, saturated second order, saturated third order, unsaturated second order, unsaturated third order), acetal, ketal, aliphatic ether, aromatic ether, vinyl ether, ethylene oxide Alkanes, peroxide ethers, ketones, dialkylcarbonyls, aromatic carbonyls, enols of 1,3-diketones, o-hydroxyaryl ketones, dialkylaldehydes, aromatic aldehydes, carboxylic acids (dimerization Compound, carboxylic acid anion), formate, acetate, conjugated ester, non-conjugated ester, aromatic ester, lactone (β-, γ-, δ-), aliphatic acid chloride, aromatic acid Chloride, acid anhydride (conjugated, non-conjugated, cyclic, acyclic), primary ammonium amine, secondary ammonium amine, lactamamine, primary amine (aliphatic, aromatic), diamine Primary amine (aliphatic, aromatic), tertiary amine (aliphatic, aromatic), primary amine salt, secondary amine salt, tertiary amine salt, ammonium ion, aliphatic nitrile, aromatic nitrile, carbodiarylene Amines, aliphatic isonitriles, aromatic isonitriles, isocyanates, thiocyanates, aliphatic thiocyanates, aromatic thiocyanates, aliphatic nitrates, aromatic nitrates, nitramines, nitrosamines, Nitrates, nitrites, nitroso bonds (aliphatic, aromatic, monomer, dimer), sulfur compounds such as thiols, thiophenols, and sulfuric acid, thiocarbonyl, sulfenyl, sulfonium, sulfonium chloride, Primary sulfonamide, secondary sulfonamide, sulfate, carbon-halogen bond, Si-A¹ Key (A¹ (H, C, O or halogen), P-A² Key (A² H, C or O), or Ti-O bond. [0156] Examples of the structural system containing the carbon-halogen bond include -CH.₂ Cl, -CH₂ Br, -CH₂ I, -CF₂ -, -CF₃ , -CH = CF₂ , -CF = CF₂ , Fluorinated aryl, and chlorinated aryl. [0157] As containing Si-A¹ Examples of the bond structure include SiH and SiH₂ SiH₃ , Si-CH₃ , Si-CH₂ -, Si-C₆ H₅ , SiO-aliphatic, Si-OCH₃ , Si-OCH₂ CH₃ Si-OC₆ H₅ , Si-O-Si, Si-OH, SiF, SiF₂ And SiF₃ Wait. As containing Si-A¹ The structure of the bond is particularly preferably a siloxane skeleton and a silsesquioxane skeleton. [0158] As containing the above-mentioned P-A² Examples of the bond structure include PH, PH₂ , P-CH₃ , P-CH₂ -, P-C₆ H₅ , A³ ₃ -P-O (A³ Aliphatic or aromatic), (A⁴ O)₃ -P-O (A⁴ System alkyl), P-OCH₃ , P-OCH₂ CH₃ , P-OC₆ H₅ , P-O-P, P-OH and O = P-OH. [0159] The above structure is capable of absorbing infrared rays having a wavelength in a desired range by selection of the type. Specifically, the wavelengths of the infrared rays whose structure is absorbable are, for example, in a range of 1 μm or more and 20 μm or less, and can be appropriately absorbed in a range of 2 μm or more and 15 μm or less. Furthermore, when the structure is a Si-O bond, a Si-C bond, and a Ti-O bond, the range may be 9 μm or more and 11 μm or less. However, the wavelengths of infrared rays that can be absorbed by each structure can be easily understood by those skilled in the art. For example, for the absorption bands in each structure, refer to the non-patent literature: SILVERSTEIN, BASSLER, MORRILL, "A Spectral Identification Method for Organic Compounds (5th Edition)-Combination of MS, IR, NMR, and UV" (1992) (Published annually) on pages 146 to 151. [0160] As a compound used for the formation of the separation layer 4, a compound having an infrared-absorbing structure is among the compounds having the structure described above. If it is soluble in a solvent for coating, it can be cured to form a solid layer. , It is not particularly limited. However, in order to effectively deteriorate the compound in the separation layer 4 and to easily separate the support plate 2 from the substrate 1, it is desirable that the infrared absorption in the separation layer 4 is large, that is, the infrared radiation in the separation layer 4 is irradiated with infrared rays. Low transmittance. Specifically, the infrared transmittance of the separation layer 4 is preferably less than 90%, and the infrared transmittance is preferably less than 80%. [0161] As an example, as a compound system having a siloxane skeleton, for example, a copolymer of a repeating unit represented by the following chemical formula (5) and a copolymer of a repeating unit represented by the following chemical formula (6) can be used. Resin or a copolymer of a repeating unit represented by the following chemical formula (5) and a copolymer derived from an acrylic compound-based repeating unit.(In formula (6), R⁶ It is hydrogen, an alkyl group having 10 or less carbon, or an alkoxy group having 10 or less carbon. ) Among them, t-butylstyrene (TBST) -di, which is a copolymer of a compound having a siloxane skeleton with a repeating unit represented by the aforementioned chemical formula (5) and a repeating unit represented by the following chemical formula (7) A methylsiloxane copolymer is preferable, and the repeating unit represented by the above formula (5) and the repeating unit represented by the following chemical formula (7) are contained in 1: 1, and TBST-dimethylsiloxane is copolymerized. More ideal.As the compound having a silsesquioxane skeleton, for example, a resin of a copolymer of a repeating unit represented by the following chemical formula (8) and a repeating unit represented by the following chemical formula (9) can be used.(In formula (8), R⁷ Is hydrogen or an alkyl group having 1 to 10 carbon atoms, and in formula (9), R⁸ Alkyl or phenyl having 1 to 10 carbon atoms. ) As a compound having a silsesquioxane skeleton, it can also be suitably used in Japanese Patent Laid-Open No. 2007-258663 (published on October 4, 2007) and Japanese Patent Laid-Open No. 2010-120901 (2010 Published on June 3), Japanese Patent Laid-Open Publication No. 2009-263316 (published on November 12, 2009), and Japanese Patent Laid-Open Publication No. 2009-263596 (published on November 12, 2009) Siloxane resin. [0162] Among them, a compound having a silsesquioxane skeleton is preferably a copolymer represented by the following chemical formula (10) and a repeating unit represented by the following chemical formula (11), and will be represented by the following chemical formula The repeating unit represented by (10) and the copolymer containing the repeating unit represented by the following chemical formula (11) at 7: 3 are more preferable.The polymer having a silsesquioxane skeleton may have a random structure, a trapezoidal structure, and a cage structure, and any of them may be used. Examples of the compound system containing a Ti—O bond include (i) tetra-i-propoxy titanium, tetra-n-butoxy titanium, (2-ethylhexyloxy) titanium, And titanium alkoxy titanium such as titanium-i-propoxy octyl glycolate; (ii) di-i-propoxy-bis (ethylacetone) titanium, and propanedioxy titanium bis (ethylethyl)钛 Acetate), etc .; (iii) iC₃ H₇ O-[-Ti (O-i-C₃ H₇ )₂ -O-]_n -i-C₃ H₇ And n-C₄ H₉ O-[-Ti (O-n-C₄ H₉ )₂ -O-]_n -n-C₄ H₉ And other titanium polymers; (iv) tri-n-butoxytitanium monostearate, titanium stearate, di-i-propoxytitanium diisostearate, and (2-n-butoxy Titanium compounds such as carbonylbenzyloxy) tributoxy titanium; (v) water-soluble titanium compounds such as di-n-butoxy-bis (triethanolamine ketone) and the like. [0164] Among them, as a compound containing a Ti—O bond is di-n-butoxy‧bis (triethanolamine ketone) titanium (Ti (OC₄ H₉ )₂ [OC₂ H₄ N (C₂ H₄ OH)₂ ]₂ ) Is ideal. [0165] The separation layer 4 described above contains a compound having a structure having infrared absorption properties, but the separation layer 4 is a step further and may contain components other than the above-mentioned compounds. Examples of the component system include a filler, a plasticizer, and a component capable of improving the peelability of the support plate 2. These ingredients may be appropriately selected from previously generally known substances or materials that do not hinder or promote the absorption of infrared rays according to the above-mentioned structure and the deterioration of the compound. [0166] (Infrared absorbing substance) The separation layer 4 may contain an infrared absorbing substance. The separation layer 4 is constituted by containing an infrared absorbing substance, and absorbs light to cause deterioration. As a result, the separation layer 4 loses its strength or adhesiveness before receiving light. Therefore, by applying a slight external force (for example, lifting the support plate 2 and the like), the separation layer 4 can be broken, and the support plate 2 and the substrate 1 can be easily separated. [0167] The infrared absorbing substance may have a structure that is deteriorated by absorbing infrared rays. For example, carbon black, iron particles, or aluminum particles can be suitably used. The infrared absorbing substance absorbs light having a wavelength in a specific range depending on the type. By irradiating the separation layer 4 with light having a wavelength in a range absorbed by the infrared absorbing substance of the separation layer 4, the infrared absorbing substance can be appropriately modified. (Reactive polysilsesquioxane) The separation layer 4 can be formed by polymerizing a reactive polysilsesquioxane, whereby the separation layer 4 has high chemical resistance and high heat resistance. . [0169] In this specification, a reactive polysilsesquioxane is a polysilsesquioxane having a silanol group at the end of the polysilsesquioxane skeleton or a functional group capable of forming a silanol group by hydrolysis. Siloxane can polymerize each other by condensing the silanol group or a functional group capable of forming a silanol group. In addition, if the reactive polysilsesquioxane has a silanol group or a functional group capable of forming a silanol group, a silsesquioxane skeleton having a random structure, a cage structure, a ladder structure, or the like can be used. [0170] It is preferable that the reactive polysilsesquioxane system has a structure represented by the following formula (12).In the formula (12), R "is independently selected from the group consisting of hydrogen and an alkyl group having 1 to 10 carbon atoms, and is composed of hydrogen and an alkyl group having 1 to 5 carbon atoms. The group is preferably selected. If "R" is hydrogen or an alkyl group having a carbon number of 1 to 10, heating by the step of forming the separation layer can make the reactive polymerization multiplied by the formula (12). The siloxanes are suitably condensed. [0171] In formula (12), p is preferably an integer of 1 or more and 100 or less, and an integer of 1 or more and 50 or less is preferable. The reactive polysilsesquioxane is formed by having a repeating unit represented by the formula (12), which is more than that of other materials. It has a higher Si-O bond content and can be formed in infrared rays (0.78 μm or more, 1000 μm). Below), far-infrared rays (3 μm or more and 1000 μm or less) are preferable, and the separation layer 4 having a high absorbance having a wavelength of 9 μm or more and 11 μm or less is more preferable. [0172] In the formula (12), R 'are independent organic groups which are the same or different from each other. Here, the R system is, for example, an aryl group, an alkyl group, or an alkenyl group, and these organic groups may have a substituent. [0173] When R 'is an aryl group, a phenyl group, a naphthyl group, an anthryl group, a phenanthryl group and the like can be mentioned, and a phenyl group is preferable. In addition, the aryl system may be bonded to the polysilsesquioxane skeleton through an alkylene group having 1 to 5 carbon atoms. [0174] When R 'is an alkyl group, examples of the alkyl group include a linear, branched, or cyclic alkyl group. When R is an alkyl group, a carbon number of 1 to 15 is preferable, and 1 to 6 is more preferable. In addition, when R is a cyclic alkyl group, it may be an alkyl group having a monocyclic or bicyclic structure. [0175] In the case where R ′ is an alkenyl group, as in the case of an alkyl group, linear, branched, or cyclic alkenyl groups may be mentioned, and the alkenyl-based carbon number is preferably 2 to 15, 2 to 6 are preferable. When R is a cyclic alkenyl group, it may be an alkenyl group having a monocyclic or bi- to tetracyclic structure. Examples of the alkenyl group include a vinyl group and an allyl group. [0176] Examples of the substituent group which R 'may have include a hydroxyl group and an alkoxy group. When the substituent is an alkoxy group, a linear, branched, or cyclic alkyl alkoxy group may be mentioned. The number of carbon atoms of the alkoxy group is preferably 1 to 15, and 1 to 10 is more preferable. ideal. [0177] In one aspect, the content of the reactive polysilsesquioxane is preferably 70 mole% or more and 99 mole% or less, and more preferably 80 mole% or more and 99 mole% or less. If the content of the reactive polysilsesquioxane is 70 mole% or more and 99 mole% or less, it can be formed by irradiating infrared rays (ideally far-infrared rays, more preferably light having a wavelength of 9 μm or more and 11 μm or less). A suitably deteriorated separation layer. [0178] In one aspect, the weight average molecular weight (Mw) of the reactive polysilsesquioxane is preferably 500 or more and 50,000 or less, and more preferably 1,000 or more and 10,000 or less. If the weight average molecular weight (Mw) of the reactive polysilsesquioxane is 500 or more and 50,000 or less, it can be suitably dissolved in a solvent and can be suitably coated on a support. [0179] Examples of commercially available products that can be used as the reactive polysilsesquioxane include SR-13, SR-21, SR-23, and SR-33 manufactured by Konishi Chemical Industry Co., Ltd. [0180] <4. Modified Example of Laminated Body> In the first embodiment described above, the laminated body 100 having the separation layer 4 between the support plate 2 and the adhesive layer 3 was used. However, in the case where an adhesive layer having a degree of peeling force that can be peeled off by applying a mechanical force is used, even if there is no separation layer, the adhesive layer is a laminated body directly adhering to the substrate and the support plate. The support separating device described in Embodiment 1 separates the support plate. [0181] Examples of the adhesive system capable of forming an adhesive layer having an adhesive force to such an extent that it can be peeled off by applying a mechanical force include pressure sensitive adhesives, peelable adhesives, and the like. Examples of pressure-sensitive adhesives (adhesives) include generally known pressure-sensitive adhesives such as synthetic rubbers such as latex rubber, acrylic rubber, isoprene rubber, and tackifier resins. The peelable adhesive may be peelable. For example, the release force may be adjusted by blending a release agent such as wax or silicone with a thermoplastic resin, a photocurable resin, or a thermosetting resin. The adhesive. Moreover, it may be a hardening type adhesive, which contains a thermosetting resin, a photocurable resin, etc., and hardens these resins, and develops peelability. Moreover, such a peelable adhesive agent may be an adhesive agent which contains a thermoplastic resin with low adhesive force, such as beeswax and wax, as a main component. [Embodiment 2] In the first embodiment described above, as shown in FIG. 6, a description will be given of a configuration in which gas is ejected simultaneously from all of the gas ejection sections 24 provided in four places, but the present invention is not limited to this. . In the second embodiment, another aspect related to gas ejection will be described with reference to FIG. 7. [0183] FIG. 7 is a schematic diagram showing the configuration of the second embodiment when a gas is ejected from the gas ejection unit 24, and is a diagram showing a state where the laminated body 100 is viewed in plan. 7 is a view corresponding to FIG. 6 of the first embodiment. [0184] In the second embodiment, in the step of ejecting the gas from the gas ejection section 24, first, as shown in FIG. 7 (a), the gas is ejected from the gas ejection section 24 at the position (i). The gas ejection unit 24 of ii) to (iv) does not eject gas. Here, the gas ejection unit 24 at the position (i) sprays, for example, a gas of 0.5 L / min for 3 seconds into the gap 7. [0185] Next, as shown in FIG. 7 (b), the gas ejection location is switched, and the gas ejection from the gas ejection portion 24 at the position (iv) is started, and the gas ejection portion 24 at the position (i) is stopped. The gas spurted. At this time, the gas ejection section 24 at the positions (ii) and (iii) does not eject gas. Here, the gas ejection part 24 at the position (iv) sprays, for example, a gas of 0.5 L / min for 3 seconds into the gap 7. [0186] Next, as shown in FIG. 7 (c), the gas ejection location is switched, and the gas ejection from the gas ejection portion 24 at the positions (i) and (iv) is started. At this time, the gas ejection section 24 at the positions (ii) and (iii) does not eject gas. Here, the gas ejection unit 24 at the positions (i) and (iv) sprays, for example, a gas of 0.5 L / min for 5 seconds into the gap 7. [0187] By going through the above steps, the support plate 2 can also be separated from the laminate 100. [0188] The switching of the above-mentioned gas ejection space can be performed by controlling the control device (not shown) of the support separation device 10 of the first embodiment. [0189] [Embodiment 3] In the first embodiment described above, as shown in FIG. 3 (c), a configuration in which each jig 23 has two inclined surfaces 23b and an ejection port 27 is disposed therebetween will be described. However, the arrangement position of the discharge port 27 in the present invention is not limited to this. The ejection port 27 may be disposed near the inclined surface 23b. This will be described using FIG. 8. [0190] FIG. 8 is a diagram showing the configuration of the third embodiment. The third embodiment has the same configuration as the first embodiment except that the arrangement of the inclined surface 23b and the discharge port 27 is different from the first embodiment. [0191] Specifically, as shown in FIG. 8, in the third embodiment, along the lower end (bottom) of the opposite surface 23a, an inclined surface 23b is formed in the middle portion to hold the inclined surface 23b. 。Equipped with an outlet 27. [0192] In this way, by setting the arrangement position of the ejection port 27 to be near the inclined surface 23b, the inclined surface 23b is brought into contact with the surface located on the flat plate portion 21 at the outer peripheral end portion of the support plate 2. In the chamfered portion 2a on the rear surface side, gas can be efficiently ejected into the gap formed on the outer peripheral portion of the support plate 2, and the outer peripheral portion of the support plate 2 can be appropriately held. [0193] [Embodiment 4] In the first embodiment, the gas ejection unit 24 is connected to the ejection port 27 provided in each jig 23, but the present invention is not limited to this. For example, it is also possible to maintain the gap 7 while the suction pad 22 is adsorbed on the outer peripheral portion of the upper surface of the support plate 2, and one of the nozzles for ejecting the gas is moved in the circumferential direction at the peripheral portion of the laminate 100 and ejects the gas in the gap. 7 appearance. [0194] [Embodiment 5] The above-mentioned Embodiment 1 is a structure in which the jig 23 and the gas ejection unit 24 are raised and lowered integrally, and are configured to slide and move integrally. However, the present invention is not limited to this, and each of the jigs 23 and the gas ejection unit 24 may be provided with a driving mechanism, and each step shown in FIGS. 5 (a) to 5 (e) may be performed. [0195] In the case where each has a driving mechanism, after the gas ejection unit 24 can be moved to a desired position for gas ejection in FIG. 5 (e), the gas is ejected from the gas ejection unit 24. Thereby, the gap can be enlarged more effectively. [Other Embodiments] (1) In the above-mentioned embodiment, the shape of the laminate in plan view is circular, but the shape of the laminate in plan view separated by the support separating device and method of the present invention is circular. (That is, the shape in plan view on the substrate and the support) may be a polygon such as a rectangle or a square. The support separation device and the support separation method of the present invention are based on ejecting fluid between the substrate and the support. For example, the substrate and the support may be separated, and the shape of the laminate in plan view is not limited. Therefore, the support separation device and the support separation method of the present invention are not limited to WLP (Wafer Level Package) known to perform semiconductor packaging (semiconductor device) including semiconductor elements (electronic parts), It can also be suitably applied to PLP (Panel Level Package). [0197] The present invention is not limited to the above-mentioned embodiments, and various changes can be made in the scope indicated in the claims, and it is obtained by appropriately combining technical means disclosed in different embodiments. Embodiments are also included in the technical scope of the present invention.

[0198]

1‧‧‧ substrate

2‧‧‧ support board (support body)

2a‧‧‧ Chamfer

3‧‧‧ Adjacent layer

4‧‧‧ separation layer

4a‧‧‧area

5‧‧‧ cutting tape

6‧‧‧ cutting frame

7‧‧‧ clearance

10‧‧‧ Support body separation device

20‧‧‧ Holding Department

21‧‧‧ Flat Department

22‧‧‧Adsorption pad (adsorption section)

23‧‧‧Jig (holding part)

23a‧‧‧ Opposite

23b‧‧‧inclined surface (locking surface)

24‧‧‧Gas ejection section (ejection section)

25‧‧‧ Sliding drive unit

26‧‧‧level block

26a‧‧‧ abutment

27‧‧‧Ejection port (opening)

30‧‧‧ Lifting Department

40‧‧‧light irradiation section

50‧‧‧platform

51‧‧‧ porous section

100‧‧‧ laminated

Claims (14)

A support separation device is a support separation device that separates the support from a laminate formed by attaching a substrate and a support that supports the substrate through an adhesive layer. The support separation device is characterized in that the support is separated from the substrate by a substrate. A side-fixed mounting table, a holding section holding the support, 升降 a lifting section for raising and lowering the holding section relative to the mounting table, the holding section is provided with at least one holding section for holding an outer peripheral end portion of the support Forming a gap between the substrate and the support; 吸附 an adsorption part which lifts up and maintains the support by adsorbing and holding the support on the back surface of the surface formed by the gap of the support; the holding part is It is provided with a discharge part which discharges a fluid from the said gap maintained by the said adsorption part toward the inside of the said laminated body. According to the support separation device of claim 1, wherein the holding portion is raised by holding the outer peripheral end portion of the support, the gap is formed. According to the support separation device of claim 1 or 2, wherein each of the holding portions includes the holding portion and the suction portion, and each of the holding portions of the plurality of layers includes the ejection portion. For example, the support separating device according to any one of claims 1 to 3, wherein a chamfered portion is provided at an outer peripheral end portion of the support, and the holding portion has a locking surface that locks the chamfered portion of the support. Is performed adjacent to the locking surface, and the opening portion through which the fluid is ejected is disposed in the ejection portion. The support separating device according to claim 4, wherein the opening is provided in the locking surface. For example, the support separation device according to any one of claims 1 to 5, wherein the support system is made of a material that transmits light, and the laminated system is provided between the substrate and the support, and is irradiated with light. The deteriorated separation layer further includes a light irradiating portion that irradiates light to at least a part of a peripheral portion of the separation layer through the support, and the holding portion is based on the support laminated on the portion through the area. The method of forming a gap between the body and the substrate is performed by holding and lifting the outer peripheral end portion of the support. The support separating device according to any one of claims 1 to 6, wherein the holding portion includes a flat plate portion connected to the lifting portion, and the flat plate portion is arranged on a peripheral portion of a side surface facing the support. The suction part is provided on the back side of the surface opposite to the support so that the grip part moves parallel to the support part so as to approach the suction part from an outer side than the peripheral part of the flat plate part. Driving department. The support separating device according to claim 7, wherein the flat plate portion is provided with an abutment surface having an abutting surface abutting the flat portion of the support body on the inner side of the peripheral portion of the flat surface portion relative to the side surface facing the support body. The contact portion is made of resin. A method for separating a support, which is a laminated body formed by attaching a substrate and a support supporting the substrate through an adhesive layer, and separating the support, which is characterized by including a gap forming step, which fixes the substrate, The outer peripheral end portion of the support is held by at least one holding portion to form a gap between the substrate and the support; 间隙 a gap maintaining step that adsorbs and holds the support by a back surface of a surface on which the gap is formed And lifting to maintain the gap; 分离 a separation step, after the gap maintaining step, the fluid is ejected from the ejection portion provided in the holding portion from the gap toward the inside of the laminate, and the laminate is separated from the laminate Support. The method for separating a support according to claim 9, wherein in the step of forming the gap, the holding portion is configured to form the gap by lifting the outer peripheral end portion of the support. The support separation method of claim 9 or 10, wherein in the gap forming step, the outer peripheral end portion of the support is held by a plurality of the holding portions, and a plurality of the above are formed between the substrate and the support. In the gap, in the gap maintaining step, the respective surfaces of the plural surfaces of the support which form the gap by holding the support by a plurality of the holding portions are individually adsorbed and lifted, and in the separation step system A fluid is ejected from a gap of one of the plurality of gaps toward the inside of the laminated body through a discharge portion provided in the gripping portion. The method for separating a support according to any one of claims 9 to 11, wherein after the gap forming step and before the gap maintaining step, the outer peripheral end portion of the support and the holding portion are separated. The support separation method according to any one of claims 9 to 12, wherein in the gap forming step, when the outer peripheral end portion of the support is gripped by the gripping portion, the gripping that is held on the support is adsorbed and held. The peripheral part of the part contacted by the part is lifted. The support separation method according to any one of claims 9 to 13, wherein the support system is composed of a light-transmitting material, and the laminated system is provided between the substrate and the support, and is provided with irradiation light. For the deteriorated separation layer, includes a light irradiation step which irradiates light through at least a part of a peripheral portion of the separation layer through the support before the gap formation step; in the gap formation step, which is the above The holding portion is configured to hold an outer peripheral end portion of the support so that a gap is formed between the support and the substrate laminated through the region.