JP2018014361A - Support body separation device and support body separation method - Google Patents

Abstract

When separating a support from a laminate, the substrate and the support are separated successfully in a short time without damaging the substrate and the support.
A support separating apparatus (10) according to an embodiment of the present invention forms a gap (7) by gripping a chamfered portion (2a) of a support plate (2) by a clamp (23). In a state where 7) is maintained by the suction pad (22), gas is ejected from the gas ejection part (24) integrated with the clamp (23).
[Selection] Figure 1

Description

  The present invention relates to a support separating apparatus and a support separating method.

  In recent years, electronic devices such as IC cards and mobile phones have been required to be thinner, smaller and lighter. In order to satisfy these requirements, a thin semiconductor chip must be used as a semiconductor chip to be incorporated. For this reason, the thickness (film thickness) of the wafer substrate on which the semiconductor chip is based is currently 125 μm to 150 μm, but it is said that it must be 25 μm to 50 μm for the next generation chip. Therefore, in order to obtain a wafer substrate having the above film thickness, a wafer substrate thinning process is indispensable.

  Since the strength of the wafer substrate is reduced due to the thin plate, in order to prevent damage to the thinned wafer substrate, a circuit is placed on the wafer substrate while automatically supporting the support plate on the wafer substrate during the manufacturing process. Etc. are mounted. Then, after the manufacturing process, the wafer substrate and the support plate are separated. So far, various methods for peeling the support from the wafer have been used.

  Patent Document 1 discloses a notch mechanism having a sharp tip inserted into a bonding surface between a substrate to be processed and a support substrate from the side of the superposed substrate, and a substrate to be processed and a support substrate from the side of the superposed substrate. And a fluid supply mechanism for supplying fluid to the joint surfaces of the film.

JP2013-219328A (released on October 24, 2013)

  However, in the method of separating the support from the laminated body by the cutting mechanism while dissolving the adhesive layer with the solvent supplied by the fluid supply mechanism as in the peeling device described in Patent Document 1, it is long to separate the substrate. There is a problem that it takes time.

  Moreover, in the peeling apparatus described in Patent Document 1, the support may be damaged when the support is separated from the laminate by the cutting mechanism.

  This invention is made | formed in view of said subject, The objective can be isolate | separated successfully in a short time, without damaging a board | substrate and a support body, when isolate | separating a support body from a laminated body. An object of the present invention is to provide a support separating apparatus and related technology.

  In order to solve the above problems, a support separating apparatus according to the present invention separates the support from a laminate formed by attaching a substrate and a support that supports the substrate via an adhesive layer. A support separating apparatus, comprising: a mounting table for fixing the laminate from the substrate side; a holding unit for holding the support; and a lifting unit for moving the holding unit up and down with respect to the mounting table. The holding portion grips the outer peripheral end portion of the support body to form a gap between the substrate and the support body, and a surface on which the gap is formed in the support body. An adsorbing portion that maintains the gap by adsorbing and holding the support from the back surface of the substrate, and the gripping portion is directed from the gap maintained by the adsorbing portion toward the inside of the laminate. Equipped with a jet part that jets fluid It is characterized in that there.

  Further, the support separating method according to the present invention is a support separating method for separating the support from a laminate formed by attaching a substrate and a support supporting the substrate via an adhesive layer. A step of forming a gap between the substrate and the support by fixing the substrate and holding the outer peripheral end of the support by at least one holding portion; and the gap is formed. By holding and lifting the support from the back side of the surface, a gap maintaining step for maintaining the gap, and after the gap maintaining step, the gripping portion is provided from the gap toward the inside of the laminate. And a separation step of separating the support from the laminate by ejecting fluid from the ejecting part.

  According to the present invention, it is possible to provide a support separating apparatus and related technology that can be successfully separated in a short time without damaging the substrate and the support when separating the support from the laminate. There is an effect.

It is a figure explaining the schematic structure of the support body separation apparatus which concerns on one Embodiment of this invention. It is a top view which shows the state after light irradiation regarding the separation layer of the laminated body which has a support body isolate | separated by the support body separation apparatus shown in FIG. It is a figure which shows the structure of the gas ejection part arrange | positioned adjacent to the clamp which the support body isolation | separation layer shown in FIG. 1 hold | grips the support body, and a clamp. It is a figure which shows the structure of the gas ejection part comprised in the support body separation layer shown in FIG. It is a figure explaining the support body separation operation | movement of the support body separation layer shown in FIG. It is a figure which shows the state which ejected the gas from the gas ejection part in the support body isolation | separation operation | movement of the support body separation layer shown in FIG. It is a figure explaining another form of the present invention. It is a figure explaining another form of the present invention.

Embodiment 1
An embodiment of the support separating apparatus and the support separating method according to the present invention will be described below.

<1. Configuration of Support Separator>
FIG. 1 is a diagram showing a configuration of a main part of the support separating apparatus according to the first embodiment, FIG. 1 (a) is a partial top view, and FIG. 1 (b) is an A in FIG. 1 (a). It is a cross section taken along line -A ′. FIGS. 1A and 1B also show an XYZ coordinate system in which the XY plane is a horizontal plane.

  As in the case of the prior art, the support separating apparatus 10 according to the first exemplary embodiment is configured such that a wafer substrate on which a structure such as a circuit is mounted constitutes a laminate together with the support plate. It is an apparatus used for peeling. However, the present invention is not limited to a laminated body in which wafer substrates are laminated, and can be used to peel off the plate for any type of laminated body in which a plate is laminated on the outermost layer. Hereinafter, the wafer substrate is simply referred to as a substrate.

  Here, although details will be described later, as shown in FIG. 1B, the laminated body 100 from which the support plate is separated by the support separating apparatus 10 according to the first embodiment includes a substrate 1 and a light-transmissive support. A plate 2 (support) is attached via an adhesive layer 3, and a separation layer 4 that is altered by irradiation with light is provided between the adhesive layer 3 and the support plate 2. Laminated body. In FIG. 1B, the laminate 100 is attached to a dicing tape 5 provided with a dicing frame 6 on the substrate 1 side.

  As shown in FIG. 1 (b), the support separating apparatus 10 according to the first embodiment for the laminated body 100 includes a stage 50 (mounting table), a light irradiation unit 40, an elevating unit 30, and the like. The holding part 20 is provided.

(1.1) Stage 50
The stage 50 is a table on which the stacked body 100 is placed. A porous portion 51 that is a porous portion is provided on the upper surface of the stage 50, and a decompression portion (not shown) communicates with the porous portion 51. Thereby, the laminated body 100 placed on the stage 50 is attracted and fixed by the porous portion 51 on the plane on the substrate 1 side.

(1.2) Light irradiation unit 40
The light irradiation unit 40 irradiates the separation layer 4 in the stacked body 100 with light through the light transmissive support plate 2.

  Specifically, the light irradiation unit 40 scans the top of the laminate 100, and the peripheral portion (region) of the separation layer 4 configured in the laminate 100 having a circular shape when viewed from above via the support plate 2. 4a) is irradiated with light to alter the part.

  Here, FIG. 2 is a diagram showing a separation layer 4 that is circular in a top view and a region 4 a that has been altered by light irradiation by the light irradiation unit 40. As shown in FIG. 2, the width W1 of the region 4a is preferably in the range of 0.5 mm or more and 8 mm or less from the outer peripheral end of the separation layer 4 to the inside, and is 1.5 mm or more and 8 mm or less. It is more preferable to be within the range. If the width W1 is 6 mm or more, a gap is formed between the substrate 1 laminated on the separation layer 4 in the region 4a and the support plate 2, and fluid is ejected from the gap toward the inside of the laminated body 100. By doing so, the support plate 2 can be separated from the laminated body 100 successfully. Further, if the width W1 is 2 mm or less, the area of the region 4a irradiated with light in the separation layer 4 can be reduced, so that the area of the substrate 1 irradiated with light can be reduced.

  In the present specification, the “deterioration” of the separation layer means a phenomenon in which the separation layer can be broken by receiving a slight external force, or a state in which the adhesive force with the layer in contact with the separation layer is reduced. To do. As a result of the alteration of the separation layer caused by absorbing light, the separation layer loses its strength or adhesion prior to light irradiation. In other words, the separation layer becomes brittle by absorbing light. The alteration of the separation layer may mean that the separation layer causes decomposition due to absorbed light energy, a change in configuration, dissociation of a functional group, or the like. The alteration of the separating layer occurs as a result of absorbing light.

  Therefore, for example, it is possible to easily separate the support plate and the substrate by changing the quality so that the separation layer is broken only by lifting the support plate. More specifically, for example, one of the substrate and the support plate in the stacked body is fixed to the mounting table by a support separating device or the like, and the other is held and lifted by a suction pad (holding means) provided with suction means. Thus, the support plate and the substrate are separated, or a force is applied by gripping the chamfered portion of the peripheral edge portion of the support plate with the separation plate having a clamp (claw portion) or the like. Can be separated. Further, for example, the support plate may be peeled from the substrate in the laminated body by a support separating apparatus provided with a peeling means for supplying a peeling liquid for peeling the adhesive. The peeling means supplies the peeling liquid to at least a part of the peripheral end portion of the adhesive layer in the laminate, and dissolves the adhesive layer in the laminate, so that the force concentrates on the separation layer from where the adhesive layer is dissolved. In this way, a force can be applied to the substrate and the support plate. For this reason, a board | substrate and a support plate can be isolate | separated suitably.

The force applied to the laminate may be appropriately adjusted depending on the size of the laminate, and is not limited. For example, if the laminate has an area of about 40000-70000 mm ² , By applying a force of about 5 kgf, the substrate and the support plate can be suitably separated.

  When the region 4 a of the separation layer 4 is altered by the light irradiation of the light irradiation unit 40, the chamfered part 2 a (FIG. 3B) at the edge of the peripheral portion of the support plate 2 is held by the clamp 23, thereby And a region 4a can be formed with a gap. More preferably, a gap is formed between the chamfered portion 2a and the region 4a by gripping and lifting the chamfered portion 2a (FIG. 3B) with the clamp 23. Although details will be described later, the substrate 1 and the support plate 2 can be separated by using this gap as a trigger.

The light irradiated to the separation layer 4 by the light irradiation unit 40 may be appropriately selected according to the wavelength absorbed by the separation layer 4. Examples of lasers that emit light to irradiate the separation layer 4 include YAG lasers, ruby lasers, glass lasers, YVO ₄ lasers, solid state lasers such as LD lasers, fiber lasers, liquid lasers such as dye lasers, CO ₂ lasers, Examples thereof include a gas laser such as an excimer laser, an Ar laser, and a He—Ne laser, a laser beam such as a semiconductor laser and a free electron laser, or a non-laser beam. The laser that emits light to irradiate the separation layer 4 can be appropriately selected according to the material constituting the separation layer 4, and irradiates light having a wavelength that can alter the material constituting the separation layer 4. The laser to be selected may be selected.

  Here, in the substrate 1, a region disposed so as to face the separation layer 4 in the region 4 a is set as a non-circuit formation region where a structure such as an integrated circuit is not formed. In the substrate 1, a structure such as an integrated circuit is formed in a region other than the region disposed so as to face the region 4 a (circuit formation region). Therefore, by altering only the separation layer 4 in the region 4a, it is possible to avoid irradiating light to a region other than the region disposed so as to face the region 4a, that is, the circuit forming region in the substrate 1. . Therefore, while the separation layer 4 in the region 4a is altered, light is irradiated from the light irradiation unit 40 to the circuit formation region in the substrate 1, and the circuit formation region in the substrate 1 is prevented from being damaged by the light. Can do.

(1.3) Lifting unit 30
As shown in FIG. 1B, the elevating part 30 is connected and fixed to the center part on the upper surface side of the plate part 21 whose shape in the top view of the holding part 20 is circular, as shown in FIGS. The holding part 20 is moved up and down along the Z axis shown in 1 (b).

In the first embodiment, the elevating part 30 is connected and fixed to the plate part 21, but the present invention is not limited to this aspect. For example, the elevating part 30 is provided with a floating joint and a stopper. May be. For example, the floating joint may be disposed at the center portion on the upper surface side of the plate portion 21 whose shape in the top view of the holding portion 20 is circular. In this case, the plate part 21 can be rotated by being connected to the elevating part 30 via the floating joint, and the surface of the plate part 21 on which the suction pad 22 is provided is fixed to the stage 50. It moves so that it may incline with respect to the plane of the laminated body 100. The stopper is provided as a locking means that prevents the plate portion 21 from tilting more than necessary. If the plate portion 21 is inclined more than necessary, the stopper comes into contact with the upper surface portion of the plate portion 21 and the plate portion 21 is not inclined further.
The inclination of the plate portion 21 can be adjusted by the floating joint and the stopper, and the support plate 2 can be arranged to be sucked and held by the suction pad 22.

(1.4) Holding unit 20
The holding unit 20 includes a plate unit 21, a suction pad 22 (suction unit), a clamp 23 (gripping unit), a gas ejection unit 24 (ejection unit), a slide drive unit 25 (drive unit), and a level block 26. (Contact part).

(1.4.1) Plate portion 21
The plate part 21 is connected to the elevating part 30. The plate portion 21 is a generally circular structure in a top view disposed so as to face the stage 50. For convenience of explanation, the center point C of the plate portion 21 is shown in FIG.

(1.4.2) Suction pad 22
The suction pad 22 is disposed on the surface of the plate portion 21 facing the stage 50. More specifically, as shown in FIG. 1A, the suction pad 22 has two locations facing each other across the center point C of the plate portion 21 having a circular shape when viewed from above, and an imaginary line connecting them. Are provided on the inner side (near the center point C) of the outer peripheral end portion of the plate portion 21 in a total of four locations facing each other across the center point C along a line perpendicular to the center point C. ing.

  The suction pad 22 is just in contact with the region on the opposite side of the region 4a of the surface of the stacked body 100 placed on the stage 50 on the support plate 2 side (may be described as the upper surface of the stacked body 100). Can do.

  The suction pad 22 can be held by vacuum suction of the support plate 2, and examples thereof include a bellows pad. If the suction pad 22 is vacuum-sucked in a state where it is in contact with the support plate 2 at the above-described position, for example, if the suction pad 22 moves in the direction away from the stage 50 along the Z axis by the elevating unit 30, the support plate 2 can be lifted.

(1.4.3) Clamp 23
The clamp 23 is connected to the plate portion 21 via the slide drive unit 25 in the vicinity of each suction pad 22 and can hold (hold) the stacked body 100 placed on the stage 50. ing.

  More specifically, as shown in FIG. 1A, the clamp 23 includes two locations facing each other across the center point C of the plate portion 21 having a circular shape when viewed from above, and a virtual connecting the two locations. At a total of four locations facing each other across the center point C along a line perpendicular to the center point C with respect to the line, outside the outer peripheral end of the plate portion 21 (on the side away from the center point C) Each is provided.

  Here, FIG. 1A shows a line along the X-axis direction corresponding to the above-mentioned virtual line and a line along the Y-axis direction. The one clamp 23 is located on the same line. The four clamps 23 are arranged at equal intervals along the outer periphery of the plate portion 21, so that the laminate 100 is held when holding (holding) the laminate 100 placed on the stage 50. Power can be applied evenly. This contributes to separating the support plate 2 without damaging it, especially when the support plate 2 of the laminate 100 is a thin glass layer (for example, about 0.4 mm).

  The clamps 23 are on both sides of the plate portion 21 in the cross-sectional view shown in FIG. Each clamp 23 has an upper end connected to a slide drive unit 25 provided on the upper surface of the plate portion 21, and a lower end portion is positioned below the lower surface (surface on which the suction pad 22 is provided) of the plate portion 21. ing. The slide drive unit 25 is provided with a mechanism for adjusting the height of each clamp 23, and the position of each clamp 23 can be adjusted along the Z-axis direction. As shown in FIG. 1B, the lower end of the clamp 23 is positioned in the vicinity of the outer peripheral region of the laminate 100 when the holding portion 20 is lowered in a state where the laminate 100 on the stage 50 is placed. become. In FIG. 1B, for convenience of explanation, the light irradiation unit 40 is positioned between the stacked body 100 on the stage 50 and the holding unit 20, but the holding unit 20 holds the stacked body 100. When performing, the light irradiation part 40 exists in the position remove | deviated from this position.

  What is necessary is just to select the material for forming the clamp 23 suitably according to the material of the support plate 2 which should be hold | gripped. Therefore, as a material for forming the clamp 23, metals such as stainless steel and aluminum, engineering plastics, and the like can be used. Further, when the material of the support plate 2 is glass, it is more preferable to use an aromatic polyether ketone, which is an engineering plastic. Among the aromatic polyether ketones, a polyether ether ketone having an aromatic group (PEEK), polyether ketone ketone (PEKK) having an aromatic group and polyether ether ketone ketone (PEEKK) having an aromatic group are preferred, and PEEK is most preferred. Thereby, when the outer periphery edge part of the support plate 2 which consists of glass is hold | gripped with the clamp 23, the said support plate 2 can be prevented from being damaged.

  Hereinafter, the clamp 23 will be described in detail with reference to FIG. FIG. 3A to FIG. 3C are enlarged cross-sectional views of a portion with a dashed circle in FIG. 1B. 3A is a cross-sectional view of the clamp 23, and FIG. 3B illustrates a state in which the inclined surface 23b of the clamp 23 is in contact with the chamfered portion 2a of the support plate 2 in the stacked body 100. 3C is a cross-sectional view taken along the line BB ′ in FIG. 3B, and the inclined surface 23b locks and captures the outer peripheral end of the support plate 2 in the laminate 100. It is a figure which shows the state before performing.

  As shown to Fig.3 (a), the clamp 23 has the opposing surface 23a and the inclined surface 23b (locking surface).

  The facing surface 23 a faces the outer peripheral end of the support plate 2. Here, the facing surface 23 a is a surface perpendicular to the flat surface portion of the support plate 2 in the stacked body 100 fixed to the stage 50, and has an arc having the same size as the arc of the outer peripheral end portion of the support plate 2. Or a surface that is curved to draw an arc larger than the size of the arc of the outer peripheral end.

  The inclined surface 23 b is a surface that is provided at the lower end portion of the clamp 23 along the lower end side (bottom side) of the facing surface 23 a and is configured to face the center point C of the plate portion 21. That is, the inclined surface 23b is inclined with respect to the YZ plane. In other words, the inclined surfaces 23b of the clamps 23 located on both sides of the plate portion 21 in FIG. 1B are inclined in a direction in which the distance between them becomes closer toward the lower side. Thereby, the inclined surface 23b can contact | abut to the chamfering site | part 2a located in the back surface side of the surface which opposes the plate part 21 in the outer peripheral edge part of the support plate 2, and can latch the chamfering site | part 2a.

  More specifically, the inclined surface 23b has an inclination within a range of 30 ° or more and less than 90 ° with respect to the XZ plane. Thereby, it is possible to prevent an excessive force from being applied to the chamfered portion 2a of the support plate 2 from the inclined surface 23b. Further, in a state where the upper surface of the support plate 2 is in contact with the lower surface of the level block 26 disposed under the plate portion 21, the inclination of the inclined surface 23 b is parallel to the inclination of the chamfered portion 2 a of the support plate 2. It is most preferable to be provided so that excessive force is not concentrated on the end portion of the chamfered portion 2a at the time of contact.

  Further, the inclined surface 23 b is provided along the lower end side of the facing surfaces 23 a of the plurality of clamps 23. The plurality of clamps 23 surround the outer peripheral end of the support plate 2 in a state where the lower surface of the level block 26 disposed below the plate portion 21 is in contact with the upper surface of the support plate 2, and The inclined surfaces 23b provided respectively are brought close to the outer peripheral end portion of the support plate 2 at the same speed by the slide drive unit 25 at the same time. Therefore, the outer peripheral end of the support plate 2 is guided by the inclined surface 23b while guiding the stacked body 100 so that the center point of the support plate 2 in the stacked body 100 and the center point C of the plate portion 21 overlap. Can be locked and gripped. Accordingly, the support separating apparatus 10 grips the outer peripheral end portion of the support plate 2 in a state close to a substantially point contact by the inclined surfaces 23b of the plurality of clamps 23 arranged at equal intervals so as to surround the plate portion 21. Can do. For this reason, the force for gripping the support plate 2 can be applied uniformly from the inclined surfaces 23b of the plurality of clamps 23, and when the plate portion 21 is lifted, the plates 21 abut against the inclined surfaces 23b of the plurality of clamps 23. It is possible to suitably prevent the outer peripheral end portion of the support plate 2 from being detached from the inclined surface 23b.

  Here, each clamp 23 is provided with two inclined surfaces 23b, which are arranged side by side along the facing surface 23a as shown in FIG. 3 (c). Each of the inclined surfaces 23b arranged side by side can have a width L of about 5 to 10 mm. In addition, the edge which adjoins the support plate 2 in each inclined surface 23b has drawn the arc in parallel with the opposing surface 23a.

  The inclined surface 23b and the inclined surface 23b arranged side by side are separated from each other, and the separated portion is configured as a gas ejection port 27 (opening portion) ejected from the gas ejection portion 24. . Specifically, a groove extending from the inner side (plate part 21 side) to the opposite side is formed in the lower end part (bottom part) of the clamp 23, and the end of the groove part on the plate part 21 side is formed in the groove. This corresponds to the above-described separated portion. On the opposite end of the groove, that is, on the opposite side to the inner side (plate part 21 side) of the clamp 23, a gas ejection part 24 is disposed, and the nozzle end communicates to supply gas to the groove. ing.

  Thus, by providing the ejection port 27 between the inclined surface 23b and the inclined surface 23b in each clamp 23, the gas ejected from the ejection port 27 is lifted by the contact of the inclined surface 23b with the chamfered portion 2a. It is possible to effectively spray the lower surface of the outer peripheral end portion of the support plate 2. In addition, the two inclined surfaces 23b provided in each clamp 23 can also be regarded as one inclined surface. In this case, it can be said that the ejection port 27 is provided in the one locking surface. it can.

(1.4.4) Gas ejection part 24
The gas ejection part 24 is configured integrally with each clamp 23. Specifically, as shown in FIG. 1A, the center point C with respect to two locations facing each other across the center point C of the plate portion 21 having a circular shape when viewed from above and a virtual line connecting them. Are provided on the outer side (the side away from the center point C) from the clamp 23 at a total of four locations that are opposed to each other with the center point C interposed therebetween. That is, with respect to a line along the X-axis direction corresponding to the imaginary line illustrated in FIG. 1A and a line along the Y-axis direction, one suction pad 22 and one clamp are provided at the same location. 23 and one gas ejection part 24 are arranged in this order along the direction away from the center point C on the same line.

  The gas ejection part 24 is constituted by a gas ejection nozzle, one end part is disposed at the lower end part of the clamp 23, and the other end part is connected to a gas supply device (not shown).

  In the gas ejection part 24, the ejection direction of the gas to be ejected is directed obliquely downward. Specifically, as shown in FIG. 4, the ejection direction of the gas to be ejected has an inclination angle (T ° in FIG. 4) of 0 to 45 ° with respect to the planar portion (XY plane) of the separation layer 4. A gas ejection nozzle is disposed on the surface. The gas ejected with this inclination angle is blown onto the plane of the separation layer 4 on the support plate 2 side in a gap formed by the outer peripheral end of the support plate 2 being held by the inclined surface 23b. This facilitates separation of the support plate 2 from the separation layer 4.

  The gas ejection portions 24 arranged at equal intervals along the outer peripheral end portion of the plate portion 21 can independently control ejection. That is, it is possible to eject gas from only a specific gas ejection part 24 without ejecting gas from a certain gas ejection part 24. Note that the amount of gas blown onto the plane of the separation layer 4 on the support plate 2 side is 0.3 to 0.5 MPa, and can be 100 to 300 L / min.

  The gas ejected from the gas ejection part 24 may be any kind of gas that does not affect the support plate 2 and the separation layer 4 and does not interfere with the separation of the support plate 2. For example, air, dry air, nitrogen, and Mention may be made of at least one selected from the group consisting of argon.

  As shown in FIG. 3B, the lower end of the inclined surface 23 b and the lower end of the gas ejection part 24 are arranged on the same plane as the surface of the support plate 2 facing the substrate 1. Thereby, it can prevent that the lower end of the inclined surface 23b and the gas ejection part 24 is caught by the board | substrate 1, the contact bonding layer 3, etc. FIG. Therefore, the inclined surface 23 b can be brought into contact with only the support plate 2, and the support plate 2 can be successfully held by the clamp 23.

  In addition, although not shown in figure, the gas ejection part 24 may be a mechanism which moves so that it can move up and down along the Z-axis direction together with the clamp 23 as described above. Thereby, the position which ejects gas toward the inside of the laminated body 100 from the gas ejection part 24 can be adjusted suitably.

(1.4.5) Slide drive unit 25
The slide drive unit 25 is disposed in the vicinity of each clamp 23 on the upper surface of the plate unit 21. Each of the slide drive units 25 slides the clamp 23 located in the vicinity so as to approach or separate from the outer peripheral end of the plate unit 21 along the XY plane direction (FIG. 3B and FIG. 3). (C)). In addition, the slide drive unit 25 slides each of the clamps 23 toward the outer peripheral end of the support plate 2 at the same speed at the same time. Accordingly, the outer peripheral end portion of the support plate 2 can be gripped while being surrounded by the clamp 23.

  As the slide drive unit 25, a slide mechanism using an air cylinder can be employed. The slide drive unit 25 is provided with a regulator (not shown), and the regulator can change the holding force of the support plate 2 by the clamp 23 by adjusting the drive pressure of the air cylinder.

  Further, as described above, the slide drive unit 25 has a mechanism for moving the clamp 23 and the gas ejection unit 24 so as to be movable up and down along the Z-axis direction.

(1.4.6) Level block 26
The level block 26 is disposed on the inner side (near the center point C) of each suction pad 22 on the lower surface (the surface facing the stage 50) of the plate portion 21, and has a structure protruding downward. As will be described later, the projecting end (lower end) of the level block 26 is provided with an abutting surface 26a that abuts against the upper surface (planar portion) of the support plate 2 so that the suction pad is separated when the support plate 2 is separated. It is possible to prevent the support plate 2 adsorbed by the 22 from being undesirably distorted. Therefore, the length (protrusion length) of the level block 26 in the Z direction is configured to be slightly shorter than the length of the suction pad 22 in the Z direction. The height difference between the protruding end (lower end) of the level block 26 and the lower end of the clamp 23 is designed to be constant in advance according to the thickness of the support plate 2 to be separated. Since the height adjusting mechanism is provided, the height can be adjusted.

  The material for forming the level block 26 may be appropriately selected according to the material of the support plate 2 that is in contact with it. For example, a resin (engineering plastic or the like) can be used. The level block 26 is more preferably formed by using an aromatic polyether ketone, which is an engineering plastic. Among the aromatic polyether ketones, the polyether ether ketone (PEEK) having an aromatic group and an aromatic group are included. Polyether ketone ketone (PEKK) having an aromatic group and polyether ether ketone ketone (PEEKK) having an aromatic group are preferred, and PEEK is most preferred. Thereby, for example, when the upper surface of the support plate 2 made of glass comes into contact, the support plate 2 can be prevented from being damaged. Moreover, the level block 26 can be reduced in weight, and the load concerning the raising / lowering part 30 can be reduced.

(1.5) Other configurations The support separating apparatus 10 according to the first embodiment includes configurations in addition to the configurations described above. For example, a position sensor (not shown) that detects each position of the clamp 23 that the slide drive unit 25 moves is provided.

  The position sensor is configured by a magnetic sensor, and includes a magnet fixed to the clamp 23 and two sensor heads that detect displacement of the magnet that moves as the clamp 23 slides. For example, the two sensor heads scale the distance between the two sensor heads with a value of 0 to 100, for example, with respect to each position. For example, if the distance between the two sensor heads is set to about several mm, the position of the clamp 23 can be determined on the order of μm. Based on this scaling value, the two sensor heads determine the position of the magnet. Thereby, the position of the clamp 23 which moves the same distance simultaneously with the magnet can be accurately determined. More specifically, according to the range of the scaling value, whether the clamp 23 is disposed at a position before gripping the outer peripheral end of the support plate 2, or whether the clamp 23 grips the outer peripheral end of the support plate 2, Alternatively, it is determined whether the clamp 23 fails to grip the outer peripheral end of the support plate 2. For example, when showing a value larger than 60, which is a scaled value in the range of 0 to 100, the clamp 23 is disposed at a position before gripping the outer peripheral end of the support plate 2 and is a value greater than 10 and less than or equal to 60. When the clamp 23 is disposed at a position where the outer peripheral end portion of the support plate 2 can be gripped, and the value of 0 or more and 10 or less, the clamp 23 grips the outer peripheral end portion of the support plate 2. It can be determined that it is arranged inside the position where the

  In addition, the support body separating apparatus 10 according to the first embodiment includes a control unit that controls the gas ejection of the gas ejection unit 24 and controls the elevating unit 30 and the slide driving unit 25.

  In the first embodiment, the number of the clamps 23 and the gas ejection portions 24 is four along the outer periphery of the plate portion 21. However, the present invention is not limited to this number of arrangements. It is only necessary that the support plate 2 of the laminated body 100 can be gripped and lifted, and the clamp 23 may be provided at only one place on the outer periphery of the plate portion 21. In addition, when arrange | positioned in several places, it is preferable that they are arrange | positioned along the outer periphery of the plate part 21 at equal intervals.

  In the first embodiment, each of the clamps is provided with the two inclined surfaces 23b. However, the outer peripheral portion of the support plate 2 can be lifted even when only one inclined surface 23b is provided. It is.

<2. Support Separation Method>
A method for separating the support plate 2 from the laminated body 100 by the support separating apparatus 10 having the above configuration (support separating method) will be described.

  The support separating method according to the first embodiment forms a gap between the substrate 1 and the support plate 2 by fixing the substrate and gripping and lifting the outer peripheral end portion of the support plate 2 with at least one gripping portion. The gap forming step, the gap maintaining step for maintaining the gap 7 by lifting and holding the support plate 2 from the back surface of the surface on which the gap 7 is formed, and the gap 100 after the gap maintaining step. A separation step of separating the support plate 2 from the laminate 100 by ejecting gas from the gas ejection part 24 provided in the clamp 23 toward the inside.

  FIG. 5A to FIG. 5E are diagrams illustrating the support separating method according to the first embodiment. 5A to 5E are cross-sectional views seen from the same direction as FIG. 1B. In addition, illustration of the raising / lowering part 30 is abbreviate | omitted in Fig.5 (a)-FIG.5 (e).

  In FIG. 5A, a laminated body 100 in which the outer peripheral end portion of the separation layer 4 is altered by the light irradiation portion 40 shown in FIG. Shows the state of being attracted to the stage 50. In this state, the position of the holding portion 20 is adjusted so that the clamp 23 and the gas ejection portion 24 are located outside the outer peripheral end portion of the stacked body 100. In this state, the level block 26 is also in contact with the upper surface of the support plate 2, and the suction pad 22 holds the upper surface of the support plate 2 by suction.

  Next, as shown in FIG. 5B, the clamp 23 and the gas ejection part 24 are slid by the slide driving part 25 and approach the laminated body 100, and the inclined surface 23 b of the clamp 23 is the outer periphery of the support plate 2. It contacts the lower side (region 4a side) of the chamfered portion 2a at the end.

  Then, when the clamp 23 and the gas ejection portion 24 are further slid from the state of FIG. 5B, the chamfered portion 2a of the support plate 2 is moved from the region 4a by the inclined surface 23b as shown in FIG. 5C. Lifts away. In this state, a gap 7 is formed between a region (including the chamfered portion 2a) of the support plate 2 facing the region 4a and the region 4a (gap forming step). In addition, in the state shown in FIG.5 (c), the clamp 23 may form the clearance gap 7 not only by sliding but also raising a little.

  Subsequently, as illustrated in FIG. 5D, the clamp 23 and the gas ejection unit 24 are driven to slide away from the stacked body 100 by being driven by the slide driving unit 25. In this state, even if the inclined surface 23b of the clamp 23 and the chamfered portion 2a of the support plate 2 are separated from each other, the chamfered portion 2a of the support plate 2 is maintained in the raised state because the suction pad 22 continues to be sucked. And the gap 7 is maintained (gap maintaining step).

  Then, as shown in FIG.5 (e), the plate part 21 raises and the position of the suction pad 22, the clamp 23, and the gas ejection part 24 rises. Thereby, the outer peripheral edge part of the support plate 2 to which the suction pad 22 is sucked is further lifted. When adjusted to this position, gas is ejected from the gas ejection part 24 (separation process). As described above, the gas ejected from the gas ejection portion 24 (ejection port 27) is ejected obliquely downward. Thereby, gas is jetted in the vicinity of the region of the support plate 2 that has been in contact with the separation layer 4 before the gas is jetted, and the support plate 2 can be separated from the separation layer 4 to be separated. If it can separate, the adsorption | suction to the stage 50 of the laminated body 100 by the porous part 51 will be stopped, and a series of support body separation methods will be complete | finished.

  FIG. 6 is a diagram illustrating a state in which gas is ejected from the gas ejection part 24 in a top view of the stacked body 100. For convenience of explanation, the configuration of the plate portion 21 and the like is not shown.

  In FIG. 6, a state is shown in which the gap 7 is spread toward the inside of the laminated body 100 by gas being ejected from each of the gas ejection portions 24 provided at four locations. As shown in FIG. 6, the gaps 7 spread at four locations along the outer peripheral edge of the laminated body 100, so that the support plate 2 is excessively separated compared to the case where the support plate 2 is separated only by the suction pad 22. The support plate 2 can be separated from the separation layer 4 without the stress of. This is very advantageous because when the support plate 2 is thin and structurally brittle, it can be successfully separated in a short time without damaging the support plate 2.

  The above-described series of operations is realized by the elevating unit 30, the slide driving unit 25, and the gas ejection unit 24 being controlled by a control unit (not shown).

  For example, the control unit first controls the elevating unit 30 to lower the suction pad 22 and the clamp 23 to a predetermined height, and turns on the suction of the porous unit 51 of the stage 50. Next, the control unit controls the slide drive unit 25 to slide the clamp 23 inward (the clamp 23 may be further raised) to form a gap. Next, suction by the suction pad 22 is started. Next, by controlling the slide drive unit 25, the clamp 23 is slid outwardly to a position away from the chamfered portion 2 a of the support plate 2. Next, in a state where the suction by the suction pad 22 is continued, the control unit controls the gas ejection unit 24 to start gas ejection, and at substantially the same time, controls the lifting unit 30 to raise the suction pad 22 to a predetermined height. Raise it up.

  Such processing may be performed based on a preset timing chart, or may be controlled while sensing the position by sensing the height of the plate portion 21, the position of the clamp 23, and the position of the suction pad 22. May be. In that case, it is also possible to use the position sensor mentioned above.

<3. Laminate>
The laminated body 100 which isolate | separates the support plate 2 with the support body separation apparatus 10 which concerns on this embodiment shown to (a) of FIG. 1 is demonstrated in detail. The laminated body 100 is formed by laminating a substrate 1, an adhesive layer 3, a separation layer 4 that is altered by absorbing light, and a support plate 2 made of a material that transmits light.

(3.1) Substrate 1
The substrate 1 is attached to a support plate 2 provided with a separation layer 4 via an adhesive layer 3. The substrate 1 can be subjected to processes such as thinning and mounting while being supported by the support plate 2. The substrate 1 is not limited to a silicon wafer substrate, and an arbitrary substrate such as a ceramic substrate, a thin film substrate, or a flexible substrate can be used.

  Note that a structure such as an integrated circuit or a metal bump may be mounted on the surface of the substrate.

(3.2) Support plate 2
The support plate 2 is a support that supports the substrate 1, and is attached to the substrate 1 through the adhesive layer 3. Therefore, the support plate 2 only needs to have a strength necessary for preventing damage or deformation of the substrate 1 during processes such as thinning, transporting, and mounting of the substrate 1. Moreover, what is necessary is just to be able to permeate | transmit the light for changing a separated layer. From the above viewpoint, examples of the support plate 2 include those made of glass, silicon, and acrylic resin.

  Note that the support plate 2 having a thickness of 300 to 1000 μm can be used. According to the support separating method according to the present embodiment, even if the support plate 2 (support) having a small thickness is used in this way, the support plate 2 is preferably prevented from being damaged and is preferably used from the laminate. Can be separated.

(3.3) Adhesive layer 3
The adhesive layer 3 is used for attaching the substrate 1 and the support plate 2.

  For the adhesive for forming the adhesive layer 3, for example, various adhesives known in the art such as acrylic, novolac, naphthoquinone, hydrocarbon, polyimide, elastomer, polysulfone, etc. are used. A polysulfone resin, a hydrocarbon resin, an acrylic-styrene resin, a maleimide resin, an elastomer resin, or a combination thereof can be more preferably used.

  The thickness of the adhesive layer 3 may be appropriately set according to the type of the substrate 1 and the support plate 2 to be attached, the treatment applied to the substrate 1 after being attached, etc., but in the range of 10 to 150 μm. Is preferably within the range of 15 to 100 μm.

  The adhesive layer 3 is used for attaching the substrate 1 and the support plate 2. The adhesive layer 3 can be formed by applying an adhesive by a method such as spin coating, dipping, roller blade, spray coating, slit coating, or the like. In addition, the adhesive layer 3 is formed, for example, by pasting a film (so-called dry film) in which an adhesive is previously applied on both sides to the substrate 1 instead of directly applying the adhesive to the substrate 1. May be.

  The adhesive layer 3 is a layer formed by an adhesive used for attaching the substrate 1 and the support plate 2.

  As the adhesive, various adhesives known in the art such as acrylic, novolak, naphthoquinone, hydrocarbon, polyimide, and elastomer can be used.

  Hereinafter, the composition of the resin contained in the adhesive layer 3 will be described.

  The resin contained in the adhesive layer 3 may be any resin having adhesiveness. For example, a hydrocarbon resin, an acrylic-styrene resin, a maleimide resin, an elastomer resin, a polysulfone resin, or a combination thereof. And the like.

(Hydrocarbon resin)
The hydrocarbon resin is a resin that has a hydrocarbon skeleton and is obtained by polymerizing a monomer composition. As the hydrocarbon resin, cycloolefin polymer (hereinafter sometimes referred to as “resin (A)”), and at least one resin selected from the group consisting of terpene resin, rosin resin and petroleum resin (hereinafter referred to as “resin (A)”). Resin (B) ”), and the like, but is not limited thereto.

  The resin (A) may be a resin obtained by polymerizing a monomer component containing a cycloolefin monomer. Specific examples include a ring-opening (co) polymer of a monomer component containing a cycloolefin monomer, and a resin obtained by addition (co) polymerization of a monomer component containing a cycloolefin monomer.

  Examples of the cycloolefin monomer contained in the monomer component constituting the resin (A) include bicyclic compounds such as norbornene and norbornadiene, tricyclic compounds such as dicyclopentadiene and hydroxydicyclopentadiene, and tetracyclodone. Tetracycles such as decene, pentacycles such as cyclopentadiene trimer, heptacycles such as tetracyclopentadiene, or alkyl (methyl, ethyl, propyl, butyl, etc.) substitutes of these polycycles, alkenyl (vinyl) Etc.) Substitutes, alkylidene (ethylidene, etc.) substitutes, aryl (phenyl, tolyl, naphthyl, etc.) substitutes and the like. Among these, norbornene-based monomers selected from the group consisting of norbornene, tetracyclododecene, and alkyl-substituted products thereof are particularly preferable.

  The monomer component constituting the resin (A) may contain another monomer copolymerizable with the above-described cycloolefin-based monomer, and preferably contains, for example, an alkene monomer. Examples of the alkene monomer include ethylene, propylene, 1-butene, isobutene, 1-hexene, α-olefin and the like. The alkene monomer may be linear or branched.

  Moreover, it is preferable from a viewpoint of high heat resistance (low thermal decomposition and thermal weight reduction property) to contain a cycloolefin monomer as a monomer component which comprises resin (A). The ratio of the cycloolefin monomer to the whole monomer component constituting the resin (A) is preferably 5 mol% or more, more preferably 10 mol% or more, and further preferably 20 mol% or more. preferable. Further, the ratio of the cycloolefin monomer to the whole monomer component constituting the resin (A) is not particularly limited, but is preferably 80 mol% or less from the viewpoint of solubility and stability over time in a solution, More preferably, it is 70 mol% or less.

  Moreover, you may contain a linear or branched alkene monomer as a monomer component which comprises resin (A). The ratio of the alkene monomer to the whole monomer component constituting the resin (A) is preferably 10 to 90 mol%, more preferably 20 to 85 mol% from the viewpoint of solubility and flexibility. 30 to 80 mol% is more preferable.

  The resin (A) is a resin having no polar group, such as a resin obtained by polymerizing a monomer component composed of a cycloolefin monomer and an alkene monomer, at high temperatures. It is preferable for suppressing generation of gas.

  The polymerization method and polymerization conditions for polymerizing the monomer components are not particularly limited, and may be set as appropriate according to conventional methods.

  Examples of commercially available products that can be used as the resin (A) include “TOPAS” manufactured by Polyplastics Co., Ltd., “APEL” manufactured by Mitsui Chemicals, Inc., “ZEONOR” and “ZEONEX” manufactured by Zeon Corporation. And “ARTON” manufactured by JSR Corporation.

  The glass transition temperature (Tg) of the resin (A) is preferably 60 ° C. or higher, and particularly preferably 70 ° C. or higher. When the glass transition temperature of the resin (A) is 60 ° C. or higher, softening of the adhesive layer 3 can be further suppressed when the laminate is exposed to a high temperature environment.

  The resin (B) is at least one resin selected from the group consisting of terpene resins, rosin resins and petroleum resins. Specifically, examples of the terpene resin include terpene resins, terpene phenol resins, modified terpene resins, hydrogenated terpene resins, hydrogenated terpene phenol resins, and the like. Examples of the rosin resin include rosin, rosin ester, hydrogenated rosin, hydrogenated rosin ester, polymerized rosin, polymerized rosin ester, and modified rosin. Examples of petroleum resins include aliphatic or aromatic petroleum resins, hydrogenated petroleum resins, modified petroleum resins, alicyclic petroleum resins, coumarone-indene petroleum resins, and the like. Among these, hydrogenated terpene resins and hydrogenated petroleum resins are more preferable.

  Although the softening point of resin (B) is not specifically limited, It is preferable that it is 80-160 degreeC. When the softening point of the resin (B) is 80 to 160 ° C., the laminate can be prevented from being softened when exposed to a high-temperature environment, and adhesion failure does not occur.

  Although the weight average molecular weight of resin (B) is not specifically limited, It is preferable that it is 300-3,000. When the weight average molecular weight of the resin (B) is 300 or more, the heat resistance is sufficient, and the degassing amount is reduced in a high temperature environment. On the other hand, when the weight average molecular weight of the resin (B) is 3,000 or less, the dissolution rate of the adhesive layer in the hydrocarbon solvent is good. For this reason, the residue of the adhesive layer on the substrate after separating the support can be quickly dissolved and removed. In addition, the weight average molecular weight of resin (B) in this embodiment means the molecular weight of polystyrene conversion measured by gel permeation chromatography (GPC).

  In addition, you may use what mixed resin (A) and resin (B) as resin. By mixing, heat resistance becomes good. For example, the mixing ratio of the resin (A) and the resin (B) is (A) :( B) = 80: 20 to 55:45 (mass ratio), and heat resistance in a high temperature environment, and It is preferable because of its excellent flexibility.

(Acrylic-styrene resin)
Examples of the acrylic-styrene resin include a resin obtained by polymerization using styrene or a styrene derivative and (meth) acrylic acid ester as monomers.

  Examples of the (meth) acrylic acid ester include a (meth) acrylic acid alkyl ester having a chain structure, a (meth) acrylic acid ester having an aliphatic ring, and a (meth) acrylic acid ester having an aromatic ring. . Examples of the (meth) acrylic acid alkyl ester having a chain structure include an acrylic long-chain alkyl ester having an alkyl group having 15 to 20 carbon atoms and an acrylic alkyl ester having an alkyl group having 1 to 14 carbon atoms. . As acrylic long-chain alkyl esters, acrylic or methacrylic acid whose alkyl group is n-pentadecyl group, n-hexadecyl group, n-heptadecyl group, n-octadecyl group, n-nonadecyl group, n-eicosyl group, etc. Examples include alkyl esters. The alkyl group may be branched.

  Examples of the acrylic alkyl ester having an alkyl group having 1 to 14 carbon atoms include known acrylic alkyl esters used in existing acrylic adhesives. For example, an alkyl group of acrylic acid or methacrylic acid in which the alkyl group is a methyl group, ethyl group, propyl group, butyl group, 2-ethylhexyl group, isooctyl group, isononyl group, isodecyl group, dodecyl group, lauryl group, tridecyl group, etc. Examples include esters.

  Examples of (meth) acrylic acid ester having an aliphatic ring include cyclohexyl (meth) acrylate, cyclopentyl (meth) acrylate, 1-adamantyl (meth) acrylate, norbornyl (meth) acrylate, isobornyl (meth) acrylate, and tricyclodecanyl. (Meth) acrylate, tetracyclododecanyl (meth) acrylate, dicyclopentanyl (meth) acrylate and the like can be mentioned, and isobornyl methacrylate and dicyclopentanyl (meth) acrylate are more preferable.

  The (meth) acrylic acid ester having an aromatic ring is not particularly limited. Examples of the aromatic ring include a phenyl group, a benzyl group, a tolyl group, a xylyl group, a biphenyl group, a naphthyl group, and an anthracenyl group. A phenoxymethyl group, a phenoxyethyl group, and the like. The aromatic ring may have a linear or branched alkyl group having 1 to 5 carbon atoms. Specifically, phenoxyethyl acrylate is preferable.

(Maleimide resin)
Examples of maleimide resins include N-methylmaleimide, N-ethylmaleimide, Nn-propylmaleimide, N-isopropylmaleimide, Nn-butylmaleimide, N-isobutylmaleimide, N-sec as monomers. -Butylmaleimide, N-tert-butylmaleimide, Nn-pentylmaleimide, Nn-hexylmaleimide, Nn-heptylmaleimide, Nn-octylmaleimide, N-laurylmaleimide, N-stearylmaleimide, etc. Male having an aliphatic hydrocarbon group such as maleimide having an alkyl group, N-cyclopropylmaleimide, N-cyclobutylmaleimide, N-cyclopentylmaleimide, N-cyclohexylmaleimide, N-cycloheptylmaleimide, N-cyclooctylmaleimide A resin obtained by polymerizing an aromatic maleimide having an aryl group such as N, N-phenylmaleimide, Nm-methylphenylmaleimide, N-o-methylphenylmaleimide, and Np-methylphenylmaleimide. It is done.

（化学式（２）中、ｎは０又は１〜３の整数である。）
このようなシクロオレフィンコポリマーとしては、ＡＰＬ ８００８Ｔ、ＡＰＬ ８００９Ｔ、およびＡＰＬ ６０１３Ｔ（全て三井化学株式会社製）等を使用することができる。 For example, a cycloolefin copolymer which is a copolymer of a repeating unit represented by the following chemical formula (1) and a repeating unit represented by the following chemical formula (2) can be used as the resin of the adhesive component.

(In chemical formula (2), n is 0 or an integer of 1 to 3)
As such cycloolefin copolymer, APL 8008T, APL 8009T, APL 6013T (all manufactured by Mitsui Chemicals, Inc.) and the like can be used.

(Elastomer)
The elastomer preferably contains a styrene unit as a constituent unit of the main chain, and the “styrene unit” may have a substituent. Examples of the substituent include an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, an alkoxyalkyl group having 1 to 5 carbon atoms, an acetoxy group, and a carboxyl group. Further, the content of the styrene unit is more preferably in the range of 14 wt% or more and 50 wt% or less. Furthermore, the elastomer preferably has a weight average molecular weight in the range of 10,000 to 200,000.

  If the content of the styrene unit is in the range of 14% by weight or more and 50% by weight or less, and the weight average molecular weight of the elastomer is in the range of 10,000 or more and 200,000 or less, the hydrocarbon solvent described later Therefore, the adhesive layer can be removed more easily and quickly. Further, since the content of the styrene unit and the weight average molecular weight are within the above ranges, a resist solvent (eg, PGMEA, PGME, etc.), acid (hydrogen fluoride) exposed when the wafer is subjected to a resist lithography process. Acid, etc.) and alkali (TMAH etc.).

  In addition, you may further mix the (meth) acrylic acid ester mentioned above with the elastomer.

  Further, the content of styrene units is more preferably 17% by weight or more, and more preferably 40% by weight or less.

  A more preferable range of the weight average molecular weight is 20,000 or more, and a more preferable range is 150,000 or less.

  As the elastomer, various elastomers can be used as long as the content of styrene units is in the range of 14% by weight to 50% by weight and the weight average molecular weight of the elastomer is in the range of 10,000 to 200,000. Can be used. For example, polystyrene-poly (ethylene / propylene) block copolymer (SEP), styrene-isoprene-styrene block copolymer (SIS), styrene-butadiene-styrene block copolymer (SBS), styrene-butadiene-butylene-styrene block copolymer (SBBS). And hydrogenated products thereof, styrene-ethylene-butylene-styrene block copolymer (SEBS), styrene-ethylene-propylene-styrene block copolymer (styrene-isoprene-styrene block copolymer) (SEPS), styrene-ethylene-ethylene- Propylene-styrene block copolymer (SEEPS), styrene-ethylene-ethylene-propylene-styrene block copolymer in which styrene blocks are reactively crosslinked (Septon V 9461 (manufactured by Kuraray Co., Ltd.), Septon V 9475 (manufactured by Kuraray Co., Ltd.)), Septon V9827 (Co., Ltd., which has a reactive cross-linked styrene-ethylene-butylene-styrene block copolymer (reactive polystyrene hard block) Kuraray)), polystyrene-poly (ethylene-ethylene / propylene) block-polystyrene block copolymer (SEEPS-OH: terminal hydroxyl group modification), and the like. An elastomer having a styrene unit content and a weight average molecular weight within the above ranges can be used.

  Of the elastomers, hydrogenated products are more preferable. If it is a hydrogenated product, the stability to heat is improved, and degradation such as decomposition and polymerization hardly occurs. Moreover, it is more preferable from the viewpoint of solubility in hydrocarbon solvents and resistance to resist solvents.

  Further, among elastomers, those having both ends of a styrene block polymer are more preferable. This is because styrene having high thermal stability is blocked at both ends, thereby exhibiting higher heat resistance.

  More specifically, the elastomer is more preferably a hydrogenated block copolymer of styrene and conjugated diene. Stability against heat is improved, and degradation such as decomposition and polymerization hardly occurs. Moreover, higher heat resistance is exhibited by blocking styrene having high thermal stability at both ends. Furthermore, it is more preferable from the viewpoint of solubility in hydrocarbon solvents and resistance to resist solvents.

  Examples of commercially available products that can be used as an elastomer included in the adhesive constituting the adhesive layer 3 include “Kepte (trade name)” manufactured by Kuraray Co., Ltd., “Hibler (trade name)” manufactured by Kuraray Co., Ltd. “Tuff Tech (trade name)” manufactured by JSR Corporation, “Dynalon (trade name)” manufactured by JSR Corporation, and the like can be mentioned.

  The content of the elastomer contained in the adhesive constituting the adhesive layer 3 is, for example, preferably in the range of 50 parts by weight or more and 99 parts by weight or less, with the total amount of the adhesive composition being 100 parts by weight, and 60 parts by weight or more. The range of 99 parts by weight or less is more preferable, and the range of 70 parts by weight or more and 95 parts by weight or less is most preferable. By setting it within these ranges, the wafer and the support can be suitably bonded together while maintaining the heat resistance.

  A plurality of types of elastomers may be mixed. That is, the adhesive constituting the adhesive layer 3 may include a plurality of types of elastomers. It is sufficient that at least one of the plurality of types of elastomers includes a styrene unit as a constituent unit of the main chain. Further, at least one of the plurality of types of elastomers has a styrene unit content in the range of 14 wt% or more and 50 wt% or less, or a weight average molecular weight of 10,000 or more and 200,000 or less. If it is within the range, it is within the scope of the present invention. Moreover, when the adhesive agent which comprises the contact bonding layer 3 contains several types of elastomers, you may adjust so that content of a styrene unit may become in said range as a result of mixing. For example, Septon 4033 of Septon (trade name) manufactured by Kuraray Co., Ltd. having a styrene unit content of 30% by weight and Septon 2063 of Septon (trade name) having a styrene unit content of 13% by weight is 1 weight ratio. When mixed in a one-to-one relationship, the styrene content with respect to the total elastomer contained in the adhesive is 21 to 22% by weight, and therefore 14% by weight or more. For example, when a styrene unit of 10% by weight and 60% by weight are mixed at a weight ratio of 1: 1, it becomes 35% by weight and falls within the above range. The present invention may be in such a form. Moreover, it is most preferable that the plurality of types of elastomers contained in the adhesive constituting the adhesive layer 3 all contain styrene units within the above range and have a weight average molecular weight within the above range.

  Note that the adhesive layer 3 is preferably formed using a resin other than a photocurable resin (for example, a UV curable resin). By using a resin other than the photocurable resin, it is possible to prevent a residue from remaining around the minute unevenness of the substrate 1 after the adhesive layer 3 is peeled or removed. In particular, the adhesive constituting the adhesive layer 3 is preferably not soluble in any solvent but soluble in a specific solvent. This is because the adhesive layer 3 can be removed by dissolving it in a solvent without applying physical force to the substrate 1. When removing the adhesive layer 3, the adhesive layer 3 can be easily removed without damaging or deforming the substrate 1 even from the substrate 1 whose strength has been reduced.

(Polysulfone resin)
The adhesive for forming the adhesive layer 3 may contain a polysulfone resin. By forming the adhesive layer 3 from a polysulfone-based resin, a laminate capable of dissolving the adhesive layer in a subsequent process and peeling the support plate from the substrate even if the laminate is processed at a high temperature is manufactured. Can do. If the adhesive layer 3 contains a polysulfone resin, the laminate can be suitably used even in a high temperature process in which the laminate is processed at a high temperature of 300 ° C. or higher by annealing or the like.

（ここで、一般式（３）のＲ^１、Ｒ^２およびＲ^３、並びに一般式（４）中のＲ^１およびＲ^２は、それぞれ独立してフェニレン基、ナフチレン基およびアントリレン基からなる群より選択され、Ｘ’は、炭素数が１以上、３以下のアルキレン基である。）
ポリサルホン系樹脂は、式（３）で表されるポリサルホン構成単位および式（４）で表されるポリエーテルサルホン構成単位のうちの少なくとも一つを備えていることによって、基板１とサポートプレート２とを貼り付けた後、高い温度条件において基板１を処理しても、分解および重合等により接着層３が不溶化することを防止することができる積層体を形成することができる。また、ポリサルホン系樹脂は、上記式（３）で表されるポリサルホン構成単位からなるポリサルホン樹脂であれば、より高い温度に加熱しても安定である。このため、洗浄後の基板１に接着層に起因する残渣が発生することを防止することができる。 The polysulfone-based resin has a structure composed of at least one structural unit selected from the structural unit represented by the following general formula (3) and the structural unit represented by the following general formula (4).

(Wherein, ^{R 1} and ^{R 2} of ^R 1, ^{R 2} and ^{R 3,} as well as the general formula (4) of the general formula (3) are each independently a phenylene group, from the group consisting of naphthylene group and an anthrylene group And X ′ is an alkylene group having 1 to 3 carbon atoms.)
The polysulfone-based resin includes at least one of the polysulfone constituent unit represented by the formula (3) and the polyethersulfone constituent unit represented by the formula (4), whereby the substrate 1 and the support plate 2 are provided. Then, even if the substrate 1 is processed under a high temperature condition, a laminate that can prevent the adhesive layer 3 from being insolubilized due to decomposition, polymerization, or the like can be formed. The polysulfone resin is stable even when heated to a higher temperature as long as it is a polysulfone resin composed of a polysulfone structural unit represented by the above formula (3). For this reason, it can prevent that the residue resulting from an contact bonding layer generate | occur | produces in the board | substrate 1 after washing | cleaning.

  The weight average molecular weight (Mw) of the polysulfone-based resin is preferably in the range of 30,000 to 70,000, and more preferably in the range of 30,000 to 50,000. If the weight average molecular weight (Mw) of the polysulfone-based resin is within a range of 30,000 or more, an adhesive composition that can be used at a high temperature of 300 ° C. or more can be obtained. Moreover, if the weight average molecular weight (Mw) of polysulfone-type resin is in the range of 70,000 or less, it can melt | dissolve suitably with a solvent. That is, an adhesive composition that can be suitably removed with a solvent can be obtained.

(Diluted solvent)
Examples of the diluting solvent used when forming the adhesive layer 3 include hexane, heptane, octane, nonane, isononane, methyloctane, decane, undecane, dodecane, tridecane, etc. 15 branched chain hydrocarbons, for example, cyclic hydrocarbons such as cyclohexane, cycloheptane, cyclooctane, naphthalene, decahydronaphthalene, tetrahydronaphthalene, p-menthane, o-menthane, m-menthane, diphenylmenthane, 1, 4-terpine, 1,8-terpine, bornin, norbornane, pinan, tujan, karan, longifolene, geraniol, nerol, linalool, citral, citronellol, menthol, isomenthol, neomenthol, α-terpineol, β-terpineol, γ- Lupineol, terpinen-1-ol, terpinen-4-ol, dihydroterpinyl acetate, 1,4-cineole, 1,8-cineole, borneol, carvone, yonon, thuyon, camphor, d-limonene, l-limonene, Terpene solvents such as dipentene; lactones such as γ-butyrolactone; ketones such as acetone, methyl ethyl ketone, cyclohexanone (CH), methyl-n-pentyl ketone, methyl isopentyl ketone, 2-heptanone; ethylene glycol, diethylene glycol, propylene Polyhydric alcohols such as glycol and dipropylene glycol; ethylene glycol monoacetate, diethylene glycol monoacetate, propylene glycol monoacetate, or dipropylene glycol monoacetate A compound having an ester bond such as a monoalkyl ether such as a monomethyl ether, monoethyl ether, monopropyl ether or monobutyl ether of the polyhydric alcohol or the compound having an ester bond, or an ether bond such as a monophenyl ether. Derivatives of polyhydric alcohols such as compounds (in these, propylene glycol monomethyl ether acetate (PGMEA) and propylene glycol monomethyl ether (PGME) are preferred); cyclic ethers such as dioxane, methyl lactate, ethyl lactate (EL), esters such as methyl acetate, ethyl acetate, butyl acetate, methoxybutyl acetate, methyl pyruvate, ethyl pyruvate, methyl methoxypropionate, ethyl ethoxypropionate; Include ethyl benzyl ether, cresyl methyl ether, diphenyl ether, dibenzyl ether, phenetole, the aromatic organic solvent such as butyl phenyl ether.

(Other ingredients)
The adhesive constituting the adhesive layer 3 may further contain other miscible materials as long as the essential properties are not impaired. For example, various conventional additives such as additional resins, plasticizers, adhesion aids, stabilizers, colorants, thermal polymerization inhibitors and surfactants for improving the performance of the adhesive may be further used. it can.

(3.4) Separation layer 4
Next, the separation layer 4 is a layer formed of a material that is altered by absorbing light irradiated through the support plate 2. Further, as shown in FIG. 5E, when the fluid is ejected from the gap provided between the substrate 1 and the support plate 2 toward the inside of the laminate 100, the separation layer 4 in a region other than the region 4a. Will also be destroyed.

  For example, the thickness of the separation layer 4 is more preferably in the range of 0.05 μm or more and 50 μm or less, and further preferably in the range of 0.3 μm or more and 1 μm or less. If the thickness of the separation layer 4 is in the range of 0.05 μm or more and 50 μm or less, desired alteration can be caused in the separation layer 4 by irradiation with light for a short time and irradiation with low energy light. . The thickness of the separation layer 4 is particularly preferably within a range of 1 μm or less from the viewpoint of productivity.

  In the laminate 100, another layer may be further formed between the separation layer 4 and the support plate 2. In this case, the other layer should just be comprised from the material which permeate | transmits light. Accordingly, a layer imparting preferable properties and the like to the stacked body 100 can be appropriately added without hindering the incidence of light on the separation layer 4. The wavelength of light that can be used differs depending on the type of material constituting the separation layer 4. Therefore, the material constituting the other layer does not need to transmit all light, and can be appropriately selected from materials capable of transmitting light having a wavelength that can alter the material constituting the separation layer 4.

  The separation layer 4 is preferably formed only from a material having a structure that absorbs light, but the material does not have a structure that absorbs light as long as the essential characteristics of the present invention are not impaired. May be added to form the separation layer 4. In addition, it is preferable that the surface of the separation layer 4 facing the adhesive layer 3 is flat (no irregularities are formed), so that the separation layer 4 can be easily formed and even when pasted. It becomes possible to paste on.

(Fluorocarbon)
The separation layer 4 may be made of a fluorocarbon. Since the separation layer 4 is composed of fluorocarbon, the separation layer 4 is altered by absorbing light. As a result, the separation layer 4 loses strength or adhesiveness before being irradiated with light. Therefore, by applying a slight external force (for example, lifting the support plate 2 or the like), the separation layer 4 is broken, and the support plate 2 and the substrate 1 can be easily separated. The fluorocarbon constituting the separation layer 4 can be suitably formed by a plasma CVD (chemical vapor deposition) method.

  The fluorocarbon absorbs light having a wavelength in a specific range depending on the type. By irradiating the separation layer with light having a wavelength in a range that is absorbed by the fluorocarbon used in the separation layer 4, the fluorocarbon can be suitably altered. The light absorption rate in the separation layer 4 is preferably 80% or more.

The light applied to the separation layer 4 is a liquid such as a solid-state laser such as a YAG laser, a ruby laser, a glass laser, a YVO ₄ laser, an LD laser, or a fiber laser, or a dye laser, depending on the wavelength that can be absorbed by the fluorocarbon. A gas laser such as a laser, a CO ₂ laser, an excimer laser, an Ar laser, or a He—Ne laser, a laser beam such as a semiconductor laser or a free electron laser, or a non-laser beam may be used as appropriate. The wavelength at which the fluorocarbon can be altered is not limited to this, but for example, a wavelength in the range of 600 nm or less can be used.

(Polymer containing light-absorbing structure in its repeating unit)
The separation layer 4 may contain a polymer containing a light-absorbing structure in its repeating unit. The polymer is altered by irradiation with light. The alteration of the polymer occurs when the structure absorbs the irradiated light. The separation layer 4 has lost its strength or adhesiveness before being irradiated with light as a result of the alteration of the polymer. Therefore, by applying a slight external force (for example, lifting the support plate 2 or the like), the separation layer 4 is broken, and the support plate 2 and the substrate 1 can be easily separated.

  The above-mentioned structure having light absorptivity is a chemical structure that absorbs light and alters a polymer containing the structure as a repeating unit. The structure is, for example, an atomic group including a conjugated π electron system composed of a substituted or unsubstituted benzene ring, condensed ring, or heterocyclic ring. More specifically, the structure may be a cardo structure, or a benzophenone structure, a diphenyl sulfoxide structure, a diphenyl sulfone structure (bisphenyl sulfone structure), a diphenyl structure or a diphenylamine structure present in the side chain of the polymer.

（式中、Ｒはそれぞれ独立して、アルキル基、アリール基、ハロゲン、水酸基、ケトン基、スルホキシド基、スルホン基又はＮ（Ｒ^４）（Ｒ^５）であり（ここで、Ｒ^４およびＲ^５はそれぞれ独立して、水素原子又は炭素数１〜５のアルキル基である）、Ｚは、存在しないか、又は−ＣＯ−、−ＳＯ_２−、−ＳＯ−若しくは−ＮＨ−であり、ｎは０又は１〜５の整数である。）
また、上記重合体は、例えば、以下の式のうち、（ａ）〜（ｄ）の何れかによって表される繰り返し単位を含んでいるか、（ｅ）によって表されるか、又は（ｆ）の構造をその主鎖に含んでいる。

（式中、ｌは１以上の整数であり、ｍは０又は１〜２の整数であり、Ｘは、（ａ）〜（ｅ）において上記の“化３”に示す式のいずれかであり、（ｆ）において上記の“化３”に示す式のいずれかであるか、又は存在せず、Ｙ_１およびＹ_２はそれぞれ独立して、−ＣＯ−又はＳＯ_２−である。ｌは好ましくは１０以下の整数である。）
上記の“化３”に示されるベンゼン環、縮合環および複素環の例としては、フェニル、置換フェニル、ベンジル、置換ベンジル、ナフタレン、置換ナフタレン、アントラセン、置換アントラセン、アントラキノン、置換アントラキノン、アクリジン、置換アクリジン、アゾベンゼン、置換アゾベンゼン、フルオリム、置換フルオリム、フルオリモン、置換フルオリモン、カルバゾール、置換カルバゾール、Ｎ−アルキルカルバゾール、ジベンゾフラン、置換ジベンゾフラン、フェナントレン、置換フェナントレン、ピレンおよび置換ピレンが挙げられる。例示した置換基がさらに置換基を有している場合、その置換基は、例えば、アルキル、アリール、ハロゲン原子、アルコキシ、ニトロ、アルデヒド、シアノ、アミド、ジアルキルアミノ、スルホンアミド、イミド、カルボン酸、カルボン酸エステル、スルホン酸、スルホン酸エステル、アルキルアミノおよびアリールアミノから選択される。 When the structure is present in the side chain of the polymer, the structure can be represented by the following formula:

(In the formula, each R is independently an alkyl group, aryl group, halogen, hydroxyl group, ketone group, sulfoxide group, sulfone group or N (R ⁴ ) (R ⁵ ) (where R ⁴ and R ⁵ Each independently represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms), Z is absent, or is —CO—, —SO ₂ —, —SO— or —NH—, and n is 0 or an integer from 1 to 5.)
In addition, the polymer includes, for example, a repeating unit represented by any one of (a) to (d) among the following formulas, is represented by (e), or (f) Contains structure in its main chain.

(In the formula, l is an integer of 1 or more, m is 0 or an integer of 1 to 2, and X is any one of the formulas shown in the above “Chemical Formula 3” in (a) to (e)). , (F) is any one of the above-mentioned formulas “Chemical Formula 3” or is not present, and Y ₁ and Y ₂ are each independently —CO— or SO ₂ —. Is an integer of 10 or less.)
Examples of the benzene ring, condensed ring and heterocyclic ring shown in the above “chemical formula 3” include phenyl, substituted phenyl, benzyl, substituted benzyl, naphthalene, substituted naphthalene, anthracene, substituted anthracene, anthraquinone, substituted anthraquinone, acridine, substituted Examples include acridine, azobenzene, substituted azobenzene, fluoride, substituted fluoride, fluoride, substituted fluoride, carbazole, substituted carbazole, N-alkylcarbazole, dibenzofuran, substituted dibenzofuran, phenanthrene, substituted phenanthrene, pyrene, and substituted pyrene. When the exemplified substituent further has a substituent, the substituent is, for example, alkyl, aryl, halogen atom, alkoxy, nitro, aldehyde, cyano, amide, dialkylamino, sulfonamide, imide, carboxylic acid, Selected from carboxylic esters, sulfonic acids, sulfonic esters, alkylamino and arylamino.

Of the substituents represented by “Chemical Formula 3” above, as an example of the fifth substituent having two phenyl groups and Z being —SO ₂ —, bis (2, 4-dihydroxyphenyl) sulfone, bis (3,4-dihydroxyphenyl) sulfone, bis (3,5-dihydroxyphenyl) sulfone, bis (3,6-dihydroxyphenyl) sulfone, bis (4-hydroxyphenyl) sulfone, bis (3-hydroxyphenyl) sulfone, bis (2-hydroxyphenyl) sulfone, and bis (3,5-dimethyl-4-hydroxyphenyl) sulfone.

  Of the substituents represented by “Chemical Formula 3” above, as an example of the fifth substituent having two phenyl groups and Z being —SO—, bis (2,3 -Dihydroxyphenyl) sulfoxide, bis (5-chloro-2,3-dihydroxyphenyl) sulfoxide, bis (2,4-dihydroxyphenyl) sulfoxide, bis (2,4-dihydroxy-6-methylphenyl) sulfoxide, bis (5 -Chloro-2,4-dihydroxyphenyl) sulfoxide, bis (2,5-dihydroxyphenyl) sulfoxide, bis (3,4-dihydroxyphenyl) sulfoxide, bis (3,5-dihydroxyphenyl) sulfoxide, bis (2,3 , 4-Trihydroxyphenyl) sulfoxide, bis (2,3,4-trihydroxy-6-methylpheny ) -Sulfoxide, bis (5-chloro-2,3,4-trihydroxyphenyl) sulfoxide, bis (2,4,6-trihydroxyphenyl) sulfoxide, bis (5-chloro-2,4,6-trihydroxy) Phenyl) sulfoxide and the like.

  Among the substituents represented by the above “Chemical Formula 3”, the fifth substituent having two phenyl groups and Z is —C (═O) — , 4-dihydroxybenzophenone, 2,3,4-trihydroxybenzophenone, 2,2 ′, 4,4′-tetrahydroxybenzophenone, 2,2 ′, 5,6′-tetrahydroxybenzophenone, 2-hydroxy-4- Methoxybenzophenone, 2-hydroxy-4-octoxybenzophenone, 2-hydroxy-4-dodecyloxybenzophenone, 2,2'-dihydroxy-4-methoxybenzophenone, 2,6-dihydroxy-4-methoxybenzophenone, 2,2 ' -Dihydroxy-4,4'-dimethoxybenzophenone, 4-amino-2'-hydroxybenzophenone, 4-dimethyl Ruamino-2′-hydroxybenzophenone, 4-diethylamino-2′-hydroxybenzophenone, 4-dimethylamino-4′-methoxy-2′-hydroxybenzophenone, 4-dimethylamino-2 ′, 4′-dihydroxybenzophenone, and 4 -Dimethylamino-3 ', 4'-dihydroxybenzophenone and the like.

  When the structure is present in the side chain of the polymer, the proportion of the repeating unit containing the structure in the polymer is such that the light transmittance of the separation layer 4 is 0.001% or more, 10 % Or less. If the polymer is prepared so that the ratio falls within such a range, the separation layer 4 can sufficiently absorb light and can be reliably and rapidly altered. That is, it is easy to remove the support plate 2 from the laminate 100, and the irradiation time of light necessary for the removal can be shortened.

  The said structure can absorb the light which has a wavelength of a desired range by selection of the kind. For example, the wavelength of light that can be absorbed by the above structure is more preferably in the range of 100 nm to 2,000 nm. Within this range, the wavelength of light that can be absorbed by the structure is on the shorter wavelength side, for example, in the range of 100 nm to 500 nm. For example, the structure can alter the polymer containing the structure by absorbing ultraviolet light, preferably having a wavelength in the range of about 300 nm to 370 nm.

  The light that can be absorbed by the above structure is, for example, a high-pressure mercury lamp (wavelength: 254 nm or more, 436 nm or less), KrF excimer laser (wavelength: 248 nm), ArF excimer laser (wavelength: 193 nm), F2 excimer laser (wavelength: 157 nm). , Light emitted from a XeCl laser (wavelength: 308 nm), XeF laser (wavelength: 351 nm) or solid-state UV laser (wavelength: 355 nm), or g-line (wavelength: 436 nm), h-line (wavelength: 405 nm) or i-line ( Wavelength: 365 nm).

  Although the separation layer 4 described above contains a polymer containing the above structure as a repeating unit, the separation layer 4 may further contain components other than the polymer. Examples of the component include a filler, a plasticizer, and a component that can improve the peelability of the support plate 2. These components are appropriately selected from conventionally known substances or materials that do not hinder or accelerate the absorption of light by the above structure and the alteration of the polymer.

(Inorganic)
The separation layer 4 may be made of an inorganic material. The separation layer 4 is made of an inorganic material, and is thus altered by absorbing light. As a result, the separation layer 4 loses its strength or adhesiveness before being irradiated with light. Therefore, by applying a slight external force (for example, lifting the support plate 2 or the like), the separation layer 4 is broken, and the support plate 2 and the substrate 1 can be easily separated.

The said inorganic substance should just be the structure which changes in quality by absorbing light, for example, can use 1 or more types of inorganic substances selected from the group which consists of a metal, a metal compound, and carbon suitably. The metal compound refers to a compound containing a metal atom, and can be, for example, a metal oxide or a metal nitride. Exemplary of such inorganic include, but are not limited to, gold, silver, copper, iron, nickel, aluminum, titanium, _{chromium, SiO 2, SiN, Si 3} N 4, TiN, and carbon One or more inorganic substances selected from the group consisting of: Carbon is a concept that may include an allotrope of carbon, for example, diamond, fullerene, diamond-like carbon, carbon nanotube, and the like.

  The inorganic material absorbs light having a wavelength in a specific range depending on the type. By irradiating the separation layer with light having a wavelength within a range that is absorbed by the inorganic material used for the separation layer 4, the inorganic material can be suitably altered.

The light applied to the separation layer 4 made of an inorganic material may be, for example, a solid-state laser such as a YAG laser, a ruby laser, a glass laser, a YVO ₄ laser, an LD laser, or a fiber laser, or a dye depending on the wavelength that can be absorbed by the inorganic material. A liquid laser such as a laser, a gas laser such as a CO ₂ laser, an excimer laser, an Ar laser, or a He—Ne laser, a laser beam such as a semiconductor laser or a free electron laser, or a non-laser beam may be used as appropriate.

  The separation layer 4 made of an inorganic material can be formed on the support plate 2 by a known technique such as sputtering, chemical vapor deposition (CVD), plating, plasma CVD, or spin coating. The thickness of the separation layer 4 made of an inorganic material is not particularly limited as long as it is a film thickness that can sufficiently absorb the light to be used. For example, the film thickness is in the range of 0.05 μm or more and 10 μm or less. Is more preferable. Alternatively, an adhesive may be applied in advance to both surfaces or one surface of an inorganic film (for example, a metal film) made of an inorganic material constituting the separation layer 4 and attached to the support plate 2 and the substrate 1.

  When a metal film is used as the separation layer 4, laser reflection or charging of the film may occur depending on conditions such as the film quality of the separation layer 4, the type of laser light source, and laser output. Therefore, it is preferable to take measures against these problems by providing an antireflection film or an antistatic film on the upper or lower side of the separation layer 4 or one of them.

(Compound having infrared absorbing structure)
The separation layer 4 may be formed of a compound having an infrared absorbing structure. The compound is altered by absorbing infrared rays. The separation layer 4 has lost its strength or adhesiveness before being irradiated with infrared rays as a result of the alteration of the compound. Therefore, by applying a slight external force (for example, lifting the support), the separation layer 4 is broken, and the support plate 2 and the substrate 1 can be easily separated.

Examples of the compound having an infrared absorptive structure or a compound having an infrared absorptive structure include alkanes, alkenes (vinyl, trans, cis, vinylidene, trisubstituted, tetrasubstituted, conjugated, cumulene, Cyclic), alkyne (monosubstituted, disubstituted), monocyclic aromatic (benzene, monosubstituted, disubstituted, trisubstituted), alcohol and phenols (free OH, intramolecular hydrogen bond, intermolecular hydrogen bond, saturation) Secondary, saturated tertiary, unsaturated secondary, unsaturated tertiary), acetal, ketal, aliphatic ether, aromatic ether, vinyl ether, oxirane ring ether, peroxide ether, ketone, dialkylcarbonyl, Aromatic carbonyl, 1,3-diketone enol, o-hydroxy aryl ketone, dialkyl aldehyde, aromatic aldehyde, carboxylic acid (dimer Carboxylate anion), formate ester, acetate ester, conjugated ester, non-conjugated ester, aromatic ester, lactone (β-, γ-, δ-), aliphatic acid chloride, aromatic acid chloride, acid anhydride ( Conjugated, non-conjugated, cyclic, acyclic), primary amide, secondary amide, lactam, primary amine (aliphatic, aromatic), secondary amine (aliphatic, aromatic), secondary Tertiary amine (aliphatic, aromatic), primary amine salt, secondary amine salt, tertiary amine salt, ammonium ion, aliphatic nitrile, aromatic nitrile, carbodiimide, aliphatic isonitrile, aromatic isonitrile, Isocyanate ester, thiocyanate ester, aliphatic isothiocyanate ester, aromatic isothiocyanate ester, aliphatic nitro compound, aromatic nitro compound, nitroamine, nitrosamine, Acid ester, nitrite ester, nitroso bond (aliphatic, aromatic, monomer, dimer), sulfur compounds such as mercaptan and thiophenol and thiolic acid, thiocarbonyl group, sulfoxide, sulfone, sulfonyl chloride, primary Secondary sulfonamide, secondary sulfonamide, sulfate ester, carbon-halogen bond, Si-A ¹ bond (A ¹ is H, C, O or halogen), P-A ² bond (A ² is H, C Or O), or Ti—O bonds.

As a structure containing halogen bond, for _{example, -CH 2 Cl, -CH 2 Br} , -CH 2 I, -CF 2 - - the _{carbon, - CF 3, -CH = CF} 2, -CF = CF 2, fluoride Aryl chloride, and aryl chloride.

Examples of the structure containing the Si—A ¹ bond include SiH, SiH ₂ , SiH ₃ , Si—CH ₃ , Si—CH ₂ —, Si—C ₆ H ₅ , SiO-aliphatic, Si—OCH ₃ , Si— _{OCH 2 CH 3, Si-OC} 6 H 5, Si-O-Si, Si-OH, SiF, SiF 2, and SiF _3, and the like. As a structure including a Si—A ¹ bond, it is particularly preferable to form a siloxane skeleton and a silsesquioxane skeleton.

Examples of the structure containing the P—A ² bond include PH, PH ₂ , P—CH ₃ , P—CH ₂ —, P—C ₆ H ₅ , A ³ ₃ —PO— (A ³ is aliphatic or aromatic. _{^{family), (A 4 O) 3}} -P-O (A 4 _{alkyl), P-OCH 3, P} -OCH 2 CH 3, P-OC 6 H 5, P-O-P, P-OH, and O = P-OH and the like can be mentioned.

  The said structure can absorb the infrared rays which have the wavelength of a desired range by selection of the kind. Specifically, the wavelength of infrared rays that can be absorbed by the above structure is, for example, in the range of 1 μm or more and 20 μm or less, and more preferably in the range of 2 μm or more and 15 μm or less. Furthermore, in the case where the structure is a Si—O bond, a Si—C bond, or a Ti—O bond, it may be in the range of 9 μm or more and 11 μm or less. In addition, those skilled in the art can easily understand the infrared wavelength that can be absorbed by each structure. For example, as an absorption band in each structure, Non-Patent Document: SILVERSTEIN / BASSLER / MORRILL, “Identification method by spectrum of organic compound (5th edition) —Combination of MS, IR, NMR and UV” (published in 1992) The description on page 146 to page 151 can be referred to.

  As the compound having an infrared absorbing structure used for forming the separation layer 4, among the compounds having the structure as described above, it can be dissolved in a solvent for coating and solidified to be solid. There is no particular limitation as long as the layer can be formed. However, in order to effectively alter the compound in the separation layer 4 and facilitate separation of the support plate 2 and the substrate 1, the infrared absorption in the separation layer 4 is large, that is, the separation layer 4 is irradiated with infrared rays. It is preferable that the infrared transmittance is low. Specifically, the infrared transmittance in the separation layer 4 is preferably lower than 90%, and the infrared transmittance is more preferably lower than 80%.

（化学式（６）中、Ｒ^６は、水素、炭素数１０以下のアルキル基、又は炭素数１０以下のアルコキシ基である。）
中でも、シロキサン骨格を有する化合物としては、上記化学式（５）で表される繰り返し単位および下記化学式（７）で表される繰り返し単位の共重合体であるｔ−ブチルスチレン（ＴＢＳＴ）−ジメチルシロキサン共重合体がより好ましく、上記式（５）で表される繰り返し単位および下記化学式（７）で表される繰り返し単位を１：１で含む、ＴＢＳＴ−ジメチルシロキサン共重合体がさらに好ましい。

また、シルセスキオキサン骨格を有する化合物としては、例えば、下記化学式（８）で表される繰り返し単位および下記化学式（９）で表される繰り返し単位の共重合体である樹脂を用いることができる。

（化学式（８）中、Ｒ^７は、水素又は炭素数１以上、１０以下のアルキル基であり、化学式（９）中、Ｒ^８は、炭素数１以上、１０以下のアルキル基、又はフェニル基である。）
シルセスキオキサン骨格を有する化合物としては、このほかにも、特開２００７−２５８６６３号公報（２００７年１０月４日公開）、特開２０１０−１２０９０１号公報（２０１０年６月３日公開）、特開２００９−２６３３１６号公報（２００９年１１月１２日公開）、および特開２００９−２６３５９６号公報（２００９年１１月１２日公開）において開示されている各シルセスキオキサン樹脂を好適に利用することができる。 For example, as the compound having a siloxane skeleton, for example, a resin that is a copolymer of a repeating unit represented by the following chemical formula (5) and a repeating unit represented by the following chemical formula (6), or A resin that is a copolymer of a repeating unit represented by the following chemical formula (5) and a repeating unit derived from an acrylic compound can be used.

(In the chemical formula (6), R ⁶ is hydrogen, an alkyl group having 10 or less carbon atoms, or an alkoxy group having 10 or less carbon atoms.)
Among them, as a compound having a siloxane skeleton, a t-butylstyrene (TBST) -dimethylsiloxane copolymer, which is a copolymer of a repeating unit represented by the chemical formula (5) and a repeating unit represented by the following chemical formula (7), is used. A polymer is more preferable, and a TBST-dimethylsiloxane copolymer containing a repeating unit represented by the above formula (5) and a repeating unit represented by the following chemical formula (7) in a ratio of 1: 1 is further preferable.

In addition, as the compound having a silsesquioxane skeleton, for example, a resin that is a copolymer of a repeating unit represented by the following chemical formula (8) and a repeating unit represented by the following chemical formula (9) can be used. .

(In the chemical formula (8), R ⁷ is hydrogen or an alkyl group having 1 to 10 carbon atoms, and in the chemical formula (9), R ⁸ is an alkyl group having 1 to 10 carbon atoms, or a phenyl group. .)
Other compounds having a silsesquioxane skeleton include JP 2007-258663 A (published on October 4, 2007), JP 2010-120901 A (published on June 3, 2010), Each silsesquioxane resin disclosed in JP 2009-263316 A (published on November 12, 2009) and JP 2009-263596 A (published on November 12, 2009) is preferably used. be able to.

シルセスキオキサン骨格を有する重合体としては、ランダム構造、ラダー構造、および籠型構造があり得るが、何れの構造であってもよい。 Among these, as the compound having a silsesquioxane skeleton, a repeating unit represented by the following chemical formula (10) and a copolymer of a repeating unit represented by the following chemical formula (11) are more preferable. A copolymer containing 7: 3 of the repeating unit represented by the following chemical formula (11) is more preferred.

The polymer having a silsesquioxane skeleton may have a random structure, a ladder structure, and a cage structure, but any structure may be used.

Examples of the compound containing a Ti—O bond include (i) tetra-i-propoxytitanium, tetra-n-butoxytitanium, tetrakis (2-ethylhexyloxy) titanium, and titanium-i-propoxyoctylene glycolate. (ii) di -i- propoxy bis (acetylacetonato) titanium, and propane di oxytitanium bis (ethylacetoacetate) chelate titanium such as; alkoxy titanium etc. _{(iii) i-C 3 H} 7 O - [- _{Ti (O-i-C 3} H 7) 2 -O-] n -i-C 3 H 7, and _{n-C 4 H 9 O -} [- Ti (O-n-C 4 H 9) 2 -O _-] n _-n-C 4 titanium polymers such as _{H 9;} (iv) tri -n- butoxy titanium monostearate, titanium stearate, di -i- Puropokishichi Tandiisostearate, and acylate titanium such as (2-n-butoxycarbonylbenzoyloxy) tributoxytitanium; (v) water-soluble titanium compounds such as di-n-butoxy-bis (triethanolaminato) titanium Can be mentioned.

Among them, as a compound containing a Ti—O bond, di-n-butoxy bis (triethanolaminato) titanium (Ti (OC ₄ H ₉ ) ₂ [OC ₂ H ₄ N (C ₂ H ₄ OH) ₂ ] ₂ ) is preferred.

  Although the separation layer 4 described above contains a compound having an infrared absorbing structure, the separation layer 4 may further contain a component other than the above compound. Examples of the component include a filler, a plasticizer, and a component that can improve the peelability of the support plate 2. These components are appropriately selected from conventionally known substances or materials that do not hinder or promote infrared absorption by the above structure and alteration of the compound.

(Infrared absorbing material)
The separation layer 4 may contain an infrared absorbing material. The separation layer 4 is configured to contain an infrared ray absorbing substance, so that it is altered by absorbing light. As a result, the strength or adhesiveness before receiving the light irradiation is lost. Therefore, by applying a slight external force (for example, lifting the support plate 2 or the like), the separation layer 4 is broken, and the support plate 2 and the substrate 1 can be easily separated.

  The infrared absorbing material only needs to have a structure that is altered by absorbing infrared rays. For example, carbon black, iron particles, or aluminum particles can be suitably used. The infrared absorbing material absorbs light having a wavelength in a specific range depending on the type. By irradiating the separation layer 4 with light having a wavelength within a range that is absorbed by the infrared absorbing material used for the separation layer 4, the infrared absorbing material can be suitably altered.

(Reactive polysilsesquioxane)
The separation layer 4 can be formed by polymerizing reactive polysilsesquioxane, whereby the separation layer 4 has high chemical resistance and high heat resistance.

  In this specification, the reactive polysilsesquioxane is a polysilsesquioxane having a silanol group at the end of the polysilsesquioxane skeleton or a functional group capable of forming a silanol group by hydrolysis. Oxane, which can be polymerized with each other by condensing the silanol groups or functional groups capable of forming silanol groups. The reactive polysilsesquioxane has a silsesquioxane skeleton such as a random structure, a cage structure, and a ladder structure as long as it has a silanol group or a functional group capable of forming a silanol group. Can be used.

式（１２）中、Ｒ”は、それぞれ独立して、水素および炭素数１以上、１０以下のアルキル基からなる群より選択され、水素および炭素数１以上、５以下のアルキル基からなる群より選択されることがより好ましい。Ｒ”が、水素又は炭素数１以上、１０以下のアルキル基であれば、分離層形成工程における加熱によって、式（１２）によって表される反応性ポリシルセスキオキサンを好適に縮合させることができる。 Moreover, it is more preferable that the reactive polysilsesquioxane has a structure represented by the following formula (12).

In formula (12), each R ″ is independently selected from the group consisting of hydrogen and an alkyl group having 1 to 10 carbon atoms, and from the group consisting of hydrogen and an alkyl group having 1 to 5 carbon atoms. More preferably, when R ″ is hydrogen or an alkyl group having 1 to 10 carbon atoms, the reactive polysilsesquioxy represented by the formula (12) by heating in the separation layer forming step. Sun can be suitably condensed.

  In formula (12), p is preferably an integer of 1 or more and 100 or less, and more preferably an integer of 1 or more and 50 or less. Reactive polysilsesquioxane has a repeating unit represented by the formula (12), so that it has a higher content of Si—O bonds than that formed using other materials, and infrared (0.78 μm or more). , 1000 μm or less), preferably far infrared rays (3 μm or more and 1000 μm or less), more preferably a separation layer 4 having a high absorbance at a wavelength of 9 μm or more and 11 μm or less.

  In the formula (12), R ′ is independently the same or different organic group. Here, R is, for example, an aryl group, an alkyl group, and an alkenyl group, and these organic groups may have a substituent.

  When R 'is an aryl group, a phenyl group, a naphthyl group, an anthryl group, a phenanthryl group and the like can be exemplified, and a phenyl group is more preferable. The aryl group may be bonded to the polysilsesquioxane skeleton via an alkylene group having 1 to 5 carbon atoms.

  When R ′ is an alkyl group, examples of the alkyl group include linear, branched, or cyclic alkyl groups. Moreover, when R is an alkyl group, it is preferable that carbon number is 1-15, and it is more preferable that it is 1-6. In addition, when R is a cyclic alkyl group, it may be a monocyclic or an alkyl group having a bicyclic to tetracyclic structure.

  When R ′ is an alkenyl group, a straight chain, branched chain, or cyclic alkenyl group can be exemplified as in the case of an alkyl group, and the alkenyl group has 2 to 15 carbon atoms. Preferably, it is 2-6. In addition, when R is a cyclic alkenyl group, it may be an alkenyl group having a monocyclic or bicyclic to tetracyclic structure. Examples of the alkenyl group include a vinyl group and an allyl group.

  Further, examples of the substituent that R ′ may have include a hydroxyl group and an alkoxy group. When the substituent is an alkoxy group, a linear, branched, or cyclic alkylalkoxy group can be exemplified, and the alkoxy group preferably has 1 to 15 carbon atoms, and preferably 1 to 10 carbon atoms. Is more preferable.

  In one aspect, the siloxane content of the reactive polysilsesquioxane is preferably 70 mol% or more and 99 mol% or less, and more preferably 80 mol% or more and 99 mol% or less. . When the siloxane content of the reactive polysilsesquioxane is 70 mol% or more and 99 mol% or less, it is preferable to irradiate infrared rays (preferably far infrared rays, more preferably light having a wavelength of 9 μm or more and 11 μm or less). A separation layer can be formed that can be transformed into

  In one aspect, the weight average molecular weight (Mw) of the reactive polysilsesquioxane is preferably 500 or more and 50,000 or less, and more preferably 1,000 or more and 10,000 or less. preferable. When the weight average molecular weight (Mw) of the reactive polysilsesquioxane is 500 or more and 50,000 or less, the reactive polysilsesquioxane can be suitably dissolved in a solvent and can be suitably coated on a support.

  Examples of commercially available products that can be used as reactive polysilsesquioxane include SR-13, SR-21, SR-23, and SR-33 manufactured by Konishi Chemical Co., Ltd.

<4. Modified example of laminate>
In the first embodiment, the laminated body 100 having the separation layer 4 between the support plate 2 and the adhesive layer 3 is used. However, when an adhesive layer having an adhesive force that can be peeled off by applying mechanical force is used, there is no separation layer, and the adhesive layer is attached to the substrate and the support plate. Even in the case of a laminated body directly bonded, the support plate can be separated using the support separating apparatus described in the first embodiment.

  Examples of the adhesive that can form an adhesive layer having an adhesive force that can be peeled off by applying a mechanical force include, for example, a pressure-sensitive adhesive and a peelable adhesive. An agent etc. can be mentioned. Examples of the pressure-sensitive adhesive (pressure-sensitive adhesive) include known pressure-sensitive adhesives containing synthetic rubber such as latex rubber, acrylic rubber, isoprene rubber, tackifier resin, and the like. Moreover, as the peelable adhesive, it is only necessary to have peelability. For example, a release agent such as wax or silicone is blended with a thermoplastic resin, a photocurable resin, or a thermosetting resin. The adhesive which adjusted the adhesive force by doing may be sufficient. Further, it may be a curable adhesive that contains a thermosetting resin, a photocurable resin, or the like, and develops releasability by curing these resins. Such a peelable adhesive may be an adhesive comprising a thermoplastic resin having a low adhesive strength such as beeswax or wax as a main component.

[Embodiment 2]
In the first embodiment, the configuration in which the gas is simultaneously ejected from all of the gas ejection portions 24 provided at the four locations as shown in FIG. 6 has been described, but the present invention is not limited to this. In the second embodiment, another aspect related to gas ejection will be described with reference to FIG.

  FIG. 7 shows the configuration of the second embodiment, and is a diagram illustrating a schematic diagram when gas is ejected from the gas ejection part 24 in a state in which the stacked body 100 is viewed from above. FIG. 7 is a diagram corresponding to FIG. 6 of the first embodiment.

  In the second embodiment, in the step of jetting gas from the gas jetting portion 24, first, as shown in FIG. 7A, gas is jetted from the gas jetting portion 24 at the position (i), and at this time the position (ii) ) To (iv), no gas is ejected from the gas ejection part 24. Here, for example, 0.5 L / min of gas is blown onto the gap 7 from the gas ejection portion 24 at the position (i) for 3 seconds, for example.

  Subsequently, the gas ejection location is switched to start gas ejection from the gas ejection section 24 at the position (iv) as shown in FIG. 7B, and the gas ejection section 24 at the position (i). Stop gas emission from At this time, no gas is ejected from the gas ejection portion 24 at the positions (ii) and (iii). Here, for example, 0.5 L / min of gas is blown onto the gap 7 from the gas ejection portion 24 at the position (iv) for 3 seconds, for example.

  Subsequently, the gas ejection location is switched, and gas ejection from the gas ejection section 24 at positions (i) and (iv) is started as shown in FIG. At this time, no gas is ejected from the gas ejection portion 24 at the positions (ii) and (iii). Here, for example, 0.5 L / min of gas is blown onto the gap 7 from the gas ejection portion 24 at the positions (i) and (iv) for 5 seconds, for example.

  You may isolate | separate the support plate 2 from the laminated body 100 through the above process.

  The above-described switching of the gas ejection locations may be controlled by a control device (not shown) of the support separating device 10 of the first embodiment.

[Embodiment 3]
In the first embodiment, as shown in FIG. 3C, the configuration in which each of the clamps 23 has two inclined surfaces 23 b and the ejection port 27 is disposed therebetween is described. However, in the present invention, the position of the jet outlet 27 is not limited to this. The spout 27 should just be arrange | positioned in the vicinity of the inclined surface 23b. This will be described with reference to FIG.

  FIG. 8 is a diagram illustrating the configuration of the third embodiment. The third embodiment has the same configuration as that of the first embodiment, except that the arrangement form of the inclined surface 23b and the ejection port 27 is different from that of the first embodiment.

  Specifically, as shown in FIG. 8, in the third embodiment, one inclined surface 23b is formed in the middle portion along the lower end side (bottom side) of the facing surface 23a. An outlet 27 is disposed so as to sandwich 23b.

  As described above, by arranging the nozzle outlet 27 in the vicinity of the inclined surface 23 b, the inclined surface is formed on the chamfered portion 2 a located on the back side of the surface facing the plate portion 21 at the outer peripheral end of the support plate 2. When 23b is brought into contact, gas can be effectively ejected into the gap formed in the outer peripheral portion of the support plate 2, and the outer peripheral portion of the support plate 2 can be suitably held.

[Embodiment 4]
In the first embodiment, the gas ejection part 24 is connected to the ejection port 27 provided in each clamp 23, but the present invention is not limited to this. For example, in a state where the suction pad 22 is attracted to the outer peripheral portion of the upper surface of the support plate 2 and the gap 7 is maintained, one nozzle that ejects gas moves along the peripheral portion of the stacked body 100 along the circumferential direction. In this case, the gas may be ejected into the gap 7.

[Embodiment 5]
In the said Embodiment 1, the clamp 23 and the gas ejection part 24 become a structure which raises / lowers integrally, and slides integrally. However, the present invention is not limited to this, and each of the clamp 23 and the gas ejection part 24 includes a drive mechanism, and may perform each step shown in FIGS. 5 (a) to 5 (e). Is possible.

  In addition, when each is provided with the drive mechanism, in FIG.5 (e), after moving the gas ejection part 24 to the position preferable for gas ejection, it is also possible to inject gas from the gas ejection part 24. FIG. Thereby, a clearance gap can be expanded more effectively.

[Other Embodiments]
In the above-described embodiment, the shape of the laminate in a top view is circular, but the shape in a top view of the laminate separated by the support separation device and the support separation method according to the present invention (that is, the substrate and The shape of the support in a top view may be a polygonal shape such as a rectangle or a rectangle. The support separating apparatus and the support separating method according to the present invention only need to be able to separate the substrate and the support by ejecting a fluid between the substrate and the support. The shape is not limited. Therefore, the support body separating device and the support body separating method according to the present invention are not limited to WLP (Wafer Level Package) known as a semiconductor package (semiconductor device) including a semiconductor element (electronic component). (Panel Level Package).

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

1 Substrate 2 Support plate (support)
2a Chamfered part 3 Adhesive layer 4 Separation layer 4a Region 5 Dicing tape 6 Dicing frame 7 Gap 10 Support body separating device 20 Holding part 21 Plate part 22 Adsorption pad (adsorption part)
23 Clamp (gripping part)
23a Face 23b Inclined surface (locking surface)
24 Gas ejection part (ejection part)
25 Slide drive unit 26 Level block 26a Abutting surface 27 Spout (opening)
30 Lifting unit 40 Light irradiation unit 50 Stage 51 Porous unit 100 Laminate

Claims (14)

A support separating apparatus for separating the support from a laminate formed by attaching a substrate and a support supporting the substrate via an adhesive layer,
A mounting table for fixing the laminate from the substrate side;
A holding unit for holding the support;
An elevating part that raises and lowers the holding part relative to the mounting table,
The holding part is
Gripping the outer peripheral edge of the support, and forming at least one grip between the substrate and the support; and
An adsorption part that maintains the gap by adsorbing and holding the support from the back surface of the surface on which the gap is formed in the support; and
The said holding | grip part is equipped with the ejection part which ejects a fluid toward the inside of the said laminated body from the said clearance gap maintained by the said adsorption | suction part, The support body separation apparatus characterized by the above-mentioned.   The support body separating apparatus according to claim 1, wherein the grip portion forms the gap by gripping and lifting an outer peripheral end portion of the support body. The holding part includes a plurality of gripping parts and suction parts, respectively.
The support body separating apparatus according to claim 1, wherein each of the plurality of gripping portions includes the ejection portion. A chamfered portion is provided at the outer peripheral end of the support,
The gripping portion has a locking surface that locks the chamfered portion of the support,
The support body separating apparatus according to any one of claims 1 to 3, wherein an opening for ejecting fluid is disposed in the ejection portion so as to be adjacent to the locking surface.   5. The support separating apparatus according to claim 4, wherein the opening is provided in the locking surface. The support is made of a light-transmitting material, and the laminate is provided with a separation layer that is altered by irradiating light between the substrate and the support.
A light irradiating unit that irradiates at least a part of the peripheral portion of the separation layer with light through the support;
The gripping portion grips and lifts the outer peripheral end of the support so as to form a gap between the support and the substrate stacked via the region. The support separating apparatus according to claim 1, wherein the support separating apparatus is characterized in that The holding part includes a plate part connected to the elevating part,
In the plate portion, the adsorbing portion is disposed on a peripheral portion of the surface facing the support, and the grip portion is disposed on the back surface of the surface facing the support, and the peripheral portion of the plate portion. The support body separation according to any one of claims 1 to 6, further comprising a drive section that moves in parallel to a planar direction of the support body so as to approach the suction section from the outside. apparatus.   An abutting portion having an abutting surface that abuts against the flat surface portion of the support is provided on the inner side of the peripheral portion of the surface on the side facing the support in the plate portion. The support separating apparatus according to claim 7, wherein is made of resin. A support separating method for separating the support from a laminate formed by attaching a substrate and a support for supporting the substrate via an adhesive layer,
A step of forming a gap between the substrate and the support by fixing the substrate and holding the outer peripheral end of the support by at least one holding portion;
A gap maintaining step for maintaining the gap by sucking and holding the support from the back surface of the surface on which the gap is formed, and
A separation step of separating the support from the laminate by ejecting a fluid from an ejection portion provided in the gripping portion from the gap toward the inside of the laminate from the gap. A support separating method comprising the steps of:   10. The support separating method according to claim 9, wherein, in the gap forming step, the gap is formed by the gripping part gripping and lifting an outer peripheral end of the support. In the gap forming step, a plurality of gaps are formed between the substrate and the support by gripping the outer peripheral end of the support by the plurality of grips.
In the gap maintaining step, each of the back surfaces of the plurality of surfaces on which the gap is formed by holding the support by the plurality of gripping portions in the support is individually sucked and held, and lifted.
The fluid is ejected by the ejection part provided in the grip part in the separation step from a part of the plurality of the gaps toward the inside of the stacked body. 2. The method for separating a support according to 1.   The support body separating method according to any one of claims 9 to 11, wherein after the gap forming step and before the gap maintaining step, the outer peripheral end portion of the support body and the gripping portion are separated from each other. .   In the gap forming step, when the outer peripheral end portion of the support body is gripped by the grip portion, the peripheral portion of the support body that is in contact with the grip portion is sucked and held and lifted. Item 13. The support separating method according to any one of Items 9 to 12. The support is made of a light-transmitting material, and the laminate is provided with a separation layer that is altered by irradiating light between the substrate and the support.
Before the gap formation step, including a light irradiation step of irradiating at least a part of the peripheral portion of the separation layer through the support,
In the gap forming step, the gripping part grips an outer peripheral end of the support so as to form a gap between the support and the substrate stacked via the region. The support separating method according to any one of claims 9 to 13.

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