TW201812934A - Gluing equipment and method of forming the same - Google Patents

Abstract

A gluing device includes: a machine body, a glue supplying device and a cleaning device provided on the machine body, so that the cleaning device and the glue supplying device are provided on the same machine body to save processing time. , And can reduce the production cost of electronic products. The invention further provides a method for forming a glue material.

Description

   Gluing equipment and method for forming glue   

The invention relates to a process for forming a glue material, and more particularly to a gluing device and a method for forming a glue material.

With the evolution of semiconductor packaging technology, semiconductor devices have developed different packaging types. Among them, Ball grid array (BGA), such as PBGA, EBGA, FCBGA, etc., are an advanced The semiconductor packaging technology is characterized in that a packaging substrate is used to place a semiconductor wafer, and a plurality of solder balls arranged in a grid array are planted on the back of the packaging substrate, and the entire packaging unit is soldered by the solder balls. It is electrically connected to external electronic devices, so that more I / O connections can be accommodated on the same unit area of the carrier to meet the requirements of highly integrated semiconductor chips.

As shown in Figure 1, the conventional flip-chip process is to first place an electronic component 11 such as a semiconductor wafer through a plurality of conductive elements 12 such as solder bumps on a carrier 10 such as a package substrate, and then resolder ( reflow) the conductive elements 12, and then perform a dispensing step, that is, use a dispenser 13 to fill the adhesive material 14 such as a primer between the electronic component 11 and the carrier 10 to cover the conductive elements 12. In order to avoid the conductive elements 12 from being defaced and damaged.

If there is dirt on the electronic component 11 and the carrier 10 where the glue material 14 is to be filled, after the glue material 14 is cured, the dirt is likely to cause voids in the glue material 14, As a result, problems such as gas explosion may occur when the process such as a reflow furnace is performed. Therefore, the electronic component 11 and the carrier 10 are generally cleaned before the dispensing step.

The conventional cleaning method is to first place the carrier 10 provided with the electronic component 11 in a box, and then clean it with a cleaning agent and deionized water. After the cleaning is completed, the electronic component 11 provided with the electronic component 11 is cleaned. The carrier 10 is moved to a dispenser, and the dispenser 13 is used for dispensing.

However, the conventional cleaning method needs to be cleaned before a cleaning machine position (such as the aforementioned box body), and then moved to the dispensing machine to perform the dispensing step, which makes the manufacturing process too complicated and increases the processing time (cleaning machine The position is moved to the transfer time of the dispensing machine), and preparation, transportation, fixing and clamping of jigs, etc. are required, resulting in increased costs. In addition, the electronic component 11 or the carrier 10 may be damaged during transportation.

Furthermore, according to the trend and demand of product miniaturization, the height of the conductive element 12 is getting lower and lower, and the pitch between the conductive elements 12 is getting narrower and narrower, which makes the conventional cleaning method not easy. For cleaning.

Therefore, how to overcome the problems in the conventional technology has become an urgent issue.

In view of the lack of the above-mentioned conventional technology, the present invention discloses a gluing device, which includes: a machine body; a glue supplying device provided on the machine body for cleaning the surface of an object; and a cleaning device, which is provided for The machine body is used for forming glue on the object.

The invention also discloses a method for forming a glue material, which comprises: providing a glue applying device; cleaning the surface of an object by the cleaning device; and forming the glue material on the object by the glue supply device.

In the aforementioned gluing equipment and method for forming a glue material, the cleaning device is a high-pressure fluid cleaning device or a plasma cleaning device (such as an atmospheric plasma cleaning device).

In the foregoing gluing equipment and method for forming a glue material, the method further includes a control device electrically connected to the machine body.

The aforementioned gluing equipment and method for forming a glue material further include a placement area provided on the machine body for placing objects after the glue material is formed.

In the aforementioned gluing equipment and method for forming a glue material, the cleaning device includes a nozzle, a transfer module, and a detection module; the glue supply device includes a glue filler, a transfer module, a storage module, and Extrusion module.

It can be known from the above that the gluing equipment and the method for forming a glue material according to the present invention are mainly provided on the same machine body by the cleaning device and the glue supplying device. Therefore, compared with the conventional technology, the present invention can save processing time , Which can reduce the manufacturing cost of electronic products.

10‧‧‧ Carrier

11‧‧‧Electronic components

12‧‧‧ conductive element

13‧‧‧ Dispenser

14‧‧‧ glue

2‧‧‧Gluing equipment

2a‧‧‧machine body

20‧‧‧Cleaning device

200‧‧‧ Nozzle

21‧‧‧ glue supply device

210‧‧‧filler

22‧‧‧ Placement Area

23‧‧‧Control device

FIG. 1 is a schematic cross-sectional view of a conventional flip-chip manufacturing process; FIG. 2 is a schematic cross-sectional view of a gluing equipment of the present invention; and FIGS. 2A to 2C are cross-sectional schematic views of a method of forming a rubber material according to the present invention.

The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

It should be noted that the structures, proportions, sizes, etc. shown in the drawings in this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. The limited conditions are not technically significant. Any modification of the structure, change of the proportional relationship, or adjustment of the size shall still fall within the scope of this invention without affecting the effects and goals that the invention can produce. The technical content disclosed by the invention can be covered. At the same time, the terms such as "upper" and "one" cited in this specification are only for the convenience of description, and are not used to limit the scope of the present invention. The relative relationship changes or adjustments, Without substantially changing the technical content, it should be regarded as the scope of the present invention.

As shown in FIG. 2, the gluing equipment 2 of the present invention includes a machine body 2 a and a glue supplying device 21 provided on the machine body 2 a. Its detailed mechanism), a cleaning device 20 provided on the machine body 2a (only the layout position is indicated by a reference numeral in the figure, and its detailed mechanism is not shown), and a placement area 22 provided on the machine body 2a (The figure only indicates the layout position by the reference numerals, and the detailed mechanism is not shown.)

The machine body 2a is equipped with electromechanical equipment related to the dispensing process.

The cleaning device 20 is a high-pressure fluid cleaning device (such as a deionized water cleaning device or a cleaning agent cleaning device) or a plasma cleaning device (such as an atmospheric plasma cleaning device). High-pressure deionized water or cleaning agent has better cleaning effect.

In the embodiment of the present case, the cleaning device 20 is an atmospheric plasma type cleaning device, which can be directly operated and used in a general environment. No additional chamber is needed, and the plasma can be directly generated by increasing the voltage and heating to extremely high temperature. , And avoid the use of vacuum plasma cleaning device, because its volume is too large, it needs to be a single machine independently, so it can not be installed on the machine body 2a, so there will still be a shortage as described in the conventional technology (such as transportation process). Specifically, the vacuum plasma cleaning device needs a chamber and extracts the air therein, so that the chamber maintains a certain degree of vacuum or low pressure, and the objects to be processed need to be placed in the chamber in order to use Plasma (or ion) is used for cleaning. On the other hand, according to the trend and demand for miniaturization of products, the height and spacing of the conductive elements electrically connected to the carrier are getting smaller and smaller. It is not possible to adjust the position of the nozzle, so its plasma is not easy to clean under the electronic components, resulting in poor fluidity of the glue material and prone to moisture absorption problems. After dispensing and baking, bubbles will be generated in the glue material (void ).

In this embodiment, the cleaning device 20 includes a nozzle 200 as shown in FIG. 2A, a transfer module (not shown), and a detection module (not shown). Specifically, the nozzle 200 is used to supply cleaning fluid or plasma to the object to be processed; the transfer module is used to control the nozzle 200 to perform three-axis or multi-directional movement or rotation; the detection module is It has image capture and calculation functions such as Charge-coupled Device (CCD). It can calculate the amount of dirt according to the image, and can also know whether the dirt is removed based on the image calculation. However, there are various types of mechanisms related to the cleaning device 20 and are not limited to the above.

The glue supplying device 21 is close to the cleaning device 20, and includes a glue filler 210 as shown in FIG. 2B, a transfer module (not shown), and a storage module (not shown). And an extrusion module (not shown).

In this embodiment, the glue filler 210 is used to supply the glue material 14 to the object. The transfer module is used to control the glue filler 210 to move or rotate. The storage module is used to store the rubber material 14. The extrusion module is used for extruding the rubber material 14 through the rubber filler 210. However, there are various types of mechanisms related to the glue supplying device 21, and they are not limited to the above.

The placing area 22 is used for placing the finished glued objects, which is close to the glue supplying device 21, and there are many types of mechanisms, which are not particularly limited.

In an embodiment, the gluing device 2 further includes a control device 23 electrically connected to the machine body 2a. In this embodiment, the control device 23 is a central control unit, a signal processor, a signal generating unit, or a computer, etc., which is externally connected to the machine body 2a to control the operation of the gluing device 2; Understandably, the control device 23 can also be built in the machine body 2a.

Figures 2A to 2C are schematic sectional views of the method for forming a glue material according to the present invention. In this embodiment, the gluing material 14 is formed by using the gluing device 2, and the gluing material 14 is, for example, a primer.

As shown in Figure 2A, an object to be glued is placed on the machine body 2a. The object includes a carrier 10 having a plurality of solder pads and wiring (not shown), and an The carrier 10 has an electronic component 11 with a plurality of electrode pads and lines (not shown). The electronic component 11 is coupled to the carrier 10 through a plurality of conductive elements 12. Then, the control device 23 controls the cleaning device 20 to clean the dirt on the surface of the conductive element 12, the carrier 10 and the electronic component 11 with its nozzle 200. The cleaning time of the cleaning device 20 may be a specific time ( (For example, cleaning time after simulation, evaluation, or experimentation).

In this embodiment, the carrier 10 is a package substrate, which is, for example, a semiconductor plate (glass, silicon wafer or silicon interposer), a ceramic plate, or an insulating plate, and is not particularly limited.

Furthermore, the electronic component 11 is an active component, a passive component, or a combination of both, and the active component is, for example, a semiconductor wafer, and the passive component is, for example, a resistor, a capacitor, and an inductor.

In addition, the lines, solder pads, and electrode pads are made of metal materials, such as copper or aluminum, but are not limited to the above.

In addition, the dirt is, for example, dust, residual glue, carbides, organic compounds (such as plastic, etc.), metal oxides (such as copper oxide, etc.), but is not limited to the above.

In the method of the present invention, the angle of the nozzle 200 can be adjusted by the transfer module of the cleaning device 20 so that the nozzle 200 is directly aligned with the gap between the carrier 10 and the electronic component 11 to remove dirt. (Such as carbides), and cleaning the underside of the electronic component 11 to increase the wettability, so that the fluidity of the adhesive material 14 in the subsequent steps can be avoided and voids caused by moisture absorption can be avoided.

As shown in Figures 2B to 2C, the detection module in the cleaning device 20 calculates the amount of dirt based on the image through the image capture and calculation functions such as the photosensitive coupling element (CCD), and can be calculated based on the image Knowing whether the dirt has been removed, after notifying the control device 23 that the dirt has been completely removed, the control device 23 will control the glue supplying device 21 to form the glue material 14 on the electronic component 11 with the glue filler 210 Between the conductive member 12 and the supporting member 10, the conductive material 12 is covered by the adhesive material 14. After that, the glued structure shown in FIG. 2C is moved to the placement area 22.

Therefore, in the method for forming a glue material according to the present invention, the design of the gluing device 2 is adopted, that is, the cleaning device 20 can be installed on the machine body 2a due to its small volume, so the objects after cleaning are completed The glue filling operation can be performed immediately (that is, there is no time difference between the plasma cleaning and the formation of the glue material), which greatly simplifies the manufacturing process and effectively shortens the processing time (because the cleaning operation and the filling operation are performed on the same machine without conveying time), and There is no need to add or make clamping fixtures, so the product cost can be greatly reduced, and damage to the electronic component 11 or the carrier 10 caused by the conventional manufacturing process can be avoided.

Furthermore, the cleaning operation and the filling operation of the present invention are performed on the same machine, so that after the objects are cleaned, the filling operation can be performed immediately, so that the electronic component 11 and the carrier 10 can be avoided due to waiting time. Oxidation of the circuit or metal materials over time.

In addition, in the gluing equipment 2 of the present invention, the cleaning device 20 can adjust the angle of the nozzle 200, so it can be aligned with the gap between the carrier 10 and the electronic component 11 for cleaning, so it is easy to clean the object to comply with Trend and demand for product miniaturization.

To sum up, the gluing equipment and the method for forming a glue material according to the present invention are provided on the same machine body 2a by the cleaning device 20 and the glue supplying device 21, so the process time can be saved, and the electronics can be reduced. Production cost of the product.

In addition, if the cleaning device adopts an atmospheric plasma type, the nozzle direction can be adjusted so that objects with small height and pitch of the solder bumps can be cleaned at different angles or positions to achieve a better Cleaning effect.

The above embodiments are used to exemplify the principle of the present invention and its effects, but not to limit the present invention. Anyone skilled in the art can modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be listed in the scope of patent application described later.

Claims (14)

    A gluing device includes: a machine body; a cleaning device provided on the machine body for cleaning the surface of an object; and a glue supplying device provided on the machine body for forming glue Material on the object.         The gluing equipment according to item 1 of the scope of patent application, wherein the cleaning device is a high-pressure fluid cleaning device or a plasma cleaning device.         The gluing equipment according to item 2 of the scope of the patent application, wherein the plasma cleaning device is an atmospheric plasma cleaning device.         As described in item 1 of the patent application scope, the gluing equipment includes a control device electrically connected to the machine body.         The gluing equipment according to item 1 of the scope of patent application, wherein the cleaning device includes a nozzle, a transfer module, and a detection module.         The gluing equipment according to item 1 of the scope of patent application, wherein the glue supplying device includes a glue filler, a transfer module, a storage module, and an extrusion module.         As described in item 1 of the scope of the patent application, the gluing equipment further includes a placement area provided on the machine body for placing the object after forming the glue material.         A method for forming a glue material, comprising: providing a gluing device as described in item 1 of the scope of patent application; cleaning the surface of an object by the cleaning device; and forming the glue material on the material by the glue supply device. Objects.         The method for forming a glue material according to item 8 of the scope of the patent application, wherein the cleaning device is a high-pressure fluid cleaning device or a plasma cleaning device.         The method for forming a glue material according to item 9 of the scope of the patent application, wherein the plasma cleaning device is an atmospheric plasma cleaning device.         According to the method for forming a glue material described in item 8 of the scope of patent application, wherein the gluing device further includes a control device electrically connected to the machine body.         The method for forming a glue material according to item 8 of the scope of patent application, wherein the cleaning device includes a nozzle, a transfer module, and a detection module.         The method for forming a rubber material according to item 8 of the scope of patent application, wherein the rubber supply device includes a rubber filler, a transfer module, a storage module, and an extrusion module.         According to the method for forming a glue material as described in item 8 of the scope of patent application, wherein the gluing equipment further includes a placement area provided on the machine body for placing objects after the glue material is formed.