TW201811139A - Leveling method of stuffing printing ink on printed circuit board and device thereof removing the ink adhered to the gyration band through solution impregnation gyration band - Google Patents
Leveling method of stuffing printing ink on printed circuit board and device thereof removing the ink adhered to the gyration band through solution impregnation gyration band Download PDFInfo
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- TW201811139A TW201811139A TW105123432A TW105123432A TW201811139A TW 201811139 A TW201811139 A TW 201811139A TW 105123432 A TW105123432 A TW 105123432A TW 105123432 A TW105123432 A TW 105123432A TW 201811139 A TW201811139 A TW 201811139A
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- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000007639 printing Methods 0.000 title claims abstract description 7
- 238000005470 impregnation Methods 0.000 title 1
- 238000004140 cleaning Methods 0.000 claims abstract description 28
- 239000002313 adhesive film Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 9
- 238000007790 scraping Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
本發明涉及印刷電路基板表面的塞孔油墨,特別有關一種印刷電路基板上塞孔油墨的整平方法及其裝置。 The invention relates to a plugging ink on the surface of a printed circuit board, and in particular, to a method and a device for leveling the plugging ink on a printed circuit board.
印刷電路基板(PCB)是由多層導電銅板與絕緣板複合而成,其中各層導電銅板皆各自形成有導電線路,透過絕緣板的居間隔絕,並且透過印刷電路基板表面所鑽設的多個埋孔與通孔,使多個埋孔與通孔在填充導電材料之後,能電連接各層導電線路而構成一機能迴路。 A printed circuit board (PCB) is a composite of a multilayer conductive copper plate and an insulating plate. Each layer of the conductive copper plate is formed with a conductive line, which is isolated through the intervening of the insulating plate and through a plurality of buried holes drilled on the surface of the printed circuit board And through holes, so that multiple buried holes and through holes can be electrically connected to each layer of conductive lines to form a functional circuit after being filled with a conductive material.
且知,在上述印刷電路基板的製程中,多個埋孔與通孔在鑽製形成之後,必須先進行絕緣處理。傳統的絕緣處理方式一般是採用網版印刷,將絕緣用的油墨塗佈於電路基板的雙端表面,使得該油墨能填塞進入各通孔與埋孔之內,隨後並利用刮刀與基板表面之間的相對移動式接觸動作,而使得油墨不但能填塞進入通孔與埋孔內之外,還能刮除印刷電路基板表面以及通孔和埋孔內多餘的油墨,以便於接續進行防焊油墨的印刷或噴塗處理。 It is also known that, in the above-mentioned manufacturing process of the printed circuit board, after the multiple buried holes and the through holes are drilled and formed, an insulation treatment must be performed first. The traditional insulation treatment method is generally screen printing. The insulating ink is coated on the double-end surface of the circuit substrate, so that the ink can be filled into the through holes and buried holes, and then the blade and the surface of the substrate are used. The relative moving contact action between them allows the ink not only to fill into the through-holes and buried holes, but also to scrape off the excess ink in the surface of the printed circuit board and the through-holes and buried holes, so as to facilitate the solder resist ink connection. Printing or spraying.
然而,上述油墨塞孔的作法,因要求塞孔之飽和度,油墨容易自通孔與埋孔中滲出,造成印刷電路基板的雙端表面發生溢墨現象,若接續覆蓋防焊油墨之方法為噴塗方式,該溢墨現象將會影響整體外觀以及良率。 However, the above-mentioned method of ink plugging, because the plug saturation is required, the ink is easy to ooze out of the through hole and the buried hole, causing the ink overflow phenomenon on the two end surfaces of the printed circuit board. If the method of continuously covering the solder resist ink is Spraying method, this ink overflow phenomenon will affect the overall appearance and yield.
為了克服上述困擾,已知台灣公告第M485589號專利案揭露一種印刷電路基板上塞孔油墨的整平裝置,其利用滾輪滾壓接觸膠膜,並藉由膠膜來壓觸已塗覆油墨的印 刷電路基板的雙端表面,使得印刷電路基板的雙端表面上以及通孔和埋孔內多餘的油墨,能經滾壓及沾粘於膠膜上而被帶離印刷電路基板的雙端表面,並藉此來提升油墨塞孔作業的良率。 In order to overcome the above-mentioned problems, a known Taiwan Patent Publication No. M485589 discloses a leveling device for plugging ink on a printed circuit board, which uses a roller to contact the adhesive film, and uses the adhesive film to press the coated ink. Seal Brushing the double-end surface of the circuit substrate allows the excess ink on the double-end surface of the printed circuit board and in the through holes and buried holes to be removed from the double-end surface of the printed circuit board by rolling and sticking to the adhesive film , And to improve the yield of ink plugging operations.
但是,由於上述專利技術中的膠膜繫屬必須拋棄之耗材,特別是當膠膜沾粘油墨之後,必須收集成捆而後丟棄,無法再次使用,以免膠膜上已沾附的油墨再去沾染到其他的印刷電路基板;導致需要經常更換新的膠膜,才能繼續實施上述沾黏暨整平的工序;如此一來,不但增加了膠膜之耗材成本,而且還耗費了膠膜的更換工時,亟待加以改進。 However, since the adhesive film in the above patented technology is a consumable that must be discarded, especially when the adhesive film is stuck with ink, it must be collected in a bundle and discarded. It cannot be reused, so as to prevent the ink already attached to the adhesive film from being contaminated. To other printed circuit boards; leading to the need to frequently replace the new adhesive film in order to continue the above-mentioned process of sticking and leveling; in this way, not only increases the cost of consumables for the adhesive film, but also consumes the replacement of the adhesive film It is urgent to improve.
有鑑於此,本發明之目的,旨在改善傳統用來沾粘油墨的膠膜無法再次使用,需要更換新的膠膜,方能繼續實施沾黏暨整平的工序,進而造成印刷電路基板表面油墨塞孔後的整平效率不佳的問題。 In view of this, the purpose of the present invention is to improve the traditional adhesive film used for sticking ink that cannot be reused. It needs to be replaced with a new adhesive film before the sticking and leveling process can be continued, thereby causing the surface of the printed circuit board. The problem of poor leveling efficiency after ink plugging.
為了實現上述目的並解決問題,本發明之一具體實施例乃在於提供一種印刷電路基板上塞孔油墨的整平方法,其技術手段包括:提供一迴旋帶於一迴圈路徑循環移動,該迴旋帶於迴圈路徑上依序循環式的執行一沾粘步驟及一清潔步驟;其中,該沾粘步驟包含該迴旋帶壓觸及沾粘該印刷電路基板之一表面上的塞孔油墨,該清潔步驟包含以一溶液清潔該迴旋帶上所沾附的油墨。 In order to achieve the above object and solve the problem, a specific embodiment of the present invention is to provide a method for leveling plugging ink on a printed circuit board. The technical method includes: providing a revolving belt to circulate on a loop path, and the revolving A sticking step and a cleaning step are sequentially performed in a circular manner on the loop path, wherein the sticking step includes the rotary tape pressure contacting the plugging ink on one surface of the printed circuit board, and the cleaning The step includes cleaning a contaminated ink on the gyro tape with a solution.
在進一步實施中,上述方法還包括:該迴旋帶係由圈狀的皮帶或膠膜構成。 In a further implementation, the above method further comprises: the convolute belt is composed of a loop-shaped belt or an adhesive film.
該印刷電路基板包含存在有塞孔油墨的兩相對表面,該整平方法包含執行於該印刷電路基板的兩相對表面。 The printed circuit substrate includes two opposite surfaces on which a pinhole ink exists. The leveling method includes performing two opposite surfaces of the printed circuit substrate.
該迴旋帶經由滾輪的施壓而壓觸及沾粘該印刷電路基板的表面。 The turning belt is pressed against the surface of the printed circuit board by pressure from the roller.
該迴旋帶係含浸於溶液中清潔油墨。 The convolute belt cleans the ink by immersion in a solution.
該清潔步驟還包含以至少一刮刀刮除該迴旋帶上所殘留的油墨。其中該刮刀係在該溶液清潔該迴旋帶上的油墨之後執行刮除油墨。 The cleaning step further includes scraping off the ink remaining on the rotating belt with at least one doctor blade. Wherein, the doctor blade scrapes the ink after the solution cleans the ink on the rotating belt.
上述方法可以透過一種裝置技術而獲得實現,為此,本發明之另一具體實施例乃在於提供一種印刷電路基板上塞孔油墨的整平裝置,其技術手段包括:一迴旋帶,佈建於一迴圈路徑上循環移動;一沾粘區站,坐落於該迴圈路徑上,該迴旋帶通過該沾粘區站而壓觸及沾粘該印刷電路基板之一表面上的塞孔油墨;及一清潔區站,該坐落於該迴圈路徑上並和該沾粘區站相互間隔,該清潔區站內存放有一溶液,所述通過該沾粘區站的迴旋帶接序接觸該溶液而清潔該迴旋帶上所沾附的油墨。 The above method can be implemented through a device technology. To this end, another specific embodiment of the present invention is to provide a leveling device for plugging ink on a printed circuit board. The technical means includes: a revolving belt, Cyclically moving on a loop path; a sticking zone station is located on the loop path, and the revolving belt passes through the sticking zone station and presses and touches the plugging ink on one surface of the printed circuit board; and A cleaning zone station, which is located on the loop path and spaced from the adhesion zone station. A solution is stored in the cleaning zone station, and the convoluted belt passing through the adhesion zone station contacts the solution in order to clean the Contaminated ink on the revolving belt.
在進一步實施中,上述裝置還包括:該迴旋帶係由圈狀的皮帶或膠膜構成。 In a further implementation, the above-mentioned device further comprises: the turning belt is composed of a loop-shaped belt or an adhesive film.
該印刷電路基板包含存在塞孔油墨的兩相對表面,該整平裝置數量為二,其分別配置於該印刷電路基板的兩相對表面的旁側。 The printed circuit board includes two opposite surfaces having a plugging ink, and the number of the leveling devices is two, which are respectively disposed beside the two opposite surfaces of the printed circuit board.
該迴圈路徑具有複數個間隔配置的滾輪,該迴旋帶係框持於複數個滾輪之間。所述複數個滾輪之中包含一壓輪,該迴旋帶經由所述壓輪的施壓,而壓觸及沾粘該印刷電路基板的表面。 The loop path has a plurality of rollers arranged at intervals, and the swing belt frame is held between the plurality of rollers. The plurality of rollers includes a pressure roller, and the rotating belt is pressed against the surface of the printed circuit board by pressure from the pressure roller.
該清潔區站包含配置一溶液槽,該溶液係存放於該溶液槽中。其中該迴旋帶經由所述複數個滾輪中至少一滾輪的導持而接觸該溶液槽中的溶液。 The cleaning station includes a solution tank, and the solution is stored in the solution tank. The convoluted belt contacts the solution in the solution tank through the guide of at least one of the plurality of rollers.
該清潔區站還包含配置至少一刮刀,用以接觸並刮除該迴旋帶上所殘留的油墨。其中該刮刀設於一擺臂上,該擺臂能旋擺帶動該刮刀接觸及遠離該迴旋帶。該刮刀係鄰近配置於溶液槽的上方。 The cleaning zone station further includes at least one scraper blade configured to contact and scrape the ink remaining on the revolving belt. The scraper is arranged on a swing arm, and the swing arm can swing to drive the scraper to contact and move away from the swing belt. The scraper is arranged above the solution tank adjacently.
該清潔區站還包含配置至少一刮刀,用以接觸並 刮除該迴旋帶上所殘留的油墨,且該刮刀的底部還配置有一集墨盤,用以收集刮刀所刮除的油墨。其中該刮刀設於一擺臂上,該擺臂能旋擺帶動該刮刀接觸及遠離該迴旋帶。 The cleaning zone station also includes at least one scraper for contacting and The ink remaining on the revolving belt is scraped off, and an ink set is arranged at the bottom of the scraper blade to collect the ink scraped off by the scraper blade. The scraper is arranged on a swing arm, and the swing arm can swing to drive the scraper to contact and move away from the swing belt.
根據上述技術手段,本發明所能產生的技術效果在於:藉由溶液含浸迴旋帶以清除迴旋帶上所沾附的油墨,再透過刮刀來刮除迴旋帶上還殘留的的油墨,使迴旋帶能重複用來沾粘印刷電路基板上的油墨,進而提升印刷電路基板上塞孔油墨的整平效率。 According to the above technical means, the technical effect that the present invention can produce is: impregnating the convolute belt with the solution to remove the ink attached to the convolute belt, and then scraping off the remaining ink on the convolute belt with a scraper to make the convolute belt. Can be used repeatedly to stick the ink on the printed circuit board, thereby improving the leveling efficiency of the plugged ink on the printed circuit board.
以上所述之方法與裝置之技術手段及其產生效能的具體實施細節,請參照下列實施例及圖式加以說明。 Please refer to the following embodiments and drawings for specific implementation details of the technical means of the methods and devices described above and their production efficiency.
10‧‧‧印刷電路基板 10‧‧‧printed circuit board
11‧‧‧表面 11‧‧‧ surface
111‧‧‧第一表面 111‧‧‧first surface
112‧‧‧第二表面 112‧‧‧Second surface
12‧‧‧傳動滾輪 12‧‧‧Drive roller
20‧‧‧迴旋帶 20‧‧‧ roundabout
201‧‧‧第一迴旋帶 201‧‧‧The first roundabout
202‧‧‧第一迴旋帶 202‧‧‧The first roundabout
30、30a‧‧‧滾輪 30, 30a‧‧‧roller
31‧‧‧壓輪 31‧‧‧Press roller
40‧‧‧沾粘區站 40‧‧‧Sticky Station
50‧‧‧清潔區站 50‧‧‧Clean District Station
51‧‧‧溶液 51‧‧‧ solution
52‧‧‧溶液槽 52‧‧‧solution tank
53‧‧‧刮刀 53‧‧‧Scraper
54‧‧‧擺臂 54‧‧‧ swing arm
55‧‧‧集墨盤 55‧‧‧set ink tray
S1至S3‧‧‧實施例之步驟說明 Steps of S1 to S3‧‧‧ embodiments
圖1是本發明之方法實施例的步驟流程圖;圖2是本發明之裝置實施例的配置示意圖;圖3是圖2中刮刀的另一實施例的配置示意圖。 FIG. 1 is a flowchart of steps of an embodiment of the method of the present invention; FIG. 2 is a schematic diagram of a configuration of an embodiment of the apparatus of the present invention; and FIG. 3 is a schematic diagram of a configuration of another embodiment of the scraper in FIG. 2.
請參閱圖1,說明本發明所提供印刷電路基板上塞孔油墨的整平方法,包括提供一迴旋帶20實施下列步驟S1至步驟S3: Please refer to FIG. 1 to describe a method for leveling plugging ink on a printed circuit board provided by the present invention, including providing a revolving belt 20 to perform the following steps S1 to S3:
步驟S1:循環移動。 Step S1: cyclic movement.
請參閱圖2,說明該迴旋帶20是佈建於印刷電路基板10的旁側,該迴旋帶20沿一迴圈路徑循環移動,該迴旋帶20能以線接觸或面接觸的方式來壓觸印刷電路基板10的表面11。進一步的說,該迴旋帶20是框持於相互間隔的多個滾輪30之間,該迴旋帶20是經由滾輪30的施壓而壓觸及沾粘該印刷電路基板10的表面11。 Please refer to FIG. 2, it is explained that the convolute belt 20 is laid on the side of the printed circuit board 10. The convolute belt 20 moves cyclically along a loop path. The convolute belt 20 can be pressed in a line contact or a surface contact manner. Surface 11 of the printed circuit board 10. Further, the turning belt 20 is framed between a plurality of rollers 30 spaced apart from each other. The turning belt 20 is pressed against the surface 11 of the printed circuit board 10 by the pressure of the roller 30.
步驟S2:沾粘油墨。 Step S2: Stick the ink.
請再次參閱圖2,說明該迴旋帶20壓觸印刷電路基板10之表面11進而沾粘該表面11上所附著的塞孔油墨。 進一步的說,該迴旋帶20能以線接觸或面接觸的方式來壓觸及沾粘印刷電路基板10之表面11上的塞孔油墨。 Please refer to FIG. 2 again, and explain that the convolute tape 20 presses against the surface 11 of the printed circuit board 10 and then sticks the plugging ink attached to the surface 11. Further, the convolute tape 20 can be used to contact the plugging ink on the surface 11 of the printed circuit board 10 by means of line contact or surface contact.
步驟S3:清潔油墨。 Step S3: Clean the ink.
請參閱圖2,說明該迴旋帶20是含浸於一溶液51中,藉由該溶液51清潔迴旋帶20上所沾附的油墨。進一步的說,該清潔步驟還包含至少一刮刀53,該刮刀53用以刮除該迴旋帶20之一側上所殘留的油墨,該刮刀53係在該溶液51清潔該迴旋帶20上的油墨之後執行刮除油墨的動作。此外,該迴旋帶20在執行上述清潔油墨的動作後沿迴圈路徑循環執行沾粘油墨及清潔油墨的動作。 Referring to FIG. 2, the convoluted belt 20 is immersed in a solution 51, and the ink adhered to the convoluted belt 20 is cleaned by the solution 51. Further, the cleaning step further includes at least one scraper blade 53 for scraping off ink remaining on one side of the revolving belt 20. The scraper 53 is based on the solution 51 and cleans the ink on the revolving belt 20. Thereafter, the ink scraping operation is performed. In addition, after performing the above-mentioned cleaning ink operation, the revolving belt 20 cyclically executes the operations of sticking ink and cleaning ink along a loop path.
另一方面,請再次參閱圖2,說明本發明還提供一種印刷電路基板上塞孔油墨的整平裝置,使上述印刷電路基板上塞孔油墨的整平方法可以容易地被實施。由上述可知該印刷電路基板上塞孔油墨的整平裝置,包括迴旋帶20、一沾粘區站40及一清潔區站50。其中:該印刷電路基板10在實施上是置放於多個間隔樞置的傳動滾輪12之間,該傳動滾輪12是導持於印刷電路基板10的雙側,使印刷電路基板10能沿垂直或水平的方向進行位移,進而對印刷電路基板10進行加工處理(例如塗佈油墨)。 On the other hand, referring to FIG. 2 again, the present invention also provides a device for leveling plugged ink on a printed circuit board, so that the method for leveling plugged ink on a printed circuit board can be easily implemented. It can be known from the above that the leveling device for plugging ink on the printed circuit board includes a revolving belt 20, a sticking area station 40 and a cleaning area station 50. Wherein, the printed circuit board 10 is placed between a plurality of spaced-apart driving rollers 12 which are guided on both sides of the printed circuit board 10 so that the printed circuit board 10 can be vertically aligned. Or, the printed circuit board 10 is processed (for example, ink is applied) by being displaced in a horizontal direction.
該迴旋帶20是框持於多個滾輪30之間而沿迴圈路徑循環移動。進一步的說,該迴旋帶20在實施上可由圈狀的皮帶或膠膜構成,所述多個滾輪30是以囓合或摩擦的方式來帶動該迴旋帶20移動。在具體實施上,該迴旋帶20和印刷電路基板10的表面11是以靜摩擦力相互接觸,也就是該迴旋帶20與印刷電路基板10的移動速度相同,使上述兩者間的相對速度為零,藉此迴旋帶20能與印刷電路基板10的表面11緊密接觸,進而提升迴旋帶20與印刷電路基板10接觸時所能壓粘而帶離的油墨效果。 The turning belt 20 is framed between a plurality of rollers 30 and cyclically moves along a loop path. Further, the turning belt 20 may be implemented by a loop-shaped belt or a rubber film. The plurality of rollers 30 move the turning belt 20 in a meshing or friction manner. In specific implementation, the rotating belt 20 and the surface 11 of the printed circuit board 10 contact each other with a static friction force, that is, the moving speed of the rotating belt 20 and the printed circuit board 10 is the same, so that the relative speed between the two is zero. Therefore, the convolute tape 20 can be in close contact with the surface 11 of the printed circuit board 10, thereby improving the ink effect that the convolute tape 20 can be pressure-bonded and peeled off when it contacts the printed circuit board 10.
該沾粘區站40是坐落於迴圈路徑上,該迴旋帶20於沾粘區站40內壓觸該印刷電路基板10之表面11,進而沾粘該印刷電路基板10之表面11上所附著的塞孔油墨,也就是說該迴旋帶20於沾粘區站40執行沾粘油墨的步驟。進一步的說,所述多個滾輪30之中包含有一壓輪31,該壓輪31是配置在印刷電路基板10移動路徑旁側,該迴旋帶20經由所述壓輪31的施壓,而壓觸及沾粘該印刷電路基板10的表面11。更具體的說,所述壓輪31可藉由彈簧或氣壓缸等驅動元件施力而對迴旋帶20進行施壓。 The adhesion zone station 40 is located on a loop path, and the convolute tape 20 presses against the surface 11 of the printed circuit board 10 in the adhesion zone station 40, and then adheres to the surface 11 of the printed circuit board 10 The plugging ink, that is, the convoluted belt 20 performs the step of sticking ink at the sticking zone station 40. Further, the plurality of rollers 30 includes a pressure roller 31. The pressure roller 31 is arranged beside the moving path of the printed circuit board 10. Touches the surface 11 of the printed circuit board 10. More specifically, the pressure roller 31 can apply pressure to the turning belt 20 by a spring or a driving element such as a pneumatic cylinder.
該清潔區站50是坐落於迴圈路徑上,該清潔區站50內配置有一溶液槽52,所述溶液51是裝填於溶液槽52內,該迴旋帶20是沿迴圈路徑循環移動而進入溶液槽52內接觸溶液51,也就是說該迴旋帶20於清潔區站50執行清潔油墨的步驟。進一步的說,所述多個滾輪30中的至少一滾輪30a是鄰近溶液槽52的上方,該迴旋帶20是經由滾輪30a的導持而沿迴圈路徑接觸該溶液槽52中的溶液51,該滾輪30a在實施上可作為驅動輪,用來驅動迴旋帶20沿迴圈路徑移動。 The cleaning zone station 50 is located on a loop path. A solution tank 52 is arranged in the cleaning zone station 50. The solution 51 is filled in the solution tank 52, and the swirling belt 20 is cyclically moved along the loop path to enter. The solution tank 52 is in contact with the solution 51, that is, the swirling belt 20 performs the step of cleaning the ink at the cleaning zone station 50. Further, at least one roller 30a of the plurality of rollers 30 is adjacent to above the solution tank 52, and the turning belt 20 contacts the solution 51 in the solution tank 52 along a loop path through the guide of the roller 30a. The roller 30a can be used as a driving wheel for driving the turning belt 20 to move along the loop path.
該刮刀53在實施上是配置在清潔區站50內,藉由刮刀53接觸並刮除該迴旋帶20上所殘留的油墨。進一步的說,該刮刀53是固定於一擺臂54上,該擺臂54能帶動刮刀53進行旋擺,使刮刀53接觸及遠離迴旋帶20,藉由刮刀53接觸迴旋帶20來刮除該迴旋帶20上所殘留的油墨。在具體實施上,該刮刀53的數量可為二,且所述二刮刀53是分別配置在迴旋帶20的相對側,藉由二刮刀53來刮除迴旋帶20上所沾附的油墨。 The scraper 53 is disposed in the cleaning zone station 50 in practice, and the ink remaining on the revolving belt 20 is scraped by the scraper 53 to contact and scrape. Further, the scraper 53 is fixed on a swing arm 54, and the swing arm 54 can drive the scraper 53 to swing, so that the scraper 53 contacts and moves away from the turning belt 20, and the scraper 53 contacts the turning belt 20 to scrape the scraper 53. The ink remaining on the convolute belt 20. In specific implementation, the number of the doctor blades 53 may be two, and the two doctor blades 53 are respectively disposed on opposite sides of the revolving belt 20, and the ink adhering to the revolving belt 20 is scraped off by the two doctor blades 53.
請再次參閱圖2,說明該刮刀53在實施上是鄰近配置於溶液槽52的上方,使刮刀53由迴旋帶20上刮除下來的油墨能集中到溶液槽52內,除了能便於回收油墨之外,還能避免地面或其他物件遭受到油墨的沾染。 Please refer to FIG. 2 again, and explain that the scraper 53 is disposed adjacent to the solution tank 52 in practice, so that the ink scraped off by the scraper 53 from the revolving belt 20 can be concentrated in the solution tank 52, in addition to facilitating the recovery of the ink. In addition, the floor or other objects can be protected from ink contamination.
請參閱圖3,說明該刮刀53的底部在實施上還可配置有一集墨盤55,該集墨盤55用來收集刮刀53由迴旋帶20上刮除下來的油墨,相較於上述刮刀53需要配置於溶液槽52之上方的實施例來說,本實施例中的刮刀53具有較大的配置空間。 Referring to FIG. 3, it is explained that the bottom of the scraper 53 can be further provided with an ink set 55 for collecting ink scraped off by the scraper 53 from the rotating belt 20. Compared with the scraper 53 described above, For the embodiment that needs to be arranged above the solution tank 52, the scraper 53 in this embodiment has a large arrangement space.
請參閱圖2,說明所述迴旋帶20在實施上包含有第一迴旋帶201及第二迴旋帶202,該第一迴旋帶201及第二迴旋帶202是分別配置於印刷電路基板10的兩相對表面11。進一步的說,該印刷電路基板10的兩相對表面11包含一第一表面111及一第二表面112,該第一迴旋帶201是用以接觸印刷電路基板10的第一表面111,該第二迴旋帶202是用以接觸印刷電路基板10的第二表面112。 Referring to FIG. 2, it is described that the convolute belt 20 includes a first convolute belt 201 and a second convolute belt 202 in practice. The first convolute belt 201 and the second convolute belt 202 are respectively disposed on two parts of the printed circuit board 10. Opposite surface 11. Further, two opposite surfaces 11 of the printed circuit substrate 10 include a first surface 111 and a second surface 112. The first turning belt 201 is used to contact the first surface 111 of the printed circuit substrate 10, and the second The turning belt 202 is used to contact the second surface 112 of the printed circuit board 10.
以上實施例僅為表達了本發明的較佳實施方式,但並不能因此而理解為對本發明專利範圍的限制。因此,本發明應以申請專利範圍中限定的請求項內容為準。 The above embodiments merely express the preferred embodiments of the present invention, but cannot be understood as limiting the scope of patents of the present invention. Therefore, the present invention shall be subject to the content of the claims defined in the scope of the patent application.
S1至S3‧‧‧實施例之步驟說明 Steps of S1 to S3‧‧‧ embodiments
Claims (19)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| TW105123432A TWI590728B (en) | 2016-07-25 | 2016-07-25 | Flattening method of plugging ink on printed circuit board and device thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105123432A TWI590728B (en) | 2016-07-25 | 2016-07-25 | Flattening method of plugging ink on printed circuit board and device thereof |
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| TWI590728B TWI590728B (en) | 2017-07-01 |
| TW201811139A true TW201811139A (en) | 2018-03-16 |
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| TWI720849B (en) * | 2020-03-17 | 2021-03-01 | 群翊工業股份有限公司 | Wet rolling equipment |
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| TWI695661B (en) * | 2019-01-10 | 2020-06-01 | 群翊工業股份有限公司 | Circuit board rolling device and method of use |
| CN114096066B (en) * | 2021-11-30 | 2022-11-11 | 深圳市中络电子有限公司 | Special jack air guide tool for integrated circuit |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI720849B (en) * | 2020-03-17 | 2021-03-01 | 群翊工業股份有限公司 | Wet rolling equipment |
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