TWI695661B - Circuit board rolling device and method of use - Google Patents
Circuit board rolling device and method of use Download PDFInfo
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- TWI695661B TWI695661B TW108101003A TW108101003A TWI695661B TW I695661 B TWI695661 B TW I695661B TW 108101003 A TW108101003 A TW 108101003A TW 108101003 A TW108101003 A TW 108101003A TW I695661 B TWI695661 B TW I695661B
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- roller
- scraper
- ink
- circuit board
- rolling device
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- 238000005096 rolling process Methods 0.000 title claims abstract description 82
- 238000000034 method Methods 0.000 title claims abstract description 15
- 239000012790 adhesive layer Substances 0.000 claims description 23
- 238000002360 preparation method Methods 0.000 claims description 14
- 238000007790 scraping Methods 0.000 claims description 10
- 239000010410 layer Substances 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 4
- 239000000976 ink Substances 0.000 description 79
- 229920003023 plastic Polymers 0.000 description 10
- 239000002985 plastic film Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coating Apparatus (AREA)
Abstract
本創作係一種電路板滾平裝置及其使用方法,該電路板滾平裝置包含一輸送軌道、一滾平組件、一上油墨清除裝置及一下油墨清除裝置,滾平組件包含有一上滾輪及一下滾輪,其分別設置於輸送軌道的上下兩側;上油墨清除裝置包含一上刮刀及一上承接盤,上刮刀貼靠於上滾輪,並可用以刮除沾黏於上滾輪上的油墨並使其向下落入上承接盤,下油墨清除裝置包含一下刮刀及一下承接盤,並其配置與上油墨清除裝置相對稱;本創作透過設置有上下刮刀,因此當上下滾輪上的油墨被刮除後,滾輪便可重新用以沾黏油墨,藉此省去使用拋棄式的油墨沾黏器具的必要。This creation is a circuit board rolling device and its use method. The circuit board rolling device includes a conveying track, a rolling component, an upper ink removal device and a lower ink removal device, and the rolling component includes an upper roller and a lower The rollers are respectively arranged on the upper and lower sides of the conveying track; the upper ink removal device includes an upper scraper and an upper receiving tray, the upper scraper is placed against the upper roller, and can be used to scrape off the ink adhering to the upper roller and make It falls into the upper receiving tray, the lower ink removal device includes a scraper and a lower receiving tray, and its configuration is symmetrical with the upper ink removal device; this creation is provided with an upper and lower scraper, so when the ink on the upper and lower rollers is scraped off , The roller can be used for sticking ink again, thereby eliminating the need to use disposable ink sticking equipment.
Description
本創作係涉及一種電路板的加工裝置,尤指一種可將電路板上多餘的防焊油墨壓合並清除之裝置。 This creation relates to a circuit board processing device, especially a device that can press and remove excess solder resist ink on the circuit board.
在電路板的加工領域中,如何清除電路板上多餘的防焊油墨是一項重要的技術;所謂多餘的防焊油墨,係指塗布在電路板上之塞孔周緣,用來防止電路短路的油墨;此些油墨在製程過程中很容易塞孔凸墨,屆時該些油墨便會由塞孔的兩側滲出,並在塞孔的端部形成圓弧狀的凸點,此些凸點便是電路板加工過程中必須滾平及去除的加工瑕疵。 In the field of circuit board processing, how to remove excess solder resist ink on the circuit board is an important technique; the so-called excess solder resist ink refers to the periphery of the plug hole coated on the circuit board to prevent short circuit Ink; these inks are easy to plug holes during the manufacturing process, then the ink will ooze from both sides of the plug holes, and arc-shaped bumps will be formed at the ends of the plug holes. It is a processing defect that must be rolled and removed during the processing of the circuit board.
請參閱圖8所示,而現有技術的電路板整平裝置,其係透過一輸送帶(圖中未示),將電路板91送進兩上下間隔設置的滾輪92之間;該兩滾輪92之間進一步設置有透明塑膠膜93,當滾輪92在轉動的同時,該些透明塑膠膜93也會順著滾輪92的滾動方向一同移動。
Please refer to FIG. 8, and the prior art circuit board leveling device, through a conveyor belt (not shown), the
當電路板91進入到該兩滾輪92之間時,其兩側面會同時受到透明塑膠膜93的貼合,再進一步受到該兩滾輪92的抵壓,因此當滾輪92抵壓電路板91的同時,也會將透明塑膠膜93一併貼合到電路板91的表面,此時透明塑膠膜93可將電路板表面的油墨94沾黏。
When the
接著,當電路板91繼續受滾輪92的推擠而離開該兩滾輪92時,透明塑膠膜93也會一併與電路板91相分離,進而將多出來的油墨94帶離電路板91,藉此達到清除電路板91表面多餘油墨94的目的。
Then, when the
然而,現有技術電路板整平裝置,因為大量仰賴拋棄式的透明塑膠膜來將多餘的油墨帶離電路板,因此在耗材的使用成本上十分龐大,同時大量使用透明塑膠膜對環境也具有負面的影響,因此現有技術的整平裝置有其缺陷存在。 However, the prior art circuit board leveling device relies heavily on disposable transparent plastic films to carry excess ink away from the circuit board, so the cost of using consumables is huge, and the large amount of transparent plastic films also has a negative impact on the environment The impact of the existing leveling device of the prior art has its shortcomings.
有鑒於現有技術的缺點及不足,本創作提供一種電路板滾平裝置及電路板滾平方法,其透過上下刮刀來達到刮除油墨之目的,因此便可避免使用消耗性的透明塑膠膜,藉此達到節省成本及保護環境之目的。 In view of the shortcomings and deficiencies of the prior art, the present invention provides a circuit board rolling device and circuit board rolling method, which achieves the purpose of scraping ink through the upper and lower scrapers, so that the use of consumable transparent plastic films can be avoided. This achieves the purpose of saving costs and protecting the environment.
為達上述之創作目的,本創作所採用的技術手段為一種電路板滾平裝置,其包含一輸送軌道,其沿一輸送方向地延伸,並其沿該輸送方向上的相對兩端分別為一前端及一後端;一滾平組件,其包含一上滾輪滾動裝置,其設置於該輸送軌道的上方;一上滾輪,其與該上滾輪滾動裝置相連接,並可受該上滾輪滾動裝置的帶動而相對該輸送軌道轉動;一下滾輪滾動裝置,其設置於該輸送軌道的下方;一下滾輪,其與該下滾輪滾動裝置相連接,並可受該下滾輪滾動裝置的帶動而相對該輸送軌道轉動,並該下滾輪與該上滾輪的位置相對應;一上油墨清除裝置,其鄰接於該上滾輪並包含一上刮刀,其選擇性地貼靠於該上滾輪的外環面,並可用以刮除沾黏於該上滾輪的外環面上的油墨; 一上承接盤,其設置於該上刮刀的下方,並可用以承接由該上刮刀刮除之油墨;一下油墨清除裝置,其鄰接於該下滾輪並包含一下刮刀,其選擇性地貼靠於該下滾輪的外環面,並可用以刮除沾黏於該下滾輪的外環面上的油墨;一下承接盤,其設置於該下刮刀的下方,並可用以承接由該下刮刀刮除之油墨。 In order to achieve the above-mentioned creative purpose, the technical means used in this creation is a circuit board rolling device, which includes a conveying track, which extends along a conveying direction, and its opposite ends in the conveying direction are respectively one Front end and a rear end; a rolling flat assembly, which includes an upper roller rolling device, which is arranged above the conveying track; an upper roller, which is connected with the upper roller rolling device and can be received by the upper roller rolling device Is driven to rotate relative to the conveying track; a roller rolling device is provided below the conveying track; a roller is connected to the lower roller rolling device and can be driven relative to the conveying by the lower roller rolling device The track rotates, and the lower roller corresponds to the position of the upper roller; an upper ink removal device, which is adjacent to the upper roller and contains an upper scraper, which selectively abuts the outer ring surface of the upper roller, and It can be used to scrape off the ink sticking to the outer ring surface of the upper roller; An upper receiving tray, which is arranged below the upper scraper, and can be used to receive the ink scraped by the upper scraper; a lower ink removal device, which is adjacent to the lower roller and contains a lower scraper, which is selectively attached to The outer ring surface of the lower roller can be used to scrape the ink adhering to the outer ring surface of the lower roller; a lower receiving tray is arranged below the lower scraper and can be used to receive scraping by the lower scraper Of ink.
為達上述之創作目的,本創作所採用的技術手段為一種電路板滾平裝置,其包含一輸送軌道,其沿一輸送方向地延伸,並其相對兩端分別為一前端及一後端;一滾平裝置,其包含一上滾輪滾動裝置,其設置於該輸送軌道的上方;一上滾輪,其與該上滾輪滾動裝置相連接,並可受該上滾輪滾動裝置的帶動而相對該輸送軌道轉動;一下滾輪滾動裝置,其設置於該輸送軌道的下方;一下滾輪,其與該下滾輪滾動裝置相連接,並可受該下滾輪滾動裝置的帶動而相對該輸送軌道轉動,並該下滾輪與該上滾輪的位置相對應;一油墨清除裝置,其鄰接於該上滾輪或該下滾輪,並該油墨清除裝置包含一刮刀,其選擇性地貼靠於該上滾輪的外環面或該下滾輪的外環面,並可用以刮除沾黏於該上滾輪的外環面或該下滾輪的外環面上的油墨;一承接盤,其設置於該刮刀的下方,並可用以承接由該刮刀刮除之油墨。 In order to achieve the above-mentioned creative purpose, the technical means used in this creation is a circuit board rolling device, which includes a conveying track, which extends in a conveying direction, and its opposite ends are a front end and a rear end, respectively; A rolling device, which includes an upper roller rolling device, which is arranged above the conveying track; an upper roller, which is connected to the upper roller rolling device and can be driven by the upper roller rolling device relative to the conveyor Orbital rotation; one-roller rolling device, which is arranged below the conveying track; one-roller, which is connected to the lower roller rolling device, and can be driven by the lower roller rolling device to rotate relative to the conveying track, and the lower The roller corresponds to the position of the upper roller; an ink removal device adjacent to the upper roller or the lower roller, and the ink removal device includes a scraper that selectively abuts the outer ring surface of the upper roller or The outer ring surface of the lower roller, and can be used to scrape the ink adhering to the outer ring surface of the upper roller or the outer ring surface of the lower roller; a receiving tray, which is arranged under the scraper and can be used Accept the ink scraped by the scraper.
為達上述之創作目的,本創作所採用的技術手段為一種電路板滾平方法,其包含以下步驟:準備步驟:準備一輸送軌道、一上滾輪、一下滾輪、一上刮刀及一下刮刀,該上滾輪及該下滾輪分別設置於該輸送軌道的上方及下方,該上刮刀及該下刮刀分別設置於該輸送軌道的上方及下方;壓合步驟:放置一電路板於該輸送軌道上,該電路板受該輸送軌道的驅動而朝向該上滾輪及該下滾輪之間移動,該上滾輪及該下滾輪分別朝向相反方向轉動,進而擠壓該電路板,並該電路板上多餘之油墨分別沾黏至該上滾輪及該下滾輪上;刮除步驟:沾黏有油墨的該上滾輪及該下滾輪持續轉動,並分別貼靠於該上刮刀及該下刮刀,該上刮刀及該下刮刀持續貼靠該上滾輪及該下滾輪,並將設置於該上滾輪及該下滾輪上的油墨刮除。 In order to achieve the above-mentioned creative purpose, the technical method used in this creation is a circuit board rolling method, which includes the following steps: preparation steps: preparing a conveyor track, an upper roller, a lower roller, an upper scraper and a scraper, the The upper roller and the lower roller are respectively arranged above and below the conveying track, and the upper scraper and the lower scraper are respectively arranged above and below the conveying track; pressing step: placing a circuit board on the conveying track, the The circuit board is driven by the conveying track to move between the upper roller and the lower roller, and the upper roller and the lower roller rotate in opposite directions respectively, thereby squeezing the circuit board, and the excess ink on the circuit board respectively Sticking to the upper roller and the lower roller; scraping step: the upper roller and the lower roller which have been stuck with ink continue to rotate, and are attached to the upper scraper and the lower scraper, the upper scraper and the lower, respectively The squeegee keeps abutting on the upper roller and the lower roller, and scrapes off the ink provided on the upper roller and the lower roller.
本創作的優點在於,透過設置有該上油墨清除裝置以及該下油墨清除裝置,當上滾輪及下滾輪在抵壓電路板並進一步將電路板上的油墨沾黏至上滾輪及下滾輪上後,在持續轉動下,與上滾輪及下滾輪分別接觸的上刮刀及下刮刀會進而將沾黏於上滾輪及下滾輪的油墨刮除,而刮除後的油墨會落入設置於該兩刮刀下方的承接盤;換言之,油墨分別被上刮刀及下刮刀刮除的上滾輪及下滾輪便可持續轉動;本創作透過前述之加工結構及方法,使整個清除電路板油墨的加工流程不需要用到任何的拋棄式沾黏材料,藉此節省整個油墨清除過程的加工成本。 The advantage of this creation is that, by providing the upper ink removal device and the lower ink removal device, when the upper roller and the lower roller are pressed against the circuit board and the ink on the circuit board is further adhered to the upper roller and the lower roller , Under continuous rotation, the upper and lower scrapers in contact with the upper and lower rollers, respectively, will then scrape the ink adhering to the upper and lower rollers, and the scraped ink will fall into the two scrapers The lower receiving tray; in other words, the upper roller and the lower roller that the ink is scraped by the upper blade and the lower blade, respectively, can continue to rotate; this creation uses the aforementioned processing structure and method to make the entire process of removing circuit board ink unnecessary To any disposable sticky material, thereby saving the processing cost of the entire ink removal process.
進一步而言,前述之電路板滾平裝置,其中該滾平組件進一步包含有一移動動力裝置,其與該上滾輪相連接,並可驅動該上滾輪相對該輸送軌道上下移動。 Further, in the aforementioned circuit board rolling device, the rolling device further includes a moving power device connected to the upper roller and driving the upper roller to move up and down relative to the conveying track.
進一步而言,前述之電路板滾平裝置,其中該移動動力裝置為一氣缸。 Further, in the aforementioned circuit board rolling device, the mobile power device is a cylinder.
進一步而言,前述之電路板滾平裝置,其中該上油墨清除裝置的該上刮刀貼靠於該上滾輪之處係介於該上滾輪的最底端及該上滾輪沿該輸送方向的最前端之間。 Further, in the aforementioned circuit board rolling device, wherein the upper scraper of the upper ink removing device abuts on the upper roller is between the lowermost end of the upper roller and the uppermost of the upper roller in the conveying direction Between the front end.
進一步而言,前述之電路板滾平裝置,其中該下油墨清除裝置的該下刮刀貼靠於該下滾輪之處係介於該下滾輪的最底端及該下滾輪沿該輸送方向的最後端之間。 Further, in the aforementioned circuit board rolling device, wherein the lower scraper of the lower ink removing device abuts on the lower roller is between the lowermost end of the lower roller and the last of the lower roller in the conveying direction Between the ends.
進一步而言,前述之電路板滾平裝置,其中該上承接盤上設有一黏性層,其用以承接由該上刮刀刮除之油墨。 Further, in the aforementioned circuit board rolling device, an adhesive layer is provided on the upper receiving plate to receive the ink scraped off by the upper scraper.
進一步而言,前述之電路板滾平裝置,其中該上油墨清除裝置進一步包含有一上刮刀動力裝置,其與該上刮刀相連接,並該上刮刀動力裝置可驅動該上刮刀相對該上滾輪移動,以使該上刮刀貼靠或遠離該上滾輪。 Further, the aforementioned circuit board rolling device, wherein the upper ink removal device further includes an upper scraper power device connected to the upper scraper, and the upper scraper power device can drive the upper scraper to move relative to the upper roller To make the upper scraper abut or move away from the upper roller.
進一步而言,前述之電路板滾平方法,其中於該準備步驟中,可根據該電路板的厚度上下位移該上滾輪。 Further, in the aforementioned circuit board rolling method, in the preparation step, the upper roller can be displaced up and down according to the thickness of the circuit board.
進一步而言,前述之電路板滾平方法,其中:於該準備步驟中,進一步包含有一上承接盤及一下承接盤,該上承接盤上設有一黏性層,該下承接盤上設有一黏性層;於該刮除步驟中,使該上承接盤的該黏性層承接該上滾輪上被該上刮刀刮除掉落的油墨,使該下承接盤的該黏性層承接該下滾輪上被該下刮刀刮除掉落的油墨。 Further, the aforementioned circuit board rolling method, wherein: in the preparation step, it further includes an upper receiving tray and a lower receiving tray, an adhesive layer is provided on the upper receiving tray, and an adhesive layer is provided on the lower receiving tray In the scraping step, the viscous layer of the upper receiving tray receives the ink that is scraped off by the upper scraper on the upper roller, so that the viscous layer of the lower receiving tray receives the lower roller The upper scraper scrapes off the fallen ink.
10:輸送軌道 10: conveyor track
11:前端 11: front end
12:後端 12: backend
20:滾平組件 20: Roll off the assembly
21:上滾輪 21: Upper roller
22:下滾輪 22: Lower roller
23:移動動力裝置 23: mobile power plant
24:上滾輪滾動裝置 24: Upper roller rolling device
25:下滾輪滾動裝置 25: Lower roller rolling device
30:上油墨清除裝置 30: Ink removal device
31:上刮刀 31: Upper scraper
32:上承接盤 32: upper receiving tray
33:黏性層 33: sticky layer
34:上刮刀動力裝置 34: Upper scraper power unit
40:下油墨清除裝置 40: Lower ink removal device
41:下刮刀 41: Lower scraper
42:下承接盤 42: Under the tray
43:黏性層 43: sticky layer
44:下刮刀動力裝置 44: Lower scraper power unit
91:電路板 91: Circuit board
92:滾輪 92: Wheel
93:透明塑膠膜 93: Transparent plastic film
94:油墨 94: Ink
21A:上滾輪 21A: Upper roller
22A:下滾輪 22A: Lower roller
31A:上刮刀 31A: Upper scraper
41A:下刮刀 41A: Lower scraper
91A:電路板 91A: Circuit board
L:輸送方向 L: conveying direction
圖1係本創作之立體外觀圖。 Figure 1 is the stereoscopic appearance of this creation.
圖2係本創作滾平裝置、上油墨清除裝置以及下油墨清除裝置之立體圖。 FIG. 2 is a perspective view of the original rolling device, upper ink removal device, and lower ink removal device.
圖3係圖2之部分元件分解圖。 FIG. 3 is an exploded view of some components of FIG. 2.
圖4係本創作與一電路板之使用狀態剖面圖。 Fig. 4 is a cross-sectional view of the original creation and the use state of a circuit board.
圖5係圖4的A部分的放大圖。 FIG. 5 is an enlarged view of part A of FIG. 4.
圖6係本創作調整上滾輪高度之動作示意圖。 Figure 6 is a schematic diagram of the movement of adjusting the height of the upper roller in this creation.
圖7係本創作更換上下滾輪並調整上刮刀及下刮刀位置之動作示意圖。 Fig. 7 is a schematic diagram of the operation of replacing the upper and lower rollers and adjusting the positions of the upper and lower scrapers.
圖8係現有技術之電路板整平裝置之示意圖。 8 is a schematic diagram of a prior art circuit board leveling device.
以下配合圖式以及本創作之較佳實施例,進一步闡述本創作為達成預定創作目的所採取的技術特徵。 The technical features adopted by this creation in order to achieve the intended purpose of creation are further described below in conjunction with the drawings and preferred embodiments of the creation.
請參閱圖1所示,本創作之電路板滾平裝置包含有一輸送軌道10、一滾平組件20及至少一油墨清除裝置。
Please refer to FIG. 1, the circuit board rolling device of the present invention includes a
輸送軌道10沿一輸送方向L延伸,並其沿輸送方向L的相對兩端分別為一前端11及一後端12。
The conveying
請參閱圖1及圖2所示,滾平組件20包含有一上滾輪21、一下滾輪22、一移動動力裝置23、一上滾輪滾動裝置24及一下滾輪滾動裝置25,上滾輪21及上滾輪滾動裝置24設置於輸送軌道10的上方,並上滾輪滾動裝置24可帶動上滾輪21相對輸送軌道10轉動,下滾輪22及下滾輪滾動裝置25設置於輸送軌道10的下方,並下滾輪滾動裝置25可帶動下滾輪22相對輸送軌道10轉動,並本主要實施例中,上滾輪21及下滾輪22的位置上下對應,並且在運轉時,上滾輪21及下滾輪22係沿相反地方向相對輸送軌道10轉動,使夾設於上滾輪21及下滾輪22之間的物體得以沿該輸送方向L地朝向輸送軌道10的前端11推動。
Please refer to FIG. 1 and FIG. 2, the rolling
另一方面,本主要實施例中,上滾輪滾動裝置24及下滾輪滾動裝置25分別為一馬達,但其不以此為限,於其他實施例中,上滾輪滾動裝置24及下滾輪滾動裝置25亦可為其他動力裝置。
On the other hand, in this main embodiment, the upper
本主要實施例中,上滾輪21及下滾輪22的表面材質皆為橡膠,該橡膠的材質可用以沾黏電路板上之油墨,但上滾輪21及下滾輪22的表面材質不以橡膠為限。
In this main embodiment, the surface materials of the
請參閱圖1及圖6所示,移動動力裝置23與上滾輪21相連接,並可驅動上滾輪21相對輸送軌道10上下移動,本主要實施例中,該移動動力裝置23為一氣缸,但其不以氣缸為限。
Please refer to FIG. 1 and FIG. 6, the
請參閱圖2及圖3所示,本主要實施例中,至少一油墨清除裝置的數量為兩個,且可進一步分為上油墨清除裝置30及一下油墨清除裝置40,但其不以此為限,於其他實施例中,亦可只有單一油墨清除裝置。
Please refer to FIG. 2 and FIG. 3, in this main embodiment, the number of at least one ink removal device is two, and can be further divided into an upper
上油墨清除裝置30鄰接於上滾輪21並包含一上刮刀31、一上承接盤32、一黏性層33及一上刮刀動力裝置34。
The upper
請參閱圖1、圖2及圖3所示,上刮刀31選擇性地貼靠於上滾輪21的外環面,並可用以刮除沾黏於上滾輪21的外環面上的油墨,本主要實施例中,上刮刀31貼靠於上滾輪21上的位置係介於上滾輪21的最底端及上滾輪21沿輸送方向L的最前端之間,換言之,該上刮刀31的位置係介於該上滾輪靠近前端11並靠近下方的四分之一圓中,並本主要實施例中,該上刮刀31係設置於上滾輪21沿輸送方向L的最前端,但其位置不以此為限。
Please refer to FIG. 1, FIG. 2 and FIG. 3, the
請進一步參閱圖4所示,上承接盤32設置於上刮刀31的下方,並可用以承接由上刮刀31刮除之油墨,並本主要實施例中,該黏性層33設置於上承接盤32內,當上刮刀31將油墨刮除後,該些油墨會落入上承接盤32內並受到黏性層33的黏合固定,但於其他實施例中,上承接盤32亦可沒有該黏性層33。
Please further refer to FIG. 4, the upper receiving
本主要實施例中,該黏性層33為一PVC膜,但其不以此為限,於其他實施例中,黏性層33亦可透過其他材質製成,僅要其具有黏性即可。
In this main embodiment, the
請參閱圖3及圖5所示,上刮刀動力裝置34與上刮刀31相連接,並上刮刀動力裝置34可驅動上刮刀31相對上滾輪21移動,以使上刮刀31貼靠或遠離上滾輪21,但在其他實施例中,亦可沒有上刮刀動力裝置34,於該些實施例中,上刮刀31亦可透過手動來調整其與該上滾輪21之間的相對位置。
Please refer to FIG. 3 and FIG. 5, the upper
請參閱圖2及圖3所示,下油墨清除裝置40鄰接於下滾輪22並包含一下刮刀41、一下承接盤42、一黏性層43及一下刮刀動力裝置44。
2 and FIG. 3, the lower
請進一步參閱圖4所示,下刮刀41選擇性地貼靠於下滾輪22的外環面,並可用以刮除沾黏於下滾輪22的外環面上的油墨,本主要實施例中,下刮刀41貼靠於下滾輪22上的位置係介於下滾輪22的最底端及下滾輪22沿輸送方向L的最後端之間,換言之,該下刮刀41的位置係介於該下滾輪靠近後端12並靠近下方的四分之一圓中,並本主要實施例中,該下刮刀41係設置於下滾輪22的該四分之一圓的中間,但其位置不以此為限。
Please further refer to FIG. 4, the
下承接盤42設置於下刮刀41的下方,並可用以承接由下刮刀41刮除之油墨,並本主要實施例中,下油墨清除裝置40的黏性層43設置於下承接盤42內,當下刮刀41將油墨刮除後,該些油墨會落入下承接盤42內並受到黏性層43的黏合固定,但於其他實施例中,下承接盤42亦可沒有該黏性層43。
The
本主要實施例中,該黏性層43為一PVC膜,但其不以此為限,於其他實施例中,黏性層43亦可透過其他材質製成,僅要其具有黏性即可。
In this main embodiment, the
下刮刀動力裝置44與下刮刀41相連接,並下刮刀動力裝置44可驅動下刮刀41相對下滾輪22移動,並使下刮刀41貼靠或遠離下滾輪22,但在其他實施例中,亦可沒有下刮刀動力裝置44,於該些實施例中,下刮刀41亦可透過手動來調整其與該下滾輪22之間的相對位置。
The lower
於本創作的另一實施例中,其與本創作之主要實施例大致相同,但該另一實施例僅具有一油墨清除裝置,而該油墨清除裝置可依使用者需求地鄰接於上滾輪或下滾輪,並該油墨清除裝置包含有一刮刀及一承接盤,該刮刀及承接盤的結構及功能皆與本創作主要實施例中的上刮刀31及上承接盤32相同,並該刮刀可依使用者需求貼靠於上滾輪的外環面或下滾輪的外環面,而該承接盤則設置於該刮刀的下方。
In another embodiment of the present creation, it is substantially the same as the main embodiment of the present creation, but the other embodiment only has an ink removal device, and the ink removal device can be adjacent to the upper roller or The lower roller, and the ink removal device includes a scraper and a receiving plate, the structure and function of the scraper and receiving plate are the same as the
請參閱圖7所示,於本創作的又一實施例中,使用者亦可透過更換不同尺寸的上滾輪21A及下滾輪22A來對應的不同尺寸的電路板91A,並在此又一實施例中,由於上滾輪21A及下滾輪22A的尺寸已變動,因此上刮刀31A及下刮刀41A與上滾輪21A及下滾輪22A之間的距離也應當進行相對應的調整,進而使上刮刀31A及下刮刀41A與滾輪21A、22A維持在最佳的刮除位置。
Please refer to FIG. 7, in another embodiment of the present creation, the user can also replace the different size of the
以下為電路板滾平裝置的使用方法。 The following is how to use the circuit board rolling device.
本創作的主要實施例在使用時,係將兩組本創作合併使用,以提高油墨清除之效率,然而,由於兩組本創作並不需要具有兩組獨立的輸送軌道10,因此在本主要實施例中,該兩組本創作係共用一組輸送軌道10。
When the main embodiment of this creation is used, two sets of this creation are used in combination to improve the efficiency of ink removal. However, since the two sets of this creation do not need to have two independent conveying
本電路板使用方法包含有一準備步驟、一壓合步驟及一刮除步驟,以下依序闡述各該步驟之細節。 The method of using the circuit board includes a preparation step, a pressing step and a scraping step. The details of each step are explained in order below.
準備步驟:請參閱圖1及圖4所示,準備一輸送軌道10、一上滾輪21、一下滾輪22、一上刮刀31及一下刮刀41,上滾輪21及下滾輪22分別設置於輸送軌道10的上方及下方,上刮刀31及下刮刀41分別設置於輸送軌道10的上方及下方;本準備步驟中之所有元件,皆與本創作之電路板滾平裝置所提及的相關結構相同,因此於此不再贅述,但本準備步驟中的元件不以與前述電路板滾平裝置的元件完全相同為限。
Preparation steps: Please refer to FIG. 1 and FIG. 4, prepare a conveying
請進一步參閱圖6所示,於本準備步驟中,使用者可根據待加工的電路板91的厚度來上下移動上滾輪21相對於輸送軌道10的距離,藉此調整電路板91受上滾輪21及下滾輪22夾設的間距。
Please refer to FIG. 6 further. In this preparation step, the user can move the distance of the
更精確地說,本準備步驟亦可進一步包含有一上承接盤32及一下承接盤42,上承接盤32上設有一黏性層33,而下承接盤42上設有一黏性層43,本準備步驟之承接盤32、42以及黏性層33、43分別與前述之電路板滾平裝置所提及的相關結構相同,因此於此不再贅述。
More precisely, this preparation step may further include an
壓合步驟:請參閱圖1、圖4及圖5所示,放置一電路板91於輸送軌道10上,電路板91受到輸送軌道10的驅動而可沿輸送方向L朝向上滾輪21及下滾輪22之間移動;當電路板91移動至上滾輪21及下滾輪22之間後,由於上滾輪21及下滾輪22分別朝向相反方向轉動,因此可進一步對電路板91同時進行抵壓以及沿輸送方向L向前推動之力量。
Pressing step: Please refer to FIG. 1, FIG. 4 and FIG. 5, a
當上滾輪21及下滾輪22擠壓電路板91後,電路板91上多餘的油墨94便可因此沾黏至上滾輪21及下滾輪22上,更精確地說,由於上滾輪21及下滾輪22的材質為略為具有彈性之橡膠,因此當電路板91被略為壓迫後,油墨94便可因壓力,轉而沾黏至上滾輪21及下滾輪22上。
When the
刮除步驟:請參閱圖5及圖6所示,沾黏有油墨94的上滾輪21及下滾輪22持續轉動,並分別貼靠於上刮刀31及下刮刀41,當上刮刀31及下刮刀41持續貼靠該兩滾輪21、22的情況下,上滾輪21及下滾輪22上沾黏有油墨94的區域便會逐漸靠近該上刮刀31及該下刮刀41,進而受到上刮刀31及下刮刀41的刮除,使油墨94由上刮刀31及下刮刀41上被刮除。
Scraping step: Please refer to FIG. 5 and FIG. 6, the
更精確地說,由於在準備步驟中,上承接盤32及下承接盤42上分別設置有黏性層33、43,因此當受刮除的油墨94落至相對應的上承接盤32或
下承接盤42後,便會被該兩黏性層33、43所沾黏,藉此油墨94便不會隨意濺灑。
More precisely, because in the preparation step, the upper receiving
而當黏性層33、43上沾黏了過多的油墨94後,使用者亦可透過更換黏性層33、43來維持其黏性。
After the ink layers 94 and 43 are adhered with too
以下為本創作之優點。 The following are the advantages of creation.
本創作在使用時,由於在沾黏油墨94的步驟不需要使用到拋棄式的材質,而是可透過上滾輪21及下滾輪22直接進行沾黏,並後續透過上刮刀31及下刮刀41的操作而將油墨從上滾輪21及下滾輪31上刮除;換言之,油墨94被刮除後的上滾輪21及下滾輪22在持續轉動下,便可繼續作為沾黏油墨94之工具,因此本創作可不必利用拋棄式的油墨沾黏設備,並可利用滾輪本身來達到重複沾黏油墨之目的,因此可有效降低本創作在使用上之成本。
When this creation is used, since the step of sticking
以上所述僅是本創作之較佳實施例而已,並非對本創作做任何形式上的限制,雖然本創作已以較佳實施例揭露如上,然而並非用以限定本創作,任何所屬技術領域中具有通常知識者,在不脫離本創作技術方案的範圍內,當可利用上述揭示的技術內容作出些許更動或修飾做為等同變化的等效實施例,但凡是未脫離本創作技術方案的內容,依據本創作的技術實質對以上實施例所做的任何簡單修改、等同變化與修飾,均仍屬於本創作技術方案的範圍內。 The above is only the preferred embodiment of the creation, and does not limit the creation in any way. Although the creation has been disclosed in the preferred embodiment as above, it is not intended to limit the creation. Generally, a knowledgeable person can use the technical content disclosed above to make some changes or modifications as an equivalent embodiment of an equivalent change without departing from the scope of this creative technical solution. Any simple modifications, equivalent changes, and modifications made to the above embodiments by the technical essence of this creation still fall within the scope of this creative technical solution.
10:輸送軌道 10: conveyor track
11:前端 11: front end
12:後端 12: backend
20:滾平組件 20: Roll off the assembly
21:上滾輪 21: Upper roller
22:下滾輪 22: Lower roller
23:移動動力裝置 23: mobile power plant
24:上滾輪滾動裝置 24: Upper roller rolling device
25:下滾輪滾動裝置 25: Lower roller rolling device
L:輸送方向 L: conveying direction
Claims (11)
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| Application Number | Priority Date | Filing Date | Title |
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| TW108101003A TWI695661B (en) | 2019-01-10 | 2019-01-10 | Circuit board rolling device and method of use |
| CN201910031160.5A CN111432570B (en) | 2019-01-10 | 2019-01-14 | Circuit board rolling device and method of use thereof |
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| TW108101003A TWI695661B (en) | 2019-01-10 | 2019-01-10 | Circuit board rolling device and method of use |
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| TWI695661B true TWI695661B (en) | 2020-06-01 |
| TW202027573A TW202027573A (en) | 2020-07-16 |
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| CN113784525B (en) * | 2021-11-10 | 2022-02-15 | 四川英创力电子科技股份有限公司 | Printed circuit board printing ink flattening device |
| CN115701820A (en) * | 2022-11-04 | 2023-02-14 | 湖南三兴精密工业股份有限公司 | A circuit board ink cleaning device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200518656A (en) * | 2004-10-28 | 2005-06-01 | Pu-Chang Yeh | Method and device of scraper for stuffing printing ink into aperture on the printed circuit board |
| TWI590728B (en) * | 2016-07-25 | 2017-07-01 | Asia Neo Tech Industrial Co Ltd | Flattening method of plugging ink on printed circuit board and device thereof |
| TWM578061U (en) * | 2019-01-10 | 2019-05-11 | 群翊工業股份有限公司 | Circuit board rolling and flattening device |
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| CN205847733U (en) * | 2016-06-07 | 2016-12-28 | 深圳市正基电子有限公司 | A kind of circuit board ink apparatus for leveling |
| CN107660075B (en) * | 2016-07-25 | 2020-03-10 | 科峤工业股份有限公司 | Leveling method and device for hole plugging ink on printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200518656A (en) * | 2004-10-28 | 2005-06-01 | Pu-Chang Yeh | Method and device of scraper for stuffing printing ink into aperture on the printed circuit board |
| TWI590728B (en) * | 2016-07-25 | 2017-07-01 | Asia Neo Tech Industrial Co Ltd | Flattening method of plugging ink on printed circuit board and device thereof |
| TWM578061U (en) * | 2019-01-10 | 2019-05-11 | 群翊工業股份有限公司 | Circuit board rolling and flattening device |
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