TW201810501A - Handler and inspection apparatus - Google Patents
Handler and inspection apparatus Download PDFInfo
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- TW201810501A TW201810501A TW106125913A TW106125913A TW201810501A TW 201810501 A TW201810501 A TW 201810501A TW 106125913 A TW106125913 A TW 106125913A TW 106125913 A TW106125913 A TW 106125913A TW 201810501 A TW201810501 A TW 201810501A
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- moving mechanism
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- 238000007689 inspection Methods 0.000 title description 190
- 230000007246 mechanism Effects 0.000 claims description 265
- 230000033001 locomotion Effects 0.000 claims description 48
- 230000008859 change Effects 0.000 abstract description 12
- 239000011295 pitch Substances 0.000 description 26
- 238000011084 recovery Methods 0.000 description 24
- 238000004064 recycling Methods 0.000 description 17
- 238000000034 method Methods 0.000 description 16
- 230000006870 function Effects 0.000 description 14
- 230000005540 biological transmission Effects 0.000 description 13
- 238000000926 separation method Methods 0.000 description 13
- 238000012546 transfer Methods 0.000 description 11
- 239000000523 sample Substances 0.000 description 8
- 238000001514 detection method Methods 0.000 description 7
- 239000011159 matrix material Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
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- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
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- 238000006073 displacement reaction Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
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- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
本發明係關於一種處理器及檢查裝置。The invention relates to a processor and an inspection device.
自先前以來,已知有一種檢查例如IC(Integrated Circuit,積體電路)元件等電子零件之電氣特性之檢查裝置。 此種檢查裝置係以將電子零件自供給托盤供給至檢查部,對供給至檢查部之電子零件之電氣特性進行檢查,於該檢查結束後,將電子零件自檢查部回收至回收托盤中之方式構成。又,收納於供給托盤中之電子零件臨時轉移至梭子上,再藉由梭子搬送至檢查部附近。於梭子上,設置有形成有凹穴(pocket)之托盤,於該凹穴中收納電子零件。 自供給托盤向托盤之電子零件之搬送係藉由供給機器人而執行。供給機器人具有複數個吸附嘴,利用各吸附嘴吸附保持供給托盤之凹穴內之電子零件,於將所保持之電子零件轉移至托盤之凹穴中之後,釋放該電子零件,藉此自供給托盤向托盤搬送電子零件。作為此種供給機器人,已知有例如如專利文獻1中所記載之供給機器人。 然而,一般之供給機器人由於複數個吸附嘴之配設間距(相互之位置關係)固定,故而會產生如下之問題。即,設置於供給托盤上之複數個凹穴之配設間距與設置於托盤上之複數個凹穴之配設間距並不一定相等。於假如設置在供給托盤上之複數個凹穴之配設間距與設置在托盤上之複數個凹穴之配設間距不同之情形時,無法統一地將保持於各吸附嘴上之電子零件向設置於托盤上之凹穴內釋放,從而必需針對各吸附嘴,逐個依序地進行相對於凹穴之位置對準、及向該凹穴內之電子零件之釋放。於此種方法中,會產生自供給托盤向托盤之電子零件之搬送需要過多時間,而無法進行順利之檢查之問題。 為了解決此種問題,亦已知有如專利文獻1之、可使吸附嘴之配設間距變化之機器人,但於此種構成中,存在如下問題:由於零件抓持部會旋轉,故而必需修正零件抓持部之旋轉之機構,一般而言零件個數會增加,有時會導致機器人之大型化。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利特開2006-17575號公報There has been known an inspection device for inspecting the electrical characteristics of electronic parts such as IC (Integrated Circuit) components since previously. Such an inspection device is a method of supplying electronic parts from a supply tray to an inspection unit, inspecting the electrical characteristics of the electronic parts supplied to the inspection unit, and recovering the electronic parts from the inspection unit to a recovery tray after the inspection is completed. Make up. In addition, the electronic parts stored in the supply tray are temporarily transferred to the shuttle, and then transferred to the vicinity of the inspection section through the shuttle. The shuttle is provided with a tray formed with a pocket, and electronic parts are stored in the pocket. The electronic parts are transferred from the supply tray to the tray by a supply robot. The supply robot has a plurality of suction nozzles, and each of the suction nozzles sucks and holds the electronic parts in the pockets of the supply tray. After the held electronic parts are transferred into the pockets of the tray, the electronic parts are released, thereby self-feeding the tray. Transfer electronic parts to the tray. As such a supply robot, for example, a supply robot described in Patent Document 1 is known. However, a general supply robot has the following problems because the arrangement distance (positional relationship) between the plurality of suction nozzles is fixed. That is, the arrangement pitch of the plurality of recesses provided on the supply tray is not necessarily equal to the arrangement pitch of the plurality of recesses provided on the tray. If the arrangement pitch of the plurality of recesses provided on the supply tray is different from the arrangement pitch of the plurality of recesses provided on the tray, the electronic parts held on the suction nozzles cannot be uniformly arranged. It is released in the cavity on the tray, so it is necessary to sequentially align the position relative to the cavity and release the electronic parts in the cavity for each suction nozzle one by one. In this method, there is a problem that it takes too much time to transfer the electronic parts from the supply tray to the tray, and a smooth inspection cannot be performed. In order to solve such a problem, a robot that can change the arrangement pitch of the suction nozzle is also known, as in Patent Document 1, but in this configuration, there is a problem in that the part must be corrected because the part holding part rotates In general, the rotation mechanism of the gripping part increases the number of parts, which sometimes leads to a larger robot. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open No. 2006-17575
[發明所欲解決之問題] 本發明之目的在於提供一種可使零件保持部之配設間距變化之該處理器中零件個數較少之處理器及檢查裝置。 [解決問題之技術手段] 本發明係為了解決上述課題之至少一部分而完成者,可作為以下之形態或應用例而實現。 此種目的係藉由下述之本發明而達成。 本發明之處理器之特徵在於:當將相互正交之3個方向設為第1方向、第2方向及第3方向時,該處理器包括: 基部; 第1支持部,其固定於上述基部上,且於動作時相對於上述基部之相對位置不變; 第1零件保持部,其支持於上述第1支持部上,以可相對於上述第1支持部沿上述第3方向移動之方式設置,且保持零件; 第1移動部,其支持於上述第1支持部上,且可相對於上述第1支持部沿上述第2方向移動; 第2零件保持部,其支持於上述第1移動部上,以相對於上述第1零件保持部而位於上述第2方向上、並且可相對於上述第1移動部沿上述第3方向移動之方式設置,且保持零件; 第2支持部,其支持於上述基部上,相對於上述第1支持部而位於上述第1方向上,並且可相對於上述基部沿上述第1方向移動; 第3零件保持部,其支持於上述第2支持部上,以可相對於上述第2支持部沿上述第3方向移動之方式設置,且保持零件; 第2移動部,其支持於上述第2支持部上,且可相對於上述第2支持部沿上述第2方向移動; 第4零件保持部,其支持於上述第2移動部上,以相對於上述第3零件保持部而位於上述第2方向上、並且可相對於上述第2移動部沿上述第3方向移動之方式設置,且保持零件; 第1移動機構,其使上述第1移動部及上述第2移動部一體地向上述第2方向移動,使上述第1零件保持部與上述第2零件保持部之於上述第2方向之相隔距離及上述第3零件保持部與上述第4零件保持部之於上述第2方向之相隔距離一起變化;及 第2移動機構,其使上述第2支持部沿上述第1方向移動,而使上述第1支持部與上述第2支持部之上述第1方向之相隔距離變化。 藉由設定為此種構成,可形成零件個數較少之處理器。 於本發明之處理器中,較佳為上述第1移動機構之至少一部分被支持於上述基部上。 藉此,裝置之構成變得簡單。 於本發明之處理器中,較佳為上述第1移動機構包括:第1移動機構用第1引導輪及第1移動機構用第2引導輪,該等於上述第2方向上相隔;第1移動機構用第1環形驅動索,其架設於上述第1移動機構用第1引導輪及上述第1移動機構用第2引導輪之間;以及第1移動機構用驅動源,其使上述第1移動機構用第1引導輪及上述第1移動機構用第2引導輪之至少一者旋轉而使上述第1移動機構用第1環形驅動索旋轉;且 至少上述第1移動機構用第1引導輪及上述第1移動機構用第2引導輪分別可旋轉地被支持於上述基部上。 藉此,第1移動機構之構成變得簡單。又,可謀求第1移動機構之零件個數之減少,故而可謀求隨之實現之小型化。 於本發明之處理器中,較佳為上述第1移動部及上述第2移動部分別直接或間接地連結於上述第1移動機構用第1環形驅動索上,且 隨著上述第1移動機構用第1環形驅動索之旋轉,上述第1移動部相對於上述第1支持部沿上述第2方向移動,並且上述第2移動部相對於上述第2支持部沿上述第2方向移動。 藉此,可簡單且確實地使固定於第1移動部上之第2零件保持部及固定於第2移動部上之第4零件保持部向第2方向移動。 於本發明之處理器中,較佳為上述第1移動機構進而包括:第1移動機構用第3引導輪及第1移動機構用第4引導輪,該等可旋轉地固定於上述第1支持部上,且於上述第2方向上相隔;第1移動機構用第2環形驅動索,其架設於上述第1移動機構用第3引導輪及上述第1移動機構用第4引導輪之間;傳遞部,其將上述第1移動機構用第1引導輪與上述第1移動機構用第3引導輪連結,而將上述第1移動機構用第1引導輪之旋轉傳遞至上述第1移動機構用第3引導輪;以及連結部,其將上述第1移動機構用第1環形驅動索與上述第1移動機構用第2環形驅動索連結;且 上述第1移動部及上述第2移動部分別連結於上述連結部。 藉此,可使第1移動部及第2移動部以良好平衡性沿第2方向移動。 於本發明之處理器中,較佳為上述第1移動機構用驅動源被支持於上述基部上。 藉此,裝置之構成變得簡單。 於本發明之處理器中,較佳為上述第2移動機構之至少一部分被支持於上述基部上。 藉此,裝置之構成變得簡單。 於本發明之處理器中,較佳為上述第2移動機構包括:第2移動機構用第1引導輪及第2移動機構用第2引導輪,該等於上述第1方向上相隔;第2移動機構用環形驅動索,其架設於上述第2移動機構用第1引導輪及上述第2移動機構用第2引導輪之間;以及第2移動機構用驅動源,其使上述第2移動機構用第1引導輪及上述第2移動機構用第2引導輪之至少一者旋轉而使上述第2移動機構用環形驅動索旋轉;且 至少上述第2移動機構用第1引導輪及上述第2移動機構用第2引導輪分別可旋轉地被支持於上述基部上。 藉此,第2移動機構之構成變得簡單。 於本發明之處理器中,較佳為上述第1支持部及上述第2支持部分別形成為於上述第2方向及上述第3方向兩方向上具有擴寬之板狀。 藉此,可謀求裝置之小型化。 於本發明之處理器中,較佳為上述第1零件保持部、上述第2零件保持部、上述第3零件保持部及上述第4零件保持部分別具有藉由吸附而保持對象物之吸附嘴。 藉此,可以簡單之構成保持對象物。 本發明之處理器之特徵在於:當將相互正交之2個方向設為第1方向及第2方向時,該處理器包括: 第1零件保持部,其保持零件; 第2零件保持部,其相對於上述第1零件保持部而位於上述第2方向上,且保持零件; 第3零件保持部,其相對於上述第1零件保持部而位於上述第1方向上,且保持零件; 第4零件保持部,其相對於上述第3零件保持部而位於上述第2方向上,且保持零件;並且 上述第3零件保持部及上述第4零件保持部一體地相對於上述第1零件保持部及上述第2零件保持部沿上述第1方向移動, 上述第2零件保持部及上述第4零件保持部一體地相對於上述第1零件保持部及上述第3零件保持部沿上述第2方向移動。 藉由設定為此種構成,可形成零件個數較少之處理器。 本發明之檢查裝置之特徵在於包括:本發明之處理器、及 進行對象物之檢查之檢查部,且 該檢查裝置係以藉由上述處理器將上述對象物搬送至上述檢查部之方式構成。 藉此,可獲得零件個數較少之檢查裝置。 本發明之檢查裝置之特徵在於:當將相互正交之3個方向設為第1方向、第2方向及第3方向時,該檢查裝置包括: 基部; 第1支持部,其固定於上述基部上,且於動作時相對於上述基部之相對位置不變; 第1零件保持部,其支持於上述第1支持部上,以可相對於上述第1支持部沿上述第3方向移動之方式設置,且保持零件; 第1移動部,其支持於上述第1支持部上,且可相對於上述第1支持部沿上述第2方向移動; 第2零件保持部,其支持於上述第1移動部上,以相對於上述第1零件保持部而位於上述第2方向上、並且可相對於上述第1移動部沿上述第3方向移動之方式設置,且保持零件; 第2支持部,其支持於上述基部上,相對於上述第1支持部而位於上述第1方向上,並且可相對於上述基部沿上述第1方向移動; 第3零件保持部,其支持於上述第2支持部上,以可相對於上述第2支持部沿上述第3方向移動之方式設置,且保持零件; 第2移動部,其支持於上述第2支持部上,且可相對於上述第2支持部沿上述第2方向移動; 第4零件保持部,其支持於上述第2移動部上,以相對於上述第3零件保持部而位於上述第2方向上、並且可相對於上述第2移動部沿上述第3方向移動之方式設置,且保持零件; 第1移動機構,其使上述第1移動部及上述第2移動部一體地向上述第2方向移動,而使上述第1零件保持部與上述第2零件保持部之上述第2方向之相隔距離及上述第3零件保持部與上述第4零件保持部之上述第2方向之相隔距離一起變化; 第2移動機構,其使上述第2支持部沿上述第1方向移動,使上述第1支持部與上述第2支持部之上述第1方向之相隔距離變化;及 檢查部,其對保持於上述第1零件保持部、上述第2零件保持部、上述第3零件保持部及上述第4零件保持部上之各零件進行檢查。 藉此,可獲得零件個數較少之檢查裝置。[Problems to be Solved by the Invention] An object of the present invention is to provide a processor and an inspection device having a small number of parts in the processor, which can change the arrangement pitch of the part holding portion. [Technical means for solving the problem] The present invention has been completed in order to solve at least a part of the problems described above, and can be implemented as the following forms or application examples. Such an object is achieved by the present invention described below. The processor of the present invention is characterized in that when three mutually orthogonal directions are set as a first direction, a second direction, and a third direction, the processor includes: a base portion; a first support portion fixed to the base portion; And the relative position with respect to the base portion does not change during operation; the first part holding portion is supported on the first support portion and is provided in a manner capable of moving in the third direction relative to the first support portion And holding parts; a first moving part supported on the first supporting part and movable in the second direction relative to the first supporting part; a second part holding part supporting the first moving part It is provided in such a way that it is located in the second direction with respect to the first part holding part and is movable in the third direction with respect to the first moving part, and holds the part; a second support part that supports the The base portion is located in the first direction relative to the first support portion and is movable in the first direction relative to the base portion; a third component holding portion is supported on the second support portion so that Relative to the above 2 The supporting portion is provided in a manner of moving in the third direction and holds parts; the second moving portion is supported on the second supporting portion and can move in the second direction relative to the second supporting portion; the fourth The component holding portion is supported by the second moving portion, is provided in a manner to be positioned in the second direction with respect to the third component holding portion, and is movable in the third direction with respect to the second moving portion, And a holding part; a first moving mechanism that integrally moves the first moving part and the second moving part in the second direction, and makes the first part holding part and the second part holding part different from the second part The separation distance in the direction and the separation distance between the third component holding portion and the fourth component holding portion in the second direction are changed together; and a second moving mechanism that moves the second support portion in the first direction, The distance between the first support portion and the second support portion in the first direction is changed. With such a configuration, a processor with a small number of parts can be formed. In the processor of the present invention, it is preferable that at least a part of the first moving mechanism is supported on the base. Thereby, the structure of the device becomes simple. In the processor of the present invention, it is preferable that the first moving mechanism includes: a first guide wheel for the first moving mechanism and a second guide wheel for the first moving mechanism, which are equal to the distance in the second direction; the first movement A first annular driving cable for the mechanism is erected between the first guide wheel for the first moving mechanism and the second guide wheel for the first moving mechanism; and a driving source for the first moving mechanism for moving the first At least one of the first guide wheel for the mechanism and the second guide wheel for the first movement mechanism rotates to rotate the first annular drive cable for the first movement mechanism; and at least the first guide wheel for the first movement mechanism and The second guide wheels for the first moving mechanism are rotatably supported on the base. Thereby, the configuration of the first moving mechanism is simplified. In addition, since the number of parts of the first moving mechanism can be reduced, miniaturization can be achieved with it. In the processor of the present invention, it is preferable that the first moving section and the second moving section are directly or indirectly connected to the first ring drive cable for the first moving mechanism, and follow the first moving mechanism. By the rotation of the first endless driving cable, the first moving portion moves in the second direction relative to the first support portion, and the second moving portion moves in the second direction relative to the second support portion. Accordingly, the second component holding portion fixed to the first moving portion and the fourth component holding portion fixed to the second moving portion can be easily and surely moved in the second direction. In the processor of the present invention, it is preferable that the first moving mechanism further includes a third guide wheel for the first moving mechanism and a fourth guide wheel for the first moving mechanism, which are rotatably fixed to the first support. Above, and separated in the second direction; the second ring drive cable for the first moving mechanism is bridged between the third guide wheel for the first moving mechanism and the fourth guide wheel for the first moving mechanism; The transmission unit connects the first guide wheel for the first movement mechanism and the third guide wheel for the first movement mechanism, and transmits the rotation of the first guide wheel for the first movement mechanism to the first movement mechanism. A third guide wheel; and a connecting portion that connects the first annular driving cable for the first moving mechanism and the second annular driving cable for the first moving mechanism; and the first moving portion and the second moving portion are connected separately On the connection section. Thereby, the first moving part and the second moving part can be moved in the second direction with good balance. In the processor of the present invention, it is preferable that the drive source for the first moving mechanism is supported on the base. Thereby, the structure of the device becomes simple. In the processor of the present invention, it is preferable that at least a part of the second moving mechanism is supported on the base. Thereby, the structure of the device becomes simple. In the processor of the present invention, it is preferable that the second moving mechanism includes: a first guide wheel for the second moving mechanism and a second guide wheel for the second moving mechanism, which are equal to the distance in the first direction; the second movement An annular driving cable for the mechanism is provided between the first guide wheel for the second movement mechanism and the second guide wheel for the second movement mechanism; and a drive source for the second movement mechanism for the second movement mechanism. At least one of the first guide wheel and the second guide wheel for the second moving mechanism rotates to rotate the ring drive cable for the second movement mechanism; and at least the first guide wheel for the second moving mechanism and the second movement The second guide wheels for the mechanism are rotatably supported on the base. Thereby, the configuration of the second moving mechanism is simplified. In the processor of the present invention, it is preferable that the first support portion and the second support portion are formed in a plate shape having a widening in both the second direction and the third direction, respectively. This makes it possible to reduce the size of the device. In the processor of the present invention, it is preferable that each of the first component holding portion, the second component holding portion, the third component holding portion, and the fourth component holding portion has a suction nozzle that holds an object by suction. . Thereby, a holding object can be constituted simply. The processor of the present invention is characterized in that when two directions orthogonal to each other are set as a first direction and a second direction, the processor includes: a first part holding part which holds a part; a second part holding part, It is located in the second direction with respect to the first part holding part and holds the part; and 3rd part holding part is in the first direction with respect to the first part holding part and holds the part; fourth The component holding portion is located in the second direction with respect to the third component holding portion and holds the component; and the third component holding portion and the fourth component holding portion are integrally formed with the first component holding portion and The second component holding portion moves in the first direction, and the second component holding portion and the fourth component holding portion move integrally with respect to the first component holding portion and the third component holding portion in the second direction. With such a configuration, a processor with a small number of parts can be formed. The inspection device of the present invention is characterized by comprising the processor of the present invention and an inspection section for inspecting an object, and the inspection device is configured to transport the object to the inspection section by the processor. Thereby, an inspection device with a small number of parts can be obtained. The inspection device of the present invention is characterized in that when three mutually orthogonal directions are set as a first direction, a second direction, and a third direction, the inspection device includes: a base portion; a first support portion fixed to the base portion; And the relative position with respect to the base portion does not change during operation; the first part holding portion is supported on the first support portion and is provided in a manner capable of moving in the third direction relative to the first support portion And holding parts; a first moving part supported on the first supporting part and movable in the second direction relative to the first supporting part; a second part holding part supporting the first moving part It is provided in such a way that it is located in the second direction with respect to the first part holding part and is movable in the third direction with respect to the first moving part, and holds the part; a second support part that supports the The base portion is located in the first direction relative to the first support portion and is movable in the first direction relative to the base portion; a third component holding portion is supported on the second support portion so that Relative to The second support portion is provided in a manner of moving in the third direction and holds parts; the second moving portion is supported on the second support portion and is movable in the second direction relative to the second support portion; The fourth component holding portion is supported by the second moving portion, is located in the second direction with respect to the third component holding portion, and is movable in the third direction with respect to the second moving portion. Install and hold parts; a first moving mechanism that moves the first moving part and the second moving part integrally to the second direction, and moves the first part holding part and the second part holding part; The separation distance in the second direction and the separation distance in the second direction between the third component holding portion and the fourth component holding portion change together; a second moving mechanism that moves the second support portion in the first direction, Changing the distance between the first support portion and the second support portion in the first direction; and an inspection portion that holds the first support portion, the second component hold portion, and the third component hold portion And above Each of the parts on the fourth part holding section is inspected. Thereby, an inspection device with a small number of parts can be obtained.
以下,基於附圖所示之實施形態詳細地對應用本發明之處理器之檢查裝置(本發明之檢查裝置)進行說明。 <第1實施形態> 圖1係表示本發明之檢查裝置之第1實施形態之概略平面圖,圖2係圖1所示之檢查用值所具有之供給機器人之手單元之立體圖,圖3係圖1所示之檢查用值所具有之供給機器人之手單元之平面圖,圖4係圖2所示之手單元所具有之第1支持部之平面圖,圖5係圖2所示之手單元所具有之第2支持部之平面圖,圖6係圖2所示之手單元所具有之第3支持部之平面圖,圖7係圖2所示之手單元所具有之第4支持部之平面圖,圖8係表示圖2所示之手單元所具有之X方向移動機構之平面圖,圖9及圖10表示係圖2所示之手單元所具有之Y方向移動機構之平面圖,圖11係圖1所示之檢查裝置所具有之檢查用機器人之手單元之立體圖,圖12至圖20係對圖1所示之檢查裝置之電子零件之檢查順序進行說明之平面圖。 再者,以下,為了便於說明,如圖1所示,將相互正交之3軸設為X軸(第1軸)、Y軸(第2軸)及Z軸(第3軸)。又,將平行於X軸之方向稱為「X方向(第1方向)」,將平行於Y軸之方向稱為「Y方向(第2方向)」,將平行於Z軸之方向稱為「Z方向」。又,於X方向、Y方向及Z方向各方向中,將箭頭前端側稱為「+」,將箭頭末端側稱為「-」。 圖1所示之檢查裝置1係用以對例如IC元件(IC晶片)、LCD(Liquid Crystal Display,液晶顯示器)、CIS(Contact Image Sensor,接觸式影像感測器)等試驗零件(電子零件)100之電氣特性進行檢查、試驗之裝置。再者,以下,為了便於說明,以使用IC元件作為試驗零件之情形為代表而進行說明。 檢查裝置1包括供給托盤2、回收托盤3、第1梭子4、第2梭子5、檢查用插口(檢查部)6、供給機器人7、回收機器人8、檢查用機器人9、第1攝像機600、第2攝像機500、及進行該等各部之控制之控制裝置10。 於此種檢查裝置1中,形成除去該等各部之中之檢查用插口6之構成,即由供給托盤2、回收托盤3、第1梭子4、第2梭子5、供給機器人7、回收機器人8、檢查用機器人9、第1攝像機600、第2攝像機500、控制裝置10,構成執行IC元件100之搬送之處理器(本發明之處理器)。再者,處理器之構成並不限定於此,既可根據需要而省略該等各部之中之至少1個,亦可添加有其他構成(例如,熱板或腔室)。 又,檢查裝置1包括搭載上述各部之基座11、及以收納上述各部之方式覆蓋於基座11上之未圖示之安全罩,於該安全罩之內側(以下稱為「區域S」),配置有第1梭子4、第2梭子5、檢查用插口6、供給機器人7、回收機器人8、檢查用機器人9、第1攝像機600及第2攝像機500,並且以可向區域S之內外移動之方式,配置有供給托盤2及回收托盤3。 以下,依序詳細地對該等各部進行說明。 1.供給托盤 供給托盤2係用以將進行檢查之IC元件100自區域S外搬送至區域S內之托盤。如圖1所示,供給托盤2形成為板狀,且於其上表面,沿X方向及Y方向呈矩陣狀地形成有用以載置IC元件100之複數個凹穴21。 此種供給托盤2係以跨越區域S之內外之方式載置於在向Y方向延伸之軌道23上移動之未圖示之平台上。而且,供給托盤2藉由以例如線性馬達作為驅動源之未圖示之驅動器件使上述平台移動,由此可沿軌道23於±Y方向上往返移動。因此,可重複進行如下動作:將收納有IC元件100之供給托盤2載置於處在區域S外之平台上,使供給托盤2與平台一併向區域S內移動,自供給托盤2上卸除所有IC元件100,之後再次使供給托盤2與平台一併向區域S外移動。 2.回收托盤 回收托盤3係用以收納檢查結束之IC元件100並將其自區域S內搬送至區域S外之托盤。如圖1所示,回收托盤3形成為板狀,且於其上表面,沿X方向及Y方向呈矩陣狀地形成有用以載置IC元件100之複數個凹穴31。 此種回收托盤3係以跨越區域S之內外之方式載置於在向Y方向延伸之軌道33上移動之未圖示之平台上。而且,回收托盤3藉由以例如線性馬達作為驅動源之未圖示之驅動器件使上述平台移動,由此可沿軌道33於±Y方向上往返移動。因此,於區域S內,可重複進行如下動作:將檢查結束之IC元件100收納於回收托盤3中,使回收托盤3移動至區域S外,將平台上之回收托盤3更換成空托盤,之後再次使回收托盤3向區域S內移動。 此種回收托盤3係相對於上述供給托盤2於+X方向上相隔而設置,且於供給托盤2與回收托盤3之間,配置有第1梭子4、第2梭子5及檢查用插口6。 3.第1梭子 第1梭子4將藉由供給托盤2而搬送至區域S內之IC元件100進而搬送至檢查用插口6之附近,故而其進而係用以將利用檢查用插口6進行過檢查之檢查結束之IC元件100搬送至回收托盤3之附近者。 如圖1所示,第1梭子4包括基底構件41、及固定於基底構件41上之2個托盤42、43。該等2個托盤42、43係沿X方向排列而設置。又,於托盤42、43上,分別以沿X方向排列4個、沿Y方向排列2個之方式呈矩陣狀(matrix狀)地形成有用以載置IC元件100之8個凹穴421、431。 托盤42、43之中,位於供給托盤2側之托盤42係用以將收納於供給托盤2中之IC元件100轉移而收納之托盤,位於回收托盤3側之托盤43係用以收納已利用檢查用插口6完成電氣特性之檢查之IC元件100之托盤。即,托盤42係用以收納未檢查之IC元件100之托盤,托盤43係用以收納檢查結束之IC元件100之托盤。 此種第1梭子4係基底構件41支持於向X方向延伸之軌道44上,藉由以例如線性馬達作為驅動源之未圖示之驅動器件,可沿軌道44於±X方向上往返移動。而且,可形成如下兩種狀態:一是第1梭子4移動至-X方向側,托盤42相對於供給托盤2排列於+Y方向側,並且托盤43相對於檢查用插口6排列於+Y方向側之狀態;二是第1梭子4移動至+X方向側,托盤43相對於回收托盤3排列於+Y方向側,並且托盤42相對於檢查用插口6排列於+Y方向側之狀態。 4.第2梭子 第2梭子5具有與上述第1梭子4相同之功能及構成。即,第2梭子5將藉由供給托盤2而搬送至區域S內之IC元件100進而搬送至檢查用插口6之附近,故而其進而係用以將藉由檢查用插口6進行過檢查之檢查結束之IC元件100搬送至回收托盤3之附近者。 如圖1所示,第2梭子5包括基底構件51、及固定於基底構件51上之2個托盤52、53。該等2個托盤52、53係沿X方向排列而設置。又,於托盤52、53上,分別以沿X方向排列4個、沿Y方向排列2個之方式呈矩陣狀地形成有用以載置IC元件100之8個凹穴521、531。 托盤52、53之中,位於供給托盤2側之托盤52係將收納於供給托盤2中之IC元件100轉移而收納之托盤,位於回收托盤3側之托盤43係用以收納已利用檢查用插口6完成電氣特性之檢查之IC元件100之托盤。即,托盤52係用以收納未檢查之IC元件100之托盤,托盤53係用以收納檢查結束之IC元件100之托盤。 此種第2梭子5係基底構件51支持於向X方向延伸之軌道54上,藉由以例如線性馬達作為驅動源之未圖示之驅動器件,可沿軌道54於±X方向上往返移動。藉此,可形成如下兩種狀態:一是第2梭子5移動至-X方向側,托盤52相對於供給托盤2排列於+Y方向側,並且托盤53相對於檢查用插口6排列於-Y方向側之狀態;二是第2梭子5移動至+X方向側,托盤53相對於回收托盤3排列於+Y方向側,並且托盤52相對於檢查用插口6排列於-Y方向側之狀態。 再者,第2梭子5係相對於上述第1梭子4於-Y方向上相隔而設置,且於第1梭子4與第2梭子5之間,配置有檢查用插口6。 5.檢查用插口 檢查用插口(檢查部)6係用以檢查IC元件100之電氣特性之插口。 此種檢查用插口6包括用以配置IC元件100之8個檢查用個別插口61,且8個檢查用個別插口61係以沿X方向排列4個、沿Y方向排列2個之方式設置。又,8個檢查用個別插口61之排列間距與形成於各托盤42、43、52、53上之8個凹穴之排列間距大致相等。藉此,可順利地進行托盤42、43、52、53與檢查用個別插口61之間之IC元件100之搬送。 雖未圖示,但於各檢查用個別插口61中,設置有自其底部突出之複數個探針。該等複數個探針分別藉由彈簧等向上方賦能。若於檢查用個別插口61中配置IC元件100,則複數個探針與該IC元件100所具有之外部端子接觸。藉此,形成IC元件100與控制裝置10(下述檢查控制部101)經由探針電性連接之狀態,即,可進行IC元件100之電氣特性之檢查(試驗)之狀態。 此種檢查用插口6裝卸自如地固定於基座11上。因此,可簡單地、與目標檢查(試驗)相應地改裝檢查用插口6、或者根據IC元件100之大小或形狀而改裝與其相符之檢查用插口6。 6.第1攝像機 第1攝像機600係設置於第1梭子4與檢查用插口6之間。如下所述,此種第1攝像機600於保持有未檢查之IC元件100之第1手單元92通過上方時,對IC元件100及第1手單元92所具有之元件標記941進行攝影。 7.第2攝像機 第2攝像機500具有與上述第1攝像機600相同之功能。此種第2攝像機500設置於第2梭子5與檢查用插口6之間。如下所述,第2攝像機500於保持有未檢查之IC元件100之第2手單元93通過上方時,對IC元件100及第2手單元93所具有之元件標記進行攝影。 8.供給機器人 供給機器人7係將收納於供給托盤2中之IC元件100搬送至托盤42、52上之機器人。 如圖1所示,供給機器人7包括:支持框7a,其支持於基座11上;移動框7b,其支持於支持框7a上,且可相對於支持框7a於±Y方向上往返移動;及手單元7c,其支持於移動框7b上,且可相對於移動框7b於±X軸方向上往返移動。 於支持框7a上,形成有沿Y方向延伸之軌道,移動框7b沿該軌道於Y方向上往返移動。又,於移動框7b上,形成有沿X方向延伸之軌道,手單元7c沿該軌道於X方向上往返移動。再者,移動框7b相對於支持框7a之移動、手單元7c相對於移動框7b之移動係藉由以例如線性馬達作為驅動源之未圖示之驅動器件而進行。 以下,基於圖2~圖10,詳細地對手單元7c進行說明。再者,於圖2~圖10各圖中,為了便於說明,省略構成之一部分圖示。 如圖2及圖3所示,手單元7c具有基部75,且該基部75可相對於移動框7b沿X方向移動地得到支持。再者,所謂「基部」係指支持其他構件(例如下述第1~第4支持部71~74)而使其聚攏之部位,且係形成手單元7c之基礎之部分。 此種基部75包括:第1基底751,其形成為於XY平面上具有擴寬且於Z方向上具有厚度之板狀;及第2基底752,其自第1基底751之-X方向側之端部向下方(-Z方向)延出,於ZY平面上具有擴寬且於X方向上具有厚度。即,基部75形成為於途中彎曲之L字狀之外形。2個基底751、752之中,於第1基底751上,固定有構成下述X方向移動機構76之零件之至少一部分,於第2基底752上,固定有構成下述Y方向移動機構77之零件之至少一部分。 又,手單元7c包括支持於基部75上之4個支持部,具體而言,包括第1支持部71、第2支持部72、第3支持部73及第4支持部74。該等4個支持部係自-X方向側向+X方向,以第3支持部73、第2支持部72、第1支持部71、第4支持部74之順序排列而設置。再者,上述「支持」係指以防止自基部75落下之狀態連結。 又,4個支持部71~74之中之第1支持部71固定於第1基底751上。再者,上述「固定」係指於動作時上述第1支持部71相對於基部75之相對位置不變。 其他第2、第3、第4支持部72、73、74分別可相對於第1基底751沿X方向移動。本實施形態中,於第1基底751之下表面形成有沿X方向延伸之軌道753,且於該軌道753上配置有可於軌道753上移動之3個導引器754、755、756。而且,於導引器754上固定有第2支持部72,於導引器755上固定有第3支持部73,於導引器756上固定有第4支持部74。藉由此種構成,第2、第3、第4支持部72、73、74可相對於基部75沿X方向移動。 又,第1、第2、第3、第4支持部71、72、73、74分別形成為於YZ平面上具有擴寬且於X方向上具有厚度之板狀。如此,藉由使各支持部71~74形成為於YZ平面上具有擴寬之板狀,可使支持部71~74以更窄之間距沿X方向並排設置。因此,可謀求手單元7c之小型化,並且可偏向X方向以較窄之間距配置下述複數個吸附嘴。 以下,詳細地對第1、第2、第3、第4支持部71、72、73、74進行說明,各支持部71~74形成為彼此相同之構成。 8-1.第1支持部 如圖4所示,於第1支持部71上設置有第1零件保持機構711。第1零件保持機構711具有保持自供給托盤2向托盤42、52搬運之IC100之功能。 此種第1零件保持機構711包括:軸712,其支持於第1支持部71上並且可相對於第1支持部71於±Z方向上往返移動;吸附嘴(第1零件保持部)713,其設置於軸712之前端部(下端部);及驅動機構714,其經由軸712使吸附嘴713相對於第1支持部71沿±Z方向移動。此種構成之第1零件保持機構711藉由驅動機構714經由軸712使吸附嘴713下降,藉由吸附嘴713而吸附IC元件100,由此保持IC元件100。以此方式,藉由吸附而保持IC元件100,由此可抑制對IC元件100施加之應力,而防止IC元件100之破損。又,可以簡單之構成且確實地保持IC元件100。再者,上述「保持」係指以IC元件100不會落下之程度持續吸附IC100。 作為驅動機構714之構成,只要可使軸712相對於第1支持部71於Z方向上往返移動,便不特別限定,於本實施形態中,其包括一對滑輪(引導輪)714a、714b、架設於一對滑輪714a、714b之間之皮帶(環形驅動索)714c、及使滑輪714a旋轉之馬達(驅動源)714d。 滑輪714a、714b可經由未圖示之軸旋轉地支持於第1支持部71之一主面上。又,滑輪714a、714b係於Z方向上相隔而設置。因此,皮帶714c具有沿Z軸方向延伸之區域,且於該區域內經由固定部714e固定有軸712。若藉由馬達714d使滑輪714a旋轉,則滑輪714b與皮帶714c隨之旋轉,固定於皮帶714c上之軸712(吸附嘴713)相對於第1支持部71沿Z軸方向移動。藉由選擇馬達714d之旋轉方向,可使吸附嘴713相對於第1支持部71上升、或下降。 再者,只要可實現如上所述之驅動,則對於引導輪、環形驅動索及驅動源之構成不特別限定。例如,亦可使用鏈輪取代滑輪714a、714b作為一對引導輪、使用鏈條取代皮帶714c作為環形驅動索。又,亦可使用壓電致動器取代馬達714d作為驅動源。 又,於第1支持部71上,設置有可相對於第1支持部71於Y方向上往返移動之第1移動部715。於第1支持部71上,設置有沿Y方向延伸之軌道(引導部),且第1移動部715可沿該軌道移動。再者,只要可沿Y方向引導第1移動部715,則亦可以沿Y方向延伸之溝槽或長孔取代上述軌道。 又,於第1支持部71上,設置有第2零件保持機構716。第2零件保持機構716與第1零件保持機構711同樣地,具有保持自供給托盤2向托盤42、52搬運之IC100之功能。 此種第2零件保持機構716包括:軸717,其支持於第1移動部715上並且可相對於第1移動部715於Z方向上往返移動;吸附嘴(第2零件保持部)718,其設置於軸717之前端部;及驅動機構719,其經由軸717使吸附嘴718相對於第1移動部715沿Z方向移動。此種構成之第2零件保持機構716藉由驅動機構719經由軸717使吸附嘴718下降,藉由吸附嘴718而吸附IC元件100,由此保持IC元件100。 作為驅動機構719之構成,只要可使軸717於±Z方向上往返移動即可,無特別限定,但於本實施形態中,其形成為與上述之驅動機構714相同之構成。即,驅動機構719包括一對滑輪719a、719b、架設於一對滑輪719a、719b之間之皮帶719c、及使滑輪719a旋轉之馬達719d。 滑輪719a、719b可經由未圖示之軸旋轉地支持於第1支持部71之一主面上。又,滑輪719a、719b係於Z方向上相隔而設置。因此,皮帶719c具有沿Z軸方向延伸之區域,且於該區域內經由固定部719e固定有軸717。若藉由馬達719d使滑輪719a旋轉,則滑輪719b與皮帶719c隨之旋轉,使得固定於皮帶719c上之軸717(吸附嘴718)相對於第1支持部71沿Z軸方向移動。藉由選擇馬達719d之旋轉方向,可使吸附嘴718相對於第1支持部71上升或下降。 再者,固定部719e於Y方向上伸縮自如,與第1移動部715相對於第1支持部71之Y方向之移動一併伸長或收縮。因此,不會阻礙第1移動部715相對於第1支持部71之Y方向之移動。又,構成驅動機構719之各部(一對滑輪719a、719b、皮帶719c、馬達719d)亦可設置於第1移動部715上。若為此種構成,則無需將固定部719e設為伸縮自如之構成。 8-2.第2支持部 如圖5所示,於第2支持部72上設置有第3零件保持機構721。第3零件保持機構721與上述第1零件保持機構711同樣地,具有保持自供給托盤2向托盤42、52搬運之IC100之功能。 此種第3零件保持機構721之構成與上述第1零件保持機構711相同。即,第3零件保持機構721包括:軸722,其支持於第2支持部72上並且可相對於第2支持部72於Z方向上往返移動;吸附嘴(第3零件保持部)723,其設置於軸722之前端部;及驅動機構724,其經由軸722使吸附嘴723相對於第2支持部72沿±Z方向移動。此種構成之第3零件保持機構721藉由驅動機構724經由軸722使吸附嘴723下降,藉由吸附嘴723而吸附IC元件100,由此保持IC元件100。 又,驅動機構724包括一對滑輪724a、724b、架設於一對滑輪724a、724b之間之皮帶724c、及使滑輪724a旋轉之馬達724d。滑輪724a、724b經由未圖示之軸可旋轉地支持於第2支持部72之一主面上。又,滑輪724a、724b係於Z方向上相隔而設置。因此,皮帶724c具有沿Z軸方向延伸之區域,且於該區域內經由固定部724e固定有軸722。若藉由馬達724d使滑輪724a旋轉,則固定於皮帶724c上之軸722(吸附嘴723)相對於第2支持部72沿Z軸方向移動。 又,於第2支持部72上,設置有可相對於第2支持部72於Y方向上往返移動之第2移動部725。於第2支持部72上,設置有沿Y方向延伸之軌道,第2移動部725係可沿該軌道移動地設置。藉由此種構成,可簡單且確實地限制第2移動部725之Y方向以外之移動。 又,於第2支持部72上,設置有第4零件保持機構726。第4零件保持機構726與上述第2零件保持機構716同樣地,具有保持自供給托盤2向托盤42、52搬運之IC100之功能。 此種第4零件保持機構726之構成與上述第2零件保持機構716相同。即,第4零件保持機構726包括:軸727,其支持於第2移動部725上並且可相對於第2移動部725於±Z方向上往返移動;吸附嘴(第4零件保持部)728,其設置於軸727之前端部;及驅動機構729,其經由軸727使吸附嘴728相對於第2移動部725沿Z方向移動。此種構成之第4零件保持機構726藉由驅動機構729經由軸727使吸附嘴728下降,藉由吸附嘴728而吸附IC元件100,由此保持IC元件100。 又,驅動機構729包括一對滑輪729a、729b、架設於一對滑輪729a、729b之間之皮帶729c、及使滑輪729a旋轉之馬達729d。滑輪729a、729b可經由未圖示之軸旋轉地支持於第2支持部72之一主面上。又,滑輪729a、729b係於Z方向上相隔而設置。因此,皮帶729c具有沿Z軸方向延伸之區域,且於該區域內經由固定部729e固定有軸727。若藉由馬達729d使滑輪729a旋轉,則固定於皮帶729c上之軸727(吸附嘴728)相對於第2支持部72沿Z軸方向移動。 再者,固定部729e於Y方向上伸縮自如,與第2移動部725相對於第2支持部72之Y方向之移動一併伸長或收縮。因此,不會阻礙第2移動部725相對於第2支持部72之Y方向之移動。 8-3.第3支持部 如圖6所示,於第3支持部73上設置有第5零件保持機構731。第5零件保持機構731與上述第1零件保持機構711同樣地,具有保持自供給托盤2向托盤42、52搬運之IC100之功能。 此種第5零件保持機構731之構成與上述第1零件保持機構711相同。即,第5零件保持機構731包括:軸732,其支持於第3支持部73上並且可相對於第3支持部73於Z方向上往返移動;吸附嘴(第5零件保持部)733,其設置於軸732之前端部;及驅動機構734,其經由軸732使吸附嘴733相對於第3支持部73沿Z方向移動。此種構成之第5零件保持機構731藉由驅動機構734經由軸732使吸附嘴733下降,藉由吸附嘴733而吸附IC元件100,由此保持IC元件100。 又,驅動機構734包括一對滑輪734a、734b、架設於一對滑輪734a、734b之間之皮帶734c、及使滑輪734a旋轉之馬達734d。滑輪734a、734b可經由未圖示之軸旋轉地支持於第3支持部73之一主面上。又,滑輪734a、734b係於Z方向上相隔而設置。因此,皮帶734c具有沿Z軸方向延伸之區域,且於該區域內經由固定部734e固定有軸732。若藉由馬達734d使滑輪734a旋轉,則固定於皮帶734c上之軸732(吸附嘴733)相對於第3支持部73沿Z軸方向移動。 又,於第3支持部73上,設置有可相對於第3支持部73於Y方向上往返移動之第3移動部735。於第3支持部73上,設置有沿Y方向延伸之軌道,第3移動部735係可沿該軌道移動地設置。藉由形成為此種構成,可簡單且確實地限制第3移動部735之Y方向以外之移動。 又,於第3支持部73上,設置有第6零件保持機構736。第6零件保持機構736與上述第2零件保持機構716同樣地,具有保持自供給托盤2向托盤42、52搬運之IC100之功能。 此種第6零件保持機構736之構成與上述第2零件保持機構716相同。即,第6零件保持機構736包括:軸737,其支持於第3移動部735上並且可相對於第3移動部735於Z方向上往返移動;吸附嘴(第6零件保持部)738,其設置於軸737之前端部;及驅動機構739,其經由軸737使吸附嘴738相對於第3移動部735沿Z方向移動。此種構成之第6零件保持機構736藉由驅動機構739經由軸737使吸附嘴738下降,藉由吸附嘴738而吸附IC元件100,由此保持IC元件100。 又,驅動機構739包括一對滑輪739a、739b、架設於一對滑輪739a、739b之間之皮帶739c、及使滑輪739a旋轉之馬達739d。滑輪739a、739b可經由未圖示之軸旋轉地支持於第3支持部73之一主面上。又,滑輪739a、739b係於Z方向上相隔而設置。因此,皮帶739c具有沿Z軸方向延伸之區域,且於該區域內經由固定部739e固定有軸737。若藉由馬達739d使滑輪739a旋轉,則固定於皮帶739c上之軸737(吸附嘴738)相對於第3支持部73沿Z軸方向移動。 再者,固定部739e於Y方向上伸縮自如,與第3移動部735相對於第3支持部73之Y方向之移動一併伸長或收縮。因此,不會阻礙第3移動部735相對於第3支持部73之Y方向之移動。 8-4.第4支持部 如圖7所示,於第4支持部74上設置有第7零件保持機構741。第7零件保持機構741與上述第1零件保持機構711同樣地,具有保持自供給托盤2向托盤42、52搬運之IC100之功能。 此種第7零件保持機構741之構成與上述第1零件保持機構711相同。即,第7零件保持機構741包括:軸742,其支持於第4支持部74上並且可相對於第4支持部74於Z方向上往返移動;吸附嘴(第7零件保持部)743,其設置於軸742之前端部;及驅動機構744,其經由軸742使吸附嘴743相對於第4支持部74沿Z方向移動。此種構成之第7零件保持機構741藉由驅動機構744經由軸742使吸附嘴743下降,藉由吸附嘴743而吸附IC元件100,由此保持IC元件100。 又,驅動機構744包括一對滑輪744a、744b、架設於一對滑輪744a、744b之間之皮帶744c、及使滑輪744a旋轉之馬達744d。滑輪744a、744b可經由未圖示之軸旋轉地支持於第4支持部74之一主面上。又,滑輪744a、744b係於Z方向上相隔而設置。因此,皮帶744c具有沿Z軸方向延伸之區域,且於該區域內經由固定部744e固定有軸742。若藉由馬達744d使滑輪744a旋轉,則固定於皮帶744c上之軸742(吸附嘴743)相對於第3支持部73沿Z軸方向移動。 又,於第4支持部74上,設置有可相對於第4支持部74於Y方向上往返移動之第4移動部745。於第4支持部74上,設置有沿Y方向延伸之軌道,第4移動部745係可沿該軌道移動地設置。藉由形成為此種構成,可簡單且確實地限制第4移動部745之Y方向以外之移動。 又,於第4支持部74上,設置有第8零件保持機構746。第8零件保持機構746與上述第2零件保持機構716同樣地,具有保持自供給托盤2向托盤42、52搬運之IC100之功能。 此種第8零件保持機構746之構成與上述第2零件保持機構716相同。即,第8零件保持機構746包括:軸747,其支持於第4移動部745上並且可相對於第4移動部745於Z方向上往返移動;吸附嘴(第8零件保持部)748,其設置於軸747之前端部;及驅動機構749,其經由軸747使吸附嘴748相對於第4移動部745沿Z方向移動。此種構成之第8零件保持機構746藉由驅動機構749經由軸747使吸附嘴748下降,藉由吸附嘴748而吸附IC元件100,由此保持IC元件100。 又,驅動機構739包括一對滑輪749a、749b、架設於一對滑輪749a、749b之間之皮帶749c、及使滑輪749a旋轉之馬達749d。滑輪749a、749b可經由未圖示之軸旋轉地支持於第4支持部74之一主面上。又,滑輪749a、749b係於Z方向上相隔而設置。因此,皮帶749c具有沿Z軸方向延伸之區域,且於該區域內經由固定部749e固定有軸747。若藉由馬達749d使滑輪749a旋轉,則固定於皮帶749c上之軸747(吸附嘴748)相對於第4支持部74沿Z軸方向移動。 再者,固定部749e於Y方向上伸縮自如,與第4移動部745相對於第4支持部74之Y方向之移動一併伸長或收縮。因此,不會阻礙第4移動部745相對於第4支持部74之Y方向之移動。 以上,對各支持部71、72、73、74之構成詳細地進行了說明。 此處,吸附嘴733、723、713、743係依序沿X方向排列而設置,且係以相等之間距配置。即,吸附嘴733與吸附嘴723之相隔距離、吸附嘴723與吸附嘴713之相隔距離、吸附嘴713與吸附嘴743之相隔距離彼此大致相等。 又,吸附嘴718係相對於吸附嘴713沿Y方向排列而設置,同樣地,吸附嘴728係相對於吸附嘴723沿Y方向排列而設置,吸附嘴738係相對於吸附嘴733沿Y方向排列而設置,吸附嘴748係相對於吸附嘴743沿Y方向排列而設置。又,吸附嘴718、713之相隔距離、吸附嘴728、723之相隔距離、吸附嘴738、733之相隔距離、吸附嘴748、743之相隔距離彼此大致相等。即,吸附嘴738、728、718、748亦係依序沿X方向排列而設置,且係以相等之間距配置。 手單元7c進而包括:X方向移動機構(第2移動機構)76,其使第2、第3、第4支持部72、73、74相對於基部75(第1支持部71)沿X方向移動;及Y方向移動機構(第1移動機構)77,其使各移動部715、725、735、745相對於基部75向Y方向移動。 8-5. X方向移動機構 X方向移動機構76係以可一面藉由使第2、第3、第4支持部72、73、74相對於第1支持部71沿X方向移動,而將吸附嘴733(738)與吸附嘴723(728)之相隔距離、吸附嘴723(728)與吸附嘴713(718)之相隔距離、及吸附嘴713(718)與吸附嘴743(748)之相隔距離維持為彼此相等,一面變更該等相隔距離之方式構成。 如圖8所示,X方向移動機構76包括一對二段滑輪(第2移動機構用第1引導輪、第2移動機構用第2引導輪)761、762、架設於一對二段滑輪761、762之間之2根皮帶(第2移動機構用第1環形驅動索、第2移動機構用第2環形驅動索)763、764、及使二段滑輪761旋轉之馬達(第2移動機構用驅動源)765。該等之中,二段滑輪761、762及馬達765分別支持於第1基底751上。 二段滑輪761、762可於第1基底751之上表面繞沿Y方向延伸之軸旋轉。又,二段滑輪761、762係於X方向上相隔而設置。 二段滑輪761包括:小徑滑輪761a,其外徑較小;及大徑滑輪761b,其具有小徑滑輪761a之大致2倍之外徑;該等係沿Y方向排列且形成為同心。同樣地,二段滑輪762包括:小徑滑輪762a,其外徑較小;及大徑滑輪762b,其具有小徑滑輪762a之大致2倍之外徑;該等係沿Y方向排列且形成為同心。再者,小徑滑輪761a、762a之外徑彼此相等,大徑滑輪761b、762b之外形亦彼此相等。 於小徑滑輪761a、762a之間,架設有皮帶763。皮帶763於小徑滑輪761a、762a之間,具有沿X方向延伸之2個區域763a、763b。而且,於一區域763a內,固定有第2支持部72,於另一區域763b內,固定有第4支持部74。若二段滑輪761旋轉,則於區域763a內皮帶763向X方向一方側進給,於區域763b內皮帶763向X方向另一側進給,故而第2、第4支持部72、74相互向X方向相反側且以大致相等之距離移動。 另一方面,於大徑滑輪761b、762b之間,架設有皮帶764。皮帶764於大徑滑輪761b、762b之間,具有沿X方向延伸之2個區域764a、764b。該等2個區域764a、764b之中,於在二段滑輪761旋轉時向與皮帶763之區域763a相同之方向進給之區域764a內,固定有第3支持部73。若皮帶763旋轉,則於區域763a、764a內,皮帶763向X方向相同側進給,故而第2、第3支持部72、73相互向X方向相同側移動。再者,如上所述,大徑滑輪761b、762b具有小徑滑輪761a、762a之2倍之外徑,故而第3支持部73之移動距離成為第2支持部72之移動距離之大致2倍。 根據此種構成,若藉由馬達765使二段滑輪761旋轉,則第2、第4支持部72、74相互向X方向相反側移動大致相等之距離,並且第3支持部73向與第2支持部72相同之方向且以第2支持部72之2倍移動。從而,根據X方向移動機構76,如上所述,可一面將吸附嘴733(738)與吸附嘴723(728)之相隔距離、吸附嘴723(728)與吸附嘴713(718)之相隔距離、及吸附嘴713(718)與吸附嘴743(748)之相隔距離維持為彼此相等,一面使該等相隔距離變化。 藉由形成為如上所述之構成,可簡化X方向移動機構76之構成,亦可謀求隨之實現之小型化、輕量化。因此,有助於手單元7c之小型化、輕量化,而提昇手單元7c之操作性。又,藉由二段滑輪761之旋轉,可統一地控制第2、第3、第4支持部72、73、74之所有移動,故而可更確實地發揮上述功能。 再者,只要可實現如上所述之驅動,則對於引導輪、環形驅動索及驅動源之構成並無特別限定。例如,亦可使用鏈輪取代滑輪作為一對引導輪、使用鏈條(金屬鏈條、橡膠鏈條等)取代皮帶作為環形驅動索。又,亦可使用壓電致動器取代馬達作為驅動源。又,小徑滑輪761a(762a)與大徑滑輪761b(762b)亦可以分體形式形成,於該情形時,亦可分別地設置用以使小徑滑輪761a旋轉之馬達、及用以使大徑滑輪761b旋轉之馬達。 8-6. Y方向移動機構 Y方向移動機構77係以可一面藉由使第1、第2、第3、第4移動部715、725、735、745相對於第1、第2、第3、第4支持部71、72、73、74一體地(具體而言,同時且等距離地)沿Y方向移動,而將吸附嘴713、718之相隔距離、吸附嘴723、728之相隔距離、吸附嘴733、738之相隔距離、及吸附嘴743、748之相隔距離維持為彼此相等,一面變更該等相隔距離之方式構成。 如圖9及圖10所示,Y方向移動機構77包括:第1單元77a及馬達(第1移動機構用驅動源)777,其設置於基部75上;第2單元77b,其設置於第1支持部71上;傳遞軸(傳遞部)778及連結軸(連結部)779,其以將第1、第2單元77a、77b連結之方式設置。 第1單元77a包括一對滑輪(第1移動機構用第1引導輪、第1移動機構用第2引導輪)771、772、及架設於一對滑輪771、772之間之皮帶(第1移動機構用第1環形驅動索)773。滑輪771、772繞沿X方向延伸之軸旋轉自如地支持於第2基底752之一(圖中右側)主面上。又,滑輪771、772係於Y方向上相隔而設置。而且,於該等滑輪771、772之間架設有皮帶773。皮帶773於滑輪771、772之間具有沿Y方向延伸之2個區域773a、773b。 馬達777係用以使滑輪771旋轉之驅動源,設置於第2基底752之另一(圖中左側)主面上。 第2單元77b包括一對滑輪(第1移動機構用第3引導輪、第1移動機構用第4引導輪)774、775、及架設於一對滑輪774、775之間之皮帶(第1移動機構用第2環形驅動索)776。滑輪774、775繞沿X方向延伸之軸旋轉自如地支持於第1支持部71之一(圖中右側)主面上。又,滑輪774、775係於Y方向上相隔而設置。而且,於該等滑輪774、775之間架設有皮帶776。皮帶776於滑輪774、775之間具有沿Y方向延伸之2個區域776a、776b。 如此,藉由將第2單元77b設置在相對於第2基底752之位置不變之第1支持部71上,可使Y方向移動機構77更穩定地驅動。 傳遞軸778係用以將馬達777之驅動力傳遞至第2單元77b之軸。此種傳遞軸778係沿X方向延伸而設置,將滑輪771、774之軸彼此連結。因此,馬達777之驅動力經由傳遞軸778被傳遞至第2單元77b,從而滑輪771、774一體地旋轉。 又,傳遞軸778係貫通位於第2基底752與第1支持部71之間之第2、第3支持部72、73而設置(參照圖5及圖6)。具體而言,傳遞軸778通過形成於第2、第3支持部72、73上之貫通孔內而將滑輪771、774連結。藉由將傳遞軸778設定為此種配置,可抑制傳遞軸778自支持部71~74之露出,從而可謀求手單元7c之小型化。又,傳遞軸778亦發揮作為第2、第3支持部72、73向X方向移動時之導引器之功能,故而可更確實且順利地進行第2、第3支持部72、73之移動。 連結軸779形成為直線狀,且沿X方向延伸。又,連結軸779於其途中之2處,經由固定具固定有皮帶773之區域773a、及皮帶776之區域776a。若皮帶773、776旋轉,則於區域773a、776a內,皮帶773、776向Y方向相同側進給,故而隨之,連結軸779維持姿勢地直接向Y方向移動。 於此種連結軸779之外周,沿其軸向設置有3個線性襯套779b、779c、779d。該等各線性襯套779b、779c、779d單獨(動作不受其他構件限制之狀態)地,相對於連結軸779沿軸向自如移動,且沿周向自如旋轉。 該等線性襯套779b~779d之中,線性襯套779b固定於第2移動部725上,線性襯套779c固定於第3移動部735上,線性襯套779d固定於第4移動部745上。再者,第1移動部715支持在固定於第1基底751上之第1支持部71上,故而不會相對於連結軸779沿Y軸方向移動。因此,於第1移動部715上,與其他移動部725~745不同,不經由線性襯套便直接固定有連結軸779。如此,藉由將連結軸779固定於第1移動部715上,可防止連結軸779之軸向(Y方向)之非本意移位。 藉由形成此種構成,若連結軸779利用皮帶773、776之旋轉而沿Y方向移動,則各移動部715、725、735、745相對於各支持部71、72、73、74沿Y方向一體地且以相等之距離移動。從而,根據此種構成之Y方向移動機構77,可確實地一面將吸附嘴713、718之相隔距離、吸附嘴723、728之相隔距離、吸附嘴733、738之相隔距離、及吸附嘴743、748之相隔距離維持為彼此相等,一面變更該等相隔距離。 再者,如上所述,線性襯套779b~779d係相對於連結軸779沿其軸向(X方向)移動自如,故而Y方向移動機構77不會阻礙第2、第3、第4支持部72、73、74藉由X方向移動機構76向X方向之移動。 又,於Y方向移動機構77中,在第2基底752上設置第1單元77a,並且在第1支持部71上設置第2單元77b,在於軸向上相隔之2處支持連結軸779,故而可使連結軸779更順利且確實地向Y方向移動特定距離。尤其是藉由使第2、第3支持部72、73位於第2基底752與第1支持部71之間,可充分地確保第2基底752與第1支持部71之相隔距離,從而可更穩定地支持連結軸779。 再者,於本實施形態之Y方向移動機構77中,第1、第2、第3、第4移動部715、725、735、745經由連結軸779(即間接地)連結於皮帶773、776上,但並不限定於此,例如,亦可省略連結軸779,而使第1、第2、第3、第4移動部715、725、735、745分別直接連結於皮帶773、776上。 以上,對手單元7c之構成具體地進行了說明。根據此種手單元7c,藉由獨立地控制各馬達765、777之驅動(打開/關閉及旋轉方向),可自由地變更吸附嘴713、718、723、728、733、738、743、748之配設間距。因此,例如,即便於形成在供給托盤2上之複數個凹穴21之配設間距與形成在托盤42(52)上之複數個凹穴421(521)之配設間距不同之情形時,亦可如下所述,自供給托盤2向托盤42(52)順利地搬運IC元件100。 再者,本實施形態之手單元7c具有8個吸附嘴,但吸附嘴之數量只要為4個以上即可,並無特別限定。例如,於吸附嘴為4個之情形時,只要使第3、第4支持部73、74分別省略吸附嘴733、738、743、748。又,例如,於吸附嘴為10個之情形時,例如,只要於第4支持部74之+X方向側,設置為與第4支持部74相同之構成且具有2個吸附嘴之第5支持部,進而,將第5支持部固定於皮帶764之區域764b內即可。如此,根據手單元7c,可簡單地進行吸附嘴之數量之變更(進而,添加、刪除)。關於手單元8c亦相同。 其次,對供給機器人7之驅動進行說明。 首先,以手單元7c位於供給托盤2上之方式,使移動框7b相對於支持框7a沿Y方向移動,並且使基部75相對於移動框7b沿X方向移動。其次,使X方向移動機構76及Y方向移動機構77各自根據需要而驅動,使吸附嘴713、718、723、728、733、738、743、748之配設間距與凹穴21之配設間距一致。再者,X方向移動機構76及Y方向移動機構77之驅動亦可於手單元7c正在移動之過程中進行。 其次,使各吸附嘴713、718、723、728、733、738、743、748下降,藉由各吸附嘴713、718、723、728、733、738、743、748而保持IC元件100。其後,使吸附嘴713、718、723、728、733、738、743、748上升,自凹穴21中取出8個IC元件100。 其次,以手單元7c位於托盤42上之方式,使移動框7b相對於支持框7a沿Y方向移動,並且使基部75相對於移動框7b沿X方向移動。由於供給托盤2之凹穴21之配設間距與托盤42之凹穴421之配設間距於X方向及Y方向兩個方向上不同,故而接著使X方向移動機構76及Y方向移動機構77分別驅動,使吸附嘴713、718、723、728、733、738、743、748之配設間距與凹穴421之配設間距一致。再者,X方向移動機構76及Y方向移動機構77之驅動亦可於手單元7c正在移動之過程中進行。 其次,使各吸附嘴713、718、723、728、733、738、743、748下降,將保持於各吸附嘴713、718、723、728、733、738、743、748上之IC元件100載置於凹穴421中。然後,於解除IC元件100之吸附狀態之後,使吸附嘴713、718、723、728、733、738、743、748上升,將各IC元件100保留於凹穴421上。 再者,於上述形態中,供給托盤2之凹穴21之配設間距與托盤42之凹穴421之配設間距於X方向及Y方向兩個方向上不同,但並不限定於此,亦可為僅X方向上之配設間距不同。於該情形時,只要姑且藉由Y方向移動機構77,調整吸附嘴713、718、723、728、733、738、743、748之Y方向之配設間距,其後,僅驅動X方向移動機構76,使吸附嘴713、718、723、728、733、738、743、748之X方向之配設間距變化即可。 相反地,亦可為僅Y方向上之配設間距不同。於該情形時,只要姑且藉由X方向移動機構76,調整吸附嘴713、718、723、728、733、738、743、748之X方向之配設間距,其後,僅驅動Y方向移動機構77,使吸附嘴713、718、723、728、733、738、743、748之Y方向之配設間距變化即可。 又,配設間距亦可為於X方向及Y方向兩個方向上相等。於該情形時,只要姑且藉由Y方向移動機構77,調整吸附嘴713、718、723、728、733、738、743、748之Y方向之配設間距,藉由X方向移動機構76,調整吸附嘴713、718、723、728、733、738、743、748之X方向之配設間距,其後不使該等配設間距變更,而進行上述IC元件100之搬送即可。 自供給托盤2向托盤52之IC元件100之搬送亦相同。 (檢查用機器人) 檢查用機器人9係將收納於托盤42、52中之IC元件100向檢查用插口6搬送,並且將配置於檢查用插口6中、已完成電氣特性之檢查之IC元件100向托盤43、53搬送之機器人。 又,檢查用機器人9於自托盤42、52向檢查用插口6搬送IC元件100時,可進行IC元件100相對於檢查用插口6(檢查用個別插口61)之定位,進而,於將IC元件100配置於檢查用插口6中而進行電氣特性之檢查時,可將IC元件100按壓於探針上,對IC元件100施加特定之檢查壓。 如圖1所示,檢查用機器人9包括:第1框911,其係相對於基座11而固定地設置;第2框912,其支持於第1框911上,且可相對於第1框911向Y方向往返移動;第1手單元支持部913及第2手單元支持部914,其支持於第2框912上,且可相對於第2框912沿Z方向升降;8個第1手單元92,其支持於第1手單元支持部913上;及8個第2手單元93,其支持於第2手單元支持部914上。 第1、第2手單元支持部913、914均支持於第2框912上,故而可沿X方向及Y方向一體地移動,而沿Z方向分別獨立地移動。第2框912相對於第1框911之移動、各手單元支持部913、914相對於第2框912之移動係藉由以例如線性馬達作為驅動源之未圖示之驅動器件而進行。 8個第1手單元92係以沿X方向排列4個、沿Y方向排列2個之方式呈矩陣狀地配置於第1手單元支持部913之下側。又,8個第1手單元92之配設間距與形成於托盤42、43上之8個凹穴421、431及設置於檢查用插口6中之8個檢查用個別插口61之配設間距大致相等。因此,可更順利地進行托盤42、43與檢查用插口6之間之IC元件100之搬送。 同樣地,8個第2手單元93係於第2梭子5之各托盤52、53與檢查用插口6之間搬送IC元件100之裝置。又,其亦係於將未檢查之IC元件100自托盤52搬送至檢查用插口6時進行IC元件100相對於檢查用插口6之定位之裝置。 8個第2手單元93係以沿X方向排列4個、沿Y方向排列2個之方式呈矩陣狀地配置於第2手單元支持部914之下側。又,8個第2手單元93之配置間距與上述8個第1手單元92同樣地,與形成於托盤42、43上之8個凹穴421、431及設置於檢查用插口6中之8個檢查用個別插口61之配設間距大致相等。因此,可更順利地進行托盤52、53與檢查用插口6之間之IC元件100之搬送。 以下,對8個第1手單元92及8個第2手單元93之構成進行說明,但各手單元92、93係彼此相同之構成,故而以下,以1個第1手單元92為代表而進行說明,對於其他第1手單元92及第2手單元93,省略其說明。 如圖11所示,第1手單元92包括:支持部94,其支持、固定於第1手單元支持部913上;第1移動部95,其支持於支持部94上,且可相對於支持部94於±X方向上往返移動;第2移動部96,其支持於第1移動部95上,且可相對於第1移動部95於±Y方向上往返移動;旋轉部97,其支持於第2移動部96上,且可相對於第2移動部96繞Z軸旋轉;及保持部98,其支持於旋轉部97上。於支持部94上,設置有用以進行所保持之IC元件100相對於檢查用個別插口61之定位之元件標記941。又,保持部98係由例如吸附嘴所構成,可藉由吸附IC元件100而進行保持。 又,第1手單元92包括:未圖示之第1驅動器件,其使第1移動部95相對於支持部94於±X方向上往返移動;未圖示之第2驅動器件,其使第2移動部96相對於第1移動部95於±Y方向上往返移動;及第3驅動機構,其使旋轉部97相對於第2移動部96繞Z軸旋轉。該等第1、第2、第3驅動機構形成為可以例如線性馬達作為驅動源,此外根據需要而添加有用以使馬達之旋轉運動轉換成直線運動之齒條、小齒輪等構成之構成。 此種第1手單元92係以如下方式,進行所保持之IC元件100之定位(目視對準)。將收納於托盤42中之未檢查之IC元件100保持於保持部98上,於第1手單元92自托盤42之正上方移動至檢查用插口6之正上方之途中,第1手單元92通過第1攝像機600之正上方。第1攝像機600於第1手單元92通過其正上方時,以捕捉保持於第1手單元92上之IC元件100及元件標記941之方式進行攝影。所得之圖像資料被發送至控制裝置10,並藉由控制裝置10予以圖像識別處理。 具體而言,於圖像識別處理中,對自第1攝像機600取得之圖像資料實施特定之處理,而算出元件標記941與IC元件100之相對位置及相對角度。然後,將所算出之相對位置及相對角度與表示元件標記941與IC元件100之適當之位置關係之基準位置及基準角度進行對比,分別演算相對位置與基準位置之間所產生之「偏移位置量」、及相對角度與基準角度之間所產生之「偏移角度量」。再者,上述「基準位置」及上述「基準角度」係指於第1手單元92配置在預先設定之檢查用原點位置時、IC元件100之外部端子較佳地連接於檢查用個別插口61之探針之位置。 然後,控制裝置10基於所求出之「偏移位置量」及「偏移角度量」,根據需要驅動第1、第2、第3驅動器件,以使相對位置及相對角度與基準位置及基準角度一致之方式,修正IC元件100之位置及姿勢(角度)。藉由此種控制,可進行由保持部98保持之IC元件100之定位。 控制裝置10係以可分別獨立地控制8個第1手單元92之驅動之方式構成,故而可分別獨立地進行保持於各第1手單元92上之8個IC元件100之定位(位置修正)。 利用第2手單元93之IC元件100之定位除了使用第2攝像機500取代第1攝像機600以外,其他與上述第1手單元92之情形相同,故而省略其說明。 (回收機器人) 回收機器人8係用以將收納於托盤43、53中之檢查結束之IC元件100搬送至回收托盤3之機器人。 回收機器人8形成為與供給機器人7相同之構成。即,回收機器人8包括:支持框8a,其支持於基座11上;移動框8b,其支持於支持框8a上,且可相對於支持框8a於Y方向上往返移動;及手單元8c,其支持於移動框8b上,且可相對於移動框8b於X方向上往返移動。該等各部之構成與供給機器人7之對應之各部之構成相同,故而省略其說明。又,回收機器人8之驅動亦與供給機器人7之驅動相同,故而省略其說明。 此處,會存在如下情形:於收納在托盤43(53)中之檢查結束之IC元件100之中,存在無法發揮特定之電氣特性之不良品。因此,例如,亦可準備2個回收托盤3,將一者作為用以收納滿足特定之電氣特性之良品之托盤而使用,將另一者作為用以回收上述不良品之托盤而使用。又,於使用1個回收托盤3之情形時,亦可利用特定之凹穴31作為用以收納上述不良品之凹穴。藉此,可明確地區分良品與不良品。 (控制裝置) 控制裝置10包括驅動控制部102、及檢查控制部101。驅動控制部102例如對供給托盤2、回收托盤3、第1梭子4及第2梭子5之移動、或供給機器人7、回收機器人8、檢查用機器人9、載置狀態檢測器件200、第1攝像機600及第2攝像機500等之機械性之驅動進行控制。一檢查控制部101基於記憶在未圖示之記憶體內之程式,進行配置於檢查用插口6中之IC元件100之電氣特性之檢查。 以上,對檢查裝置1之構成進行了說明。 [檢查裝置之檢查方法] 其次,對檢查裝置1對IC元件100之檢查方法進行說明。再者,以下所說明之檢查方法尤其是IC元件100之搬送順序僅為一例,並不限定於此。 (步驟1) 首先,如圖12所示,將於各凹穴21內收納有IC元件100之供給托盤2向區域S內搬送,並且使第1、第2梭子4、5移動至-X方向側,而形成托盤42、52分別相對於供給托盤2排列於+Y方向側之狀態。 (步驟2) 其次,如圖13所示,藉由供給機器人7,將收納於供給托盤2中之IC元件100轉移至托盤42、52上,並將IC元件100收納於托盤42、52之各凹穴421、521中。 其次,藉由載置狀態檢測器件200,檢測收納於托盤42、52之各凹穴421、521中之IC元件100之載置狀態。即便於僅檢測出1個異常之載置狀態之IC元件100之情形時,驅動控制部102亦臨時使各部之驅動停止,糾正異常之載置狀態,於確認IC元件100全部處於正常之載置狀態下之後,再次開始各部之驅動。 (步驟3) 其次,如圖14所示,將第1、第2梭子4、5均移動至+X方向側,而形成托盤42相對於檢查用插口6排列於+Y方向側、托盤52相對於檢查用插口6排列於-Y方向側之狀態。 其次,如圖15所示,使第1、第2手單元支持部913、914一體地移動至+Y方向側,而形成第1手單元支持部913位於托盤42之正上方並且第2手單元支持部914位於檢查用插口6之正上方之狀態。其後,藉由各第1手單元92保持收納於托盤42中之IC元件100。 (步驟5) 其次,如圖16所示,使第1、第2手單元支持部913、914一體地移動至-Y方向側,而形成第1手單元支持部913位於檢查用插口6之正上方(檢查用原點位置)並且第2手單元支持部914位於托盤52之正上方之狀態。於該移動之過程中,基於藉由第1攝像機600拍攝所得之圖像資料,獨立地進行各IC元件100之定位(目視對準)。 與此種第1、第2手單元支持部913、914之移動及IC元件100之定位同時地,亦進行如下之作業。首先,使第1梭子4移動至-X方向側,而形成托盤43相對於檢查用插口6沿+Y方向排列之狀態,並且形成托盤42相對於供給托盤2沿+Y方向排列之狀態。其次,藉由供給機器人7,將收納於供給托盤2中之IC元件100轉移至托盤42上,將IC元件100收納於托盤42之各凹穴421中。然後,與上述同樣地,藉由載置狀態檢測器件200,檢測收納於各凹穴421中之IC元件100之載置狀態。 (步驟6) 其次,使第1手單元支持部913下降,將由各第1手單元92保持之IC元件100配置於檢查用插口6之各檢查用個別插口61內。此時,各第1手單元92以特定之檢查壓(壓力)將IC元件100按壓於檢查用個別插口61中。藉此,IC元件100之外部端子與設置於檢查用個別插口61中之探針形成為電性連接之狀態,於該狀態下,藉由控制裝置10之檢查控制部101對各檢查用個別插口61內之IC元件100實施電氣特性之檢查。若該檢查結束,則使第1手單元支持部913上升,自檢查用個別插口61中取出由各第1手單元92保持之IC元件100。 與此種作業(IC元件100之檢查)同時地,支持於第2手單元支持部914上之各第2手單元93保持收納於托盤52中之IC元件100,再自托盤52中取出IC元件100。 (步驟7) 其次,如圖17所示,使第1、第2手單元支持部913、914移動至+Y方向側,而形成第1手單元支持部913位於第1梭子4之托盤43之正上方並且第2手單元支持部914位於檢查用插口6之正上方(檢查用原點位置)之狀態。於該移動之過程中,基於藉由第2攝像機500拍攝所得之圖像資料,獨立地進行各IC元件100之定位(目視對準)。 與此種第1、第2手單元支持部913、914之移動同時地,亦進行如下之作業。首先,使第2梭子5移動至-X方向側,而形成托盤53相對於檢查用插口6沿-Y方向排列之狀態,並且形成托盤52相對於供給托盤2沿+Y方向排列之狀態。其次,藉由供給機器人7,將收納於供給托盤2中之IC元件100轉移至托盤52上,將IC元件100收納於托盤52之各凹穴521中。然後,與上述同樣地,藉由載置狀態檢測器件200,檢測收納於各凹穴521中之IC元件100之載置狀態。 (步驟8) 其次,如圖18所示,使第2手單元支持部914下降,將由各第2手單元93保持之IC元件100配置於檢查用插口6之各檢查用個別插口61內。然後,藉由檢查控制部101,對各檢查用個別插口61內之IC元件100實施電氣特性之檢查。若該檢查結束,則使第2手單元支持部914上升,自檢查用個別插口61中取出由第2手單元93保持之IC元件100。 與此種作業同時地進行如下之作業。首先,將各第1手單元92所保持之檢查結束之IC元件100收納於托盤43之各凹穴431中。其次,使第1梭子4移動至+X方向側,而形成托盤42相對於檢查用插口6沿+Y方向排列且位於各第1手單元92之正下方之狀態,並且形成托盤43相對於回收托盤3沿+Y方向排列之狀態。其次,各第1手單元92保持收納於托盤42中之IC元件100,並且藉由回收機器人8,將收納於托盤43中之檢查結束之IC元件100轉移至回收托盤3中。 (步驟9) 其次,如圖19所示,使第1、第2手單元支持部913、914移動至-Y方向側,而形成第1手單元支持部913位於檢查用插口6之正上方(檢查用原點位置)並且第2手單元支持部914位於托盤52之正上方之狀態。此時,亦與上述步驟5同樣地,進行保持於第1手單元92上之IC元件100之定位。 與此種第1、第2手單元支持部913、914之移動同時地,亦進行如下之作業。首先,使第1梭子4移動至-X方向側,而形成托盤43相對於檢查用插口6沿+Y方向排列之狀態,並且形成托盤42相對於供給托盤2沿+Y方向排列之狀態。其次,藉由供給機器人7,將收納於供給托盤2中之IC元件100轉移至托盤42上,將IC元件100收納於托盤42之各凹穴421中。然後,與上述同樣地,藉由載置狀態檢測器件200,檢測收納於各凹穴421中之IC元件100之載置狀態。 (步驟10) 其次,如圖20所示,使第1手單元支持部913下降,將由各第1手單元92保持之IC元件100配置於檢查用插口6之各檢查用個別插口61內。然後,藉由檢查控制部101,對各檢查用個別插口61內之IC元件100實施電氣特性之檢查。若該檢查結束,則使第1手單元支持部913上升,自檢查用個別插口61中取出由各第1手單元92保持之IC元件100。 與此種作業同時地進行如下之作業。首先,將各第2手單元93所保持之檢查結束之IC元件100收納於托盤53之各凹穴531中。其次,使第2梭子5移動至+X方向側,而形成托盤52相對於檢查用插口6沿-Y方向排列且位於第2手單元93之正下方之狀態,並且形成托盤53相對於回收托盤3沿+Y方向排列之狀態。其次,各第2手單元93保持收納於托盤52中之IC元件100,並且藉由回收機器人8,將收納於托盤53中之檢查結束之IC元件100轉移至回收托盤3中。 (步驟11) 自此以後,重複上述步驟7~步驟10。再者,於該重複之途中,若收納於供給托盤2中之IC元件100已全部移動至第1梭子4中,則供給托盤2向區域S外移動。然後,於向供給托盤2供給新IC元件100、或已與收納有IC元件100之其他供給托盤2交換之後,供給托盤2再次向區域S內移動。同樣地,於重複之途中,若IC元件100已收納於回收托盤3之所有凹穴31中,則回收托盤3向區域S外移動。然後,卸除收納於回收托盤3中之IC元件100,或將回收托盤3更換成其他空回收托盤3,之後回收托盤3再次向區域S內移動。 根據此種方法,可以較佳效率進行IC元件100之檢查。具體而言,檢查用機器人9具有第1手單元92及第2手單元93,例如,於正利用檢查用插口6檢查第1手單元92(關於第2手單元93亦相同)所保持之IC元件100之狀態下,第2手單元93同時將已完成檢查之IC元件100收納於托盤53中,並且保持下個要檢查之IC元件100而等待。如此,可使用2個手單元,分別同時地進行不同之作業,藉此可削減無需之時間,而有效率地進行IC元件100之檢查。 <第2實施形態> 其次,對本發明之檢查裝置之第2實施形態進行說明。 圖21係表示本發明之第2實施形態之檢查裝置所具有之供給機器人之手單元之平面圖,圖22係圖21所示之手單元所具有之支持部之平面圖。 以下,以與上述實施形態之不同點為中心,對第2實施形態之檢查裝置進行說明,關於相同之事項,省略其說明。 本發明之第2實施形態之檢查裝置除了供給機器人及回收機器人之手單元所具有之Y方向移動機構之構成不同以外,其他與上述第1實施形態相同。再者,對與上述第1實施形態相同之構成,標註相同符號。又,於本實施形態中,供給機器人所具有之手單元與回收機器人所具有之手單元之構成彼此相同,故而以下,以供給機器人所具有之手單元為代表而進行說明,關於回收機器人所具有之手單元,省略其說明。 如圖21所示,本實施形態之手單元7c所具有之Y方向移動機構77'包括:第1支持部用單元1100,其設置於第1支持部71上;第2支持部用單元1200,其設置於第2支持部72上;第3支持部用單元1300,其設置於第3支持部73上;第4支持部用單元1400,其設置於第4支持部74上;及驅動機構1500,其驅動各單元1100、1200、1300、1400。 驅動機構1500包括:一對滑輪(第1移動機構用第1引導輪、第1移動機構用第2引導輪)1508、1509,其設置於第2基底752上;皮帶(第1移動機構用第1環形驅動索)1510,其架設於一對滑輪1508、1509之間;花鍵軸(動力傳遞軸)1501,其同軸固定於滑輪1509上,且沿X方向延伸;4個花鍵螺帽1502、1503、1504、1505,其設置於花鍵軸1501之外周;及馬達1507,其使滑輪1508旋轉。 馬達1507固定於第2基底752上。若驅動馬達1507,則其驅動力經由皮帶1510傳遞至滑輪1509,而使花鍵軸1501繞其軸旋轉。以此方式,藉由將馬達1507固定於基部75上,可使馬達1507穩定地驅動,並且可防止第1~第4支持部71~74之重量之增加。 4個花鍵螺帽1502、1503、1504、1505分別相對於花鍵軸1501向其軸向自如移動,但繞其軸之旋轉受到限制。即,若花鍵軸1501藉由馬達1507而旋轉,則花鍵螺帽1502、1503、1504、1505亦分別旋轉。 又,花鍵螺帽1502、1503、1504、1505之中,花鍵螺帽1502旋轉自如地支持於第1支持部71上,花鍵螺帽1503旋轉自如地支持於第2支持部72上,花鍵螺帽1504旋轉自如地支持於第3支持部73上,花鍵螺帽1505旋轉自如地支持於第4支持部74上。 再者,如上所述,花鍵螺帽1503、1504、1505相對於花鍵軸1501向其軸向(X方向)自如移動,故而Y方向移動機構77'不會阻礙第2、第3、第4支持部72、73、74藉由X方向移動機構76向X方向之移動。 如圖22所示,第1支持部用單元1100包括一對滑輪(第1移動機構用第3引導輪、第1移動機構用第4引導輪)1101、1102、及架設於一對滑輪1101、1102之間之皮帶(第1移動機構用第2環形驅動索)1103。其中,滑輪1101同軸固定於花鍵螺帽1502上,與花鍵螺帽1502一併繞花鍵軸1501之軸旋轉。又,滑輪1102係相對於滑輪1101於Y方向上相隔,且旋轉自如地支持於第1支持部71上。而且,於該等滑輪1101、1102之間架設有皮帶1103。皮帶1103於滑輪1101、1102之間具有沿Y方向延伸之2個區域1103a、1104b,於區域1103a內第1移動部715固定於皮帶1103上。再者,花鍵螺帽1503亦可兼作滑輪1101。 第2支持部用單元1200之構成與上述第1支持部用單元1100之構成相同。第2支持部用單元1200包括一對滑輪(第1移動機構用第5引導輪、第1移動機構用第6引導輪)1201、1202、及架設於一對滑輪1201、1202之間之皮帶(第1移動機構用第3環形驅動索)1203。其中,滑輪1201同軸固定於花鍵螺帽1503上,與花鍵螺帽1503一併繞花鍵軸1501旋轉。又,滑輪1202係相對於滑輪1201於Y方向上相隔,且旋轉自如地支持於第2支持部72上。而且,於該等滑輪1201、1202之間架設有皮帶1203。皮帶1203於滑輪1201、1202之間具有沿Y方向延伸之2個區域1203a、1204b,於區域1203a內第2移動部725固定於皮帶1203上。 第3支持部用單元1300之構成亦與上述第1支持部用單元1100之構成相同。第3支持部用單元1300包括一對滑輪(第1移動機構用第7引導輪、第1移動機構用第8引導輪)1301、1302、及架設於一對滑輪1301、1302之間之皮帶(第1移動機構用第4環形驅動索)1303。其中,滑輪1301同軸固定於花鍵螺帽1504上,與花鍵螺帽1504一併繞花鍵軸1501旋轉。又,滑輪1302係相對於滑輪1301於Y方向上相隔,且旋轉自如地支持於第3支持部73上。而且,於該等滑輪1301、1302之間架設有皮帶1303。皮帶1303於滑輪1301、1302之間具有沿Y方向延伸之2個區域1303a、1304b,於區域1303a內第3移動部735固定於皮帶1303上。 第4支持部用單元1400之構成亦與上述第1支持部用單元1100之構成相同。第4支持部用單元1400包括一對滑輪(第1移動機構用第9引導輪、第1移動機構用第10引導輪)1401、1402、及架設於一對滑輪1401、1402之間之皮帶(第1移動機構用第5環形驅動索)1403。其中,滑輪1401同軸固定於花鍵螺帽1505上,且與花鍵螺帽1505一併繞花鍵軸1501旋轉。又,滑輪1402係相對於滑輪1401於Y方向上相隔,且旋轉自如地支持於第4支持部74上。而且,於該等滑輪1401、1402之間架設有皮帶1403。皮帶1403於滑輪1401、1402之間具有沿Y方向延伸之2個區域1403a、1404b,於區域1403a內第4移動部745係固定於皮帶1403上。 再者,滑輪1101、1102、1201、1202、1301、1302、1401、1402分別具有相等之外徑。 於此種構成之Y方向移動機構77'中,若藉由馬達1507使花鍵軸1501旋轉,而將其旋轉力傳遞至各滑輪1101、1201、1301、1401,使各皮帶1103、1203、1303、1403旋轉,則於區域1103a、1203a、1303a、1403a中,皮帶1103、1203、1303、1403向Y方向之相同側以相等之速度進給。從而,若皮帶1103、1203、1303、1403旋轉,則各移動部715、725、735、745相對於各支持部71、72、73、74於Y方向上一體地且以相等之距離移動。 根據此種構成之Y方向移動機構77,可確實地一面將吸附嘴713、718之相隔距離、吸附嘴723、728之相隔距離、吸附嘴733、738之相隔距離、及吸附嘴743、748之相隔距離維持為彼此相等,一面變更該等相隔距離。又,於Y方向移動機構77中,每個支持部71~74均設置有專用之單元,故而可更確實地使各移動部715~745向Y方向移動。 於此種第2實施形態中,亦可發揮與上述第1實施形態相同之效果。 再者,於上述驅動機構1500中,形成將花鍵軸1501與花鍵螺帽1502~1505組合之構成,但只要可發揮與該等相同之機能,則驅動機構1500之構成並無特別限定。 以上,基於圖示之實施形態,對本發明之處理器及檢查裝置進行了說明,但本發明並不限定於此,各部之構成可置換成具有相同功能之任意之構成。又,於本發明中,亦可添加其他任意之構成物。又,亦可將各實施形態適當地組合。Hereinafter, the inspection device (inspection device of the present invention) to which the processor of the present invention is applied will be described in detail based on the embodiment shown in the drawings. <First Embodiment> Fig. 1 is a schematic plan view showing a first embodiment of the inspection device of the present invention, and Fig. 2 is a perspective view of a hand unit supplied to a robot having the inspection value shown in Fig. 1, and Fig. 3 is a diagram A plan view of a hand unit for a robot provided with the inspection value shown in FIG. 1 is a plan view of a first support portion provided in the hand unit shown in FIG. 2, and FIG. 5 is a view provided in the hand unit shown in FIG. 2. FIG. 6 is a plan view of the third support portion of the hand unit shown in FIG. 2, and FIG. 7 is a plan view of the fourth support portion of the hand unit shown in FIG. 2. 2 are plan views showing the X-direction moving mechanism of the hand unit shown in FIG. 2, and FIGS. 9 and 10 are plan views showing the Y-direction moving mechanism of the hand unit shown in FIG. 2, and FIG. 11 is shown in FIG. 1. A perspective view of a hand unit of the inspection robot included in the inspection device. FIGS. 12 to 20 are plan views illustrating the inspection sequence of the electronic parts of the inspection device shown in FIG. 1. In the following, for convenience of explanation, as shown in FIG. 1, the three axes orthogonal to each other are X axis (first axis), Y axis (second axis), and Z axis (third axis). The direction parallel to the X axis is referred to as "X direction (first direction)", the direction parallel to the Y axis is referred to as "Y direction (second direction)", and the direction parallel to the Z axis is referred to as " Z direction. " In each of the X direction, the Y direction, and the Z direction, the front end side of the arrow is referred to as "+", and the end side of the arrow is referred to as "-". The inspection device 1 shown in FIG. 1 is used to test parts (electronic parts) such as IC elements (IC chips), LCD (Liquid Crystal Display), and CIS (Contact Image Sensor). It is a device for checking and testing the electrical characteristics of 100. In the following, for convenience of explanation, a case where an IC element is used as a test part will be described as a representative. The inspection device 1 includes a supply tray 2, a recovery tray 3, a first shuttle 4, a second shuttle 5, an inspection socket (inspection section) 6, a supply robot 7, a recovery robot 8, an inspection robot 9, a first camera 600, and a first 2 a camera 500, and a control device 10 that controls the various parts. In such an inspection device 1, a configuration is formed in which the inspection socket 6 is removed from each of these parts, that is, a supply tray 2, a recovery tray 3, a first shuttle 4, a second shuttle 5, a supply robot 7, and a recovery robot 8. The inspection robot 9, the first camera 600, the second camera 500, and the control device 10 constitute a processor (the processor of the present invention) that executes the transfer of the IC element 100. Furthermore, the configuration of the processor is not limited to this, and at least one of these sections may be omitted as needed, or other configurations (for example, a hot plate or a chamber) may be added. In addition, the inspection device 1 includes a base 11 on which the above-mentioned parts are mounted, and a safety cover (not shown) which is covered on the base 11 so as to accommodate the above-mentioned parts, and is inside the safety cover (hereinafter referred to as "area S") The first shuttle 4, the second shuttle 5, the inspection socket 6, the supply robot 7, the recovery robot 8, the inspection robot 9, the first camera 600 and the second camera 500 are arranged, and can be moved inside and outside the area S In one aspect, the supply tray 2 and the collection tray 3 are arranged. Hereinafter, these units will be described in detail in order. 1. Supply Tray The supply tray 2 is a tray for transferring the IC components 100 to be inspected from outside the area S to the inside of the area S. As shown in FIG. 1, the supply tray 2 is formed in a plate shape, and a plurality of recesses 21 are formed on the upper surface of the supply tray 2 in a matrix form along the X direction and the Y direction for mounting the IC device 100. Such a supply tray 2 is placed on a platform (not shown) moving on a track 23 extending in the Y direction so as to span the inside and outside of the area S. In addition, the supply tray 2 can be moved back and forth in the ± Y direction along the rail 23 by moving the above-mentioned platform by a driving device (not shown) using, for example, a linear motor as a driving source. Therefore, the following operations can be repeated: placing the supply tray 2 containing the IC components 100 on a platform outside the area S, moving the supply tray 2 and the platform into the area S together, and unloading from the supply tray 2 After removing all the IC components 100, the supply tray 2 is moved again outside the area S together with the platform. 2. Recycling Tray The recycling tray 3 is a tray for accommodating the IC device 100 after the inspection and transferring it from the area S to the area outside the area S. As shown in FIG. 1, the recovery tray 3 is formed in a plate shape, and a plurality of recesses 31 are formed on the upper surface thereof in a matrix shape along the X direction and the Y direction for mounting the IC device 100. Such a recovery tray 3 is placed on a platform (not shown) moving on the rail 33 extending in the Y direction so as to span the inside and outside of the area S. Further, the recovery tray 3 can be moved back and forth in the ± Y direction along the rail 33 by moving the above-mentioned platform by a driving device (not shown) using, for example, a linear motor as a driving source. Therefore, in the area S, the following operations can be repeated: store the IC component 100 that has completed the inspection in the recovery tray 3, move the recovery tray 3 outside the area S, replace the recovery tray 3 on the platform with an empty tray, and then The collection tray 3 is moved into the area S again. Such a recovery tray 3 is provided apart from the supply tray 2 in the + X direction, and a first shuttle 4, a second shuttle 5, and an inspection socket 6 are arranged between the supply tray 2 and the recovery tray 3. 3. The first shuttle and the first shuttle 4 will be transported to the IC component 100 in the area S by the supply tray 2 and then to the vicinity of the inspection socket 6. Therefore, it is further used to inspect the inspection using the inspection socket 6 The completed IC device 100 is transported to the vicinity of the collection tray 3. As shown in FIG. 1, the first shuttle 4 includes a base member 41 and two trays 42 and 43 fixed to the base member 41. The two trays 42 and 43 are arranged along the X direction. In addition, eight recesses 421 and 431 are formed on the trays 42 and 43 in a matrix shape to arrange four in the X direction and two in the Y direction. . Among the trays 42 and 43, the tray 42 on the supply tray 2 side is used to transfer and store the IC components 100 stored in the supply tray 2, and the tray 43 on the recovery tray 3 side is used to store the used inspection. The tray of the IC device 100 whose electrical characteristics are checked by using the socket 6. That is, the tray 42 is a tray for storing the IC components 100 that have not been inspected, and the tray 43 is a tray for storing the IC components 100 that have been inspected. The first shuttle 4 series base member 41 is supported on a rail 44 extending in the X direction, and a drive device (not shown) using, for example, a linear motor as a driving source can move back and forth in the ± X direction along the rail 44. Moreover, the following two states can be formed: first, the first shuttle 4 is moved to the -X direction side, the tray 42 is aligned on the + Y direction side with respect to the supply tray 2, and the tray 43 is aligned on the + Y direction with respect to the inspection socket 6 The second state is that the first shuttle 4 is moved to the + X direction side, the tray 43 is aligned on the + Y direction side with respect to the recovery tray 3, and the tray 42 is aligned on the + Y direction side with respect to the inspection socket 6. 4. Second shuttle The second shuttle 5 has the same function and configuration as the first shuttle 4 described above. That is, the second shuttle 5 is transported to the IC component 100 in the area S by the supply tray 2 and further to the vicinity of the inspection socket 6. Therefore, it is further used to inspect the inspection performed by the inspection socket 6. The completed IC device 100 is transported to the vicinity of the collection tray 3. As shown in FIG. 1, the second shuttle 5 includes a base member 51 and two trays 52 and 53 fixed to the base member 51. The two trays 52 and 53 are arranged along the X direction. In addition, eight recesses 521 and 531 are formed on the trays 52 and 53 in a matrix form to arrange four in the X direction and two in the Y direction, respectively. Among the trays 52 and 53, the tray 52 on the supply tray 2 side is a tray for transferring and storing the IC components 100 stored in the supply tray 2, and the tray 43 on the recovery tray 3 side is for storing the used inspection socket. 6 Pallet of IC component 100 that has completed inspection of electrical characteristics. That is, the tray 52 is a tray for storing the IC component 100 that has not been inspected, and the tray 53 is a tray for storing the IC component 100 that has been inspected. This second shuttle 5 series base member 51 is supported on the rail 54 extending in the X direction, and can be moved back and forth along the rail 54 in the ± X direction by a driving device (not shown) using, for example, a linear motor as a driving source. Thereby, the following two states can be formed: first, the second shuttle 5 moves to the -X direction side, the tray 52 is aligned on the + Y direction side with respect to the supply tray 2, and the tray 53 is aligned on -Y with respect to the inspection socket 6 The second side is a state in which the second shuttle 5 moves to the + X direction side, the tray 53 is aligned on the + Y direction side with respect to the recovery tray 3, and the tray 52 is aligned on the -Y direction side with respect to the inspection socket 6. In addition, the second shuttle 5 is provided apart from the first shuttle 4 in the -Y direction, and an inspection socket 6 is disposed between the first shuttle 4 and the second shuttle 5. 5. Inspection socket Inspection socket (inspection section) 6 is a socket for inspecting the electrical characteristics of the IC component 100. Such an inspection socket 6 includes eight inspection individual sockets 61 for arranging the IC component 100, and the eight inspection individual sockets 61 are provided in such a manner that four are arranged in the X direction and two are arranged in the Y direction. In addition, the arrangement pitch of the eight individual inspection sockets 61 is substantially equal to the arrangement pitch of the eight recesses formed in each of the trays 42, 43, 52, and 53. This makes it possible to smoothly carry the IC device 100 between the trays 42, 43, 52, and 53 and the inspection individual socket 61. Although not shown, a plurality of probes protruding from the bottom of each of the individual inspection sockets 61 are provided. The plurality of probes are energized upward by springs or the like, respectively. When the IC element 100 is arranged in the inspection individual socket 61, a plurality of probes are brought into contact with external terminals of the IC element 100. As a result, a state where the IC element 100 and the control device 10 (the inspection control unit 101 described below) are electrically connected via a probe is formed, that is, a state in which the electrical characteristics of the IC element 100 can be inspected (tested). The inspection socket 6 is detachably fixed to the base 11. Therefore, the inspection socket 6 can be easily refitted in accordance with the target inspection (test), or the inspection socket 6 can be refitted according to the size or shape of the IC component 100. 6. First camera The first camera 600 is provided between the first shuttle 4 and the inspection socket 6. As described below, when the first hand unit 92 holding the unchecked IC element 100 passes above, the first camera 600 photographs the component mark 941 included in the IC element 100 and the first hand unit 92. 7. Second camera The second camera 500 has the same function as the first camera 600 described above. Such a second camera 500 is provided between the second shuttle 5 and the inspection socket 6. As described below, when the second camera unit 500 holding the unchecked IC device 100 passes above, the second camera 500 photographs the component marks of the IC device 100 and the second hand unit 93. 8. Supply Robot The supply robot 7 is a robot that transfers the IC components 100 stored in the supply tray 2 to the trays 42 and 52. As shown in FIG. 1, the supply robot 7 includes: a support frame 7 a that is supported on the base 11; a moving frame 7 b that is supported on the support frame 7 a and can move back and forth in the ± Y direction relative to the support frame 7 a; The hand unit 7c is supported on the moving frame 7b, and can move back and forth in the ± X axis direction relative to the moving frame 7b. A track extending in the Y direction is formed on the support frame 7a, and the moving frame 7b moves back and forth in the Y direction along the track. Further, a track extending in the X direction is formed on the moving frame 7b, and the hand unit 7c moves back and forth in the X direction along the track. The movement of the moving frame 7b with respect to the supporting frame 7a and the movement of the hand unit 7c with respect to the moving frame 7b are performed by a driving device (not shown) using, for example, a linear motor as a driving source. Hereinafter, the opponent unit 7 c will be described in detail based on FIGS. 2 to 10. In addition, in each of FIGS. 2 to 10, for convenience of explanation, a part of the configuration is not shown. As shown in FIGS. 2 and 3, the hand unit 7 c has a base portion 75, and the base portion 75 is supported to be movable in the X direction with respect to the moving frame 7 b. The "base portion" refers to a portion that supports other members (for example, the first to fourth support portions 71 to 74 described below) and brings them together, and forms the basis of the hand unit 7c. Such a base portion 75 includes: a first base 751 formed in a plate shape having a widening on the XY plane and a thickness in the Z direction; and a second base 752 from the -X direction side of the first base 751 The end portion extends downward (-Z direction), has a widening in the ZY plane, and has a thickness in the X direction. That is, the base portion 75 is formed in an L-shaped outer shape that is bent halfway. Among the two bases 751 and 752, at least a part of the parts constituting the following X-direction moving mechanism 76 is fixed to the first base 751, and on the second base 752, the following Y-direction moving mechanism 77 is fixed. At least part of a part. The hand unit 7 c includes four support sections supported on the base section 75, and specifically includes a first support section 71, a second support section 72, a third support section 73, and a fourth support section 74. The four support sections are arranged in the order of the third support section 73, the second support section 72, the first support section 71, and the fourth support section 74 from the −X direction to the + X direction. In addition, the above-mentioned "support" refers to being connected in a state of being prevented from falling from the base portion 75. A first support portion 71 of the four support portions 71 to 74 is fixed to the first base 751. The “fixed” means that the relative position of the first support portion 71 with respect to the base portion 75 does not change during operation. The other second, third, and fourth support portions 72, 73, and 74 are movable in the X direction with respect to the first base 751, respectively. In this embodiment, a track 753 extending in the X direction is formed on the lower surface of the first base 751, and three guides 754, 755, and 756 that can move on the track 753 are arranged on the track 753. A second support portion 72 is fixed to the guide 754, a third support portion 73 is fixed to the guide 755, and a fourth support portion 74 is fixed to the guide 756. With this configuration, the second, third, and fourth support portions 72, 73, and 74 can move in the X direction relative to the base portion 75. The first, second, third, and fourth support portions 71, 72, 73, and 74 are formed in a plate shape having a widening on the YZ plane and a thickness in the X direction. In this way, by forming each support portion 71 to 74 in a plate shape having a widening on the YZ plane, the support portions 71 to 74 can be arranged side by side in the X direction with a narrower pitch. Therefore, the miniaturization of the hand unit 7c can be achieved, and a plurality of suction nozzles described below can be arranged at a narrow pitch in the X direction. Hereinafter, the first, second, third, and fourth support sections 71, 72, 73, and 74 will be described in detail. Each of the support sections 71 to 74 has the same configuration. 8-1. First Supporting Section As shown in FIG. 4, a first component holding mechanism 711 is provided on the first supporting section 71. The first parts holding mechanism 711 has a function of holding the IC 100 conveyed from the supply tray 2 to the trays 42 and 52. Such a first part holding mechanism 711 includes: a shaft 712 supported on the first support portion 71 and capable of moving back and forth in the ± Z direction relative to the first support portion 71; a suction nozzle (first part holding portion) 713, It is provided at the front end portion (lower end portion) of the shaft 712, and the drive mechanism 714 moves the suction nozzle 713 in the ± Z direction relative to the first support portion 71 via the shaft 712. The first component holding mechanism 711 having such a structure lowers the suction nozzle 713 through the shaft 712 by the driving mechanism 714, and sucks the IC element 100 by the suction nozzle 713, thereby holding the IC element 100. In this way, the IC element 100 is held by suction, whereby stress applied to the IC element 100 can be suppressed, and damage to the IC element 100 can be prevented. Moreover, the IC element 100 can be held in a simple structure and reliably. In addition, the above-mentioned "holding" means that the IC 100 is continuously adsorbed to such an extent that the IC element 100 does not fall. The configuration of the drive mechanism 714 is not particularly limited as long as the shaft 712 can be moved back and forth in the Z direction relative to the first support portion 71. In this embodiment, it includes a pair of pulleys (guide wheels) 714a, 714b, A belt (an endless drive cable) 714c that is set between a pair of pulleys 714a and 714b, and a motor (drive source) 714d that rotates the pulley 714a. The pulleys 714a and 714b are rotatably supported on a main surface of the first support portion 71 via a shaft (not shown). In addition, the pulleys 714a and 714b are provided apart from each other in the Z direction. Therefore, the belt 714c has a region extending in the Z-axis direction, and the shaft 712 is fixed in this region via the fixing portion 714e. When the pulley 714a is rotated by the motor 714d, the pulley 714b and the belt 714c rotate accordingly, and the shaft 712 (suction nozzle 713) fixed to the belt 714c moves in the Z-axis direction with respect to the first support portion 71. By selecting the rotation direction of the motor 714d, the suction nozzle 713 can be raised or lowered relative to the first support portion 71. In addition, as long as the driving as described above can be realized, the configuration of the guide wheel, the ring-shaped driving cable, and the driving source is not particularly limited. For example, a sprocket may be used instead of the pulleys 714a and 714b as a pair of guide wheels, and a chain may be used instead of the belt 714c as the endless driving cable. Alternatively, instead of the motor 714d, a piezoelectric actuator may be used as a drive source. The first support portion 71 is provided with a first moving portion 715 capable of moving back and forth in the Y direction with respect to the first support portion 71. A rail (guide portion) extending in the Y direction is provided on the first support portion 71, and the first moving portion 715 is movable along the rail. Furthermore, as long as the first moving part 715 can be guided in the Y direction, a groove or a slot extending in the Y direction may be used instead of the above-mentioned track. A second component holding mechanism 716 is provided on the first support portion 71. The second part holding mechanism 716 has a function of holding the IC 100 that is carried from the supply tray 2 to the trays 42 and 52 in the same manner as the first part holding mechanism 711. Such a second part holding mechanism 716 includes a shaft 717 supported on the first moving part 715 and capable of moving back and forth in the Z direction relative to the first moving part 715, and a suction nozzle (second part holding part) 718, which It is provided at the front end of the shaft 717, and a drive mechanism 719 moves the suction nozzle 718 in the Z direction with respect to the first moving portion 715 via the shaft 717. The second component holding mechanism 716 having such a configuration lowers the suction nozzle 718 through the shaft 717 by the driving mechanism 719, and sucks the IC element 100 by the suction nozzle 718, thereby holding the IC element 100. The configuration of the driving mechanism 719 is not particularly limited as long as the shaft 717 can be moved back and forth in the ± Z direction, but in this embodiment, it has the same configuration as the driving mechanism 714 described above. That is, the drive mechanism 719 includes a pair of pulleys 719a and 719b, a belt 719c stretched between the pair of pulleys 719a and 719b, and a motor 719d that rotates the pulley 719a. The pulleys 719a and 719b are rotatably supported on a main surface of the first support portion 71 via a shaft (not shown). In addition, the pulleys 719a and 719b are provided apart from each other in the Z direction. Therefore, the belt 719c has a region extending in the Z-axis direction, and the shaft 717 is fixed in this region via the fixing portion 719e. When the pulley 719a is rotated by the motor 719d, the pulley 719b and the belt 719c rotate accordingly, so that the shaft 717 (suction nozzle 718) fixed to the belt 719c moves in the Z-axis direction relative to the first support portion 71. By selecting the rotation direction of the motor 719d, the suction nozzle 718 can be raised or lowered relative to the first support portion 71. In addition, the fixed portion 719e expands and contracts freely in the Y direction, and expands or contracts with the movement of the first moving portion 715 in the Y direction with respect to the first support portion 71. Therefore, the Y-direction movement of the first moving portion 715 relative to the first support portion 71 is not hindered. Further, each part (a pair of pulleys 719a and 719b, a belt 719c, and a motor 719d) constituting the driving mechanism 719 may be provided on the first moving part 715. With such a configuration, it is not necessary to make the fixing portion 719e a flexible configuration. 8-2. Second Supporting Section As shown in FIG. 5, a third component holding mechanism 721 is provided on the second supporting section 72. The third component holding mechanism 721 has a function of holding the IC 100 conveyed from the supply tray 2 to the trays 42 and 52 in the same manner as the first component holding mechanism 711 described above. The configuration of the third component holding mechanism 721 is the same as that of the first component holding mechanism 711 described above. That is, the third component holding mechanism 721 includes a shaft 722 supported on the second support portion 72 and movable back and forth in the Z direction with respect to the second support portion 72, and a suction nozzle (third component holding portion) 723, which It is provided at the front end portion of the shaft 722; and a drive mechanism 724 that moves the suction nozzle 723 in the ± Z direction relative to the second support portion 72 via the shaft 722. The third component holding mechanism 721 having such a structure lowers the suction nozzle 723 through the shaft 722 by the driving mechanism 724, and sucks the IC element 100 by the suction nozzle 723, thereby holding the IC element 100. The driving mechanism 724 includes a pair of pulleys 724a and 724b, a belt 724c stretched between the pair of pulleys 724a and 724b, and a motor 724d that rotates the pulley 724a. The pulleys 724a and 724b are rotatably supported on a main surface of the second support portion 72 via a shaft (not shown). In addition, the pulleys 724a and 724b are provided apart from each other in the Z direction. Therefore, the belt 724c has a region extending in the Z-axis direction, and the shaft 722 is fixed in this region via the fixing portion 724e. When the pulley 724a is rotated by the motor 724d, the shaft 722 (suction nozzle 723) fixed to the belt 724c moves in the Z-axis direction with respect to the second support portion 72. A second moving portion 725 is provided on the second support portion 72 so as to be able to move back and forth in the Y direction with respect to the second support portion 72. A rail extending in the Y direction is provided on the second support portion 72, and the second moving portion 725 is movably provided along the rail. With this configuration, it is possible to simply and surely restrict the movement other than the Y direction of the second moving portion 725. A fourth component holding mechanism 726 is provided on the second support portion 72. The fourth component holding mechanism 726 has a function of holding the IC 100 conveyed from the supply tray 2 to the trays 42 and 52 in the same manner as the second component holding mechanism 716 described above. The configuration of the fourth component holding mechanism 726 is the same as that of the second component holding mechanism 716 described above. That is, the fourth component holding mechanism 726 includes: a shaft 727 supported on the second moving portion 725 and movable back and forth in the ± Z direction with respect to the second moving portion 725; a suction nozzle (fourth component holding portion) 728, It is provided at the front end portion of the shaft 727; and a drive mechanism 729 moves the suction nozzle 728 in the Z direction with respect to the second moving portion 725 via the shaft 727. The fourth component holding mechanism 726 having the above-mentioned structure lowers the suction nozzle 728 through the shaft 727 by the driving mechanism 729, and sucks the IC element 100 by the suction nozzle 728, thereby holding the IC element 100. In addition, the driving mechanism 729 includes a pair of pulleys 729a and 729b, a belt 729c stretched between the pair of pulleys 729a and 729b, and a motor 729d that rotates the pulley 729a. The pulleys 729a and 729b are rotatably supported on a main surface of the second support portion 72 via a shaft (not shown). In addition, the pulleys 729a and 729b are provided apart from each other in the Z direction. Therefore, the belt 729c has a region extending in the Z-axis direction, and the shaft 727 is fixed in this region via the fixing portion 729e. When the pulley 729a is rotated by the motor 729d, the shaft 727 (suction nozzle 728) fixed to the belt 729c moves in the Z-axis direction with respect to the second support portion 72. In addition, the fixed portion 729e expands and contracts freely in the Y direction, and expands or contracts with the movement of the second moving portion 725 in the Y direction of the second support portion 72. Therefore, the Y-direction movement of the second moving portion 725 relative to the second support portion 72 is not hindered. 8-3. Third Support Section As shown in FIG. 6, a fifth component holding mechanism 731 is provided on the third support section 73. The fifth component holding mechanism 731 has a function of holding the IC 100 conveyed from the supply tray 2 to the trays 42 and 52 in the same manner as the first component holding mechanism 711 described above. The structure of the fifth component holding mechanism 731 is the same as that of the first component holding mechanism 711 described above. That is, the fifth component holding mechanism 731 includes a shaft 732 supported on the third support portion 73 and movable back and forth in the Z direction with respect to the third support portion 73, and a suction nozzle (fifth component holding portion) 733, which It is provided in the front end part of the shaft 732, and the drive mechanism 734 moves the suction nozzle 733 in the Z direction with respect to the 3rd support part 73 via the shaft 732. The fifth component holding mechanism 731 having such a configuration lowers the suction nozzle 733 through the shaft 732 through the drive mechanism 734, and sucks the IC element 100 through the suction nozzle 733, thereby holding the IC element 100. The drive mechanism 734 includes a pair of pulleys 734a and 734b, a belt 734c stretched between the pair of pulleys 734a and 734b, and a motor 734d that rotates the pulley 734a. The pulleys 734a and 734b are rotatably supported on a main surface of the third support portion 73 via an axis (not shown). In addition, the pulleys 734a and 734b are provided apart from each other in the Z direction. Therefore, the belt 734c has a region extending in the Z-axis direction, and the shaft 732 is fixed in this region via the fixing portion 734e. When the pulley 734a is rotated by the motor 734d, the shaft 732 (suction nozzle 733) fixed to the belt 734c moves in the Z-axis direction with respect to the third support portion 73. A third moving portion 735 is provided on the third support portion 73 so as to be able to move back and forth in the Y direction with respect to the third support portion 73. A rail extending in the Y direction is provided on the third support portion 73, and the third moving portion 735 is movably provided along the rail. With such a configuration, movement in the third moving portion 735 other than the Y direction can be easily and reliably restricted. A sixth component holding mechanism 736 is provided on the third support portion 73. The sixth component holding mechanism 736 has a function of holding the IC 100 conveyed from the supply tray 2 to the trays 42 and 52 in the same manner as the second component holding mechanism 716 described above. The configuration of the sixth component holding mechanism 736 is the same as that of the second component holding mechanism 716 described above. That is, the sixth part holding mechanism 736 includes a shaft 737 supported on the third moving part 735 and capable of moving back and forth in the Z direction relative to the third moving part 735, and a suction nozzle (sixth part holding part) 738, which It is provided at the front end portion of the shaft 737; and a drive mechanism 739 that moves the suction nozzle 738 in the Z direction with respect to the third moving portion 735 via the shaft 737. The sixth component holding mechanism 736 having the above-mentioned structure lowers the suction nozzle 738 through the shaft 737 through the drive mechanism 739, and sucks the IC element 100 through the suction nozzle 738, thereby holding the IC element 100. The drive mechanism 739 includes a pair of pulleys 739a and 739b, a belt 739c stretched between the pair of pulleys 739a and 739b, and a motor 739d that rotates the pulley 739a. The pulleys 739a and 739b are rotatably supported on a main surface of the third support portion 73 via a shaft (not shown). In addition, the pulleys 739a and 739b are provided apart from each other in the Z direction. Therefore, the belt 739c has a region extending in the Z-axis direction, and the shaft 737 is fixed in this region via the fixing portion 739e. When the pulley 739a is rotated by the motor 739d, the shaft 737 (suction nozzle 738) fixed to the belt 739c moves in the Z-axis direction relative to the third support portion 73. In addition, the fixed portion 739e expands and contracts freely in the Y direction, and expands or contracts with the movement of the third moving portion 735 in the Y direction of the third support portion 73. Therefore, the Y-direction movement of the third moving portion 735 relative to the third support portion 73 is not hindered. 8-4. Fourth Support Section As shown in FIG. 7, a seventh component holding mechanism 741 is provided on the fourth support section 74. The seventh parts holding mechanism 741 has a function of holding the IC 100 conveyed from the supply tray 2 to the trays 42 and 52 similarly to the first parts holding mechanism 711 described above. The configuration of the seventh component holding mechanism 741 is the same as that of the first component holding mechanism 711 described above. That is, the seventh component holding mechanism 741 includes a shaft 742 supported on the fourth support portion 74 and movable back and forth in the Z direction with respect to the fourth support portion 74, and a suction nozzle (seventh component holding portion) 743, which It is provided at the front end portion of the shaft 742; and a drive mechanism 744 moves the suction nozzle 743 in the Z direction relative to the fourth support portion 74 via the shaft 742. The seventh component holding mechanism 741 having such a structure lowers the suction nozzle 743 through the shaft 742 by the driving mechanism 744, and sucks the IC element 100 by the suction nozzle 743, thereby holding the IC element 100. The drive mechanism 744 includes a pair of pulleys 744a and 744b, a belt 744c stretched between the pair of pulleys 744a and 744b, and a motor 744d that rotates the pulley 744a. The pulleys 744a and 744b are rotatably supported on a main surface of the fourth support portion 74 via a shaft (not shown). The pulleys 744a and 744b are provided apart from each other in the Z direction. Therefore, the belt 744c has a region extending in the Z-axis direction, and the shaft 742 is fixed in this region via the fixing portion 744e. When the pulley 744a is rotated by the motor 744d, the shaft 742 (suction nozzle 743) fixed to the belt 744c moves in the Z-axis direction with respect to the third support portion 73. A fourth moving portion 745 is provided on the fourth supporting portion 74 so as to be able to move back and forth in the Y direction with respect to the fourth supporting portion 74. A rail extending in the Y direction is provided on the fourth support portion 74, and a fourth moving portion 745 is movably provided along the rail. With such a configuration, movement in the fourth moving portion 745 other than the Y direction can be easily and reliably restricted. An eighth component holding mechanism 746 is provided on the fourth support portion 74. The eighth parts holding mechanism 746 has a function of holding the IC 100 conveyed from the supply tray 2 to the trays 42 and 52 similarly to the second parts holding mechanism 716 described above. The configuration of the eighth component holding mechanism 746 is the same as that of the second component holding mechanism 716 described above. That is, the eighth part holding mechanism 746 includes a shaft 747 that is supported on the fourth moving part 745 and can move back and forth in the Z direction with respect to the fourth moving part 745, and a suction nozzle (eighth part holding part) 748, which It is provided at the front end portion of the shaft 747; and a drive mechanism 749 moves the suction nozzle 748 in the Z direction relative to the fourth moving portion 745 via the shaft 747. The eighth component holding mechanism 746 having such a structure lowers the suction nozzle 748 through the shaft 747 by the driving mechanism 749, and sucks the IC element 100 by the suction nozzle 748, thereby holding the IC element 100. The driving mechanism 739 includes a pair of pulleys 749a and 749b, a belt 749c stretched between the pair of pulleys 749a and 749b, and a motor 749d that rotates the pulley 749a. The pulleys 749a and 749b are rotatably supported on a main surface of the fourth support portion 74 via a shaft (not shown). In addition, the pulleys 749a and 749b are provided apart from each other in the Z direction. Therefore, the belt 749c has a region extending in the Z-axis direction, and the shaft 747 is fixed in this region via the fixing portion 749e. When the pulley 749a is rotated by the motor 749d, the shaft 747 (suction nozzle 748) fixed to the belt 749c moves in the Z-axis direction with respect to the fourth support portion 74. In addition, the fixed portion 749e can expand and contract freely in the Y direction, and can be extended or contracted together with the movement of the fourth moving portion 745 in the Y direction with respect to the fourth support portion 74. Therefore, the Y-direction movement of the fourth moving portion 745 relative to the fourth support portion 74 is not hindered. The configuration of each of the support sections 71, 72, 73, and 74 has been described in detail above. Here, the suction nozzles 733, 723, 713, and 743 are sequentially arranged in the X direction, and are arranged at equal intervals. That is, the distance between the suction nozzle 733 and the suction nozzle 723, the distance between the suction nozzle 723 and the suction nozzle 713, and the distance between the suction nozzle 713 and the suction nozzle 743 are substantially equal to each other. In addition, the suction nozzle 718 is arranged along the Y direction with respect to the suction nozzle 713. Similarly, the suction nozzle 728 is arranged along the Y direction with respect to the suction nozzle 723, and the suction nozzle 738 is arranged along the Y direction with respect to the suction nozzle 733. In addition, the suction nozzles 748 are arranged along the Y direction with respect to the suction nozzles 743. The distance between the suction nozzles 718, 713, the distance between the suction nozzles 728, 723, the distance between the suction nozzles 738, 733, and the distance between the suction nozzles 748, 743 are substantially equal to each other. That is, the suction nozzles 738, 728, 718, and 748 are also arranged sequentially in the X direction, and are arranged at equal intervals. The hand unit 7c further includes an X-direction moving mechanism (a second moving mechanism) 76 that moves the second, third, and fourth support portions 72, 73, and 74 in the X direction relative to the base portion 75 (the first support portion 71). And a Y-direction moving mechanism (first moving mechanism) 77 that moves each of the moving portions 715, 725, 735, and 745 in the Y direction with respect to the base portion 75. 8-5. X-direction movement mechanism X-direction movement mechanism 76 moves the second, third, and fourth support portions 72, 73, and 74 in the X direction relative to the first support portion 71 to move the suction nozzle 733 (738 ) The distance from the suction nozzle 723 (728), the distance between the suction nozzle 723 (728) and the suction nozzle 713 (718), and the distance between the suction nozzle 713 (718) and the suction nozzle 743 (748) are kept equal to each other. , While changing the way of these separation distances. As shown in FIG. 8, the X-direction moving mechanism 76 includes a pair of two-stage pulleys (the first guide wheel for the second moving mechanism and the second guide wheel for the second moving mechanism) 761, 762, and a pair of two-stage pulleys 761. Two belts between 762 and 762 (the first endless driving cable for the second moving mechanism, the second endless driving cable for the second moving mechanism) 763, 764, and a motor (for the second moving mechanism) that rotates the second stage pulley 761 Drive source) 765. Among these, the second-stage pulleys 761, 762, and the motor 765 are supported on the first base 751, respectively. The two-stage pulleys 761 and 762 can rotate on the upper surface of the first base 751 about an axis extending in the Y direction. Further, the two-stage pulleys 761 and 762 are spaced apart from each other in the X direction. The second-stage pulley 761 includes: a small-diameter pulley 761a having a small outer diameter; and a large-diameter pulley 761b having approximately twice the outer diameter of the small-diameter pulley 761a; these are arranged along the Y direction and formed concentrically. Similarly, the second-stage pulley 762 includes: a small-diameter pulley 762a having a smaller outer diameter; and a large-diameter pulley 762b having approximately twice the outer diameter of the small-diameter pulley 762a; these are arranged along the Y direction and formed as concentric. Moreover, the outer diameters of the small-diameter pulleys 761a and 762a are equal to each other, and the outer shapes of the large-diameter pulleys 761b and 762b are also equal to each other. A belt 763 is set between the small-path pulleys 761a and 762a. The belt 763 has two areas 763a and 763b extending in the X direction between the small-diameter pulleys 761a and 762a. A second support portion 72 is fixed in one area 763a, and a fourth support portion 74 is fixed in the other area 763b. When the second-stage pulley 761 rotates, the belt 763 is fed to one side in the X direction in the area 763a, and the belt 763 is fed to the other side in the X direction in the area 763b. Therefore, the second and fourth support portions 72 and 74 face each other. It moves on the opposite side of the X direction at approximately the same distance. On the other hand, a belt 764 is set between the large-diameter pulleys 761b and 762b. The belt 764 is provided between the large-diameter pulleys 761b and 762b and has two regions 764a and 764b extending in the X direction. Among the two areas 764a and 764b, a third support portion 73 is fixed in an area 764a that is fed in the same direction as the area 763a of the belt 763 when the second-stage pulley 761 rotates. When the belt 763 rotates, the belts 763 are fed to the same side in the X direction in the areas 763a and 764a, and the second and third support portions 72 and 73 move to the same side in the X direction. In addition, as described above, the large-diameter pulleys 761b and 762b have twice the outer diameter of the small-diameter pulleys 761a and 762a. Therefore, the moving distance of the third supporting portion 73 is approximately twice the moving distance of the second supporting portion 72. According to this configuration, when the second-stage pulley 761 is rotated by the motor 765, the second and fourth support portions 72 and 74 are moved substantially equal to each other in the direction opposite to the X direction, and the third support portion 73 is moved toward the second side. The support part 72 moves in the same direction and twice as much as the second support part 72. Therefore, according to the X-direction moving mechanism 76, as described above, the distance between the suction nozzle 733 (738) and the suction nozzle 723 (728), the distance between the suction nozzle 723 (728) and the suction nozzle 713 (718), The separation distance between the suction nozzles 713 (718) and 743 (748) is maintained to be equal to each other, and the separation distances are changed on the one hand. By having the structure as described above, the structure of the X-direction moving mechanism 76 can be simplified, and the miniaturization and weight reduction achieved therewith can also be achieved. Therefore, it contributes to miniaturization and weight reduction of the hand unit 7c, and improves the operability of the hand unit 7c. In addition, by the rotation of the two-stage pulley 761, all movements of the second, third, and fourth support portions 72, 73, and 74 can be uniformly controlled, so that the above functions can be more reliably performed. In addition, as long as the driving as described above can be realized, the configuration of the guide wheel, the endless driving cable, and the driving source is not particularly limited. For example, a sprocket may be used instead of a pulley as a pair of guide wheels, and a chain (metal chain, rubber chain, etc.) may be used instead of a belt as an endless driving cable. Alternatively, a piezoelectric actuator may be used instead of a motor as a drive source. In addition, the small-diameter pulley 761a (762a) and the large-diameter pulley 761b (762b) can also be formed separately. In this case, a motor for rotating the small-diameter pulley 761a and a large-diameter pulley can be separately provided. Motor for rotating the pulley 761b. 8-6. Y-direction moving mechanism Y-direction moving mechanism 77 2nd, 3rd 4th moving part 715, 725, 735, 745 relative to the first, 2nd, 3rd 4th support section 71, 72, 73, 74 in one piece (specifically, Simultaneously and equidistantly) in the Y direction, And the suction nozzle 713, Distance between 718, Suction nozzle 723, Distance of 728, Suction nozzle 733, Distance between 738, And suction nozzle 743, The separation distances of 748 are kept equal to each other, One way is to change the way of these separation distances. As shown in Figures 9 and 10, The Y-direction moving mechanism 77 includes: The first unit 77a and the motor (the driving source for the first moving mechanism) 777, It is disposed on the base 75; Unit 2 77b, It is disposed on the first support portion 71; Transmission shaft (transmission part) 778 and connection shaft (connection part) 779, It takes the first, Unit 2 77a, 77b link mode is set. The first unit 77a includes a pair of pulleys (a first guide wheel for a first moving mechanism, 2nd guide wheel for 1st moving mechanism) 771, 772, And erected on a pair of pulleys 771, A belt between 772 (the first endless driving cable for the first moving mechanism) 773. Pulley 771, 772 is rotatably supported on one of the main surfaces of the second base 752 (right side in the figure) around an axis extending in the X direction. also, Pulley 771, The 772 is disposed at intervals in the Y direction. and, On these pulleys 771, A belt 773 is set up between 772. Belt 773 on pulley 771, There are two areas 773a extending along the Y direction between 772, 773b. The motor 777 is a driving source for rotating the pulley 771, It is provided on the other (left side in the figure) main surface of the second base 752. The second unit 77b includes a pair of pulleys (the third guide wheel for the first moving mechanism, (4th guide wheel for the first moving mechanism) 774, 775, And erected on a pair of pulleys 774, A belt between 775 (a second endless drive cable for the first moving mechanism) 776. Pulley 774, 775 is rotatably supported on the main surface of one of the first support portions 71 (right side in the figure) around an axis extending in the X direction. also, Pulley 774, 775 is set apart in the Y direction. and, On these pulleys 774, A belt 776 is set up between 775. Belt 776 on pulley 774, Between 775 there are two regions extending along the Y direction 776a, 776b. in this way, By arranging the second unit 77b on the first support portion 71 whose position relative to the second base 752 is unchanged, The Y-direction moving mechanism 77 can be driven more stably. The transmission shaft 778 is a shaft for transmitting the driving force of the motor 777 to the second unit 77b. This transmission shaft 778 is provided extending in the X direction, Turn pulley 771, The axis of 774 is connected to each other. therefore, The driving force of the motor 777 is transmitted to the second unit 77b via the transmission shaft 778, Thus pulley 771, 774 rotates integrally. also, The transmission shaft 778 penetrates the second and second portions located between the second base 752 and the first support portion 71 3rd support department 72, 73 (see FIGS. 5 and 6). in particular, The transmission shaft 778 is formed in the second and the second passages. 3rd support department 72, 73 through the through hole on the pulley 771, 774 links. By setting the transmission shaft 778 to this configuration, It can suppress the exposure of the transmission shaft 778 from the support portions 71 to 74, Therefore, miniaturization of the hand unit 7c can be achieved. also, Transmission shaft 778 also plays as the 2nd 3rd support department 72, 73 The function of the guide when moving in the X direction, Therefore, the second and second steps can be performed more surely and smoothly. 3rd support department 72, 73 of the move. The connecting shaft 779 is formed in a linear shape, And extend along the X direction. also, The connecting shaft 779 is at two places along the way. The area 773a where the belt 773 is fixed via a fixture, And the area 776a of the belt 776. If the belt 773, 776 rotations, Then in area 773a, Within 776a, Belt 773, 776 feeds to the same side in the Y direction, So with it, The connection shaft 779 moves directly in the Y direction while maintaining the posture. On the outer periphery of this connecting shaft 779, Three linear bushes 779b, 779c, 779d. The linear bushings 779b, 779c, 779d alone (in a state where the movement is not restricted by other components), Moves freely in the axial direction relative to the connecting shaft 779, And rotate freely in the circumferential direction. Among the linear bushings 779b ~ 779d, The linear bush 779b is fixed to the second moving part 725, The linear bush 779c is fixed to the third moving part 735, The linear bush 779d is fixed to the fourth moving portion 745. Furthermore, The first moving part 715 is supported on the first supporting part 71 fixed on the first base 751, Therefore, it does not move in the Y-axis direction with respect to the connecting shaft 779. therefore, On the first moving part 715, Unlike other moving parts 725 ~ 745, The connecting shaft 779 is directly fixed without a linear bush. in this way, By fixing the connecting shaft 779 to the first moving portion 715, Unintentional displacement of the axial direction (Y direction) of the connecting shaft 779 can be prevented. By forming this structure, If the connecting shaft 779 uses a belt 773, 776 rotation to move in the Y direction, Each moving part 715, 725, 735, 745 for each support section 71, 72, 73, 74 moves integrally and at equal distances in the Y direction. thereby, According to this structure of the Y-direction moving mechanism 77, The suction nozzle 713, Distance between 718, Suction nozzle 723, Distance of 728, Suction nozzle 733, Distance between 738, And suction nozzle 743, The separation distances of 748 are kept equal to each other, Change these separations on one side. Furthermore, As mentioned above, The linear bushings 779b ~ 779d move freely along the axial direction (X direction) with respect to the connecting shaft 779 Therefore, the Y-direction moving mechanism 77 does not hinder the second and second 3rd 4th support section 72, 73, 74 is moved in the X direction by the X-direction moving mechanism 76. also, In the Y-direction moving mechanism 77, The first unit 77a is provided on the second base 752, And a second unit 77b is provided on the first support portion 71, The connecting shaft 779 is supported at two places in the axial direction. Therefore, the connecting shaft 779 can be moved smoothly and reliably in the Y direction by a certain distance. Especially by making the 2nd 3rd support department 72, 73 is located between the second base 752 and the first support portion 71, The distance between the second base 752 and the first support portion 71 can be sufficiently ensured. Therefore, the coupling shaft 779 can be supported more stably. Furthermore, In the Y-direction moving mechanism 77 of this embodiment, First 2nd, 3rd 4th moving part 715, 725, 735, 745 is connected to the belt 773 via a connecting shaft 779 (that is, indirectly), On 776, But not limited to this, E.g, The connecting shaft 779 can also be omitted, While the first, 2nd, 3rd 4th moving part 715, 725, 735, 745 are directly connected to the belt 773, 776 on. the above, The configuration of the opponent unit 7c is specifically described. According to such a hand unit 7c, By controlling each motor 765 independently, 777 drive (open / close and rotation direction), Freely change the suction nozzle 713, 718, 723, 728, 733, 738, 743, 748 is equipped with spacing. therefore, E.g, That is, when it is convenient for the arrangement pitch of the plurality of recesses 21 formed on the supply tray 2 to be different from the arrangement pitch of the plurality of recesses 421 (521) formed on the tray 42 (52), Also as follows, The IC device 100 is smoothly transferred from the supply tray 2 to the tray 42 (52). Furthermore, The hand unit 7c of this embodiment has eight suction nozzles, However, the number of suction nozzles may be 4 or more. It is not particularly limited. E.g, When there are four suction nozzles, Just make the 3rd, 4th support section 73, 74 omit suction nozzles 733, 738, 743, 748. also, E.g, When there are 10 suction nozzles, E.g, As long as it is on the + X direction side of the fourth support portion 74, A fifth support portion provided with the same structure as the fourth support portion 74 and having two suction nozzles and then, The fifth support portion may be fixed in the region 764b of the belt 764. in this way, According to the hand unit 7c, The number of nozzles can be easily changed (and, Add to, delete). The same applies to the hand unit 8c. Secondly, The driving of the supply robot 7 will be described. First of all, So that the hand unit 7c is positioned on the supply tray 2, Moving the moving frame 7b in the Y direction relative to the supporting frame 7a, The base portion 75 is moved in the X direction with respect to the moving frame 7b. Secondly, Each of the X-direction moving mechanism 76 and the Y-direction moving mechanism 77 is driven as needed, Make the suction nozzle 713, 718, 723, 728, 733, 738, 743, The arrangement interval of 748 is consistent with the arrangement interval of the cavity 21. Furthermore, The driving of the X-direction moving mechanism 76 and the Y-direction moving mechanism 77 may also be performed while the hand unit 7c is moving. Secondly, Make each suction nozzle 713, 718, 723, 728, 733, 738, 743, 748 drops, With each suction nozzle 713, 718, 723, 728, 733, 738, 743, 748 while holding the IC element 100. Since then, Make the suction nozzle 713, 718, 723, 728, 733, 738, 743, 748 rises, Eight IC components 100 are taken out of the cavity 21. Secondly, With the hand unit 7c on the tray 42, Moving the moving frame 7b in the Y direction relative to the supporting frame 7a, The base portion 75 is moved in the X direction with respect to the moving frame 7b. Since the arrangement pitch of the recesses 21 of the supply tray 2 and the arrangement pitch of the recesses 421 of the tray 42 are different in the X direction and the Y direction, Therefore, the X-direction moving mechanism 76 and the Y-direction moving mechanism 77 are driven separately, Make the suction nozzle 713, 718, 723, 728, 733, 738, 743, The arrangement pitch of 748 is the same as that of the recess 421. Furthermore, The driving of the X-direction moving mechanism 76 and the Y-direction moving mechanism 77 may also be performed while the hand unit 7c is moving. Secondly, Make each suction nozzle 713, 718, 723, 728, 733, 738, 743, 748 drops, Will be held in each nozzle 713, 718, 723, 728, 733, 738, 743, The IC device 100 on the 748 is placed in the recess 421. then, After the adsorption state of the IC device 100 is released, Make the suction nozzle 713, 718, 723, 728, 733, 738, 743, 748 rises, Each IC element 100 is retained on the recess 421. Furthermore, In the above form, The arrangement pitch of the recesses 21 of the supply tray 2 and the arrangement pitch of the recesses 421 of the tray 42 are different in the X direction and the Y direction. But not limited to this, The arrangement pitch may be different only in the X direction. In that case, As long as the mechanism 77 is moved by the Y direction, Adjust the suction nozzle 713, 718, 723, 728, 733, 738, 743, The spacing in the Y direction of 748, Since then, Driving only the X-direction moving mechanism 76, Make the suction nozzle 713, 718, 723, 728, 733, 738, 743, The configuration pitch of X direction of 748 can be changed. Instead, The arrangement pitch may be different only in the Y direction. In that case, As long as the mechanism 76 is moved in the X direction, Adjust the suction nozzle 713, 718, 723, 728, 733, 738, 743, 748 in the X direction, Since then, Only drives the Y-direction moving mechanism 77, Make the suction nozzle 713, 718, 723, 728, 733, 738, 743, The configuration pitch of Y direction of 748 can be changed. also, The arrangement pitch may be equal in both the X direction and the Y direction. In that case, As long as the mechanism 77 is moved by the Y direction, Adjust the suction nozzle 713, 718, 723, 728, 733, 738, 743, The spacing in the Y direction of 748, With the X-direction moving mechanism 76, Adjust the suction nozzle 713, 718, 723, 728, 733, 738, 743, 748 in the X direction, After that, the arrangement spacing will not be changed. It is only necessary to carry out the transportation of the IC device 100 described above. The same applies to the transfer of the IC components 100 from the supply tray 2 to the tray 52. (Inspection robot) The inspection robot 9 is housed in a tray 42, The IC component 100 in 52 is transported to the inspection socket 6, It will be placed in the inspection socket 6, IC component 100 having completed inspection of electrical characteristics 53 transported robot. also, Inspection robot 9 is on pallet 42, When the IC component 100 is transferred to the inspection socket 6 at 52, Positioning of the IC component 100 with respect to the inspection socket 6 (inspection individual socket 61) is possible, and then, When the IC element 100 is placed in the inspection socket 6 and the electrical characteristics are inspected, The IC element 100 can be pressed on the probe, A specific inspection pressure is applied to the IC device 100. As shown in Figure 1, The inspection robot 9 includes: Box 1 911, It is fixedly disposed with respect to the base 11; Box 2 912, It is supported on Box 911, And can move back and forth in the Y direction relative to the first frame 911; First-hand unit support unit 913 and second-hand unit support unit 914, It is supported on box 2 912, And can be raised and lowered in the Z direction relative to the second frame 912; 8 first-hand units 92, It is supported on the first-hand unit support section 913; And 8 second-hand units 93, It is supported on the second-hand unit support section 914. First Second hand unit support 913, 914 is supported on frame 2 912, Therefore, it can be moved integrally in the X direction and the Y direction, Instead, they move independently in the Z direction. The movement of the second frame 912 relative to the first frame 911, Support unit for each hand 913, The movement of 914 from the second frame 912 is performed by a driving device (not shown) using, for example, a linear motor as a driving source. Eight first-hand units 92 are arranged in four in the X direction, The two are arranged in the Y direction in a matrix form below the first-hand unit support portion 913. also, The arrangement pitch of the eight first-hand units 92 is formed on the tray 42, 8 of 43 recesses 421, The arrangement pitches of 431 and eight inspection individual sockets 61 provided in the inspection socket 6 are substantially equal. therefore, Allows smoother tray 42, The IC device 100 is transported between 43 and the inspection socket 6. Similarly, Eight second-hand units 93 are attached to each tray 52 of the second shuttle 5, Device for transferring IC component 100 between 53 and inspection socket 6. also, It is also a device for positioning the IC component 100 relative to the inspection socket 6 when the unchecked IC component 100 is transferred from the tray 52 to the inspection socket 6. Eight second-hand units 93 are arranged in four in the X direction, Two of them are arranged in the Y direction and arranged in a matrix form below the second-hand unit support portion 914. also, The arrangement pitch of the eight second-hand units 93 is the same as that of the eight first-hand units 92 described above. And formed on the tray 42, 8 of 43 recesses 421, The arrangement pitches of 431 and eight inspection individual sockets 61 provided in the inspection socket 6 are substantially equal. therefore, Smoother tray 52, The IC component 100 is transported between 53 and the inspection socket 6. the following, The structures of the eight first-hand units 92 and the eight second-hand units 93 will be described. But each hand unit 92, 93 is the same structure as each other, Therefore the following, The description will be made using one first-hand unit 92 as a representative. For other first-hand units 92 and second-hand units 93, The description is omitted. As shown in Figure 11, The first-hand unit 92 includes: Support Department 94, Its support, Fixed on the first-hand unit support 913; First moving section 95, It is supported on the support section 94, And can move back and forth in the ± X direction relative to the support portion 94; Second moving section 96, It is supported on the first moving part 95, It can move back and forth in the ± Y direction relative to the first moving part 95; 转 部 97 , The rotation part 97, It is supported on the second moving part 96, And can rotate around the Z axis with respect to the second moving portion 96; And holding section 98, It is supported on the rotating portion 97. On support 94, A component mark 941 is provided to perform positioning of the held IC component 100 with respect to the individual socket 61 for inspection. also, The holding portion 98 is composed of, for example, a suction nozzle, The IC device 100 can be held by being held. also, The first-hand unit 92 includes: The first driving device (not shown), It makes the first moving part 95 move back and forth in the ± X direction relative to the support part 94; The second driving device (not shown) It moves the second moving part 96 back and forth in the ± Y direction relative to the first moving part 95; And the third drive mechanism, This rotates the rotation portion 97 about the Z axis with respect to the second moving portion 96. Of the first, 2nd, The third driving mechanism is formed so that, for example, a linear motor can be used as a driving source, In addition, racks that convert the rotary motion of the motor into linear motion are added as needed, The structure of the pinion and the like. This first-hand unit 92 is as follows, The positioning (visual alignment) of the held IC device 100 is performed. The unchecked IC component 100 stored in the tray 42 is held on the holding portion 98, On the way that the first-hand unit 92 moves from directly above the tray 42 to directly above the inspection socket 6, The first hand unit 92 passes directly above the first camera 600. When the first camera 600 passes directly above the first hand unit 92, The image is captured so that the IC device 100 and the device mark 941 held on the first hand unit 92 are captured. The obtained image data is sent to the control device 10, Image recognition processing is performed by the control device 10. in particular, In the image recognition process, Perform specific processing on the image data obtained from the first camera 600, A relative position and a relative angle between the component mark 941 and the IC component 100 are calculated. then, Compare the calculated relative position and angle with a reference position and reference angle indicating a proper positional relationship between the component mark 941 and the IC component 100 Calculate the "offset position" between the relative position and the reference position, And the "offset angle" between the relative angle and the reference angle. Furthermore, The "reference position" and the "reference angle" described above refer to when the first-hand unit 92 is disposed at a preset inspection origin position, The external terminal of the IC component 100 is preferably connected to a position of a probe of the individual socket 61 for inspection. then, The control device 10 is based on the obtained "offset position amount" and "offset angle amount", Drive 1st as needed 2nd, 3rd drive device, In such a way that the relative position and the relative angle are consistent with the reference position and the reference angle, Correct the position and posture (angle) of the IC device 100. With this control, The IC component 100 held by the holding portion 98 can be positioned. The control device 10 is configured so as to independently control the driving of the eight first hand units 92, Therefore, the positioning (position correction) of the eight IC components 100 held on each of the first hand units 92 can be performed independently. The positioning of the IC component 100 using the second hand unit 93 is in addition to using the second camera 500 instead of the first camera 600. The other conditions are the same as those of the first-hand unit 92, Therefore, its description is omitted. (Recycling robot) The recycling robot 8 is used for storing in the tray 43, The IC component 100 whose inspection is completed in 53 is transferred to the robot of the collection tray 3. The collection robot 8 has the same configuration as the supply robot 7. which is, The recycling robot 8 includes: Support box 8a, It is supported on the base 11; Move frame 8b, It is supported on the support frame 8a, And can move back and forth in the Y direction relative to the support frame 8a; And hand unit 8c, It is supported on the moving frame 8b, And it can move back and forth in the X direction with respect to the moving frame 8b. The configuration of these sections is the same as that of the corresponding sections of the supply robot 7, Therefore, its description is omitted. also, The drive of the recovery robot 8 is also the same as the drive of the supply robot 7, Therefore, its description is omitted. Here, The following situations exist: Among the IC components 100 stored in the tray 43 (53) after the inspection is completed, There are defective products that cannot exhibit specific electrical characteristics. therefore, E.g, Can also prepare 2 collection trays 3, Use one of them as a tray for storing good products that meet specific electrical characteristics, The other is used as a tray for collecting the defective products. also, When using one collection tray 3, It is also possible to use the specific recess 31 as a recess for accommodating the above-mentioned defective products. With this, Can clearly distinguish between good and bad products. (Control Device) The control device 10 includes a drive control section 102, And inspection control unit 101. The drive control unit 102 applies, for example, to the supply tray 2. Recycling tray 3, The movement of shuttle 1 and shuttle 5, Or supply robot 7, Recycling robot 8. Inspection robot 9. Mounting state detection device 200, The first camera 600 and the second camera 500 are controlled by mechanical driving. An inspection control unit 101 is based on a program stored in an unillustrated memory, The inspection of the electrical characteristics of the IC device 100 arranged in the inspection socket 6 is performed. the above, The configuration of the inspection device 1 has been described. [Inspection method of inspection device] Second, The method for inspecting the IC device 100 by the inspection device 1 will be described. Furthermore, The inspection method described below, especially the transfer order of the IC component 100, is only an example. It is not limited to this. (Step 1) First, As shown in Figure 12, The supply tray 2 in which the IC components 100 are stored in each of the pockets 21 is transported into the area S And make the first, 2nd shuttle 4, 5Move to the -X direction side, And form a tray 42, 52 are respectively arranged in the + Y direction side with respect to the supply tray 2. (Step 2) Second, As shown in Figure 13, By supplying the robot 7, Transfer the IC components 100 stored in the supply tray 2 to the tray 42, 52 on, And store the IC component 100 in the tray 42, 52 of each recess 421, 521 in. Secondly, By mounting the state detection device 200, Detection and storage in the tray 42, 52 of each recess 421, The mounting state of the IC element 100 in 521. That is, when it is convenient to detect only one abnormally placed IC device 100, The drive control unit 102 also temporarily stops the drive of each unit, Correct abnormal loading conditions, After confirming that all the IC components 100 are in a normal mounting state, Start the drive of each department again. (Step 3) Second, As shown in Figure 14, Will the first, 2nd shuttle 4, 5 are all moved to the + X direction side, The forming tray 42 is arranged on the + Y direction side with respect to the inspection socket 6, The tray 52 is in a state aligned with the -Y direction side with respect to the inspection socket 6. Secondly, As shown in Figure 15, Make the first Second hand unit support 913, 914 moves to the + Y direction side as a whole, A state where the first-hand unit support portion 913 is positioned directly above the tray 42 and the second-hand unit support portion 914 is positioned directly above the inspection socket 6 is formed. Since then, The IC components 100 stored in the tray 42 are held by the first hand units 92. (Step 5) Second, As shown in Figure 16, Make the first Second hand unit support 913, 914 moves to the -Y direction side, A state where the first-hand unit support portion 913 is located directly above the inspection socket 6 (the origin position for inspection) and the second-hand unit support portion 914 is located directly above the tray 52 is formed. During the movement, Based on the image data obtained by the first camera 600, The positioning (visual alignment) of each IC element 100 is performed independently. With this first, Second hand unit support 913, The movement of 914 and the positioning of IC component 100 are simultaneously, The following operations were also performed. First of all, Move the first shuttle 4 to the -X direction side, The tray 43 is formed in a state of being aligned with the inspection socket 6 in the + Y direction, In addition, the trays 42 are aligned in the + Y direction with respect to the supply tray 2. Secondly, By supplying the robot 7, Transfer the IC components 100 stored in the supply tray 2 to the tray 42, The IC device 100 is stored in each recess 421 of the tray 42. then, As above, By mounting the state detection device 200, The mounting state of the IC device 100 stored in each of the pockets 421 is detected. (Step 6) Second, Lowering the first-hand unit support section 913, The IC element 100 held by each first-hand unit 92 is arranged in each inspection individual socket 61 of the inspection socket 6. at this time, Each of the first hand units 92 presses the IC element 100 against the inspection-use individual socket 61 with a specific inspection pressure (pressure). With this, The external terminals of the IC component 100 are electrically connected to the probes provided in the individual sockets 61 for inspection. In this state, The inspection control unit 101 of the control device 10 inspects the electrical characteristics of the IC element 100 in each inspection individual socket 61. If the check is over, Then raise the first-hand unit support section 913, The IC component 100 held by each of the first hand units 92 is taken out from the individual socket 61 for inspection. Simultaneously with such operations (inspection of the IC device 100), Each second-hand unit 93 supported on the second-hand unit supporting portion 914 holds the IC component 100 stored in the tray 52, The IC component 100 is taken out of the tray 52 again. (Step 7) Second, As shown in Figure 17, Make the first Second hand unit support 913, 914 moves to the + Y direction side, A state where the first-hand unit support portion 913 is located directly above the tray 43 of the first shuttle 4 and the second-hand unit support portion 914 is located directly above the inspection socket 6 (position of the inspection origin) is formed. During the movement, Based on image data captured by the second camera 500, The positioning (visual alignment) of each IC element 100 is performed independently. With this first, Second hand unit support 913, 914 moves simultaneously, The following operations were also performed. First of all, Move the second shuttle 5 to the -X direction side, The tray 53 is formed in a state aligned with the inspection socket 6 in the -Y direction, Then, the tray 52 is arranged in a + Y direction with respect to the supply tray 2. Secondly, By supplying the robot 7, Transfer the IC components 100 stored in the supply tray 2 to the tray 52, The IC device 100 is stored in each recess 521 of the tray 52. then, As above, By mounting the state detection device 200, The mounting state of the IC device 100 stored in each of the recesses 521 is detected. (Step 8) Second, As shown in Figure 18, Lowering the second-hand unit support section 914, The IC device 100 held by each second-hand unit 93 is arranged in each inspection individual socket 61 of the inspection socket 6. then, With the inspection control section 101, An inspection of the electrical characteristics of the IC element 100 in each inspection individual socket 61 is performed. If the check is over, The second-hand unit support portion 914 is raised, The IC device 100 held by the second hand unit 93 is taken out from the individual socket 61 for inspection. The following operations are performed simultaneously with such operations. First of all, The IC device 100 having completed the inspection held by each of the first-hand units 92 is stored in each of the recesses 431 of the tray 43. Secondly, Move the first shuttle 4 to the + X direction side, The tray 42 is formed in a state of being aligned in the + Y direction with respect to the inspection socket 6 and directly below each of the first hand units 92, In addition, a state in which the tray 43 is aligned with the recovery tray 3 in the + Y direction is formed. Secondly, Each first-hand unit 92 holds the IC component 100 stored in the tray 42, And by recycling the robot 8, The IC components 100 stored in the tray 43 that have been inspected are transferred to the collection tray 3. (Step 9) Second, As shown in Figure 19, Make the first Second hand unit support 913, 914 moves to the -Y direction side, A state where the first-hand unit support portion 913 is located directly above the inspection socket 6 (the origin position for inspection) and the second-hand unit support portion 914 is located directly above the tray 52 is formed. at this time, Also in the same manner as in step 5 above, The positioning of the IC device 100 held on the first hand unit 92 is performed. With this first, Second hand unit support 913, 914 moves simultaneously, The following operations were also performed. First of all, Move the first shuttle 4 to the -X direction side, The tray 43 is formed in a state of being aligned with the inspection socket 6 in the + Y direction, In addition, the trays 42 are aligned in the + Y direction with respect to the supply tray 2. Secondly, By supplying the robot 7, Transfer the IC components 100 stored in the supply tray 2 to the tray 42, The IC device 100 is stored in each recess 421 of the tray 42. then, As above, By mounting the state detection device 200, The mounting state of the IC device 100 stored in each of the pockets 421 is detected. (Step 10) Second, As shown in Figure 20, Lowering the first-hand unit support section 913, The IC element 100 held by each first-hand unit 92 is arranged in each inspection individual socket 61 of the inspection socket 6. then, With the inspection control section 101, An inspection of the electrical characteristics of the IC element 100 in each inspection individual socket 61 is performed. If the check is over, Then raise the first-hand unit support section 913, The IC component 100 held by each of the first hand units 92 is taken out from the individual socket 61 for inspection. The following operations are performed simultaneously with such operations. First of all, The IC device 100 having completed the inspection held by each second-hand unit 93 is stored in each of the recesses 531 of the tray 53. Secondly, Move the second shuttle 5 to the + X direction side, The tray 52 is formed in a state of being aligned in the -Y direction with respect to the inspection socket 6 and directly below the second hand unit 93. In addition, a state in which the tray 53 is aligned with the recovery tray 3 in the + Y direction is formed. Secondly, Each second-hand unit 93 holds the IC component 100 stored in the tray 52, And by recycling the robot 8, The IC components 100 that have been inspected and stored in the tray 53 are transferred to the collection tray 3. (Step 11) Since then, Repeat steps 7 to 10 above. Furthermore, On the way back, If all the IC components 100 stored in the supply tray 2 have been moved to the first shuttle 4, Then, the supply tray 2 moves outside the area S. then, For supplying new IC components 100 to the supply tray 2, Or after having been exchanged with another supply tray 2 containing the IC component 100, The supply tray 2 moves into the area S again. Similarly, On the way back, If the IC component 100 has been stored in all the recesses 31 of the recycling tray 3, Then, the collection tray 3 moves outside the area S. then, Remove the IC component 100 stored in the recovery tray 3, Or replace the recycling tray 3 with another empty recycling tray 3, After that, the collection tray 3 moves again into the area S. According to this method, The inspection of the IC device 100 can be performed with better efficiency. in particular, The inspection robot 9 includes a first hand unit 92 and a second hand unit 93, E.g, While the IC device 100 held by the first-hand unit 92 (the same applies to the second-hand unit 93) is inspected using the inspection socket 6, The second-hand unit 93 simultaneously stores the IC component 100 that has been inspected in the tray 53. And wait for the next IC component 100 to be inspected. in this way, Can use 2 hand units, To perform different tasks simultaneously, This can reduce unnecessary time, The inspection of the IC device 100 is performed efficiently. <Second Embodiment> Next, A second embodiment of the inspection device of the present invention will be described. FIG. 21 is a plan view showing a hand unit for supplying a robot included in the inspection apparatus according to the second embodiment of the present invention. FIG. 22 is a plan view of a supporting portion provided in the hand unit shown in FIG. 21. the following, Focusing on the differences from the above embodiment, The inspection device of the second embodiment will be described. Regarding the same thing, The description is omitted. The inspection device according to the second embodiment of the present invention is different from the configuration of the Y-direction moving mechanism in the hand unit of the supply robot and the recovery robot. The other parts are the same as those of the first embodiment. Furthermore, For the same structure as the first embodiment, Annotate the same symbols. also, In this embodiment, The hand units of the supply robot and the hand units of the recovery robot have the same configuration, Therefore the following, As an example, the hand unit of the supply robot will be described. Regarding the hand unit of the recycling robot, The description is omitted. As shown in Figure 21, The Y-direction moving mechanism 77 'included in the hand unit 7c of this embodiment includes: The first support unit 1100, It is disposed on the first support portion 71; The second support unit 1200, It is provided on the second support portion 72; 3rd support unit 1300, It is provided on the third support portion 73; The fourth support unit 1400, It is provided on the fourth support portion 74; And driving mechanism 1500, It drives each unit 1100, 1200, 1300, 1400. The driving mechanism 1500 includes: A pair of pulleys (the first guide wheel for the first moving mechanism, (2nd guide wheel for 1st moving mechanism) 1508, 1509, It is disposed on the second substrate 752; Belt (the first endless drive cable for the first moving mechanism) 1510, It is erected on a pair of pulleys 1508, Between 1509 Spline shaft (power transmission shaft) 1501, It is coaxially fixed on the pulley 1509, And extends along the X direction; 4 spline nuts 1502 1503, 1504, 1505, It is set on the periphery of the spline shaft 1501; And motor 1507, It causes the pulley 1508 to rotate. The motor 1507 is fixed to the second base 752. If driving motor 1507, Its driving force is transmitted to the pulley 1509 via the belt 1510, Instead, the spline shaft 1501 is rotated around its axis. In this way, By fixing the motor 1507 to the base 75, Can make the motor 1507 drive stably, Furthermore, it is possible to prevent the weight of the first to fourth support portions 71 to 74 from increasing. 4 spline nuts 1502 1503, 1504, 1505 moves freely in the axial direction relative to the spline shaft 1501, However, rotation around its axis is limited. which is, If the spline shaft 1501 is rotated by the motor 1507, Spline Nut 1502 1503, 1504, 1505 also rotates separately. also, Spline Nut 1502 1503, 1504, Among 1505, The spline nut 1502 is rotatably supported on the first support portion 71, The spline nut 1503 is rotatably supported on the second support portion 72, The spline nut 1504 is rotatably supported on the third support portion 73, The spline nut 1505 is rotatably supported on the fourth support portion 74. Furthermore, As mentioned above, Spline Nut 1503, 1504, 1505 moves freely in the axial direction (X direction) relative to the spline shaft 1501, Therefore, the Y-direction moving mechanism 77 'does not hinder the second and second 3rd 4th support section 72, 73, 74 is moved in the X direction by the X-direction moving mechanism 76. As shown in Figure 22, The first support unit 1100 includes a pair of pulleys (a third guide wheel for a first moving mechanism, (4th guide wheel for the first moving mechanism) 1101 1102, And erected on a pair of pulleys 1101 The belt between 1102 (the second endless drive cable for the first moving mechanism) 1103. among them, The pulley 1101 is coaxially fixed on the spline nut 1502, Together with the spline nut 1502, it rotates around the axis of the spline shaft 1501. also, The pulley 1102 is separated from the pulley 1101 in the Y direction. The first support portion 71 is rotatably supported. and, On these pulleys 1101 A belt 1103 is set up between 1102. Belt 1103 on pulley 1101 1102 has two regions 1103a extending in the Y direction, 1104b, The first moving portion 715 is fixed to the belt 1103 in the area 1103a. Furthermore, The spline nut 1503 can also double as the pulley 1101. The configuration of the second support unit 1200 is the same as the configuration of the first support unit 1100 described above. The second support unit 1200 includes a pair of pulleys (the fifth guide wheel for the first moving mechanism, (6th guide wheel for the first moving mechanism) 1201 1202 And erected on a pair of pulleys 1201 The belt between 1202 (the third endless drive cable for the first moving mechanism) 1203. among them, The pulley 1201 is coaxially fixed on the spline nut 1503. Together with the spline nut 1503, it rotates around the spline shaft 1501. also, The pulley 1202 is separated from the pulley 1201 in the Y direction. The second support portion 72 is rotatably supported. and, On these pulleys 1201 A belt 1203 is set up between 1202. Belt 1203 on pulley 1201 1202 has two regions 1203a extending in the Y direction, 1204b, The second moving portion 725 is fixed to the belt 1203 in the area 1203a. The configuration of the third support unit 1300 is also the same as the configuration of the first support unit 1100 described above. The third support unit 1300 includes a pair of pulleys (seventh guide wheel for the first moving mechanism, (8th guide wheel for the first moving mechanism) 1301, 1302, And erected on a pair of pulleys 1301 The belt between 1302 (the fourth endless drive cable for the first moving mechanism) 1303. among them, The pulley 1301 is coaxially fixed on the spline nut 1504. Together with the spline nut 1504, it rotates around the spline shaft 1501. also, The pulley 1302 is separated from the pulley 1301 in the Y direction. The third support portion 73 is rotatably supported. and, On these pulleys 1301 A belt 1303 is set up between 1302. Belt 1303 on pulley 1301 Between 1302, there are two regions 1303a extending along the Y direction. 1304b, The third moving portion 735 is fixed to the belt 1303 in the area 1303a. The configuration of the fourth support unit 1400 is also the same as the configuration of the first support unit 1100 described above. The fourth support unit 1400 includes a pair of pulleys (the ninth guide wheel for the first moving mechanism, (10th guide wheel for 1st moving mechanism) 1401 1402 And erected on a pair of pulleys 1401 The belt between 1402 (the fifth endless driving cable for the first moving mechanism) 1403. among them, The pulley 1401 is coaxially fixed on the spline nut 1505. And rotate with the spline nut 1505 about the spline shaft 1501. also, The pulley 1402 is separated from the pulley 1401 in the Y direction. The fourth support portion 74 is rotatably supported. and, On these pulleys 1401 A belt 1403 is set up between 1402. Belt 1403 on pulley 1401 Between 1402, there are two regions 1403a extending in the Y direction, 1404b, The fourth moving portion 745 in the area 1403a is fixed to the belt 1403. Furthermore, Pulley 1101 1102, 1201 1202 1301, 1302, 1401, 1402 each has an equal outer diameter. In the Y-direction moving mechanism 77 'having such a structure, If the spline shaft 1501 is rotated by the motor 1507, And transmit its rotational force to each pulley 1101 1201 1301, 1401, Make each belt 1103, 1203, 1303, 1403 rotation, Then in area 1103a, 1203a, 1303a, In 1403a, Belt 1103, 1203, 1303, 1403 Feeds at the same speed to the same side in the Y direction. thereby, If the belt 1103, 1203, 1303, 1403 rotation, Each moving part 715, 725, 735, 745 for each support section 71, 72, 73, 74 moves integrally and at equal distances in the Y direction. According to this structure of the Y-direction moving mechanism 77, The suction nozzle 713, Distance between 718, Suction nozzle 723, Distance of 728, Suction nozzle 733, Distance between 738, And suction nozzle 743, The separation distances of 748 are kept equal to each other, Change these separations on one side. also, In the Y-direction moving mechanism 77, Each support section 71 ~ 74 is provided with a dedicated unit, Therefore, each of the moving parts 715 to 745 can be moved more surely in the Y direction. In this second embodiment, The same effects as those of the first embodiment can be exhibited. Furthermore, In the driving mechanism 1500, Formed by combining the spline shaft 1501 and the spline nuts 1502 ~ 1505, But as long as they can perform the same functions as these, The configuration of the driving mechanism 1500 is not particularly limited. the above, Based on the illustrated embodiment, The processor and inspection device of the present invention have been described, However, the present invention is not limited to this, The configuration of each part can be replaced with any configuration having the same function. also, In the present invention, Other arbitrary components may be added. also, The respective embodiments may be appropriately combined.
1‧‧‧檢查裝置
2‧‧‧供給托盤
3‧‧‧回收托盤
4‧‧‧第1梭子
5‧‧‧第2梭子
6‧‧‧檢查用插口
7‧‧‧供給機器人
7a‧‧‧支持框
7b‧‧‧移動框
7c‧‧‧手單元
8‧‧‧回收機器人
8a‧‧‧支持框
8b‧‧‧移動框
8c‧‧‧手單元
9‧‧‧檢查用機器人
10‧‧‧控制裝置
11‧‧‧基座
21‧‧‧凹穴
23‧‧‧軌道
31‧‧‧凹穴
33‧‧‧軌道
41‧‧‧基底構件
42‧‧‧托盤
43‧‧‧托盤
44‧‧‧軌道
51‧‧‧基底構件
52‧‧‧托盤
53‧‧‧托盤
54‧‧‧軌道
61‧‧‧檢查用個別插口
62‧‧‧探針
71‧‧‧第1支持部
72‧‧‧第2支持部
73‧‧‧第3支持部
74‧‧‧第4支持部
75‧‧‧基部
76‧‧‧X方向移動機構
77‧‧‧Y方向移動機構
77a‧‧‧第1單元
77b‧‧‧第2單元
92‧‧‧手單元
93‧‧‧手單元
94‧‧‧支持部
95‧‧‧第1移動部
96‧‧‧第2移動部
97‧‧‧旋轉部
98‧‧‧保持部
100‧‧‧IC元件
101‧‧‧檢查控制部
102‧‧‧驅動控制部
200‧‧‧載置狀態檢測器件
421‧‧‧凹穴
431‧‧‧凹穴
500‧‧‧第2攝像機
521‧‧‧凹穴
531‧‧‧凹穴
600‧‧‧第1攝像機
611‧‧‧側面
613‧‧‧底部
711‧‧‧第1零件保持機構
712‧‧‧軸
713‧‧‧吸附嘴
714‧‧‧第1驅動機構
714a‧‧‧滑輪
714b‧‧‧滑輪
714c‧‧‧皮帶
714d‧‧‧馬達
714e‧‧‧固定部
715‧‧‧第1移動部
716‧‧‧第2零件保持機構
717‧‧‧軸
718‧‧‧吸附嘴
719‧‧‧驅動機構
719a‧‧‧滑輪
719b‧‧‧滑輪
719c‧‧‧皮帶
719d‧‧‧馬達
719e‧‧‧固定部
721‧‧‧第3零件保持機構
722‧‧‧軸
723‧‧‧吸附嘴
724‧‧‧驅動機構
724a‧‧‧滑輪
724b‧‧‧滑輪
724c‧‧‧皮帶
724d‧‧‧馬達
724e‧‧‧固定部
725‧‧‧第2移動部
726‧‧‧第4零件保持機構
727‧‧‧軸
728‧‧‧吸附嘴
729‧‧‧驅動機構
729a‧‧‧滑輪
729b‧‧‧滑輪
729c‧‧‧皮帶
729d‧‧‧馬達
729e‧‧‧固定部
731‧‧‧第5零件保持機構
732‧‧‧軸
733‧‧‧吸附嘴
734‧‧‧驅動機構
734a‧‧‧滑輪
734b‧‧‧滑輪
734c‧‧‧皮帶
734d‧‧‧馬達
734e‧‧‧固定部
735‧‧‧第3移動部
736‧‧‧第6零件保持機構
737‧‧‧軸
738‧‧‧吸附嘴
739‧‧‧驅動機構
739a‧‧‧滑輪
739b‧‧‧滑輪
739c‧‧‧皮帶
739d‧‧‧馬達
739e‧‧‧固定部
741‧‧‧第7零件保持機構
742‧‧‧軸
743‧‧‧吸附嘴
744‧‧‧驅動機構
744a‧‧‧滑輪
744b‧‧‧滑輪
744c‧‧‧皮帶
744d‧‧‧馬達
744e‧‧‧固定部
745‧‧‧第4移動部
746‧‧‧第8零件保持機構
747‧‧‧軸
748‧‧‧吸附嘴
749‧‧‧驅動機構
749a‧‧‧滑輪
749b‧‧‧滑輪
749c‧‧‧皮帶
749d‧‧‧馬達
749e‧‧‧固定部
751‧‧‧第1基底
752‧‧‧第2基底
753‧‧‧軌道
754‧‧‧導引器
755‧‧‧導引器
756‧‧‧導引器
761‧‧‧二段滑輪
761a‧‧‧小徑滑輪
761b‧‧‧大徑滑輪
762‧‧‧二段滑輪
762a‧‧‧小徑滑輪
762b‧‧‧大徑滑輪
763‧‧‧皮帶
763a‧‧‧區域
763b‧‧‧區域
764‧‧‧皮帶
764a‧‧‧區域
764b‧‧‧區域
765‧‧‧馬達
771‧‧‧滑輪
772‧‧‧滑輪
773‧‧‧皮帶
773a‧‧‧區域
773b‧‧‧區域
774‧‧‧滑輪
775‧‧‧滑輪
776‧‧‧皮帶
776a‧‧‧區域
776b‧‧‧區域
777‧‧‧馬達
778‧‧‧傳遞軸
779‧‧‧連結軸
779b‧‧‧線性襯套
779c‧‧‧線性襯套
779d‧‧‧線性襯套
911‧‧‧框
911a‧‧‧軌道
912‧‧‧框
912a‧‧‧軌道
912b‧‧‧軌道
913‧‧‧手單元支持部
914‧‧‧手單元支持部
941‧‧‧元件標記
1100‧‧‧第1支持部用單元
1101‧‧‧滑輪
1102‧‧‧滑輪
1103‧‧‧皮帶
1103a‧‧‧區域
1103b‧‧‧區域
1200‧‧‧第2支持部用單元
1201‧‧‧滑輪
1202‧‧‧滑輪
1203‧‧‧皮帶
1203a‧‧‧區域
1203b‧‧‧區域
1300‧‧‧第3支持部用單元
1301‧‧‧滑輪
1302‧‧‧滑輪
1303‧‧‧皮帶
1303a‧‧‧區域
1303b‧‧‧區域
1400‧‧‧第4支持部用單元
1401‧‧‧滑輪
1402‧‧‧滑輪
1403‧‧‧皮帶
1403a‧‧‧區域
1403b‧‧‧區域
1500‧‧‧驅動機構
1501‧‧‧花鍵軸
1502‧‧‧花鍵螺帽
1503‧‧‧花鍵螺帽
1504‧‧‧花鍵螺帽
1505‧‧‧花鍵螺帽
1507‧‧‧馬達
1508‧‧‧滑輪
1509‧‧‧滑輪
1510‧‧‧皮帶
S‧‧‧區域
X‧‧‧方向
Y‧‧‧方向
Z‧‧‧方向1‧‧‧Inspection device
2‧‧‧ supply tray
3‧‧‧Recycling tray
4‧‧‧ the first shuttle
5‧‧‧ 2nd shuttle
6‧‧‧ Inspection socket
7‧‧‧ supply robot
7a‧‧‧ Support Box
7b‧‧‧moving frame
7c‧‧‧hand unit
8‧‧‧Recycling robot
8a‧‧‧Support box
8b‧‧‧moving frame
8c‧‧‧hand unit
9‧‧‧ Inspection robot
10‧‧‧Control device
11‧‧‧ base
21‧‧‧Dent
23‧‧‧ track
31‧‧‧Dent
33‧‧‧ track
41‧‧‧ base member
42‧‧‧tray
43‧‧‧tray
44‧‧‧ track
51‧‧‧ base member
52‧‧‧tray
53‧‧‧tray
54‧‧‧ track
61‧‧‧Inspection socket
62‧‧‧ Probe
71‧‧‧The first support department
72‧‧‧ 2nd support department
73‧‧‧ 3rd support department
74‧‧‧ 4th support department
75‧‧‧ base
76‧‧‧X-direction moving mechanism
77‧‧‧Y-direction moving mechanism
77a‧‧‧Unit 1
77b‧‧‧Unit 2
92‧‧‧hand unit
93‧‧‧hand unit
94‧‧‧Support Department
95‧‧‧ the first mobile unit
96‧‧‧The second mobile unit
97‧‧‧Rotating part
98‧‧‧holding department
100‧‧‧IC components
101‧‧‧ Inspection Control Department
102‧‧‧Drive Control Department
200‧‧‧ Mounted state detection device
421‧‧‧Dent
431‧‧‧Dent
500‧‧‧Second camera
521‧‧‧Dent
531‧‧‧Dent
600‧‧‧The first camera
611‧‧‧ side
613‧‧‧ bottom
711‧‧‧1st part holding mechanism
712‧‧‧axis
713‧‧‧ Nozzle
714‧‧‧1st drive mechanism
714a‧‧‧ pulley
714b‧‧‧ pulley
714c‧‧‧belt
714d‧‧‧motor
714e‧‧‧Fixed section
715‧‧‧The first mobile unit
716‧‧‧Second part holding mechanism
717‧‧‧axis
718‧‧‧ Nozzle
719‧‧‧Drive mechanism
719a‧‧‧ pulley
719b‧‧‧ pulley
719c‧‧‧Belt
719d‧‧‧motor
719e‧‧‧Fixed section
721‧‧‧3rd part holding mechanism
722‧‧‧axis
723‧‧‧Nozzle
724‧‧‧Drive mechanism
724a‧‧‧ pulley
724b‧‧‧ pulley
724c‧‧‧Belt
724d‧‧‧motor
724e‧‧‧Fixed section
725‧‧‧The second mobile unit
726‧‧‧4th part holding mechanism
727‧‧‧axis
728‧‧‧ Nozzle
729‧‧‧Drive mechanism
729a‧‧‧ pulley
729b‧‧‧ pulley
729c‧‧‧Belt
729d‧‧‧motor
729e‧‧‧Fixed
731‧‧‧5th part holding mechanism
732‧‧‧axis
733‧‧‧ Nozzle
734‧‧‧Drive mechanism
734a‧‧‧ pulley
734b‧‧‧ pulley
734c‧‧‧belt
734d‧‧‧motor
734e‧‧‧Fixed
735‧‧‧The third mobile unit
736‧‧‧6th part holding mechanism
737‧‧‧axis
738‧‧‧ Nozzle
739‧‧‧Drive mechanism
739a‧‧‧ pulley
739b‧‧‧ pulley
739c‧‧‧belt
739d‧‧‧motor
739e‧‧‧Fixed section
741‧‧‧7th part holding mechanism
742‧‧‧axis
743‧‧‧ Nozzle
744‧‧‧Drive mechanism
744a‧‧‧ pulley
744b‧‧‧ pulley
744c‧‧‧belt
744d‧‧‧motor
744e‧‧‧Fixed section
745‧‧‧The fourth mobile unit
746‧‧‧8th part holding mechanism
747‧‧‧axis
748‧‧‧ Nozzle
749‧‧‧Drive mechanism
749a‧‧‧ pulley
749b‧‧‧ pulley
749c‧‧‧belt
749d‧‧‧motor
749e‧‧‧Fixed section
751‧‧‧1st base
752‧‧‧ 2nd base
753‧‧‧track
754‧‧‧Director
755‧‧‧Director
756‧‧‧Director
761‧‧‧secondary pulley
761a‧‧‧ Trail pulley
761b‧‧‧large diameter pulley
762‧‧‧secondary pulley
762a‧‧‧ Trail pulley
762b‧‧‧large diameter pulley
763‧‧‧Belt
763a‧‧‧area
763b‧‧‧area
764‧‧‧Belt
764a‧‧‧area
764b‧‧‧area
765‧‧‧Motor
771‧‧‧ pulley
772‧‧‧ pulley
773‧‧‧Belt
773a‧‧‧area
773b‧‧‧area
774‧‧‧ pulley
775‧‧‧ pulley
776‧‧‧Belt
776a‧‧‧area
776b‧‧‧area
777‧‧‧Motor
778‧‧‧Transmission shaft
779‧‧‧Connecting shaft
779b‧‧‧ Linear Bushing
779c‧‧‧ Linear Bushing
779d‧‧‧ Linear Bushing
911‧‧‧box
911a‧‧‧track
912‧‧‧box
912a‧‧‧track
912b‧‧‧track
913‧‧‧Hand Unit Support Department
914‧‧‧Hand Unit Support Department
941‧‧‧component marking
1100‧‧‧ 1st support unit
1101‧‧‧ pulley
1102‧‧‧Pulley
1103‧‧‧Belt
1103a‧‧‧area
1103b‧‧‧area
1200‧‧‧ 2nd support unit
1201‧‧‧ pulley
1202‧‧‧ pulley
1203‧‧‧Belt
1203a‧‧‧area
1203b‧‧‧area
1300‧‧‧3rd support unit
1301‧‧‧ pulley
1302‧‧‧ pulley
1303‧‧‧Belt
1303a‧‧‧area
1303b‧‧‧area
1400‧‧‧4th support unit
1401‧‧‧ pulley
1402‧‧‧ pulley
1403‧‧‧Belt
1403a‧‧‧area
1403b‧‧‧area
1500‧‧‧Drive mechanism
1501‧‧‧Splined shaft
1502‧‧‧spline nut
1503‧‧‧spline nut
1504‧‧‧Spline Nut
1505‧‧‧Spline Nut
1507‧‧‧Motor
1508‧‧‧ pulley
1509‧‧‧ pulley
1510‧‧‧Belt
S‧‧‧ area
X‧‧‧ direction
Y‧‧‧ direction
Z‧‧‧ direction
圖1係表示本發明之檢查裝置之第1實施形態之概略平面圖。 圖2係圖1所示之檢查用值所具有之供給機器人之手單元之立體圖。 圖3係圖1所示之檢查用值所具有之供給機器人之手單元之平面圖。 圖4係圖2所示之手單元所具有之第1支持部之平面圖。 圖5係圖2所示之手單元所具有之第2支持部之平面圖。 圖6係圖2所示之手單元所具有之第3支持部之平面圖。 圖7係圖2所示之手單元所具有之第4支持部之平面圖。 圖8係表示圖2所示之手單元所具有之X方向移動機構之平面圖。 圖9表示係圖2所示之手單元所具有之Y方向移動機構之平面圖。 圖10(a)、(b)係表示圖2所示之手單元所具有之Y方向移動機構之平面圖。 圖11係圖1所示之檢查裝置所具有之檢查用機器人之手單元之立體圖。 圖12係對圖1所示之檢查裝置的電子零件檢查順序進行說明之平面圖。 圖13係對圖1所示之檢查裝置的電子零件檢查順序進行說明之平面圖。 圖14係對圖1所示之檢查裝置的電子零件檢查順序進行說明之平面圖。 圖15係對圖1所示之檢查裝置的電子零件檢查順序進行說明之平面圖。 圖16係對圖1所示之檢查裝置的電子零件檢查順序進行說明之平面圖。 圖17係對圖1所示之檢查裝置的電子零件檢查順序進行說明之平面圖。 圖18係對圖1所示之檢查裝置的電子零件檢查順序進行說明之平面圖。 圖19係對圖1所示之檢查裝置的電子零件檢查順序進行說明之平面圖。 圖20係對圖1所示之檢查裝置的電子零件檢查順序進行說明之平面圖。 圖21係表示本發明之第2實施形態之檢查裝置所具有之供給機器人之手單元之平面圖。 圖22係圖21所示之手單元所具有之支持部之平面圖。Fig. 1 is a schematic plan view showing a first embodiment of the inspection apparatus of the present invention. FIG. 2 is a perspective view of a hand unit supplied to a robot, which is provided with the inspection value shown in FIG. 1. FIG. 3 is a plan view of a hand unit supplied to the robot with the inspection value shown in FIG. 1. FIG. FIG. 4 is a plan view of a first support portion provided in the hand unit shown in FIG. 2. Fig. 5 is a plan view of a second support portion provided in the hand unit shown in Fig. 2. Fig. 6 is a plan view of a third support portion provided in the hand unit shown in Fig. 2. Fig. 7 is a plan view of a fourth support portion provided in the hand unit shown in Fig. 2. FIG. 8 is a plan view showing an X-direction moving mechanism provided in the hand unit shown in FIG. 2. FIG. 9 is a plan view of a Y-direction moving mechanism provided in the hand unit shown in FIG. 2. 10 (a) and 10 (b) are plan views showing the Y-direction moving mechanism of the hand unit shown in FIG. 11 is a perspective view of a hand unit of an inspection robot included in the inspection apparatus shown in FIG. 1. FIG. 12 is a plan view illustrating an electronic component inspection procedure of the inspection apparatus shown in FIG. 1. FIG. FIG. 13 is a plan view illustrating an electronic component inspection procedure of the inspection apparatus shown in FIG. 1. FIG. 14 is a plan view illustrating an electronic component inspection procedure of the inspection apparatus shown in FIG. 1. FIG. 15 is a plan view illustrating an electronic component inspection procedure of the inspection apparatus shown in FIG. 1. FIG. FIG. 16 is a plan view illustrating an electronic component inspection procedure of the inspection apparatus shown in FIG. 1. FIG. 17 is a plan view illustrating an electronic component inspection procedure of the inspection apparatus shown in FIG. 1. FIG. FIG. 18 is a plan view illustrating an electronic component inspection procedure of the inspection apparatus shown in FIG. 1. FIG. FIG. 19 is a plan view illustrating an electronic component inspection procedure of the inspection apparatus shown in FIG. 1. FIG. FIG. 20 is a plan view illustrating an electronic component inspection procedure of the inspection apparatus shown in FIG. 1. FIG. FIG. 21 is a plan view showing a hand unit for supplying a robot included in an inspection apparatus according to a second embodiment of the present invention. FIG. 22 is a plan view of a supporting portion provided in the hand unit shown in FIG. 21.
1‧‧‧檢查裝置 1‧‧‧Inspection device
2‧‧‧供給托盤 2‧‧‧ supply tray
3‧‧‧回收托盤 3‧‧‧Recycling tray
4‧‧‧第1梭子 4‧‧‧ the first shuttle
5‧‧‧第2梭子 5‧‧‧ 2nd shuttle
6‧‧‧檢查用插口 6‧‧‧ Inspection socket
7‧‧‧供給機器人 7‧‧‧ supply robot
7a‧‧‧支持框 7a‧‧‧ Support Box
7b‧‧‧移動框 7b‧‧‧moving frame
7c‧‧‧手單元 7c‧‧‧hand unit
8‧‧‧回收機器人 8‧‧‧Recycling robot
8a‧‧‧支持框 8a‧‧‧Support box
8b‧‧‧移動框 8b‧‧‧moving frame
8c‧‧‧手單元 8c‧‧‧hand unit
9‧‧‧檢查用機器人 9‧‧‧ Inspection robot
10‧‧‧控制裝置 10‧‧‧Control device
21‧‧‧凹穴 21‧‧‧Dent
23‧‧‧軌道 23‧‧‧ track
31‧‧‧凹穴 31‧‧‧Dent
33‧‧‧軌道 33‧‧‧ track
41‧‧‧基底構件 41‧‧‧ base member
42‧‧‧托盤 42‧‧‧tray
43‧‧‧托盤 43‧‧‧tray
44‧‧‧軌道 44‧‧‧ track
51‧‧‧基底構件 51‧‧‧ base member
52‧‧‧托盤 52‧‧‧tray
53‧‧‧托盤 53‧‧‧tray
54‧‧‧軌道 54‧‧‧ track
61‧‧‧檢查用個別插口 61‧‧‧Inspection socket
92‧‧‧手單元 92‧‧‧hand unit
93‧‧‧手單元 93‧‧‧hand unit
100‧‧‧IC元件 100‧‧‧IC components
101‧‧‧檢查控制部 101‧‧‧ Inspection Control Department
102‧‧‧驅動控制部 102‧‧‧Drive Control Department
421‧‧‧凹穴 421‧‧‧Dent
431‧‧‧凹穴 431‧‧‧Dent
500‧‧‧第2攝像機 500‧‧‧Second camera
521‧‧‧凹穴 521‧‧‧Dent
531‧‧‧凹穴 531‧‧‧Dent
600‧‧‧第1攝像機 600‧‧‧The first camera
911‧‧‧框 911‧‧‧box
912‧‧‧框 912‧‧‧box
913‧‧‧手單元支持部 913‧‧‧Hand Unit Support Department
914‧‧‧手單元支持部 914‧‧‧Hand Unit Support Department
S‧‧‧區域 S‧‧‧ area
X‧‧‧方向 X‧‧‧ direction
Y‧‧‧方向 Y‧‧‧ direction
Z‧‧‧方向 Z‧‧‧ direction
Claims (11)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-146018 | 2012-06-28 | ||
| JP2012146018A JP2014010018A (en) | 2012-06-28 | 2012-06-28 | Handler and inspection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201810501A true TW201810501A (en) | 2018-03-16 |
Family
ID=50106854
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106125913A TW201810501A (en) | 2012-06-28 | 2013-06-25 | Handler and inspection apparatus |
| TW104132246A TWI595588B (en) | 2012-06-28 | 2013-06-25 | Electronic parts handling equipment |
| TW102122580A TWI509727B (en) | 2012-06-28 | 2013-06-25 | Processor and inspection device |
| TW104126144A TWI603419B (en) | 2012-06-28 | 2013-06-25 | Processor |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104132246A TWI595588B (en) | 2012-06-28 | 2013-06-25 | Electronic parts handling equipment |
| TW102122580A TWI509727B (en) | 2012-06-28 | 2013-06-25 | Processor and inspection device |
| TW104126144A TWI603419B (en) | 2012-06-28 | 2013-06-25 | Processor |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2014010018A (en) |
| KR (2) | KR101476913B1 (en) |
| CN (3) | CN203519648U (en) |
| TW (4) | TW201810501A (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103964133B (en) * | 2014-04-03 | 2016-01-20 | 北京首都国际机场股份有限公司 | Differential drive unit, the conveyer applying this differential drive unit and carrying method |
| JP6331809B2 (en) * | 2014-07-17 | 2018-05-30 | セイコーエプソン株式会社 | Electronic component conveying device and electronic component inspection device |
| JP6903267B2 (en) * | 2016-06-01 | 2021-07-14 | 株式会社Nsテクノロジーズ | Electronic component transfer device and electronic component inspection device |
| JP6601385B2 (en) * | 2016-12-27 | 2019-11-06 | 株式会社ダイフク | Support device for learning |
| KR102254353B1 (en) | 2017-03-10 | 2021-05-21 | 주식회사 엘지화학 | Charging Method of Secondary Battery |
| TWI635292B (en) * | 2018-01-05 | 2018-09-11 | Electronic component conveying device and conveying method | |
| JP2020051944A (en) * | 2018-09-27 | 2020-04-02 | セイコーエプソン株式会社 | Electronic component transport device and electronic component inspection device |
| CN114787978A (en) * | 2019-12-26 | 2022-07-22 | 佐藤控股株式会社 | IC chip mounting device and IC chip mounting method |
| EP4083861A4 (en) * | 2019-12-26 | 2023-06-14 | Sato Holdings Kabushiki Kaisha | IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD |
| CN116705671B (en) * | 2023-08-07 | 2023-10-13 | 江苏海纳电子科技有限公司 | Chip FT testing device and testing method |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS648150A (en) * | 1987-06-30 | 1989-01-12 | Shimadzu Corp | Conveying device |
| EP1209106A1 (en) * | 2000-11-23 | 2002-05-29 | Mars B.V. | Conveyor and method for conveying products |
| JP4426276B2 (en) * | 2003-10-06 | 2010-03-03 | 住友重機械工業株式会社 | Conveying device, coating system, and inspection system |
| KR100733846B1 (en) * | 2005-05-17 | 2007-07-02 | 미래산업 주식회사 | Test Tray Feeder of Handler for Semiconductor Device Testing |
| US8529185B2 (en) * | 2005-08-31 | 2013-09-10 | Hirata Corporation | Work handling apparatus |
| KR100914923B1 (en) * | 2005-08-31 | 2009-08-31 | 히라따기꼬오 가부시키가이샤 | Work handling apparatus |
| JP4962147B2 (en) * | 2007-06-07 | 2012-06-27 | パナソニック株式会社 | Substrate transport apparatus and substrate transport method |
| KR20090034463A (en) * | 2007-10-04 | 2009-04-08 | (주) 핸들러월드 | Customer Tray Feeder of Semiconductor Disk Test Equipment |
| KR100916538B1 (en) * | 2007-12-12 | 2009-09-11 | 코리아테크노(주) | Multi Sorter Wafer Handling System |
| TW200946933A (en) * | 2008-05-08 | 2009-11-16 | King Yuan Electronics Co Ltd | IC handler with sites of variable pitch |
| JP5287227B2 (en) * | 2008-12-25 | 2013-09-11 | 村田機械株式会社 | Transport cart |
-
2012
- 2012-06-28 JP JP2012146018A patent/JP2014010018A/en active Pending
-
2013
- 2013-06-25 TW TW106125913A patent/TW201810501A/en unknown
- 2013-06-25 TW TW104132246A patent/TWI595588B/en not_active IP Right Cessation
- 2013-06-25 TW TW102122580A patent/TWI509727B/en not_active IP Right Cessation
- 2013-06-25 TW TW104126144A patent/TWI603419B/en not_active IP Right Cessation
- 2013-06-27 KR KR1020130074417A patent/KR101476913B1/en not_active Expired - Fee Related
- 2013-06-28 CN CN201320381990.9U patent/CN203519648U/en not_active Expired - Fee Related
- 2013-06-28 CN CN201420108592.4U patent/CN203794200U/en not_active Expired - Fee Related
- 2013-06-28 CN CN201420108957.3U patent/CN203825037U/en not_active Expired - Fee Related
-
2014
- 2014-08-25 KR KR1020140110564A patent/KR20140118947A/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| TW201543607A (en) | 2015-11-16 |
| TWI603419B (en) | 2017-10-21 |
| TWI509727B (en) | 2015-11-21 |
| CN203794200U (en) | 2014-08-27 |
| TW201401416A (en) | 2014-01-01 |
| CN203825037U (en) | 2014-09-10 |
| TW201601241A (en) | 2016-01-01 |
| CN203519648U (en) | 2014-04-02 |
| KR101476913B1 (en) | 2014-12-29 |
| TWI595588B (en) | 2017-08-11 |
| KR20140118947A (en) | 2014-10-08 |
| JP2014010018A (en) | 2014-01-20 |
| KR20140004012A (en) | 2014-01-10 |
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