TW201818499A - Object conveying device, object processing device, exposure device, manufacturing method of flat panel display, component manufacturing method, object conveying method, and object exchange method - Google Patents

Abstract

The substrate carrying device (80) that transports the substrate (P) to the substrate stage (20) is provided with the vicinity of one end (+X side end) and the other end (-X) of the holding substrate (P2) from the lower side. a plurality of loading arms (84) in the vicinity of the side end portion, and a gas disposed on the upper surface of the substrate (P2) and having a force upward in the direction of gravity acts on the substrate (P2) supported by the plurality of loading arms (84) A suction device (86) and a drive system for driving the plurality of loading arms (84) and the gas suction device (86). Thereby, the substrate can be transported with good efficiency.

Description

 Object conveying device, object processing device, exposure device, manufacturing method of flat panel display, component manufacturing method, object conveying method, and object exchange method  

The present invention relates to an object transporting apparatus, an object processing apparatus, an exposure apparatus, a flat panel display manufacturing method, a component manufacturing method, an object transporting method, and an object exchange method, and more particularly to an object transporting apparatus and method for transporting an object An object exchange method for exchanging an object on the object holding device using the object transport method, an object processing device including the object transport device, an exposure device including the object processing device, and a flat panel display using the object processing device or the exposure device Manufacturing method and component manufacturing method.

In the lithography process for manufacturing electronic components (microcomponents) such as liquid crystal display elements, semiconductor elements (integrated circuits, etc.), a step-and-repeat projection exposure apparatus (so-called stepping) is used. Machine), or step-scan type projection exposure device (so-called scanning stepper (also known as scanner)).

In such an exposure apparatus, a substrate supporting member that supports a substrate from below is used to suppress the bending of the substrate, and the substrate carrier device is introduced (see, for example, Patent Document 1).

Here, with the increase in the size of the substrate in recent years, the substrate supporting member for supporting the substrate from below is also increased in size. However, since the substrate supporting member is carried on the substrate stage after the substrate is carried in the substrate stage, the substrate supporting member is enlarged, and the movement performance of the substrate stage may be lowered.

In the exposure apparatus, it is known that a plurality of glass substrates are continuously exposed to light by appropriately exchanging the glass substrate on the substrate stage by using the loading device and the unloading device (see, for example, Patent Document 2).

Here, when a plurality of glass substrates are continuously exposed, it is preferable to rapidly transport the glass substrate in order to improve the overall productivity. On the other hand, in recent years, glass substrates have become larger and thinner, and their handling must be handled with greater caution.

[Advanced technical literature]

[Patent Document 1] US Patent No. 6,559,928

[Patent Document 2] US Patent Application Publication No. 2011/0141448

According to a first aspect of the present invention, there is provided an object transporting apparatus that transports an object, comprising: a support member that supports at least a part of an end portion of the object from below; and a facing member that faces a side surface in a gravity direction of the object The arrangement is such that a force directed upward in the direction of gravity acts on the object supported by the support member, and a drive system that drives the support member and the opposing member.

According to the above, since the force directed upward in the direction of gravity acts on the object from the side surface side in the direction of gravity, even if only the end of the object is supported from below, the object can be transported with good efficiency in a state in which the bending due to the self-weight is suppressed. . Further, since the opposing member is disposed on the side surface side in the gravity direction of the substrate and supports only the substrate end portion, when the substrate is placed on a predetermined member, it can be directly placed on the member.

According to a second aspect of the present invention, there is provided an object processing apparatus comprising: the object transporting device according to the first aspect; and an object holding device capable of holding the object transported by the object transporting device; The support member and the opposing member are driven downward in the direction of gravity to transfer the object to the object holding device; the object is controlled to be opposite to the portion of the opposing member when being transferred to the object holding device The portion supported by the aforementioned support member protrudes downward.

According to a third aspect of the present invention, a method of manufacturing a flat panel display includes: an operation of exposing the object using the object processing apparatus according to the second aspect; and an operation of developing the object after exposure.

According to a fourth aspect of the present invention, there is provided a method of manufacturing a device comprising: an operation of exposing the object using the object processing apparatus according to the second aspect; and an operation of developing the object after the exposure.

According to a fifth aspect of the present invention, there is provided an object transport method for transporting an object, comprising: supporting at least a part of an end portion of the object from below by using a support member; and using the opposite member from a side surface side in the direction of gravity A force acting upward in the direction of gravity acts on the object supported by the support member; and an action of moving the support member and the opposing member.

According to a sixth aspect of the present invention, there is provided an object transporting apparatus for transporting a predetermined object in a plane parallel to a surface of the object, comprising: a suspension holding means for holding the object from above, at least parallel to the surface of the object The in-plane movement; and the supporting member are movable in a plane parallel to the surface of the object together with the overhanging device in a state of being disposed under the object held by the overhanging device.

According to the above, since the support member is disposed below the object held (suspended and held) from above by the overhanging device, when the object is transported by the overhanging device, the object can be prevented from falling from the overhanging device, and the object can be more reliably transported.

According to a seventh aspect of the present invention, there is provided an object processing apparatus comprising: an object holding device that holds the object when a predetermined process is performed on the object, an object that carries the aforementioned processing on the object holding device, and the object from the object The object carrying device that carries the object that has been subjected to the above processing is carried out by the holding device; and the object carrying device of the sixth aspect is used as the object carrying device.

According to an eighth aspect of the present invention, there is provided an exposure apparatus comprising: the object processing apparatus according to the seventh aspect of the present invention; and the processing of the object, using the energy beam to form the object held by the object holding device A pattern forming device of a predetermined pattern.

According to a ninth aspect of the present invention, a method of manufacturing a flat panel display includes: an operation of exposing the object using an exposure apparatus according to the eighth aspect; and an operation of developing the exposed object.

According to a tenth aspect of the present invention, there is provided a method of manufacturing a device comprising: an operation of exposing the object using an exposure apparatus according to the eighth aspect; and an operation of developing the object before exposure.

According to an eleventh aspect of the present invention, there is provided an object transporting method for transporting a predetermined object in a plane parallel to a surface of the object, comprising: an action of holding the overhanging device to hold the object from above; and maintaining the overhanging An operation of arranging the support member below the object of the holding device; and an operation of driving the overhanging device holding the object and the support member in a plane parallel to the surface of the object.

According to the above, since the support member is disposed below the object held (suspended and held) from above by the overhanging device, when the object is transported by the overhanging device, the object can be prevented from falling from the overhanging device, and the object can be more reliably transported.

According to a twelfth aspect of the present invention, there is provided an operation of performing predetermined processing on a first object held by an object holding device, an operation of carrying out the first object from the object holding device, and holding the object by using an object loading device The object exchange method in the object holding device that moves the device into the second object, wherein the above-described carry-out operation uses the object transport method according to the eleventh aspect.

10‧‧‧Liquid exposure device

11‧‧‧

14‧‧‧ bottom frame

16‧‧‧Y linear guide

16a‧‧‧Y linear guide

16b‧‧‧Y sliding member

18y‧‧‧Y voice coil motor

18z‧‧‧Z voice coil motor

19a‧‧‧With arm members

19b‧‧‧Loading arm members

20‧‧‧Substrate stage

21‧‧‧Micro-motion stage

22x‧‧‧X pole mirror

22y‧‧‧Y pole mirror

23x‧‧‧X coarse moving stage

23y‧‧‧Y coarse moving stage

24‧‧‧ mirror base

25‧‧‧X column

26‧‧‧Y bracket

27‧‧‧X linear guide

27a‧‧‧X linear guide

27b‧‧‧X sliding member

28‧‧‧X linear motor

28a‧‧‧Magnetic unit

28b‧‧‧ coil unit

29‧‧‧ spacers

30‧‧‧ device body

31‧‧‧Film holder

32‧‧‧ side column

33‧‧‧Substrate mounting platform

34‧‧‧Anti-vibration device

35‧‧‧Y linear guide

35a‧‧‧Y linear guide

35b‧‧‧Y sliding member

40‧‧‧Substrate holder

41‧‧‧ gap

42‧‧‧ gap

43‧‧‧ gap

44‧‧‧ pillar

45‧‧‧Substrate slide device

45a‧‧‧Adsorption pad

45b‧‧‧Drive

50‧‧‧Y stepping plate

51‧‧‧Bending device

54‧‧‧Weight elimination device

55‧‧‧Bending device

56‧‧‧Z sensor

57‧‧‧ target

58‧‧‧Air suspension device

59‧‧‧ Leveling device

60‧‧‧Exports and Exports

61‧‧‧ 台台

62‧‧‧Substrate guiding device

64‧‧‧ 台台

65‧‧‧Air suspension device

66‧‧‧X linear guide

66a‧‧‧X linear guide

66b‧‧‧X sliding member

68‧‧‧Substrate lifting device

68a‧‧‧Z actuator

68b‧‧‧lifting pin

70‧‧‧Substrate removal device

71‧‧‧Adsorption pad

72‧‧‧Support members

73‧‧‧X linear guide

73a‧‧‧X linear guide

73b‧‧‧X sliding parts

74‧‧‧X linear motor

74a‧‧‧Magnetic unit

74b‧‧‧ coil unit

75‧‧‧Z linear guide

75a‧‧‧Z linear guide

75b‧‧‧Z sliding member

76‧‧‧Z actuator

80‧‧‧Substrate loading device

81‧‧‧X travel guide

82a‧‧‧1X sliding member

82b‧‧‧2X sliding member

82c‧‧‧3X sliding member

83a‧‧‧1st link

83b‧‧‧2nd link

84‧‧‧ mechanical arm

85‧‧‧Support pin

86‧‧‧ gas suction device

88‧‧‧Rack

881‧‧‧Top Board

882‧‧‧foot

883‧‧‧ 补刚部

884‧‧‧Connecting members

885‧‧‧Support members

89‧‧‧Z actuator

IL‧‧‧Lights

IOP‧‧‧Lighting Department

M‧‧‧Photo Mask

MST‧‧‧Photomask stage

P, P1, P2, P3‧‧‧ substrates

PL‧‧‧Projection Optics

PST‧‧‧Substrate stage device

Fig. 1 is a view schematically showing the configuration of a liquid crystal exposure apparatus according to a first embodiment.

2 is a side view of a substrate stage device, an entrance and exit portion, and a substrate loading device of the liquid crystal exposure device of FIG. 1.

3 is a plan view of a substrate holder provided in the substrate stage device of FIG. 2.

4 is a plan view of the inlet and outlet portions and the substrate loading device of FIG. 2.

5(A) and 5(B) are diagrams for explaining the exchange operation of the substrate (1 and 2).

6(A) and 6(B) are diagrams for explaining the exchange operation of the substrates (3 and 4).

7(A) and 7(B) are diagrams for explaining the exchange operation of the substrates (the 5 and 6 thereof).

8(A) and 8(B) are diagrams for explaining the exchange operation of the substrates (the 7 and 8 thereof).

9(A) and 9(B) are diagrams for explaining the exchange operation of the substrates (9 and 10 thereof).

10(A) and 10(B) are diagrams for explaining the exchange operation of the substrates (the 11 and 12 thereof).

11(A) to 11(C) are diagrams for explaining the operation of the substrate unloading device (1 to 3).

12(A) and 12(B) are views for explaining the operation of the substrate loading device (1 and 2).

Fig. 13(A) is a cross-sectional view of the substrate stage of the second embodiment, and Fig. 13(B) is a plan view of the substrate holder of the substrate stage of Fig. 13(A).

14(A) to 14(C) are views for explaining the operation of the substrate carrying device 170 included in the substrate stage 120 of Fig. 13(A) (the third to third).

Figs. 15(A) and 15(B) are views for explaining the exchange operation of the substrate of the second embodiment (the first to third aspects thereof).

16(A) and 16(B) are views for explaining the exchange operation of the substrate in the second embodiment (the third and fourth portions thereof).

17(A) and 17(B) are views for explaining the exchange operation of the substrate of the second embodiment (the fifth and sixth portions thereof).

18(A) and 18(B) are views for explaining the exchange operation of the substrate in the second embodiment (the seventh and eighth aspects thereof).

19(A) and 19(B) are views for explaining the exchange operation of the substrate in the second embodiment (9 and 10 thereof).

20(A) and 20(B) are views for explaining the exchange operation of the substrate of the second embodiment (the 11 and 12 thereof).

21(A) and 21(B) are views for explaining the exchange operation of the substrate of the second embodiment (13 and 14 thereof).

22(A) and 22(B) are views for explaining the exchange operation of the substrate in the second embodiment (the 15 and 16 thereof).

Fig. 23 is a plan view showing a substrate carrying device according to a first modification.

Fig. 24 is a plan view showing a substrate carrying device according to a second modification.

Fig. 25 is a plan view showing a substrate holder according to a third modification.

26(A) and 26(B) are views for explaining the operation of the substrate carrying device of the fourth modification (1 and 2).

27(A) and 27(B) are views for explaining the operation of the substrate carrying device of the fourth modification (3 and 4).

Fig. 28 is a view schematically showing the configuration of a liquid crystal exposure apparatus according to a third embodiment.

Figure 29 is a cross-sectional view showing a substrate stage and an entrance and exit portion of the liquid crystal exposure apparatus of Figure 28.

Figure 30 is a plan view (1) of the inlet and outlet portions of Figure 29.

Figure 31 is a plan view (2) of the inlet and outlet portions of Figure 29.

Fig. 32 is a view showing a substrate guiding device and a substrate carrying device.

33(A) and 33(B) are diagrams for explaining the substrate loading operation (1 and 2).

34(A) and 34(B) are diagrams for explaining the substrate exchange operation (1 and 2).

35(A) and 35(B) are diagrams for explaining the substrate exchange operation (3 and 4).

36(A) and 36(B) are diagrams for explaining the substrate exchange operation (5 and 6 thereof).

37(A) and 37(B) are diagrams for explaining the substrate exchange operation (7 and 8).

38(A) and 38(B) are diagrams for explaining the substrate exchange operation (9 and 10 thereof).

39(A) and 39(B) are diagrams for explaining the substrate exchange operation (11 and 12 thereof).

Fig. 40 is a view showing the substrate carrying device of the fourth embodiment.

41(A) to 41(C) are views for explaining the substrate loading operation of the fourth embodiment (the first to third aspects thereof).

42(A) and 42(B) are views for explaining a modification (No. 1) of the fourth embodiment.

43(A) and 43(B) are views for explaining a modification (part 2) of the fourth embodiment.

Fig. 44 is a view showing the substrate stage of the fifth embodiment;

Figure 45 is a cross-sectional view showing the substrate stage of the fifth embodiment.

Fig. 46 is a view for explaining the substrate carrying operation of the fifth embodiment.

"First Embodiment"

Hereinafter, the first embodiment will be described with reference to Figs. 1 to 12(B).

In Fig. 1, the configuration of the liquid crystal exposure apparatus 10 of the first embodiment is schematically shown. The liquid crystal exposure apparatus 10 is a rectangular (angular) glass substrate P (for example, the substrate P1 and the substrate P2 in FIG. 1 , hereinafter referred to as a substrate P as appropriate) as a projection exposure of an exposure target object, for example, a liquid crystal display device (flat panel display). Device.

The liquid crystal exposure apparatus 10 includes an illumination system IOP, a mask stage MST holding the mask M, a projection optical system PL, a device body 30, and a surface (the surface facing the +Z side in FIG. 1) coated with a resist. The substrate stage device PST of the substrate P (the substrate P1 in FIG. 1) and the entrance and exit portion 60 for transferring the substrate P between the external device (for example, the coating and developing device) (not shown in FIG. 1) Referring to Fig. 2), a substrate carrying device 80 for loading a substrate P (substrate P2 in Fig. 1) into a substrate stage device PST, and the like, and the like. In the following description, when the exposure is performed, the direction in which the mask M and the substrate P are scanned relative to the projection optical system PL is the X-axis direction, and the direction orthogonal to the horizontal plane in the horizontal plane is the Y-axis direction, and the X-axis and the Y-axis. The direction orthogonal to the direction is the Z-axis direction, and the directions of the rotation (tilting) around the X-axis, the Y-axis, and the Z-axis are θx, θy, and θz directions, respectively. Further, the positions in the X-axis, the Y-axis, and the Z-axis direction will be described as the X position, the Y position, and the Z position, respectively.

The illumination system IOP is configured in the same manner as the illumination system disclosed in, for example, the specification of U.S. Patent No. 6,552,775. In other words, the illumination system IOP is configured to emit light emitted from a light source (for example, a mercury lamp) (not shown) through a mirror, a dichroic mirror, a blind, a wavelength selective filter, various lenses, and the like, which are not shown. Illumination light (illumination light) IL is applied to the mask M as exposure light. For the illumination light IL, for example, an i-line (wavelength: 365 nm), a g-line (wavelength: 436 nm), an h-line (wavelength: 405 nm), or the like (or the above-described i-line, g-line, and h-line combined light) is used.

In the mask stage MST, for example, a mask M in which a circuit pattern or the like is formed on the pattern surface is adsorbed and held by vacuum suction. The mask stage MST is mounted on the lens holder 31, which is a part of the apparatus main body 30 (body), and is driven in the scanning direction by a predetermined long stroke by, for example, a mask stage driving system (not shown) including a linear motor. X-axis direction), and is appropriately micro-driven in the Y-axis direction and the θz direction. The position information (including the rotation information in the θz direction) of the mask stage MST in the XY plane is measured by a mask interferometer system including a laser interferometer (not shown).

The projection optical system PL is disposed below the mask stage MST, and is supported by a portion of the apparatus body 30, that is, the barrel holder 31. The projection optical system PL has the same configuration as the projection optical system disclosed in the specification of U.S. Patent No. 6,552,775. In other words, the projection optical system PL includes a plurality of projection optical systems (multi-lens projection optical systems) in which the projection regions of the pattern image of the mask M are arranged in a staggered manner, and a rectangular single image field having a longitudinal direction in the Y-axis direction. The projection optics have equal functions. In the present embodiment, each of the plurality of projection optical systems is formed by, for example, forming an erect positive image by a double eccentricity on both sides.

Therefore, when the illumination area on the reticle M is illuminated by the illumination light IL from the illumination system IOP, that is, by the illumination light IL passing through the reticle M, the circuit of the reticle M in the illumination area is transmitted through the projection optical system PL. The pattern projection image (partial erect image) is formed in an irradiation region (exposure region) of the illumination light IL conjugate with the illumination region on the substrate P. And by the synchronous driving of the mask stage MST and the substrate stage device PST, the mask M is moved in the scanning direction with respect to the illumination area (illumination light IL) and the substrate P is moved in the scanning direction with respect to the exposure area (illumination light IL). According to the scanning exposure of one irradiation region on the substrate P, the pattern formed on the mask M is transferred in the irradiation region. That is, in the present embodiment, the illumination system IOP and the projection optical system PL are used to form the pattern of the mask M on the substrate P, and the exposure layer (resist layer) on the substrate P using the illumination light IL is exposed. This pattern is formed on the substrate P.

The apparatus body 30 has a barrel fixed plate 31, a pair of side columns 32, and a substrate stage stand 33. The barrel holder 31 is composed of a plate-like member disposed in parallel with the XY plane, and supports the projection optical system PL, the mask stage MST, and the like. One of the pair of side pillars 32 supports the vicinity of the +Y side end portion of the lens barrel platen 31 from below, and the other side supports the vicinity of the Y-side end portion of the lens barrel platen 31 from below. The substrate stage stand 33 is composed of a member extending in the Y-axis direction, and is supported from below by an anti-vibration device 34 provided on the floor 11 of the clean room. One of the pair of side columns 32 is mounted on the vicinity of the +Y side end portion of the substrate stage stand 33, and the other side is mounted on the vicinity of the Y-side end portion of the substrate stage stand 33. The barrel holder 31, the pair of side posts 32, and the substrate stage stand 33 are integrally coupled. Thereby, the apparatus body 30 (and the projection optical system PL, the mask stage MST, etc.) are separated from the ground by vibration.

As shown in FIG. 2, the substrate stage device PST includes a bottom frame 14 and a substrate stage 20. In addition, the substrate stage 20 shown in FIG. 1 corresponds to the A-A line cross section of FIG. 2, and the substrate loading apparatus 80 shown in FIG. 1 corresponds to the line B-B of FIG.

The bottom frame 14 is formed of a member extending in the Y-axis direction, and is disposed on the ground 11 at a predetermined distance (in a non-contact state) from the substrate stage 33. The bottom frame 14 supports the Y coarse movement stage 23y, which is a part of the substrate stage 20 to be described later, from below, and functions as a guide member when the substrate stage 20 is moved in the Y-axis direction by a predetermined length. The bottom frame 14 is provided with a pair (not shown in FIG. 2) in the X-axis direction, and supports the vicinity of both end portions in the longitudinal direction of the Y coarse movement stage 23y from below. In addition, when a plurality of the substrate stage stages 33 are provided at a predetermined interval in the X-axis direction, the intermediate portion of the longitudinal direction of the Y coarse movement stage 23y may be disposed between the substrate stage stages 33 adjacent to each other. The bottom of the box. A Y linear guide 16a which is an element of the Y linear guide is fixed to the upper end surface (+Z side end portion) of the bottom frame 14.

The substrate stage 20 includes a Y coarse movement stage 23y, an X coarse movement stage 23x, a fine movement stage 21, a substrate holder 40, a Y stepping platen 50, a weight eliminating device 54, and a substrate unloading device 70.

The Y coarse movement stage 23y is disposed above the substrate stage stand 33 and is mounted on the bottom frame 14. The Y coarse movement stage 23y has a pair of X-pillars 25 as shown in FIG. The X-pillar 25 is composed of a member having a rectangular YZ cross section extending in the X-axis direction. The pair of X-pillars 25 are integrally connected to each other at the end portions of the -X side and the +X side (not shown in Fig. 1 and see Fig. 2) by a plate-like member called a Y bracket 26. Below the Y bracket 26, a Y sliding member 16b constituting the Y linear guiding device 16 together with the Y linear guide 16a is fixed. The Y sliding member 16b is slidably engaged with the corresponding Y linear guide 16a with low friction, and the Y coarse movement stage 23y is movable on the pair of bottom frames 14 with a predetermined stroke with low friction in the Y-axis direction.

The Y coarse movement stage 23y is driven in the Y-axis direction by a pair of Y actuators (not shown) on the pair of bottom frames 14. The type of the Y actuator is not particularly limited, and for example, a feed screw device, a linear motor, a belt drive device, or the like can be used. On the upper side of each of the pair of X-pillars 25, for example, an X linear guide 27a which is an element of two X linear guides is fixed at a predetermined interval in the Y-axis direction. Further, a magnet unit 25a (X stator) including a plurality of permanent magnets arranged at predetermined intervals in the X-axis direction is fixed in a region between the X-pillars 25 and, for example, between the two X-axis guides 27a.

The X coarse movement stage 23x is formed of a rectangular plate-shaped member in plan view, and an opening portion (not shown) is formed at a central portion thereof. Below the X coarse movement stage 23x, an X sliding member 27b constituting the X linear guide 27 together with the above-described X linear guides 27a is fixed via a spacer 29. The X sliding member 27b is provided with, for example, four at a predetermined interval in the X-axis direction with respect to one X linear guide 27a. The X sliding member 27b is slidably engaged with the corresponding X linear guide 27a with low friction, and the X coarse movement stage 23x is movable on the pair of X columns 25 with a predetermined stroke with low friction in the X-axis direction. Further, a coil unit 28b (X movable member) constituting the X linear motor 28 for driving the X coarse movement stage 23x to the X-axis direction with a predetermined stroke is fixed to the lower surface of the X coarse movement stage 23x. ).

The X coarse movement stage 23x is restricted from moving relative to the Y coarse movement stage 23y in the Y-axis direction by a plurality of (four in FIG. 1) X linear guides 27, and the Y coarse movement stage 23y. The unit moves in the Y-axis direction. That is, the X coarse movement stage 23x and the Y coarse movement stage 23y together constitute a gantry type double shaft stage apparatus. The Y position information of the Y coarse movement stage 23y and the X position information of the X coarse motion stage 23x are respectively obtained by a linear encoder system (not shown).

The fine movement stage 21 is constituted by a box-shaped member having a rectangular shape in plan view, and a substrate holder 40 is fixed thereon. The fine movement stage 21 is micro-driven in the three-degree-of-freedom direction (X-axis, Y-axis, θz) on the X coarse movement stage 23x by the fine movement stage drive system, and the fine movement stage drive system is fixed by the X-thickness A plurality of voice coil motors composed of a stator of the movable stage 23x and a movable body fixed to the fine movement stage 21. The plurality of voice coil motors include a plurality of X voice coil motors (not shown in FIG. 1) that generate thrust in the X-axis direction and a plurality of Y voice coil motors 18y that generate thrust in the Y-axis direction (however, in FIG. 2 In order to avoid the drawing being too complicated, a plurality of voice coil motors are not shown.

The fine movement stage 21 is induced by the X coarse movement stage 23x by the thrust generated by the plurality of voice coil motors, and moves in the X-axis direction and/or the Y-axis direction together with the X coarse motion stage 23x with a predetermined stroke. Further, the fine movement stage 21 is appropriately micro-driven in the three-degree-of-freedom direction with respect to the X coarse motion stage 23x by a plurality of voice coil motors. Further, the fine movement stage drive system has a plurality of Z voice coil motors 18z for micro-driving the fine movement stage 21 in the three-degree-of-freedom directions of θx, θy, and Z-axis directions. A plurality of Z voice coil motors 18z are disposed, for example, at positions corresponding to the four corners of the fine movement stage 21. The construction of a micro-motion stage drive system comprising a plurality of voice coil motors is disclosed, for example, in the specification of U.S. Patent Application Publication No. 2010/0018950.

The position information (including the rotation amount information in the θz direction) of the fine movement stage 21 in the XY plane is comprised by a substrate interferometer system including an unillustrated laser interferometer (X interferometer and Y interferometer) fixed to the apparatus body 30. The X-ray mirror 22x (not shown in Fig. 1 with reference to Fig. 2) and the Y-bar mirror 22y fixed to the fine movement stage 21 through the lens holder 24 are obtained. Further, the positional information of each of the θx, θy, and Z-axis directions of the fine movement stage 21 is fixed to a target 57 of a weight eliminating device 54 to be described later by a plurality of Z sensors 56 fixed to the lower surface of the fine movement stage 21. Find it. The configuration of the position measuring system of the above-described fine movement stage 21 is disclosed in, for example, U.S. Patent Application Publication No. 2010/0018950.

As shown in FIG. 3, the substrate holder 40 is formed of a rectangular plate-like member having a rectangular shape in the longitudinal direction of the X-axis direction, and a plurality of small pieces (not shown) for holding and holding the substrate P by vacuum adsorption are formed on the substrate. Hole section. The substrate holder 40 can also eject the pressurized gas (for example, air) from the plurality of holes (or other holes) to the lower surface of the substrate P, and can also float the substrate P. The size of the substrate holder 40 in the X-axis and the Y-axis direction is set to be shorter than the dimensions of the substrate P in the X-axis and the Y-axis direction, and the substrate P is placed in the state in which the substrate holder 40 is placed on the substrate P. The end portion extends beyond the end of the substrate P. The reason is that even if a resist (sensor) applied to the surface of the substrate P is wound around the back side of the substrate P and adheres to the vicinity of the periphery of the back surface of the substrate P, the resist can be prevented from adhering to the substrate. With 40 reasons.

A notch 41 is formed in each of the four corners of the upper surface of the substrate holder 40. The notch 41 is opened on the corresponding side surface of the substrate holder 40 (for example, the +X side and the +Y side notch 41 are opened on the +X side surface and the +Y side side surface of the substrate holder 40). Further, a notch 42 that is open to the corresponding side surface of the substrate holder 40 is formed at a central portion in the vicinity of the end portions of the +X side and the +X side of the upper surface of the substrate holder 40.

Further, in the vicinity of the -Y side end portion of the upper surface of the substrate holder 40, the notches 43 opened on the side of the -Y side of the substrate holder 40 are separated by, for example, two in the X-axis direction. For example, a portion of the substrate slide device 45 is housed in each of the two notches 43.

As shown in FIG. 1, the substrate slide device 45 is mounted on a mirror holder 24 for fixing the Y-bar mirror 22y to the fine movement stage 21. As shown in FIG. 3, the substrate slide device 45 includes an adsorption pad 45a and a driving device 45b for driving the adsorption pad 45a in the Y-axis and Z-axis directions. The adsorption pad 45a is formed of a rectangular member in plan view and is housed in the notch 43. The adsorption pad 45a is connected to a vacuum suction device (not shown). The adsorption pad 45a is placed on the lower surface of the substrate P in a state where the substrate P is placed on the substrate holder 40, and the upper surface functions as a substrate adsorption surface.

The drive device 45b includes a Y actuator and a Z actuator (not shown), and can drive the adsorption pad 45a in the Y-axis direction in a predetermined (for example, about 10 to 100 mm) stroke in the notch 43 and the adsorption pad 45a. The position of the back surface of the adsorption substrate P is driven in the Z-axis direction by a predetermined (for example, about 2 mm) stroke between the position on the back surface of the substrate P and the position away from the back surface of the substrate P.

Referring back to Fig. 1, the Y stepping plate 50 is composed of a member having a rectangular YZ cross section extending in the X-axis direction, and is inserted between a pair of X-pillars 25. The length direction dimension of the Y stepping platen 50 is set to be slightly longer than the movement stroke of the fine movement stage 21 in the X-axis direction. The flatness of the upper surface of the Y stepping plate 50 is made very high. As shown in FIG. 2, the Y stepping plate 50 is constituted by a plurality of Y linear guides 35a fixed to the upper surface of the substrate stage 33 and a plurality of Y sliding members 35b fixed under the Y stepping plate 50. A plurality of Y linear guides 35 are guided straight in the Y-axis direction on the substrate stage gantry 33 with a predetermined stroke.

The Y stepping plate 50 is in the vicinity of both end portions in the X-axis direction (longitudinal direction), and is transmitted through a pair of devices called a bending device 51 (not shown in the bending device 51 on the -X side in Fig. 2). Column 25 is mechanically linked. Thereby, the Y stepping plate 50 and the Y coarse movement stage 23y are integrally moved in the Y-axis direction. Referring back to Fig. 1, the bending device 51 includes, for example, a strip-shaped steel sheet having a thickness thinner than the XY plane, and a sliding device (e.g., a ball joint) provided at both end portions of the steel plate, the steel plate being erected in the Y step by the sliding device. The fixed plate 50 and the X column 25 rooms. Therefore, the rigidity of the other five degrees of freedom directions (X, Z, θx, θy, θz directions) of the bending device 51 is lower than that of the Y axis direction, and the Y stepping plate 50 and the Y coarse moving stage 23y are in the above five freedoms. The direction of the vibration is separated on the vibration.

The weight eliminating device 54 supports the fine movement stage 21 from below via a device called a leveling device 59, which will be described later. The weight eliminating device 54 is inserted into the opening formed in the X coarse movement stage 23x. The weight eliminating device 54 of the present embodiment has the same configuration as the weight eliminating device disclosed in the specification of the U.S. Patent Application Publication No. 2010/0018950. In other words, the weight eliminating device 54 includes an air spring or the like (not shown), and the force generated by the air spring toward the upper side (+Z direction) in the direction of gravity cancels the system including the fine movement stage 21 and the substrate holder 40. The weight (the force of the downward acceleration (-Z direction) generated by the weight acceleration) thereby reducing the load of the plurality of Z voice coil motors 18z of the micro-motion stage drive system.

The weight eliminating device 54 is mechanically coupled to the X coarse movement stage 23x via a plurality of bending devices 55, and moves integrally with the X coarse motion stage 23x in the X-axis direction and/or the Y-axis direction. The configuration of the bending device 55 is substantially the same as the aforementioned bending device 51 for connecting the Y stepping plate 50 to the X column 25. The leveling device 59 includes a spherical bearing device (or a pseudo-spherical bearing device as disclosed in, for example, the specification of the U.S. Patent Application Publication No. 2010/0018950), and the fine movement stage 21 is swingably (tilted) from below in the θx and θy directions. .

Here, the weight eliminating device 54 is mounted on the Y stepping plate 50 in a non-contact state by a plurality of air suspension devices 58 attached to the lower side. The weight eliminating device 54 moves on the Y stepping plate 50 when moving integrally with the X coarse movement stage 23x in the X-axis direction. On the other hand, when the weight canceling device 54 moves integrally with the X coarse movement stage 23x in the Y-axis direction, the weight canceling device 54 moves integrally with the Y coarse movement stage 23y and the Y stepping fixed plate 50 in the Y-axis direction. It falls off from the Y stepping plate 50.

The substrate carrying device 70 is a device in which the substrate P placed on the substrate holder 40 is carried out to the outside of the substrate stage device PST (hereinafter referred to as an inlet/outlet portion 60 (see FIG. 2) to be described later). The outer side of the +Y side X-pillar 25 of the pair of X-pillars 25 (the surface facing the +Y side). The substrate unloading device 70 has an adsorption pad 71 on the lower surface of the substrate P for holding and holding the substrate, a support member 72 that supports the adsorption pad 71, and a support pair of the support member 72 (and the adsorption pad 71) in the X-axis direction. The guiding device 73 and the X linear motor 74 for driving the supporting member 72 (and the adsorption pad 71) in the X-axis direction.

The adsorption pad 71 is formed of a member having an L-shaped cross section of YZ, and a portion parallel to the XY plane is composed of a plate-like member having a rectangular shape in a longitudinal direction in the X-axis direction. The adsorption pad 71 is connected to a vacuum suction device (not shown), and the upper surface of the portion parallel to the XY plane functions as a substrate suction surface. One of the portions of the adsorption pad 71 that is parallel to the XZ plane faces one surface (the surface facing the +Y side) near the upper end portion of the support member 72. The adsorption pad 71 is mounted to be movable relative to the support member 72 through a Z linear guide 75 formed of a Z linear guide 75a fixed to one side of the support member 72 and a Z slide member 75b fixed to the portion parallel to the XY plane. In the Z axis direction. Further, the adsorption pad 71 is positioned between the upper surface of the substrate holder 40 and the lower side of the substrate holder 40 by the Z actuator 76 attached to the support member 72 on the upper surface (substrate adsorption surface). Driven in the Z-axis direction.

The support member 72 is formed of a plate-like member extending in the Z-axis direction and parallel to the XZ plane. In order to feed the substrate P to the inlet and outlet portion 60, the intermediate portion in the longitudinal direction is curved so that the +Z side end portion is closer to the -Z side end portion to the + side. The X side protrudes. The other surface (the surface facing the -Y side) near the lower end portion of the support member 72 faces the outer side surface of the X-pillar 25 on the +Y side. On the other hand, on the outer side surface of the X column 25 on the +Y side, for example, two (one pair) X linear guides 73a are fixed at predetermined intervals in the Z-axis direction. Further, on the other surface of the support member 72, a plurality of X sliders 73b slidably engaged with the X linear guides 73a are fixed. The X linear guide 73a and the X slider 73b constitute an X linear guide 73 for guiding the support member 72 (and the suction pad 71) in the X-axis direction. Further, between the pair of X linear guides 73a, a plurality of permanent magnets 74a including a plurality of permanent magnets arranged at predetermined intervals in the X-axis direction are fixed. On the other hand, the coil unit 74b including the coil is fixed to the other surface of the support member 72. The magnet unit 74a (X stator) and the coil unit 74b (X mover) constitute an X linear motor 74 for driving the support member 72 (and the adsorption pad 71) in the X-axis direction.

The entrance and exit portion 60 is disposed on the +X side of the substrate stage device PST as shown in Fig. 2 . The entrance and exit portion 60 is housed in a chamber (not shown) together with the apparatus body 30 (not shown in FIG. 2, see FIG. 1) and the substrate stage device PST.

The entrance and exit portion 60 includes a substrate guiding device 62 and a substrate lifting and lowering device 68 that receive the exposed substrate P (the substrate P1 in FIG. 2) from the substrate stage 20. The substrate guiding device 62 is mounted on the gantry 61 provided on the ground 11. The substrate guiding device 62 has a base 63 and a plurality of air suspension devices 65 that are mounted on the base 63 through the mounting frame 64.

The base 63 is formed of a plate-like member having a rectangular shape in plan view. The base 63 is guided straight in the X-axis direction by an X linear guide 66 configured by an X linear guide 66a fixed to the upper surface of the mount 61 and an X slide member 66b fixed to the lower surface of the base 63. Further, the base 63 is driven in the X-axis direction by a predetermined stroke with respect to the gantry 61 by an X actuator (not shown). When the substrate is carried out later, when the liquid crystal exposure apparatus 10 is used (including the exposure operation), the base 63 (substrate guiding device 62) is located at the stroke end on the +X side shown in FIG. 2 (from the substrate stage device PST) Leave the location).

A plurality of air suspension devices 65 are respectively formed of plate members parallel to the XY plane. A plurality of micro hole portions (not shown) are formed on the upper surface of the air suspension device 65, and a pressurized gas (for example, air) is ejected from the hole portion, and the substrate P can be suspended and supported via a small gap (gap, clearance). Further, at least a part of the air suspension device 65 can also adsorb and hold the substrate P by using the plurality of holes (or other holes).

As shown in FIG. 4, a plurality of air suspension devices 65 are disposed apart from each other at a predetermined interval so as to support the lower surface of the substrate P substantially uniformly. In the first embodiment, the air suspension device array including a plurality of (for example, three) air suspension devices 65 arranged at a predetermined interval in the X-axis direction has a plurality of columns (for example, five columns) arranged at a predetermined interval in the Y-axis direction. ). As described above, in the first embodiment, the substrate guiding device 62 supports the substrate P from below by using, for example, a total of 15 air suspension devices 65. In addition, the arrangement and the number of the air suspension devices 65 are not limited thereto, and can be appropriately changed depending on, for example, the size of the substrate P.

Referring back to Fig. 2, the substrate lifting and lowering device 68 includes a Z actuator 68a attached to the base 63 of the substrate guiding device 62 and a plurality of lifting pins 68b driven by the Z actuator 68a in a Z-axis direction with a predetermined stroke. . Each of the lift pins 68b is formed of a rod-shaped member extending in the Z-axis direction, and a pad member for protecting the back surface of the substrate P is attached to the front end portion (+Z side end portion). The plurality of lift pins 68b are disposed between the plurality of air suspension devices 65 in a state where they are separated from each other at a predetermined interval so as to support the lower surface of the substrate P substantially uniformly. In the first embodiment, a plurality of rows (for example, four rows) are arranged in the Y-axis direction at a predetermined interval by a plurality of (for example, three) lift pins 68b arranged at a predetermined interval in the X-axis direction. As described above, in the first embodiment, the substrate lifting and lowering device 68 supports the substrate P from below by using, for example, a total of twelve lifting pins 68b.

The plurality of lift pins 68b and the -Z side end portions are coupled to each other through the joint member, and are integrally driven in the Z-axis direction by the Z actuator 68a. The type of the Z actuator 68a is not particularly limited, and for example, an air cylinder or the like can be used. Further, the substrate lifting and lowering device 68 may be configured such that a plurality of lift pins 68b are driven by one Z actuator 68a, or a plurality of lift pins 68b may be provided with Z actuators.

As shown in FIG. 4, the substrate loading device 80 includes a pair of X traveling guides 81, one pair of X-shaped traveling guides 81, one pair of first X-sliding members 82a, and one pair of X-traveling guides 81. The second X sliding member 82b, the first connecting rod 83a, the second connecting rod 83b, the plurality of robot arms 84, the plurality of support pins 85, and the pair of X traveling guides 81 are provided to the third X sliding member 82c, And a gas suction device 86.

Each of the pair of X traveling guides 81 is formed of a member extending in the X-axis direction, and is disposed in parallel with each other at a predetermined interval (a little wider than the Y-axis direction dimension of the substrate P) in the Y-axis direction. Each of the pair of X traveling guides 81 is mounted on a gantry 88 set on the ground 11 via a plurality of Z actuators 89 as shown in FIG. 2 . The type of the Z actuator 89 is not particularly limited.

The gantry 88 includes a top plate portion 881 formed of a plate-like member extending in the X-axis direction, a pair of leg portions 882 that support the top plate portion 881 from below on the ground 11, and a complementary portion 883 that is spanned between the pair of leg portions 882. The top plate portion 881 is supported by the leg portion 882 from the lower side in the vicinity of the end portion on the +X side and the center portion in the longitudinal direction, and the vicinity of the end portion on the -X side is suspended and supported by the lens holder 31 through the support member 885 (not shown in FIG. 2). As shown in the figure, refer to Figure 1). As shown in FIG. 1, the gantry 88 is provided with a pair corresponding to a pair of X traveling guides 81. A pair of stands 88 are connected to each other by a connecting member 884 near the lower end of the leg portion 882 as shown in Fig. 2 (however, the stand 88 of one of Fig. 2 is not shown). The X traveling guide 81 is supported by the Z actuator 89 with respect to the top plate portion 881 of the corresponding gantry 88. Further, the X traveling guide 81 may, for example, as a whole of the top plate portion 881 is suspended and supported from above.

Each of the pair of first X sliding members 82a is slidably engaged with the corresponding X traveling guide 81 in the X-axis direction as shown in FIG. 4, and is not shown by an X actuator (for example, a feed screw device, A linear motor, a belt drive, a line drive, etc., are driven synchronously along the X travel guide 81 at a predetermined stroke. The pair of second X sliding members 82b are disposed on the -X side of the pair of first X sliding members 82a. The pair of second X sliding members 82b are slidably engaged with the corresponding X traveling guides 81 in the X-axis direction, and are not illustrated by X actuators (for example, a feed screw device, a linear motor, a belt drive device, etc.) Independently with the first X-sliding member 82a, it is driven along the corresponding X-traveling guide 81 by a predetermined stroke. Further, as long as the pair of first X sliding members 82a can be synchronously driven in the X-axis direction, when the X actuator is a feed screw device or the like, it can be driven by a common motor or only one of the first X sliding members 82a. It is driven by the X actuator (the pair of second X sliding members 82b and the third X sliding member 82c which will be described later are the same).

The first connecting rod 83a is formed of a member extending in the Y-axis direction and is disposed between the pair of first X sliding members 82a. The second connecting rod 83b is formed of a member extending in the Y-axis direction and is disposed between the pair of second X sliding members 82b. When the substrate P is transported to the substrate stage 20 by the substrate loading device 80, the substrate P is inserted between the first connecting rod 83a and the second connecting rod 83b.

In the first embodiment, for example, each of the four robot arms 84 is formed of a rectangular member having a rectangular shape in the longitudinal direction of the Y-axis direction, and supports the end portion of the substrate P from below. For example, two of the four robot arms 84 are separately attached to the first connecting rod 83a in the Y-axis direction, and the other two are separated and attached to the second connecting rod 83b in the Y-axis direction. For example, four robot arms 84 are respectively connected to a vacuum suction device (not shown) to adsorb and hold the substrate P.

In the first embodiment, for example, the two support pins 85 are formed of a columnar member extending in the X-axis direction, and support the end portion of the substrate P from below. For example, one of the two support pins 85 is attached to the central portion of the first connecting rod 83a in the longitudinal direction (for example, between the two robot arms 84), and the other is attached to the central portion of the second connecting rod 83b in the longitudinal direction (for example, two). Between the robot arms 84). The Z positions of the plurality of robot arms 84 and the plurality of support pins 85 are substantially set to be the same. In addition, the arrangement and the number of the mechanical arm 84 and the support pin 85 are not limited to those described above, and may be appropriately changed depending on the size of the substrate P or the like. Further, the support pin 85 may not necessarily be provided, and the substrate P may be supported only by the mechanical arm 84. Further, the mechanical arm 84 may not necessarily be provided, and the substrate P may be supported only by the support pin 85.

The third X sliding member 82c is disposed between the first X sliding member 82a and the second X sliding member 82b. The 3X sliding member 82c is slidably engaged with the corresponding X traveling guide 81 in the X-axis direction, and is represented by an X actuator (for example, a feed screw device, a linear motor, a belt driving device, etc.) (not shown). The first X sliding member 82a and the second X sliding member 82b are independently driven along the corresponding X traveling guide 81 by a predetermined stroke.

The gas suction device 86 is disposed between the first connecting rod 83a and the second connecting rod 83b, and is disposed between the pair of third X sliding members 82c. The gas suction device 86 is formed of a rectangular plate-like member in a plan view, and is set to have a size in the Y-axis direction that is slightly longer than the dimension of the substrate P in the Y-axis direction, and is set to be shorter in the X-axis direction than in the X-axis direction of the substrate P (for example, 2/). 3 or so). As can be seen from Fig. 1 and Fig. 2, the Z position of the lower portion of the gas suction device 86 is set to be slightly higher than the Z position on the upper surface of the mechanical arm 84, and the lower side of the gas suction device 86 is opposed to the X-axis direction with a small gap (gap, clearance). The both end portions are supported by the robot arm 84 and a plurality of support pins 85 from the center portion of the substrate P supported from below.

A plurality of hole portions (not shown) are formed under the gas suction device 86 (opposing surface on the upper surface of the counter substrate P). The gas suction device 86 is connected to a vacuum suction device (not shown), and sucks the gas between the substrate P and the substrate P through the plurality of holes, thereby applying a force against the substrate P in the vertical direction (+Z direction) to the substrate. P. Thereby, the amount of bending due to the self weight of the central portion of the substrate P is controlled.

Here, in order to protect the upper surface (resist layer) of the substrate P, the attraction force of the gas suction device 86 (the force acting on the substrate P in the vertical direction) is set so that the lower surface of the gas suction device 86 does not contact the substrate P. The extent of it. Further, the gas suction device 86 can suppress the bending of the central portion of the substrate P, and it is not necessary to perform pressure control until the substrate P is closely parallel to the horizontal plane. Further, the gas suction device 86 can also discharge gas to the upper surface of the substrate P in cooperation with the gas suction operation using the vacuum suction device, thereby preventing contact with the substrate P.

The liquid crystal exposure apparatus 10 (see FIG. 1) configured as described above is subjected to the mask M on the mask stage MST by a mask loader (not shown) under the management of a main control unit (not shown). Loading, the substrate P is loaded onto the substrate holder 40 by the substrate loading device 80. Thereafter, the main control device performs the alignment measurement using an alignment detecting system (not shown), and after the alignment measurement is completed, the stepwise scanning exposure operation is sequentially performed on the plurality of irradiation regions set on the substrate. In addition, since this exposure operation is the same as the exposure operation of the conventional step-and-scan method, the detailed description is omitted. Then, the substrate after the exposure process is completed is carried out from the substrate holder 40 to the inlet and outlet portion 60 by the substrate carrying device 70, and the other substrate that is exposed next time is transferred to the substrate holder 40, whereby the substrate holder 40 is carried out. The substrate is replaced, and a plurality of substrates are continuously subjected to an exposure operation or the like.

Hereinafter, the substrate P on the substrate holder 40 in the liquid crystal exposure apparatus 10 will be described with reference to FIGS. 5(A) to 12(B) (for the sake of convenience, a plurality of substrates P are referred to as a substrate P1, a substrate P2, and a substrate P3). Exchange actions. The following substrate exchange operation is performed under the management of a main control device (not shown). In FIG. 5(A), the substrate P1 after exposure is held in the substrate holder 40, and the substrate carrying device 80 holds the other substrate P2 which is subjected to exposure processing subsequent to the substrate P1.

After the exposure of the substrate P1 is completed, the substrate stage 20 controls the Y coarse movement stage 23y and the X coarse movement stage 23x so that the substrate holder 40 is positioned as shown in FIG. 5(A) in order to carry out the substrate P1. Substrate exchange location. In the state of the substrate exchange position, the Z position on the substrate holder 40 is controlled to substantially coincide with the Z position on the plurality of air suspension devices 65 of the substrate guiding device 62. Further, as shown in FIG. 11(A), the substrate carrying device 70 included in the substrate stage 20 is positioned such that the suction pad 71 is adjacent to the vicinity of the -X side end portion of the substrate holder 40. Referring back to FIG. 5(A), the substrate P2 is placed in advance in the state above the substrate exchange position while being supported by the plurality of robot arms 84 of the substrate loading device 80. Further, the substrate guiding device 62 of the entrance and exit portion 60 is positioned at the stroke end on the -X side.

Next, as shown in FIG. 5(B), the substrate P1 on the substrate holder 40 is carried out to the substrate guiding device 62 of the inlet and outlet portion 60 by the substrate carrying device 70. When the substrate P1 is carried out, the substrate holder 40 is driven in the +Z direction by the respective adsorption pads 45a of the pair of substrate slide devices 45 as shown in Fig. 11(A), and the lower surface of the substrate P1 is adsorbed and held. The pressurized gas is ejected from the upper surface of the substrate holder 40, and the substrate P1 floats on the substrate holder 40. In this state, as shown in FIG. 11(B), the adsorption pad 45a is driven in the +Y direction, and the substrate P1 is driven in the +Y direction with respect to the substrate holder 40. Thereby, the vicinity of the +Y side end portion of the substrate P1 protrudes (exceeds) from the +Y side end portion of the substrate holder 40, and overlaps with the adsorption pad 71 of the substrate carrying device 70 in the vertical direction. Next, the adsorption pad 71 is driven in the +Z direction, and the corners on the +Y side and the -X side of the substrate P1 are adsorbed and held by the adsorption pad 71.

Thereafter, as shown in FIG. 11(C), the adsorption holding of the substrate P1 by the adsorption pad 45a is released, and the adsorption pad 71 is driven in the +X direction. Thereby, the substrate P1 moves along the upper surface of the substrate holder 40, and as shown in FIG. 5(B), it is carried out to the substrate guiding device 62 of the inlet and outlet portion 60. Therefore, when the substrate holder 40 is positioned at the substrate exchange position, the center position of the Y-axis direction is pre-positioned with respect to the center of the Y-axis direction of the substrate guiding device 62 of the inlet and outlet portion 60 to the -Y side. Move a little. In order to carry in the substrate P2, the adsorption pad 45a is driven in the -Z direction as shown in Fig. 11(C), and is driven in the -Y direction (return to the initial position).

After the substrate P1 is carried out from the substrate holder 40, the substrate guiding device 62 sucks and holds the substrate P1 using a plurality of air floating devices 65 as shown in FIG. 6(A), and is moved to the +X direction in this state (from the substrate stage). 20 leaves the direction) drive. Further, on the substrate stage 20, the adsorption pad 71 of the substrate unloading device 70 is driven in the -Z direction.

Next, the substrate P2 is carried into the substrate holder 40 by using the substrate loading device 80. As shown in FIG. 6(B), the substrate loading device 80 is not shown by a plurality of Z actuators 89 (Fig. 6(B) is hidden on the deep side of the paper surface of the X traveling guide 81. Referring to Fig. 6 ( A)) The X travel guide 81 is driven down. Thereby, the plurality of robot arms 84 and the gas suction device 86 supported by the X traveling guide 81 move in the -Z direction.

Here, as shown in FIG. 12(A), the substrate loading device 80 is located above the notch 41 corresponding to each of the plurality of robot arms 84 with respect to the substrate holder 40 located at the substrate exchange position, and two (one pair). The pair of first and second X sliding members 82a and 82b are positioned so that the support pins 85 correspond to the upper portions of the notches 42 (the X and Y positions are the same) (not shown in FIG. 12(A). See FIG. (B)). Therefore, as shown in FIG. 6(B), after the pair of X traveling guides 81 are driven downward, as shown in FIG. 12(A), a plurality of mechanical arms 84 are respectively inserted into the notches 41 corresponding to each other, and a pair of branches are respectively inserted. The underpins 85 corresponding to the notches 42 are respectively placed on the substrate holder 40 by the plurality of robot arms 84 and the pair of support pins 85 supported by the substrate P2 from below.

Further, when the substrate P2 is placed on the substrate holder 40 (this embodiment also includes the case where the substrate P2 is transferred from the upper side of the inlet/outlet portion 60 to the upper side of the substrate exchange position), the substrate loading device 80 attracts the gas. The gas suction pressure (attraction force) of the device 86 is controlled so that the central portion of the substrate P2 (the portion acting by the force of the gas suction device 86 in the +Z direction) is supported at both ends in the X-axis direction (supported by the robot arm 84) Part of it) extends downward (downward) in the (-Z direction). Therefore, when the substrate P2 is placed on the substrate holder 40, the first portion of the substrate P2 abuts against the upper surface of the substrate holder 40, and secondly from the central portion to the outer side in the X-axis direction. Connected to the substrate holder 40.

After the substrate P2 is placed on the substrate holder 40, the adsorption and holding of the plurality of robot arms 84 on the substrate P2 are released, and as shown in FIG. 6(B), the X traveling guide 81 is driven down to the plurality of robot arms 84. And a pair of support pins 85 are separated from the substrate P2, respectively. Further, the gas suction of the gas suction device 86 is stopped, and the substrate holder 40 adsorbs and holds the substrate P2.

Further, in parallel with the above-described transfer operation from the substrate loading device 80 to the substrate P2 of the substrate stage 20, in the inlet and outlet portion 60, the plurality of air suspension devices 65 are released from the substrate P1, and the plurality of lift pins 68b are driven up. (Refer to Fig. 6(B)). Thereby, the front end portions of the plurality of lift pins 68b abut against the lower surface of the substrate P1, and the substrate P1 is lifted from the plurality of air suspension devices 65.

Next, in the substrate loading device 80, as shown in FIG. 7(A), the first X sliding member 82a is driven in the +X direction, and the second X sliding member 82b is driven in the -X direction. Thereby, as shown in Fig. 12(B), the inside of the notch 41 corresponding to each of the robot arms 84 and the notch 42 corresponding to each of the support pins 85 are separated. Referring to Fig. 7(A), in the inlet/outlet portion 60, an external transfer robot arm member 19a disclosed in, for example, the specification of U.S. Patent No. 7,520,545 is incorporated between the substrate P1 and the plurality of air suspension devices 65. The carry-out arm member 19a is formed by a plurality of openings formed on the -X side end portion (in the present embodiment, for example, four are formed at predetermined intervals in the Y-axis direction in accordance with the interval between the plurality of lift pins 68b). The forked member of the notch is formed, and the lift pin 68b is inserted into the notch.

Thereafter, as shown in FIG. 7(B), one of the gas suction devices 86 is driven up by the X traveling guide 81, whereby the plurality of mechanical arms 84 and the pair of support pins 85 (not shown in FIG. 7(B) Referring to Fig. 12(A)), it is retracted to a position higher than the upper surface of the substrate P2 (on the +Z side). Further, in the entrance/exit portion 60, the carry-out arm member 19a is driven in the +Z direction and then driven in the +X direction, thereby lifting the substrate P1 from the plurality of lift pins 68b to the external device (for example, coating the developing device) ) Transfer.

The substrate holder 40 holding and holding the substrate P2 is driven to be driven away from the inlet and outlet portion 60 in order to perform alignment processing and exposure processing on the substrate P2 as shown in FIG. 8(A). Hereinafter, the description of the operation of the substrate stage 20 in the alignment process and the exposure process will be omitted. Further, in the inlet/outlet portion 60, a pair of the substrate loading device 80 is provided above the plurality of air suspension devices 65 (one of which is not shown in Fig. 8(A); see Fig. 4). The carrying arm member 19b for the external transfer robot that is to be subjected to the exposure processing subsequent to the substrate P2 is supported below. The carry-in arm member 19b has a configuration that is substantially the same as that of the carry-out arm member 19a (not shown in FIG. 8(A). See FIG. 7(A)), and the lift pin 68b is inserted into the notch. Next, as shown in FIG. 8(B), the loading arm member 19b is driven in the -Z direction and then driven in the +X direction, whereby the substrate P3 is transferred to the plurality of lift pins 68b. In addition, in the substrate transfer operation between the external transfer robot (the carry-out arm member 19a and the carry-in arm member 19b) and the entrance/exit portion 60 (elevation pin 68b), the carry-out arm member 19a and the carry-in arm may be replaced. The member 19b is moved up and down to move the lift pin 68b up and down.

Next, as shown in Fig. 9(A), the plurality of lift pins 68b are slightly lowered to drive the Z position on the upper surface of the substrate P3 to a plurality of robot arms 84 and a pair of support pins 85 (not shown in Fig. 9(A). Referring to Figure 4), the Z position below is low. Further, each of the pair of first to third X-sliding members 82a to 82c is driven in the +X direction, whereby the plurality of robot arms 84 and the gas suction device 86 are moved above the inlet and outlet portion 60. At this time, the pair of first and second X sliding members 82a and 82b are positioned such that the plurality of robot arms 84 and the substrate P3 do not overlap in the vertical direction.

Thereafter, as shown in FIG. 9(B), the plurality of lift pins 68b are driven to be driven into a plurality of robot arms 84 and a pair of support pins 85 at the Z position below the substrate P3 (not shown in FIG. 9(B). 4) The upper Z position is high (although the substrate P3 is not in contact with the gas suction device 86). Thereafter, the pair of first X sliding members 82a are driven in the -X direction, and the pair of second X sliding members 82b are driven in the +X direction, whereby the plurality of robot arms 84 are inserted under the substrate P3. At this time, instead of driving the substrate P3 up and down using a plurality of lift pins 68b, the X traveling guide 81 may be driven downward.

Next, as shown in FIG. 10(A), a plurality of lift pins 68b are driven downward, whereby the substrate P3 is provided with a plurality of robot arms 84 and a pair of support pins 85 at both ends in the X-axis direction (FIG. 10(A)). It is not shown. It is supported from below by referring to FIG. 4). Further, in parallel with this, the gas suction device 86 sucks the gas between the substrate P3 and the force in the +Z direction acts on the central portion of the substrate P3. Thereby, the substrate P3 is substantially parallel to the horizontal plane (XY plane).

Thereafter, as shown in FIG. 10(B), each of the pair of first to third X-sliding members 82a to 82c is driven in the -X direction, whereby the substrate P3 is transported to a position above the substrate exchange position along the horizontal plane. . The transport operation of the substrate P3 shown in FIG. 8(A) to FIG. 10(B) (the transport operation from the outside to the entrance and exit portion 60 and the transfer operation from the entrance/exit portion 60 to the position above the substrate exchange position) and the counter substrate The alignment processing and the exposure processing of P2 are performed in parallel.

In the substrate loading device 80 of the first embodiment described above, since the gas suction device 86 is disposed on the upper surface side of the substrate P, the substrate P can be directly placed on the substrate mounting surface of the substrate holder 40. Therefore, it is not necessary to provide a device and a member (for example, a lift pin device) for receiving the substrate P on the substrate stage 20 (in particular, the substrate mounting surface of the substrate holder 40), and the substrate stage 20 is controlled and held on the substrate. The flatness of the substrate P with 40 is improved. Further, since the gas suction device 86 is disposed on the upper surface side of the substrate P, the substrate P that is supported by the plurality of lift pins 68b from below can be directly received at the entrance and exit portion 60.

In addition, the substrate loading device 80 can control the amount of bending of the substrate P by the force acting in the +Z direction (upward in the vertical direction) from the upper side of the substrate P without contact, so that the substrate P is initially in contact with the central portion. The substrate holder 40 is placed on the upper surface of the substrate holder 40, and the substrate holder 40 is sequentially brought into contact with the substrate holder 40 in the X-axis direction. The air between the substrate P and the substrate holder 40 is from the center of the substrate holder 40 to the +X side. The -X side end is pressed out. Therefore, a so-called air accumulator is prevented from being formed between the substrate P and the substrate holder 40.

Further, the substrate loading device 80 can independently control the X position of the mechanical arm 84 from one of the +X side end portions of the support P from the lower side and the one side of the X-side end supporting the substrate P from the lower side (can Since the distance between the substrates P is arbitrarily changed according to the size of the substrate P, even when a plurality of substrates having different sizes are used for exposure, the substrate P can be easily transferred from the inlet and outlet portion 60 to the substrate holder 40.

"Second Embodiment"

Next, a second embodiment will be described with reference to Figs. 13(A) to 22(B). The configuration of the liquid crystal exposure apparatus of the second embodiment is the same as that of the above-described first embodiment except that the configuration of the substrate stage 120 is different. Therefore, the following elements having the same configuration and function as those of the first embodiment are used. The same reference numerals as in the above-described first embodiment are omitted. Further, as shown in FIG. 13(A), the configuration of the substrate stage 120 is the same as that of the above-described first embodiment except for the substrate holder 140 and the substrate carrying device 170. Therefore, only the differences will be described below.

The substrate holder 140, as shown in Figs. 13(A) and 13(B), has a plurality of substrate lifting and lowering devices 46. As shown in FIG. 13(A), each of the substrate lifting and lowering devices 46 includes an air suspension device 46a and a Z actuator 46b that drives the air suspension device 46a in the Z-axis direction. On the upper surface of the substrate holder 140, as shown in FIG. 13(B), a plurality of substrate lifting and lowering devices 46 are formed with X grooves 46c extending in the X-axis direction, and a plurality of substrate lifting and lowering devices 46 are housed in the corresponding X grooves 46c. The substrate holder 140 of the second embodiment has, for example, a substrate lifting and lowering device array of, for example, five substrate lifting and lowering devices 46 arranged at predetermined intervals in the Y-axis direction at a predetermined interval in the X-axis direction, and has a total of 15 sets of substrate lifting device 46. Further, the number and arrangement of the substrate lifting and lowering devices 46 are not limited thereto, and can be appropriately changed depending on, for example, the size of the substrate P.

The air suspension device 46a is composed of a plate-like member extending in the X-axis direction, and the substrate P can be floated by ejecting pressurized gas from a plurality of micropores formed on the upper surface. The air suspension device 46a is driven by the Z actuator 46b between a position on the upper side of the substrate holder 140 that protrudes toward the +Z side and a position on the upper side of the substrate holder 140 that is lowered (pushed in) from the upper side of the substrate holder 140. Thereby, the substrate lifting and lowering device 46 can separate the lower surface of the substrate P from the upper surface of the substrate holder 140. The type of the Z actuator is not particularly limited, and for example, an air cylinder, a cam gear, a feed screw device, or the like can be used. Further, in the second embodiment, the Z actuator 46b is housed in the substrate holder 140, but the Z actuator 46b is not limited thereto, and may be provided, for example, on the fine movement stage 21 or the X coarse movement stage. 23x.

The substrate unloading device 170 differs from the above-described first embodiment (see FIG. 1) in that the adsorption pad 71 and the Z actuator 76 are attached to the surface of the support member 72 on the -Y side (the substrate holder 40 side). As a result, as shown in FIG. 13(A), the substrate carrying-out device 170 according to the second embodiment can provide a region in the vicinity of the end portion on the -Y side of the adsorption pad 71 and a region near the +Y-side end portion of the substrate holder 140. The configuration is superimposed in the vertical direction.

As shown in FIG. 14(A), the adsorption pad 71 is in the alignment process of the substrate P or the exposure process, and the substrate holder 140 is on the Y coarse movement stage 23y (not shown in FIG. 14(A). When 13 (A)) is driven in a predetermined stroke in the X-axis direction, it is disposed away from the movable range of the substrate holder 140. Next, when the substrate P is carried out, the adsorption pad 71 is inserted into the substrate holder by the substrate lifting and lowering device 46 (not shown in FIG. 14(B), see FIG. 13(A)), as shown in FIG. 14(B). 140 is raised between the lower surface of the substrate P and the upper surface of the substrate holder 140 (see FIG. 13(A)).

In the same manner as in the above-described first embodiment, the adsorption pad 71 adsorbs and holds the vicinity of the +Y side and the -X side of the substrate P. In this state, as shown in FIG. 14(C), the suction pad 71 is moved to the +X direction. The substrate P is carried out to the inlet and outlet portion 60 (not shown in FIG. 14(C). See FIG. 15(A)). At this time, pressurized gas is discharged from the plurality of air suspension devices 46a to the lower surface of the substrate P. Therefore, unlike the above-described first embodiment, the hole portion for gas ejection is not formed on the substrate holder 140. Further, the substrate holder 140 is not formed with the notches 41 to 43 of the substrate holder 40 of the first embodiment shown in FIG. 3, and the substrate slide device 45 is not provided.

In the second embodiment, as in the first embodiment, the substrate stage 120 whose exposure operation is completed is controlled so that the substrate holder 140 is positioned at the substrate exchange position as shown in Fig. 15(A). As shown in FIG. 15(B), the substrate loading device 80 transports the substrate P2 to the substrate holder 140 located at the substrate exchange position. Hereinafter, the substrate P1 on the substrate holder 140 is carried out to the inlet and outlet portion 60 by the above steps. That is, as shown in Fig. 16(A), after the substrate P1 is lifted from the substrate holder 140 by a plurality of air suspension devices 46a, as shown in Fig. 16(B), the adsorption pad 71 is driven in the -X direction. Inserted between the lower surface of the substrate P1 and the upper surface of the substrate holder 140. Next, as shown in FIG. 17(A), a plurality of air suspension devices 46a are driven downward (may also drive the adsorption pad 71 to the +Z direction), and the substrate P1 is adsorbed and held by the adsorption pad 71, as shown in FIG. As shown in B), the substrate P1 is carried out to the inlet and outlet portion 60 by the suction pad 71 being driven in the +X direction along the guide surface defined by the plurality of air suspension devices 46a and the plurality of air suspension devices 65. Therefore, it is not necessary to form the hole for gas ejection on the upper surface of the substrate holder 140, and the flatness of the upper surface of the substrate holder 140 can be improved. Further, as shown in FIG. 18(A), the substrate guiding device 62 that receives the substrate P1 is driven in the direction of separation from the substrate stage 120 (+X direction), and the adsorption pad 71 is driven downward.

Here, in the first embodiment, as shown in Fig. 6(B), the substrate loading device 80 directly mounts the substrate P1 on the substrate holder 40, and in the second embodiment, as shown in Fig. 18 ( In the case of B), the plurality of air suspension devices 46a are driven in the +Z direction when the substrate P2 is taken out from the substrate loading device 80, and then moved in the +Z direction as compared with the substrate P1. Thereafter, as shown in Fig. 18(B), the substrate is driven. One of the carry-in devices 80 is driven down by the X travel guide 81, and the substrate P2 is placed on a plurality of air suspension devices 46a. Thereafter, as shown in FIG. 19(B), a plurality of air suspension devices 46a supporting the substrate P2 from below are driven downward, whereby the substrate P2 is placed on the substrate holder 140. In addition, the operation of the substrate loading device 80 after the substrate P2 is transferred to the substrate stage 120, the transfer operation of the substrate P1 to the carry-out arm member 19a at the entrance/exit portion 60, and the entrance and exit portion 60 from the loading arm member 19b are performed. The transfer operation of the substrate P3 (see FIGS. 19(A) to 22(B)) is the same as that of the above-described first embodiment, and thus the description thereof is omitted.

Further, the configurations described in the first and second embodiments described above can be appropriately changed. For example, the substrate connecting device 80a shown in FIG. 23 may be connected to the first pair of X sliding members 82d by integrally connecting the first connecting rod 83a and the gas suction device 86 to each other. Further, for example, the substrate carrying device 80b shown in Fig. 24 may be directly attached to the pair of second X sliding members 82b and the pair of X sliding members 82c (may be divided into the same manner as in the first embodiment). The X sliding member 82a and the X sliding member 82c (see FIG. 4, respectively) are attached to the X sliding member 82a), and support the +Y side and the -Y side end portion of the substrate P from below.

Further, in the first embodiment, the substrate slide device 47 having the pressing pin 47a for pressing the substrate P as shown in FIG. 25 can be used to slide the substrate P in the Y-axis direction. In this case, since the holding substrate P is not adsorbed, the stopper pin 48 (stop member) may be disposed on the opposite side of the substrate sliding device 47 via the substrate holder 40.

Further, the substrate P can be carried in by using the substrate loading device 90 shown in Fig. 26(A). The substrate loading device 90 has a pair at a predetermined interval in the Y-axis direction (one of FIGS. 26(A) to 27(B) is not shown) for driving the first connecting rod 83a (the machine to which the +X side is attached) The first driving portion 91a of the arm 84) and the second driving portion 91b for driving the second connecting rod 83b (the arm 84 on the -X side are attached). The first driving unit 91a has a first X sliding member 93a that is driven by the motor 99 on the X traveling guide 92a, and the second driving unit 91b has a second X sliding member 93b that is coupled to the first X sliding member 93a via the connecting rod 95. The 2X sliding member 93b is guided straight by the X traveling guide 92b in the X-axis direction. The X traveling guide 92b is driven in the Z-axis direction by a Z driving device 96 which will be described later. The connecting rod 95 is bridged between the first X sliding member 93a and the second X sliding member 93b by, for example, a free joint, and allows relative movement of the first X sliding member 93a and the second X sliding member 93b in the Z-axis direction.

The 1X sliding member 93a has a Z driving device 98 including a motor, a feed screw device, and a Z linear guide, and drives the first connecting rod 83a in the Z-axis direction. Further, the first X sliding member 93a includes an X drive unit 97 that includes a motor, a feed screw device, and an X linear guide, and drives the second X slide member 93b to the X-axis direction with respect to the first X slide member 93a via the connecting rod 95. The Z drive unit 96 includes a base 96a, a motor 96c mounted on one of the base 96a, a Z cam device 96b, a cam for driving one of the Z cam devices 96b, and a connecting rod for connecting the cams of the pair of Z cam devices 96b to each other. 96d and a plurality of Z linear guides 96e and the like that guide the X traveling guide 92b in the Z-axis direction.

The gas suction device 86 is connected to the first X sliding member 93a (or the second X sliding member 93b) via a connecting member (not shown), and moves integrally with the first X sliding member 93a in the X-axis direction. However, the gas suction device 86 can also be driven by a separate drive unit.

When the substrate loading device 90 transports the substrate P from above the entrance/exit portion 60 to the substrate exchange position, the Z position of the X traveling guide 92b is positioned at the Z position of the +X side end portion of the substrate P and the -X side end portion. The Z position is approximately the same. Further, when the substrate P is transferred to the substrate holder 40 (not shown in FIGS. 26(A) to 27(B). See FIG. 1), as shown in FIG. 26(B), the Z driving device 96 is used. The X traveling guide 92b is driven downward, and the first connecting rod 83a is driven downward by the Z driving device 96. Further, after the substrate P is transferred to the substrate holder 40, as shown in FIG. 26(A), the first X sliding member 93a is driven in the +X direction, and the second X sliding member 93b is transmitted through the connecting rod 95 by the X driving device 97. -X direction drive. Thereby, a plurality of mechanical arms 84 are retracted from below the substrate P. Next, as shown in Fig. 27(B), the X traveling guide 92b is driven up by the Z driving device 96, and the first connecting rod 83a is driven up by the Z driving device 98. In this state, the X sliding member 93a is driven. Driven in the +X direction. Thereby, the X sliding member 93b is pulled by the X sliding member 93a through the connecting rod 96d, and the X sliding member 93b is integrally moved in the +X direction. In the substrate loading device 90, since the sliding member 93a and the X sliding member 93b can be driven in the X-axis direction by one motor 99, the efficiency is excellent.

Further, in the first and second embodiments (and the modifications thereof, the same applies hereinafter), the means for controlling the Z position of the central portion of the substrate P is not limited to the force of the +Z direction. As the gas suction device 86, a device that does not attract a gas such as a Bernou chuck can also be used. Further, although one gas suction device 86 having an area of about 2/3 of the substrate P is used to apply a force in the +Z direction to the central portion of the substrate P, the present invention is not limited thereto, and a plurality of gas suction devices may be used (or The same device) acts on the plurality of substrates P separated from each other by a force in the +Z direction. In addition, the gas suction device 86 is used to apply the force in the +Z direction to the substrate P in a non-contact manner. However, depending on the type of the object to be transported, the force in the +Z direction may be applied in contact with the object to be transported. . Further, when the substrate P is transferred to the substrate holders 40 and 140, the shape of the substrate P is controlled such that the central portion is protruded downward from the end portion by controlling the attraction force of the gas suction device 86 to the gas, but is not limited thereto. The shape of the substrate P can also be controlled by the gas suction device 86 and the plurality of mechanical arms 84 being configured to be relatively movable in the Z-axis direction.

Further, the means for carrying out the substrate P from the substrate stages 20, 120 may not be provided on the substrate stages 20, 120, and may be provided, for example, at the entrance/exit portion 60. Further, the substrate lifting device 68 including the plurality of lifting pins 68b is used to transfer the substrate P between the inlet and outlet portion 60 and the external conveying device (the carrying-out arm member 19a and the loading arm member 19b). A plurality of air suspension devices 65 are configured to be movable up and down, and the plurality of air suspension devices 65 are used to perform the handover operation of the substrate P.

"Third Embodiment"

Next, a third embodiment will be described with reference to Figs. 28 to 39. The configuration of the liquid crystal exposure apparatus according to the third embodiment is the same as that of the above-described first embodiment except that the configuration of the inlet/outlet portion 240 (see FIG. 29) and the configuration of the substrate stage 220 are different. The components having the same configurations and functions as those of the first embodiment are denoted by the same reference numerals as those of the first embodiment, and the description thereof will be omitted. In addition, as shown in FIG. 28, the configuration of the substrate stage 220 is the same as that of the above-described first embodiment except that the substrate carrying device 270 is provided instead of the substrate carrying device 70. Therefore, only the differences will be described below.

The inlet/outlet portion 240 is disposed on the +X side of the substrate stage 220 as shown in FIG. 29, and is housed in a chamber (not shown) together with the substrate stage 220. The entrance and exit portion 240 includes a substrate guiding device 250 and a substrate loading device 260. The substrate guiding device 250 and the substrate loading device 260 are mounted on a stand 242 provided on the ground 11.

The substrate guiding device 250 is placed on the substrate P after being carried into the liquid crystal exposure device 210 by the external transfer robot 298 (not shown in FIG. 29 (see FIG. 30) provided outside the liquid crystal exposure device 210 (in FIG. 29 The substrate P3) is transferred to the substrate stage 220 by the substrate loading device 260, or the substrate P (the substrate P1 in FIG. 29) on the substrate stage 220 carried out by the substrate carrying device 270 is carried out to the liquid crystal exposure device. 210 The function of the relay device when external.

Here, the external transfer robot 298 shown in FIG. 30 and FIG. 31 and the like has the same configuration as the external transfer robot disclosed in the specification of US Pat. No. 7,905,699, and has an unloading arm and a loading arm (one of FIGS. 30 and 31). The figure is hereinafter appropriately referred to as an arm member. Each of the unloading arm and the loading arm has substantially the same configuration, and includes a plurality of thin plate-like members (hereinafter referred to as claw portions 298a) extending in the X-axis direction and separated in the Y-axis direction, and formed into a fork shape having a small thickness. The external transfer robot 298 is provided on the chamber +X side (not shown), and can carry in (input) the substrate P into the inlet and outlet portion 240 and carry out (recover) the substrate P from the inlet and outlet portion 240. The vicinity of the +X side end portion of each of the unloading arm and the loading arm of the external transfer robot 298 is cantilevered by a robot arm (not shown), and is moved in the X-axis direction by appropriately controlling the robot arm. Further, as the external transfer robot 298, the substrate can be carried in (input) and carried out (recovered) using one fork member.

As shown in FIG. 32, the substrate guiding device 250 has an X base 252, a Z base 254, a Z actuator 256, a plurality of air suspension devices 258, and the like. The X base 252 is composed of a plate-like member disposed in parallel with the XY plane. The X base 252 is guided straight in the X-axis direction on the gantry 242 by an X linear guide 251 which is fixed to the upper surface of the gantry 242 and an X slider fixed to the underside of the X base 252. Further, the X base 252 is driven on the gantry 242 in the X-axis direction by an X linear motor 253 formed by an X stator fixed to the upper surface of the gantry 242 and an X movable member fixed to the lower surface of the X base 252. Further, the type of the actuator that drives the X base 252 is not particularly limited, and may be, for example, a feed screw device or the like.

The Z base 254 is formed of a plate-like member disposed in parallel with the XY plane, and is mounted on the X base 252 via the Z actuator 256. The Z actuator 256 drives the Z base 254 on the X base 252 in the Z-axis direction (to move it up and down). The type of the Z actuator is not particularly limited, but it is preferable to stop the Z base 254 at any three places, for example. Further, in the present embodiment, the plurality of air suspension devices 258 mounted on the Z base 254 are vertically moved by one Z actuator 256, but the Z actuators may be provided in the plurality of air suspension devices 258, respectively. And the individual moves above.

Each of the plurality of air suspension devices 258 is supported by the Z base 254 from below via a post 257. In the present embodiment, as shown in FIG. 31, a plurality of air suspension devices 258 are provided in total, for example, twelve (the three air suspension devices 258 arranged at predetermined intervals in the Y-axis direction are provided at predetermined intervals in the X-axis direction). Four rows), as long as the lower surface of the substrate P can be supported substantially equally (see FIGS. 30 and 32), the number and arrangement of the air suspension devices 258 can be appropriately changed, for example, depending on the size of the substrate P. The interval between the plurality of air suspension devices 258 in the Y-axis direction is determined by considering the shape of the arm members (unloading arms and loading arms) of the external transfer robot 298. Specifically, the position of the plurality of air suspension devices 258 and the Y positions of the plurality of claw portions 298a of the arm member are not repeated in a state where the arm members of the external transfer robot 298 are positioned above the substrate guiding device 250. .

A plurality of holes are formed on the air suspension device 258. A pressurized gas (for example, compressed air) supply device (not shown) is connected to the air suspension device 258, and the pressurized gas is discharged from the lower surface of the substrate P placed on the plurality of air suspension devices 258 from the plurality of holes. The substrate P can be floated. Further, at least a part of the plurality of air suspension devices 258 can also adsorb and hold the substrate P by using the plurality of holes (or other holes).

As shown in FIG. 32, the substrate loading device 260 is transported to the substrate stage 220 (not shown in FIG. 32, see FIG. 29) from the substrate P supported by the substrate guiding device 250 from below, and is placed on the gantry 242. The upper side is the +Y side of the substrate guiding device 250. The substrate loading device 260 has an X traveling guide 262, an X sliding member 264, a support member 266, an adsorption pad 268, and the like. In addition, in FIG. 31, in order to avoid that the illustration is too complicated, illustration of the substrate carrying-in apparatus 260 is abbreviate|omitted.

The X traveling guide 262 is constituted by a member extending in the X-axis direction (refer to FIG. 30). The X sliding member 264 is slidably engaged with the X traveling guide 262 in the X-axis direction, and is guided along the X traveling guide 262 by an X actuator (for example, a feed screw device, a linear motor, or the like) (not shown). The trip is driven. The support member 266 is constituted by a member extending in the Z-axis direction, and one end (-Z-side end portion) is fixed to the X-sliding member 264. As shown in FIG. 29, the support member 266 is formed by bending the intermediate portion in the longitudinal direction, and the other end (+Z side end portion) side protrudes toward the -X side (the substrate stage 220 side) from the one end side.

Referring back to Fig. 32, the adsorption pad 268 is composed of a Y-shaped cross-sectional L-shaped member, and is attached to the vicinity of the other end (+Z-side end portion) of the support member 266 via a mechanical Z linear guide 269. The adsorption pad 268 is driven by the Z actuator 267 (for example, a cylinder) attached to the support member 266 with respect to the support member 266 in a predetermined stroke in the Z-axis direction. The adsorption pad 268 is connected to a vacuum suction device (not shown) provided outside, and functions to adsorb the surface of the substrate.

Here, the operation of the substrate loading device 260 will be described with reference to FIGS. 32 to 33(B). As shown in FIG. 32, the substrate loading device 260 adsorbs and holds the +X side and the +Y side corner of the lower surface of the substrate P placed on the plurality of air suspension devices 258 of the substrate guiding device 250 by the adsorption pad 268 ( Refer to Figure 33 (A)). Next, as shown in FIG. 33(A), the adsorption pad 268 is driven toward the substrate stage 220 side (-X direction) in a state where the pressurized gas is discharged from the plurality of air suspension devices 258 to the lower surface of the substrate P. At this time, the Z position of the plurality of air suspension devices 258 (and/or the Z position of the substrate holder 40) is positioned such that the Z position above the plurality of air suspension devices 258 is substantially the same as the Z position above the substrate holder 40 ( Or the air suspension device 258 is a little higher).

Further, the Z base 254 supporting the plurality of air suspension devices 258 is positioned closest to the -X side in the Z-axis direction (close to the substrate stage 220). Thereby, the substrate P is slid along the guiding surface formed by the upper surface of the substrate holder 40 (substrate mounting surface) substantially parallel to the XY plane by a plurality of air suspension devices 258, and is slid from a plurality of air suspension devices 258 The substrate holder 40 is handed over. At this time, pressurized gas is also ejected from the upper surface of the substrate holder 40 to the lower surface of the substrate P. Thereby, the substrate P can be transferred from the substrate guiding device 250 to the substrate stage 220 at a high speed and with low dust.

Further, in the substrate loading device 260, since the adsorption pad 268 adsorbs and holds the +X side of the substrate P and the vicinity of the +Y side corner portion, when the substrate P is transferred to the substrate holder 40 as shown in FIG. 33(A), The substrate holder 40 is positioned at a position where its center is offset from the center of the substrate P toward the -Y side. Therefore, the substrate P includes a portion that is adsorbed and held by the adsorption pad 268, and a region near the +Y side end portion is placed beyond the +Y side end portion of the substrate holder 40 to be placed.

Therefore, the substrate stage 220 has a pair of pressing positions 38a and a pair of positioning pins 38b for correcting the Y position of the substrate P on the substrate holder 40. The pair of pressing pins 38a are disposed apart from the +Y side of the substrate holder 40 in the X-axis direction, and are movable in the Y-axis direction with respect to the substrate holder 40. The pair of positioning pins 38b are disposed on the opposite side of the pair of pressing pins 38a via the substrate holder 40. The pair of pressing pins 38a and the pair of positioning pins 38b may be provided in the substrate holder 40, or may be provided on the fine movement stage 21 (not shown in FIG. 33(A). See FIG. 28), or the X coarse movement stage. 23x (not shown in Fig. 33(A). See Fig. 28). Further, the number of the pair of pressing pins 38a and the pair of positioning pins 38b is not particularly limited.

As shown in FIG. 33(A), the substrate loading device 260 transfers the substrate P to the substrate holder 40, and then releases the adsorption of the substrate P by the adsorption pad 268 and drives the adsorption pad 268 in the -Z direction. Next, as shown in FIG. 33(B), the adsorption pad 268 is driven in a direction (+X direction) away from the substrate stage 220. Also, the substrate guiding device 250 also separates the Z base 254 from the substrate stage 220. Thereby, for example, a space for work can be secured between the substrate stage 220 and the substrate guiding device 250. Further, in order to separate the substrate P from the adsorption pad 268, the fine movement stage 21 (see FIG. 28) of the substrate stage 220 may be driven in the +Z direction. In this case, the substrate loading device 260 does not need to have the adsorption pad 268. The Z actuator 267 is driven in the Z-axis direction (see Fig. 32).

Further, in the substrate stage 220, the pair of pressing pins 38a press the +Y side end portion of the substrate P, and the substrate P is moved in the -Y direction by a predetermined distance (for example, about 10 to 100 mm) to the center of the substrate P and the substrate holder 40. The center is roughly the same. Thereafter, the substrate holder 40 adsorbs and holds the substrate P. Further, the pressing pin and the positioning pin for positioning the substrate P on the substrate holder 40 in the X-axis direction may be provided on the +X side and the -X side of the substrate holder 40, respectively.

Referring back to FIG. 30, the substrate unloading device 270 has a pair of X traveling guides 272, a suspension holding device 280, a fall prevention device 290, and the like.

Each of the pair of X traveling guides 272 is formed of a member extending in the X-axis direction, and is disposed in parallel with each other at a predetermined interval (interval of the width of the substrate P in the Y-axis direction) in the Y-axis direction. The length direction of each of the X traveling guides 272 is set to be twice as long as the size of the substrate P in the X-axis direction (for example, about 2.5 times). As shown in Fig. 32, each of the X traveling guides 272 is supported from below by a plurality of struts 44 provided on the ground 11. A plurality of pillars 44 support the vicinity of the both end portions in the longitudinal direction of each of the X traveling guides 272 and the center portion. Further, as is clear from FIGS. 28 and 32, in the plurality of pillars 44, a pair of pillars 44 (see FIG. 28) in the vicinity of the -X side end portion of the pair of X traveling guides 272 are supported to avoid interference with the substrate stage 220. It is slightly separated from the other pillars 44 (see FIG. 32) in the Y-axis direction. Additionally, a pair of X travel guides 272 can also be suspended, for example. In addition, in FIG. 29, in order to avoid that the illustration is too complicated, illustration of the pillar 44 is abbreviate|omitted.

Returning to Fig. 30, for example, two X sliding members 274 separated in the X-axis direction are mechanically engaged with the pair of X traveling guides 272, respectively. In other words, the entire substrate carrying device 270 is provided with, for example, four X sliding members 274 in total. For example, a total of four X sliding members 274 are slidably engaged with the corresponding X traveling guides 272 in the X-axis direction by an X actuator (not shown) (for example, a feed screw device, a linear motor, a belt drive) The device, etc., is driven synchronously along the corresponding X travel guide 272.

As shown in Fig. 29, for example, two X-sliding members 274 are engaged with one of the X-traveling guides 272 (the same as the X-traveling guide 272 on the -Y side in Fig. 29 but the X-direction guide 272 on the -Y side). Z travel guides 276 are respectively fixed. In other words, the entire substrate carrying device 270 is provided with, for example, four Z traveling guides 276 in total. Returning to Fig. 29, the Z traveling guide 276 is constituted by a member extending in the Z-axis direction, and the vicinity of the +Z side end portion is connected to the X sliding member 274. Therefore, the -Z side end portion of the Z traveling guide 276 protrudes downward (-Z side) from the X traveling guide 272.

As shown in FIG. 30, a Z sliding member 278 is mechanically engaged with, for example, four Z-travel guides 276, respectively. In other words, the entire substrate carrying device 270 is provided with, for example, four Z sliding members 278 in total. For example, a total of four Z sliding members 278 are slidably engaged with the corresponding Z traveling guides 276 in the Z-axis direction by a Z actuator (not shown) (for example, a feed screw device, a linear motor, a belt drive) The device, etc., is driven synchronously along the Z travel guide 276.

Further, as shown in FIG. 29, the X sliding member 292 is mechanically engaged with the +X side of, for example, the two X sliding members 274 of the one X traveling guide 272. That is, as shown in FIG. 30, for example, two Z sliding members 292 are provided in total for the entire substrate unloading device 270. For example, a total of two Z sliding members 292 are slidably engaged with the corresponding X traveling guides 272 in the X-axis direction by an X actuator (not shown) (for example, a feed screw device, a linear motor, a belt drive) The device, etc., is driven synchronously along the corresponding X travel guide 272.

Here, for example, the two X sliding members 292 and the above-described four X sliding members 274 can independently perform position control in the X-axis direction. When the X actuator that drives the X sliding member 274 and the X sliding member 292 is a linear motor, an X stator (for example, a magnet unit) for driving the X linear motor of the X sliding member 274 and a X sliding member 292 for driving the X sliding member 274 The X stator of the X linear motor can also be common.

As shown in FIG. 29, a Z traveling guide 294 is fixed to each of the two X sliding members 292. The Z traveling guide 292 is constituted by a member extending in the Z-axis direction, and is connected to the X sliding member 292 in the vicinity of the +Z side end portion. Therefore, the -Z side end portion of the Z traveling guide 292 protrudes downward (-Z side) from the X traveling guide 272. Here, the length direction of the Z traveling guide 294 is set to be longer than the Z traveling guide 276 described above. A Z-sliding member 296 is mechanically engaged with the Z-traveling guide 294. That is, as shown in FIG. 30, for example, two Z sliding members 296 are provided in total for the entire substrate unloading device 270. For example, a total of two Z sliding members 296 are slidably engaged with the corresponding Z traveling guides 294 in the Z-axis direction by a Z actuator (not shown) (for example, a feed screw device, a linear motor, a belt drive) The device, etc., is driven synchronously along the corresponding Z travel guides 294.

As shown in FIG. 30, the suspension holding device 280 is formed of a rectangular box-shaped member having a low rectangular shape in plan view, and the above-described four Z sliding members 278 are connected to the vicinity of the four corner portions. Therefore, the suspension holding device 280 is moved in the X-axis direction by, for example, four X sliding members 274 being synchronously driven in the X-axis direction along the corresponding X traveling guides 272. The suspension holding device 280 is moved in the Z-axis direction by, for example, four X sliding members 278 that are synchronously driven in the Z-axis direction along the corresponding Z traveling guides 276. Further, as long as the suspension holding device 280 can be driven in the X-axis and Z-axis directions, the arrangement and number of the Z traveling guide 276 and the Z sliding member 278 can be appropriately changed, or can be set to suppress the bending of the suspension holding device 280. This embodiment is numerous.

The overhang retaining device 280 has a plurality of non-contact collet devices 282. The non-contact collet device 282 is also referred to as a Benui collet or the like, and its configuration is disclosed, for example, in the specification of U.S. Patent No. 5,067,762. That is, a gas supply device (not shown) is connected to each of the plurality of non-contact chuck devices 282, and the lower surface of the suspension holding device 280 is opposed to the upper surface of the substrate P with a predetermined gap (gap, clearance). A plurality of non-contact chuck devices 282 eject a pressurized gas (for example, air) at a high speed on the upper surface of the substrate P. Then, by the action of the gas between the lower surface of the suspension holding device 280 and the upper surface of the substrate P at a high speed (a so-called Berno effect and an ejector effect), the force (attraction force) toward the upper side in the weight direction acts on the substrate P, The substrate P is held (held and attracted) in a non-contact manner to the overhanging device 280. Here, although the overhanging device 280 ejects gas on the surface (upper surface, exposed surface) of the substrate P, in the present embodiment, since the substrate P held by the overhanging device 280 is exposed, it is assumed that the pressurization is performed. The gas contains dust and there is no exposure.

Then, the suspension holding device 280 is driven in the X-axis direction or the Z-axis direction while the substrate P is held in contact, and the substrate P moves integrally with the suspension holding device 280 in the X-axis direction or the Z-axis direction. Thereby, the substrate P can be transported in the X-axis direction between the substrate guiding device 250 and the substrate holder 40 (refer to FIG. 29) located at a predetermined substrate exchange position, and is positioned above the substrate guiding device 250. The substrate P is moved up and down by the respective positions above the substrate holder 40 at the substrate exchange position. Further, in the present embodiment, for example, 25 non-contact chuck devices 282 are disposed at predetermined intervals in the X-axis direction and the Y-axis direction so that the attractive force acts uniformly on the entire substrate P, but the non-contact clip The number and arrangement of the head devices 282 are not limited thereto, and may be appropriately changed depending on, for example, the size of the substrate P.

Here, since the non-contact chuck device 282 does not restrain the position in the horizontal plane of the substrate P, the suspension holding device 280 does not cause the substrate P and the suspension holding device 280 to be in the X-axis, the Y-axis, and the θz direction in order to convey the substrate P. The relative movement is provided in the vicinity of the end portions on the +X side and the -X side, respectively, as shown in Fig. 29, and has a plurality of press-off pins 281 which are overlapped in the direction in which the paper is deep. The plurality of pressing pins 281 are respectively movable in a predetermined stroke in the X-axis direction, and the substrate P and the suspension holding device 280 are suppressed by abutting on the +X side end portion of the substrate P or the -X side end portion of the substrate P. Relative movement in the X-axis direction. Further, although not shown, the suspension holding device 280 is also provided to prevent the substrate P and the overhanging device 280 from being abutted on the +Y side end portion of the substrate P or the Y-side end portion of the substrate P. The offset of the relative movement of the shaft direction. Further, the plurality of pressing pins 281 may be configured not to move in the X-axis direction.

The fall prevention device 290 is a device that supports the transfer operation of the suspension holding device 280 to the substrate P. Specifically, when the substrate carry-out device 270 transports the substrate P using the overhang holding device 280, for example, a plurality of non-contact collet devices 282 When the gas supply of some (or all) of the suspension is stopped, and the substrate holding function of the suspension holding device 280 is lowered (or invalidated), the substrate P is prevented from falling to the ground 11 or the substrate stage 220 or the like (refer to FIG. 29). .

As shown in FIG. 31, the fall prevention device 290 includes a pair of main body portions 290a, connection portions 290b and 290c that connect the pair of main body portions 290a, and a plurality of mounting portions 290d that are spanned between the pair of main body portions 290a. Each of the pair of main body portions 290a is formed in a rod shape extending in the X-axis direction, and is disposed in parallel with each other at a predetermined interval in the Y-axis direction (in the present embodiment, a space is slightly wider than the Y-axis direction of the substrate P). The dimension of the main body portion 290a in the X-axis direction (longitudinal direction) is set to be approximately the same as the dimension of the substrate P in the X-axis direction.

The connecting portions 290b and 290c are respectively formed of members extending in the Y-axis direction, and the connecting portion 290b connects the vicinity of the +X side end portions of the pair of main body portions 290a to each other, and the connecting portion 290c connects the -X side end portions of the pair of main body portions 290a. Connected to each other nearby. The erecting portion 290d is formed in an array extending in the Y-axis direction. In the present embodiment, for example, seven branches are provided at predetermined intervals in the X-axis direction. The plurality of mounting portions 290d are erected in a state in which a predetermined tension (suppression of bending) is applied between the pair of main body portions 290a. As the mounting portion 290d, a rod-shaped member formed of a metal material or CFRP (Carbon Fiber Reinforced Plastics), a metal rope, a synthetic resin rope, or the like is used.

The connecting portion 290b is bridged between the above-described two Z sliding members 296, and the drop preventing device 290 can move integrally with the Z sliding members 296 in the X-axis direction or the Z-axis direction, for example. Here, as shown in FIG. 29, since the Z traveling guide 294 for the fall prevention device 290 is formed longer than the Z traveling guide 276 for the overhanging holding device 280, the Z position of the fall prevention device 290 is higher than the dangling holding device 280. Below. By the fall prevention device 290 and the overhanging device 280 being driven in the X-axis direction, the drop preventing device 290 can be positioned in the up-and-down direction with respect to the overhanging device 280 as shown in FIG. 29 (the position below the overhanging device 280) The movement in the X-axis direction and the position in which the overhanging device 280 does not overlap in the vertical direction as shown in FIG. 31 (FIG. 30 shows that the half of the X side of the fall prevention device 290 is located below the suspension holding device 280). ).

Further, for example, the interval between the seven bracket portions 290d and the interval between the rack portion 290d on the -X side and the connecting portion 290c are set to be longer than the X-axis direction of the air suspension device 258 of the substrate guiding device 250. The X position of the plurality of air suspension devices 258 and the X position of the plurality of mounting portions 290d are not repeated in a state where the drop preventing device 290 is positioned above the substrate guiding device 250 as shown in FIG. Therefore, if a plurality of air suspension devices 258 are moved up and down in the state shown in FIG. 31, the plurality of air suspension devices 258 pass between the mounting portions 290d adjacent to each other or the mounting portion 290d on the -X side. Between the connection portion 290c. In addition, as long as a plurality of air suspension devices 258 can pass between the erecting portions 290d adjacent to each other, the number and direction of the plurality of erecting portions 290d can be appropriately changed, for example, extending in the X-axis direction.

Hereinafter, the substrate P on the substrate holder 40 in the liquid crystal exposure device 210 (for the sake of convenience, a plurality of substrates P will be referred to as a substrate P1, a substrate P2, and a substrate P3) will be described with reference to FIGS. 34(A) to 39(B). Exchange actions. The following substrate exchange operation is performed under the management of a main control device (not shown). In addition, in order to simplify the illustration, in FIGS. 34(A) to 39(B), the member other than the substrate holder 40 of the substrate stage 220, the Z actuator 256 of the substrate guiding device 250, and the X base 252 (respectively The illustrations of FIG. 32) and the substrate loading device 260 (see FIG. 32) are omitted.

FIG. 34(A) shows a state in which the substrate P1 held by the substrate holder 40 is exposed. On the substrate guiding device 250, another substrate P2 that is subjected to an exposure operation subsequent to the substrate P1 is placed. The substrate unloading device 270 drives the overhanging device 280 in the -X direction to be positioned above the substrate exchange position during the exposure operation on the substrate P1. At this time, the fall prevention device 290 stands by at a position above the substrate guide 250.

After the exposure operation on the substrate P1 is completed, the substrate holder 220 is controlled such that the substrate holder 40 is positioned such that the substrate P1 is positioned at a predetermined substrate exchange position as indicated by an arrow in FIG. 34(B). Further, in the substrate unloading device 270, the overhanging device 280 which is placed in advance above the substrate exchange position is driven in the direction (downward) in the vicinity of the substrate holder 40.

After the substrate P1 is positioned at the substrate exchange position, as shown by the arrow in FIG. 35(A), the overhanging device 280 is further driven downward, and is positioned such that the distance between the upper surface of the substrate P1 and the underside of the overhanging device 280 becomes a predetermined value ( The distance between the substrate holding function of the non-contact chuck device 282 (not shown in FIG. 35(A) and FIG. 30) can be exhibited. Further, the pressing pin 281 protruding from the lower surface of the suspension holding device 280 is driven to abut against the substrate P1.

Thereafter, as shown in FIG. 35(B), gas is ejected at a high speed from the lower surface of the overhanging holding device 280 and the upper surface of the substrate P1 from the overhanging holding device 280, whereby the substrate P1 is suspended and held by the overhanging holding device 280 in a non-contact manner. (The white arrow in Fig. 35(B) does not show the direction of the air and shows the direction of the force). Next, the substrate holder 40 is released from the substrate P1, and the overhanging device 280 is driven upward, whereby the lower surface of the substrate P1 is separated from the upper surface of the substrate holder 40. Further, in the substrate guiding device 250, pressurized air is discharged from the plurality of air floating devices 258 to the lower surface of the substrate P2, whereby the substrate P2 floats on the plurality of air floating devices 258. Further, on the substrate stage 220, pressurized gas is ejected from the upper surface of the substrate holder 40 in order to carry in the substrate P2.

After being separated from the upper surface of the substrate holder 40 on the lower surface of the substrate P1, as shown by the arrow in Fig. 36(A), the drop preventing means 290 is driven in the -X direction, between the lower surface of the insertion substrate P and the upper surface of the substrate holder 40. . Moreover, the substrate P2 is transferred to the substrate holder 40 by the substrate loading device 260 (not shown in FIG. 36(A). FIG. 32) (the substrate loading operation of the substrate loading device 260 is shown in FIG. 33(A) and FIG. 33(B)). That is, the operation of inserting the fall prevention device 290 between the substrate P1 and the substrate holder 40 is performed in parallel with the loading operation of the substrate carrying device 260 to the substrate P2 of the substrate holder 40.

After the substrate P2 of the substrate holder 40 is carried in (before the loading is completed), the substrate carrying device 270 is integrated with the drop preventing device 290 as shown in FIG. 36(B) (falling prevention device) The 290 following drape holding device 280) is driven in the +X direction. Thereby, the substrate P1 is carried out from the substrate stage 220. At this time, as described above, the substrate holding function of the overhanging device 280 is invalidated by the gas supply stop of the non-contact chuck device 282 (not shown in FIG. 36(B), see FIG. 30), and the substrate P1 is disabled. Since it is also dropped to the drop prevention device 290 which is disposed in advance below the substrate P1, it is prevented from falling to the ground 11 or the substrate stage 220 or the like (see FIG. 29). Further, in cooperation with this, the substrate guiding device 250 is driven in the direction (+X direction) from which the substrate stage 220 is separated.

The substrate stage 220 on which the substrate P2 is placed is placed on the substrate holder 40, and the substrate P2 is adsorbed and held by the substrate holder 40, and the substrate is exposed to the substrate P2 as shown by an arrow in FIG. 37(A). The holder 40 is moved from the substrate exchange position to a predetermined exposure operation start position (for example, a position below the alignment detection system). 37(B) to 39(B), the substrate stage 220 holding the substrate P2 is illustrated for convenience of explanation. However, the exchange operation between the substrate P2 and the substrate P3 in the inlet/outlet portion 240 to be described below and the substrate P2 are described below. The exposure operation is performed in parallel, and the actual position of the substrate stage 220 is different.

Further, after the substrate P1 is transported over the substrate guiding device 250 by the suspension holding device 280, as shown by the arrow in FIG. 37(A), the plurality of air floating devices 258 of the substrate guiding device 250 are driven up, and the substrate carrying device is driven. The fall prevention device 290 of 270 is driven down. The plurality of air suspension devices 258 pass between the plurality of mounting portions 290d of the drop preventing device 290 to support the substrate P1 from below. The suspension holding device 280 stops the gas ejection from the non-contact chuck device 282 (not shown in FIG. 37(A), see FIG. 30) after the substrate P1 is supported by the plurality of air suspension devices 258 from below. Thereby, the suspension holding device 280 is released from the suspension of the substrate P. Thereafter, the suspension holding device 280 is driven to be driven while being driven in a direction separating from the substrate P1.

Next, in order to carry out the substrate P1 to the outside of the liquid crystal exposure device 210 (see FIG. 28), as shown by the arrow in FIG. 37(B), the arm member of the external transfer robot 298 is inserted into the substrate formed by the lowering driving of the fall prevention device 290. The space below P1. At this time, as described above, the arm members of the external transfer robot 298 are not in contact with the plurality of air suspension devices 258. Thereafter, as shown by the arrow in Fig. 38(A), the arm member of the external transfer robot 298 is driven up, and the substrate P1 is supported by the arm member from below (it is also possible to drive down the plurality of substrate guiding devices 250). In this state, the arm member is driven in the +X direction (outside the liquid crystal exposure device 210), whereby the substrate P1 is carried out to the outside of the liquid crystal exposure device 210.

After the arm member of the external transfer robot 298 is retracted from below the suspension holding device 280, as shown by the arrow in Fig. 38(B), the fall prevention device 290 is driven up, and the plurality of air suspension devices 258 of the substrate guiding device 250 are lowered. drive. Next, as shown in FIG. 39(A), the arm member of the external transfer robot 298 that supports the substrate P3 is inserted into a space formed between the fall prevention device 290 and the plurality of air suspension devices 258. At this time, since the substrate P3 does not abut against the plurality of air suspension devices 258, the Z position under the arm members may be lower than the Z position on the plurality of air suspension devices 258.

Thereafter, as shown by the arrow in Fig. 39 (B), the arm member of the external transfer robot 298 is driven down. Thereby, the substrate P3 is transferred to a plurality of air suspension devices 258. Next, the arm members of the external transfer robot 298 after the plurality of air suspension devices 258 are transferred to the substrate P3 are externally driven to the liquid crystal exposure device 210 (see FIG. 28). Thereafter, during the exposure operation on the substrate P2, the suspension holding device 280 is driven in the -X direction to be positioned above the substrate exchange position, and returns to the state shown in FIG. 34(A) (however, the substrate P1 is replaced with the substrate. P2, the substrate P2 is replaced with the substrate P3). Further, after the substrate P3 is transferred to the plurality of air suspension devices 258, alignment (alignment) of the substrate P3 with the substrate guiding device 250 may be performed in a state of being floated on the plurality of air suspension devices 258. The alignment may be performed by, for example, detecting an end portion (edge) of the substrate P3 by an edge sensor or a CCD (Charge Coupled Device) camera while pressing a plurality of end portions of the substrate P3. Thereafter, by repeating the operations shown in FIGS. 34(A) to 39(B), the plurality of substrates P are continuously subjected to an exposure operation.

As described above, according to the present embodiment, when the substrate P is carried out from the substrate stage 220, the substrate P is suspended and held in a non-contact state by the overhanging device 280 including a plurality of non-contact chuck devices 282. Then, since the drop preventing device 290 disposed under the substrate P and the overhanging device 280 move integrally (following the overhang holding device 280), if the substrate holding function of the overhanging device 280 is lowered (or invalidated), the substrate P is also The fall prevention device 290 is received to prevent it from falling on the ground 11 or the substrate stage 220 or the like. The substrate P used in the flat panel display device may be, for example, 1 mm or less. If it is dropped on the ground 11 or the substrate stage 220 or the like, there is a possibility of cracking, but this is not the case in the present embodiment.

Further, the fall prevention device 290 is only required to support (take) the substrate P dropped from the overhanging device 280, and therefore rigidity is not particularly required. Therefore, the thickness can be formed to be thin. Therefore, when the overhanging device 280 separates (lifts) the substrate P to be carried out from the substrate holder 40 (see FIG. 35(B)), the amount of rise of the substrate P may be small, and the substrate P can be quickly carried out.

Further, since the overhanging device 280 and the fall prevention device 290 are relatively movable in the X-axis direction (the transport direction of the substrate P), the drape holding device 280 can be retracted from the lower side of the overhanging device 280. The substrate P is easily suspended from above. Further, in the fall prevention device 290, since the interval between the plurality of mounting portions 290d is set to allow the passage of the plurality of air suspension devices 258 of the substrate guiding device 250, the drop preventing device 290 can be placed in the hanging holding device. In a state between the 280 and the substrate guiding device 250, the substrate P is easily transferred from the overhanging device 280 to the substrate guiding device 250 (see FIGS. 36(B) and 37(A)).

Further, the substrate loading device 260 directly slides the substrate P into the substrate stage 220 by sliding the substrate P substantially parallel to the horizontal plane by using the upper surface of each of the plurality of air suspension devices 258 and the substrate holder 40 as a guide surface, and the substrate is carried out. The device 270 directly holds the substrate P on the substrate holder 40 using the overhanging device 280. As described above, since the substrate exchange system on the substrate stage 220 is directly performed on the substrate holder 40, the exchange of the substrate P can be performed more quickly than in the case of using a lift pin or the like, for example. In addition, since the loading path of the substrate P using the substrate carrying device 260 and the carrying path of the substrate P using the substrate carrying device 270 are set to overlap in the vertical direction, the exchange of the substrate P on the substrate stage 220 can be performed in a space-saving manner.

"Fourth Embodiment"

Next, a fourth embodiment will be described with reference to Figs. 40 to 43(A). The configuration of the liquid crystal exposure apparatus of the fourth embodiment is substantially the same as that of the liquid crystal exposure apparatus of the third embodiment except for the configuration of the inlet and outlet portion 340 (the substrate guiding device 350 and the substrate loading device 360). The components having the same configurations and functions as those of the above-described third embodiment are denoted by the same reference numerals as those of the third embodiment, and the description thereof will be omitted.

As shown in FIG. 32, the substrate loading device 260 of the third embodiment is disposed outside the plurality of air suspension devices 258 (on the +Y side in the third embodiment) as compared with the substrate loading device 260. As shown in FIG. 40, in the fourth embodiment, the substrate loading device 360 is disposed at the center of the gantry 242, and a plurality of air levitation devices 258 are disposed on both sides (+Y side and -Y side) of the substrate loading device 360. This point is different.

In the fourth embodiment, as shown in FIG. 41(A), the adsorption pad 368 of the substrate loading device 360 adsorbs and holds the vicinity of the +X side end portion of the substrate P in the vicinity of the central portion in the Y-axis direction. Further, on the substrate stage 320, one of the X positions of the substrate P on the substrate holder 40 is corrected. The pressing pin 338a is provided on the +X side of the substrate holder 40, and the pair of positioning pins 338b are provided on the substrate holder 40. -X side. The pair of pressing pins 338a are movable in the X-axis direction and the Z-axis direction. Further, similarly to the third embodiment, a positioning pin or the like for correcting the Y position of the substrate P on the substrate holder 40 may be provided.

Further, the substrate guiding device 350 has, for example, two air floating devices 258 disposed on the +Y side of the substrate loading device 360 and a plurality of air floating devices 258 disposed on the Y-side of the substrate loading device 360. A Z actuator 256, all air suspension devices 258 are driven synchronously.

In the fourth embodiment, as shown in FIG. 41(A), the adsorption pad 368 that holds and holds the substrate P is driven in the -X direction, and the substrate P is on the plurality of air suspension devices 258 and the substrate holder 40. mobile. At this time, the Z position of the pair of pressing pins 338a is controlled so as not to be in contact with the substrate P. Next, as shown in FIG. 41(B), after the substrate P is transferred onto the substrate holder 40, the adsorption holding of the substrate P by the adsorption pad 368 is released, and the substrate holder 40 is driven in the +Z direction, after which, for example, As shown in Fig. 41 (C), the adsorption pad 368 is driven in the +X direction. Further, the substrate P is finally positioned on the substrate holder 40 by a pair of pressing pins 338a.

According to the fourth embodiment, when the substrate P is driven by the adsorption pad 368, since the center of gravity (center) of the substrate P acts on the thrust parallel to the X-axis, the moment in the θz direction is not applied to the substrate P. Therefore, in the fourth embodiment, the adsorption pad 368 can be miniaturized. Further, in the third embodiment, a moment in the θz direction is applied to the substrate P, but the adsorption pad 268 which is adsorbed and held on the rectangular adsorption surface and the substrate P are moved in a non-contact floating state. Therefore, the substrate P does not actually rotate. Further, in the fourth embodiment, the center of the substrate P in the Y-axis direction coincides with the substrate guide device 350 at the center of the Y-axis direction when the substrate is loaded (the Y position of the substrate P does not need to be aligned after the loading). Therefore, after the substrate loading operation is completed, the positioning of the substrate P to the exposure operation start position can be quickly performed.

Further, the direction in which the substrate P is carried into the substrate holder 40 is not limited thereto. For example, as shown in FIG. 42(A) and FIG. 42(B), in the state where most of the substrate P has been transferred to the substrate holder 40, the adsorption holding of the adsorption pad 368 is released, and the contact pin 338b is abutted. The substrate P is slid on the substrate holder 40 by inertia. Further, as shown in FIGS. 43(A) and 43(B), the suction pad 368 may be inserted in the vicinity of the +X side end portion of the substrate holder 40 and in the vicinity of the central portion in the Y-axis direction. Inside the gap 37. In this case, the substrate P can be directly brought into contact with the positioning pin 338b by the substrate loading device 360. Alternatively, the positioning of the substrate P can be completed by the adsorption pad 368 even if the positioning pin 338b is not provided. In the same manner as the above, in the third embodiment, for example, the corner portion on the +X side of the substrate holder 40 (see FIG. 33(A) and the like) and the +Y side can be formed to accommodate the adsorption pad 268. gap.

"Fifth Embodiment"

Next, a fifth embodiment will be described with reference to Figs. 44 to 46. The liquid crystal exposure apparatus of the fifth embodiment is substantially the same as the liquid crystal exposure apparatus of the third embodiment except for the substrate stage 420. Therefore, only the differences will be described below, and the configuration is the same as that of the third embodiment. The components of the components and functions are denoted by the same reference numerals as those of the third embodiment, and the description thereof will be omitted.

In the fifth embodiment, as shown in FIG. 44, the third embodiment and the fourth embodiment are different in that the substrate loading unit 460 is provided on the substrate stage 420. In the fifth embodiment, the substrate loading devices 260 and 360 provided in the inlet and outlet portions 240 and 340 in the third and fourth embodiments are provided on the substrate stage 420 as the substrate loading device 460. The substrate holder 440 of the substrate stage 420 has a different number of X grooves 46c formed on the upper surface (and the number of substrate lifting devices 46 accommodated in the X grooves 46c), as shown in FIG. The substrate holder 140 of the second embodiment has the same configuration. That is, on the substrate holder 440, a plurality of (for example, seven) X-grooves 46c extending in the X-axis direction are formed at predetermined intervals in the Y-axis direction, and the bottom surface of the predetermined X-groove 46c is as shown in FIG. A plurality of (for example, three) recesses are formed at predetermined intervals in the X-axis direction, and a portion of the substrate lifting and lowering device 46 is inserted into the recess.

As shown in FIG. 44, the substrate loading device 460 is attached to the outer surface (the surface facing the +Y side) of the +Y side X-pillar 25 of the pair of X-pillars 25. The substrate loading device 460 has substantially the same configuration as the substrate carrying device 70 of the first embodiment, and includes an adsorption pad 468, a support member 466, and a pair of X linear guides 467 that guide the support member 466 in the X-axis direction. An X linear motor 469 for driving the support member 466 (and the adsorption pad 468) in the X-axis direction.

The adsorption pad 468 is formed of a member having an L-shaped cross section of the YZ, and a portion parallel to the XY plane is formed into a rectangular plate shape in a plan view in the longitudinal direction in the X-axis direction as shown in FIG. The adsorption pad 468 is connected to a vacuum suction device (not shown) provided outside the substrate stage 420, and the upper surface of the portion parallel to the XY plane functions as a substrate suction surface. As shown in Fig. 45, the support member 466 is constituted by a plate-like member extending in the Z-axis direction parallel to the XZ plane, and an adsorption pad 468 is attached near the upper end portion (+Z-side end portion). The support member 466 has a structure in which the rigidity in the X-axis direction is higher than the rigidity in the Y-axis direction.

The support member 466 is formed to be bent toward the +X side from a portion on the +Z side of the central portion in the Z-axis direction, and the upper end portion is further to the +X side (ie, the entrance and exit) than the lower end portion (the -Z side end portion). The portion 240 (not shown in Fig. 45, see Fig. 29) is protruded. Further, between the support member 466 and the adsorption pad 468 and the substrate holder 440, as shown in FIG. 44, even when the support member 466 is adjacent to the substrate holder 440, even if the substrate holder 440 is relatively moved relative to the X. A gap (gap, clearance) in which the stage 23x is not in contact with each other in the case of the Y-axis direction and/or the θz direction.

Here, the adsorption pad 468 is protruded from the surface on the -Y side of the support member 466 toward the -Y side (the substrate holder 440 side), and the Y position of the -Y side end portion is higher than the +Y side of the substrate holder 440. The end is closer to the -Y side. That is, when the substrate stage 420 is viewed from the +Z side, the adsorption pad 468 is positioned above the substrate holder 440 (overlapped in the Z-axis direction). Further, the adsorption pad 468 is supported by the support member 466 such that the Z position below it is located higher than the Z position above the substrate holder 440 (since the Z position of the substrate holder 440 is changed within a small range, for example, The substrate holder 440 is located at a position higher than the Z position on the upper surface of the substrate holder 440 in a state of being in the neutral position in the Z-axis direction. Thereby, the adsorption pad 468 can be inserted between the substrate P and the substrate holder 440 in a state where the substrate P is separated from the upper surface of the substrate holder 440.

One of the vicinity of the lower end portion of the support member 466 faces the outer side of the X-pillar 25 toward the +X side. On the other hand, on the outer side surface of the X column 25 on the +Y side, for example, two (one pair) X linear guides extending in the X-axis direction are fixed at predetermined intervals in the Z-axis direction. The length (X-axis direction dimension) of the pair of X linear guides is set to be substantially half of the X-pillar 25 (or the same as the length of the substrate P in the X-axis direction), and is disposed at the center of the X-axis 25 in the X-axis direction. Further, it is an area on the +X side (the side of the entrance/exit portion 240 (not shown in Fig. 44, see Fig. 29)). Further, one surface of the support member 466 (opposing surface opposite to the X-pillar 25) includes a rolling element (for example, a circulating sphere or the like) (not shown) and is X-slidably mechanically slidably engaged with the X linear guide. The member is fixed with, for example, two at a predetermined interval in the X-axis direction with respect to one X-axis guide. The X linear guide 467 which guides the support member 466 (and the adsorption pad 468) in the X-axis direction is formed by the above-mentioned X linear guide and, for example, two X sliders corresponding to the X linear guide.

Further, between the pair of X linear guides, a magnet unit including a plurality of permanent magnets arranged at predetermined intervals in the X-axis direction is fixed. On the other hand, on one surface of the support member 466 (opposite to the X-pillar 25), the coil unit 74b including the coil is fixed to the magnet unit at a predetermined interval. The X-axis motor 469 for driving the support member 466 (and the adsorption pad 468) in the X-axis direction is constituted by the magnet unit (X stator) and the coil unit (X mover) corresponding to the magnet unit. Further, the actuator for driving the support member 466 (and the adsorption pad 468) in the X-axis direction is not limited thereto, and for example, a ball screw (feed screw) device, a rope (or a belt, etc.) may be used. Other single-axis actuators such as traction devices.

When the substrate stage 420 carries out the loading operation of the substrate P, the plurality of Z actuators 46b are controlled such that the Z position on the upper surface of each of the plurality of substrate lifting and lowering devices 46 is closer to the +Z side than the upper surface of the substrate holder 440. Further, in the entrance/exit portion 240 (see FIG. 29), the Z position on the upper surface of the plurality of air suspension devices 258 is positioned to be the same as or slightly higher than the Z position on the upper surface of each of the plurality of substrate lifting devices 46. Next, in the substrate loading device 460, as shown in FIG. 46, the adsorption pad 468 adsorbs the -X side of the substrate P and is located below the +Y side end portion (corner portion). In this state, the support member 466 is linearly X-shaped. The guiding device 469 (see FIG. 44) is driven, whereby the substrate P is moved in the -X direction on a plurality of air floating devices 258 (see FIG. 29) and carried into the substrate holder 440. At this time, pressurized air is discharged from the plurality of air suspension devices 258 and the substrate lifting and lowering device 46 to the lower surface of the substrate P, and the substrate P is floated and supported. Thereby, the substrate P is moved on the substrate holder 440 with low friction.

Here, in the substrate loading device 460, as shown in FIG. 45, the shape (bending amount) of the support member 466 is set such that the X position of the adsorption pad 468 when the support member 466 is positioned at the stroke end on the +X side is made. When the X coarse movement stage 23x is located at the stroke end of the +X side, the X position of the substrate holder 440 is closer to the +X side. Thereby, during the exposure processing of the substrate P or the like, the adsorption pad 468 can be retracted to the outside of the movable range of the substrate holder 440. Further, by separating the adsorption pad 468 from the inlet/outlet portion 240 (see FIG. 29), the external transfer robot 298 (not shown in FIG. 45, see FIG. 30) performs the exchange of the substrate P at the inlet and outlet portion 240. The external transfer robot 298 can also be prevented from coming into contact with the adsorption pad 468.

Further, in the fifth embodiment, although the intermediate portion of the support member 466 is curved, the shape of the support member 466 is not limited as long as the suction pad 468 can be retracted to the outside of the movable range of the substrate holder 440 in the X-axis direction. this. Further, although the substrate loading device 460 is attached to the +Y side surface of the X column 25 on the +Y side via the X linear guiding device 467, the present invention is not limited thereto, and the X linear guiding device and the X actuator may be configured. The X linear actuator unit and the X column 25 are disposed independently on the +Y side of the +Y side X column 25.

As described above, according to the fifth embodiment, since the substrate loading device 460 is attached to the Y coarse movement stage 23y which is in a stationary state during the scanning operation in the substrate stage 420, the substrate loading unit 460 is provided on the substrate stage. 420 does not affect the position control of the X coarse movement stage 23x, and can control the X position of the substrate P with high precision during the scanning operation.

Further, the substrate stage 420 has a structure in which the X coarse movement stage 23x and the fine movement stage 21 are mounted on the Y coarse movement stage 23y having the substrate loading apparatus 460 (the structure in which the Y coarse motion stage 23y is at the lowest position). Therefore, the maintenance of the substrate loading device 460 is also easy. Further, since the substrate loading device 460 moves the adsorption pad 468 (and the support member 466) only in the X-axis (1-axis) direction, the configuration and control are simple, and the cost is lower than, for example, the multi-joint robot arm. Further, since the substrate loading device 460 can retract the adsorption pad 468 to the outside of the movable range of the substrate P in the X-axis direction, even the height position (Z position) of the adsorption pad 468 and the substrate P (or the substrate holder 440) is the same. It also prevents contact with each other. Further, since the substrate holder 440 does not need to eject a pressurized gas sufficient to float the substrate P from the substrate mounting surface, the substrate mounting surface can be configured to be suitable for the planar correction of the substrate P (for example, the pin chuck shape). ).

Further, each of the above embodiments can be appropriately changed. For example, in the above-described third to fifth embodiments, the substrate P to be carried out is suspended by the suspension holding device 280 including a plurality of non-contact chuck devices 282 (so-called Bernou chucks) in a non-contact state, but In this case, the substrate P can be held from above without affecting the pattern formed on the surface of the substrate. For example, the surface of the substrate can be contacted by using a vacuum chuck or the like. Further, the fall prevention device 290 is disposed below the substrate P with a predetermined gap (gap or clearance) when the substrate P is carried out. However, the fall prevention device 290 is not limited to this, and the fall prevention device 290 can also be in contact with the substrate P (fall prevention device) 290 supports the substrate P) from below.

Further, in the above-described third to fifth embodiments, the loading path of the substrate P and the carrying-out path overlap in the vertical direction, but the present invention is not limited thereto. For example, the substrate P may be carried in the +X direction from the substrate holders 40, 440, and the other substrates P may be carried in the -X direction from the substrate holders 40, 440 (the above-described embodiments are carried in from the +X side). Further, the loading path and the carrying-out path of the substrate P may not be parallel to the X-axis.

Further, in the third to fifth embodiments, the plurality of air suspension devices 258 are configured to receive the exposed substrate P (see FIG. 37(A)) from the suspension holding device 280 in the inlet and outlet portions 240 and 340, but are not limited thereto. Alternatively, a member other than the air suspension device 258, such as a lift pin or the like, may be used. In this case, the drop prevention device 290 may be formed as an opening through which the lift pins are allowed to pass. Further, in the substrate carrying device 270 (see FIG. 30), the drop preventing device 290 and the overhanging device 280 are configured to move in the X-axis direction along the common X traveling guide 272. However, the present invention is not limited thereto, and the fall preventing device 290 is not limited thereto. The suspension holding device 280 can also be positionally controlled by separate driving mechanisms.

Further, in the third to fifth embodiments, the suspension holding device 280 and the drop preventing device 290 including the plurality of non-contact chuck devices 282 are used for the substrate unloading device for carrying out the substrate P from the substrate stages 220, 320, and 420. 270, but not limited thereto, the substrate transfer device that transports the substrate P in a plane parallel to the surface of the substrate P can be used regardless of the application, and can be used, for example, to carry the substrate P into the substrate stage 220, 320, 420. The substrate loading device is used.

Further, in the first to fifth embodiments and the modifications, the illumination light may be ultraviolet light such as ArF excimer laser light (wavelength: 193 nm), KrF excimer laser light (wavelength: 248 nm), or F2 laser light (wavelength: 157 nm). ) Wait for vacuum ultraviolet light. Further, as the illumination light, for example, a single-wavelength laser light of an infrared band or a visible light band emitted from a DFB semiconductor laser or a fiber laser may be used, for example, an optical fiber amplifier doped with germanium (or both germanium and germanium). The amplitude is converted to the harmonics of ultraviolet light using nonlinear optical crystallization. Further, a solid laser (wavelength: 355 nm, 266 nm) or the like can also be used.

In addition, the case where the projection optical system PL is a multi-lens projection optical system including a plurality of projection optical units has been described, but the number of projection optical units is not limited thereto, and may be one or more. Further, it is not limited to the multi-lens type projection optical system, and may be, for example, a projection optical system using an OFNER type large-sized mirror. Further, in the above-described embodiment, the case where the projection magnification is equal to the magnification is described as the projection optical system PL. However, the present invention is not limited thereto, and may be either a reduction system or an amplification system.

Further, although a light-transmitting type mask in which a predetermined light-shielding pattern (or a phase pattern or a light-reducing pattern) is formed on a light-transmitting mask substrate is used, it is also possible to use, for example, US Pat. No. 6,778,257. An electronic reticle (variable shaping reticle) for forming a transmissive pattern or a reflective pattern or an illuminating pattern according to an electronic material of a pattern to be exposed, for example, using a non-emissive type image display element (also referred to as spatial light modulation) A variable-mold mask of a DMD (Digital Micro-mirror Device) of one type.

Further, the object to be carried in the object transport device is not limited to the substrate to be exposed, and may be a pattern holder such as a mask (original). Further, the object transporting device may be used for carrying out the substrate substrate instead of loading the substrate (or loading the substrate). Further, the object transport device is used for transporting an object in the exposure device, but is not limited thereto, and may be used to transport an object (for example, a substrate) between the exposure device and an external device (for example, a coater device). Further, the exposure apparatus can also be applied to an exposure apparatus of a step & stitch type. When the object to be transported is the substrate P exposed by the exposure device, the size of the substrate (including at least one of the outer diameter, the diagonal, and one side) is 500 mm or more, and the flat panel display (FPD) such as a liquid crystal display device is large. The exposure apparatus for substrate exposure is particularly effective.

Further, the use of the exposure apparatus is not limited to a liquid crystal exposure apparatus for transferring a liquid crystal display element pattern to a square glass plate, and can be widely applied to, for example, an exposure apparatus for semiconductor manufacturing, for manufacturing a thin film magnetic head, a micromachine, and DNA. An exposure device such as a wafer. Further, the present invention can be applied not only to micro-elements such as semiconductor element elements, but also to photomasks or reticle for manufacturing photo-exposure devices, EUV exposure devices, X-ray exposure devices, and electron beam exposure devices. The circuit pattern is transferred to an exposure device such as a glass substrate or a germanium wafer. Further, the object to be exposed is not limited to a glass plate, and may be another object such as a wafer, a ceramic substrate, a film member, or a mask blank. In the case where the object to be exposed is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and for example, a film-like member having a flexible sheet member is also included. Moreover, the object processing apparatus including the object transporting apparatus is not limited to the exposure apparatus, and may be, for example, a substrate inspection apparatus.

An electronic component such as a liquid crystal display element (or a semiconductor element) is manufactured by the following steps, that is, a step of performing a function of a device, a performance design, a step of fabricating a photomask (or a reticle) according to the design procedure, and manufacturing. a step of transferring a pattern of a photomask (reticle) to a lithography step of a glass substrate according to the exposure apparatus and the exposure method of the above embodiments, and developing the exposed glass substrate The developing step, an etching step of removing the exposed portion of the portion other than the portion where the resist remains by etching, a resist removing step for removing the resist which is not required for the etching end, a component assembling step, an inspection step, and the like. In this case, in the lithography step, since the exposure method is performed by using the exposure apparatus of each of the above embodiments, the element pattern is formed on the glass substrate, so that a high-complexity element can be manufactured with good productivity.

Industrial availability

As described above, the object transporting apparatus and method of the present invention are suitable for transporting objects. Further, the object processing apparatus of the present invention is suitable for processing an object. Further, the object exchange method of the present invention is suitable for performing object exchange on the object holding device. Further, the exposure apparatus of the present invention is suitable for forming a predetermined pattern of an object. Further, the method of manufacturing a flat panel display of the present invention is suitable for the manufacture of a flat panel display. Further, the component manufacturing method of the present invention is suitable for the manufacture of microcomponents.

Claims (1)

 An object transporting apparatus that transports an object, comprising: a support member that supports at least a part of an end portion of the object from below; and a facing member that is disposed opposite to a side surface in a gravity direction of the object to force upward toward a gravity direction Acting on the object supported by the support member; and a drive system for driving the support member and the opposing member.