TW201818085A - Sorter for testing electronic components - Google Patents

Abstract

The present invention relates to a sorting machine for testing electronic components. A sorting machine for testing an electronic component according to the present invention includes a moving chamber that can accommodate a test tray on which electronic components are stacked and moves along a predetermined moving path. And, the moving chamber may include: a first chamber portion for adjusting the temperature of the electronic components stacked on the test tray; and a second chamber portion for returning the temperature of the electronic components stacked on the test tray to the normal temperature . According to the present invention, a plurality of test windows can be arranged in a unit form by constituting a moving chamber, so that a setting space with respect to a processing capacity can be greatly reduced, and a function can be additionally set by dividing one chamber into two, which can be minimized. Set the area.

Description

Sorter for testing electronic components

The present invention relates to a sorting machine for testing electronic components.

The electronic components produced are divided into good and defective products after being tested by the tester, and only the good products are shipped.

The electrical connection between the tester and the electronic component is realized by a sorting machine for testing electronic components (hereinafter referred to as "sorting machine"), and various sorting machines are available depending on the type of electronic component. The present invention relates to a sorting machine to which a test tray capable of stacking a plurality of electronic components is applied.

The sorting machine for applying the test tray has various forms including the Korean Patent Publication No. 10-2013-0105104, and the like, generally, as shown in the conceptual plan view of FIG. 1, includes: a loader 110; a first chamber 120; Test chamber 130; connector 140; second chamber 150 and unloader 160.

The loader 110 loads the electronic components to be tested stacked on the customer-tray CT ₁ to the test tray TT at the loading position (LP: LOADING POSITION).

The first chamber 120 is provided for advance temperature adjustment (preheating or pre-cooling) according to test temperature conditions before testing the electronic components stacked on the contained test tray TT.

The test chamber 130 is equipped for testing electronic components on the test tray TT that is moved to the test position (TP: TEST POSITION) after the first chamber 120 is preheated/precooled. That is, the test chamber 130 is provided to maintain the temperature of the electronic components stacked on the contained test tray TT at the test temperature condition.

The connector 140 electrically connects the electronic components stacked on the test tray TT of the test position TP to the tester.

The second chamber 150 is provided for cooling the electronic component in the heated state on the test tray TT transferred from the test chamber 130 to return to room temperature or a predetermined temperature at which no problem occurs when unloading.

The unloader 160 sorts the test pieces by the test level while unloading the electronic components from the test tray TT at the unloading position (UP: UNLOADING POSITION) and moves them to the empty customer tray CT ₂ .

As described above, the test tray TT is circulated in accordance with the circulation path CC which is returned to the loading position LP via the loading position LP, the test position TP, and the unloading position UP. For this purpose, a plurality of conveyors not shown are forming the circulation path CC. The test tray TT is transferred to each section.

In addition, as shown in FIG. 1, the sorter 100 has a structure in which the test chamber 130 is located between the first chamber 110 and the second chamber 150 and a structure in which the test tray TT is transferred to the closed circulation path CC, so that it is considered When the width and height of the equipment are used, it is difficult to configure more than 4 test windows TW. Here, the test window TW refers to a window in which an electronic component is electrically connected to a tester (TESTER), and each test window TW corresponds to one test tray TT. Of course, the tester (TESTER) is combined with the sorter 100 through the test window TW.

Therefore, the electronic component that can be tested once is also limited to the number of test trays TT stacked on at least one up to three, which makes the sorter 100 that cannot be infinitely expanded to have the limit of the processing capacity.

It is an object of the present invention to provide a technique for a chamber for temperature adjustment that can supply test trays to a plurality of test windows or can receive test trays from a plurality of test windows.

A sorting machine for testing an electronic component according to a first aspect of the present invention includes: a moving chamber capable of accommodating a test tray stacked with electronic components and moving along a predetermined moving path; and a transferer at said moving Transferring the moving chamber on a path; a connector disposed on at least one side of the moving path to be capable of receiving a test tray from the moving chamber or providing a test tray to the moving chamber, and causing an electronic component Electrically connecting or disconnecting from a tester coupled to the test window to enable electrical property testing of electronic components stacked on the test tray; and at least one mobile device to connect the test tray to the mobile chamber Move between the devices.

The at least one mobile device can be disposed in the moving chamber to move with the moving chamber.

The moving chamber includes: a first chamber portion for adjusting a temperature of an electronic component stacked on the test tray; and a second chamber portion disposed side by side with the first chamber portion in an up and down direction, such that The temperature of the electronic components stacked on the test tray is restored to normal temperature, and the inside of the first chamber portion and the second chamber portion are separated from each other by the partition wall.

The first chamber portion includes: a switch door that will receive a test tray at a loading position or a first moving hole switch that transmits a test tray to the connector, the second chamber portion including: a second movement a hole for conveying or receiving a test tray from the unloading position, the inside of the second chamber portion being in communication with the outside through the second moving hole.

Still further comprising: an elevator that is in a position to be able to transfer the test tray from the first chamber portion to the connector by lifting the moving chamber, or in the second chamber portion being connectable from the connection Receive the position of the test tray.

The apparatus may further include: an ascending machine capable of carrying out the test tray containing the electronic component for testing to be disposed in the first cavity by raising the test tray loaded from the first chamber portion into the test chamber The second chamber portion of the upper side of the chamber portion.

The test window is a plurality of, and the plurality of test windows are respectively configured with the connector.

The method further includes: a plurality of test chambers, receiving test trays from the moving chambers, and being disposed on respective test window sides to maintain test temperature conditions of the electronic components, the moving chambers having a pair with the test chambers A large number of relationships.

The plurality of connectors are respectively disposed on both sides of the moving path.

The method may further include: a test chamber that receives the test tray from the moving chamber, and maintains the temperature of the electronic components stacked on the contained test tray at a test temperature condition; and an isolator for isolating the location The electronic components of the test tray and the outside air on the path of the moving chamber moving toward the test chamber.

The sorting machine further includes: a first buffer chamber that stands by before the test tray carrying the electronic component to be tested moves to the moving chamber; and a second buffer chamber that receives from the moving chamber The stack of test pieces carrying the electronic components that have been tested is put into standby, and the first buffer chamber and the second buffer chamber may be configured to be fixed.

a thermal state inside the first buffer chamber is formed in the first buffer chamber and the moving chamber before the test tray moves from the inside of the first buffer chamber to the inside of the moving chamber A closed passage between the chambers is transmitted to the interior of the moving chamber, and the temperature inside the moving chamber is assimilated to the temperature inside the first buffer chamber.

A sorting machine for testing an electronic component according to a second aspect of the present invention includes: a housing chamber capable of accommodating a test tray on which electronic components are stacked; and a connector configured to receive a test tray from the housing chamber or Transmitting a test tray to the receiving chamber to electrically connect or disconnect the electronic component from the tester coupled to the test window to enable electrical characteristic testing of the electronic components stacked on the test tray, and to be disposed in the receiving a side of the chamber; and a plurality of mobile devices for moving the test tray between the receiving chamber and the connector, the receiving chamber comprising: a first chamber portion for adjusting the stacking test a temperature of the electronic component of the tray; and a second chamber portion integrally coupled with the first chamber portion and arranged side by side, the interior thereof being separated from the first chamber portion by a partition wall for being stacked in the test The temperature of the electronic components of the tray is restored to normal temperature, and a part of the plurality of mobile devices moves the test tray from the first chamber portion to the connector, and the other portion The test tray moves from the connector to the second chamber portion.

The first chamber portion and the second chamber portion are arranged side by side in the up and down direction.

According to the present invention, the following effects are obtained.

First, by constructing a moving chamber accessible to the test window, a plurality of test windows can be configured in a unit form, so that the size of the sorter relative to the processing capacity can be minimized.

Secondly, a moving chamber can be connected to a plurality of test chambers (or connectors) while moving, so that the number of transferers that can be used to pass the test trays through the test chambers can be correspondingly greatly reduced, thereby enabling the size It is even smaller and can reduce production costs.

Third, the number of cells can be increased or decreased with the same structure, so it is easier to produce a sorting machine that meets the requirements of the customer company. That is, it is not necessary to design separately for the increase or decrease of the capacity.

Fourth, a moving chamber can be accessed to each test chamber (or connector), so if the moving chamber is divided into two areas and its function is set differently, not only can it be tested in various temperature environments, but also The size of the sorter can be further minimized.

Fifth, it may be an optimized device for equipment that has a longer test time than the environment in the mobile chamber.

DESCRIPTION OF THE PREFERRED EMBODIMENTS The preferred embodiments of the present invention are described with reference to the drawings, but the description of the repetition or the like is omitted as much as possible for the sake of brevity of the description. <First Embodiment> 1. A general description of the composition

Figure 2 is a conceptual plan view of a sorter 200 in accordance with a first embodiment of the present invention.

The sorting machine 200 according to the embodiment includes: a moving chamber 210; an elevator 220; a transfer unit 230; eight test chambers 241 to 248; eight connectors 251 to 258; two first mobile devices 261a, 261b; Two second mobile devices 262a, 262b; a loader 271; an unloader 272; a first opener 281; a second opener 282; a drive tester DT; and two isolators 291, 292.

The moving chamber 210 reciprocates the predetermined moving path MC in the front-rear direction. This moving chamber 210 can accommodate a test tray (TT).

The elevator 220 raises and lowers the moving chamber 210. This is to enable the moving chamber 210 to provide the test tray TT to the test chambers 241-248 or the unloading position UP or to receive the test tray TT from the test chambers 241-248 or the loading position LP at appropriate locations.

The transporter 230 moves the moving chamber 210 on the moving path MC.

The eight test chambers 241 to 248 are respectively disposed on the left and right sides of the movement path MC, and are disposed in order to maintain the test temperature conditions for the electronic components of the contained test tray TT.

The eight connectors 251 to 258 electrically connect the electronic components of the test tray TT accommodated in the test chambers 241 to 248 to a tester (not shown). Also, the respective connectors 251-258 are configured to receive the test tray TT from the moving chamber 210 or to provide the test tray TT to the moving chamber 210. Therefore, the eight connectors 251 to 258 are also disposed on the left and right sides of the movement path MC, respectively.

The two first mobile devices 261a, 261b and the two second mobile devices 262a, 262b are disposed in the moving chamber 210 and move together with the moving chamber 210. Here, the first mobile device 261a, 261b performs the transfer of the test tray TT on which the electronic component is loaded from the loading position LP to the moving chamber 210 or the test tray TT received in the moving chamber 210 to the respective test chambers 241. ~248 features. Further, the second mobile device 262a, 262b performs a function of transferring the test tray TT located in the test chambers 241 to 248 to the moving chamber 210 or to the unloading position UP.

The loader 271 moves the electronic components located on the customer tray CT ₁ to the test tray TT at the loading position LP.

The unloader 272 moves the electronic components from the test tray TT located at the unloading position UP to the empty customer trays CT ₂ , CT ₃ .

The first opener 281 enables the electronic components to be properly stacked to the test tray TT by opening the test tray TT at the loading position LP.

The second opener 282 enables the electronic components to be properly removed from the corresponding test tray TT by opening the test tray TT at the unloading position UP.

The drive tester DT is equipped for simple testing of the electrical drive of the electronic components.

The two separators 291, 292 are disposed in the movement chamber 210, and perform a function of isolating the test tray TT moving from the movement chamber 210 to the test chambers 241 to 248 from the outside air. 2. Description of the movement of the individual chambers 210 described configuration A.

As shown in the schematic front cross-sectional view of FIG. 3, the moving chamber 210 is divided by the partition wall DW into a lower first chamber portion 211 and an upper second chamber portion 212. Here, in order to isolate the heat transfer, the partition wall DW is preferably composed of a heat insulating material.

The first chamber portion 211 is provided to pre-adjust the temperature of the electronic components stacked on the test tray TT to enable it to correspond to the test temperature environmental conditions. Such a first chamber portion 211 may selectively or wholly have a heater HT for forming a high temperature environment and a cooling module CM for forming a low temperature environment according to application conditions of the sorter 200. Here, in consideration of air movement according to the air temperature state, the heater HT is preferably disposed at a lower portion of the first chamber portion 211, and the cooling module CM is preferably disposed at an upper portion of the first chamber portion 211. Here, the cooling module CM may be constituted by the evaporator 1, the circulation fan 2, and the casing 3. The internal air of the first chamber portion 211 flows into the interior of the casing 3 by means of the circulation fan 2, and then passes through the evaporator 1 from the casing. The 3 discharge mode circulates, thereby cooling the electronic components of the test tray TT. Here, in order to prevent the drive motor 2a of the circulation fan 2 from being damaged by heat or frost, it is preferably disposed outside the first chamber portion 211.

For reference, depending on the implementation, the moving chamber 210 can be embodied such that the first chamber portion 211 functions as a heating chamber and the second chamber portion 212 functions as a cooling chamber. In this case, in consideration of the principle that the cold air is lowered due to the rise of the hot air and the reason for the structural structure, the lower portion is usually a structure in which a plurality of structures are filled and the upper portion is open without other structures, and is preferably disposed on the lower side. The temperature-increased first chamber portion 211 is disposed on the upper side with the temperature-reduced second chamber portion 212. Also, in the case of the normal temperature test, it may be designed to maximize the opening of the upper second chamber portion 212, but in order to return to a predetermined temperature or to cool to a predetermined temperature, it may be preferable to consider the second chamber portion 212 as well. It is configured as a closed structure that can isolate outside air.

Further, in order to allow the first chamber portion 211 to receive the test tray TT from the loading position LP on the left side of the movement path MC or to selectively transfer the test tray TT to the test chambers 241 to 248 located on the left and right sides of the movement path MC, respectively, A left side moving hole LH _{1 is} formed in the left side wall, and a right side moving hole RH _{1 is} formed in the right side wall. Obviously, in order to isolate the first chamber interior and the outside air portion 211, a first chamber portion 211 having a left door LD ₁ and the right side switch for moving the right door RD holes RH for the left side of the moving orifice switch LH ₁ . Here, each of the switch gates LD, RD may be arranged to elevate and open and close the moving holes LH ₁ , RH ₁ by other driving sources such as the cylinder CD. Obviously, depending on the implementation, the switch door can also be configured to be switched by a hinge structure, but it is more preferable to use the lift structure in order to prevent the width of the equipment from widening.

Also, the first chamber portion 211 has a pair of support rails 211a and a lift cam mechanism 211b.

The pair of support rails 211a support the movement of the test tray TT that is accommodated in the front and rear ends of the test tray TT of the first chamber portion 211 and is guided to move in the left-right direction.

The lift cam mechanism 211b raises and lowers a pair of support rails. To this end, as shown in FIG. 4, the lift cam mechanism 211b includes a drive shaft DS, a passive shaft PS, a conveyor belt TB, and a rotary motor RM.

A cam protrusion CP having a center O' offset from the center O of each axis is formed in the drive shaft DS and the driven shaft PS. The pair of support rails 211a are supported in a state of being lifted by the cam protrusions CP.

The conveyor belt TB transmits the rotational force of the drive shaft DS to the passive shaft PS. Such a conveyor belt TB can be considered to preferably consist of a timing belt to achieve an accurate linkage of the drive shaft DS with the passive shaft PS.

The rotation motor RM rotates the drive shaft DS. Therefore, if the rotary motor RM operates, the drive shaft DS and the driven shaft PS rotate to cause the cam projection CP to also rotate, and as shown in FIG. 5, the support rail 211a is raised and lowered by a predetermined height H. Obviously, as the support rail 211a rises and falls, the test tray TT placed on the support rail 211a also moves up and down.

The second chamber portion 212 is a temperature that changes the temperature of the electronic component that completes the test to be close to normal temperature, or changes the temperature to at least the extent that the electronic component can be properly unloaded without damage of the electronic component or the unloader 272. And configuration.

The second chamber portion 212 is also configured as a closed structure according to the application conditions of the sorter 200, and may be configured to selectively use a heater for increasing the temperature of the electronic component and a cooling module for lowering the temperature of the electronic component. The ground has or has all. However, in the present embodiment, it is constituted only by the simplest cooling structure in which the electronic component is exposed to the outside air in order to change the temperature of the electronic component that completes the test, and the electronic component is lowered by the exhaust fan VP. temperature.

This second chamber portion 212 is also configured to be able to receive the test tray TT from the test chambers 241 to 248 located on the left and right sides of the movement path MC or to transfer the test tray TT to the unloading position UP on the right front side at the left and right side walls. Left side moving holes LH ₂ and right side moving holes RH ₂ are formed, respectively. Moreover, the second chamber portion 212 in the present embodiment does not have other opening and closing doors for opening the left side moving hole LH ₂ and the right side moving hole RH ₂ to expose the internal electronic components thereof to the outside air, in order to make the interior more The ground is exposed to the outside air, and a communication hole CH is also formed in the front and rear side walls.

Similarly, the second chamber portion 212 also includes a pair of front and rear support rails 212a for supporting the accommodated test tray TT and guiding the movement of the test tray TT moving in the left and right direction directions; and a lifting cam mechanism 212b for making The support rail 212a is raised and lowered.

As described above, the first chamber portion 211 functions as a supply chamber for supplying the test tray TT to the test chambers 241 to 248, and the second chamber portion 212 serves as a recovery chamber for recovering the test tray TT from the test chambers 241 to 248. The room plays a role. Also, the first chamber portion 211 functions as a heat treatment chamber (SOAK CHAMBER) that applies temperature stimulation to the electronic component, and the second chamber portion 212 serves as a heat treatment chamber for eliminating temperature stimuli from the electronic component (DESOAK) CHAMBER) works. Obviously, the upper and lower positions of the two chamber portions 211, 212 can also be interchanged. B. Description of the lift ( 220 )

The elevator 220 raises and lowers the moving chamber 210. This is to enable the moving chamber 210 to provide or receive the test tray TT at an appropriate location. As shown in FIG. 6, such an elevator 220 may be constituted by a lifting cylinder 221 provided to the moving frame 231 of the conveyor 230.

Thus, if the elevating working cylinder 221, shown in Figure 7, the first chamber portion 211 of the hole moving LH _1, RH ₁ is in the test chamber 248 of the switch 241 to the same height as the hole or OH second chamber portion 212 The moving holes LH ₂ and RH ₂ are at the same height as the switch holes of the test chambers 241 to 248. Therefore, the test tray TT can move from the first chamber portion 211 to the test chambers 241 to 248 or can move from the test chambers 241 to 248 to the second chamber portion 212. Obviously, the lift cylinder 221 can be configured with one or more quantities.

Further, as a scheme for adjusting an appropriate position, it is also possible to design a configuration in which the openers 281 and 282 on both sides are moved up and down instead of moving the chamber 210. However, in this case, each of the openers 281 and 282 needs to have more than one lift cylinder. Therefore, it is more preferable to configure the moving chamber 210 from the viewpoints of production cost, optimization of equipment size, and control of the side surface. Lifting.

Obviously, when the upper and lower heights of the test chambers 241 to 248 are applied higher than the upper and lower heights of the moving chamber 210, and when the structure for elevating and lowering the electronic components is applied in the test chamber, it is not necessary to separately configure the moving chamber. 210 or an elevator that lifts 281, 282 up and down. That is, in the case where the connector explained below can make the test tray TT selectively at the height of the first chamber portion 211 or the second chamber portion 212, there is no need to separately configure the moving chamber 210 or open. Lifts for lifting 281, 282. C. Description of the Transmitter 230

The transporter 230 moves the moving chamber 210 on the moving path MC. Here, the movement path MC is a long path in the front-rear direction that can reciprocate between the loading position LP or the unloading position UP on the left and right sides and the test chambers 241 to 248. As shown in FIG. 8, the conveyor 230 includes a moving frame 231, a rotating shaft 232, a transfer motor 233, and a pair of guide rails 234.

The moving frame 231 is coupled to the rotating shaft 232 in a bolted manner, and thus can be moved in the front-rear direction in accordance with the rotation of the rotating shaft 232. The moving frame 231 is provided with the elevator 220 as described above, and the moving chamber 210 is coupled to the elevator 220, so that the moving chamber 210 and the elevator 220 move together according to the movement of the moving frame 231.

In order to provide the moving path MC, the rotating shaft 232 is formed into a shape that is long in the front-rear direction.

The transfer motor 233 rotates the forward and reverse rotation shafts 232.

A pair of guide rails 234 guide the forward and backward movement of the moving frame 231. D. Description of test chambers 241~248

Four test chambers 241 to 248 are respectively disposed on the left and right sides of the movement path MC.

As shown in the schematic front cross-sectional view of FIG. 9, in order to enable the test tray TT to be transferred from the moving chamber 210 or transferred to the moving chamber 210, an opening hole OH is formed in the moving path MC of the test chamber 241. Further, it is a matter of course that the control gate CG for controlling the switch hole OH is disposed for heat insulation.

In addition, a test window TW is formed on the lower side of the test chamber 241, and a tester (TESTER) is coupled to the side of the test window TW. Generally, one test chamber 241 to 248 is provided with one test window TW, so that a total of eight test windows TW are arranged in the sorter 200 according to the present embodiment. The test window TW referred to herein refers to a test site (test area), that is, an area where the test chamber meets the tester.

Obviously, the test chamber 241 can selectively or entirely have the heater HT forming the high temperature environment and the cooling module CM forming the low temperature environment according to the application conditions of the sorter 200. Obviously, for the uniform distribution of hot air or cold air, a fan for air circulation (PAN) is preferably disposed.

Further, the test chamber 241 is provided with an electromagnet EM on its switch hole OH side. If the electromagnet EM is supplied with power, the isolator 291 operates.

The test chambers of the symbols 242 to 248 are identical to the test chamber of the symbol 241 or are symmetrical with respect to the movement path MC as a reference line, and thus the description thereof is omitted.

According to the sorting machine 200 of the present invention, the test chambers 241 to 248 are divided into left and right and arranged in the form of a chamber. Therefore, in the case where it is necessary to process a sorting machine having an enlarged capacity, the transfer unit 230 described below can be configured as Longer and additional configuration of the test chamber for simple design.

Obviously, in the case of equipment for performing a normal temperature test that is configured to maintain the predetermined temperature at the time of performing the test, it is not necessary to equip the test chamber. That is, the test chamber 241 can be configured only for equipment that requires testing of electronic components within a predetermined temperature range. Obviously, in the case of being embodied as a normal temperature test equipment, the test chamber can also be configured in an open configuration. E. Description of connectors 251~258

The eight connectors 251 to 258 pressurize the electronic components of the test tray TT stacked in the test chambers 241 to 248 to the tester (TESTER) side (accurately, the test slot side of the tester), thereby The electronic components are electrically connected to the tester (TESTER). To this end, as shown in FIG. 10, the connector 251 includes a gripping member GE and a pressurizing source PS.

The gripping member GE is disposed inside the test chamber 241 and includes a gripping groove GH for gripping both ends of the test tray TT. Here, since the grip groove GH is formed to be long in the left-right direction, the movement of the test tray TT that moves in the left-right direction can be guided.

The pressurizing source PS may be configured as a motor, and the test tray TT gripped by the gripping member GE is lowered or raised by raising and lowering the gripping member GE. At this time, as shown in FIG. 11a, if the connector 251 lowers the test tray TT, the electronic component is pressurized toward the side of the tester (TESTER) coupled below, thereby electrically connecting the tester (TESTER) to the electronic component. Further, as shown in FIG. 11b, if the connector 251 raises the test tray TT, the electrical connection between the tester (TESTER) and the electronic component is released.

Obviously, the movement of the test tray TT is achieved in the state shown in Fig. 11b.

For reference, in order to prevent the pressurized source PS from being affected by the temperature environment inside the test chamber 241, the pressurized source PS is preferably disposed outside the test chamber 241 (in the present embodiment, on the upper side of the test chamber).

The connectors of the symbols 252 to 258 are the same as the connectors of the symbol 251 or are symmetrical with each other with the movement path C as a reference line, and thus the description thereof will be omitted. F. Description of the mobile devices 261a , 261b , 262a , 262b

The first mobile device 261a, 261b is disposed in the first chamber portion 211, the first mobile device of the symbol 261a is responsible for the movement of the test tray TT in the left direction of the moving path C, and the first mobile device of the symbol 261b is responsible for the moving path. The movement of the test tray TT is performed in the right direction of C.

The second mobile device 262a, 262b is disposed in the second chamber portion 212, the second mobile device of the symbol 262a is responsible for the movement of the test tray TT in the left direction of the moving path C, and the second mobile device of the symbol 262b is responsible for the moving path. The movement of the test tray TT is performed in the right direction of C.

As shown in FIG. 12, the first mobile device 261a includes a gripping pusher GS and a moving source MS.

The grip pusher GS has a grip pin GP for gripping the test tray TT at its left end, and a rack RG is formed in the left and right direction. As shown in FIG. 13a and FIG. 13b, the gripping pin GP is inserted into the gripping hole GH of the test tray TT while the test tray TT is raised by the operation of the lifting cam mechanism 211b, and the test tray TT is gripped when the test tray TT is lowered. Detach from the grip hole GH.

The moving source MS moves the gripping pusher GS in the left-right direction, thereby moving the test tray TT gripped by the gripping pusher GS in the left-right direction. To this end, the moving source MS includes a pinion PG that meshes with a rack RG gear that grips the push rod GS. Such a moving source MS is preferably considered to be disposed outside of the moving chamber 210 to prevent thermal damage. Further, if the moving source MS operates in the state of Fig. 13a, as shown in Fig. 13c, as the gripping pusher GS moves to the left side, the test tray TT also moves to the left side together.

The first mobile device of the symbol 261b and the second mobile devices 262a, 262b are actually arranged in the same configuration, and therefore the description thereof will be omitted. G. Description of loader 271 and unloader 272

The loader 271 and the unloader 272 may have a configuration in which the electronic component is moved. The loader 271 and the unloader 272 are tools for placing the electronic components at a desired location after gripping and moving the electronic components, which may have various gripping structures depending on the kind of the electronic components. A technique of such a plurality of gripping structures according to the type of the electronic component is known from the Korean Patent Publication No. 10-2002-0049848, No. 10-2003-0016060, and the like, and thus detailed description thereof will be omitted. According to the implementation, an example in which the electronic component is supplied to the sorter in a state of being stacked on the test tray can be exemplified, in which case the loader 271 can be omitted. Further, in a case where the test tray in a state in which the electronic component in which the test is completed is loaded is taken out from the sorter and classified in other equipment, the unloader 272 may be omitted. H. Description of open machines 281 , 282

The openers 281 and 282 may perform a function of opening the test tray TT in order to stack electronic components to the test tray TT or take out electronic components from the test tray TT. Obviously, the openers 281, 282 can also have various open structures depending on the fixed structure of the electronic components of the electronic component type. The technique of the various open structures according to the type of the electronic component is also known from the Korean Patent Publication No. 10-2009-0008062, No. 10-2011-0136312, and the like, and the detailed description thereof is omitted.

For reference, in the horizontal state of the test tray, in the horizontal sorter to be tested, the open machine may or may not be configured depending on the type of the electronic component. I. Description of the drive tester DT

The drive tester DT is for testing whether the electronic component is properly driven when the power is supplied to the electronic component, and the drive tester DT is configured such that the loader 271 can electrically connect the electronic component in a state of being grasped by the loader 271 to the drive tester The location of the DT is fine. The drive tester DT in this embodiment is disposed in front of the loading position LP to minimize the working radius of the loader 271. J. Description of the isolators 291 , 292

The separators 291, 292 are capable of isolating the test tray TT moving from the moving chamber 210 to the test chambers 241 to 248 from the outside air (more specifically, isolating the electronic components moving together with the test tray from the outside air), It can be configured in any form.

In the present embodiment, the isolator 291 and 292 located in the mobile chamber so as to surround the first chamber 210 moves the hole portion 211 of the LH _1, RH embodiment of _a chamber 210 provided in the mobile. Obviously, depending on the implementation, it is also preferable to provide eight isolators in the test chambers 241 to 248.

As shown in FIG. 14, in the present embodiment, the isolator 291 can be constituted by a bellows WT and a coupling ring CR.

One side of the bellows WT is coupled to the moving chamber 210, and is configured to be contractible and expandable in the left-right direction, and a passage through which the test tray TT can pass is formed.

The coupling ring CR is composed of a magnetic body and is disposed at the left end of the bellows WT. As shown in FIG. 15, the coupling ring 291b is magnetically coupled to the right side wall surface of the test chamber 241 when the electromagnet EM located in the test chamber 241 is magnetized. Accordingly, the switch hole in the testing chamber (OH) 241 of LH and moving the movable chamber ₁ between the hole 210, is formed by a bellows WT closed with the outside air movement path of the test tray TT MW. This isolator 291 serves to minimize heat or cold gas loss. In particular, in the low temperature test, condensation caused by the test tray (TT, including the stacked electronic components) assimilated into the low temperature in the program moving from the first chamber portion 211 to the test chambers 241 to 248 is prevented, It can prevent damage to electronic components caused by condensation.

The isolator of symbol 292 is only different in direction from the isolator of symbol 291 and the other structures are identical, so the description thereof is omitted.

For reference, in the example in which the first chamber portion 211 functions as a heating chamber and the second chamber portion 212 becomes a closed structure to function as a cooling chamber, the separator should be on the left and right of the first chamber portion 211. One side is disposed on each of the left and right sides of the second chamber portion 212 on both sides, and four are disposed in total. That is, an isolator including a bellows may not be required when performing only a normal temperature test, but an isolator including a bellows may be required when testing at a predetermined temperature. This is because the principle of frosting when the cooled object meets the ambient air may cause damage to the electronic components including the semiconductor element, so that the spacers may be disposed in the two chamber portions 211, 212 as needed. Or an isolator is disposed in both chamber portions 211, 212. For example, when performing the normal temperature test, the isolator is not required, and the moving chamber does not need to be divided into two chamber portions, and even if divided into two chamber portions, it can be formed into an open type. In this case, the moving chamber has no temperature adjustment function and therefore only functions as a relay test tray. In addition, in the case of low temperature testing, both chamber portions need to have a closed structure, and in order to prevent condensation, both chamber portions need to be equipped with an isolator. 3. Reference item A. Symbol A is a loading vehicle, and symbol B is an unloading vehicle.

The loading vehicle A can stack a plurality of customer trays and is detachably mounted to the sorting machine 200. Obviously, the customer's pallet CT ₁ stacked on the loading vehicle A is loaded with electronic components to be tested. At this time, the technique of mounting the loading vehicle A to the sorting machine 200 and the technique of circulating the customer tray CT ₁ in the loading vehicle A have been provided by the Korean Patent Application No. 10-2016-0026482, so the details are omitted. Description.

The unloading vehicle B can also stack a plurality of customer trays CT ₂ and can be detachably mounted to the sorting machine 100. This unloading vehicle B is loaded with a customer tray CT ₂ equipped with electronic components for testing.

Obviously, it is also conceivable to arrange a loading stacker or a stacker for unloading which is basically installed in the sorting machine instead of the loading vehicle A or the unloading vehicle B, and it is also conceivable to arrange other different types of supply or recovery devices. B. A customer tray CT ₃ for stacking electronic components determined to be defective is disposed in the unloader box (C, Unloader Bin Box). C. The sorting machine 200 may be provided with a buffer table BT for temporarily stacking electronic components according to selection, an identifier (BR such as a bar code reader) for recognizing electronic components, and the like. D. As described above, the test tray TT has the grip hole GH into which the grip pin GP can be inserted, and can have various stacking structures depending on the kind of the electronic component. The various types of test trays TT have been provided by the prior patent documents such as Korean Patent Publication No. 10-2011-0136312, and No. 10-2008-0040654, and the description thereof is omitted. E. Further, in the present embodiment, the first chamber portion 211 is used as a heat treatment chamber (Soak Chamber) that applies thermal stress, and the second chamber portion 212 is used as a heat treatment for eliminating applied thermal stress. Used by the chamber (Desoak Chamber). Further, a heater HT and a cooling module CM are disposed in the first chamber portion 211.

However, depending on the implementation, both the first chamber portion and the second chamber portion may be configured to be internally closable, in which case, for example, the heater may be disposed in the first chamber portion, and A cooling module is provided in the second chamber portion. In applying this example, in the high temperature test, the first chamber portion functions as a heat treatment chamber and the second chamber portion functions as a heat treatment chamber. In the low temperature test, the second chamber portion is subjected to heat treatment. The chamber functions as the first chamber portion functions as a heat treatment chamber. 4. Job description

The loader 271 moves the electronic component from the customer tray CT ₁ located at the uppermost side of the loading vehicle A to the test tray TT located at the loading position LP. At this time, the first opener 281 maintains the test tray TT in an open state. Further, the loader 271 electrically connects the grasped electronic component to the drive tester DT in the program for moving the electronic component, thereby testing whether the electronic component is electrically driven. The electronic components that are determined to have problems with the electric drive in this program are piled up to the buffer table BT, and good electronic components are moved to the test tray TT. Obviously, in the program in which the electronic component is moved by the loader 271, the electronic component is also recognized by the recognizer DA, so that the individual history management of the electronic component can be performed.

Further, after the electronic component is loaded to the test tray TT of the loading position LP, the first mobile device of the symbol 261a operates to move the test tray TT of the loading position LP to the inside of the first chamber portion 211. Accordingly, the electronic components stacked on the test tray TT begin to assimilate to the internal temperature environment of the first chamber portion 211. At the same time, the moving chamber 210 moves toward the currently empty test chambers 241, 242, 243, 244, 245, 246, 247, 248, and the first mobile device 261a or 261b operates to bring the test tray TT from the first The chamber portion 211 is moved to the test chambers 241, 242, 243, 244, 245, 246, 247, 248. At this time, the separators 291, 292 form a closed moving path MW that can move the test tray TT between the moving chamber 210 and the test chambers 241 to 248 (particularly, between the first test portion and the test chamber). . Then, the test tray TT accommodated in the test chambers 241 to 248 is in a state of being gripped by the gripping member GE, and the pressurizing source PS is operated to lower the test tray TT toward the tester (TESTER) side. If the lowering of the test tray TT is completed, the electronic components mounted on the test tray TT are electrically connected to the tester (TESTER), and in this state, the electronic components are tested.

In addition, if the test of the electronic component is completed, the connectors 251, 252, 253, 254, 255, 256, 257, 258 raise the test tray TT, and the second mobile device 262a or 262b operates to make the test tray TT The two chamber portion 212 moves. At this time, the moving chamber 210 is in a state of being lowered by the elevator 220, and thus the moving holes LH ₂ , RH ₂ of the second chamber portion 212 are located at the switches with the test chambers 241, 242, 243, 244, 245, 246, 247. The position corresponding to the hole OH. Next, if the test tray TT ends the movement to the inside of the second chamber portion 212, the movement chamber 210 moves forward and is located on the left side of the unloading position UP, in which state the second mobile device of the symbol 262b operates to The test tray TT is moved to the unloading position UP. Next, the unloader 272 operates to move the electronic component from the test tray TT located at the unloading position UP to the empty customer tray CT ₂ located at the upper side of the unloading vehicle B. At this time, the electronic components determined to be defective are stacked on the customer tray CT ₃ located in the unloading box C. < Second embodiment >

Figure 16 is a conceptual plan view of a sorting machine 300 in accordance with a second embodiment of the present invention.

The sorting machine 300 according to the embodiment includes: a moving chamber 310; an elevator 320; a transfer unit 330; eight test chambers 341 to 348; eight connectors 351 to 358; two first mobile devices 361a, 361b; Two second mobile devices 362a, 362b; a loading/unloading machine 370; a first opener 381; a second opener 382; a drive tester DT; and two isolators 391, 392. The moving chamber 310, the elevator 320, the transfer 330, the eight test chambers 341-348, the eight connectors 351-358, the two first mobile devices 361a, 361b, the two second mobile devices 362a, 362b, The structure and function of the first opener 381, the second opener 382, the drive tester DT, and the two isolators 391, 392 and the moving chamber 210, the lift 220, and the transfer of the sorter 200 according to the first embodiment, respectively 230, 8 test chambers 241~248, 8 connectors 251~258, 2 first mobile devices 261a, 261b, 2 second mobile devices 262a, 262b, first open machine 281, second open machine 282. The drive tester DT and the two isolators 291 and 292 are the same, and thus the description thereof will be omitted.

However, in the sorting machine 300 according to the present embodiment, the loading position LP and the unloading position UP are divided into the first position 1P and the second position 2P without distinction. Also, the first position 1P and the second position 2P may be converted into a loading position or an unloading position according to the operating state of the loading/unloading machine 370. That is, the loading/unloading machine 370 loads the electronic component to be tested to the empty test tray TT located at the first position 1P or the second position 2P, or from the stack at the first position 1P or the second position 2P to complete the test. The test tray TT of the electronic components unloads the electronic components.

In the sorting machine 300 according to the present embodiment, in order to minimize the moving path of the loading/unloading machine 370, it is preferable that the driving tester DT is disposed in front of the moving chamber 310. Obviously, the drive tester can also be equipped with more than two.

Moreover, depending on the implementation, it is also conceivable to divide the loading/unloading machine into a first picking machine and a second picking machine. In this case, it is necessary to prevent the first picking machine from The control method of the work interference between the second pickers or the separation design of the work area. < Modification of Second Embodiment >

Figure 17 is a conceptual plan view of a sorter 400 in accordance with a variation of the second embodiment of the present invention.

In the modification of Figure 17, without further configured to unload the car and unload boxes 3 C _1, C _2, C ₃ arranged in a row in the left-right direction on the plane, so as to test the electronic component from the unloading tray TT Good and defective products. Moreover, it is also possible to further classify good products into various levels. <Third embodiment>

Figure 18 is a conceptual plan view of a sorting machine 500 according to a third embodiment of the present invention.

The sorting machine 500 according to the present embodiment includes a housing chamber 510, an elevator 520, a test chamber 540, a connector 550, first mobile devices 561a, 561b, second mobile devices 562a, 562b, and a loading/unloading machine 570. Open machine 580.

In the present embodiment, the receiving chamber 510 is located in front of the test chamber 540.

However, the accommodating chamber 510 has a structure in which the state in which the first chamber portion and the second chamber portion are divided by the partition wall in the up-and-down direction as in the first embodiment are arranged side by side in the vertical direction. That is, the first chamber portion and the second chamber portion are integrated to form a receiving chamber 510. The housing chamber 510 in this embodiment does not move forward or backward, but can only be lifted and lowered by the elevator 520.

The remaining components, that is, the elevator 520, the test chamber 540, the connector 550, the first mobile devices 561a, 561b, the second mobile devices 562a, 562b, the loading/unloading machine 570, and the opener 580 are sorted in the second embodiment. The elevator 320 of the machine 300, the test chambers 341 to 348, the connectors 351 to 358, the first mobile devices 361a, 361b, the second mobile devices 362a, 362b, the loading/unloading machine 370, and the opener 380 are the same, and thus the description thereof is omitted. Description.

For reference, FIG. 19 shows a case where a plurality of sorters 300 of FIG. 18 are provided for use.

Also in the present embodiment, in the case where the upper and lower heights of the accommodation chamber 510 and the test chamber 540 and the structure for raising and lowering the test tray TT in the test chamber 540 are applied in the same manner, the elevator 520 may be omitted. <Fourth embodiment>

This embodiment is an example in which the movement of the test tray TT is smooth and the electronic component can reach the temperature required for the test more quickly.

Figure 20 is a conceptual plan view of a sorting machine 600 according to a fourth embodiment of the present invention.

The sorting machine 600 according to the embodiment includes: a moving chamber 610; an elevator 620; a transfer 630; 8 test chambers 641~648; 8 connectors 651~658; 2 first mobile devices 661a, 661b; Two second mobile devices 662a, 662b; a loading and unloading machine 670; a first opener 681; a second opener 682; a drive tester DT; and two isolators 691, 692. Further, the sorter 600 according to the present embodiment is provided with a first buffer chamber BC1 between the first opener 681 and the test chamber of the symbol 641, between the second opener 682 and the test chamber of the symbol 645. A second buffer chamber BC2 is disposed.

In the above configuration, the moving chamber 610, the elevator 620, the transfer unit 630, the eight test chambers 641 to 648, the eight connectors 651 to 658, the two first mobile devices 661a, 661b, and the two second mobile devices The configuration and function of the 662a, 662b, the first opener 681, the second opener 682, the drive tester DT, and the two isolators 691, 692 are actually respectively different from the moving chamber 210, the elevator 220 in the first embodiment, Transmitter 230, 8 test chambers 241-248, 8 connectors 251-258, 2 first mobile devices 261a, 261b, 2 second mobile devices 262a, 262b, first open machine 281, second open Since the machine 282, the drive tester DT, and the two isolators 291 and 292 are the same, the description thereof will be omitted.

The loading and unloading machine 670 moves the electronic components located on the customer tray CT ₁ to the test tray TT at the loading position LP and moves the electronic components from the test tray TT located at the unloading position UP to the empty customer trays CT ₂ , CT ₃ . This loading and unloading machine 670 also functions in the same manner as the loader 271 and the unloader 272 of the first embodiment. That is, it is possible to appropriately select whether to perform loading and unloading by one loading and unloading machine 670 as in the present embodiment or to load according to the first embodiment, depending on whether it is a specification supporting the quick test or a specification supporting the slow test. The machine 271 is designed to be equipped with the unloader 272.

The first buffer chamber BC1 waits before the action to the action chamber 610 after accommodating the test tray TT of the electronic component that should be tested at the loading position LP. Of course, as disclosed in Korean Laid-Open Patent Publication No. 10-2008-0082591, it is possible to accommodate a plurality of test trays TT in the first buffer chamber BC1 and to move the contained test trays TT in parallel.

Also, the first buffer chamber BC1 may be configured to provide a temperature environment according to test conditions. In this case, during the high temperature test, the inside of the first buffer chamber BC1 is maintained at a high temperature, and during the low temperature test, the inside of the first buffer chamber BC1 is maintained at a low temperature.

In the second buffer chamber BC2, the test tray TT on which the electronic components for completing the test from the moving chamber 610 are loaded is accommodated and stands by before being moved to the unloading position UP. This second buffer chamber BC2 can be configured to eliminate thermal stimuli from the electronic components that are carried from the moving chamber 610 and stacked on the test tray TT. Likewise, the second buffer chamber can also be configured to accommodate more than one test tray TT.

If the temperature of the electronic component is controlled by the first buffer chamber BC1 and the second buffer chamber BC2 configured as the fixed type chamber, the time during which the electronic component stays in the moving chamber 610 can be saved to improve the action chamber 610. Utilization rate. Therefore, the test tray TT can be moved more quickly than the first embodiment in which the temperature of the electronic component can be controlled by the movement chamber 210 that can be moved only by performing the function of loading and transferring the electronic components, and thus the processing capacity can be increased.

Hereinafter, the operation of the sorting machine 600 according to the present embodiment as described above will be described.

If the loading vehicle A carrying the customer tray CT ₁ on which the electronic components are mounted is mounted to the sorting machine 600, the loading and unloading machine 670 moves the electronic components from the customer tray CT ₁ located at the uppermost side of the loading vehicle A. Go to the test tray TT at the loading position LP. In this procedure, the loading and unloading machine 670 passes through the identifier BR and the drive tester DT. According to this, after the electronic component is recognized by the identifier BR, the test is completed by driving the tester DT, and the electronic component is tested according to one test. Once screened as defective or not. At this time, the electronic components judged to be defective are piled up to the buffer table BT.

After loading the electronic component to the test tray TT at the loading position LP, the test tray TT moves to the first buffer chamber BC1 and stands by, and then moves to the moving chamber 610. Next, the test tray TT is moved to the test chambers 641 to 648 together with the moving chamber 610 to the empty test chambers 641 to 648, and is stacked on the test tray TT in the test chambers 641 to 648. 2 tests of electronic components. If the 2 tests for the electronic component are completed, the test tray TT is re-actuated to the action chamber 610, then moved to the second buffer chamber BC2 and waited, and then moved to the unloading position UP. And, if all the electronic components are unloaded from the test tray TT located at the unloading position UP by the loading and unloading machine 670, the test tray TT is moved from the unloading position UP to the loading position LP. Obviously, the electronic component unloaded from the test tray TT located at the unloading position UP by the loading and unloading machine 670 is moved to the empty customer tray CT ₂ located on the upper side of the unloading vehicle B or the electronic component determined to be defective to be moved to Customer tray CT ₃ located in unloading box C.

For reference, the confirmation of the electronic component and the driving test procedure are added at the time of loading, and the time for applying the thermal stimulus to the electronic component is longer than the time for eliminating the thermal stimulus from the electronic component, and therefore it can be preferably considered to be configured as the first buffer chamber BC1. More test trays TT are accommodated than the second buffer chamber BC2.

As in the present embodiment, if the first buffer chamber BC1 and the second buffer chamber BC2 are disposed, the degree of design freedom for the moving chamber 610 can be improved according to the control.

For example, as described below, the temperature of the moving chamber 610 can be assimilated by the first buffer chamber BC1 during the low temperature test.

When the low temperature test is performed, the inside of the first buffer chamber BC1 is formed at a temperature of -40 degrees. If the moving chamber 610 is located on the side of the first buffer chamber BC1, the isolator 691 operates to open the passage between the first buffer chamber BC1 and the moving chamber 610. At this point, the door of the moving chamber 610 and the door of the first buffer chamber BC1 are closed.

The temperature of the air within the passage is sensed by sensing, and the first buffer chamber BC1 and the door of the moving chamber 610 operate in two steps.

First, a procedure of assimilation of the internal temperature of the passage opened by the isolator 691 with the internal temperature of the first buffer chamber BC1 is required. Therefore, a low-temperature gas capable of assimilation of the temperature of the channel is additionally injected into the first buffer chamber BC1. Then, the gate of the first buffer chamber BC1 is slightly opened as a first step, and the cryogenic gas additionally injected into the interior of the first buffer chamber BC1 is used to assimilate the passage opened through the isolator 691 to a desired low temperature (-40 degrees). Or depending on the case, a temperature slightly lower than -40 degrees). That is, the cold air which is rapidly moved by the required amount corresponding to the low-temperature gas injected into the first buffer chamber BC1 by the opening which is opened by the isolator 691 is rapidly assimilated into The internal temperature of the first buffer chamber BC1. Obviously, the door of the first chamber 610 is now maintained in a closed state.

If the passage opened by the isolator 691 due to sensing is assimilated to the desired low temperature, the door of the first buffer chamber BC1 is completely open to the second step and requires an internal temperature sufficient to assimilate it into the moving chamber 610. The low temperature gas is thus additionally supplied with the low temperature gas to the first buffer chamber BC1. After injecting a sufficient amount of cryogenic gas, the door of the moving chamber 610 is opened, and the interior of the moving chamber 610 also begins to assimilate to the internal temperature of the buffer chamber BC1. Obviously, the internal temperature of the moving chamber 610 is also sensed at this time. Also, the internal temperature of the moving chamber 610 is rapidly lowered to a desired low temperature in accordance with the convection phenomenon caused by the difference in air pressure and the temperature difference. Here, the door of the moving chamber 610 can also be opened by the steps of two or more steps. Here, in a state where the first buffer chamber BC1 is slightly opened, the internal temperature of the moving chamber 610 may be associated to a desired low temperature, and then the door of the first buffer chamber BC1 may be completely opened. Depending on the implementation, the door of the moving chamber 610 can also be configured to be fully open during the first step.

Also, if the interior of the moving chamber 610 is assimilated to the desired low temperature, the test tray TT is moved from the first buffer chamber BC1 to the action chamber 610.

That is, according to the present example, before the test tray TT is moved from the inside of the first buffer chamber BC1 to the action chamber 610, it is formed by the separator 691 between the first buffer chamber BC1 and the moving chamber 610. The closed passage, the thermal state of the interior of the first buffer chamber BC1 is rapidly transferred to the interior of the moving chamber 610, so that the temperature inside the moving chamber 610 is assimilated to the temperature inside the first buffer chamber BC1.

As described above, if the internal temperature of the moving chamber 610 is assimilated to the internal temperature of the first buffer chamber BC1, the cooling chamber or the blower fan need not be separately disposed in the moving chamber 610. In such an example, it may be preferable to apply the same temperature control as in the above first buffer chamber BC1 and the moving chamber 610 between the test chambers 641 to 648 and the moving chamber 610. method. Obviously, in accordance with such an example, the thermal insulation of the moving chamber 610 can be further enhanced.

For reference, the procedure for cooling a low-temperature gas (for example, LN 2 gas) is described in the above example, but it is also conceivable to cool the first buffer chamber BC1 by supplying cold air using a cooling system of another compressor and the evaporator. internal.

Further, the above example of the temperature control is described by taking the low temperature test as an example, but it can be applied in the same manner in the high temperature test at the time of implementation. <Additional example> 1. Test chamber lifting

In the above embodiment, the movement of the test tray TT between the moving chamber and the test chamber is mainly achieved by the lifting and lowering movement chambers 210, 310, 610. However, depending on the implementation, it is also conceivable to raise and lower the test chamber without lifting the moving chamber. 2. Lifting of the test tray in the test chamber

Also, by moving the test tray TT inside the test chamber, the movement of the test tray TT between the moving chamber and the test chamber can be achieved. For example, it is possible to adopt a configuration in which the test tray that is carried into the lower region of the test chamber is raised without moving the moving chamber and is carried out in the upper region. Such a structure can be realized by forming a riser that can raise the test tray after the end of the test of the electronic components mounted on the test tray. Figure 21 shows the simplest example of a riser used to raise a test tray within a test chamber. Referring to (a) and (b) of Fig. 21, the riser UA includes a pair of support tables UB and a rising source UF.

The support table UB supports the test tray TT that is carried into the lower side area. At this time, it is preferable that the support table UB is disposed in a shape of a support rail that can support while guiding the movement of the test tray TT. Further, the two support stages UB function as a work window OW that can be used to connect the electronic component mounted on the test tray TT to the tester as a connector for electrically connecting the electronic component to the tester. Obviously, the two support tables UB can be connected to each other to the other support tables SB within the range of maintaining the working window OW.

As shown, the ascending source UF can be constructed most simply by a cylinder, but can also be constructed of a motor.

Further, in the case where the connector is used to pressurize the electronic component to the tester side by the lifting operation to electrically connect the electronic component to the conventional general structure of the tester, it is possible to arrange other rising sources in the riser UA. It is preferable to consider the rise of the test tray TT by the rising power of the connector. Obviously, in this case, it is only necessary to provide the two support tables to the connector and to ascend and descend along with the lifting of the connector. Further, at this time, the configuration of the elevator UA can be completed as the two support tables from which the other lifting sources are removed.

In this example, the lower side portion of the moving chamber is used as a soaking portion for applying thermal stress to the electronic component, and the upper portion is preferably used when it is used as a heat-reducing portion for releasing thermal stress applied to the electronic component. In this example, the movement of the electronic components between the moving chamber and the test chamber is performed in the following order: the electronic component that is converted to a high temperature or a low temperature at the lower side portion of the moving chamber to be loaded on the test tray TT is After moving into the test chamber, the test is lifted by the elevator and moved out of the moving chamber.

The invention has been described in detail with reference to the embodiments of the accompanying drawings, but the description of the preferred embodiments of the invention It is understood as the scope of patent application and its equivalent scope.

200‧‧‧ sorting machine

210‧‧‧moving chamber

211‧‧‧ first chamber section

212‧‧‧Second chamber section

220‧‧‧ Lifts

230‧‧‧Transfer

241~248‧‧‧Test chamber

251~258‧‧‧Connector

261a, 261b‧‧‧ first mobile device

262a, 262b‧‧‧ second mobile device

271‧‧‧Loader

272‧‧‧Unloader

291, 292‧‧‧ isolators

1 is a conceptual plan view of a conventional sorting machine for testing electronic components.

Figure 2 is a conceptual plan view of a sorting machine in accordance with a first embodiment of the present invention.

Figure 3 is a schematic elevational cross-sectional view of a moving chamber corresponding to the sorting machine of Figure 2.

4 is a conceptual perspective view of a lifting cam mechanism corresponding to the moving chamber of FIG. 3.

Fig. 5 is a reference view for explaining the operation of the lift cam mechanism of Fig. 4;

Fig. 6 is a conceptual front view corresponding to a lifting mechanism for the sorting machine of Fig. 2.

Fig. 7 is a reference view for explaining the operation of the elevator of Fig. 6.

Figure 8 is a conceptual plan view corresponding to the transfer for the sorter of Figure 2.

Figure 9 is a conceptual front cross-sectional view of a test chamber corresponding to the sorter of Figure 2.

Figure 10 is a conceptual side cross-sectional view of a connector corresponding to the sorter of Figure 2.

Fig. 11 is a reference diagram for explaining the operation of the connector of Fig. 10.

Figure 12 is a conceptual perspective view of a mobile device corresponding to the sorter of Figure 2 .

Fig. 13 is a reference diagram for explaining the operation of the mobile device of Fig. 12;

Figure 14 is a conceptual front cross-sectional view of an isolator corresponding to the sorter of Figure 2.

Fig. 15 is a reference diagram for explaining the operation and function of the isolator of Fig. 12.

Figure 16 is a conceptual plan view of a sorting machine in accordance with a second embodiment of the present invention.

Figure 17 is a conceptual plan view of a sorting machine according to a modification of the second embodiment of the present invention.

Figure 18 is a conceptual plan view of a sorting machine according to a third embodiment of the present invention.

Fig. 19 is a reference view showing a state in which a plurality of sorting machines of Fig. 18 are arranged side by side.

Figure 20 is a conceptual plan view of a sorting machine according to a fourth embodiment of the present invention.

21 is a schematic illustration of an ascending machine for implementing an additional example of movement of a test tray between a moving chamber and a test chamber in the present invention.

Domestic deposit information (please note according to the order of the depository, date, number)

Foreign deposit information (please note in the order of country, organization, date, number)

Claims (13)

A sorting machine for testing electronic components, comprising: a moving chamber capable of accommodating a test tray stacked with electronic components and moving along a predetermined moving path; and a transfer device transferring the said moving path a moving chamber; a connector disposed on at least one side of the moving path to be capable of receiving a test tray from the moving chamber or providing a test tray to the moving chamber, and coupling the electronic component to the test window The tester is electrically connected or disconnected to enable electrical property testing of the electronic components that are carried on the test tray; and at least one mobile device that moves the test tray between the moving chamber and the connector. A sorting machine for testing an electronic component according to claim 1, wherein said at least one mobile device is disposed in said moving chamber to move together with said moving chamber. A sorting machine for testing an electronic component according to claim 1, wherein the moving chamber comprises: a first chamber portion for adjusting a temperature of an electronic component stacked on the test tray; and a second chamber portion Having a side-by-side arrangement with the first chamber portion in an up-and-down direction to restore the temperature of the electronic components stacked on the test tray to a normal temperature, the interior of the first chamber portion and the second chamber portion being separated by a wall Separated from each other. A sorting machine for testing an electronic component according to claim 3, wherein the first chamber portion comprises: a switch door, a first to be used for receiving a test tray at a loading position or transmitting a test tray to the connector Moving the hole switch, the second chamber portion includes: a second moving hole for conveying the test tray to the unloading position or receiving the test tray from the connector, the inside of the second chamber portion passing the second movement The hole is connected to the outside. A sorting machine for testing an electronic component according to claim 3, further comprising: an elevator that is placed at a position capable of transferring the test tray from the first chamber portion to the connector by moving the moving chamber up and down Or at a location where the second chamber portion is capable of receiving a test tray from the connector. A sorting machine for testing an electronic component according to claim 3, further comprising: a riser for causing the test to be completed by raising a test tray that is carried from the first chamber portion into the test chamber The test tray of the electronic component can be carried out to the second chamber portion disposed on the upper side of the first chamber portion. A sorting machine for testing an electronic component according to claim 1, wherein the test window is plural, and each of the plurality of test windows is respectively configured with the connector. A sorting machine for testing an electronic component according to claim 7, further comprising: a plurality of test chambers, accommodating test trays from said moving chambers, and being disposed on respective test window sides to maintain test temperature of electronic components Condition, the moving chamber has a one-to-many relationship with the test chamber. A sorting machine for testing an electronic component according to claim 7, wherein the plurality of connectors are respectively disposed on both sides of the moving path. A sorting machine for testing an electronic component according to claim 1, further comprising: a test chamber that accommodates a test tray from the moving chamber and maintains a temperature of the electronic component stacked on the contained test tray at Testing temperature conditions; and an isolator for isolating electronic components and external air of the test tray located on a path moving from the moving chamber to the test chamber. A sorting machine for testing an electronic component according to claim 1, further comprising: a first buffer chamber that stands by before a test tray carrying the electronic component to be tested moves to the moving chamber; and, a second buffer The chamber receives a test tray from the moving chamber that carries the electronic components that have been tested and stands by, and the first buffer chamber and the second buffer chamber are configured to be fixed. A sorting machine for testing an electronic component according to claim 11, wherein the heat inside the first buffer chamber is before the test tray moves from the inside of the first buffer chamber to the inside of the moving chamber a state is transmitted to the interior of the moving chamber through a closed passage formed between the first buffer chamber and the moving chamber, and the temperature inside the moving chamber is assimilated to the first The temperature inside the buffer chamber. A sorting machine for testing electronic components, comprising: a receiving chamber capable of accommodating a test tray on which electronic components are stacked; and a connector configured to receive a test tray from the receiving chamber or to the receiving chamber The test tray is transported to electrically connect or disconnect the electronic component to the tester coupled to the test window to enable electrical characteristic testing of the electronic components stacked on the test tray, and is disposed on one side of the receiving chamber And a plurality of mobile devices moving the test tray between the receiving chamber and the connector, the receiving chamber comprising: a first chamber portion for adjusting electronic components stacked on the test tray a temperature; and a second chamber portion integrally coupled with the first chamber portion and arranged side by side, the interior thereof being separated from the first chamber portion by a partition wall for loading electronic components stacked on the test tray The temperature returns to normal temperature, and a part of the plurality of mobile devices moves the test tray from the first chamber portion to the connector, and the other portion Means that the test tray is moved from said connector to said second chamber portion, arranged side by side on said first chamber portion and said second chamber portion in the vertical direction.