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TW201816514A - 感光性樹脂組成物、硬化膜、有機ｅｌ顯示裝置、半導體電子零件、半導體裝置 - Google Patents

感光性樹脂組成物、硬化膜、有機ｅｌ顯示裝置、半導體電子零件、半導體裝置 Download PDF

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Publication number
TW201816514A
TW201816514A TW106128704A TW106128704A TW201816514A TW 201816514 A TW201816514 A TW 201816514A TW 106128704 A TW106128704 A TW 106128704A TW 106128704 A TW106128704 A TW 106128704A TW 201816514 A TW201816514 A TW 201816514A
Authority
TW
Taiwan
Prior art keywords
photosensitive resin
film
resin composition
mass
acid
Prior art date
Application number
TW106128704A
Other languages
English (en)
Chinese (zh)
Inventor
早坂惇
木內洋平
奧田良治
Original Assignee
日商東麗股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東麗股份有限公司 filed Critical 日商東麗股份有限公司
Publication of TW201816514A publication Critical patent/TW201816514A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electroluminescent Light Sources (AREA)
  • Polyamides (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
TW106128704A 2016-08-29 2017-08-24 感光性樹脂組成物、硬化膜、有機ｅｌ顯示裝置、半導體電子零件、半導體裝置 TW201816514A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016166701 2016-08-29
JP2016-166701 2016-08-29
JP2016166702 2016-08-29
JP2016-166702 2016-08-29

Publications (1)

Publication Number Publication Date
TW201816514A true TW201816514A (zh) 2018-05-01

Family

ID=61301876

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106128704A TW201816514A (zh) 2016-08-29 2017-08-24 感光性樹脂組成物、硬化膜、有機ｅｌ顯示裝置、半導體電子零件、半導體裝置

Country Status (3)

Country Link
JP (1) JP7062953B2 (fr)
TW (1) TW201816514A (fr)
WO (1) WO2018043250A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI656605B (zh) * 2018-06-27 2019-04-11 欣興電子股份有限公司 線路板的製造方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6808831B2 (ja) * 2017-06-06 2021-01-06 富士フイルム株式会社 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイスおよび化合物
WO2020031240A1 (fr) * 2018-08-06 2020-02-13 日立化成デュポンマイクロシステムズ株式会社 Composition de résine photosensible, procédé de production de film durci à motif, film durci, film isolant intercouche, couche de revêtement de surface, film de protection de surface et composant électronique
CN109742110B (zh) 2019-01-04 2022-07-08 京东方科技集团股份有限公司 有机发光显示器及制造方法
KR20210146882A (ko) * 2019-03-27 2021-12-06 도레이 카부시키가이샤 감광성 수지 조성물, 감광성 수지 시트, 중공 구조의 제조 방법 및 전자 부품
JP7264728B2 (ja) * 2019-05-31 2023-04-25 太陽ホールディングス株式会社 硬化性組成物、ドライフィルムまたはプリプレグ、硬化物、および電子部品
US11199774B2 (en) * 2020-03-30 2021-12-14 Canon Kabushiki Kaisha Method and apparatus to improve frame cure imaging resolution for extrusion control
CN121039566A (zh) * 2023-06-27 2025-11-28 东丽株式会社 感光性树脂组合物、固化物及电子部件
WO2025249286A1 (fr) * 2024-05-27 2025-12-04 日産化学株式会社 Composition décapante pour élimination d'irradiation de lumière

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102290334B (zh) * 2005-07-05 2015-03-11 日立化成株式会社 半导体装置的制造方法
JP2009294536A (ja) 2008-06-06 2009-12-17 Hitachi Chem Co Ltd 感光性樹脂組成物及び基板の接着方法
JP2010192867A (ja) * 2009-01-20 2010-09-02 Renesas Electronics Corp 半導体集積回路装置および半導体集積回路装置の製造方法
CN102549497B (zh) * 2009-09-10 2013-07-31 东丽株式会社 感光性树脂组合物及感光性树脂膜的制造方法
JP2012069734A (ja) * 2010-09-24 2012-04-05 Toshiba Corp 半導体装置の製造方法
JP5548604B2 (ja) 2010-12-21 2014-07-16 富士フイルム株式会社 感光性樹脂組成物
JP5641652B2 (ja) * 2011-03-31 2014-12-17 日本化薬株式会社 感光性樹脂組成物
TWI574111B (zh) * 2012-08-08 2017-03-11 旭化成電子材料股份有限公司 Flexible printed wiring board
WO2015137281A1 (fr) * 2014-03-14 2015-09-17 東レ株式会社 Composition de résine photosensible
TWI671343B (zh) * 2014-06-27 2019-09-11 Fujifilm Corporation 熱硬化性樹脂組成物、硬化膜、硬化膜的製造方法以及半導體裝置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI656605B (zh) * 2018-06-27 2019-04-11 欣興電子股份有限公司 線路板的製造方法

Also Published As

Publication number Publication date
JP7062953B2 (ja) 2022-05-09
WO2018043250A1 (fr) 2018-03-08
JPWO2018043250A1 (ja) 2019-06-24

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