TW201816478A - Method and machine for polishing glass substrate - Google Patents

Abstract

To provide a polishing method and a polishing device for a glass substrate, with which chemical polishing of a glass substrate surface can be performed so as to form the glass substrate into a uniform thin film, tool marks can be suppressed, risk of damage can be reduced, and high polishing efficiency can be achieved. This polishing method for a glass substrate is for uniformly polishing the surface of a glass substrate to be used for a liquid crystal display or organic EL display and includes: an arranging step of arranging and securing a vertically-hung glass substrate; a chemical polishing step of continuously spraying and applying a chemical polishing solution on both sides of the glass substrate from a plurality of spray nozzles; and a washing step of washing the melt-polished glass substrate. In the chemical polishing step, to prevent unevenness from occurring and remaining in spray application of the chemical polishing solution due to dripping, the spray nozzles on the upper edge side of the glass substrate are disposed such that the vertical spacing or horizontal spacing therebetween is narrower than on the lower edge side of the glass substrate.

Description

   Method and device for polishing glass substrate   

The present invention relates to a polishing device for polishing a glass substrate to make it ultra-thin, and more particularly, to a method for chemically polishing the surface of a glass substrate until a glass substrate used for a liquid crystal display or an organic EL display becomes a thin film, and A polishing method and a polishing device for a glass substrate that improve polishing efficiency.

Since the prior art, a number of techniques have been developed and utilized for polishing the surface of a glass substrate to make the glass substrate ultra-thin. Generally speaking, in polishing technology, there are a method of physically polishing an object to be polished by a grinder or the like, or a method of electrically and chemically polishing an object to be polished by electricity, or using a chemical substance. Grinding methods that cause chemical reactions.

Among these methods, chemical polishing refers to a method that uses a chemical substance to grind by dissolving the surface of the object to be polished, and is mostly a solution in which a processing object is placed in a solution filled with a fluoric acid solution. And immersed in the solution to dissolve the surface. During dissolution, bubbling (a method of colliding air bubbles with the object to be circulated to circulate the solution) can be adopted so that the surface of the object to be ground can be ground without leakage. At present, chemical polishing is widely used as a method for polishing glass substrates such as liquid crystal displays or organic EL displays, and chemical polishing can be used to manufacture thin and light glass substrates for liquid crystal displays or organic EL displays.

However, the use of liquid crystal as a display for a TV or a personal computer is now widely spread. In addition to achieving high image quality, high-speed, large-capacity, thin-film, or light-weight devices have also been sought. In addition, technologies such as tablet type terminals and smartphones are also progressing. As displays used in these technologies, thin-and-light-weight liquid crystal display parts are required to be manufactured. The status quo is to accept the requirements of such a market, and have been asked that the liquid crystal display can be finally processed to be thinner.

In addition, the uniformity of the thickness of the display substrate after the chemical polishing is required is required to make the area of the end portion of the substrate uniform, and the narrow frame of the display product is also required.

For such requirements, in the chemical polishing technology using the above-mentioned bubbling effect, a batch processing method of simultaneously polishing and processing a plurality of substrates is used, and there will be traces of a fixture for holding the substrate formed at the end of the substrate. It is said that it can fully respond to the problem of narrow width requirements. That is, in the case of the batch processing method, it is necessary to increase the speed in order to immerse a large number of pieces in the polishing liquid at the same time, or it is necessary to stir the polishing liquid in order to suppress the unevenness of the polishing amount caused by the immersed place ( Bubbling treatment), and it is necessary to hold firmly to prevent the substrate from shifting or cracking, but a jig mark will be formed by the jig, which will lead to a situation where the thickness on the end portion becomes non-uniform. On the other hand, in order to reduce the above-mentioned jig marks, the number of jigs that press the substrate is reduced, or the strength of the pressing is reduced, and the problems of substrate offset (groove offset) or cracks or rupture are also caused during the polishing process. point.

As a technique for solving such a problem, there is a technique disclosed in Japanese Patent Application Laid-Open No. 2013-252984. Here, there has been disclosed a chemical polishing technology including a plurality of transfer rollers and a processing chamber configured to transfer a glass substrate in a horizontal direction, and the processing chamber is configured to The glass substrates carried by a plurality of conveying rollers are chemically polished. The processing chamber has at least a processing tank and a recovery tank. The processing tank is positioned higher than the plurality of conveying rollers so that The chemical polishing liquid overflows, and the recovery tank is configured to recover the chemical polishing liquid overflowing from the processing tank.

According to this technique, it is considered that the number of jigs can be reduced because the glass substrate can be transported in a horizontal direction, and the chemical polishing liquid can be sprayed into a shower shape from the upper and lower surfaces of the glass substrate to perform chemical polishing (etching). However, since the substrate is arranged horizontally, it is sufficient to supply the polishing liquid in a paddle shape on the upper surface side of the substrate. In contrast, the polishing liquid sprayed on the substrate from the lower surface side directly passes the polishing liquid. Since gravity falls, there is a problem that the supply of the polishing liquid that can sufficiently contribute to the chemical reaction of polishing is reduced relative to the upper surface side. In addition, since rollers or shafts or the like for conveying the glass substrate in a horizontal direction are provided on the lower surface side, there is a problem in that the spray to the substrate surface is shielded.

In addition, although the allowable range of the uniformity of the plate thickness becomes smaller when the formed glass substrate becomes thin, a plate on the lower surface side where the polishing liquid is shielded by a device such as a roller conveyance may occur in particular. The thickness is not uniform, and in order to minimize it, it is necessary to consider the appropriate handling speed. However, when the conveying speed is increased, uneven feeding speed or uneven sliding conditions between the roller and the substrate may cause vibration on the substrate, and the thickness of the substrate may easily occur. Thinning can cause problems such as microcracks around the substrate. In addition, although the effect of preventing cracks and the like can be expected by reducing the pitch of roller conveyance, the area covered by the polishing liquid will increase, so there is uniformity of the thickness of the plate after polishing on the lower surface side of the substrate. Reduced problem points.

In addition, as a method of arranging the substrates vertically, there is Japanese Patent Application Laid-Open No. 2008-13389. Here, a technique has been disclosed in which an etching device capable of performing etching by ejecting a shower-like fluoric acid solution onto a glass substrate, and an etching process using the etching device, and appropriately designing a shower device The spray angle of the shower, the interval between the shower nozzle and the substrate, the swing amplitude length of the substrate, etc., can be uniformly supplied from the shower into the substrate surface, thereby suppressing fine particles (relative to fluoric acid (Insoluble matter) adheres to the surface of the substrate, and can achieve high-speed and uniform in-plane etching.

According to this method, although the above-mentioned problem that the polishing liquid is blocked by a conveying device such as a roller can be eliminated, the polishing liquid flows down while contacting the surface of the substrate installed in the vertical direction, so it is on the surface of the area above the substrate. The falling flow rate is slow and the flow rate is also fixed, but the polishing liquid dropped by the shower spray on the lower side of the substrate is continuously added, so the liquid volume will increase and the flow rate will increase. As a result, there is a problem that the polishing rate of the lower area of the substrate becomes high and the thickness of the plate changes between the upper and lower sides.

Furthermore, in Japanese Patent No. 3995146, the following technology has been disclosed: it simultaneously contains a certain concentration of a polishing component having a function of chemically polishing a glass substrate, and a thickener having a function of increasing the viscosity of a solution, and The polishing liquid having a viscosity in the range of 5 × 10 ^-1 to 5 × 10 ⁵ Pa˙s is applied only to a predetermined amount on a glass substrate to perform a flattening reaction on the glass substrate, and is washed after a predetermined time elapses. The polishing liquid supplied to the flattening reaction.

According to this method, although it is considered that the polishing liquid composed of a viscosity range of 5 × 10 ^-1 to 5 × 10 ⁵ Pa˙s can be prevented from flowing downward, and the thickness of the substrate above and below the substrate can be prevented from changing, From the viewpoint of polishing efficiency and the viewpoint of non-uniformity in thickness at the end portion due to the formation of jig marks by the jig, it is not necessarily a sufficient technique.

Therefore, it is desired to develop a polishing method and polishing method for a glass substrate that can be chemically polished so that a glass substrate used in a liquid crystal display or an organic EL display becomes a uniform thin film, and the polishing efficiency is improved, the occurrence of jig marks is suppressed, and the risk of breakage is suppressed. Device.

    [Previous Technical Literature]         [Patent Literature]    

Patent Document 1: Japanese Patent Application Laid-Open No. 2013-252984

Patent Document 2: Japanese Patent Application Laid-Open No. 2008-13389

Patent Document 3: Japanese Patent No. 3995146

An object of the present invention is to solve the above-mentioned problems, and to provide a chemical film capable of uniformly thinning a glass substrate used in a liquid crystal display or an organic EL display, improving the polishing efficiency, suppressing the occurrence of jig marks, and suppressing the risk of breakage. A method and apparatus for polishing a glass substrate with high polishing efficiency.

In order to achieve the above object, the method for polishing a glass substrate of the present invention is a method for polishing a glass substrate used for uniformly polishing the surface of a glass substrate used for a liquid crystal display or an organic EL display. The polishing method includes the following steps: The glass substrate is suspended by being vertically suspended to be fixed; and a chemical polishing process is performed by continuously spraying and coating the chemical polishing liquid for melting and polishing the glass substrate from a plurality of spray nozzles on both sides of the glass substrate; and The cleaning process is to clean the aforementioned glass substrate which has been melt-polished after a predetermined melting and polishing time; the aforementioned chemical polishing process is to prevent uneven spray coating of the chemical polishing liquid caused by the liquid flowing downward. Occurrence and residue, the vertical and horizontal intervals of the spray nozzles on the upper end of the glass substrate are arranged to be narrower than the lower end of the glass substrate to spray a large amount of the chemical polishing liquid on the upper end, and a small amount On the lower side.

The method for polishing a glass substrate of the present invention is a method for polishing a glass substrate that is used for uniformly polishing the surface of a glass substrate used for a liquid crystal display or an organic EL display. The polishing method includes the following steps: The substrate is suspended vertically to be fixed; and a chemical polishing process, which continuously sprays and applies chemical polishing liquid for melting and polishing the glass substrate from a plurality of spray nozzles on both sides of the glass substrate; and a cleaning process It is to clean the aforementioned glass substrate which has been melt-polished; the aforementioned chemical polishing process is to prevent the uneven and spraying of the spray coating of the chemical polishing liquid caused by the downward flow of the liquid, and it will be separated from the regular interval The amount of the chemical polishing liquid sprayed by the plurality of spray nozzles provided is equal to the amount of the chemical polishing liquid sprayed from the spray nozzle on the lower end side of the glass substrate than the amount of the chemical polishing liquid sprayed from the spray nozzle on the upper end side of the glass substrate. There are still few ways to spray.

The glass substrate is a glass substrate for a liquid crystal display or an organic EL display, in which liquid crystal is sealed in a gap between a CF (Color Filter) substrate and a TFT (Thin Film Transistor) substrate. Made of glass substrate.

The chemical polishing liquid contains one or a plurality of molten polishing components selected from the group consisting of hydrofluoric acid, sulfuric acid, and hydrochloric acid.

In addition, the method for polishing a glass substrate is performed by spray-coating a chemical polishing solution containing sulfuric acid to block and remove a potential flaw on the glass substrate.

The glass substrate polishing device of the present invention is a polishing device for uniformly polishing a glass substrate used on the surface of a glass substrate of a liquid crystal display or an organic EL display. The substrate is suspended vertically to set and be fixed; and a plurality of spray nozzles spraying and coating the chemical polishing liquid used to melt and grind the glass substrate on both sides of the glass substrate vertically and continuously; and a cleaning method, which It is to clean the glass substrate that has been melt-polished after a predetermined melt-polishing time; the spray nozzle is to prevent the unevenness and residue of the spray coating of the chemical polishing liquid caused by the liquid flowing downward, and The vertical or horizontal interval of the spray nozzles on the upper end of the glass substrate is set to be narrower than the vertical or horizontal interval of the spray nozzles on the lower end of the glass substrate, so that a large amount of the chemical polishing liquid is sprayed on the upper end. A small amount is sprayed on the lower end side.

The glass substrate polishing device of the present invention is a polishing device for uniformly polishing a glass substrate used on the surface of a glass substrate of a liquid crystal display or an organic EL display. The substrate is suspended vertically to set and be fixed; and a plurality of spray nozzles spraying and coating the chemical polishing liquid used to melt and grind the glass substrate on both sides of the glass substrate vertically and continuously; and a cleaning method, which It is to clean the glass substrate that has been melt-polished after a predetermined melt-polishing time; the spray nozzle is to prevent the unevenness and residue of the spray coating of the chemical polishing liquid caused by the liquid flowing downward, and The amount of the chemical polishing liquid sprayed from the plurality of spray nozzles arranged at equal intervals is equal to the amount of the chemical polishing liquid sprayed from the spray nozzle on the lower end side of the glass substrate, compared to the amount of chemical sprayed from the spray nozzle on the upper end side of the glass substrate. The amount of the polishing liquid is still small to spray.

In addition, the aforementioned setting means is composed of side edge fixing means for supporting the left and right edge ends of the glass substrate and bottom edge fixing means for supporting the lower edge end of the glass substrate; and the above-mentioned side fixing means is formed on both sides of the uncoated glass substrate. Positioned in contact with the corners of the left and right edges of the glass substrate, and formed by a shallow groove with a generally triangular cut in the cross section clamped from both ends; the aforementioned bottom edge fixing means is a base for placing the bottom edge of the glass substrate Made up.

Furthermore, the plurality of ports before the spray nozzles provided at equal intervals in the aforementioned spray nozzles are formed to have a larger port diameter before the spray nozzles on the upper end side and a smaller port diameter before the spray nozzles on the lower end side.

Since the method and apparatus for polishing a glass substrate of the present invention have the same structure as described above, they have the following effects.

1. Since the chemical polishing liquid is spray-coated from both sides by a plurality of spray nozzles onto the glass substrate suspended by the installation process, the chemical polishing liquid can be applied to the glass substrate without leakage. In addition, because the vertical or horizontal interval of the spray nozzles on the upper end side of the glass substrate is arranged to be narrower than the lower end of the glass substrate, it is possible to prevent the non-uniform spray coating of the chemical polishing liquid caused by the downward flow of the liquid and the Residual.

2. It is a structure that the upper end side of the glass substrate is sprayed more than the amount of the chemical polishing liquid sprayed from the plurality of spray nozzles, so that the chemical caused by the liquid flowing downward can be prevented. Non-uniform spray coating of the polishing liquid occurs and remains.

3. Since the glass substrate is a glass substrate for a liquid crystal display or a glass substrate for an organic EL display, the glass substrate used in various displays can be polished.

4. Because the chemical polishing liquid contains molten polishing ingredients such as hydrofluoric acid, sulfuric acid, and hydrochloric acid, it is possible to use hydrochloric acid-based polishing liquids with a small specific gravity to sulfuric acid-based polishing liquids with a high specific gravity.

5. Since the chemical polishing liquid containing sulfuric acid is spray-coated, it is possible to enjoy the effect of suppressing the polishing in the recessed portion during polishing for potential flaws or abnormalities (pits) generated on the glass substrate.

6. A plurality of spray nozzles for spraying and coating the chemical polishing liquid on both sides of the glass substrate suspended by the setting means are provided, so that the chemical polishing liquid can be applied to the glass substrate without leaking. In addition, because the vertical or horizontal interval of the spray nozzles on the upper end side of the glass substrate is arranged to be narrower than the lower end of the glass substrate, it is possible to prevent the non-uniform spray coating of the chemical polishing liquid caused by the downward flow of the liquid and the Residual. In addition, it is possible to achieve space saving of the device, and it is possible to configure a polishing device by modifying or coping with a part of a conventional polishing device (batch method).

7. The plurality of spray nozzles for spraying the chemical polishing liquid form a structure in which the upper end side of the glass substrate is sprayed more than the amount on the lower end side, so the spray coating of the chemical polishing liquid caused by the liquid flowing downward can be prevented. Unevenness occurs and remains.

8. The installation means is constituted by a side edge fixing means constituted by a shallow groove with a cutout having a substantially triangular cross section, and a bottom edge fixing means constituted by a mounting base on which the bottom edge of the glass substrate is placed. Therefore, it is possible to suppress the occurrence of jig marks generated by chemical polishing.

9. Due to the ports before the plurality of injection nozzles, the upper end side is made larger and the lower end side is made smaller. Therefore, it is possible to prevent the non-uniformity and residue of the spray coating of the chemical polishing liquid caused by the liquid flowing downward.

10‧‧‧ glass substrate

12‧‧‧CF substrate

14‧‧‧TFT substrate

16‧‧‧ LCD

20‧‧‧ chemical polishing liquid

100‧‧‧Glass substrate grinding method

110‧‧‧Set up process

120‧‧‧ chemical grinding process

130‧‧‧washing process

200‧‧‧ glass substrate grinding device

210‧‧‧ Setting means

212‧‧‧side fixation

214‧‧‧Bottom fixing method

220, 220a, 220b ‧‧‧jet nozzle

230‧‧‧washing means

240‧‧‧Frame

FIG. 1 is a flowchart of a method for polishing a glass substrate according to the present invention.

FIG. 2 is a conceptual diagram of a polishing device for a glass substrate.

Fig. 3 is a sectional view of a side surface of a glass substrate.

FIG. 4 is a side view of an injection nozzle with an optimally arranged interval.

FIG. 5 is a side view of a spray nozzle that optimizes the spray amount of the polishing liquid.

FIG. 6 is a perspective view showing the structure of the setting means.

Hereinafter, a method 100 and a polishing apparatus 200 for polishing a glass substrate according to the present invention will be described in detail based on examples shown in the drawings.

FIG. 1 is a flowchart of a method for polishing a glass substrate of the present invention, and FIG. 2 is a conceptual diagram of a polishing device for a glass substrate. FIG. 3 is a cross-sectional view of a side surface of a glass substrate, and FIG. 4 is a side view of an injection nozzle with an optimal interval. FIG. 5 is a side view of a spray nozzle that optimizes the spray amount of the polishing liquid, and FIG. 6 is a perspective view showing the structure of the installation means.

As shown in FIG. 1, the glass substrate polishing method 100 of the present invention is composed of a polishing method 100, a chemical polishing process 120, and a cleaning process 130, and is used for polishing liquid crystal displays or organic materials with a uniform and uniform thickness. A method for polishing the surface of the glass substrate 10 of an EL display.

The glass substrate 10 to be polished is first placed in a state capable of being processed in the setting process 110. The setting process 110 refers to a process of hanging the glass substrate 10 vertically to fix the setting. The glass substrate 10 is composed of a thickness of 1 mm to several mm before polishing. By this process, the glass substrate 10 as an object to be polished can be fixed by a jig until the polishing is completed.

Next, as shown in FIG. 1, the glass substrate 10 fixedly installed in the setting process 110 is processed in the chemical polishing process 120. The chemical polishing process 120 refers to a process of melting and polishing the glass substrate 10 by using the chemical polishing liquid 200. The plurality of spray nozzles 220 are directed toward the glass substrate 10 disposed vertically, and the chemical polishing liquid is spray-coated on both sides from all sides. 20, whereby the glass substrate 10 is melt-polished. In this embodiment, the chemical polishing liquid 20 is continuously spray-coated from a plurality of spray nozzles 220 on both sides of the glass substrate 10 during a certain period of time. The sprayed chemical polishing liquid 20 is applied to the glass substrate 10 and then flows through the glass substrate 10 and accumulates in a waste liquid accumulation means (not shown) provided in the lower portion. Thereby, the chemical polishing liquid 20 can be continuously sprayed on the glass substrate 10 for continuous polishing, and efficient chemical polishing can be performed.

Furthermore, in this embodiment, although the processing of the chemical polishing process 120 is performed continuously for about 5 minutes to 120 minutes, it is not limited to this processing time, and it may be not constant but at a certain interval. To process intermittently (intermittently).

Next, the glass substrate 10 subjected to the chemical polishing process in the chemical polishing process 120 is processed in the cleaning process 130 shown in FIG. 1. The cleaning process 130 refers to a process for cleaning and removing the chemical polishing liquid 20 and the reaction product adhered to the surface of the glass substrate 10 after being dissolved and polished. After the predetermined melting and polishing time by the chemical polishing process 120 has passed, the glass substrate 10 after the melting and polishing is cleaned. Thereby, the progress of the chemical polishing can be interrupted to complete the polishing process.

The chemical polishing process 120 and the cleaning process 130 of the glass substrate 10 can be repeatedly performed. Thereby, the polishing and cleaning effects of the glass substrate 10 can be improved. Furthermore, although the chemical polishing liquid 20 used in the chemical polishing process 120 and the cleaning liquid (not shown) of the chemical polishing liquid 20 used in the cleaning process 130 are used, both of them flow to Waste liquid accumulation means, but in order to suppress mixing of the two, it is also possible to form a structure in which waste liquid piping is switched by each process. By having such a structure, waste liquid can be reused efficiently.

As a technique used conventionally, as mentioned above, although there is a chemical polishing method in which a glass substrate is placed in a horizontal direction and is applied in a shower method from above and below while conveying a polishing liquid, as long as it is the final processing The thickness of the substrate is, for example, a glass substrate product having a thickness of about 0.3 mm, and the problem of unevenness of the plate thickness due to the difference in the polishing characteristics of the upper and lower surfaces, that is, the difference in the polishing speed, and the like does not occur.

However, in glass substrate products that are required to be thinner than 0.3 mm, when the plate thickness is, for example, about 0.25 mm, the thickness of the single board to be bonded will be about 0.125 mm before and after the substrate. When it becomes thin, especially the intensity | strength of the board | substrate edge part will fall sharply. For this reason, there is a problem that a difference occurs in the thickness of the upper and lower plates due to the influence of the difference in the polishing characteristics of the upper substrate and the lower substrate. Moreover, even in such a situation, in order to maintain the specification value of the total thickness of the substrate, the thinner substrate must be thinner and finally processed, resulting in the total thickness having to be included in the specification value. And the problem of the strength of the substrate, in particular the problem of the strength of the end portion of the substrate becoming low.

According to the present invention, such a problem can be eliminated by arranging the glass substrate 10 in the vertical direction, and chemical polishing can be performed uniformly on any side, and polishing to match the required specifications can be eliminated. As a result, the glass substrate can be eliminated. The problem of impaired strength.

In this embodiment, the chemical polishing process 120 has a structure in which the vertical or horizontal intervals of the spray nozzles 220 on the upper end side of the glass substrate 10 are arranged to be narrower than the lower end of the glass substrate 10. The chemical polishing liquid 20 is spray-coated on the glass substrate 10. With this configuration, a large amount of the chemical polishing liquid 20 can be spray-coated on the upper end of the glass substrate 10, and a small amount can be sprayed on the lower end side of the glass substrate 10.

In the case where the chemical polishing liquid 20 is spray-coated in a state where the glass substrate 10 is vertically installed, the chemical polishing liquid 20 flows down while contacting the surface of the glass substrate 10 installed in the vertical direction. The area above the 10 has a slower flow rate and a constant flow rate. However, the chemical polishing liquid 20 dropped by spray coating on the lower side of the glass substrate 10 is continuously applied, so the liquid The amount will increase and the flow rate will increase. As a result, since the polishing rate of the lower region of the glass substrate 10 becomes high, a problem arises that the plate thickness becomes uneven between the upper and lower portions of the glass substrate 10.

According to this embodiment, a large amount of the chemical polishing liquid 20 is spray-coated on the upper portion of the glass substrate 10, and a small amount of the chemical polishing liquid 20 is coated on the lower portion, so that the upper and lower chemical polishing liquid 20 can be applied. Optimizing the amount of cloth and circulation can prevent the uneven and uneven spray coating of the chemical polishing liquid 20 caused by the liquid flowing downward, and can suppress the uneven thickness of the polishing.

As another embodiment of the method 100 for polishing a glass substrate of the present invention, after a plurality of spray nozzles 220 are provided at equal intervals with respect to the glass substrate 10, the chemical sprayed from the plurality of spray nozzles 220 is controlled. The amount of the polishing liquid 20 is sprayed more than the amount of the chemical polishing liquid 20 sprayed from the spray nozzle 220 b located on the lower end side of the glass substrate 10 than that of the chemical polishing sprayed from the spray nozzle 220 a on the upper end side of the glass substrate 10. The amount of liquid 20 is still small.

As described above, when the chemical polishing liquid 20 is spray-coated equally on the upper and lower regions of the glass substrate 10, the polishing rate of the lower region of the glass substrate 10 becomes lower than that of the upper region of the glass substrate 10. Since it is high, there exists a problem that plate | board thickness becomes non-uniformity between the upper and lower sides of the glass substrate 10. According to the configuration of the present invention, a large amount of the chemical polishing liquid 20 is spray-coated on the upper portion of the glass substrate 10, and a small amount of the chemical polishing liquid 20 is coated on the lower portion, so that the chemical polishing liquid 20 between the upper and lower portions can be changed. The amount of coating and distribution is optimized, which can prevent the unevenness of the spray coating of the chemical polishing liquid 20 caused by the liquid flowing downward and the residue, and can suppress the unevenness of the polishing thickness.

In addition, as shown in FIG. 3, the glass substrate 10 of this embodiment is a glass substrate for a liquid crystal display which can be used to seal the liquid crystal 16 in the gap between the CF substrate 12 and the TFT substrate 14. It is needless to say that a glass substrate for an organic EL display can be used.

Thereby, the glass substrate used for various displays can be grind | polished and manufactured, and the polishing method 100 which can respond | correspond to all the glass substrates required can be comprised.

In addition, a liquid crystal display is formed by bonding two substrates of a CF substrate and a TFT substrate to form a uniform thickness of the liquid crystal, forming a gap in the substrate, and sealing the liquid crystal in the gap. Finally, a manufacturing method in which the bonded substrates are chemically polished (etched) from both sides to make them thinner. Although the final processing thickness (thickness of the finished product) after the polishing is generally about 0.3 mm to 0.6 mm, the market demand in recent years, especially the requirement to reduce the thickness of the substrate, has increased the final processing ratio. 0.3mm thin product. By grinding the bonded substrate to a thinner thickness, for example, a touch panel can be built into the substrate, and products having various functions can be developed together.

The chemical polishing liquid 20 can be a liquid material containing one or a plurality of molten polishing components selected from the group consisting of hydrofluoric acid, sulfuric acid, and hydrochloric acid. Thereby, it is possible to use a hydrochloric acid-based polishing liquid with a small specific gravity to a sulfuric acid-based polishing liquid with a high specific gravity, and it is possible to use all the chemical polishing liquids 20 according to the thickness of the object to be polished or the polishing speed, and it is possible to perform highly efficient glass Polishing of substrates.

In particular, as an example of the polishing method 100 of the glass substrate of the present invention, the chemical polishing liquid 20 containing sulfuric acid can be spray-coated. Thereby, the effect of blocking potential scars of the glass substrate 10 can be additionally obtained, and the effect of preventing damage cracks due to the existing slight damage can be obtained. Moreover, it is possible to enjoy the effect | action which suppresses the grinding | polishing in the recessed part at the time of a latent flaw or an abnormality (crater) produced in the glass substrate 10 during grinding | polishing.

Next, the polishing apparatus 200 of the glass substrate of this invention is demonstrated. As shown in FIG. 2, the glass substrate polishing device 200 is composed of a setting device 210, a spray nozzle 220, and a cleaning device 230 for uniformly and uniformly polishing the glass substrate 10 used for a liquid crystal display or an organic EL display. surface.

The setting means 210 refers to a means for setting and fixing the glass substrate 10 as the object to be polished by hanging vertically. As shown in FIG. 2, in this embodiment, the setting means 210 is provided on the frame 240. A structure in which both upper and lower side surfaces and the bottom of the glass substrate 10 are fixed to the frame 240 is provided. The glass substrate 10 has a thickness of 1 mm to several mm before grinding; the glass substrate 10 is fixed by a fixture of the setting means 210 until the grinding is completed. In addition, the installation means 210 does not necessarily need to be provided in the frame 240, and may be formed into a structure using a frame jig (not shown) or the like dedicated to supporting the glass substrate 10 having the same function. It is also possible to consider a configuration in which the installation means 210 is provided in the frame jig, and the same effect can be expected even with this configuration.

The spray nozzle 220 refers to spray-coating a chemical polishing liquid 20 for melt polishing (chemical polishing) the glass substrate 10 on a thin opening portion for the glass substrate 10, and as shown in FIG. 2, FIG. 4, and FIG. A plurality of positions where the chemical polishing liquid 20 is vertically sprayed on the glass substrate 10 are provided, and the chemical polishing liquid 20 is sprayed on both sides of the glass substrate 10 uniformly and continuously. Thereby, the chemical polishing liquid 20 can be spray-coated on both sides of the glass substrate 10, and the glass substrate 10 can be melt-polished (chemically polished).

In the present embodiment, the plurality of spray nozzles 220 are configured to spray and apply the chemical polishing liquid 20 to both sides of the glass substrate 10 continuously for a certain period of time. The sprayed chemical polishing liquid 20 is applied to the glass substrate 10 and then flows through the glass substrate 10 and accumulates in a waste liquid accumulation means (not shown) provided in the lower portion. By having such a structure, the chemical polishing liquid 20 can always be sprayed on the glass substrate 10, and the glass substrate 10 can continuously perform chemical polishing over the entire surface and perform efficient chemical polishing.

In addition, in this embodiment, the chemical polishing liquid 20 is sprayed and applied to the glass substrate 10 from the spray nozzle 220 continuously for about 5 minutes to 120 minutes, but it is not limited to this processing time, and It is also possible to form a structure that is not continuous but is processed intermittently (intermittently) at a certain interval.

The cleaning means 230 refers to a method of washing the glass substrate 10 that has been melt-polished with the chemical polishing liquid 20 and washing away the chemical polishing liquid 20, and is a method for attaching the glass substrate that has been dissolved and polished Means for washing and removing the chemical polishing liquid 20 and the reaction product on the surface of 10 After the chemical polishing liquid 20 is sprayed from the spray nozzle 220 to perform melt polishing (chemical polishing) for a predetermined period of time, the cleaning liquid is sprayed onto the glass substrate 10 after being melt-polished to be washed. Thereby, the progress of the chemical polishing can be interrupted to complete the polishing process.

The dissolving and polishing process of the glass substrate 10 caused by the spray application of the chemical polishing liquid 20 from the spray nozzle 220 and the cleaning process of the glass substrate 10 caused by the cleaning means 230 can be formed to be repeatedly performed. . Thereby, the polishing and cleaning effects of the glass substrate 10 can be improved. In addition, although the chemical polishing liquid 20 spray-coated from the spray nozzle 220 and the cleaning liquid (not shown) of the chemical polishing liquid 20 used in the cleaning means 230 are both, it flows either. Although it is a waste liquid accumulation means (not shown), in order to suppress mixing and discarding of both, it can also be set as the structure which switches waste liquid pipes. With this structure, waste liquid can be efficiently discarded or reused.

In addition, the cleaning means 230 may be configured to switch the method of supplying the chemical polishing liquid 20 and spray the cleaning liquid (not shown) from the spray nozzle 220 to spray the glass substrate 10 to perform a cleaning process. . The glass substrate 10 can also be sprayed and supplied with another cleaning liquid supply pipe (supply nozzle (not shown)) using another cleaning liquid supply pipe (supply nozzle, not shown), and is not particularly limited to the spraying and supplying of the cleaning liquid. method.

In this embodiment, as shown in FIG. 4, the ejection nozzles 220 are arranged such that the ejection nozzles 220 a located on the upper end side of the glass substrate 10 are spaced apart vertically or horizontally from the ejection nozzles located on the lower end side of the glass substrate 10. 220b has a narrow vertical or horizontal interval. With such a configuration, a configuration in which a large amount of the chemical polishing liquid 20 is sprayed on the upper end side of the glass substrate 10 and a small amount is sprayed on the lower end side of the glass substrate 10 can be formed. Thereby, it is possible to prevent the non-uniformity of the spray coating of the chemical polishing liquid 20 caused by the liquid flowing downward and to remain, and to suppress the non-uniformity of the polishing thickness.

That is, as in the polishing apparatus of the present invention, in a state where the glass substrate 10 is vertically installed, the chemical polishing liquid 20 is sprayed and applied to the glass substrate 10 from the horizontal direction, and the chemical polishing liquid 20 is formed. It will flow on the surface of the glass substrate 10 installed in the vertical direction. At this time, the flow velocity falling on the surface of the region on the upper side of the glass substrate 10 is slow and the flow rate is constant. However, the lower side of the glass substrate 10 is matched with the chemical polishing liquid 20 sprayed directly, and is spray-coated. The chemical polishing liquid 20 on the upper part of the glass substrate 10 is continuously flowing in a state of being continuously applied. Therefore, the amount of the liquid flowing on the surface under the glass substrate 10 increases and the flow velocity becomes high. As a result, since the polishing rate of the lower region of the glass substrate 10 becomes high, a problem occurs in that the thickness of the glass substrate 10 becomes non-uniform.

According to this embodiment, since a large amount of the chemical polishing liquid 20 is spray-coated on the upper portion of the glass substrate 10 and a small amount of the chemical polishing liquid 20 is applied on the lower portion, the chemical polishing liquid 20 above and below the glass substrate 10 can be applied. The amount of coating and distribution is optimized, which can prevent the unevenness of the spray coating of the chemical polishing liquid 20 caused by the liquid flowing downward and the residue, and can suppress the unevenness of the polishing thickness.

As another example of the polishing device 200 for a glass substrate of the present invention, as shown in FIG. 5, it can be formed into a structure in which a plurality of spray nozzles 220 are provided at equal intervals with respect to the glass substrate 10. The amount of the chemical polishing liquid 20 sprayed from the plurality of spray nozzles 220 is controlled so that the amount of the chemical polishing liquid 20 sprayed from the spray nozzle 220 b located on the lower end side of the glass substrate 10 is formed to be larger than that of the chemical polishing liquid 20 located on the glass substrate 10. The amount of the chemical polishing liquid 20 sprayed by the spray nozzle 220a on the upper end side is still small.

As described above, when the chemical polishing liquid 20 is spray-coated uniformly on the upper and lower regions of the glass substrate 10, the area above the glass substrate 10 is related to the application amount and flow rate of the chemical polishing liquid 20. In comparison, since the polishing rate of the lower region of the glass substrate 10 becomes higher, a problem occurs in that the plate thickness changes between the upper and lower sides of the glass substrate 10. According to the above configuration, a large amount of the chemical polishing liquid 20 is spray-coated on the upper portion of the glass substrate 10, and a small amount of the chemical polishing liquid 20 is coated on the lower portion, so that the coating and circulation of the chemical polishing liquid 20 between the upper and lower portions can be performed. Optimizing the amount can prevent the non-uniformity of the spray coating of the chemical polishing liquid 20 caused by the liquid flowing downward and the residue, and can suppress the non-uniformity of the polishing thickness.

As shown in FIG. 6, the installation means 210 can be formed by a side fixing means 212 and a bottom fixing means 214. The side fixing means 212 refers to a member for supporting and fixing the left and right edge ends of the glass substrate 10. In this embodiment, it refers to covering both sides of the glass substrate 10 and not hindering the chemical polishing liquid 20. In the spray coating method, the glass substrate 10 is sandwiched from both ends while contacting the corners of the left and right edges of the glass substrate 10, and the shape is formed by a shallow groove with a substantially triangular cross-section.

Conventionally, when the glass substrate 10 is chemically polished and the glass substrate 10 is fixed, the glass substrate 10 is fixedly clamped by a fixing means composed of a deep groove. With this configuration, the fixing means partially covers both sides of the glass substrate 10, and the spray coating of the chemical polishing liquid 20 is hindered, and the marks of the jig for pressing the glass substrate 10 are formed at the left and right ends of the glass substrate 10. Problems in the ministry area.

According to the present invention, by forming the side fixing means 212 into a shallow groove with a substantially triangular cross-section and forming the length of the side fixing means 212 to be short, it is possible to constitute a spray coating that does not hinder the chemical polishing liquid 20, Moreover, the grinding | polishing apparatus 200 of the glass substrate which suppresses the residue of a jig mark is suppressed.

The bottom edge fixing means 214 refers to a member for supporting the lower end edge of the glass substrate 10 and is configured by a mounting base on which the bottom edge of the glass substrate 10 is placed.

Conventionally, similar to the side fixing means 212, the bottom part of the glass substrate 10 is fixed by the fixing means which consists of a deep groove. Although the glass substrate 10 is firmly fixed with such a structure, the glass substrate 10 can be prevented from falling off during chemical polishing due to bubbling or the like. However, there are causes for the formation of jig marks and glass. Problems in the cause of damage to the substrate 10.

In the present invention, by forming the bottom edge fixing means 214 in the shape of a base for mounting, it is possible to form a structure in which the spray coating of the chemical polishing liquid 20 is not hindered, and to suppress the pinch due to the fixing means. The structure of the grinding | polishing apparatus 200 of the glass substrate which hold | maintains the damage | damage of the glass substrate 10 is hold | maintained.

As still another embodiment of the polishing device 200 for a glass substrate of the present invention, the ports before the plurality of spray nozzles 220 provided at equal intervals can be formed to have a larger port diameter before the spray nozzles 220a on the upper end side. The lower end side of the injection nozzle 220b has a smaller port diameter. Even with this configuration, as described above, a large amount of the chemical polishing liquid 20 is spray-coated on the upper portion of the glass substrate 10, and a small amount of the chemical polishing liquid 20 is coated on the lower portion. The amount of coating and circulation of 20 is optimized, and it is possible to prevent the unevenness of the spray coating of the chemical polishing liquid 20 caused by the liquid flowing downward, and to prevent the unevenness of the polishing thickness.

With the above configuration, the glass substrate 10 can be more efficiently polished than a method of immersing the glass substrate in a conventional solution to perform a bubbling treatment.

The non-uniform thickness of the glass substrate 10 after the chemical polishing is necessary to decrease as the final processing thickness becomes thinner. For example, if the plate thickness at the start of grinding is set to 1 mm, the final plate thickness is set to 0.4 mm, and the allowable value of the non-uniformity of the plate thickness is set to 10% of the final processed thickness, the non-uniformity is allowed. The value is equal to or less than 0.04 mm. On the other hand, when the polishing amount is 0.6 mm, and the non-uniformity of the thickness of the substrate before polishing is assumed to be zero, in order to perform the 0.6 mm polishing process, the allowable rate of the non-uniformity within 0.04 mm is realized in the entire substrate. It is 0.067 (permissible non-uniformity / polishing amount).

When the final processing of 0.3 mm is performed, when the allowable range of the unevenness is set to 10% of the final processing thickness, it becomes 0.03 mm or less. Although the polishing amount is 0.7 mm, the allowable non-uniformity relative to the polishing amount is 0.03 mm, the allowable rate is 0.043 (permissible non-uniformity / polishing treatment amount), and the final processing of 0.4 mm requires stricter requirements. Value. In addition, when the final processing thickness is 0.25 mm, the allowable non-uniformity with respect to the polishing amount of 0.75 mm is 0.025, and the allowable rate is 0.033 (permissible non-uniformity / polishing treatment amount). It is the slight unevenness that cannot be ignored.

In the case of polishing a liquid crystal display, even if the difference in thickness between the CF-side substrate and the TFT-side substrate is required, the required error is slight. For example, in the case of polishing a 1 mm liquid crystal display, when a difference of about 1% of the polishing amount occurs in each plate thickness, a difference of 6% of 1% of the polishing amount of 600 μ occurs in the case of 0.4 mm final processing. In the case where the overall allowable amount is plus or minus 40 μ and the allowable range is set to 80 μ, the allowable range actually becomes 74 μ (80-6) when the difference between the board thicknesses of both substrates is 6 μ.

Similarly, in the case of 0.3mm final processing, it is 53μ (60-7) after deducting 1% of the polishing amount from 60μ in the allowable range, and when the final processing thickness is set to 0.25mm, it is 50μ in the allowable range. After deducting 7.5μ, which is 1% of the polishing amount, it becomes 42.5μ (50-7.5), and as the structure is thinner, it is necessary to strictly suppress unevenness.

Moreover, in the case of 0.25μ final processing, although the CF-side and TFT-side substrates can be final processed at 0.125mm as long as there is no difference in the thickness of each substrate, when there is a difference in the thickness of each substrate, In the case where there is unevenness on the thinner side, there is a problem that the strength becomes weak. When the plate thickness is about 0.1 mm (100 μ), the strength of the end portion of the substrate becomes relatively weak, and the risk of damage is increased.

For example, in the manufacturing process where the final processing thickness is about 0.3mm to 0.6mm, currently increasing thinner substrates to the extent that uneven demand hardly poses a problem, especially in the case of producing products below 0.3mm, is becoming a problem. It is strictly required to suppress the uneven state of the polishing amount.

By using the polishing method and the polishing device of the glass substrate of the present invention, the above-mentioned unevenness can be suppressed, and compared with the conventional bubbling method or other prior technologies, a method capable of manufacturing more A polishing method and a polishing device for a glass substrate that are efficient and free of uneven products that can suppress uneven polishing thickness.

Claims (9)

    A method for polishing a glass substrate is a method (100) for polishing a glass substrate used uniformly on the surface of a glass substrate of a liquid crystal display or an organic EL display. The method is characterized by comprising a setting process (110), A glass substrate (10) is suspended vertically to be fixed; and a chemical polishing process (120) is a method of continuously spraying and coating a chemical polishing liquid (20) for melting and polishing the glass substrate from a plurality of spray nozzles (220). It is disposed on both sides of the aforementioned glass substrate; and a cleaning process (130), which cleans the aforementioned glass substrate that has been melt-polished after a predetermined melting and polishing time; the aforementioned chemical polishing process (120) is to prevent The unevenness of the spray coating of the chemical polishing liquid caused by the downward flow of the liquid occurs and remains, and the vertical or horizontal interval of the spray nozzle (220) on the upper end side of the glass substrate (10) is narrower than the lower end of the glass substrate The method is configured to spray a large amount of the chemical polishing liquid on the upper end side and a small amount of the chemical polishing liquid on the lower end side.         A method for polishing a glass substrate is a method (100) for polishing a glass substrate used uniformly on the surface of a glass substrate of a liquid crystal display or an organic EL display. The method is characterized by comprising a setting process (110), The glass substrate is suspended vertically to be set and fixed; and a chemical polishing process (120), which continuously sprays and applies a chemical polishing liquid for melt-polishing the glass substrate from a plurality of spray nozzles (220) onto the glass substrate. Both sides; and a cleaning process (130), which cleans the aforementioned glass substrate which has been melt-polished; the aforementioned chemical polishing process (120), in order to prevent the spray coating of the chemical polishing liquid caused by the liquid flowing downward The unevenness of cloth occurs and remains, and the amount of the chemical polishing liquid sprayed from the plurality of spray nozzles (220) arranged at equal intervals is compared with the amount of the chemical polishing liquid sprayed from the spray nozzles on the lower end side of the glass substrate. The amount of the chemical polishing liquid sprayed from the spray nozzle on the upper end side of the glass substrate is sprayed so that the amount is small.         For example, the method for polishing a glass substrate according to item 1 or 2 of the application, wherein the glass substrate (10) is a glass for a liquid crystal display device in which liquid crystal is sealed in a gap between the CF substrate (12) and the TFT substrate (14). A substrate or a glass substrate for an organic EL display.         For example, the method for polishing a glass substrate according to item 1 or 2 of the patent application scope, wherein the aforementioned chemical polishing liquid (20) contains one or more molten polishing components selected from the group consisting of hydrofluoric acid, sulfuric acid, and hydrochloric acid. .         For example, the method for polishing a glass substrate according to item 1 or 2 of the patent application scope, wherein the method (100) for polishing the glass substrate is to apply a chemical polishing solution (20) containing sulfuric acid to block and remove the glass substrate. Potential scars.         A glass substrate polishing device is a polishing device (200) for uniformly polishing a glass substrate used on the surface of a glass substrate of a liquid crystal display or an organic EL display. The polishing device (200) is characterized by comprising: a setting means (210); The glass substrate (10) is suspended vertically to be fixed; and a plurality of spray nozzles (220) are formed by applying a chemical polishing liquid (20) for melting and polishing the glass substrate (10) to the glass substrate (10). Both sides are spray-coated vertically and continuously; and a cleaning means (230), which cleans the glass substrate that has been melt-polished after a predetermined melt-polishing time; the spray nozzle (220) is used to prevent The unevenness of the spray coating of the chemical polishing liquid (20) caused by the downward flow of the liquid occurs and remains, and the vertical or horizontal interval of the spray nozzle (220a) on the upper end of the glass substrate is longer than the spray nozzle on the lower end of the glass substrate (220b) is arranged in such a manner that the vertical interval or the horizontal interval is still narrow, and a large amount of the chemical polishing liquid is sprayed on the upper end side, and a smaller amount is sprayed on the lower end side.         A glass substrate polishing device is a polishing device (200) for uniformly polishing a glass substrate used on the surface of a glass substrate of a liquid crystal display or an organic EL display. The polishing device (200) is characterized by comprising: a setting means (210); The glass substrate (10) is suspended vertically to be fixed; and a plurality of spray nozzles (220) are used to vertically and continuously apply a chemical polishing liquid for melt grinding the glass substrate (10) to both sides of the glass substrate Spray coating; and a cleaning means (230), which cleans the glass substrate that has been melt-polished after a predetermined melt-polishing time; the spray nozzle (220) is for preventing the liquid from flowing downward Occurrence and residue of the non-uniform spray coating of the chemical polishing liquid (20), and the amount of the chemical polishing liquid sprayed from a plurality of spray nozzles (220) arranged at equal intervals, from the spray nozzles on the lower end side of the glass substrate (220b) The amount of the chemical polishing liquid sprayed is sprayed in a manner that the amount of the chemical polishing liquid sprayed from the spray nozzle (220a) on the upper end side of the glass substrate is smaller.         For example, the device for polishing a glass substrate according to item 6 or 7 of the patent application, wherein the aforementioned setting means (210) is a side edge fixing means (212) supporting the left and right edges of the glass substrate and a bottom edge supporting the lower edge of the glass substrate. The fixing means (214) is constituted; the side fixing means (212) is a cross section that is in contact with the corners of the left and right edges of the glass substrate at positions on both sides of the uncovered glass substrate (10) and is clamped from both ends A substantially triangular notch is formed by a shallow groove; the aforementioned bottom edge fixing means (214) is composed of a base for placing the bottom edge of the glass substrate (10).         For example, the polishing device for a glass substrate according to item 6 or 7 of the patent application, wherein the plurality of front ports of the spray nozzles (220) provided at equal intervals are formed by forming the front port diameter of the upper side spray nozzles (220a). The larger the diameter is, the smaller the port diameter is before the injection nozzle (220b) on the lower end side.