TW201816410A - Electronic component conveying device and electronic component inspection device - Google Patents

Abstract

Provided is an electronic component conveying apparatus and an electronic component inspection apparatus capable of locally spraying ionized, dry air on a target. The electronic component conveying apparatus comprises a dry air supply unit 3A capable of supplying dry air DA, an ion generation unit capable of ionizing the dry air, a spray unit 5A capable of spraying the dry air (ionized air IA) ionized by the ion generation unit, a temperature adjustment unit 12 that, as an electronic component disposition unit, capable of disposing and cooling an IC device 90, which is an electronic component, and a storage unit 8A that is capable of storing the temperature adjustment unit 12 and that has an opening 841 through which the IC device 90 can pass, wherein the spray unit 5A comprises at least one spray opening 511 capable of spraying the ionized air IA on the interior of the storage unit 8A.

Description

Electronic component transfer device and electronic component inspection device

The invention relates to an electronic component conveying device and an electronic component inspection device.

Conventionally, there has been known an electronic component inspection device that inspects (tests) the electrical characteristics of electronic components such as semiconductor elements (for example, IC devices). In this electronic component inspection apparatus, there is a person who is in contact with the ionized air jet while heating the electronic component in the inspection socket (for example, refer to Patent Document 1). In addition, the electrostatic neutralization of the electronic component is performed by the contact of the ionized spray air. An electronic component transfer device for transferring an IC device is incorporated in the electronic component inspection device (for example, refer to Patent Document 2). Moreover, in the electronic component inspection device, a plurality of IC devices are placed on a tray, and the tray is transferred into the device together with the tray, and the tray is transported to the inspection section by the transport section. When the inspection is completed, the IC device is placed on a tray, and the IC device is transported together with the tray to be discharged to the outside of the device. In such an electronic component conveying device, a door (opening / closing section) is provided on the outermost cover. For example, when the operation of the conveying section is stopped or maintenance is performed for some reason, the operator sometimes opens the door. . [Prior Art Literature] [Patent Literature] [Patent Literature 1] Japanese Patent Laid-Open No. 2010-223588 [Patent Literature 2] Japanese Patent Laid-Open No. 11-111802

[Problems to be Solved by the Invention] However, in the electronic component inspection device described in Patent Document 1, since a specific interior is filled with ionized spray air, it is necessary to locally cool the electronic component, for example. In the case of blowing ionized spray air, it cannot be performed. Further, in the electronic component inspection device described in Patent Document 2, even if the operator is not in a state where it is not appropriate to open the door, for example, when the electronic component inspection device is filled with cooling gas or the internal temperature becomes relatively high, the operator is difficult Determine whether the door can be opened. [Technical means for solving the problem] The present invention has been completed to solve at least a part of the problems described above, and can be implemented as the following forms or application examples. [Application Example 1] The electronic component transfer device of this application example includes a dry air supply unit that can supply dry air, an ion generation unit that can ionize the dry air, and an injection unit that can spray the ionization. Dry air; an electronic part disposing section that can dispose and cool electronic parts; and a storage section that can accommodate the electronic part disposing section and has an opening through which the electronic part can pass; and the spraying section has an The inside of the accommodating part sprays at least one ejection port of the ionized dry air. The electronic component conveying device of this application example can locally spray the ionized dry air to the target by appropriately setting the position of the ejection outlet, and therefore, it can perform static elimination on the target. Moreover, since the storage section is filled with dry air from the dry air supply section, it is possible to prevent the ionized dry air from reducing the effect of removing static electricity due to moisture. [Application Example 2] In the electronic component transfer device described in the application example, it is preferable that the storage unit is included in an exterior of the electronic component transfer device. Thereby, the dry air from the dry air supply portion can easily be filled with a portion necessary for preventing dew condensation. [Application Example 3] In the electronic component transfer device described in the above application example, it is preferable that the dry air from the dry air supply section and the dry air from the ion generating section are lower than the outer side of the exterior, respectively. Humidity. With this, it is possible to prevent the occurrence of dew condensation in the accommodating portion regardless of the use environment of the electronic component transfer device. [Application Example 4] In the electronic component conveying device described in the above application example, it is preferable that a pressure inside the storage portion is higher than a pressure outside the storage portion. Thereby, the dry air from the dry air supply section is ejected through the opening of the storage section, and therefore, relatively humid air outside the storage section can be prevented from flowing into the storage section through the opening. [Application Example 5] In the electronic component transporting device described in the above application example, it is preferable that the electronic component disposing unit is a temperature-equalizing plate that can adjust the temperature of the electronic component. Therefore, when the electrical inspection of the electronic parts is performed in the electronic parts conveying device, the electronic parts can be cooled or heated in advance before the inspection to adjust the temperature suitable for the inspection. [Application Example 6] In the electronic component conveying device described in the above application example, it is preferable that the electronic component disposing unit is a shuttle board capable of conveying the electronic component. Accordingly, when the electrical inspection of the electronic components is performed in the electronic component transfer device, the electronic components can be transported toward the inspection section that can perform the inspection. [Application Example 7] In the electronic component transporting device described in the above application example, preferably, the storage section includes a plurality of the openings, and includes a shutter that opens and closes the plurality of openings. Thereby, the opening can adopt an open state and a closed state. In the closed state, the airtightness of the storage portion can be ensured. Therefore, relatively humid air outside the storage portion can be prevented from flowing into the storage portion through the opening. In the open state, the electronic components can be taken out of the storage portion. [Application Example 8] In the electronic component conveying device described in the above application example, it is preferable that a height of the ejection port is higher than an upper surface of the electronic component disposition portion. Thereby, the ionized dry air can pass directly above the electronic parts. At this time, the surface of the electronic component comes into contact with the dry air to be destaticized. [Application Example 9] In the electronic component transporting device described in the above application example, it is preferable that the installation portion of the ion generating portion is higher than the electronic component disposing portion. The dry air from the ion generating section has a larger specific gravity. Therefore, if the ion generating portion is provided at a position higher than the electronic component placement portion, the dry air can quickly flow down toward the electronic component placement portion. [Application Example 10] In the electronic component transfer device described in the above application example, it is preferable that the number of the ion generating sections is set at least around the electronic component arranging section when the electronic component arranging section is viewed from above. There are 1. Accordingly, when a plurality of electronic component placement sections are provided, for example, the ionized dry air can be directed as uniformly as possible toward the electronic components on each electronic component placement section. [Application Example 11] In the electronic component conveying device described in the above application example, it is preferable that the electronic component disposing section includes concave portions for arranging the electronic components one by one, and a position where the ejection outlet is provided is above the concave portions. Thereby, the ejection port can be made as close as possible to the electronic components in the recessed portion, so the effect of removing static electricity generated by the ionized dry air is improved. [Application Example 12] In the electronic component conveying device described in the above application example, it is preferable that the installation portion of the ejection port corresponds to each of the recessed portions. Thereby, the ionized dry air can be blown individually to the electronic parts located in each recessed portion, and therefore, sufficient static elimination can be performed. [Application Example 13] In the electronic component conveying device described in the above application example, it is preferable that the plurality of ejection ports are provided, and the plurality of ejection ports are arranged in a planar direction. Thereby, the ionized dry air can be blown individually to the electronic parts located in each recessed portion, and therefore, sufficient static elimination can be performed. [Application Example 14] The electronic component inspection device of this application example includes a dry air supply section that can supply dry air, an ion generation section that can ionize the dry air, and an injection section that can spray the ionization. Dry air; an electronic parts disposition unit that can be configured to cool electronic parts; a storage unit that can accommodate the electronic parts disposition unit and has an opening through which the electronic parts can pass; and an inspection unit that inspects the electronic parts And the spraying section has at least one spraying port capable of spraying the ionized dry air into the interior of the storage section. The electronic part inspection device of this application example can locally spray the ionized dry air to the target by appropriately setting the position of the ejection port, and therefore, it can perform static elimination on the target. Moreover, since the storage section is filled with dry air from the dry air supply section, it is possible to prevent the ionized dry air from reducing the effect of removing static electricity due to moisture. [Application Example 15] The electronic component transfer device of this application example is characterized by including: a transfer section that can transfer electronic components; an opening and closing section that can be opened and closed; a display section that can display the operation state of the above-mentioned transfer section; and a notification section , It reports whether the opening and closing section can be opened and closed. Thereby, the operator can recognize whether the opening / closing part can be opened or closed. Therefore, for example, it is possible to prevent the operator from setting the opening / closing portion to the open state even though the inside of the device is in a poor state for the operator. As a result, the safety of the operator can be ensured. [Application Example 16] In the electronic component transporting device described in Application Example 15, it is preferable that the notification unit uses at least one of light and sound for notification. Thereby, the operator can recognize whether the opening-closing part can be opened or closed with high accuracy. [Application Example 17] The electronic component transfer device described in Application Example 15 or 16 above preferably includes a lock section that can switch between maintaining the closed state of the opening and closing section and releasing the closed state. Thereby, for example, it is possible to prevent the operator from accidentally opening the opening / closing section during the transportation of electronic parts. [Application Example 18] In the electronic component transporting device described in Application Example 17, the notification unit preferably includes a window portion that visually recognizes an operating state of the lock portion. This makes it possible to omit, for example, a device such as a display device as the notification unit, and to simplify the configuration of the notification unit. [Application Example 19] In the electronic component transporting device described in Application Example 18, it is preferable that a first display indicating that the opening and closing section can be set to an open state is attached to the window portion, and the first display is provided in the The first display has a different position, and the display is restricted to the second display in which the opening and closing section is set to the open state, and the notification section includes a recognition section that interlocks with the operating state of the lock section to isolate the above. The window portion is moved between the first position where the first display overlaps and the second position where the window portion overlaps the second display, and it is recognized whether the opening / closing portion can be opened or closed. This makes it possible to omit, for example, a device such as a display device as the notification unit, and to simplify the configuration of the notification unit. [Application Example 20] In the electronic component transporting device described in any one of the above Application Examples 15 to 19, it is preferable that the notification unit is provided in the opening and closing unit. Thereby, when the operator performs the opening and closing operation of the opening and closing portion, the operator can recognize with high accuracy whether the opening and closing portion can be opened and closed. [Application Example 21] In the electronic component transporting device described in any one of the above-mentioned Application Examples 15 to 20, it is preferable that the notification section reports information before the opening and closing section can be opened. Thereby, for example, when the information is time, the operator can grasp the time before it becomes possible to open the opening and closing section. Therefore, the operator can perform other operations before performing the operation of opening and closing the opening and closing section. [Application Example 22] In the electronic component transfer device described in any one of the above-mentioned Application Examples 15 to 21, it is preferable that the notification unit is disposed at a distance of 600 mm or more and 2000 mm from the installation surface on which the electronic component transfer device is installed. The following height positions. With this, when the notification section is configured to report by visual inspection, it is possible to notify the operator with high accuracy. [Application Example 23] In the electronic component transporting device described in any one of the above Application Examples 15 to 22, it is preferable that the display section displays whether the opening / closing section can be opened or closed. In addition to the notification section, whether the opening / closing section can be opened or closed is also displayed on the display section, so that the operator can easily recognize it. [Application Example 24] The electronic component inspection device of this application example is characterized by including: a conveying section that can convey electronic components; an opening and closing section that can open and close; a display section that can display the operating state of the above-mentioned conveying section; It reports whether the above-mentioned opening and closing section can be opened and closed; and an inspection section, which inspects electronic parts. Thereby, the operator can recognize whether the opening / closing part can be opened or closed. Therefore, for example, it is possible to prevent the operator from setting the opening / closing portion to the open state even though the inside of the device is in a poor state for the operator. As a result, the safety of the operator can be ensured.

Hereinafter, the electronic component transfer device and the electronic component inspection device of the present invention will be described in detail based on a preferred embodiment with reference to the attached drawings. In the following embodiments, for convenience of explanation, the three axes that are orthogonal to each other shown in the figure are the X axis, the Y axis, and the Z axis. The XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. Further, a direction parallel to the X axis is also referred to as "X direction", a direction parallel to the Y axis is also referred to as "Y direction", and a direction parallel to the Z axis is also referred to as "Z direction". Among the arrows showing the three axes, the front end side of the arrow is referred to as a "positive side (+ side)", and the base end side is referred to as a "negative side (-side)". In addition, the + Z direction side in the figure may be referred to as "up (or above)", and the -Z direction side may be referred to as "down (or below)". In addition, the "horizontal" mentioned in the description of the present case is not limited to a complete level, and includes a state inclined slightly (for example, less than about 5 °) with respect to the level as long as it does not hinder the transportation of electronic components. <First Embodiment> Fig. 1 is a schematic perspective view of a first embodiment of the electronic component inspection device of the present invention as viewed from the front side. FIG. 2 is a schematic plan view showing an operating state of the electronic component inspection device shown in FIG. 1. FIG. 3 is a cross-sectional view of a horizontal portion of a temperature-equalizing plate and a periphery thereof provided in the electronic component inspection device shown in FIG. 1. FIG. 4 is a cross-sectional view taken along line AA in FIG. 3 showing a state where the shutter is closed, and FIG. 5 is a cross-sectional view taken along line AA in FIG. 3 which shows a state where the shutter is opened. 6 is a cross-sectional view taken along the line BB in FIG. 3. FIG. 7 is a horizontal partial cross-sectional view of a supply shuttle plate and its surroundings provided in the electronic component inspection device shown in FIG. 1. FIG. 8 is a cross-sectional view taken along a line CC in FIG. 7. The inspection devices (electronic component inspection devices) 1 shown in Figs. 1 and 2 transport IC devices such as BGA (Ball grid array) packages or LGA (Land grid array) packages, A device that checks the electrical characteristics of electronic components such as LCD (Liquid Crystal Display) and CIS (CMOS Image Sensor: CMOS image sensor) during the transportation process. In the following, for convenience of explanation, a case where an IC device is used as the above-mentioned electronic component for inspection will be described as a representative, and it will be referred to as "IC device 90". As shown in FIGS. 1 and 2, the inspection device 1 is divided into a tray supply area A1, a device supply area (hereinafter referred to as the "supply area") A2, an inspection area A3, and a device recovery area (hereinafter referred to as the "recycling area") A4. , And the tray removal area A5. Further, in the normal conveyance mode, for example, the IC device 90 passes through (each area) in order from the tray supply area A1 to the tray removal area A5, and is inspected in the inspection area A3 in the middle. In this way, the inspection device 1 is formed to include an electronic component transfer device (processor) that transports IC devices 90 in each area, an inspection unit 16 that performs inspection in the inspection area A3, and a control unit 80. In addition, the inspection apparatus 1 includes a monitor 300, a signal lamp 400, and an operation panel 700 (see FIG. 1). In addition, the inspection device 1 is a side where the tray supply area A1 and the tray removal area A5 (the -Y direction side in FIG. 2) are disposed as the front side, and the opposite side, that is, the side where the inspection area A3 is disposed (in FIG. 2). (+ Y direction side) is used as the back side. The tray supply area A1 is a material supply section for supplying a tray (mounting member) 200 in which a plurality of IC devices 90 are arranged in an unchecked state. In the tray supply area A1, a plurality of trays 200 can be stacked. The supply area A2 is an area where a plurality of IC devices 90 arranged on the tray 200 from the tray supply area A1 are supplied to the inspection area A3, respectively. In addition, tray transfer mechanisms 11A and 11B are provided so as to straddle the tray supply area A1 and the supply area A2 in the horizontal direction to transfer the tray 200 piece by piece. The tray conveying mechanism 11A is a moving part that can move the tray 200 and the IC device 90 placed on the tray 200 to the positive side in the Y direction. Thereby, the IC device 90 can be stably fed into the supply area A2. The tray conveyance mechanism 11B is a moving unit that can move the empty tray 200 to the negative side in the Y direction, that is, from the supply area A2 to the tray supply area A1. In the supply area A2, a temperature adjustment section 12, a device transfer head 13, and a tray transfer mechanism 15 are provided. As shown in FIGS. 4 to 6, the temperature adjustment unit 12 includes a plate-shaped cooling member 121 that can uniformly cool the plurality of IC devices 90, and a plate that is disposed below the cooling member 121 and can uniformly heat the plurality of IC devices 90. The shaped heating member 122 is sometimes referred to as a "temperature equalizing plate". With the temperature equalizing plate, the IC device 90 before the inspection by the inspection unit 16 can be cooled or heated in advance, and adjusted to a temperature suitable for the inspection. In the configuration shown in FIG. 2, two temperature adjustment sections 12 are arranged and fixed in the Y direction. In addition, the IC devices 90 on the tray 200 carried in (carried in) from the tray supply area A1 by the tray transfer mechanism 11A are transferred to any of the temperature adjustment sections 12. In addition, the plurality of IC devices 90 are arranged one by one in the state of the grooves (recesses) 124 of the plate-shaped electronic component arrangement portion 123 called a "change kit" that is replaced according to each type of the IC device 90. It is placed on the cooling member 121 (see FIGS. 4 to 6). The IC devices 90 are cooled or heated together with the electronic component placement section 123. The device transfer head 13 includes a suction portion 131 and is supported so as to be movable in the X direction and the Y direction and further in the Z direction within the supply area A2. With this, the device transfer head 13 can transfer the IC device 90 between the tray 200 and the temperature adjustment section 12 carried in from the tray supply area A1, and the IC device 90 between the temperature adjustment section 12 and the device supply section 14 described later. Of transportation. The tray transfer mechanism 15 is a mechanism that transfers the empty tray 200 in a state where all IC devices 90 are removed, to the positive side in the X direction in the supply area A2. After the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray transfer mechanism 11B. The inspection area A3 is an area where the IC device 90 is inspected. An inspection unit 16 and a device transfer head 17 are provided in the inspection area A3. A device supply unit 14 that moves across the supply area A2 and the inspection area A3, and a device recovery unit 18 that moves across the inspection area A3 and the recovery area A4 are also provided. The device supply unit 14 is a moving unit that mounts the IC device 90 that has been temperature-adjusted by the temperature adjustment unit 12 and can transport (move) the IC device 90 to the vicinity of the inspection unit 16. It is sometimes referred to as a "supply shuttle"board". The device supply portion 14 is supported to be movable between the supply area A2 and the inspection area A3 in the X direction and the horizontal direction. In the configuration shown in FIG. 2, two device supply sections 14 are arranged in the Y direction, and the IC devices 90 on the temperature adjustment section 12 are transported to any one of the device supply sections 14. The device supply unit 14 is configured to maintain the temperature-adjusted state of the temperature-adjusted IC device 90. As shown in FIG. 8, the device supply unit 14 includes a plate-shaped cooling member 141 that can uniformly cool the plurality of IC devices 90 and a plate-shaped heating that is disposed below the cooling member 141 and can uniformly heat the plurality of IC devices 90. Component 142. Thereby, the IC device 90 can be cooled or heated, and therefore, the temperature adjustment state of the IC device 90 can be maintained. The device supply unit 14 is similar to the temperature adjustment unit 12 in that a plate-shaped electronic component arrangement unit 143 called a "change kit" that is replaced for each type of the IC device 90 is placed on the cooling member 141 and used. (See Figure 8). In addition, the plurality of IC devices 90 transported by the device supply section 14 are cooled or heated together with the electronic component placement section 143 in a state of being disposed in the recesses (recesses) 144 of the electronic component placement section 143 one by one. As described later, in this embodiment, the temperature adjustment unit 12 constitutes a part of the first temperature adjustment unit 10A, and the device supply unit 14 constitutes a part of the second temperature adjustment unit 10B. In addition, the cooling member 121 of the temperature adjustment section 12 and the cooling member 141 of the device supply section 14 form a flow passage (not shown) through which a refrigerant such as liquid nitrogen passes, for example, thereby cooling the IC device 90. In addition, as the constituent materials of the cooling member 121 and the cooling member 141, as well as the electronic component placement portion 123 and the electronic component placement portion 143, there is no particular limitation, and it is preferably a metal material with relatively high thermal conductivity such as aluminum . The heating member 122 of the temperature adjustment section 12 and the heating member 142 of the device supply section 14 are each constituted by a rubber heater that generates heat when a voltage is applied, whereby the IC device 90 can be heated. The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90. The inspection unit 16 is provided with a plurality of probe pins that are electrically connected to the terminals of the IC device 90 while maintaining the state of the IC device 90. The terminals of the IC device 90 are electrically connected (contacted) with the probe pins, and the IC device 90 is inspected through the probe pins. The inspection of the IC device 90 is performed based on a program stored in an inspection control unit provided in a tester connected to the inspection unit 16. In addition, in the inspection unit 16, similarly to the temperature adjustment unit 12, a plurality of IC devices 90 may be cooled or heated, and the IC devices 90 may be adjusted to a temperature suitable for inspection. The device transfer head 17 is supported to be movable in the Y direction within the inspection area A3. Thereby, the device transfer head 17 can transfer and place the IC device 90 on the device supply part 14 carried in from the supply area A2 to the inspection part 16. In addition, the device transfer head 17 may cool or heat the IC device 90 and adjust the IC device 90 to a temperature suitable for inspection. The device recovery section 18 is an IC device 90 that is placed after the inspection of the inspection section 16 and can be moved (moved) to the recovery section A4. This is sometimes called a "recycling shuttle" . The device recovery section 18 is supported so as to be movable in the horizontal direction in the X direction between the inspection area A3 and the recovery area A4. In the configuration shown in FIG. 2, the device recovery unit 18 is the same as the device supply unit 14, and two IC devices 90 on the inspection unit 16 are transported to any of the device recovery units 18. Place. This transfer is performed by the device transfer head 17. In addition, the device recovery unit 18 or the inspection unit 16 is similar to the temperature adjustment unit 12 in that a change kit for each type of the IC device 90 is mounted and used. The recovery area A4 is an area of the plurality of IC devices 90 after the recovery inspection is completed. In this collection area A4, a collection tray 19, a device transfer head 20, and a tray transfer mechanism 21 are provided. An empty tray 200 is also prepared in the collection area A4. The collection tray 19 is placed on the placement portion of the IC device 90 after inspection by the inspection unit 16 and is fixed so as not to move within the collection area A4. Thereby, even in the recovery area A4 in which various movable parts such as a relatively large number of device transfer heads 20 are arranged, the IC devices 90 that have been inspected are stably placed on the recovery tray 19. In the configuration shown in FIG. 2, three collection trays 19 are arranged in the X direction. Three empty trays 200 are also arranged in the X direction. The empty tray 200 also serves as a mounting section for the IC device 90 mounted on the inspection section 16. Then, the IC device 90 on the device collection unit 18 that has moved to the collection area A4 is transferred to and placed on any one of the collection tray 19 and the empty tray 200. Thereby, the IC device 90 is sorted and recovered according to each inspection result. The device transfer head 20 is supported to be movable in the X direction and the Y direction, and also in the Z direction within the recovery area A4. Thereby, the device transfer head 20 can transfer the IC device 90 from the device collection part 18 to the collection tray 19 or the empty tray 200. The tray transfer mechanism 21 is a mechanism that transfers the empty tray 200 carried in from the tray removal area A5 in the X direction in the collection area A4. In addition, after the transfer, the empty tray 200 will be disposed at the position where the IC device 90 is collected, and it may become any of the three empty trays 200 described above. The tray removal area A5 is a material removal portion that collects and removes the trays 200 in which the plurality of IC devices 90 in the inspection state are arranged. In the tray removing area A5, a plurality of trays 200 can be stacked. In addition, tray transfer mechanisms 22A and 22B for transferring the tray 200 piece by piece in the Y direction are provided so as to span the collection area A4 and the tray removal area A5. The tray conveyance mechanism 22A is a moving portion that can move the tray 200 in the Y direction. Thereby, the IC device 90 after the inspection can be carried from the recovery area A4 to the tray removal area A5. In addition, the tray transfer mechanism 22B is a moving part that can be used to move the empty tray 200 of the recovered IC device 90 from the tray removal area A5 to the collection area A4. The control unit 80 (see FIG. 1) includes, for example, a drive control unit. The drive control unit controls, for example, the tray transfer mechanism 11A, 11B, the temperature adjustment unit 12, the device transfer head 13, the device supply unit 14, the tray transfer mechanism 15, the inspection unit 16, the device transfer head 17, the device recovery unit 18, and the device transfer head 20. , The tray conveyance mechanism 21, and the drive of each part of the tray conveyance mechanism 22A, 22B. The inspection control unit of the tester performs inspection of the electrical characteristics of the IC device 90 arranged in the inspection unit 16 based on, for example, a program stored in a memory not shown. The operator can set or confirm the operating conditions of the inspection device 1 and the like via the monitor 300. The monitor 300 includes, for example, a display screen (display section) 301 composed of a liquid crystal screen, and is arranged on the upper portion of the front side of the inspection device 1. As shown in FIG. 1, on the right side (+ X direction side) in the drawing of the tray removal area A5, a mouse stage 600 for placing a mouse used for operating and displaying a screen on the monitor 300 is provided. An operation panel 700 is disposed on the lower right side in FIG. 1 with respect to the monitor 300. Unlike the monitor 300, the operation panel 700 is an operator required to instruct the inspection device 1. In addition, the signal lamp 400 can report the operation state of the inspection device 1 and the like by a combination of light emitting colors. The signal lamp 400 is disposed above the inspection device 1. In addition, a speaker 500 is built into the inspection device 1, and the operating state and the like of the inspection device 1 can be reported by the speaker 500. As shown in FIG. 2, the inspection device 1 divides (separates) the tray supply area A1 and the supply area A2 by the first partition 61, and divides the supply area A2 and the inspection area A3 by the second partition 62. The third partition 63 partitions the inspection area A3 and the recovery area A4, and the fourth partition 64 partitions the recovery area A4 and the tray removal area A5. The supply area A2 and the recovery area A4 are also divided by a fifth partition plate 65. These partitions have the function of maintaining the airtightness of each area. In addition, the inspection device 1 is covered with a cover at the outermost surface, and the cover includes, for example, a front cover 70, a side cover 71, a side cover 72, a rear cover 73, and a top cover 74. The inspection device 1 is provided with a first temperature adjustment unit 10A and a second temperature adjustment unit 10B. Hereinafter, a case where the IC device 90 is cooled by the first temperature adjustment unit 10A (temperature adjustment unit 12) and the second temperature adjustment unit 10B (device supply unit 14) will be described. First, the first temperature adjustment unit 10A will be described with reference to FIGS. 3 to 6. As shown in FIGS. 3 to 6, the first temperature adjustment unit 10A includes a temperature adjustment unit 12, a dry air supply unit 3A, an ion generation unit 4A, an injection unit 5A, and a storage unit 8A. The storage section 8A is a housing that integrally stores (inner-packs) the two temperature adjustment sections 12 on the inside thereof, and includes a storage section body 81 and a shutter 82. The storage unit body 81 includes a side wall 83 that surrounds the two temperature adjustment units 12 in the circumferential direction thereof, and a top plate 84 that covers the two temperature adjustment units 12 from above. A plurality of openings 841 are formed in the top plate 84. The openings 841 are formed in such a manner that a plurality of grooves 124 are arranged in a matrix shape facing the electronic component placement portions 123 facing the respective temperature adjustment portions 12. In addition, one IC device 90 can pass through each opening 841. Thereby, the IC device 90 can be taken out of the storage portion 8A. The shutter 82 is arranged for each opening 841 arranged in the X direction, and those openings 841 are opened and closed. The shutter 82 is supported to be movable in the Y direction on the back side (lower side) of the top plate 84. Thereby, the opening 841 can assume the closed state shown in FIG. 4 and the open state shown in FIG. 5. In the closed state shown in FIG. 4, the airtightness of the storage portion 8A can be ensured. This can prevent relatively humid air (hereinafter referred to as "humid air") in the supply area A2 from flowing into the storage portion 8A through the opening 841. In the storage section 8A, the temperature adjustment section 12 is in a cooling operation, or the IC device 90 is cooled by the temperature adjustment section 12, but if humid air flows into the storage section 8A, there may be condensation on the temperature adjustment section 12 or the IC device 90 situation. However, in the closed state, the prevention of dew condensation can be prevented by preventing the inflow of humid air. In the open state shown in FIG. 5, the suction portion 131 of the device transfer head 13 can enter the storage portion 8A through the opening 841. Thereby, the IC device 90 can be adsorbed and transported from the temperature adjustment section 12 to the device supply section 14. The shutter 82 is connected to a drive source (not shown) such as an air cylinder or a motor. Accordingly, the shutter 82 can be moved in the Y direction. As shown in FIG. 3, the dry air supply section 3A includes a rigid tube body 31 extending in the Y direction in the storage section 8A and provided in parallel with the two temperature adjustment sections 12. The pipe body 31 is connected to a dry air generating unit 900 that generates dry air DA. As shown in FIG. 6, a side hole 311 is formed in the pipe body 31 through the pipe wall. A plurality of side holes 311 are arranged at intervals along the longitudinal direction of the pipe body 31. Accordingly, the dry air DA can be sufficiently supplied into the storage portion 8A, and the dry air DA can be filled in the storage portion 8A. In addition, the pressure inside the storage section 8A filled with the dry air DA becomes higher than the pressure outside the storage section 8A, that is, inside the supply area A2. Thereby, even if the opening 841 of the accommodating part 8A is in an open state as shown in FIG. Such a structure is preferable for preventing dew condensation in the storage portion 8A. In addition, the pipe body 31 is preferably disposed as low as possible in the storage portion 8A, and more preferably disposed at least lower than the upper surface 125 of the electronic component placement portion 123 of the temperature adjustment portion 12 which is vertically above the highest. Thereby, the state where the dry air DA is ejected from the opening 841 can be increased, and therefore, the inflow of the humid air can be sufficiently prevented. In addition, although the side hole 311 formed in the pipe body 31 faces the temperature adjustment part 12 in the structure shown in FIG. 6, it is not limited to this, For example, it may face upward. Further, in the pipe body 31, a side hole 311 facing the temperature adjustment portion 12 and a side hole 311 facing upward may be formed, respectively. The dry air DA has a lower humidity than the air (atmosphere) on the outside of the outermost casing (side cover 71, etc.) of the inspection device 1. With this, it is possible to prevent the occurrence of dew condensation in the storage portion 8A regardless of the use environment of the inspection device 1. Moreover, in the inspection apparatus 1, the storage part 8A is contained in the inside of the outermost part of the inspection apparatus 1, ie, a part of the supply area A2. Thereby, the entire supply area A2 can be filled with dry air DA, and the storage portion 8A of the box (housing) or lid can be partially covered with the periphery of the temperature adjustment portion 12 that is prone to dew condensation, and can be easily prevented from being filled with dry air DA. The part needed for condensation. The ion generating unit 4A is an ionizer that ionizes dry air and generates the ionized dry air (hereinafter referred to as "ionized air IA"). The ion generating section 4A is not particularly limited, and for example, a person using a corona discharge, a person using ionizing radiation, or the like can be used. The surface of the IC device 90 may be charged with static electricity, for example, during transportation of the IC device 90. Therefore, this static electricity must be removed. Therefore, in the first temperature adjustment unit 10A, the ionized air IA generated by the ion generation unit 4A can be blown to the surface of the IC device 90 through the injection unit 5A to remove static electricity. As shown in FIG. 3, one ion generating unit 4A is provided around each temperature adjusting unit 12 in a plan view. Accordingly, the ionized air IA can be directed as uniformly as possible toward the IC devices 90 on the respective temperature adjustment sections 12. In addition, in the configuration shown in FIG. 3, although the temperature adjustment section 12 on the positive side in the Y direction in the figure, the ion generating section 4A is arranged on the positive side in the Y direction, and the temperature adjustment section 12 on the negative side in the Y direction in the figure, The ion generating sections 4A are arranged on the negative side in the Y direction, but the arrangement locations of the ion generating sections 4A are not limited to this. The ion generating section 4A is preferably provided at a position higher than the temperature adjusting section 12. The ionized air IA as the dry air usually has a larger specific gravity. Therefore, by setting the ion generating section 4A higher than the temperature adjusting section 12, the ionized air IA can flow down from the ion generating section 4A toward the temperature adjusting section 12 quickly. Also, similar to the dry air DA, the ionized air IA has a lower humidity than the air (air) outside the inspection device 1. With this, it is possible to prevent the occurrence of dew condensation in the storage portion 8A regardless of the use environment of the inspection device 1. As shown in FIG. 3, an injection unit 5A that injects ionized air IA is connected to each ion generating unit 4A. The spraying section 5A includes a resin-made pipe body 51. Although the tube body 51 also depends on the positional relationship between the ion generating portion 4A and the temperature adjustment portion 12, it may be linear (refer to the tube body 51 on the negative side in the Y direction in FIG. 3) or may be halfway in the length Bend or bend (refer to the tube body 51 on the positive side in the Y direction in FIG. 3). As shown in FIG. 4 to FIG. 6, the tube body 51 has a spray outlet 511 opened in the storage portion 8A. The ionized air IA can be sprayed into the storage portion 8A through the spray port 511. The spray target of the ionized air IA, that is, the spray target is the surface of the IC device 90. Therefore, the ejection port 511 is, for example, centerline O ₅₁₁ The upper surface 125 of the electronic component disposition portion 123 of the temperature adjustment portion 12 is provided at a higher position in the vertical direction (see FIG. 4). Thereby, the ionized air IA ejected from the ejection outlet 511 can pass directly above the IC device 90 in the horizontal direction, that is, along the upper surface 125. At this time, the surface of the IC device 90 is brought into contact with the ionized air IA, and static electricity is removed. As described above, in the first temperature adjustment unit 10A, by appropriately setting the position of the ejection port 511, the ionized air IA can be locally sprayed toward the target, that is, the surface of the IC device 90. As a result, static electricity can be removed on the surface of the IC device 90. Moreover, since the inside of the storage portion 8A is filled with the dry air DA as described above, it is possible to prevent a reduction in the static elimination effect of the ionized air IA due to moisture. Here, let us consider a case where the ejection port 511 is provided at a position lower than the upper surface 125 of the electronic component placement portion 123. In this case, the ejection port 511 is opened toward the side surface of the electronic component placement portion 123 or the cooling member 121. When the ionized air IA is ejected in this state, ions in the ionized air IA collide with the side surfaces made of a metal material and are absorbed. Therefore, the antistatic effect of the ionized air IA on the IC device 90 cannot be expected. In addition, although each injection part 5A is formed as the structure which has one ejection opening in this embodiment, it is not limited to this, For example, it may be formed as the structure which has two or more ejection openings. Next, the second temperature adjustment unit 10B will be described with reference to FIGS. 7 and 8. Here, the differences between the second temperature adjustment unit 10B and the first temperature adjustment unit 10A will be mainly described, and descriptions of the same matters will be omitted. As shown in FIGS. 7 and 8, the second temperature adjustment unit 10B includes a center line O in the X direction with respect to the inspection unit 16. ₁₆ The two sets of the device supply section 14, the dry air supply section 3B, the ion generating section 4B, the injection section 5B, and the storage section 8B are arranged symmetrically. The configuration of each group is the same except that the positions are different. Therefore, the configuration of one group (upper side in FIG. 7) will be representatively described. As described above, the device supply section 14 is movable between the supply area A2 and the inspection area A3. Hereinafter, the stop position of the device supply section 14 in the supply area A2 is referred to as a “first stop position”, and the stop position in the inspection area A3 is referred to as a “second stop position”. Further, in the electronic component placement section 143 of the device supply section 14, grooves 144 are arranged in a matrix shape in the X direction and the Y direction. Moreover, as shown in FIG. 7, in the present embodiment, the row of the grooves 144 along the X direction has a "first row L ₁ ", Line 2 L ₂ "A total of 2 lines. As shown in FIG. 7 and FIG. 8, the storage portion 8B is a case containing the device supply portion 14 located at the first stop position. The accommodating portion 8B includes a side wall 85 that surrounds the device supply portion 14 located at the first stop position in a part of its circumferential direction, and a top plate 86 that covers the device supply portion 14 located at the first stop position from above. A plurality of openings 861 are formed in the top plate 86. The openings 861 are formed so that a plurality of grooves 144 are arranged in a matrix in a manner facing the electronic component placement section 143 of the device supply section 14 located at the first stop position. In addition, one IC device 90 can be passed through each opening 861. Thereby, the IC device 90 can be placed in the groove 144 from the outside of the storage portion 8B. In addition, as shown in FIG. 2, in the inspection device 1, a storage portion 8C is provided on the recovery area A4 side, which has the same configuration as the storage portion 8B, and stores (inner) each device recovery portion 18. In addition, the storage portion 8C may be configured to be supplied with dry air DA or ionized air IA. As shown in FIG. 7, the dry air supply section 3B includes a rigid pipe body 32 extending in the X direction in the storage section 8B and provided in parallel with the device supply section 14 located at the first stop position. The pipe body 32 is connected to a dry air generating unit 900 that is common to the pipe body 31 of the dry air supply unit 3A. As shown in FIG. 8, the pipe body 32 is formed with a side hole 321 penetrating the pipe wall, similarly to the pipe body 31. Thereby, the dry air DA can be supplied into the storage section 8B, and the dry air DA can be filled in the storage section 8B. Then, the pressure inside the storage portion 8B filled with the dry air DA becomes higher than the pressure outside the storage portion 8B, that is, inside the supply area A2. Thereby, the dry air DA is prevented from being sprayed from the openings 861 of the storage portion 8B, and the humid air flows into the storage portion 8B through the openings 861. Therefore, dew condensation in the storage portion 8B is prevented. As shown in FIG. 7, in a plan view, two ion generating sections 4B are arranged adjacent to each other in the X direction around the device supply section 14 (the negative side in the Y direction) located at the first stop position. The ion generating section 4B may be one of the ion generating section 4B ₁ Ionized air IA generated, and ion generating unit 4B in the other ₂ The generated ionized air IA is supplied into the storage portion 8B at the same timing or at different timings. Further, in the second temperature adjustment unit 10B, two injection units 5B are provided corresponding to the two ion generating units 4B. Among the spraying sections 5B, one of the spraying sections 5B ₁ Connected to the ion generator 4B ₁ , The other 5B ₂ Connected to the ion generator 4B ₂ . Spraying section 5B ₁ A tube body 52 is provided. The tube body 52 is branched into two in the middle in the longitudinal direction, and thereby has a spray outlet 521 and a spray outlet 522 that are opened in the side wall 85 of the storage portion 8B. As shown in FIG. 7, in a plan view, the opening direction of the ejection port 521 is directed toward the first row L. ₁ The direction of the groove 144 and the opening direction of the ejection port 522 are toward the second line L. ₂ The direction of the groove 144. As shown in FIG. 8, the ejection port 521 (the same is true of the ejection port 522) is, for example, centerline O. ₅₂₁ It is set so that it may become higher than the upper surface 145 of the electronic component arrangement | positioning part 143 of the device supply part 14. With this configuration, the ionized air IA ejected from the ejection outlet 521 can pass through the first line L along the upper surface 145 ₁ Above the IC device 90, at this time, the surface of the IC device 90 is in contact with the ionized air IA, and the static electricity is removed. Similarly, the ionized air IA ejected from the ejection outlet 522 can pass through the second line L along the upper surface 145 ₂ Above the IC device 90, at this time, the surface of the IC device 90 is in contact with the ionized air IA, and the static electricity is removed. Spraying section 5B ₂ 管管 53。 Has a pipe body 53. The pipe body 53 has a portion along the Y direction, and at this portion, a discharge port 531 and a discharge port 532 (see FIG. 7) that are opened in the top plate 86 of the storage portion 8B, that is, open toward the negative side in the Z direction are provided. As shown in FIG. 8, it is arranged in the first row L while the device supply unit 14 moves from the first stop position to the second stop position. ₁ Each IC device 90 of the recess 144 passes through the nozzle opening 531 in the order corresponding to the nozzle opening 531, that is, faces the nozzle opening 531 in order. And, at the time of passing, the first line L ₁ The surface of the IC device 90 is in contact with the ionized air IA, and the static electricity is further removed sufficiently. Similarly, placed on line 2 L ₂ Each of the IC devices 90 in the recess 144 also moves along with the device supply part 14 and sequentially passes directly below the ejection port 532. And, at the time of passing, the second line L ₂ The surface of the IC device 90 is in contact with the ionized air IA, and the static electricity is further removed sufficiently. In addition, although each injection part 5B is formed into the structure which has two discharge ports in this embodiment, it is not limited to this, For example, it can be set as the structure which has one or three or more discharge ports. <Second Embodiment> Fig. 9 is a plan view of a supply shuttle plate and its surroundings provided in the electronic component inspection device (second embodiment) of the present invention. Hereinafter, the second embodiment of the electronic component transfer device and the electronic component inspection device of the present invention will be described with reference to the figure, but the differences from the above embodiment will be mainly described, and the description of the same matters will be omitted. This embodiment is the same as the first embodiment except that the configuration of the injection unit of the second temperature adjustment unit is different. As shown in FIG. 9, the inspection apparatus 1a of this embodiment is equipped with the injection part 5C in the 2nd temperature adjustment means 10Ba. The ejection section 5C of the inspection device 1a includes a hollow plate-like member (sheet body) 54 which is arranged to face the device supply section 14 located at the first stop position. A plurality of ejection ports 541 are formed on the lower surface of the plate-like member 54 and penetrate through the thickness direction. The ejection openings 541 are arranged in a matrix in a planar direction of the plate-like member 54. As a result, each ejection port 541 is in a state corresponding to each groove 144 of the device supply portion 14 located at the first stop position. Thereby, the ionized air IA can be blown individually to the IC device 90 located in each groove 144, and therefore, sufficient static elimination can be performed. <Third Embodiment> Hereinafter, a third embodiment of the electronic component transfer device and the electronic component inspection device according to the present invention will be described with reference to FIGS. 10 to 17. The inspection device 101 (electronic component inspection device) shown in FIG. 10 and FIG. 11 is a person who has built-in electronic component transfer device 10, and transfers electronic components such as IC devices packaged in a BGA (Ball Grid Array) package, and the transportation process A device for checking and testing electrical characteristics (hereinafter referred to as "inspection"). The inspection device 101 includes: a conveying section 6 that can convey electronic components; an opening and closing section 4 that can be opened and closed; a monitor 300 that is a display section that can display the operating state of the conveying section 6; and a notification section 5 that reports the opening and closing section 4 Whether it can be opened and closed; and the inspection section 116, which performs inspection of electronic parts. The electronic component transfer device 10 includes a transfer unit 6 capable of transferring electronic components, an opening / closing unit 4 capable of being opened and closed, a monitor 300 serving as a display unit capable of displaying an operation state of the transfer unit 6, and a notification unit 5 It reports whether the opening / closing unit 4 can be opened or closed. In the following, for convenience of explanation, a case where an IC device is used as an electronic component will be described as a representative, and it will be referred to as “IC device 90”. The IC device 90 is placed on a tray 200, that is, a mounting member. The inspection device 101 is divided into a tray supply area A1, a device supply area (hereinafter referred to simply as "supply area") A2, an inspection area A3, a device recovery area A4 (hereinafter referred to as "recycling area"), and a tray removal area A5. In addition, the IC device 90 is from the tray supply area A1 to the tray removal area A5 according to the arrow α. ₉₀ The direction passes through each area in order, and inspection is performed in the inspection area A3 in the middle. In this manner, the inspection device 101 is formed to include the electronic component transfer device 10 (processor) that transports the IC device 90 in each of the areas A1 to A5, and the inspection unit 116 that performs inspection in the inspection area A3. In addition, the inspection device 101 includes a signal light 400 and an operation panel 700. In addition, the inspection device 101 is provided with the side of the tray supply area A1 and the tray removal area A5, that is, the negative side in the Y direction in FIG. 11 becomes the front side, and the side with the inspection area A3, that is, the Y direction in FIG. The side is used as the back side. The tray supply area A1 is a material supply section for supplying a tray 200 in which a plurality of IC devices 90 are arranged in an unchecked state. In the tray supply area A1, a plurality of trays 200 can be stacked. The supply area A2 is an area for supplying a plurality of IC devices 90 on the tray 200 carried from the tray supply area A1 to the inspection area A3, respectively. In addition, tray transfer mechanisms 11A and 11B are provided so as to straddle the tray supply area A1 and the supply area A2 in the horizontal direction to transfer the tray 200 one by one. The tray transfer mechanism 11A enables the tray 200 and the IC device 90 placed on the tray 200 to be on the positive side of the Y direction, that is, the arrow α in FIG. 11 _11A Moving part. Thereby, the IC device 90 can be stably fed into the supply area A2. In addition, the tray conveying mechanism 11B can move the empty tray 200 to the negative side of the Y direction, that is, the arrow α in FIG. 11. _11B Moving part. Thereby, the empty tray 200 can be moved from the supply area A2 to the tray supply area A1. In the supply area A2, a temperature adjustment section (equivalent temperature plate (English expression: soak plate, Chinese expression (one example): uniform temperature plate)) 112, a device transfer head 13, a tray transfer mechanism 15, and a density sensor 800 are provided. . The temperature adjustment unit 112 is a “temperature equalizing plate” that can mount a plurality of IC devices 90 and collectively heat or cool the IC devices 90. With the temperature equalizing plate, the IC device 90 before the inspection by the inspection unit 116 can be heated or cooled in advance, and adjusted to a temperature suitable for the inspection (high temperature inspection or low temperature inspection). In the configuration shown in FIG. 11, two temperature adjustment sections 112 are arranged and fixed in the Y direction. The IC device 90 on the tray 200 carried in from the tray supply area A1 by the tray transfer mechanism 11A is transferred to any one of the temperature adjustment units 112. The device transfer head 13 is supported to be movable in the X direction and the Y direction, and further in the Z direction within the supply area A2. Thereby, the device transfer head 13 can transfer the IC device 90 between the tray 200 and the temperature adjustment section 112 carried in from the tray supply area A1, and the IC device 90 between the temperature adjustment section 112 and the device supply section 114 described later. Of transportation. In FIG. 11, the arrow α _13X Indicates the X-direction movement of the device transfer head 13 with the arrow α _13Y The Y-direction movement of the device transfer head 13 is shown. The tray conveying mechanism 15 is a tray 200 that removes all the empty IC devices 90 in the state, and goes to the positive side of the X direction in the supply area A2, that is, the arrow α ₁₅ Directional transport agency. After the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray transfer mechanism 11B. The density sensor 800 detects a nitrogen concentration in the supply area A2. The density sensor 800 is electrically connected to the control unit 180, and information on the concentration detected by the density sensor 800 is transmitted to the control unit 180. In addition, the concentration sensor may be one that detects the concentration of oxygen. The inspection area A3 is an area where the IC device 90 is inspected. An inspection unit 116 and a device transfer head 117 are provided in the inspection area A3. A device supply unit 114 that moves across the supply area A2 and the inspection area A3, and a device recovery unit 118 that moves across the inspection area A3 and the recovery area A4 are also provided. The device supply section 114 is configured to mount the IC device 90 that has been temperature-adjusted by the temperature adjustment section 112, and the IC device 90 can be transported to a mounting section near the inspection section 116, which is referred to as a "supply shuttle" or Referred to as the "supply shuttle". The device supply unit 114 is supported so that it can be located between the supply area A2 and the inspection area A3 in the X direction, that is, the arrow α ₁₄ Move back and forth in the direction. In the configuration shown in FIG. 11, two device supply sections 114 are arranged in the Y direction, and the IC devices 90 on the temperature adjustment section 112 are transported to any one of the device supply sections 114. The device supply unit 114 is configured to heat or cool the IC device 90 mounted on the device supply unit 114 in the same manner as the temperature adjustment unit 112. Thereby, the IC device 90 temperature-adjusted by the temperature adjustment section 112 can be transported to the vicinity of the inspection section 116 of the inspection area A3 while maintaining its temperature adjustment state. The device transfer head 117 is an operation unit that holds the IC device 90 that maintains the temperature adjustment state, and transfers the IC device 90 in the inspection area A3. The device transfer head 117 is supported to reciprocate in the Y direction and the Z direction within the inspection area A3, and becomes a part of a mechanism called an "indicator arm". Thereby, the device transfer head 117 can transfer the IC device 90 on the device supply part 114 carried in from the supply area A2 to the inspection part 116 and mount it. In FIG. 11, the arrow α _17Y The Y-direction reciprocating movement of the device transfer head 117 is shown. Moreover, although the device transfer head 117 can be supported to reciprocate in the Y direction and the Z direction, it is not limited to this, and it can also be supported so as to be able to reciprocate in the X direction. The device supply unit 117 is configured to heat or cool the IC device 90 held by the device, similarly to the temperature adjustment unit 112. Thereby, the temperature adjustment state of the IC device 90 can be continuously maintained from the device supply section 114 to the inspection section 116. The inspection unit 116 is a mounting unit configured to mount an IC device 90 which is an electronic component, and to inspect and test (inspect) the electrical characteristics of the IC device 90. The inspection unit 116 is provided with a plurality of probe pins electrically connected to the terminal portion of the IC device 90. In addition, the IC device 90 can be inspected by electrically connecting the terminal portion of the IC device 90 with the probe pin. The inspection of the IC device 90 is performed based on a program stored in the storage unit 183 (see FIG. 12) of the control unit 180. In addition, in the inspection unit 116, similarly to the temperature adjustment unit 112, the IC device 90 may be heated or cooled to adjust the IC device 90 to a temperature suitable for inspection. The device recovery section 118 is configured to place the IC device 90 after the inspection by the inspection section 116 is completed, and the IC device 90 can be transferred to the placement section of the recovery area A4, which is called a "recycling shuttle" or simply "Recycling shuttle". In addition, the device recovery unit 118 is supported so as to be able to move between the inspection area A3 and the recovery area A4 in the X direction, that is, the arrow α ₁₈ Move back and forth in the direction. In the configuration shown in FIG. 11, the device recovery unit 118 is the same as the device supply unit 114, and two IC devices 90 are arranged in the Y direction. The IC device 90 on the inspection unit 116 is transferred to any of the device recovery units 118 and loaded. Home. This transfer is performed by the device transfer head 117. The recovery area A4 is an area of the plurality of IC devices 90 after the recovery inspection is completed. In this collection area A4, a collection tray 19, a device transfer head 20, and a tray transfer mechanism 21 are provided. An empty tray 200 is also prepared in the collection area A4. The recycling tray 19 is configured as a mounting portion for placing the IC device 90 after inspection by the inspection unit 116 and is fixed so as not to move in the recovery area A4. Thereby, even in the recovery area A4 in which various movable parts such as a relatively large number of device transfer heads 20 are arranged, the IC devices 90 that have been inspected are stably placed on the recovery tray 19. In the configuration shown in FIG. 11, three collection trays 19 are arranged in the X direction. Three empty trays 200 are also arranged in the X direction. The empty tray 200 also serves as a mounting section for the IC device 90 mounted on the inspection section 116. Then, the IC device 90 on the device recovery section 118 moved to the recovery area A4 is transported to and placed on any one of the recovery tray 19 and the empty tray 200. Thereby, the IC device 90 is sorted and recovered according to each inspection result. The device transfer head 20 is supported to be movable in the X direction and the Y direction, and also in the Z direction within the recovery area A4. Thereby, the device transfer head 20 can transfer the IC device 90 from the device collection part 118 to the collection tray 19 or the empty tray 200. In FIG. 11, the arrow α _20X Indicates the X-direction movement of the device transfer head 20, with the arrow α _20Y The Y-direction movement of the device transfer head 13 is shown. The tray transfer mechanism 21 is such that the empty tray 200 carried in from the tray removal area A5 is in the X direction, that is, the arrow α, in the collection area A4. _{twenty one} The organization that moves in the direction. In addition, after the transfer, the empty tray 200 will be arranged at the position where the IC device 90 is collected, and it may become any of the three empty trays 200. The tray removal area A5 is a material removal portion that collects and removes the trays 200 in which the plurality of IC devices 90 in the inspection state are arranged. In the tray removing area A5, a plurality of trays 200 can be stacked. In addition, tray transfer mechanisms 22A and 22B for transferring the tray 200 piece by piece in the Y direction are provided so as to span the collection area A4 and the tray removal area A5. The tray conveying mechanism 22A can make the tray 200 in the Y direction, that is, the arrow α _22A The moving part that moves back and forth in the direction. Thereby, the IC device 90 after the inspection can be carried from the recovery area A4 to the tray removal area A5. In addition, the tray transfer mechanism 22B can be used to collect the empty tray 200 of the IC device 90 toward the positive side of the Y direction, that is, the arrow α. _22B Move in the direction. Thereby, the empty tray 200 can be moved from the tray removal area A5 to the collection area A4. The inspection device 101 divides the inspection area between the tray supply area A1 and the supply area A2 by the first partition plate 61, divides the supply area A2 and the inspection area A3 by the second partition plate 62, and divides the inspection by the third partition plate 63. Between the area A3 and the collection area A4, the fourth partition 64 divides the area between the collection area A4 and the tray removal area A5. The supply area A2 and the recovery area A4 are also divided by a fifth partition plate 65. The inspection device 101 is most covered with a cover, and the cover includes, for example, a front cover 70, a side cover 71a, a side cover 72a, a rear cover 73a, and a top cover 74. The front cover 70, the side cover 71a, the side cover 72a, the back cover 73a, and the top cover 74 are assembled to form a frame body 76, and an opening and closing portion 4 is formed in the frame body 76. A transport unit 6 is disposed inside the housing 76. As shown in FIG. 11, a first door 711 and a second door 712 are provided on the side cover 71 a. By opening the first door 711 or the second door 712, for example, maintenance in the supply area A2 or elimination of a bad condition can be performed. The first door 711 and the second door 712 are formed as arrows α in FIGS. 11 and 14. ₇₁ The structure of opening and closing in the direction. Similarly, a first door 721 and a second door 722 are provided on the side cover 72a. By opening the first door 721 or the second door 722, for example, operations in the device recovery area A4 can be performed. The first door 721 and the second door 722 are formed as arrows α in FIG. 11. ₇₂ The structure of opening and closing in the direction. A first door 731, a second door 732, and a third door 733 are also provided on the rear cover 73a. By opening the first door 731, for example, work in the supply area A2 can be performed. By opening the third door 733, for example, operations in the device recovery area A4 can be performed. In addition, a fourth door 75 is provided on the inner partition 66 of the zoning inspection area A3. Further, by opening the second and fourth doors 732 and 75, for example, work in the inspection area A3 can be performed. The first door 731 is attached to the arrow α in FIG. 11. ₇₃₁ Open and close direction, the second door 732 is tied to the arrow α in FIG. 11 ₇₃₂ Opening and closing in the direction, the third door 733 is tied to the arrow α in FIG. 11 ₇₃₃ Opening and closing in the direction, the fourth door 75 is attached to the arrow α in FIG. 11 ₇₅ Direction opening and closing. In addition, when the doors are closed, the airtightness or heat insulation of the corresponding areas can be ensured. The first door 711, the second door 712, the first door 721, the second door 722, the first door 731, the second door 732, the third door 733, and the fourth door 75 are respectively It is comprised by the opening-closing part 4 which can be opened and closed. As shown in FIG. 12, the control unit 180 includes a drive control unit 181, an inspection control unit 182, and a memory unit 183. The drive control unit 181 controls, for example, the tray transfer mechanism 11A, the tray transfer mechanism 11B, the temperature adjustment unit 112, the device transfer head 13, the device supply unit 114, the tray transfer mechanism 15, the inspection unit 116, the device transfer head 117, The operation of each of the device recovery unit 118, the device transfer head 20, the tray transfer mechanism 21, the tray transfer mechanism 22A, and the tray transfer mechanism 22B. The inspection control unit 182 performs inspection of the electrical characteristics of the IC device 90 arranged in the inspection unit 116 based on the program stored in the memory unit 183. The memory unit 183 includes volatile memory such as RAM (Random Access Memory), non-volatile memory such as ROM (Read Only Memory), and EPROM (Erasable and Programmable Read Only Memory). : Erasable and Programmable Read Only Memory), EEPROM (Electrically Erasable and Programmable Read Only Memory), Flash Memory and other rewritable (Erasable, Rewriteable) Write) non-volatile memory, etc., various semiconductor memory (IC memory), etc. The control unit 180 is electrically connected to the monitor 300 as a display unit. The monitor 300 is configured to display the operating state of the conveying section 6 or the operating state of other parts of the inspection device 101. As shown in FIG. 11, the transfer unit 6 includes the following components: a tray transfer mechanism 11B, a device transfer head 13, a device supply unit 114, a tray transfer mechanism 15, a device transfer head 117, a device recovery unit 118, and a device transfer head. 20. Tray transfer mechanism 21, tray transfer mechanism 22A, and tray transfer mechanism 22B. The operator can set or confirm the operating conditions of the inspection device 101 through the monitor 300. The monitor 300 includes a display screen 301 made of, for example, a liquid crystal screen, and is arranged on the upper portion of the front side of the inspection device 101. As shown in FIG. 10, on the right side (positive side in the X direction) of the drawing of the tray removal area A5, a mouse stage 600 is provided for placing a mouse used for operating and displaying the screen on the monitor 300. An operation panel 700 is disposed on the lower right of FIG. 10 with respect to the monitor 300. Unlike the monitor 300, the operation panel 700 is an operator required to instruct the inspection device 101. The control unit 180 is electrically connected to the signal light 400. The signal lamp 400 can report the operating state of the inspection device 101 and the like by a combination of the colors of light emission. The signal lamp 400 is disposed above the inspection device 101. In addition, a speaker 500 is built into the inspection device 101, and the operating state and the like of the inspection device 101 can also be notified through the speaker 500. Next, the first door 711 and the second door 712 on the side cover 71a will be described in detail. Since the first door 711 and the second door 712 have the same configuration, the first door 711 will be representatively described below. As shown in FIGS. 13 and 14, the first door 711 is a door that can be opened and closed with respect to the opening portion 713 formed in the side cover 71 a. Thereby, the opening and closing portion 4 can cover one half of the opening portion 713 (the portion on the positive side in the Y direction in the figure) in the closed state (see FIG. 13), and can open the opening portion 713 in the opened state (see FIG. 14) . The first door 711 is constituted by a plate member having a substantially rectangular shape in a plan view. In addition, although the size of the first door 711 depends on the size of the inspection device 101, it is preferably 400 mm or more and 600 or more in the longitudinal length (the length in the Z direction) and the lateral length (the length in the Y direction). mm or less, more preferably 450 mm or more and 550 mm or less. In addition, the first door 711 having a quadrangular shape is a side 41a extending in the vertical direction among the four sides (edge portions) 41a, 41b, 41c, and 41d, and is connected to the side cover 71a by two rotation support portions 42. The two rotation support portions 42 are spaced apart in the Z direction. Each rotation support portion 42 is configured by a hinge that supports the first door 711 to be rotatable. Thereby, the first door 711 can be supported as an axis that can be parallel to the vertical direction, that is, the Z direction. The arrow α in FIG. 11 and FIG. 14 ₇₁ It can be turned in the direction and can be opened and closed smoothly. Further, a handle 714 configured by a protrusion is provided on each of the first door 711 and the second door 712. This makes it possible to easily open and close the first door 711 and the second door 712. As shown in FIGS. 15 and 16, a cylinder block 740 is fixed near the upper portion of the opening portion 713 of the side cover 71 a (for example, 0 mm or more and 50 mm or less). The cylinder 740 is a person who can freely enter and exit the piston rod 740a. And, when the piston rod 740a protrudes downward, it can be fastened to the lock member 43 (refer FIG. 15) provided in the surface of the positive side of the X direction of the 1st door 711 (refer FIG. 15). The cylinder 740 is electrically connected to the control unit 180, and its operation is controlled by the control unit 180. In addition, in this embodiment, the cylinder block 740 can maintain not only the closed state of the first door 711 but also the closed state of the second door 712. That is, the cylinder block 740 is a piston rod 740a that can be integrally engaged with the lock member 43 of the first door 711 and the lock member 43 of the second door 712. Therefore, the closed states of the first and second doors 711 and 712 can be maintained uniformly. When the piston rod 740a is retracted upward, the engagement with the lock member 43 is released, and the first door 711 can be opened (see FIG. 16). As described above, the inspection device 101 includes a cylinder 740 and a lock member 43 as locking portions that switch between maintaining the closed state of the first door 711 and releasing the closed state. This prevents an operator of the inspection device 101 from accidentally opening the first door 711 while the IC device 90 is being transported. In addition, on the front side of the first door 711, that is, the front side in the X direction in FIG. 13, a notification unit 5 is provided to notify whether the opening / closing unit 4 can be opened or closed. The notification unit 5 includes a monitor 151 configured by a circular LCD (Liquid Crystal Display). The monitor 151 is electrically connected to the control unit 180, and its operation is controlled by the control unit 180. The notification unit 5 is provided in the first door 711, the first door 721, the first door 731, the second door 732, and the third door 733, but in the following, the notification unit 5 is provided in the first door 711 The notification unit 5 will be described representatively. As shown in FIGS. 14 and 16, in a state where the first door 711 and the second door 712 can be opened, the text “OK” is displayed on the monitor 151. On the other hand, as shown in FIG. 13, in a state where the first door 711 and the second door 712 are restricted from being opened, a text “NO” is displayed on the monitor 151. Further, on the monitor 151, it is preferable that the color of the text when "OK" is displayed is different from the color of the text when "Not available" is displayed. In the monitor 151, it is preferable that the background color of the text when "OK" is displayed is different from the background color of the text when "Not available" is displayed. With such a configuration, the operator can easily recognize it. In the inspection device 101, by installing the monitor 151 on the opening and closing section 4, that is, the first door 711, the operator can open and close the first door 711 and the second door 712 when the operator performs Visual recognition with higher accuracy. As shown in FIG. 13, the monitor 151 is preferably disposed at a height H of 600 mm or more and 2000 mm or less from the installation surface M of the installation inspection device 101, and more preferably 900 mm or more and 1700 mm or more. Position of height H below. Thereby, regardless of the height of the operator, the monitor 151 can be easily observed, and the operator can recognize the monitor 151 with high accuracy. Here, as described above, the inspection device 101 is a person performing a high-temperature inspection or a low-temperature inspection. In particular, when a low-temperature inspection is performed, a cooling gas (for example, nitrogen) is enclosed in the inspection device 101, so that the concentration of the cooling gas becomes high. Therefore, it is not suitable for the operator to perform the opening operation of the opening / closing section 4 in this state. Therefore, in this invention, it is a structure effective in preventing abnormality. Hereinafter, the control operation of the control unit 180 will be described based on the flowchart shown in FIG. 17. In the following, a case where the inspection device 101 is temporarily stopped during the low-temperature inspection, and the first and second doors 711 and 712 are opened to perform maintenance in the supply area A2 will be described. In addition, during the operation of the inspection device 101, as shown in FIG. 13, the notification section 5 displays the word "impossible". First, the operator operates the operation panel 700 to stop the operation of the inspection device 101, and presses the release button (not shown) of the cylinder 740 and the locking member 43 that is engaged. In step S101, the concentration N of the cooling gas in the supply area A2 is detected by the concentration sensor 800. Then, in step S102, the calculated concentration N becomes smaller than a specific value N previously stored in the storage unit 183. ₀ The time required before is the remaining time before it becomes possible to open the first door 711 and the second door 712. This calculation is performed based on the obtained calibration curve (not shown) by measuring and decreasing the concentration N over time. Next, in step S103, the time calculated in step S102 is displayed on the monitor 151 (refer to FIG. 15). In FIG. 15, a number “15” is displayed on the monitor 151, indicating that the remaining time is 15 seconds. The remaining time displayed on the monitor 151 is counted down as time passes, and the displayed number gradually decreases. In this way, the monitor 151 displays (reports) the remaining time before the information becomes that the first door 711 and the second door 712 can be opened. Thereby, for example, the operator can grasp the time before it becomes possible to open the first door 711 and the second door 712. Therefore, the operator can perform other operations before performing the operation of opening the first and second doors 711 and 712, and can improve the operation efficiency. Then, in step S104, the concentration N of the cooling gas detected by the concentration sensor 800 is compared with the specific value N memorized by the memory unit 183. ₀ . In addition, the specific value N ₀ It is a value indicating the concentration of the cooling gas, and is a value that is low enough to the operator. It is determined that the concentration N of the cooling gas is a specific value N ₀ In the above case (S104; NO), the comparison is continued. In step S104, it is determined that the concentration N is lower than a specific value N ₀ In the case (S104; YES), the engagement of the cylinder 740 and the lock member 43 is released in step S105 (see FIG. 16). Then, in step S106, it is notified that the first door 711 and the second door 712 can be opened. In this embodiment, as shown in FIG. 16, the word “OK” is displayed on the monitor 151. This allows the operator to recognize that the first door 711 and the second door 712 can be opened. Therefore, although the decrease in the concentration N of the cooling gas is insufficient, it is possible to prevent the operator from setting the first and second doors 711 and 712 to the open state. Therefore, the safety of the operator can be ensured. In addition, if the operator wants to open the first door 711 and the second door 712 in the closed state where the cylinder 740 and the locking member 43 are engaged, the cylinder 740 and the locking member 43 are also determined depending on the strength thereof. Risk of breakage. The inspection device 101 is configured to release the engagement between the cylinder 740 and the lock member 43 to open the first door 711 and the second door 712, and the notification unit 5 notifies the intention. This can prevent the cylinder 740 and the lock member 43 from being damaged. Further, in step S106, not only the notification that the first door 711 and the second door 712 can be opened is notified by the notification unit 5, but the intention is also displayed on the monitor 300. That is, the monitor 300 indicates whether or not the first door 711 and the second door 712 can be opened or closed. Thereby, even if the operator is located far away from the first and second doors 711 and 712, the operator can recognize that the first and second doors 711 and 712 can be opened. In addition, in the inspection device 101, since the notification unit 5 uses light to notify the operator, the operator can recognize with high accuracy whether the first and second doors 711 and 712 can be opened and closed. The first door 711 and the second door 712 are made of a material having light transmittance. Therefore, the operator can visually recognize the operating states of the cylinder 740 and the lock member 43. That is, it can be said that the notification section 5 has a window section that can visually recognize the operating states of the cylinder 740 and the lock member 43. With this, for example, even if the monitor 151 is omitted and the configuration of the notification unit 5 is simplified, the operator can grasp the opening and closing of the first door 711 and the second door 712 by viewing the operating states of the cylinder 740 and the lock member 43. Is it possible. In this way, according to the electronic component conveying device 10, the operator can recognize whether the opening / closing section 4 can be opened or closed. Therefore, for example, it is possible to prevent the operator from setting the opening / closing unit 4 to the open state even though the inside of the electronic component transporting device 10 is in a poor state for the operator. This ensures the safety of the operator. In addition, the inspection device 101 including the electronic component transfer device 10 and the inspection unit 116 can also ensure the safety of the operator. <Fourth Embodiment> FIGS. 18 and 19 are diagrams showing an opening and closing section and a notification section provided in the electronic component inspection apparatus (fourth embodiment) of the present invention. Hereinafter, the fourth embodiment of the electronic component transfer device and the electronic component inspection device of the present invention will be described with reference to the drawings, but the differences from the third embodiment described above will be mainly described, and the same matters will be omitted. Instructions. In the inspection device 101a of this embodiment, the notification section 5a has a first display H1 of "OK" provided in the first door 711a as the window portion, and a second display of "No" provided in the first door 711a. H2, and an identification plate 152 as an identification portion connected to the piston rod 740a. The first display H1 is provided near the corner of the positive side in the Z direction and the negative side in the Y direction of the first door 711a. The first display H1 is a display in which the first door 711a and the second door 712 can be opened. The second display H2 is located on the negative side of the Z direction as an example of a different position of the first display H1. The second display H2 is a display-restricted display in which the first door 711a and the second door 712 are set to the open state. The first display H1 and the second display H2 are composed of, for example, printing using ink, or attachments. The first display H1 and the second display H2 are preferably relatively light colors such as white. The identification plate 152 is constituted by a plate member fixed to an end portion on the negative side in the Z direction of the piston rod 740a. The identification plate 152 has a relatively dark color such as black. As shown in FIG. 18, the identification plate 152 is comprised in the 1st position which overlaps the 1st door 711 and the 1st display H1 in the state which the piston rod 740a retracted, ie, can be set to an open state. On the other hand, as shown in FIG. 19, the identification plate 152 is configured to be located at the second position overlapping the second display H2 between the first door 711 and the second display H2 in a state where the piston rod 740a is protruding, that is, a state where the restriction is set to the open state. position. In a state where the first display H1 and the identification plate 152 overlap, the first display H1 can be more noticeable than the second display H2 by the identification plate 152. Thereby, the operator can easily recognize that it can be turned on. On the other hand, in a state where the second display H2 and the identification plate 152 overlap, the second display H2 can be more noticeable than the first display H1 by the identification plate 152. Thereby, the operator can easily recognize that the restriction is set to the on state. In this way, the identification plate 152 can be moved between the first position and the second position by interlocking with the operating state of the piston rod 740a to identify whether the first and second doors 711 and 712 can be opened and closed. According to this embodiment, the monitor 151 of the third embodiment can be omitted. Therefore, the configuration of the notification unit 5a can be simplified, and the cost can be reduced. Although the electronic component transfer device and the electronic component inspection device of the present invention have been described above with reference to the illustrated embodiments, the present invention is not limited to this, and the parts constituting the electronic component transfer device and the electronic component inspection device may be replaced with Any constituent who performs the same function. Moreover, you may add arbitrary structures. In addition, the electronic component transfer device and the electronic component inspection device of the present invention may be a combination (a feature) of any two or more of the embodiments described above. In addition, in the third and fourth embodiments described above, although the notification unit is both the notification of whether the opening and closing unit can be opened and closed, that is, the purpose of notifying that it can be opened and the purpose of prohibiting opening, the invention is not limited to this. In this case, at least one of the intention to open and the intention to prohibit opening may be used. In the third and fourth embodiments described above, the case where the inspection device performs a low-temperature inspection is described, but the present invention can also be applied to a case where a high-temperature inspection is performed. In this case, a temperature sensor may be provided in the device supply area, and if the temperature detected by the temperature sensor becomes less than a specific value, a configuration in which it can be opened is reported. In addition, in the third embodiment described above, although the notification unit is a notification by light, in the present invention, it is not limited to this, as long as the notification is performed using at least one of light and sound. That is, the notification using light may be omitted, and the notification may be performed using only sound, or the notification may be performed using both light and sound. In addition, in the third and fourth embodiments described above, although the notification section is provided in the opening and closing section, it is not limited to this in the present invention, and may be provided near the opening and closing section, for example, at a position away from the opening and closing section. . The display section of the notification section may be a display using an LED (Light Emitting Diode). In the third and fourth embodiments described above, although the opening / closing section is opened and closed by rotation, it is not limited to this in the present invention, and may be, for example, due to the X direction, Y direction, and Z direction. Either of them slides to open and close the operator. In the third embodiment described above, the notification unit is an example of displaying the remaining time as information before it can be opened and closed. However, in the present invention, the notification unit is not limited to this. For example, the percentage may be displayed. Those who know the remaining time.

1‧‧‧Inspection device (electronic parts inspection device)

1a‧‧‧Inspection device (electronic parts inspection device)

3A‧‧‧ Dry Air Supply Department

3B‧‧‧ Dry Air Supply Department

4‧‧‧ opening and closing department

4A‧‧‧Ion generating department

4B‧‧‧Ion generating department

4B ₁ ‧‧‧Ion generation unit

4B ₂ ‧‧‧Ion generation unit

5‧‧‧Information Department

5a‧‧‧Notification Department

5A‧‧‧Jet Department

5B‧‧‧ Spray Department

5B ₁ ‧‧‧ Spray Department

5B ₂ ‧‧‧ Spray Department

5C‧‧‧Jet Department

6‧‧‧ Transport Department

8A‧‧‧Storage

8B‧‧‧Storage

8C‧‧‧Storage

10‧‧‧Electronic parts transfer device

10A‧‧‧The first temperature adjustment unit

10B‧‧‧Second temperature adjustment unit

10Ba‧‧‧Second temperature adjustment unit

11A‧‧‧Tray transfer mechanism

11B‧‧‧Tray transfer mechanism

12‧‧‧Temperature Adjustment Department

13‧‧‧ device transfer head

14‧‧‧Device Supply Department

15‧‧‧pallet transfer mechanism

16‧‧‧ Inspection Department

17‧‧‧ device transfer head

18‧‧‧Device Recycling Department

19‧‧‧Recycling tray

20‧‧‧ device transfer head

21‧‧‧Tray transfer mechanism

22A‧‧‧Tray transfer mechanism

22B‧‧‧Tray transfer mechanism

31‧‧‧ tube body

32‧‧‧ tube body

41a‧‧‧Edge (Edge)

41b‧‧‧Edge (Edge)

41c‧‧‧Edge (Edge)

41d‧‧‧Edge (Edge)

42‧‧‧Rotation support

43‧‧‧Locking member

51‧‧‧ tube body

52‧‧‧ tube body

53‧‧‧tube body

54‧‧‧ plate member (sheet body)

61‧‧‧The first partition

62‧‧‧Second partition

63‧‧‧3rd partition

64‧‧‧ 4th partition

65‧‧‧ 5th partition

66‧‧‧Inner partition

70‧‧‧ front cover

71‧‧‧side cover

71a‧‧‧side cover

72‧‧‧side cover

72a‧‧‧side cover

73‧‧‧ rear cover

73a‧‧‧back cover

74‧‧‧Top cover

75‧‧‧4th door

76‧‧‧Frame

80‧‧‧Control Department

81‧‧‧Storage body

82‧‧‧Brake

83‧‧‧ sidewall

84‧‧‧Top plate

85‧‧‧ sidewall

86‧‧‧Top plate

90‧‧‧IC device

101‧‧‧Inspection device (electronic parts inspection device)

101a‧‧‧Inspection device

112‧‧‧Temperature Adjustment Department

114‧‧‧Device Supply Department

116‧‧‧ Inspection Department

117‧‧‧device transfer head

118‧‧‧Device Recycling Department

121‧‧‧ cooling components

122‧‧‧Heating components

123‧‧‧Electronic component placement department

124‧‧‧Groove (recess)

125‧‧‧ Top surface

131‧‧‧ Adsorption Department

141‧‧‧cooling component

142‧‧‧Heating components

143‧‧‧Electronic component placement department

144‧‧‧Groove (recess)

145‧‧‧upper surface

151‧‧‧Monitor

152‧‧‧Identification board

180‧‧‧Control Department

181‧‧‧Drive Control Department

182‧‧‧ Inspection Control Department

183‧‧‧Memory Department

200‧‧‧ tray (mounting member)

300‧‧‧ monitor

301‧‧‧display

311‧‧‧ side hole

321‧‧‧Side hole

400‧‧‧ signal light

500‧‧‧Speaker

511‧‧‧spout

521‧‧‧Spout

522‧‧‧Spout

531‧‧‧Spout

532‧‧‧Spout

541‧‧‧Spout

600‧‧‧Mouse Station

700‧‧‧ operation panel

711‧‧‧first door

711a‧‧‧first door

712‧‧‧The second door

713‧‧‧ opening

714‧‧‧handle

721‧‧‧first door

722‧‧‧The second door

731‧‧‧first door

732‧‧‧The second door

733‧‧‧first door

740‧‧‧cylinder

740a‧‧‧Piston rod

800‧‧‧Concentration sensor

841‧‧‧ opening

861‧‧‧ opening

900‧‧‧ Dry Air Production Department

A1‧‧‧Tray supply area

A2‧‧‧Device supply area (supply area)

A3‧‧‧ Inspection area

A4‧‧‧device recycling area (recycling area)

A5‧‧‧Tray removal area

DA‧‧‧ Dry Air

H‧‧‧ height

H1‧‧‧The first display

H2‧‧‧ 2nd display

IA‧‧‧ ionized air

L ₁ ‧‧‧ line 1

L ₂ ‧‧‧ line 2

M‧‧‧ Setting surface

O ₁₆ ‧‧‧ Centerline

O ₅₁₁ ‧‧‧ Centerline

O ₅₂₁ ‧‧‧ Centerline

S101 ～ S106‧‧‧step

X‧‧‧ axis (direction)

Y‧‧‧axis (direction)

Z‧‧‧axis (direction)

α _11A ‧‧‧ Arrow

α _11B ‧‧‧ Arrow

α _13X ‧‧‧ Arrow

α _13Y ‧‧‧ Arrow

α ₁₄ ‧‧‧arrow

α ₁₅ ‧‧‧arrow

α _17Y ‧‧‧ Arrow

α ₁₈ ‧‧‧ arrow

α _20X ‧‧‧ Arrow

α _20Y ‧‧‧ Arrow

α ₂₁ ‧‧‧ Arrow

α _22A ‧‧‧ Arrow

α _22B ‧‧‧ Arrow

α ₇₁ ‧‧‧arrow

α ₇₂ ‧‧‧arrow

α ₇₅ ‧‧‧arrow

α ₉₀ ‧‧‧ arrow

α ₇₃₁ ‧‧‧arrow

α ₇₃₂ ‧‧‧arrow

α ₇₃₃ ‧‧‧arrow

FIG. 1 is a schematic perspective view of a first embodiment of the electronic component inspection device according to the present invention as viewed from the front side. FIG. 2 is a schematic plan view showing an operating state of the electronic component inspection device shown in FIG. 1. FIG. 3 is a cross-sectional view of a horizontal portion of a temperature-equalizing plate and a periphery thereof provided in the electronic component inspection device shown in FIG. 1. Fig. 4 is a sectional view taken along the line A-A in Fig. 3 (showing a state in which the shutter is closed). Fig. 5 is a sectional view taken along the line A-A in Fig. 3 (showing a state in which the shutter is opened). Fig. 6 is a sectional view taken along the line B-B in Fig. 3. FIG. 7 is a horizontal partial cross-sectional view of a supply shuttle plate and its surroundings provided in the electronic component inspection device shown in FIG. 1. Fig. 8 is a sectional view taken along the line C-C in Fig. 7. FIG. 9 is a plan view of a supply shuttle plate and its periphery provided in the electronic component inspection device (second embodiment) of the present invention. Fig. 10 is a schematic perspective view of the electronic component inspection device (third embodiment) of the present invention as viewed from the front side. FIG. 11 is a plan view of the electronic component inspection device shown in FIG. 10. FIG. 12 is a block diagram of the electronic component inspection apparatus shown in FIG. 10. FIG. 13 is a diagram showing an opening and closing section and a notification section included in the electronic component inspection apparatus shown in FIG. 10. FIG. 14 is a diagram showing an opening and closing section and a notification section included in the electronic component inspection apparatus shown in FIG. 10. FIG. 15 is a diagram showing an opening and closing section and a notification section included in the electronic component inspection apparatus shown in FIG. 10. FIG. 16 is a diagram showing an opening and closing section and a notification section included in the electronic component inspection apparatus shown in FIG. 10. FIG. 17 is a flowchart showing a control operation of the electronic component inspection device shown in FIG. 10. FIG. 18 is a diagram showing an opening / closing section and a reporting section provided in the electronic component inspection apparatus (the fourth embodiment) of the present invention. FIG. 19 is a diagram showing an opening / closing section and a reporting section provided in the electronic component inspection apparatus (the fourth embodiment) of the present invention.

Claims (13)

An electronic component transporting device, comprising: a dry air supply unit that can supply dry air; an ion generating unit that can ionize the dry air; an injection unit that can spray the ionized dry air; and an electronic part A arranging part that can arrange and cool electronic parts; and a storage part that can store the electronic part placement part and includes an opening through which the electronic part can pass; and the storage part includes a plurality of the openings and includes opening and closing A plurality of opening shutters; the spraying section includes at least one spraying port capable of spraying the ionized dry air; the spraying port is configured to spray the ionized ions between the electronic component disposition section and the shutter Into dry air. For example, the electronic component transfer device according to claim 1, wherein the storage unit is included in an exterior of the electronic component transfer device. For example, the electronic component transfer device of claim 1 or 2, wherein the dry air from the dry air supply unit and the dry air from the ion generating unit are lower than the humidity on the outside of the exterior. For example, the electronic component transfer device of claim 1 or 2, wherein the pressure inside the storage portion is higher than the pressure outside the storage portion. For example, the electronic component conveying device of claim 1 or 2, wherein the above-mentioned electronic component disposition unit is a temperature equalizing plate that can adjust the temperature of the above-mentioned electronic components. For example, the electronic component transfer device of item 1 or 2, wherein the electronic component disposition unit is a shuttle board capable of transferring the electronic component. For example, the electronic component transfer device of claim 1 or 2, wherein the height of the ejection opening is higher than the upper surface of the electronic component disposition portion. For example, the electronic component transfer device according to claim 1 or 2, wherein the position of the ion generating portion is higher than that of the electronic component disposing portion. For example, if the electronic component transfer device of claim 1 or 2 is viewed from above, the number of the ion generating portions is at least one around the electronic component placing portion. For example, the electronic component transfer device according to claim 1 or 2, wherein the electronic component disposition portion includes a concave portion for arranging the electronic components one by one; and the position of the ejection outlet is above the concave portion. According to the electronic component transfer device of claim 10, wherein the installation position of the ejection port corresponds to each of the recesses. For example, the electronic component transfer device of claim 1 or 2, wherein the above-mentioned ejection outlets are provided with a plurality of; and the above-mentioned plural ejection outlets are arranged in a plane direction. An electronic component inspection device, comprising: a dry air supply unit that can supply dry air; an ion generating unit that can ionize dry air; an injection unit that can spray the ionized dry air; and an electronic part A arranging part that can arrange and cool electronic parts; a storage part that can store the electronic part placement part and includes an opening through which the electronic parts can pass; and an inspection part that checks the electronic parts; and the storage part includes The plurality of openings, and a shutter for opening and closing the plurality of openings; the spraying section includes at least one spraying port that can spray the ionized dry air; the spraying port is configured to be able to be connected to the electronic component disposing section and The ionized dry air is sprayed between the shutters.