以下，基於參照附加圖式之較佳實施形態對本發明之電子零件搬送裝置及電子零件檢查裝置進行詳細說明。 另，於以下，為了便於說明，將圖中所示之相互正交之3軸設為X軸、Y軸及Z軸。又，包含X軸與Y軸之XY平面成為水平，Z軸成為鉛垂。又，將平行於X軸之方向亦稱為「X方向」，將平行於Y軸之方向亦稱為「Y方向」，將平行於Z軸之方向亦稱為「Z方向」。又，將各方向之箭頭朝向之方向稱為「正」，將其相反方向稱為「負」。 又，有時亦將Z方向正側稱為「上(或上方)」，將Z方向負側稱為「下(或下方)」。又，於檢查裝置中，將電子零件之搬送方向之上游側亦簡稱為「上游側」，將下游側亦簡稱為「下游側」。又，於本案說明書言及之「水平」並非限定於完全水平，只要不阻礙電子零件之搬送，則亦包含相對於水平略微(例如不滿5°左右)傾斜之狀態。 又，於以下之實施形態中，檢查裝置(電子零件檢查裝置)係用以搬送例如BGA(Ball Grid Array：球狀柵格陣列)封裝或LGA(Land Grid Array：平台柵格陣列)封裝等IC器件、LCD(Liquid Crystal Display：液晶顯示器)、CIS(CMOS Image Sensor：CMOS影像感測器)等電子零件，並於其搬送過程中檢查、試驗(以下簡稱為「檢查」)電性特性之裝置。另，於以下，為了便於說明，針對使用IC器件作為進行檢查之上述電子零件之情形為代表進行說明，且將其設為「IC器件90」。 另，檢查裝置係以配置有托盤供給區域A1、托盤去除區域A5之側(例如圖2中之Y方向負側)成為正面側，且以其相反側、即配置有檢查區域A3、或檢查區域A30之側(例如圖2中之Y方向正側)作為背面側使用。 ＜第1實施形態＞ 以下，參照圖1～圖7對本發明之電子零件搬送裝置及電子零件檢查裝置之第1實施形態進行說明。 另，本說明書中之「作用部」係指於電子零件搬送裝置或檢查裝置之各部中，加熱或冷卻IC器件90、並搬送IC器件90，即，藉由對IC器件90進行特定作用而造成某種影響之部位。 如圖1及圖2所示，檢查裝置1具備搬送IC器件90之電子零件搬送裝置10與檢查部16。電子零件搬送裝置10至少包含進行特定作用之作用部、報知部40、操作部50、及控制部80。 如圖2所示，檢查裝置1分成托盤供給區域A1、器件供給區域(以下簡稱為「供給區域」)A2、檢查區域A3、器件回收區域(以下簡稱為「回收區域」)A4、及托盤去除區域A5。且，IC器件90係藉由電子零件搬送裝置10搬送，而自托盤供給區域A1依序經由上述各區域搬送至托盤去除區域A5，且於中途之檢查區域A3內之檢查部16進行檢查。 於該檢查裝置1中，亦可將自托盤供給區域A1至托盤去除區域A5之中、自搬送IC器件90之供給區域A2至回收區域A4稱為「搬送區域(Delivery area)」。 托盤供給區域A1係被供給排列有未檢查狀態之複數個IC器件90之托盤(配置構件)200之供材部。於托盤供給區域A1中，可堆疊多個托盤200。 供給區域A2係將配置於來自托盤供給區域A1之托盤200上之複數個IC器件90分別供給至檢查區域A3之區域。另，以跨及托盤供給區域A1與供給區域A2之方式，設置有逐片搬送托盤200之托盤搬送機構11A、11B。 於供給區域A2，設置有溫度調整部(均熱板)12、器件搬送頭13、及托盤搬送機構(第1搬送裝置)15。 溫度調整部12係載置複數個IC器件90之載置部，且可將該等複數個IC器件90加熱或冷卻。藉此，可將IC器件90調整為適於檢查之溫度。於圖2所示之構成中，溫度調整部12係於Y方向上配置並固定有2個。且，藉由托盤搬送機構11A自托盤供給區域A1搬入(搬送來)之托盤200上之IC器件90係被搬送至任一溫度調整部12，並載置。 器件搬送頭13被支持為可於供給區域A2內移動。藉此，器件搬送頭13可承擔自托盤供給區域A1搬入之托盤200與溫度調整部12之間之IC器件90之搬送、及溫度調整部12與後述之器件供給部14之間之IC器件90之搬送。 托盤搬送機構15係使經去除所有IC器件90之狀態之空的托盤200於供給區域A2內於X方向上搬送之機構。且，於該搬送後，空的托盤200係藉由托盤搬送機構11B自供給區域A2返回至托盤供給區域A1。 檢查區域A3係檢查IC器件90之區域。於該檢查區域A3，設置有器件供給部(供給梭)14、檢查部16、器件搬送頭17、及器件回收部(回收梭)18。 器件供給部14係載置經溫度調整後之IC器件90之載置部，且可將該IC器件90搬送至檢查部16附近。該器件供給部14被支持為可於供給區域A2與檢查區域A3之間沿著X方向移動。又，於圖2所示之構成中，器件供給部14係於Y方向上配置有2個，且溫度調整部12上之IC器件90被搬送至任一器件供給部14，並載置。 檢查部16係檢查、試驗IC器件90之電性特性之單元。於檢查部16，設置有以保持IC器件90之狀態與該IC器件90之端子電性連接之複數個探針銷。且，將IC器件90之端子與探針銷電性連接(接觸)，而經由探針銷進行IC器件90之檢查。另，於檢查部16中，與溫度調整部12相同，可將IC器件90加熱或冷卻，而將該IC器件90調整為適於檢查之溫度。 於本實施形態中，於檢查部16，設置有以凹部構成之4個凹槽161～164。該等4個凹槽161～164係配置成2列2行之矩陣狀。 器件搬送頭17被支持為可於檢查區域A3內移動。藉此，器件搬送頭17可將自供給區域A2搬入之器件供給部14上之IC器件90搬送至檢查部16上，並載置。 另，於檢查裝置1中，器件搬送頭17具有2條臂171、172。IC器件90係藉由臂171、172之任一者配置於檢查部16上。 器件回收部18係載置於檢查部16之檢查結束後之IC器件90之載置部，且可將該IC器件90搬送至回收區域A4。該器件回收部18被支持為可於檢查區域A3與回收區域A4之間沿著X方向移動。又，於圖2所示之構成中，器件回收部18與器件供給部14相同，於Y方向上配置有2個，且檢查部16上之IC器件90被搬送至任一器件回收部18，並載置。該搬送係藉由器件搬送頭17進行。 回收區域A4係回收結束檢查之複數個IC器件90之區域。於該回收區域A4，設置有回收用托盤19、器件搬送頭20、及托盤搬送機構(第2搬送裝置)21。又，於回收區域A4，亦準備有空的托盤200。 回收用托盤19係載置IC器件90之載置部，且固定於回收區域A4內，於圖2所示之構成中，沿著X方向配置有3個。又，空的托盤200亦為載置IC器件90之載置部，且沿著X方向配置有3個。且，移動至回收區域A4之器件回收部18上之IC器件90被搬送至該等回收用托盤19及空的托盤200中之任一者，並載置。藉此，IC器件90依每次檢查結果被回收，並分類。 器件搬送頭20被支持為可於回收區域A4內移動。藉此，器件搬送頭20可將IC器件90自器件回收部18搬送至回收用托盤19或空的托盤200。 托盤搬送機構21係使自托盤去除區域A5搬入之空的托盤200於回收區域A4內於X方向上搬送之機構。且，於該搬送後，空的托盤200會被配置於回收IC器件90之位置。即，可成為上述3個空的托盤200中之任一者。 於如此之檢查裝置1中，於回收區域A4設置有托盤搬送機構21，且除此以外，於供給區域A2設置有托盤搬送機構15。藉此，相較於例如藉由1個搬送機構進行空的托盤200向X方向之搬送，可謀求處理量(平均單位時間之IC器件90之搬送個數)之提高。 另，作為托盤搬送機構15、21之構成，並未特別限定，可列舉例如具有吸附托盤200之吸附構件、與將該吸附構件支持為可於X方向上移動之滾珠螺桿等支持機構之構成。 托盤去除區域A5係將排列有完成檢查狀態之複數個IC器件90之托盤200回收並去除之卸材部。於托盤去除區域A5中，可堆疊多個托盤200。 又，以跨及回收區域A4與托盤去除區域A5之方式，設置有逐片搬送托盤200之托盤搬送機構22A、22B。托盤搬送機構22A係將載置有完成檢查之IC器件90之托盤200自回收區域A4搬送至托盤去除區域A5之機構。托盤搬送機構22B係將用以回收IC器件90之空的托盤200自托盤去除區域A5搬送至回收區域A4之機構。 又，於供給區域A2，設置有旋轉載台23A。該旋轉載台23A呈圓盤狀，且以可繞著Z軸旋轉之載置台構成。於該旋轉載台23A載置IC器件90之狀態下，可藉由旋轉載台23A旋轉，而變更IC器件90之方向。 又，於回收區域A4，亦設置有旋轉載台23B。該旋轉載台23B呈圓盤狀，且以可繞著Z軸旋轉之載置台構成。於該旋轉載台23B載置有IC器件90之狀態下，可藉由旋轉載台23B旋轉，而變更IC器件90之方向。 於如以上之檢查裝置1中，除溫度調整部12或檢查部16以外，器件搬送頭13、器件供給部14、器件搬送頭17亦構成為可加熱或冷卻IC器件90。藉此，IC器件90於搬送期間溫度被維持為固定。並且，於以下，就對IC器件90進行冷卻，而於例如-60℃～-40℃之範圍內之低溫環境下進行檢查之情形進行說明。 如圖2所示，檢查裝置1係藉由第1分隔壁61劃分(隔開)托盤供給區域A1與供給區域A2之間，藉由第2分隔壁62劃分供給區域A2與檢查區域A3之間，藉由第3分隔壁63劃分檢查區域A3與回收區域A4之間，藉由第4分隔壁64劃分回收區域A4與托盤去除區域A5之間。且，供給區域A2與回收區域A4之間亦藉由第5分隔壁65劃分。該等分隔壁具有保持各區域之氣密性之功能。 此外，檢查裝置1係最外裝以蓋覆蓋，且該蓋有前蓋70、側蓋71及72、及後蓋73。 且，供給區域A2成為藉由第1分隔壁61、第2分隔壁62、第5分隔壁65、側蓋71及後蓋73區劃出之第1室R1。於第1室R1，將未檢查狀態之複數個IC器件90連托盤200在內一併搬入。 檢查區域A3成為藉由第2分隔壁62、第3分隔壁63及後蓋73區劃出之第2室R2。又，於第2室R2，於較後蓋73更內側配置有內側分隔壁66。 回收區域A4成為藉由第3分隔壁63、第4分隔壁64、第5分隔壁65、側蓋72及後蓋73區劃出之第3室R3。於第3室R3，將檢查結束之複數個IC器件90自第2室R2搬入。 如圖2所示，於側蓋71，設置有第1擋門(左側第1擋門)711與第2擋門(左側第2擋門)712。藉由打開第1擋門711或第2擋門712，可進行例如於第1室R1內之維護或IC器件90夾住之解除等(以下，將該等統稱為「作業」)。另，第1擋門711與第2擋門712構成為相互於相反方向開閉。又，於在第1室R1內之作業時，該第1室R1內之器件搬送頭13等之可動部停止。 同樣，於側蓋72，設置有第1擋門(右側第1擋門)721與第2擋門(右側第2擋門)722。藉由打開第1擋門721或第2擋門722，可進行例如於第3室R3內之作業。另，第1擋門721與第2擋門722亦相互於相反方向開閉。又，於在第3室R3內之作業時，該第3室R3內之器件搬送頭20等之可動部停止。 又，於後蓋73，亦設置有第1擋門(背面側第1擋門)731、第2擋門(背面側第2擋門)732、及第3擋門(背面側第3擋門)733。藉由打開第1擋門731，可進行例如於第1室R1內之作業。藉由打開第3擋門733，可進行例如於第3室R3內之作業。 此外，於內側分隔壁66，設置有第4擋門75。並且，藉由打開第2擋門732及第4擋門75，可進行例如於第2室R2內之作業。另，第1擋門731、第2擋門732及第4擋門75係於相同方向開閉，且第3擋門733係於與該等擋門相反方向開閉。又，於在第2室R2內之作業時，該第2室R2內之器件搬送頭17等之可動部停止。 並且，藉由關閉各擋門，可確保於對應之各室之氣密性或絕熱性。 如圖1所示，報知部40具有顯示各部之驅動或檢查結果等之監視器41、燈42、及蜂鳴器43。 監視器41可以例如發光之液晶顯示面板或有機EL等之顯示面板等構成。監視器41配置於檢查裝置1之圖中上方右側(X方向正側)。作業者可經由該監視器41設定、確認檢查裝置1之各種處理或條件等。 燈42配置於檢查裝置1之圖中上方左側(X方向負側)。該燈42係由控制部80控制作動。蜂鳴器43係由控制部80控制作動。 操作部50係滑鼠501等之輸入器件，其將對應於由作業者操作之操作信號輸出至控制部80。因此，作業者可使用滑鼠501對控制部80進行各種處理等之指示。滑鼠501可如圖1所示般配置於檢查裝置1之圖中右側、且接近監視器41(報知部40)之位置。又，於本實施形態中，雖使用滑鼠501作為操作部50，但操作部50並非限定於此，亦可為例如鍵盤、軌跡球、觸控面板等之輸入器件等。 如圖3所示，控制部80具有驅動控制部81、檢查控制部82、記憶部83、運算部84、判斷部85、及發送部86。另，藉由記憶部83、運算部84及判斷部85構成更換時期推定部100。 驅動控制部81控制托盤搬送機構11A、11B、溫度調整部12、器件搬送頭13、器件供給部14、托盤搬送機構15、檢查部16、器件搬送頭17、器件回收部18、器件搬送頭20、托盤搬送機構21、及托盤搬送機構22A、22B之各部之驅動。 檢查控制部82基於記憶部83所記憶之程式，進行配置於檢查部16之IC器件90之電性特性之檢查等。 記憶部83係以例如RAM(Random-Access Memory：隨機存取記憶體)等揮發性記憶體、ROM(Read-Only Memory：唯讀記憶體)等非揮發性記憶體、EPROM(Erasable and Programmable Read Only Memory：可抹除可程式化唯讀記憶體)、EEPROM(Electronically Erasable and Programmable Read Only Memory：電子可抹除可程式化唯讀記憶體)、快閃記憶體等可重寫(可抹除、重寫)之非揮發性記憶體等、各種半導體記憶體(IC記憶體)等構成。 此處，檢查裝置1必須於較短時間內進行多個IC器件90之檢查，即要求高處理量。為實現較高處理量，於檢查裝置1中，要求各部之高速下之動作、急劇之加減速、頻繁之導通/關斷操作等。又，由於同時把持或搬送多個IC器件90，故各部成為複雜之構成。又，於檢查裝置1中，於管理溫度、濕度等環境之狀態下進行IC器件90之檢查。進而，由於為了提高處理量，而管理各部之位置資訊，使各部聯合作動，故要求各部之回應性等、較高之可靠性。 如此，檢查裝置1，可為複雜之構成，且進行繁瑣之操作。例如，與進行曝光或蝕刻等，而製造IC器件90之製造裝置相比，檢查裝置1之複雜構成亦較特異。 此處，作為構成檢查裝置1之「檢查裝置1之各部之零件」，於以下之表1顯示代表性者。於該表1中，縱排記載有零件名，橫排記載有各部之名稱。 [表1]於托盤搬送機構11A，搭載有皮帶、馬達、軸承、及缸體。於托盤搬送機構11B，搭載有皮帶、馬達、軸承、及缸體。於溫度調整部12，搭載有加熱器。於器件搬送頭13，搭載有泵、滾珠螺桿、線性導引器、加熱器、馬達、軸承、缸體、閥門、及噴射器。於器件供給部14，搭載有皮帶、線性導引器、加熱器、馬達、及軸承。於托盤搬送機構15，搭載有泵、皮帶、線性導引器、馬達、及軸承。於檢查部16，搭載有加熱器。 於器件搬送頭17，搭載有泵、滾珠螺桿、加熱器、馬達、缸體、閥門、襯套、噴射器、及隔膜。於器件回收部18，搭載有線性導引器、加熱器、馬達、及軸承。於器件搬送頭20，搭載有泵、滾珠螺桿、線性導引器、加熱器、馬達、軸承、缸體、閥門、及噴射器。於托盤搬送機構21，搭載有泵、滾珠螺桿、線性導引器、馬達、軸承、缸體、閥門、及噴射器。於托盤搬送機構22A，搭載有皮帶、馬達、軸承、及缸體。於托盤搬送機構22B，搭載有皮帶、馬達、軸承、及缸體。 另，於檢查裝置1中，各泵係於器件搬送頭13、托盤搬送機構15、器件搬送頭17、器件搬送頭20、托盤搬送機構21中使用共通之1個泵。又，於檢查裝置1中，例如線性導引器或泵等係於檢查裝置1之各部中使用適合之種類(大小等)者。 如此之檢查裝置1之各部之零件係消耗者，當接近更換時期時需要迅速地進行更換或維護。例如，於在檢查裝置1作動中各部之零件消耗而破損之情形時，需要停止檢查裝置1整體之作動，而使處理量顯著下降。又，各部之零件各者自新品之狀態至破損之期間不同，故難以個別地管理各個零件之狀態。 於檢查裝置1中，由於藉由更換時期推定部100，進行更換時期之推定，故可管理包含作用部之各部之零件之更換時期，而成為對解決如上述般之問題有效之構成。 以下，對此點進行說明。另，於以下，作為「檢查裝置1之各部之零件」，代表性地說明器件搬送頭13之線性導引器。 於記憶部83，記憶有預先決定之值即第1值T1
及第2值T2
。參照圖4對第1值T1
及第2值T2
進行說明。 圖4係橫軸以時間表示之圖表。於該圖表中，左側表示過去，右側表示未來。又，該圖表之左端表示更換為新品時、或安裝新品時。又，圖表之右端表示自新品之狀態消耗而破損之破損時期。線性導引器破損之前之累積使用時間T3
(t3
-t0
)係依線性導引器之種類而大致固定。 另，於本說明書中，自新品之狀態至破損之時期包含破損之後更換之情形之平均故障間隔MTTF(Mean Time To Failure：到故障的平均時間)、與破損之後進行修理等維護之情形之平均故障間隔MTBF(Mean Time Between Failure：平均故障間隔時間)之兩者。 第1值T1
係線性導引器自新品之狀態使用至哪種程度建議更換或維護之判斷基準。第1值T1
係短於累積使用時間T3
(t3
-t0
)之期間(t1
-t0
)。 第2值T2
係線性導引器自新品之狀態使用至哪種程度應更換或維護之判斷基準。第2值T2
係短於累積使用時間T3
(t3
-t0
)、且長於第1值T1
之期間(t2
-t0
)。 運算部84具有算出線性引導器之當前使用狀況(累積作動時間TZ
)之功能。即，運算部84算出線性導引器之當前使用狀況於圖4所示之圖表中，位於累積使用時間T3
之前之哪一位置。以下，使用圖4所示之圖表及以下之表2說明該算出方法。 如圖4之圖表所示，例如求出將線性導引器自新品之狀態初次使用之第N1次之作動時間TN1
。然後，求出其次使用之第N2次之作動時間TN2
。然後，將作動時間TN1
與作動時間TN2
相加。藉此，於第N2次之作動結束時，可獲得線性導引器之使用狀況於圖4所示之圖表中位於累積使用時間T3
之前之哪一位置。又，藉由於第3次以後亦同樣將作動之時間加上TN1
+TN2
，可獲得線性導引器之作動結束時之使用狀況。 此處，作為一例對作動時間TN1
之求出方法進行說明。以下之表2記載有「最大處理量(UPH)與實際運轉處理量(UPH)之比率」、與對應於該比率之「速度換算值」與「作動時間係數」。最大處理量係指檢查裝置1進行IC器件90之搬送及檢查時之處理量之最大值。實際運轉處理量係指實際上運轉時之處理量。速度換算值係指根據最大處理量與實際運轉處理量之比率，視為器件搬送頭13相對於器件搬送頭13之最高速度，以哪一程度之速度實際作動之比例。作動時間係數係指根據速度換算值乘以作動時間之係數。 [表2]
例如，如表2所示，最大處理量與實際運轉處理量之比率為20%以下時，速度換算值成為20%，作動時間係數為1/8。藉由將該作動時間係數1/8乘以作動時間，可求出以最高速度(最大處理量之狀態)使用時之時間。 如此，藉由計測第N1次之實際作動時間，並將該計測之作動時間乘以作動時間係數，可獲得作動時間TN1
。由於關於作動時間TN2
～TNx
亦同樣地算出，故省略其說明。 然後，判斷部85判斷累積作動時間TZ
是否達至第1值T1
及第2值T2
。又，於檢查裝置1中，於累積作動時間TZ
達至第1值T1
之情形時，對作業者如以下般報知。 如圖1及圖5所示，於檢查裝置1中，於監視器41顯示有視窗W。於視窗W中，自圖5中Z方向正側依序並排顯示有顯示累積作動時間TZ
達至第1值T1
之旨意之區域、顯示其細節之區域、及檢查裝置1之各部之概略俯視圖。 於圖示之構成中，成為器件搬送頭13之線性導引器之累積作動時間TZ
達至第1值T1
時之顯示。於概略俯視圖中，根據圖中所示之圓形標記之位置表示哪處零件之更換時期接近。 又，於檢查裝置1中，於累積作動時間TZ
達至第1值T1
之情形時、與累積作動時間TZ
達至第2值T2
時，點亮燈42。藉此，即使檢查裝置1之作業者位於遠離檢查裝置1之場所之情形時，亦可得知累積作動時間TZ
達至第1值T1
或第2值T2
。 又，於檢查裝置1中，以與燈42之點亮相同之時點蜂鳴器43作動。藉此，即使作業者未看著檢查裝置1，亦可得知累積作動時間TZ
達至第1值T1
或第2值T2
。 另，燈42之顏色或亮滅模式雖未特別限定，但較佳於累積作動時間TZ
達至第1值T1
時、與達至第2值T2
時不同。藉此，作業者容易區別累積作動時間TZ
是達至第1值T1
，還是達至第2值T2
。 又，蜂鳴器43之聲音較佳於累積作動時間TZ
達至第1值T1
時、與達至第2值T2
時不同。藉此，作業者容易區別累積作動時間TZ
是達至第1值T1
，還是達至第2值T2
。 又，於累積作動時間TZ
達至第1值T1
時，將該旨意藉由發送部86發送至例如主機電腦。藉此，例如可以主機電腦等管理各部之更換時期。 此種發送部86可藉由例如LAN(Local Area Network：區域網路)、WAN(Wide Area Network：廣域網路)、或MAN(Metropolitan Area Network：都會區網路)、或網際網路等通信手段構成。 又，關於發送部86通信之規格雖未特別限定，但較佳為SECS/GEM協定。處理一般半導體之機器之通信由於依據SECS/GEM協定進行，故因依據SECS/GEM協定進行通信，故通用性優異。 另，「SECS」係「SEMI Equipment Communications Standard：半導體設備通信標準」之簡稱，「GEM」係「Generic Model For Communications and Control of Manufacturing Equipment：通信之通用模型與製造設備之控制」之簡稱。 另，如圖6所示，於檢查裝置1中，可將發送記錄記憶至記憶部83。藉此，可以檢查裝置1管理過去之發送履歷。因此，即使於作業者輪換為不同作業者之情形時，亦可掌握檢查裝置1過去之狀況。 於以上，作為一例，雖對器件搬送頭13之線性導引器加以說明，但於本發明中並不限定於此，對於其他零件亦可同樣地管理更換時期。 例如，以下所示之表3係顯示器件搬送頭13之線性導引器以外之零件實際作用時間求出方法之表，且係表示於圖2所示位置把持IC器件90、並搬送至器件供給部、且返回至圖2所示之位置之時間(1週期之時間)之表。如該表3所示，器件搬送頭13於以常溫進行檢查之常溫模式之情形時為1.60秒。又，於以高溫進行檢查之高溫模式之情形時為3.00秒。又，於以常溫模式經由旋轉載台23A之情形時(常溫有旋轉)時為2.60秒。又，於以高溫模式經由旋轉載台23A之情形時(高溫有旋轉)時為4.00秒。 [表3]
如此，於檢查裝置1中，亦能夠根據器件搬送頭13搬送幾個IC器件90之資訊、與此時之溫度模式之資訊，算出器件搬送頭13之實際作動時間。 又，以下所示之表4係顯示器件搬送頭20之實際作動時間之求出方法之表。於該表4中顯示根據器件搬送頭20之搬送處1週期所需之時間。另，器件搬送頭20之1週期係指把持載置於器件回收部18之IC器件、並搬送至托盤200之時間。 [表4]
於表4中，「卸載機1」表示將IC器件90搬送至托盤搬送機構22A搬送之回收區域A4內之3個托盤200之中，圖2中X方向最負側之托盤200時之1週期之時間。於經由旋轉載台23B之情形時(有旋轉)為1.00秒，於不經由旋轉載台23B之情形時(無旋轉)時為0.70秒。 「卸載機2」表示將IC器件90搬送至托盤搬送機構22A搬送之回收區域A4內之3個托盤200之中，圖2中X方向正中央之托盤200時之1週期之時間。於經由旋轉載台23B之情形時為1.75秒，於不經由旋轉載台23B之情形時為0.75秒。 「卸載機3」表示將IC器件90搬送至托盤搬送機構22A搬送之回收區域A4內之3個托盤200之中，圖2中X方向最正側之托盤200時之1週期之時間。於經由旋轉載台23B之情形時為1.10秒，於不經由旋轉載台23B之情形時為0.80秒。 又，「固定托盤1」表示將IC器件90搬送至圖2中之3個回收用托盤19之中，X方向最正側之回收用托盤19時之1週期之時間。於經由旋轉載台23B之情形時為0.80秒，於不經由旋轉載台23B之情形時為0.50秒。 又，「固定托盤2」表示將IC器件90搬送至圖2中之3個回收用托盤19之中，X方向正中央之回收用托盤19時之1週期之時間。於經由旋轉載台23B之情形時為0.85秒，於不經由旋轉載台23B之情形時為0.55秒。 又，「固定托盤3」表示將IC器件90搬送至圖2中之3個回收用托盤19之中，X方向最負側之回收用托盤19時之1週期之時間。於經由旋轉載台23B之情形時為0.90秒，於不經由旋轉載台23B之情形時為0.60秒。 另，亦有器件供給部14、器件搬送頭17、及器件回收部18等無論溫度模式為何，1週期所需之時間均為相同時間之零件。 器件供給部14之1週期係指自圖2之以實線顯示器件供給部14之位置移動至圖2之檢查區域A3內之以虛線顯示之位置，且再次返回至圖2之以實線顯示器件供給部14之位置為止。 又，器件搬送頭17之1週期係指把持檢查區域A3內之器件供給部14之IC器件90，且於檢查部16載置IC器件90，並再次返回原先位置為止。 器件供給部18之1週期係指自圖2之以實線顯示器件供給部18之位置移動至圖2之檢查區域A3內之以虛線顯示之位置，且再次返回至圖2之以實線顯示器件供給部18之位置為止。 如以上所說明般，根據檢查裝置1，更換時期推定部100可基於檢查裝置1之各部之零件(作用部)之作用次數(週期數)、作用時間(實際作動時間)及作用速度(實際作動速度)中之至少作用次數或作用時間之任一者推定更換時期。 又，於該推定結果達至第1值T1
及第2值T2
之情形時，可藉由報知部40報知該旨意。藉此，例如，可預防於檢查裝置1之作動中零件破損、而檢查裝置1停止。因此，可有效地防止伴隨此種檢查裝置1意外停止之處理量之降低。其結果，於檢查裝置1，可維持較高處理量。 尤其是，由於可管理比較消耗較其他零件大之泵、閥門及噴射器等空壓機器、加熱器及馬達等電力機器、皮帶、滾珠螺桿、及缸體等滑動機器之更換時期，故可更有效地發揮上述效果。 以下，基於圖7所示之流程圖，對檢查裝置1之控制程式進行說明。另，於以下，舉出器件搬送頭13之線性導引器為一例進行說明。 首先，於步驟S101中，藉由上述方法，算出器件搬送頭13之累積作動時間TZ
。 然後，於步驟S102中，判斷累積作動時間TZ
是否小於第1值T1
。於步驟S102中，於判斷為累積作動時間TZ
小於第1值T1
、即未達第1值T1
之情形時(S102：是(YES))，返回步驟S101，算出累積作動時間TZ
。 又，於步驟S102中，於判斷為累積作動時間TZ
大至第1值T1
以上、即達至第1值T1
之情形時(S102：否(NO))，進行至步驟S103，判斷累積作動時間TZ
是否小於第2值T2
。 於步驟S103中，於判斷為累積作動時間TZ
小於第2值T2
、即未達第2值T2
之情形時(S103：是)，進行至步驟S104，報知累積作動時間TZ
達至第1值T1
。藉此，作業者可得知線性導引器之更換時期接近，而可於所需之時點進行線性導引器之維護或更換。 於步驟S103中，於判斷為累積作動時間TZ
大至第2值T2
以上、即達至第2值T2
之情形時(S103：否)，停止檢查裝置1之各部之作動(步驟S105)。 然後，於步驟S106中，報知累積作動時間TZ
達至第2值T2
。藉此，作業者可得知更換時期更接近。 如此於檢查裝置1中，可以2階段報知線性導引器之更換時期接近。因此，作業者階段性地得知更換時期接近，而容易計畫更換之時點。 尤其於檢查裝置1中，構成為於線性導引器達至更換時期以前、即線性導引器破損以前停止檢查裝置1之各部之作動並催促更換。藉此，可避免儘管線性導引器已破損，仍繼續檢查裝置1之作動，而使線性導引器以外之零件損傷之風險。 進而，於檢查裝置1中，於記憶部83記憶有IC器件90之檢查狀況(至今為止搬送了幾個IC器件90或托盤200之累積資料)。因此，於將上述程式安裝於檢查裝置1之時點，可基於檢查狀況、與例如表3及表4所示之累積作動時間之求出方法，算出當前之累積作動時間TZ
。 ＜第2實施形態＞ 以下，參照圖8及圖9對本發明之電子零件搬送裝置及電子零件檢查裝置之第2實施形態進行說明，但以與上述之實施形態之不同點為中心進行說明，且對相同之事項省略其說明。 本實施形態係除控制部之控制程式不同以外與上述第1實施形態相同。 如圖8及圖9所示，器件搬送頭13具有8個手131。各手131自Z軸方向觀看時，呈沿X軸方向排列4個手131之行、於Y軸方向排列2列之2列4行之矩陣狀。另，於以下，該等8個手131之中，將自+Y軸側之行之-X軸側之手131起依序設為手131a、131b、131c及131d，自-Y軸側之行之-X軸側之手131起依序設為手131e、131f、131g及131h。 對例如如圖8所示般使用手131a及手131d進行檢查之情形進行說明。於該情形時，手131a及手131d較其他手131之零件(於以下，作為一例對閥門進行說明)消耗更多而累積作動時間變大。 於使用手131a及手131d進行檢查之中途，手131a及手131d之閥門之累積作動時間達至第1值之情形時，於檢查裝置1中，如圖9所示，切換為使用手131e及手131h之模式。因此，可使用手131e及131h繼續檢查。 根據如此之本實施形態，即使檢查裝置1之零件之更換時期接近，亦可切換為使對IC器件90進行相同作用之部位作動之模式。因此，即使檢查裝置1之零件之更換時期接近，亦可抑制該零件繼續消耗。其結果，可減少零件之維護或更換之次數，而進一步提高處理量。 另，於使用手131a及手131d進行檢查之中途，手131a及手131d之閥門之累積作動時間達至第1值之情形時，所切換之手131較佳切換為手131b、131c、131e、131f、131g及131h之中累積作動時間較少之手131。藉此，可將各手131之累積作動時間儘可能地設為相同。因此，可進一步減少零件之維護或更換之次數，而進一步提高處理量。 又，於本實施形態中，作為一例對器件搬送頭13之手131之切換進行說明，但於檢查裝置1中，於可對IC器件90進行相同作用之作用部中，可如上述般進行切換。 ＜第3實施形態＞ 以下，參照圖10～圖16對本發明之電子零件搬送裝置及電子零件檢查裝置之第3實施形態進行說明。另，於本實施形態中，對與上述實施形態相同之構成構件標註同一符號進行說明。 於本實施形態中，如圖12所示，於各IC器件90之表側之面，附加條碼901作為關於該IC器件90之資訊。於該條碼901中，包含例如IC器件90之製造商、IC器件90之製造序號等各種資訊。又，作為條碼901，較佳使用一維條碼(藉由條紋圖案狀之線之粗細表示資訊之識別碼)、及二維條碼(例如QR碼(註冊商標))。作為條碼901對IC器件90之賦予方法，並未特別限定，可列舉例如使用噴墨之方法、使用雷射標記之方法等。 如圖10、圖11所示，檢查裝置1a係分成托盤供給區域A1、器件供給區域(以下簡稱為「供給區域」)A2、檢查區域A3、器件回收區域(以下簡稱為「回收區域」)A4、及托盤去除區域A5。並且，IC器件90自托盤供給區域A1依序經由上述各區域至托盤去除區域A5，於中途之檢查區域A3進行檢查。 如此，檢查裝置1a形成為具備如下構件者：電子零件搬送裝置(處理機)，其於各區域搬送IC器件90；檢查部16a，其於檢查區域A3內進行檢查；及控制部800。又，此外，檢查裝置1a具備監視器300、信號燈400、及操作面板700。 托盤供給區域A1係供給排列有未檢查狀態之複數個IC器件90之托盤(載置構件)200之供材部。於托盤供給區域A1中，可堆疊多個托盤200。 供給區域A2係將配置於來自托盤供給區域A1之托盤200上之複數個IC器件90分別供給至檢查區域A3之區域。另，以跨及托盤供給區域A1與供給區域A2之方式，設置有逐片於水平方向搬送托盤200之托盤搬送機構11A、11B。 托盤搬送機構11A係可使托盤200與載置於該托盤200之IC器件90一起向Y方向之正側移動之移動部。藉此，可將IC器件90穩定地送入供給區域A2。又，托盤搬送機構11B係可使空的托盤200向Y方向之負側、即自供給區域A2向托盤供給區域A1移動之移動部。 於供給區域A2，設置有溫度調整部12、器件搬送頭13、及托盤搬送機構15。 溫度調整部12係可將複數個IC器件90一起加熱或冷卻者，有時被稱為「均熱板」。藉由該均熱板，可將於檢查部16a檢查前之IC器件90預先冷卻或加熱，而調整為適於該檢查之溫度。 於圖11所示之構成中，溫度調整部12係於Y方向上配置並固定有2個。且，藉由托盤搬送機構11A自托盤供給區域A1搬入(搬送來)之托盤200上之IC器件90被搬送至任一溫度調整部12。 器件搬送頭13被支持為可於供給區域A2內於X方向及Y方向、進而亦於Z方向上移動。藉此，器件搬送頭13可承擔自托盤供給區域A1搬入之托盤200與溫度調整部12之間之IC器件90之搬送、及溫度調整部12與後述之器件供給部14a之間之IC器件90之搬送。 托盤搬送機構15係使去除所有IC器件90之狀態之空的托盤200於供給區域A2內向X方向之正側搬送之機構。且，於該搬送後，空的托盤200係藉由托盤搬送機構11B自供給區域A2返回至托盤供給區域A1。 檢查區域A3係檢查IC器件90之區域。於該檢查區域A3，設置有檢查部16a與器件搬送頭17a。又，亦設置有以跨及供給區域A2與檢查區域A3之方式移動之器件供給部14a、及以跨及檢查區域A3與回收區域A4之方式移動之器件回收部18a。進而，於供給區域A2與檢查區域A3之間，設置有第1資訊取得單元10A、與第2資訊取得單元10B。 器件供給部14a係載置有於溫度調整部12經溫度調整後之IC器件90，且可將該IC器件90搬送(移動)至檢查部16a附近之載置部，有時被稱為「供給用梭板」。 如圖12所示，器件供給部14a具有於X方向每4個、於Y方向每2個地配置成矩陣狀之凹部(凹槽)141。於各凹部141，逐個收納於檢查部16a檢查前之IC器件90。 又，器件供給部14a於較各凹部141更向X方向之正側進而具有2個凹部(凹槽)142。該等2個凹部142係沿Y方向配置，而可收納後述之虛擬器件(虛擬電子零件)91。又，凹部142對於虛擬器件91之定位精度高於凹部141對於IC器件90之定位高度。即，於凹部142內之虛擬器件91之間隙較於凹部141內之IC器件90之間隙更抑制為極小。 於以後，將凹部141及凹部142配置於Y方向負側之行稱為「第1行M1」，將配置於Y方向正側之行稱為「第2行M2」。另，凹部141及凹部142之形成數或配置態樣當然不限定於圖12所示之構成。 又，該器件供給部14a被支持為可於供給區域A2與檢查區域A3之間沿X方向於水平方向上移動。於圖11所示之構成中，器件供給部14a於Y方向上配置有2個，且溫度調整部12上之IC器件90被搬送至任一器件供給部14a。又，器件供給部14a構成為可將上述經溫度調整之IC器件90維持其溫度調整狀態。藉此，可冷卻或加熱IC器件90，因此，可維持該IC器件90之溫度調整狀態。 檢查部16a係載置IC器件90，並檢查、試驗該IC器件90之電性特性之載置部。於該檢查部16a，設置有與IC器件90之端子部電性連接之複數個探針銷。且，將IC器件90之端子部與探針銷電性連接(接觸)，而經由探針銷進行IC器件90之檢查。IC器件90之檢查係基於連接於檢查部16a之測試器具備之檢查控制部所記憶之程式而進行。另，於檢查部16a中，可與溫度調整部12同樣，將複數個IC器件90冷卻或加熱，而將該IC器件90調整為適於檢查之溫度。 器件搬送頭17a被支持為可於檢查區域A3內於Y方向及Z方向上移動。藉此，器件搬送頭17a可將自供給區域A2搬入之器件供給部14a上之IC器件90搬送至檢查部16a上，並載置。另，器件搬送頭17a亦可將IC器件90冷卻或加熱，而將該IC器件90調整為適於檢查之溫度。 器件回收部18a係載置以檢查部16a檢查結束後之IC器件90，且可將該IC器件90搬送(移動)至回收區域A4之載置部，有時被稱為「回收用梭板」。又，器件回收部18a被支持為可於檢查區域A3與回收區域A4之間沿X方向於水平方向上移動。又，於圖11所示之構成中，器件回收部18a與器件供給部14a同樣，於Y方向上配置有2個，且檢查部16a上之IC器件90被搬送至任一器件回收部18a並載置。該搬送係藉由器件搬送頭17a進行。 又，於檢查裝置1a中，1個器件供給部14a、與1個器件回收部18a係介隔連結部23於X方向連結，而構成於同方向一起移動之梭單元。於以下，將圖12中之Y方向負側側、即正面側之梭單元稱為「第1梭單元24A」，將Y方向正側、即背面側之梭單元稱為「第2梭單元24B」。 第1資訊取得單元10A係取得第1梭單元24A之器件供給部14a上之IC器件90之條碼901等之單元。第2資訊取得單元10B係取得第2梭單元24B之器件供給部14a上之IC器件90之條碼901等之單元。關於該等單元之細節見後述。 回收區域A4係回收檢查結束後之複數個IC器件90之區域。於該回收區域A4，設置有回收用托盤19、器件搬送頭20、及托盤搬送機構21。又，於回收區域A4，亦準備有空的托盤200。 回收用托盤19係載置以檢查部16a檢查後之IC器件90之載置部，且被固定為於回收區域A4內不移動。藉此，即使於較多地配置有器件搬送頭20等各種可動部之回收區域A4，於回收用托盤19上，亦穩定地載置已檢查之IC器件90。另，於圖11所示之構成中，回收用托盤19沿X方向配置有3個。 又，空的托盤200亦沿X方向配置有3個。該空的托盤200亦成為載置以檢查部16a檢查後之IC器件90之載置部。且，移動至回收區域A4之器件回收部18a上之IC器件90被搬送至回收用托盤19及空的托盤200中之任一者並載置。藉此，將IC器件90依每一檢查結果分類並回收。 器件搬送頭20被支持為可於回收區域A4內於X方向及Y方向、進而亦於Z方向上移動。藉此，器件搬送頭20可將IC器件90自器件回收部18a搬送至回收用托盤19或空的托盤200。 托盤搬送機構21係使自托盤去除區域A5搬入之空的托盤200於回收區域A4內於X方向上搬送之機構。且，於該搬送後，空的托盤200成為配置於回收IC器件90之位置，亦即可成為上述3個空的托盤200中之任一個。 托盤去除區域A5係將排列有已檢查狀態之複數個IC器件90之托盤200回收並去除之卸材部。於托盤去除區域A5中，可堆疊多個托盤200。 又，以跨及回收區域A4與托盤去除區域A5之方式，設置有逐片於Y方向上搬送托盤200之托盤搬送機構22A、22B。托盤搬送機構22A係可使托盤200於Y方向上移動之移動部。藉此，可將已檢查之IC器件90自回收區域A4搬送至托盤去除區域A5。又，托盤搬送機構22B係可將用以回收IC器件90之空的托盤200自托盤去除區域A5移動至回收區域A4之移動部。 控制部800具有例如驅動控制部。驅動控制部控制例如托盤搬送機構11A、11B、溫度調整部12、器件搬送頭13、器件供給部14a、托盤搬送機構15、檢查部16a、器件搬送頭17a、器件回收部18a、器件搬送頭20、托盤搬送機構21、托盤搬送機構22A、22B、第1資訊取得單元10A、及第2資訊取得單元10B各部之驅動。 另，上述測試器之檢查控制部基於例如未圖示之記憶體內所記憶之程式，而進行配置於檢查部16a之IC器件90之電性特性之檢查等。 操作者(作業者)可經由監視器300設定、確認檢查裝置1a之動作條件等。該監視器300具有例如以液晶畫面構成之顯示畫面(顯示部)301，且配置於檢查裝置1a之正面側上部。如圖10所示，於托盤去除區域A5之圖中之X方向正側，設置有載置操作顯示於監視器300之畫面時使用之滑鼠之滑鼠台600。 又，相對於監視器300於圖10中之X方向正側下方，配置有操作面板700。除監視器300以外，操作面板700另另行對檢查裝置1a命令所需之動作者。 又，信號燈400可利用發光之顏色之組合，報知檢查裝置1a之作動狀態等。信號燈400係配置於檢查裝置1a之上部。另，於檢查裝置1a中，亦可內置有揚聲器500，而藉由該揚聲器500亦可報知檢查裝置1a之作動狀態等。 如圖11所示，檢查裝置1a係藉由第1分隔壁61劃分(隔開)托盤供給區域A1與供給區域A2之間，藉由第2分隔壁62劃分供給區域A2與檢查區域A3之間，藉由第3分隔壁63劃分檢查區域A3與回收區域A4之間，藉由第4分隔壁64劃分回收區域A4與托盤去除區域A5之間。且，供給區域A2與回收區域A4之間亦藉由第5分隔壁65劃分。 如圖11、圖15所示，於第2分隔壁62形成有開口部621、開口部622。第1梭單元24A之器件供給部14a可通過開口部621(參照圖13、圖14)。藉此，開口部621作為使器件供給部14a自供給區域A2進入檢查區域A3之入口發揮功能，且作為使器件供給部14a自檢查區域A3出去到供給區域A2之出口發揮功能。 又，第2梭單元24B之器件供給部14a可通過開口部622。藉此，開口部622亦作為使器件供給部14a自供給區域A2進入檢查區域A3之入口發揮功能，且作為使器件供給部14a自檢查區域A3出去到供給區域A2之出口發揮功能。 又，如圖11所示，於第3分隔壁63亦形成有開口部631、開口部632。又，第1梭單元24A之器件回收部18a可通過開口部631，且第2梭單元24B之器件回收部18a可通過開口部632。 檢查裝置1a係最外裝以蓋覆蓋，且該蓋有前蓋70、側蓋71、側蓋72、後蓋73及頂蓋74。 如上所述，於各IC器件90附有條碼901。且，藉由第1資訊取得單元10A取得於第1梭單元24A之器件供給部14a上載置之IC器件90之條碼901。另一方面，藉由第2資訊取得單元10B取得於第2梭單元24B之器件供給部14a上載置之IC器件90之條碼901。又，將所取得之條碼901記憶至控制部800之記憶體。 如圖12、圖15所示，第1資訊取得單元10A及第2資訊取得單元10B各者具有可取得於IC器件90所附之資訊之第1條碼讀取器(資訊取得部)3A與第2條碼讀取器3B(資訊取得部)。於第1資訊取得單元10A中，將第1條碼讀取器3A與第2條碼讀取器3B配置於開口621，於第2資訊取得單元10B中，將第1條碼讀取器3A與第2條碼讀取器3B配置於開口部622。第1資訊取得單元10A與第2資訊取得單元10B由於除配置部位不同以外，為相同之構成，故以下，針對第1資訊取得單元10A代表性地進行說明。 第1條碼讀取器3A與第2條碼讀取器3B均外形形狀呈扁平之箱狀，且以其厚度方向與水平方向(X方向)一致之方式，以所謂「豎置」之狀態(豎起之狀態)配置。又，第1條碼讀取器3A與第2條碼讀取器3B例如內置有雷射二極體與光電二極體。來自雷射二極體之出射光L1一面掃描，一面透過光透過部31朝向下方出射。隨後，出射光L1於條碼901朝向上方反射。反射光L2透過光透過部31，於光電二極體被接收。藉由對基於所接收之反射光L2之信號依序進行A/D轉換、解碼，而可讀取條碼901。 如圖12所示，第1條碼讀取器3A於載置有IC器件90之器件供給部14a通過正下方時，可讀取該器件供給部14a上之IC器件90中之第1行M1之IC器件90之條碼901。第2條碼讀取器3B於載置有IC器件90之器件供給部14a通過正下方時，可讀取該器件供給部14a上之IC器件90中之第2行M2之IC器件90之條碼901。 另，於第2資訊取得單元10B中，第1條碼讀取器3A讀取第2行M2之IC器件90之條碼901，第2條碼讀取器3B讀取第1行M1之IC器件90之條碼901。 如上所述，第1條碼讀取器3A與第2條碼讀取器3B係配置於第2分隔壁62之開口部621。藉此，可儘可能地於IC器件90於檢查區域A3內受檢查之前立即讀取該IC器件90之條碼901。藉此，可儘可能地防止讀取所獲得之資訊與檢查結果為相同1個IC器件90者、即所取得之IC器件90之資訊、與所檢查之IC器件90之檢查結果之關聯(建立關聯)崩潰。 此處考慮假若將第1條碼讀取器3A與第2條碼讀取器3B配置於第1分隔壁61之情形。於該情形時，即使早已讀取條碼901，若被讀取該條碼901之IC器件90於供給區域A2內之搬送中途意外落下，則雖使器件搬送頭13把持(重執)該落下之IC器件90，但有將該IC器件90把持於與原先之位置(落下前之位置)不同位置之情況。且，如此一來，於檢查區域A3內檢查與原本應檢查之IC器件90不同之IC器件90，而該檢查結果會被辨識為被讀取條碼901之IC器件90者。因此，於檢查裝置1a中，藉由於檢查區域A3內檢查之前立刻讀取條碼901，可防止此種IC器件90之資訊與IC器件90之檢查結果不正確建立關聯。 又，第1條碼讀取器3A與第2條碼讀取器3B係可取得IC器件90之資訊之可取得資訊區域(可檢測距離)、即感測器範圍(感測範圍)相互不同。例如於本實施形態中，作為第1條碼讀取器3A，較佳使用感測器範圍為50 mm上、600 mm以下者，作為第2條碼讀取器3B，較佳使用感測器範圍為110 mm以上、1000 mm以下者。 藉此，如圖15所示般，可使第1條碼讀取器3A與第2條碼讀取器3B之鉛垂方向之設置高度不同，而可將感測器範圍較小之第1條碼讀取器3A配置於低位置，將感測器範圍較大之第2條碼讀取器3B配置於高位置。且，可自該狀態進而如圖12所示般，於俯視下(自鉛垂方向上方觀看時)將第1條碼讀取器3A與第2條碼讀取器3B以具有相互重疊之重疊部32之方式配置。藉此，可將第1資訊取得單元10A之Y方向之距離縮小重疊部32之量，因此，小型化。 然而，第1條碼讀取器3A或第2條碼讀取器3B例如因經時劣化或故障，此外，因光透過部31模糊等之原因，而變得難以或無法正確地取得條碼901。且，若未察覺成為此種狀態而繼續使用，則有變成讀取之IC器件90之不正確資訊、與IC器件90之檢查結果產生關連之狀態之虞。 因此，於檢查裝置1a中，構成為消除此種狀態。以下，對該構成進行說明。 於檢查裝置1a中，控制部800構成為作為進行第1條碼讀取器3A及第2條碼讀取器3B之作動是否正常之判斷之判斷部發揮功能。另，控制部800具有CPU與記憶體。於記憶體中，記憶有上述判斷用之控制程式。且，CPU可叫出該控制程式，並執行該控制程式。此處，「第1條碼讀取器3A及第2條碼讀取器3B之作動正常」係指第1條碼讀取器3A及第2條碼讀取器3B正確地讀取條碼(條碼901)。 又，作為上述判斷之判斷基準，使用於虛擬器件91之表側之面所附之基準條碼(基準標記)911。又，虛擬器件91係模擬IC器件90者，且與IC器件90一併載置於器件供給部14a上而使用(參照圖12～圖14)。另，基準條碼911係預先記憶於控制部800。又，作為對IC器件91賦予基準條碼911之方法，並未特別限定，可列舉例如使用噴墨之方法、使用雷射標記之方法、貼附自IC器件90切除之條碼901之方法等。 以下，基於圖16之流程圖對上述判斷用之控制程式進行說明。又，由於對第1條碼讀取器3A之判斷、與對第2條碼讀取器3B之判斷相同，故此處，就對第1條碼讀取器3A之判斷代表性地進行說明。 首先，於開始控制程式時，於供給區域A2內，於器件供給部14a上載置8個IC器件90，且亦載置2個虛擬器件91(參照圖12、圖13)。然後，基於該狀態開始控制程式。 控制程式使器件供給部14a朝向檢查區域A3移動1次(步驟S201)。「移動1次」係指，使器件供給部14a移動至器件供給部14a上之虛擬器件91位於第1條碼讀取器3A之正下方(參照圖14)。 使第1條碼讀取器3A作動，將虛擬器件91之基準條碼911讀取特定次數(步驟S202)。且，對該讀取之基準條碼911與預先記憶於控制部800之基準條碼911進行比較，判斷兩者之基準條碼911吻合之次數(符合次數)N是否超過預先設定之次數(閾值)N0
(步驟S203)。 於步驟S203之判斷結果，次數N超過次數N0
之情形時(步驟S203：是)，視為「第1條碼讀取器3A之作動正常」，使器件供給部14a朝向檢查區域A3移動2次(步驟S204)，且使第1條碼讀取器3A作動，讀取IC器件90之條碼901(步驟S205)。「移動2次(第1動作)」係指以第1條碼讀取器3A依序讀取器件供給部14a上之IC器件90之條碼901之方式，使器件供給部14a移動。又，該移動既可為每當IC器件90位於第1條碼讀取器3A之正下方時重複移動與停止之移動(間距移送)，亦可為省略停止之連續移動(連續移送)。 且，判斷是否已對第1行M1之所有IC器件90完成藉由第1條碼讀取器3A進行之IC器件90之條碼901之讀取(步驟S206)。若已對所有IC器件90完成(步驟S206：是)，則結束流程。若未對所有IC器件90完成(步驟S206：否)，則返回步驟S204並重複進行步驟直至完成。 於步驟S203之判斷結果，次數N未超過次數N0
之情形時，視為「第1條碼讀取器3A之作動不正常」，而報知需要對第1條碼讀取器3A之光透過部31進行清潔之旨意(第2動作)(步驟S207)。作為該報知方法，雖未特別限定，但可列舉例如利用經由監視器300之畫面顯示之方法、利用經由揚聲器500之聲音之方法等。 且，操作者於欲按照上述報知進行清潔之情形時，可例如操作顯示於監視器300之「開始清潔按鈕」。控制程式於確認「開始清潔按鈕」之導通操作之前(步驟S208：否)，於S208待機，當確認「開始清潔按鈕」之導通操作時(步驟S208：是)，使移動1次之器件供給部14a返回至供給區域A2內之原本位置(步驟S209)。藉此，於第1條碼讀取器3A之下方確保可插入操作者之手之程度之空間，因此，操作者可進行對光透過部31之清潔。 於清潔結束後，操作者可例如操作顯示於監視器300之「結束清潔按鈕」。控制程式於確認「結束清潔按鈕」之導通操作之前(步驟S210：否)，於S210待機，當確認「結束清潔按鈕」之導通操作時(步驟S210：是)，返回步驟S201，以後，自其依序執行下位之步驟。藉此，於檢查裝置1a中，於清潔後亦可判斷第1條碼讀取器3A之作動是否正常。 於步驟S203之判斷使用之次數N0
係次數N、與第1條碼讀取器3A對基準條碼911之總讀取次數(於步驟S202之特定次數)之比成為例如為70%以上、100%以內之情形之值。 另，於檢查裝置1a中，亦可構成為階段性地變更次數N0
。例如，可設定上述比成為70%以上、100%以內之情形作為第1階段，設定上述比成為30%以上、70%以內之情形作為第2階段，設定上述比成為0%以上、30%以內之情形作為第3階段。可於第1階段中，採取作為「第1條碼讀取器3A之作動正常」之第1動作，且於第2階段中，採取作為「必需要對第1條碼讀取器3A清潔」之第2動作，並於第3階段中，採取作為「第1條碼讀取器3A因經時劣化或故障之原因，而無法進行正常之作動，必須更換」之第3動作。 又，第1條碼讀取器3A因經時劣化或故障之原因，而無法進行正常作動之情形時，檢查裝置1a成為重複步驟S201～步驟S203、隨後重複步驟S207～步驟S210之狀態。於該情形時，亦可替代上述第3階段，若上述步驟之重複次數連續超過特定次數，則視為「第1條碼讀取器3A因經時劣化或故障之原因，而無法進行正常之作動」，而報知該旨意、與必須進行第1條碼讀取器3A之更換之旨意。 又，於步驟S207之報知中，亦較佳繼續IC器件90之搬送。 又，於步驟S207後，亦可不執行步驟S208，而使裝置停止(第3動作)。 於以上般之檢查裝置1a中，可藉由控制程式，選擇是就此繼續使用第1條碼讀取器3A(第2條碼讀取器3B)、還是進行清潔或更換，進而判斷作動是否正常。且，由於無需進行清潔或更換而可就此繼續使用正常之第1條碼讀取器3A，故該第1條碼讀取器3A可長期間穩定且正確地取得IC器件90所附之條碼901。藉此，可將自條碼901取得之IC器件90之資訊、與該IC器件90之檢查結果正確地建立關聯。 ＜第4實施形態＞ 以下，參照圖17對本發明之電子零件搬送裝置及電子零件檢查裝置之第4實施形態進行說明，但以與上述之實施形態之不同點為中心進行說明，且對相同之事項省略其說明。 本實施形態之檢查裝置1a'係除條碼讀取器之配置態樣不同以外與第3實施形態之檢查裝置1a相同。 如圖17所示，於本實施形態之檢查裝置1a'中，第1條碼讀取器3A'與第2條碼讀取器3B'均係外形形狀呈扁平之箱狀，且以其厚度方向與鉛垂方向(Z方向)一致之方式，以所謂「橫置」之狀態(平置之狀態)配置。又，自X方向觀看時，第1條碼讀取器3A'與第2條碼讀取器3B'係配置為具有相互重疊之重疊部32'。藉此，可將第1資訊取得單元10A及第2資訊取得單元10B之Y方向之距離均縮小重疊部32'之量，因此，可將檢查裝置小型化。 ＜第5實施形態＞ 以下，參照圖18～圖22對本發明之電子零件搬送裝置及電子零件檢查裝置之第5實施形態進行說明。另，於本實施形態中，對與上述實施形態相同之構成構件標註同一符號進行說明。 又，於圖19中，為避免圖變繁瑣，省略離子產生器及感測器之圖示。又，於圖20中，為了容易分別離子產生器及感測器，將該等以實線顯示，將其他構造物以雙點鏈線顯示。 如圖18、圖19所示，檢查裝置1b係分成托盤供給區域A1、器件供給區域(以下簡稱為「供給區域」)A2、檢查區域A30、器件回收區域(以下簡稱為「回收區域」)A4、及托盤去除區域A5。並且，IC器件90自托盤供給區域A1依序經由上述各區域至托盤去除區域A5，且於中途之檢查區域A30進行檢查。 如此，檢查裝置1b具備：電子零件搬送裝置(處理機)，其於各區域搬送IC器件90；及檢查部16b，其於檢查區域A30內進行檢查。又，電子零件搬送裝置具備控制部800b、報知部即監視器(顯示部)300、信號燈400、揚聲器500、及操作面板700(參照圖18、圖21)。 托盤供給區域A1係供給排列有未檢查狀態之複數個IC器件90之托盤(載置構件)200之供材部。於托盤供給區域A1中，可堆疊多個托盤200。 供給區域A2係將配置於來自托盤供給區域A1之托盤200上之複數個IC器件90分別供給至檢查區域A30之區域。另，以跨及托盤供給區域A1與供給區域A2之方式，設置有逐片於水平方向搬送托盤200之托盤搬送機構11A、11B。 托盤搬送機構11A係可使托盤200與載置於該托盤200之IC器件90一起向Y方向之正側移動之移動部。藉此，可將IC器件90穩定地送入供給區域A2。又，托盤搬送機構11B係可使空的托盤200向Y方向之負側、即自供給區域A2向托盤供給區域A1移動之移動部。 於供給區域A2，設置有溫度調整部(均熱板(英文表述：soak plate，中文表述(一例)：均溫板))12、器件搬送頭13b、及托盤搬送機構15。 溫度調整部12係可將複數個IC器件90一起加熱或冷卻者，有時被稱為「均熱板」。藉由該均熱板，可將於檢查部16b檢查前之IC器件90預先冷卻或加熱，而調整為適於該檢查之溫度。於圖19所示之構成中，溫度調整部12係於Y方向上配置並固定有2個。且，藉由托盤搬送機構11A自托盤供給區域A1搬入(搬送來)之托盤200上之IC器件90被搬送至任一溫度調整部12。 器件搬送頭13b被支持為可於供給區域A2內於X方向及Y方向、進而亦於Z方向上移動。藉此，器件搬送頭13b可承擔自托盤供給區域A1搬入之托盤200與溫度調整部12之間之IC器件90之搬送、及溫度調整部12與後述之器件供給部14b之間之IC器件90之搬送。 器件搬送頭13b具有複數個手單元130，作為把持IC器件90之把持部(於圖19中，僅作為代表記載有1個符號「130」)。手單元130具備吸嘴，而以該吸嘴藉由吸附IC器件90而把持。 托盤搬送機構15係使去除所有IC器件90之狀態之空的托盤200於供給區域A2內向X方向之正側搬送之機構。且，於該搬送後，空的托盤200係藉由托盤搬送機構11B自供給區域A2返回至托盤供給區域A1。 檢查區域A30係檢查IC器件90之區域。於該檢查區域A30，設置有檢查部16b與器件搬送頭17b。又，亦設置有以跨及供給區域A2與檢查區域A30之方式移動之器件供給部14b、及以跨及檢查區域A30與回收區域A4之方式移動之器件回收部18b。 器件供給部14b係載置經溫度調整部12溫度調整後之IC器件90，且可將該IC器件90搬送(移動)至檢查部16b附近之載置部，有時被稱為「供給用梭板」。 器件供給部14b具有於X方向及Y方向分別配置複數個、即配置成矩陣狀之凹部(凹槽)140(於圖19中，作為代表僅記載有1個符號「140」)。於各凹部140，逐個收納由檢查部16b檢查前之IC器件90。 又，器件供給部14b被支持為可於供給區域A2與檢查區域A30之間沿X方向於水平方向上移動。於圖19所示之構成中，器件供給部14b於Y方向上配置有2個，且溫度調整部12上之IC器件90被搬送至任一器件供給部14b。又，器件供給部14b構成為可將上述經溫度調整之IC器件90維持其溫度調整狀態。藉此，可冷卻或加熱IC器件90，因此，可維持該IC器件90之溫度調整狀態。 檢查部16b係載置(保持)IC器件90，並檢查、試驗(進行電性檢查)IC器件90之電性特性之單元、即於檢查IC器件90時載置該IC器件90之構件。 於檢查部16b之上表面，設置有複數個收容(載置)(保持)IC器件90之凹部即保持部160(於圖19中，僅作為代表記載有1個符號「160」)。將IC器件90收容於保持部160，藉此，載置於檢查部16b。 又，於檢查部16b之對應於各保持部160之位置，分別設置有於將IC器件90保持於保持部160之狀態下與該IC器件90之端子電性連接之探針銷。且，將IC器件90之端子與探針銷電性連接(接觸)，而經由探針銷進行IC器件90之檢查。IC器件90之檢查係藉由連接於檢查部16b之未圖示之測試器所具備之檢查控制部，基於該檢查控制部之記憶部所記憶之程式而進行。另，於檢查部16b中，可與溫度調整部12同樣，將IC器件90加熱或冷卻，而將該IC器件90調整為適於檢查之溫度。 器件搬送頭17b被支持為可於檢查區域A30內於Y方向及Z方向上移動。又，器件搬送頭17b可將自供給區域A2搬入之器件供給部14b上之IC器件90搬送至檢查部16b上並載置，又，可將檢查部16b上之IC器件90搬送至器件回收部18b上並載置。又，於檢查IC器件90時，器件搬送頭17b將IC器件90朝向檢查部16b按壓，藉此，使IC器件90抵接於檢查部16b。藉此，如上述般，將IC器件90之端子與檢查部16b之探針銷電性連接。另，器件搬送頭17b亦可將複數個IC器件90冷卻或加熱，而將該IC器件90調整為適於檢查之溫度。 器件搬送頭17b具有複數個手單元175，作為把持IC器件90之把持部(於圖19中，僅作為代表記載有1個符號「175」)。手單元175具備吸嘴，而以該吸嘴藉由吸附IC器件90而把持。 器件回收部18b係載置以檢查部16b檢查結束後之IC器件90，且可將該IC器件90搬送(移動)至回收區域A4之載置部，有時被稱為「回收用梭板」。 器件回收部18b具有於X方向及Y方向分別配置複數個、即配置成矩陣狀之凹部(凹槽)181(於圖19中，作為代表僅記載有1個符號「181」)。 又，器件回收部18b被支持為可於檢查區域A30與回收區域A4之間沿X方向於水平方向上移動。又，於圖19所示之構成中，器件回收部18b與器件供給部14b同樣，於Y方向上配置有2個，且檢查部16b上之IC器件90被搬送至任一器件回收部18b並載置。該搬送係藉由器件搬送頭17b進行。 又，於檢查裝置1b中，1個器件供給部14b與1個器件回收部18b係介隔未圖示連結部於X方向連結，而構成於同方向一起移動之梭單元。另，器件供給部14b與器件回收部18b亦可構成為可獨立移動。 回收區域A4係回收檢查結束後之複數個IC器件90之區域。於該回收區域A4，設置有回收用托盤19、器件搬送頭20b及托盤搬送機構21。又，於回收區域A4，亦準備有空的托盤200。 回收用托盤19係載置以檢查部16b檢查後之IC器件90之載置部，且被固定為於回收區域A4內不移動。藉此，即使於較多地配置有器件搬送頭20b等各種可動部之回收區域A4，於回收用托盤19上，亦穩定地載置已檢查之IC器件90。另，於圖19所示之構成中，回收用托盤19沿X方向配置有3個。 又，空的托盤200亦沿X方向配置有3個。該空的托盤200亦成為載置以檢查部16b檢查後之IC器件90之載置部。且，移動至回收區域A4之器件回收部18b上之IC器件90被搬送至回收用托盤19及空的托盤200中之任一者並載置。藉此，將IC器件90依每一檢查結果分類並回收。 器件搬送頭20b被支持為可於回收區域A4內於X方向及Y方向、進而亦於Z方向上移動。藉此，器件搬送頭20b可將IC器件90自器件回收部18b搬送至回收用托盤19或空的托盤200。 器件搬送頭20b具有複數個手單元201，作為把持IC器件90之把持部(於圖19中，僅作為代表記載有1個符號「201」)。手單元201具備吸嘴，而以該吸嘴藉由吸附IC器件90而把持。 托盤搬送機構21係使自托盤去除區域A5搬入之空的托盤200於回收區域A4內於X方向上搬送之機構。且，於該搬送後，空的托盤200成為配置於回收IC器件90之位置，即可成為上述3個空的托盤200中之任一個。 托盤去除區域A5係將排列有已檢查狀態之複數個IC器件90之托盤200回收並去除之卸材部。於托盤去除區域A5中，可堆疊多個托盤200。 又，以跨及回收區域A4與托盤去除區域A5之方式，設置有逐片於Y方向上搬送托盤200之托盤搬送機構22A、22B。托盤搬送機構22A係可使托盤200於Y方向上移動之移動部。藉此，可將已檢查之IC器件90自回收區域A4搬送至托盤去除區域A5。又，托盤搬送機構22B係可將用以回收IC器件90之空的托盤200自托盤去除區域A5移動至回收區域A4之移動部。 控制部800b控制例如托盤搬送機構11A、11B、溫度調整部12、器件搬送頭13b、器件供給部14b、托盤搬送機構15、檢查部16b、器件搬送頭17b、器件回收部18b、器件搬送頭20b、托盤搬送機構21、托盤搬送機構22A、22B、監視器300、信號燈400、揚聲器500、及後述之離子產生器31b～39b、40b～46b等各部之驅動。 使用者(作業者)可經由監視器300設定、確認檢查裝置1b之動作條件等。該監視器300具有例如以液晶畫面構成之顯示畫面(顯示部)301，且配置於檢查裝置1b之正面側上部。如圖18所示，於托盤去除區域A5之圖中之X方向正側，設置有載置於操作顯示於監視器300之畫面時使用之滑鼠之滑鼠台600。 又，相對於監視器300於圖18中之X方向正側下方，配置有操作面板700。操作面板700係與監視器300另行對檢查裝置1b命令所需之動作者。 又，信號燈400可利用發光之顏色之組合，報知檢查裝置1b之作動狀態等。信號燈400係配置於檢查裝置1b之上部。另，於檢查裝置1b中，亦可內置有揚聲器500，而藉由該揚聲器500報知檢查裝置1b之作動狀態等。 如圖19所示，檢查裝置1b係藉由第1分隔壁61劃分(隔開)托盤供給區域A1與供給區域A2之間，藉由第2分隔壁62劃分供給區域A2與檢查區域A30之間，藉由第3分隔壁63劃分檢查區域A30與回收區域A4之間，藉由第4分隔壁64劃分回收區域A4與托盤去除區域A5之間。且，供給區域A2與回收區域A4之間亦藉由第5分隔壁65劃分。 於第2分隔壁62形成有開口部621、開口部622。一器件供給部14b可通過開口621。藉此，開口部621作為器件供給部14b自供給區域A2進入檢查區域A30之入口發揮功能，且作為器件供給部14b自檢查區域A30出去到供給區域A2之出口發揮功能。又，另一器件供給部14b可通過開口部622。藉此，開口部622亦作為器件供給部14b自供給區域A2進入檢查區域A30之入口發揮功能，且作為器件供給部14b自檢查區域A30出去到供給區域A2之出口發揮功能。 又，於第3分隔壁63亦形成有開口部631、開口部632。一器件回收部18b可通過開口部631，且另一器件回收部18b可通過開口部632。 檢查裝置1b係最外裝以蓋覆蓋，且該蓋有前蓋70、側蓋71、側蓋72、後蓋73及頂蓋74。 又，如圖20所示，於檢查裝置1b中，設置有產生離子、以該離子將靜電中和而去除(除靜電)之複數個(於圖示之構成中為16個)離子產生器(離子產生部)31b～39b、40b～46b，與檢測離子平衡與除靜電時間中之至少一者之複數個(於圖示之構成中為4個)感測器(檢測部)51～54。 離子產生器31b～46b各者係將乾燥空氣離子化，而產生該離子化之乾燥空氣(以下稱為「離子化空氣」)之裝置。作為離子產生器31b～46b，各者並未特別限定，可使用例如利用電暈放電者、利用電離輻射者等。 IC器件90之表面有例如於IC器件90之搬送中帶靜電之虞。因此，必須除去該靜電。於檢查裝置1b中，使離子產生器31b～46b作動而產生離子化空氣，而可藉由該離子化空氣，對IC器件90等進行除靜電。 又，離子產生器31b～46b之離子平衡各者於感測器51～54之檢測值越接近0 V越好。 又，離子產生器31b～46b之除靜電時間各者越短越好。除靜電時間係自特定之第1電壓除靜電至特定之第2電壓(絕對值較第1電壓更小之電壓)所需之時間。另，除靜電時間與離子量對應(與離子量等價)，除靜電時間越短離子量越多。 另，感測器51～54雖只要各者可檢測離子平衡與除靜電時間中之至少一者即可，但於本實施形態中，作為一例，係以檢測離子平衡之感測器進行說明。 於供給區域A2，設置有複數個(於圖示之構成中為6個)離子產生器31b～36b。又，於供給區域A2，設置有單一感測器51。於該供給區域A2中，離子產生器31b～36b中之任意2個離子產生器之一者為第1離子產生部，另一者為第2離子產生部。 離子產生器31b～36b及感測器51之配置各者雖未特別限定，但較好離子產生器31b～36b各者配置為可遍及供給區域A2之整體去除靜電。 又，於本實施形態中，離子產生器31b～36b分別配置於檢查裝置1b之頂板。又，感測器51係配置於檢查裝置1b之基底。即，感測器51配置於較離子產生器31b～36b更向鉛垂方向下方。以離子產生器31b～36b產生之離子化空氣通常比重較大氣更大。因此，藉由將感測器51配置於較離子產生器31b～36b更向鉛垂方向下方，可利用感測器51確實地檢測離子平衡。 又，於回收區域A4，設置有複數個(於圖示之構成中為6個)離子產生器37b～39b、40b～42b。又，於回收區域A4，設置有單一之感測器52。於該回收區域A4中，離子產生器37b～42b中之任意2個離子產生器之一者為第1離子產生部，另一者為第2離子產生部。 離子產生器37b～42b及感測器52之配置各者雖未特別限定，但離子產生器37b～42b較佳各者配置為可遍及回收區域A4之整體去除靜電。 又，於本實施形態中，離子產生器37b～42b分別配置於檢查裝置1b之頂板。又，感測器52係配置於檢查裝置1b之基底。即，感測器52配置於較離子產生器37b～42b更向鉛垂方向下方。因此，可利用感測器52確實地檢測離子平衡。 檢查區域A30分成圖20中之X方向負側之第1區域A31、與圖20中之X方向正側之第2區域A32之2個。另，於圖19及圖20中，以雙點鏈線顯示第1區域A31與第2區域A32之概念性邊界線。 於第1區域A31，設置有複數個(於圖示之構成中為2個)離子產生器43b及44b。又，於第1區域A31，設置有單一之感測器53。於該第1區域A31中，離子產生器43b及44b中之一者為第1離子產生部，另一者為第2離子產生部。 離子產生器43b、44b及感測器53之配置各者雖未特別限定，但較好離子產生器43b及44b各者配置為可遍及第1區域A31之整體去除靜電。 又，於本實施形態中，離子產生器43b及44b分別配置於檢查裝置1b之壁82b(參照圖22)。又，感測器53係配置於檢查裝置1b之基底81b(參照圖22)。即，感測器53配置於較離子產生器43b及44b更向鉛垂方向下方。因此，可利用感測器53確實地檢測離子平衡。 又，於第2區域A32，設置有複數個(於圖示之構成中為2個)離子產生器45b及46b。又，於第2區域A32，設置有單一感測器54。於該第2區域A32中，離子產生器45b及46b中之一者為第1離子產生部，另一者為第2離子產生部。 電離器45b、44b及感測器54之配置各者雖未特別限定，但較好離子產生器45b及46b各者配置為可遍及第2區域A32之整體去除靜電。 又，於本實施形態中，離子產生器45b及46b分別配置於檢查裝置1b之壁83b(參照圖22)。又，感測器54係配置於檢查裝置1b之基底81b(參照圖22)。即，感測器54配置於較離子產生器45b及46b更向鉛垂方向下方。因此，可利用感測器54確實地檢測離子平衡。 如以上，於供給區域A2、回收區域A4、第1區域A31及第2區域A32之各區域，分別設置有複數個離子產生器、與單一感測器。藉由於各區域分別設置複數個離子產生器，可提高除靜電能力，且於各區域中，可分別無遺漏地除靜電。 另，離子產生器之數量及感測器之數量當然並非各限定於上述之數量。 又，檢查裝置1b具有對離子產生器31b～46b分別檢查是否正常之功能(動作模式)。以下，將不正常稱為「異常」。另，作為離子產生器之異常之具體例，可列舉例如故障、劣化等缺陷之產生、未充分清潔等。 以下，對離子產生器31b～46b之檢查進行說明，但於以下，代表性地針對於供給區域A2之離子產生器31b～36b之檢查進行說明。 於供給區域A2中，藉由控制部800b之控制，使離子產生器31b～36b逐個作動，並藉由感測器51逐個檢測離子平衡，進行檢查。 即，於使特定之1個離子產生器作動時，停止其他5個離子產生器之作動。具體而言，於檢查離子產生器31b之情形時，以使該離子產生器31b作動、且停止其他離子產生器32b～36b之作動之狀態，藉由感測器51檢測離子平衡，進行檢查。關於離子產生器32b～36b亦同樣。另，離子產生器31b～36b之檢查順序並未特別限定，可根據諸條件適當設定。 藉此，於電離器31b～36b中之至少1個有異常之情形時，可檢測產生上述異常，且可特定出產生異常之離子產生器。 又，可以單一之感測器51進行上述檢測，藉此，可減少感測器之數量。 又，於離子產生器31b之檢查中，控制部800b基於感測器51之檢測結果，判斷離子產生器31b是否正常。 即，控制部800b於感測器51之檢測結果未達基準值之情形時，判斷為離子產生器31b異常(不正常)，於達至基準值之情形時，判斷為離子產生器31b正常。 另，因感測器51檢測離子平衡，故於顯示檢測之離子平衡之電壓值(檢測結果)大於基準值之情形時，判斷為離子產生器31b異常。 該基準值雖未特別限定，而根據諸條件適當設定，但較佳設定為5 V以上、200V以下之範圍之值，且更佳設定為10 V以上、100 V以下之範圍內之值，進而更佳設定為20 V以上、50 V以下之範圍內之值。 若上述基準值大於上述上限值，則根據其他條件，而有儘管離子產生器31b異常之情形亦判斷為正常之虞。又，若上述基準值小於上述上限值，則根據其他條件，而有儘管離子產生器31b正常之情形亦判斷為異常之虞。 另，因感測器51檢測除靜電時間，故於測定之除靜電時間(檢測結果)長於基準值之情形時，判斷為離子產生器31b異常。 將該檢查之結果顯示於監視器300。即，於監視器300，於離子產生器31b異常之情形時，顯示表示離子產生器31b異常之資訊，又，於離子產生器31b正常之情形時，顯示表示離子產生器31b正常之資訊。 另，關於離子產生器32b～36b之檢查雖省略說明，但與上述離子產生器31b之檢查之情形相同。 又，於回收區域A4亦與上述供給區域A2之情形同樣，藉由控制部800b之控制，使離子產生器37b～42b逐個作動，並藉由感測器52逐個檢測離子平衡，進行檢查。 又，於第1區域A31亦與上述供給區域A2之情形同樣，藉由控制部800b之控制，使離子產生器43b及離子產生器44b逐個作動，並藉由感測器53逐個檢測離子平衡，進行檢查。 又，於第2區域A32亦與上述供給區域A2之情形同樣，藉由控制部800b之控制，使離子產生器45b及離子產生器46b逐個作動，並藉由感測器54逐個檢測離子平衡，進行檢查。 另，於上述供給區域A2、回收區域A4、第1區域A31及第2區域A32中，分別於各區域每一者獨立地藉由對應之感測器檢測離子平衡，進行檢查。因此，供給區域A2之檢查、回收區域A4之檢查、第1區域A31之檢查、第2區域A32之檢查可錯開時間進行，又亦可同時進行任意2個區域、任意3個區域或4個區域之檢查。於同時進行之情形，可縮短整體檢查所需之時間。 又，於檢查裝置1b中，上述檢查之結果，於離子產生器31b～46b中之至少1個有異常之情形時，於監視器300顯示產生上述異常、與特定出產生異常之離子產生器之資訊。又，使信號燈400點亮或熄滅或發光色變化，又，自揚聲器500發出警告(警報)。又，於離子產生器31b～46b全部正常之情形時，於監視器300顯示該旨意。 使用者觀看監視器300之上述顯示，於離子產生器31b～46b中之至少1個有異常之情形時，可容易地掌握產生上述異常、與產生異常之離子產生器。又，於離子產生器31b～46b全部正常之情形時，可容易地掌握該旨意。 又，將上述檢查結果之履歷記憶至記憶部801。且，上述履歷例如可利用於保養、檢查、修理等。 又，進行離子產生器31b～46b之檢查之時期雖未特別限定，但可列舉例如接通檢查裝置1b之電源時(上升時)、切斷檢查裝置1b之電源前、檢查之IC器件90之批次與下一批次之間、經過特定期間時等。又，亦可藉由使用者之操作，使上述檢查開始。 如以上所說明般，根據檢查裝置1b，於離子產生器31b～46b中之至少1個有異常之情形時，可基於檢測部之檢測結果，確實地檢測產生上述異常，且可特定出產生異常之離子產生器。藉此，使用者可迅速且確實地應對。 以上，雖就圖示之實施形態對本發明之電子零件搬送裝置及電子零件檢查裝置加以說明，但本發明並非限定於此，亦可將構成電子零件搬送裝置及電子零件檢查裝置之各部置換為可發揮相同功能之任意之構成者。又，亦可追加任意之構成物。 又，本發明之電子零件搬送裝置及電子零件檢查裝置亦可為組合上述各實施形態中之任意2種以上之構成(特徵)者。 於上述之第1實施形態中，雖設為於檢查裝置1具備包含作用部、報知部40、操作部50及控制部80之電子零件搬送裝置，但本發明並不限定於此，亦可設為具備作用部、報知部40、操作部50及控制部80之檢查裝置。 於上述之第3、第4實施形態中，雖使用條碼讀取器作為可取得於電子零件所附之資訊之資訊取得部，但並不限定於此，例如，亦可使用CCD(Charge Coupled Device)相機等攝像裝置。於攝像裝置之情形時，較佳使該攝像裝置一面掃描一面進行拍攝(線掃描)。 又，於判斷第1條碼讀取器及第2條碼讀取器之作動是否正常所使用之基準標記雖於上述之實施形態中為條碼，但並不限定於此，亦可為圖形、文字、記號等。於該情形時，使用可進行圖像處理之CCD(Charge Coupled Device)相機等攝像裝置作為資訊取得部。 又，第1條碼讀取器之感測器範圍與第2條碼讀取器之感測器範圍雖於上述之各實施形態中不同，但並不限定於此，亦可相同。 又，於第1資訊取得單元及第2資訊取得單元之條碼讀取器之設置數雖於上述之各實施形態中分別為2個，但並不限定於此，例如，根據需要亦可為1個或3個以上。 又，對第1條碼讀取器或第2條碼讀取器之清潔雖於上述之各實施形態中為藉由操作者進行之手動作業，但並不限定於此，例如，亦可於檢查裝置設置自動清潔機構，而以該自動清潔機構進行。 又，檢查裝置之判斷用之控制程式亦可構成為與於步驟S207(第3實施形態)之報知同時將該報知資訊發送至其他外部機器。Hereinafter, the electronic component transfer device and the electronic component inspection device of the present invention will be described in detail based on a preferred embodiment with reference to the attached drawings. In the following, for convenience of explanation, the three axes shown in the figure which are orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. The XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. Further, a direction parallel to the X axis is also referred to as "X direction", a direction parallel to the Y axis is also referred to as "Y direction", and a direction parallel to the Z axis is also referred to as "Z direction". The direction in which the arrows in each direction are directed is referred to as "positive", and the opposite direction is referred to as "negative". In addition, the positive side in the Z direction may be referred to as "up (or above)", and the negative side in the Z direction may be referred to as "down (or below)." In addition, in the inspection device, the upstream side in the conveyance direction of the electronic components is also simply referred to as "upstream side", and the downstream side is also simply referred to as "downstream side". In addition, the "horizontal" mentioned in the description of the present case is not limited to a complete level, as long as it does not hinder the transportation of electronic parts, it also includes a state inclined slightly (for example, less than about 5 °) with respect to the level. In the following embodiments, the inspection device (electronic component inspection device) is used to transport ICs such as a BGA (Ball Grid Array) package or an LGA (Land Grid Array) package. Device, electronic device such as LCD (Liquid Crystal Display), CIS (CMOS Image Sensor: CMOS image sensor), and inspection and test (hereinafter referred to as "inspection") electrical characteristics during the transportation process . In the following, for convenience of explanation, a case where an IC device is used as the above-mentioned electronic component for inspection will be described as a representative, and it will be referred to as "IC device 90". The inspection device is configured such that the side where the tray supply area A1 and the tray removal area A5 are arranged (for example, the negative side in the Y direction in FIG. 2) becomes the front side, and the opposite side, that is, the inspection area A3 or the inspection area is arranged The side of A30 (for example, the positive side in the Y direction in FIG. 2) is used as the back side. <First Embodiment> Hereinafter, a first embodiment of an electronic component transfer device and an electronic component inspection device according to the present invention will be described with reference to FIGS. 1 to 7. In addition, the "acting part" in this specification refers to heating or cooling the IC device 90 and transporting the IC device 90 in each part of the electronic component transfer device or the inspection device, that is, caused by performing a specific action on the IC device 90 Somewhere affected. As shown in FIGS. 1 and 2, the inspection apparatus 1 includes an electronic component transport apparatus 10 and an inspection unit 16 that transport IC devices 90. The electronic component transporting apparatus 10 includes at least an action section, a notification section 40, an operation section 50, and a control section 80 that perform specific functions. As shown in FIG. 2, the inspection device 1 is divided into a tray supply area A1, a device supply area (hereinafter referred to as a "supply area") A2, an inspection area A3, a device recovery area (hereinafter referred to as a "recycling area") A4, and a tray removal Area A5. Further, the IC device 90 is transported by the electronic component transporting device 10, and is sequentially transported from the tray supply area A1 to the tray removal area A5 through the above-mentioned areas, and is inspected by the inspection section 16 in the inspection area A3 in the middle. In this inspection device 1, from the tray supply area A1 to the tray removal area A5, from the supply area A2 to the collection area A4 of the IC device 90 may be referred to as a "delivery area". The tray supply area A1 is a material supply section to which trays (arrangement members) 200 in which a plurality of IC devices 90 are arranged in an unchecked state are supplied. In the tray supply area A1, a plurality of trays 200 can be stacked. The supply area A2 is an area where a plurality of IC devices 90 arranged on the tray 200 from the tray supply area A1 are supplied to the inspection area A3, respectively. In addition, tray transfer mechanisms 11A and 11B are provided so as to straddle the tray supply area A1 and the supply area A2. In the supply area A2, a temperature adjustment section (a soaking plate) 12, a device transfer head 13, and a tray transfer mechanism (first transfer device) 15 are provided. The temperature adjustment section 12 is a mounting section on which a plurality of IC devices 90 are placed, and the plurality of IC devices 90 can be heated or cooled. Thereby, the IC device 90 can be adjusted to a temperature suitable for inspection. In the configuration shown in FIG. 2, two temperature adjustment sections 12 are arranged and fixed in the Y direction. In addition, the IC device 90 on the tray 200 that is carried in (carried in) from the tray supply area A1 by the tray transfer mechanism 11A is transferred to and placed on any one of the temperature adjustment units 12. The device transfer head 13 is supported to be movable within the supply area A2. With this, the device transfer head 13 can transfer the IC device 90 between the tray 200 and the temperature adjustment section 12 carried in from the tray supply area A1, and the IC device 90 between the temperature adjustment section 12 and the device supply section 14 described later. Of transportation. The tray transfer mechanism 15 is a mechanism that transfers the empty tray 200 in a state where all the IC devices 90 are removed in the X direction in the supply area A2. After the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray transfer mechanism 11B. The inspection area A3 is an area where the IC device 90 is inspected. In this inspection area A3, a device supply section (supply shuttle) 14, an inspection section 16, a device transfer head 17, and a device recovery section (recovery shuttle) 18 are provided. The device supply section 14 is a mounting section on which the temperature-adjusted IC device 90 is placed, and the IC device 90 can be transported to the vicinity of the inspection section 16. The device supply unit 14 is supported to be movable in the X direction between the supply area A2 and the inspection area A3. In the configuration shown in FIG. 2, two device supply units 14 are arranged in the Y direction, and the IC devices 90 on the temperature adjustment unit 12 are transported to and placed on any one of the device supply units 14. The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90. The inspection unit 16 is provided with a plurality of probe pins that are electrically connected to the terminals of the IC device 90 while maintaining the state of the IC device 90. In addition, the terminals of the IC device 90 are electrically connected (contacted) with the probe pins, and the inspection of the IC device 90 is performed through the probe pins. In addition, in the inspection section 16, similarly to the temperature adjustment section 12, the IC device 90 can be heated or cooled, and the IC device 90 can be adjusted to a temperature suitable for inspection. In this embodiment, the inspection section 16 is provided with four grooves 161 to 164 constituted by recessed portions. The four grooves 161 to 164 are arranged in a matrix of two columns and two rows. The device transfer head 17 is supported to be movable within the inspection area A3. Thereby, the device transfer head 17 can transfer and place the IC device 90 on the device supply part 14 carried in from the supply area A2 to the inspection part 16. In the inspection device 1, the device transfer head 17 includes two arms 171 and 172. The IC device 90 is disposed on the inspection unit 16 by any one of the arms 171 and 172. The device recovery section 18 is a placement section of the IC device 90 placed in the inspection section 16 after the inspection is completed, and the IC device 90 can be transported to the recovery area A4. The device recovery section 18 is supported to be movable in the X direction between the inspection area A3 and the recovery area A4. In the configuration shown in FIG. 2, the device recovery unit 18 is the same as the device supply unit 14, and two of them are arranged in the Y direction, and the IC devices 90 on the inspection unit 16 are transferred to any of the device recovery units 18. And placed. This transfer is performed by the device transfer head 17. The collection area A4 is an area of the plurality of IC devices 90 after the collection inspection is completed. In the collection area A4, a collection tray 19, a device transfer head 20, and a tray transfer mechanism (second transfer device) 21 are provided. An empty tray 200 is also prepared in the collection area A4. The collection tray 19 is a mounting portion on which the IC device 90 is placed, and is fixed in the collection area A4. In the configuration shown in FIG. 2, three collection trays are arranged along the X direction. The empty tray 200 is also a mounting portion on which the IC device 90 is mounted, and three empty trays 200 are arranged along the X direction. Then, the IC device 90 on the device recovery section 18 moved to the recovery area A4 is transported to and placed on any one of the recovery tray 19 and the empty tray 200. Thereby, the IC device 90 is collected and classified according to the inspection result. The device transfer head 20 is supported to be movable within the recovery area A4. Thereby, the device transfer head 20 can transfer the IC device 90 from the device collection part 18 to the collection tray 19 or the empty tray 200. The tray transfer mechanism 21 is a mechanism that transfers the empty tray 200 carried in from the tray removal area A5 in the X direction in the recovery area A4. After the transfer, the empty tray 200 is placed at a position where the IC device 90 is collected. In other words, it can be any one of the three empty trays 200 described above. In such an inspection device 1, a tray conveyance mechanism 21 is provided in the recovery area A4, and in addition, a tray conveyance mechanism 15 is provided in the supply area A2. This makes it possible to increase the throughput (the number of IC devices 90 to be transported per unit time) compared to when the empty tray 200 is transported in the X direction by one transport mechanism. In addition, the configurations of the tray transfer mechanisms 15 and 21 are not particularly limited, and examples thereof include configurations of a support member such as an adsorption member having an adsorption tray 200 and a ball screw supporting the adsorption member to be movable in the X direction. The tray removal area A5 is a material removal portion that collects and removes the trays 200 in which the plurality of IC devices 90 in the inspection state are arranged. In the tray removing area A5, a plurality of trays 200 can be stacked. In addition, tray transfer mechanisms 22A and 22B are provided so as to straddle the recovery area A4 and the tray removal area A5. The tray transfer mechanism 22A is a mechanism that transfers the tray 200 on which the IC devices 90 having been inspected are placed from the recovery area A4 to the tray removal area A5. The tray transfer mechanism 22B is a mechanism that transfers the empty tray 200 for recycling the IC devices 90 from the tray removal area A5 to the collection area A4. A rotation stage 23A is provided in the supply area A2. The rotary stage 23A is formed in a disc shape and is constituted by a stage that can be rotated around the Z axis. In the state where the IC device 90 is placed on the rotary stage 23A, the orientation of the IC device 90 can be changed by rotating the rotary stage 23A. A rotation stage 23B is also provided in the recovery area A4. The rotary stage 23B is formed in a disc shape and is configured as a stage that can be rotated around the Z axis. In a state where the IC device 90 is placed on the rotary stage 23B, the orientation of the IC device 90 can be changed by rotating the rotary stage 23B. In the inspection device 1 as described above, in addition to the temperature adjustment section 12 or the inspection section 16, the device transfer head 13, the device supply section 14, and the device transfer head 17 are also configured to heat or cool the IC device 90. Thereby, the temperature of the IC device 90 is maintained constant during the transportation. In the following, a case where the IC device 90 is cooled and inspected in a low-temperature environment in a range of, for example, -60 ° C to -40 ° C will be described. As shown in FIG. 2, the inspection device 1 divides (separates) the tray supply area A1 and the supply area A2 by the first partition wall 61, and divides the supply area A2 and the inspection area A3 by the second partition wall 62 The third partition wall 63 divides the inspection area A3 and the recovery area A4, and the fourth partition wall 64 divides the recovery area A4 and the tray removal area A5. The supply area A2 and the recovery area A4 are also divided by a fifth partition wall 65. These partitions have the function of maintaining the airtightness of each area. In addition, the inspection device 1 is covered with a cover at the outermost surface, and the cover includes a front cover 70, side covers 71 and 72, and a rear cover 73. The supply area A2 is a first room R1 defined by the first partition wall 61, the second partition wall 62, the fifth partition wall 65, the side cover 71, and the rear cover 73. In the first room R1, a plurality of IC devices 90 in an unchecked state are carried in together with the tray 200. The inspection area A3 is a second room R2 defined by the second partition wall 62, the third partition wall 63, and the rear cover 73. In addition, an inner partition wall 66 is disposed on the inner side of the second chamber R2 than the rear cover 73. The recovery area A4 is a third room R3 defined by the third partition wall 63, the fourth partition wall 64, the fifth partition wall 65, the side cover 72, and the rear cover 73. In the third room R3, the plurality of IC devices 90 after the inspection are carried in from the second room R2. As shown in FIG. 2, a first door (first left door) 711 and a second door (second left door) 712 are provided on the side cover 71. By opening the first door 711 or the second door 712, for example, maintenance in the first room R1 or release of the IC device 90 from being caught (hereinafter, these are collectively referred to as "operation"). The first door 711 and the second door 712 are configured to open and close in opposite directions. When working in the first room R1, the movable parts such as the device transfer head 13 in the first room R1 are stopped. Similarly, a first door (the right first door) 721 and a second door (the right second door) 722 are provided on the side cover 72. By opening the first door 721 or the second door 722, for example, work in the third room R3 can be performed. The first and second doors 721 and 722 also open and close in opposite directions. When working in the third room R3, the movable parts such as the device transfer head 20 in the third room R3 are stopped. Further, the rear cover 73 is also provided with a first door (first door on the back side) 731, a second door (second door on the back side) 732, and a third door (third door on the back side) ) 733. By opening the first door 731, for example, work in the first room R1 can be performed. By opening the third door 733, for example, work in the third room R3 can be performed. A fourth door 75 is provided on the inner partition wall 66. Further, by opening the second door 732 and the fourth door 75, for example, work in the second room R2 can be performed. The first door 731, the second door 732, and the fourth door 75 are opened and closed in the same direction, and the third door 733 is opened and closed in a direction opposite to these doors. When working in the second room R2, the movable parts such as the device transfer head 17 in the second room R2 are stopped. In addition, by closing each door, the airtightness or heat insulation of each corresponding room can be ensured. As shown in FIG. 1, the notification unit 40 includes a monitor 41, a lamp 42, and a buzzer 43 that display the driving or inspection results of each unit. The monitor 41 may be configured by, for example, a light-emitting liquid crystal display panel or a display panel such as an organic EL. The monitor 41 is arranged on the upper right side (positive side in the X direction) in the drawing of the inspection device 1. The operator can set and confirm various processes and conditions of the inspection device 1 through the monitor 41. The lamp 42 is arranged on the upper left side (negative side in the X direction) in the drawing of the inspection device 1. The lamp 42 is controlled and operated by the control unit 80. The buzzer 43 is controlled and operated by the control unit 80. The operation unit 50 is an input device such as a mouse 501 and outputs an operation signal corresponding to an operation performed by an operator to the control unit 80. Therefore, the operator can use the mouse 501 to instruct the control unit 80 for various processes and the like. As shown in FIG. 1, the mouse 501 may be disposed on the right side of the inspection device 1 in the figure and near the monitor 41 (notification unit 40). In this embodiment, although the mouse 501 is used as the operation unit 50, the operation unit 50 is not limited to this, and may be an input device such as a keyboard, a trackball, a touch panel, and the like. As shown in FIG. 3, the control section 80 includes a drive control section 81, an inspection control section 82, a memory section 83, a calculation section 84, a determination section 85, and a transmission section 86. In addition, the memory section 83, the calculation section 84, and the determination section 85 constitute a replacement time estimation section 100. The drive control unit 81 controls the tray transfer mechanisms 11A and 11B, the temperature adjustment unit 12, the device transfer head 13, the device supply unit 14, the tray transfer mechanism 15, the inspection unit 16, the device transfer head 17, the device recovery unit 18, the device transfer head 20 , The respective parts of the tray conveyance mechanism 21 and the tray conveyance mechanisms 22A and 22B. The inspection control unit 82 inspects the electrical characteristics of the IC device 90 arranged in the inspection unit 16 based on the program stored in the memory unit 83. The memory unit 83 includes, for example, volatile memory such as RAM (Random-Access Memory), non-volatile memory such as ROM (Read-Only Memory), and EPROM (Erasable and Programmable Read). Only Memory: Erasable and Programmable Read Only Memory (EEPROM), EEPROM (Electrically Erasable and Programmable Read Only Memory), Flash Memory and other rewritable (Erasable) , Rewrite), non-volatile memory, etc., various semiconductor memory (IC memory), etc. Here, the inspection device 1 must inspect a plurality of IC devices 90 in a short time, that is, a high throughput is required. In order to achieve a high throughput, the inspection device 1 requires high speed operation, rapid acceleration and deceleration, frequent on / off operations, and the like of each unit. Moreover, since a plurality of IC devices 90 are held or transported at the same time, each part has a complicated structure. In addition, in the inspection device 1, the inspection of the IC device 90 is performed while managing the environment such as temperature and humidity. Furthermore, in order to increase the processing amount, the position information of each department is managed and the departments cooperate with each other. Therefore, the responsiveness and the like of each department are required to have high reliability. As described above, the inspection device 1 can have a complicated structure and perform complicated operations. For example, compared with a manufacturing apparatus for manufacturing the IC device 90 by performing exposure or etching, the complex structure of the inspection apparatus 1 is also more specific. Here, as "parts of each part of the inspection apparatus 1" which comprises the inspection apparatus 1, the representative is shown in Table 1 below. In Table 1, the names of the parts are described in the vertical row, and the names of the parts are described in the horizontal row. [Table 1] A belt, a motor, a bearing, and a cylinder are mounted on the tray transfer mechanism 11A. A belt, a motor, a bearing, and a cylinder are mounted on the tray transfer mechanism 11B. A heater is mounted on the temperature adjustment unit 12. The device transfer head 13 is equipped with a pump, a ball screw, a linear guide, a heater, a motor, a bearing, a cylinder, a valve, and an ejector. A belt, a linear guide, a heater, a motor, and a bearing are mounted on the device supply unit 14. A pump, a belt, a linear guide, a motor, and a bearing are mounted on the tray transfer mechanism 15. A heater is mounted on the inspection unit 16. A pump, a ball screw, a heater, a motor, a cylinder, a valve, a bushing, an ejector, and a diaphragm are mounted on the device transfer head 17. A linear guide, a heater, a motor, and a bearing are mounted on the device recovery unit 18. The device transfer head 20 is equipped with a pump, a ball screw, a linear guide, a heater, a motor, a bearing, a cylinder, a valve, and an ejector. A pump, a ball screw, a linear guide, a motor, a bearing, a cylinder, a valve, and an ejector are mounted on the tray transfer mechanism 21. A belt, a motor, a bearing, and a cylinder are mounted on the tray transfer mechanism 22A. A belt, a motor, a bearing, and a cylinder are mounted on the tray conveyance mechanism 22B. In addition, in the inspection apparatus 1, each of the pumps is a common pump used in the device transfer head 13, the tray transfer mechanism 15, the device transfer head 17, the device transfer head 20, and the tray transfer mechanism 21. In addition, in the inspection apparatus 1, for example, a linear guide, a pump, or the like is used in each part of the inspection apparatus 1 by using a suitable type (size, etc.). The parts of each part of the inspection device 1 are consumers, and need to be quickly replaced or maintained when the replacement time is approaching. For example, when the parts of each part are consumed and damaged during the operation of the inspection device 1, it is necessary to stop the operation of the entire inspection device 1 to significantly reduce the throughput. In addition, each part has a different period from the state of the new product to the state of breakage, so it is difficult to manage the state of each part individually. In the inspection device 1, since the replacement time is estimated by the replacement time estimation unit 100, the replacement time of the parts including the active part can be managed, and it becomes a structure effective for solving the problems as described above. This point will be described below. In the following, as the “parts of each part of the inspection apparatus 1”, the linear guide of the device transfer head 13 will be representatively described. The first value T, which is a predetermined value, is stored in the storage unit 83. 1 And the second value T 2 . Referring to FIG. 4 for the first value T 1 And the second value T 2 Be explained. FIG. 4 is a time-horizontal graph. In the chart, the left indicates the past and the right indicates the future. In addition, the left end of the graph indicates when a new product is replaced or when a new product is installed. In addition, the right end of the graph indicates the breakage period when the state of the new product is consumed and broken. Cumulative use time T before the linear guide breaks 3 (t 3 -t 0 ) Is roughly fixed depending on the type of linear guide. In addition, in this manual, the period from the state of a new product to the time of breakage includes the mean time between failures (MTTF) (Mean Time To Failure: average time to failure), and the average time between maintenance and repair after breakage MTBF (Mean Time Between Failure). 1st value T 1 It is the criterion for judging to what extent the linear guide is used from the state of the new product. 1st value T 1 Is shorter than the cumulative use time T 3 (t 3 -t 0 ) (T 1 -t 0 ). 2nd value T 2 It is the criterion for judging the extent to which the linear guide should be replaced or maintained after it is used. 2nd value T 2 Is shorter than the cumulative use time T 3 (t 3 -t 0 ), And longer than the first value T 1 Period (t 2 -t 0 ). The arithmetic unit 84 has a function for calculating the current use condition (cumulative operation time T of the linear guide). Z ) Function. That is, the calculation unit 84 calculates the current usage status of the linear guide in the graph shown in FIG. 4 and is located at the accumulated usage time T 3 Where it was before. The calculation method is described below using the graph shown in FIG. 4 and the following Table 2. As shown in the graph of FIG. 4, for example, the N1th operation time T of the first use of the linear guide from the new state is obtained. N1 . Next, find the N2th actuation time T for the next use N2 . Then, the operating time T N1 With actuation time T N2 Add up. Thereby, at the end of the N2th operation, the usage status of the linear guide can be obtained. It is located at the accumulated usage time T in the graph shown in FIG. 4. 3 Where it was before. In addition, since the third and subsequent times also increase the operating time by T N1 + T N2 , To obtain the usage status of the linear guide at the end. Here, as an example, the operating time T N1 The calculation method will be described. Table 2 below describes the "ratio of the maximum processing amount (UPH) to the actual operation processing amount (UPH)", and the "speed conversion value" and the "operation time coefficient" corresponding to the ratio. The maximum processing amount refers to the maximum value of the processing amount when the inspection device 1 performs the transportation and inspection of the IC device 90. The actual operation throughput refers to the throughput during actual operation. The speed conversion value refers to the ratio of the actual speed at which the maximum speed of the device transfer head 13 relative to the device transfer head 13 is actuated according to the ratio of the maximum processing amount to the actual operation processing amount. The operating time coefficient is the coefficient multiplied by the operating time based on the speed conversion value. [Table 2] For example, as shown in Table 2, when the ratio of the maximum processing amount to the actual operation processing amount is 20% or less, the speed conversion value becomes 20%, and the operating time coefficient is 1/8. By multiplying the operating time coefficient by 1/8 by the operating time, the time when used at the highest speed (in a state of maximum processing amount) can be obtained. In this way, by measuring the actual operating time of the N1th time and multiplying the measured operating time by the operating time coefficient, the operating time T can be obtained. N1 . As for the operating time T N2 ~ T Nx The calculation is performed in the same manner, and the description is omitted. Then, the determination unit 85 determines the cumulative operation time T Z Whether to reach the first value T 1 And the second value T 2 . In addition, in the inspection device 1, the cumulative operating time T Z Reached the first value T 1 In this case, the operator is notified as follows. As shown in FIGS. 1 and 5, in the inspection device 1, a window W is displayed on the monitor 41. In window W, the cumulative operating time T is displayed side by side from the positive side in the Z direction in FIG. 5 in order. Z Reached the first value T 1 The intended area, the area showing the details, and a schematic plan view of each part of the inspection device 1. In the structure shown in the figure, the cumulative operating time T of the linear guide of the device transfer head 13 Z Reached the first value T 1 The time is displayed. In the schematic plan view, the position of the circle mark shown in the figure indicates which parts are near the replacement time. In addition, in the inspection device 1, the cumulative operating time T Z Reached the first value T 1 Situation, and cumulative operating time T Z Reached the second value T 2 At that time, the lamp 42 is turned on. Thereby, even when the operator of the inspection device 1 is located away from the inspection device 1, the cumulative operating time T can be known. Z Reached the first value T 1 Or 2nd value T 2 . In the inspection device 1, the buzzer 43 is operated at the same time as when the lamp 42 is turned on. Thereby, even if the operator does not look at the inspection device 1, the accumulated operating time T can be known. Z Reached the first value T 1 Or 2nd value T 2 . In addition, although the color or on / off mode of the lamp 42 is not particularly limited, it is better than the cumulative operating time T Z Reached the first value T 1 Time, and reach the second value T 2 Different. This makes it easy for the operator to distinguish the accumulated operating time T Z Yes to the first value T 1 , Still reaches the second value T 2 . The sound of the buzzer 43 is preferably better than the accumulated operating time T. Z Reached the first value T 1 Time, and reach the second value T 2 Different. This makes it easy for the operator to distinguish the accumulated operating time T Z Yes to the first value T 1 , Still reaches the second value T 2 . Also, at the cumulative operating time T Z Reached the first value T 1 In this case, the intention is transmitted to, for example, the host computer through the transmitting unit 86. This makes it possible to manage the replacement time of each unit, for example, a host computer. Such a transmitting unit 86 can be implemented by communication means such as LAN (Local Area Network), WAN (Wide Area Network), MAN (Metropolitan Area Network), or the Internet. Make up. The specifications of the communication of the transmitting unit 86 are not particularly limited, but the SECS / GEM protocol is preferred. The communication of equipment handling general semiconductors is performed in accordance with the SECS / GEM agreement, so the communication is performed in accordance with the SECS / GEM agreement, so the versatility is excellent. In addition, "SECS" is an abbreviation of "SEMI Equipment Communications Standard: Semiconductor Equipment Communication Standard", and "GEM" is an abbreviation of "Generic Model For Communications and Control of Manufacturing Equipment: General Model of Communications and Control of Manufacturing Equipment". In addition, as shown in FIG. 6, in the inspection device 1, the transmission log can be stored in the storage unit 83. Thereby, the inspection apparatus 1 can manage the past transmission history. Therefore, even when the operator is rotated to a different operator, the past state of the inspection device 1 can be grasped. As described above, the linear guide of the device transfer head 13 is described as an example, but the present invention is not limited to this, and the replacement time can be similarly managed for other parts. For example, Table 3 shown below is a table showing a method for determining the actual operating time of parts other than the linear guide of the device transfer head 13, and is shown as holding the IC device 90 at the position shown in FIG. 2 and transferring it to the device supply This table is the time (1 cycle time) for returning to the position shown in Figure 2. As shown in Table 3, in the case of the normal temperature mode in which the device transfer head 13 is inspected at normal temperature, it is 1.60 seconds. In the case of the high-temperature mode in which the inspection was performed at a high temperature, it was 3.00 seconds. In addition, when passing through the rotary stage 23A in the normal temperature mode (there is rotation at normal temperature), it was 2.60 seconds. In addition, when passing through the rotary stage 23A in the high temperature mode (there is rotation at high temperature), it is 4.00 seconds. [table 3] In this way, in the inspection device 1, the actual operating time of the device transfer head 13 can also be calculated based on the information of the several IC devices 90 transferred by the device transfer head 13 and the temperature mode information at this time. Note that Table 4 shown below is a table showing a method for determining the actual operating time of the device transport head 20. Table 4 shows the time required for one cycle according to the transfer place of the device transfer head 20. In addition, one cycle of the device transfer head 20 refers to a time when the IC device placed in the device recovery section 18 is held and transferred to the tray 200. [Table 4] In Table 4, "Unloader 1" indicates a cycle when the IC device 90 is transferred to the three trays 200 in the recovery area A4 transferred by the tray transfer mechanism 22A. The tray 200 on the most negative side in the X direction in FIG. 2 Time. When passing through the rotary stage 23B (with rotation), it is 1.00 second, and when not passing through the rotary stage 23B (without rotation), it is 0.70 second. "Unloader 2" indicates the time of one cycle when the IC device 90 is transferred to the three trays 200 in the recovery area A4 transferred by the tray transfer mechanism 22A, and the tray 200 is centered in the X direction in FIG. 2. When the rotary stage 23B is passed, it is 1.75 seconds, and when the rotary stage 23B is not passed, it is 0.75 seconds. "Unloader 3" indicates the time of one cycle when the IC device 90 is transferred to the three trays 200 in the recovery area A4 transferred by the tray transfer mechanism 22A. The tray 200 on the most positive side in the X direction is shown in FIG. 2. When passing through the rotary stage 23B, it is 1.10 seconds, and when it does not pass through the rotary stage 23B, it is 0.80 second. In addition, the "fixed tray 1" indicates a cycle time when the IC device 90 is transferred to the three recycling trays 19 in FIG. 2 and the recycling tray 19 on the most positive side in the X direction. In the case of passing through the rotary stage 23B, it is 0.80 second, and in the case of not passing through the rotary stage 23B, it is 0.50 second. In addition, the "fixed tray 2" indicates a period of one cycle when the IC device 90 is transferred to the three recycling trays 19 in FIG. 2 and the recycling tray 19 is located at the center in the X direction. When the rotary stage 23B is passed, it is 0.85 seconds, and when the rotary stage 23B is not passed, it is 0.55 seconds. In addition, the "fixed tray 3" indicates a cycle time when the IC device 90 is transferred to the three recycling trays 19 in FIG. 2 and the recycling tray 19 on the most negative side in the X direction. When the rotary stage 23B is passed, it is 0.90 seconds, and when the rotary stage 23B is not passed, it is 0.60 seconds. In addition, there are components such as a device supply unit 14, a device transfer head 17, and a device recovery unit 18, and the time required for one cycle is the same time regardless of the temperature mode. The 1 cycle of the device supply section 14 means that the position of the device supply section 14 shown by the solid line in FIG. 2 is moved to the position shown by the broken line in the inspection area A3 of FIG. 2 and returned to the line shown in FIG. 2 again. Up to the position of the device supply section 14. The cycle of the device transfer head 17 is to hold the IC device 90 of the device supply section 14 in the inspection area A3, and place the IC device 90 in the inspection section 16 and return to the original position again. The 1 cycle of the device supply section 18 means that the position of the device supply section 18 shown by the solid line in FIG. 2 is moved to the position shown by the broken line in the inspection area A3 of FIG. 2 and returned to the line shown in FIG. 2 again. Up to the position of the device supply section 18. As described above, according to the inspection device 1, the replacement timing estimation unit 100 can be based on the number of operations (cycle number), the action time (actual operation time), and the action speed (actual operation) of the parts (action parts) of each part of the inspection device 1. Either at least the number of actions or the action time is estimated to be the replacement period. The estimated result reaches the first value T. 1 And the second value T 2 In this case, the notification can be notified by the notification unit 40. With this, for example, it is possible to prevent the parts from being damaged during the operation of the inspection device 1 and stop the inspection device 1. Therefore, it is possible to effectively prevent a reduction in the amount of processing accompanying such an accidental stop of the inspection device 1. As a result, the inspection apparatus 1 can maintain a high throughput. In particular, it is possible to manage the replacement period of air compressors such as pumps, valves, and ejectors that are relatively larger than other parts, electric machines such as heaters and motors, belts, ball screws, and sliding machines such as cylinders. Effectively exert the above effects. Hereinafter, the control program of the inspection device 1 will be described based on the flowchart shown in FIG. 7. In the following, the linear guide of the device transfer head 13 will be described as an example. First, in step S101, the cumulative operation time T of the device transfer head 13 is calculated by the above method. Z . Then, in step S102, the cumulative operation time T is determined. Z Whether it is less than the first value T 1 . In step S102, it is determined that the accumulated operating time T Z Less than the first value T 1 , That is, the first value T is not reached 1 In this case (S102: YES), return to step S101 to calculate the cumulative operating time T Z . In step S102, it is determined that the accumulated operating time T is Z Up to the first value T 1 Above, it reaches the first value T 1 In the case (S102: NO), proceed to step S103, and judge the cumulative operating time T Z Whether it is less than the second value T 2 . In step S103, it is determined that the accumulated operating time T Z Less than the second value T 2 , That is, the second value T is not reached 2 In the case (S103: YES), proceed to step S104, and report the cumulative operating time T Z Reached the first value T 1 . By this, the operator can know that the replacement time of the linear guide is close, and the maintenance or replacement of the linear guide can be performed at the required time. In step S103, it is determined that the accumulated operating time T Z Up to the second value T 2 Above, it reaches the second value T 2 In this case (S103: No), the operations of the various units of the inspection apparatus 1 are stopped (step S105). Then, in step S106, the cumulative operating time T is reported. Z Reached the second value T 2 . Thereby, the operator can know that the replacement time is closer. As described above, in the inspection device 1, it can be notified in two stages that the replacement time of the linear guide is approaching. Therefore, the operator knows that the replacement time is approaching step by step, and it is easy to plan the timing of the replacement. In particular, the inspection device 1 is configured to stop the operations of the inspection device 1 and urge replacement before the linear guide reaches the replacement time, that is, before the linear guide is damaged. Thereby, the risk of damaging parts other than the linear guide by continuously inspecting the operation of the device 1 even though the linear guide has been damaged can be avoided. Furthermore, in the inspection device 1, the inspection status of the IC device 90 is stored in the memory unit 83 (so far, several IC devices 90 or the accumulated data of the tray 200 have been transported). Therefore, at the time when the above-mentioned program is installed in the inspection device 1, the current cumulative operating time T can be calculated based on the inspection status and the method of obtaining the cumulative operating time shown in Tables 3 and 4, for example. Z . <Second Embodiment> Hereinafter, a second embodiment of the electronic component transfer device and the electronic component inspection device according to the present invention will be described with reference to FIGS. 8 and 9. However, the differences from the above embodiment will be mainly described, and The description of the same matters is omitted. This embodiment is the same as the first embodiment except that the control program of the control unit is different. As shown in FIGS. 8 and 9, the device transfer head 13 includes eight hands 131. When each hand 131 is viewed from the Z-axis direction, it has a matrix shape of two rows of four hands 131 arranged in the X-axis direction and two columns of two rows and four rows in the Y-axis direction. In the following, among the eight hands 131, the hands from the + Y axis side to the -X axis side hands 131 are sequentially set to the hands 131a, 131b, 131c, and 131d, and from the -Y axis side to The hands on the X-axis side are sequentially set to the hands 131e, 131f, 131g, and 131h. For example, a case where the hand 131a and the hand 131d are used for inspection as shown in FIG. 8 will be described. In this case, the parts of the hand 131a and the hand 131d consume more than the parts of the other hand 131 (hereinafter, the valve will be described as an example), and the accumulated operating time becomes larger. In the case where the hands 131a and 131d are used for inspection and the accumulated operating time of the valves of the hands 131a and 131d reaches the first value, in the inspection device 1, as shown in FIG. 9, switch to use the hands 131e and Hand 131h mode. Therefore, the inspection can be continued using the hands 131e and 131h. According to this embodiment, even when the replacement timing of the parts of the inspection device 1 is approaching, it is possible to switch to a mode in which a part that performs the same action on the IC device 90 is operated. Therefore, even if the replacement timing of the parts of the inspection device 1 is approaching, it is possible to suppress continued consumption of the parts. As a result, the number of maintenance or replacement of parts can be reduced, and the throughput can be further increased. In addition, during the inspection using the hands 131a and 131d, when the cumulative operating time of the valves of the hands 131a and 131d reaches the first value, the switched hands 131 are preferably switched to the hands 131b, 131c, 131e, 131f, 131g, and 131h have fewer hands with cumulative action time 131. Thereby, the cumulative operating time of each hand 131 can be made as same as possible. Therefore, the number of maintenance or replacement of parts can be further reduced, and the throughput can be further improved. In this embodiment, the switching of the hand 131 of the device transfer head 13 is described as an example. However, in the inspection device 1, the switching can be performed as described above in the working portion that can perform the same function as the IC device 90. . <Third Embodiment> Hereinafter, a third embodiment of the electronic component transfer device and the electronic component inspection device according to the present invention will be described with reference to FIGS. 10 to 16. In this embodiment, the same components as those in the above embodiment are denoted by the same reference numerals. In this embodiment, as shown in FIG. 12, a barcode 901 is attached to the front surface of each IC device 90 as information about the IC device 90. The barcode 901 includes various information such as the manufacturer of the IC device 90 and the manufacturing serial number of the IC device 90. As the bar code 901, a one-dimensional bar code (identification code that represents information by the thickness of a stripe-like line) and a two-dimensional bar code (for example, a QR code (registered trademark)) are preferably used. The method for applying the barcode 901 to the IC device 90 is not particularly limited, and examples thereof include a method using inkjet and a method using laser marking. As shown in Figs. 10 and 11, the inspection device 1a is divided into a tray supply area A1, a device supply area (hereinafter referred to as "supply area") A2, an inspection area A3, and a device recovery area (hereinafter referred to as "recycling area") A4. , And the tray removal area A5. In addition, the IC device 90 performs inspection in the inspection area A3 in the middle from the tray supply area A1 to the tray removal area A5 in this order. In this manner, the inspection device 1a is formed by the following components: an electronic component transfer device (processor) that transports the IC device 90 in each area; an inspection unit 16a that performs inspection in the inspection area A3; and a control unit 800. In addition, the inspection device 1 a includes a monitor 300, a signal light 400, and an operation panel 700. The tray supply area A1 is a material supply section for supplying a tray (mounting member) 200 in which a plurality of IC devices 90 are arranged in an unchecked state. In the tray supply area A1, a plurality of trays 200 can be stacked. The supply area A2 is an area where a plurality of IC devices 90 arranged on the tray 200 from the tray supply area A1 are supplied to the inspection area A3, respectively. In addition, tray transfer mechanisms 11A and 11B are provided so as to straddle the tray supply area A1 and the supply area A2 in the tray 200 horizontally. The tray conveyance mechanism 11A is a moving part that can move the tray 200 to the positive side in the Y direction together with the IC device 90 placed on the tray 200. Thereby, the IC device 90 can be stably fed into the supply area A2. The tray conveyance mechanism 11B is a moving unit that can move the empty tray 200 to the negative side in the Y direction, that is, from the supply area A2 to the tray supply area A1. In the supply area A2, a temperature adjustment section 12, a device transfer head 13, and a tray transfer mechanism 15 are provided. The temperature adjustment section 12 is a device that can heat or cool a plurality of IC devices 90 together, and is sometimes referred to as a "heat equalizing plate". With this soaking plate, the IC device 90 before the inspection by the inspection unit 16a can be cooled or heated in advance, and adjusted to a temperature suitable for the inspection. In the configuration shown in FIG. 11, two temperature adjustment units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 that is carried in (carried in) from the tray supply area A1 by the tray transfer mechanism 11A is transferred to any one of the temperature adjustment units 12. The device transfer head 13 is supported to be movable in the X direction and the Y direction, and further in the Z direction within the supply area A2. With this, the device transfer head 13 can transfer the IC device 90 between the tray 200 and the temperature adjustment section 12 carried in from the tray supply area A1, and the IC device 90 between the temperature adjustment section 12 and a device supply section 14a described later. Of transportation. The tray transfer mechanism 15 is a mechanism that transfers the empty tray 200 in a state where all IC devices 90 are removed, to the positive side in the X direction in the supply area A2. After the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray transfer mechanism 11B. The inspection area A3 is an area where the IC device 90 is inspected. In this inspection area A3, an inspection section 16a and a device transfer head 17a are provided. A device supply unit 14a that moves across the supply area A2 and the inspection area A3, and a device recovery unit 18a that moves across the inspection area A3 and the recovery area A4 are also provided. Furthermore, a first information acquisition unit 10A and a second information acquisition unit 10B are provided between the supply area A2 and the inspection area A3. The device supply section 14a is a mounting section on which the temperature-adjusted IC device 90 is placed, and the IC device 90 can be transported (moved) to the inspection section 16a near the inspection section 16a. Use the shuttle board. " As shown in FIG. 12, the device supply portion 14 a has recesses (grooves) 141 arranged in a matrix form every four in the X direction and every two in the Y direction. Each of the recesses 141 is housed in the IC devices 90 before the inspection by the inspection unit 16a. In addition, the device supply portion 14 a further includes two recessed portions (grooves) 142 on the positive side in the X direction from each of the recessed portions 141. The two recessed portions 142 are arranged along the Y direction, and can accommodate a virtual device (virtual electronic component) 91 described later. The positioning accuracy of the recessed portion 142 with respect to the dummy device 91 is higher than the positioning height of the recessed portion 141 with respect to the IC device 90. That is, the gap of the dummy device 91 in the recessed portion 142 is more suppressed than the gap of the IC device 90 in the recessed portion 141. Hereinafter, a row where the recesses 141 and 142 are arranged on the negative side in the Y direction will be referred to as "first row M1", and a row arranged on the positive side in the Y direction will be referred to as "second row M2". It is needless to say that the number of formations or the arrangement of the recesses 141 and 142 is not limited to the configuration shown in FIG. 12. The device supply unit 14a is supported to be movable in the X direction in the horizontal direction between the supply area A2 and the inspection area A3. In the configuration shown in FIG. 11, two device supply sections 14 a are arranged in the Y direction, and the IC devices 90 on the temperature adjustment section 12 are transported to any one of the device supply sections 14 a. The device supply unit 14a is configured to maintain the temperature-adjusted IC device 90 as described above. Thereby, the IC device 90 can be cooled or heated, and therefore, the temperature adjustment state of the IC device 90 can be maintained. The inspection portion 16 a is a placement portion on which the IC device 90 is placed, and the electrical characteristics of the IC device 90 are inspected and tested. A plurality of probe pins electrically connected to the terminal portion of the IC device 90 are provided in the inspection portion 16a. In addition, the terminal portion of the IC device 90 is electrically connected (contacted) with the probe pin, and the inspection of the IC device 90 is performed through the probe pin. The inspection of the IC device 90 is performed based on a program stored in an inspection control unit provided in the tester connected to the inspection unit 16a. In addition, in the inspection unit 16a, similarly to the temperature adjustment unit 12, a plurality of IC devices 90 may be cooled or heated, and the IC devices 90 may be adjusted to a temperature suitable for inspection. The device transfer head 17a is supported to be movable in the Y direction and the Z direction within the inspection area A3. Thereby, the device transfer head 17a can transfer and place the IC device 90 on the device supply part 14a carried in from the supply area A2 to the inspection part 16a. In addition, the device transfer head 17a may cool or heat the IC device 90, and adjust the IC device 90 to a temperature suitable for inspection. The device recovery section 18a is an IC device 90 on which the IC device 90 is placed after the inspection by the inspection section 16a, and the IC device 90 can be transported (moved) to the recovery area A4, and is sometimes referred to as a "recycling shuttle" . The device recovery unit 18a is supported so as to be movable in the horizontal direction between the inspection area A3 and the recovery area A4 in the X direction. In the configuration shown in FIG. 11, the device recovery unit 18 a is the same as the device supply unit 14 a. Two device recovery units 18 a are arranged in the Y direction, and the IC devices 90 on the inspection unit 16 a are transferred to any of the device recovery units 18 a and Place. This transfer is performed by the device transfer head 17a. Moreover, in the inspection apparatus 1a, one device supply part 14a and one device recovery part 18a are connected in the X direction via the connection part 23, and are comprised in the shuttle unit which moves together in the same direction. In the following, the shuttle unit on the negative side in the Y direction, that is, the front side is referred to as "first shuttle unit 24A", and the shuttle unit on the positive side in the Y direction, that is, the back side is referred to as "second shuttle unit 24B"". The first information acquisition unit 10A is a unit that acquires a bar code 901 of the IC device 90 on the device supply section 14a of the first shuttle unit 24A. The second information acquisition unit 10B is a unit that acquires the barcode 901 of the IC device 90 on the device supply section 14a of the second shuttle unit 24B. Details of these units are described below. The recovery area A4 is an area of the plurality of IC devices 90 after the recovery inspection is completed. In this collection area A4, a collection tray 19, a device transfer head 20, and a tray transfer mechanism 21 are provided. An empty tray 200 is also prepared in the collection area A4. The recovery tray 19 is a mounting portion on which the IC device 90 after the inspection by the inspection portion 16a is placed, and is fixed so as not to move within the recovery area A4. Thereby, even in the recovery area A4 where various movable parts such as the device transfer head 20 are arranged, the inspected IC device 90 is stably placed on the recovery tray 19. In the configuration shown in FIG. 11, three collection trays 19 are arranged in the X direction. Three empty trays 200 are also arranged in the X direction. The empty tray 200 also serves as a placement section for the IC device 90 placed on the inspection section 16a. Then, the IC device 90 on the device recovery section 18 a moved to the recovery area A4 is transported to and placed on any one of the recovery tray 19 and the empty tray 200. Thereby, the IC devices 90 are sorted and recovered according to each inspection result. The device transfer head 20 is supported to be movable in the X direction and the Y direction, and also in the Z direction within the recovery area A4. Thereby, the device transfer head 20 can transfer the IC device 90 from the device collection part 18 a to the collection tray 19 or the empty tray 200. The tray transfer mechanism 21 is a mechanism that transfers the empty tray 200 carried in from the tray removal area A5 in the X direction in the recovery area A4. In addition, after the transfer, the empty tray 200 is placed at a position where the IC device 90 is collected, that is, it may be any one of the three empty trays 200 described above. The tray removal area A5 is a material removal portion that collects and removes the trays 200 in which the plurality of IC devices 90 in a checked state are arranged. In the tray removing area A5, a plurality of trays 200 can be stacked. In addition, tray transfer mechanisms 22A and 22B for transferring the tray 200 in the Y direction one by one are provided across the collection area A4 and the tray removal area A5. The tray conveyance mechanism 22A is a moving portion that can move the tray 200 in the Y direction. Thereby, the inspected IC device 90 can be transferred from the recovery area A4 to the tray removal area A5. The tray transfer mechanism 22B is a moving unit that can move the empty tray 200 for recycling the IC devices 90 from the tray removal area A5 to the collection area A4. The control unit 800 includes, for example, a drive control unit. The drive control unit controls, for example, the tray transfer mechanisms 11A and 11B, the temperature adjustment unit 12, the device transfer head 13, the device supply unit 14a, the tray transfer mechanism 15, the inspection unit 16a, the device transfer head 17a, the device recovery unit 18a, and the device transfer head 20. , The tray conveyance mechanism 21, the tray conveyance mechanisms 22A, 22B, the first information acquisition unit 10A, and the second information acquisition unit 10B. The inspection control unit of the tester performs inspection of the electrical characteristics of the IC device 90 disposed in the inspection unit 16a based on, for example, a program stored in a memory (not shown). The operator (operator) can set and confirm the operating conditions of the inspection device 1a and the like via the monitor 300. The monitor 300 includes, for example, a display screen (display section) 301 composed of a liquid crystal screen, and is arranged on the upper portion of the front side of the inspection device 1a. As shown in FIG. 10, on the front side in the X direction in the drawing of the tray removal area A5, a mouse stage 600 for placing a mouse for use in displaying a screen on the monitor 300 is provided. An operation panel 700 is disposed below the X-direction front side of the monitor 300 in FIG. 10. In addition to the monitor 300, the operation panel 700 additionally instructs an operator required for the inspection device 1a. In addition, the signal lamp 400 can report the operation state of the inspection device 1a and the like by using a combination of colors of light emission. The signal lamp 400 is arranged above the inspection device 1a. In addition, a speaker 500 may be built in the inspection device 1a, and the operating state of the inspection device 1a and the like may be notified by the speaker 500. As shown in FIG. 11, the inspection device 1 a divides (separates) the tray supply area A1 and the supply area A2 by the first partition wall 61, and divides the supply area A2 and the inspection area A3 by the second partition wall 62. The third partition wall 63 divides the inspection area A3 and the recovery area A4, and the fourth partition wall 64 divides the recovery area A4 and the tray removal area A5. The supply area A2 and the recovery area A4 are also divided by a fifth partition wall 65. As shown in FIGS. 11 and 15, an opening portion 621 and an opening portion 622 are formed in the second partition wall 62. The device supply portion 14a of the first shuttle unit 24A can pass through the opening portion 621 (see FIGS. 13 and 14). Thereby, the opening portion 621 functions as an entrance for the device supply section 14a to enter the inspection area A3 from the supply area A2, and functions as an exit for the device supply section 14a to exit from the inspection area A3 to the supply area A2. The device supply portion 14 a of the second shuttle unit 24B can pass through the opening portion 622. Thereby, the opening portion 622 also functions as an entrance for the device supply section 14a to enter the inspection area A3 from the supply area A2, and functions as an exit for the device supply section 14a to exit from the inspection area A3 to the supply area A2. As shown in FIG. 11, an opening portion 631 and an opening portion 632 are also formed in the third partition wall 63. The device recovery portion 18a of the first shuttle unit 24A can pass through the opening portion 631, and the device recovery portion 18a of the second shuttle unit 24B can pass through the opening portion 632. The inspection device 1a is covered with a cover at the outermost surface, and the cover includes a front cover 70, a side cover 71, a side cover 72, a rear cover 73, and a top cover 74. As described above, a barcode 901 is attached to each IC device 90. The first information acquisition unit 10A obtains the barcode 901 of the IC device 90 placed on the device supply unit 14a of the first shuttle unit 24A. On the other hand, the bar code 901 of the IC device 90 placed on the device supply unit 14a of the second shuttle unit 24B is obtained by the second information acquisition unit 10B. The acquired barcode 901 is stored in the memory of the control unit 800. As shown in FIGS. 12 and 15, each of the first information acquisition unit 10A and the second information acquisition unit 10B has a first barcode reader (information acquisition unit) 3A and an information acquisition unit that can acquire information attached to the IC device 90. 2 bar code reader 3B (information acquisition section). In the first information obtaining unit 10A, the first barcode reader 3A and the second barcode reader 3B are arranged in the opening 621, and in the second information obtaining unit 10B, the first barcode reader 3A and the second barcode reader The barcode reader 3B is disposed in the opening 622. Since the first information acquisition unit 10A and the second information acquisition unit 10B have the same configuration except that they are arranged differently, the first information acquisition unit 10A will be representatively described below. The first barcode reader 3A and the second barcode reader 3B both have a flat box shape, and in a manner that their thickness direction is consistent with the horizontal direction (X direction), in a so-called "vertical" state (vertical From the state) configuration. The first barcode reader 3A and the second barcode reader 3B include, for example, a laser diode and a photodiode. The outgoing light L1 from the laser diode is scanned downward, and is transmitted downward through the light transmitting portion 31. Subsequently, the outgoing light L1 is reflected upward by the barcode 901. The reflected light L2 passes through the light transmitting portion 31 and is received at the photodiode. By sequentially performing A / D conversion and decoding on the signal based on the received reflected light L2, the barcode 901 can be read. As shown in FIG. 12, when the first barcode reader 3A passes directly below the device supply section 14a on which the IC device 90 is mounted, it can read the first line M1 of the IC device 90 on the device supply section 14a. Bar code 901 of the IC device 90. The second bar code reader 3B can read the bar code 901 of the second line M2 of the IC device 90 of the IC device 90 on the device supply portion 14a when the device supply portion 14a on which the IC device 90 is placed passes directly below . In addition, in the second information obtaining unit 10B, the first barcode reader 3A reads the barcode 901 of the IC device 90 in the second line M2, and the second barcode reader 3B reads the IC device 90 in the first line M1. Bar code 901. As described above, the first barcode reader 3A and the second barcode reader 3B are disposed in the opening portion 621 of the second partition wall 62. Thereby, the barcode 901 of the IC device 90 can be read as soon as possible before the IC device 90 is inspected in the inspection area A3. With this, it is possible to prevent as far as possible the reading of the information obtained and the inspection result being the same as an IC device 90, that is, the obtained information of the IC device 90, and the association with the inspection result of the inspected IC device 90 (establishment Association) crash. Here, a case where the first barcode reader 3A and the second barcode reader 3B are arranged on the first partition wall 61 is considered. In this case, even if the barcode 901 has already been read, if the IC device 90 that reads the barcode 901 accidentally drops during the transportation in the supply area A2, the device transfer head 13 holds (re-executes) the dropped IC. Device 90, but the IC device 90 may be held at a position different from the original position (position before dropping). And, in this way, an IC device 90 different from the IC device 90 that should be inspected is inspected in the inspection area A3, and the inspection result is identified as the IC device 90 that reads the barcode 901. Therefore, in the inspection device 1a, by reading the barcode 901 immediately before the inspection in the inspection area A3, it is possible to prevent the information of the IC device 90 from being incorrectly associated with the inspection result of the IC device 90. In addition, the first barcode reader 3A and the second barcode reader 3B are different from each other in the obtainable information area (detectable distance) that can obtain the information of the IC device 90, that is, the sensor range (sensing range). For example, in this embodiment, as the first barcode reader 3A, it is preferable to use a sensor with a range of 50 mm or more and less than 600 mm. As the second barcode reader 3B, the range of a sensor is preferably used. Above 110 mm and below 1000 mm. Thereby, as shown in FIG. 15, the vertical setting height of the first barcode reader 3A and the second barcode reader 3B can be made different, and the first barcode with a smaller sensor range can be read The picker 3A is arranged in a low position, and the second barcode reader 3B with a larger sensor range is arranged in a high position. Further, from this state, as shown in FIG. 12, the first barcode reader 3A and the second barcode reader 3B can be overlapped with each other in a plan view (when viewed from above in the vertical direction) so as to have an overlapping portion 32 overlapping each other. Way configuration. Thereby, the distance in the Y direction of the first information acquisition unit 10A can be reduced by the amount of the overlapping portion 32, and therefore, the size can be reduced. However, for example, the first barcode reader 3A or the second barcode reader 3B is deteriorated or malfunctioned with time, and it is difficult or impossible to obtain the barcode 901 accurately due to, for example, blurring of the light transmitting portion 31. In addition, if such a state is not recognized and continued to be used, there is a possibility that the incorrect information of the read IC device 90 may become a state related to the inspection result of the IC device 90. Therefore, the inspection device 1a is configured to eliminate such a state. This configuration will be described below. In the inspection device 1a, the control unit 800 is configured to function as a judgment unit that judges whether the operation of the first barcode reader 3A and the second barcode reader 3B is normal. The control unit 800 includes a CPU and a memory. In the memory, a control program for judging is stored. In addition, the CPU can call the control program and execute the control program. Here, "the operation of the first barcode reader 3A and the second barcode reader 3B is normal" means that the first barcode reader 3A and the second barcode reader 3B correctly read the barcode (barcode 901). In addition, as a judgment criterion for the above-mentioned judgment, a reference barcode (reference mark) 911 attached to the front surface of the virtual device 91 is used. The dummy device 91 is an analog IC device 90, and is mounted on the device supply unit 14a together with the IC device 90 and used (see FIGS. 12 to 14). The reference bar code 911 is stored in the control unit 800 in advance. The method of assigning the reference bar code 911 to the IC device 91 is not particularly limited, and examples thereof include a method using inkjet, a method using laser marking, and a method of attaching the bar code 901 cut off from the IC device 90. Hereinafter, the control program for the above determination will be described based on the flowchart of FIG. 16. In addition, since the judgment on the first barcode reader 3A is the same as the judgment on the second barcode reader 3B, here, the judgment on the first barcode reader 3A will be representatively described. First, when the control program is started, eight IC devices 90 are placed on the device supply section 14a in the supply area A2, and two dummy devices 91 are also placed (see FIGS. 12 and 13). Then, the control program is started based on this state. The control program moves the device supply unit 14a toward the inspection area A3 once (step S201). “Move once” means that the virtual device 91 that moves the device supply unit 14a to the device supply unit 14a is located directly below the first barcode reader 3A (see FIG. 14). The first barcode reader 3A is operated to read the reference barcode 911 of the virtual device 91 a specific number of times (step S202). In addition, the read reference barcode 911 is compared with the reference barcode 911 stored in the control unit 800 in advance, and it is determined whether the number of times (the number of coincidences) N that the reference barcode 911 of the two matches exceeds a preset number (threshold value) N 0 (Step S203). As a result of the determination in step S203, the number of times N exceeds the number of times N 0 In this case (step S203: YES), it is deemed that "the operation of the first barcode reader 3A is normal", the device supply unit 14a is moved twice toward the inspection area A3 (step S204), and the first barcode reader is moved 3A is operated to read the barcode 901 of the IC device 90 (step S205). "Move twice (1st action)" means that the device supply unit 14a is moved by sequentially reading the barcode 901 of the IC device 90 on the device supply unit 14a by the first barcode reader 3A. In addition, the movement may be a movement (repeated movement) in which the movement and stop are repeated whenever the IC device 90 is located directly below the first barcode reader 3A, or a continuous movement (continuous movement) in which the stopping is omitted. And, it is judged whether all the IC devices 90 of the first line M1 have completed reading the barcode 901 of the IC device 90 by the first barcode reader 3A (step S206). If all IC devices 90 have been completed (step S206: YES), the flow ends. If not completed for all IC devices 90 (step S206: NO), return to step S204 and repeat the steps until completion. As a result of the judgment in step S203, the number of times N has not exceeded the number of times N 0 In this case, it is considered that "the operation of the first barcode reader 3A is abnormal", and it is reported that the light transmitting portion 31 of the first barcode reader 3A needs to be cleaned (second operation) (step S207). The notification method is not particularly limited, but examples thereof include a method using screen display via the monitor 300 and a method using sound via the speaker 500. In addition, when the operator wants to perform cleaning according to the above-mentioned report, for example, the operator can operate the "start cleaning button" displayed on the monitor 300. The control program waits before confirming the turn-on operation of the "Start Cleaning Button" (step S208: No), and waits at S208. When confirming the turn-on operation of the "Start Cleaning Button" (step S208: Yes), the device supply unit moves once 14a returns to the original position in the supply area A2 (step S209). Thereby, a space to the extent that the operator's hand can be inserted is secured below the first barcode reader 3A, and therefore, the operator can clean the light transmitting portion 31. After the cleaning is completed, the operator can operate, for example, the “End Cleaning Button” displayed on the monitor 300. The control program waits before confirming the ON operation of the "End Cleaning Button" (Step S210: No), and waits for the ON operation of the "End Cleaning Button" (Step S210: Yes), and returns to Step S201. Perform the next steps in order. Thereby, in the inspection device 1a, it can be judged whether the operation of the first barcode reader 3A is normal after cleaning. The number of judgments N in step S203 0 The ratio between the number of times N and the total number of times the first barcode reader 3A reads the reference barcode 911 (the specific number of times in step S202) is, for example, a value of 70% or more and 100% or less. In addition, the inspection device 1a may be configured to change the number of times N in steps. 0 . For example, the first stage may be set when the ratio is 70% or more and less than 100%, and the second stage is set when the ratio is 30% or more and 70% or less. The ratio is set to 0% or more and 30% or less. This situation is considered as the third stage. In the first stage, the first action as "the normal operation of the first barcode reader 3A" can be taken, and in the second stage, the first action can be adopted as "the first barcode reader 3A must be cleaned" 2 actions, and in the 3rd stage, take the 3rd action as "the first bar code reader 3A cannot perform normal operation due to deterioration or failure over time, and must be replaced." When the first barcode reader 3A is unable to perform normal operation due to deterioration or failure over time, the inspection device 1a is in a state of repeating steps S201 to S203 and then repeating steps S207 to S210. In this case, it can also replace the third stage. If the number of repetitions of the above steps exceeds a certain number of times in a row, it will be deemed that "the first barcode reader 3A cannot perform normal operations due to time degradation or failure. And informed of the intention and the intention to replace the first barcode reader 3A. In addition, in the notification in step S207, it is also preferable to continue the transportation of the IC device 90. After step S207, the device may be stopped without executing step S208 (third operation). In the above-mentioned inspection device 1a, the control program can be used to select whether to continue to use the first barcode reader 3A (second barcode reader 3B) or to perform cleaning or replacement, thereby determining whether the operation is normal. In addition, since the normal first barcode reader 3A can be continuously used without cleaning or replacement, the first barcode reader 3A can obtain the barcode 901 attached to the IC device 90 stably and accurately for a long period of time. Thereby, the information of the IC device 90 obtained from the barcode 901 and the inspection result of the IC device 90 can be correctly associated. <Fourth Embodiment> Hereinafter, a fourth embodiment of the electronic component transfer device and the electronic component inspection device according to the present invention will be described with reference to FIG. 17, but the differences from the above embodiment will be mainly described, and the same Matters are omitted from the description. The inspection device 1a 'of this embodiment is the same as the inspection device 1a of the third embodiment except that the arrangement of the barcode reader is different. As shown in FIG. 17, in the inspection device 1 a ′ of this embodiment, the first barcode reader 3A ′ and the second barcode reader 3B ′ are both flat and box-shaped, and the thickness direction and The vertical direction (Z direction) is aligned in a so-called "horizontal" state (horizontal state). When viewed from the X direction, the first barcode reader 3A ′ and the second barcode reader 3B ′ are arranged to have overlapping portions 32 ′ which overlap each other. Thereby, the distances in the Y direction of the first information acquisition unit 10A and the second information acquisition unit 10B can be reduced by the amount of the overlapping portion 32 ', and therefore, the inspection apparatus can be miniaturized. <Fifth Embodiment> Hereinafter, a fifth embodiment of the electronic component transfer device and the electronic component inspection device according to the present invention will be described with reference to FIGS. 18 to 22. In this embodiment, the same components as those in the above embodiment are denoted by the same reference numerals. In addition, in FIG. 19, in order to avoid complication of the figure, the illustration of the ion generator and the sensor is omitted. In addition, in FIG. 20, in order to easily separate the ion generator and the sensor, these are shown as solid lines, and other structures are shown as double-dot chain lines. As shown in FIGS. 18 and 19, the inspection device 1b is divided into a tray supply area A1, a device supply area (hereinafter referred to as "supply area") A2, an inspection area A30, and a device recovery area (hereinafter referred to as "recycling area") A4. , And the tray removal area A5. In addition, the IC device 90 sequentially passes from each of the above-mentioned areas to the tray removal area A5 from the tray supply area A1, and performs inspection in the inspection area A30 in the middle. As described above, the inspection device 1b includes an electronic component transfer device (processor) that transports the IC device 90 in each area, and an inspection unit 16b that performs inspection in the inspection area A30. The electronic component transporting device includes a control unit 800b, a monitor (display unit) 300 as a notification unit, a signal light 400, a speaker 500, and an operation panel 700 (see FIGS. 18 and 21). The tray supply area A1 is a material supply section for supplying a tray (mounting member) 200 in which a plurality of IC devices 90 are arranged in an unchecked state. In the tray supply area A1, a plurality of trays 200 can be stacked. The supply area A2 is an area where a plurality of IC devices 90 arranged on the tray 200 from the tray supply area A1 are supplied to the inspection area A30, respectively. In addition, tray transfer mechanisms 11A and 11B are provided so as to straddle the tray supply area A1 and the supply area A2 in the tray 200 horizontally. The tray conveyance mechanism 11A is a moving part that can move the tray 200 to the positive side in the Y direction together with the IC device 90 placed on the tray 200. Thereby, the IC device 90 can be stably fed into the supply area A2. The tray conveyance mechanism 11B is a moving unit that can move the empty tray 200 to the negative side in the Y direction, that is, from the supply area A2 to the tray supply area A1. In the supply area A2, a temperature adjustment section (a soaking plate (English expression: soap plate, Chinese expression (one example): soaking plate)) 12, a device transfer head 13b, and a tray transfer mechanism 15 are provided. The temperature adjustment section 12 is a device that can heat or cool a plurality of IC devices 90 together, and is sometimes referred to as a "heat equalizing plate". With this soaking plate, the IC device 90 before the inspection by the inspection unit 16b can be cooled or heated in advance, and adjusted to a temperature suitable for the inspection. In the configuration shown in FIG. 19, two temperature adjustment units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 that is carried in (carried in) from the tray supply area A1 by the tray transfer mechanism 11A is transferred to any one of the temperature adjustment units 12. The device transfer head 13b is supported so as to be movable in the X direction and the Y direction and further in the Z direction within the supply area A2. With this, the device transfer head 13b can transfer the IC device 90 between the tray 200 and the temperature adjustment section 12 carried in from the tray supply area A1, and the IC device 90 between the temperature adjustment section 12 and a device supply section 14b described later. Of transportation. The device transfer head 13b includes a plurality of hand units 130 as holding portions for holding the IC device 90 (in FIG. 19, only one symbol "130" is described as a representative). The hand unit 130 includes a suction nozzle, and the suction nozzle is held by the suction IC device 90. The tray transfer mechanism 15 is a mechanism that transfers the empty tray 200 in a state where all IC devices 90 are removed, to the positive side in the X direction in the supply area A2. After the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray transfer mechanism 11B. The inspection area A30 is an area where the IC device 90 is inspected. In this inspection area A30, an inspection section 16b and a device transfer head 17b are provided. Further, a device supply unit 14b that moves across the supply area A2 and the inspection area A30, and a device recovery unit 18b that moves across the inspection area A30 and the recovery area A4 are also provided. The device supply section 14b is a mounting section on which the IC device 90 temperature-adjusted by the temperature adjustment section 12 is placed, and the IC device 90 can be transported (moved) to the inspection section 16b near the inspection section 16b. board". The device supply section 14b has a plurality of recesses (grooves) 140 arranged in the X direction and the Y direction, that is, arranged in a matrix (only one symbol "140" is shown as a representative in FIG. 19). In each of the recesses 140, the IC devices 90 before inspection by the inspection section 16 b are stored one by one. The device supply unit 14b is supported so as to be movable in the X direction in the horizontal direction between the supply area A2 and the inspection area A30. In the configuration shown in FIG. 19, two device supply sections 14 b are arranged in the Y direction, and the IC devices 90 on the temperature adjustment section 12 are transported to any one of the device supply sections 14 b. The device supply unit 14b is configured to maintain the temperature-adjusted IC device 90 as described above. Thereby, the IC device 90 can be cooled or heated, and therefore, the temperature adjustment state of the IC device 90 can be maintained. The inspection unit 16 b is a unit that mounts (holds) the IC device 90 and inspects and tests (performs electrical inspection) the electrical characteristics of the IC device 90, that is, a component that mounts the IC device 90 when inspecting the IC device 90. On the upper surface of the inspection portion 16b, a plurality of holding portions 160 which are recessed portions for housing (mounting) (holding) the IC device 90 are provided (in FIG. 19, only one symbol "160" is recorded as a representative). The IC device 90 is housed in the holding section 160 and is thereby placed on the inspection section 16b. In addition, at the positions corresponding to the respective holding portions 160 of the inspection portion 16b, probe pins which are electrically connected to the terminals of the IC device 90 while holding the IC device 90 in the holding portion 160 are provided. In addition, the terminals of the IC device 90 are electrically connected (contacted) with the probe pins, and the inspection of the IC device 90 is performed through the probe pins. The inspection of the IC device 90 is performed by an inspection control section provided in a tester (not shown) connected to the inspection section 16b, based on a program stored in a memory section of the inspection control section. In addition, in the inspection section 16b, the IC device 90 may be heated or cooled as in the temperature adjustment section 12, and the IC device 90 may be adjusted to a temperature suitable for inspection. The device transfer head 17b is supported to be movable in the Y direction and the Z direction within the inspection area A30. In addition, the device transfer head 17b can transfer and place the IC device 90 on the device supply section 14b carried in from the supply area A2 to the inspection section 16b, and can transfer the IC device 90 on the inspection section 16b to the device recovery section. 18b and placed. When the IC device 90 is inspected, the device transfer head 17b presses the IC device 90 toward the inspection section 16b, thereby bringing the IC device 90 into contact with the inspection section 16b. Thereby, as described above, the terminals of the IC device 90 are electrically connected to the probe pins of the inspection section 16b. In addition, the device transfer head 17b may cool or heat the plurality of IC devices 90, and adjust the IC devices 90 to a temperature suitable for inspection. The device transfer head 17b includes a plurality of hand units 175 as holding parts for holding the IC device 90 (in FIG. 19, only one symbol "175" is recorded as a representative). The hand unit 175 includes a suction nozzle, and the suction nozzle is used to hold the IC device 90. The device recovery section 18b is an IC device 90 that is placed after the inspection by the inspection section 16b, and the IC device 90 can be transported (moved) to the recovery section A4. This is sometimes called a "recycling shuttle" . The device recovery unit 18b has a plurality of recesses (grooves) 181 arranged in the X direction and the Y direction, that is, arranged in a matrix shape (in FIG. 19, only one symbol "181" is described as a representative). The device recovery unit 18b is supported so as to be movable in the horizontal direction between the inspection area A30 and the recovery area A4 in the X direction. In the configuration shown in FIG. 19, the device recovery unit 18b is the same as the device supply unit 14b, and two IC devices 90 on the inspection unit 16b are transported to any of the device recovery units 18b. Place. This transfer is performed by the device transfer head 17b. Furthermore, in the inspection device 1b, one device supply unit 14b and one device recovery unit 18b are connected in the X direction via a connection portion (not shown), and constitute a shuttle unit that moves together in the same direction. The device supply unit 14b and the device recovery unit 18b may be configured to be independently movable. The recovery area A4 is an area of the plurality of IC devices 90 after the recovery inspection is completed. In this collection area A4, a collection tray 19, a device transfer head 20b, and a tray transfer mechanism 21 are provided. An empty tray 200 is also prepared in the collection area A4. The recovery tray 19 is a mounting portion on which the IC device 90 after the inspection by the inspection portion 16b is placed, and is fixed so as not to move in the recovery area A4. Thereby, even in the recovery area A4 where various movable parts such as the device transfer head 20 b are arranged, the inspected IC device 90 is stably placed on the recovery tray 19. In the configuration shown in FIG. 19, three collection trays 19 are arranged in the X direction. Three empty trays 200 are also arranged in the X direction. The empty tray 200 also serves as a placement section for the IC device 90 placed on the inspection section 16b. Then, the IC device 90 on the device recovery section 18 b moved to the recovery area A4 is transported to and placed on any one of the recovery tray 19 and the empty tray 200. Thereby, the IC devices 90 are sorted and recovered according to each inspection result. The device transfer head 20b is supported so as to be movable in the X direction and the Y direction, and further in the Z direction within the recovery area A4. Thereby, the device transfer head 20b can transfer the IC device 90 from the device collection part 18b to the collection tray 19 or the empty tray 200. The device transfer head 20b has a plurality of hand units 201 as holding parts for holding the IC device 90 (in FIG. 19, only one symbol "201" is described as a representative). The hand unit 201 includes a suction nozzle, and the suction nozzle holds the IC device 90 with the suction nozzle. The tray transfer mechanism 21 is a mechanism that transfers the empty tray 200 carried in from the tray removal area A5 in the X direction in the recovery area A4. After the transfer, the empty tray 200 is placed at the position where the IC device 90 is collected, and may be any one of the three empty trays 200 described above. The tray removal area A5 is a material removal portion that collects and removes the trays 200 in which the plurality of IC devices 90 in a checked state are arranged. In the tray removing area A5, a plurality of trays 200 can be stacked. In addition, tray transfer mechanisms 22A and 22B for transferring the tray 200 in the Y direction one by one are provided across the collection area A4 and the tray removal area A5. The tray conveyance mechanism 22A is a moving portion that can move the tray 200 in the Y direction. Thereby, the inspected IC device 90 can be transferred from the recovery area A4 to the tray removal area A5. The tray transfer mechanism 22B is a moving unit that can move the empty tray 200 for recycling the IC devices 90 from the tray removal area A5 to the collection area A4. The control unit 800b controls, for example, the tray transfer mechanism 11A, 11B, the temperature adjustment unit 12, the device transfer head 13b, the device supply unit 14b, the tray transfer mechanism 15, the inspection unit 16b, the device transfer head 17b, the device recovery unit 18b, and the device transfer head 20b. , The tray conveying mechanism 21, the tray conveying mechanisms 22A, 22B, the monitor 300, the signal light 400, the speaker 500, and the ion generators 31b to 39b and 40b to 46b described later. The user (operator) can set and confirm the operating conditions of the inspection device 1b and the like via the monitor 300. The monitor 300 includes, for example, a display screen (display section) 301 composed of a liquid crystal screen, and is arranged on the upper portion of the front side of the inspection device 1b. As shown in FIG. 18, on the front side in the X direction in the drawing of the tray removal area A5, a mouse stage 600 is provided for placing a mouse used when operating the screen displayed on the monitor 300. An operation panel 700 is disposed below the X-direction front side of the monitor 300 in FIG. 18. The operation panel 700 and the monitor 300 separately instruct an operator required for the inspection device 1b. In addition, the signal lamp 400 can report the operation state of the inspection device 1b and the like by using a combination of light emitting colors. The signal lamp 400 is arranged above the inspection device 1b. In addition, a speaker 500 may be built in the inspection device 1b, and the operating state of the inspection device 1b and the like may be notified through the speaker 500. As shown in FIG. 19, the inspection device 1 b divides (separates) the tray supply area A1 and the supply area A2 by the first partition wall 61, and divides the supply area A2 and the inspection area A30 by the second partition wall 62. The inspection area A30 and the recovery area A4 are divided by the third partition wall 63, and the recovery area A4 and the tray removal area A5 are divided by the fourth partition wall 64. The supply area A2 and the recovery area A4 are also divided by a fifth partition wall 65. An opening portion 621 and an opening portion 622 are formed in the second partition wall 62. A device supply portion 14 b can pass through the opening 621. Thereby, the opening portion 621 functions as an entrance of the device supply portion 14b from the supply area A2 into the inspection area A30, and functions as an exit of the device supply portion 14b from the inspection area A30 to the supply area A2. The other device supply portion 14 b can pass through the opening portion 622. Thereby, the opening portion 622 also functions as an entrance of the device supply portion 14b from the supply area A2 into the inspection area A30, and functions as an exit of the device supply portion 14b from the inspection area A30 to the supply area A2. Further, an opening portion 631 and an opening portion 632 are also formed in the third partition wall 63. One device recovery portion 18 b can pass through the opening portion 631, and the other device recovery portion 18 b can pass through the opening portion 632. The inspection device 1b is covered with a cover on the outermost surface, and the cover includes a front cover 70, a side cover 71, a side cover 72, a rear cover 73, and a top cover 74. As shown in FIG. 20, the inspection device 1b is provided with a plurality of ion generators (16 in the configuration shown in the figure) that generate ions and neutralize and remove (remove static electricity) the static electricity with the ions. Ion generation units) 31b to 39b, 40b to 46b, and a plurality of sensors (detection units) 51 to 54 that detect at least one of ion balance and static elimination time (in the configuration shown in the figure). Each of the ion generators 31b to 46b is a device that ionizes dry air and generates the ionized dry air (hereinafter referred to as "ionized air"). Each of the ion generators 31b to 46b is not particularly limited, and for example, a person using a corona discharge, a person using ionizing radiation, or the like can be used. The surface of the IC device 90 may be charged with static electricity during transportation of the IC device 90, for example. Therefore, this static electricity must be removed. In the inspection device 1b, the ion generators 31b to 46b are operated to generate ionized air, and the ionized air can be used to remove static electricity from the IC device 90 and the like. In addition, the closer the detected values of the ion balances of the ion generators 31b to 46b to the sensors 51 to 54 are, the better it is to 0 V. The static elimination time of each of the ion generators 31b to 46b is preferably as short as possible. The static elimination time is the time required to remove static electricity from a specific first voltage to a specific second voltage (a voltage whose absolute value is smaller than the first voltage). In addition, the static elimination time corresponds to the amount of ions (equivalent to the amount of ions), and the shorter the static elimination time, the larger the amount of ions. The sensors 51 to 54 only need to detect at least one of ion balance and static elimination time, but in this embodiment, as an example, a sensor that detects ion balance will be described. In the supply area A2, a plurality of (six in the illustrated configuration) ion generators 31b to 36b are provided. A single sensor 51 is provided in the supply area A2. In this supply area A2, one of any two ion generators among the ion generators 31b to 36b is a first ion generating unit, and the other is a second ion generating unit. Although the arrangement of the ion generators 31b to 36b and the sensor 51 is not particularly limited, each of the ion generators 31b to 36b is preferably disposed so as to remove static electricity throughout the entire supply area A2. In this embodiment, the ion generators 31b to 36b are arranged on the top plate of the inspection device 1b, respectively. The sensor 51 is disposed on the base of the inspection device 1b. That is, the sensor 51 is arranged further downward in the vertical direction than the ion generators 31b to 36b. The ionized air generated by the ion generators 31b to 36b is usually larger than the heavier gas. Therefore, by arranging the sensor 51 in a vertical direction lower than the ion generators 31b to 36b, the ion balance can be reliably detected by the sensor 51. Further, a plurality of (six in the illustrated configuration) ion generators 37b to 39b and 40b to 42b are provided in the recovery area A4. A single sensor 52 is provided in the recovery area A4. In the recovery area A4, one of any two ion generators among the ion generators 37b to 42b is a first ion generating unit, and the other is a second ion generating unit. Although the arrangement of the ion generators 37b to 42b and the sensor 52 is not particularly limited, each of the ion generators 37b to 42b is preferably disposed so as to remove static electricity throughout the entire recovery area A4. Moreover, in this embodiment, the ion generators 37b-42b are arrange | positioned on the top plate of the inspection apparatus 1b, respectively. The sensor 52 is disposed on the base of the inspection device 1b. That is, the sensor 52 is arranged in a vertical direction lower than the ion generators 37b to 42b. Therefore, the ion balance can be reliably detected by the sensor 52. The inspection area A30 is divided into two first areas A31 on the negative side in the X direction in FIG. 20 and second areas A32 on the positive side in the X direction in FIG. 20. In addition, in FIG. 19 and FIG. 20, the conceptual boundary line of the 1st area A31 and the 2nd area A32 is shown by a two-dot chain line. In the first area A31, a plurality of (two in the illustrated configuration) ion generators 43b and 44b are provided. A single sensor 53 is provided in the first area A31. In this first area A31, one of the ion generators 43b and 44b is a first ion generating unit, and the other is a second ion generating unit. Although the arrangement of the ion generators 43b and 44b and the sensor 53 is not particularly limited, each of the ion generators 43b and 44b is preferably arranged so as to remove static electricity throughout the entire first area A31. Moreover, in this embodiment, the ion generators 43b and 44b are each arrange | positioned on the wall 82b of the inspection apparatus 1b (refer FIG. 22). The sensor 53 is disposed on the base 81b of the inspection device 1b (see FIG. 22). That is, the sensor 53 is arranged further downward in the vertical direction than the ion generators 43b and 44b. Therefore, the ion balance can be reliably detected by the sensor 53. In the second area A32, a plurality of (two in the illustrated configuration) ion generators 45b and 46b are provided. A single sensor 54 is provided in the second area A32. In the second region A32, one of the ion generators 45b and 46b is a first ion generating section, and the other is a second ion generating section. Although the arrangement of the ionizers 45b and 44b and the sensor 54 is not particularly limited, each of the ion generators 45b and 46b is preferably arranged so as to remove static electricity throughout the entire second area A32. Moreover, in this embodiment, the ion generators 45b and 46b are each arrange | positioned on the wall 83b of the inspection apparatus 1b (refer FIG. 22). The sensor 54 is disposed on the base 81b of the inspection device 1b (see FIG. 22). That is, the sensor 54 is arranged further downward in the vertical direction than the ion generators 45b and 46b. Therefore, the ion balance can be reliably detected by the sensor 54. As described above, a plurality of ion generators and a single sensor are provided in each of the supply area A2, the recovery area A4, the first area A31, and the second area A32. Since a plurality of ion generators are separately provided in each area, the static elimination ability can be improved, and static electricity can be removed in each area without omission. In addition, of course, the number of ion generators and the number of sensors are not limited to the aforementioned numbers. In addition, the inspection device 1b has a function (operation mode) of checking whether the ion generators 31b to 46b are normal. Hereinafter, abnormality is referred to as "abnormality". Specific examples of the abnormality of the ion generator include generation of defects such as failure and deterioration, insufficient cleaning, and the like. Hereinafter, the inspection of the ion generators 31b to 46b will be described, but in the following, the inspection of the ion generators 31b to 36b in the supply area A2 will be representatively described. In the supply area A2, the ion generators 31b to 36b are operated one by one under the control of the control unit 800b, and the ion balance is detected one by one by the sensor 51 to perform an inspection. That is, when one specific ion generator is operated, the operation of the other five ion generators is stopped. Specifically, when the state of the ion generator 31b is checked, the ion generator 31b is operated and the operation of the other ion generators 32b to 36b is stopped, and the ion balance is detected by the sensor 51 to perform an inspection. The same applies to the ion generators 32b to 36b. The inspection order of the ion generators 31b to 36b is not particularly limited, and can be appropriately set according to various conditions. Accordingly, when at least one of the ionizers 31b to 36b has an abnormality, the above-mentioned abnormality can be detected, and the ion generator that generates the abnormality can be identified. In addition, the above detection can be performed by a single sensor 51, thereby reducing the number of sensors. In the inspection of the ion generator 31b, the control unit 800b determines whether the ion generator 31b is normal based on the detection result of the sensor 51. That is, the control unit 800b determines that the ion generator 31b is abnormal (not normal) when the detection result of the sensor 51 does not reach the reference value, and determines that the ion generator 31b is normal when the detection value reaches the reference value. In addition, since the sensor 51 detects the ion balance, it is determined that the ion generator 31b is abnormal when the voltage value (detection result) of the detected ion balance is greater than a reference value. Although the reference value is not particularly limited and is appropriately set according to various conditions, it is preferably set to a value in a range of 5 V to 200 V, and more preferably set to a value in a range of 10 V to 100 V. A more preferable setting is a value within a range of 20 V to 50 V. If the above-mentioned reference value is larger than the above-mentioned upper limit value, it may be judged as normal even if the ion generator 31b is abnormal according to other conditions. If the reference value is smaller than the upper limit value, it may be determined to be abnormal even if the ion generator 31b is normal according to other conditions. In addition, since the static elimination time is detected by the sensor 51, when the measured static elimination time (detection result) is longer than the reference value, it is determined that the ion generator 31b is abnormal. The result of this inspection is displayed on the monitor 300. That is, the monitor 300 displays information indicating that the ion generator 31b is abnormal when the ion generator 31b is abnormal, and displays information indicating that the ion generator 31b is normal when the ion generator 31b is normal. The description of the inspection of the ion generators 32b to 36b is omitted, but it is the same as that of the inspection of the ion generator 31b. In the recovery area A4, as in the case of the above-mentioned supply area A2, the ion generators 37b to 42b are operated one by one under the control of the control unit 800b, and the ion balance is detected one by one by the sensor 52 to perform an inspection. In the first area A31, as in the case of the above-mentioned supply area A2, the ion generator 43b and the ion generator 44b are operated one by one under the control of the control unit 800b, and the ion balance is detected one by one by the sensor 53. Check. In the second area A32, as in the case of the above-mentioned supply area A2, the ion generator 45b and the ion generator 46b are operated one by one under the control of the control unit 800b, and the ion balance is detected one by one by the sensor 54. Check. In addition, in the supply area A2, the recovery area A4, the first area A31, and the second area A32, the ion balance is detected and detected by a corresponding sensor in each of the areas independently. Therefore, the inspection of the supply area A2, the inspection of the recovery area A4, the inspection of the first area A31, and the inspection of the second area A32 can be performed at different times, and any 2 areas, any 3 areas, or 4 areas can be performed simultaneously. Its check. In the case of simultaneous execution, the time required for the overall inspection can be shortened. In addition, in the inspection device 1b, when at least one of the ion generators 31b to 46b has an abnormality as a result of the above inspection, the monitor 300 displays the above-mentioned abnormality and the specific ion generator that caused the abnormality. Information. In addition, the signal lamp 400 is turned on or off, or the emission color is changed, and a warning (alarm) is issued from the speaker 500. When all of the ion generators 31 b to 46 b are normal, the intention is displayed on the monitor 300. When the user views the display on the monitor 300, when at least one of the ion generators 31b to 46b has an abnormality, the user can easily grasp the ion generator that generates the abnormality and the abnormality. When all the ion generators 31b to 46b are normal, the purpose can be easily grasped. The history of the inspection results is stored in the storage unit 801. The history can be used for maintenance, inspection, and repair, for example. In addition, although the timing of the inspection of the ion generators 31b to 46b is not particularly limited, examples thereof include when the power of the inspection device 1b is turned on (when rising), before the power of the inspection device 1b is turned off, and the IC device 90 being inspected Between batches and the next batch, when a specific period has elapsed, etc. The inspection may be started by a user's operation. As described above, according to the inspection device 1b, when at least one of the ion generators 31b to 46b is abnormal, the abnormality can be reliably detected and generated based on the detection result of the detection unit, and the abnormality can be identified. Ion generator. This allows the user to respond quickly and reliably. Although the electronic component transfer device and the electronic component inspection device of the present invention have been described above with reference to the illustrated embodiments, the present invention is not limited to this, and the parts constituting the electronic component transfer device and the electronic component inspection device may be replaced with Any constituent who performs the same function. Moreover, arbitrary structures may be added. In addition, the electronic component transfer device and the electronic component inspection device of the present invention may be a combination (a feature) of any two or more of the embodiments described above. In the first embodiment described above, although the inspection device 1 is provided with an electronic component transfer device including an action portion, a notification portion 40, an operation portion 50, and a control portion 80, the present invention is not limited to this, and may be provided The inspection device includes an action section, a notification section 40, an operation section 50, and a control section 80. In the above-mentioned third and fourth embodiments, although a bar code reader is used as an information acquisition unit that can acquire information attached to an electronic component, it is not limited to this. For example, a CCD (Charge Coupled Device) may be used. ) Camera and other imaging devices. In the case of an imaging device, it is preferable that the imaging device is scanned while scanning (line scanning). In addition, the reference mark used to determine whether the operation of the first barcode reader and the second barcode reader is normal is a bar code in the above embodiment, but it is not limited to this, and may be graphics, characters, Marks, etc. In this case, an imaging device such as a CCD (Charge Coupled Device) camera capable of image processing is used as the information acquisition unit. In addition, although the sensor range of the first barcode reader and the sensor range of the second barcode reader are different in each of the embodiments described above, they are not limited to this and may be the same. The number of barcode readers installed in the first information acquisition unit and the second information acquisition unit is two in each of the above-mentioned embodiments, but it is not limited to this. For example, it may be one as needed. Or more. In addition, the cleaning of the first barcode reader or the second barcode reader is a manual operation performed by an operator in each of the above-mentioned embodiments, but it is not limited to this. For example, it may be used in an inspection device. An automatic cleaning mechanism is provided, and the automatic cleaning mechanism is used. The control program for the determination of the inspection device may be configured to transmit the notification information to other external devices at the same time as the notification in step S207 (third embodiment).