TW201815539A - Diamond tools and scribing method thereof - Google Patents

Abstract

Diamond tools and scribing method thereof are provided. To enable scribing from the outside of a substrate when scribing. An inclined surface is formed from both sides of the base with respect to theangle of the base (11) of the diamond tool (10) so that the intersection point of the ridgelines (17a and 17b) and the top surfaces (18a and 18b) is point (P1, P2). Any one point of the diamond tool (10) is scribed without contact with the substrate. In this case, even if the scribing is started from the outside of the substrate, since the guide surface comes into contact with the end portion of the substrate in advance of the point, the scribing can be started without damaging the point.

Description

   Diamond tool and its scoring method   

The present invention relates to a diamond tool for scoring a brittle material substrate such as a glass substrate or a silicon wafer with a diamond tip, and a scribe method thereof.

In the past, in order to scribe a glass substrate or a silicon wafer, a tool using a scribe wheel or a diamond tip formed of a single crystal diamond has been known. The glass substrate mainly uses a scoring wheel that rolls relative to the substrate, but in terms of improving the strength of the substrate after the scoring, the use of a diamond tip as a fixed knife has also been studied. Patent Documents 1 and 2 propose sharp-edged tools useful for scoring high-hardness substrates such as sapphire wafers and alumina wafers. In these patent documents, a tool provided with a cutting tip on a ridge line of a pyramid, or a tool having a tapered tip is used. Further, in Patent Document 3, a scoring device using a glass scriber having a conical front end is proposed for scoring a glass plate.

[Prior technical literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2003-183040

[Patent Document 2] Japanese Patent Laid-Open No. 2005-079529

[Patent Document 3] Japanese Patent Laid-Open No. 2013-043787

If scoring is performed with a tool known as a fixed knife, the pointed tip will be worn, so the pointed tip must be replaced. Here, the tip must be in contact with the substrate at an appropriate angle in the scoring performed by the tool. However, in the conventional tool, when the tip is replaced, the tool must be rotated in the axial direction, so that it is difficult to adjust the contact angle with good accuracy.

Therefore, it is considered that the vertices of the corner-cylinder-shaped tool are ground so as to overlap from both sides to form an inclined surface, and the two sides of the intersection of the inclined surface are set as sharp-pointed scoring tools. In the conventional scribing method using such a scribing tool for scribing, it is necessary to start scribing from the inner upper surface of the end portion of the brittle material substrate, that is, the scribing must be started by incision. The reason is that if scribing is started from the end of the brittle material substrate, there is a possibility that both the tip and the substrate are damaged when the sharp point collides with the end of the brittle material substrate. However, in the case where the incision is performed by incision, an unscribed portion remains at the end of a substrate such as a glass plate. If the substrate scribed in this manner is cut along the scribe line, there is a problem that the cutting accuracy at the end of the substrate where the scribe line is not formed is deteriorated.

The present invention has been made in view of such a conventional problem, and an object thereof is to provide a diamond tool and a method for scoring that will not cause damage to a brittle material substrate or a pointed end even if scribe is started.

In order to solve this problem, the diamond tool of the present invention is provided with: a square base having a side surface and a plurality of outer peripheral surfaces; first and second inclined surfaces, which are at least one corner of the base, The two side surfaces of the base are formed toward one of the adjacent outer peripheral surfaces; the ridge line is the intersection of the first and second inclined surfaces; and the top surface is provided between the one outer peripheral surface and the ridge line. A part or the entire surface of the outer peripheral surface adjacent to the top surface becomes a guide surface, at least the ridgeline, the top surface, and the guide surface are formed of diamonds, and the intersection of the ridgeline and the top surface is set as a pointed tip .

Here, the circumferential length of the guide surface may be 1 mm or more.

Here, the base may be a polygonal base, and two corners may be provided at one corner of the polygon.

In order to solve this problem, the scoring method of the diamond tool of the present invention uses the following scoring method of the diamond tool, which has a ridge line formed at a corner portion of the base at the center of the thickness of the base, The top surface at one end and the guide surface opposite to the ridge line are arranged adjacent to the top surface, and the point shared by the ridge line and the top surface is set as a pointed tip. The method for scoring the diamond tool is Hold the diamond tool on the scoring head such that one of the tips of the diamond tool becomes the lowest position, and press down the scoring head so that the tip on the outer side of the substrate becomes lower than the upper surface of the substrate By moving the scoring head in parallel with the surface of the substrate, the guide surface is brought into contact with the end portion of the substrate, and after the guide surface slides a certain distance from the substrate end portion, the top surface is in contact with the surface The end of the substrate is in contact with each other, and the scribe is started, and the scribe is finished in a state where the pointed end is in contact with the upper surface of the substrate.

According to the present invention having such a feature, the scribe can be performed from the end portion of the brittle material substrate, that is, the scribe can be started by cutting. Therefore, after the scribe is finished, when the substrate is divided along the scribe line, a good cross-section can be obtained from the starting point of the scribe, and the effect of suppressing the damage of the tip and the substrate when the substrate is hit can be obtained.

10, 50‧‧‧ Diamond Tools

11, 51‧‧‧ base

11a, 11b, 51a, 51b ‧‧‧ side

12a, 12b, 52a ~ 52d‧‧‧outer surface (guide surface)

13a, 13b, 15a ~ 15b, 16a ~ 16b, 53a ~ 53d, 54a ~ 54d, 55a ~ 55h, 56a ~ 56h‧‧‧inclined surface

14, 17a, 17b, 57a ~ 57d, 58a ~ 58d

18a, 18b, 59a ~ 59d, 60a ~ 60d

P1 ~ P8‧‧‧ pointed

1 is a plan view, a side view, and a front view showing a manufacturing process of a diamond tool according to a first embodiment of the present invention.

2 is a plan view, a side view, and a front view of a diamond tool according to the first embodiment.

Fig. 3 is a front view and a side view showing a scoring head on which a diamond tool according to a first embodiment of the present invention is mounted;

Fig. 4 is a front view (part 1) showing a scribe using a diamond tool according to the first embodiment of the present invention.

Fig. 5 is a front view (part 2) showing a scribe using a diamond tool according to the first embodiment of the present invention.

Fig. 6 is a front view (part 3) showing a scribe using a diamond tool according to the first embodiment of the present invention.

Fig. 7 is a front view (part 4) showing a scribe using a diamond tool according to the first embodiment of the present invention.

FIG. 8 is an enlarged view of the tip P1 before the scoring of this embodiment is started.

FIG. 9 is an enlarged view of the periphery of the tip P1 at the beginning of the scoring in this embodiment.

10 is a plan view, a side view, and a front view of a diamond tool according to a modification of the first embodiment of the present invention.

11 is a plan view, a side view, and a front view of a diamond tool according to a modification of the first embodiment of the present invention.

12 is a side view and a front view of a diamond tool according to a second embodiment of the present invention.

13 is a side view and a front view showing a manufacturing process of a diamond tool according to a third embodiment of the present invention.

14 is a side view and a front view of a diamond tool according to a third embodiment of the present invention.

Next, a first embodiment of the present invention will be described. FIG. 1 is a plan view, a side view, and a front view showing a manufacturing process of a diamond tool 10 according to a first embodiment of the present invention, and FIG. 2 is a plan view, a side view, and a front view of a diamond tool after manufacturing is completed. The diamond tool 10 uses a plate of a monocrystalline diamond with a fixed thickness and an isosceles triangle as the base 11. As shown in FIG. 1, the base 11 is ground from both sides of a corner portion of a vertex into a V shape in front view. That is, cutting is performed from one side surface 11a toward the two outer peripheral surfaces 12a, 12b of the base 11 until it reaches 1/2 or more of the thickness of the base 11 to form an inclined surface 13a. At this time, it is preferable to cut so that the corners formed by the inclined surface 13a and the two adjacent outer peripheral surfaces 12a and 12b of the base 11 become equal to each other. Then, cut from the other side surface 11b of the base 11 toward the two adjacent outer peripheral surfaces 12a, 12b of the base 11 in the same manner until it reaches about 1/2 of the thickness of the base 11 and is formed in plan view to become Trapezoidal inclined surface 13b. The intersection of the inclined surfaces 13 a and 13 b becomes a ridge line 14.

Next, as shown in FIG. 2, with respect to the inclined surface 13 a, the inclined surfaces 15 a and 15 b are formed by inclining from the side surface 11 a to the outer peripheral surfaces 12 a and 12 b, respectively. Similarly, with respect to the inclined surface 13b, inclined surfaces 16a and 16b are formed from the side surface 11b toward the outer peripheral surfaces 12a and 12b, respectively. If so, the first and second inclined surfaces 15a and 16a located at the position of the original outer peripheral surface 12a intersect, and in the middle of the thickness direction of the base 11, preferably at the center position as shown in FIG. 2 (a), A ridge line 17a parallel to the side surfaces 11a, 11b of the base. Similarly, the third and fourth inclined surfaces 15b and 16b located at the position of the original outer peripheral surface 12b intersect, and are respectively located at the middle and preferably the central position of the thickness direction of the base 11 to form parallel side surfaces 11a, The ridgeline 11b of 11b.

Then, the top surface 18a is formed from the outer peripheral surface 12a toward the inclined surfaces 15a and 16a. Similarly, the top surface 18b is formed from the outer peripheral surface 12b toward the inclined surfaces 15b and 16b. Here, the top surface refers to a surface that shares one end of each of the ridge lines 17a and 17b. The ends of the ridge lines 17a and 17b that are in contact with the top surfaces 18a and 18b are set as sharp points P1 and P2, respectively. The top surface is the surface that acts on the scribed substrate. As long as it acts on the substrate, that is, the length in the circumferential direction from the intersection point with the ridge line is 0.05 mm or more in the side view of Figure 2 (b), it is regarded as the top surface. Effective function, for example, about 0.05 to 0.1 mm. In addition, the ridge lines 17a and 17b function as long as they act on the substrate during scoring, that is, when the intersection point with the top surface is 0.02 mm or longer when viewed from the side view in FIG. 2 (b).

By forming the pointed points P1 and P2 in this manner, as shown in FIG. 2, the triangular diamond tool 10 in the side view can form two pointed points. The top surface and the inclined surface constituting the pointed points P1 and P2 are independent of each other without forming another pointed point, so that the pointed points can be precisely ground without affecting each other. Such an inclined surface or a top surface can be easily formed by laser processing. In addition, mechanical polishing may be performed after laser processing, so that the portion forming the ridge line becomes a more precise polishing surface.

FIG. 3 is a front view and a side view showing a state where the scoring head unit 30 is mounted with the diamond tool 10. As shown in FIG. 3, the diamond tool 10 is held in a tool holder 20. The tool holder 20 is a rectangular parallelepiped member, and the diamond tool 10 is held obliquely at the lower end of the tool holder 20 so that any one of the pointed ends, here, the pointed end P1 becomes the lower end. The tool holder 20 is fixed to the scoring head 30 by providing two screw holes.

The scoring head unit 30 is configured such that the plate-shaped top plate 31 itself is vertically moved by a sliding mechanism (not shown). A cylinder 32 for scoring a load is fixed to the top plate 31. The rod 32a at the lower end of the air cylinder 32 protrudes freely. In addition, as shown in FIG. 3 (b), a guide mechanism 33 and a sliding portion 34 are provided below the lever 32a of the top plate 31, and the sliding portion 34 is pressed downward with a specific load. The guide mechanism 33 holds the slide portion 34 so that it can move up and down freely. An L-shaped plate 35 is provided on the sliding portion 34. The plate 35 moves up and down together with the slide portion 34, and the lower limit is restricted by the stopper portion 36. The tool holder 20 is fixed to the plate 35 in an oblique direction by screwing. The scoring can be performed by moving the scoring head unit 30 in the direction of arrow A.

A case where the diamond tool 10 according to this embodiment is used for scribing will be described with reference to FIGS. 4 to 7. When scoring is started, first, as shown in FIG. 4, one tip P1 of the diamond tool 10 is brought close to the substrate 40 and the scoring head unit 30 is lowered. At this time, as shown in the enlarged view around the tip P1 of FIG. 8, the angle θ between the outer peripheral surface 12 a and the brittle material substrate is preferably 15 to 20 °, and the tip P1 of the diamond tool 10 is lower than that of the substrate 40. On the upper surface, the scoring head unit 30 is pushed down so that the difference D between the height of the substrate 40 and the tip P1 corresponds to the thickness of the substrate 40 and becomes about 0.05 to 0.2 mm. Then, the scoring head unit 30 is moved from the left side of the substrate 40 to the right. If so, as shown in FIG. 5, the outer peripheral surface 12 a of the diamond tool 10 is in contact with the upper left end portion of the substrate 40. That is, at least a part or all of the outer peripheral surface 12 a functions as a guide surface that guides the tip P1 to the substrate 40. At this time, as shown in the enlarged view of FIG. 9, the interval F between the tip P1 and the substrate 40 is determined by the difference D between the angle θ and the height. For example, if θ = 15 ° and D = 0.2 mm, F becomes 0.78 mm. Therefore, the guide surface 12 a preferably has a length of 1.0 mm or more in the circumferential direction of the diamond tool 10. Then, if the diamond tool is moved in the direction of the arrow A, as shown in FIG. 6, the base plate 40 resists the pressure of the air cylinder 32 and slightly presses the sliding portion 34, so that the plate 35 itself rises. If the scoring head unit 30 is further moved to the right side, the peripheral portion of the tip P1 including the top surface 18a while sliding on the guide surface 12a relative to the substrate 40 enters the substrate 40, so that it can start from the end of the substrate 40 Scribing, that is, cutting out. If the scoring head unit 30 is further moved in the direction of the arrow A to perform scoring, the scoring can be performed such that the top surface 18 a of the diamond tool 10 goes ahead and the ridge line 17 a goes behind. As described above, at the beginning of the incision and scoring, first, the outer peripheral surface (guide surface) 12a of the diamond tool 10 is in contact with the upper left end of the substrate 40, and thereafter the tip including the top surface 18a is guided by the guide surface. By being in contact with the substrate 40, even if scratching is started by cutting out, damage to the tip can be prevented. Furthermore, the top surface with a wider width comes into contact with the substrate first, and then the ridge lines contact the substrate, thereby eliminating the concentration of stress on the end portion of the substrate 40, so that damage to the end portion of the substrate can also be suppressed. In addition, when the outer scribe is started, the other pointed point P2 is located outside and above the edge portion of the substrate 40, so the pointed point P2 is not damaged.

Further, as shown in FIG. 7, the scribe is performed until the end of the substrate 40 is reached, and then the scribe head 30 is raised and the scribe is completed by incision. Furthermore, if the scribe is performed until the tip P1 leaves the end of the substrate 40, that is, the scribe is finished by cutting out, there is a possibility that after the tip P1 leaves the substrate 40, the scribe head is The air cylinder 32 descends, and the tip P2 is damaged at the end of the substrate 40. Therefore, it is preferable to end the scribe by incision.

When the tip P1 in contact with the substrate 40 deteriorates due to abrasion, the diamond tool 10 is reversed, the other tip P2 is brought into contact with the substrate 40, and the tip P2 is similarly used for scoring. If so, it can be scored with a new pointed tip.

Furthermore, in the first embodiment, after the inclined surfaces 13a and 13b are formed from the side surfaces 11a and 11b on both sides as shown in FIG. 1 (a), the first to fourth inclined surfaces are newly formed, as shown in FIG. As shown, the inclined surfaces 13a and 13b are set as the first and second inclined surfaces, respectively, and the ends of the outer peripheral surfaces 12a and 12b are directly set as the top surfaces, and the ridge line 14 is used as the intersection line. In this case, the guide surface and the top surface become on the same plane. If so, the intersection points P1 and P2 of both sides of the ridgeline 14 and the outer peripheral surface can be pointed, the portion of the outer peripheral surface that is connected to the ridgeline can be used as the top surface, and the portion of the outer peripheral surface that is separated from the ridgeline can be used as the tip. Guide surface. Alternatively, as shown in FIG. 11, the ends of the outer peripheral surfaces 12a and 12b may be slightly polished, and the top surfaces 18a and 18b may be formed separately. In this case, the tips P1 and P2 share the ridge line 14 and the outer peripheral surfaces 12a and 12b become the guide surfaces.

Next, a second embodiment of the present invention will be described. In the first embodiment, as shown in FIG. 2, the first to fourth inclined surfaces 15a, 15b, 16a, and 16b are formed so that a part of the original inclined surfaces 13a and 13b remains, but the second embodiment is shown in FIG. 12 As shown in the figure, the first to fourth inclined surfaces 15a, 15b, 16a, and 16b are enlarged so that the original inclined surfaces 13a and 13b are disappeared and formed.

Next, a third embodiment of the present invention will be described with reference to Figs. 13 and 14. In the above-mentioned first embodiment, an isosceles triangle-shaped base is used, but the diamond tool 50 of this embodiment is formed at two corners of a square base as shown in FIG. 2. As shown in FIG. 13, a diamond tool 50 of this embodiment uses a single crystal diamond having a square shape and a plate-shaped base 51 having a fixed thickness. Further, inclined surfaces 53a to 53d are formed from one side surface 51a of the base 51 toward the intersection of the four outer peripheral surfaces 52a to 52d. Similarly, inclined surfaces 54a to 54d are formed toward the four corners from the other side surface 51b.

Next, as shown in FIGS. 14 (a) and 14 (b), the inclined surfaces 53a are inclined from the side surface 51a to the outer peripheral surfaces 52a and 52b, respectively, to form inclined surfaces 55a and 55b. Similarly, the inclined surfaces 56a and 56b are formed from the side surface 51b toward the outer peripheral surfaces 52a and 52b with respect to the inclined surface 54a, respectively. If so, the first and second inclined surfaces 55a and 56a located on the side of the original outer peripheral surface 52a intersect, and in the middle, preferably the central position, of the thickness direction of the base 51 to form a side surface 51a parallel to the base, The ridge line 57a of 51b. Similarly, the third and fourth inclined surfaces 55b and 56b located at the position of the original outer peripheral surface 52b intersect, and are respectively located at the middle and preferably the central position in the thickness direction of the base 51 to form side surfaces 51a, parallel to the base. The ridgeline 58a of 51b.

Then, the inclined surfaces 53b are inclined from the side surface 51a to the outer peripheral surfaces 52b and 52c, respectively, to form inclined surfaces 55c and 55d. Similarly, inclined surfaces 56c and 56d are formed from the side surface 51b toward the outer peripheral surfaces 52b and 52c with respect to the inclined surface 54b, respectively. If so, the first and second inclined surfaces 55c and 56c located at the position of the original outer peripheral surface 52b intersect, and in the middle of the thickness direction of the base 51, it is preferably at the center position as shown in FIG. 14 (b). A ridge line 57b is formed parallel to the side surfaces 51a, 51b of the base. Similarly, the third and fourth inclined surfaces 55d and 56d located on the side of the original outer peripheral surface 52b intersect, and are respectively located at the middle and preferably the central position of the thickness direction of the base 51 to form parallel side surfaces 51a, The ridge line 51b of 51b.

Then, the inclined surfaces 53c are inclined from the side surface 51a to the outer peripheral surfaces 52c and 52d, respectively, to form inclined surfaces 55e and 55f. Similarly, inclined surfaces 56e and 56f are formed from the side surface 51b toward the outer peripheral surfaces 52c and 52d with respect to the inclined surface 54c, respectively. If so, the first and second inclined surfaces 55e and 56e located at the position of the original outer peripheral surface 52c intersect, and in the middle, preferably the central position, in the thickness direction of the base 51 to form a side surface 51a parallel to the base, 51b ridge 57c. Similarly, the third and fourth inclined surfaces 55f and 56f located on the side of the original outer peripheral surface 52d intersect, and are respectively located at the middle and preferably at the center of the thickness direction of the base 51 to form parallel sides 51a, The ridge line 51c of 51b.

Furthermore, it is inclined with respect to the inclined surface 53d from the side surface 51a toward the outer peripheral surface 52d, and 52a side, and the inclined surfaces 55g and 55h are formed. Similarly, inclined surfaces 56g and 56h are formed from the side surface 51b toward the outer peripheral surfaces 52d and 52a with respect to the inclined surface 54d, respectively. If so, the first and second inclined surfaces 55g and 56g located on the side of the original outer peripheral surface 52d intersect, and in the middle, preferably the center position, of the base 51 in the thickness direction, forming a side surface 51a parallel to the base, 51b ridge 57d. Similarly, the third and fourth inclined surfaces 55h and 56h located at the position of the original outer peripheral surface 52a intersect, and are respectively located at the middle and preferably the central position of the thickness direction of the base 51 to form parallel sides 51a, The ridge line 51d of 51b.

Then, the top surface 59a is formed from the outer peripheral surface 52a toward the inclined surfaces 55a and 56a. Similarly, the top surface 60a is formed from the outer peripheral surface 52b toward the inclined surfaces 55b and 56b. Then, the top surface 59b is formed from the outer peripheral surface 52b toward the inclined surfaces 55c, 56c, and the top surface 60b is formed from the outer peripheral surface 52c toward the inclined surfaces 55d, 56d. Then, a top surface 59c is formed from the outer peripheral surface 52c toward the inclined surfaces 55e, 56e, and a top surface 60c is formed from the outer peripheral surface 52d toward the inclined surfaces 55f, 56f. Next, a top surface 59d is formed from the outer peripheral surface 52d toward the inclined surfaces 55g and 56g, and a top surface 60d is formed from the outer peripheral surface 52a toward the inclined surfaces 55h and 56h. The ends of the ridge lines 57a to 57d that are in contact with the top surfaces 59a to 59d are set as sharp points P1, P3, P5, and P7. The ends of the ridge lines 58a to 58d that are in contact with the top surfaces 60a to 60d are set as sharp points P2, P4, P6, and P8, respectively.

In this embodiment, neither the top surface or the inclined surface that constitutes each of the pointed ends is independent of other pointed ends, and therefore it is possible to perform precise polishing without affecting the other pointed ends. If so, eight pointed points P1 to P8 can be formed around the base.

In the above embodiments, the entire base is made of single crystal diamond. However, as long as the surface portion in contact with the substrate of the brittle material is diamond, it is sufficient to use a base made of cemented carbide or sintered diamond. A polycrystalline diamond layer is formed on the outer peripheral surface of the seat and the surface of the ridgeline, which is further precisely ground to form a pointed tip. Alternatively, a single crystal or polycrystalline diamond having conductivity by doping impurities such as boron may be used. By using a diamond having conductivity, an inclined surface can be easily formed by electric discharge machining.

Further, in the above-mentioned embodiment, the diamond tool is moved to the top surface direction of each of the pointed ends to perform the scoring, or the diamond tool may be moved to the ridgeline direction of each of the pointed ends to perform the scoring.

[Industrial availability]

The diamond tool of the present invention can be used for a scoring device for scoring a substrate of a brittle material, and in particular, it can also be effectively used for scoring objects with higher hardness and increased wear of the diamond tool.

Claims (4)

    A diamond tool includes: a square base having side surfaces and a plurality of outer peripheral surfaces; and first and second inclined surfaces, which are at least one corner with respect to the base, from two of the base. The side surface is formed toward one of the adjacent outer peripheral surfaces; the ridge line is the intersection of the first and second inclined surfaces; and the top surface is provided between the one outer peripheral surface and the ridge line; the outer peripheral surface A part or the entire surface adjacent to the top surface becomes a guide surface, at least the ridgeline, the top surface, and the guide surface are formed of diamonds, and the intersection of the ridgeline and the top surface is set as a sharp point.         For example, the diamond tool in the scope of patent application, wherein the length of the above-mentioned guide surface in the circumferential direction is 1 mm or more.         For example, the diamond tool of the first scope of the patent application, wherein the above-mentioned base is a polygon-shaped base, and there are two above-mentioned pointed ends at one corner of the above-mentioned polygon.         A scoring method using a diamond tool. The diamond tool has a ridge line formed at a corner portion of a base at the center of the thickness of the base, a top surface sharing one end of the ridge line, and disposed adjacent to the top surface. On the guide surface opposite to the ridge line, a point shared by the ridge line and the top surface is set as a pointed point, and the scoring method is such that the above-mentioned one of the diamond tools has the lowest position to set the above point The diamond tool is held on the scoring head, and the scoring head is pushed down so that the pointed point on the outer side of the substrate becomes lower than the upper surface of the substrate. After the guide surface is brought into contact with the end of the substrate, and after the guide surface slides a certain distance from the end of the substrate, the top surface comes into contact with the end of the substrate and begins to cut out.