TW201808842A - Diamond Tools capable of carrying out a highly productive tool tip processing as the top surface and the tilted surface cannot cause any effects on the top surfaces of other spikes during the process - Google Patents
Diamond Tools capable of carrying out a highly productive tool tip processing as the top surface and the tilted surface cannot cause any effects on the top surfaces of other spikes during the process Download PDFInfo
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- TW201808842A TW201808842A TW106126979A TW106126979A TW201808842A TW 201808842 A TW201808842 A TW 201808842A TW 106126979 A TW106126979 A TW 106126979A TW 106126979 A TW106126979 A TW 106126979A TW 201808842 A TW201808842 A TW 201808842A
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Dicing (AREA)
Abstract
Description
本發明係關於一種用於利用鑽石尖頭在玻璃基板或矽晶圓等之脆性材料基板上劃線的鑽石工具。The present invention relates to a diamond tool for scribe lines on a substrate of a brittle material such as a glass substrate or a silicon wafer by using a diamond tip.
先前,為了在玻璃基板或矽晶圓上劃線,而使用採用由刻劃輪或單晶鑽石形成之鑽石尖頭之工具。針對玻璃基板,主要使用相對於基板而使其滾動之刻劃輪,但自提高劃線後之基板之強度等之優點而言,亦不斷研究作為固定刀之鑽石尖頭之使用。在專利文獻1中提議有為了在玻璃板上劃線而使用具有圓錐形之前端之玻璃劃線器的劃線裝置。又,在專利文獻2中,提議有將鑽石粒子3之前端面設為平面、朝向棱線形成研磨面且使研磨面與棱線之交點形成尖頭的鑽石劃線器。 [先前技術文獻] [專利文獻] [專利文獻1]日本特開2013-043787號公報 [專利文獻2]日本特開2005-088455號公報Previously, in order to scribe on a glass substrate or a silicon wafer, a tool using a diamond tip formed by a scribing wheel or a single crystal diamond was used. For glass substrates, the scribe wheel that rolls relative to the substrate is mainly used, but from the advantages of improving the strength of the substrate after scribing, etc., the use of diamond tips as fixed knives has also been continuously studied. Patent Document 1 proposes a scribing device using a glass scribing device having a conical front end for scribing on a glass plate. Further, in Patent Document 2, a diamond scribe is proposed in which the front end face of the diamond particles 3 is flat, a polishing surface is formed toward the ridge line, and a point of intersection between the polishing surface and the ridge line is formed. [Prior Art Literature] [Patent Literature] [Patent Literature 1] Japanese Patent Laid-Open No. 2013-043787 [Patent Literature 2] Japanese Patent Laid-Open No. 2005-088455
[發明所欲解決之問題] 在先前之以單晶鑽石作為工具來加工之情形下,雖然根據結晶方位而存在較佳之加工方向,但有在單一平面之加工上難以形成適合於各個尖頭之加工面的問題點。又,加工被稱為刀尖之頂面的面,其次加工與頂面連接之棱線而形成尖頭,在重複此操作而形成複數個刀尖時,若在任一棱線加工上在頂面側產生缺損時,產生再次進行頂面加工之必要。相同地,在進行為了形成棱線之傾斜面之加工時亦然,有可能對其他棱線之位置或角度帶來影響。因此,有下述問題點,即:連無須加工之處亦產生加工之必要,或有可能在已經形成之尖頭上產生缺損。 本發明係鑒於如此之先前之問題點而完成者,其目的在於提供一種可進行高生產效率之刀尖加工的鑽石工具。 [解決問題之技術手段] 為了解決該課題,本發明之鑽石工具具備:角柱形之基座,其包含上表面及與其垂直之複數個外周面;頂面,其以與在前述角柱之上表面之各頂點上包含上表面之該頂點且將上表面等分之等分線垂直的線成為截距之方式自上表面傾斜角度θ1;及一對傾斜面,其等自包含該頂點之鄰接之2個外周面朝向該頂點傾斜;且以前述一對傾斜面與前述頂面之交點為尖頭。 此處前述上表面與前述頂面之角度θ1可形成為超過0°且在15°以下。 [發明之效果] 根據具有如此之特徵之本發明,能夠在加工角柱狀之單晶鑽石時,就各每一尖頭進行適宜於結晶方位之加工,從而加工品質穩定。又,由於將頂面與棱線獨立地進行加工,故在1個尖頭之頂面及棱線之加工時不會對其他尖頭之頂面及棱線帶來影響。進而,在先加工頂面而後加工棱線之情形下,可獲得即便在頂面側產生缺損而進行再次加工亦不會對其他尖頭之頂面帶來影響之效果。又,將工具之側面設為垂直於上表面之外周面,而在安裝於工具保持具時可容易地進行定位。[Problems to be Solved by the Invention] In the previous case where single crystal diamond was used as a tool for processing, although there is a better processing direction according to the crystalline orientation, it is difficult to form a single plane processing suitable for each pointed tip. Problems with the machined surface. In addition, the surface called the top surface of the cutting edge is processed, and then a ridge line connected to the top surface is processed to form a pointed end. When this operation is repeated to form a plurality of cutting edges, if any edge processing is performed on the top surface When a defect occurs on the side, it is necessary to perform the top surface processing again. Similarly, it is also possible to perform processing on an inclined surface for forming a ridgeline, which may affect the position or angle of other ridgelines. Therefore, there are problems as follows: even where no processing is required, processing is necessary, or there may be defects in the already formed tips. The present invention has been made in view of such a previous problem, and an object thereof is to provide a diamond tool capable of performing high-efficiency cutting edge processing. [Technical means to solve the problem] In order to solve the problem, the diamond tool of the present invention includes a corner pillar-shaped base including an upper surface and a plurality of outer peripheral surfaces perpendicular to the corner base; and a top surface formed on the upper surface of the corner pillar. Each vertex includes the vertex of the upper surface and the line perpendicular to the bisector of the upper surface becomes an intercept from the upper surface in an angle of θ1; and a pair of inclined surfaces from the adjacent adjacent vertex The two outer peripheral surfaces are inclined toward the vertex; and the intersection point of the pair of inclined surfaces and the top surface is pointed. Here, the angle θ1 between the upper surface and the upper surface may be formed to exceed 0 ° and be 15 ° or less. [Effects of the Invention] According to the present invention having such a feature, when processing angular prism-shaped single crystal diamonds, it is possible to perform processing suitable for the crystalline orientation for each of the sharp tips, so that the processing quality is stable. In addition, since the top surface and the ridgeline are processed independently, the processing of the top surface and the ridgeline of one sharp point will not affect the top surface and the ridgeline of the other sharp points. Furthermore, in the case where the top surface is processed first and then the ridge line is processed later, it is possible to obtain an effect that even if a defect is generated on the top surface side and reprocessing is performed, it will not affect the top surface of other sharp points. The side surface of the tool is perpendicular to the outer peripheral surface of the upper surface, and can be easily positioned when mounted on the tool holder.
其次,針對本發明之實施形態進行說明。圖1係顯示本發明之實施形態之鑽石工具之製造過程的俯視圖及前視圖。該鑽石工具以一定高度之四角柱之單晶鑽石作為基座11。該基座11具有上表面12及四方之外周面13a~13d。上表面12為正方形,將上表面12之四方之頂點設為12a~12d。針對基座11,在上表面12之各頂點12a~12d部分產生尖頭。 其次,針對在上表面12之四方之頂點上形成之尖頭之加工進行說明。針對上表面12之1個頂點12a如圖2(a)及圖3所示般,以與包含該頂點12a且將上表面12等分之等分線15垂直的線成為上表面12之截距14a之方式,且以自上表面12朝向外周面13a、13b傾斜角度θ1之方式形成頂面16a。 針對上表面12之頂點12b如圖2(a)所示般,以與包含該頂點12b且將上表面12等分之等分線14垂直的線成為上表面12之截距15a之方式,且以自上表面12朝向外周面13b、13c傾斜角度θ1之方式形成頂面16b。 針對上表面12之頂點12c如圖2(a)所示般,以與等分線15垂直之線成為上表面12之截距14b之方式,且以自上表面12朝向外周面13c、13d傾斜角度θ1之方式形成頂面16c。 針對上表面12之頂點12d如圖2(a)所示般,以與等分線14垂直之線成為上表面12之截距15b之方式,且以自上表面12朝向外周面13d、13a傾斜角度θ1之方式形成頂面16d。此處角度θ1設為超過0°且在15°以下,較佳的是設為1°~10°。若接近於0°,則加工面積變大,加工較為費時,且在頂面加工時有可能對其他頂面帶來影響。若超過15°則難以進行後述之傾斜面之加工。 其次,針對頂點12a如圖2(a)、圖3所示般,研磨外周面13a之與頂面16a相接之部分而形成傾斜面17a,且研磨外周面13b之與頂面16a相接之部分而形成傾斜面17b。此時若將2個傾斜面17a、17b所成之線設為棱線18a,則在圖2(a)之俯視圖中傾斜面17a、17b為對稱,而以棱線18a平行於等分線15之方式形成傾斜面17a、17b。將如此般形成之頂面16a與棱線18a之交點設為尖頭P1。 其次,針對頂點12b如圖2(a)所示般,研磨外周面13b之與頂面16b相接之部分而形成傾斜面17c,且研磨外周面13c之與頂面16b相接之部分而形成傾斜面17d。此時若將2個傾斜面17c、17d所成之線設為棱線18b,則在圖2(a)之俯視圖中傾斜面17c、17d為對稱,而以棱線18b平行於等分線14之方式形成傾斜面17c、17d。將如此般形成之頂面16b與棱線18b之交點設為尖頭P2。又,尖頭P1之傾斜面17b與尖頭P2之傾斜面17c雖然係自相同之外周面13b研磨,但是為各自獨立之面。亦即,由於針對傾斜面亦就每一尖頭而形成不同之面,故各傾斜面之研磨不會對其他尖頭之傾斜面帶來影響。 其次,針對頂點12c如圖2(a)所示般,研磨外周面13c之與頂面16c相接之部分而形成傾斜面17e,且研磨外周面13d之與頂面16c相接之部分形成傾斜面17f。此時若將2個傾斜面17e、17f所成之線設為棱線18c,則在圖2(a)之俯視圖中傾斜面17e、17f為對稱,而以棱線18c平行於等分線15之方式形成傾斜面17e、17f。將如此般形成之頂面16c與棱線18c之交點設為尖頭P3。 其次針對頂點12d如圖2(a)所示般,研磨外周面13d之與頂面16d相接之部分而形成傾斜面17g,且研磨外周面13a之與頂面16d相接之部分而形成傾斜面17h。此時若將2個傾斜面17g、17h所成之線設為棱線18d,則在圖2(a)之俯視圖中傾斜面17g、17h為對稱,而以棱線18d平行於等分線14之方式形成傾斜面17g、17h。將如此般形成之頂面16d與棱線18d之交點設為尖頭P4。 此處如圖3所示般,頂面16a與棱線18a所成之角度θ2較佳者為130°以上160°以下。為了將角度θ2設為如此之值,上表面12與頂面16a之角度θ1較佳者為15°以下。針對其他頂點亦相同。藉此可形成在四角柱之基座12之各頂點12a~12d之附近具有尖頭P1~P4之鑽石工具10。而且該基座11之下方可利用釺銲等而容易且穩定地安裝於工具保持具。此時,外周面在基座11之下方留有特定長度,藉由使該面與工具保持具接觸,而可將鑽石工具10相對於工具保持具確實地定位。 另外,在該實施形態中,係在四角柱之基座11之上表面之頂點12a~12a上先形成頂面16a~16d,繼之形成傾斜面17a~17h,但亦可先形成各個傾斜面17a~17h而在其後形成頂面16a~16d。在任一情形下皆然,在加工頂面而形成傾斜面且在加工棱線時,即便在頂面側產生缺損時,只要再次僅對該頂面進行加工即可,不會對其他尖頭之頂面帶來影響。又,針對傾斜面亦相同地,在1個尖頭之棱線加工時不會對相鄰之尖頭之傾斜面及頂面帶來影響。 在前述之各實施形態中,在四角柱之基座之上表面之各頂點附近之4個部位設置尖頭,但尖頭不一定必須設置此4個部位全部,至少設置2個部位即可。又,在該實施形態中係使用四角柱之基座,但並不限定於四角柱,只要係在多角柱之上表面之頂點上形成尖頭者即可。 [產業上之可利用性] 本發明可使用合成鑽石而容易地製造劃線工具,可作為薄的玻璃板等之各種形狀之脆性材料基板之劃線工具而使用。Next, an embodiment of the present invention will be described. FIG. 1 is a top view and a front view showing a manufacturing process of a diamond tool according to an embodiment of the present invention. The diamond tool uses a single crystal diamond with a square prism of a certain height as the base 11. The base 11 has an upper surface 12 and four outer peripheral surfaces 13a to 13d. The upper surface 12 is a square, and the vertices of the four sides of the upper surface 12 are 12a-12d. With respect to the base 11, sharp points are generated at the vertices 12 a to 12 d of the upper surface 12. Next, a description will be given of the processing of the pointed ends formed on the vertexes of the four sides of the upper surface 12. As shown in FIG. 2 (a) and FIG. 3, a vertex 12 a of the upper surface 12 is an intercept of the upper surface 12 by a line including the vertex 12 a and perpendicular to the bisector 15 of the upper surface 12. 14a, and the top surface 16a is formed so that the angle θ1 is inclined from the upper surface 12 toward the outer peripheral surfaces 13a and 13b. As shown in FIG. 2 (a), the vertex 12b of the upper surface 12 is such that the line perpendicular to the line containing the vertex 12b and dividing the upper surface 12 bisector 14 becomes the intercept 15a of the upper surface 12, and The top surface 16 b is formed so as to be inclined by an angle θ1 from the upper surface 12 toward the outer peripheral surfaces 13 b and 13 c. As shown in FIG. 2 (a), the vertex 12c of the upper surface 12 is inclined such that a line perpendicular to the bisector 15 becomes the intercept 14b of the upper surface 12 and is inclined from the upper surface 12 toward the outer peripheral surfaces 13c and 13d. The angle θ1 forms the top surface 16c. As shown in FIG. 2 (a), the vertex 12d of the upper surface 12 is inclined such that a line perpendicular to the bisector 14 becomes the intercept 15b of the upper surface 12 and is inclined from the upper surface 12 toward the outer peripheral surfaces 13d and 13a. The angle θ1 forms a top surface 16d. Here, the angle θ1 is set to more than 0 ° and 15 ° or less, and preferably 1 ° to 10 °. If it is close to 0 °, the processing area becomes large, the processing is time-consuming, and it may affect other top surfaces when the top surface is processed. If it exceeds 15 °, it will be difficult to process the inclined surface described later. Next, as shown in FIG. 2 (a) and FIG. 3, for the vertex 12a, a portion where the outer peripheral surface 13a is in contact with the top surface 16a is polished to form an inclined surface 17a, and a portion where the outer peripheral surface 13b is in contact with the top surface 16a Partly, an inclined surface 17b is formed. At this time, if the line formed by the two inclined surfaces 17a and 17b is set as the edge line 18a, the inclined surfaces 17a and 17b are symmetrical in the plan view of FIG. 2 (a), and the edge line 18a is parallel to the bisector 15 In this way, the inclined surfaces 17a, 17b are formed. The intersection of the top surface 16a and the ridgeline 18a formed in this manner is referred to as a pointed point P1. Next, as shown in FIG. 2 (a), the vertex 12b is formed by polishing the portion of the outer peripheral surface 13b that is in contact with the top surface 16b to form an inclined surface 17c, and polishing the portion of the outer peripheral surface 13c that is in contact with the top surface 16b. 17d. At this time, if the line formed by the two inclined surfaces 17c and 17d is set as an edge line 18b, the inclined surfaces 17c and 17d are symmetrical in the plan view of FIG. 2 (a), and the edge line 18b is parallel to the bisector 14 In this way, the inclined surfaces 17c and 17d are formed. The intersection of the top surface 16b and the ridgeline 18b formed in this manner is referred to as a pointed point P2. Moreover, although the inclined surface 17b of the pointed P1 and the inclined surface 17c of the pointed P2 are polished from the same outer peripheral surface 13b, they are independent surfaces. That is, since different surfaces are formed for each of the pointed surfaces with respect to the inclined surface, the grinding of each inclined surface will not affect the inclined surfaces of the other pointed surfaces. Next, as shown in FIG. 2 (a), the vertex 12c is formed by grinding the portion of the outer peripheral surface 13c that is in contact with the top surface 16c to form an inclined surface 17e, and grinding the portion of the outer peripheral surface 13d that is in contact with the top surface 16c is inclined. Face 17f. At this time, if the line formed by the two inclined surfaces 17e and 17f is set as an edge line 18c, the inclined surfaces 17e and 17f are symmetrical in the plan view of FIG. 2 (a), and the edge line 18c is parallel to the bisector 15 In this way, the inclined surfaces 17e and 17f are formed. The intersection of the top surface 16c and the ridgeline 18c formed in this manner is referred to as a pointed point P3. Next, as shown in FIG. 2 (a), the apex 12d is ground by grinding the portion of the outer peripheral surface 13d that is in contact with the top surface 16d to form an inclined surface 17g, and grinding the portion of the outer peripheral surface 13a that is in contact with the top surface 16d to form an inclined surface 17h. At this time, if the line formed by the two inclined surfaces 17g and 17h is set as an edge line 18d, the inclined surfaces 17g and 17h are symmetrical in the plan view of FIG. 2 (a), and the edge line 18d is parallel to the bisector 14 In this way, inclined surfaces 17g and 17h are formed. The intersection point of the top surface 16d and the ridgeline 18d formed in this manner is referred to as a pointed point P4. Here, as shown in FIG. 3, the angle θ2 formed by the top surface 16 a and the ridge line 18 a is preferably 130 ° or more and 160 ° or less. In order to set the angle θ2 to such a value, the angle θ1 between the upper surface 12 and the top surface 16a is preferably 15 ° or less. The same is true for other vertices. As a result, a diamond tool 10 having pointed points P1 to P4 can be formed near the vertices 12a to 12d of the base 12 of the quadrangular pillar. In addition, the lower part of the base 11 can be easily and stably attached to the tool holder by brazing or the like. At this time, the outer peripheral surface has a specific length below the base 11, and the diamond tool 10 can be reliably positioned relative to the tool holder by bringing the surface into contact with the tool holder. In addition, in this embodiment, the top surfaces 16a to 16d are formed on the vertices 12a to 12a of the upper surface of the base 11 of the quadrangular pillar, and then the inclined surfaces 17a to 17h are formed, but each of the inclined surfaces may be formed first. 17a to 17h and top surfaces 16a to 16d are formed thereafter. In any case, when the top surface is processed to form an inclined surface, and when a ridge line is processed, even if a defect occurs on the top surface side, only the top surface is processed again, and no other sharp points are processed. The top surface makes an impact. In addition, the same applies to the inclined surface, and it does not affect the inclined surface and the top surface of the adjacent sharp point during the ridge line processing of one sharp point. In each of the foregoing embodiments, sharp points are provided at four locations near each vertex of the upper surface of the base of the quadrangular pillar, but the sharp points do not necessarily need to be provided at all four locations, and at least two locations may be provided. In this embodiment, the base of the quadrangular post is used, but it is not limited to the quadrangular post, as long as the tip is formed on the vertex of the upper surface of the polygonal post. [Industrial Applicability] The present invention can easily produce a scribing tool using a synthetic diamond, and can be used as a scribing tool for various shapes of a brittle material substrate such as a thin glass plate.
10‧‧‧鑽石工具
11‧‧‧基座
12‧‧‧上表面
12a~12d‧‧‧頂點
13a~13d‧‧‧外周面
14‧‧‧等分線
14a‧‧‧截距
14b‧‧‧截距
15‧‧‧等分線
15a‧‧‧截距
15b‧‧‧截距
16a~16d‧‧‧頂面
17a~17h‧‧‧傾斜面
18a~18d‧‧‧棱線
P1~P4‧‧‧尖頭
θ1‧‧‧角度
θ2‧‧‧角度10‧‧‧ Diamond Tools
11‧‧‧ base
12‧‧‧ top surface
12a ~ 12d‧‧‧Vertex
13a ~ 13d‧‧‧outer surface
14‧‧‧ bisector
14a‧‧‧intercept
14b‧‧‧intercept
15‧‧‧ bisector
15a‧‧‧intercept
15b‧‧‧intercept
16a ~ 16d‧‧‧Top
17a ~ 17h‧‧‧inclined surface
18a ~ 18d‧‧‧Edge
P1 ~ P4‧‧‧point θ1‧‧‧angle θ2‧‧‧angle
圖1(a)、(b)係顯示本發明之實施形態之鑽石工具之製造過程的俯視圖及前視圖。 圖2(a)、(b)係實施形態之鑽石工具之俯視圖及前視圖。 圖3係顯示本發明之實施形態之鑽石工具之尖頭部分的局部放大圖。1 (a) and (b) are a plan view and a front view showing a manufacturing process of a diamond tool according to an embodiment of the present invention. 2 (a) and 2 (b) are a plan view and a front view of a diamond tool according to an embodiment. FIG. 3 is a partial enlarged view showing a pointed portion of a diamond tool according to an embodiment of the present invention.
10‧‧‧鑽石工具 10‧‧‧ Diamond Tools
12‧‧‧上表面 12‧‧‧ top surface
13a~13d‧‧‧外周面 13a ~ 13d‧‧‧outer surface
14a‧‧‧截距 14a‧‧‧intercept
14b‧‧‧截距 14b‧‧‧intercept
15a‧‧‧截距 15a‧‧‧intercept
15b‧‧‧截距 15b‧‧‧intercept
16a~16d‧‧‧頂面 16a ~ 16d‧‧‧Top
17a~17h‧‧‧傾斜面 17a ~ 17h‧‧‧inclined surface
18a~18d‧‧‧棱線 18a ~ 18d‧‧‧Edge
P1~P4‧‧‧尖頭 P1 ~ P4‧‧‧ pointed
Claims (2)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016168326A JP2018034381A (en) | 2016-08-30 | 2016-08-30 | Diamond tool |
| JP??2016-168326 | 2016-08-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201808842A true TW201808842A (en) | 2018-03-16 |
Family
ID=61531539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106126979A TW201808842A (en) | 2016-08-30 | 2017-08-09 | Diamond Tools capable of carrying out a highly productive tool tip processing as the top surface and the tilted surface cannot cause any effects on the top surfaces of other spikes during the process |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2018034381A (en) |
| KR (1) | KR20180025173A (en) |
| CN (1) | CN107791402A (en) |
| TW (1) | TW201808842A (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005088455A (en) * | 2003-09-19 | 2005-04-07 | Namiki Precision Jewel Co Ltd | Diamond scriber |
| JP2005302781A (en) * | 2004-04-06 | 2005-10-27 | Tecdia Kk | Diamond scriber and method for producing point portion thereof |
| TWI424580B (en) * | 2009-02-24 | 2014-01-21 | 三星鑽石工業股份有限公司 | A trench processing tool, a trench processing method and a cutting device using a thin film solar cell |
| JP6476883B2 (en) * | 2015-01-16 | 2019-03-06 | 三星ダイヤモンド工業株式会社 | Multipoint diamond tool |
| JP6476892B2 (en) * | 2015-01-20 | 2019-03-06 | 三星ダイヤモンド工業株式会社 | Multipoint diamond tools |
-
2016
- 2016-08-30 JP JP2016168326A patent/JP2018034381A/en active Pending
-
2017
- 2017-07-24 KR KR1020170093358A patent/KR20180025173A/en not_active Withdrawn
- 2017-08-02 CN CN201710651646.XA patent/CN107791402A/en active Pending
- 2017-08-09 TW TW106126979A patent/TW201808842A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN107791402A (en) | 2018-03-13 |
| JP2018034381A (en) | 2018-03-08 |
| KR20180025173A (en) | 2018-03-08 |
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