TW201814728A - Melanized metal grid structure and manufacture method thereof - Google Patents

Abstract

The invention discloses a melanized metal grid structure and a manufacture method thereof. The melanized metal grid structure comprises a substrate, at least one metal layer and at least two melanized layers, wherein the substrate comprises a first surface and a second surface; the at least one metal layer is formed on the first surface and the second surface of the substrate, or is formed on one of the first surface and the second surface; each metal layer is provided with a circuit and is not overlapped with the corresponding positions of other metal layers; and the amount of the melanized layers is two times of the amount of the metal layers. The invention further discloses a manufacture method for the melanized metal grid structure. By means of the above structure and method, the melanized layers are used for covering the circuit of each metal layer, and the gray scale and the thickness of each melanized layer can be controlled.

Description

Blackened metal grid structure and manufacturing method thereof

The invention relates to a blackened metal grid structure and a manufacturing method thereof, in particular to a blackened metal grid structure using a blackened layer to cover a metal layer line to control the gray scale and thickness of the blackened layer and a manufacturing method thereof. .

The current metal grid structure, such as the Republic of China Patent Publication No. I504697, discloses a blackened coating and an electrode structure using the blackened coating. The blackened coating has the effects of anti-corrosion and reducing the reflection of metal and the invisibility of the human eye. The blackened layer formed by the blackened coating of the present invention can replace the traditional resist layer, thereby reducing the electrode manufacturing process of the touch panel, so as to achieve the effect of reducing cost and reflecting light of the metal electrode.

The Republic of China Patent Bulletin No. M491203 also discloses a touch electrode structure including a substrate layer; at least one adhesion layer forming a circuit pattern on the surface of the substrate layer; and a conductive electrode formed on the surface of the adhesion layer And a conductive line is formed corresponding to the circuit pattern; a first blackening layer is formed on the surface of the conductive electrode and is made of a material that is easy to etch; and a weathering layer is formed on the surface of the first blackening layer and is formed by Made of a material with resistance to etching; wherein the thickness of the weathering layer is smaller than that of the first blackening layer, and the first blackening layer allows light to be absorbed by the first blackening layer and cannot enter the conductive electrode, forming a Prevent users from directly viewing the shielding surface of the conductive electrodes. Based on this, this creation can avoid the human eye from directly seeing the existence of conductive electrodes under the touch panel, and reduce the serious lateral etching phenomenon of conductive electrodes, and improve the conductivity. Production yield of electrode products.

The Republic of China Patent Bulletin No. I509484 also discloses a touch panel device and an electrode structure thereof. The electrode structure can be made of a metal conductive material. In order to effectively suppress metal reflection without affecting light transmission and metal conductivity, the electrode structure proposed in the embodiment The main structure includes a metal conductive layer, a roughened and roughened structure, and a blackened layer. The electrode structure is combined with the substrate. The electrode structure is provided with a roughened structure. It can be used to reduce the reflection of both the metal conductive layer and the substrate. The roughened structure can be formed by etching or processing on the metal conductive layer, or it can be formed by electrolytic, sputtering, deposition or coating methods. The coating layer is used to absorb the light directed to the metal conductive layer, so as to reduce the color deviation of the screen and resist metal reflection.

However, because the above electrode structure can only select specific materials, such as copper, rhenium, palladium, palladium oxide, or copper oxide, the oxide layer is not a bright metal, and the grayscale color of the blackened layer cannot be adjusted.

Therefore, how to design a blackened metal grid structure capable of adjusting the grayscale color of the blackened layer and the manufacturing method thereof have become the goals that are commonly expected by relevant equipment manufacturers and R & D personnel.

In view of the inability of the conventional technology to adjust the lack of grayscale color of the blackened layer, the inventor has actively started development in order to improve the existing shortcomings described above. After continuous experiments and efforts, the present invention was finally developed.

A first object of the present invention is to provide a blackened metal mesh structure.

A second object of the present invention is to provide a method for manufacturing a blackened metal mesh structure.

To achieve the above object, the blackened metal mesh structure of the present invention includes a substrate, at least one metal layer, and at least two blackened layers.

The substrate system includes a first surface and a second surface. The metal layers are formed on the first surface and the second surface of the substrate, or one of the first surface and the second surface, the metal layers have wiring, and the metal layers are not related to the other The corresponding positions of the metal layers overlap.

The number of the blackening layer is twice that of the metal layer, and the blackening layers are respectively formed on the first surface and the second surface directly on the metal layers, and corresponding to the metal layers. Position, formed on the first surface or the second surface, the blackened layers are photoresist.

In order to achieve the above-mentioned object, the method for manufacturing a blackened metal mesh structure of the present invention includes steps: Step A: providing a substrate, the substrate including a first surface and a second surface; Step B: on the substrate The first surface and the second surface, or one of the first surface and the second surface, forms at least one metal layer, the metal layers have wiring, and the metal layers are not in contact with other metal layers. The corresponding positions overlap; and step C: forming a blackened layer on the first surface and the second surface respectively directly on the metal layers, and the positions corresponding to the metal layers on the first surface or Another blackened layer is formed on the second surface, and the blackened layers are photoresist; the gray scale and thickness of the blackened layers can be controlled by using the blackened layers to cover the lines of the metal layers.

With the above-mentioned structure and method, the present invention can control the gray scale and thickness of the blackened layer by using the blackened layer to cover the lines of the metal layer.

In order to make those skilled in the art understand the purpose of the present invention, the preferred embodiments of the present invention are described in detail below with reference to the drawings.

Please refer to FIG. 1 and FIG. 2. The blackened metal grid structure (1) of the present invention includes a substrate (10), at least one metal layer (11), and at least two blackened layers (12).

The substrate (10) includes a first surface and a second surface. The metal layers (11) are formed on the first surface and the second surface of the substrate (10), or one of the first surface and the second surface, and the metal layers (11) have wiring. And these metal layers (11) do not overlap with corresponding positions of other metal layers (11).

The number of the blackened layer (12) is twice that of the metal layer (11), and the blackened layers (12) are respectively formed on the first surface and the second surface directly on the metal layers ( 11), and the positions corresponding to the metal layers (11) are formed on the first surface or the second surface, and the blackened layers (12) are photoresist.

The invention uses the blackening layers (12) to cover the lines of the metal layer (11) from the first surface and the second surface in a two-to-one manner to control the blackening layers (12). ) Gray scale and thickness.

In a preferred embodiment of the present invention, the blackened layers (12) disposed directly on the metal layers (11) are respectively covered with the metal layers (11).

Please refer to FIG. 1, FIG. 2 and FIG. 3a to FIG. 3h. In a preferred embodiment of the present invention, the metal layers (11) are formed on the substrate (10) by physical vapor deposition coating. The first surface and the second surface, or one of the first surface and the second surface.

The formation of the blackened layers (12) is due to photoresist coating, photoresist attachment and line exposure, line development and etching, line photoresist removal on the first surface due to the metal layer (11). Resist exposure, photoresist development on the first side, photoresist exposure on the second side, and photoresist development on the second side.

The blackening layer (12) is a positive type photoresist or a negative type photoresist.

Please refer to FIG. 1, FIG. 2 and FIG. 4a to FIG. 4c. In another preferred embodiment of the present invention, the metal layers (11) are formed on the substrate (10) by physical vapor deposition coating. The first surface and the second surface, or one of the first surface and the second surface.

The formation of the blackened layers (12) is due to the photoresist coating, photoresist attachment and line exposure, line development and etching performed by the metal layer (11).

The blackening layer (12) is a positive type photoresist or a negative type photoresist.

In a preferred embodiment of the present invention, the material of the metal layers (11) is one of copper, aluminum, palladium, silver, gold, molybdenum, or molybdenum-neodymium alloy.

In yet another preferred embodiment of the present invention, the photoresist color difference of the blackened layers (12) is less than 1.0, and the photoresist value of the blackened layers (12) is less than 0.8.

In yet another preferred embodiment of the present invention, the material of the substrate (10) is a transparent material, and the light transmittance of the substrate (10) ranges from 85% to 100%.

In another preferred embodiment of the present invention, the optical density range of the photoresist of the blackened layers (12) is 1 to 10, and the photoresistance line width of the blackened layers (12) is 1 to 5 microns. The thickness of the blackened layers (12) ranges from 0.1 to 2 microns.

In another preferred embodiment of the present invention, the blackened layers (12) are lines covering the metal layers (11), or the photoresistance line width of the blackened layers (12) is greater than The wiring of the metal layer (11).

In another preferred embodiment of the present invention, the material of the substrate (10) is glass, polyethylene terephthalate, polyethylene naphthalate, polycycloolefin polymer, and cycloolefin polymerization. Or polyimide.

Please refer to FIG. 1, FIG. 2 and FIG. 5. The manufacturing method (2) of the blackened metal grid structure of the present invention includes steps: Step 200: Provide a substrate (10), the substrate (10) includes A first surface and a second surface; step 201: forming at least one metal layer on the first surface and the second surface of the substrate (10), or one of the first surface and the second surface ( 11), the metal layers (11) have lines, and the metal layers (11) do not overlap with corresponding positions of other metal layers (11); and step 202: on the first surface and the second surface, respectively Forming a blackened layer (12) directly on each of the metal layers (11), and forming another black on the first surface or the second surface corresponding to the positions of the metal layers (11) The blackening layer (12), the blackening layers (12) are photoresistors; by using the blackening layers (12) to cover the lines of the metal layers, the grayscale and thickness.

In a preferred embodiment of the present invention, the blackened layers (12) disposed directly on the metal layers (11) are respectively covered with the metal layers (11).

Please refer to FIG. 1, FIG. 2, FIG. 3a to FIG. 3h, and FIG. 5. In step 201 in a preferred embodiment of the present invention, the metal layers (11) are formed on the metal layer (11) by a physical vapor deposition coating. One of the first surface and the second surface of the substrate (10), or the first surface and the second surface.

In step 202 in another preferred embodiment of the present invention, the formation of the blackened layers (12) is performed by the metal layer (11) for photoresist coating, photoresist attachment and circuit exposure, and circuit development. And etching, removing the photoresist on the line, performing photoresist exposure on the first surface, photoresist development on the first surface, photoresist exposure on the second surface, and photoresist development on the second surface.

The blackening layer (12) is a positive type photoresist or a negative type photoresist.

Please refer to FIG. 1, FIG. 2, FIG. 4 a to FIG. 4 c, and FIG. 5. In step 201 in another preferred embodiment of the present invention, the metal layers (11) are formed by using a physical vapor deposition coating. One of the first surface and the second surface of the substrate (10), or the first surface and the second surface.

In step 202 in still another preferred embodiment of the present invention, the formation of the blackened layers (12) is performed by the metal layer (11) for photoresist coating, photoresist attachment and circuit exposure, and circuit development. With etching.

The blackening layer (12) is a positive type photoresist or a negative type photoresist.

In a preferred embodiment of the present invention, the material of the metal layers (11) is one of copper, aluminum, palladium, silver, gold, molybdenum, or molybdenum-neodymium alloy.

In yet another preferred embodiment of the present invention, the photoresist color difference of the blackened layers (12) is less than 1.0, and the photoresist value of the blackened layers (12) is less than 0.8.

In yet another preferred embodiment of the present invention, the material of the substrate (10) is a transparent material, and the light transmittance of the substrate (10) ranges from 85% to 100%.

In another preferred embodiment of the present invention, the optical density range of the photoresist of the blackened layers (12) is 1 to 10, and the photoresistance line width of the blackened layers (12) is 1 to 5 microns. The thickness of the blackened layers (12) ranges from 0.1 to 2 microns.

In a preferred embodiment of the present invention, the gray levels of the blackened layers (12) may be adjusted by using different metal materials, or adjusted by different thicknesses of the same black-based photoresist, or adjusted by using different metal materials. , Or the same thickness of different black-based photoresists.

Further, in the present invention, a circuit made of the metal layers (11) is used as a mask, and a blackening layer (12) is firstly coated, and then subjected to light development and etching, and then a blackening layer is applied. Layer (12), and then subjected to light development and etching, so that there is such a blackened layer (12) above and below any line.

In another preferred embodiment of the present invention, the blackened layers (12) are lines covering the metal layers (11), or the photoresistance line width of the blackened layers (12) is greater than The wiring of the metal layer (11).

In another preferred embodiment of the present invention, the material of the substrate (10) is glass, polyethylene terephthalate, polyethylene naphthalate, polycycloolefin polymer, and cycloolefin polymerization. Or polyimide.

Through the above-mentioned structure, the present invention uses the blackened layers to cover the lines of the metal layers, and not only can the gray scale and thickness of the blackened layers be controlled by photoresistance attachment, line exposure, and line development and etching. Furthermore, since the metal layer can be made of any metal material, the grayscale color of the blackened layer can be adjusted. Furthermore, its structural form is not something that can be easily reached by those in the technical field to which it belongs, and it is undoubtedly novel and progressive.

Through the above detailed description, it can fully show that the purpose and efficacy of the present invention are progressive in implementation, have great industrial utility value, and are new inventions that have never been seen on the market today, and fully meet the requirements of invention patents , Apply according to law. The above descriptions are merely preferred embodiments of the present invention, and should not be used to limit the scope of implementation of the present invention. That is to say, all equal changes and modifications made according to the scope of the patent of the present invention should fall within the scope of the patent of the present invention. I ask your reviewing committee to make a clear reference and pray for your approval.

(1) ‧‧‧Blackened metal grid structure

(10) ‧‧‧Substrate

(11) ‧‧‧Metal layer

(12) ‧‧‧Blackened layer

(2) ‧‧‧Manufacturing method of blackened metal grid structure

Step 200 ~ Step 202

Fig. 1 is a schematic diagram of a first embodiment of a blackened metal grid structure of the present invention; Fig. 2 is a schematic diagram of a second embodiment of a blackened metal grid structure of the present invention; Fig. 3a is a physical vapor deposition method of the present invention. Schematic diagram of the metal layers formed by coating; Figure 3b is a schematic diagram of the photoresist coating, photoresistance attachment and circuit exposure of the present invention; Figure 3c is a schematic diagram of the development and etching of the circuit of the present invention; Figure 3d is a photoresist removal of the circuit of the present invention Fig. 3e is a schematic diagram of the present invention performing photoresist exposure on the first side; Fig. 3f is a schematic diagram of the present invention performing photoresist development on the first side; Fig. 3g is an embodiment of the present invention performing photoresist on the second side Schematic diagram of exposure; Figure 3h is a schematic diagram of photoresist development on the second side of the present invention; Figure 4a is a schematic diagram of the present invention using physical vapor deposition to form these metal layers; Figure 4b is a photoresist coating of the present invention, Schematic diagram of photoresistor attachment and circuit exposure; Figure 4c is a schematic diagram of the development and etching of a circuit of the present invention; and Figure 5 is a method flowchart of a method for manufacturing a blackened metal grid structure of the present invention.

Claims (10)

A blackened metal grid structure includes: a substrate including a first surface and a second surface; at least one metal layer formed on the first surface and the second surface of the substrate, or the first surface One surface and one of the second surface, the metal layers have lines, and the metal layers do not overlap with corresponding positions of other metal layers; and at least two blackened layers, the number of which is two of the metal layers Times, the blackened layers are respectively formed on the first surface and the second surface directly on the metal layers, and the positions corresponding to the metal layers are formed on the first surface or the second surface. Above, the blackened layers are photoresist; by using the blackened layers to cover the lines of the metal layers, the gray scale and thickness of the blackened layers can be controlled. The blackened metal grid structure described in item 1 of the scope of the patent application, wherein the blackened layers directly disposed on the metal layers are each covered with the metal layers. The blackened metal grid structure according to item 1 or item 2 of the patent application scope, wherein the metal layers are formed on the first surface and the second surface of the substrate by physical vapor deposition coating, or the One of the first surface and the second surface. The blackened metal grid structure described in item 3 of the scope of the patent application, wherein the formation of the blackened layers is due to the photoresist coating, photoresistance and circuit exposure, circuit development and etching, Line photoresist removal, photoresist exposure on the first side, photoresist development on the first side, photoresist exposure on the second side, and photoresist development on the second side. The blackened metal grid structure described in item 4 of the scope of the patent application, wherein the blackened layers are a positive photoresist or a negative photoresist. The blackened metal grid structure described in item 3 of the scope of the patent application, wherein the formation of the blackened layers is performed by the metal layer for photoresist coating, photoresist attachment and circuit exposure, circuit development and etching. The blackened metal grid structure as described in item 6 of the scope of patent application, wherein the blackened layers are a positive type photoresist or a negative type photoresist. The blackened metal grid structure described in item 1 of the scope of patent application, wherein the material of the metal layers is one of copper, aluminum, palladium, silver, gold, molybdenum, or molybdenum-neodymium alloy, and the blackened The photoresist color difference of the layers is less than 1.0, the photoresist value of the blackened layers is less than 0.8, the material of the substrate is transparent material, and the light transmission range of the substrate is 85% to 100%. The blackened metal grid structure described in the first item of the patent application range, wherein the photoresist optical concentration range of the blackened layers is 1 to 10, and the photoresistance line width of the blackened layers is 1 to 5 microns. The thickness of the blackened layers is 0.1 to 2 microns. The blackened layers cover the circuits of the metal layers, or the photoresistance line width of the blackened layers is greater than the lines of the metal layers. The material of the substrate is one of glass, polyethylene terephthalate, polyethylene naphthalate, polycycloolefin polymer, cycloolefin polymer or polyimide. A method for manufacturing a blackened metal grid structure includes the steps of: Step A: providing a substrate including a first surface and a second surface; Step B: on the first surface of the substrate and the first surface Two surfaces, or one of the first surface and the second surface, form at least one metal layer, the metal layers have lines, and the metal layers do not overlap with corresponding positions of other metal layers; and step C: A blackened layer is formed on the first surface and the second surface respectively directly on the metal layers, and another position corresponding to the metal layers is formed on the first surface or the second surface. A blackened layer, the blackened layers are photoresist; the gray scale and thickness of the blackened layers can be controlled by using the blackened layers to cover the lines of the metal layers.