TW201803044A - Resin molding device and method for producing resin molded article - Google Patents

Abstract

The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded article that verify whether a substrate supplied to a molding die is positioned properly. The device comprises: a forming mold (24), which has a first mold (23) and a second mold (12) arranged opposite to each other; a substrate supply mechanism (10), which supplies a substrate to a mold surface of the first mold (23) A positioning mechanism for positioning a positioning object (5) including at least a substrate; a mold clamping mechanism for clamping a molding mold (24); a camera (11) in a state where the molding mold (24) is opened, It can be arranged between the first mold (23) and the second mold (12); and the processor performs processing based on the image data captured by the camera (11), and the first mold (23) has a camera (11) The recognizable reference mark (29, 30), the camera (11) shoots the positioned object (5) and the reference mark (29, 30), and the processor according to the object (5) shot by the camera (11) With the image data of the fiducial marks (29, 30), determine whether the object (5) is positioned normally.

Description

Resin molding device and method for manufacturing resin molded product

The present invention relates to the use of a resin, such as a transistor, an integrated circuit (IC), and a light emitting diode (LED), in a wafer-like electronic component (hereinafter referred to as a "wafer"). Resin molding apparatus and method for manufacturing a resin molded product.

Conventionally, a resin molding apparatus is used to resin-encapsulate a semiconductor wafer or the like mounted on a substrate. In a resin molding apparatus, a semiconductor wafer is resin-encapsulated by positioning a substrate at a predetermined position of a molding mold and clamping the molding mold. As a technique for positioning the substrate at a predetermined position of the molding die, for example, there is a technology of bringing the outer surface of the substrate into contact with a guide pin provided in the molding die (see Patent Document 1).

Patent Document 1: Japanese Patent Application Laid-Open No. 8-142106

However, the substrate positioning technology using guide pins disclosed in Patent Document 1 has the following problems. As shown in FIG. 8 of Patent Document 1, an insertion hole 32 of a guide pin 28 is provided in the lower mold 10b, and the mold is closed while the guide pin 28 is protruded from the clamping surface of the upper mold 10a. Alternatively, as shown in FIG. 9, the guide pins 28 are received in the upper mold 10 a when the mold is closed. In either case, the guide pin 28 is repeatedly brought into contact with the insertion hole 32 of the lower mold 10b or the clamping surface of the lower mold 10b during mold clamping, so the guide pin 28 may be worn or damaged. When the guide pin 28 is deformed due to abrasion or damage, the substrate may not be normally positioned to a prescribed position of the upper mold 10a. Further, after the positioning operation, if the resin molding is performed without confirming whether or not the normal positioning is performed, the positional defect of the resin molded product may occur without proper positioning.

The present invention has been made to solve the above problems, and an object thereof is to provide a resin molding apparatus and a method for manufacturing a resin molded product that can reduce the occurrence of molding defects caused by positioning.

In order to solve the above-mentioned problems, the method for manufacturing a resin molded article according to the present invention includes: a substrate supplying step of supplying a substrate to a mold surface of any one of a molding mold having a first mold and a second mold which are arranged to face each other. Positioning step, positioning the positioning object including at least the substrate on the mold surface; photographing step, shooting the positioning object positioned in the positioning step and the reference mark set in a mold; determining step, according to the The image data of the positioning object obtained during the shooting step and the image data of the fiducial mark determine whether the positioning object is normally positioned; and the resin molding step, when it is determined in the determination step that the substrate is normally positioned, the molding mold The mold is closed for resin molding.

According to the present invention, it is possible to reduce the occurrence of molding defects caused by positioning.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. For any figure in the present application, for ease of understanding, it is schematically omitted or exaggerated as appropriate. For the same constituent elements, the same reference numerals are attached and descriptions thereof are appropriately omitted. In addition, in this application file, "resin molding" refers to the molding of a resin by a molding die, and is an expression including the concept of "resin packaging" by molding a sealing resin portion by a molding die. In addition, a "resin molded product" refers to a product that includes at least a resin portion after resin molding, and is an expression including the concept of a packaged substrate as described later. A packaged substrate is a wafer mounted on the substrate and is resin-molded by a molding die. Thereby, the resin-encapsulated form.

Embodiment 1

Structure of resin molding device

The structure of the resin molding apparatus of Embodiment 1 which concerns on this invention is demonstrated with reference to FIG. The resin molding apparatus 1 shown in FIG. 1 is a resin molding apparatus using a compression molding method, for example. An example in which a liquid resin, which is a fluid resin, is used as the resin material is shown.

The resin molding apparatus 1 includes a substrate supply housing module 2, three molding modules 3A, 3B, 3C, and a resin supply module 4 as constituent elements, respectively. The substrate supply storage module 2, the molding modules 3A, 3B, 3C, and the resin supply module 4 as structural elements can be attached to and detached from each other and can be replaced.

The substrate supply and storage module 2 is provided with: a pre-package substrate supply unit 6 for supplying the pre-package substrate 5; a post-package substrate storage unit 8 for storing the post-package substrate 7; and a substrate mounting unit 9 for before packaging The substrate 5 and the packaged substrate 7 are transferred; and the substrate transfer mechanism 10 transfers the packaged substrate 5 and the packaged substrate 7. The substrate transport mechanism 10 is provided with a camera 11 that captures a positioning state when the substrate 5 before packaging is supplied to a mold surface of a molding mold. A Charge Coupled Device (CCD) image sensor or a Complementary Metal Oxide Semiconductor (CMOS) image sensor is mounted in the camera 11 as an imaging element. The predetermined position S1 is a position in which the substrate transport mechanism 10 is in a standby state without being operated.

Each of the molding modules 3A, 3B, and 3C is provided with a lower mold 12 that can be raised and lowered and an upper mold (not shown, see FIG. 2) disposed opposite to the lower mold 12. The upper mold and the lower mold 12 together constitute a molding mold. Each of the molding modules 3A, 3B, and 3C includes a mold clamping mechanism 13 (a portion indicated by a two-dot chain line in the figure) for clamping and opening the upper mold and the lower mold 12. A cavity 14 which is supplied with a liquid resin as a resin material and which is a space for curing is set in the lower mold 12. The lower mold 12 is provided with a release film supply mechanism 15 that supplies a long release film. In addition, the structure in which the cavity 14 is provided in the lower mold 12 is described here. However, the cavity may be provided in the upper mold, and may be provided in both the upper mold and the lower mold.

The resin supply module 4 is provided with a dispenser 16 that supplies a liquid resin to a molding die, and a resin transport mechanism 17 that transports the dispenser 16. The dispenser 16 includes a resin ejection portion 18 that ejects a liquid resin at a front end portion. The predetermined position R1 is a position where the resin conveyance mechanism 17 stands by in a state where no operation is performed.

The dispenser 16 shown in FIG. 1 is a single-liquid type dispenser using a liquid resin in which a base agent and a curing agent are mixed in advance. As the main agent, for example, a thermosetting silicone resin or an epoxy resin is used. A two-liquid mixing type dispenser in which a main agent and a curing agent are mixed when a liquid resin is ejected may be used.

A control unit 19 is provided in the resin supply module 4. The control unit 19 is assembled with a memory 20 that stores image data captured by the camera 11 provided in the substrate transport mechanism 10, and a processor 21 that performs image processing and arithmetic processing based on the captured image data. Data processing; functions required for controlling the resin molding apparatus 1 and the like.

The control unit 19 controls the transportation of the pre-package substrate 5 and the post-package substrate 7, the positioning of the pre-package substrate 5, the supply of the liquid resin, the heating of the molding die, and the opening and closing of the molding die. In other words, the control unit 19 controls various operations in the substrate supply housing module 2, the molding modules 3A, 3B, 3C, and the resin supply module 4.

The position where the control unit 19 is arranged may be any position, and may be arranged on at least one of the substrate supply housing module 2, the molding modules 3A, 3B, 3C, and the resin supply module 4, or may be arranged on each module. Outside. In addition, the control unit 19 may be configured as a plurality of control units that are formed by separating at least a part of the control units according to operations to be controlled.

Operation of resin molding device (method of manufacturing resin molded product)

Referring to FIGS. 1 to 2, an operation of resin-molding a wafer mounted on a substrate in a resin molding apparatus 1 to perform resin encapsulation will be described. The description here is also a description of a method for manufacturing a resin molded article. A case where the molding module 3B is used as the operation of the resin molding apparatus 1 will be described below.

First, for example, for the package front substrate 5 on which the wafer 22 (see FIG. 2 (a)) is mounted, the surface on which the wafer 22 is mounted is the lower side, and the package front substrate 5 is sent out from the package front substrate supply unit 6 To the substrate mounting portion 9. Next, the substrate transport mechanism 10 is moved from the predetermined position S1 in the + Y direction to receive the pre-package substrate 5 from the substrate mounting portion 9. The substrate transfer mechanism 10 is returned to the predetermined position S1.

Next, for example, the substrate transport mechanism 10 is moved from the predetermined position S1 in the + X direction to the predetermined position M1 of the molding module 3B. Next, in the molding module 3B, the substrate transfer mechanism 10 is moved in the + Y direction and stopped at a predetermined position C1 below the upper mold 23 (see (a) in FIG. 2). The upper mold 23 and the lower mold 12 together constitute a molding mold 24 (see (a) of FIG. 2). Next, the substrate transport mechanism 10 is raised to supply the pre-package substrate 5 to the mold surface of the upper mold 23.

Next, the pre-package substrate 5 is positioned at a predetermined position on the mold surface of the upper mold 23 using a positioning mechanism (see (a) in FIG. 3). The camera 11 provided in the substrate conveyance mechanism 10 can be used to verify whether or not the pre-package substrate 5 is normally positioned at a predetermined position on the mold surface of the upper mold 23. The operation of determining whether or not the pre-package substrate 5 is normally positioned at a predetermined position on the mold surface of the upper mold 23 will be described later (refer to FIGS. 3 to 5). The substrate transfer mechanism 10 is returned to the predetermined position S1 of the substrate supply storage module 2.

Next, the dispenser 16 is used to move the dispenser 16 from the predetermined position R1 of the resin supply module 4 in the −X direction to the predetermined position M1 of the molding module 3B. Next, in the molding module 3B, the dispenser 16 is used to move the dispenser 16 from the predetermined position M1 to the predetermined position C1 in the + Y direction. As shown in FIG. 2 (a), the release film 25 is supplied to the cavity 14 of the lower mold 12 by the release film supply mechanism 15 (see FIG. 1). Next, a predetermined amount of the liquid resin 26 is ejected from the resin ejection portion 18 of the dispenser 16 into the cavity 14. After the ejection of the liquid resin 26 is completed, the resin transport mechanism 17 is returned to the predetermined position R1.

Next, as shown in FIG. 2 (b), the lower mold 12 is raised by the mold clamping mechanism 13 (see FIG. 1), and the upper mold 23 and the lower mold 12 are clamped. By performing mold clamping, the wafer 22 mounted on the pre-package substrate 5 is immersed in the liquid resin 26 supplied to the cavity 14. At this time, a cavity bottom member (not shown) provided in the lower mold 12 may be used to apply a predetermined resin pressure to the liquid resin 26 in the cavity 14.

In addition, during the mold clamping process, a vacuuming mechanism (not shown) may be used to suck the inside of the mold cavity 14. Accordingly, air remaining in the cavity 14 and air bubbles and the like contained in the liquid resin 26 are discharged to the outside of the molding die 24. The cavity 14 is set to a predetermined degree of vacuum.

Next, a heater (not shown) provided in the lower mold 12 is used to heat the liquid resin 26 for the time required to cure the liquid resin 26. The liquid resin 26 is cured to form a cured resin 27. Accordingly, the wafer 22 mounted on the pre-package substrate 5 is resin-encapsulated with the cured resin 27 molded in accordance with the shape of the cavity 14.

Next, as shown in FIG. 2 (c), after the liquid resin 26 is cured, the upper mold 23 and the lower mold 12 are opened using the mold clamping mechanism 13. On the mold surface of the upper mold 23, a molded product 28 (the packaged substrate 7) encapsulated with a resin is fixed.

Next, the substrate transfer mechanism 10 is moved from a predetermined position S1 of the substrate supply storage module 2 to a predetermined position C1 below the upper mold 23 to receive the packaged substrate 7. Next, the substrate transport mechanism 10 is moved to deliver the packaged substrate 7 to the substrate mounting portion 9. The packaged substrate 7 is stored in the packaged substrate storage portion 8 from the substrate mounting portion 9. At this stage, resin packaging is completed.

In the resin molding apparatus 1, the control unit 19 (refer to FIG. 1) supplies the pre-package substrate 5, the positioning of the pre-package substrate 5, the supply of the release film 25, the movement of the resin transport mechanism 17, and the liquid resin 26. Operations such as ejection, mold clamping and opening of the upper mold 23 and the lower mold 12, and storage of the substrate 7 after packaging are controlled.

Positioning operation and verification operation of the substrate (part of a method for manufacturing a resin molded product)

The positioning operation of the pre-package substrate 5 supplied to the molding die 24 and the operation of verifying whether the supplied pre-package substrate 5 is normally positioned will be described with reference to FIGS. 3 to 5. The description here is also a part of a method for manufacturing a resin molded article. In this embodiment, a case where the pre-package substrate 5 is supplied to the upper mold 23 of the molding mold 24 is illustrated.

As shown in FIG. 3 (a), on the mold surface (lower surface) of the upper mold 23, for example, reference marks 29 in the X direction and reference marks 30 in the Y direction are respectively provided. The reference marks 29 and 30 are reference marks for verifying whether or not the pre-package substrate 5 supplied to the mold surface of the upper mold 23 is normally positioned. The reference marks 29 and 30 may be marks that can be recognized by the camera 11 provided on the substrate conveyance mechanism 10, and are not particularly limited to pattern shapes such as straight lines, dots, and curves, and uneven shapes and colors on the surface. In the first embodiment, an example in which a linear convex pattern is used as a reference mark is drawn. In addition, when the reference mark is a convex pattern, if the height of the convex portion is made smaller than the thickness of the substrate 5 before the package, there is no obstacle when the mold 24 is closed. In a case where the fiducial mark is a convex pattern and it is possible to use a package front substrate 5 which is thinner than the height of the convex portion, a concave portion may be provided in a mold surface portion of the lower mold 12 facing the convex portion.

In the upper mold 23 of this embodiment, on the mold surface opposite to the mold surface on which the reference mark 29 is provided, a positioning pin 31 is provided for positioning the package front substrate 5 in the Y direction. Positioning parts. On a mold surface opposite to the mold surface on which the reference mark 30 is provided, a positioning pin 32 is provided, and the positioning pin 32 is a positioning member for positioning the front package substrate 5 in the X direction. The positioning pins 31 and 32 are provided, for example, in at least two in the X direction and the Y direction.

As shown in FIG. 3 (b), in a state where the molding die 24 is opened, the positioning pins 31 and 32 protrude from the die surface of the upper die 23. In a state where the molding die 24 is closed, the positioning pins 31 and 32 are pushed up by the die surface of the lower die 12 and are stored in the upper die 23. Further, for example, the positioning pins 31 and 32 may be configured to be supported by an elastic member such as a spring. In addition, the positioning pins 31 and 32 may not be movable, and they may be avoided from opening holes provided in the lower mold 12.

Referring to FIG. 3, an operation of positioning the pre-package substrate 5 to a predetermined position on the mold surface of the upper mold 23 will be described. First, as shown in FIG. 3 (b), the substrate conveyance mechanism 10 in which the pre-package substrate 5 is housed is moved to a predetermined position between the upper mold 23 and the lower mold 12. Next, the substrate transfer mechanism 10 is raised to transfer the pre-package substrate 5 from the substrate transfer mechanism 10 to the mold surface of the upper mold 23. Next, as shown in FIG. 3 (a), the positioning mechanisms 33 and 34 provided on the upper mold 23 are used to push the end faces of the package substrate 5 to the positioning pins 31 and 32, respectively. The positioning mechanisms 33 and 34 may be provided in the substrate transfer mechanism 10.

In this embodiment, a case where the long-side direction of the package front substrate 5 is arranged in the X direction and the short-side direction of the package front substrate 5 is arranged in the Y direction is illustrated. Hereinafter, the end surface of the package front substrate 5 in the longitudinal direction is referred to as an end surface of the package front substrate 5 in the X direction. Similarly, the end surface in the short-side direction of the package front substrate 5 is referred to as the end surface in the Y direction of the package front substrate 5.

First, the positioning mechanism 33 is used to push the end surface of the package front substrate 5 in the X direction against the two positioning pins 31. Accordingly, the end surface of the front substrate 5 in the X direction is positioned at a predetermined position on the mold surface of the upper mold 23. Next, the positioning mechanism 34 is used to push the end surface in the Y direction of the package front substrate 5 against the two positioning pins 32. According to this, the end surface of the front substrate 5 in the Y direction is positioned to a predetermined position on the mold surface of the upper mold 23.

The front packaging substrate 5 is pushed against the positioning pins 31 and 32 by using the positioning mechanisms 33 and 34 to position the front packaging substrate 5 to a predetermined position on the mold surface of the upper mold 23. After the pre-package substrate 5 is positioned at a predetermined position, the pre-package substrate 5 is vacuum-adsorbed by an adsorption mechanism (not shown) to be fixed to the mold surface of the upper mold 23. In this state, the positioning of the pre-package substrate 5 with respect to the upper mold 23 is completed.

In this case, using the positioning mechanisms 33 and 34 provided in the upper mold 23, the positioning of the front package substrate 5 with respect to the Y direction and the X direction is performed separately. It is not limited to this, and it can be set as the structure which linked the positioning mechanisms 33 and 34. Accordingly, the positioning of the pre-package substrate 5 with respect to the Y direction and the X direction can be performed simultaneously.

As the pre-package substrate 5, for example, a lead frame, a printed circuit board, a ceramic substrate, a film-based substrate, or the like is used. A mark 35 for position alignment is appropriately provided on the pre-package substrate 5 as necessary. The mark 35 for position alignment provided on the pre-package substrate 5 can be used as a mark for verifying the positioning of the pre-package substrate 5. In FIG. 3, an example in which the alignment marks 35 are provided on the four corners of the pre-package substrate 5 is shown.

The operation of verifying whether the pre-package substrate 5 supplied to the upper mold 23 is normally positioned will be described with reference to FIG. 4. The basic verification operation is performed as follows.

First, using the camera 11 provided in the substrate transfer mechanism 10, an area including the pre-package substrate 5 and the reference mark 29 and an area including the pre-package substrate 5 and the reference mark 30 are photographed, respectively. Next, the distance between the pre-package substrate 5 and the reference mark 29 and the distance between the pre-package substrate 5 and the reference mark 30 are measured based on each image data captured by the camera 11. The measured distance is compared with a preset allowable range, and if it is within the allowable range, it is determined that the pre-package substrate 5 is positioned normally, and the molding die 24 is closed to perform resin sealing. If the measured distance deviates from the allowable range, it is determined that the pre-package substrate 5 is not positioned normally, and the advancement to the next step (clamping) is stopped.

Hereinafter, an operation for verifying whether the substrate 5 before the package is normally positioned will be specifically described. In this embodiment, for example, as shown in FIG. 4A, the distance Y1 between the arbitrary position P1 of the end portion in the X direction of the front substrate 5 and the reference mark 29 and the front substrate The distance X2 between the arbitrary position P2 of the end portion along the Y direction of 5 and the reference mark 30 is measured separately to verify whether the pre-package substrate 5 is properly positioned.

First, as shown in (a) of FIG. 4, the camera 11 provided on the substrate transport mechanism 10 is moved to an area A1 including the position P1 of the end portion in the X direction of the front substrate 5 and the reference mark 29. Shooting location. At this position, the area A1 is photographed by the camera 11 to obtain the image data D1. The acquired image data D1 is stored in a memory 20 (see FIG. 1) incorporated in the control unit 19 (see FIG. 1).

Next, the camera 11 is moved to a position where the position P2 of the end portion in the Y direction of the package front substrate 5 and the area A2 of the reference mark 30 can be captured. At this position, the area A2 is photographed by the camera 11 to obtain image data D2. The acquired image data D2 is stored in the memory 20 incorporated in the control unit 19.

Next, using the processor 21 (see FIG. 1) incorporated in the control unit 19, the image data D1 and D2 obtained in the respective regions A1 and A2 are taken from the memory 20 and image processing is performed. Accordingly, the distance Y1 between the position P1 of the end portion in the X direction of the pre-package substrate 5 and the reference mark 29 and the position P2 of the end portion in the Y direction of the front package substrate 5 and the reference mark 30 can be measured. The distance X2. As an example of specific image processing, edge detection can be performed on the ends of the corresponding front substrate 5 and the edges of the reference marks 29 and 30 to determine the distance between the edges of the two.

Next, the processor 21 compares the distances Y1 and X2 measured respectively with a preset reference value T0. Here, the reference value T0 is a design distance (design value) between the end of the package front substrate 5 and the reference marks 29 and 30 when the package front substrate 5 is normally positioned at a predetermined position on the mold surface of the upper mold 23. As the reference value T0, it is assumed that the same value is set in the X direction and the Y direction.

With reference to FIG. 5, three modes that occur when the pre-package substrate 5 is positioned on the mold surface of the upper mold 23 will be described. The three forms refer to: (a) a state in which the front substrate 5 is normally positioned; (b) a state in which the front substrate 5 is not positioned normally and the front substrate 5 is not in contact with the positioning pin; The positioning is abnormal (the positioning pin is deformed due to wear or damage).

In FIG. 5, for example, in a case where the package front substrate 5 is positioned for the X direction, three forms are illustrated. In FIG. 5, “T0” indicates a reference value (design value) showing a normal distance between the end portion of the front substrate 5 and the reference mark 30, and “d” indicates a deviation including each component, a measurement error, and the like. Allowable value for positioning of the substrate 5 before packaging. Therefore, the value (T0-d) after subtracting the allowable value d from the reference value T0 and the value (T0 + d) after adding the allowable value d to the reference value T0 are the ranges indicating that the substrate 5 before the package is normally positioned. The allowable limit value. The reference value T0 and the allowable value d have the same value in the X direction and the Y direction. In this case, the allowable range in both the X direction and the Y direction is from (T0-d) to (T0 + d). Here, in order to set the allowable range, the same allowable value d is set on both the positive and negative sides with respect to the reference value T0, but different values may be set as the allowable values on the positive and negative sides.

As shown in (a) of FIG. 5, if the distance X2 measured for the X direction is (T0-d) ≤ X2 ≤ (T0 + d), it is determined that the front substrate 5 is sealed against the mold surface of the upper mold 23. The X direction is positioned normally. In other words, it is a state where the end surface of the front substrate 5 in the Y direction is normally in contact with the positioning pin 32.

Similarly, if the distance Y1 measured in the Y direction (refer to FIG. 4) is (T0-d) ≦ Y1 ≦ (T0 + d), it is determined that the front substrate 5 is in the Y direction of the mold surface of the upper mold 23. Being positioned normally. In this case, it is determined that the pre-package substrate 5 is normally positioned for the X direction and the Y direction, and is advanced to the mold clamping step as the next step.

As shown in (b) of FIG. 5, if the distance X2 measured in the X direction is X2 <(T0-d), it is determined that the X direction of the package substrate 5 against the mold surface of the upper mold 23 is not properly positioned. . In other words, it is a state where the end surface of the front substrate 5 in the Y direction is not in contact with the positioning pin 32. In this case, it is determined that the pre-package substrate 5 is not positioned normally in the X direction, and the advancement to the next step is stopped.

Even if the distance X2 measured for the X direction is normal, that is, (T0-d) ≤ X2 ≤ (T0 + d), if the distance Y1 measured for the Y direction is Y1 <(T0-d), then the front substrate 5 of the package It is also determined that the Y-direction of the pre-package substrate 5 with respect to the mold surface of the upper mold 23 is not properly positioned, and the advancement to the next step is stopped. Therefore, when any one of the distances X2 and Y1 measured for the X and Y directions deviates from the allowable limit value (X2 or Y1 <(T0-d)), it is determined that the pre-package substrate 5 is not positioned properly, and Stop moving to the next step. When it is determined that the pre-package substrate 5 is not positioned normally, after confirming the state of the resin molding apparatus 1, the positioning of the pre-package substrate 5 is performed at least once again.

As shown in FIG. 5 (c), if the distance X2 measured in the X direction is X2> (T0 + d), it is determined that an abnormality may occur in the upper mold 23. In this case, there is a possibility that the positioning pin 32 is deformed due to abrasion, damage, or the like that exceeds the allowable value d. This is because if the positioning pin 32 is not deformed beyond the allowable value d, it is impossible to achieve X2> (T0 + d).

Similarly, if the distance Y1 measured in the Y direction is Y1> (T0 + d), it is determined that the positioning pin 31 may be deformed by abrasion, damage, or the like exceeding the allowable value d. When any one of the distances X2 and Y1 measured in the X direction and the Y direction deviates from the allowable limit value (X2 or Y1> (T0 + d)), a signal indicating that an abnormality has occurred in the resin molding apparatus 1 is sent, and it is confirmed Replace the positioning pins 31 and 32 with each other.

In this way, it is possible to judge the three forms generated when the pre-package substrate 5 is positioned on the mold surface of the upper mold 23. Therefore, when it is determined that the pre-package substrate 5 is positioned normally, the next step is advanced. When it is determined that the pre-package substrate 5 is not positioned properly or an abnormality occurs in the molding die, the next step is stopped. Accordingly, it is possible to prevent the occurrence of molding defects due to positioning.

Data processing for positioning verification of substrates

An example of basic data processing in the above-mentioned substrate positioning verification operation will be described using a functional block diagram, FIG. 6 and a flowchart, FIG. 7.

In FIG. 6, the camera C corresponds to the camera 11 in FIGS. 1, 3, and 4, the processor P corresponds to the processor 21 in FIG. 1, and the memory M stores a preset allowable range. The memory may be the same as or different from the memory 20 in FIG. 1. The information output unit O is used to output the information to the outside when it is determined that the substrate is not positioned normally. For example, a display device may be used, or a display device of the operation portion of the resin molding device 1 may be used in common.

As shown in FIG. 7, after the process is started, in S11, the positioning operation of the front package substrate 5 by the positioning mechanisms 33 and 34 is performed on the mold surface of the upper mold 23. The positioning operation by the positioning mechanisms 33 and 34 may be instructed by the processor P, or may be instructed by other processors in the control unit 19.

In S12, the processor P requests the camera C for image data for measuring the distance X between the reference mark 30 and the front package substrate 5 and the distance Y between the reference mark 29 and the front package substrate 5. The camera C outputs the captured image data D to the processor P. The processor P obtains the image data D from the camera C, and uses the image data D to obtain the distance X between the reference mark 30 and the front substrate 5 and the distance Y between the reference mark 29 and the front substrate 5. In the foregoing description, it is assumed that the image data D is taken into the memory 20, but the image data D may be directly acquired by the processor P from the camera C as described herein.

In S13, the processor P reads the minimum value of the allowable range (the smaller value of the allowable limit value), that is, (T0-d) from the memory M, and compares it with the distances X and Y. As a result of the comparison, if both the distances X and Y are greater than the allowable limit value (T0-d), the process proceeds to S14, and if at least one of X and Y is less than the allowable limit value (T0-d), the process proceeds to S15.

In S14, the processor P reads the maximum value of the allowable range (the larger value of the allowable limit value), that is, (T0 + d) from the memory M, and compares it with the distances X and Y. As a result of the comparison, if both the distances X and Y are less than the allowable limit value (T0 + d), the process proceeds to process A, and if at least one of X and Y is less than the allowable limit value (T0 + d), the process proceeds to process B.

The advancement to the process A should be determined by the processor P in S13 and 14 as having performed normal substrate positioning.

The process A is a process performed by the processor P to end the positioning operation and the positioning verification operation and proceed to the next step. Specifically, the processor P instructs the substrate transport mechanism 10 and the positioning mechanisms 33 and 34 to escape from between the upper mold 23 and the lower mold 12 and advances to the lower mold clamping step. At this time, the processor P may instruct the information output unit O to output information indicating that the normal substrate positioning is completed and the process is shifted to the next clamping step.

The advancement to the processing B should be determined by the processor P in S13 and 14 that the normal substrate positioning is not performed and the positioning pins 31 or 32 may be deformed. In other words, it should be the state where the processor P judges that the substrate is invading to the position where the positioning pins 31 or 32 should be located.

The process B is a process performed by the processor P to end the positioning operation and the positioning verification operation and stop the steps for resin molding. Specifically, the processor P instructs the substrate transport mechanism 10 and the positioning mechanisms 33 and 34 to escape from between the upper mold 23 and the lower mold 12 and does not proceed to the lower mold clamping step. At this time, the processor P instructs the information output unit O to output information indicating, for example, that normal substrate positioning cannot be performed, that the positioning pins 31 or 32 may be deformed, or that the positioning pins are inspected. As the output information, other contents such as stopping the resin molding step due to failure to perform a normal positioning operation may be used.

The advance to S15 should be judged by the processor P as not to contact the positioning pins 31 or 32 even though the front substrate 5 is packaged even if the positioning operation by the positioning mechanisms 33 and 34 is performed.

In S15, the processor P refers to a set value related to the preset number of positioning operations, and compares it with a value obtained by counting the number of positioning operations performed. The setting value related to the number of times may be stored in the memory M in advance, or may be stored in other memories in advance. If the result of the comparison is that the statistical value is less than the set value, the positioning operation is performed again. Regarding the positioning operation here, the positioning operation by both the positioning mechanisms 33 and 34 may not be performed. At least the positioning operation performed by the positioning mechanism corresponding to a value smaller than the allowable limit value (T0-d) in the comparison result of S13 can be performed.

In the second and subsequent processes, the comparison process with the distances X and Y may not be performed in S13. At least a comparison process with respect to a value corresponding to a value smaller than the allowable limit value (T0-d) in the comparison result of the previous S13 may be performed.

If the comparison result of S15 is that the statistical value is greater than the set value, it proceeds to process C.

The advancement to the process C should be determined by the processor P as not performing normal substrate positioning and the pre-package substrate 5 may not be in contact with the positioning pins 31 or 32 for some reason.

The process C is a process performed by the processor P to end the positioning operation and the positioning verification operation and stop the steps for resin molding. Specifically, the processor P instructs the substrate transport mechanism 10 and the positioning mechanisms 33 and 34 to escape from between the upper mold 23 and the lower mold 12 and does not proceed to the lower mold clamping step. At this time, the processor P instructs the information output unit O to output, for example, that the normal substrate positioning cannot be performed, the pre-package substrate 5 may not contact the positioning pins 31 or 32 for some reasons, or the positioning pins and the positioning mechanism may be prompted. Information for inspection. As the output information, other contents such as stopping the resin molding step due to failure to perform a normal positioning operation may be used.

In addition, the process of S15 may be omitted, and if at least one of the distances X and Y is smaller than the allowable limit value (T0-d) in the comparison result of S13, the process shifts to the process C.

In the above manner, data processing in the positioning verification operation of the substrate can be performed. In addition, in the description here, even if the distances X and Y are multiple as in the description of the second embodiment and later, the data processing can be performed in the same manner. For the sake of simplicity, only "X" and "Y" are marked. "And explained. In addition, the image data D is actually a plurality of data, but for the sake of simplicity, only the description is given with “D”. Therefore, the same description will not be repeated after Embodiment 2 described later.

Effect

In this embodiment, the resin molding apparatus 1 is configured to include a molding die 24 having an upper mold 23 as a first mold and a lower mold 12 as a second mold arranged to face each other; and a substrate supply mechanism 10 The substrate is supplied to the mold surface of the upper mold 23 which is any one of the upper mold 23 and the lower mold 12; the positioning mechanisms 33, 34, on the mold surface, face the package front substrate 5 as a positioning object including at least the substrate Positioning; mold clamping mechanism 13 to mold the mold 24; the camera 11 (C) can be arranged between the upper mold 23 and the lower mold 12 in a state where the mold 24 is opened; and the processor 21 (P), processing is performed based on the image data captured by the camera 11 (C).

Further, the upper mold 23, which is a mold, has reference marks 29 and 30 for positioning that can be recognized by the imaging of the camera 11 (C), and the camera 11 (C) is positioned on the positioning mechanism 33 and 34. The front package substrate 5 and the reference marks 29 and 30 are photographed. The processor 21 (P) determines whether the front package substrate 5 is based on the image data of the front package substrate 5 and the reference marks 29 and 30 captured by the camera 11 (C). Being positioned normally.

With such a configuration, it is possible to perform resin molding and resin encapsulation while verifying that the pre-package substrate 5 supplied to the molding die 24 is normally positioned, thereby reducing the occurrence of molding defects due to positioning. Therefore, when it is determined that the pre-package substrate 5 is normally positioned, resin packaging by resin molding is performed. When it is determined that the pre-package substrate 5 is not positioned normally, the resin packaging by resin molding is stopped.

In addition, in the present embodiment, the upper mold 23 as a mold has positioning pins 31 and 32 which are used for positioning by contacting the package front substrate 5 as a positioning object. The positioning mechanisms 33 and 34 perform positioning by contacting the front substrate 5 with the positioning pins 31 and 32.

According to this structure, even if the positioning pins 31 and 32 are deformed by abrasion, damage, or the like, it is possible to reduce the occurrence of molding defects due to positioning.

In addition, the processor 21 (P) obtains the front substrate 5 and the reference marks 29, 30 based on the image data of the front substrate 5 and the reference marks 29, 30 as positioning objects, which are captured by the camera 11 (C). The information related to the distance between 30 and 30 is compared with a preset allowable range to determine whether the substrate 5 before packaging is normally positioned.

According to this structure, it is possible to more reliably reduce the occurrence of molding defects due to positioning.

In this embodiment, when the processor 21 (P) determines that the pre-packaged substrate 5 as a positioning object does not contact at least a part of the positioning pins 31 and 32 as a positioning member, the positioning mechanisms 33 and 34 perform at least one more time. Positioning operation.

According to this configuration, the possibility of completing the normal substrate positioning can be increased, and the productivity can be improved.

In more detail, according to this embodiment, in a state where the pre-package substrate 5 is positioned on the upper mold 23, the positions P1 and P2 of the ends including the package front substrate 5 by the camera 11 and The areas A1 and A2 of the fiducial marks 29 and 30 are respectively photographed to obtain image data D1 and D2. Based on the acquired image data D1 and D2, the processor 21 measures the distances Y1 and X2 between the ends P1 and P2 of the package front substrate 5 and the reference marks 29 and 30, respectively. The processor 21 compares these distances Y1 and X2 with a preset reference value T0 to verify whether the pre-package substrate 5 is normally positioned at a predetermined position of the upper mold 23.

There are three types of states before the package substrate 5 is positioned on the mold surface of the upper mold 23. The first aspect is a state in which the pre-package substrate 5 is normally positioned at a predetermined position of the upper mold 23. In this case, the mold clamping as the next step is performed. The second form is a state in which the pre-package substrate 5 is not positioned normally and the pre-package substrate 5 is not in contact with the positioning pins 31 and 32. In this case, temporarily stop the resin encapsulation by resin molding, and perform positioning at least once more. The third mode is a state where an abnormality has occurred in the positioning of the substrate 5 before the package. Since a state that is not possible originally occurs, the positioning pins 31 and 32 may be deformed due to wear, damage, or the like exceeding the allowable value. In this case, a signal indicating that an abnormality has occurred in the device is transmitted, and the state of the device is investigated to respond. The processor 21 can perform data processing based on the image data captured by the camera 11 so that the three modes can be determined.

According to this embodiment, the processor 21 performs image processing based on the image data captured by the camera 11. By comparing the distance measured by the image processing measurement with a reference value, it is determined whether the pre-package substrate 5 is normally positioned at a predetermined position of the upper mold 23. Accordingly, when it is not normally positioned or when an abnormality occurs in the device, the advancement to the next step is stopped. Therefore, resin molding is not performed for resin packaging in a state where the substrate 5 before packaging is not normally positioned, so that occurrence of molding defects due to positioning can be reduced.

In the present embodiment, the camera 11 captures the position of the end of the package front substrate 5 and the area of the fiducial marks 29 and 30 provided on the upper mold 23 to obtain image data. In this case, the position of the end portion of the substrate 5 before packaging is recognized by the camera 11. The position at which the pre-package substrate 5 is identified is not limited to the position of the end portion of the pre-package substrate 5. For example, as shown in FIG. 3, the positional alignment marks 35 provided on the four corners of the package front substrate 5 may be identified. Further, it may be a pattern or a wafer formed on the inside of the substrate 5 before the package, such as an object that can be recognized by the camera 11.

In this embodiment, as means for positioning the pre-package substrate 5, positioning mechanisms 33 and 34 provided on the upper mold 23 are used. Not limited to this, a positioning mechanism may be provided in the substrate transfer mechanism 10. After the substrate transport mechanism 10 delivers the pre-package substrate 5 to the mold surface of the upper mold 23, the positioning mechanism provided on the substrate transport mechanism 10 is used to push the pre-package substrate 5 against the positioning pins 31 and 32, respectively. Accordingly, the pre-package substrate 5 can be positioned at a predetermined position on the mold surface of the upper mold 23. By providing the positioning mechanism in the substrate transfer mechanism 10, the structure of the resin molding apparatus 1 can be further simplified.

Further, the substrate transport mechanism 10 itself may be used as a positioning mechanism. In the case of using the substrate transport mechanism 10 itself as a positioning mechanism, the substrate transport mechanism 10 is used to move the pre-package substrate 5 in the Y and X directions while delivering the package substrate 5 to the mold surface of the upper mold 23. , So that the end faces of the package front substrate 5 are pushed against the positioning pins 31 and 32, respectively. Accordingly, the pre-package substrate 5 can be positioned at a predetermined position on the mold surface of the upper mold 23. By using the substrate transport mechanism 10 itself as a positioning mechanism, the structure of the resin molding apparatus 1 can be further simplified.

In this embodiment, on the mold surface opposite to the mold surface on which the reference mark 29 is provided, a positioning pin 31 is provided for positioning the package front substrate 5 in the Y direction. Similarly, on the mold surface opposite to the mold surface on which the reference mark 30 is provided, a positioning pin 32 is provided for positioning the package front substrate 5 in the X direction. Not limited to this, a positioning pin 31 for positioning the package front substrate 5 in the Y direction may be provided on a mold surface on the same side where the reference mark 29 is provided, and may be provided on a mold surface on the same side where the reference mark 30 is provided. A positioning pin 32 for positioning the package front substrate 5 in the X direction. In this case, the magnitude relationship between the distance measured and the allowable limit value shown in (b) and (c) of FIG. 5 is reversed. Therefore, in the description referring to FIGS. 6 and 7, the magnitude relationship between the distances X and Y and the allowable limit value is also reversed.

In this embodiment, three molding modules 3A, 3B, and 3C are arranged and mounted between the substrate supply storage module 2 and the resin supply module 4 in the X direction. The substrate supply storage module 2 and the resin supply module 4 may be set as one module, and a molding module 3A may be arranged and installed in the X direction on the module. Further, another forming module 3B may be mounted on the forming module 3A. Accordingly, it is possible to increase or decrease the molding modules 3A, 3B,... According to the production form or production volume. Therefore, since the structure of the resin molding apparatus 1 can be optimized, productivity can be improved.

In addition, in the present embodiment, a configuration including a substrate supply housing module 2, three molding modules 3A, 3B, 3C, and a resin supply module 4 as the resin molding apparatus 1 has been described. The resin molding apparatus is not limited to this structure, as long as it is a device that includes at least a molding mold, a dispenser for supplying liquid resin, and a mold clamping mechanism that molds the molding mold and has a function of performing resin molding.

Since a relatively rigid substrate such as a ceramic substrate is used as the substrate, the positioning pin is easily deformed. This embodiment is particularly effective in this case. In addition, it is particularly effective when an optical resin portion such as a lens portion is used to resin-encapsulate an optical wafer such as an LED or a photodiode that requires relatively high position accuracy.

Embodiment 2

The operation of verifying whether the pre-package substrate 5 supplied to the upper mold 23 is properly positioned in the second embodiment will be described with reference to FIGS. 8 to 9. The difference from the first embodiment is that the positioning is verified by photographing two positions at the ends of the front substrate 5 in the X direction and the Y direction, respectively. Accordingly, it is possible to verify whether positioning is performed normally not only in the X and Y directions but also in the θ direction. The other operations (manufacturing methods) and the structure of the molding die are the same as those in the first embodiment, and therefore descriptions thereof are omitted.

Substrate positioning verification operation (part of a method for manufacturing a resin molded product)

Hereinafter, an operation of verifying whether the pre-package substrate 5 is properly positioned in the second embodiment will be described. The description here is also a part of a method for manufacturing a resin molded article. In this embodiment, for example, as shown in FIG. 8 (a), the distances Y3 and Y4 between the arbitrary positions P3 and P4 of the ends in the X direction of the package front substrate 5 and the reference marks 29 are respectively performed. Measure. Similarly, the distances X5 and X6 between the arbitrary positions P5 and P6 of the ends in the Y direction of the package front substrate 5 and the reference mark 30 are measured, respectively. By measuring the distance between the positions of these four points and the reference mark, it is possible to verify whether the pre-package substrate 5 is normally positioned in the X direction, the Y direction, and the θ direction.

First, as shown in (a) of FIG. 8, the camera 11 provided on the substrate transport mechanism 10 is moved to an area A3 including the position P3 of the X-direction end portion of the front substrate 5 and the reference mark 29. Shooting location. At this position, the camera 11 captures the area A3 to obtain the image data D3. The acquired image data D3 is stored in the memory 20 incorporated in the control unit 19.

Next, the camera 11 is moved to a position where an image of the area A4 including the position P4 of the end portion of the front substrate 5 in the X direction and the reference mark 29 can be captured. At this position, the camera 11 captures the area A4 to obtain the image data D4. The acquired image data D4 is stored in the memory 20 incorporated in the control unit 19.

Next, the camera 11 is moved to a position where the region P5 including the end portion of the front substrate 5 in the Y direction and the reference mark 30 can be imaged. At this position, the camera 11 captures the area A5 to obtain the image data D5. The acquired image data D5 is stored in the memory 20 incorporated in the control unit 19.

Next, the camera 11 is moved to a position capable of capturing an image of an area A6 including the position P6 of the end portion in the Y direction of the package front substrate 5 and the reference mark 30. At this position, the camera 11 captures the area A6 to obtain the image data D6. The acquired image data D6 is stored in the memory 20 incorporated in the control unit 19.

Next, using the processor 21 incorporated in the control unit 19, the image data D3, D4, D5, and D6 obtained in the respective areas A3, A4, A5, and A6 are taken from the memory 20 and image processing is performed. The distances Y3 and Y4 between the positions P3 and P4 of the X-direction end portions of the front substrate 5 and the reference mark 29 are measured, respectively. Similarly, the distances X5 and X6 between the arbitrary positions P5 and P6 of the ends in the Y direction of the package front substrate 5 and the reference mark 30 are measured, respectively.

Next, the processor 21 compares the measured distances Y3 and Y4 and X5 and X6 with a preset reference value T0, respectively. According to this, it is possible to verify the four forms generated when the pre-package substrate 5 is positioned on the mold surface of the upper mold 23.

Referring to FIG. 9, four modes generated when the pre-package substrate 5 is positioned on the mold surface of the upper mold 23 will be described. The four forms refer to: (a) the state before the package substrate 5 is normally positioned; (b) the state before the package substrate 5 is not properly positioned and the package substrate 5 does not contact the two positioning pins; (c) before the package A state in which the positioning of the substrate 5 is abnormal (the positioning pin is deformed due to abrasion, damage, or the like); (d) A state in which a position shift in the θ direction occurs.

In FIG. 9, for example, in a case where the package front substrate 5 is positioned in the X direction, four modes are described. As in Embodiment 1, "T0" is a reference value indicating the normal distance between the end of the package front substrate 5 and the reference mark 30, and "d" is the positioning of the package front substrate 5 including deviations and measurement errors. And the allowable value. (T0-d) and (T0 + d) are allowable limit values indicating a range in which the substrate 5 before the package is normally positioned.

As shown in (a) of FIG. 9, if the distances X5 and X6 measured in the X direction are (T0-d) ≤ X5 and X6 ≤ (T0 + d), it is determined that the front substrate 5 for packaging is directed toward the upper mold 23 The X direction of the mold surface is positioned normally. In other words, it is a state where the end surface of the front substrate 5 in the Y direction is normally in contact with the positioning pin 32.

Similarly, if the distances Y3 and Y4 measured for the Y direction are (T0-d) ≤ Y3 and Y4 ≤ (T0 + d), it is determined that the Y direction of the front substrate 5 against the mold surface of the upper mold 23 is normal. Positioning. Since there are two positions for the X direction and two positions for the Y direction, they are normally positioned, so it can be determined that they are also positioned normally for the θ direction. Therefore, in this case, it is determined that the pre-package substrate 5 is normally positioned with respect to the X direction, the Y direction, and the θ direction, and proceeds to the mold clamping step as the next step.

As shown in (b) of FIG. 9, if the distances X5 and X6 measured in the X direction are X5 <(T0-d) and X6 <(T0-d), it is determined that the front substrate 5 for packaging is directed to the upper mold 23. The X-direction of the mold surface is not properly positioned. In other words, it is a state where the end surface of the front substrate 5 in the Y direction is not in contact with the two positioning pins 32.

Similarly, if the distances Y3 and Y4 measured for the Y direction are Y3 <(T0-d) and Y4 <(T0-d), it is determined that the Y direction of the package substrate 5 against the mold surface of the upper mold 23 is not In the normal positioning, the end surface of the front substrate 5 in the X direction does not contact the two positioning pins 31. In this case, it is determined that the pre-package substrate 5 is not positioned normally for the X direction or the Y direction, and the advancement to the next step is stopped.

As shown in (c) of FIG. 9, if the distances X5 and X6 measured in the X direction are X5> (T0 + d) and X6> (T0 + d), it is determined that the upper mold 23 may be abnormal. . In this case, there is a possibility that the positioning pin 32 is deformed due to abrasion, damage, or the like that exceeds the allowable value d.

Similarly, if the distances Y3 and Y4 measured in the Y direction are Y3> (T0 + d) and Y4> (T0 + d), it is determined that the upper mold 23 may be abnormal. In this case, a signal indicating that an abnormality has occurred in the resin molding apparatus 1 is transmitted, and the states of the positioning pins 31 and 32 are confirmed, and measures such as replacement are performed.

As shown in (d) of FIG. 9, for example, if the distances X5 and X6 measured in the X direction are (T0-d) ≦ X5 ≦ (T0 + d) and X6 <(T0-d), it is determined as The pre-package substrate 5 is shifted in position in the θ direction on the mold surface of the upper mold 23. In this case, it is not clear what the contact state between the end surface of the package front substrate 5 and the positioning pins 31 and 32 is. Regarding the distances X5 and X6 measured in the X direction, when either one is within the allowable range and the other is out of the allowable range, it can be determined that a position shift in the θ direction has occurred. In this way, by measuring the distance between the two positions of the end portion of the front substrate 5 in one direction and the reference mark at two places, the positional deviation in the θ direction can be confirmed.

Similarly, if the distances Y3 and Y4 measured in the Y direction are, for example, (T0-d) ≤Y3≤ (T0 + d) and Y3 <(T0-d), it is determined that the substrate 5 before packaging is on the upper mold 23. A positional shift in the θ direction occurred on the mold surface. In this case, it is determined that the pre-package substrate 5 has shifted in position in the X direction, the Y direction, and the θ direction, and stops advancing to the next step.

As shown in FIGS. 8 to 9, by measuring the distance from the reference mark to the two positions of the end portions of the front substrate 5 in the X direction and the Y direction, it is possible to determine Whether the Y direction and the θ direction are properly positioned. Therefore, when the measured distances of the four points are within the allowable range, it is judged that they are normally positioned and proceed to the next step. When one of the four points deviates from the allowable range, it is judged that it is not positioned normally, and the next step is stopped.

In addition, in the states shown in (b) of FIG. 9 and (d) of FIG. 9, that is, when the forms (b) and (d) of the four forms (a) to (d) described above, At least one of the values of the plurality of distances X is smaller than the minimum value of the allowable range, that is, the allowable limit value (T0-d). In these cases, by performing the positioning operation again, it is possible to place the substrate 5 in a position where it is normally positioned, so that the positioning operation can be performed at least once more.

The data processing of the positioning verification operation of the substrate in this embodiment is the same as that in the first embodiment, and therefore the description will not be repeated.

Effect

According to this embodiment, the distances Y3 and Y4 between the positions P3 and P4 of the X-direction end portions of the front substrate 5 and the reference mark 29 are measured, respectively. Similarly, the distances X5 and X6 between the arbitrary positions P5 and P6 of the ends in the Y direction of the package front substrate 5 and the reference mark 30 are measured, respectively. By comparing these measured distances Y3, Y4, X5, and X6 with a preset allowable range, it is possible to verify whether the pre-package substrate 5 is properly positioned in the X, Y, and θ directions. Therefore, it is possible to reduce the occurrence of molding defects caused by positioning.

There are four forms of the state before the package substrate 5 is positioned on the mold surface of the upper mold 23. The first aspect is a state in which the pre-package substrate 5 is normally positioned at a predetermined position of the upper mold 23. In this case, the mold clamping as the next step is performed. The second form is a state in which the pre-package substrate 5 is not positioned normally and the pre-package substrate 5 is not in contact with the two positioning pins. In this case, the end faces of the package substrate 5 are not in contact with the positioning pins 31 and 32, and the resin packaging by resin molding is temporarily stopped, and positioning is performed at least once more. The third mode is a state where an abnormality has occurred in the positioning of the substrate 5 before the package. Since a state that is not possible originally occurs, the positioning pins 31 and 32 may be deformed due to wear, damage, or the like exceeding the allowable value. In this case, a signal indicating that an abnormality has occurred in the device is transmitted, and the state of the device is investigated to respond. The fourth form is a state in which a position shift in the θ direction occurs without being positioned normally. In this case, at least one of the positioning pins 31 and 32 is not in contact with the end surface of the package front substrate 5, the resin packaging by resin molding is temporarily stopped, and positioning is performed at least once again. By performing data processing based on the image data of the four positions captured by the camera 11, the four forms can be judged.

In this embodiment, the distance between the two positions of the end portion of the package front substrate 5 in the X direction and the reference mark 29 and the two positions of the end portion of the package front substrate 5 in the Y direction and the reference The distance between the markers 30 was measured at four positions in total, and the displacements in the X, Y, and θ directions were verified. Not limited to this, the distance between the three positions of the ends of the package front substrate 5 in the X direction and the Y direction and the reference marks 29 and 30 can be measured at at least three points, so that the X direction, Y Direction and theta direction. In order to verify the deviation in the θ direction, the distance between the two points in either the X-direction end or the Y-direction end of the package front substrate 5 may be measured.

Embodiment 3

The operation of verifying whether the pre-package substrate 5 supplied to the upper mold 23 is normally positioned in the third embodiment will be described with reference to FIG. 10. The description here is also a part of a method for manufacturing a resin molded article. The difference from Embodiment 1 is that a U-shaped reference mark including X-direction and Y-direction is provided in the upper mold 23, and the position of the corner portion of the substrate is used for data processing. The structure and operation (manufacturing method) of the other molding dies are the same as those of the first embodiment, and therefore description thereof is omitted.

Hereinafter, the operation of verifying whether the pre-package substrate 5 is properly positioned in the third embodiment will be described. As shown in FIG. 10 (a), a U-shaped reference mark 36 is provided on the mold surface of the upper mold 23. In this embodiment, for example, the distances X7 and Y7 between the position P7 of the corner of the front substrate 5 and the U-shaped reference mark 36 are measured. Similarly, the distances X8 and Y8 between the position P8 of the corner portion of the front substrate 5 and the U-shaped reference mark 36 are measured. By measuring the two points X7 and X8 for the X direction and the two points Y7 and Y8 for the Y direction, it is verified whether the pre-package substrate 5 is properly positioned in the X direction, the Y direction, and the θ direction. In addition, in the image processing related to the positions P7 and P8 of the corner portions of the pre-package substrate 5, corner point detection may be used, and edge detection of two end faces that intersect at the corner portions of the pre-package substrate 5 may also be used.

First, as shown in FIG. 10 (a), the camera 11 provided on the substrate transfer mechanism 10 is moved to a position where the region P7 including the corner portion P7 of the front substrate 5 and the reference mark 36 can be imaged. At this position, the area A7 is captured by the camera 11 to obtain image data D7. The acquired image data D7 is stored in the memory 20 incorporated in the control unit 19.

Next, the camera 11 is moved to a position where the region P8 including the corner position P8 of the package front substrate 5 and the reference mark 36 can be imaged. At this position, the area A8 is photographed by the camera 11 to obtain image data D8. The acquired image data D8 is stored in the memory 20 incorporated in the control unit 19.

Next, using the processor 21 incorporated in the control unit 19, the image data D7 and D8 obtained in the respective regions A7 and A8 are taken from the memory 20 and image processing is performed. The distances X7 and Y7 between the corner portion P7 of the package front substrate 5 and the U-shaped reference mark 36 and the distances X8 and Y8 between the corner portion P8 of the package front substrate 5 and the U-shaped reference mark 36 are measured, respectively.

Next, the processor 21 compares the measured distances X7 and Y7 and X8 and Y8 with a preset reference value T0, respectively. If these distances X7, Y7, X8, and Y8 are within the allowable range, it is determined that the X, Y, and θ directions are normally positioned, and the next step is advanced.

When any one of the measured distances X7, Y7, X8, and Y8 deviates from the allowable range, it is determined that it is not positioned normally, and the advancement to the next step is stopped. In this way, it is possible to verify whether the pre-package substrate 5 is normally positioned in the X direction, the Y direction, and the θ direction.

Regarding the data processing of the positioning verification operation of the substrate of the present embodiment, the differences from the description using FIG. 6 and FIG. 7 in the first embodiment are described below.

In the comparison processing related to the distance Y of S13, the same is true for the distance Y7, but different for the distance Y8. In this embodiment, regarding the comparison processing related to the distance Y8, the processor P reads the maximum value of the allowable range (the larger value of the allowable limit value), that is, (T0 + d) from the memory M, and performs Comparison with distance Y8. If the result of the comparison is that the distance Y8 is less than the allowable limit value (T0 + d) and the other distances X7, X8, and Y7 are all greater than the allowable limit value (T0-d), the process proceeds to S14. If the result of the comparison is that the distance Y8 is greater than the allowable limit value (T0 + d) or at least one of the other distances X7, X8, and Y7 is less than the allowable limit value (T0-d), the process proceeds to S15.

In the comparison processing related to the distance Y of S14, the same is true for the distance Y7, but different for the distance Y8. In the present embodiment, regarding the comparison processing related to the distance Y8, the processor P reads the minimum value of the allowable range (the smaller value of the allowable limit value), that is, (T0-d) from the memory M, and performs Comparison with distance Y8. If the result of the comparison is that the distance Y8 is greater than the allowable limit value (T0-d) and the other distances X7, X8, and Y7 are all less than the allowable limit value (T0 + d), the process proceeds to process A. If the result of the comparison is that the distance Y8 is less than the allowable limit value (T0-d) or at least one of the other distances X7, X8, and Y7 is greater than the allowable limit value (T0 + d), the process proceeds to process B.

Processing other than S13 and S14 can be appropriately changed in accordance with these differences in S13 and S14.

In this embodiment, an example has been described in which data is processed using the positions P7 and P8 of the corners of the front substrate 5, but the data may also be processed using two end faces that intersect at the corners of the front substrate 5. deal with.

According to this embodiment, the distance X7, Y7 between the corner P7 of the package front substrate 5 and the U-shaped reference mark 36 and the distance between the corner P8 of the package front substrate 5 and the U-shaped reference mark 36 are determined. X8 and Y8 are respectively measured, so that it is possible to verify whether the pre-package substrate 5 is normally positioned in the X direction, the Y direction, and the θ direction. Therefore, it is possible to reduce the occurrence of molding defects caused by positioning.

By photographing two areas including the corners of the package front substrate 5 and the U-shaped reference mark 36 by the camera 11 provided on the substrate transport mechanism 10, it is possible to verify that the package front substrate 5 is in the X direction, the Y direction, and Whether it is positioned normally in the θ direction. Therefore, the distance for moving the camera 11 can be shortened. The number of man-hours for imaging the pre-package substrate 5 can be reduced. Accordingly, it is possible to reduce the operation of verifying whether or not the pre-package substrate 5 is normally positioned.

In this embodiment, by measuring the distance between the corner of the package front substrate 5 and the U-shaped reference mark 36, it is verified whether the package front substrate 5 is normal in the X, Y, and θ directions. Positioning. Not limited to this, for example, the distance between the alignment marks 35 and the U-shaped reference marks 36 provided at the four corners of the front substrate 5 can be measured to verify that the front substrate 5 is in the X direction and the Y direction. Whether it is normally positioned in the direction and the θ direction.

Embodiment 4

The operation of verifying whether or not the pre-package substrate 5 supplied to the upper mold 23 is normally positioned in the fourth embodiment will be described with reference to FIG. 11. The description here is also a part of a method for manufacturing a resin molded article. The difference from Embodiment 3 is that a positioning pin 32 provided in the Y direction is provided on the mold surface on the same side as the U-shaped reference mark 36 in the upper mold 23. The structure and operation (manufacturing method) of the other molding dies are the same as those of the third embodiment, and therefore description thereof is omitted.

As shown in FIG. 11 (a), in this embodiment, an area A9 including the position P7 of the corner portion of the front substrate 5, the reference mark 36, and the positioning pin 32 is captured. Similarly, an area A10 including the position P8 of the corner portion of the front substrate 5, the reference mark 36, and the positioning pin 32 is captured. By photographing the area A9, the distances X7 and Y7 between the corner P7 of the package front substrate 5 and the reference mark 36 can be measured, and the state of the positioning pin 32 can be observed. Similarly, by photographing the area A10, the distances X8 and Y8 between the corner P8 of the package front substrate 5 and the reference mark 36 can be measured, and the state of the positioning pin 32 can be observed. Therefore, it is possible to verify whether the pre-package substrate 5 is properly positioned in the X direction, the Y direction, and the θ direction, and it is possible to confirm whether the positioning pin 32 is deformed due to abrasion or damage.

Regarding the data processing of the positioning verification operation of the substrate of the present embodiment, the difference from the third embodiment may be changed to reverse the magnitude relationship between the distance X and the allowable limit value.

According to the present embodiment, the area including the position of the corners of the front substrate 5, the reference mark, and the positioning pin is captured at the same time. Therefore, it is possible to verify whether or not the positioning is normally performed in the X direction, the Y direction, and the θ direction, and it is possible to confirm the state of the positioning pin at any time. Therefore, when an abnormality occurs in the positioning pin, it can be detected early.

Embodiment 5

The operation of verifying whether the pre-package substrate 5 supplied to the upper mold 23 is normally positioned in the fifth embodiment will be described with reference to FIG. 12. The description here is also a part of a method for manufacturing a resin molded article. The difference from the fourth embodiment is that rectangular reference marks are provided in the vicinity of the corners of the upper die 23 along the Y direction of the upper die 23, and the corners of the reference marks are used for data processing. The structure and operation (manufacturing method) of the other molding dies are the same as those of the fourth embodiment, and therefore description thereof will be omitted.

As shown in FIG. 12A, for example, rectangular reference marks 37 and 38 are provided near corners of the mold surface of the upper mold 23, for example. In this embodiment, an area A9 including the position P7 of the corner portion of the front substrate 5, the reference mark 37, and the positioning pin 32 is captured. Similarly, an area A10 including the position P8 of the corner portion of the front substrate 5, the reference mark 38, and the positioning pin 32 is captured.

According to the captured image data, the distance L1 between the position P7 of the corner of the front substrate 5 and the corner of the reference mark 37 and the position P8 of the corner of the front substrate 5 and the corner of the reference mark 38 The distance L2 is measured separately. The measured distance L1 includes information on the distances X7 and Y7 measured in the third and fourth embodiments. Similarly, the measured distance L2 includes information on the distances X8 and Y8 measured in the third and fourth embodiments. Therefore, by measuring the distance between the corners of the package front substrate 5 and the reference marks 37 and 38 at two places, it is possible to verify whether the package front substrate 5 is normally positioned in the X direction, the Y direction, and the θ direction. . In addition, in the image processing related to the corners of the fiducial marks 37 and 38, corner point detection may be used, and edge detection of two end faces intersecting at the corners may also be used.

Regarding the data processing of the positioning verification operation of the substrate according to this embodiment, the difference from Embodiments 1 to 4 is that the distances L1 and L2 are compared with the allowable range in this embodiment. If the result of the comparison is that both the distances L1 and L2 are within the allowable range, the processor P determines that the normal substrate positioning has been performed, and shifts to the process A in FIG. 7.

If the result of the comparison is that at least one of the distances L1 and L2 is outside the allowable range, the processor P determines that the normal substrate positioning has not been performed, and the processor P executes to end the positioning operation and the positioning verification operation and stops for resin. Processing of molding steps. At this time, the processor P instructs the information output unit O to output information such as stopping the resin molding step because the normal positioning operation is not performed.

According to this embodiment, the distance L1 between the corner portion P7 of the package front substrate 5 and the corner portion of the reference mark 37 and the distance L2 between the corner portion P8 of the package front substrate 5 and the corner portion of the reference mark 38 are determined. By measuring the distance between the two locations, it is possible to verify whether the pre-package substrate 5 is normally positioned in the X direction, the Y direction, and the θ direction. Therefore, it is possible to reduce man-hours for performing image processing based on the captured image data. Accordingly, it is possible to reduce the operation of verifying whether or not the pre-package substrate 5 is normally positioned.

In this embodiment, a rectangular reference mark is provided as the reference mark. As long as it is a fiducial mark capable of detecting a point by image processing, it is not limited to this, and fiducial marks having a circular shape, a triangular shape, a polygonal shape, or the like may be used. Further, fiducial marks such as dots, plus (+) shape, minus (-) shape, etc. may also be used. It only needs to be a mark that can be recognized by a camera. The position at which the fiducial mark is arranged may be any position that has a substantial distance from the corner of the front package substrate 5 with respect to the X and Y directions.

In each embodiment, the pre-package substrate 5 is supplied to the upper mold 23 of the molding die 24, and it is verified by the camera 11 that the pre-package substrate 5 supplied to the upper mold 23 is normally positioned. Not limited to this, the present invention can be applied even in a case where the pre-package substrate 5 is supplied to the lower mold 12 of the molding mold 24 and positioned on the mold surface of the lower mold 12. In this case, the same effects as those shown in the respective embodiments can be obtained.

In each of the embodiments, a case where it is verified whether or not the pre-package substrate 5 supplied to the upper mold 23 is normally positioned in the molding mold 24 of the resin molding apparatus 1 using a compression molding method. The present invention is not limited to this, and can be applied to a molding die of a resin molding apparatus using a transfer molding method or an injection molding method.

In each embodiment, an example in which the package front substrate 5 is used as a positioning target is illustrated, but the invention is not limited to this. It suffices to include at least a substrate, for example, an object obtained by mounting a reinforcing jig on the substrate.

In each embodiment, a case where a liquid resin is used as the resin material is illustrated. The resin material is not limited to this, and powdery, granular, flake, solid resin materials, and the like can be used.

In each embodiment, the resin molding apparatus and the manufacturing method of a resin molded product used when resin-molding a semiconductor wafer are demonstrated. The object for resin molding may be a semiconductor wafer such as an IC or a transistor, or a non-semiconductor wafer that does not use a semiconductor, or a wafer group in which a semiconductor wafer and a non-semiconductor wafer are mixed. The present invention can be applied when resin-molding one or a plurality of wafers mounted on a substrate such as a lead frame, a printed circuit board, or a ceramic substrate with a cured resin.

As described above, in the resin molding apparatus of the above-mentioned embodiment, the following configuration is provided, which includes a molding mold having a first mold and a second mold arranged to face each other, and a substrate supply mechanism that supplies a substrate to the first mold and A mold surface of any one of the second molds; a positioning mechanism for positioning a positioning object including at least a substrate on the mold surface; a mold clamping mechanism for clamping the molding mold; a camera that opens the molding mold In a state, it can be disposed between the first mold and the second mold; and the processor performs processing based on the image data captured by the camera. One mold has a reference mark for positioning that can be recognized by the camera. The camera shoots the positioning object and the fiducial mark after being positioned by the positioning mechanism, and the processor determines whether the positioning object is normally positioned according to the image data of the positioning object and the fiducial mark captured by the camera.

Further, in the resin molding apparatus of the above-mentioned embodiment, one mold has a positioning member used for positioning by contact of a positioning object, and the positioning mechanism performs positioning by bringing the positioning object into contact with the positioning member. .

According to this configuration, even if the positioning member is deformed by abrasion, damage, or the like, it is possible to reduce the occurrence of molding defects due to positioning.

Further, in the resin molding apparatus of the above embodiment, the processor obtains information related to the distance between the positioning object and the reference mark based on the image data of the positioning object and the reference mark captured by the camera, and Compare with the preset allowable range to determine whether the positioning object is normally positioned. When it is determined that the positioning object is not normally positioned, the positioning mechanism may be caused to perform at least one positioning operation.

According to this structure, it is possible to more reliably reduce the occurrence of molding defects due to positioning.

Further, in the resin molding apparatus of the above embodiment, when the processor determines that the positioning object does not contact at least a part of the positioning member, the positioning mechanism performs a positioning operation at least once more.

According to this configuration, it is possible to increase the possibility that normal substrate positioning can be completed, and productivity can be improved.

The method for manufacturing a resin molded article according to the above-mentioned embodiment includes a substrate supply step of supplying a substrate to a mold surface of any one of a molding mold having a first mold and a second mold arranged to face each other; a positioning step, Positioning a positioning object including at least a substrate on the surface; a photographing step, photographing the positioning object positioned in the positioning step and a fiducial mark set in a mold; a judging step, according to the positioning obtained in the photographing step Image data of the object and the fiducial mark to determine whether the positioning object is normally positioned; and in the resin molding step, when it is determined in the determination step that the substrate is normally positioned, the mold is clamped to perform resin molding.

According to this method, resin molding can be performed in a state where it is verified that the positioning object supplied to the molding die is normally positioned, and the occurrence of molding defects due to positioning can be reduced.

Furthermore, in the manufacturing method of the resin molded article of the said embodiment, a positioning process performs positioning by making a positioning object contact the positioning member provided in one mold.

According to this method, even if the positioning member is deformed by abrasion, damage, or the like, it is possible to reduce the occurrence of molding defects caused by positioning.

Further, in the method for manufacturing a resin molded article according to the above embodiment, the determination step obtains information related to the distance between the positioning object and the reference mark, and compares it with a preset allowable range to determine the positioning object. Whether it is positioned normally.

According to this method, it is possible to more reliably reduce the occurrence of molding defects due to positioning.

Moreover, in the manufacturing method of the resin molded article of the said embodiment, when it is determined in the determination step that a positioning target does not contact at least one part of a positioning member, positioning at the positioning step is performed at least once more.

According to this method, it is possible to increase the possibility that normal substrate positioning can be completed, and it is possible to improve productivity.

The present invention is not limited to the above-mentioned embodiments, and can be arbitrarily and appropriately combined, changed, or selected and adopted as needed without departing from the scope of the present invention.

1‧‧‧ resin molding device
2‧‧‧ substrate supply storage module
3A, 3B, 3C‧‧‧forming module
4‧‧‧Resin supply module
5‧‧‧ Before the package substrate (substrate, positioning object)
6‧‧‧ Pre-package substrate supply department
7‧‧‧ Substrate after packaging
8‧‧‧ Post-package substrate storage section
9‧‧‧ Substrate mounting section
10‧‧‧ substrate transport mechanism
11‧‧‧Camera
12‧‧‧ lower mold (second mold, first mold)
13‧‧‧Clamping mechanism
14‧‧‧ cavity
15‧‧‧Release film supply mechanism
16‧‧‧Distributor
17‧‧‧Resin Delivery Agency
18‧‧‧Resin ejection section
19‧‧‧ Control Department
20‧‧‧Memory
21‧‧‧Processor
22‧‧‧Chip
23‧‧‧ Upper mold (first mold, second mold)
24‧‧‧Forming mold
25‧‧‧Release film
26‧‧‧Liquid resin
27‧‧‧cured resin
28‧‧‧ molded products
29, 30‧‧‧ fiducial marks
31, 32‧‧‧ dowels (locating parts)
33, 34‧‧‧ Positioning agencies
35‧‧‧ Positioning mark
36‧‧‧U-shaped reference mark (reference mark)
37, 38‧‧‧ Rectangular fiducial marks (fiducial marks)
S1, R1, M1, C1‧‧‧ prescribed positions
P1, P2, P3, P4, P5, P6, P7, P8, P9, P10 ‧‧‧ position on the end of the front substrate
Y1, Y3, Y4, Y7, Y8‧‧‧Measured distances
Distance measured by X2, X5, X6, X7, X8‧‧‧
L1, L2‧‧‧Measured distance
A1, A2, A3, A4, A5, A6, A7, A8, A9, A10
D1, D2, D3, D4, D5, D6, D7, D8‧‧‧ image data
T0‧‧‧ benchmark
d‧‧‧Allowable value (T0-d), (T0 + d) ‧‧‧Allowable limit value
C‧‧‧Camera
P‧‧‧Processor
M‧‧‧Memory
O: Information output department

FIG. 1 is a plan view showing an outline of an apparatus in the resin molding apparatus according to the first embodiment.

(A)-(c) of FIG. 2 is a schematic sectional view which shows the process of resin-sealing the wafer mounted on the board | substrate in Embodiment 1.

FIG. 3 is a schematic view showing a state where the substrate before packaging is positioned on the mold surface of the upper mold in Embodiment 1, (a) is a bottom view, and (b) is a cross-sectional view taken along the line A-A.

FIG. 4 is a schematic view showing a state in which a pre-package substrate that has been positioned on a mold surface of an upper mold is imaged in Embodiment 1, (a) is a bottom view, and (b) is a cross-sectional view taken along the line B-B.

(A)-(c) of FIG. 5 are schematic diagrams which show three states when the substrate before packaging is positioned on the mold surface of the upper mold in the first embodiment.

FIG. 6 is a functional block diagram for verifying the positioning of the substrate in the first embodiment.

FIG. 7 is a flowchart for verifying whether or not the pre-package substrate that is supplied to the mold surface of the upper mold is properly positioned in the first embodiment.

FIG. 8 is a schematic view showing a state in which a pre-package substrate that has been positioned on a mold surface of an upper mold is imaged in Embodiment 2. (a) is a bottom view, and (b) is a cross-sectional view taken along the line C-C.

(A)-(d) of FIG. 9 is a schematic diagram which shows four states when the pre-package substrate is positioned on the mold surface of the upper mold in Embodiment 2.

Fig. 10 is a schematic view showing a state in which a pre-package substrate that has been positioned on a mold surface of an upper mold is imaged in Embodiment 3, (a) is a bottom view, and (b) is a cross-sectional view taken along the line D-D.

FIG. 11 is a schematic view showing a state in which a pre-package substrate that has been positioned on a mold surface of an upper mold is imaged in Embodiment 4, (a) is a bottom view, and (b) is a cross-sectional view taken along line E-E.

FIG. 12 is a schematic view showing a state in which a pre-package substrate that has been positioned on a mold surface of an upper mold is imaged in Embodiment 5, (a) is a bottom view, and (b) is a cross-sectional view taken along the line F-F.

5‧‧‧Pre-package substrate (substrate, positioning object)

10‧‧‧ substrate transport mechanism

11‧‧‧Camera

12‧‧‧ lower mold (second mold, first mold)

14‧‧‧ cavity

22‧‧‧Chip

23‧‧‧ Upper mold (first mold, second mold)

24‧‧‧Forming mold

29, 30‧‧‧ fiducial marks

31, 32‧‧‧ positioning pins (positioning parts)

35‧‧‧ Positioning mark

A1, A2‧‧‧ area

P1, P2‧‧‧Position on the end of the package substrate

X2‧‧‧Measured distance

Y1‧‧‧Measured distance

Claims (8)

A resin molding device includes: a molding mold having a first mold and a second mold arranged opposite to each other; and a substrate supply mechanism for supplying a substrate to any one of the first mold and the second mold A mold surface; a positioning mechanism for positioning a positioning object including at least the substrate on the mold surface; a mold clamping mechanism for clamping the molding mold; a camera on which the molding mold is opened In a state, it can be arranged between the first mold and the second mold; and a processor for processing according to the image data captured by the camera, any one of the first mold and the second mold The camera has a reference mark for positioning that can be identified through shooting by the camera. The camera shoots the positioning object and the reference mark after being positioned through the positioning mechanism, and the processor is based on the reference mark captured by the camera. The image data of the positioning object and the image data of the fiducial mark determine whether a positioning object is normally positioned. The resin molding device according to item 1 of the scope of patent application, wherein any one of the first mold and the second mold has a positioning member used for positioning by contacting the positioning object. The positioning mechanism performs positioning by contacting the positioning object with the positioning member. The resin molding device according to item 2 of the scope of patent application, wherein the processor obtains the positioning object based on the image data of the positioning object and the image data of the fiducial mark captured by the camera. A piece of information related to the distance between the reference marks, the obtained information is compared with a preset allowable range, and whether the positioning object is normally positioned is determined based on the comparison result. The resin molding device according to item 2 of the scope of patent application, wherein when the processor determines that the positioning object does not contact at least a part of the positioning component, the positioning mechanism performs a positioning operation at least once more. A method for manufacturing a resin molded article, comprising: a substrate supplying step of supplying a substrate to a mold surface of a molding mold having a first mold and a second mold arranged opposite to each other; a positioning step Positioning a positioning object including at least the substrate on the mold surface; a photographing step of positioning a positioning object positioned in the first step and the second mold after positioning in the positioning step; A reference mark of any mold or mold for shooting; a judgment step of determining whether the positioning object is normal according to the image data of the positioning object and the image data of the reference mark obtained in the shooting step Positioning; and a resin molding step, when it is determined in the determination step that the substrate is normally positioned, the molding mold is closed for resin molding. The method for manufacturing a resin molded article according to item 5 of the scope of patent application, wherein the positioning step is to contact the positioning object to a positioning member provided in any one of the first mold and the second mold. To locate. The method for manufacturing a resin molded article according to item 6 of the scope of the patent application, wherein the determination step obtains information related to the distance between the positioning object and the reference mark, and the obtained information is preset with The permissible range is compared, and whether the positioning object is normally positioned according to the comparison result. The method for manufacturing a resin molded article according to item 6 of the scope of patent application, wherein when it is determined in the determining step that the positioning object does not touch at least a part of the positioning member, the positioning step is performed at least once more. Positioning operation.