TW201801603A - Processing position correcting device and method thereof - Google Patents

Abstract

The present invention relates to measuring the degree of material deformation when performing hole processing of printed circuit board materials. Based on this, an error correction formula is calculated to minimize the deviation between the designed processing hole position and the actual processing hole position, thereby Processing position correction device and method for improved processing precision. The processing position correction method includes: receiving design drawings for processing printed circuit board materials, extracting alignment mark design information from the received design drawings; The step of extracting the actual coordinate position information of the alignment mark of the printed circuit board material; the step of calculating the position compensation value for compensating the position of the machining hole based on the material deformation based on the alignment mark design information and the actual coordinate position information : And the step of correcting the coordinates of the machining hole position by the position compensation value calculated above, in order to embody the machining position correction method for the machining of holes for printed circuit board materials.

Description

Processing position correction device and method

The invention relates to a processing position correction device and a method thereof. In particular, the invention relates to measuring the deformation degree of a material when processing a hole of a printed circuit board material. Based on this, an error correction formula is calculated to make the position of the processing hole on the design and the actual processing hole position The processing position correction device and method for minimizing the occurrence of errors between the processing errors can be improved.

Recently, with the reduction in weight and miniaturization of electronic devices such as smartphones, notebook computers, and tablet computers, high-resolution printed circuit boards (PCBs) and flexible printed circuit boards (FPCBs) are required. And precision.

In the past, mechanical drilling was mainly used to process small holes and special via holes corresponding to interlayer connection paths of multilayer printed circuit boards. Recently, due to such high pixel quality and precision requirements, Laser light mechanics are mainly used. The laser light processing device is a device for perforating small holes and special through holes by using a laser beam in order to connect various layers of electronic equipment of a multi-layer substrate.

Use a mechanical drilling machine or laser drilling device to machine holes in a printed circuit board, and use a printed circuit that designs a path for the motor to move on the processing surface. Board design drawing.

Generally, when processing the printed circuit board material hole, the position of the processed hole is read by the 4 or more alignment mark identification on the periphery of the material to read the coordinates. Based on the alignment mark coordinate, the processed hole coordinates are designed by the printed circuit board. Based on the data correction, the corrected processed hole coordinates are generated, and based on this, the printed circuit board hole processing is performed.

Conventional techniques for processing holes in a printed circuit board are the following (Patent Document 1) to (Patent Document 4).

The prior art disclosed in (Patent Document 1) includes an image imaging section that images an image including a hole, and a hole information judgment section that is obtained from the position of the drilling machine and the diameter of a bit mounted on the drilling machine. The size and position of the hole formed in the printed circuit board by the drilling machine; and the position control unit, which compares the position of the hole imaged by the image imaging unit and the position and size of the hole obtained by the underband and hole information determination unit Adjust the position of the drilling machine so that the center of the hole formed by the drilling machine coincides with the center of the hole, determine the adjusted position as the reference position of the drilling machine, and determine the position of the drilling machine for printed circuit board processing And printed circuit board design values.

With this structure, productivity can be improved by saving working time, and the number of parts can be reduced, thereby reducing production costs.

Further, the prior art disclosed in (Patent Document 2) includes a step of calculating an absolute coordinate by recognizing an alignment mark formed on the edge of a plate-shaped substrate that is a laser light processing target, and storing the calculated absolute coordinate as reference position information. ; A step of moving a plurality of optical pickup units along a horizontal or vertical pattern formed on the plate-like substrate; passing the plurality of light The steps of learning the coordinates of the pattern detected by the pick-up unit are stored as error position information; and the step of comparing the reference position information and the error position information to modify the actual processing position information, using a processing error correction method of the optical pickup.

With this structure, a substrate processing speed using laser light or the like can be greatly improved.

Further, in the prior art disclosed in (Patent Document 3), in order to remove the insulator of the printed circuit board in the through-hole processing step, when the appropriate number of laser light irradiation is N, the beam size is B, the energy is P, and the pulse width When it is W, it is inversely proportional to the reduction amount of laser light irradiation number N, increasing the reference energy P of the laser light irradiation, and inversely proportional to the reduction amount of laser light irradiation number N, reducing the beam size B of the laser light irradiation to reduce Laser light irradiation number N for through hole processing.

With this structure, in the laser light perforation processing step for through-hole processing, productivity can be improved by reducing the number of laser light irradiations.

In addition, the prior art disclosed in (Patent Document 4) includes a processing range setting step that sets a processing range formed by a laser light incident area that is incident and emitted to a mirror, and a loading step that loads and forms a film having Process the position information of the reference position corresponding to the positions of the plurality of holes of the base material; a step of setting up to the reference, in the position information, after removing the reference position in the highest area from the density of the reference position in the processing range, The center point of the processing range is set as the reference position; the moving path setting step generates the moving path of the substrate to be measured from the reference position; and the processing step moves the above along the moving path. The substrate is processed and laser processing is performed.

In the prior art structured as described above, when laser light processing is performed, a processing range is set by a rotating mirror, and after processing a plurality of holes in the processing range, the processed substrate is moved and the processed substrate is moved. This minimizes the movement path, thereby reducing the time required to form a plurality of holes in the substrate being processed.

[Prior technical literature]

[Patent Literature]

(Patent Document 1) Korean Patent No. 10-0607822 (authorized on July 26, 2006) (device for determining the position of a drilling machine for printed circuit board processing and the design value of a printed circuit board).

(Patent Document 2) Korean Laid-Open Patent No. 10-2011-0138879 (published on December 28, 2011) (processing error correction method using an optical pickup).

(Patent Document 3) Korean Laid-Open Patent No. 10-2014-0142403 (published on December 12, 2014) (driving method of laser light drilling machine for processing through holes).

(Patent Document 4) Korean Granted Patent No. 10-1542018 (granted on July 29, 2015) (laser light processing method with optimized moving path).

However, the above-mentioned hole processing method of the general printed circuit board material causes a large deformation of the material through the production steps (heat, pressure) of the printed circuit board material. Regardless of the above problems, the alignment marks (alignment marks) around the material are used. Mark) coordinates are used as a reference to perform only a linear correction of the data to process the hole. Therefore, according to the material deformation phenomenon, a coordinate error between the corrected processed hole position and the actual processed hole position may occur, thereby reducing the processing precision.

In addition, the general hole processing method of printed circuit board materials uses linear alignment design coordinates on the periphery of the printed circuit board material as a reference to linearly design and design the machining coordinates. Therefore, when the material undergoes a large degree of non-linear deformation, the hole is actually machined. The coordinate error between the position and the position of the corrected machined hole is large.

In addition, the aforementioned prior art is not a method for providing processing accuracy, but a technique for improving productivity by saving working time and the like, and does not perform error correction of material deformation occurring in a printed circuit board production step. Therefore, the prior art has a problem in that it is impossible to perform deformation correction of a material size that occurs in a production step, and therefore the processing precision is reduced.

Therefore, the present invention is proposed in order to solve all the problems occurring in the prior art as described above, and an object of the present invention is to provide a method for measuring the degree of deformation of a material when processing a hole of a printed circuit board material, and based on this, calculate an error correction. Formally, the error between the position of the processed hole and the position of the actual processed hole is deviated, so as to seek a processing position correction device and method with improved processing precision.

Another object of the present invention is to improve the precision of processing when reducing the deviation between the position of the processed hole and the position of the corrected processing hole caused by the deformation of the material during the material production step when the hole of the printed circuit board material is processed. Degree processing position correction device and method.

In order to solve the above-mentioned problems, the processing position correction device of the present invention is characterized by including: an alignment mark design information extraction section, which extracts the alignment mark design information from a design drawing used for the printed circuit board material processing; and an alignment mark coordinate extraction section. , Using a photographing device to extract the actual coordinate position information of the alignment mark of the printed circuit board material; a position compensation value calculation unit, based on the above-mentioned alignment mark design information and actual coordinate position information, calculates a process for compensating the deformation based on the material Compensation value for hole position; the machining hole coordinate correction unit corrects the machining hole position coordinate through the position compensation value calculated by the position compensation value calculation unit, Among them, the present invention is characterized in that the photographing device uses a visual camera that photographs a printed circuit board material used for hole processing to obtain an image of the printed circuit board material.

The present invention is characterized in that the position compensation value calculation unit includes a virtual material change curve calculation unit that calculates a virtual material change for estimating a change in the material based on the alignment mark design information and the actual coordinate position information. A curve formula; and a processing area dividing section that uses the virtual material change curve formula calculated by the virtual material change curve calculation section to divide the entire processed hole area.

Among them, the present invention is characterized in that the virtual material change curve calculation unit adds an arbitrary alignment mark to the alignment mark design information of the actual printed circuit board material, and calculates a virtual line calculation that passes the coordinates of the alignment mark by the virtual material change curve formula. .

Wherein, the present invention is characterized in that the virtual material change curve formula is Based on the above-mentioned alignment mark design information and the above-mentioned actual coordinate position information, calculation is performed by a second-order curve type estimation, or calculation is performed by segmented spline interpolation.

Among them, the present invention is characterized in that the processing region dividing section divides the entire processing hole region in a nearly linear shape based on a virtual material change curve formula.

Among them, the present invention is characterized in that the processing region dividing section divides the entire processing hole region in a quadrangular shape based on a virtual material change curve formula.

The present invention is characterized in that the machining hole coordinate correction unit obtains the reference points of the virtual division area in each divided area, and uses the coordinates of the virtual division area corresponding to the obtained reference points to perform bilinear interpolation (Biliner Interpolation) Correct the coordinates of the machined hole.

In addition, the processing position correction method of the present invention is characterized in that it includes: step (a), receiving a design drawing for processing a printed circuit board material, and extracting alignment mark design information from the received design drawing; step (b) , Use a photographing device to extract the actual coordinate position information of the alignment mark of the printed circuit board material; step (c), based on the above-mentioned alignment mark design information and the actual coordinate position information, calculate a process for compensating the deformation based on the material Position compensation value of hole position: and step (d), the position coordinates of the machined hole are corrected by the position compensation value calculated in the above step (c).

Wherein, the present invention is characterized in that the step (c) includes: step (c1), based on the alignment mark design information and the actual coordinate position information, calculating a virtual material change curve formula for estimating a change in the material; And step (c2), using the virtual material calculated in step (c) above Change the curve formula to divide the whole machining hole area.

Wherein, the present invention is characterized in that in the step (c1), an arbitrary alignment mark is added to the alignment mark design information of the actual printed circuit board material, and a virtual line passing through the alignment mark coordinates is calculated by a virtual material change curve formula. .

Among them, the present invention is characterized in that in the step (c1), a quadratic curve is estimated based on the alignment mark design information and the actual coordinate position information to calculate a virtual material change curve formula, or segmented spline interpolation is used to calculate Calculate the virtual material change curve formula.

Among them, the present invention is characterized in that in the step (c2), based on the virtual material change curve formula, the entire processed hole area is divided into regions in a nearly linear shape.

Among them, the present invention is characterized in that in the step (c2), based on the virtual material change curve formula, the entire processed hole region is divided into regions in a quadrangular shape.

Wherein, the present invention is characterized in that in step (d) above, the reference points of the virtual division area are obtained in each divided area, and the coordinates of the virtual division area corresponding to the obtained reference points are used to process the pair by bilinear interpolation. The hole coordinates are corrected.

According to the present invention, the present invention has the advantage that in the event of material deformation based on the printed circuit board material production step, the non-linear deformation of the material is divided into nearly rectangular areas to linearly correct each virtual divided area, and This can reduce the deviation of the processing coordinate error and improve the processing time. Work precision.

10‧‧‧ Alignment Mark Design Information Extraction Department

20‧‧‧ Camera

30‧‧‧Alignment Mark Coordinate Extraction Department

40‧‧‧Position compensation unit

41‧‧‧Virtual Material Change Curve Calculation Department

42‧‧‧Processing area division

60‧‧‧Working hole coordinate correction department

70‧‧‧Printed circuit board hole processing department

FIG. 1 is a block diagram of a processing position correction device according to the present invention.

FIG. 2 is a flowchart showing a processing position correction method of the present invention.

FIG. 3 is a diagram illustrating an example of processing area division for correcting a processing position in the present invention.

FIG. 4 is a diagram showing an example of processing area division added by a virtual reference point in the present invention.

FIG. 5 is an illustration of calculation of a virtual material change curve in the present invention.

FIG. 6 is a diagram illustrating an example of a virtual division alignment position and an additional alignment mark in the present invention.

FIG. 7 is a result diagram when the processing error correction method of the present invention is applied.

Hereinafter, a processing position correction device and a method thereof according to a preferred embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a block diagram of a processing position correction device according to a preferred embodiment of the present invention, including an alignment mark design information extraction section 10, a photographing device 20, an alignment mark coordinate extraction section 30, a position compensation value calculation unit 40, and a machining hole coordinate. The correction section 60 and the printed circuit board hole processing section 70.

The above-mentioned alignment mark design information extraction section 10 extracts the alignment mark design information from a design drawing for processing a printed circuit board material.

The above-mentioned photographing device 20 acquires an image by imaging a printed circuit board material for actual hole processing. A variety of image photographing devices can be used, but In the present invention, as an embodiment, a visual camera is preferably used.

The alignment mark coordinate extraction unit 30 uses the imaging device 20 to extract actual coordinate position information of the alignment mark of the printed circuit board.

The position compensation value calculation unit 40 calculates a position compensation value for compensating the position of the processed hole based on the deformation of the material based on the design information of the alignment mark and the position information of the actual coordinates.

Such a position compensation value calculation unit 40 may include a virtual material change curve calculation unit 41 that calculates a virtual material change curve formula for estimating a change in the material based on the alignment mark design information and the actual coordinate position information; and The processing region dividing unit 42 divides the entire processed hole region using a virtual material change curve formula calculated by the virtual material change curve calculation unit.

3)次多項式。 Among them, the virtual material change curve calculation unit 41 adds an arbitrary alignment mark to the alignment mark design information of the actual printed circuit board material to calculate a virtual line passing through the alignment mark coordinates as a virtual material change curve formula. At this time, the virtual material change curve formula is calculated based on the estimated curve formula based on the above-mentioned alignment mark design information and the above-mentioned actual coordinate position information, or is calculated by piecewise spline interpolation. Among them, the second degree curve formula can include N (N

3) Degree polynomial.

In the preferred embodiment of the present invention, in order to calculate the above-mentioned virtual material change curve formula, only the second-degree polynomial and piecewise interpolation are described. However, the present invention is not limited to this, and a person of ordinary skill in the technical field to which the present invention belongs It is known that a variety of methods disclosed for calculating a virtual material curve can be used.

The processing region dividing unit 42 is based on a virtual material change curve. Expression, the entire processed hole area is divided into regions in a nearly linear shape. More preferably, the processing region dividing unit 42 divides the entire processing hole region in a quadrangular shape based on a virtual material change curve formula.

The machining hole coordinate correction unit 60 corrects the machining hole position coordinates by using the position compensation value calculated by the position compensation value calculation unit 40.

Such a machining hole coordinate correction unit 60 obtains reference points of the virtual divided areas in each divided area, and uses the coordinates of the virtual divided areas corresponding to the obtained reference points to correct the machining hole coordinates by bilinear interpolation.

FIG. 2 is a processing position correction method of the present invention, including: step (a), receiving a design drawing for processing a printed circuit board material, and extracting alignment mark design information from the received design drawing (step S10, step S20) Step (b), use the photographing device to extract the actual coordinate position information of the alignment mark of the printed circuit board material (step S30); Step (c), based on the above-mentioned alignment mark design information and the above-mentioned actual coordinate position information Calculate a position compensation value (Step S40, Step S50) for compensating the position of the processed hole based on the deformation of the material: and step (d), correct the position coordinate of the processed hole by the position compensation value calculated in the above step (c) Step S60), processing holes of the printed circuit board material based on the corrected processed hole position information (Step S70).

The operation of the processing position correction device and method of the present invention configured as described above will be specifically described.

First, in the present invention, when performing hole processing of printed circuit board materials, in the material production step, reducing the occurrence of errors between the actual processed hole position and the corrected processed hole position caused by material deformation due to heat or pressure, etc. Deviation to improve machining accuracy.

For this reason, as shown in FIG. 4, in addition to the alignment marks (P0-P3) at the four points on the periphery of the printed circuit board material, at least one alignment mark (A1, A2) is added to obtain the coordinates of the alignment mark. Based on this, the virtual line is divided into a plurality of virtual areas (virtual area # 1 to virtual area # 4), and the processing positions in the divided areas are corrected by correcting the processing coordinates.

For example, the alignment mark design information extraction unit 10 extracts the alignment marks from the design information used for the processing of the printed circuit board material (step S10, step S20). The printed circuit board design information is the printed circuit board material design information, as shown in the figure As shown in FIG. 4, the four points P0, P1, P2, and P3 on the periphery of the design information are extracted as alignment mark design information. The design information includes the coordinates of the machined hole. The above-mentioned extracted alignment mark design information is transmitted to the position compensation value calculation unit 40.

At the same time, the photographing device 20 uses a photographing device such as a vision camera to use the actual printed circuit board material for hole processing, and transmits the imaged image of the printed circuit board material to the alignment mark coordinate extraction section 30. The phenomenon on the upper right side of FIG. 4 is the shape of the printed circuit board material actually photographed by the imaging device 20. The actual printed circuit board material is deformed due to heat or pressure during the material production step.

The alignment mark coordinate extraction unit 30 extracts the alignment mark coordinates of the imaged printed circuit board material and transfers them to the position compensation value calculation unit 40 (step S30). Wherein, the coordinate of the alignment mark of the photographed printed circuit board material is the actual moving coordinate position. At this time, in addition to the alignment marks at the outer four points, two or more additional alignment mark movement coordinates are acquired. And, will get The taken moving coordinates are set to the actual position and reference position of the alignment mark.

The position compensation value calculation unit 40 calculates a compensation based on the alignment mark design information transmitted from the alignment mark design information extraction unit 10 and the actual coordinate position information transmitted from the alignment mark coordinate extraction unit 30. Compensation for the position of the machined hole for material deformation.

For example, the virtual material change curve calculation unit 41 of the position compensation value calculation unit 40 calculates a virtual material change curve formula for a change in the estimated material based on the alignment mark design information and the actual coordinate position information (step S40). As shown in FIG. 5, the virtual material change curve formula for estimating the material change is calculated based on the moving coordinates of the alignment mark passing through three or more points (for example, P0 → A0 → P1). Among them, the virtual material change curve formula is calculated by estimating the quadratic curve formula (ax ² + bx + c = y) based on the above-mentioned actual coordinate position information, or by piecewise spline interpolation. In addition to the above two methods, various methods for calculating the virtual material change curve formula can be applied.

Among them, the segmented interpolation is specifically explained as follows.

In Figure 3, if ① point is (x0, f0), ② point is (x1, f1), and ③ point is (x2, f2), use the following mathematical formula 1 and mathematical formula 2 and substitute the value of each point to calculate Coefficient of the formula.

If each point is substituted, the following four mathematical formulas can be obtained.

Formula 3 F ₀ = A ₁ × x ₀ ² + B ₁ × x ₀ + C ₁

Math 4 F ₁ = A ₁ × x ₁ ² + B ₁ × x ₁ + C ₁

Formula 5 F ₁ = A ₂ × x ₁ ² + B ₂ × x ₁ + C ₂

Math 6 F ₂ = A ₂ × x ₂ ² + B ₂ × x ₂ + C ₂

Further, under the continuous condition, the pseudo-curve equation can be obtained as the following mathematical expression 7 such as F1 '(x) = F2' (x).

Based on the initial value and the condition of selecting a straight line or a curve, the following formula 8 or formula 9 is obtained by connecting the points ① and ②.

If the known Mathematical Expressions 3 to 7 and Mathematical Expression 8 or Mathematical Expression 9 are calculated, the coefficients of Mathematical Expressions 1 and 2 as virtual curve expressions can be obtained.

The virtual curve symmetrical to the above is calculated by the same method as above.

Next, a method for obtaining a virtual curve equation from a quadratic equation will be described as follows.

In Figure 3, if ① point is (x0, f0), ② point is (x1, f1), and ③ point is (x2, f2), use the following mathematical formula 10 to substitute the value of each point and find the coefficient of the formula.

When each point is substituted, three expressions such as the following mathematical expressions 11 to 13 can be obtained.

Formula 11 F ₁ = A ₁ × x ₀ ² + B ₁ × x ₀ + C ₁

Formula 12 F ₁ = A ₁ × x ₁ ² + B ₁ × x ₁ + C ₁

Formula 13 F ₁ = A ₁ × x ₂ ² + B ₁ × x ₂ + C ₁

When the known mathematical formulas 11 to 13 are calculated, the coefficients of the mathematical formula 10 as the virtual curve formula can be obtained.

The virtual curve of the point symmetrical to the above is calculated by the same method as above.

As described above, after calculating the virtual material change curve formula, the virtual material change curve formula calculated in the processing area dividing section 42 is used to divide the entire machining hole area into a plurality of (step S50).

For example, one alignment mark (A) is added between points ① and ② shown in FIG. 3, one alignment mark (B) is added between ② and ③, and A 'and B '. In this way, the entire processing area is divided into a plurality of virtual areas (virtual area # 1-virtual area # 4). Among them, curve 1 is the curve connecting point ① and point A in virtual area # 1, and curve 2 is the virtual line Curve connecting point ① 'and point A' in imaginary area # 1.

At this time, in the area of the entire machining hole, the non-linear change based on the deformation of the material is divided into regions in a nearly linear shape. More preferably, based on the virtual material change curve formula, the entire processed hole area is segmented in a quadrangular shape. After the virtual area is divided, the virtual divided area reference point is obtained for each virtual area. In FIG. 4, the points V0 to V3 are virtual area division reference points of the virtual area divided based on the virtual material change curve formula. FIG. 6 illustrates an example in which one or more virtual division reference points such as V0 and V3 are added to divide a division area into a straight line.

In addition, the machined hole coordinate correction unit 60 uses the obtained virtual divided area coordinates to correct the processed hole coordinates in the virtual divided area by bilinear interpolation (step S60). For example, the divided regions are corrected by bilinear interpolation, respectively.

The above-mentioned bilinear interpolation is as shown in the following mathematical formula 14.

Mathematical formula 14 F = A ₀ + A ₁ × U + A ₂ × V + A ₃ × U × V

FIG. 7 is a result diagram when a processing error correction method of the present invention is applied. When error correction is performed on a coordinate position, corresponding to a case where a material periphery is used as a reference, deviations in processing coordinate errors based on a virtual segmentation region can be reduced.

After the correction of the processed hole coordinates is completed, the printed circuit board processed hole information is transmitted to the printed circuit board hole processing section 70, and the printed circuit board hole processing section 70 executes the printed circuit board hole processing based on the corrected processed hole information (step S70). .

In the present invention, in the case of material deformation based on the printed circuit board material production step, the non-linear deformation of the material is divided into a near-rectangular area to linearly correct each virtual division area, thereby reducing the processing coordinates. The error is deviated, and the processing precision can be adjusted.

The invention of the present inventors has been specifically described based on the above-mentioned embodiments, but the present invention is not limited thereto, and various changes can be made without departing from the scope of the present invention.

10‧‧‧ Alignment Mark Design Information Extraction Department

20‧‧‧ Camera

30‧‧‧Alignment Mark Coordinate Extraction Department

40‧‧‧Position compensation unit

41‧‧‧Virtual Material Change Curve Calculation Department

42‧‧‧Processing area division

60‧‧‧Working hole coordinate correction department

70‧‧‧Printed circuit board hole processing department

Claims (14)

A processing position correction device for processing holes of printed circuit board materials includes: an alignment mark design information extraction section, which extracts alignment mark design information from a design drawing used for printed circuit board material processing; an alignment mark coordinate extraction section , Using a photographing device to extract the actual coordinate position information of the alignment mark of the printed circuit board material; a position compensation value calculation unit, based on the aforementioned alignment mark design information and the aforementioned actual coordinate position information, calculates a compensation for the deformation based on the material A compensation value for the position of the machined hole; and a coordinate correction unit for the machined hole, which corrects the position coordinates of the machined hole by the position compensation value calculated by the position compensation value calculation unit; Calculate a virtual material change curve formula for estimating a change in the material based on the alignment mark design information and the aforementioned actual coordinate position information; and a processing area dividing section using the virtual material change curve formula calculated by the virtual material change curve calculation section To divide the entire machined hole area. The processing position correction device according to claim 1, wherein the imaging device uses a visual camera that captures a printed circuit board material used for hole processing to obtain an image of the printed circuit board material. The processing position correction device according to claim 1, wherein the aforementioned virtual material change curve calculation section compares the actual printed circuit board materials with each other. The quasi-mark design information adds an arbitrary alignment mark to calculate a virtual line passing through the coordinates of the alignment mark using a virtual material change curve. The processing position correction device according to claim 3, wherein the aforementioned virtual material change curve formula is calculated by a second-order curve type estimation based on the aforementioned alignment mark design information and the aforementioned actual coordinate position information, or is calculated by segmented spline interpolation . The processing position correction device according to claim 3, wherein the aforementioned material change curve formula is calculated by N-degree polynomial estimation based on the aforementioned alignment mark design information and the aforementioned actual coordinate position information, where N

3. The processing position correction device according to claim 1, wherein the processing region dividing section divides the entire processing hole region into a nearly linear shape based on a virtual material change curve formula. The processing position correction device according to claim 1, wherein the processing region dividing section divides the entire processing hole region in a quadrangular shape based on a virtual material change curve formula. The processing position correction device according to claim 1, wherein the processing hole coordinate correction unit obtains a reference point of the virtual division area in each divided area, and uses the coordinates of the virtual division area corresponding to the obtained reference point to pass the bilinearity. Interpolation corrects the coordinates of the machined hole. A processing position correction method for hole processing of printed circuit board materials includes the following steps: step (a), receiving a design drawing for processing of printed circuit board materials, and extracting alignment mark design information from the foregoing design drawing received ; Step (b), use the photographing device to extract the actual coordinate position information of the alignment mark of the printed circuit board material; step (c), based on the foregoing alignment mark design information and the foregoing actual coordinate position information, calculate for compensation based on Position compensation value of the processed hole position of material deformation: and step (d), the position coordinate of the processed hole is corrected by the position compensation value calculated in the foregoing step (c); the foregoing step (c) includes: step (c1), Calculating a virtual material change curve formula for estimating a change of the material based on the aforementioned alignment mark design information and the aforementioned actual coordinate position information; and step (c2), using the virtual material change curve calculated in the aforementioned step (c) Formula to divide the entire machining hole area. The processing position correction method according to claim 9, wherein in the aforementioned step (c1), an arbitrary alignment mark is added to the alignment mark design information of the actual printed circuit board material, and the alignment is calculated by a virtual material change curve formula. A virtual line marking the coordinates. The processing position correction method according to claim 9, wherein in the aforementioned step (c1), a secondary curve is estimated based on the aforementioned alignment mark design information and the aforementioned actual coordinate position information to calculate a virtual material change curve formula, or Segment spline interpolation to calculate the virtual material change curve. The processing position correction method according to claim 9, wherein in the aforementioned step (c2), the virtual material change curve formula is used to approximate the linear shape Morphology of the entire machining hole area. The processing position correction method according to claim 9, wherein in the aforementioned step (c2), based on the virtual material change curve formula, the entire processed hole area is divided into regions in a quadrangular shape. The processing position correction method according to claim 9, wherein in the aforementioned step (d), the reference points of the virtual divided area are obtained in each divided area, and the coordinates of the virtual divided area corresponding to the obtained reference points are used to pass the double Linear interpolation corrects the coordinates of the machined hole.