TW201807203A - Conductive material and connected structure - Google Patents

Abstract

The invention provides a conductive material, which can efficiently dispose solder between electrodes to be connected, and can improve the conduction reliability and insulation reliability. The conductive material of the present invention includes a plurality of first conductive particles having solder on the outer surface portion of the conductive portion, second conductive particles having silver, ruthenium, iridium, gold, palladium or platinum on the outer surface portion of the conductive portion, Thermosetting compounds and thermosetting agents.

Description

Conductive material and connection structure

The present invention relates to a conductive material containing conductive particles having solder. The present invention also relates to a connection structure using the conductive material.

Anisotropic conductive materials such as anisotropic conductive pastes and anisotropic conductive films are widely known. In the anisotropic conductive material, conductive particles are dispersed in a binder. The content of the solder particles in the anisotropic conductive material is, for example, 80% by weight or less. The above-mentioned anisotropic conductive material is used, for example, for connection between a flexible printed substrate and a glass substrate (FOG (Film on Glass, glass film)), connection between a semiconductor wafer and a flexible printed substrate (COF (Chip on Film, film on film)) ), The connection of semiconductor wafers and glass substrates (COG (Chip on Glass)), and the connection of flexible printed substrates and glass epoxy substrates (FOB (Film on Board, substrate coating)), etc. to obtain various connections Structure. When using an anisotropic conductive material to electrically connect, for example, an electrode of a flexible printed circuit board and an electrode of a glass epoxy substrate, the anisotropic conductive material including conductive particles is disposed on the glass epoxy substrate. Then, the flexible printed circuit board is laminated, and heated and pressed. Thereby, the anisotropic conductive material is hardened, and the electrodes are electrically connected via the conductive particles to obtain a connection structure. As an example of the anisotropic conductive material described below, Patent Document 1 below describes an anisotropic conductive material including conductive particles and a resin component whose curing is not completely completed at the melting point of the conductive particles. Specific examples of the conductive particles include tin (Sn), indium (In), bismuth (Bi), silver (Ag), copper (Cu), zinc (Zn), lead (Pb), and cadmium (Cd). , Gallium (Ga) and thorium (Tl) and other metals, or alloys of these metals. Patent Document 1 describes a resin heating step of heating the anisotropic conductive material to a temperature higher than the melting point of the conductive particles and the curing of the resin component is not completely completed, and a resin component curing step of curing the resin component. Electrically connect the electrodes. In addition, Patent Document 1 describes mounting with a temperature distribution shown in FIG. 8 of Patent Document 1. In Patent Document 1, the conductive particles are melted in a resin component whose curing is not completely completed at the heating temperature of the anisotropic conductive material. The following patent document 2 discloses a solder paste in which a solder powder and a flux are mixed. The said flux contains polyalkyl methacrylate at 1 mass% or more and 2 mass% or less. The above-mentioned flux contains octadecylamine in an amount of 5% by mass or more and less than 15% by mass. The viscosity of the solder paste is 50 Pa · s or more and 150 Pa · s or less. [Prior Art Literature] [Patent Literature] [Patent Literature 1] Japanese Patent Laid-Open No. 2004-260131 [Patent Literature 2] Japanese Patent Laid-Open No. 2013-132654

[Problems to be Solved by the Invention] The conventional anisotropic conductive materials may not be efficiently disposed between the upper and lower electrodes to be connected. The prior anisotropic conductive materials have the following problems: during hardening, the solder moves to the electrode at a slower speed, the viscosity of the solder increases before the solder is sufficiently moved to the electrode, and the solder tends to remain in the electrodeless area. An object of the present invention is to provide a conductive material, which can efficiently dispose solder between electrodes to be connected, and can improve conduction reliability and insulation reliability. It is another object of the present invention to provide a connection structure using the conductive material. [Technical means to solve the problem] According to a broad aspect of the present invention, a conductive material is provided, which includes a plurality of first conductive particles having solder on a surface portion of a conductive portion, and a surface portion of the conductive portion. It has second conductive particles of silver, ruthenium, iridium, gold, palladium, or platinum, a thermosetting compound, and a thermosetting agent. In a specific aspect of the conductive material of the present invention, the second conductive particle has gold, palladium, or platinum on an outer surface portion of the conductive portion. In a specific aspect of the conductive material of the present invention, the viscosity of the conductive material at the melting point of the solder in the first conductive particles is 2 Pa · s or more and 10 Pa · s or less. In a specific aspect of the conductive material of the present invention, the average particle diameter of the second conductive particles is smaller than the average particle diameter of the first conductive particles. In a specific aspect of the conductive material of the present invention, the content of the second conductive particles is 10% by weight or less. In a specific aspect of the conductive material of the present invention, the ratio of the content of the first conductive particles to the content of the second conductive particles is 3 or more and 80 or less on a weight basis. In a specific aspect of the conductive material of the present invention, the thermosetting compound includes a thermosetting compound that is liquid at 25 ° C. In a specific aspect of the conductive material of the present invention, the thermosetting compound includes a thermosetting compound having a polyether skeleton. In a specific aspect of the conductive material of the present invention, a flux having a melting point of 50 ° C. or higher and 190 ° C. or lower is included. In a specific aspect of the conductive material of the present invention, a carboxyl group or an amine group exists on the outer surface of the first conductive particle. In a specific aspect of the conductive material of the present invention, the first conductive particles are solder particles having solder in a central portion and an outer surface portion. A specific aspect of the conductive material of the present invention includes insulating particles that are not adhered to any of the surface of the first conductive particles and the surface of the second conductive particles. According to a broad aspect of the present invention, there is provided a connection structure including: a first connection target member having at least one first electrode on a surface; and a second connection target member having at least one second electrode on a surface. And a connection portion that connects the first connection target member and the second connection target member, the material of the connection portion is the conductive material described above, and the connection portion includes a hardened portion, a solder portion, and the second conductive particle The second conductive particles are arranged in the solder portion, and the first electrode and the second electrode are electrically connected through the solder portion of the connection portion. According to a broad aspect of the present invention, there is provided a connection structure including: a first connection target member having at least one first electrode on a surface; and a second connection target member having at least one second electrode on a surface. And a connection portion that connects the first connection target member and the second connection target member, the connection portion includes a hardened portion, a solder portion, and silver, ruthenium, iridium, gold, and palladium on the outer surface portion of the conductive portion Or platinum second conductive particles, the second conductive particles are arranged in the solder portion, and the first electrode and the second electrode are electrically connected through the solder portion of the connection portion. In a specific aspect of the connection structure of the present invention, the second conductive particle has gold, palladium, or platinum on an outer surface portion of the conductive portion. In a specific aspect of the connection structure of the present invention, when a portion of the first electrode facing the second electrode is viewed in a lamination direction of the first electrode, the connection portion, and the second electrode The solder portion of the connection portion is disposed at 50% or more of an area of 100% of a portion of the first electrode facing the second electrode. [Effects of the Invention] The conductive material of the present invention includes a plurality of first conductive particles having solder on the surface portion of the conductive portion, and silver, ruthenium, iridium, gold, palladium, or platinum on the surface portion of the conductive portion. Since the second conductive particles, the thermosetting compound, and the thermosetting agent, the solder can be efficiently disposed between the electrodes to be connected, and the conduction reliability and the insulation reliability can be improved. The connection structure of the present invention includes a first connection target member having at least one first electrode on the surface, a second connection target member having at least one second electrode on the surface, and the first connection target member and the above. A connection portion to which a second connection target member is connected, the connection portion having a hardened portion, a solder portion, and second conductive particles having silver, ruthenium, iridium, gold, palladium, or platinum on an outer surface portion of the conductive portion, the solder The second conductive particles are arranged in the portion, and the first electrode and the second electrode are electrically connected by the solder portion in the connection portion, so that the conduction reliability and the insulation reliability can be improved.

Hereinafter, the details of the present invention will be described. (Conductive material) The conductive material of the present invention includes first conductive particles, second conductive particles, a thermosetting compound, and a thermosetting agent. The first conductive particle has a conductive portion. The first conductive particles have solder on an outer surface portion of the conductive portion. The solder is contained in the conductive portion and is a part or all of the conductive portion. The second conductive particle has a conductive portion. The second conductive particle has silver, ruthenium, iridium, gold, palladium, or platinum on an outer surface portion of the conductive portion. Silver, ruthenium, iridium, gold, palladium, or platinum is contained in the conductive portion, and is a part or all of the conductive portion. In the present invention, since the above-mentioned structure is provided, the speed at which the solder moves to the electrodes becomes faster, the solder can be efficiently disposed between the electrodes to be connected, and the conduction reliability and insulation reliability can be improved. When the electrode width or the width between electrodes is narrow, it is difficult to gather the solder on the electrodes. However, in the present invention, even if the electrode width or the width between the electrodes is narrow, the solder can be sufficiently gathered on the electrodes. . In the present invention, since the above-mentioned configuration is provided, when the electrodes are electrically connected, the solder is easily gathered between the electrodes facing up and down, and the solder can be efficiently disposed on the electrodes (wires). Further, in the present invention, if a certain electrode width is wide, the solder is more efficiently disposed on the electrode. The reason why the above-mentioned effect is exhibited is that during the conductive connection, since the second conductive particles exist between the plurality of first conductive particles, the first conductive particles are attracted to the other first conductive via the second conductive particles. Sex particles. Since the second conductive particle has silver, ruthenium, iridium, gold, palladium, or platinum on the outer surface portion of the conductive portion, it has the effect of attracting solder. Moreover, in the present invention, it is difficult to dispose a part of the solder in a region (interval) where no electrode is formed, and the amount of solder disposed in a region where no electrode is formed can be greatly reduced. In the present invention, the solder which is not located between the opposed electrodes can be efficiently moved to between the opposed electrodes. Therefore, the conduction reliability between the electrodes can be improved. In addition, it is possible to prevent electrical connection between electrodes that are not connectable in the lateral direction and improve insulation reliability. Furthermore, in the present invention, it is possible to prevent a positional shift between the electrodes. In the present invention, when the second connection target member is superimposed on the first connection target member on which the conductive material is disposed on the upper surface, the electrode of the first connection target member and the electrode of the second connection target member are aligned. When the first connection target member and the second connection target member are overlapped in the offset state, the offset may be corrected so that the electrode of the first connection target member and the electrode of the second connection target member are connected (self-aligned). effect). In order to arrange the solder on the electrode more efficiently, the conductive material is preferably liquid at 25 ° C, and is preferably a conductive paste. In order to arrange the solder on the electrode more efficiently, the viscosity (η25) of the above conductive material at 25 ° C is preferably 10 Pa · s or more, more preferably 50 Pa · s or more, and even more preferably 100 Pa · s. Above, it is preferably 800 Pa · s or less, more preferably 600 Pa · s or less, and even more preferably 500 Pa · s or less. The viscosity (η25) can be appropriately adjusted by the type and amount of the compounding ingredients. The viscosity (η25) can be measured, for example, using an E-type viscometer ("TVE22L" manufactured by Toki Sangyo Co., Ltd.) at 25 ° C and 5 rpm. In order to arrange the solder on the electrode more efficiently, the viscosity (ηmp) of the conductive material at the melting point of the solder in the first conductive particles is preferably 2 Pa · s or more, and more preferably 3 Pa · s or more. It is more preferably 4 Pa · s or more, more preferably 10 Pa · s or less, still more preferably 9 Pa · s or less, and still more preferably 8 Pa · s or less. The viscosity (ηmp) can be appropriately adjusted by the type and amount of the blending ingredients. The melting point of the solder is a temperature that easily affects the movement of the first conductive particles onto the electrode. The viscosity (ηmp) can be measured, for example, under the conditions of STRESSTECH (manufactured by EOLOGICA) equal to a strain control of 1 rad, a frequency of 1 Hz, a heating rate of 20 ° C / min, and a measurement temperature range of 40 ° C to the melting point of the solder. In this measurement, the viscosity at the melting point of the solder is read. The above conductive materials can be used as a conductive paste, a conductive film, and the like. The conductive film is preferably an anisotropic conductive film. From the viewpoint of more efficiently disposing the solder on the electrode, the conductive material is preferably a conductive paste. The above conductive material can be preferably used for the electrical connection of the electrodes. The conductive material is preferably a circuit connection material. Hereinafter, each component contained in the said conductive material is demonstrated. Furthermore, in this specification, "(meth) acrylic acid" means one or both of "acrylic acid" and "methacrylic acid", and "(meth) acrylate" means "acrylate" and "formaldehyde" One or both of "methacrylate" and "(meth) acryl" refers to one or both of "acryl" and "methacryl". (First conductive particle) The first conductive particle is used to electrically connect the electrodes of a connection target member. The first conductive particles have solder on an outer surface portion of the conductive portion. The first conductive particles may be solder particles made of solder. The solder particles have solder on an outer surface portion of the conductive portion. Both the central portion of the solder particles and the outer surface portion of the conductive portion are formed of solder. The solder particles are particles of solder on the central portion and the outer surface of the conductive portion. The said solder particle does not have a base material particle as a core particle. The solder particles are different from conductive particles including a substrate particle and a conductive portion disposed on a surface of the substrate particle. The solder particles include, for example, preferably 80% by weight or more, more preferably 90% by weight or more, and still more preferably 95% by weight or more. The first conductive particle may include a substrate particle and a conductive portion disposed on a surface of the substrate particle. In this case, the first conductive particles have solder on the outer surface portion of the conductive portion. In addition, compared with the case where the above-mentioned solder particles are used, when the first conductive particles having base material particles not formed of solder and solder portions arranged on the surface of the base material particles are used, the first conductive material is used. It is difficult for the conductive particles to collect on the electrodes, and the solderability of the first conductive particles to each other is low. Therefore, the first conductive particles moved to the electrodes tend to move outside the electrodes, and the positional displacement between the electrodes is suppressed. The effect also tends to decrease. Therefore, the first conductive particles are preferably solder particles made of solder. From the viewpoint of effectively reducing the connection resistance of the connection structure and effectively suppressing the generation of voids, it is preferable that a carboxyl group or an amine group is present on the outer surface (the outer surface of the solder) of the first conductive particle, and more preferably A carboxyl group is present, preferably an amine group. The outer surface of the first conductive particle (the outer surface of the solder) is preferably covalently bonded to a group containing a carboxyl group through a Si-O bond, an ether bond, an ester bond, or a group represented by the following formula (X). Amino group. The group containing a carboxyl group or an amine group may also include both a carboxyl group and an amine group. In addition, in the following formula (X), the right end part and the left end part represent a bonding site. [Chemical 1]There are hydroxyl groups on the surface of the solder. By covalently bonding the hydroxyl group to a group containing a carboxyl group, a stronger bond than that obtained by other coordination bonds (chelation coordination) or the like can be formed. First conductive particles that reduce the connection resistance between electrodes and suppress the generation of voids. In the first conductive particle, the bonding form between the surface of the solder and the group containing a carboxyl group may not include a coordination bond, or a bond by chelate coordination. From the viewpoint of effectively reducing the connection resistance of the connection structure and effectively suppressing the generation of voids, the first conductive particles are preferably obtained by using a functional group capable of reacting with a hydroxyl group and a carboxyl group. Or an amine-based compound (hereinafter sometimes referred to as compound X), the functional group capable of reacting with the hydroxyl group is reacted with a hydroxyl group on the surface of the solder. A covalent bond is formed in the above reaction. By reacting the hydroxyl group on the surface of the solder with the functional group capable of reacting with the hydroxyl group in the compound X, it is possible to easily obtain the first conductivity in which the group containing a carboxyl group or an amine group is covalently bonded to the surface of the solder. The particles can also be obtained as first conductive particles having a group containing a carboxyl group or an amine group covalently bonded on the surface of the solder via an ether bond or an ester bond. By reacting the functional group capable of reacting with a hydroxyl group with the hydroxyl group on the surface of the solder, the compound X can be chemically bonded to the surface of the solder in a form of covalent bonding. Examples of the functional group capable of reacting with a hydroxyl group include a hydroxyl group, a carboxyl group, an ester group, and a carbonyl group. Preferred is a hydroxyl group or a carboxyl group. The functional group capable of reacting with a hydroxyl group may be a hydroxyl group or a carboxyl group. Examples of the compound having a functional group capable of reacting with a hydroxyl group include acetopropionic acid, glutaric acid, glycolic acid, succinic acid, malic acid, oxalic acid, malonic acid, adipic acid, and 5-oxohexanoic acid. , 3-hydroxypropionic acid, 4-aminobutyric acid, 3-mercaptopropionic acid, 3-mercaptoisobutyric acid, 3-methylthiopropionic acid, 3-phenylpropanoic acid, 3-phenylisobutyric acid, 4-phenylbutanoic acid, capric acid, dodecanoic acid, tetradecanoic acid, pentadecanoic acid, hexadecanoic acid, 9-hexadecenoic acid, heptadecanoic acid, stearic acid, oleic acid, Isoleic acid, linoleic acid, (9,12,15) -linolenic acid, nonadecanic acid, arachidic acid, decanedioic acid, and dodecanedioic acid. Preferred is glutaric acid or glycolic acid. The compound having a functional group capable of reacting with a hydroxyl group may be used alone, or two or more kinds may be used in combination. The compound having a functional group capable of reacting with a hydroxyl group is preferably a compound having at least one carboxyl group. The compound X preferably has a flux effect, and the compound X preferably has a flux effect in a state of being bonded to the surface of the solder. The compound with flux function can remove the oxide film on the solder surface and the oxide film on the electrode surface. Carboxyl has a flux effect. Examples of the compound having a flux function include acetic acid, glutaric acid, glycolic acid, succinic acid, 5-oxohexanoic acid, 3-hydroxypropionic acid, 4-aminobutyric acid, and 3-mercaptopropionic acid. Acids, 3-mercaptoisobutyric acid, 3-methylthiopropionic acid, 3-phenylpropanoic acid, 3-phenylisobutyric acid, 4-phenylbutanoic acid, and the like. Preferred is glutaric acid or glycolic acid. These compounds having a flux function may be used alone or in combination of two or more. From the viewpoint of effectively reducing the connection resistance of the connection structure and effectively suppressing the generation of voids, the functional group capable of reacting with a hydroxyl group in the compound X is preferably a hydroxyl group or a carboxyl group. The functional group capable of reacting with a hydroxyl group in the compound X may be a hydroxyl group or a carboxyl group. When the functional group capable of reacting with a hydroxyl group is a carboxyl group, the compound X preferably has at least two carboxyl groups. By reacting a carboxyl group of a part of a compound having at least two carboxyl groups with a hydroxyl group on the surface of the solder, first conductive particles having a group containing a carboxyl group covalently bonded to the surface of the solder can be obtained. The method for producing the first conductive particle includes, for example, a process of using the first conductive particle, mixing the first conductive particle, a compound having a functional group and a carboxyl group capable of reacting with a hydroxyl group, a catalyst, and a solvent. In the method for producing the first conductive particle, the first conductive particle having a group containing a carboxyl group covalently bonded to the surface of the solder can be easily obtained by the above-mentioned mixing process. In the method for producing the first conductive particle, it is preferable that the first conductive particle is used, the first conductive particle, a compound having the functional group and a carboxyl group capable of reacting with a hydroxyl group, and the contact The vehicle and the solvent are mixed and heated. The first conductive particles having a group containing a carboxyl group covalently bonded to the surface of the solder can be more easily obtained by a mixing and heating process. Examples of the solvent include alcohol solvents such as methanol, ethanol, propanol, and butanol, or acetone, methyl ethyl ketone, ethyl acetate, toluene, and xylene. The solvent is preferably an organic solvent, and more preferably toluene. These solvents may be used alone or in combination of two or more. Examples of the catalyst include p-toluenesulfonic acid, benzenesulfonic acid, and 10-camphorsulfonic acid. The catalyst is preferably p-toluenesulfonic acid. These catalysts may be used alone or in combination of two or more. Preferably, heating is performed during the above-mentioned mixing. The heating temperature is preferably 90 ° C or higher, more preferably 100 ° C or higher, and preferably 130 ° C or lower, and more preferably 110 ° C or lower. From the viewpoint of effectively reducing the connection resistance of the connection structure and effectively suppressing the generation of voids, it is preferable that the first conductive particles are obtained through a process in which an isocyanate compound is used to make the isocyanate compound and the hydroxyl group on the surface of the solder. Perform the reaction. A covalent bond is formed in the above reaction. By reacting the hydroxyl group on the surface of the solder with the isocyanate compound, the first conductive particles having the nitrogen atom derived from the isocyanate group covalently bonded to the surface of the solder can be easily obtained. By reacting the isocyanate compound with a hydroxyl group on the surface of the solder, the isocyanate-derived group can be chemically bonded to the surface of the solder in a form of covalent bonding. In addition, the silane coupling agent can be easily reacted with a group derived from an isocyanate group. Since the first conductive particles can be easily obtained, the carboxyl group-containing group is introduced by a reaction using a silane coupling agent having a carboxyl group, or the reaction having a silane coupling agent is used to make a group having at least one carboxyl group. The compound is introduced by reacting with a group derived from a silane coupling agent. The first conductive particles are preferably obtained by reacting the isocyanate compound with a hydroxyl group on the surface of the solder using the isocyanate compound, and then reacting a compound having at least one carboxyl group. From the viewpoint of effectively reducing the connection resistance of the connection structure and effectively suppressing the generation of voids, the compound having at least one carboxyl group preferably has a plurality of carboxyl groups. Examples of the isocyanate compound include diphenylmethane-4,4'-diisocyanate (MDI), hexamethylene diisocyanate (HDI), toluene diisocyanate (TDI), and isophorone diisocyanate (IPDI). . Other isocyanate compounds may be used. After the above isocyanate compound is reacted with the surface of the solder, the residual isocyanate group is allowed to react with the compound having a reactivity with the residual isocyanate group and having a carboxyl group, which can be expressed by the above formula (X). The base introduces the carboxyl group to the surface of the solder. As the isocyanate compound, a compound having an unsaturated double bond and an isocyanate group can also be used. Examples include 2-propenyloxyethyl isocyanate and 2-isocyanatoethyl methacrylate. By reacting the isocyanate group of the compound with the surface of the solder, the compound having a functional group having a reactive group for the remaining unsaturated double bond and having a carboxyl group can be reacted through the above formula (X). The indicated group introduces a carboxyl group to the surface of the solder. Examples of the silane coupling agent include 3-isocyanatopropyltriethoxysilane ("KBE-9007" manufactured by Shin-Etsu Silicones), and 3-isocyanatopropyltrimethoxysilane ( "Y-5187" manufactured by MOMENTIVE). These silane coupling agents may be used alone or in combination of two or more. Examples of the compound having at least one carboxyl group include acetopropionic acid, glutaric acid, glycolic acid, succinic acid, malic acid, oxalic acid, malonic acid, adipic acid, 5-oxohexanoic acid, 3- Hydroxypropionic acid, 4-aminobutyric acid, 3-mercaptopropionic acid, 3-mercaptoisobutyric acid, 3-methylthiopropionic acid, 3-phenylpropanoic acid, 3-phenylisobutyric acid, 4-benzene Butyric acid, capric acid, dodecanoic acid, myristic acid, pentadecanoic acid, hexadecanoic acid, 9-hexadecenoic acid, heptadecanoic acid, stearic acid, oleic acid, isoleic acid , Linoleic acid, (9,12,15) -linolenic acid, nonadecanic acid, arachidic acid, decanedioic acid, and dodecanedioic acid. Preference is given to glutaric acid, adipic acid or glycolic acid. These compounds having at least one carboxyl group may be used alone or in combination of two or more. By using the isocyanate compound, the isocyanate compound is reacted with the hydroxyl group on the solder surface, and then a part of the carboxyl group of the compound having a plurality of carboxyl groups is reacted with the hydroxyl group on the solder surface, so that the group containing the carboxyl group can be left. In the method for producing the first conductive particle, using the first conductive particle and using an isocyanate compound, the isocyanate compound is reacted with a hydroxyl group on the surface of the solder, and then a compound having at least one carboxyl group is reacted to obtain First conductive particles having a carboxyl group-containing group are bonded to the surface of the solder via the group represented by the formula (X). In the manufacturing method of the said 1st electroconductive particle, the 1st electroconductive particle which the group containing a carboxyl group was introduce | transduced into the surface of a solder can be obtained easily by the said process. As a specific manufacturing method of the said 1st electroconductive particle, the following method is mentioned. The first conductive particles are dispersed in an organic solvent, and a silane coupling agent having an isocyanate group is added. Thereafter, a reaction catalyst of a hydroxyl group and an isocyanate group on the surface of the solder of the first conductive particle is used to covalently bond the silane coupling agent to the surface of the solder. Then, a hydroxyl group is generated by hydrolyzing an alkoxy group of a silicon atom bonded to a silane coupling agent. The carboxyl group of a compound having at least one carboxyl group is reacted with the generated hydroxyl group. Moreover, as a specific manufacturing method of the said 1st electroconductive particle, the following method is mentioned. The first conductive particles are dispersed in an organic solvent, and a compound having an isocyanate group and an unsaturated double bond is added. Thereafter, a covalent bond is formed using a reaction catalyst between a hydroxyl group on the solder surface of the first conductive particle and an isocyanate group. Thereafter, a compound having an unsaturated double bond and a carboxyl group is reacted with the introduced unsaturated double bond. Examples of the reaction catalyst between the hydroxyl group and the isocyanate group on the solder surface of the first conductive particles include tin-based catalysts (such as dibutyltin dilaurate), amine-based catalysts (such as triethylene glycol diamine), and the like. Carboxylic acid ester catalysts (lead naphthenate, potassium acetate, etc.), and trialkylphosphine catalysts (triethylphosphine, etc.). From the viewpoint of effectively reducing the connection resistance of the connection structure and effectively suppressing the generation of voids, the compound having at least one carboxyl group is preferably a compound represented by the following formula (1). The compound represented by the following formula (1) has a flux effect. The compound represented by the following formula (1) has a flux effect in a state where the compound is introduced onto the surface of the solder. [Chemical 2]In the formula (1), X represents a functional group capable of reacting with a hydroxyl group, and R represents a divalent organic group having 1 to 5 carbon atoms. The organic group may include a carbon atom, a hydrogen atom, and an oxygen atom. The organic group may be a divalent hydrocarbon group having 1 to 5 carbon atoms. The main chain of the organic group is preferably a divalent hydrocarbon group. A carboxyl group or a hydroxyl group may be bonded to the divalent hydrocarbon group in the organic group. The compound represented by the formula (1) includes, for example, citric acid. The compound having at least one carboxyl group is preferably a compound represented by the following formula (1A) or the following formula (1B). The compound having at least one carboxyl group is preferably a compound represented by the following formula (1A), and more preferably a compound represented by the following formula (1B). [Chemical 3]In the formula (1A), R represents a divalent organic group having 1 to 5 carbon atoms. R in the above formula (1A) is the same as R in the above formula (1). [Chemical 4]In the formula (1B), R represents a divalent organic group having 1 to 5 carbon atoms. R in the above formula (1B) is the same as R in the above formula (1). It is preferable that a base represented by the following formula (2A) or the following formula (2B) is bonded to the surface of the solder. It is preferable that the base represented by the following formula (2A) is bonded to the surface of the solder, and more preferably the base represented by the following formula (2B) is bonded to the surface of the solder. In addition, in the following formula (2A), the left end portion indicates a bonding site. [Chemical 5]In the formula (2A), R represents a divalent organic group having 1 to 5 carbon atoms. R in the above formula (2A) is the same as R in the above formula (1). In addition, in the following formula (2B), the left end portion indicates a bonding site. [Chemical 6]In the formula (2B), R represents a divalent organic group having 1 to 5 carbon atoms. R in the above formula (2B) is the same as R in the above formula (1). From the viewpoint of improving the wettability of the solder surface, the molecular weight of the compound having at least one carboxyl group is preferably 10,000 or less, more preferably 1,000 or less, and even more preferably 500 or less. The above molecular weight means a molecular weight that can be calculated from the structural formula when the compound having at least one carboxyl group is not a polymer, and when the structural formula of the compound having at least one carboxyl group can be specified. When the compound having at least one carboxyl group is a polymer, it means a weight average molecular weight. In order to effectively improve the cohesiveness of the solder particles during the conductive connection, the first conductive particles preferably have a first conductive particle body and an anionic polymerization disposed on a surface of the first conductive particle body. Thing. The first conductive particles are preferably obtained by subjecting the first conductive particles to a surface treatment with an anionic polymer or a compound that becomes an anionic polymer. The first conductive particles are preferably surface-treated products using an anionic polymer or a compound that becomes an anionic polymer. The anionic polymer and the compound to be used as the anionic polymer may be used alone or in combination of two or more. The anionic polymer is a polymer having an acidic group. Examples of a method for surface-treating the first conductive particle body with an anionic polymer include a method using a (meth) acrylic polymer obtained by copolymerizing (meth) acrylic acid, a dicarboxylic acid and a dicarboxylic acid Polyester polymer synthesized by alcohol and having carboxyl groups at both ends, polymer obtained by intermolecular dehydration condensation reaction of dicarboxylic acid and having carboxyl groups at both ends, synthesized from dicarboxylic acid and diamine and having Polyester polymers having a carboxyl group, and modified polyvinyl alcohols having a carboxyl group ("GOHSENX T" manufactured by Nippon Synthetic Chemical Co., Ltd.) are used as anionic polymers so that the carboxyl group of the anionic polymer and The hydroxyl group reacts. Examples of the anionic part of the anionic polymer include the carboxyl group described above, and other examples include a tosylsulfonyl group (p-H₃ CC₆ H₄ S (= O)₂ -), Sulfonic ion group (-SO₃ ^- ), And phosphate ion group (-PO₄ ^- )Wait. In addition, as another method for surface-treating the first conductive particle body by using an anionic polymer, a method may be mentioned in which a functional group having a reaction with a hydroxyl group on the surface of the first conductive particle body is used, and further, it has The compound of a functional group polymerized by addition or condensation reaction polymerizes the compound on the surface of the first conductive particle body. Examples of the functional group that reacts with a hydroxyl group on the surface of the first conductive particle body include a carboxyl group and an isocyanate group. Examples of the functional group that is polymerized by an addition or condensation reaction include a hydroxyl group, a carboxyl group, and an amine. And (meth) acrylfluorenyl. The weight average molecular weight of the anionic polymer is preferably 2,000 or more, more preferably 3,000 or more, and preferably 10,000 or less, and more preferably 8,000 or less. When the weight average molecular weight is equal to or more than the lower limit and equal to or less than the upper limit, a sufficient amount of electric charge and fluxability can be introduced into the surface of the first conductive particles. Thereby, the cohesiveness of the first conductive particles can be effectively improved during the conductive connection, and the oxide film on the electrode surface can be effectively removed during the connection of the connection target member. If the weight-average molecular weight is greater than or equal to the lower limit and less than the upper limit, the anionic polymer can be easily disposed on the surface of the first conductive particle body, and the cohesiveness of the first conductive particle can be effectively improved during the conductive connection. The first conductive particles are arranged on the electrode more efficiently. The above weight average molecular weight indicates a weight average molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC). The weight average molecular weight of the polymer obtained by surface-treating the first conductive particle body with a compound that becomes an anionic polymer can be obtained by melting the solder in the first conductive particle and using After the first conductive particles are removed by dilute hydrochloric acid or the like which causes the decomposition of the polymer, the weight average molecular weight of the remaining polymer is measured. Next, a specific example of the first conductive particles will be described with reference to the drawings. 4 is a cross-sectional view showing a first example of first conductive particles that can be used for a conductive material. The first conductive particles 21 shown in FIG. 4 are solder particles. The entire first conductive particles 21 are made of solder. The first conductive particles 21 do not have substrate particles in the core, and are not core-shell particles. Both the central portion of the first conductive particles 21 and the outer surface portion of the conductive portion are formed of solder. FIG. 5 is a cross-sectional view showing a second example of the first conductive particles that can be used for a conductive material. The first conductive particles 31 shown in FIG. 5 include substrate particles 32 and a conductive portion 33 disposed on the surface of the substrate particles 32. The conductive portion 33 covers the surface of the substrate particles 32. The first conductive particles 31 are coated particles whose surface is covered with the conductive portion 33 on the surface of the substrate particles 32. The conductive portion 33 includes a second conductive portion 33A and a solder portion 33B (first conductive portion). The first conductive particles 31 include a second conductive portion 33A between the substrate particles 32 and the solder portion 33B. Therefore, the first conductive particles 31 include base material particles 32, a second conductive portion 33A disposed on the surface of the base particle 32, and a solder portion 33B disposed on an outer surface of the second conductive portion 33A. FIG. 6 is a cross-sectional view showing a third example of the first conductive particles that can be used for a conductive material. As described above, the conductive portion 33 in the first conductive particle 31 has a two-layer structure. The first conductive particle 41 shown in FIG. 6 has a solder portion 42 as a single-layer conductive portion. The first conductive particles 41 include base material particles 32 and solder portions 42 arranged on the surface of the base material particles 32. Examples of the substrate particles include resin particles, inorganic particles other than metal particles, organic-inorganic mixed particles, and metal particles. The substrate particles are preferably substrate particles other than metal, and are preferably resin particles, inorganic particles other than metal particles, or organic-inorganic mixed particles. The substrate particles may be copper particles. The substrate particles may be core-shell particles having a core and a shell arranged on a surface of the core. The core may be an organic core, and the shell may be an inorganic shell. As the resin for forming the resin particles, various organic substances can be preferably used. Examples of the resin for forming the resin particles include polyolefin resins such as polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyvinylidene chloride, polyisobutylene, and polybutadiene; polymethacrylic acid Acrylic resins such as methyl ester and polymethyl acrylate; polycarbonate, polyamide, phenol formaldehyde resin, melamine-formaldehyde resin, benzoguanamine formaldehyde resin, urea formaldehyde resin, phenol resin, melamine resin, benzoguanamine resin, Urea resin, epoxy resin, unsaturated polyester resin, saturated polyester resin, polyethylene terephthalate, polyfluorene, polyphenylene ether, polyacetal, polyimide, polyimide, imine, Polyetheretherketone, polyetherfluorene, divinylbenzene polymers, and divinylbenzene copolymers. Examples of the divinylbenzene-based copolymer include a divinylbenzene-styrene copolymer and a divinylbenzene- (meth) acrylate copolymer. Since the hardness of the resin particles can be easily controlled to a preferred range, the resin used to form the resin particles is preferably polymerized by polymerizing one or two or more polymerizable monomers having an ethylenically unsaturated group. Polymer. When the polymerizable monomer having an ethylenically unsaturated group is polymerized to obtain the resin particles, examples of the polymerizable monomer having an ethylenically unsaturated group include non-crosslinkable monomers and crosslinks. The monomer of sex. Examples of the non-crosslinkable monomer include styrene-based monomers such as styrene and α-methylstyrene; carboxyl-containing monomers such as (meth) acrylic acid, maleic acid, and maleic anhydride; ( Methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, lauryl (meth) acrylate (Meth) acrylic acid alkyl ester compounds such as cetyl (meth) acrylate, stearyl (meth) acrylate, cyclohexyl (meth) acrylate, iso (meth) acrylate, etc. ; Oxygen atom (meth) acrylate compounds such as 2-hydroxyethyl (meth) acrylate, glyceryl (meth) acrylate, polyoxyethylene (meth) acrylate, glycidyl (meth) acrylate; Nitrile-containing monomers such as (meth) acrylonitrile; vinyl ether compounds such as methyl vinyl ether, ethyl vinyl ether, and propyl vinyl ether; vinyl acetate, vinyl butyrate, vinyl laurate, vinyl stearate Isoacid vinyl ester compounds; unsaturated hydrocarbons such as ethylene, propylene, isoprene, butadiene; methyl trifluoro (meth) acrylate, pentafluoro (methyl) Acid ethyl ester, vinyl chloride, vinyl fluoride, chlorine halogen-containing monomers such as styrene and the like. Examples of the crosslinkable monomer include tetramethylolmethane tetra (meth) acrylate, tetramethylolmethane tri (meth) acrylate, and tetramethylolmethane di (meth) acrylic acid. Ester, trimethylolpropane tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol penta (meth) acrylate, glyceryl tri (meth) acrylate, di (meth) acrylic acid Glyceride, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, (poly) tetramethylene glycol di (meth) acrylate, 1,4- Multifunctional (meth) acrylate compounds such as butanediol di (meth) acrylate; triallyl (iso) cyanurate, triallyl trimellitate, divinylbenzene, phthalate diene Silane-containing compounds such as propyl ester, diallyl allylamine, diallyl ether, γ- (meth) propenyloxypropyltrimethoxysilane, trimethoxysilylstyrene, vinyltrimethoxysilane, etc. Monomer and so on. The resin particles can be obtained by polymerizing the polymerizable monomer having an ethylenically unsaturated group by a known method. Examples of the method include a method of performing suspension polymerization in the presence of a radical polymerization initiator, and a method of using a non-crosslinked seed particle to swell the radical polymerization initiator together with a monomer to perform polymerization. Wait. When the above-mentioned substrate particles are inorganic particles or organic-inorganic mixed particles other than metal particles, examples of the inorganic substance used to form the substrate particles include silicon dioxide, aluminum oxide, barium titanate, zirconia, and carbon black. Wait. The inorganic substance is preferably a non-metal. The particles formed from the above-mentioned silicon dioxide are not particularly limited, and examples thereof include particles obtained by hydrolyzing silicides of two or more hydrolyzable alkoxysilyl groups After the crosslinked polymer particles are formed, firing is performed as necessary. Examples of the organic-inorganic mixed particles include organic-inorganic mixed particles formed of a crosslinked alkoxysilyl polymer and an acrylic resin. The organic-inorganic mixed particles are preferably core-shell type organic-inorganic mixed particles having a core and a shell arranged on the surface of the core. The core is preferably an organic core. The shell is preferably an inorganic shell. From the viewpoint of more effectively reducing the connection resistance between the electrodes, the substrate particles are preferably organic-inorganic mixed particles having an organic core and an inorganic shell disposed on the surface of the organic core. As a material of the said organic core, the material of the said resin particle etc. are mentioned. Examples of the material of the inorganic shell include the inorganic materials listed above as the material of the substrate particles. The material of the inorganic shell is preferably silicon dioxide. The inorganic shell is preferably formed by forming a metal alkoxide on the surface of the core by a sol-gel method, and then firing the shell. The metal alkoxide is preferably an alkoxysilane. The inorganic shell is preferably formed from an alkoxysilane. When the substrate particles are metal particles, examples of the metal used to form the metal particles include silver, copper, nickel, silicon, gold, and titanium. When the substrate particles are metal particles, the metal particles are preferably copper particles. However, the substrate particles are preferably non-metal particles. The particle diameter of the substrate particles is preferably 0. 5 μm or more, more preferably 1 μm or more, still more preferably 3 μm or more, and more preferably 100 μm or less, more preferably 60 μm or less, and still more preferably 50 μm or less. If the particle diameter of the substrate particles is greater than or equal to the above lower limit, the contact area between the conductive particles and the electrodes becomes larger, so the reliability of the conduction between the electrodes is further improved, and the distance between the electrodes connected via the conductive particles can be more effectively reduced. Connect the resistor. Furthermore, it is difficult to aggregate when forming a conductive part on the surface of a base material particle, and it is difficult to form aggregated conductive particles. When the particle diameter of the substrate particles is equal to or smaller than the upper limit described above, the conductive particles are easily sufficiently compressed, and the connection resistance between the electrodes connected via the conductive particles can be more effectively reduced. The particle diameter of the substrate particles is particularly preferably 5 μm or more and 40 μm or less. If the particle diameter of the substrate particles is in the range of 5 μm or more and 40 μm or less, the interval between the electrodes can be made smaller, and even if the thickness of the conductive portion is made thicker, smaller conductive particles can be obtained. The particle diameter of the substrate particles indicates a diameter when the substrate particles are truly spherical, and indicates a maximum diameter when the substrate particles are not truly spherical. The particle diameter of the substrate particles indicates a number average particle diameter. The particle size of the substrate particles is determined using a particle size distribution measuring device or the like. The particle diameter of the substrate particles is preferably obtained by observing an arbitrary 50 substrate particles with an electron microscope or an optical microscope, and calculating an average value. When measuring the particle diameter of the said base material particle in electroconductive particle, it can measure it as follows, for example. The content of the conductive particles was added to "Technovit4000" manufactured by Kulzer Corporation so that the content of the conductive particles became 30% by weight, and dispersed to prepare a buried resin for conductive particle inspection. A cross-section of the conductive particles was cut out using an ion polishing apparatus ("IM4000" manufactured by Hitachi High-Technologies Corporation) so that the vicinity of the center of the conductive particles dispersed in the resin for inspection was passed through. Then, using a field emission scanning electron microscope (FE-SEM), the image magnification was set to 25,000 times, 50 conductive particles were randomly selected, and the substrate particles of each conductive particle were observed. The particle diameter of the base material particles in each conductive particle was measured, and the arithmetic mean value was calculated to be the particle diameter of the base material particles. A method of forming a conductive portion on the surface of the substrate particle, and a method of forming a solder portion on the surface of the substrate particle or the surface of the second conductive portion are not particularly limited. Examples of the method for forming the conductive portion and the solder portion include a method using electroless plating, a method using electroplating, a method using physical collision, a method using mechanochemical reaction, and physical vapor deposition or physical adsorption. And a method of applying a metal powder or a paste containing a metal powder and a binder to the surface of the substrate particles. The method of forming the conductive portion and the solder portion is preferably a method using electroless plating, electroplating, or physical collision. Examples of the method using the physical vapor deposition include methods such as vacuum vapor deposition, ion plating, and ion sputtering. In addition, in the above-mentioned method using physical collision, for example, Theta Composer (manufactured by Tokusho Work Co., Ltd.) is used. The melting point of the substrate particles is preferably higher than the melting points of the conductive portion and the solder portion. The melting point of the substrate particles is preferably more than 160 ° C, more preferably more than 300 ° C, even more preferably more than 400 ° C, and even more preferably more than 450 ° C. The melting point of the substrate particles may not reach 400 ° C. The melting point of the substrate particles may be 160 ° C or lower. The softening point of the substrate particles is preferably 260 ° C or higher. The softening point of the substrate particles may not reach 260 ° C. The first conductive particles may have a single-layer solder portion. The first conductive particles may have a plurality of layers of conductive portions (solder portion, second conductive portion). That is, two or more conductive portions may be laminated on the first conductive particles. When the conductive portion is two or more layers, it is preferable that the first conductive particles include solder on an outer surface portion of the conductive portion. The solder is preferably a metal (low melting point metal) having a melting point of 450 ° C or lower. The solder portion is preferably a metal layer (low melting point metal layer) having a melting point of 450 ° C or lower. The low melting point metal layer is a layer containing a low melting point metal. The solder in the first conductive particles is preferably metal particles (low-melting metal particles) having a melting point of 450 ° C. or lower. The low-melting metal particles are particles containing a low-melting metal. The low melting point metal means a metal having a melting point of 450 ° C or lower. The melting point of the low melting point metal is preferably 300 ° C or lower, and more preferably 160 ° C or lower. The solder in the first conductive particles preferably contains tin. 100% by weight of the metal contained in the solder portion and 100% by weight of the metal contained in the solder in the first conductive particle, the content of tin is preferably 30% by weight or more, more preferably 40% by weight or more It is more preferably 70% by weight or more, particularly preferably 90% by weight or more. When the content of tin in the solder in the first conductive particles is greater than or equal to the above lower limit, the conduction reliability between the first conductive particles and the electrode is further improved. Furthermore, the above-mentioned tin content can be measured using a high-frequency inductively coupled plasma emission spectrometer ("ICP-AES" manufactured by Horiba, Ltd.) or a fluorescent X-ray analyzer ("EDX-800HS", manufactured by Shimadzu Corporation). ) And so on. When the first conductive particles having the above-mentioned solder are used on the outer surface portion of the conductive portion, the solder melts and joins the electrodes, and the solder conducts between the electrodes. For example, since solder and electrodes are likely to be in surface contact rather than point contact, the connection resistance becomes low. In addition, the use of the first conductive particles having solder on the outer surface portion of the conductive portion improves the bonding strength between the solder and the electrode. As a result, it is more difficult for the solder to peel off from the electrode, and the conduction reliability is effectively improved. The low-melting-point metal constituting the solder portion and the solder particles is not particularly limited. The low melting point metal is preferably tin or an alloy containing tin. Examples of the alloy include tin-silver alloy, tin-copper alloy, tin-silver-copper alloy, tin-bismuth alloy, tin-zinc alloy, and tin-indium alloy. In terms of excellent wettability to the electrode, the above-mentioned low-melting metal is preferably tin, tin-silver alloy, tin-silver-copper alloy, tin-bismuth alloy, and tin-indium alloy. More preferred are tin-bismuth alloys and tin-indium alloys. The material constituting the solder (solder portion) is preferably a filler material having a liquidus of 450 ° C. or lower based on JIS Z3001: soldering term. Examples of the composition of the solder include metal compositions including zinc, gold, silver, lead, copper, tin, bismuth, and indium. A low melting point and lead-free tin-indium system (117 ° C eutectic) or tin-bismuth system (139 ° C eutectic) is preferred. That is, the solder is preferably lead-free, and is preferably solder containing tin and indium, or solder containing tin and bismuth. In order to further improve the bonding strength between the solder and the electrode, the solder in the first conductive particles may further include nickel, copper, antimony, aluminum, zinc, iron, gold, titanium, phosphorus, germanium, tellurium, cobalt, bismuth, and manganese. , Chromium, molybdenum, palladium and other metals. From the viewpoint of further improving the bonding strength between the solder and the electrode, the solder in the first conductive particles preferably contains nickel, copper, antimony, aluminum, or zinc. From the viewpoint of further improving the bonding strength between the solder and the electrode in the solder portion or the first conductive particles, the content of these metals used to increase the bonding strength is less than 100% by weight of the solder in the first conductive particles. It is preferably 0. 0001% by weight or more, and preferably 1% by weight or less. The melting point of the second conductive portion is preferably higher than the melting point of the solder portion. The melting point of the second conductive portion is preferably more than 160 ° C, more preferably more than 300 ° C, still more preferably more than 400 ° C, still more preferably more than 450 ° C, even more preferably more than 500 ° C, and most preferably more than 600 ° C. . Since the solder portion has a low melting point, it melts during conductive connection. The second conductive portion is preferably not melted during conductive connection. The first conductive particles are preferably used by melting solder, preferably used by melting the solder portion, and preferably used by melting the solder portion without melting the second conductive portion. Since the melting point of the second conductive portion is higher than the melting point of the solder portion, only the solder portion can be melted without melting the second conductive portion during the conductive connection. The absolute value of the difference between the melting point of the solder portion and the melting point of the second conductive portion exceeds 0 ° C, preferably 5 ° C or more, more preferably 10 ° C or more, still more preferably 30 ° C or more, and even more preferably 50 ° C or more. , Preferably 100 ° C or more. The second conductive portion preferably contains a metal. The metal constituting the second conductive portion is not particularly limited. Examples of the metal include gold, silver, copper, platinum, palladium, zinc, lead, aluminum, cobalt, indium, nickel, chromium, titanium, antimony, bismuth, germanium, and cadmium, and alloys thereof. Also, as the metal, tin-doped indium oxide (ITO) may be used. These metals may be used alone or in combination of two or more. The second conductive portion is preferably a nickel layer, a palladium layer, a copper layer, or a gold layer, more preferably a nickel layer or a gold layer, and even more preferably a copper layer. The first conductive particles preferably have a nickel layer, a palladium layer, a copper layer, or a gold layer, more preferably have a nickel layer or a gold layer, and even more preferably have a copper layer. By using the first conductive particles having these preferred conductive portions for connection between electrodes, the connection resistance between the electrodes is further reduced. In addition, solder portions can be more easily formed on the surfaces of these preferred conductive portions. The thickness of the solder portion is preferably 0. 005 μm or more, more preferably 0. 01 μm or more, and preferably 10 μm or less, more preferably 1 μm or less, and even more preferably 0. 3 μm or less. When the thickness of the solder portion is greater than or equal to the above lower limit and less than or equal to the above upper limit, sufficient conductivity can be obtained, and the first conductive particles do not become too hard, and the first conductive particles are sufficiently deformed during the connection between the electrodes. The average particle diameter of the first conductive particles is preferably 0. 5 μm or more, more preferably 1 μm or more, still more preferably 3 μm or more, and more preferably 100 μm or less, more preferably 50 μm or less, still more preferably 40 μm or less, and even more preferably 30 μm or less. If the average particle diameter of the first conductive particles is above the lower limit and below the upper limit, the solder in the first conductive particles can be disposed on the electrode more efficiently, and the solder in the first conductive particles can be easily placed. A large number are arranged between the electrodes, and the conduction reliability is further improved. The "average particle diameter" of the first conductive particles indicates a number average particle diameter. The average particle diameter of the first conductive particles is determined, for example, by observing an arbitrary 50 first conductive particles with an electron microscope or an optical microscope, and calculating an average value. The CV (coefficient of variation) value of the particle size of the first conductive particles is preferably 5% or more, more preferably 10% or more, and preferably 40% or less, and more preferably 30% or less. If the CV value of the particle diameter is greater than or equal to the lower limit and less than or equal to the upper limit, the solder can be more efficiently disposed on the electrode. However, the CV value of the particle diameter of the conductive particles may not be higher than 5%. The CV value (coefficient of variation) of the particle diameter of the first conductive particles can be measured as follows. CV value (%) = (ρ / Dn) × 100 ρ: standard deviation of the particle diameter of the first conductive particle Dn: average value of the particle diameter of the first conductive particle The shape of the first conductive particle is not special limited. The shape of the first conductive particles may be a spherical shape or a shape other than a spherical shape such as a flat shape. The acid value of the first conductive particles is preferably 0. 1 mg / KOH or more, more preferably 1 mg / KOH or more, and preferably 10 mg / KOH or less, and more preferably 7 mg / KOH or less. When the said acid value is more than the said lower limit and below the said upper limit, the heat resistance of hardened | cured material will improve further, and the discoloration of hardened | cured material will be suppressed further. The said acid value can be measured as follows. Add phenolphthalein to ethanol and use 0. 1N-KOH was neutralized to obtain a solution of 50 ml, and 1 g of the first conductive particles was added to the solution, and dispersed by ultrasonic treatment, and then 0. 1N-KOH was titrated. Of the 100% by weight of the conductive material, the content of the first conductive particles is preferably 1% by weight or more, more preferably 2% by weight or more, still more preferably 10% by weight or more, particularly preferably 20% by weight or more. It is preferably 30% by weight or more, and more preferably 90% by weight or less, more preferably 80% by weight or less, still more preferably 60% by weight or less, and even more preferably 50% by weight or less. If the content of the first conductive particles is above the lower limit and below the upper limit, the solder in the first conductive particles can be disposed on the electrode more efficiently, and the solder in the first conductive particles can be easily disposed in a large amount. Between the electrodes, the conduction reliability is further improved. From the viewpoint of further improving the conduction reliability, the content of the first conductive particles is preferably large. (Second conductive particle) The second conductive particle has silver, ruthenium, iridium, gold, palladium, or platinum (a conductive portion including silver, ruthenium, iridium, gold, palladium, or platinum) on the outer surface portion of the conductive portion. The second conductive particles may be metal particles made of silver, ruthenium, iridium, gold, palladium, or platinum. The metal particles include silver, ruthenium, iridium, gold, palladium, or platinum on an outer surface portion of the conductive portion. The metal particles are particles of silver, ruthenium, iridium, gold, palladium, or platinum on the central portion and the outer surface of the conductive portion. The metal particles do not have substrate particles as core particles. The metal particles are different from conductive particles including a substrate particle and a conductive portion disposed on a surface of the substrate particle. The outer surface portion of the conductive portion and the conductive portion containing silver, ruthenium, iridium, gold, palladium, or platinum include, for example, preferably 80% by weight or more, more preferably 90% by weight or more, and further preferably 95% by weight or more Of silver, ruthenium, iridium, gold, palladium and platinum. The second conductive particle may include a substrate particle and a conductive portion disposed on a surface of the substrate particle. In this case, the second conductive particles include silver, ruthenium, iridium, gold, palladium, or platinum on the outer surface portion of the conductive portion. The outer surface portion of the conductive portion of the second conductive particle has a higher melting point than the outer surface portion of the conductive portion of the first conductive particle. The melting point of the outer surface portion of the conductive portion of the second conductive particle and the conductive portion including silver, ruthenium, iridium, gold, palladium, or platinum is preferably higher than that of the outer surface portion of the conductive portion of the first conductive particle. 50 ° C or higher, preferably 100 ° C or higher. The melting point of the outer surface portion of the conductive portion of the second conductive particle and the conductive portion including silver, ruthenium, iridium, gold, palladium, or platinum is preferably 300 ° C or higher, more preferably 400 ° C or higher, and even more preferably Above 500 ℃. Examples of the substrate particles in the second conductive particles include the same substrate particles as the substrate particles in the first conductive particles. The second conductive particles may be conductive particles obtained by changing the solder in the conductive particles 21 shown in FIG. 4 to silver, ruthenium, iridium, gold, palladium, or platinum. The second conductive particles may be conductive particles obtained by changing the solder of the second conductive portion 33B in the conductive particles 31 shown in FIG. 5 to silver, ruthenium, iridium, gold, palladium, or platinum. The second conductive particles may be conductive particles obtained by changing the solder of the solder portion 42 in the conductive particles 41 shown in FIG. 6 to silver, ruthenium, iridium, gold, palladium, or platinum. The conductive portion containing silver, ruthenium, iridium, gold, palladium, or platinum may include at least one metal selected from the group consisting of silver, ruthenium, iridium, gold, palladium, and platinum. The conductive portion including silver, ruthenium, iridium, gold, palladium, or platinum may also include two or more metals selected from the group consisting of silver, ruthenium, iridium, gold, palladium, and platinum. Among conductive parts including silver, ruthenium, iridium, gold, palladium, or platinum, silver, ruthenium, iridium, gold, palladium, and platinum may also be alloyed. From the viewpoint of more efficiently disposing the solder in the first conductive particles on the electrode, it is preferable that the second conductive particles have silver, gold, palladium, or platinum on the outer surface portion of the conductive portion, and more preferably In order to have silver, gold, or palladium on the outer surface portion of the conductive portion, it is more preferable to have gold or palladium on the outer surface portion of the conductive portion, and it is more preferable to have gold on the outer surface portion of the conductive portion. The thickness of the above-mentioned conductive portion including silver, ruthenium, iridium, gold, palladium, or platinum is preferably 0. 005 μm or more, more preferably 0. 01 μm or more, and preferably 10 μm or less, more preferably 1 μm or less, and even more preferably 0. 3 μm or less. When the thickness of the conductive portion including silver, ruthenium, iridium, gold, palladium, or platinum is at least the above lower limit and at most the above upper limit, sufficient conductivity can be obtained. The average particle diameter of the second conductive particles is preferably 3 μm or more, and preferably 50 μm or less, more preferably 20 μm or less, and even more preferably 10 μm or less. When the second conductive particle is at least the above lower limit and at most the above upper limit, the second conductive particle can more efficiently dispose the solder in the first conductive particle on the electrode. The ratio of the average particle diameter of the first conductive particles to the average particle diameter of the second conductive particles (average particle diameter of the first conductive particles / average particle diameter of the second conductive particles) is preferably 1 or more , More preferably 2 or more, even more preferably 3 or more, and more preferably 4 or less. When the ratio (average particle diameter of the first conductive particles / average particle diameter of the second conductive particles) is equal to or more than the lower limit and equal to or less than the upper limit, the first conductive particles can be more efficiently conducted by the second conductive particles. The solder in the particles is disposed on the electrode. From the viewpoint of efficiently disposing the solder on the electrode, the average particle diameter of the second conductive particles is particularly preferably smaller than the average particle diameter of the first conductive particles. The "average particle diameter" of the second conductive particles indicates a number average particle diameter. The average particle diameter of the second conductive particles is obtained, for example, by observing an arbitrary 50 second conductive particles with an electron microscope or an optical microscope, and calculating an average value. The shape of the second conductive particles is not particularly limited. The shape of the second conductive particles may be a spherical shape or a shape other than a spherical shape such as a flat shape. The content of the second conductive particles in 100% by weight of the conductive material is preferably 1% by weight or more, and more preferably 3% by weight or more. When the content of the second conductive particles is greater than or equal to the above lower limit, the solder in the first conductive particles can be more efficiently arranged on the electrodes by the second conductive particles. The content of the second conductive particles in 100% by weight of the conductive material is preferably 10% by weight or less, and more preferably 5% by weight or less. If the content of the second conductive particles is greater than or equal to the above lower limit, the second conductive particles can more efficiently arrange the solder in the first conductive particles on the electrodes, and the bonding strength of the connection portion can be further improved. . From the viewpoint of efficiently disposing the solder in the first conductive particles on the electrode, the ratio of the content of the first conductive particles to the content of the second conductive particles is preferably 3 on a weight basis. The above is more preferably 10 or more, more preferably 80 or less, and even more preferably 70 or less. (Thermosetting compound) The said thermosetting compound is a compound which can be hardened by heating. Examples of the thermosetting compound include an oxetane compound, an epoxy compound, an episulfide compound, a (meth) acrylic compound, a phenol compound, an amino compound, an unsaturated polyester compound, and a polyurethane. Compounds, polysiloxanes and polyimide compounds. From the viewpoint of making the conductive material harder and viscosity better and further improving connection reliability, an epoxy compound or an episulfide compound is preferred. These thermosetting compounds may be used alone or in combination of two or more. From the viewpoint of more effectively disposing the solder on the electrode, it is preferable that the thermosetting compound includes a thermosetting compound having a polyether skeleton. Examples of the thermosetting compound having a polyether skeleton include a compound having a glycidyl ether group at both ends of an alkyl chain having a carbon number of 3 to 12, and a polyether skeleton having a carbon number of 2 to 4 and 2 to Ten polyether-type epoxy compounds and the like which are structural units in which the polyether skeleton is continuously bonded. From the viewpoint of effectively improving the heat resistance of the cured product and from the viewpoint of effectively reducing the dielectric constant of the cured product, it is preferable that the thermosetting compound includes a thermosetting compound having a tri- 𠯤 skeleton. Examples of the above-mentioned thermosetting compound having a triple skeleton include tris (glycidyl ether), and TEPIC Series (TEPIC-G, TEPIC-S, TEPIC-SS, manufactured by Nissan Chemical Industries, Ltd.). , TEPIC-HP, TEPIC-L, TEPIC-PAS, TEPIC-VL, TEPIC-UC). Examples of the epoxy compound include an aromatic epoxy compound. Crystalline epoxy compounds such as a resorcinol-type epoxy compound, a naphthalene-type epoxy compound, a biphenyl-type epoxy compound, and a benzophenone-type epoxy compound are preferred. An epoxy compound which is solid at normal temperature (23 ° C) and has a melting temperature below the melting point of the solder is preferred. The melting temperature is preferably 100 ° C or lower, more preferably 80 ° C or lower, and more preferably 40 ° C or higher. By using the above-mentioned preferred epoxy compound, the viscosity is high in the stage of bonding the connection target members, and when acceleration is applied due to the impact of transportation or the like, the first connection target member and the second connection target member can be suppressed. The position is shifted, and the viscosity of the conductive material can be greatly reduced by the heat during hardening, and the condensation of the solder can be performed efficiently. From the viewpoint of more efficiently disposing the solder on the electrode, the thermosetting compound is preferably a thermosetting compound that is liquid at 25 ° C. The content of the thermosetting compound in 100% by weight of the conductive material is preferably 20% by weight or more, more preferably 40% by weight or more, still more preferably 50% by weight or more, and more preferably 99% by weight or less, more It is preferably 98% by weight or less, more preferably 90% by weight or less, and even more preferably 80% by weight or less. If the content of the thermosetting compound is greater than or equal to the above lower limit and less than or equal to the above upper limit, the solder in the conductive particles can be disposed on the electrodes more efficiently, the positional displacement between the electrodes can be further suppressed, and the inter-electrode can be further improved The conduction reliability. From the viewpoint of further improving the impact resistance, the content of the thermosetting compound is preferably large. (Thermosetting agent) The thermosetting agent thermally hardens the thermosetting compound. Examples of the thermal curing agent include an imidazole curing agent, a phenol curing agent, a thiol curing agent, an amine curing agent, an acid anhydride curing agent, a thermal cation initiator, and a thermal radical generator. The said thermosetting agent may be used only 1 type, and may use 2 or more types together. The imidazole curing agent is not particularly limited, and examples thereof include 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, and 1-cyanoethyl-2- Phenylimidazolium trimellitate, 2,4-diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-mesantriol 𠯤 and 2,4-di Amino-6- [2'-methylimidazolyl- (1 ')]-ethyl-trisene 𠯤 isotricyanic acid adducts and the like. The thiol curing agent is not particularly limited, and examples thereof include trimethylolpropane tri-3-mercaptopropionate, pentaerythritol tetra-3-mercaptopropionate, and dipentaerythritol hexa-3-mercaptopropionate. The solubility parameter of the above thiol hardener is preferably 9. 5 or more, and preferably 12 or less. The above solubility parameters are calculated by the Fedors method. For example, trimethylolpropane tri-3-mercaptopropionate has a solubility parameter of 9. 6, the solubility parameter of dipentaerythritol hexa-3-mercaptopropionate is 11. 4. The amine hardener is not particularly limited, and examples thereof include hexamethylenediamine, octamethylenediamine, decamethylenediamine, 3,9-bis (3-aminopropyl) -2, 4,8,10-four-spiral [5. 5] Undecane, bis (4-aminocyclohexyl) methane, m-phenylenediamine, and diaminodiphenylphosphonium. Examples of the thermal cationic initiator include a fluorene-based cationic curing agent,Based cationic hardeners and fluorene based cationic hardeners. Examples of the fluorene-based cationic hardener include bis (4-thirdbutylphenyl) fluorene hexafluorophosphate and the like. As aboveCation hardener, trimethylTetrafluoroborate, etc. Examples of the fluorene-based cationic hardener include tri-p-tolyl fluorene hexafluorophosphate and the like. The thermal radical generator is not particularly limited, and examples thereof include an azo compound and an organic peroxide. Examples of the azo compound include azobisisobutyronitrile (AIBN) and the like. Examples of the organic peroxide include di-third butyl peroxide and methyl ethyl ketone peroxide. The reaction start temperature of the above-mentioned thermosetting agent is preferably 50 ° C or higher, more preferably 70 ° C or higher, even more preferably 80 ° C or higher, and more preferably 250 ° C or lower, more preferably 200 ° C or lower, and even more preferably 150 ° C. The temperature is below 140 ° C, particularly preferably below 140 ° C. When the reaction start temperature of the thermosetting agent is equal to or higher than the lower limit and equal to or lower than the upper limit, the first conductive particles can be disposed on the electrode more efficiently. The reaction start temperature of the thermosetting agent is particularly preferably 80 ° C or higher and 140 ° C or lower. From the viewpoint of more efficiently disposing the solder on the electrode, the reaction starting temperature of the thermal hardener is preferably higher than the melting point of the solder in the first conductive particles, more preferably 5 ° C or higher, and It is preferably 10 ° C or higher. The reaction start temperature of the above-mentioned thermosetting agent means the temperature at which the rise of the exothermic peak in DSC (Differential Scanning Calorimetry) is started. The content of the thermosetting agent is not particularly limited. Relative to 100 parts by weight of the entire thermosetting compound, the content of the thermosetting agent is preferably 0. 01 parts by weight or more, more preferably 1 part by weight or more, and preferably 200 parts by weight or less, more preferably 100 parts by weight or less, and still more preferably 75 parts by weight or less. When the content of the thermosetting agent is at least the above-mentioned lower limit, it is easy to sufficiently harden the conductive material. If the content of the heat curing agent is equal to or less than the above-mentioned upper limit, the remaining heat curing agent that does not participate in hardening does not easily remain after curing, and the heat resistance of the cured product is further improved. (Flux) The conductive material preferably contains a flux. By using the flux, the solder can be more efficiently placed on the electrode. The flux is not particularly limited. As the flux, a flux generally used for soldering or the like can be used. Examples of the flux include zinc chloride, a mixture of zinc chloride and an inorganic halide, a mixture of zinc chloride and an inorganic acid, a molten salt, phosphoric acid, a derivative of phosphoric acid, an organic halide, hydrazine, an organic acid, and Rosin, etc. These fluxes may be used alone, or two or more of them may be used in combination. Examples of the molten salt include ammonium chloride. Examples of the organic acid include lactic acid, citric acid, stearic acid, glutamic acid, and glutaric acid. Examples of the turpentine include active turpentine and inactive turpentine. The above-mentioned flux is preferably an organic acid or rosin having two or more carboxyl groups. The above-mentioned flux may be an organic acid having two or more carboxyl groups, or may be rosin. With the use of organic acids and rosin having two or more carboxyl groups, the reliability of conduction between the electrodes is further improved. The rosin is a rosin containing rosin acid as a main component. The flux is preferably rosin, and more preferably rosin acid. With the use of the better flux, the reliability of the conduction between the electrodes is further improved. The activity temperature (melting point) of the above flux is preferably 50 ° C or higher, more preferably 70 ° C or higher, even more preferably 80 ° C or higher, and more preferably 200 ° C or lower, more preferably 190 ° C or lower, and even more preferably 160. ℃ or lower, more preferably 150 ℃ or lower, and even more preferably 140 ℃ or lower. When the active temperature of the flux is above the lower limit and below the upper limit, the flux effect can be more effectively exerted, and the first conductive particles can be disposed on the electrode more efficiently. The activity temperature (melting point) of the flux is preferably 80 ° C or higher and 190 ° C or lower. The activity temperature (melting point) of the above-mentioned flux is particularly preferably 80 ° C or higher and 140 ° C or lower. Examples of the flux whose activity temperature (melting point) of the flux is 80 ° C or higher and 190 ° C or lower include succinic acid (melting point 186 ° C), glutaric acid (melting point 96 ° C), adipic acid (melting point 152 ° C), Dicarboxylic acids such as pimelic acid (melting point: 104 ° C), suberic acid (melting point: 142 ° C), benzoic acid (melting point: 122 ° C), malic acid (melting point: 130 ° C), and the like. The boiling point of the flux is preferably 200 ° C or lower. From the viewpoint of more efficiently disposing the solder on the electrode, the melting point of the flux is preferably higher than the melting point of the solder in the first conductive particle, more preferably 5 ° C or higher, and even more preferably Above 10 ° C. From the viewpoint of more efficiently disposing the solder on the electrode, the melting point of the above-mentioned flux is preferably higher than the reaction starting temperature of the above-mentioned thermosetting agent, more preferably 5 ° C or higher, and further preferably 10 ° C or higher. the above. The above-mentioned flux may be dispersed in a conductive material or may be adhered to the surface of the first conductive particles. Since the melting point of the flux is higher than the melting point of the solder, the first conductive particles can be efficiently aggregated on the electrode portion. The reason is that when heating is performed at the time of joining, if the electrode formed on the connection target member is compared with the portion of the connection target member around the electrode, the thermal conductivity of the electrode portion is higher than that of the connection target around the electrode. The thermal conductivity of the component part, thereby, the temperature rise of the electrode part is faster. When the melting point of the first conductive particles exceeds the melting point of the first conductive particles, the inside of the first conductive particles melts, but the oxide film formed on the surface has not been removed because the melting point (active temperature) of the flux has not been reached. In this state, since the temperature of the electrode part reaches the melting point (active temperature) of the flux first, the oxide coating on the surface of the first conductive particle that reaches the electrode preferentially is removed, and the first conductive particle can be on the electrode. Wetting and diffusion on the surface. Thereby, the first conductive particles can be efficiently aggregated on the electrode. The above-mentioned flux is preferably a flux that releases cations by heating. By using the flux which releases a cation by heating, the 1st electroconductive particle can be arrange | positioned on an electrode more efficiently. Examples of the flux that releases cations by heating include the above-mentioned thermal cation initiators. 100% by weight of the conductive material, the content of the flux is preferably 0. 5% by weight or more, and preferably 30% by weight or less, and more preferably 25% by weight or less. The conductive material may not include a flux. If the content of the flux is above the above lower limit and below the above upper limit, it becomes more difficult to form an oxide film on the surface of the solder and the electrode, and further, the oxide film formed on the surface of the solder and the electrode can be more effectively removed. (Insulating particles) The conductive material preferably contains insulating particles. In the conductive material, the insulating particles may not be adhered to any one of the surface of the first conductive particles and the surface of the second conductive particles. In the conductive material, the insulating particles are preferably separated from the first conductive particles, and the insulating particles are preferably separated from the second conductive particles. By including the above-mentioned insulating particles, the interval between the members to be connected by the hardened material of the conductive material and the interval between the members to be connected by the solder in the first conductive particles can be controlled with high accuracy. . The average particle diameter of the insulating particles is preferably 10 μm or more, more preferably 20 μm or more, still more preferably 25 μm or more, and more preferably 100 μm or less, more preferably 75 μm or less, and even more preferably 50 μm or less. If the average particle diameter of the insulating particles is greater than or equal to the above lower limit and less than or equal to the above upper limit, the interval between the connection target members connected by the hardened material of the conductive material, and the connection by the solder in the first conductive particle. The spacing between connected object components will become more moderate. Examples of the material of the insulating particles include insulating resins and insulating inorganic substances. Specific examples of the insulating resin as the material of the insulating particles include polyolefin compounds, (meth) acrylate polymers, (meth) acrylate copolymers, block polymers, thermoplastic resins, and thermoplastic resins. Crosslinked products, thermosetting resins and water-soluble resins. Examples of the polyolefin compound include polyethylene, ethylene-vinyl acetate copolymer, and ethylene-acrylate copolymer. Examples of the (meth) acrylate polymer include polymethyl (meth) acrylate, polyethyl (meth) acrylate, and polybutyl (meth) acrylate. Examples of the block polymer include polystyrene, a styrene-acrylate copolymer, a styrene-butadiene (styrene-butadiene) type styrene-butadiene block copolymer, and an SBS (styrene -butadiene-styrene, styrene-butadiene-styrene) type styrene-butadiene block copolymer, and hydrides thereof. Examples of the thermoplastic resin include a vinyl polymer and a vinyl copolymer. Examples of the thermosetting resin include epoxy resin, phenol resin, and melamine resin. Examples of the water-soluble resin include polyvinyl alcohol, polyacrylic acid, polyacrylamide, polyvinylpyrrolidone, polyethylene oxide, and methyl cellulose. A water-soluble resin is preferred, and polyvinyl alcohol is more preferred. Specific examples of the insulating inorganic substance as the material of the insulating particles include silicon dioxide and organic-inorganic mixed particles. The particles formed from the above-mentioned silicon dioxide are not particularly limited, and examples thereof include particles obtained by hydrolyzing silicides of two or more hydrolyzable alkoxysilyl groups After the crosslinked polymer particles are formed, firing is performed as necessary. Examples of the organic-inorganic mixed particles include organic-inorganic mixed particles formed of a crosslinked alkoxysilyl polymer and an acrylic resin. 100% by weight of the conductive material, the content of the insulating particles is preferably 0. 1% by weight or more, more preferably 0. 5% by weight or more, and preferably 10% by weight or less, and more preferably 5% by weight or less. The conductive material may not include insulating particles. If the content of the insulating particles is at least the above lower limit and below the above upper limit, the interval between the connection target members connected by the hardened material of the conductive material and the interval between the connection target members connected by the solder will be further increased. Moderate. (Other components) The above-mentioned conductive material may include, for example, fillers, extenders, softeners, plasticizers, polymerization catalysts, hardening catalysts, colorants, antioxidants, heat stabilizers, light stabilizers, and ultraviolet rays as needed. Various additives such as absorbents, lubricants, antistatic agents and flame retardants. (Connection structure and manufacturing method of connection structure) The connection structure of the present invention includes a first connection target member having at least one first electrode on the surface, and a second connection target member having at least one second electrode on the surface. And a connecting portion that connects the first connection target member and the second connection target member. In the connection structure of the present invention, the material of the connection portion is the above-mentioned conductive material. The connection portion is a hardened material of the conductive material. The connection portion is formed of the conductive material. In the connection structure of the present invention, the first electrode and the second electrode are electrically connected through a solder portion of the connection portion. The connection portion includes a hardened portion, a solder portion, and second conductive particles having silver, ruthenium, iridium, gold, palladium, or platinum on an outer surface portion of the conductive portion. In the connection structure, the second conductive particles are arranged in the solder portion. It is preferable that the said 2nd electroconductive particle has gold, palladium, or platinum in the outer surface part of a conductive part. The method for manufacturing the above-mentioned connection structure includes the following process: a process of using the above-mentioned conductive material to arrange the above-mentioned conductive material on the surface of a first connection target member having at least one first electrode on the surface; A process in which the second connection target member of each second electrode is disposed on the surface of the conductive material opposite to the first connection target member side so that the first electrode and the second electrode face each other; and The conductive material is heated to a temperature above the melting point of the solder in the first conductive particles, and the conductive material is used to form a connection portion that connects the first connection target member and the second connection target member, and the connection portion passes through the connection portion. The process of electrically connecting the first electrode and the second electrode by a solder part in the process. The conductive material is preferably heated to a temperature higher than the curing temperature of the thermosetting component or the thermosetting compound. In the obtained connection structure, the above-mentioned second conductive particles were arranged in the solder portion. In the connection structure of the present invention and the method of manufacturing the connection structure, since a specific conductive material is used, the solder in the plurality of first conductive particles is easily gathered on the first electrode by the second conductive particles. With the second electrode, the solder can be efficiently disposed on the electrode (wire). Moreover, it is difficult to dispose a part of the solder in a region (space) where no electrode is formed, and the amount of solder disposed in a region where no electrode is formed can be greatly reduced. Therefore, the conduction reliability between the first electrode and the second electrode can be improved. In addition, it is possible to prevent electrical connection between electrodes that are not connectable in the lateral direction and to improve insulation reliability. Moreover, in order to efficiently arrange the solder in the plurality of first conductive particles on the electrode and greatly reduce the amount of solder disposed in the region where the electrode is not formed, it is preferable to use a conductive paste instead of a conductive film. The thickness of the solder portion between the electrodes is preferably 10 μm or more, more preferably 20 μm or more, and preferably 100 μm or less, and more preferably 80 μm or less. Solder wetted area on the surface of the electrode (area of solder contact in 100% of the exposed area of the electrode) is exposed relative to the first electrode before the connection portion is formed and the second electrode electrically connected to the first electrode The area of 100% of the contact area of the solder portion after forming the connection portion is preferably 50% or more, more preferably 70% or more, and preferably 100% or less. The average particle diameter of the second conductive particles may be equal to or less than the thickness of the solder portion between the electrodes, or may not be greater than the thickness of the solder portion between the electrodes, or may be less than 1/2 of the thickness of the solder portion between the electrodes. It may also be 1/3 or less of the thickness of the solder portion between the electrodes. Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view schematically showing a connection structure obtained by using a conductive material according to an embodiment of the present invention. The connection structure 1 shown in FIG. 1 includes a first connection target member 2, a second connection target member 3, and a connection portion 4 that connects the first connection target member 2 and the second connection target member 3. The connection portion 4 is formed of the aforementioned conductive material. In this embodiment, the conductive material includes solder particles as the first conductive particles. The connection portion 4 includes a solder portion 4A in which a plurality of solder particles are aggregated and bonded to each other, a hardened portion 4B formed by thermally curing a thermosetting component, and second conductive particles 11C. The first connection target member 2 has a plurality of first electrodes 2a on a surface (upper surface). The second connection target member 3 has a plurality of second electrodes 3a on the surface (lower surface). The first electrode 2a and the second electrode 3a are electrically connected through the solder portion 4A. Therefore, the first connection target member 2 and the second connection target member 3 are electrically connected by the solder portion 4A. In the connection structure 1, the second conductive particles 11C are arranged in the solder portion 4A. In the connection portion 4, solder is not present in a region (a portion of the hardened portion 4B) different from the solder portion 4A collected between the first electrode 2a and the second electrode 3a. In a region different from the solder portion 4A (the portion of the hardened portion 4B), there is no solder separated from the solder portion 4A. Furthermore, if the amount is small, solder may be present in a region (a portion of the hardened portion 4B) different from the solder portion 4A collected between the first electrode 2a and the second electrode 3a. In the connection portion 4, the second conductive particles 11C are not present in a region other than the solder portion 4A (the portion of the hardened portion 4B) collected between the first electrode 2 a and the second electrode 3 a. In the region of the solder portion 4A (the portion of the hardened portion 4B), there are no second conductive particles 11C separated from the solder portion 4A. In addition, if it is a small amount, the second conductive particles 11C may also be present in a region other than the solder portion 4A (the portion of the hardened portion 4B) collected between the first electrode 2a and the second electrode 3a. As shown in FIG. 1, in the connection structure 1, a plurality of solder particles are gathered between the first electrode 2a and the second electrode 3a. After the plurality of solder particles are melted, the molten material of the solder particles wets and diffuses on the surface of the electrode. Post-curing to form the solder portion 4A. Therefore, the connection area between the solder portion 4A and the first electrode 2a, and the solder portion 4A and the second electrode 3a become larger. Therefore, the connection reliability and connection reliability of the connection structure 1 are improved. Furthermore, the flux contained in the conductive material is usually gradually deactivated by heating. Furthermore, in the connection structure 1 shown in FIG. 1, all the solder portions 4A are located in regions facing each other between the first and second electrodes 2 a and 3 a. The connection structure 1X of the modification shown in FIG. 3 is different from the connection structure 1 shown in FIG. 1 only in the connection portion 4X. The connection portion 4X includes a solder portion 4XA and a hardened portion 4XB. Like the connection structure 1X, the solder portion 4XA is mostly located in the area facing the first and second electrodes 2a and 3a, and a part of the solder portion 4XA can also be oriented from the area facing the first and second electrodes 2a and 3a. Stick out on the side. The solder portion 4XA protruding from the side opposite to the first and second electrodes 2a and 3a is a portion of the solder portion 4XA, and is not solder separated from the solder portion 4XA. Furthermore, in this embodiment, although the amount of solder spaced from the solder portion can be reduced, the hardened portion may also have solder spaced from the solder portion. Furthermore, in the connection structure 1X, the second conductive particles 11C are also arranged in the solder portion 4XA. When the amount of solder particles used is reduced, it becomes easy to obtain the connection structure 1. When the amount of solder particles used is increased, it becomes easy to obtain the connection structure 1X. From the viewpoint of further improving the conduction reliability, it is preferable to observe a portion of the first electrode facing the second electrode in a lamination direction of the first electrode, the connection portion, and the second electrode, in The solder portion of the connection portion is disposed at 50% or more (preferably 60% or more, and more preferably 70% or more) of an area of 100% of an area of the first electrode facing the second electrode. From the viewpoint of further improving the conduction reliability, it is preferable that the first electrode and the second electrode are opposed to each other when viewed in a direction orthogonal to the lamination direction of the first electrode, the connection portion, and the second electrode. In the case where the first electrode and the second electrode face each other, at least 60% (preferably 70% or more, more preferably 90% or more, and even more preferably) of the solder portion of the connection portion is arranged. 99% or more). From the viewpoint of further improving the conduction reliability and insulation reliability, the ratio of the number of the second conductive particles arranged in the solder portion to the total number of the second conductive particles in the connection portion is preferably 100%. It is 50% or more, more preferably 80% or more, still more preferably 90% or more, and even more preferably 95% or more. Next, an example of a method for manufacturing the connection structure 1 using the conductive material according to an embodiment of the present invention will be described. First, the first connection target member 2 having the first electrode 2a on the surface (upper surface) is prepared. Next, as shown in FIG. 2 (a), a conductive material 11 (a first Process). The conductive material used includes a thermosetting compound and a thermosetting agent as the thermosetting component 11B. A conductive material 11 is disposed on a surface of the first connection target member 2 on which the first electrode 2a is provided. After the conductive material 11 is disposed, the solder particles 11A are disposed on both the first electrode 2a (line) and the area (space) where the first electrode 2a is not formed. The arrangement method of the conductive material 11 is not particularly limited, and examples thereof include coating using a dispenser, screen printing, and discharging using an inkjet device. Moreover, the second connection target member 3 having the second electrode 3a on the surface (lower surface) is prepared. Next, as shown in FIG. 2 (b), among the conductive material 11 on the surface of the first connection target member 2, a second connection is arranged on the surface of the conductive material 11 opposite to the first connection target member 2 side. Target component 3 (second process). The second connection target member 3 is disposed on the surface of the conductive material 11 from the second electrode 3a side. At this time, the first electrode 2a and the second electrode 3a are opposed to each other. Next, the conductive material 11 is heated above the melting point of the solder particles 11A (third process). The conductive material 11 is preferably heated to a temperature higher than the curing temperature of the thermosetting component 11B (adhesive). During this heating, the solder particles 11A existing in the region where the electrode is not formed are collected between the first electrode 2a and the second electrode 3a (self-aggregation effect). At this time, the second conductive particles 11C existing between the plurality of solder particles 11A attract the solder particles 11A and promote the movement of the solder particles 11A. When a conductive paste is used instead of a conductive film, the solder particles 11A are effectively collected between the first electrode 2a and the second electrode 3a. In addition, the solder particles 11A are melted and bonded to each other. The thermosetting component 11B is thermoset. As a result, as shown in FIG. 2 (c), the connection portion 4 that connects the first connection target member 2 and the second connection target member 3 is formed of the conductive material 11. The connection portion 4 is formed by the conductive material 11, a plurality of solder particles 11A are joined to form a solder portion 4A, and the thermosetting component 11B is thermally cured to form a hardened portion 4B. The second conductive particles 11C are arranged and introduced in the solder portion 4A. As long as the solder particles 11A move sufficiently, the solder particles 11A, which are never located between the first electrode 2a and the second electrode 3a, begin to move until the movement of the solder particles 11A to the first electrode 2a and the second electrode 3a ends, and The temperature may not be kept constant. In this embodiment, it is preferable not to pressurize in the said 2nd process and the said 3rd process. In this case, the weight of the second connection target member 3 is applied to the conductive material 11. Therefore, when the connection portion 4 is formed, the solder particles 11A are effectively collected between the first electrode 2a and the second electrode 3a. Furthermore, if pressure is applied in at least one of the second process and the third process, the tendency of the solder particles 11A to aggregate between the first electrode 2a and the second electrode 3a is hindered. . Furthermore, in this embodiment, since no pressure is applied, when the second connection target member is superposed on the first connection target member coated with a conductive material, even if the electrode of the first connection target member and the second connection target member are When the alignment of the electrode of the connection target member is shifted so that the first connection target member overlaps with the second connection target member, the offset may be corrected so that the electrode of the first connection target member and the second connection target Component electrode connection (self-aligned effect). The reason is that for the molten solder that self-agglomerates between the electrode of the first connection target member and the electrode of the second connection target member, the When the area where the solder and other components of the conductive material are in contact is minimized, it is stable to energy, so the force that forms the connection structure that is the smallest area, that is, the aligned connection structure, acts. At this time, it is desirable that the conductive material is not hardened and the viscosity of components other than the conductive particles of the conductive material is sufficiently low under the conditions of the temperature and time. In this way, the connection structure 1 shown in FIG. 1 is obtained. The second process and the third process may be performed continuously. Moreover, after performing the said 2nd process, you may carry out the said 3rd process by moving the laminated body of the 1st connection object member 2, the conductive material 11, and the 2nd connection object member 3 obtained to a heating part. In order to perform the heating, the laminated body may be arranged on a heating member, or the laminated body may be arranged in a heated space. The heating temperature in the third process is preferably 140 ° C or higher, more preferably 160 ° C or higher, and more preferably 450 ° C or lower, more preferably 250 ° C or lower, and even more preferably 200 ° C or lower. Examples of the heating method in the third process include a method of heating the entire connection structure to a temperature higher than the melting point of the solder and a temperature higher than the curing temperature of the thermosetting compound using a reflow furnace or an oven, or only to the connection structure locally. A method for heating the connection part of the body. The first and second connection target members are not particularly limited. Specific examples of the first and second connection target members include semiconductor wafers, semiconductor packages, LED (Light Emitting Diode) wafers, electronic components such as LED packages, capacitors, and diodes, And electronic parts such as resin films, printed substrates, flexible printed substrates, flexible flat cables, rigid flexible substrates, glass epoxy substrates, and circuit substrates such as glass substrates. The first and second connection target members are preferably electronic components. Preferably, at least one of the first connection target member and the second connection target member is a resin film, a flexible printed circuit board, a flexible flat cable, or a rigid flexible substrate. The second connection target member is preferably a resin film, a flexible printed circuit board, a flexible flat cable, or a rigid flexible substrate. Resin films, flexible printed circuit boards, flexible flat cables, and rigid flexible substrates have high flexibility and are relatively lightweight. When a conductive film is used for connection of such a connection target member, solder tends to be hardly collected on the electrode. In contrast, by using a conductive paste, even if a resin film, a flexible printed circuit board, a flexible flat cable, or a rigid flexible substrate is used, the solder can be efficiently collected on the electrodes, thereby sufficiently improving the conduction between the electrodes reliability. When a resin film, a flexible printed circuit board, a flexible flat cable, or a rigid flexible substrate is used, compared with a case where other connection target members such as a semiconductor wafer are used, conduction between the electrodes can be obtained more effectively without pressure Improved reliability. Examples of the electrode provided on the connection target member include metal electrodes such as gold electrodes, nickel electrodes, tin electrodes, aluminum electrodes, copper electrodes, molybdenum electrodes, silver electrodes, SUS (Steel Use Stainless) electrodes, and tungsten electrodes. When the connection target member is a flexible printed circuit board, the electrode is preferably a gold electrode, a nickel electrode, a tin electrode, a silver electrode, or a copper electrode. When the connection target member is a glass substrate, the electrode is preferably an aluminum electrode, a copper electrode, a molybdenum electrode, a silver electrode, or a tungsten electrode. Furthermore, when the above-mentioned electrode is an aluminum electrode, it may be an electrode formed of only aluminum, or an electrode having an aluminum layer on the surface area of the metal oxide layer. Examples of the material of the metal oxide layer include indium oxide doped with a trivalent metal element and zinc oxide doped with a trivalent metal element. Examples of the trivalent metal element include Sn, Al, and Ga. Hereinafter, the present invention will be specifically described with examples and comparative examples. The invention is not limited to the following examples. Polymer A: (1) Synthesis of the first reactant of bisphenol F and 1,6-hexanediol diglycidyl ether and bisphenol F-type epoxy resin: Bisphenol F (weight ratio of 2 :: 3: 1 contains 4,4'-methylenebisphenol, 2,4'-methylenebisphenol, and 2,2'-methylenebisphenol) 72 parts by weight of 1,6-hexanediol di 270 parts by weight of glycidyl ether and 30 parts by weight of bisphenol F-type epoxy resin ("EPICLON EXA-830CRP" manufactured by DIC Corporation) were put into a three-necked flask, and the mixture was melted at 100 ° C under a nitrogen stream. Thereafter, tetra-n-butyl bromide hydrazone 0 was added as a catalyst for the addition reaction of hydroxyl and epoxy groups. One part by weight was subjected to an addition polymerization reaction at 130 ° C. for 6 hours under a nitrogen stream to obtain a first reactant. The addition polymerization reaction was confirmed by NMR (Nuclear Magnetic Resonance), and it was confirmed that the first reactant had a hydroxyl group derived from bisphenol F and 1,6-hexanediol diglycidyl ether, and bisphenol in the main chain. Structural unit of epoxy group bonding of F-type epoxy resin, and has epoxy groups at both ends. (2) Synthesis of polymer A: 100 parts by weight of the above-mentioned first reactant was put into a three-necked flask and melted at 120 ° C under a nitrogen stream. Thereafter, 2 parts by weight of "KBE-9007" (3-isocyanatopropyltriethoxysilane) manufactured by Shin-Etsu Silicones was added, and a side chain hydroxyl group and 3-isocyanate as the first reactant were added. Isocyanate reaction catalyst of cyanopropyltriethoxysilane dibutyltin dilaurate 002 parts by weight, and allowed to react for 4 hours at 120 ° C under a nitrogen stream. Thereafter, it was dried under vacuum at 110 ° C for 5 hours to remove unreacted KBE-9007. The reaction of the side chain hydroxyl group of the first reactant with the isocyanate group of 3-isocyanatopropyltriethoxysilane was confirmed by NMR, and it was confirmed that the obtained compound has a bisphenol F derived from bisphenol F in the main chain. Structural unit of epoxy group bonding of hydroxyl group with 1,6-hexanediol diglycidyl ether and bisphenol F epoxy resin, and having epoxy groups at both ends and propyl triethoxy in side chains Silane. Thus, a phenoxy resin (Polymer A) was obtained. Thermosetting compound 1: Resorcinol type epoxy compound, "Epolight TDC-LC" manufactured by Kyoeisha Chemical Co., Ltd., epoxy equivalent 120 g / eq Thermosetting compound 2: Epoxy compound, manufactured by ADEKA Corporation "EP-3300", epoxy equivalent 160 g / eq photopolymerization initiator: fluorenyl phosphine oxide compound, "DAROCUR TPO" manufactured by Ciba Japan, chain transfer agent: pentaerythritol tetrakis (3-mercaptobutyrate), "Karenz MT PE1" latent epoxy thermal hardener manufactured by Showa Denko Corporation: "Fujicure7000" manufactured by T & K TOKA Flux 1: Add 25 parts by weight of glutaric acid and 25 parts by weight of monomethyl glutarate to three mouthpieces The flask was allowed to melt under a nitrogen stream at 80 ° C. Thereafter, 57 parts by weight of benzylamine was added, and the mixture was reacted at 80 ° C. under reduced pressure (4 Torr or less) for 2 hours to obtain flux 1 which is solid at 25 ° C. Insulating particles: average particle diameter 30 μm, CV value 5%, softening point 330 ° C, manufactured by Sekisui Chemical Industry Co., Ltd., divinylbenzene crosslinked particles solder particles 1: p-toluenesulfonic acid used as a catalyst, Sn-3Ag -0. 5Cu solder particles ("ST-5" manufactured by Mitsui Metals Corporation, average particle diameter (median diameter) 30 μm), and citric acid ("citric acid" manufactured by Wako Pure Chemical Industries, Ltd.) in a toluene solvent at 90 ° C The next side was dehydrated and stirred for 8 hours, thereby obtaining solder particles 1 (CV value 20%) having a group containing a carboxyl group covalently bonded to the surface of the solder. Solder particles 2: Weigh Sn-3Ag-0. 5Cu solder particles ("ST-5" manufactured by Mitsui Metals Co., Ltd., average particle diameter (median diameter) 30 μm) 200 g, silane coupling agent with isocyanate group ("KBE-9007" manufactured by Shin-Etsu Silicones) ") 10 g and 70 g of acetone into a three-necked flask. Add dibutyltin dilaurate as a reaction catalyst between the hydroxyl groups on the surface of the solder particles and the isocyanate group while stirring at room temperature. 25 g was heated under stirring in a nitrogen atmosphere at 100 ° C for 2 hours. Then, 50 g of methanol was added, and it heated at 60 degreeC for 1 hour in nitrogen atmosphere with stirring. After that, it was cooled to room temperature, and the solder particles were filtered with a filter paper, and the solvent was removed by vacuum drying at room temperature for 1 hour. The above solder particles were added to a three-necked flask, and 70 g of acetone, 30 g of trimethyl citrate, and monobutyltin oxide 0 as a transesterification catalyst were added. 5 g was allowed to react under stirring in a nitrogen atmosphere at 60 ° C. for 1 hour. Thereby, an ester group of trimethyl citrate is reacted with a silanol group derived from a silane coupling agent by a transesterification reaction, so that they are covalently bonded. Thereafter, 10 g of citric acid was added, and the mixture was allowed to react at 60 ° C. for 1 hour, whereby citric acid was added to the residual methyl ester group of trimethyl citrate which had not reacted with the silanol group. After that, it was cooled to room temperature, and the solder particles were filtered with filter paper. The solder particles were washed with hexane on the filter paper, and unreacted and residual trimethyl citrate attached to the surface of the solder particles by non-covalent bonds. After removing the ester and citric acid, the solvent was removed by vacuum drying at room temperature for 1 hour. After the obtained solder particles are crushed by a ball mill, a screen is selected so as to have a specific CV value. Thus, solder particles 2 (CV value: 20%) were obtained. (CV value of particle diameter of solder particles and conductive particles) The CV value was measured using a laser diffraction type particle size distribution measuring device ("LA-920" manufactured by Horiba, Ltd.). The second conductive particle 1: a gold layer (thickness of 0. 02 μm) conductive particles (average particle size 15 μm) Second conductive particles 2: a palladium layer (thickness of 0. 02 μm) conductive particles (average particle size 15 μm) second conductive particles 3: a platinum layer (thickness 0. 0) is arranged on the surface of the divinylbenzene resin particles 02 μm) conductive particles (average particle size 15 μm) second conductive particles 6: a ruthenium layer (thickness 0. 02 μm) conductive particles (average particle size 15 μm) second conductive particles 7: an iridium layer (thickness of 0. 02 μm) conductive particles (average particle size 15 μm) second conductive particles 4: a gold layer (thickness 0. 02 μm) conductive particles (average particle size 10 μm) second conductive particles 5: a gold layer (thickness 0. 02 μm) conductive particles (average particle size 30 μm) (Examples 1 to 13 and Comparative Examples 1 to 2) (1) Production of conductive materials The following tables were prepared with the blending amounts shown in Tables 1 and 2 below A conductive material (conductive paste) was obtained with the components shown in 1 and 2. (2) Preparation of the connection structure. The upper surface has a copper electrode pattern with an L / S of 45 μm / 45 μm and an electrode length of 3 mm (the thickness of the copper electrode is 12 μm), and a plurality of copper foils are formed on its periphery. Carrier strips of strips of solder pads. Further, a semiconductor device having an electrode having an L / S of 45 μm / 45 μm on the lower surface was prepared. On the upper surface of the long carrier tape, the conductive paste was coated on the copper electrode pattern so that the thickness became 100 μm to form a conductive paste layer. Then, the above-mentioned semiconductor element is mounted using a chip mounter. Furthermore, a solder paste ("M705-GRN360-K2V" manufactured by Senju Metal Industry Co., Ltd.) was applied to the plurality of copper foil pads, and then a 1005 size chip resistor component was mounted on the copper foil pads using a chip mounter. On the coating film. Thereafter, a reflow process is performed in a reflow furnace to obtain a connection structure obtained by connecting the semiconductor element and the chip resistance component with the electrode. (Evaluation) (1) Viscosity (η25) Using an E-type viscometer ("TVE22L" manufactured by Toki Sangyo Co., Ltd.) at 25 ° C and 5 rpm, the viscosity (η25) of the conductive paste was measured. (2) The viscosity of the first conductive particles was measured using STRESSTECH (manufactured by EOLOGICA) under the conditions of 1 rad strain control, 1 Hz frequency, 20 ° C / min heating rate, and 40 ° C to the melting point of the solder. The viscosity (ηmp) of the conductive paste at the melting point. In this measurement, the viscosity at the melting point of the solder is read. (3) Thickness of solder portion The thickness of the solder portion between the upper and lower electrodes was evaluated by observing the cross section of the obtained connection structure. (4) Accuracy of the placement of solder on the electrode 1 When the part of the first electrode, the second electrode, and the second electrode that is opposite to each other is viewed in the layered direction of the obtained connection structure, The ratio X of the area where the solder portion is arranged in 100% of the area of the portion where the first electrode and the second electrode face each other is evaluated. The placement accuracy of the solder on the electrodes was judged on the basis of the following standards. [Criteria for determining the placement accuracy of solder on electrodes 1] ○: ratio X is 70% or more ○: ratio X is 60% or more and less than 70% △: ratio X is 50% or more and less than 60% ×: The proportion X is less than 50%. (5) The placement accuracy of the second conductive particles in the solder part 2 The 100% of the total number of the second conductive particles in the connection part in the obtained connection structure is placed in the solder part The ratio Y of the number of the second conductive particles was evaluated. The precision 2 of the arrangement of the second conductive particles in the solder portion was determined based on the following criteria. [Criteria for judging the arrangement accuracy of the second conductive particles in the solder part 2] ○ ○ ○: the ratio of the number of Y is 95% or more ○ ○: the ratio of the number of Y is 90% or more and less than 95% ○: number Number ratio Y is 80% or more and less than 90% △: Number ratio Y is 50% or more and less than 80% ×: Number ratio Y is less than 50% (6) Reliability of conduction between upper and lower electrodes In the obtained connection structure (n = 15), the connection resistance at each connection between the upper and lower electrodes was measured by the four-terminal method, respectively. Calculate the average connection resistance. Furthermore, the connection resistance can be obtained by measuring the voltage at which a certain current flows based on the relationship of voltage = current × resistance. The following criteria were used to determine the conduction reliability. However, even if one of the n = 15 electrodes is not conducting between the upper and lower electrodes, it is determined to be “×”. [Judgment Criteria for Continuity Reliability] ○ ○: The average value of the connection resistance is 50 mΩ or less ○: The average value of the connection resistance exceeds 50 mΩ and 70 mΩ or less △: The average value of the connection resistance exceeds 70 mΩ and 100 mΩ or less ×: The average value of the connection resistance exceeds 100 mΩ or a connection failure occurs (7) Insulation reliability between adjacent electrodes in the horizontal direction In the obtained connection structure (n = 15), at 85 ° C and humidity 85 After leaving it for 100 hours in a% environment, 15 V was applied between the electrodes adjacent in the horizontal direction, and the resistance was measured at 25 places. Insulation reliability was judged by the following criteria. However, even when one of the n = 15 electrodes is connected between electrodes adjacent in the horizontal direction, it is determined as "×". [Judgment Criteria for Insulation Reliability] ○○○: The average value of the connection resistance is 10¹⁴ Ω or more ○ ○: The average value of the connection resistance is 10⁸ Above Ω and below 10¹⁴ Ω ○: The average value of the connection resistance is 10⁶ Above Ω and below 10⁸ Ω △: The average value of the connection resistance is 10⁵ Above Ω and below 10⁶ Ω ×: The average value of the connection resistance is less than 10⁵ Ω The results are shown in Tables 1 and 2 below. [Table 1] [Table 2]

1‧‧‧ connection structure
1X‧‧‧Connection Structure
2‧‧‧The first connection target component
2a‧‧‧The first electrode
3‧‧‧ 2nd connection target component
3a‧‧‧Second electrode
4‧‧‧ Connection Department
4A‧‧‧Solder Department
4B‧‧‧Hardened Materials Division
4X‧‧‧Connecting section
4XA‧‧‧Solder Department
4XB‧‧‧Hardened material department
11‧‧‧ conductive material
11A‧‧‧Solder particles (first conductive particles)
11B‧‧‧thermosetting ingredients
11C‧‧‧Second conductive particles
21‧‧‧The first conductive particle (solder particle)
31‧‧‧ the first conductive particle
32‧‧‧ substrate particles
33‧‧‧Conductive part (conductive part with solder)
33A‧‧‧The second conductive part
33B‧‧‧Solder Department
41‧‧‧ the first conductive particle
42‧‧‧Solder Department

FIG. 1 is a cross-sectional view schematically showing a connection structure obtained by using a conductive material according to an embodiment of the present invention. 2 (a) to (c) are cross-sectional views for explaining each process of an example of a method of manufacturing a connection structure using a conductive material according to an embodiment of the present invention. FIG. 3 is a cross-sectional view showing a modified example of the connection structure. 4 is a cross-sectional view showing a first example of first conductive particles that can be used for a conductive material. FIG. 5 is a cross-sectional view showing a second example of the first conductive particles that can be used for a conductive material. FIG. 6 is a cross-sectional view showing a third example of the first conductive particles that can be used for a conductive material.

1‧‧‧ connection structure

2‧‧‧The first connection target component

2a‧‧‧The first electrode

3‧‧‧ 2nd connection target component

3a‧‧‧Second electrode

4‧‧‧ Connection Department

4A‧‧‧Solder Department

4B‧‧‧Hardened Materials Division

11C‧‧‧Second conductive particles

Claims (16)

A conductive material comprising: a plurality of first conductive particles having solder on an outer surface portion of the conductive portion; and a second conductive particle having silver, ruthenium, iridium, gold, palladium, or platinum on the outer surface portion of the conductive portion. , Thermosetting compounds, and thermosetting agents. The conductive material according to claim 1, wherein the second conductive particle has gold, palladium, or platinum on an outer surface portion of the conductive portion. For example, the conductive material of claim 1, wherein the viscosity of the conductive material at the melting point of the solder in the first conductive particles is 2 Pa · s or more and 10 Pa · s or less. The conductive material according to any one of claims 1 to 3, wherein the average particle diameter of the second conductive particles is smaller than the average particle diameter of the first conductive particles. The conductive material according to any one of claims 1 to 3, wherein the content of the second conductive particles is 10% by weight or less. The conductive material according to any one of claims 1 to 3, wherein the ratio of the content of the first conductive particles to the content of the second conductive particles is 3 or more and 80 or less on a weight basis. The conductive material according to any one of claims 1 to 3, wherein the thermosetting compound includes a thermosetting compound that is liquid at 25 ° C. The conductive material according to any one of claims 1 to 3, wherein the thermosetting compound includes a thermosetting compound having a polyether skeleton. The conductive material according to any one of claims 1 to 3, which includes a flux having a melting point of 50 ° C or higher and 190 ° C or lower. The conductive material according to any one of claims 1 to 3, wherein a carboxyl group or an amine group is present on the outer surface of the first conductive particle. The conductive material according to any one of claims 1 to 3, wherein the first conductive particles are solder particles having solder in a central portion and an outer surface portion. The conductive material according to any one of claims 1 to 3, which includes insulating particles that are not adhered to any of the surface of the first conductive particles and the surface of the second conductive particles. A connection structure comprising: a first connection target member having at least one first electrode on a surface; a second connection target member having at least one second electrode on a surface; and the first connection target member and the above. The connection part to which the second connection object member is connected, and the material of the connection part is the conductive material according to any one of claims 1 to 12, the connection part has a hardened part, a solder part, and the second conductive particle, and The second conductive particles are arranged in a solder portion, and the first electrode and the second electrode are electrically connected through a solder portion of the connection portion. A connection structure comprising: a first connection target member having at least one first electrode on a surface; a second connection target member having at least one second electrode on a surface; and the first connection target member and the above. A connection portion to which a second connection object member is connected, the connection portion having a hardened portion, a solder portion, and second conductive particles having silver, ruthenium, iridium, gold, palladium, or platinum on an outer surface portion of the conductive portion; The second conductive particles are arranged in the portion, and the first electrode and the second electrode are electrically connected through a solder portion of the connection portion. The connection structure according to claim 14, wherein the second conductive particle has gold, palladium, or platinum on an outer surface portion of the conductive portion. In the connection structure according to any one of claims 13 to 15, when a portion of the first electrode facing the second electrode is viewed in a lamination direction of the first electrode, the connection portion, and the second electrode The solder portion of the connection portion is disposed at 50% or more of an area of 100% of a portion of the first electrode facing the second electrode.