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TW201807123A - 用於形成包括含胺引發多元醇之雙組分無溶劑黏著劑組合物之層製品的方法 - Google Patents

用於形成包括含胺引發多元醇之雙組分無溶劑黏著劑組合物之層製品的方法 Download PDF

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Publication number
TW201807123A
TW201807123A TW106113158A TW106113158A TW201807123A TW 201807123 A TW201807123 A TW 201807123A TW 106113158 A TW106113158 A TW 106113158A TW 106113158 A TW106113158 A TW 106113158A TW 201807123 A TW201807123 A TW 201807123A
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Taiwan
Prior art keywords
substrate
component
forming
polyol
laminated structure
Prior art date
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TW106113158A
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English (en)
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TWI822656B (zh
Inventor
托爾斯坦 史密特
丹尼爾 梵西
馬可 弗拉斯科尼
Original Assignee
陶氏全球科技有限責任公司
羅門哈斯公司
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Publication of TW201807123A publication Critical patent/TW201807123A/zh
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Abstract

揭示用於形成包括雙組分無溶劑聚胺甲酸酯黏著劑組合物之層壓結構的方法。所述黏著劑組合物經調配以使各組分獨立地塗覆於相應基板，隨後使所述基板結合在一起以形成所述層壓結構。所述黏著劑組合物具有高度反應性，且可包括胺引發多元醇或提供快速固化之催化劑。所述胺引發多元醇所包括之官能度為2至12，羥基數目為5至1,830，且40℃下的黏度為500至20,000mPa-s。所述催化劑可為鉍催化劑、鋅催化劑、鋯催化劑、錫催化劑及鋁催化劑。再者，揭示一種根據所述方法形成之層製品。

Description

用於形成包括含胺引發多元醇之雙組分無溶劑黏著劑組合物之層製品的方法
本發明係關於用於形成包括無溶劑黏著劑組合物之層壓結構的方法。更特定而言，本發明係關於用於形成包括雙組分無溶劑聚胺甲酸酯黏著劑組合物之層製品的方法，所述黏著劑組合物經調配以使各組分經組態以獨立地塗覆於相應基板，隨後使基板結合在一起以形成層壓結構。黏著劑組合物可包括提供較快固化速度及改良之轉化效率的胺引發多元醇。在一些實施例中，黏著劑組合物可包括用於提高黏著劑組合物之反應性的催化劑，諸如鉍催化劑、鋅催化劑、鋯催化劑、錫催化劑及鋁催化劑。
在一些實施例中，黏著劑組合物之一種組分經組態以均勻地塗覆於第一基板之表面，且黏著劑組合物之另一組分經組態以塗覆於第二基板之表面。隨後使第一與第二基板結合在一起，藉此混合兩種組分且使其反應，以在第一與第二基板之間形成黏著劑。以此方式，黏著劑可隨後固化，進而黏合第一與第二基板。
黏著劑組合物適用於廣泛多種目的。舉例而言，黏著劑組合物用於將基板，諸如聚乙烯、聚丙烯、聚酯、聚醯胺、金屬、紙或塞璐芬(cellophane)黏合在一起，以形成複合膜，亦即層製品。黏著劑在不同的最終用途應用中之用途為一般已知的。舉例而言，黏著劑可用於製造用於封裝行業，尤其用於食品封裝之膜/膜及膜/箔層製品。用於層壓應用之黏著劑或「層壓黏著劑」可通常分為三種類別：溶劑類、水類及無溶劑類。黏著劑之效能視類別及塗覆黏著劑之應用而改變。
可塗覆高達100%固體且無有機溶劑或水性載劑之無溶劑層壓黏著劑。因為在塗覆時不需要自黏著劑乾燥有機溶劑或水，故此等黏著劑可以高線速度操作且在需要快速黏著劑塗覆之應用中為較佳的。溶劑類及水類層壓黏著劑受到在塗覆黏著劑後可有效乾燥且自層壓結構中移除溶劑或水之速率的限制。出於環境、健康及安全原因，層壓黏著劑較佳含水或無溶劑。
在無溶劑層壓黏著劑之類別中，存在許多種類。一種特定種類包含預混合之雙組分聚胺甲酸酯類層壓黏著劑。通常，雙組分聚胺甲酸酯類層壓黏著劑包含：第一組分，其包括含異氰酸酯的預聚物及/或聚異氰酸酯；及第二組分，其包括多元醇。預聚物可藉由使過量異氰酸酯與每分子含有兩個或更多個羥基之聚醚及/或聚酯反應而獲得。第二組分包括經每分子兩個或更多個羥基官能化之聚醚及/或聚酯。以預定比率組合或「預混合」兩種組分，且隨後將其塗覆於第一基板(「載體幅材」)上。隨後，使第一基板與第二基板結合在一 起以形成層壓結構。必須在黏著劑組合物之適用期(通常小於三十分鐘)內使第一與第二基板結合在一起。
可將額外基板層添加至結構中，其中額外黏著劑組合物層位於各連續基板之間。隨後，在室溫或高溫下固化黏著劑，藉此使基板黏合在一起。
層壓結構之進一步加工係視黏著劑之固化速度而定。黏著劑之固化速度指示為層壓基板之間的機械黏合變得足以允許進一步加工且層製品符合適用規定(例如，食品接觸規定)所花費的時間。緩慢固化速度導致較低轉化效率。相比於傳統含溶劑之黏著劑，預混合之雙組分無溶劑層壓黏著劑呈現較弱初始黏合及緩慢固化速度。轉化行業中的一般趨勢係針對較快固化層壓黏著劑。較快固化改良轉化器之操作效率。具體而言，將成品快速搬離倉庫提高了生產能力及處理最後時刻訂單之靈活性(例如，零售商促銷活動)。為了提高操作效率，應使用反應性遠高於現有黏著劑組合物之黏著劑組合物來形成層製品。然而，所述黏著劑組合物將對傳統黏著劑塗覆技術造成難題。
因此，需要用於形成包括雙組分無溶劑聚胺甲酸酯類層壓黏著劑組合物之層製品的更快及更有效的方法。
揭示用於形成層壓結構之方法。在一些實施例中，所述方法包含將異氰酸酯組分均勻地塗覆於第一基板。異氰酸酯組分包含至少一種聚異氰酸酯。所述方法進一步包含將多元醇組分均勻地塗覆於第二基板。隨後使第一與第二基板結合在一起，藉此混合異氰酸酯組分與多元醇組分且使其 反應，以在第一與第二基板之間形成黏著劑。隨後固化混合之黏著劑組合物，藉此黏合第一與第二基板。因為黏著劑組合物之成分具有反應性，故在使第一與第二基板結合在一起後的10分鐘內，黏著劑組合物能夠達成大於10,000mPa-s之黏度。
根據所揭示方法製得之層壓結構可在短至層壓後兩小時內切割且在兩天內遞送至客戶。使用現有通用黏著劑組合物製得之層製品通常需要在層壓兩至三天後切割且需要五至七天遞送。因此，根據所揭示之方法，加工效率大大提高。此外，相比於現有通用黏著劑之二十至三十分鐘適用期，在所揭示方法中使用之黏著劑組合物的適用期為無限期的。如下文將論述，此係因為所揭示黏著劑組合物之適用期與固化製程完全無關。
因為用於所揭示方法之黏著劑組合物經調配比現有黏著劑組合物具有更高反應性，故其並不理想地適於與現有黏著劑塗覆設備一起使用。此係因為兩種組分反應極快，促使黏著劑膠化且不適於塗覆至基板。因此，用於所揭示方法之黏著劑組合物經調配以使異氰酸酯及多元醇組分分別塗覆於兩種不同基板上，而非使其預混合且塗覆於載體幅材上。
特定而言，用於所揭示方法之黏著劑組合物經調配使得異氰酸酯組分可均勻地塗覆於第一基板表面且多元醇組分可均勻地塗覆於第二基板表面。隨後使第一基板表面與第二基板表面接觸以混合兩種組分且使其反應，藉此形成層製品。隨後固化黏著劑組合物。
102‧‧‧第一基板
104‧‧‧第一退繞機幅材
106‧‧‧塗覆單元
108‧‧‧第二基板
110‧‧‧第二退繞機幅材
112‧‧‧塗覆單元
114‧‧‧夾持滾筒
116‧‧‧滾筒
118‧‧‧重繞滾筒
參考附圖，其中： 圖1為用於形成包括黏著劑組合物之層製品的塗覆設備之示意性圖示；且圖2為說明性實例及比較實例之黏度相對於時間的說明圖。
如上文所陳述，用於所揭示方法之雙組分無溶劑黏著劑組合物包括異氰酸酯組分及多元醇組分。
異氰酸酯組分
異氰酸酯組分包括至少一種異氰酸酯。至少一種異氰酸酯可選自由以下各者組成之群：異氰酸酯預聚物、異氰酸酯單體、聚異氰酸酯(例如，二聚體、三聚體等)及其兩者或更多者之組合。如本文所使用，「聚異氰酸酯」為任何含有兩個或更多個異氰酸酯基團之化合物。異氰酸酯預聚物為包括至少一種異氰酸酯及至少一種多元醇之反應物的反應產物。如本文所使用，「異氰酸酯預聚物」可為聚異氰酸酯本身。
至少一種異氰酸酯所包括之的官能度為1.5至10、或1.8至5、或2至3。如關於異氰酸酯組分所使用，「官能度」係指每分子羥基反應性位點之數目。諸如異氰酸酯組分之具有異氰酸酯基團的化合物可由參數「%NCO」表徵，所述參數為按化合物重量計異氰酸酯基團之量(按重量計)。參數%NCO藉由ASTM D 2572-97(2010)之方法量測。所揭示異氰酸酯組分之%NCO為至少3%、或至少6%、或至少10%。較佳地，異氰酸酯組分之%NCO不超過25%、或18%、或14%。
此外，至少一種異氰酸酯所包括之游離單體含量為0%至50%、或5%至40%、或10%至30%。再者，至少一 種異氰酸酯所包括之分子量為200至3,000g/mol、或300至2,000g/mol、或500至1,000g/mol。甚至進一步，如藉由ASTM D2196之方法所量測，在25℃下異氰酸酯組分之黏度為300至40,000mPa-s、或500至20,000mPa-s、或1,000至10,000mPa-s。
異氰酸酯組分之至少一種異氰酸酯可選自由以下各者組成之群：芳族異氰酸酯、脂族異氰酸酯、環脂族異氰酸酯及其組合。「芳族聚異氰酸酯」為含有一或多個芳環之異氰酸酯。「脂族聚異氰酸酯」不含芳環。「環脂族聚異氰酸酯」為脂族聚異氰酸酯的子集，其中化學鏈為環結構。
適於根據本發明使用之芳族異氰酸酯的實例包含(但不限於)二異氰酸亞甲基二苯酯(「MDI」)之異構體，諸如4,4-MDI、2,2-MDI及2,4-MDI；甲苯-二異氰酸酯(「TDI」)之異構體，諸如2,4-TDI、2,6-TDI；萘-二異氰酸酯(「NDI」)之異構體，諸如1,5-NDI；降莰烷二異氰酸酯(「NBDI」)之異構體；四甲基二甲苯二異氰酸酯(「TMXDI」)之異構體；及其兩者或更多者之組合。較佳為MDI之異構體，尤其是4,4-MDI與2,4-MDI(亦即，液體MDI)或4,4-MDI(亦即，固體MDI)之混合物。
適於根據本發明使用之脂族及環脂族異氰酸酯的實例包含(但不限於)二異氰酸己二酯(「HDI」)之異構體、異佛爾酮二異氰酸酯(「IPDI」)之異構體、二甲苯二異氰酸酯(「XDI」)之異構體及其組合。
按黏著劑組合物之重量(亦即，異氰酸酯組分及多元醇組分之總重量)計，黏著劑組合物中至少一種異氰酸酯 的量(按重量計)為至少5wt%、或至少10wt%、或至少20wt%。按黏著劑組合物之重量計，黏著劑組合物中至少一種異氰酸酯的量(按重量計)不超過100wt%、或不超過95wt%、或不超過90wt%。
異氰酸酯組分可進一步包括所屬領域的技術人員通常已知的其他成分，例如多元醇、催化劑等。
多元醇組分
在一些實施例中，無溶劑黏著劑組合物進一步包括多元醇組分，所述多元醇組分包括至少一種高度反應性胺引發多元醇。相比於用於現有雙組分無溶劑黏著劑組合物之傳統多元醇，在多元醇組分中包含至少一種胺引發多元醇提供較高反應性及較快固化。胺引發多元醇包括一級羥基及併有至少一個三級胺之主鏈。在一些實施例中，多元醇組分亦可包括另一類型之多元醇，即非胺引發多元醇。各多元醇類型可包含一種類別之多元醇。或者，各多元醇類型可包含不同類別之多元醇的混合物。在一些實施例中，一種多元醇類型可為一種類別之多元醇，而另一多元醇類型可為不同類別之多元醇的混合物。
胺引發多元醇包括一級羥基及併有至少一個三級胺之主鏈。在一些實施例中，胺引發多元醇具有以下化學結構I：
其中R1、R2及R3各自獨立地為直鏈或分支鏈烷基。舉例 而言，可各自獨立地為C1-C6直鏈或分支鏈烷基。在一些實施例中，胺引發多元醇包括三級胺及二級胺。
至少一種胺引發多元醇所包括之官能度為2至12、或3至10、或4至8。如關於多元醇組分所使用，「官能度」係指每分子異氰酸酯反應性位點之數目。此外，至少一種胺引發多元醇所包括之羥基數目為5至1,830、或20至100、或31至40。如關於多元醇組分所使用，「羥基數目」為可用於反應的反應性羥基之量的量測值。此數目在濕分析法中測定且報導為氫氧化鉀之毫克數，其等效於一公克樣品中存在之羥基。測定羥基數目之最常用的方法描述於ASTM D 4274 D中。再者，在25℃下至少一種胺引發多元醇所包括之黏度為500至20,000mPa-s、或1,000至15,000mPa-s、或1,500至10,000mPa-s。
適於根據本發明使用之胺引發多元醇係藉由用一或多種環氧烷使一或多種胺引發劑烷氧基化而製得。
按黏著劑組合物之重量(亦即，異氰酸酯組分及多元醇組分之總重量)計，黏著劑組合物中至少一種胺引發多元醇之量(按重量計)為至少2wt%、或至少10wt%、或至少20wt%。按黏著劑組合物之重量計，黏著劑組合物中至少一種胺引發多元醇之量(按重量計)不超過100wt%、或不超過95wt%、或不超過90wt%。
在一些實施例中，多元醇組分包括用於提高系統之反應性的催化劑。適於充分提高黏著劑組合物之反應性以使其可根據所揭示方法使用的催化劑包含(但不限於)鉍催化劑、鋅催化劑、鋯催化劑、錫催化劑及鋁催化劑。
在一些實施例中，至少一種非胺引發多元醇可視情況包含於黏著劑組合物中，例如包含於多元醇組分中。非胺引發多元醇之實例包含(但不限於)聚酯多元醇、聚醚多元醇、聚碳酸酯多元醇、聚丙烯酸酯多元醇、聚己內酯多元醇、聚烯烴多元醇、天然油多元醇及其兩者或更多者之組合。較佳地，如藉由ASTM D2196之方法所量測，在25℃下非按引發多元醇之黏度為30至40,000mPa-s、或50至30,000mPa-s、或70至20,000mPa-s。較佳地，如藉由ASTM D2196之方法所量測，在25℃下非胺引發多元醇之黏度為100至10,000mPa-s。
黏著劑組合物中至少一種非胺引發多元醇之量為至少0wt%、或至少5wt%、或至少10wt%。黏著劑組合物中至少一種非胺引發多元醇之量不超過98wt%、或不超過90wt%、或不超過80wt%。
異氰酸酯組分與多元醇組分之混合比(按重量計)係藉由調節各組分對其各別基板之塗佈重量而控制。在一些實施例中，最終黏著劑組合物中異氰酸酯組分與多元醇組分之混合比可為100：100、或100：90、或100：80。所揭示之黏著劑組合物比傳統黏著劑更為寬容且可接受一定塗佈重量誤差(例如，至多約10%塗佈重量誤差)。
在一些實施例中，一或多種添加劑可視情況包含於黏著劑組合物中。所述添加劑之實例包含(但不限於)增黏劑、塑化劑、流變改質劑、助黏劑、抗氧化劑、填充劑、著色劑、界面活性劑、催化劑、溶劑及其兩者或更多者之組合。
多元醇組分可進一步包括所屬領域的技術人員通常已知的其他成分，例如額外多元醇、催化劑、異氰酸酯等。
層製品形成
預期分別調配用於所揭示方法之無溶劑黏著劑組合物的異氰酸酯組分及多元醇組分，且儲存直至需要形成層壓結構。較佳地，異氰酸酯組分及多元醇組分在25℃下呈液態。即使組分在25℃下為固體，但可接受視需要加熱組分以使其呈液態。因為黏著劑組合物之適用期與固化製程無關，故組分可無限期地儲存。
根據所揭示方法形成之層製品可藉由將黏著劑組合物之異氰酸酯及多元醇組分分別塗覆於諸如兩個膜之兩個不同基板而形成。如本文所使用，「膜」為一個尺寸為0.5mm或更小且其他兩個尺寸為1cm或更大之任何結構。「聚合物膜」為由聚合物或聚合物之混合物製成的膜。聚合物膜之組成通常為80重量%或更大的一或多種聚合物。
出於說明之目的，現轉而參看圖1，顯示進行所述方法之設備的示意圖。設備包含自第一退繞機幅材104展開的第一基板102。如上文所論述，第一基板可為膜。第一基板102傳送通過塗覆單元106，在所述單元中將黏著劑組合物之異氰酸酯組分層塗覆於第一基板102。塗覆單元包含通常在30與40℃之間操作的配料滾筒。塗覆單元進一步包含通常在30與60℃之間操作的塗覆滾筒。設備進一步包含自第二退繞機幅材110展開的第二基板108。第二基板108亦可為膜。第二基板108傳送通過塗覆單元112，在所述單元中將黏著劑組合物之多元醇組分層塗覆於第二基板108。較佳地，塗覆於第一基板102及第二基板108之第一及第二層的厚度各自分別為0.5至2.5μm。藉由控制塗覆於各基板之層的厚度，組分 之比率可得到控制。
隨後使第一基板102及第二基板108之表面穿過用於向第一基板102及第二基板108施加外部壓力之裝置，諸如夾持滾筒114。夾持滾筒通常在30與50℃之間且在2與4巴之間的壓力下操作。使異氰酸酯組分與多元醇組分結合在一起形成可固化黏著劑混合物層。當第一基板102與第二基板108之表面結合在一起時，可固化黏著劑混合物層之厚度為1至5μm。當第一基板102與第二基板108結合在一起且組分彼此接觸時，異氰酸酯組分與多元醇組分開始混合且反應。此標誌著固化製程之開始。
在第一基板102及第二基板108穿過各種其他滾筒(例如，滾筒116)且最終到達重繞滾筒118時，實現進一步混合及反應。在第一基板102及第二基板108穿過滾筒時進行進一步混合及反應，因為基板各自比穿過各滾筒之其他基板採取更長或更短路徑。以此方式，兩個基板相對於彼此移動，使各別基板上的組分混合。塗覆設備中之滾筒配置通常為所屬領域中已知的。隨後固化可固化混合物或允許可固化混合物固化。
層壓結構中的適合基板包括膜，諸如紙、編織及非編織織物、金屬箔、聚合物及金屬塗佈之聚合物。膜視情況具有上面用油墨印刷影像的表面；油墨可與黏著劑組合物接觸。
現轉而參看圖2，所示為顯示根據本發明之黏著劑組合物(亦即，包括所揭示之胺引發多元醇)的反應性曲線及不含胺引發多元醇之黏著劑組合物的反應性曲線之圖。在 圖2中，在層壓時，按多元醇組分之重量計，包括13重量%胺引發多元醇之黏著劑組合物在40℃下所包括的最初黏度為約4,000mPa-s。出人意料地，在層壓後小於十五分鐘內，黏度快速提高至大於10,000mPa-s。在層壓時，按多元醇組分之重量計，包括8重量%胺引發多元醇之黏著劑組合物在40℃下所包括的最初黏度為約3,000mPa-s。出人意料地，在層壓後小於二十分鐘內，黏度快速提高至大於10,000mPa-s。相反地，在層壓時，不含胺引發多元醇之黏著劑組合物在40℃下所包括的最初黏度為約1,000mPa-s。直至層壓後約六十分鐘，黏度才超過10,000mPa-s。此反應性曲線為現有無溶劑黏著劑組合物所典型的。
本發明之實例
現將藉由描述說明所揭示之黏著劑組合物及現有黏著劑組合物之實例(統稱為「實例」)來進一步詳細解釋本發明。然而，本發明之範疇當然不限於所述實例。
在實例中，異氰酸酯組分包括所屬領域的技術人員通常已知的芳族異氰酸酯，例如TDI MDI。實例之多元醇組分係根據下文表1中所列之配方製備：
包括表1中所描述之多元醇組分的層壓結構係在Nordmeccanica LABO COMBITM層壓機上製備。隨後在LABO COMBITM層壓機上測試所製備之層壓結構的黏合強度及一級芳族胺衰減。根據ASTM F904測試層壓結構之黏合強度。一級芳族胺衰減分析為針對含水食品刺激劑(3%乙酸)中一級芳族胺測定之測試。測試係基於官方BrF方法第L 00-00.6號及委員會條例(Commission Regulation，EU)第10/2011號。
效能結果顯示於下文表2中。根據ASTM F904在層壓2小時、4小時、1天及2天後量測黏合強度。根據BrF方法第L 00-00.6號及委員會條例(EU)第10/2011號在層壓後24小時、2天及3天測試一級芳族胺衰減。
在表2中，「a」表示黏著劑保持不變，且「t」表示層壓結構中之一者破損。基於表2中之資料，包含胺引發多元醇提高了黏著劑組合物之反應性。如表3中所說明，包括胺引發多元醇之調配物呈現較快黏合發展及較快PAA衰減。特定而言，在兩天內實現充分黏合發展。當至少一種異氰酸酯及多元醇之所有官能基(例如，NCO及OH基團)已反應且整合於最終聚合物鏈中時，出現充分黏合發展，亦即，不進行其他交聯反應且實現最終黏合效能、耐熱性及耐化學性。 然而，使用包括高度反應性胺引發多元醇之多元醇組分在層壓後一小時內實現足以切割層壓結構之黏合。當層壓結構具有至少1N/15mm之黏合強度及無黏性黏著劑時，其具有足以切割之黏合。
如根據本發明所設想，層壓結構亦在具有雙塗佈頭之層壓機器上形成。隨後測試所製備之層壓結構的黏合強度及一級芳族胺衰減。
如表3中所指示，包含所揭示之胺引發多元醇的黏著劑組合物均出人意料地在層壓兩小時內實現超過1.0N/15mm之黏合強度。許多實例甚至在層壓兩小時內呈現超過2.0N/15mm之黏合強度。
102‧‧‧第一基板
104‧‧‧第一退繞機幅材
106‧‧‧塗覆單元
108‧‧‧第二基板
110‧‧‧第二退繞機幅材
112‧‧‧塗覆單元
114‧‧‧夾持滾筒
116‧‧‧滾筒
118‧‧‧重繞滾筒

Claims (18)

  1. 一種用於形成層壓結構之方法，其包括：將異氰酸酯組分均勻地塗覆於第一基板，所述異氰酸酯組分包括至少一種異氰酸酯；將多元醇組分均勻地塗覆於第二基板；使所述第一與第二基板結合在一起，藉此混合所述異氰酸酯組分與所述多元醇組分且使其反應，以在所述第一與第二基板之間形成黏著劑；及固化所述黏著劑以黏合所述第一與第二基板，其中在使所述第一與第二基板結合在一起後的10分鐘內，所述黏著劑所包括之黏度(在40℃下)大於10,000mPa-s。
  2. 如申請專利範圍第1項所述的用於形成層壓結構之方法，其中所述異氰酸酯組分及多元醇組分以0.5：1至1.5：1之異氰酸酯組分：多元醇組分之比分別塗覆於所述第一基板及第二基板。
  3. 如申請專利範圍第1項所述的用於形成層壓結構之方法，其中所述異氰酸酯組分及多元醇組分各自以0.25至1.5g/m2之塗佈重量分別塗覆於所述第一基板及第二基板。
  4. 如申請專利範圍第1項所述的用於形成層壓結構之方法，其中在使所述第一基板與第二基板結合在一起後的60分鐘內，所述黏著劑組合物所包括之黏合強度為至少0.5N/15mm。
  5. 如申請專利範圍第1項所述的用於形成層壓結構之方法，其中使所述第一基板與第二基板結合在一起包括將所述 第一與第二基板傳送通過夾持滾筒。
  6. 如申請專利範圍第1項所述的用於形成層壓結構之方法，其進一步包括藉由將所述第一基板及第二基板傳送通過一或多個滾筒而在使所述第一基板與第二基板結合在一起後混合所述異氰酸酯組分與多元醇組分。
  7. 如申請專利範圍第1項所述的用於形成層壓結構之方法，其中所述第一基板及第二基板各自選自由以下各者組成之群：紙、編織及非編織織物、金屬箔、聚合物膜、金屬塗佈之聚合物膜、印刷膜及其兩者或更多者之組合。
  8. 如申請專利範圍第1項所述的用於形成層壓結構之方法，其進一步包括將所述異氰酸酯組分及多元醇組分加熱至30至80℃之間，隨後將其分別塗覆於所述第一基板及第二基板。
  9. 如申請專利範圍第1項所述的用於形成層壓結構之方法，其中在40℃下所述異氰酸酯組分及多元醇組分所包括之黏度各自為500至10,000mPa-s。
  10. 一種用於形成層壓結構之方法，其包括：將異氰酸酯組分均勻地塗覆於第一基板，所述異氰酸酯組分包括至少一種異氰酸酯；將多元醇組分均勻地塗覆於第二基板，所述多元醇組分包括至少一種胺引發多元醇，所述胺引發多元醇包括一級羥基及併有三級胺之主鏈；使所述第一與第二基板結合在一起，藉此混合所述異氰酸酯組分與所述多元醇組分且使其反應，以在所述第一與第二基板之間形成黏著劑；及 固化所述黏著劑以黏合所述第一與第二基板。
  11. 如申請專利範圍第10項所述的用於形成層壓結構之方法，其中在使所述第一與第二基板結合在一起後的10分鐘內，所述黏著劑所包括之黏度(在40℃下)大於10,000mPa-s。
  12. 如申請專利範圍第10項所述的用於形成層壓結構之方法，其中所述胺引發多元醇具有以下結構I： 其中R1、R2及R3獨立地為直鏈或分支鏈烷基。
  13. 如申請專利範圍第10項所述的用於形成層壓結構之方法，其中所述胺引發多元醇所包括之官能度為4。
  14. 如申請專利範圍第10項所述的用於形成層壓結構之方法，其中所述胺引發多元醇所包括之羥基數目為37。
  15. 如申請專利範圍第10項所述的用於形成層壓結構之方法，其中在25℃下所述胺引發多元醇所包括之黏度為約1,200mPa-s。
  16. 如申請專利範圍第10項所述的用於形成層壓結構之方法，其中所述胺引發多元醇所包括之分子量為約6,000g/mol。
  17. 如申請專利範圍第10項所述的用於形成層壓結構之方法，其中所述異氰酸酯組分及多元醇組分以0.5：1至1.5：1之異氰酸酯組分：多元醇組分之比分別塗覆於所述第一基板及第二基板。
  18. 一種用於形成層壓結構之方法，其包括： 將異氰酸酯組分均勻地塗覆於第一基板，所述異氰酸酯組分包括至少一種異氰酸酯；將多元醇組分均勻地塗覆於第二基板，所述多元醇組分包括至少一種選自由以下各者組成之群的催化劑：鉍催化劑、鋅催化劑、鋯催化劑、錫催化劑及鋁催化劑；使所述第一與第二基板結合在一起，藉此混合所述異氰酸酯組分與所述多元醇組分且使其反應，以在所述第一與第二基板之間形成黏著劑；及固化所述黏著劑以黏合所述第一與第二基板。
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