TW201806839A - Apparatus and method for sorting double substrates - Google Patents
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Abstract
本發明揭露一種用於選別雙基材的裝置及方法。該雙基材選別裝置包括一基材輸送裝置、一基材引導寬度調整裝置、一基材夾持器及一基材夾持器輸送裝置。該雙基材選別方法包括以下步驟:使該雙基材選別裝置移動至配置有一匣之一位置;改變基材引導構件以對應收納在該匣中之基材的尺寸以便調整寬度;調整夾持構件之寬度;向前移動以便藉由該等夾持構件夾持該等基材;移動以便為配置在一不同位置之匣提供該等基材;及釋放該等夾持構件之夾持狀態。The invention discloses a device and a method for selecting dual substrates. The dual substrate selecting device includes a substrate conveying device, a substrate guide width adjusting device, a substrate holder and a substrate holder conveying device. The dual-substrate selection method includes the following steps: moving the dual-substrate selection device to a position where a box is configured; changing the substrate guide member to correspond to the size of the substrate stored in the box so as to adjust the width; adjusting the clamping The width of the component; moving forward to clamp the substrate by the clamping members; moving to provide the substrate for a cassette configured at a different position; and releasing the clamping state of the clamping member.
Description
相關申請案之交互參照 本申請案主張2016年8月17日在韓國智慧財產局申請之韓國專利申請案第10-2016-0104434號,其揭示在此加入作為參考。Cross Reference to Related Applications This application claims Korean Patent Application No. 10-2016-0104434, filed with the Korean Intellectual Property Office on August 17, 2016, the disclosure of which is incorporated herein by reference.
發明背景 1.技術領域 本發明係有關於用於選別雙基材的裝置及方法,且更特別有關於用於選別配置在匣中之雙基材的裝置及方法。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device and method for selecting dual substrates, and more particularly to a device and method for selecting dual substrates arranged in a cassette.
2.相關技術之說明 通常,一半導體製造系統係構造成藉由一自動輸送裝置在用於儲存儲存複數個基材之多個匣的一儲料器與實施該等基材之單元處理的一單元處理裝置間輸送該等匣。該自動輸送裝置可依據一預設程式依序在該儲料器與該單元處理裝置之間輸送複數個匣。2. Description of Related Technology Generally, a semiconductor manufacturing system is configured by an automatic conveying device in a stocker for storing a plurality of cassettes for storing a plurality of substrates and a unit for performing unit processing of the substrates. The cassettes are transported between unit processing units. The automatic conveying device can sequentially convey a plurality of cassettes between the stocker and the unit processing device according to a preset program.
韓國專利第10-1467523號(專利文獻1)揭露一種用於輸送基材之裝置,其包括:一梭單元,其由一側至另一側互相平行地輸送在相同高度上之至少一對基材;一緩衝單元,用以安置由一側至另一側互相平行地輸送通過該梭單元之該等基材;一選別器,其具有設置在該高度方向上之複數個擱架以便支持該等基材,使得該等基材安置在各擱架上且朝該高度方向裝載;一定位單元,其在輸送互相平行地安置之至少一對基材至該選別器時朝垂直方向堆積該等基材在各擱架上;及一控制單元,用以儲存裝載在該選別器之各擱架上之該等基材。在專利文獻1中,輸送及安置該等檢查後之基材在該緩衝單元120上的該梭單元110包括一第一軌道112、一第一滑件114及一拾取器116。此外,用於裝載由該定位單元130輸送之基材的專利文獻1之選別器160具有設置在該高度方向上之複數個擱架。因為各基材朝該高度方向一個一個地安置且裝載在各擱架上,所以該定位單元朝該垂直方向堆積且裝載平行地安置之該等基材在該選別器上。但是,因為該梭單元110之拾取器116是固定的,所以專利文獻1具有無法應付多種基材之一缺點。此外,因為無法檢查該等基材之一拾取狀態,所以專利文獻1具有無法免除當該等基材被吸取時產生之缺陷。Korean Patent No. 10-1467523 (Patent Document 1) discloses a device for conveying a substrate, which includes a shuttle unit that conveys at least a pair of substrates at the same height from one side to the other in parallel with each other A buffer unit for arranging the substrates conveyed through the shuttle unit from one side to the other in parallel; a selector having a plurality of shelves arranged in the height direction to support the And other substrates, so that the substrates are placed on each shelf and loaded toward the height direction; a positioning unit, which stacks the substrates in a vertical direction when conveying at least one pair of substrates arranged parallel to each other to the selector; The substrates are on the shelves; and a control unit for storing the substrates loaded on the shelves of the selector. In Patent Document 1, the shuttle unit 110 that transports and places the inspected substrates on the buffer unit 120 includes a first track 112, a first slider 114, and a picker 116. In addition, the selector 160 of Patent Document 1 for loading a substrate conveyed by the positioning unit 130 has a plurality of shelves provided in the height direction. Since the substrates are arranged one by one toward the height direction and loaded on the shelves, the positioning unit is stacked in the vertical direction and the substrates arranged in parallel are loaded on the selector. However, since the picker 116 of the shuttle unit 110 is fixed, Patent Document 1 has a disadvantage that it cannot cope with various substrates. In addition, since the pick-up state of one of the substrates cannot be checked, Patent Document 1 has a defect that cannot be avoided when the substrates are sucked.
相關技術文獻 專利文獻Related Technical Literature Patent Literature
專利文獻1:在2014年11月25日核准之韓國專利第10-1467523號Patent Document 1: Korean Patent No. 10-1467523 approved on November 25, 2014
發明內容 因此,本發明已有鑒於在習知技術中發生之上述問題作成,且本發明之一目的係提供一種用於選別雙基材的裝置及方法,其可自由地將多個基材放在多個匣中且將該等基材取出該等匣。SUMMARY OF THE INVENTION Accordingly, the present invention has been made in view of the above-mentioned problems occurring in the conventional technology, and an object of the present invention is to provide a device and method for selecting dual substrates, which can freely place a plurality of substrates. The cassettes are in multiple cassettes and the substrates are removed from the cassettes.
本發明之另一目的係提供一種用於選別雙基材的裝置及方法,其可在檢查該等基材之狀態時藉由一夾持構件將多個基材放在多個匣中及將該等基材取出該等匣,藉此增加工作效率。Another object of the present invention is to provide a device and method for selecting dual substrates, which can place a plurality of substrates in a plurality of cassettes and a The substrates are taken out of the cassettes, thereby increasing work efficiency.
為達成上述目的,依據本發明,提供一種用於選別雙基材的裝置,其配置在配置於一Y軸輸送單元上之一Z軸輸送單元的一側並側向地移動且夾持配置在一匣內之多個基材以便插入及取出該等基材,該雙基材選別裝置包括:一基材引導輸送裝置,其包括:一上板,其具有配置成互相分開一預定間距之第一直線運動軌道;一支持板,其配置在該上板下方且具有配置成互相分開一預定間距之第二直線運動軌道;多個移動板,各藉由一垂直框架與該支持板連接且具有與該第一直線運動軌道連接之第一直線運動引導件;一連接板,其與該等移動板連接且具有配置一滾珠螺桿之一側;一第一驅動源,其具有與該連接板之該滾珠螺桿連接的一側;及多個基材引導構件,其配置在該支持板下方且依據該支持板之一來回移動與該支持板一起移動;一基材引導寬度調整裝置,其包括:多個基材引導構件,其配置在該支持板下方且沿著該支持板之該等第二直線運動軌道朝側向與該支持板一起移動;多個連桿,其配置在與該等基材引導構件連接之該等調整板上;一旋轉板,其兩側與該等連桿分別地連接;及一第二驅動源,其與該旋轉板連接;一基材夾持器,其包括:一下板,其配置在該上板下方且具有配置成互相分開一預定間距之第三直線運動軌道;多個移動塊,各具有配置在該移動塊之下部且與該下板之各第三直線運動軌道結合的一第三直線運動引導件及配置在該移動塊之上部的一第四直線運動軌道;多個支持塊,各具有與該移動塊之該第四直線運動軌道連接的一第四直線運動引導件;多個夾持器缸,其與該等支持塊分別地連接;及多個夾持構件,其與該等夾持器缸分別地連接以便夾持該等基材;及一基材夾持器輸送裝置,其包括:一對第一與第二滑輪,其配置在配置於該下板上之該等第三直線運動軌道外側並互相分開一預定間距;多個皮帶,其嵌合在該等第一與第二滑輪之間;及多個第三驅動源,其與該等第一滑輪分別地連接。In order to achieve the above object, according to the present invention, a device for selecting dual substrates is provided, which is arranged on one side of a Z-axis conveying unit disposed on a Y-axis conveying unit and moves laterally and is clamped and arranged on A plurality of substrates in a box for inserting and removing the substrates. The dual-substrate selection device includes: a substrate-guided conveying device including: an upper plate having first sections configured to be separated from each other by a predetermined distance; A linear motion track; a support plate disposed below the upper plate and having a second linear motion track configured to be separated from each other by a predetermined distance; a plurality of moving plates each connected to the support plate by a vertical frame and having A first linear motion guide connected to the first linear motion track; a connecting plate connected to the moving plates and having one side configured with a ball screw; a first driving source having the ball screw connected to the connecting plate A connected side; and a plurality of substrate guide members arranged below the support plate and moving back and forth with the support plate according to one of the support plates; a substrate guide width adjustment It includes: a plurality of substrate guide members arranged below the support plate and moving sideways with the support plate along the second linear motion tracks of the support plate; and a plurality of links configured On the adjustment plates connected to the substrate guide members; a rotating plate whose two sides are respectively connected to the connecting rods; and a second driving source which is connected to the rotating plate; a substrate clip A holder includes: a lower plate disposed below the upper plate and having a third linear motion track configured to be separated from each other by a predetermined distance; a plurality of moving blocks each having a lower portion disposed below the moving block and connected to the lower plate; A third linear motion guide combined with each third linear motion track of the board and a fourth linear motion track arranged above the moving block; a plurality of support blocks each having the fourth linear motion with the moving block A fourth linear motion guide connected by the track; a plurality of gripper cylinders which are separately connected to the support blocks; and a plurality of gripping members which are separately connected with the gripper cylinders to hold the And other substrates; and a substrate holder The conveying device includes: a pair of first and second pulleys, which are arranged outside the third linear motion tracks arranged on the lower plate and separated from each other by a predetermined distance; a plurality of belts which are fitted in the Between the first and second pulleys; and a plurality of third driving sources respectively connected to the first pulleys.
本發明之另一方面提供一種用於選別雙基材的方法,其包括以下步驟:(S10)使一雙基材選別裝置移動至配置有一匣之一位置;(S20)操作一基材引導寬度調整裝置以對應收納在該匣中之基材的尺寸以便藉由改變基材引導構件來調整寬度;(S30)當完成藉由改變該等基材引導構件來調整寬度時,藉由操作該基材引導輸送裝置使該等基材引導構件向前移動;(S40)當完成該等基材引導構件之向前移動時使該基材夾持器之該等夾持構件向前移動;(S50)藉由該等夾持構件夾持收納在該匣中之該等基材;(S60)在夾持該等基材之狀態中使該等夾持構件向後移動;(S70)當完成該等夾持構件之向後移動時使該等基材引導構件向後移動;(S80)使該雙基材選別裝置移動至配置有一匣之另一位置;(S90)藉由操作該基材引導輸送裝置使該等基材引導構件向前移動;(S100)當完成該等基材引導構件之該向前移動時使夾持該等基材S之該等夾持構件向前移動;(S110)藉由夾持該等基材之該等夾持構件來為配置在多個不同位置之多個匣提供多個基材並釋放該等夾持構件之該夾持狀態;(S120)當解除該等夾持構件之該夾持狀態時,使該等夾持構件向後移動;及(S130)當完成該等夾持構件之該向後移動時使該等基材引導構件向後移動。Another aspect of the present invention provides a method for sorting dual substrates, which includes the following steps: (S10) moving a dual substrate sorting device to a position configured with a box; (S20) operating a substrate guide width The adjustment device corresponds to the size of the substrate stored in the cassette so as to adjust the width by changing the substrate guide members; (S30) When the adjustment of the width by changing the substrate guide members is completed, the substrate is operated by The material guide conveying device moves the substrate guide members forward; (S40) When the forward movement of the substrate guide members is completed, the holder members of the substrate holder are moved forward; (S50) ) The substrates stored in the box are clamped by the clamping members; (S60) The clamping members are moved backward in the state of clamping the substrates; (S70) When the When the holding member is moved backward, the substrate guide members are moved backward; (S80) the dual substrate selection device is moved to another position configured with a cassette; (S90) by operating the substrate guide conveying device, The substrate guide members move forward; (S100) When the substrate guide is completed When the component moves forward, the holding members holding the substrate S are moved forward; (S110) the holding members holding the substrate are arranged at a plurality of different positions. The plurality of cassettes provide a plurality of substrates and release the clamping state of the clamping members; (S120) when the clamping state of the clamping members is released, the clamping members are moved backward; and ( S130) When the backward movement of the clamping members is completed, the substrate guide members are moved backward.
如上所述,依據本發明之較佳實施例的用於選別雙基材的裝置及方法可將至少一或多數基材連續地插入該等匣中及由該等匣中移除該等基材,藉此增加工作效率。As described above, the apparatus and method for selecting dual substrates according to the preferred embodiments of the present invention can continuously insert at least one or more substrates into and remove the substrates from the cassettes. To increase work efficiency.
此外,即使它是一單一裝置,因為它可應付配置在各種匣上之各種基材,即,具有不同尺寸之基材,所以依據本發明之較佳實施例之用於選別雙基材的裝置及方法仍可實施各種功能,藉此減少製造成本。In addition, even if it is a single device, since it can cope with various substrates arranged on various cassettes, that is, substrates having different sizes, a device for selecting dual substrates according to a preferred embodiment of the present invention And methods can still implement various functions, thereby reducing manufacturing costs.
詳細說明 以下,配合附圖說明依據本發明之一用於選別雙基材的裝置的示範實施例。DETAILED DESCRIPTION Hereinafter, an exemplary embodiment of an apparatus for selecting a dual substrate according to the present invention will be described with reference to the accompanying drawings.
如圖4至6所示,該雙基材選別裝置300包括一基材引導輸送裝置350、一基材引導寬度調整裝置380、一基材夾持器450及一基材夾持器輸送裝置460。As shown in FIGS. 4 to 6, the dual substrate selection device 300 includes a substrate guide conveying device 350, a substrate guide width adjusting device 380, a substrate holder 450 and a substrate holder conveying device 460. .
如圖1至3所示,該雙基材選別裝置300係配置在配置於一Y軸輸送單元100上之一Z軸輸送單元200的一側並可側向地移動,且具有夾持、插入及取出配置在一匣M內之一基材S的功能。如圖4所示,該雙基材選別裝置300更包括設置在配置一上板302下方之一下板402一側的一基材狀態偵測裝置400以便偵測該基材S之狀態。可了解的是該基材狀態偵測裝置400係各具有一相機及一照明單元的一種偵測裝置。As shown in FIGS. 1 to 3, the dual substrate sorting device 300 is disposed on one side of a Z-axis conveying unit 200 disposed on a Y-axis conveying unit 100 and can move laterally, and has clamping and insertion And the function of taking out a substrate S arranged in a box M. As shown in FIG. 4, the dual substrate selection device 300 further includes a substrate condition detecting device 400 disposed on a side of a lower plate 402 disposed below an upper plate 302 to detect the state of the substrate S. It can be understood that the substrate state detection device 400 is a detection device each having a camera and a lighting unit.
如圖2所示,該Y軸輸送單元100包括一基板104、一移動板108、一滾珠螺桿110、一伺服馬達112及一對感測器114。直線運動軌道102配置在該基板104上並互相分開一預定間距,且與直線運動引導件106移動地結合,並且該等直線運動引導件106配置在該移動板108下方並互相分開一預定間距。該滾珠螺桿110配置在該基板104之直線運動軌道102之間,且具有與該移動板108連接之一側及與該伺服馬達112連接之另一側,並且該伺服馬達112係一驅動源。此外,一對感測器114配置在該等直線運動軌道102之兩側並互相分開,且該等直線運動軌道102配置在該基板104上。As shown in FIG. 2, the Y-axis conveying unit 100 includes a substrate 104, a moving plate 108, a ball screw 110, a servo motor 112, and a pair of sensors 114. The linear motion rails 102 are disposed on the substrate 104 and separated from each other by a predetermined distance, and are movably combined with the linear motion guides 106, and the linear motion guides 106 are disposed below the moving plate 108 and separated from each other by a predetermined distance. The ball screw 110 is disposed between the linear motion rails 102 of the substrate 104, and has one side connected to the moving plate 108 and the other side connected to the servo motor 112, and the servo motor 112 is a driving source. In addition, a pair of sensors 114 are disposed on two sides of the linear motion tracks 102 and are separated from each other, and the linear motion tracks 102 are disposed on the substrate 104.
該等感測器114係用於感測及檢查該移動板108之一移動狀態。The sensors 114 are used to sense and check the movement status of one of the moving boards 108.
如圖3所示,該Z軸輸送單元200包括一連接板201、一基板204、一移動板208、一滾珠螺桿210、一伺服馬達212及一對感測器214。As shown in FIG. 3, the Z-axis conveying unit 200 includes a connection plate 201, a base plate 204, a moving plate 208, a ball screw 210, a servo motor 212, and a pair of sensors 214.
該連接板2-1配置在該Y軸輸送單元100之移動板108上,使得該Z軸輸送單元200可依據該Y軸輸送單元100之移動來移動。該垂直基板204係垂直地配置在該連接板201上,且直線運動軌道202配置成互相分開一預定間距。該移動板208配置在該垂直基板204之上部上,且包括與該等直線運動軌道202分別地連接之直線運動引導件206。用於安置該雙基材選別裝置300之一支持構件205配置在該移動板208上。該滾珠螺桿210配置在該垂直基板204之直線運動軌道202之間,且該滾珠螺桿210具有與該移動板208連接之一側及與該伺服馬達212連接之另一側,且該伺服馬達212係一驅動源。此外,一對感測器214配置在該直線運動軌道202之兩側並互相分開,且該等直線運動軌道202配置在該基板204上。該等感測器214係用於感測及檢查該移動板208之一移動狀態。即,該感測器214感測及檢查該雙基材選別裝置300之移動狀態,且該雙基材選別裝置300與該移動板208連接並配置在該支持構件205上。The connecting plate 2-1 is disposed on the moving plate 108 of the Y-axis conveying unit 100, so that the Z-axis conveying unit 200 can move according to the movement of the Y-axis conveying unit 100. The vertical substrate 204 is vertically disposed on the connecting plate 201, and the linear motion rails 202 are disposed to be separated from each other by a predetermined distance. The moving plate 208 is disposed on the upper portion of the vertical substrate 204 and includes linear motion guides 206 respectively connected to the linear motion rails 202. A supporting member 205 for accommodating one of the dual substrate selecting devices 300 is disposed on the moving plate 208. The ball screw 210 is disposed between the linear motion rails 202 of the vertical substrate 204, and the ball screw 210 has one side connected to the moving plate 208 and the other side connected to the servo motor 212, and the servo motor 212 A drive source. In addition, a pair of sensors 214 are disposed on two sides of the linear motion track 202 and are separated from each other, and the linear motion tracks 202 are disposed on the substrate 204. The sensors 214 are used to sense and check the movement status of one of the moving boards 208. That is, the sensor 214 senses and checks the moving state of the dual-substrate selection device 300, and the dual-substrate selection device 300 is connected to the moving plate 208 and is disposed on the supporting member 205.
如圖4與5所示,基材引導輸送裝置350包括一上板302、一支持板306、移動板310、一連接板312、一第一驅動源330及基材引導構件332。As shown in FIGS. 4 and 5, the substrate guiding and conveying device 350 includes an upper plate 302, a supporting plate 306, a moving plate 310, a connecting plate 312, a first driving source 330 and a substrate guiding member 332.
一矩形開口部(未圖示)形成在該上板302之中間,且第一直線運動軌道304配置在該開口部之兩側並互相分開一預定間距。該支持板306配置在該上板302下方,且具有配置成互相分開一預定間距之第二直線運動軌道324。A rectangular opening (not shown) is formed in the middle of the upper plate 302, and the first linear motion track 304 is disposed on both sides of the opening and separated from each other by a predetermined distance. The support plate 306 is disposed below the upper plate 302 and has second linear motion tracks 324 configured to be separated from each other by a predetermined distance.
該等移動板310藉由一垂直框架307與該支持板306分別地連接,且包括與配置在該上板上之該等第一直線運動軌道304分別地連接的第一直線運動引導件308。該連接板312與該等移動板310連接且該滾珠螺桿314配置在該連接板312之一側。該滾珠螺桿314通過配置在該連接板312中間的一連接部315且旋轉地嵌合在一托架317中。因為該滾珠螺桿314之一側與該第一驅動源330連接且另一側嵌合在該托架317中,所以當操作該第一驅動源330時,該連接板312沿著該滾珠螺桿314移動,且該移動板310亦依據該連接板312之移動來移動。該第一驅動源330係使該等基材引導構件向前或向後移動之一伺服馬達。The moving plates 310 are respectively connected to the support plate 306 through a vertical frame 307 and include first linear motion guides 308 respectively connected to the first linear motion rails 304 disposed on the upper plate. The connecting plate 312 is connected to the moving plates 310 and the ball screw 314 is disposed on one side of the connecting plate 312. The ball screw 314 is rotatably fitted into a bracket 317 through a connecting portion 315 disposed in the middle of the connecting plate 312. Because one side of the ball screw 314 is connected to the first driving source 330 and the other side is fitted in the bracket 317, when the first driving source 330 is operated, the connection plate 312 is along the ball screw 314 Move, and the moving plate 310 moves according to the movement of the connecting plate 312. The first driving source 330 is a servo motor that moves the substrate guiding members forward or backward.
該等基材引導構件332配置在該支持板306下方且當該支持板306向前或向後移動時與該支持板306一起移動。即,該等基材引導構件332係分別地結合在調整板320上,且各調整板320具有一第二直線運動引導件328,並且該第二直線運動引導件328嵌合在配置於該支持板306下方之該第二直線運動軌道324中。The substrate guide members 332 are disposed below the support plate 306 and move together with the support plate 306 when the support plate 306 moves forward or backward. That is, the substrate guide members 332 are respectively coupled to the adjustment plates 320, and each adjustment plate 320 has a second linear motion guide 328, and the second linear motion guide 328 is fitted in the support In the second linear motion track 324 under the plate 306.
當操作該第一驅動源330時,該連接板312沿著該滾珠螺桿314移動。當與該連接板312連接之該等移動板310沿著該等第一直線運動軌道304移動時,因為該等移動板310透過該等垂直框架307與該支持板306連接,所以當該等移動板310移動時該支持板306亦移動。此外,因為該等調整板320與該支持板306連接且該等基材引導構件332與該等調整板320一體地連接,所以該等基材引導構件332可用於引導該等基材S。When the first driving source 330 is operated, the connecting plate 312 moves along the ball screw 314. When the moving plates 310 connected to the connecting plate 312 move along the first linear motion rails 304, because the moving plates 310 are connected to the support plate 306 through the vertical frames 307, the moving plates When 310 moves, the support plate 306 also moves. In addition, since the adjustment plates 320 are connected to the support plate 306 and the substrate guide members 332 are integrally connected to the adjustment plates 320, the substrate guide members 332 can be used to guide the substrates S.
如圖4至6所示,該基材引導寬度調整裝置380包括該等基材引導構件332、連桿334、一旋轉板335及一第二驅動源340。As shown in FIGS. 4 to 6, the substrate guide width adjusting device 380 includes the substrate guide members 332, a connecting rod 334, a rotating plate 335, and a second driving source 340.
如圖4與5所示,該等基材引導構件332配置在該支持板306下方且組配成沿著該支持板306之第二直線運動軌道324朝側向移動。即,該等基材引導構件332與該等調整板320分別地連接且依據該等調整板320之移動而與該等調整板320一起移動,該等調整板320具有與該等第二直線運動軌道324分別地連接之該等第二直線運動引導件328,且該等第二直線運動軌道324在該支持板306下方互相分開。As shown in FIGS. 4 and 5, the substrate guiding members 332 are disposed below the support plate 306 and are assembled to move laterally along a second linear movement track 324 of the support plate 306. That is, the substrate guide members 332 are separately connected to the adjustment plates 320 and move with the adjustment plates 320 in accordance with the movement of the adjustment plates 320, and the adjustment plates 320 have a second linear motion with the second linear motion. The rails 324 are respectively connected to the second linear motion guides 328, and the second linear motion rails 324 are separated from each other under the support plate 306.
如圖8所示,該等連桿334配置在與該等基材引導構件332連接之該等調整板320上。該等旋轉板335之兩側與該等連桿334分別地連接,且該旋轉板335與該第二驅動源340之一軸桿(未圖示)連接以便與該等連桿334一起旋轉。該第二驅動源340係用於依據該等基材S之種類來調整該等基材引導構件332之寬度的一伺服馬達。As shown in FIG. 8, the connecting rods 334 are disposed on the adjustment plates 320 connected to the substrate guide members 332. Two sides of the rotating plates 335 are respectively connected to the connecting rods 334, and the rotating plate 335 is connected to a shaft (not shown) of the second driving source 340 to rotate together with the connecting rods 334. The second driving source 340 is a servo motor for adjusting the width of the substrate guiding members 332 according to the type of the substrates S.
在該基材引導寬度調整裝置380之情形中,當操作該第二驅動源340時,如圖8所示,該旋轉板335旋轉,且在此情形下,與該旋轉板335連接之該等連桿334亦旋轉。因為藉由該等連桿334之旋轉來調整該等調整板320之寬度,所以可調整與該等調整板320連接之該等基材引導構件332的寬度。In the case of the substrate guide width adjusting device 380, when the second driving source 340 is operated, as shown in FIG. 8, the rotating plate 335 is rotated, and in this case, the rotating plate 335 is connected to the rotating plate 335. The connecting rod 334 also rotates. Since the width of the adjustment plates 320 is adjusted by the rotation of the links 334, the width of the substrate guide members 332 connected to the adjustment plates 320 can be adjusted.
如圖4與6所示,該基材夾持器450包括一下板402、移動塊410、支持塊420、夾持器缸430及夾持構件440。As shown in FIGS. 4 and 6, the substrate holder 450 includes a lower plate 402, a moving block 410, a support block 420, a holder cylinder 430 and a holding member 440.
該下板402具有第三直線運動軌道404,該等第三直線運動軌道404藉由多數框架401互相連接在該上板302下方且配置成互相分開一預定間距。與該下板402之第三直線運動軌道404分別地接合之第三直線運動引導件406分別地配置在該等移動塊410下方,且第四直線運動軌道414分別地配置在該等移動塊410之上部並互相分開一預定間距。該等支持塊420分別地包括與該等移動塊410之第四直線運動軌道414分別地連接的第四直線運動引導件416。該等夾持器缸430與該等支持塊420分別地連接,且該等夾持構件440與該等夾持器缸430分別地連接以便夾持該等基材S。The lower plate 402 has a third linear motion track 404, and the third linear motion tracks 404 are connected to each other under the upper plate 302 by a plurality of frames 401 and are arranged to be separated from each other by a predetermined distance. The third linear motion guides 406 which are respectively engaged with the third linear motion track 404 of the lower plate 402 are respectively disposed under the moving blocks 410, and the fourth linear motion track 414 are respectively disposed under the moving blocks 410. The upper parts are separated from each other by a predetermined distance. The support blocks 420 include fourth linear motion guides 416 respectively connected to the fourth linear motion track 414 of the moving blocks 410. The holder cylinders 430 are respectively connected to the support blocks 420, and the holding members 440 are separately connected to the holder cylinders 430 so as to hold the substrates S.
該等夾持構件440配置在該等支持塊420上且具有該等第四直線運動引導件416之該等支持塊420沿著配置在該等移動塊410上之第四直線運動軌道414移動,使得該等夾持構件440之寬度可調整。此外,如圖7所示,為了避免在夾持該等基材S時互相干涉,該等夾持構件440配置在互相不同之高度以便個別地或同時地夾持該等基材S。即,當該等夾持構件440夾持該等基材S時,只有該等二夾持構件400中之一夾持構件可個別地移動或所有夾持構件440可同時移動。The holding members 440 are disposed on the support blocks 420 and the support blocks 420 having the fourth linear motion guide 416 are moved along a fourth linear motion track 414 disposed on the moving blocks 410, The width of the clamping members 440 can be adjusted. In addition, as shown in FIG. 7, in order to avoid interference with each other when the substrates S are clamped, the clamping members 440 are disposed at mutually different heights so as to individually or simultaneously clamp the substrates S. That is, when the holding members 440 hold the substrate S, only one of the two holding members 400 may be individually moved or all the holding members 440 may be moved simultaneously.
該基材夾持器450係組配成使得配置有該等夾持構件440及該等夾持器缸430之該等支持塊420可沿著該等第三直線運動軌道404及該等第四直線運動軌道414朝來回方向及朝側向移動。該等夾持構件440同時操作該等夾持器缸430以便夾持該等基材S。換言之,當該等夾持器缸430在該等夾持構件440互相分開之狀態中操作時,在該等夾持構件440間之一間距減少使得該等夾持構件440可夾持該等基材S。在該等基材S移動至設置該匣M之一預定位置後,當該等夾持器缸430之操作停止時,該等夾持構件440返回其初始狀態。The substrate holder 450 is assembled so that the support blocks 420 provided with the holding members 440 and the holder cylinders 430 can move along the third linear movement track 404 and the fourth The linear motion track 414 moves in a back-and-forth direction and a side direction. The holding members 440 simultaneously operate the holder cylinders 430 to hold the substrates S. In other words, when the holder cylinders 430 are operated in a state where the holding members 440 are separated from each other, a distance between the holding members 440 is reduced so that the holding members 440 can hold the bases.材 S. After the substrates S are moved to a predetermined position where the cassette M is set, when the operation of the holder cylinders 430 is stopped, the holding members 440 return to their initial states.
同時,因為分別配置在該基材夾持器450之支持塊420上部上的滾珠軸襯422分別嵌合在與該等基材引導構件332之底側分別地且一體地連接之連接構件342的長孔344中,所以當調整該等基材引導構件332之寬度時,該等支持塊420亦沿著該等第四直線運動軌道414朝該側向(寬度方向)移動,使得該等夾持構件440之寬度亦可調整。At the same time, the ball bushings 422 respectively arranged on the upper part of the support block 420 of the substrate holder 450 are respectively fitted to the connection members 342 which are separately and integrally connected to the bottom side of the substrate guide members 332. Long hole 344, so when adjusting the width of the substrate guide members 332, the support blocks 420 also move along the fourth linear movement track 414 toward the side (width direction), so that the clamping The width of the member 440 can also be adjusted.
如圖4與6所示,該基材夾持器輸送裝置460包括一對第一與第二滑輪452與454、皮帶456及第三驅動源458。As shown in FIGS. 4 and 6, the substrate holder conveying device 460 includes a pair of first and second pulleys 452 and 454, a belt 456, and a third driving source 458.
該等第一與第二滑輪452與454分別配置在配置於該下板402上之第三直線運動軌道404外側並互相分開一間距。該等皮帶456分別嵌合在該等第一與第二滑輪452與454之間。該等第三驅動源458與該第一滑輪452分別地連接。The first and second pulleys 452 and 454 are respectively disposed outside the third linear motion track 404 disposed on the lower plate 402 and spaced apart from each other. The belts 456 are fitted between the first and second pulleys 452 and 454, respectively. The third driving sources 458 are respectively connected to the first pulley 452.
該基材夾持器輸送裝置460係組配成使得當操作該等第三驅動源458時,操作與該等第三驅動源458之軸桿(未圖示)連接的該等第一滑輪452。在此情形下,藉由該等第一滑輪452及該等皮帶456互相連接之該等第二滑輪454亦旋轉。藉此,該等移動塊410朝垂直方向(朝來回方向)沿著該等第三直線運動軌道404移動。即,因為配置在該等移動塊410上的該等支持塊420之夾持構件440朝垂直方向移動,所以該等夾持構件440可朝向配置在一預定位置之匣M內的該等基材S向前移動,且在夾持該等基材S後向後移動,並取出該等基材S。The substrate holder conveying device 460 is configured so that when the third driving sources 458 are operated, the first pulleys 452 connected to a shaft (not shown) of the third driving sources 458 are operated. . In this case, the second pulleys 454 connected to each other by the first pulleys 452 and the belts 456 also rotate. Thereby, the moving blocks 410 move in the vertical direction (toward the back and forth direction) along the third linear movement track 404. That is, since the holding members 440 of the supporting blocks 420 arranged on the moving blocks 410 move in a vertical direction, the holding members 440 may face the substrates arranged in the cassette M at a predetermined position. S moves forward, and moves backward after clamping the substrates S, and removes the substrates S.
以下,說明依據本發明之較佳實施例的雙基材選別裝置的操作關係。Hereinafter, the operation relationship of the dual-substrate selection device according to the preferred embodiment of the present invention will be described.
如圖1至4所示,依據本發明之較佳實施例的雙基材選別裝置使用該Y軸輸送單元100及該Z軸輸送單元200移動至配置有該匣M之一預定位置。As shown in FIGS. 1 to 4, the dual substrate selecting apparatus according to the preferred embodiment of the present invention uses the Y-axis conveying unit 100 and the Z-axis conveying unit 200 to move to a predetermined position where the cassette M is arranged.
當該雙基材選別裝置300移動至該預定位置時,它操作該基材引導輸送裝置350之第一驅動源330。當操作該第一驅動源330時,該連接板312沿著該滾珠螺桿14移動,且接著與該連接板312連接之移動板310沿著該等第一直線運動軌道304移動。此外,因為該移動板310透過該垂直框架307與該支持板306連接,所以當該移動板310移動時,該支持板306亦移動。因為該等調整板320與該支持板306連接且該等基材引導構件332與該等調整板320一體地連接,所以該等基材引導構件332向前移動以便引導該等基材S。When the dual substrate selection device 300 is moved to the predetermined position, it operates the first driving source 330 of the substrate guide conveying device 350. When the first driving source 330 is operated, the connecting plate 312 moves along the ball screw 14, and then the moving plate 310 connected to the connecting plate 312 moves along the first linear motion rails 304. In addition, since the moving plate 310 is connected to the supporting plate 306 through the vertical frame 307, when the moving plate 310 moves, the supporting plate 306 also moves. Since the adjustment plates 320 are connected to the support plate 306 and the substrate guide members 332 are integrally connected to the adjustment plates 320, the substrate guide members 332 move forward to guide the substrates S.
操作該基材引導輸送裝置350之第一驅動源330,且在同時或在一預定時間間隔後,操作該基材引導寬度調整裝置380之第二驅動源340。當操作該第二驅動源340時,該旋轉板335旋轉,且在此情形下,各有一側與該旋轉板335連接之連桿34亦旋轉。因為可藉由該等連桿34之旋轉調整該等調整板320之寬度,所以亦可調整與該等調整板320連接的該等基材引導構件332之寬度。The first drive source 330 of the substrate guide conveying device 350 is operated, and the second drive source 340 of the substrate guide width adjusting device 380 is operated at the same time or after a predetermined time interval. When the second driving source 340 is operated, the rotating plates 335 rotate, and in this case, the connecting rods 34 connected to the rotating plate 335 on one side also rotate. Since the width of the adjustment plates 320 can be adjusted by the rotation of the links 34, the width of the substrate guide members 332 connected to the adjustment plates 320 can also be adjusted.
同時,因為該基材夾持器450係組配成使得配置有該等夾持構件440及該等夾持器缸430之該等支持塊420可沿著該等第三直線運動軌道404及該等第四直線運動軌道414朝該來回方向及朝該側向移動,所以該等夾持構件440可藉由操作該等夾持器缸430來夾持該等基材S。At the same time, because the substrate holder 450 is assembled so that the supporting blocks 420 provided with the holding members 440 and the holder cylinders 430 can move along the third linear movement track 404 and the The fourth linear motion track 414 moves toward the back and forth direction and the side direction, so the clamping members 440 can clamp the substrate S by operating the clamper cylinders 430.
因為分別地配置在該基材夾持器450之支持塊420之上部上的該等全軸襯422嵌合在與該等基材引導構件332之下部分別地且一體地連接之連接構件342的長孔344中,所以一調整該等基材引導構件332之寬度,該等支持塊420就沿著該等第四直線運動軌道414朝該側向(寬度方向)移動,使得該等夾持構件440之寬度亦可調整。This is because the full bushes 422 that are separately arranged on the upper part of the support block 420 of the substrate holder 450 are fitted to the connection members 342 that are separately and integrally connected to the lower part of the substrate guide members 332. In the long hole 344, as soon as the width of the substrate guide members 332 is adjusted, the support blocks 420 move along the fourth linear movement track 414 toward the side (width direction), so that the clamps The width of the member 440 can also be adjusted.
當操作該等第三驅動源458時,亦操作與該等第三驅動源458之軸桿(未圖示)連接的該等第一滑輪452。在此情形下,亦操作藉由該等第一滑輪452及該等皮帶456互相連接之該等第二滑輪454,且接著該等移動塊410沿著該等第三直線運動軌道404朝該垂直方向(朝該來回方向)移動。When the third driving sources 458 are operated, the first pulleys 452 connected to a shaft (not shown) of the third driving sources 458 are also operated. In this case, the second pulleys 454 connected to each other by the first pulleys 452 and the belts 456 are also operated, and then the moving blocks 410 are moved along the third linear movement track 404 toward the vertical Direction (toward the back and forth direction).
以下,說明依據本發明之一較佳實施例的一用於選別雙基材的方法。Hereinafter, a method for selecting dual substrates according to a preferred embodiment of the present invention will be described.
如圖9與10所示,該雙基材選別方法包括以下步驟:(S10)使該雙基材選別裝置300移動至配置有該匣M之一位置;(S20)操作該基材引導寬度調整裝置380以對應收納在該匣M中之基材S的尺寸以便藉由改變該等基材引導構件332來調整寬度;(S30)當完成藉由改變該等基材引導構件332來調整寬度時,藉由操作該基材引導輸送裝置350使該等基材引導構件332向前移動;(S40)當完成該等基材引導構件332之向前移動時,使該基材夾持器450之該等夾持構件440向前移動;(S50)藉由該等夾持構件440夾持收納在該匣M中之該等基材S;(S60)在夾持該等基材S之狀態中使該等夾持構件440向後移動;(S70)當完成該等夾持構件440之向後移動時,使該等基材引導構件332向後移動;(S80)使該雙基材選別裝置300移動至配置有一匣M之另一位置;(S90)藉由操作該基材引導輸送裝置350使該等基材引導構件332向前移動;(S100)當完成該等基材引導構件332之該向前移動時,使夾持該等基材S之該等夾持構件440向前移動;(S110)藉由夾持該等基材S之該等夾持構件440來為配置在多個不同位置之該等匣M提供多個基材S並釋放該等夾持構件440之夾持狀態;(S120)當解除該等夾持構件440之該夾持狀態時,使該等夾持構件440向後移動;及(S130)當完成該等夾持構件440之該向後移動時,使該等基材引導構件332向後移動。As shown in FIGS. 9 and 10, the dual substrate selection method includes the following steps: (S10) moving the dual substrate selection device 300 to a position where the cassette M is arranged; (S20) operating the substrate guide width adjustment The device 380 corresponds to the size of the substrate S stored in the cassette M so as to adjust the width by changing the substrate guide members 332; (S30) When the adjustment of the width by changing the substrate guide members 332 is completed , By moving the substrate guide conveying device 350 to move the substrate guide members 332 forward; (S40) When the forward movement of the substrate guide members 332 is completed, the substrate holder 450 is moved. The clamping members 440 are moved forward; (S50) The substrates S stored in the cassette M are clamped by the clamping members 440; (S60) In a state of clamping the substrates S Move the clamping members 440 backward; (S70) When the backward movement of the clamping members 440 is completed, move the substrate guide member 332 backward; (S80) Move the dual substrate selection device 300 to One position of a box M is arranged; (S90) the substrate guide members 332 are advanced by operating the substrate guide conveying device 350 Move; (S100) when the forward movement of the substrate guide members 332 is completed, the holding members 440 holding the substrate S are moved forward; (S110) by holding the substrates The clamping members 440 of the material S to provide a plurality of substrates S for the cassettes M arranged at a plurality of different positions and release the clamping state of the clamping members 440; (S120) when the clamping is released When the clamping state of the members 440 is made, the clamping members 440 are moved backward; and (S130) When the backward movement of the clamping members 440 is completed, the substrate guide members 332 are moved backward.
如圖11所示,使該雙基材選別裝置300移動至配置有該匣M之位置的步驟(S10)包括以下步驟:(S12)使該雙基材選別裝置300移動至沿著該Y軸輸送單元100之一Y軸;及(S14)使該雙基材選別裝置300移動至沿著該Z軸輸送單元200之一Z軸。As shown in FIG. 11, the step (S10) of moving the dual-substrate selection device 300 to a position where the cassette M is disposed includes the following steps: (S12) moving the dual-substrate selection device 300 along the Y axis A Y-axis of the transport unit 100; and (S14) moving the dual substrate sorting device 300 to a Z-axis of the Z-axis transport unit 200.
在使該雙基材選別裝置300移動至沿著該Y軸輸送單元100之Y軸的步驟(S12)中,與配置在該Z軸輸送單元200下部之該連接板201連接的該移動板108移動,且配置在該基板104之兩側的該等感測器114感測該移動板108之移動。In the step (S12) of moving the dual substrate sorting device 300 to the Y axis of the Y axis conveying unit 100, the moving plate 108 connected to the connection plate 201 disposed at the lower portion of the Z axis conveying unit 200 Movement, and the sensors 114 disposed on both sides of the substrate 104 sense the movement of the moving plate 108.
在使該雙基材選別裝置300移動至沿著該Z軸輸送單元200之Z軸的步驟(S14)中,該雙基材選別裝置300配置在與該移動板208連接之支持構件205上,且在該雙基材選別裝置300配置在該支持構件205上之狀態中,該移動板208沿著該等直線運動軌道202移動。在此,當操作該伺服馬達212時,該移動板208依據該滾珠螺桿210之移動來移動。In the step (S14) of moving the dual-substrate selection device 300 to the Z-axis along the Z-axis conveying unit 200, the dual-substrate selection device 300 is disposed on a support member 205 connected to the moving plate 208, And in a state where the dual-substrate selection device 300 is disposed on the supporting member 205, the moving plate 208 moves along the linear movement tracks 202. Here, when the servo motor 212 is operated, the moving plate 208 moves according to the movement of the ball screw 210.
如圖12所示,操作該基材引導寬度調整裝置380以對應收納在該匣M中之該等基材S的尺寸以便藉由改變該等基材引導構件332來調整寬度的步驟(S20)更包含以下步驟:(S22)操作該第二驅動源340以便操作與該第二驅動源340連接之該旋轉板336及該等連桿334;及(S24)藉由操作該等連桿334來操作與該等調整板320連接之該等基材引導構件332。As shown in FIG. 12, the step of operating the substrate guide width adjusting device 380 to correspond to the size of the substrates S stored in the cassette M so as to adjust the width by changing the substrate guide members 332 (S20) It further includes the following steps: (S22) operating the second driving source 340 to operate the rotating plate 336 and the links 334 connected to the second driving source 340; and (S24) by operating the links 334 to The substrate guide members 332 connected to the adjustment plates 320 are operated.
在操作該第二驅動源340以便操作與該第二驅動源340連接之該旋轉板336及該等連桿334的步驟(S22)中,當操作該第二驅動源340時,與該第二驅動源340之軸桿(未圖示)連接的該旋轉板336旋轉,且接著與該旋轉板336連接之該等連桿334亦旋轉。在藉由操作該等連桿334來操作與該等調整板320連接之該等基材引導構件332的步驟(S24)中,該等連桿334之狀態藉由該旋轉板336之旋轉而由一直線狀態改變成一傾斜狀態,使得與該等調整板320的該等基材引導構件332之寬度可調整。In the step (S22) of operating the second driving source 340 to operate the rotating plate 336 and the links 334 connected to the second driving source 340, when the second driving source 340 is operated, the second driving source 340 is connected to the second driving source 340. The rotating plate 336 connected to a shaft (not shown) of the driving source 340 rotates, and then the connecting rods 334 connected to the rotating plate 336 also rotate. In the step (S24) of operating the substrate guide members 332 connected to the adjustment plates 320 by operating the links 334, the state of the links 334 is caused by the rotation of the rotary plate 336 A linear state is changed to an inclined state, so that the widths of the substrate guiding members 332 with the adjusting plates 320 can be adjusted.
如圖9與10所示,該雙基材選別方法更包括以下步驟:(S25)在實施操作該基材引導寬度調整裝置380以對應收納在該匣M中之該等基材S的尺寸以便藉由改變該等基材引導構件332來調整寬度的步驟(S20)後,依據具有對應於該基材S尺寸之已調整寬度的基材引導構件332,改變配置該等夾持構件440之該等支持塊420以便調整該等夾持構件440之寬度。即,當操作該第二驅動源340時,依據本發明之雙基材選別裝置的基材引導寬度調整裝置380使配置在該等調整板320上之旋轉板335及兩側與該旋轉板335連接之該等連桿334旋轉,藉此第一次調整該等基材引導構件332之寬度。此外,因為該等支持塊420之該等滾珠軸襯422嵌合在配置在該等基材引導構件332下方之該等連接構件342的長孔344中,所以一調整該等基材引導構件332之寬度,該等支持塊420就沿著該等第四直線運動軌道414朝該側向(寬度方向)移動,使得該等夾持構件440之寬度第二次被調整。As shown in FIGS. 9 and 10, the dual substrate selection method further includes the following steps: (S25) The substrate guide width adjusting device 380 is implemented to correspond to the sizes of the substrates S stored in the cassette M so that After the step (S20) of adjusting the width by changing the base material guide members 332, according to the base material guide member 332 having an adjusted width corresponding to the size of the base material S, the arrangement of the holding members 440 is changed. The supporting blocks 420 are waited for adjusting the width of the clamping members 440. That is, when the second driving source 340 is operated, the substrate guide width adjusting device 380 of the dual substrate selecting device according to the present invention makes the rotating plates 335 and the two sides disposed on the adjusting plates 320 and the rotating plate 335 The connected links 334 rotate, thereby adjusting the width of the substrate guide members 332 for the first time. In addition, since the ball bushings 422 of the support blocks 420 are fitted in the long holes 344 of the connection members 342 disposed below the substrate guide members 332, the substrate guide members 332 are adjusted The width of the supporting blocks 420 moves along the fourth linear movement track 414 toward the side (width direction), so that the width of the clamping members 440 is adjusted for the second time.
當改變該等基材引導構件332且完成該寬度調整時,如圖13所示,藉由操作該基材引導輸送裝置350使該等基材引導構件332向前移動的步驟(S30)包括以下步驟:(S32)操作該第一驅動源330以便操作與該第一驅動源330連接之滾珠螺桿314及使該連接板312及與該連接板312連接之該移動板310移動;及(S34)使透過該垂直框架307與該移動板310連接之該支持板306及與該支持板306連接之該等基材引導構件332移動。When the substrate guide members 332 are changed and the width adjustment is completed, as shown in FIG. 13, the step (S30) of moving the substrate guide members 332 forward by operating the substrate guide conveying device 350 includes the following: Steps: (S32) operating the first driving source 330 so as to operate the ball screw 314 connected to the first driving source 330 and move the connection plate 312 and the moving plate 310 connected to the connection plate 312; and (S34) The support plate 306 connected to the moving plate 310 through the vertical frame 307 and the substrate guide members 332 connected to the support plate 306 are moved.
在操作該第一驅動源330以便操作與該第一驅動源330連接之滾珠螺桿314及使該連接板312及與該連接板312連接之該移動板310移動的步驟(S32)中,當操作該第一驅動源330時,該連接板312沿著該滾珠螺桿314移動,且接著與該連接板312連接之該等移動板310沿著該等第一直線運動軌道304移動。In the step (S32) of operating the first driving source 330 to operate the ball screw 314 connected to the first driving source 330 and moving the connection plate 312 and the moving plate 310 connected to the connection plate 312, when operating When the first driving source 330, the connecting plate 312 moves along the ball screw 314, and then the moving plates 310 connected to the connecting plate 312 move along the first linear motion track 304.
在使透過該垂直框架307與該移動板310連接之該支持板306及與該支持板306連接之該等基材引導構件332移動的步驟(S34)中,因為該移動板310透過該垂直框架307與該支持板306連接,所以當該移動板310移動時該支持板306亦移動。因為該等調整板320與該支持板306連接且該等基材引導構件332與該等調整板320一體地連接,該等基材引導構件332向前移動以便引導該等基材S。In the step (S34) of moving the support plate 306 connected to the moving plate 310 through the vertical frame 307 and the substrate guide members 332 connected to the support plate 306, the moving plate 310 passes through the vertical frame 307 is connected to the supporting board 306, so when the moving board 310 moves, the supporting board 306 also moves. Because the adjustment plates 320 are connected to the support plate 306 and the substrate guide members 332 are integrally connected with the adjustment plates 320, the substrate guide members 332 are moved forward to guide the substrates S.
如圖14所示,當完成該等基材引導構件332之向前移動時,使該基材夾持器450之該等夾持構件440向前移動的步驟(S40)包括以下步驟:(S42)決定是否使該等夾持構件440中之一或全部夾持構件向前移動;及(S44)操作該等第三驅動源458以使該等移動塊410移動至配置有該匣M之一位置。As shown in FIG. 14, when the forward movement of the substrate guide members 332 is completed, the step of moving the holding members 440 of the substrate holder 450 forward (S40) includes the following steps: (S42 ) Decide whether to move one or all of the holding members 440 forward; and (S44) operate the third driving source 458 to move the moving block 410 to one of the cassettes M position.
在決定是否使該等夾持構件440中之一或全部夾持構件向前移動的步驟(S42)中,一控制單元(未圖示)決定是否使該等夾持構件440中之一或全部夾持構件向前移動。In a step (S42) of deciding whether to move one or all of the clamping members 440 forward, a control unit (not shown) decides whether to make one or all of the clamping members 440 The holding member moves forward.
如圖15所示,藉由該等夾持構件440夾持收納在該匣M中之該等基材S的步驟(S50)包括以下步驟:(S52)操作該等夾持器缸430以便藉由該等夾持構件440夾持該等基材S;及(S54)當該等夾持構件440夾持該等基材S時藉由該基材狀態偵測裝置400檢查該等基材S之夾持狀態。As shown in FIG. 15, the step (S50) of holding the substrates S stored in the cassette M by the holding members 440 includes the following steps: (S52) operating the holder cylinders 430 to borrow The substrates S are clamped by the clamping members 440; and (S54) when the substrates S are clamped by the clamping members 440, the substrates S are inspected by the substrate state detecting device 400 Its clamping state.
因為藉由該等夾持構件440夾持該等基材S之步驟(S52)及檢查該等基材S之夾持狀態的步驟(S54)類似於該雙基材選別裝置300之操作關係,所以省略其詳細說明。Because the step (S52) of holding the base material S by the holding members 440 and the step (S54) of checking the holding state of the base material S are similar to the operation relationship of the dual base material selection device 300, Therefore, its detailed description is omitted.
如上所述,依據本發明之較佳實施例的雙基材選別方法可藉由單一裝置實施各種操作,因為它可對應於各種基材之尺寸調整該等基材引導構件之寬度及調整該等夾持構件之寬度。此外,因為該等夾持構件配置在互不相同之高度以便避免互相干渉,所以該等夾持構件可個別地或同時地夾持該等基材。As described above, the dual substrate selection method according to the preferred embodiment of the present invention can perform various operations by a single device because it can adjust the width of the substrate guide members and adjust the The width of the clamping member. In addition, because the holding members are arranged at different heights to avoid mutual interference, the holding members can hold the substrates individually or simultaneously.
依據本發明之用於選別雙基材的裝置及方法可廣泛地應用在用於製造半導體之領域中,例如插入多個匣及由多個匣取出之半導體設備中。The device and method for sorting dual substrates according to the present invention can be widely used in the field for manufacturing semiconductors, such as semiconductor devices inserted into and removed from multiple cases.
100‧‧‧Y軸輸送單元
102,202‧‧‧直線運動軌道
104,204‧‧‧基板
106,206‧‧‧直線運動引導件
108,208,310‧‧‧移動板
110,210,314‧‧‧滾珠螺桿
112,212‧‧‧伺服馬達
114,214‧‧‧感測器
200‧‧‧Z軸輸送單元
201,312‧‧‧連接板
205‧‧‧支持構件
300‧‧‧雙基材選別裝置
302‧‧‧上板
304‧‧‧第一直線運動軌道
306‧‧‧支持板
307‧‧‧垂直框架
308‧‧‧第一直線運動引導件
315‧‧‧連接部
317‧‧‧托架
320‧‧‧調整板
324‧‧‧第二直線運動軌道
328‧‧‧第二直線運動引導件
330‧‧‧第一驅動源
332‧‧‧基材引導構件
334‧‧‧連桿
335,336‧‧‧旋轉板
340‧‧‧第二驅動源
342‧‧‧連接構件
344‧‧‧長孔
350‧‧‧基材引導輸送裝置
380‧‧‧基材引導寬度調整裝置
400‧‧‧基材狀態偵測裝置
401‧‧‧框架
402‧‧‧下板
404‧‧‧第三直線運動軌道
406‧‧‧第三直線運動引導件
410‧‧‧移動塊
414‧‧‧第四直線運動軌道
416‧‧‧第四直線運動引導件
420‧‧‧支持塊
422‧‧‧滾珠軸襯
430‧‧‧夾持器缸
440‧‧‧夾持構件
450‧‧‧基材夾持器
452‧‧‧第一滑輪
454‧‧‧第二滑輪
456‧‧‧皮帶
458‧‧‧第三驅動源
460‧‧‧基材夾持器輸送裝置
M‧‧‧匣
S‧‧‧基材
S10,S12,S14,S20,S22,S24,S25,S30,S32,S34,S40,S42,S44,S50,S52,S54,S60,S70,S80,S90,S100,S110,S120,S130‧‧‧步驟100‧‧‧Y-axis conveying unit
102,202‧‧‧Straight motion track
104,204‧‧‧ substrate
106,206‧‧‧ Linear Motion Guide
108,208,310‧‧‧Mobile board
110,210,314‧‧‧ball screw
112,212‧‧‧Servo motor
114,214‧‧‧ sensors
200‧‧‧Z axis conveying unit
201,312‧‧‧Connecting plate
205‧‧‧Support components
300‧‧‧Dual substrate selection device
302‧‧‧on board
304‧‧‧The first linear motion track
306‧‧‧Support board
307‧‧‧Vertical Frame
308‧‧‧The first linear motion guide
315‧‧‧Connection Department
317‧‧‧carriage
320‧‧‧ Adjustment board
324‧‧‧Second linear motion track
328‧‧‧Second linear motion guide
330‧‧‧first drive source
332‧‧‧ substrate guide member
334‧‧‧ connecting rod
335,336‧‧‧Rotating plate
340‧‧‧Second drive source
342‧‧‧Connecting components
344‧‧‧long hole
350‧‧‧ substrate guide conveying device
380‧‧‧ substrate guide width adjustment device
400‧‧‧ substrate condition detection device
401‧‧‧Frame
402‧‧‧Lower plate
404‧‧‧The third linear motion track
406‧‧‧The third linear motion guide
410‧‧‧moving block
414‧‧‧Fourth linear motion track
416‧‧‧Fourth linear motion guide
420‧‧‧ support block
422‧‧‧ball bush
430‧‧‧ gripper cylinder
440‧‧‧Clamping member
450‧‧‧ substrate holder
452‧‧‧The first pulley
454‧‧‧second pulley
456‧‧‧Belt
458‧‧‧third drive source
460‧‧‧ substrate holder conveying device
M‧‧‧ box
S‧‧‧ substrate
S10, S12, S14, S20, S22, S24, S25, S30, S32, S34, S40, S42, S44, S50, S52, S54, S60, S70, S80, S90, S100, S110, S120, S130 step
圖式簡單說明 本發明之上述及其他目的、特徵及優點可配合附圖由本發明之較佳實施例的以下詳細說明了解,其中:Brief Description of the Drawings The above and other objects, features and advantages of the present invention can be understood from the following detailed description of the preferred embodiments of the present invention in conjunction with the drawings, wherein:
圖1係簡單顯示依據本發明一較佳實施例之一用以選別雙基材的裝置的立體圖;FIG. 1 is a perspective view briefly showing a device for selecting dual substrates according to a preferred embodiment of the present invention; FIG.
圖2係顯示依據本發明較佳實施例之雙基材選別裝置的一Y軸輸送單元的截面圖;2 is a cross-sectional view showing a Y-axis conveying unit of a dual substrate selecting device according to a preferred embodiment of the present invention;
圖3係顯示依據本發明較佳實施例之雙基材選別裝置的一Z軸輸送單元的截面圖;3 is a cross-sectional view showing a Z-axis conveying unit of a dual substrate selecting device according to a preferred embodiment of the present invention;
圖4係顯示依據本發明較佳實施例之用以選別雙基材的裝置的立體圖;4 is a perspective view showing a device for selecting dual substrates according to a preferred embodiment of the present invention;
圖5係顯示依據本發明較佳實施例之雙基材選別裝置的一基材引導輸送裝置及一基材引導寬度調整裝置的立體圖;5 is a perspective view showing a substrate guide conveying device and a substrate guide width adjusting device of a dual substrate selection device according to a preferred embodiment of the present invention;
圖6係顯示依據本發明較佳實施例之雙基材選別裝置的一基材夾持器及一基材夾持器輸送裝置的立體圖;6 is a perspective view showing a substrate holder and a substrate holder conveying device of a dual substrate selection device according to a preferred embodiment of the present invention;
圖7係顯示依據本發明較佳實施例之雙基材選別裝置的基材夾持構件的截面圖;7 is a cross-sectional view showing a substrate holding member of a dual substrate selection device according to a preferred embodiment of the present invention;
圖8係顯示在該雙基材選別裝置之該基材引導寬度調整裝置之一旋轉板與多個連桿間之操作關係的截面圖;8 is a cross-sectional view showing an operation relationship between a rotating plate and a plurality of links of the substrate guide width adjusting device of the dual substrate selecting device;
圖9與10係流程圖,簡單顯示本發明一較佳實施例之一用於選別雙基材的方法;9 and 10 are flowcharts showing a method for selecting dual substrates according to a preferred embodiment of the present invention;
圖11係流程圖,顯示使該雙基材選別裝置移動至配置有一匣之一位置的步驟;11 is a flowchart showing the steps of moving the dual-substrate selection device to a position where one of the cassettes is arranged;
圖12係流程圖,顯示操作該基材引導寬度調整裝置以對應收納在該匣中之基材的尺寸以便藉由改變基材引導構件來調整寬度;12 is a flowchart showing the operation of the substrate guide width adjusting device to correspond to the size of the substrate stored in the cassette so as to adjust the width by changing the substrate guide member;
圖13係流程圖,顯示當完成藉由改變該等基材引導構件來調整寬度時,藉由操作該基材引導輸送裝置使該等基材引導構件向前移動的步驟;13 is a flowchart showing the steps of moving the substrate guide members forward by operating the substrate guide conveying device when adjusting the width by changing the substrate guide members;
圖14係流程圖,顯示當完成該等基材引導構件之向前移動時,使該基材夾持器之該等夾持構件向前移動的步驟;及14 is a flowchart showing the steps of moving the holding members of the substrate holder forward when the forward movement of the substrate guide members is completed; and
圖15係流程圖,顯示藉由該等夾持構件夾持收納在該匣中之該等基材的步驟。FIG. 15 is a flowchart showing the steps of holding the substrates stored in the cassette by the holding members.
100‧‧‧Y軸輸送單元 100‧‧‧Y-axis conveying unit
200‧‧‧Z軸輸送單元 200‧‧‧Z axis conveying unit
300‧‧‧雙基材選別裝置 300‧‧‧Dual substrate selection device
M‧‧‧匣 M‧‧‧ box
S‧‧‧基材 S‧‧‧ substrate
Claims (16)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2016-0104434 | 2016-08-17 | ||
| KR1020160104434A KR101849351B1 (en) | 2016-08-17 | 2016-08-17 | Dual substrate sorting apparatus and method |
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| Publication Number | Publication Date |
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| TW201806839A true TW201806839A (en) | 2018-03-01 |
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| KR (1) | KR101849351B1 (en) |
| SG (1) | SG10201705990UA (en) |
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| CN111942883A (en) * | 2020-08-13 | 2020-11-17 | 深圳市恒茂科技有限公司 | Get mechanism of putting not co-altitude PCB product |
| KR20220106900A (en) | 2021-01-22 | 2022-08-01 | 삼성디스플레이 주식회사 | Cassette for loading panel and substrate processign method using the same |
| KR20220108243A (en) | 2021-01-25 | 2022-08-03 | 삼성디스플레이 주식회사 | Manufacturing apparatus of window and manufacturing method of window using the same |
| CN114632705B (en) * | 2022-03-22 | 2024-01-09 | 合肥新创中原信息技术有限公司 | Intelligent logistics cargo automatic sorting device |
| KR102867525B1 (en) * | 2023-06-12 | 2025-10-14 | (주)에스티아이 | Substrate transper apparatus and substrate transper method using the same |
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| KR20180020011A (en) | 2018-02-27 |
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