TW201806699A - Compound chemical mechanical polish dresser comprising a based on which support pillars are provided to carry thereon sharp end grinding particles and flat end grinding particles - Google Patents

Abstract

A compound chemical mechanical polish dresser comprises a base, a plurality of first grinder units, and a plurality of second grinder units. The base comprises first and second receiving troughs. The first and second grinder units respectively comprise first support pillars and second support pillars that are respectively fixed in the first and second receiving troughs, first and second bonding layers provided on the first and second support pillars, and sharp end grinding particles mounted on the first bonding layers and flat end grinding particles mounted on the second bonding layers. The sharp end grinding particles have a height that is greater than the flat end grinding particles. Through integrating the sharp end grinding particles and the flat end grinding particles into one unitary base, the compound chemical mechanical polish dresser possesses both properties of glazing removal and roughening.

Description

Composite chemical mechanical grinding and dressing device

The invention relates to a chemical mechanical polishing dresser, in particular to a composite chemical mechanical polishing dresser having both deglazing and roughening.

During the semiconductor wafer manufacturing process, a chemical mechanical polish (CMP) process is widely used to polish the wafer to flatten the surface of the wafer. A common chemical mechanical polishing process uses a polishing pad (or polishing pad) fixed on a rotary table to contact and apply force to a wafer carried on a spinable carrier. During polishing, the carrier And the rotary table will rotate and provide a polishing slurry to the polishing pad. Generally speaking, due to the movement of pressure and speed (Preston equation), the high point of polishing on the polishing pad will produce high-temperature glazing, and the debris caused by the polishing will accumulate in the holes in the polishing pad, causing it to be difficult to crystallize. The circular grinding effect is reduced. Therefore, a conditioner is required to remove the enamel points and residual debris on the polishing pad.

The Republic of China Invention Patent Publication No. 201532734, filed by the applicant of this case, proposes a high-performance chemical mechanical polishing dresser, which includes a substrate, a bonding layer, and a plurality of abrasive particles. The bonding layer is disposed on the substrate. The abrasive particles are directly fixed on the substrate through the bonding layer. Each abrasive particle is disposed on a metal fixing seat, and the substrate has a plurality of grooves or a plurality of through holes, so that the metal fixing seat The metal particles are contained in the grooves or the through holes, and the metal fixing base is fixed on the substrate by the bonding layer, wherein the abrasive particles are processed through a surface processing to make the abrasive particles have specific properties. The cutting edge angle, crystal structure, tip height, and tip directionality, or the abrasive particles are unprocessed abrasive particles.

See also the Republic of China Invention Patent Publication No. 201143979, which proposes a chemical mechanical polishing pad dresser with a mixed dressing function, which includes a support matrix, a plurality of smooth superabrasive particles, and a plurality of rough superabrasive particles. A particle system is disposed on the support substrate. The plurality of smooth superabrasive particles can be used to cut a large rough portion on a polishing pad. The rough superabrasive particles are disposed on the support substrate. The plurality of rough superabrasive particles can be used in A plurality of abrasive liquid channels are cut out from the plurality of large rough portions, and the plurality of abrasive liquid channels are used to promote the movement of the abrasive liquid throughout the plurality of large rough portions in the chemical mechanical polishing process.

In addition, the Republic of China Invention Patent Application No. 104135197 filed by the applicant of this case proposes a hybrid chemical mechanical polishing dresser including a base, a first polishing unit, and a plurality of second polishing units. The unit is disposed on the base, and includes a first bonding layer fixed on the base, a polishing unit substrate disposed on the first bonding layer, and a polishing layer disposed on the polishing unit substrate. The polishing layer is a diamond coating film formed by a chemical vapor deposition method, and the surface of the diamond coating film has a plurality of polishing tips. The second polishing unit is disposed on the base, and includes a fixed base. A second bonding layer, a bearing column disposed on the second bonding layer, an abrasive particle disposed on the bearing column, and an abrasive bonding layer disposed between the bearing column and the abrasive particle.

In the above prior art, the Republic of China Invention Patent Publication No. 201532734 discloses that these abrasive particles have a specific cutting edge angle, crystal structure, tip height and tip directionality, but the abrasive particles have a single shape, so the Limited functions. The Republic of China Invention Patent Publication No. 201143979 and Application No. 104135197 both disclose a hybrid chemical mechanical polishing dresser with two types of grinding units, but it does not have a more detailed definition of the structure design, so it is difficult to achieve the claimed It has both deglazing and roughening effects. From the above, the structural design of the chemical mechanical polishing dresser still needs to be improved.

The main purpose of the present invention is to solve the problem that the conventional chemical mechanical polishing dresser is difficult to have both deglazing and roughening functions.

To achieve the above object, the present invention provides a composite chemical mechanical polishing dresser for dressing a surface of a polishing pad. The composite chemical mechanical polishing dresser includes a base, a plurality of first polishing units, and a plurality of first polishing units. Two grinding units. The base includes a first receiving groove and a second receiving groove. The first grinding unit includes a first bearing post fixed on the first receiving groove, and a first receiving pole. A first bonding layer on the bearing column and a pointed abrasive particle disposed on the first bonding layer and fixed to the first bearing column through the first bonding layer. The second grinding unit includes a fixing member fixed on the first A second bearing post with two accommodating slots, a second bonding layer disposed on the second bearing post, and a flat head disposed on the second bonding layer and fixed to the second bearing post through the second bonding layer. Abrasive particles, wherein the pointed abrasive particles have a height higher than that of the flat abrasive particles, and the height is a distance from an upper surface of the base to a tip vertex of the pointed abrasive particles.

In an embodiment, the first grinding unit further includes a first bearing post bonding layer disposed between the first receiving groove and the first bearing post, and the first bearing post is bonded through the first bearing post. The layer is fixed in the first receiving groove.

In one embodiment, the composition of the first supporting pillar bonding layer is selected from the group consisting of ceramic material, brazing material, electroplating material, metal material and polymer material.

In an embodiment, the second grinding unit further includes a second bearing post bonding layer disposed between the second receiving groove and the second bearing post, and the second bearing post is combined through the second bearing post. The layer is fixed in the second receiving groove.

In one embodiment, the composition of the second supporting pillar bonding layer is selected from the group consisting of ceramic material, brazing material, electroplating material, metal material, and polymer material.

In one embodiment, the material of the base is selected from the group consisting of stainless steel, metal materials, plastic materials and ceramic materials.

In one embodiment, the material of the first bearing post and the second bearing post is selected from the group consisting of stainless steel, metal material, plastic material and ceramic material.

In one embodiment, the composition of the first bonding layer and the second bonding layer is selected from the group consisting of ceramic materials, brazing materials, electroplating materials, metal materials, and polymer materials.

In one embodiment, the tip vertex of the pointed abrasive particles and a flat top mask of the flat abrasive particles have a height difference between 10 μm and 200 μm.

In an embodiment, the tip vertex of the pointed abrasive particles and a flat top mask of the flat abrasive particles have a height difference between 10 μm and 100 μm.

In one embodiment, the tip vertex of the pointed abrasive particles and a flat top mask of the flat abrasive particles have a height difference between 10 μm and 50 μm.

In one embodiment, the number ratio of the first grinding unit to the second grinding unit is between 1: 4 and 4: 1.

A flat planar top surface of the abrasive particles in a first embodiment, positioned on the base having a range between 10000μm ² to 160000μm ² area.

In one embodiment, the number of the flat head abrasive particles is between 10 and 200.

In one embodiment, the number of the flat head abrasive particles is preferably between 20 and 40.

In one embodiment, the shape of the flat head abrasive particles is a hexahedron or a hexa-octahedron structure.

In one embodiment, the flat head abrasive particles have a negative bevel or a 0 degree angle.

In one embodiment, the negative oblique angle is between 0 degrees and -35 degrees.

Compared with the foregoing prior art, for example, the hybrid polishing pad conditioner disclosed in the Republic of China Invention Patent Publication No. 201143979 and Application No. 104135197, the pointed abrasive particles of the present invention are at a distance from the flat abrasive particles. Poor, and compared to the Republic of China Invention Patent Publication No. 201532734, the present invention is to integrate the pointed grinding particles and the flat grinding particles on a single base. Wherein, the flat head abrasive particles are used to provide the functions of Truing and Deglazing, and the sharp head abrasive particles can provide a roughening effect to create a ridge on the surface of the polishing pad. , On the whole will provide excellent trimming effects.

The detailed description and technical contents of the present invention are described below with reference to the drawings:

Please refer to [Figure 1] and [Figure 2] for the top schematic diagram of one embodiment of the present invention and the side schematic diagram of the AA direction of [Figure 1], as shown in the figure, the present invention is a composite chemical The mechanical grinding dresser includes a base 10, a plurality of first grinding units 20, and a plurality of second grinding units 30. The base 10 includes a first receiving groove 11 and a second receiving groove 12. In one embodiment of the invention, the base 10 is made of stainless steel, metal material, plastic material, ceramic material, or a combination thereof.

The first grinding unit 20 includes a first bearing post 21, a first bonding layer 22, and a sharp-pointed abrasive particle 23. The first bearing post 21 is fixed on the first receiving groove 11. A layer 22 is disposed on the first bearing post 21, and the pointed abrasive particles 23 are disposed on the first joining layer 22 and fixed to the first bearing post 21 through the first joining layer 22. The second grinding unit 30 includes a second bearing post 31, a second bonding layer 32, and a flat-head grinding particle 33. The second bearing post 31 is fixed on the second receiving groove 12. The second bonding layer 32 is disposed on the second bearing column 31, and the flat-head abrasive particles 33 are disposed on the second bonding layer 32 and fixed to the second bearing column 31 through the second bonding layer 32. In this embodiment, the first grinding unit 20 further includes a first load-bearing column bonding layer 24, which is disposed between the first receiving groove 11 and the first load-bearing column 21. The first bearing column 21 is fixed to the first receiving slot 11 through the first bearing column bonding layer 24; the second grinding unit 30 further includes a second bearing column bonding layer 34, and the second bearing column bonding layer 34 It is disposed between the second receiving groove 12 and the second bearing post 31. The second bearing post 31 is fixed to the second receiving groove 12 through the second bearing post bonding layer 34.

In one embodiment of the present invention, the number of the flat-head grinding particles 33 on the base 10 is between 10 and 200. In a preferred embodiment, the flat-head grinding particles 33 are on the base. The number on 10 is between 20 and 40. In this embodiment, the number ratio of the first grinding unit 20 and the second grinding unit 30 on the base 10 is 1: 4 to 4: 1, and they are in a patterned arrangement. The patterned arrangement may be It is a matrix arrangement, a radial arrangement or a honeycomb arrangement. It is further added that "Fig. 1" is for illustrative purposes only, and does not show the actual number of particles and arrangement of the flat grinding particles 33 and the pointed grinding particles 23, which can be adjusted according to actual needs. Limited to the example of "Figure 1".

In an embodiment of the present invention, the material of the first load-bearing post 21 and the second load-bearing post 31 may be stainless steel, metal material, plastic material, ceramic material, or a combination thereof. The material of the first bonding layer 22, the second bonding layer 32, the first bearing pillar bonding layer 24, and the second bearing pillar bonding layer 34 may be a ceramic material, a brazing material, a plating material, a metal material, or a polymer. Materials, wherein the brazing material can be a metal or alloy of iron, cobalt, nickel, chromium, manganese, silicon, aluminum, boron, carbon. In one embodiment, the brazing material can be an alloy of Nicrobraz LM. The composition is 7 wt.% Cr, 3.1 wt.% B, 4.5 wt.% Si, 3.0 wt.% Fe, 0.06 wt% C, and the rest are Ni. The polymer material may be an epoxy resin, a polyester resin, a polyacrylic resin, or a phenolic resin. In the present invention, the base 10, the first load-bearing column 21 and / or the second load-bearing column 31 are preferably made of stainless steel, but the invention is not limited thereto, and the user can arbitrarily change according to requirements. . The first load-bearing pillar bonding layer 24 and the second load-bearing pillar bonding layer 34 are preferably polymer materials, for example, epoxy resin or acrylic resin; the first binding layer 22 and the second binding layer 32 are more suitable. It is preferably a brazing material or a polymer material.

In the present invention, the pointed abrasive particles 23 have a tip vertex 231, the flat abrasive particles 33 have a flat top surface 331, the sharp abrasive particles 23 have a height h higher than the flat abrasive particles 33, h is a distance from an upper surface 101 of the base 10 to the tip vertex 231 of the pointed abrasive particle 23, and the tip vertex 231 and the flat top surface 331 are separated by a height difference d. In one embodiment of the present invention, the flat head of the flat top surface of the abrasive particles having a 33,133 between 10000μm ² 160000μm ² to the area here means the area of the flat head positioned all abrasive particles 10 on the base The surface area of the flat top surface 331 is 33. In one embodiment, the height difference d is between 10 μm and 200 μm. In a preferred embodiment, the height difference d is between 10 μm and 100 μm. In a preferred embodiment, the height is d. The difference d is between 10 μm and 50 μm.

Please continue to refer to "Figure 3" to "Figure 6", which are schematic diagrams of the first aspect, the second aspect, the third aspect, and the fourth aspect of the pointed abrasive particle in an embodiment of the present invention, respectively. The shape of the pointed abrasive particles 23 may be an octahedron, as shown in FIG. 3. However, the pointed abrasive particles 23 of the shape of FIG. 3 are difficult to obtain in practice, so it is easier to obtain them. The sharp-shaped abrasive particles 23 having a shape of hexa-octahedron are as shown in FIG. 4 to FIG. 6, wherein the first aspect, the second aspect, the third aspect, and the fourth aspect are The V (100) / V (111) of the pointed abrasive particles 23 are 1.65, 1.30, 1.155, and 1.00, respectively, and α is 2.85, 2.25, 2.00, and 1.73, respectively. The above is only an example, and the pointed abrasive particles 23 in the present invention should include any abrasive particles having the tip apex 231. Please refer to [FIG. 7] to [FIG. 10] again, which are schematic diagrams of the first aspect, the second aspect, the third aspect, and the fourth aspect of the flat-faced abrasive particle in an embodiment of the present invention. The shape of the flat-faced abrasive particles 33 may be a hexahedron, as shown in FIG. 7. However, the flat-faced abrasive particles 33 in the shape of FIG. 7 are difficult to obtain in practice. The flat-faced abrasive particles 33 of the hexa-octahedron are as shown in FIG. 8 to FIG. 10, wherein the flat-faced abrasive particles of the first aspect, the second aspect, the third aspect, and the fourth aspect are shown in FIG. 8. V (100) / V (111) of 33 is 0.60, 0.70, 0.80, and 0.87, and α is 1.04, 1.21, 1.39, and 1.50, respectively. In this embodiment, the flat-faced abrasive particles 33 in [FIG. 2] are the flat-faced abrasive particles 33 having a shape of hexa-octahedron as shown in [FIG. 8]. The above is just an example. The flat-head abrasive particles 33 referred to in the present invention should include any abrasive particles having the flat top surface 331.

Further, in one embodiment of the present invention, the flat-head grinding particles 33 have a negative oblique angle or a 0 degree angle, wherein the negative oblique angle is between 0 degrees and -35 degrees. Please refer to FIG. 11, which is a schematic diagram showing that the cutting angle is a negative oblique angle according to an embodiment of the present invention. The flat-faced abrasive particles 33 have a cutting surface 332, and the cutting surface 332 is performed on a surface of a polishing pad 40. When trimming, a cutting angle θ is formed. When the cutting angle θ is greater than 90 degrees, it is the negative oblique angle. As shown in "Figure 11", when the cutting angle θ is less than 90 degrees, it is a positive oblique angle. When the cutting angle θ is equal to 90 degrees, it is the 0 degree angle.

In actual operation, the wafer needs to be flattened by the polishing pad 40 in the semiconductor manufacturing process. When the polishing pad 40 is used multiple times, the engraving on the polishing pad 40 will gradually passivate and produce Debris, so the polishing pad 40 needs to be trimmed by a trimmer. When the composite chemical mechanical polishing dresser of the present invention is used, the tip apex 231 of the pointed abrasive particles 23 will contact the surface of the polishing pad 40 to generate a bulge on the surface, and the polishing pad 40 The function of causing roughening; on the other hand, the flat top surface 331 of the flat-faced abrasive particles 33 will remove the unevenness of the polishing pad 40 and cause the function of deglazing the polishing pad 40.

To sum up, the effect of the present invention compared with the prior art is that the sharp-pointed abrasive particles can provide a roughened dressing effect, create bulges on the surface of the polishing pad, and the flat-headed abrasive particles can provide a trimmed and deglazed surface. The dressing function removes debris from the surface of the polishing pad. Therefore, by integrating the sharp-pointed abrasive particles and the flat-shaped abrasive particles on a single base, the composite chemical mechanical polishing dresser has excellent performance. Trimming effect.

The present invention has been described in detail above, but the above is only a preferred embodiment of the present invention, and the scope of implementation of the present invention cannot be limited. That is, all equivalent changes and modifications made in accordance with the scope of the application of the present invention should still fall within the scope of the patent of the present invention.

10‧‧‧ base
101‧‧‧ top surface
11‧‧‧ the first receiving tank
12‧‧‧Second accommodation slot
20‧‧‧ the first grinding unit
21‧‧‧ the first bearing column
22‧‧‧The first combined layer
23‧‧‧ pointed abrasive particles
231‧‧‧ Tip Vertex
24‧‧‧ the first bearing column binding layer
30‧‧‧Second grinding unit
31‧‧‧Second loading column
32‧‧‧ the second combination layer
33‧‧‧ flat head abrasive particles
331‧‧‧ flat top surface
332‧‧‧cut surface
34‧‧‧Second loading column binding layer
40‧‧‧Polishing pad
h‧‧‧ height
d‧‧‧height difference θ‧‧‧cut angle

[Figure 1] is a schematic top view of an embodiment of the present invention. "Figure 2" is a schematic side view in the direction A-A of "Figure 1". [Figure 3] is a schematic diagram of a first aspect of the pointed abrasive particles in an embodiment of the present invention. [Fig. 4] is a schematic diagram of a second aspect of the pointed abrasive particle in an embodiment of the present invention. [Figure 5] is a schematic diagram of a third aspect of the pointed abrasive particle in an embodiment of the present invention. [Fig. 6] is a schematic diagram of a fourth aspect of the pointed abrasive particles in an embodiment of the present invention. [Fig. 7] is a schematic diagram of a first aspect of the flat-head grinding particle in an embodiment of the present invention. [Fig. 8] is a schematic diagram of a second aspect of the flat-head grinding particle in an embodiment of the present invention. [Fig. 9] is a schematic diagram of a third aspect of the flat-head grinding particle in an embodiment of the present invention. [Fig. 10] is a schematic diagram of a fourth aspect of the flat-head grinding particle in an embodiment of the present invention. [Fig. 11] is a schematic diagram showing that the cutting angle is a negative oblique angle in an embodiment of the present invention.

10‧‧‧ base

101‧‧‧ top surface

11‧‧‧ the first receiving tank

12‧‧‧Second accommodation slot

20‧‧‧ the first grinding unit

21‧‧‧ the first bearing column

22‧‧‧The first combined layer

23‧‧‧ pointed abrasive particles

231‧‧‧ Tip Vertex

24‧‧‧ the first bearing column binding layer

30‧‧‧Second grinding unit

31‧‧‧Second loading column

32‧‧‧ the second combination layer

33‧‧‧ flat head abrasive particles

331‧‧‧ flat top surface

34‧‧‧Second loading column binding layer

h‧‧‧ height

d‧‧‧height difference

Claims (18)

A composite chemical mechanical polishing dresser is used for dressing a surface of a polishing pad. The composite chemical mechanical polishing dresser includes: a base including a first receiving groove and a second receiving groove; The first grinding unit includes a first bearing post fixed on the first receiving groove, a first bonding layer provided on the first bearing post, and a first bonding layer provided on the first bonding layer and passing through the first A bonding layer is fixed to the pointed abrasive particles of the first bearing column; and a plurality of second grinding units include a second bearing column fixed to the second receiving groove, and a second bearing column. A second bonding layer disposed on the second bonding layer and fixed to the second load-bearing column through the second bonding layer, wherein the pointed grinding particles have a higher height than the flat grinding particles. The height is a distance from an upper surface of the base to a tip vertex of the pointed abrasive particle. The composite chemical mechanical polishing dresser according to item 1 of the scope of patent application, wherein the first grinding unit further includes a first bearing column bonding layer disposed between the first receiving groove and the first bearing column. The first bearing post is fixed to the first receiving slot through the first bearing post bonding layer. The composite chemical mechanical polishing dresser according to item 2 of the scope of patent application, wherein the composition of the first load-bearing column bonding layer is selected from the group consisting of ceramic materials, brazing materials, electroplating materials, metal materials, and polymer materials Group. The composite chemical mechanical polishing dresser according to item 1 of the patent application scope, wherein the second grinding unit further includes a second bearing column bonding layer disposed between the second receiving groove and the second bearing column. The second bearing post is fixed to the second receiving slot through the second bearing post bonding layer. The composite chemical mechanical polishing dresser according to item 4 of the scope of patent application, wherein the composition of the second bearing column bonding layer is selected from the group consisting of ceramic materials, brazing materials, electroplating materials, metal materials and polymer materials. Group. The composite chemical mechanical polishing and dressing device according to item 1 of the scope of the patent application, wherein the material of the base is selected from the group consisting of stainless steel, metal materials, plastic materials and ceramic materials. The composite chemical mechanical polishing dresser according to item 1 of the scope of patent application, wherein the material of the first load bearing post and the second load bearing post is selected from the group consisting of stainless steel, metal materials, plastic materials and ceramic materials . The composite chemical mechanical polishing dresser according to item 1 of the scope of the patent application, wherein the composition of the first bonding layer and the second bonding layer is selected from ceramic materials, brazing materials, electroplating materials, metal materials and polymers A group of materials. The composite chemical mechanical polishing dresser according to item 1 of the application, wherein the tip vertex of the pointed abrasive particles and a flat top mask of the flat abrasive particles have a height difference between 10 μm and 200 μm. The composite chemical mechanical polishing dresser according to item 1 of the patent application range, wherein the tip vertex of the pointed abrasive particles and a flat top mask of the flat abrasive particles have a height difference between 10 μm and 100 μm. The composite chemical mechanical polishing dresser according to item 1 of the patent application range, wherein the tip vertex of the pointed abrasive particles and a flat top mask of the flat abrasive particles have a height difference between 10 μm and 50 μm. The composite chemical mechanical polishing dresser according to item 1 of the scope of the patent application, wherein the number ratio of the first polishing unit to the second polishing unit is between 1: 4 and 4: 1. The scope of the patent application according to item 1 composite chemical mechanical polishing conditioner, which is located in a flat planar top surface of the head of the abrasive particles on a base having between 10000μm ² to 160000μm ² area. According to the compound chemical mechanical polishing and dressing device described in item 1 of the patent application scope, the number of the flat-headed abrasive particles is between 10 and 200. According to the compound chemical mechanical grinding and dressing device described in item 1 of the patent application scope, the number of the flat-head grinding particles is between 20 and 40. The composite chemical mechanical polishing dresser according to item 1 of the scope of the patent application, wherein the shape of the flat-head abrasive particles is a hexahedron or a hexa-octahedron structure. The composite chemical mechanical polishing dresser according to item 1 of the scope of the patent application, wherein the flat-faced abrasive particles have a negative oblique angle or a 0 degree angle. The composite chemical mechanical polishing dresser according to item 17 of the application, wherein the negative oblique angle is between 0 degrees and -35 degrees.