TW201723506A - Detecting device having a xy[theta]z alignment stage and detecting device having a multi-dimension alignment stage - Google Patents

Abstract

A detecting device having a multi-dimension (xy[theta]z) alignment stage is provided. The alignment stage includes: a platform, having a first base provided with a carrying portion for carrying a PCB, a plane on which the carrying portion locates being defined as a XY plane, a direction perpendicular to the XY plane being defined as a Z direction; a first multi-dimension alignment mechanism, disposed on the platform and correspondingly above the first base, movable in the Z direction and movable parallel to the XY plane; a first detecting module, disposed on the first multi-dimension alignment mechanism, for detecting the PCB carried by the carrying portion.

Description

Detection device with xy θ z alignment mechanism and detection device with multi-dimensional alignment mechanism

The invention relates to a testing machine, in particular to a detecting device with an xy θ z aligning mechanism and a detecting device with a multi-dimensional aligning mechanism.

According to the considerations of miniaturization and volume space, electronic products are moving toward a light and short trend. The circuit board can be densely arranged with a circuit structure, and the three-dimensional wiring can be made according to the shape of the space to reduce the volume of the electronic product. Boards are one of the ways that are often used.

Usually, after the manufacturing of the circuit board, for example, after setting electronic components such as capacitors, inductors, resistors or chips, electrical detection is performed to confirm whether the circuit board can operate normally, so that the detection result is normal. The board is screened out and the board with abnormal detection results is eliminated, which can reduce the chance of misuse of the bad board to ensure the yield of the product.

A conventional test machine, such as that disclosed in TWI 343 481, utilizes four slide bars that slide the test pin plate on the machine table to achieve that the test pin plate can be moved up and down for board testing. Such conventional test needle plates can only be configured to move in the Z-axis direction. However, the circuit structure of a general circuit board is numerous and increasingly small, and some positional deviation may occur during the manufacturing process. Therefore, the test machine having only the Z-axis direction moving capability cannot accurately detect and effectively detect.

Therefore, it is necessary to provide a novel and progressive detection device having an xy θ z alignment mechanism and a detection device having a multi-dimensional alignment mechanism to solve the above problems.

The main object of the present invention is to provide a detecting device with a xy θ z aligning mechanism and a detecting device with a multi-dimensional aligning mechanism, which can realize xy θ z, high degree of freedom, high precision, and fast detection operation.

In order to achieve the above object, the present invention provides a detecting device with an xy θ z aligning mechanism, comprising: a machine base comprising a first pedestal, wherein the first pedestal is provided with a carrying portion for placing a circuit board, The plane of the carrying portion defines an XY plane, and defines a Z-axis direction perpendicular to the XY plane; a first xy θ z aligning mechanism is disposed on the machine and located opposite the first pedestal, along the The Z-axis direction moves and can move parallel to the XY plane; a first detecting module is disposed on the first xy θ z aligning mechanism for detecting a circuit board placed on the carrying portion.

In order to achieve the above object, the present invention further provides a detecting device with a multi-dimensional alignment mechanism, comprising: a machine base comprising a first base, the first base being provided with a carrying portion for placing a circuit board, The plane of the carrying portion defines an XY plane, and defines a Z-axis direction perpendicular to the XY plane; a first multi-dimensional alignment mechanism is disposed on the machine and located opposite the first base, along the Z The axis direction moves and can move parallel to the XY plane; a first detecting module is disposed in the first multi-dimensional alignment mechanism for detecting a circuit board placed on the carrying portion.

1‧‧‧Detecting device with multi-dimensional registration mechanism

10‧‧‧ machine

11‧‧‧First base

12‧‧‧Loading Department

13‧‧‧Second base

20‧‧‧First multidimensional registration agency

21‧‧‧First mobile platform

22‧‧‧The first multidimensional mapping platform

51‧‧‧Second mobile platform

52‧‧‧Second multidimensional registration platform

53‧‧‧Second changing mechanism

60‧‧‧Sending agency

61‧‧‧Feeding device

62‧‧‧Conveyor

621‧‧‧First loading platform

622‧‧‧Second loading platform

221‧‧‧ first platform

222‧‧‧ Second platform

223‧‧‧ Third platform

224‧‧‧fourth platform

23‧‧‧First die change mechanism

231‧‧‧ ‧ frame

232‧‧‧Fixed parts

30‧‧‧First detection module

40‧‧‧Second multidimensional counter mechanism

50‧‧‧Second test module

63‧‧‧First take-up arm

64‧‧‧ Third take-up arm

70‧‧‧Image agency

80‧‧‧ Track

90‧‧‧Second reclaim arm

100‧‧‧ cleaning device

110‧‧‧Receiving agency

111‧‧‧ Third take-up arm

112‧‧‧Place rack

200‧‧‧ boards

1 is a perspective view of a preferred embodiment of the present invention.

Figure 2 is a side elevational view of a preferred embodiment of the present invention.

3 is a schematic diagram of a multi-dimensional alignment mechanism according to a preferred embodiment of the present invention.

The following is a description of the possible embodiments of the present invention, and is not intended to limit the scope of the invention as claimed.

Referring to FIGS. 1 to 3, there is shown a preferred embodiment of the present invention. The detecting device 1 of the multi-dimensional alignment mechanism of the present invention comprises a machine table 10, a first multi-dimensional alignment mechanism 20 and a first detection. Module 30. In the present embodiment, the detecting device 1 having the multi-dimensional alignment mechanism is a detecting device having an xy θ z registration mechanism.

The machine base 10 includes a first base 11 , and the first base 11 is provided with a carrying portion 12 for placing a circuit board 200 . The plane of the carrying portion 12 defines an XY plane and defines a perpendicular to the XY. The Z-axis direction of the plane. The first multi-dimensional alignment mechanism 20 is disposed on the machine table 10 and located above the first base 11 . The first multi-dimensional alignment mechanism 20 is movable along the Z-axis direction and can be parallel to the XY plane. Movement (for example, moving in the direction of θ around the Z-axis direction, moving in the X or / and Y-axis directions). The first detecting module 30 is disposed on the first multi-dimensional alignment mechanism 20 for detecting the circuit board 200 placed on the carrying portion 12. Thereby, the first multi-dimensional alignment mechanism 20 can perform XY θ Z four-axis precise alignment without adjusting the relative positions of the carrying portion 12, the first detecting module 30, the circuit board 200 to be tested, or the like. The detection is convenient and fast.

In detail, the machine 10 further includes a second base 13 spaced apart from the first base 11 . The first multi-dimensional alignment mechanism 20 includes a first base and a second base 11 . a first moving platform 21 between 13 and movable in the Z-axis direction, a first multi-dimensional alignment platform 22 disposed on the first moving platform 21 and movable parallel to the XY plane, and a first The first mold changing mechanism 23 of the first multi-dimensional alignment platform 22 is fixed to the first mold changing mechanism 23. The first multi-dimensional alignment platform 22 includes a first platform 221 disposed on the first mobile platform 21, and a second platform 222 disposed on the first platform 221 so as to be movable along an X-axis direction. a third platform 223 disposed on the second platform 222 along a Y-axis direction, and a fourth platform 224 rotatably disposed on the third platform 223 parallel to the XY plane, the first die-changing The institution is located on the fourth platform 224. In this embodiment, the first multi-dimensional alignment mechanism 20 is a first xy θ z alignment mechanism, and the first multi-dimensional alignment platform 22 is a first xy θ z alignment platform. Of course, the first multi-dimensional alignment mechanism may also be composed of a majority of platforms, a plurality of driving devices (such as servo motors), and most of the sliding rails.

The first die changing mechanism 23 includes at least one frame 231 that receives the first detecting module 30 and at least one fixing member 232 that is adjustably disposed on the at least one frame 231. The at least one fixing member 232 fixes the first portion. A detection module 30. The at least one frame 231 is, for example, a frame member for receiving the first detecting module 30. The at least one fixing member 232 includes, for example, a plurality of screws spliced to the frame member to be screwed to the first detecting module. 30, whereby the first detecting module 30 can be quickly disassembled or replaced according to different detecting objects or programs.

Preferably, the first pedestal 11 is further provided with a second multi-dimensional aligning mechanism 40, and the second multi-dimensional aligning mechanism 40 is a second xy θ z aligning mechanism movable along the Z-axis direction. It can move parallel to the XY plane. A second detecting module 50 is further disposed on the second multi-dimensional alignment mechanism 40, and the first and second detecting modules 30, 50 are configured to detect the circuit board 200 in cooperation with each other. The second multi-dimensional aligning mechanism 40 includes a second moving platform 51 disposed between the first multi-dimensional aligning mechanism 20 and the first pedestal 11 and movable along the Z-axis direction. a second moving platform 51 and a second multi-dimensional alignment platform 52 movable parallel to the XY plane, and a second mold changing mechanism 53 disposed on the second multi-dimensional alignment platform 52, the second detecting mode The set 50 is fixed to the second die change mechanism 53. The second multi-dimensional alignment platform 52 can be the same structure (as in FIG. 3) or a different structure as the first multi-dimensional alignment platform 22.

In this embodiment, the detecting device 1 with a multi-dimensional alignment mechanism further includes a pick-up mechanism 60 and an image capturing mechanism 70. The pick-up mechanism 60 is disposed on the machine table 10 and is configured to feed the circuit board 200 toward The first pedestal 11 is moved, and the image capturing mechanism 70 (such as a CCD image capturing device) is movably disposed on the machine table 10. The picking mechanism 60 feeds the circuit board 200 and moves the circuit board 200 to An image is captured by the image capturing mechanism 70 relative to the position of the image capturing mechanism 70 for subsequent detection operations. The picking mechanism 60 is configured to move the imaged board 200 to the carrying portion 12 for detection by the first detecting module 30 or/and the second detecting module 50. The first detecting module The group 30 or/and the second detection module 50 is, for example, a test needle plate. Specifically, the feeding mechanism 60 includes a feeding device 61 for arranging the at least one circuit board 200, a conveying device 62 movably disposed on the machine table 10, and a device 10 disposed on the machine table 10. The first retracting arm 63 is movable between the feeding device 61 and the conveying device 62. The first retracting arm 63 is supplied from the feeding device 61 to the circuit board 200 and moved to the conveying device 62. The conveying device 62 is configured to move the circuit board 200 to a position relative to the image capturing mechanism 70, and then move the imaged board 200 to the first base 11 after being imaged.

Preferably, the conveying device 62 includes a first loading platform 621 and a second loading platform 622 between the image capturing mechanism 70 and the first loading platform 621. There is a track 80, one end of the track 80 is adjacent to the first loading platform 621, the track The extending range of 80 is greater than and beyond the carrying portion 12, and the two second loading platforms 622 are movable along the rail 80. The two second loading platforms 622 are disposed in parallel and can carry the circuit board 200 in turn to The image capturing mechanism 70 is positioned and positioned relative to the carrier portion 12.

After the second loading arm 90 is sucked to the first loading platform 621, for example, the circuit board 200 is transported by the first loading platform 621 toward the second loading platform 622, and then the first The retracting arm 63 moves from the first loading platform 621, for example, the circuit board 200 to the second loading platform 622. The second loading platform 622 is sequentially moved along the rail 80 to be opposite to the image taking mechanism 70. The image capturing device 70 captures the image of the circuit board 200 and moves to the carrier unit 12 for electrical detection by the first detecting module 30 or/and the second detecting module 50. The first pedestal 11 is moved out of position.

Preferably, a cleaning device 100 coupled to the machine table 10 and for cleaning the circuit board 200 is further disposed on the moving path of the conveying device 62. The cleaning device 100 includes, for example, at least one pair of roller bars, and the roller surface of the at least one pair of roller bars is preferably provided with a layer of adhesive material, for example, or has an air blowing function, so that the circuit board can be used before detection. Foreign matter such as dust, processing debris, other particles, or other substances that may affect the test results may be removed from the surface of the 200 to improve the efficiency, accuracy, and accuracy of test operations such as image inspection.

In addition, at least one receiving mechanism 110 is disposed on one side of the machine table 10, and the at least one receiving mechanism 110 is provided for the printed circuit board 200 after being tested. The receiving mechanism 110 includes a track 80 disposed on the machine table 10, a third retracting arm 111 movably disposed on the track 80, and at least one placement frame 112 disposed on the machine table 10. The third retracting arm 111 is movable between the first pedestal 11 and the at least one placement frame 112. The third retracting arm 111 is supplied from the first pedestal 11 to the detected circuit board 200. Move to one of the shelves 112. Further, The receiving mechanism 110 includes a plurality of placement racks 112 arranged side by side, which can accommodate a plurality of circuit boards 200, or can be divided into different types, or can be separated into good products or defective products, but the receiving mechanism 110 can also only Includes a shelf.

In summary, the first multi-dimensional alignment mechanism of the present invention can perform XY θ Z four-axis precise alignment without adjusting the relative positions of the carrying portion, the first detecting module, the circuit board to be tested, or the like. Multi-dimensional, high-degree-of-freedom, high-precision, and fast inspections are possible.

In summary, the overall structural design, practicability and efficiency of the present invention are indeed fully in line with the needs of industrial development, and the disclosed structural invention is also an unprecedented innovative structure, so it has "novelty" should Undoubtedly, the invention can be more effective than the conventional structure, and therefore has "progressiveness", which fully complies with the requirements of the application requirements of the invention patents of the Chinese Patent Law, and is filed according to law, and please The bureau will review it early and give it affirmation.

1‧‧‧Detecting device with multi-dimensional registration mechanism

10‧‧‧ machine

12‧‧‧Loading Department

60‧‧‧Sending agency

621‧‧‧First loading platform

63‧‧‧First take-up arm

80‧‧‧ Track

90‧‧‧Second reclaim arm

100‧‧‧ cleaning device

110‧‧‧Receiving agency

112‧‧‧Place rack

200‧‧‧ boards

Claims (10)

A detecting device with an xy θ z aligning mechanism, comprising: a machine base, comprising a first pedestal, wherein the first pedestal is provided with a carrying portion for placing a circuit board, wherein the plane of the carrying portion defines an XY a plane, and defining a direction perpendicular to the Z-axis of the XY plane; a first xy θ z alignment mechanism disposed on the machine and located above the first pedestal, movable along the Z-axis and parallelizable Moving in the XY plane; a first detecting module is disposed on the first xy θ z aligning mechanism for detecting a circuit board placed on the carrying portion. The detecting device of the xy θ z aligning mechanism according to claim 1, wherein the machine further comprises a second pedestal spaced from the first pedestal, the first xy θ z aligning mechanism comprises a a first moving platform disposed between the first and second pedestals and movable along the Z-axis direction, a first xy θ z pair disposed on the first moving platform and movable parallel to the XY plane a bit platform, and a first die changing mechanism disposed on the first xy θ z alignment platform, the first detecting module being fixed to the first die changing mechanism. The detecting device with the xy θ z aligning mechanism as claimed in claim 2, wherein the first xy θ z aligning platform comprises a first platform disposed on the first mobile platform, and one movable along an X-axis direction a second platform disposed on the first platform, a third platform disposed on the second platform in a Y-axis direction, and a third platform rotatably disposed parallel to the XY plane In the fourth platform, the first die changing mechanism is disposed on the fourth platform. The detecting device of the xy θ z aligning mechanism according to claim 2, wherein the first die changing mechanism comprises at least one frame receiving the first detecting module and at least one adjustablely disposed on the at least one frame The fixing member of the body, the at least one fixing member fixing the first detecting module. The detecting device of the xy θ z aligning mechanism according to claim 1, wherein a second xy θ z aligning mechanism is further disposed on the first pedestal, and the second xy θ z aligning mechanism is along the Z Moving in the axial direction and moving parallel to the XY plane, wherein a second detecting module is further disposed on the second xy θ z aligning mechanism, and the first and second detecting modules are configured to cooperate with each other to detect the circuit a plate, wherein the second xy θ z alignment mechanism includes a second mobile platform disposed between the first xy θ z alignment mechanism and the first pedestal and movable along the Z-axis direction, a second moving platform and a second xy θ z alignment platform movable parallel to the XY plane, and a second mold changing mechanism disposed on the second xy θ z alignment platform, the second detecting module It is fixed to the second die changing mechanism. The detecting device with the xy θ z aligning mechanism according to claim 1, further comprising a picking mechanism and an image capturing mechanism, wherein the picking mechanism is disposed on the machine and is configured to take the circuit board toward the first The accommodating mechanism is movably disposed on the machine table, wherein the pick-up mechanism feeds a circuit board and moves the circuit board to a position relative to the image taking mechanism to be captured by the image taking mechanism The image capturing mechanism is configured to move the imaged board to the carrying portion for detection by the first detecting module. The detecting device of the xy θ z aligning mechanism according to claim 6, wherein the feeding mechanism comprises a feeding device for arranging the at least one circuit board, and a conveying device movably disposed on the machine And a first retracting arm disposed on the machine and movable between the feeding device and the conveying device, the first retracting arm is provided by the feeding device to take the circuit board and moved to the A transport device for moving the circuit board to a position relative to the image taking mechanism and then moving the imaged board toward the first base. The detecting device with the xy θ z aligning mechanism according to claim 7, wherein a cleaning device coupled to the machine table for cleaning the circuit board is further disposed on the moving path of the conveying device. The detecting device with the xy θ z aligning mechanism according to claim 1, wherein at least one receiving mechanism is disposed on one side of the machine table, and the at least one receiving mechanism is provided for the circuit after the detection a receiving mechanism comprising: a track disposed on the machine, a third retracting arm movably disposed on the track, and at least one placement frame disposed on the machine, the third reclaiming The arm is movable between the first base and the at least one placement frame, and the third retracting arm is supplied from the first base to the detected circuit board and moved to the placement rack. A detecting device with a multi-dimensional alignment mechanism, comprising: a machine base, comprising a first base, the first base is provided with a bearing portion for placing a circuit board, wherein the plane of the bearing portion defines an XY plane, And defining a Z-axis direction perpendicular to the XY plane; a first multi-dimensional alignment mechanism disposed on the machine and located above the first pedestal, movable along the Z-axis direction and parallel to the XY Moving in a plane; a first detecting module is disposed in the first multi-dimensional alignment mechanism for detecting a circuit board placed on the carrying portion.