TW201724227A - Sheet peeling device and peeling method - Google Patents
Sheet peeling device and peeling method Download PDFInfo
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- TW201724227A TW201724227A TW105127278A TW105127278A TW201724227A TW 201724227 A TW201724227 A TW 201724227A TW 105127278 A TW105127278 A TW 105127278A TW 105127278 A TW105127278 A TW 105127278A TW 201724227 A TW201724227 A TW 201724227A
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Abstract
本發明係一種薄片剝離裝置及剝離方法,其中,薄片剝離裝置(10)係具備:將剝離用膠帶(PT)貼附於接著薄片(AS)的貼附手段(20),和於加以貼附於接著薄片(AS)的剝離用膠帶(PT),賦予張力而自被著體(WF),剝離接著薄片(AS)之拉伸手段(30),和規定經由在拉伸手段(30)之接著薄片(AS)的剝離,而被著體(WF)則移動至接著薄片(AS)之剝離方向之移動規定手段(40),和將自被著體(WF)所剝離之接著薄片(AS),按壓於被著體(WF)方向的按壓手段(50);而選擇性地利用移動規定手段(40)與按壓手段(50),剝離1片之接著薄片(AS)。The present invention relates to a sheet peeling apparatus (10) comprising: a attaching means (20) for attaching a peeling tape (PT) to a subsequent sheet (AS), and attaching the sheet In the peeling tape (PT) of the sheet (AS), the stretching means (WF) is applied to the sheet (AS), and the stretching means (30) of the sheet (AS) is peeled off, and the predetermined passage means (30). Then, the sheet (AS) is peeled off, and the body (WF) is moved to the movement regulating means (40) in the peeling direction of the sheet (AS), and the succeeding sheet (AS) which is peeled off from the object (WF). The pressing means (50) pressed in the direction of the object (WF) is selectively pressed by the movement regulating means (40) and the pressing means (50) to peel off one sheet of the sheet (AS).
Description
本發明係有關薄片剝離裝置及剝離方法。 The present invention relates to a sheet peeling device and a peeling method.
以往,知道有藉由剝離用膠帶而剝離加以貼附於被著體之接著薄片的薄片剝離裝置(例如,文獻1:參照日本特開2010-219265號公報,文獻2:參照日本特開2010-103220號公報)。 In the past, a sheet peeling device which is peeled off by a tape for peeling and attached to a sheet to be attached to a subject is known (for example, Document 1: Japanese Patent Laid-Open Publication No. 2010-219265, No. 2: Japanese Patent Application No. 2010-- Bulletin 103220).
但,在如文獻1所記載之以往的薄片剝離裝置中,以板構件進行按壓同時,將接著薄片折返而自被著體剝離之故,接著薄片的剝離開端係容易形成,但有對於被著體之負荷變大之情況。另一方面,在如文獻2所記載之以往的薄片剝離裝置中,將自被著體所剝離之接著薄片,由第1滾軸而按壓於該被著體方向進行剝離之故,對於被著體之負荷係可縮小,但有不易形成接著薄片的剝離開端之情況。 However, in the conventional sheet peeling apparatus described in Document 1, the sheet member is pressed and the sheet is folded back and peeled off from the object, and then the peeling start of the sheet is easily formed, but it is easy to be formed. The situation in which the load on the body becomes larger. On the other hand, in the conventional sheet peeling apparatus described in the document 2, the succeeding sheet peeled from the object is peeled off by the first roller and pressed in the direction of the object, and is placed on the sheet. The load of the body can be reduced, but it is difficult to form the peeling start of the subsequent sheet.
本發明之目的係提供;可確實地剝離接著薄片之薄片 剝離裝置及剝離方法。 The object of the present invention is to provide a sheet which can be peeled off reliably and then Peeling device and peeling method.
為了達成前述目的,本發明之薄片剝離裝置係剝離加以貼附於被著體之接著薄片的薄片剝離裝置,其中,採用具備:將剝離用膠帶貼附於前述接著薄片的貼附手段,和於加以貼附於前述接著薄片的剝離用膠帶,賦與張力而自前述被著體,剝離前述接著薄片之拉伸手段,和規定經由在前述拉伸手段之前設接著薄片的剝離,而前述被著體則移動至前述接著薄片之剝離方向之移動規定手段,和將自前述被著體所剝離之接著薄片,按壓於前述被著體方向的按壓手段;而選擇性地利用前述移動規定手段與前述按壓手段,剝離1片之前述接著薄片的構成。 In order to achieve the above object, the sheet peeling device of the present invention is a sheet peeling device which is peeled off and attached to a sheet of a subject, and is provided with a attaching means for attaching a peeling tape to the succeeding sheet, and The peeling tape attached to the succeeding sheet is stretched, and the stretching means is peeled off from the object, and the stretching means for peeling off the sheet is removed, and the peeling of the sheet is performed before the stretching means. The movement means to move the predetermined means for moving the peeling direction of the sheet, and the pressing means for pressing the succeeding sheet peeled off from the object to be pressed in the direction of the object to be held; and selectively using the movement regulating means and the The pressing means peels off the configuration of the succeeding sheet of one sheet.
此時,在本發明之薄片剝離裝置中,前述移動規定手段係加以利用於僅前述接著薄片之剝離開始側端部的剝離者為佳。 In the sheet peeling device of the present invention, it is preferable that the movement regulating means is used only for the peeling of the end portion of the peeling start side of the sheet.
另外,在本發明之薄片剝離裝置中,前述按壓手段係在由前述移動規定手段之前述剝離開始側端部的剝離後,加以利用於前述接著薄片的剝離者為佳。 Further, in the sheet peeling apparatus of the present invention, it is preferable that the pressing means is used for peeling off the sheet from the peeling start side end portion of the movement regulating means.
另一方面,本發明之薄片剝離方法係剝離加以貼附於被著體之接著薄片的薄片剝離方法,其中,採用具備:將剝離用膠帶貼附於前述接著薄片的貼附工程,和於加以貼附於前述接著薄片的剝離用膠帶,賦與張力而自前述被著體,剝離前述接著薄片之拉伸工程;在前述拉伸工程中,選擇性地進行規定經由前述接著薄片的剝離,而前述被著體則移動至前述接著薄片之剝離方向的移動規定工程,與 將自被著體所剝離之接著薄片,按壓於前述被著體方向之按壓工程,而剝離1片之前述接著薄片的構成。 On the other hand, the sheet peeling method of the present invention is a sheet peeling method which is peeled off and attached to the succeeding sheet of the object, and is provided with an attaching work for attaching the peeling tape to the succeeding sheet, and The peeling tape attached to the succeeding sheet is stretched and stretched from the object to be stretched, and the stretching process of the succeeding sheet is peeled off. In the stretching process, the peeling of the succeeding sheet is selectively performed. The above-mentioned object is moved to the movement regulation process of the peeling direction of the sheet, and The subsequent sheet peeled off from the object is pressed in the pressing direction of the object to be pressed, and the configuration of the sheet of the sheet is peeled off.
如根據如以上的本發明,選擇性地利用(選擇性地進行)移動規定手段(移動規定工程)與按壓手段(按壓工程)而剝離1片之前述接著薄片之故,可確實地剝離接著薄片。 According to the present invention as described above, the movement of the predetermined means (movement regulation) and the pressing means (pressing process) are selectively used (selectively) to peel off one of the subsequent sheets, and the subsequent sheets can be reliably peeled off. .
此時,如將移動規定手段,利用於僅接著薄片之剝離開始側端部的剝離時,成為容易形成接著薄片之剝離開端。 At this time, when the movement predetermined means is used for peeling only at the end portion of the peeling start side of the sheet, the peeling start end of the succeeding sheet is easily formed.
另外,如將按壓手段,在由移動規定手段之剝離開始側端部的剝離後,利用於接著薄片的剝離時,可降地在剝離接著薄片時,賦予至被著體之負荷。 In addition, when the peeling means is peeled off from the peeling start side end portion by the movement regulating means, the peeling force is applied to the object to be placed when peeling off the succeeding sheet.
10‧‧‧薄片剝離裝置 10‧‧‧Sheet stripping device
20‧‧‧貼附手段 20‧‧‧ Attachment means
22‧‧‧推進手段 22‧‧‧Advance means
21A‧‧‧旋轉軸 21A‧‧‧Rotary axis
21B‧‧‧轉動臂 21B‧‧‧Rotating arm
22A‧‧‧轉動馬達 22A‧‧‧Rotary motor
22B‧‧‧推進滾軸 22B‧‧‧Advance roller
23,23C‧‧‧保持手段 23, 23C‧‧‧ means of keeping
24‧‧‧保持補助手段 24‧‧‧Maintenance means
24A‧‧‧直接傳動馬達 24A‧‧‧Direct drive motor
24B‧‧‧輸出軸 24B‧‧‧ Output shaft
25‧‧‧按壓手段 25‧‧‧Measure means
25B‧‧‧滑件 25B‧‧‧Sliding parts
25C‧‧‧按壓頭 25C‧‧‧ Pressing head
25D‧‧‧加熱手段 25D‧‧‧heating means
30‧‧‧拉伸手段 30‧‧‧ stretching means
31‧‧‧移動手段 31‧‧‧Mobile means
31A‧‧‧線性馬達 31A‧‧‧Linear motor
31B‧‧‧滑件 31B‧‧‧Sliding parts
31C‧‧‧支持面 31C‧‧‧Support surface
31D‧‧‧平台 31D‧‧‧ platform
32‧‧‧誘導手段 32‧‧‧Induction means
32A‧‧‧線性馬達 32A‧‧·linear motor
32B‧‧‧滑件 32B‧‧‧Sliding parts
32C‧‧‧誘導滾軸 32C‧‧‧Induction Roller
40‧‧‧移動規定手段 40‧‧‧Mobile regulations
41‧‧‧線性馬達 41‧‧‧Linear motor
41A‧‧‧滑件 41A‧‧‧Sliding parts
43‧‧‧移動規定板 43‧‧‧Mobile Provisioning Board
50‧‧‧按壓手段 50‧‧‧Measure means
51‧‧‧線性馬達 51‧‧‧Linear motor
52‧‧‧轉動馬達 52‧‧‧Rotating motor
53‧‧‧按壓滾軸 53‧‧‧Pressing roller
60‧‧‧夾入手段 60‧‧‧clamping means
61‧‧‧直接傳動馬達 61‧‧‧Direct drive motor
61A‧‧‧輸出軸 61A‧‧‧ Output shaft
62‧‧‧壓輪 62‧‧‧pressure wheel
70‧‧‧切斷手段 70‧‧‧cutting means
71‧‧‧線性馬達 71‧‧‧Linear motor
71A‧‧‧滑件 71A‧‧‧Sliding parts
72‧‧‧切斷刃 72‧‧‧ cutting blade
80‧‧‧折疊手段 80‧‧‧Folding means
81‧‧‧壓著手段 81‧‧‧ pressing means
81A‧‧‧轉動馬達 81A‧‧‧Rotary motor
81B‧‧‧驅動滑輪 81B‧‧‧ drive pulley
81C‧‧‧隨動滑輪 81C‧‧‧Sliding pulley
81D‧‧‧無端帶 81D‧‧‧ Endless belt
81F‧‧‧托架 81F‧‧‧ bracket
81G‧‧‧驅動滑輪 81G‧‧‧ drive pulley
81H‧‧‧隨動滑輪 81H‧‧‧Sliding pulley
82‧‧‧送出手段 82‧‧‧Send means
82A‧‧‧轉動馬達 82A‧‧‧Rotary motor
82B‧‧‧驅動滑輪 82B‧‧‧ drive pulley
82C‧‧‧隨動滑輪 82C‧‧‧Sliding pulley
82D‧‧‧無端帶 82D‧‧‧ Endless belt
90‧‧‧回收手段 90‧‧‧Recycling means
91‧‧‧回收箱 91‧‧‧Recycling bin
92‧‧‧多關節機械手臂 92‧‧‧Multi-joint robot
92A‧‧‧作業臂 92A‧‧‧Working arm
93‧‧‧保持手段 93‧‧‧Retention means
AS‧‧‧接著薄片 AS‧‧‧ followed by thin slices
PT‧‧‧剝離用膠帶 PT‧‧‧ peeling tape
圖1係有關本發明之一實施形態的薄片剝離裝置之側面圖。 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a side view showing a sheet peeling apparatus according to an embodiment of the present invention.
圖2A係薄片剝離裝置之動作說明圖。 Fig. 2A is an explanatory view of the operation of the sheet peeling device.
圖2B係薄片剝離裝置之動作說明圖。 Fig. 2B is an explanatory view of the operation of the sheet peeling device.
圖2C係薄片剝離裝置之動作說明圖。 Fig. 2C is an explanatory view of the operation of the sheet peeling device.
圖2D係薄片剝離裝置之動作說明圖。 Fig. 2D is an explanatory view of the operation of the sheet peeling device.
圖2E係薄片剝離裝置之動作說明圖。 Fig. 2E is an explanatory view of the operation of the sheet peeling device.
圖2F係薄片剝離裝置之動作說明圖。 Fig. 2F is an explanatory view of the operation of the sheet peeling device.
以下,依據圖面而加以說明本發明之一實施形態。 Hereinafter, an embodiment of the present invention will be described based on the drawings.
然而,在本實施形態之X軸,Y軸,Z軸係各自有正交的關係,X軸及Y軸係作為特定平面內的軸,Z軸係作為正交於前述特定平面的軸。更且,在本實施形態中,將自與Y軸平行之圖1中前側方向而視的情況作為基準,而顯示方向的情況,「上」則為Z軸的箭頭方向,而「下」則為其相反方向,「左」則為X軸之箭頭方向,「右」則為其相反方向,「前」則為與Y軸平行之圖1中前側方向,「後」則作為其相反方向。 However, in the present embodiment, the X-axis, the Y-axis, and the Z-axis are orthogonal to each other, the X-axis and the Y-axis are axes in a specific plane, and the Z-axis is an axis orthogonal to the specific plane. Further, in the present embodiment, the case where the direction is displayed from the front side direction in FIG. 1 parallel to the Y-axis is used as the reference, and the "up" is the arrow direction of the Z-axis, and the "down" is the "down". In the opposite direction, "Left" is the direction of the arrow of the X-axis, "Right" is the opposite direction, "Front" is the front direction of Figure 1 parallel to the Y-axis, and "Rear" is the opposite direction.
在圖1中,薄片剝離裝置10係剝離加以貼附於作為被著體之半導體晶圓(以下,有單稱作「晶圓」之情況)WF之接著薄片AS的裝置,係成為具備:將剝離用膠帶PT貼附於接著薄片AS之貼附手段20,和賦予張力於貼附在接著薄片AS之剝離用膠帶PT,而自晶圓WF剝離接著薄片AS之拉伸手段30,和規定經由以拉伸手段30之接著薄片AS的剝離而晶圓WF移動至接著薄片AS之剝離方向的移動規定手段40,和將自晶圓WF所剝離之接著薄片AS,按壓於晶圓WF方向之按壓手段50,和由按壓手段50而夾入剝離用膠帶PT之夾入手段60,和切斷剝離用膠帶PT之切斷手段70;選擇性地利用移動規定手段40與按壓手段50,而剝離1片之接著薄片AS的構成。 In FIG. 1, the sheet peeling apparatus 10 is detached and attached to the subsequent sheet AS as a semiconductor wafer (hereinafter referred to as "wafer") WF, and is provided with The peeling tape PT is attached to the attaching means 20 of the succeeding sheet AS, and the stretching means 30 for applying the tension to the peeling tape PT attached to the succeeding sheet AS, and peeling off the sheet AS from the wafer WF, and prescribed The movement regulating means 40 for moving the wafer WF to the peeling direction of the sheet AS by the peeling of the sheet AS of the stretching means 30, and the pressing sheet AS peeled from the wafer WF are pressed against the wafer WF direction. The means 50, the cutting means 60 for inserting the peeling tape PT by the pressing means 50, and the cutting means 70 for cutting the peeling tape PT; and selectively using the movement regulating means 40 and the pressing means 50, peeling off 1 The composition of the sheet following the sheet AS.
貼附手段20係具備:可旋轉地支持所捲回之剝離用膠帶PT的膠帶支持手段21,和由該膠帶支持手段21而 夾入支持於膠帶支持手段21之剝離用膠帶PT,賦予推進力至該剝離用膠帶PT之推進手段22,和保持剝離用膠帶PT之導引端部之保持手段23,和補助保持手段23所保持剝離用膠帶PT之情況之保持補助手段24,和將由保持手段23所保持之剝離用膠帶PT,按壓於接著薄片AS而貼附之按壓手段25。 The attaching means 20 includes a tape supporting means 21 that rotatably supports the peeling tape PT that is wound back, and the tape supporting means 21 The peeling tape PT supported by the tape supporting means 21 is interposed, the pushing means 22 for supplying the pushing force to the peeling tape PT, and the holding means 23 for holding the leading end portion of the peeling tape PT, and the auxiliary holding means 23 are provided. The holding aid 24 for holding the peeling tape PT and the peeling tape PT held by the holding means 23 are pressed against the pressing means 25 attached to the sheet AS.
膠帶支持手段21係具備:加以支持於可轉動旋轉軸21A於中心之轉動臂21B的自由端側,支持所捲回之剝離用膠帶PT的支持滾輪21C,和作為將轉動臂21B賦能於推進手段22方向之賦能手段的彈簧21D。 The tape supporting means 21 is provided with a support roller 21C that supports the peeling tape PT that is wound back on the free end side of the pivoting arm 21B at the center of the rotatable rotating shaft 21A, and that is capable of energizing the turning arm 21B. The spring 21D of the energizing means in the direction of the means 22.
推進手段22係具備:經由作為驅動機器之轉動馬達22A而驅動之推進滾軸22B。 The propulsion means 22 includes a propulsion roller 22B that is driven via a rotation motor 22A as a drive machine.
保持手段23係具備:加以收容於由作為驅動機器的直接傳動馬達23A之輸出軸23B所支持之收容手段23C內,藉由形成於收容手段23C底面之吸附面23D的吸引孔23E,而吸附保持剝離用膠帶PT之減壓幫浦或真空抽氣機等之吸引手段23F。 The holding means 23 is provided in a housing means 23C supported by the output shaft 23B of the direct drive motor 23A as a driving device, and is held by the suction hole 23E formed in the adsorption surface 23D on the bottom surface of the housing means 23C. A suction means 23F such as a decompression pump or a vacuum aspirator of the tape PT is peeled off.
保持補助手段24係具備:由作為驅動機器的直接傳動馬達24A之輸出軸24B所支持,使剝離用膠帶PT接合於吸附面23D的補助滾軸24C。 The holding assisting means 24 is provided with an auxiliary roller 24C that is supported by the output shaft 24B of the direct drive motor 24A as a drive device, and the peeling tape PT is joined to the suction surface 23D.
按壓手段25係具備:由作為收容於收容手段23C內之驅動機器的線性馬達25A之滑件25B所支持,可自收容手段23C之底面突沒地加以設置之按壓頭25C,和線圈加熱器或熱導管之加熱側的加熱手段25D。 The pressing means 25 includes a pressing head 25C supported by a slider 25B of a linear motor 25A as a driving device housed in the housing means 23C, and a pressing head 25C which is provided from the bottom surface of the housing means 23C, and a coil heater or Heating means 25D on the heating side of the heat pipe.
拉伸手段30係具備:使剝離用膠帶PT與晶圓WF相對移動之移動手段31,和使用於接著薄片AS之剝離的剝離用膠帶PT則呈位置於切斷手段70之附近地,進行誘導之誘導手段32。 The stretching means 30 includes a moving means 31 for relatively moving the peeling tape PT and the wafer WF, and a peeling tape PT for peeling off the sheet AS is positioned in the vicinity of the cutting means 70 to induce Induction means 32.
移動手段31係具備:由作為驅動機器之線性馬達31A之滑件31B所支持,經由減壓幫浦或真空抽氣機等之未圖示的減壓手段,而具有可吸附保持晶圓WF之支持面31C的平台31D。 The moving means 31 is provided by a slider 31B which is a linear motor 31A as a driving device, and has a decompression means (not shown) such as a decompression pump or a vacuum aspirator, and has a susceptibility to hold the wafer WF. The platform 31D of the surface 31C is supported.
誘導手段32係具備:具備由作為驅動機器之線性馬達32A之滑件32B所支持之誘導滾軸32C。 The induction means 32 includes an induction roller 32C supported by a slider 32B of a linear motor 32A as a drive device.
移動規定手段40係成為具備:由作為驅動機器之線性馬達41之滑件41A所支持,作為驅動機器之轉動馬達42,和由轉動馬達42之輸出軸42A所支持之移動規定板43,而加以利用於僅接著薄片AS之剝離開始側端部的剝離之構成。 The movement regulation means 40 includes a rotation motor 42 as a drive machine supported by a slider 41A as a drive motor linear motor 41, and a movement regulation plate 43 supported by an output shaft 42A of the rotation motor 42. It is used for the peeling of the edge part of the peeling start side of the sheet AS only.
按壓手段50係成為具備:由作為驅動機器之線性馬達51之滑件51A所支持,作為驅動機器之轉動馬達52,和由轉動馬達52之未圖示的輸出軸所支持之按壓滾軸53,而在由移動規定手段40之剝離開始側端部的剝離後,加以利用於接著薄片AS之剝離的構成。 The pressing means 50 is provided with a rotating motor 52 as a driving device supported by a slider 51A of a linear motor 51 as a driving device, and a pressing roller 53 supported by an output shaft (not shown) of the turning motor 52, On the other hand, after the peeling start side end portion of the movement regulating means 40 is peeled off, it is used for the peeling of the sheet AS.
夾入手段60係具備:由作為驅動機器的直接傳動馬達61之輸出軸61A所支持,由按壓滾軸53而夾入剝離用膠帶PT或接著薄片AS之壓輪62。 The sandwiching means 60 is provided by the output shaft 61A of the direct drive motor 61 as a drive device, and the pressure roller 62 is sandwiched between the peeling tape PT and the sheet AS by the pressing roller 53.
切斷手段70係具備:由作為收容於收容手段23C內 之驅動機器的線性馬達71之滑件71A所支持,可自收容手段23C之底面突沒地加以設置之切斷刃72。 The cutting means 70 is provided to be housed in the storage means 23C. The cutting blade 72 is provided by the slider 71A of the linear motor 71 of the driving machine, and the cutting blade 72 is provided to be protruded from the bottom surface of the housing means 23C.
在以上的薄片剝離裝置10中,說明剝離加以貼附於晶圓WF之接著薄片AS的步驟。 In the above-described sheet peeling device 10, the step of peeling and attaching to the succeeding sheet AS of the wafer WF will be described.
首先,作業者則將剝離用膠帶PT,如以圖1中實線所示地放置之後,各構件則對於在初期位置進行待機之圖1中實線所示之薄片剝離裝置10而言,藉由未圖示之操作面板或個人電腦等之輸入手段而輸入自動運轉開始的信號。如此,貼附手段20則驅動吸引手段23F,在吸附面23D,吸附保持剝離用膠帶PT。並且,經由人手或多關節機器手臂或皮帶輸送機等之未圖示的搬送手段,以接著薄片AS成為上方之狀態,將晶圓WF加以載置於支持面31C上時,拉伸手段30則驅動未圖示之減壓手段,開始晶圓WF之吸附保持。之後,拉伸手段30則驅動線性馬達31A,使平台31D移動至左方向,如以圖1中二點鎖鏈線所示地,使接著薄片AS之左端部位置於按壓頭25C正下方。 First, the operator puts the peeling tape PT, and after placing it as shown by the solid line in Fig. 1, each member is borrowed from the sheet peeling device 10 shown by the solid line in Fig. 1 which stands by at the initial position. A signal for starting the automatic operation is input by an operation means such as an operation panel or a personal computer (not shown). In this manner, the attaching means 20 drives the suction means 23F to adsorb and hold the peeling tape PT on the adsorption surface 23D. Further, when the wafer WF is placed on the support surface 31C in a state where the sheet AS is placed upward by a conveyance means (not shown) such as a human hand or a multi-joint robot arm or a belt conveyor, the stretching means 30 The decompression means (not shown) is driven to start the adsorption holding of the wafer WF. Thereafter, the stretching means 30 drives the linear motor 31A to move the stage 31D to the left direction. As shown by the two-point chain line in Fig. 1, the left end portion of the succeeding sheet AS is placed directly below the pressing head 25C.
接著,貼附手段20則驅動直接傳動馬達24A,如以圖1中二點鎖鏈線所示地,使補助滾軸24C,自收容手段23C的下方退避之後,驅動轉動馬達22A及直接傳動馬達23A,推進剝離用膠帶PT同時,使收容手段23C下降至接著薄片AS之正上方特定位置。之後,貼附手段20則驅動線性馬達25A,如圖2A所示,使按壓頭25C下降,將剝離用膠帶PT按壓貼附於接著薄片AS之左端部。此 時,貼附手段20則驅動加熱手段25D,加熱剝離用膠帶PT亦可。對於接著薄片AS之剝離用膠帶PT的貼附結束時,貼附手段20則停止吸引手段23F的驅動之同時,驅動線性馬達25A及直接傳動馬達23A,使按壓頭25C及收容手段23C回歸至初期位置。 Next, the attaching means 20 drives the direct drive motor 24A, and the auxiliary roller 24C is driven away from the lower side of the receiving means 23C as shown by the two-point chain line in Fig. 1, and the rotary motor 22A and the direct drive motor 23A are driven. At the same time as the peeling tape PT is advanced, the receiving means 23C is lowered to a specific position immediately above the sheet AS. Thereafter, the attaching means 20 drives the linear motor 25A, and as shown in FIG. 2A, the pressing head 25C is lowered, and the peeling tape PT is pressed and attached to the left end portion of the succeeding sheet AS. this In this case, the attaching means 20 drives the heating means 25D and heats the peeling tape PT. When the attachment of the peeling tape PT to the sheet AS is completed, the attaching means 20 stops the driving of the suction means 23F, drives the linear motor 25A and the direct drive motor 23A, and returns the pressing head 25C and the housing means 23C to the initial stage. position.
之後,夾入手段60則驅動直接傳動馬達61,由壓輪62與按壓滾軸53,以特定的按壓力而夾入剝離用膠帶PT之後,拉伸手段30則驅動線性馬達31A,使接著薄片AS之左端部,位置於按壓滾軸53之最下部的正下方。接著,移動規定手段40則驅動線性馬達41及轉動馬達42,如圖2B所示,藉由剝離用膠帶PT而在移動規定板43之左端部,按壓接著薄片AS的左端部。接著,拉伸手段30及按壓手段50則驅動線性馬達31A及轉動馬達52,使平台31D移動於左方向的同時,使按壓滾軸53旋轉於逆時鐘旋轉方向。經由此,接著薄片AS係如以圖2B中二點鎖鏈線所示,加以維持在移動規定板43的左端部加以折返的姿勢同時,自晶圓WF加以剝離。然而,接著薄片AS之剝離中係拉伸手段30則驅動線性馬達32A,於經由壓輪62及按壓滾軸53所推進之剝離用膠帶PT或接著薄片AS,使誘導滾軸32C接觸,賦予特定的張力於此等,而該剝離用膠帶PT或接著薄片AS則呈成為2折疊地進行誘導(之後亦為相同)。 Thereafter, the sandwiching means 60 drives the direct drive motor 61, and after the pressure roller 62 and the pressing roller 53, sandwich the peeling tape PT with a specific pressing force, the stretching means 30 drives the linear motor 31A to follow the sheet. The left end of the AS is located directly below the lowermost portion of the pressing roller 53. Next, the movement regulation means 40 drives the linear motor 41 and the rotation motor 42, and as shown in FIG. 2B, the left end portion of the subsequent sheet AS is pressed by the peeling tape PT at the left end portion of the movement regulation plate 43. Next, the stretching means 30 and the pressing means 50 drive the linear motor 31A and the turning motor 52 to move the pressing plate 53 in the counterclockwise direction while moving the stage 31D in the left direction. As a result, the sheet AS is peeled off from the wafer WF while maintaining the posture of the left end portion of the movement regulating plate 43 and folding back as shown by the two-point chain line in FIG. 2B. However, the peeling medium stretching means 30 of the sheet AS drives the linear motor 32A to bring the induction roller 32C into contact with the peeling tape PT or the sheet AS which is pushed by the pressure roller 62 and the pressing roller 53, giving the specific roller 32C a specific The tension is such that the peeling tape PT or the subsequent sheet AS is induced to be folded in two folds (the same is true thereafter).
並且,自晶圓WF之左端部,加以剝離特定長度之接著薄片AS之情況,當由未圖示之光學感測器或攝影手段 等之檢測手段所檢測時,拉伸手段30及按壓手段50則停止線性馬達31A、32A及轉動馬達52的驅動。接著,移動規定手段40則驅動線性馬達41及轉動馬達42,使移動規定板43回歸於初期位置之後,按壓手段50則驅動線性馬達51,如圖2C所示,在按壓滾軸53的最下部,按壓接著薄片AS之彎曲部。然而,按壓滾軸53之移動後,亦由經由壓輪62與按壓滾軸53之剝離用膠帶PT或接著薄片AS的特定之按壓力,加以持續進行夾入。 Further, when the left end portion of the wafer WF is peeled off, the sheet AS of a specific length is peeled off, by an optical sensor or a photographing means not shown. When the detection means is detected, the stretching means 30 and the pressing means 50 stop the driving of the linear motors 31A, 32A and the turning motor 52. Next, the movement regulation means 40 drives the linear motor 41 and the rotation motor 42 to return the movement regulation plate 43 to the initial position, and the pressing means 50 drives the linear motor 51, as shown in Fig. 2C, at the lowermost portion of the pressing roller 53. Pressing the curved portion of the sheet AS. However, after the movement of the pressing roller 53, the pressing force of the peeling tape PT or the subsequent sheet AS via the pressure roller 62 and the pressing roller 53 is continuously sandwiched.
接著,拉伸手段30及按壓手段50則驅動線性馬達31A,32A及轉動馬達52,使平台31D移動於左方向的同時,使按壓滾軸53旋轉於逆時鐘旋轉方向。經由此,接著薄片AS係如圖2D所示,加以持續在按壓滾軸53之最下部加以按壓其彎曲部的姿勢同時,自晶圓WF加以剝離。經由如此之構成,亦可規定經由在拉伸手段30之接著薄片AS的剝離,而晶圓WF移動至接著薄片AS之剝離方向者。並且,如圖2E所示,當接著薄片AS之剝離結束時,拉伸手段30及按壓手段50則停止線性馬達31A,32A,未圖示之減壓手段及轉動馬達52之驅動。 Next, the stretching means 30 and the pressing means 50 drive the linear motors 31A, 32A and the turning motor 52 to move the pressing plate 53 in the counterclockwise direction while moving the stage 31D in the left direction. As a result, the sheet AS is continuously peeled off from the wafer WF while continuing to press the bent portion at the lowermost portion of the pressing roller 53 as shown in FIG. 2D. According to such a configuration, it is also possible to restrict the peeling of the succeeding sheet AS by the stretching means 30, and the wafer WF is moved to the peeling direction of the sheet AS. Then, as shown in FIG. 2E, when the peeling of the sheet AS is completed, the stretching means 30 and the pressing means 50 stop the linear motors 31A, 32A, the driving means (not shown) and the driving of the turning motor 52.
接著,貼附手段20則驅動直接傳動馬達24A及吸引手段23F,如圖2F所示,使補助滾軸24C回歸至初期位置,在吸附面23D,吸附保持剝離用膠帶PT。之後,切斷手段70則驅動線性馬達71,使切斷刃72下降而切斷剝離用膠帶PT,再由人手或未圖示之移送手段,回收接著薄片AS。然而,交疊於剝離用膠帶PT之切斷動作,而 由人手或未圖示之搬送手段,將平台31D上之晶圓WF,搬送至接下來的工程之後,拉伸手段30則驅動線性馬達31A,使平台31D回歸於初期位置。並且,拉伸手段30,按壓手段50及夾入手段60則驅動線性馬達32A,51及直接傳動馬達61,使誘導滾軸32C,按壓滾軸53及壓輪62回歸至初期位置,之後反覆同樣的動作。 Next, the attaching means 20 drives the direct drive motor 24A and the suction means 23F, and as shown in FIG. 2F, the auxiliary roller 24C is returned to the initial position, and the peeling tape PT is adsorbed and held on the adsorption surface 23D. Thereafter, the cutting means 70 drives the linear motor 71, lowers the cutting edge 72, cuts the peeling tape PT, and collects the succeeding sheet AS by a hand or a transfer means (not shown). However, it overlaps with the cutting action of the peeling tape PT, and After the wafer WF on the stage 31D is transported to the next project by a hand or a transport means (not shown), the stretching means 30 drives the linear motor 31A to return the stage 31D to the initial position. Further, the stretching means 30, the pressing means 50, and the sandwiching means 60 drive the linear motors 32A, 51 and the direct drive motor 61 to return the induction roller 32C, the pressing roller 53 and the pressing wheel 62 to the initial position, and then repeat the same. Actions.
如根據如以上的實施形態,對於在自晶圓WF剝離接著薄片AS時,選擇性地利用移動規定手段40與按壓手段50而剝離1片之前述接著薄片之故,可確實地剝離接著薄片AS。 According to the above-described embodiment, when the sheet AS is peeled off from the wafer WF, the sheet is peeled off by the movement regulating means 40 and the pressing means 50, and the sheet is reliably peeled off. .
如以上,為了實施本發明之最佳構成,方法等係在前述記載加以揭示,但本發明係不限定於此等者。即,本發明係主要關於特定之實施形態特別加以圖示,且加以說明,但在未自本發明之技術思想及目的的範圍脫離者,而對於以上所述之實施形態而言,在形狀,材質,數量,其他的詳細構成中,該業者可加上種種變形者。另外,限定上述揭示之形狀,材質等之記載係為了將本發明之理解作為容易而例示性地加以記載者,因並非限定本發明之故,在除了此等形狀,材質等之限定的一部分或全部的限定之構件的名稱之記載係包含於本發明。 As described above, in order to carry out the best configuration of the present invention, methods and the like are disclosed in the above description, but the present invention is not limited thereto. That is, the present invention has been specifically described with respect to specific embodiments, but is not departing from the scope of the technical idea and object of the present invention, and in the above-described embodiments, in the shape, In terms of material, quantity, and other detailed composition, the manufacturer can add various deformers. In addition, the description of the shapes, materials, and the like described above is intended to be illustratively described in order to facilitate the understanding of the present invention, and is not limited to the present invention, and a part of the shape or the like is limited. The description of the names of all the defined members is included in the present invention.
例如,由使推進手段22,作為變更剝離用膠帶PT之切斷位置的切斷位置變更手段而發揮機能,使推進滾軸22B旋轉者,以支持滾軸21C卷繞剝離用膠帶PT,再經由切斷手段70而將剝離用膠帶PT與接著薄片AS之雙 方,或僅接著薄片AS進行切斷亦可,此情況,切斷位置變更手段係取代或併用推進手段22,而採用以機械夾盤或夾持筒等之夾持手段,庫倫力,接著劑,黏著劑,磁力,白努利吸附等而保持剝離用膠帶PT,拉伸於卷繞方向之構成亦可。 For example, the propulsion means 22 functions as a cutting position changing means for changing the cutting position of the peeling tape PT, and the push roller 22B is rotated, and the peeling tape PT is wound around the supporting roller 21C. The cutting means 70 and the pair of peeling tape PT and the succeeding sheet AS Alternatively, the sheet AS may be cut only by the sheet AS. In this case, the cutting position changing means replaces or uses the advancing means 22, and uses a clamping means such as a mechanical chuck or a holding cylinder, Coulomb force, an adhesive. The adhesive tape, the magnetic force, the white nucleus adsorption, etc., may be held by the peeling tape PT and stretched in the winding direction.
貼附手段20係為按壓貼附枚葉的剝離用膠帶於接著薄片AS之構成亦可。 The attaching means 20 is a structure in which the peeling tape for attaching the leaves is pressed to the subsequent sheet AS.
膠帶支持手段21係未加以賦能於推進手段22方向而支持剝離用膠帶PT亦可,此情況,推進手段22係如採用由轉動馬達22A而夾入剝離用膠帶PT之壓輪等即可。 In the case where the tape supporting means 21 is not provided in the direction of the advancing means 22, the peeling tape PT may be supported. In this case, the pushing means 22 may be a pressure roller or the like in which the peeling tape PT is sandwiched by the turning motor 22A.
保持手段23係可取代或併用吸引手段23F,而採用以機械夾盤或夾持筒等之夾持手段,庫倫力,接著劑,黏著劑,磁力,白努利吸附等而保持剝離用膠帶PT之構成。 The holding means 23 can be used instead of or in combination with the suction means 23F, and the peeling tape PT can be held by a clamping means such as a mechanical chuck or a holding cylinder, a Coulomb force, an adhesive, an adhesive, a magnetic force, and a white Nuori adsorption. The composition.
保持補助手段24係可取代或併用補助滾軸24C,而採用以棒狀構件,板狀構件,氣體之噴射而將剝離用膠帶PT接觸於吸附面23D之構成。 In the holding assisting means 24, the reinforcing roller 24C can be used instead of or in combination with the auxiliary roller 24C, and the peeling tape PT is brought into contact with the adsorption surface 23D by a rod-shaped member, a plate-shaped member, and a gas jet.
保持補助手段24係如可僅由保持手段23而保持接著薄片AS剝離後之剝離用膠帶PT,而未有亦可。 The holding aid 24 can hold the peeling tape PT after the sheet AS is peeled off only by the holding means 23, but it is not possible.
按壓手段25係可取代或併用按壓頭25C,而採用板材,橡膠,樹脂,泡棉,經由氣體的噴射等之按壓構件,而剝離用膠帶PT則為感壓接著性的接著薄片情況,加熱手段25D係可有可無。 The pressing means 25 can be used instead of or in combination with the pressing head 25C, and a pressing member such as a plate, a rubber, a resin, or a foam, or the like can be used, and the peeling tape PT is a pressure-sensitive adhesive sheet. The 25D system is optional.
按壓手段25及切斷手段70之至少一方係未加以收容 於收容手段23C,而以未圖示之托架而加以支持線性馬達25A、71亦可。 At least one of the pressing means 25 and the cutting means 70 is not accommodated In the housing means 23C, the linear motors 25A and 71 may be supported by a bracket (not shown).
賦能手段係亦可取代或併用彈簧21D,而採用橡膠或樹脂等。 The energizing means can also replace or use the spring 21D instead of rubber or resin.
拉伸手段30係作為僅由推進手段22之驅動而剝離接著薄片AS,以及僅由轉動馬達52之驅動而剝離接著薄片AS均可。 The stretching means 30 is peeled off by the driving means 22, and the sheet AS is peeled off, and the sheet AS is peeled off only by the driving of the turning motor 52.
拉伸手段30係固定平台31D,使貼附手段20,拉伸手段30,移動規定手段40,按壓手段50及夾入手段60等移動亦可,而亦可使此等各手段與平台31D移動。 The stretching means 30 is a fixed platform 31D, and the attachment means 20, the stretching means 30, the movement regulating means 40, the pressing means 50, the sandwiching means 60, and the like may be moved, and the means and the platform 31D may be moved. .
移動手段31係亦可為以機械夾盤或夾持筒等之夾持手段,庫倫力,接著劑,黏著劑,磁力,白努利吸附等而支持被著體之構成。 The moving means 31 may be configured to support the object by a clamping means such as a mechanical chuck or a holding cylinder, a Coulomb force, an adhesive, an adhesive, a magnetic force, and a Canulin suction.
誘導手段32係接著面之相反側的面彼此則呈成為作為對向之2折疊地,誘導接著薄片AS亦可,或無亦可。 The inducing means 32 is such that the surfaces on the opposite sides of the adjoining surface are folded in the opposite direction, and the subsequent sheet AS may be induced or not.
誘導手段32係亦可取代或併用誘導滾軸32C,而採用棒狀構件或板狀構件等,而以氣體之噴射等而接著薄片AS則呈成為2折疊地進行誘導亦可。 The inducing means 32 may be replaced by or in combination with the inducing roller 32C, and may be induced by a gas jet or the like and then the sheet AS may be formed into a two-folded shape by a gas jet or the like.
移動規定手段40係亦可取代或併用移動規定板43,而以滾軸構件或氣體的噴射等,規定晶圓WF的移動。 The movement regulation means 40 can also regulate the movement of the wafer WF by the movement of the roller member or the gas, instead of or in combination with the movement of the predetermined plate 43.
移動規定手段40係在由移動規定板43而剝離接著薄片AS左端側之後,未使移動規定板43回歸至初期位置,而經由平台31D之移動及按壓滾軸53的旋轉,使接著薄片AS之剝離結束亦可,此情況,在該左端部之剝離 前或剝離後,或者剝離前後,按壓滾軸53則按壓接著薄片AS亦可,以及在剝離前後未按壓亦可。 After the movement regulation plate 40 is peeled off from the left end side of the sheet AS by the movement regulation plate 43, the movement regulation plate 43 is not returned to the initial position, and the movement of the table 31D and the rotation of the pressing roller 53 are caused to cause the subsequent sheet AS. The peeling is also possible. In this case, peeling at the left end Before or after peeling, or before and after peeling, the pressing roller 53 may press the sheet AS or may not be pressed before and after peeling.
移動規定手段40係亦可在剝離接著薄片AS之左端部(剝離開始側端部),中間部,右端部(剝離終了側端部)等任何位置,按壓該剝離接著薄片AS。 The movement regulating means 40 may press the peeling and succeeding sheet AS at any position such as the left end portion (the peeling start side end portion), the intermediate portion, and the right end portion (the peeling end side end portion) of the peeling sheet AS.
按壓手段50係亦可取代或併用按壓滾軸53,而以板狀構件或氣體的噴射等而將接著薄片AS,按壓於晶圓WF方向。 The pressing means 50 may press the roller 53 instead of or in combination with the pressing roller 53, and press the sheet AS in the direction of the wafer WF by spraying of a plate member or a gas.
按壓手段50係在接著薄片AS左端部的剝離前,以按壓滾軸53而按壓該左端部,經由平台31D之移動及按壓滾軸53之旋轉,剝離接著薄片AS全體亦可,此情況,在接著薄片AS左端部的剝離前或剝離後,移動規定板43則按壓接著薄片AS亦可,以及在剝離前後,移動規定板43則未按壓接著薄片亦可。 The pressing means 50 presses the left end portion by pressing the roller 53 before the peeling of the left end portion of the sheet AS, and the sheet 31D is moved and the rotation of the pressing roller 53 is rotated to peel off the entire sheet AS. Next, before or after peeling of the left end portion of the sheet AS, the movement of the predetermined plate 43 may be performed by pressing the sheet AS, and before and after peeling, the sheet 13 may be moved without pressing the sheet.
按壓手段50則由按壓滾軸53而剝離接著薄片AS之左端部之後,使該按壓滾軸53回歸至初期位置之同時,移動規定手段40則由移動規定板43而按壓接著薄片AS,再經由平台31D之移動及按壓滾軸53之旋轉而使接著薄片AS之剝離結束亦可。 When the pressing means 53 peels off the left end portion of the sheet AS by pressing the roller 53, the pressing roller 53 is returned to the initial position, and the movement regulating means 40 is pressed by the movement regulating plate 43 to press the sheet AS, and then The movement of the stage 31D and the rotation of the pressing roller 53 may complete the peeling of the succeeding sheet AS.
按壓手段50係亦可在接著薄片AS之左端部,中間部,右端部等任何位置,按壓該接著薄片AS。 The pressing means 50 can also press the subsequent sheet AS at any position such as the left end portion, the intermediate portion, and the right end portion of the sheet AS.
按壓手段50係亦可將接觸自晶圓WF所剝離之接著薄片AS,呈接觸於加以貼附於晶圓WF之接著薄片AS地按壓,而呈未接觸地按壓亦可。 The pressing means 50 may press the subsequent sheet AS that has been peeled off from the wafer WF to be pressed in contact with the subsequent sheet AS attached to the wafer WF, and may be pressed in a non-contact manner.
按壓手段50係亦可在按壓滾軸53之最下部以外的位置而按壓接著薄片AS之彎曲部,而如可以按壓滾軸53,按壓接著薄片AS之彎曲部之情況下,均可在任何位置進行按壓。 The pressing means 50 can also press the bent portion of the succeeding sheet AS at a position other than the lowermost portion of the pressing roller 53, and can be in any position as long as the roller 53 can be pressed and the bent portion of the sheet AS is pressed. Press it.
夾入手段60係亦可取代或併用壓輪62,而以板狀構件或氣體的噴射等,由按壓滾軸53而夾入剝離用膠帶PT等,而未有亦可。 The sandwiching means 60 may be replaced by or in combination with the pressure roller 62, and the peeling tape PT or the like may be sandwiched by the pressing roller 53 by a plate member or a gas jet or the like.
切斷手段70係亦可取代或併用切斷刃72,而採用雷射切割,熱切割,氣體切割,壓縮水切割等之其他的構成者。 The cutting means 70 may be replaced by or in combination with the cutting blade 72, and other members such as laser cutting, thermal cutting, gas cutting, and compressed water cutting may be employed.
切斷手段70係在自剝離用膠帶PT之把持位置(經由支持滾軸21C及推進滾軸22B之把持位置),至對於該剝離用膠帶PT之接著薄片AS的貼附位置為止之間,切斷該剝離用膠帶PT亦可,以及例如,如文獻1所記載之以往的薄片剝離裝置,在自剝離用膠帶PT之把持位置,至支持該剝離用膠帶PT之支持位置為止之間,切斷該剝離用膠帶PT亦可。 The cutting means 70 is cut between the holding position of the self-peeling tape PT (the holding position via the support roller 21C and the advance roller 22B), and the attachment position to the subsequent sheet AS of the peeling tape PT. The peeling tape PT may be broken, and, for example, the conventional sheet peeling device described in the document 1 is cut between the holding position of the peeling tape PT and the supporting position of the peeling tape PT. This peeling tape PT is also possible.
由未圖示之檢測手段而加以檢測到對於使用移動規定手段40及按壓手段50之一方的接著薄片AS左端部的剝離失敗之情況,使用另一方的手段,或使用雙方的手段而進行該左端部之剝離動作亦可。 When the peeling of the left end portion of the succeeding sheet AS using one of the movement regulating means 40 and the pressing means 50 is detected by the detecting means (not shown), the other side is used or the left end is used by both means. The stripping action of the department is also possible.
因應被著體及接著薄片之至少一方的材質,種別,形狀等,作為呈自動地選擇移動規定手段40或按壓手段50亦可,或作為呈以手動進行選擇亦可。 The material, the type, the shape, and the like of at least one of the body and the succeeding sheet may be automatically selected as the movement regulating means 40 or the pressing means 50, or may be manually selected.
另外,在本發明之接著薄板AS,剝離用膠帶PT及被著體的材質,種別,形狀等係並無特別加以限定。例如,接著薄片AS及剝離用膠帶PT係亦可為圓形,橢圓形,三角形或四角形等之多角形,其他形狀,而為感壓接著性,感熱接著性等之接著形態的構成亦可,對於加以採用感熱接著性等之接著形態的構成情況之被著體的貼附,係如以設置加熱接著薄片AS或剝離用膠帶PT之適宜的線圈加熱或熱導管等加熱側之加熱手段的適宜方法,進行接著即可。另外,如此之接著薄片AS及剝離用膠帶PT係例如,亦可為僅接著劑層之單層的構成,於基材薄片與接著劑層之間具有中間層之構成,於基材薄片的上面具有蓋層等之3層以上的構成,更且,如可自接著劑層剝離基材薄片者之所謂兩面接著薄片之構成,而兩面接著薄片係亦可為具有單層或複層之中間層之構成,或未有中間層之單層或複層之構成。另外,作為被著體係例如,亦可將食品,樹脂容器,矽半導體晶圓或化合物半導體晶圓等之半導體晶圓,電路基板,光碟等之資訊記錄基板,玻璃基板,鋼板,陶器,木板或樹脂板等,任意形態之構件或物品等作為對象者。然而,將接著薄片AS變換為機能性,用途性的理解,例如,可將資訊記載用標籤,裝飾用標籤,保護薄片,切割膠帶,晶圓貼附膜,晶片接合膠帶,記錄層形成樹脂薄片等之任意的形狀之任意的薄片,薄膜,膠帶等貼附於如前述之任意的被著體者。 Further, in the adhesive sheet AS of the present invention, the peeling tape PT and the material of the object to be placed, the type, the shape, and the like are not particularly limited. For example, the sheet AS and the peeling tape PT may have a polygonal shape such as a circular shape, an elliptical shape, a triangular shape, or a square shape, and other shapes may be formed by a pressure-adhesive property or a thermal deformation property. The attachment of the object to the structure in which the bonding form of the heat-sensitive adhesive or the like is applied is preferably a heating means such as a coil heating or a heat pipe which is provided with heating of the sheet AS or the peeling tape PT. The method can be followed. Further, the subsequent sheet AS and the peeling tape PT may be, for example, a single layer of only the adhesive layer, and have an intermediate layer between the base sheet and the adhesive layer, on the upper surface of the base sheet. There are three or more layers of a cap layer or the like, and a so-called two-sided sheet of a substrate which can be peeled off from the adhesive layer, and the two sides of the sheet may be an intermediate layer having a single layer or a plurality of layers. The composition, or the composition of a single layer or a multiple layer of the intermediate layer. In addition, as a system to be used, for example, a semiconductor wafer such as a food, a resin container, a semiconductor wafer or a compound semiconductor wafer, a circuit board, an optical recording board, or the like may be used as an information recording substrate, a glass substrate, a steel plate, a ceramic plate, or a wood board or A resin plate or the like, a member or an article of any form is targeted. However, the subsequent sheet AS is converted into a functional property, and the usability is understood. For example, the information recording label, the decorative label, the protective sheet, the dicing tape, the wafer attaching film, the wafer bonding tape, and the recording layer can be formed into a resin sheet. Any sheet, film, tape, or the like of any shape is attached to any of the above-mentioned subjects.
在本發明之手段及工程係只要可達成對於此等手段及 工程說明過之動作,機能或工程,並未加以限定者,而未完全加以限定於在前述實施形態所示之單一實施形態之構成物或工程者。例如,貼附手段係只要如為可貼附剝離用膠帶於接著薄片者,對照於申請最初之技術常識,而如為其技術範圍內者,未加以限定者(對於其他的手段及工程之說明係省略)。 In the means and engineering department of the present invention, as long as the means and The operation, function, or engineering described in the project are not limited, and are not completely limited to the components or engineers of the single embodiment shown in the above embodiments. For example, the attachment means is as long as the tape for peeling can be attached to the subsequent sheet, in contrast to the initial technical knowledge of the application, and is not limited to the technical scope of the application (for other means and engineering descriptions) Omitted).
另外,在前述實施形態之驅動機器係可採用轉動馬達,直接傳動馬達,線性馬達,單軸機械手臂,多關節機械手臂等之電動機器,空氣壓缸,油壓壓缸,無桿壓缸及迴轉壓缸等之空氣壓缸等,並且亦可採用直接性或間接性地組合此等者(亦有與在實施形態所例示之構成重複者)。 Further, in the driving machine of the above embodiment, a rotary motor, a direct drive motor, a linear motor, a single-axis robot arm, a multi-joint robot arm, an electric motor, an air cylinder, a hydraulic cylinder, a rodless cylinder, and the like can be used. An air cylinder such as a rotary cylinder or the like may be combined directly or indirectly (also in a configuration overlapping with the embodiment exemplified in the embodiment).
10‧‧‧薄片剝離裝置 10‧‧‧Sheet stripping device
20‧‧‧貼附手段 20‧‧‧ Attachment means
21‧‧‧膠帶支持手段 21‧‧‧ Tape support means
21A‧‧‧旋轉軸 21A‧‧‧Rotary axis
21B‧‧‧轉動臂 21B‧‧‧Rotating arm
21C‧‧‧支持滾輪 21C‧‧‧Support wheel
21D‧‧‧彈簧 21D‧‧‧ Spring
22‧‧‧推進手段 22‧‧‧Advance means
22A‧‧‧轉動馬達 22A‧‧‧Rotary motor
22B‧‧‧推進滾軸 22B‧‧‧Advance roller
23,23C‧‧‧保持手段 23, 23C‧‧‧ means of keeping
23A‧‧‧傳動馬達 23A‧‧‧Drive motor
23B‧‧‧輸出軸 23B‧‧‧ Output shaft
23D‧‧‧吸附面 23D‧‧‧Adsorption surface
23E‧‧‧吸引孔 23E‧‧‧Attraction hole
23F‧‧‧吸引手段 23F‧‧‧ attraction
24‧‧‧保持補助手段 24‧‧‧Maintenance means
24A‧‧‧直接傳動馬達 24A‧‧‧Direct drive motor
24B‧‧‧輸出軸 24B‧‧‧ Output shaft
24C‧‧‧補助滾軸 24C‧‧‧Subsidy roller
25‧‧‧按壓手段 25‧‧‧Measure means
25A‧‧‧線性馬達 25A‧‧‧linear motor
25B‧‧‧滑件 25B‧‧‧Sliding parts
25C‧‧‧按壓頭 25C‧‧‧ Pressing head
25D‧‧‧加熱手段 25D‧‧‧heating means
30‧‧‧拉伸手段 30‧‧‧ stretching means
31‧‧‧移動手段 31‧‧‧Mobile means
31A‧‧‧線性馬達 31A‧‧‧Linear motor
31B‧‧‧滑件 31B‧‧‧Sliding parts
31C‧‧‧支持面 31C‧‧‧Support surface
31D‧‧‧平台 31D‧‧‧ platform
32‧‧‧誘導手段 32‧‧‧Induction means
32A‧‧‧線性馬達 32A‧‧·linear motor
32B‧‧‧滑件 32B‧‧‧Sliding parts
32C‧‧‧誘導滾軸 32C‧‧‧Induction Roller
40‧‧‧移動規定手段 40‧‧‧Mobile regulations
41‧‧‧線性馬達 41‧‧‧Linear motor
41A‧‧‧滑件 41A‧‧‧Sliding parts
42‧‧‧轉動馬達 42‧‧‧Rotating motor
42A‧‧‧輸出軸 42A‧‧‧ Output shaft
43‧‧‧移動規定板 43‧‧‧Mobile Provisioning Board
50‧‧‧按壓手段 50‧‧‧Measure means
51‧‧‧線性馬達 51‧‧‧Linear motor
51A‧‧‧滑件 51A‧‧‧Sliding parts
52‧‧‧轉動馬達 52‧‧‧Rotating motor
53‧‧‧按壓滾軸 53‧‧‧Pressing roller
60‧‧‧夾入手段 60‧‧‧clamping means
61‧‧‧直接傳動馬達 61‧‧‧Direct drive motor
61A‧‧‧輸出軸 61A‧‧‧ Output shaft
62‧‧‧壓輪 62‧‧‧pressure wheel
70‧‧‧切斷手段 70‧‧‧cutting means
71‧‧‧線性馬達 71‧‧‧Linear motor
71A‧‧‧滑件 71A‧‧‧Sliding parts
72‧‧‧切斷刃 72‧‧‧ cutting blade
AS‧‧‧接著薄片 AS‧‧‧ followed by thin slices
PT‧‧‧剝離用膠帶 PT‧‧‧ peeling tape
WF‧‧‧晶圓 WF‧‧‧ wafer
Claims (4)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015171467A JP6562778B2 (en) | 2015-08-31 | 2015-08-31 | Sheet peeling apparatus and peeling method |
| JP2015-171467 | 2015-08-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201724227A true TW201724227A (en) | 2017-07-01 |
| TWI688999B TWI688999B (en) | 2020-03-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105127278A TWI688999B (en) | 2015-08-31 | 2016-08-25 | Sheet peeling device and peeling method |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6562778B2 (en) |
| KR (1) | KR102558075B1 (en) |
| CN (1) | CN107615475B (en) |
| TW (1) | TWI688999B (en) |
| WO (1) | WO2017038470A1 (en) |
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| TWI648213B (en) * | 2017-11-30 | 2019-01-21 | 景碩科技股份有限公司 | Tear foil mechanism |
| TWI827978B (en) * | 2021-09-16 | 2024-01-01 | 日商新川股份有限公司 | Mounting apparatus |
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|---|---|---|---|---|
| JP7344647B2 (en) * | 2019-02-18 | 2023-09-14 | 株式会社ディスコ | tape pasting device |
| JP7415395B2 (en) * | 2019-09-25 | 2024-01-17 | オムロン株式会社 | Protective sheet peeling device and protective sheet peeling method |
| JP7454434B2 (en) * | 2020-04-14 | 2024-03-22 | リンテック株式会社 | Sheet peeling device and sheet peeling method |
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| JP4698517B2 (en) * | 2006-04-18 | 2011-06-08 | 日東電工株式会社 | Protective tape peeling method and apparatus using the same |
| JP2008004712A (en) * | 2006-06-21 | 2008-01-10 | Takatori Corp | Method and device for peeling protective tape |
| JP4801016B2 (en) * | 2007-07-19 | 2011-10-26 | リンテック株式会社 | Sheet sticking device and sticking method |
| JP4964070B2 (en) * | 2007-09-10 | 2012-06-27 | 日東電工株式会社 | Protective tape peeling method and protective tape peeling apparatus |
| JP4740296B2 (en) * | 2008-08-28 | 2011-08-03 | リンテック株式会社 | Sheet peeling apparatus and peeling method |
| JP5149122B2 (en) | 2008-10-22 | 2013-02-20 | リンテック株式会社 | Sheet peeling apparatus and peeling method |
| JP5249826B2 (en) | 2009-03-17 | 2013-07-31 | リンテック株式会社 | Sheet peeling apparatus and peeling method |
| JP5185868B2 (en) * | 2009-03-27 | 2013-04-17 | リンテック株式会社 | Sheet peeling apparatus and peeling method |
| JP5449937B2 (en) * | 2009-09-16 | 2014-03-19 | リンテック株式会社 | Sheet peeling apparatus and peeling method |
| JP5368226B2 (en) * | 2009-09-16 | 2013-12-18 | リンテック株式会社 | Sheet peeling apparatus and peeling method |
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| JP2014229636A (en) * | 2013-05-17 | 2014-12-08 | リンテック株式会社 | Sheet sticking device and sheet sticking method |
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-
2015
- 2015-08-31 JP JP2015171467A patent/JP6562778B2/en active Active
-
2016
- 2016-08-17 KR KR1020177037376A patent/KR102558075B1/en active Active
- 2016-08-17 WO PCT/JP2016/074016 patent/WO2017038470A1/en not_active Ceased
- 2016-08-17 CN CN201680033596.2A patent/CN107615475B/en active Active
- 2016-08-25 TW TW105127278A patent/TWI688999B/en active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI648213B (en) * | 2017-11-30 | 2019-01-21 | 景碩科技股份有限公司 | Tear foil mechanism |
| TWI827978B (en) * | 2021-09-16 | 2024-01-01 | 日商新川股份有限公司 | Mounting apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107615475A (en) | 2018-01-19 |
| JP6562778B2 (en) | 2019-08-21 |
| JP2017050364A (en) | 2017-03-09 |
| TWI688999B (en) | 2020-03-21 |
| CN107615475B (en) | 2021-01-15 |
| WO2017038470A1 (en) | 2017-03-09 |
| KR102558075B1 (en) | 2023-07-20 |
| KR20180046920A (en) | 2018-05-09 |
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