TW201718814A - Conductive material and connection structure - Google Patents

Abstract

The present invention provides a conductive material which can suppress the generation of black soot in a cured product and selectively arrange the solder in the conductive particles on the electrode to improve the conduction reliability. The conductive material of the present invention contains a plurality of conductive particles having a solder on the outer surface portion of the conductive portion, a thermosetting component, and a flux, and contains a compound having a hetero-cyanuric acid skeleton as the thermosetting component or the above. In the flux, the conductive material under the melting point of the solder in the conductive particles has a viscosity of 0.1 Pa·s or more and 20 Pa·s or less.

Description

Conductive material and connection structure

The present invention relates to a conductive material containing conductive particles having solder. Further, the present invention relates to a connection structure using the above conductive material.

Anisotropic conductive materials such as anisotropic conductive pastes and anisotropic conductive films are widely known. In the anisotropic conductive material described above, conductive particles are dispersed in the binder. In order to obtain various connection structures, the anisotropic conductive material is used for, for example, a connection between a flexible printed substrate and a glass substrate (FOG (Film on Glass)), and a connection between a semiconductor wafer and a flexible printed substrate (COF (Chip) On film, film flip chip), connection between semiconductor wafer and glass substrate (COG (Chip on Glass)), and connection between flexible printed substrate and epoxy glass substrate (FOB (Film on Board) )Wait. When the electrode of the flexible printed circuit board and the electrode of the epoxy glass substrate are electrically connected by the anisotropic conductive material, the anisotropic conductive material containing the conductive particles is placed on the epoxy glass substrate. Then, a flexible printed circuit board is laminated and heated and pressurized. Thereby, the anisotropic conductive material is cured, and the electrodes are electrically connected via the conductive particles to obtain a bonded structure. As an example of the above-mentioned anisotropic conductive material, Patent Document 1 listed below discloses an anisotropic conductive material containing conductive particles and a resin component which is not cured at the melting point of the conductive particles. Specific examples of the conductive particles include tin (Sn), indium (In), bismuth (Bi), silver (Ag), copper (Cu), zinc (Zn), lead (Pb), and cadmium (Cd). ), metals such as gallium (Ga) and tantalum (Tl), or alloys of such metals. Patent Document 1 describes a resin heating step in which an electrode is electrically connected to each other by heating an anisotropic conductive resin to a temperature higher than a melting point of the conductive particles and the resin component is not cured. a resin component hardening step of hardening the above resin component. Further, Patent Document 1 describes that the mounting is performed under the temperature distribution shown in FIG. 8 of Patent Document 1. In Patent Document 1, the conductive particles are melted in a resin component that has not been cured at a temperature at which the anisotropic conductive resin is heated. Patent Document 2 listed below discloses an adhesive tape comprising a resin layer containing a thermosetting resin, a solder powder, and a curing agent, and the solder powder and the curing agent are present in the resin layer. This adhesive tape is in the form of a film rather than a paste. [Prior Art Document] [Patent Document 1] Japanese Patent Laid-Open Publication No. 2004-260131 [Patent Document 2] WO2008/023452A1

[Problems to be Solved by the Invention] The present inventors have found that an anisotropic conductive material containing a solder powder or an electroconductive particle having a solder layer on its surface is present in a cured product of an anisotropic conductive material. Contains black ash from solder. Especially when the solder is subjected to the fluxing action by the flux, black soot is easily generated. The black soot increases the connection resistance between the electrodes and reduces the conduction reliability. In addition, when the electrodes are electrically connected by the method described in Patent Document 1, the anisotropic conductive material described in Patent Document 1 is used, and the conductive particles containing the solder are not efficiently disposed on the electrode ( On the line). Further, in the embodiment of Patent Document 1, in order to sufficiently move the solder at a temperature equal to or higher than the melting point of the solder, the manufacturing efficiency of the connection structure is lowered. When the mounting is performed under the temperature distribution shown in FIG. 8 of Patent Document 1, the manufacturing efficiency of the connection structure is lowered. Further, the adhesive tape described in Patent Document 2 is in the form of a film rather than a paste. In the adhesive tape having the composition described in Patent Document 2, it is difficult to efficiently arrange the solder powder on the electrode (wire). For example, in the adhesive tape described in Patent Document 2, it is easy to arrange a part of the solder powder in a region (interval) where the electrode is not formed. The solder powder disposed in the region where the electrode is not formed does not contribute to conduction between the electrodes. An object of the present invention is to provide a conductive material which can suppress the generation of black soot in a cured product and further selectively deposit the solder in the conductive particles on the electrode to improve the conduction reliability. Further, it is an object of the invention to provide a connection structure using the above-mentioned conductive material. [Technical means for solving the problem] According to a broad aspect of the present invention, there is provided a conductive material comprising a plurality of conductive particles having a solder on a surface portion of a conductive portion, a thermosetting component, and a flux, and having The compound of the isocyanuric acid skeleton is the thermosetting component or the flux, and the conductive material at the melting point of the solder in the conductive particles has a viscosity of 0.1 Pa·s or more and 20 Pa·s or less. It is preferable that the weight ratio of the content of the compound having an iso-cyanuric acid skeleton to the content of the flux is 0.5 or more and 20 or less. The weight ratio of the content of the compound having an iso-cyanuric acid skeleton to the content of the conductive particles is preferably 0.05 or more and 0.5 or less. In a specific aspect of the electrically conductive material of the present invention, the molecular weight of the compound having an isomeric cyanuric acid skeleton is 200 or more and 1,000 or less. In a specific aspect of the electrically conductive material of the present invention, the electrically conductive material contains a thermosetting compound having a hetero-cyanuric acid skeleton or a thermosetting agent having a hetero-cyanuric acid skeleton as the thermosetting component. In a specific aspect of the conductive material of the present invention, the conductive material contains a thermosetting compound having a hetero-cyanuric acid skeleton as the thermosetting component. In a specific aspect of the electrically conductive material of the present invention, the electrically conductive material contains a thermosetting compound having no isomeric cyanuric acid skeleton as the thermosetting component. In a specific aspect of the conductive material of the present invention, a thermosetting compound having a hetero-cyanuric acid skeleton and the above-mentioned thermosetting compound having no iso-cyanuric acid skeleton are contained as the thermosetting component. In a specific aspect of the conductive material of the present invention, the thermosetting compound having no hetero-cyanuric acid skeleton is a thermosetting compound having no hetero-cyanuric acid skeleton and having an aromatic skeleton or an alicyclic skeleton. Sex compounds. In a particular aspect of the electrically conductive material of the present invention, the electrically conductive material comprises a phosphate compound. In a specific aspect of the conductive material of the present invention, the conductive particles are solder particles. In a particular aspect of the electrically conductive material of the present invention, the electrically conductive material is liquid at 25 ° C and is a conductive paste. According to a broad aspect of the present invention, there is provided a connection structure comprising: a first connection target member having at least one first electrode on its surface; a second connection target member having at least one second electrode on its surface; and the first The connection portion is connected to the second connection target member, and the connection portion is a cured material of the conductive material, and the first electrode and the second electrode are electrically connected by a solder portion of the connection portion. In a specific aspect of the connection structure of the present invention, when the first electrode and the second electrode are opposed to each other along the laminated direction of the first electrode, the connection portion, and the second electrode, The solder portion in the connection portion is disposed at 50% or more of the area of the portion where the first electrode and the second electrode face each other. [Effects of the Invention] The conductive material of the present invention contains a plurality of conductive particles, a thermosetting component, and a flux having a solder on the outer surface portion of the conductive portion, and contains a compound having a hetero-cyanuric acid skeleton as the above. In the thermosetting component or the flux, the viscosity of the conductive material at the melting point of the solder in the conductive particles is 0.1 Pa·s or more and 20 Pa·s or less, so that the black soot in the cured material of the conductive material can be suppressed. produce. Further, the solder in the conductive particles can be selectively disposed on the electrode to improve the conduction reliability.

Hereinafter, the details of the present invention will be described. (Conductive Material) The electrically conductive material of the present invention contains a plurality of electrically conductive particles and a binder. The conductive particles have a conductive portion. The conductive particles have solder on the outer surface portion of the conductive portion. The solder is contained in the conductive portion and is part or all of the conductive portion. The binder is a component other than the conductive particles contained in the conductive material. The conductive material of the present invention contains a thermosetting component and a flux as the above-mentioned binder. The thermosetting component contains a thermosetting compound. The thermosetting component preferably contains a thermosetting agent. The conductive material of the present invention contains a compound having a hetero-cyanuric acid skeleton as the above-mentioned thermosetting component or the above-mentioned flux. The compound having an iso-cyanuric acid skeleton may be a thermosetting component having a hetero-cyanuric acid skeleton, a flux having a hetero-cyanuric acid skeleton, or a hetero-cyanuric acid skeleton. A thermosetting compound or a thermal hardener having a hetero-cyanuric acid skeleton. The thermosetting component having the iso-cyanuric acid skeleton may be a thermosetting compound having a hetero-cyanuric acid skeleton or a thermosetting agent having a hetero-cyanuric acid skeleton. In the conductive material of the present invention, the conductive material under the melting point of the solder in the conductive particles has a viscosity of 0.1 Pa·s or more and 20 Pa·s or less. In the present invention, since the above configuration is provided, generation of black soot derived from solder in the cured material of the conductive material can be suppressed. When black soot is contained in the cured material of the conductive material, the connection resistance between the electrodes becomes high, and the conduction reliability is lowered. In the present invention, since the generation of black soot can be suppressed, the connection resistance between the electrodes can be reduced, and the conduction reliability can be improved. Further, in the present invention, since the above-described configuration is provided, in particular, the viscosity of the conductive material at the melting point of the solder in the conductive particles is within the above range, so that the solder selectivity in the conductive particles can be selected. Placed on the electrode. When the electrodes are electrically connected to each other, the solder in the conductive particles is likely to be collected between the electrodes facing up and down, and the solder in the conductive particles can be efficiently disposed on the electrodes (wires). Further, it is difficult to arrange one of the solders in the conductive particles in a region (interval) where the electrode is not formed, and the amount of solder disposed in a region where the electrode is not formed can be extremely small. In the present invention, the solder not located between the opposing electrodes can be efficiently moved to between the opposite electrodes. Therefore, the conduction reliability between the electrodes can be improved. Moreover, the electrical connection between the electrodes adjacent to each other that are not connected can be prevented, and the insulation reliability can be improved. In order to more efficiently dispose the solder on the electrode, the above conductive material is preferably liquid at 25 ° C, and is preferably a conductive paste. In order to efficiently dispose the solder on the electrode, the viscosity (ηmp) of the conductive material at the melting point of the solder in the conductive particles is 0.1 Pa·s or more and 20 Pa·s or less. The viscosity (ηmp) is preferably 1 Pa·s or more, and preferably 15 Pa·s or less, and more preferably 10 Pa·s or less, from the viewpoint of more effectively disposing the solder on the electrode. When the viscosity (ηmp) is not less than the above lower limit and not more than the above upper limit, the conductive particles or the solder are efficiently moved from the initial stage to the middle stage during the conductive connection. The viscosity can be STRESSTECH (manufactured by EOLOGICA Co., Ltd.) or the like, and the strain control is 1 rad, the frequency is 1 Hz, the temperature rise rate is 20 ° C / min, and the measurement temperature range is 40 to 200 ° C (wherein the melting point of the solder exceeds 200 ° C, The measurement was carried out under the conditions that the upper limit of the temperature was set to the melting point of the solder. The melting point of the above solder may be 200 ° C or less. The above conductive material may be used in the form of a conductive paste, a conductive film or the like. The above conductive material is preferably an anisotropic conductive material. The above conductive paste is preferably an anisotropic conductive paste. The above conductive film is preferably an anisotropic conductive film. The above conductive material can be preferably used for electrical connection of electrodes. The above conductive material is preferably a circuit connecting material. The molecular weight of the compound having an iso-cyanuric acid skeleton is preferably 200 or more, more preferably 300 or more, and is preferably 1,000 or less, more preferably 600 or less, from the viewpoint of further suppressing generation of black soot. In view of further suppressing the generation of black soot, the content of the compound having an iso-cyanuric acid skeleton in 100% by weight of the conductive material is preferably 5% by weight or more, more preferably 10% by weight or more, and more preferably It is preferably 30% by weight or less, more preferably 20% by weight or less. Hereinafter, each component contained in the above-mentioned conductive material will be described. (Electroconductive Particles) The conductive particles electrically connect the electrodes of the connection member. The conductive particles have solder on the outer surface portion of the conductive portion. The conductive particles may be solder particles. The above solder particles are formed of solder. The solder particles have solder on the outer surface portion of the conductive portion. The solder particles are the central portion of the solder particles and the outer surface portion of the conductive portion are particles of solder. Regarding the above solder particles, the central portion and the outer surface portion of the conductive portion are formed of solder. The conductive particles may have substrate particles and a conductive portion disposed on a surface of the substrate particles. In this case, the conductive particles have solder on the outer surface portion of the conductive portion. In addition, when using the conductive particles including the substrate particles not formed of solder and the solder portion disposed on the surface of the substrate particles, the conductive particles become difficult to use. Since the conductive particles are deposited on the electrode and the conductive particles have a low solder joint property, the conductive particles that have moved to the electrode tend to move outside the electrode, and the effect of suppressing the displacement between the electrodes tends to be lowered. Therefore, the above conductive particles are preferably solder particles. From the viewpoint of effectively reducing the connection resistance in the bonded structure and effectively suppressing the generation of voids, it is preferred that a carboxyl group or an amine group be present on the outer surface (the outer surface of the solder) of the conductive particles, preferably present. A carboxyl group is preferably an amine group. It is preferred that a carboxyl group or an amine group is covalently bonded to the outer surface (the outer surface of the solder) of the above-mentioned conductive particles via a Si—O bond, an ether bond, an ester bond or a group represented by the following formula (X). More preferably, it is preferably a group having a carboxyl group or an amine group covalently bonded to the outer surface of the conductive particle (the outer surface of the solder) via an ether bond, an ester bond or a group represented by the following formula (X). . The group containing a carboxyl group or an amine group may contain both a carboxyl group and an amine group. Further, in the following formula (X), the right end portion and the left end portion indicate a bonding portion. [Chemical 1]A hydroxyl group is present on the surface of the solder. By covalently bonding the hydroxyl group to a carboxyl group-containing group, a bond stronger than that by other coordinate bonds (chelating coordination) or the like can be formed, so that it is possible to reduce the interelectrode. Conductive particles that connect the resistors and suppress the generation of voids. In the above conductive particles, the bonding form of the surface of the solder and the group containing a carboxyl group may not contain a coordinate bond, or may not contain a bond formed by chelating coordination. The conductive particles are preferably a compound having a functional group capable of reacting with a hydroxyl group and a carboxyl group or an amine group from the viewpoint of effectively reducing the connection resistance in the bonded structure and effectively suppressing the generation of voids (hereinafter, It is sometimes referred to as compound X), and a hydroxyl group on the surface of the solder is obtained by reacting the above-mentioned functional group capable of reacting with a hydroxyl group. A covalent bond is formed in the above reaction. Conductive particles having a carboxyl group or an amine group covalently bonded to the surface of the solder can be easily obtained by reacting a hydroxyl group on the surface of the solder with a functional group capable of reacting with a hydroxyl group in the above compound. Conductive particles having a carboxyl group or an amine group covalently bonded to the surface of the solder via an ether bond or an ester bond are obtained. By reacting the hydroxyl group on the surface of the solder with the functional group capable of reacting with the hydroxyl group, the compound X can be chemically bonded to the surface of the solder in the form of a covalent bond. Examples of the functional group capable of reacting with a hydroxyl group include a hydroxyl group, a carboxyl group, an ester group, a carbonyl group and the like. It is preferably a hydroxyl group or a carboxyl group. The functional group capable of reacting with a hydroxyl group may be a hydroxyl group or a carboxyl group. Examples of the compound having a functional group reactive with a hydroxyl group include acetopropionic acid, glutaric acid, glycolic acid, succinic acid, malic acid, oxalic acid, malonic acid, adipic acid, 5-ketohexanoic acid, and 3 -hydroxypropionic acid, 4-aminobutyric acid, 3-mercaptopropionic acid, 3-mercaptoisobutyric acid, 3-methylthiopropionic acid, 3-phenylpropionic acid, 3-phenylisobutyric acid, 4- Phenylbutyric acid, citric acid, dodecanoic acid, myristic acid, pentadecanoic acid, palmitic acid, 9-hexadecenoic acid, heptadecanoic acid, stearic acid, oleic acid, oil Acid, linoleic acid, (9,12,15)-linolenic acid, nonadecanoic acid, arachidic acid, sebacic acid and dodecanedioic acid. Preferred is glutaric acid or glycolic acid. The above-mentioned compound having a functional group capable of reacting with a hydroxyl group may be used alone or in combination of two or more. The compound having a functional group reactive with a hydroxyl group is preferably a compound having at least one carboxyl group. The above compound X preferably has a fluxing action, and the above compound X preferably has a fluxing action in a state of being bonded to the surface of the solder. The compound having a fluxing action can remove the oxide film on the surface of the solder and the oxide film on the surface of the electrode. The carboxyl group has a fluxing effect. Examples of the compound having a fluxing action include acetopropionic acid, glutaric acid, glycolic acid, succinic acid, 5-ketohexanoic acid, 3-hydroxypropionic acid, 4-aminobutyric acid, and 3-mercaptopropionic acid. , 3-mercaptoisobutyric acid, 3-methylthiopropionic acid, 3-phenylpropionic acid, 3-phenylisobutyric acid, 4-phenylbutyric acid, and the like. Preferred is glutaric acid or glycolic acid. The above-mentioned compound having a fluxing action may be used alone or in combination of two or more. From the viewpoint of effectively reducing the connection resistance in the bonded structure and effectively suppressing the generation of voids, it is preferred that the functional group capable of reacting with a hydroxyl group in the above compound X is a hydroxyl group or a carboxyl group. The functional group capable of reacting with a hydroxyl group in the above compound X may be a hydroxyl group or a carboxyl group. When the functional group capable of reacting with a hydroxyl group is a carboxyl group, the compound X preferably has at least two carboxyl groups. Conductive particles in which a carboxyl group-containing group is covalently bonded to the surface of the solder can be obtained by reacting a partial carboxyl group of a compound having at least two carboxyl groups with a hydroxyl group on the surface of the solder. The method for producing the conductive particles includes, for example, a method of mixing conductive particles, a compound having a functional group capable of reacting with a hydroxyl group and a carboxyl group, a catalyst, and a solvent using conductive particles. In the method for producing the conductive particles described above, the conductive particles having a carboxyl group-containing group covalently bonded to the surface of the solder can be easily obtained by the mixing step. Further, in the method for producing the conductive particles, it is preferred to use conductive particles, and to mix the conductive particles, the compound having a functional group capable of reacting with a hydroxyl group and a carboxyl group, the catalyst, and the solvent, and Heat up. Conductive particles having a carboxyl group-containing group covalently bonded to the surface of the solder can be more easily obtained by the mixing and heating steps. Examples of the solvent include alcohol solvents such as methanol, ethanol, propanol and butanol; acetone, methyl ethyl ketone, ethyl acetate, toluene, and xylene. The above solvent is preferably an organic solvent, more preferably toluene. These solvents may be used alone or in combination of two or more. Examples of the catalyst include p-toluenesulfonic acid, benzenesulfonic acid, and 10-camphorsulfonic acid. The above catalyst is preferably p-toluenesulfonic acid. The above catalysts may be used alone or in combination of two or more. It is preferred to carry out heating at the time of the above mixing. The heating temperature is preferably 90 ° C or higher, more preferably 100 ° C or higher, and is preferably 130 ° C or lower, more preferably 110 ° C or lower. The conductive particles are preferably obtained by the following steps from the viewpoint of effectively reducing the connection resistance in the bonded structure and effectively suppressing the generation of voids: using an isocyanate compound to carry out the hydroxyl group on the surface of the solder with the above isocyanate compound reaction. A covalent bond is formed in the above reaction. Conductive particles in which a nitrogen atom derived from an isocyanate group is covalently bonded to the surface of the solder can be easily obtained by reacting a hydroxyl group on the surface of the solder with the above isocyanate compound. By reacting the hydroxyl group on the surface of the solder with the isocyanate compound, the isocyanate group-derived group can be chemically bonded to the surface of the solder in the form of a covalent bond. Further, the isocyanate group-derived group and the decane coupling agent can be easily reacted. Since the above conductive particles can be easily obtained, the carboxyl group-containing group is preferably introduced by a reaction using a decane coupling agent having a carboxyl group, or by a reaction using a decane coupling agent. The group of the mixture is introduced by reacting with a compound having at least one carboxyl group. The conductive particles are preferably obtained by reacting a hydroxyl group on the surface of the solder with the isocyanate compound and reacting with a compound having at least one carboxyl group by using the above isocyanate compound. From the viewpoint of effectively reducing the connection resistance in the bonded structure and effectively suppressing the generation of voids, it is preferred that the compound having at least one carboxyl group has a plurality of carboxyl groups. Examples of the isocyanate compound include diphenylmethane-4,4'-diisocyanate (MDI), hexamethylene diisocyanate (HDI), toluene diisocyanate (TDI), and isophorone diisocyanate (IPDI). Isocyanate compounds other than these may also be used. After reacting the compound with the surface of the solder, the residual isocyanate group is reacted with a compound having a carboxyl group reactive with the residual isocyanate group, whereby the carboxyl group can be introduced to the group represented by the above formula (X). The surface of the solder. As the above isocyanate compound, a compound having an unsaturated double bond and having an isocyanate group can also be used. For example, 2-propenyloxyethyl isocyanate and 2-isocyanate ethyl methacrylate are mentioned. By reacting the isocyanate group of the compound with the surface of the solder, and reacting with a compound having a functional group reactive with the remaining unsaturated double bond and having a carboxyl group, the group represented by the above formula (X) can be used. The carboxyl group is introduced to the surface of the solder. Examples of the above decane coupling agent include 3-isocyanatopropyltriethoxysilane ("KBE-9007" manufactured by Shin-Etsu Silicones Co., Ltd.), and 3-isocyanatopropyltrimethoxydecane ( "Y-5187" manufactured by MOMENTIVE Co., Ltd., etc. The above decane coupling agents may be used alone or in combination of two or more. Examples of the compound having at least one carboxyl group include acetopropionic acid, glutaric acid, glycolic acid, succinic acid, malic acid, oxalic acid, malonic acid, adipic acid, 5-ketohexanoic acid, and 3-hydroxyl group. Propionic acid, 4-aminobutyric acid, 3-mercaptopropionic acid, 3-mercaptoisobutyric acid, 3-methylthiopropionic acid, 3-phenylpropionic acid, 3-phenylisobutyric acid, 4-phenyl Butyric acid, citric acid, dodecanoic acid, myristic acid, pentadecanoic acid, palmitic acid, 9-hexadecenoic acid, heptadecanoic acid, stearic acid, oleic acid, isooleic acid, Linseed acid, (9,12,15)-linolenic acid, nonadecanoic acid, arachidic acid, azelaic acid and dodecanedioic acid. Preferred is glutaric acid, adipic acid or glycolic acid. The compound having at least one carboxyl group may be used alone or in combination of two or more. By using the above isocyanate compound, a hydroxyl group on the surface of the solder is reacted with the above isocyanate compound, and a part of the carboxyl group of a compound having a plurality of carboxyl groups is reacted with a hydroxyl group on the surface of the solder, whereby a carboxyl group-containing group remains. In the method for producing the above-mentioned conductive particles, an electroconductive particle is used, and an isocyanate compound is used to react a hydroxyl group on the surface of the solder with the isocyanate compound, and then reacted with a compound having at least one carboxyl group to obtain a formula (X). The conductive particles of the carboxyl group-containing group are bonded to the surface of the solder. In the method for producing the above-mentioned conductive particles, the conductive particles in which the carboxyl group-containing group is introduced on the surface of the solder can be easily obtained by the above steps. As a specific manufacturing method of the said electroconductive particle, the following methods are mentioned. The conductive particles are dispersed in an organic solvent, and a decane coupling agent having an isocyanate group is added. Thereafter, a reaction catalyst of a hydroxyl group and an isocyanate group on the surface of the solder of the conductive particles is used to covalently bond the decane coupling agent to the surface of the solder. Then, a hydroxyl group is formed by hydrolyzing an alkoxy group bonded to a ruthenium atom of a decane coupling agent. The resulting hydroxyl group is reacted with a carboxyl group of a compound having at least one carboxyl group. Moreover, as a specific manufacturing method of the said electroconductive particle, the following methods are mentioned. The conductive particles are dispersed in an organic solvent, and a compound having an isocyanate group and an unsaturated double bond is added. Thereafter, a reaction catalyst of a hydroxyl group on the surface of the solder of the conductive particles and an isocyanate group is used to form a covalent bond. Thereafter, an unsaturated double bond and a compound having a carboxyl group are allowed to react with the introduced unsaturated double bond. Examples of the reaction catalyst for the hydroxyl group and the isocyanate group on the surface of the solder of the conductive particles include a tin-based catalyst (dibutyltin dilaurate), an amine-based catalyst (such as triethylenediamine), and a carboxylate catalyst. (lead naphthenate, potassium acetate, etc.), and a trialkylphosphine catalyst (such as triethylphosphine). The compound having at least one carboxyl group is preferably a compound represented by the following formula (1) from the viewpoint of effectively reducing the connection resistance in the bonded structure and effectively suppressing the generation of pores. The compound represented by the following formula (1) has a fluxing action. Further, the compound represented by the following formula (1) has a fluxing action in a state of being introduced into the surface of the solder. [Chemical 2]In the above formula (1), X represents a functional group reactive with a hydroxyl group, and R represents a divalent organic group having 1 to 5 carbon atoms. The organic group may contain a carbon atom, a hydrogen atom, and an oxygen atom. The organic group may be a divalent hydrocarbon group having 1 to 5 carbon atoms. The main chain of the above organic group is preferably a divalent hydrocarbon group. In the organic group, a carboxyl group or a hydroxyl group may be bonded to the divalent hydrocarbon group. The compound represented by the above formula (1) contains, for example, citric acid. The compound having at least one carboxyl group is preferably a compound represented by the following formula (1A) or the following formula (1B). The compound having at least one carboxyl group is preferably a compound represented by the following formula (1A), and more preferably a compound represented by the following formula (1B). [Chemical 3]In the above formula (1A), R represents a divalent organic group having 1 to 5 carbon atoms. R in the above formula (1A) is the same as R in the above formula (1). [Chemical 4]In the above formula (1B), R represents a divalent organic group having 1 to 5 carbon atoms. R in the above formula (1B) is the same as R in the above formula (1). Preferably, the surface represented by the following formula (2A) or the following formula (2B) is bonded to the surface of the solder. It is preferable that the surface represented by the following formula (2A) is bonded to the surface of the solder, and it is more preferable to bond the group represented by the following formula (2B). In the following formula (2A) and the following formula (2B), the left end portion indicates a bonding portion. [Chemical 5]In the above formula (2A), R represents a divalent organic group having 1 to 5 carbon atoms. R in the above formula (2A) is the same as R in the above formula (1). [Chemical 6]In the above formula (2B), R represents a divalent organic group having 1 to 5 carbon atoms. R in the above formula (2B) is the same as R in the above formula (1). The molecular weight of the compound having at least one carboxyl group is preferably 10,000 or less, more preferably 1,000 or less, still more preferably 500 or less from the viewpoint of improving the wettability of the solder surface. In the case where the compound having at least one carboxyl group is not a polymer and the structural formula in which the compound having at least one carboxyl group is specified, the molecular weight means a molecular weight which can be calculated from the structural formula. Further, in the case where the compound having at least one carboxyl group is a polymer, it means a weight average molecular weight. The conductive particles are preferably an electroconductive particle main body and an anionic polymer disposed on the surface of the electroconductive particle main body in terms of effectively improving the aggregability of the conductive particles during the conductive connection. The conductive particles are preferably obtained by subjecting the conductive particles to a surface treatment by using an anionic polymer or a compound which is an anionic polymer. The conductive particles are preferably surface treated by an anionic polymer or a compound which is an anionic polymer. The above-mentioned anionic polymer and the above-mentioned compound which becomes an anionic polymer may be used alone or in combination of two or more. The above anionic polymer is a polymer having an acidic group. The method of surface-treating the main body of the electroconductive particle by an anionic polymer is a method of using, for example, a (meth)acrylic polymer obtained by copolymerizing (meth)acrylic acid as an anionic polymer, a polyester polymer synthesized from a dicarboxylic acid and a diol and having a carboxyl group at both terminals, a polymer obtained by intermolecular dehydration condensation reaction of a dicarboxylic acid and having a carboxyl group at both terminals, synthesized from a dicarboxylic acid and a diamine A polyester polymer having a carboxyl group at both ends and a modified polyvinyl alcohol having a carboxyl group ("Gohsenx T" manufactured by Nippon Synthetic Chemical Co., Ltd.) and the like, and reacting a carboxyl group of the anionic polymer with a hydroxyl group on the surface of the conductive particle body. The anion portion of the anionic polymer may, for example, be the above-mentioned carboxyl group, and other examples thereof include toluenesulfonyl group (p-H).₃ CC₆ H₄ S(=O)₂ -), sulfonate ion group (-SO₃ ^- ), and phosphate ion base (-PO₄ ^- )Wait. Moreover, as another method of surface treatment, a method of using a functional group having a functional group reactive with a hydroxyl group on the surface of the conductive particle and further having a functional group polymerizable by addition or condensation reaction is used. The compound is polymerized on the surface of the conductive particle body. Examples of the functional group that reacts with the hydroxyl group on the surface of the conductive particle body include a carboxyl group and an isocyanate group. Examples of the functional group to be polymerized by addition or condensation reaction include a hydroxyl group, a carboxyl group, an amine group, and (A). Base) propylene fluorenyl. The weight average molecular weight of the above anionic polymer is preferably 2,000 or more, more preferably 3,000 or more, and is preferably 10,000 or less, more preferably 8,000 or less. When the weight average molecular weight is not less than the above lower limit and not more than the above upper limit, a sufficient amount of charge and solderability can be introduced into the surface of the conductive particles. Thereby, the aggregation property of the electroconductive particle can be effectively improved at the time of electrically conductive connection, and the oxide film of the electrode surface can be effectively removed at the time of connection of the connection target member. When the weight average molecular weight is not less than the above lower limit and not more than the above upper limit, the anionic polymer is easily disposed on the surface of the conductive particle body, and the aggregation of the solder particles can be effectively improved during the conductive connection, and the conductive particles can be further improved. Efficiently placed on the electrode. The above weight average molecular weight means a weight average molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC). The weight average molecular weight of the anionic polymer can be obtained by dissolving the solder in the conductive particles, removing the conductive particles by dilute hydrochloric acid or the like which does not cause decomposition of the anionic polymer, and measuring the weight average molecular weight of the remaining anionic polymer. . The amount of introduction of the anionic polymer to the surface of the conductive particles is preferably 1 mgKOH or more per 1 g of the conductive particles, more preferably 2 mgKOH or more, and is preferably 10 mgKOH or less, more preferably 6 mgKOH. the following. The above acid value can be measured by the following method. 1 g of the conductive particles were added to 36 g of acetone, and they were dispersed by ultrasonic waves for 1 minute. Thereafter, phenolphthalein was used as an indicator, and titration was carried out using a 0.1 mol/L potassium hydroxide ethanol solution. Next, a specific example of the conductive particles will be described with reference to the drawings. Fig. 4 is a cross-sectional view showing a first example of conductive particles which can be used for a conductive material. The conductive particles 21 shown in Fig. 4 are solder particles. The conductive particles 21 are entirely formed of solder. The conductive particles 21 do not have substrate particles in the core, and are not core-shell particles. The central portion of the conductive particles 21 and the outer surface portion of the conductive portion are all formed of solder. Fig. 5 is a cross-sectional view showing a second example of conductive particles which can be used for a conductive material. The conductive particles 31 shown in FIG. 5 include substrate particles 32 and a conductive portion 33 disposed on the surface of the substrate particles 32. The conductive portion 33 covers the surface of the substrate particles 32. The conductive particles 31 are coated particles in which the surface of the substrate particles 32 is covered with the conductive portion 33. The conductive portion 33 has a second conductive portion 33A and a solder portion 33B (first conductive portion). The conductive particles 31 include a second conductive portion 33A between the substrate particles 32 and the solder portion 33B. Therefore, the conductive particles 31 include the substrate particles 32, the second conductive portion 33A disposed on the surface of the substrate particles 32, and the solder portion 33B disposed on the outer surface of the second conductive portion 33A. Fig. 6 is a cross-sectional view showing a third example of conductive particles which can be used for a conductive material. As described above, the conductive portion 33 in the conductive particles 31 has a two-layer structure. The conductive particles 41 shown in FIG. 6 have a solder portion 42 as a single-layer conductive portion. The conductive particles 41 include the substrate particles 32 and the solder portion 42 disposed on the surface of the substrate particles 32. Examples of the substrate particles include resin particles, inorganic particles other than metal particles, organic-inorganic hybrid particles, and metal particles. The substrate particles are preferably substrate particles other than metal, and are preferably resin particles, inorganic particles other than metal particles, or organic-inorganic hybrid particles. The substrate particles may be copper particles. The substrate particles may have a core and a shell disposed on a surface of the core, and may be core-shell particles. The above-mentioned core may be an organic core, and the above shell may be an inorganic shell. As the resin for forming the above resin particles, various organic materials can be preferably used. Examples of the resin for forming the resin particles include polyolefin resins such as polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyvinylidene chloride, polyisobutylene, and polybutadiene; and polymethacrylic acid; Acrylic resin such as methyl ester and polymethyl acrylate; polycarbonate, polyamide, phenol formaldehyde resin, melamine formaldehyde resin, benzoguanidine formaldehyde resin, urea formaldehyde resin, phenol resin, melamine resin, benzoguanamine resin, Urea resin, epoxy resin, unsaturated polyester resin, saturated polyester resin, polyethylene terephthalate, polyfluorene, polyphenylene ether, polyacetal, polyimide, polyamidimide, Polyetheretherketone, polyether oxime, divinylbenzene polymer, and divinylbenzene copolymer. Examples of the divinylbenzene-based copolymer and the like include a divinylbenzene-styrene copolymer and a divinylbenzene-(meth)acrylate copolymer. Since the hardness of the resin particles can be easily controlled within a preferred range, the resin for forming the resin particles preferably polymerizes one or two or more kinds of polymerizable monomers having an ethylenically unsaturated group. The polymer. When the polymerizable monomer having an ethylenically unsaturated group is polymerized to obtain the above resin particles, examples of the polymerizable monomer having an ethylenically unsaturated group include a non-crosslinkable monomer and cross-linking. Sexual monomer. Examples of the non-crosslinkable monomer include a styrene monomer such as styrene or α-methylstyrene, and a carboxyl group such as (meth)acrylic acid, maleic acid or maleic anhydride. Monomer; methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, (a) Base) lauryl acrylate, cetyl (meth) acrylate, stearyl (meth) acrylate, cyclohexyl (meth) acrylate, (meth) acrylateAlkyl (meth) acrylate compound such as ester; 2-hydroxyethyl (meth) acrylate, glyceryl (meth) acrylate, polyoxyethylene (meth) acrylate, glycidyl (meth) acrylate, etc. (meth) acrylate compound containing oxygen atom; nitrile containing monomer such as (meth) acrylonitrile; vinyl ether compound such as methyl vinyl ether, ethyl vinyl ether or propyl vinyl ether; vinyl acetate, ethylene butyrate Acidic vinyl ester compounds such as ester, vinyl laurate, vinyl stearate; unsaturated hydrocarbons such as ethylene, propylene, isoprene, butadiene; trifluoromethyl (meth)acrylate, (meth)acrylic acid A halogen-containing monomer such as pentafluoroethyl ester, vinyl chloride, vinyl fluoride or chlorostyrene. Examples of the crosslinkable monomer include tetramethylol methane tetra(meth)acrylate, tetramethylol methane tri(meth)acrylate, and tetramethylolmethane di(meth)acrylate. Ester, trimethylolpropane tri(meth)acrylate, dipentaerythritol hexa(meth) acrylate, dipentaerythritol penta (meth) acrylate, tris(meth) acrylate, di(meth)acrylic acid Glyceride, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, (poly)tetramethylene glycol di(meth)acrylate, 1,4- A polyfunctional (meth) acrylate compound such as butanediol di(meth) acrylate; triallyl (iso) cyanurate, triallyl trimellitate, divinyl benzene, phthalic acid Allyl ester, diallyl acrylamide, diallyl ether; and γ-(meth) propylene methoxy propyl trimethoxy decane, trimethoxy decyl styrene, vinyl trimethoxy decane Such as decane-containing monomers and the like. The above resin particles can be obtained by polymerizing the above polymerizable monomer having an ethylenically unsaturated group by a known method. Examples of the method include a method in which suspension polymerization is carried out in the presence of a radical polymerization initiator, and a method in which a non-crosslinked seed particle and a radical polymerization initiator are used to swell the monomer to carry out polymerization. . In the case where the substrate particles are inorganic particles or organic-inorganic hybrid particles other than metal, examples of the inorganic material for forming the substrate particles include ceria, alumina, barium titanate, zirconia, and carbon black. Wait. The above inorganic substance is preferably not a metal. The particle formed of the cerium oxide is not particularly limited, and for example, a hydrazine compound having two or more hydrolyzable alkoxyalkylalkyl groups is hydrolyzed to form crosslinked polymer particles, and then, if necessary, Particles obtained by calcination. Examples of the organic-inorganic hybrid particles include organic-inorganic hybrid particles formed of a crosslinked alkoxyfluorene alkyl polymer and an acrylic resin. In the case where the substrate particles are metal particles, examples of the metal for forming the metal particles include silver, copper, nickel, rhodium, gold, and titanium. In the case where the substrate particles are metal particles, the metal particles are preferably copper particles. Preferably, however, the substrate particles are not metal particles. The particle diameter of the substrate particles is preferably 0.1 μm or more, more preferably 1 μm or more, further preferably 1.5 μm or more, particularly preferably 2 μm or more, and preferably 100 μm or less, more preferably 50 μm or less. Further, it is preferably 40 μm or less, more preferably 20 μm or less, still more preferably 10 μm or less, still more preferably 5 μm or less, and most preferably 3 μm or less. When the particle diameter of the substrate particles is at least the above lower limit, the contact area between the conductive particles and the electrode is increased, so that the conduction reliability between the electrodes can be further improved, and the electrode connected between the conductive particles can be further reduced. Connect the resistor. When the particle diameter of the substrate particles is not more than the above upper limit, the conductive particles are easily sufficiently compressed, and the connection resistance between the electrodes can be further reduced, and the interval between the electrodes can be further reduced. The particle diameter of the substrate particles indicates a diameter when the substrate particles are in a true spherical shape, and indicates a maximum diameter when the substrate particles are not in a true spherical shape. The particle diameter of the substrate particles is particularly preferably 2 μm or more and 5 μm or less. When the particle diameter of the substrate particles is in the range of 2 μm or more and 5 μm or less, the interval between the electrodes can be further reduced, and even if the thickness of the conductive portion is made thick, a small amount of conductive particles can be obtained. A method of forming a conductive portion on the surface of the substrate particle, and a method of forming a solder portion on the surface of the substrate particle or the surface of the second conductive portion are not particularly limited. Examples of the method of forming the conductive portion and the solder portion include a method using electroless plating, a method using electroplating, a method using physical collision, a method using mechanochemical reaction, and a method using physical vapor deposition or physical adsorption. And a method of applying a paste containing a metal powder or a metal powder and a binder to the surface of the substrate particles. It is preferred to use a method of electroless plating, electroplating or physical collision. Examples of the method using physical vapor deposition include vacuum deposition, ion plating, and ion sputtering. Further, in the above method of utilizing physical collision, for example, Thetacomposer (manufactured by Deshou Works Co., Ltd.) or the like is used. The melting point of the substrate particles is preferably higher than the melting points of the conductive portion and the solder portion. The melting point of the substrate particles is preferably more than 160 ° C, more preferably more than 300 ° C, still more preferably more than 400 ° C, and even more preferably more than 450 ° C. Further, the melting point of the substrate particles may be less than 400 °C. The base material particles may have a melting point of 160 ° C or lower. The softening point of the substrate particles is preferably 260 ° C or higher. The softening point of the above substrate particles may also be less than 260 °C. The conductive particles may have a single layer solder portion. The conductive particles may have a plurality of conductive portions (solder portions, second conductive portions). In other words, in the conductive particles, two or more conductive portions may be laminated. When the conductive portion is two or more layers, the conductive particles preferably have solder on the outer surface portion of the conductive portion. The above solder is preferably a metal having a melting point of 450 ° C or less (low melting point metal). The solder portion is preferably a metal layer (low melting point metal layer) having a melting point of 450 ° C or lower. The low melting point metal layer is a layer containing a low melting point metal. The solder in the conductive particles is preferably a metal particle (low melting point metal particle) having a melting point of 450 ° C or lower. The low melting point metal particles are particles containing a low melting point metal. The so-called low melting point metal means a metal having a melting point of 450 ° C or lower. The melting point of the low melting point metal is preferably 300 ° C or lower, more preferably 160 ° C or lower. Further, the solder in the conductive particles preferably contains tin. In 100% by weight of the metal contained in the solder portion and 100% by weight of the metal contained in the solder in the conductive particles, the content of tin is preferably 30% by weight or more, more preferably 40% by weight or more, and further preferably It is 70% by weight or more, and particularly preferably 90% by weight or more. When the content of tin contained in the solder in the conductive particles is at least the above lower limit, the conduction reliability of the conductive particles and the electrode is further improved. In addition, the high-frequency inductively coupled plasma emission spectrometer ("ICP-AES" manufactured by Horiba, Ltd.) or the fluorescent X-ray analyzer (EDX-800HS manufactured by Shimadzu Corporation) can be used. ), etc. are measured. By using the conductive particles having solder on the outer surface portion of the conductive portion, the solder is melted and bonded to the electrode, and the solder conducts the electrodes. For example, since the solder is easily in surface contact with the electrode instead of point contact, the connection resistance becomes low. Further, by using conductive particles having solder on the outer surface portion of the conductive portion, the bonding strength between the solder and the electrode is increased, and as a result, peeling of the solder and the electrode is more difficult to occur, and the conduction reliability is effectively improved. The low melting point metal constituting the solder portion and the solder particles is not particularly limited. The low melting point metal is preferably tin or an alloy containing tin. Examples of the alloy include a tin-silver alloy, a tin-copper alloy, a tin-silver-copper alloy, a tin-bismuth alloy, a tin-zinc alloy, and a tin-indium alloy. The low melting point metal is preferably tin, tin-silver alloy, tin-silver-copper alloy, tin-bismuth alloy, or tin-indium alloy in terms of excellent wettability of the electrode. More preferably, it is a tin-bismuth alloy or a tin-indium alloy. The material constituting the solder (solder portion) is preferably a filler material having a liquidus of 450 ° C or less, based on JIS Z3001: welding term. Examples of the composition of the solder include a metal composition containing zinc, gold, silver, lead, copper, tin, antimony, indium, or the like. A tin-indium system (117 ° C eutectic) or a tin-lanthanide (139 ° C eutectic) having a low melting point and no lead is preferable. That is, the solder is preferably free from lead, and is preferably a solder containing tin and indium or a solder containing tin and antimony. In order to further improve the bonding strength between the solder and the electrode, the solder in the conductive particles may also contain nickel, copper, lanthanum, aluminum, zinc, iron, gold, titanium, phosphorus, lanthanum, cerium, cobalt, lanthanum, manganese, chromium. , molybdenum, palladium and other metals. Further, from the viewpoint of further improving the bonding strength between the solder and the electrode, the solder in the conductive particles preferably contains nickel, copper, ruthenium, aluminum or zinc. From the viewpoint of further increasing the bonding strength between the solder and the electrode in the solder portion or the conductive particles, it is preferable that the content of the metal for improving the bonding strength is 100% by weight of the solder in the conductive particles. 0.0001% by weight or more, and preferably 1% by weight or less. The melting point of the second conductive portion is preferably higher than the melting point of the solder portion. The melting point of the second conductive portion is preferably more than 160 ° C, more preferably more than 300 ° C, still more preferably more than 400 ° C, more preferably more than 450 ° C, more preferably more than 500 ° C, and most preferably more than 600 ° C . The solder portion is melted at the time of conductive connection because of a low melting point. Preferably, the second conductive portion does not melt when electrically connected. The conductive particles are preferably used by melting solder, and it is preferable to use the solder portion by melting. It is preferable to use the solder portion while melting the second conductive portion without melting the solder portion. When the melting point of the second conductive portion is higher than the melting point of the solder portion, the solder portion can be melted without melting the second conductive portion during the conductive connection. The absolute value of the difference between the melting point of the solder portion and the melting point of the second conductive portion exceeds 0 ° C, preferably 5 ° C or higher, more preferably 10 ° C or higher, further preferably 30 ° C or higher, and particularly preferably 50 ° C or higher. The best is above 100 °C. The second conductive portion preferably contains a metal. The metal constituting the second conductive portion is not particularly limited. Examples of the metal include gold, silver, copper, platinum, palladium, zinc, lead, aluminum, cobalt, indium, nickel, chromium, titanium, ruthenium, osmium, iridium, and cadmium, and the like. Further, as the above metal, tin-doped indium oxide (ITO) can be used. The above metals may be used alone or in combination of two or more. The second conductive portion is preferably a nickel layer, a palladium layer, a copper layer or a gold layer, more preferably a nickel layer or a gold layer, and further preferably a copper layer. The conductive particles preferably have a nickel layer, a palladium layer, a copper layer or a gold layer, more preferably have a nickel layer or a gold layer, and further preferably have a copper layer. By using the conductive particles having the preferred conductive portions for the connection between the electrodes, the connection resistance between the electrodes is further lowered. Further, the solder portion can be formed more easily on the surface of the preferred conductive portions. The thickness of the solder portion is preferably 0.005 μm or more, more preferably 0.01 μm or more, and is preferably 10 μm or less, more preferably 1 μm or less, still more preferably 0.3 μm or less. When the thickness of the solder portion is not less than the above lower limit and not more than the above upper limit, sufficient conductivity can be obtained, and the conductive particles are not excessively hard, and the conductive particles are sufficiently deformed at the time of connection between the electrodes. The average particle diameter of the conductive particles is preferably 0.5 μm or more, more preferably 1 μm or more, still more preferably 3 μm or more, and is preferably 100 μm or less, more preferably 50 μm or less, and still more preferably 40. Below μm, it is preferably 30 μm or less. When the average particle diameter of the conductive particles is not less than the above lower limit and not more than the above upper limit, the solder in the conductive particles can be more efficiently disposed on the electrode, and the solder in the conductive particles can be easily disposed between the electrodes. The conduction reliability is further improved. The "average particle diameter" of the above conductive particles means a number average particle diameter. The average particle diameter of the conductive particles can be determined, for example, by observing an arbitrary 50 conductive particles by an electron microscope or an optical microscope and calculating an average value. The shape of the conductive particles is not particularly limited. The shape of the conductive particles may be spherical or may be a shape other than a spherical shape such as a flat shape. The content of the conductive particles in 100% by weight of the conductive material is preferably 1% by weight or more, more preferably 2% by weight or more, still more preferably 10% by weight or more, and particularly preferably 20% by weight or more. 30% by weight or more, and preferably 80% by weight or less, more preferably 60% by weight or less, still more preferably 50% by weight or less. When the content of the conductive particles is not less than the above lower limit and not more than the above upper limit, the solder in the conductive particles can be more efficiently disposed on the electrode, and the solder in the conductive particles can be easily disposed between the electrodes, and the reliability is improved. Further improve. From the viewpoint of further improving the conduction reliability, the content of the above conductive particles is preferably large. (thermosetting compound) The above thermosetting compound is a compound which can be hardened by heating. Examples of the thermosetting compound include an oxetane compound, an epoxy compound, an episulfide compound, a (meth)acrylic compound, a phenol compound, an amine compound, an unsaturated polyester compound, and a polyaminocarboxylic acid. An ester compound, a polyoxymethylene compound, a polyimine compound, or the like. From the viewpoint of further improving the curing property and viscosity of the conductive material and further improving the connection reliability, an epoxy compound or an episulfide compound is preferred, and an epoxy compound is more preferred. The above conductive material preferably contains an epoxy compound. These thermosetting compounds may be used alone or in combination of two or more. An aromatic epoxy compound is mentioned as said epoxy compound. A crystalline epoxy compound such as a resorcinol type epoxy compound, a naphthalene type epoxy compound, a biphenyl type epoxy compound, and a benzophenone type epoxy compound is preferable. It is preferably an epoxy compound which is solid at normal temperature (23 ° C) and has a melting temperature below the melting point of the solder. The melting temperature is preferably 100 ° C or lower, more preferably 80 ° C or lower, and is preferably 40 ° C or higher. By using the above-mentioned preferred epoxy compound, the viscosity is high at the stage of bonding the member to be joined, and when the acceleration is applied by the impact of the conveyance or the like, the first connection member and the second connection member can be suppressed. The misalignment and the viscosity of the conductive material can be greatly reduced by the heat during hardening, so that the agglomeration of the solder can be efficiently performed. In view of suppressing the generation of black soot, the conductive material preferably contains a thermosetting compound having a hetero-cyanuric acid skeleton as the thermosetting component and the thermosetting compound. The thermosetting compound having an isomeric cyanuric acid skeleton preferably has an epoxy group or an episulfide group, and preferably has a different viewpoint from the viewpoint of improving the hardenability of the conductive material and improving the connection reliability. An epoxy compound of a cyanuric acid skeleton or an episulfide compound having a hetero-cyanuric acid skeleton. It is especially preferred to be an epoxy compound having a hetero-cyanuric acid skeleton. The above conductive material may also contain a thermosetting compound which does not have a hetero-cyanuric acid skeleton. Examples of the thermosetting compound having an isomeric cyanuric acid skeleton include threeExamples of the triglycidyl ether include the TEPIC series (TEPIC-G, TEPIC-S, TEPIC-SS, TEPIC-HP, TEPIC-L, TEPIC-PAS, TEPIC-VL, TEPIC-UC) manufactured by Nissan Chemical Industries, Ltd., etc. . The above episulfide compound having an isomeric cyanuric acid skeleton can be obtained, for example, by converting an epoxy group of an epoxy compound having an isomeric cyanuric acid skeleton into an ethylenethio group. This method of transformation is well known. The molecular weight of the thermosetting compound having an isomeric cyanuric acid skeleton is preferably 200 or more, more preferably 300 or more, and is preferably 1,000 or less, more preferably 600, from the viewpoint of further suppressing the generation of black soot. the following. From the viewpoint of improving the hardenability of the conductive material and improving the connection reliability, the conductive material preferably contains the above-mentioned thermosetting compound having a hetero-cyanuric acid skeleton and contains a thermosetting having no hetero-cyanuric acid skeleton. The compound is the thermosetting component and the thermosetting compound. The thermosetting compound having no isomeric cyanuric acid skeleton preferably has an aromatic skeleton or an alicyclic skeleton from the viewpoint of improving the hardenability of the conductive material and the heat resistance of the cured product and improving the connection reliability. A thermosetting compound which does not have an iso-cyanuric skeleton and has an aromatic skeleton or an alicyclic skeleton is preferred. The content of the entire thermosetting compound in 100% by weight of the conductive material is preferably 20% by weight or more, more preferably 40% by weight or more, still more preferably 50% by weight or more, and preferably 99% by weight or less. More preferably, it is 98% by weight or less, further preferably 90% by weight or less, and particularly preferably 80% by weight or less. When the content of the thermosetting compound is not less than the above lower limit and not more than the above upper limit, the solder in the conductive particles can be more efficiently disposed on the electrode, and the displacement between the electrodes can be further suppressed, thereby further improving the conduction between the electrodes. Sex. From the viewpoint of further improving the impact resistance, it is preferred that the content of the above thermosetting compound is large. The content of the epoxy compound is preferably 10% by weight or more, and more preferably 15% by weight, based on 100% by weight of the conductive material, in order to further improve the curing property and the viscosity of the conductive material. The above is preferably 50% by weight or less, more preferably 30% by weight or less. In view of further suppressing the generation of black soot, the content of the thermosetting component having the iso-cyanuric acid skeleton is preferably 5% by weight or more, more preferably 10% by weight or more, based on 100% by weight of the conductive material. And it is preferably 30% by weight or less, more preferably 20% by weight or less. In view of further suppressing the generation of black soot, the content of the thermosetting compound having an isomeric cyanuric acid skeleton is preferably 5% by weight or more, more preferably 10% by weight or more, based on 100% by weight of the conductive material. And it is preferably 30% by weight or less, more preferably 20% by weight or less. The content of the thermosetting compound having no isomeric cyanuric acid skeleton is preferably 1% by weight or more, and more preferably 100% by weight of the conductive material, in terms of improving the curing property of the conductive material and improving the connection reliability. It is preferably 2% by weight or more, and preferably 20% by weight or less, more preferably 15% by weight or less. The weight ratio of the content of the compound having an iso-cyanuric acid skeleton to the content of the flux (the content of the compound having an iso-cyanuric acid skeleton/flux) from the viewpoint of further suppressing the generation of black soot The content is preferably 0.5 or more, more preferably 3 or more, and is preferably 20 or less, more preferably 15 or less, and may be 1 or less. In the case where the flux contains a flux having a hetero-cyanuric acid skeleton, the flux content also includes a flux having a hetero-cyanuric acid skeleton. From the viewpoint of further suppressing the generation of black soot, the weight ratio of the content of the thermosetting component having the iso-cyanuric acid skeleton to the content of the flux (the thermosetting component having a hetero-cyanuric acid skeleton) The content of the content/flux is preferably 0.5 or more, more preferably 3 or more, and is preferably 20 or less, more preferably 15 or less. The weight ratio of the content of the thermosetting compound having a hetero-cyanuric acid skeleton to the content of the flux (the thermosetting compound having a hetero-cyanuric acid skeleton) in terms of further suppressing the generation of black soot The content of the content/flux is preferably 0.5 or more, more preferably 3 or more, and is preferably 20 or less, more preferably 15 or less. The weight ratio of the content of the compound having an iso-cyanuric acid skeleton to the content of the above-mentioned conductive particles (the content of the compound having an iso-cyanuric acid skeleton/conductivity) from the viewpoint of further suppressing the generation of black soot The content of the particles is preferably 0.05 or more, more preferably 0.1 or more, and is preferably 0.5 or less, more preferably 0.4 or less. From the viewpoint of further suppressing the generation of black soot, the weight ratio of the content of the thermosetting component having the iso-cyanuric acid skeleton to the content of the conductive particles (the thermosetting property of the iso-cyanuric skeleton) The content of the component/the content of the conductive particles is preferably 0.05 or more, more preferably 0.1 or more, and is preferably 0.5 or less, more preferably 0.4 or less. The weight ratio of the content of the thermosetting compound having the iso-cyanuric acid skeleton to the content of the conductive particles (the thermosetting property having a hetero-cyanuric acid skeleton) from the viewpoint of further suppressing the generation of black soot The content of the compound / the content of the conductive particles is preferably 0.05 or more, more preferably 0.1 or more, and is preferably 0.5 or less, more preferably 0.4 or less. (Hot Curing Agent) The above-mentioned thermosetting agent thermally hardens the above-mentioned thermosetting compound. Examples of the thermosetting agent include an imidazole curing agent, a phenol curing agent, a thiol curing agent, an amine curing agent, an acid anhydride curing agent, a thermal cation initiator (thermal cation curing agent), and a thermal radical generating agent. These thermosetting agents may be used alone or in combination of two or more. From the viewpoint of further suppressing the generation of black soot, a thermal hardener or a thiol hardener having a hetero-cyanuric acid skeleton is preferred. From the viewpoint of further suppressing the generation of black soot, a thermosetting agent having an iso-cyanuric acid skeleton is preferred, and a mercaptan curing agent is preferred. The above conductive material may also contain a thermal hardener which does not have a hetero-cyanuric acid skeleton. The imidazole curing agent is not particularly limited, and examples thereof include 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, and trimellitic acid 1-cyanide. Ethyl-2-phenylimidazolium salt, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-all threeAnd 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-all threeAn isocyanuric acid addition product or the like. The thiol curing agent is not particularly limited, and examples thereof include trimethylolpropane tris(3-mercaptopropionate), pentaerythritol tetrakis(3-mercaptopropionate), and dipentaerythritol hexa(3-mercaptopropionic acid). Ester) and the like. The solubility parameter of the above thiol hardener is preferably 9.5 or more, and preferably 12 or less. The above solubility parameters are calculated by the Fedors method. For example, the solubility parameter of trimethylolpropane tris(3-mercaptopropionate) is 9.6, and the solubility parameter of dipentaerythritol hexa(3-mercaptopropionate) is 11.4. The amine curing agent is not particularly limited, and examples thereof include hexamethylenediamine, octanediamine, decanediamine, and 3,9-bis(3-aminopropyl)-2,4,8,10-tetraro [5.5] Undecane, bis(4-aminocyclohexyl)methane, m-phenylenediamine, and diaminodiphenylphosphonium. Examples of the above thermal cationic initiator include a lanthanide cationic curing agent.It is a cationic hardener and a lanthanide cationic hardener. The ruthenium-based cation hardener may, for example, be bis(4-tert-butylphenyl)phosphonium hexafluorophosphate. As abovea cationic hardener, exemplified by trimethyl tetrafluoroborateWait. Examples of the ruthenium-based cation hardener include tris(p-tolyl)phosphonium hexafluorophosphate. The thermal radical generating agent is not particularly limited, and examples thereof include an azo compound and an organic peroxide. Examples of the azo compound include azobisisobutyronitrile (AIBN) and the like. Examples of the organic peroxide include ditributyl peroxide and methyl ethyl ketone peroxide. Examples of the thermosetting agent having an isomeric cyanuric acid skeleton include tris[(3-mercaptopropyloxy)ethyl]isocyanurate. The reaction initiation temperature of the above-mentioned thermosetting agent is preferably 50 ° C or more, more preferably 70 ° C or more, further preferably 80 ° C or more, and preferably 250 ° C or less, more preferably 200 ° C or less, and further preferably 150 ° C or less, particularly preferably 140 ° C or less. When the reaction initiation temperature of the above-mentioned thermosetting agent is not less than the above lower limit and not more than the above upper limit, the solder is more efficiently disposed on the electrode. The reaction initiation temperature of the above-mentioned thermosetting agent is particularly preferably 80 ° C or more and 140 ° C or less. The reaction initiation temperature of the thermal curing agent is preferably higher than the melting point of the solder in the conductive particles, more preferably 5 ° C or higher, from the viewpoint of more effectively disposing the solder on the electrode. Jia is 10°C higher. The reaction initiation temperature of the above-mentioned thermosetting agent means a temperature at which an exothermic peak in DSC (differential scanning calorimetry) starts to rise. From the viewpoint of further suppressing the generation of black soot, the molecular weight of the above-mentioned thermosetting agent having an iso-cyanuric acid skeleton is preferably 200 or more, more preferably 300 or more, and is preferably 1,000 or less, more preferably 600 or less. . The content of the above-mentioned thermosetting agent is not particularly limited. The content of the above-mentioned thermosetting agent is preferably 0.01 parts by weight or more, more preferably 1 part by weight or more, and preferably 200 parts by weight or less, more preferably 100 parts by weight or less, based on 100 parts by weight of the thermosetting compound. Further, it is preferably 75 parts by weight or less. When the content of the thermosetting agent is at least the above lower limit, the conductive material is easily sufficiently cured. When the content of the thermosetting agent is at most the above upper limit, the remaining thermosetting agent that does not participate in hardening after hardening is less likely to remain, and the heat resistance of the cured product is further improved. In view of further suppressing the generation of black soot, the content of the thermosetting agent having the iso-cyanuric acid skeleton in 100% by weight of the conductive material is preferably 5% by weight or more, more preferably 10% by weight or more. It is preferably 30% by weight or less, more preferably 20% by weight or less. (Phosphoric Acid Compound) From the viewpoint of allowing the solder to be more efficiently concentrated on the electrode, it is preferred that the conductive material contains a phosphoric acid compound. These phosphoric acid compounds may be used alone or in combination of two or more. The phosphoric acid compound is preferably a phosphorous acid or a phosphite, more preferably a phosphite, and more preferably a phosphite is the following formula (11), from the viewpoint of allowing the solder to be more efficiently concentrated on the electrode. Represents the phosphite. [Chemistry 7]In the above formula (11), R is preferably an organic group having 1 or more and 15 or less carbon atoms, more preferably an organic group having 6 or more and 15 or less carbon atoms. The phosphoric acid compound preferably has one or more organic groups having 6 or more carbon atoms and 15 or less carbon atoms, more preferably one or more hydrocarbon groups having 6 or more carbon atoms and 15 or less carbon atoms, and particularly preferably one or more carbon numbers of 6 or more. An aryl group of 15 or less. The above phosphoric acid compound may have two such groups. It is preferably a phosphorous acid having at least one aryl group, more preferably a phosphorous acid having two aryl groups, and still more preferably a diphenylphosphoric acid or a dibenzylphosphoric acid. The phosphorous acid having two aryl groups may have one phenyl group, may have two phenyl groups, may have one benzyl group, or may have two benzyl groups. The pH of the aqueous solution obtained by dissolving 1 g of the above phosphoric acid compound in 10 g of water was measured. The pH of the aqueous solution is preferably 3.5 or more, more preferably 3.7 or more, still more preferably 5 or more, and preferably 6 or less. The pH of the above aqueous solution may also be 5 or less. When the pH of the aqueous solution is not less than the above lower limit and not more than the above upper limit, the solder is more efficiently concentrated on the electrode. The pH of the aqueous solution may exceed 3, may exceed 4, may exceed 5, or may be 7 or more. The pH of the aqueous solution can be measured using a pH meter ("D-72" manufactured by HORIBA) and an electrode ToupH electrode 9615-10D. The phosphite is preferably a phosphite monoester or a phosphite diester from the viewpoint of allowing the solder to be more efficiently concentrated on the electrode. The phosphoric acid compound preferably has no (meth)acrylonitrile group, and is preferably not a (meth) acrylate compound, from the viewpoint of allowing the solder to be more efficiently concentrated on the electrode. The above phosphoric acid compound may be a reactant of phosphoric acid or a phosphoric acid compound and an imidazole compound. The content of the phosphoric acid compound is preferably 0.1% by weight or more, more preferably 1% by weight, based on 100% by weight of the conductive material, in order to further improve the conduction reliability of the solder. The above is preferably 15% by weight or less, more preferably 10% by weight or less. (flux) The above conductive material contains a flux. By using a flux, the solder can be more efficiently disposed on the electrode. When the solder is subjected to the fluxing action by the flux, black soot is easily generated. However, in the present invention, since a compound having a hetero-cyanuric acid skeleton is used, generation of black soot can be suppressed. The flux is not particularly limited. As the flux, a flux which is generally used for solder bonding or the like can be used. Examples of the flux include zinc chloride, a mixture of zinc chloride and an inorganic halide, a mixture of zinc chloride and an inorganic acid, a molten salt, a phosphoric acid, a derivative of phosphoric acid, an organic halide, an anthracene, and an organic acid. And turpentine and so on. The flux may be used singly or in combination of two or more. Examples of the molten salt include ammonium chloride and the like. Examples of the organic acid include lactic acid, citric acid, stearic acid, glutamic acid, and glutaric acid. Examples of the rosin include activated rosin and non-activated rosin. The flux is preferably an organic acid or rosin having two or more carboxyl groups. The flux may be an organic acid having two or more carboxyl groups or a rosin. By using an organic acid or rosin having two or more carboxyl groups, the conduction reliability between the electrodes is further improved. The above rosin is a rosin mainly composed of rosin acid. The flux is preferably rosin, more preferably rosin acid. By using the preferred flux, the conduction reliability between the electrodes is further improved. From the viewpoint of further suppressing the generation of black soot, a flux having an iso-cyanuric skeleton is preferred. The above conductive material may also contain a flux that does not have a hetero-cyanuric acid skeleton. Examples of the flux having a hetero-cyanuric acid skeleton include a compound having a carboxyl group and a hetero-cyanuric acid skeleton. As a commercial item of the above-mentioned flux which has a hetero-cyanuric acid skeleton, CIC acid, MACIC-1 (made by Shikoku Chemical Industry Co., Ltd.), etc. are mentioned. The above conductive material may also contain a flux that does not have a hetero-cyanuric acid skeleton. The active temperature (melting point) of the flux is preferably 50 ° C or higher, more preferably 70 ° C or higher, further preferably 80 ° C or higher, and preferably 200 ° C or lower, more preferably 190 ° C or lower, and further preferably It is 160 ° C or less, more preferably 150 ° C or less, and still more preferably 140 ° C or less. When the activation temperature of the flux is not less than the above lower limit and not more than the above upper limit, the flux effect is more effectively exhibited, and the solder can be more efficiently disposed on the electrode. The active temperature (melting point) of the above flux is preferably 80 ° C or more and 190 ° C or less. The active temperature (melting point) of the above flux is particularly preferably 80 ° C or more and 140 ° C or less. Examples of the flux having a living temperature (melting point) of the flux of 80 ° C or more and 190 ° C or less include succinic acid (melting point 186 ° C), glutaric acid (melting point 96 ° C), and adipic acid (melting point 152 ° C). a dicarboxylic acid such as pimelic acid (melting point 104 ° C) or suberic acid (melting point 142 ° C); benzoic acid (melting point 122 ° C), malic acid (melting point 130 ° C), and the like. Further, the flux has a boiling point of preferably 200 ° C or lower. From the viewpoint of more efficiently disposing the solder on the electrode, the melting point of the flux is preferably higher than the melting point of the solder in the conductive particles, more preferably 5 ° C or higher, and even more preferably 10 Above °C. From the viewpoint of more efficiently disposing the solder on the electrode, the melting point of the flux is preferably higher than the reaction initiation temperature of the thermal curing agent, more preferably 5 ° C or higher, and further preferably 10 higher. Above °C. The flux may be dispersed in the conductive material or attached to the surface of the conductive particles. By the melting point of the flux being higher than the melting point of the solder, the solder can be efficiently concentrated on the electrode portion. The reason for this is that when heat is applied during bonding, if the electrode formed on the member to be connected is compared with the portion of the member to be connected around the electrode, the thermal conductivity of the electrode portion is higher than the portion of the member to be connected around the electrode. The thermal conductivity is such that the temperature of the electrode portion rises faster. At the stage of exceeding the melting point of the solder in the conductive particles, although the solder in the conductive particles is melted, since the melting point (active temperature) of the flux is not reached, the oxide film formed on the surface is not removed. In this state, since the temperature of the electrode portion first reaches the melting point (active temperature) of the flux, the oxide film on the surface of the solder in the conductive particles on the electrode is preferentially removed, or the conductivity is activated by the activated flux. The charge on the surface of the solder in the particles is neutralized, whereby the solder is wettable and diffuses onto the surface of the electrode. Thereby, the solder can be efficiently concentrated on the electrode. The above flux is preferably a flux which releases a cation by heating. By using a flux that releases cations by heating, the solder can be more efficiently disposed on the electrodes. The above-mentioned hot cation initiator can be mentioned as the flux which releases the cation by heating. From the viewpoint of further suppressing the generation of black soot, the molecular weight of the above-mentioned flux having an iso-cyanuric acid skeleton is preferably 200 or more, more preferably 300 or more, and is preferably 1,000 or less, more preferably 600 or less. The content of the flux in 100% by weight of the conductive material is preferably 0.5% by weight or more, and preferably 30% by weight or less, more preferably 25% by weight or less. When the content of the flux is not less than the above lower limit and not more than the above upper limit, it becomes more difficult to form an oxide film on the surface of the solder and the electrode, and the oxide film formed on the surface of the solder and the electrode can be more effectively removed. In view of further suppressing the generation of black soot, the content of the flux having the iso-cyanuric acid skeleton in 100% by weight of the conductive material is preferably 5% by weight or more, more preferably 10% by weight or more, and It is preferably 30% by weight or less, more preferably 20% by weight or less. (Other Ingredients) The above conductive material may optionally contain, for example, a filler, a bulking agent, a softener, a plasticizer, a polymerization catalyst, a hardening catalyst, a colorant, an antioxidant, a heat stabilizer, a light stabilizer, and an ultraviolet absorption. Various additives such as agents, lubricants, antistatic agents and flame retardants. (Manufacturing Method of Connection Structure and Connection Structure) The connection structure of the present invention includes a first connection target member having at least one first electrode on its surface, and a second connection target member having at least one second electrode on its surface, and A connection portion between the first connection target member and the second connection target member. In the connection structure of the present invention, the material of the connection portion is the above-mentioned conductive material, and the connection portion is a cured product of the above-mentioned conductive material. In the connection structure of the present invention, the first electrode and the second electrode are electrically connected by a solder portion of the connection portion. The method for manufacturing the connection structure includes the step of disposing the conductive material on a surface of a first connection member having at least one first electrode on the surface thereof by using the conductive material, and using the first electrode and the second electrode a step of disposing a second connection member having at least one second electrode on the surface of the conductive material on a surface opposite to the first connection member side; wherein the conductive material is heated to In the conductive particles, the connection portion connecting the first connection member and the second connection member is formed by the conductive material, and the first portion is formed by the solder portion of the connection portion. The step of electrically connecting the electrode to the second electrode. Preferably, the conductive material is heated to a temperature higher than a curing temperature of the thermosetting component or the thermosetting compound. In the connection structure of the present invention and the method of manufacturing the connection structure, since a specific conductive material is used, solder in the plurality of conductive particles is likely to be collected between the first electrode and the second electrode, and the solder can be soldered. Efficiently placed on the electrode (line). Further, it is difficult to arrange one of the solders in a region (interval) in which the electrodes are not formed, and the amount of solder disposed in a region where the electrodes are not formed can be extremely small. Therefore, the conduction reliability between the first electrode and the second electrode can be improved. Moreover, the electrical connection between the electrodes adjacent to each other that are not connected can be prevented, and the insulation reliability can be improved. Further, in order to efficiently dispose the solder in the plurality of conductive particles on the electrode and to minimize the amount of the solder disposed in the region where the electrode is not formed, it is preferable to use a conductive paste instead of the conductive film. The thickness of the solder portion between the electrodes is preferably 10 μm or more, more preferably 20 μm or more, and is preferably 100 μm or less, more preferably 80 μm or less. The solder wetted area on the surface of the electrode (the area where the area of the exposed electrode is 100% in contact with the solder) is preferably 50% or more, more preferably 60% or more, still more preferably 70% or more, and is preferably 100% or less. In the method of manufacturing the connection structure of the present invention, in the step of arranging the second connection member and the step of forming the connection portion, it is preferable that the second connection object is applied to the conductive material without applying pressure. In the step of arranging the second connection member and the step of forming the connection portion, the weight of the member is preferably a pressing pressure that does not apply a force exceeding the weight of the second connection member to the conductive material. In such cases, the uniformity of the amount of solder in the plurality of solder portions can be further improved. Further, the thickness of the solder portion can be more effectively increased, and the solder in the plurality of conductive particles can be easily accumulated in a large amount between the electrodes, and the solder in the plurality of conductive particles can be more efficiently disposed on the electrode (line). on. Further, it is difficult to arrange one of the plurality of conductive particles in a region (interval) in which the electrode is not formed, and the amount of the solder disposed in the conductive particles in the region where the electrode is not formed can be made smaller. Therefore, the conduction reliability between the electrodes can be further improved. Moreover, the electrical connection between the electrodes adjacent to each other that are not connected can be further prevented, and the insulation reliability can be further improved. Furthermore, in the step of arranging the second connection member and the step of forming the connection portion, if the weight of the second connection member is applied to the conductive material without applying pressure, the connection portion is disposed before the connection portion is formed. The solder in the region (interval) where the electrode is not formed is more likely to be collected between the first electrode and the second electrode, and the solder in the plurality of conductive particles can be more efficiently disposed on the electrode (wire). In the present invention, a configuration in which a conductive paste is used instead of a conductive film and a combination of weights of the second connection target member applied to the conductive paste without pressurization is used, and the present invention is obtained at a higher level. In terms of effect, it has a greater meaning. Further, in WO 2008/023452 A1, from the viewpoint of squeezing the solder powder to the surface of the electrode and moving it efficiently, it is preferable to pressurize at a specific pressure in the subsequent step, and it is described From the viewpoint of further reliably forming the solder region, the pressurizing pressure is, for example, 0 MPa or more, preferably 1 MPa or more, and further described that the pressure applied to the subsequent tape may be 0 MPa or may be configured by The weight of the component that is subsequently carried on is applied to the belt to apply a specific pressure. WO 2008/023452 A1 discloses that the pressure applied to the subsequent tape may be 0 MPa, but there is no description about the difference between the effect of applying a pressure exceeding 0 MPa and the case of setting it to 0 MPa. Further, WO2008/023452A1 does not have any knowledge about the importance of using a paste-like conductive paste instead of a film. Further, when a conductive paste is used instead of the conductive film, it is easy to adjust the thickness of the connection portion and the solder portion by the amount of the conductive paste applied. On the other hand, in the case of the conductive film, there is a problem that a conductive film of a different thickness or a conductive film of a specific thickness must be prepared in order to change or adjust the thickness of the connection portion. Further, in the case of the conductive film, compared with the conductive paste, the melt viscosity of the conductive film cannot be sufficiently lowered at the melting temperature of the solder, and the tendency of the solder to aggregate is easily hindered. Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. Fig. 1 is a cross-sectional view schematically showing a connection structure obtained by using a conductive material according to an embodiment of the present invention. The connection structure 1 shown in FIG. 1 includes a first connection object member 2, a second connection object member 3, and a connection portion 4 that connects the first connection object member 2 and the second connection object member 3. The connecting portion 4 is formed of the above-described conductive material. In the present embodiment, the conductive material contains solder particles as conductive particles. The connection portion 4 has a solder portion 4A in which a plurality of solder particles are aggregated and joined to each other, and a cured portion 4B in which a thermosetting component is thermally cured. The first connection target member 2 has a plurality of first electrodes 2a on the surface (upper surface). The second connection target member 3 has a plurality of second electrodes 3a on the front surface (lower surface). The first electrode 2a and the second electrode 3a are electrically connected by the solder portion 4A. Therefore, the first connection object member 2 and the second connection object member 3 are electrically connected by the solder portion 4A. Further, in the connection portion 4, solder is not present in a region (a portion of the cured portion 4B) different from the solder portion 4A collected between the first electrode 2a and the second electrode 3a. There is no solder separated from the solder portion 4A in a region different from the solder portion 4A (the portion of the cured portion 4B). In addition, in a small amount, solder may be present in a region (a portion of the cured portion 4B) different from the solder portion 4A collected between the first electrode 2a and the second electrode 3a. As shown in FIG. 1, in the connection structure 1, a plurality of solder particles are collected between the first electrode 2a and the second electrode 3a, and after a plurality of solder particles are melted, the melt of the solder particles is wetted and diffused on the surface of the electrode. After the curing, the solder portion 4A is formed. Therefore, the connection area between the solder portion 4A and the first electrode 2a and the solder portion 4A and the second electrode 3a is increased. In other words, by using the solder particles, the solder portion 4A and the first electrode 2a, and the solder portion 4A and the second electrode are used as compared with the case where the conductive portion of the metal such as nickel, gold or copper is used. The contact area of 3a increases. Therefore, the connection reliability and connection reliability of the connection structure 1 are improved. Furthermore, fluxes are often deactivated by heating. Further, in the connection structure 1 shown in Fig. 1, the solder portions 4A are all located in the opposing regions between the first and second electrodes 2a and 3a. In the connection structure 1X of the variation shown in FIG. 3, only the connection portion 4X is different from the connection structure 1 shown in FIG. The connecting portion 4X has a solder portion 4XA and a cured portion 4XB. As in the connection structure 1X, most of the solder portion 4XA may be located in a region where the first and second electrodes 2a and 3a face each other, and a portion of the solder portion 4XA may be opposed to the first and second electrodes 2a and 3a. The area extends laterally. A portion of the solder portion 4XA-based solder portion 4XA that protrudes laterally from the region in which the first and second electrodes 2a and 3a face each other is not solder separated from the solder portion 4XA. Further, in the present embodiment, the amount of solder separated from the solder portion may be small, but the solder separated from the solder portion may be present in the cured portion. When the amount of use of the solder particles is reduced, the connection structure 1 is easily obtained. When the amount of use of the solder particles is increased, the connection structure 1X is easily obtained. In view of further improving the conduction reliability, when the first electrode and the second electrode are opposed to each other along the laminated direction of the first electrode, the connecting portion, and the second electrode, it is preferably 50% or more (more preferably 60% or more, further preferably 70% or more, and particularly preferably 80% or more) of the area of the portion where the first electrode and the second electrode face each other. The solder portion in the above connection portion is disposed for 90% or more. Next, an example of a method of manufacturing the bonded structure 1 using the conductive material of one embodiment of the present invention will be described. First, the first connection target member 2 having the first electrode 2a on the front surface (upper surface) is prepared. Next, as shown in FIG. 2(a), a conductive material 11 containing a thermosetting component 11B and a plurality of solder particles 11A is placed on the surface of the first connection member 2 (first step). The conductive material 11 used contains a thermosetting compound and a thermosetting agent as the thermosetting component 11B. The conductive material 11 is disposed on the surface of the first connection object member 2 on which the first electrode 2a is provided. After the conductive material 11 is disposed, the solder particles 11A are disposed on both the first electrode 2a (line) and the region (interval) where the first electrode 2a is not formed. The method of disposing the conductive material 11 is not particularly limited, and examples thereof include coating by a dispenser, screen printing, and ejection by an inkjet device. Moreover, the second connection member 3 having the second electrode 3a on the front surface (lower surface) is prepared. Next, as shown in FIG. 2(b), in the electrically conductive material 11 on the surface of the first connection member 2, the second connection is placed on the surface of the electrically conductive material 11 opposite to the side of the first connection member 2; Target member 3 (second step). The second connection member 3 is placed on the surface of the conductive material 11 from the second electrode 3a side. At this time, the first electrode 2a and the second electrode 3a are opposed to each other. Next, the conductive material 11 is heated to a temperature equal to or higher than the melting point of the solder particles 11A (third step). It is preferred to heat the conductive material 11 to a temperature higher than the hardening temperature of the thermosetting component 11B (adhesive). At the time of this heating, the solder particles 11A existing in the region where the electrode is not formed are collected between the first electrode 2a and the second electrode 3a (self-aggregation effect). In the case where a conductive paste is used instead of the conductive film, the solder particles 11A are effectively collected between the first electrode 2a and the second electrode 3a. Further, the solder particles 11A are melted and joined to each other. Further, the thermosetting component 11B is thermally cured. As a result, as shown in FIG. 2( c ), the connecting portion 4 that connects the first connection target member 2 and the second connection target member 3 is formed by the conductive material 11 . The connection portion 4 is formed by the conductive material 11, and the solder portion 4A is joined by a plurality of solder particles 11A, and is thermally cured by the thermosetting component 11B to form the cured portion 4B. In the present embodiment, it is preferable that no pressurization is performed in the second step and the third step. In this case, the weight of the second connection member 3 is applied to the conductive material 11. Therefore, when the connection portion 4 is formed, the solder particles 11A are effectively collected between the first electrode 2a and the second electrode 3a. In addition, when pressurization is performed in at least one of the second step and the third step, the tendency of the solder particles to be concentrated between the first electrode and the second electrode is inhibited. Further, in the present embodiment, when the second connection member is superposed on the first connection member to which the conductive material is applied, the electrode of the first connection member and the second connection target are not applied. When the alignment of the electrodes of the member is misaligned, even when the first connection member and the second connection member are overlapped, the displacement can be corrected, and the electrode of the first connection member can be connected to the second connection. Electrode connection of the object member (automatic alignment effect). The solder is melted between the electrode of the first connection member and the electrode of the second connection member between the electrode of the first connection member and the electrode of the second connection member. When the area in contact with other components of the conductive material is minimized, the energy becomes stable, and therefore the force of the connected structure of the minimum area, that is, the aligned connection structure, acts. In this case, it is preferable that the conductive material is not cured, and the viscosity of the components other than the conductive particles of the conductive material is sufficiently low under the conditions of the temperature and time. Thus, the connection structure 1 shown in Fig. 1 is obtained. Furthermore, the second step and the third step described above can be continuously performed. Further, after the second step, the obtained first connection member 2 and the laminated body of the conductive material 11 and the second connection member 3 may be moved to the heating unit, and the third step may be performed. In order to perform the above heating, the laminated body may be disposed on the heating member, or the laminated body may be disposed in the heated space. The heating temperature in the third step is preferably 140 ° C or higher, more preferably 160 ° C or higher, and is preferably 450 ° C or lower, more preferably 250 ° C or lower, and still more preferably 200 ° C or lower. The heating method in the third step may be a method of heating the entire connection structure to a temperature equal to or higher than the melting point of the solder and a curing temperature of the thermosetting component by using a reflow furnace or an oven, or only connecting the connection structure. The method of locally heating to a temperature higher than a melting point of the solder and a hardening temperature of the thermosetting component. The first and second connection target members are not particularly limited. Specific examples of the first and second connection target members include electronic components such as a semiconductor wafer, a semiconductor package, an LED (Light Emitting Diode) wafer, an LED package, a capacitor, and a diode; Electronic components such as a resin film, a printed circuit board, a flexible printed circuit board, a flexible flat cable, a rigid flexible substrate, a glass substrate such as a glass substrate, and a glass substrate. The first and second connection target members are preferably electronic components. At least one of the first connection target member and the second connection target member is preferably a resin film, a flexible printed circuit board, a flexible flat cable, or a rigid flexible substrate. Preferably, the second connection member is a resin film, a flexible printed circuit board, a flexible flat cable, or a rigid flexible substrate. The resin film, the flexible printed circuit board, the flexible flat cable, and the rigid flexible substrate have high flexibility and relatively lightweight properties. When a conductive film is used for the connection of such a connection member, there is a tendency that solder is hard to be accumulated on the electrode. On the other hand, by using a conductive paste, even if a resin film, a flexible printed circuit board, a flexible flat cable, or a rigid flexible substrate is used, it is possible to sufficiently improve the conduction reliability between the electrodes by efficiently collecting the solder on the electrodes. . When a resin film, a flexible printed circuit board, a flexible flat cable, or a rigid flexible substrate is used, it is possible to more effectively obtain conduction between electrodes due to no pressurization as compared with the case of using other connection member such as a semiconductor wafer. Increased reliability. In the form of the connection target member, there are surrounding arrays, area arrays, and the like. As a feature of each member, the electrodes in the surrounding array substrate exist only in the outer peripheral portion of the substrate. The electrodes in the area array substrate exist in the plane. Examples of the electrode provided in the connection target member include metal electrodes such as a gold electrode, a nickel electrode, a tin electrode, an aluminum electrode, a copper electrode, a molybdenum electrode, a silver electrode, a SUS electrode, and a tungsten electrode. In the case where the connection target member is a flexible printed substrate, the electrode is preferably a gold electrode, a nickel electrode, a tin electrode, a silver electrode or a copper electrode. In the case where the connection target member is a glass substrate, the electrode is preferably an aluminum electrode, a copper electrode, a molybdenum electrode, a silver electrode or a tungsten electrode. Further, in the case where the electrode is an aluminum electrode, it may be an electrode formed only of aluminum, or an electrode having an aluminum layer on a surface layer of the metal oxide layer. Examples of the material of the metal oxide layer include indium oxide doped with a trivalent metal element and zinc oxide doped with a trivalent metal element. Examples of the trivalent metal element include Sn, Al, Ga, and the like. In the form of the connection target member, there are surrounding arrays, area arrays, and the like. As a feature of each member, the electrodes in the surrounding array substrate exist only in the outer peripheral portion of the substrate. The electrodes in the area array substrate exist in the plane. Hereinafter, the present invention will be specifically described by way of examples and comparative examples. The invention is not limited to the following examples. Thermosetting compound: "YL980" manufactured by Mitsubishi Chemical Corporation, "TEPIC-PAS" manufactured by Nissan Chemical Industry Co., Ltd., bisphenol A type epoxy resin, modified with epoxy compound TEPIC-PAS of iso-cyanuric acid skeleton A compound (synthetic product) obtained by converting an epoxy group of "TEPIC" manufactured by Nissan Chemical Industries Co., Ltd. into an ethylene sulfide group, and an episulfide compound having a hetero-cyanuric acid skeleton, manufactured by Nissan Chemical Industries Co., Ltd. TEPIC-VL "TEPIC-UC" manufactured by Nissan Chemical Industries Co., Ltd. Thermal hardener: "HXA3922HP" manufactured by Asahi Kasei E-MATERIALS Co., Ltd. "TEMPIC" manufactured by SC Organic Chemical Industry Co., Ltd. Hardening accelerator: Shikoku Chemical Industry Co., Ltd. "2MA-OK", imidazole hardening accelerator phosphate compound: "JP260" manufactured by Seongbuk Chemical Industry Co., Ltd., diphenyl hydrogen phosphate, (C₆ H₅ -O-)₂ P(=O)H Flux: "CIC" manufactured by Shigaki Chemical Co., Ltd. "MACIC-1" manufactured by Shikoku Chemicals Co., Ltd. Conductive particles: SnBi solder particles (average particle size 30 μm), Mitsui Manufactured by a metal company, Sn42Bi58 (Examples 1 to 11 and Comparative Example 1) (1) Preparation of anisotropic conductive paste The components shown in Tables 1 and 2 below were prepared by the amounts shown in Tables 1 and 2 below. And an anisotropic conductive paste is obtained. (2) Preparation of the first connection structure (area array substrate) As the first connection target member, the surface of the semiconductor wafer main body (size 5 × 5 mm, thickness 0.4 mm) is arranged in an area array at a pitch of 400 μm. A copper electrode of μm and a semiconductor wafer having a passivation film (polyimine, thickness 5 μm, opening diameter of electrode portion 200 μm) formed on the outermost surface. The number of copper electrodes is 100 in total of 10 × 10 for each semiconductor wafer. The surface of the epoxy glass substrate main body (size: 20 × 20 mm, thickness: 1.2 mm, material FR-4) is disposed so as to have the same pattern with respect to the electrode of the first connection member. A copper electrode, and a glass substrate having a solder resist film formed in a region where the copper electrode is not disposed. The step difference between the surface of the copper electrode and the surface of the solder resist film is 15 μm, and the solder resist film is more prominent than the copper electrode. The anisotropic conductive paste immediately after the application was applied to the upper surface of the above-mentioned epoxy glass substrate so as to have a thickness of 100 μm to form an anisotropic conductive paste layer. Next, the semiconductor wafer is surface-mounted with the electrodes facing the anisotropic conductive paste layer. The weight of the above semiconductor wafer is applied to the anisotropic conductive paste layer. The temperature of the anisotropic conductive paste layer was heated from this state to 139 ° C (the melting point of the solder) 5 seconds after the start of the temperature rise. Further, the anisotropic conductive paste layer was heated to a temperature of 160 ° C after 15 seconds from the start of the temperature rise, and the anisotropic conductive paste was cured to obtain a bonded structure. No pressure is applied during heating. (3) The second connection structure (the surrounding array substrate) was prepared as a first connection target member, and was prepared on the surface of the semiconductor wafer main body (size 5 × 5 mm, thickness 0.4 mm) at a peripheral pitch of the wafer at a pitch of 400 μm ( There are 250 μm copper electrodes arranged around, and a semiconductor wafer having a passivation film (polyimine, thickness 5 μm, opening diameter of the electrode portion 200 μm) is formed on the outermost surface. Regarding the number of copper electrodes, the total number of semiconductor wafers is 10 x 4 sides. As the second connection target member, copper is disposed on the surface of the epoxy glass substrate body (size: 20 × 20 mm, thickness: 1.2 mm, material FR-4) so as to have the same pattern with respect to the electrode of the first connection member. The step of the electrode and the surface of the copper electrode on which the solder resist film is formed in the region where the copper electrode is not disposed is 15 μm from the surface of the solder resist film, and the solder resist film is more prominent than the copper electrode. The anisotropic conductive paste immediately after the application was applied to the periphery of the upper surface of the above-mentioned epoxy glass substrate so as to have a thickness of 100 μm to form an anisotropic conductive paste layer. Next, the semiconductor wafer is surface-mounted with the electrodes facing the anisotropic conductive paste layer. The weight of the above semiconductor wafer is applied to the anisotropic conductive paste layer. The temperature of the anisotropic conductive paste layer was heated from this state to 139 ° C (the melting point of the solder) 5 seconds after the start of the temperature rise. Further, the anisotropic conductive paste layer was heated to a temperature of 160 ° C after 15 seconds from the start of the temperature rise, and the anisotropic conductive paste was cured to obtain a bonded structure. No pressure is applied during heating. (Evaluation) (1) Viscosity was measured using STRESSTECH (manufactured by EOLOGICA Co., Ltd.) under the conditions of strain control 1 rad, frequency 1 Hz, temperature increase rate 20 ° C/min, and measurement temperature range 40 to 200 ° C. The viscosity (ηmp) of the melting point of the solder in the conductive particles at °C. (2) Generation of black soot It is evaluated whether or not the black soot derived from solder is contained in the connection portion (cured portion) of the first and second connection structures obtained. The generation of black soot was determined according to the following criteria. [Criteria for judging black soot] ○○○: No black soot is produced, and there is no slight coloring. ○○: Black soot is not produced, and there is a slightly colored portion ○: A very small amount of black soot is generated (does not affect the connection resistance) Degree) △: A small amount of black soot is generated (a slight influence on the degree of connection resistance) ×: black soot is generated (very much influence on the connection resistance) (3) The arrangement accuracy of the solder on the electrode is the first and second connections obtained. In the structure, the area of the portion where the first electrode and the second electrode face each other when the first electrode and the second electrode face each other in the direction in which the first electrode, the connecting portion, and the second electrode are opposed to each other is 100. Among the %, the ratio X of the area of the solder portion in the connection portion was evaluated. The arrangement accuracy of the solder on the electrodes was determined in accordance with the following criteria. [Criteria for Judging the Arrangement Accuracy of the Solder on the Electrode] ○○○: The ratio X is 95% or more ○○: The ratio X is 90% or more and less than 95% ○: The ratio X is 80% or more and less than 90% △ : ratio X is 60% or more, less than 80% ×: ratio X is less than 60% (4) The conduction reliability between the upper and lower electrodes is in the obtained first and second connection structures (n = 15) The connection resistance between the upper and lower electrodes was measured by a four-terminal method. Calculate the average of the connection resistance. Furthermore, the connection resistance can be obtained by measuring the voltage at which a constant current flows in accordance with the relationship of voltage=current×resistance. The conduction reliability was determined according to the following criteria. [Criteria for the determination of the conduction reliability] ○○: The average value of the connection resistance is 8.0 Ω or less. ○: The average value of the connection resistance exceeds 8.0 Ω and is 10.0 Ω or less. △: The average value of the connection resistance exceeds 10.0 Ω and is 15.0 Ω or less. ×: The average value of the connection resistance exceeds 15.0 Ω. (5) The insulation reliability between the adjacent electrodes is obtained in the first and second connection structures (n = 15) at a temperature of 85 ° C and a humidity of 85%. After standing for 100 hours in the environment, a voltage of 5 V was applied between the adjacent electrodes, and the resistance value was measured at 25 locations. The insulation reliability was determined according to the following criteria. [Determination of insulation reliability] ○○: The average value of the connection resistance is 10⁷ Ω or more ○: The average value of the connection resistance is 10⁶ Ω or more and less than 10⁷ Ω △: The average value of the connection resistance is 10⁵ Ω or more and less than 10⁶ Ω ×: the average value of the connection resistance is less than 10⁵ Ω The results are shown in Tables 1 and 2 below. [Table 1] [Table 2] The same tendency can be seen in the case of using a flexible printed circuit board, a resin film, a flexible flat cable, and a rigid flexible substrate.

1‧‧‧Connection structure
1X‧‧‧Connection structure
2‧‧‧1st connection object component
2a‧‧‧1st electrode
3‧‧‧2nd connection object component
3a‧‧‧2nd electrode
4‧‧‧Connecting Department
4A‧‧‧ solder department
4B‧‧‧ Hardened Parts
4X‧‧‧Connecting Department
4XA‧‧‧ solder department
4XB‧‧‧ Hardened Parts Department
11‧‧‧Electrical materials
11A‧‧‧ solder particles (conductive particles)
11B‧‧‧ thermosetting ingredients
21‧‧‧Electrical particles (solder particles)
31‧‧‧Electrical particles
32‧‧‧Substrate particles
33‧‧‧Electrically conductive parts (with conductive parts of solder)
33A‧‧‧2nd Conductive Department
33B‧‧‧ solder department
41‧‧‧Electrical particles
42‧‧‧ solder department

Fig. 1 is a cross-sectional view schematically showing a connection structure obtained by using a conductive material according to an embodiment of the present invention. 2(a) to 2(c) are cross-sectional views for explaining respective steps of an example of a method of manufacturing a bonded structure using a conductive material according to an embodiment of the present invention. Fig. 3 is a cross-sectional view showing a variation of the connection structure. Fig. 4 is a cross-sectional view showing a first example of conductive particles which can be used for a conductive material. Fig. 5 is a cross-sectional view showing a second example of conductive particles which can be used for a conductive material. Fig. 6 is a cross-sectional view showing a third example of conductive particles which can be used for a conductive material.

no

Claims (14)

A conductive material comprising a plurality of conductive particles having a solder on a surface portion of a conductive portion, a thermosetting component, and a flux, and containing a compound having a hetero-cyanuric acid skeleton as the thermosetting component or the above In the flux, the conductive material at the melting point of the solder in the conductive particles has a viscosity of 0.1 Pa·s or more and 20 Pa·s or less. The conductive material of claim 1, wherein the weight ratio of the content of the compound having an iso-cyanuric acid skeleton to the content of the flux is 0.5 or more and 20 or less. The conductive material according to claim 1 or 2, wherein a weight ratio of the content of the compound having an iso-cyanuric acid skeleton to the content of the conductive particles is 0.05 or more and 0.5 or less. The conductive material according to claim 1 or 2, wherein the compound having the isomeric cyanuric acid skeleton has a molecular weight of 200 or more and 1,000 or less. The conductive material according to claim 1 or 2, which contains a thermosetting compound having a hetero-cyanuric acid skeleton or a thermosetting agent having a hetero-cyanuric acid skeleton as the above-mentioned thermosetting component. The electrically conductive material of claim 5, which contains a thermosetting compound having a hetero-cyanuric acid skeleton as the above thermosetting component. The conductive material according to claim 1 or 2, which contains a thermosetting compound having no iso-cyanuric acid skeleton as the above-mentioned thermosetting component. The electrically conductive material of claim 7, which comprises a thermosetting compound having a hetero-cyanuric acid skeleton and the above-mentioned thermosetting compound having no isomeric cyanuric acid skeleton as the thermosetting component. The electrically conductive material according to claim 7, wherein the thermosetting compound having no isomeric cyanuric acid skeleton is a thermosetting compound having no hetero-cyanuric acid skeleton and having an aromatic skeleton or an alicyclic skeleton. A conductive material according to claim 1 or 2 which contains a phosphoric acid compound. The conductive material of claim 1 or 2, wherein the conductive particles are solder particles. A conductive material according to claim 1 or 2 which is liquid at 25 ° C and is a conductive paste. A connection structure comprising: a first connection target member having at least one first electrode on its surface; a second connection target member having at least one second electrode on its surface; and the first connection target member and the second connection a connecting portion to which the target member is connected, wherein the connecting portion is a cured material of the conductive material according to any one of claims 1 to 12, wherein the first electrode and the second electrode are electrically connected by a solder portion of the connecting portion . The connection structure of claim 13, wherein the first electrode and the second electrode are opposed to each other along a direction of lamination of the first electrode, the connection portion, and the second electrode, and the first The solder portion in the connection portion is disposed at 50% or more of the area of the portion where the electrode and the second electrode face each other.