TW201703888A - Automation system for washing a plate member - Google Patents
Automation system for washing a plate member Download PDFInfo
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- TW201703888A TW201703888A TW104140900A TW104140900A TW201703888A TW 201703888 A TW201703888 A TW 201703888A TW 104140900 A TW104140900 A TW 104140900A TW 104140900 A TW104140900 A TW 104140900A TW 201703888 A TW201703888 A TW 201703888A
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- partition wall
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- flow channel
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- 238000005406 washing Methods 0.000 title 1
- 238000005192 partition Methods 0.000 claims description 177
- 238000004140 cleaning Methods 0.000 claims description 83
- 239000007788 liquid Substances 0.000 claims description 72
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 25
- 230000007246 mechanism Effects 0.000 claims description 19
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 12
- 230000003749 cleanliness Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000002245 particle Substances 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000011017 operating method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
- Casting Support Devices, Ladles, And Melt Control Thereby (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Clamps And Clips (AREA)
Abstract
Description
本發明關於一種自動化系統，尤指一種用來清洗一平板構件之自動化系統。The present invention relates to an automated system, and more particularly to an automated system for cleaning a flat member.
近來，玻璃基材大量地使用在不同的產品上，尤其是顯示器面板，因此各製造廠商紛紛引進不同的自動化流程以及自動化設備以提升產能，藉此應付日益增加的需求量，如何提供一種可提高玻璃基材之生產效率的自動化系統便成為業界努力的課題之一。Recently, glass substrates have been used in a large number of different products, especially display panels, so manufacturers have introduced different automation processes and automation equipment to increase production capacity to cope with increasing demand and how to provide an improvement. The automation system for the production efficiency of glass substrates has become one of the topics of the industry's efforts.
因此，為解決上述問題，本發明提供一種用來清洗一平板構件之自動化系統，使得整體作業程序更加精簡，且使得生產線上整體作業空間更為有效地利用，藉此以提升生產效率。Therefore, in order to solve the above problems, the present invention provides an automated system for cleaning a flat member, which makes the overall operating procedure more streamlined and enables more efficient use of the overall working space on the production line, thereby improving production efficiency.
為達成上述目的，本發明揭露一種用來清洗一平板構件之自動化系統，其包含有一底座、一槽體、一卡匣結構以及一移載機構，該槽體設置於該底座上，其內至少區隔有一第一槽室及一第二槽室，該卡匣結構選擇性地設置於該第一槽室或該第二槽室內，用以承載該平板構件，該移載機構包含有一第一軌道以及一第一驅動裝置，該第一軌道設置於該底座上，該第一軌道具有一第一軸向，該第一驅動裝置包含有一第一基座以及一第一驅動件，該第一基座可滑動地設置於該第一軌道上，該第一基座能沿平行於該第一軸向之一第一方向由對應該第一槽室之一第一槽位移動至對應該第二槽室之一第二槽位或沿相反於該第一方向之一第二方向由該第二槽位移動至該第一槽位，該第一基座具有一第二軸向，該第一驅動件可伸縮地安裝於該第一基座上且固持於該卡匣結構，當該第一驅動件沿平行於該第二軸向之一伸出方向伸出於該第一基座時，該第一驅動件驅動該卡匣結構離開該第一槽室或該第二槽室，當該第一驅動件沿相反於該伸出方向之一縮回方向縮回於該第一基座時，該第一驅動件驅動該卡匣結構進入該第一槽室或該第二槽室。In order to achieve the above object, the present invention discloses an automated system for cleaning a flat member, which comprises a base, a trough body, a cassette structure and a transfer mechanism, the trough body being disposed on the base, at least Separating a first trough chamber and a second trough chamber, the latching structure is selectively disposed in the first trough chamber or the second trough chamber for carrying the flat plate member, the transfer mechanism includes a first And a first driving device, the first rail is disposed on the base, the first rail has a first axial direction, and the first driving device comprises a first base and a first driving component, the first The base is slidably disposed on the first rail, and the first base is movable in a first direction parallel to the first axial direction by a first slot corresponding to one of the first slots to correspond to a second slot of one of the two slots is moved from the second slot to the first slot in a second direction opposite to the first direction, the first base having a second axial direction, the first a driving member is telescopically mounted on the first base and held on the card a structure, when the first driving member protrudes from the first base in a direction parallel to one of the second axial directions, the first driving member drives the latch structure away from the first slot chamber or the second a first driving member driving the cassette structure into the first chamber or the first driving member when the first driving member is retracted to the first base in a retracting direction opposite to the protruding direction Two trough chamber.
根據本發明其中之一實施例，該移載機構另包含有一第二軌道以及一第二驅動裝置，該第二軌道設置於該底座上且與該第一軌道平行，該第二驅動裝置包含有一第二基座以及一第二驅動件，該第二基座可滑動地設置於該第二軌道上，該第二基座能與該第一基座同動而沿該第一方向由該第一槽位移動至該第二槽位或沿該第二方向由該第二槽位移動至該第一槽位，該第二驅動件可伸縮地安裝於該第二基座上且固持於該卡匣結構，該第二驅動件能與該第一驅動件同動而沿該伸出方向伸出於該第二基座，以驅動該卡匣結構離開該第一槽室或該第二槽室，或沿該縮回方向縮回於該第二基座，以驅動該卡匣結構進入該第一槽室或該第二槽室。According to one embodiment of the present invention, the transfer mechanism further includes a second track and a second drive device. The second track is disposed on the base and parallel to the first track. The second drive device includes a second drive device. a second base and a second driving member, the second base is slidably disposed on the second rail, and the second base can be moved in the first direction by the first base Moving a slot to the second slot or moving from the second slot to the first slot in the second direction, the second driving member is telescopically mounted on the second base and held by the slot a latching structure, the second driving member can be coupled to the first driving member and protrudes from the second base in the extending direction to drive the latching structure away from the first slot chamber or the second slot The chamber is retracted to the second base in the retracting direction to drive the cassette structure into the first or second chamber.
根據本發明其中之一實施例，該第一驅動裝置與該第二驅動裝置分別為一氣壓缸機構，該第一基座與該第二基座分別為一氣壓缸座，且該第一驅動件與該第二驅動件分別為一氣壓頂桿。According to one embodiment of the present invention, the first driving device and the second driving device are respectively a pneumatic cylinder mechanism, and the first base and the second base are respectively a pneumatic cylinder seat, and the first driving The piece and the second driving member are respectively a gas pressure ejector.
根據本發明其中之一實施例，該第一驅動裝置為一氣壓缸機構，該第一基座為一氣壓缸座，且該第一驅動件為一氣壓頂桿。According to one embodiment of the present invention, the first driving device is a pneumatic cylinder mechanism, the first base is a pneumatic cylinder block, and the first driving member is a pneumatic ram.
根據本發明其中之一實施例，該第一軸向實質上垂直於該第二軸向。According to one embodiment of the invention, the first axial direction is substantially perpendicular to the second axial direction.
根據本發明其中之一實施例，該槽體包含有一底壁、一第一側壁、一第二側壁、一第一間隔壁、一第二間隔壁以及一第一流道側壁，該底壁設置於該底座上，該第一側壁連接於該底壁之一第一側，該第一側壁形成有一入水孔，該第二側壁連接於該底壁相對於該第一側之一第二側，該第一間隔壁設置於該第一側壁與該第二側壁之間，該第一間隔壁與該第一側壁間定義該第一槽室，該第一間隔壁具有一第一間隔壁上端及一第一間隔壁下端，該第一間隔壁下端連接於該底壁，該第一間隔壁上端與該底壁間定義一第一壁高，該第二間隔壁設置於該第一間隔壁與該第二側壁之間，該第二間隔壁具有一第二間隔壁上端及一第二間隔壁下端，該第二間隔壁下端連接於該底壁，該第二間隔壁上端與該底壁間定義一第二壁高，該第一流道側壁設置於該第一間隔壁與該第二間隔壁之間，該第一流道側壁與該第一間隔壁間定義一第一流道，該第一流道側壁與該第二間隔壁間定義該第二槽室，該第一流道側壁具有一第一流道側壁上端及一第一流道側壁下端，該第一流道側壁上端與該第一間隔壁上端間定義一第一流道入口，該第一流道側壁下端與該底壁間具有一第一間隙，使該第一流道連通於該第二槽室，其中一清洗液經由該入水孔注入該第一槽室，該第一壁高大於該第二壁高，經由該入水孔注入該第一槽室之該清洗液經由該第一間隔壁上端進入該第一流道入口，並經由該第一間隙進入該第二槽室。According to one embodiment of the present invention, the tank body includes a bottom wall, a first side wall, a second side wall, a first partition wall, a second partition wall, and a first flow channel side wall. The first side wall is connected to a first side of the bottom wall, the first side wall is formed with a water inlet hole, and the second side wall is connected to the second side of the bottom wall relative to the first side, The first partition wall is disposed between the first side wall and the second side wall, and the first partition wall defines the first groove chamber, the first partition wall has a first partition wall upper end and a first partition wall a lower end of the first partition wall, the lower end of the first partition wall is connected to the bottom wall, a first wall height is defined between the upper end of the first partition wall and the bottom wall, and the second partition wall is disposed on the first partition wall Between the second side walls, the second partition wall has a second partition wall upper end and a second partition wall lower end, the second partition wall lower end is connected to the bottom wall, and the second partition wall upper end is defined between the bottom wall and the bottom wall a second wall is high, the first flow channel sidewall is disposed on the first partition wall and the Between the two partition walls, a first flow passage is defined between the first flow passage sidewall and the first partition wall, and the second flow chamber defines a second groove chamber between the first flow passage sidewall and the second partition wall, and the first flow passage sidewall has a An upper end of the first flow channel sidewall and a lower end of the first flow channel sidewall define a first flow channel inlet between the upper end of the first flow channel sidewall and the upper end of the first partition wall, and a first gap between the lower end of the first flow channel sidewall and the bottom wall The first flow channel is connected to the second groove chamber, wherein a cleaning liquid is injected into the first groove chamber through the water inlet hole, the first wall height is higher than the second wall height, and the first groove is injected through the water inlet hole The cleaning liquid of the chamber enters the first flow path inlet through the upper end of the first partition wall, and enters the second groove chamber via the first gap.
根據本發明其中之一實施例，該槽體另包含有一第一分流板，設置於該第一流道側壁下端與該第一間隔壁下端之間，該第一分流板上形成有複數個第一分流孔洞，由該入水孔注入之該清洗液經由該複數個第一分流孔洞進入該第一間隙。According to one embodiment of the present invention, the tank body further includes a first diverter plate disposed between the lower end of the first flow channel side wall and the lower end of the first partition wall, and the first diverter plate is formed with a plurality of first The diversion hole, the cleaning liquid injected from the water inlet hole enters the first gap through the plurality of first diversion holes.
根據本發明其中之一實施例，該第一分流板斜接於該第一間隔壁與該第一流道側壁。According to one embodiment of the present invention, the first splitter plate is obliquely connected to the first partition wall and the first flow channel side wall.
根據本發明其中之一實施例，該第一流道側壁上端與該底壁間定義一第一板高，該第一板高大於該第二壁高。According to one embodiment of the present invention, a first plate height is defined between an upper end of the first flow channel sidewall and the bottom wall, and the first plate height is greater than the second wall height.
根據本發明其中之一實施例，該第一板高小於該第一壁高。According to one embodiment of the invention, the first panel height is less than the first wall height.
根據本發明其中之一實施例，該第一間隔壁上端及該第二間隔壁上端分別形成有一波浪結構。According to one embodiment of the present invention, the upper end of the first partition wall and the upper end of the second partition wall are respectively formed with a wave structure.
根據本發明其中之一實施例，該槽體內另區隔有一第三槽室及一第四槽室，該卡匣結構選擇性地設置於該第一槽室、該第二槽室、該第三槽室或該第四槽室內，該第一基座於對應該第一槽室之該第一槽位、對應該第二槽室之該第二槽位、對應該第三槽室之一第三槽位以及對應該第四槽室之一第四槽位間移動，該第二基座於對應該第一槽位之該第一位置、對應該第二槽位之該第二位置、對應該第三槽位之一第三位置及對應該第四槽位之一第四位置間與該第一基座同動，且該槽體另包含有一第三間隔壁、一第二流道側壁以及一第三流道側壁，該第三間隔壁設置於該第二間隔壁與該第二側壁之間，該第三間隔壁具有一第三間隔壁上端及一第三間隔壁下端，該第三間隔壁下端連接該底壁，該第三間隔壁上端與該底壁間定義一第三壁高，該第二流道側壁設置於該第三間隔壁與第二間隔壁之間，該第二流道側壁與該第二間隔壁間定義一第二流道，該第二流道側壁與該第三間隔壁間定義該第三槽室，該第二流道側壁具有一第二流道側壁上端及一第二流道側壁下端，該第二流道側壁上端與該第二間隔壁上端間定義一第二流道入口，該第二流道側壁下端與該底壁間具有一第二間隙，使該第二流道連通於該第三槽室，該第三流道側壁設置於該第三間隔壁與該第二側壁之間，該第三流道側壁與該第三間隔壁間定義一第三流道，該第三流道側壁與該第二側壁間定義該第四槽室，該第三流道側壁具有一第三流道側壁上端及一第三流道側壁下端，該第三流道側壁上端與該第三間隔壁上端間定義一第三流道入口，該第三流道側壁下端與該底壁間具有一第三間隙，使該第三流道連通於該第四槽室，其中，該第二壁高大於該第三壁高，經由該第一間隙進入該第二槽室之該清洗液經由該第二間隔壁上端進入該第二流道入口，並經由該第二間隙進入該第三槽室，且經由該第二間隙進入該第三槽室之該清洗液經由該第三間隔壁上端進入該第三流道入口，並經由該第三間隙進入該第四槽室。According to one embodiment of the present invention, the tank body is further provided with a third tank chamber and a fourth tank chamber, and the latching structure is selectively disposed in the first tank chamber, the second tank chamber, and the first In the three-slot chamber or the fourth chamber, the first base corresponds to the first slot of the first slot, the second slot corresponding to the second slot, and one of the third slots Moving between the third slot and the fourth slot corresponding to one of the fourth slots, the second base being in the first position corresponding to the first slot, corresponding to the second position of the second slot, Corresponding to the third position corresponding to one of the third position of the third slot and the fourth position corresponding to the fourth slot, the slot further includes a third partition wall and a second flow path a third partition wall disposed between the second partition wall and the second side wall, the third partition wall having a third partition wall upper end and a third partition wall lower end, the third partition wall The lower end of the third partition wall is connected to the bottom wall, and a third wall height is defined between the upper end of the third partition wall and the bottom wall, and the second flow channel sidewall is disposed Between the third partition wall and the second partition wall, a second flow passage is defined between the second flow passage sidewall and the second partition wall, and the third flow passage sidewall defines the third space between the second partition wall and the third partition wall The second flow channel side wall has a second flow channel sidewall upper end and a second flow channel sidewall lower end, and a second flow channel inlet is defined between the upper end of the second flow channel sidewall and the upper end of the second barrier wall. a second gap is formed between the lower end of the sidewall of the second flow channel and the bottom wall, so that the second flow channel communicates with the third groove chamber, and the third flow channel sidewall is disposed on the third partition wall and the second sidewall a third flow path is defined between the third flow channel sidewall and the third partition wall, and the fourth flow channel defines a fourth groove chamber between the third flow channel sidewall and the second sidewall The upper end of the side wall of the third flow channel and the lower end of the side wall of the third flow channel define a third flow path inlet between the upper end of the side wall of the third flow path and the upper end of the third partition wall, and the lower end of the side wall of the third flow path and the bottom wall a third gap, the third flow channel is connected to the fourth groove chamber, wherein the second wall height is greater than the The three walls are high, and the cleaning liquid entering the second chamber through the first gap enters the second channel inlet via the upper end of the second partition wall, and enters the third chamber through the second gap, and The cleaning fluid entering the third chamber through the second gap enters the third channel inlet via the upper end of the third partition wall, and enters the fourth chamber through the third gap.
根據本發明其中之一實施例，該槽體另包含有一第一分流板、一第二分流板以及一第三分流板，該第一分流板設置於該第一流道側壁下端與該第一間隔壁下端之間，該第一分流板上形成有複數個第一分流孔洞，由該入水孔注入之該清洗液經由該複數個第一分流孔洞進入該第一間隙，該第二分流板，設置於該第二流道側壁下端與該第二間隔壁下端之間，該第二分流板上形成有複數個第二分流孔洞，進入該第二槽室之該清洗液經由該複數個第二分流孔洞進入該第二間隙，該第三分流板，設置於該第三流道側壁下端與該第三間隔壁下端之間，該第三分流板上形成有複數個第三分流孔洞，進入該第三槽室之該清洗液經由該複數個第三分流孔洞進入該第三間隙。According to one embodiment of the present invention, the tank body further includes a first splitter plate, a second splitter plate and a third splitter plate. The first splitter plate is disposed at a lower end of the first flow channel side wall and the first space. Between the lower ends of the partition walls, the first diverter plate is formed with a plurality of first diversion holes, and the cleaning liquid injected from the water inlet holes enters the first gap through the plurality of first diversion holes, and the second diverter plate is disposed Between the lower end of the sidewall of the second flow channel and the lower end of the second partition wall, a plurality of second shunt holes are formed on the second shunt plate, and the cleaning liquid entering the second trough chamber passes through the plurality of second shunts The hole enters the second gap, and the third splitter plate is disposed between the lower end of the third flow path sidewall and the lower end of the third partition wall, and the third splitter plate is formed with a plurality of third split holes, and enters the first The cleaning liquid of the three-slot chamber enters the third gap through the plurality of third diversion holes.
根據本發明其中之一實施例，該第一分流板斜接於該第一間隔壁與該第一流道側壁，該第二分流板斜接於該第二間隔壁與該第二流道側壁，且該第三分流板斜接於該第三間隔壁與該第三流道側壁。According to one embodiment of the present invention, the first splitter plate is obliquely connected to the first partition wall and the first flow channel sidewall, and the second splitter plate is obliquely connected to the second partition wall and the second flow channel sidewall. And the third splitter plate is obliquely connected to the third partition wall and the third flow channel sidewall.
根據本發明其中之一實施例，該第一流道側壁上端與該底壁間定義一第一板高，該第二流道側壁上端與該底壁間定義一第二板高，該第三流道側壁上端與該底壁間定義一第三板高，該第一板高大於該第二壁高，該第二板高大於該第三壁高。According to one embodiment of the present invention, a first plate height is defined between an upper end of the first flow channel sidewall and the bottom wall, and a second plate height is defined between the upper end of the second flow channel sidewall and the bottom wall, the third flow A third plate height is defined between the upper end of the side wall and the bottom wall, the first plate height is greater than the second wall height, and the second plate height is greater than the third wall height.
根據本發明其中之一實施例，該第一板高小於該第一壁高，該第二板高小於該第二壁高，該第三板高小於該第三壁高。According to an embodiment of the invention, the first plate height is lower than the first wall height, the second plate height is lower than the second wall height, and the third plate height is smaller than the third wall height.
根據本發明其中之一實施例，該第二側壁形成有連通於該第四槽室之一出水孔，且流入該第四槽室之該清洗液經由該出水孔流出。According to one embodiment of the present invention, the second side wall is formed with a water outlet hole communicating with one of the fourth tank chambers, and the cleaning liquid flowing into the fourth tank chamber flows out through the water outlet hole.
根據本發明其中之一實施例，該第一間隔壁上端、該第二間隔壁上端及該第三間隔壁上端分別形成有一波浪結構。According to one embodiment of the present invention, the first partition wall upper end, the second partition wall upper end and the third partition wall upper end are respectively formed with a wave structure.
綜上所述，本發明自動化系統利用移載機構將平板構件於對應各槽室之各槽位間移動，且本發明自動化系統另利用移載機構的第一驅動件及第二驅動件驅動該卡匣結構進入或離開對應之槽室，因此本發明之自動化系統不僅使浸鍍或清洗平板構件的整體作業程序更加精簡，更使生產線上整體作業空間更為有效地利用。有關本發明之前述及其他技術內容、特點與功效，在以下配合參考圖式之實施例的詳細說明中，將可清楚的呈現。In summary, the automation system of the present invention uses a transfer mechanism to move the plate member between the slots of the corresponding slot chambers, and the automation system of the present invention further drives the first drive member and the second drive member of the transfer mechanism. The cassette structure enters or leaves the corresponding tank chamber, so the automated system of the present invention not only simplifies the overall operation of the dip-plating or cleaning plate member, but also makes the overall working space on the production line more efficient. The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the embodiments of the invention.
以下實施例中所提到的方向用語，例如：上、下、左、右、前或後等，僅是參考附加圖式的方向。因此，使用的方向用語是用來說明並非用來限制本發明。請參閱第1圖至第3圖，第1圖及第2圖為本發明實施例一自動化系統1於不同視角之外觀示意圖，第3圖為本發明實施例自動化系統1之上視圖。如第1圖至第3圖所示，自動化系統1用來清洗一平板構件2，且包含有一底座10、一槽體11、一卡匣結構12以及一移載機構13，槽體11設置於底座10上，且其內區隔有一第一槽室C1、一第二槽室C2、一第三槽室C3及一第四槽室C4，卡匣結構12可選擇性地設置於第一槽室C1、第二槽室C2、第三槽室C3或第四槽室C4內並用以承載平板構件2，移載機構13包含有一第一軌道130、一第一驅動裝置131、一第二軌道132以及一第二驅動裝置133，第一軌道130設置於底座10上且具有一第一軸向S1，第一驅動裝置131包含有一第一基座1310以及一第一驅動件1311，第一基座1310可滑動地設置於第一軌道130上，第一驅動件1311的一端固持於卡匣結構12之一側。第二軌道132設置於底座10上且與第一軌道130平行，第二驅動裝置133包含有一第二基座1330以及一第二驅動件1331，第二基座1330可滑動地設置於第二軌道132上，第二驅動件1331的一端固持於卡匣結構12之另一側。The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only directions referring to the additional drawings. Therefore, the directional terminology used is for the purpose of illustration and not limitation. Please refer to FIG. 1 to FIG. 3 . FIG. 1 and FIG. 2 are schematic diagrams showing the appearance of the automation system 1 at different viewing angles according to an embodiment of the present invention. FIG. 3 is a top view of the automation system 1 according to an embodiment of the present invention. As shown in FIG. 1 to FIG. 3, the automation system 1 is used for cleaning a flat plate member 2, and includes a base 10, a trough body 11, a cassette structure 12, and a transfer mechanism 13 disposed on the trough body 11 The base 10 has a first slot chamber C1, a second slot chamber C2, a third slot chamber C3 and a fourth slot chamber C4. The cassette structure 12 is selectively disposed in the first slot. The chamber C1, the second tank chamber C2, the third tank chamber C3 or the fourth tank chamber C4 are used to carry the plate member 2. The transfer mechanism 13 includes a first rail 130, a first driving device 131, and a second rail. 132 and a second driving device 133, the first rail 130 is disposed on the base 10 and has a first axial direction S1. The first driving device 131 includes a first base 1310 and a first driving member 1311. The seat 1310 is slidably disposed on the first rail 130, and one end of the first driving member 1311 is held on one side of the latch structure 12. The second track 132 is disposed on the base 10 and parallel to the first track 130. The second driving device 133 includes a second base 1330 and a second driving member 1331. The second base 1330 is slidably disposed on the second track. 132, one end of the second driving member 1331 is held on the other side of the cassette structure 12.
於實務上，可利用一控制晶片(未繪示於圖中)控制第一基座1310與第二基座1330同動，以使第一基座1310與第二基座1330能同時沿第一軸向S1朝一第一方向D1移動或沿第一軸向S1朝相反於第一方向D1之一第二方向D2移動。進一步地，第一驅動件1311具有一第二軸向S2，第一驅動件1311可伸縮地安裝於第一基座1310上，且第二驅動件1331可伸縮地安裝於第二基座1330上。值得注意的是，該控制晶片另可控制第一驅動件1311與第二驅動件1331同動，以使第一驅動件1311與第二驅動件1331能同時沿第二軸向S2朝一伸出方向D3而分別伸出於第一基座1310與第二基座1330或是沿第二軸向S2朝相反於伸出方向D3之一縮回方向D4而分別縮回於第一基座1310與第二基座1330。於本實施例中，第一軸向S1實質上垂直於第二軸向S2，即第一軌道130與第一基座1310互相垂直，且第二軌道132與第二基座1330互相垂直，然而本發明並不侷限於此。In practice, the first pedestal 1310 and the second pedestal 1330 can be controlled by a control chip (not shown) so that the first pedestal 1310 and the second pedestal 1330 can simultaneously follow the first The axial direction S1 moves toward a first direction D1 or moves along the first axial direction S1 in a second direction D2 opposite to the first direction D1. Further, the first driving member 1311 has a second axial direction S2, the first driving member 1311 is telescopically mounted on the first base 1310, and the second driving member 1331 is telescopically mounted on the second base 1330. . It should be noted that the control chip can also control the first driving member 1311 to be co-operating with the second driving member 1331, so that the first driving member 1311 and the second driving member 1331 can simultaneously extend in the second axial direction S2 toward a protruding direction. D3 respectively protrudes from the first base 1310 and the second base 1330 or retracts to the first base 1310 and the first base 1310 in the second axial direction S2 in a retracting direction D4 opposite to the protruding direction D3 Two pedestals 1330. In this embodiment, the first axis S1 is substantially perpendicular to the second axis S2, that is, the first track 130 and the first pedestal 1310 are perpendicular to each other, and the second track 132 and the second pedestal 1330 are perpendicular to each other. The invention is not limited to this.
請參閱第4圖至第6圖，第4圖為本發明實施例槽體11之外觀示意圖，第5圖為本發明實施例槽體11之上視圖，第6圖為本發明實施例於第5圖中槽體11沿A-A線段之剖面示意圖。如第4圖至第6圖所示，槽體11包含有一底壁110、一第一側壁111、一第二側壁112、一第一間隔壁113、一第二間隔壁114、一第一流道側壁115、一第三間隔壁116、一第二流道側壁117、一第三流道側壁118、一第一分流板119、一第二分流板120及一第三分流板121。Please refer to FIG. 4 to FIG. 6 , FIG. 4 is a schematic view showing the appearance of the tank body 11 according to the embodiment of the present invention, FIG. 5 is a top view of the tank body 11 according to the embodiment of the present invention, and FIG. 6 is an embodiment of the present invention. 5 is a schematic cross-sectional view of the trough body 11 along the AA line segment. As shown in FIG. 4 to FIG. 6, the tank body 11 includes a bottom wall 110, a first side wall 111, a second side wall 112, a first partition wall 113, a second partition wall 114, and a first flow path. The sidewall 115, a third partition 116, a second runner sidewall 117, a third runner sidewall 118, a first splitter 119, a second splitter 120, and a third splitter 121.
底壁110設置於底座10上，第一側壁111連接於底壁110之一第一側1101，第一側壁111形成有一入水孔1111，第二側壁112連接於底壁110相對於第一側1101之一第二側1102，第二側壁112形成有一出水孔1121，第一間隔壁113設置於第一側壁111與第二側壁112之間，第一間隔壁113與第一側壁111間定義第一槽室C1，一清洗液F經由入水孔1111注入第一槽室C1，第一間隔壁113具有一第一間隔壁上端1131及一第一間隔壁下端1132，第一間隔壁下端1132連接於底壁110，第一間隔壁上端1131與底壁110間定義一第一壁高H1，第二間隔壁114設置於第一間隔壁113與第二側壁112之間，第二間隔壁114具有一第二間隔壁上端1141及一第二間隔壁下端1142，第二間隔壁下端1142連接於底壁110，第二間隔壁上端1141與底壁110間定義一第二壁高H2，第一流道側壁115設置於第一間隔壁113與第二間隔壁114之間，第一流道側壁115與第一間隔壁113間定義一第一流道P1，第一流道側壁115與第二間隔壁114間定義第二槽室C2，第一流道側壁115具有一第一流道側壁上端1151及一第一流道側壁下端1152，第一流道側壁上端1151與底壁110間定義一第一板高L1，第一流道側壁上端1151與第一間隔壁上端1131間定義一第一流道入口E1，第一流道側壁下端1152與底壁110間具有一第一間隙G1，使第一流道P1連通於第二槽室C2。The bottom wall 110 is disposed on the base 10, and the first side wall 111 is connected to the first side 1101 of the bottom wall 110. The first side wall 111 is formed with a water inlet hole 1111. The second side wall 112 is connected to the bottom wall 110 relative to the first side 1101. The second side wall 112 is formed with a water outlet hole 1121. The first partition wall 113 is disposed between the first side wall 111 and the second side wall 112. The first partition wall 113 defines a first space between the first side wall 111 and the first side wall 111. The first chamber 113 has a first partition wall upper end 1131 and a first partition wall lower end 1132. The first partition wall lower end 1132 is connected to the bottom. The first partition wall 113 has a first partition wall upper end 1131 and a first partition wall lower end 1132. The wall 110 defines a first wall height H1 between the upper end 1131 of the first partition wall and the bottom wall 110. The second partition wall 114 is disposed between the first partition wall 113 and the second side wall 112. The second partition wall 114 has a first partition wall 114. The second partition wall upper end 1141 and the second partition wall lower end 1142 are connected to the bottom wall 110, and the second partition wall upper end 1141 and the bottom wall 110 define a second wall height H2, and the first flow channel side wall 115 Provided between the first partition wall 113 and the second partition wall 114, the first flow channel sidewall A first flow channel P1 is defined between the first partition wall 113 and the first partition wall 113. The first flow channel sidewall 115 defines a second groove chamber C2. The first flow channel sidewall 115 has a first flow channel sidewall upper end 1151 and a first A first channel height L1 is defined between the upper end 1151 and the bottom wall 110 of the first channel sidewall, and a first channel inlet E1 is defined between the upper end 1151 of the first channel sidewall and the upper end 1131 of the first barrier wall. The first channel is defined. A first gap G1 is defined between the lower end 1522 of the sidewall and the bottom wall 110, so that the first flow passage P1 communicates with the second chamber C2.
第三間隔壁116設置於第二間隔壁114與第二側壁112之間，第三間隔壁116具有一第三間隔壁上端1161及一第三間隔壁下端1162，第三間隔壁下端1162連接底壁110，第三間隔壁上端1161與底壁110間定義一第三壁高H3，第二流道側壁117設置於第三間隔壁116與第二間隔壁114之間，第二流道側壁117與第二間隔壁間114定義一第二流道P2，第二流道側壁117與第三間隔壁116間定義第三槽室C3，第二流道側壁117具有一第二流道側壁上端1171及一第二流道側壁下端1172，第二流道側壁上端1171與底壁110間定義一第二板高L2，第二流道側壁上端1171與第二間隔壁上端1141間定義一第二流道入口E2，第二流道側壁下端1172與底壁110間具有一第二間隙G2，使第二流道P2連通於第三槽室C3，第三流道側壁118設置於第三間隔壁116與第二側壁112之間，第三流道側壁118與第三間隔壁116間定義一第三流道P3，第三流道側壁118與第二側壁112間定義第四槽室C4，第三流道側壁18具有一第三流道側壁上端1181及一第三流道側壁下端1182，第三流道側壁上端1181與底壁110間定義一第三板高L3，第三流道側壁上端1181與第三間隔壁上端1161間定義一第三流道入口E3，第三流道側壁下端1182與底壁110間具有一第三間隙G3，使第三流道P3連通於第四槽室C4。於此實施例中，第一壁高H1大於第一板高L1，第一板高L1大於第二壁高H2，第二壁高H2大於第二板高L2，第二板高L2大於第三壁高H3，第三壁高H3大於第三板高L3，然而本發明並不侷限於此。於本實施例中，第一間隔壁上端1131、第二間隔壁上端1141及第三間隔壁上端1161可分別形成有一波浪結構122。The third partition wall 116 is disposed between the second partition wall 114 and the second side wall 112. The third partition wall 116 has a third partition wall upper end 1161 and a third partition wall lower end 1162. The third partition wall lower end 1162 is connected to the bottom. The wall 110 defines a third wall height H3 between the upper end 1161 of the third partition wall and the bottom wall 110. The second flow path sidewall 117 is disposed between the third partition wall 116 and the second partition wall 114. The second flow channel sidewall 117 A second flow path P2 is defined between the second partition wall 114, a third flow chamber C3 is defined between the second flow passage sidewall 117 and the third partition wall 116, and the second flow passage sidewall 117 has a second flow passage sidewall upper end 1171. And a second flow channel sidewall lower end 1172, a second plate height L2 is defined between the second channel sidewall upper end 1171 and the bottom wall 110, and a second flow is defined between the second channel sidewall upper end 1171 and the second barrier wall upper end 1141. The second inlet G2 has a second gap G2 between the lower end 1172 of the second flow channel and the bottom wall 110, so that the second flow passage P2 communicates with the third storage chamber C3, and the third flow passage sidewall 118 is disposed on the third partition wall 116. A third flow path P3 is defined between the third flow path sidewall 118 and the third partition wall 116. A fourth tank chamber C4 is defined between the third runner sidewall 118 and the second sidewall 112. The third runner sidewall 18 has a third runner sidewall upper end 1181 and a third runner sidewall lower end 1182. The third runner sidewall upper end 1181 is A third plate height L3 is defined between the bottom wall 110, and a third flow path inlet E3 is defined between the upper end wall 1181 of the third flow path and the upper end 1161 of the third partition wall. The lower end 1182 of the third flow path has a space between the lower end 1182 and the bottom wall 110. The third gap G3 connects the third flow path P3 to the fourth groove chamber C4. In this embodiment, the first wall height H1 is greater than the first plate height L1, the first plate height L1 is greater than the second wall height H2, the second wall height H2 is greater than the second plate height L2, and the second plate height L2 is greater than the third The wall height H3, the third wall height H3 is greater than the third plate height L3, but the present invention is not limited thereto. In this embodiment, the first partition wall upper end 1131, the second partition wall upper end 1141, and the third partition wall upper end 1161 may be respectively formed with a wave structure 122.
如第4圖至第6圖所示，清洗液F經由入水孔1111注入第一槽室C1，當清洗液F在第一槽室C1中的一液面高度大於第一壁高H1時，即清洗液F在第一槽室C1中的一液面C10高於第一間隔壁113的第一間隔壁上端1131時，清洗液F可自液面C10溢過第一間隔壁上端1131，並經由第一流道入口E1進入第一流道P1。進一步地，當清洗液F自液面C10溢過第一間隔壁上端1131時，位於第一間隔壁上端1131的波浪結構122可將清洗液F均勻溢過第一間隔壁上端1131，即清洗液F可藉由波浪結構122而沿第一間隔壁113之長度方向（即一方向X ，如第5圖所示）平均地溢出第一槽室C1，且經由第一流道入口E1進入第一流道P1。As shown in FIG. 4 to FIG. 6, the cleaning liquid F is injected into the first tank chamber C1 via the water inlet hole 1111, and when the liquid level of the cleaning liquid F in the first tank chamber C1 is greater than the first wall height H1, When the cleaning liquid F is higher than the first partition wall upper end 1131 of the first partition wall 113, the cleaning liquid F may overflow from the liquid surface C10 through the first partition wall upper end 1131, and The first flow path inlet E1 enters the first flow path P1. Further, when the cleaning liquid F overflows from the liquid surface C10 through the upper end 1131 of the first partition wall, the wave structure 122 located at the upper end 1131 of the first partition wall can uniformly overflow the cleaning liquid F through the upper end 1131 of the first partition wall, that is, the cleaning liquid F may equally overflow the first chamber C1 along the length direction of the first partition wall 113 (ie, one direction X, as shown in FIG. 5) by the wave structure 122, and enter the first flow path via the first flow passage inlet E1. P1.
同理，當清洗液F在第二槽室C2中的一液面高度大於第二壁高H2時，即清洗液F在第二槽室C2中的一液面C20高於第二間隔壁114的第二間隔壁上端1141時，清洗液F可自液面C20溢過第二間隔壁上端1141，並經由第二流道入口E2進入第二流道P2。進一步地，當清洗液F自液面C20溢過第二間隔壁上端1141時，位於第二間隔壁上端1141的波浪結構122可將清洗液F均勻溢過第二間隔壁上端1141，即清洗液F可藉由波浪結構122而沿第二間隔壁114之長度方向（即該方向X ，如第2圖所示）平均地溢出第二槽室C2，且經由第二流道入口E2進入第二流道P2。以此類推，清洗液F溢出第三槽室C3與清洗液F溢出第四槽室C4之過程與上述清洗液F溢出第一槽室C1或清洗液F溢出第二槽室C2之過程相似，於此不再贅述。Similarly, when the liquid level of the cleaning liquid F in the second tank chamber C2 is greater than the second wall height H2, that is, one liquid surface C20 of the cleaning liquid F in the second tank chamber C2 is higher than the second partition wall 114. When the second partition wall upper end 1141, the cleaning liquid F may overflow from the liquid surface C20 through the second partition wall upper end 1141 and enter the second flow passage P2 via the second flow passage inlet E2. Further, when the cleaning liquid F overflows from the liquid surface C20 through the upper end 1141 of the second partition wall, the wave structure 122 located at the upper end 1141 of the second partition wall can uniformly overflow the cleaning liquid F through the upper end 1141 of the second partition wall, that is, the cleaning liquid F may equally overflow the second chamber C2 along the length direction of the second partition wall 114 (ie, the direction X, as shown in FIG. 2) by the wave structure 122, and enter the second through the second flow passage inlet E2. Flow path P2. By analogy, the process in which the cleaning liquid F overflows the third tank chamber C3 and the cleaning liquid F overflows the fourth tank chamber C4 is similar to the process in which the cleaning liquid F overflows the first tank chamber C1 or the cleaning liquid F overflows the second tank chamber C2. This will not be repeated here.
如第6圖及第7圖所示，第一分流板119設置於第一流道側壁下端1152與第一間隔壁下端1132之間，且斜接於第一間隔壁113與第一流道側壁115，第一分流板119上形成有複數個第一分流孔洞1190，第二分流板120設置於第二流道側壁下端1172與第二間隔壁下端1142之間，且斜接於第二間隔壁114與第二流道側壁117，第二分流板120上形成有複數個第二分流孔洞1200，第三分流板121設置於第三流道側壁下端1182與第三間隔壁下端1162之間，且斜接於第三間隔壁116與第三流道側壁118，第三分流板121上形成有複數個第三分流孔洞1210。As shown in FIG. 6 and FIG. 7 , the first flow dividing plate 119 is disposed between the lower end 1152 of the first flow path sidewall and the lower end 1132 of the first partition wall, and is obliquely connected to the first partition wall 113 and the first flow channel sidewall 115 . The first splitter plate 119 is formed with a plurality of first splitting holes 1190. The second splitter plate 120 is disposed between the second flow channel sidewall lower end 1172 and the second partition wall lower end 1142, and is obliquely connected to the second partition wall 114. The second flow channel sidewall 117 has a plurality of second flow dividing holes 1200 formed on the second flow dividing plate 120. The third flow dividing plate 121 is disposed between the third flow channel sidewall lower end 1182 and the third partitioning wall lower end 1162, and is mitered. A plurality of third split holes 1210 are formed in the third partition wall 116 and the third flow path sidewall 118, and the third splitter plate 121.
當清洗液F經由第一流道入口E1進入第一流道P1時，經由第一流道入口E1進入第一流道P1的清洗液F可通過第一流道P1向下流至第一分流板119。當清洗液F向下流至第一分流板119時，清洗液F可經由第一分流板119上的第一分流孔洞1190流過第一分流板119，使清洗液F被第一分流孔洞1190分流，進而平均地經過第一間隙G1來到第二槽室C2內，藉此第一分流板119便可使清洗液F平均而穩定地流入第二槽室C2，進而使第二槽室C2內的清洗液F保持一穩定狀態。同理，當清洗液F經由第二流道入口E2進入第二流道P2時，經由第二流道入口E2進入第二流道P2的清洗液F可通過第二流道P2向下流至第二分流板120。當清洗液F向下流至第二分流板120時，清洗液F可經由第二分流板120上的第二分流孔洞1200流過第二分流板120，使清洗液F被第二分流孔洞1200分流，進而平均地經過第二間隙G2來到第三槽室C3內，藉此第二分流板20便可使清洗液F平均而穩定地流入第三槽室C3，進而使第三槽室C3內的清洗液F保持一穩定狀態。以此類推，清洗液F經過第三間隙G3來到第四槽室C4之過程與上述清洗液F經過第一間隙G1來到第二槽室C2之過程或清洗液F經過第二間隙G2來到第三槽室C3之過程相似，於此不再贅述。最後，進入第四槽室C4之清洗液F便經由出水孔1121流出。When the cleaning liquid F enters the first flow path P1 via the first flow path inlet E1, the cleaning liquid F entering the first flow path P1 via the first flow path inlet E1 may flow down to the first flow dividing plate 119 through the first flow path P1. When the cleaning liquid F flows down to the first flow dividing plate 119, the cleaning liquid F can flow through the first flow dividing hole 1190 on the first flow dividing plate 119 through the first flow dividing plate 119, so that the cleaning liquid F is shunted by the first dividing hole 1190. And passing through the first gap G1 to the second tank chamber C2 on average, whereby the first splitter plate 119 can uniformly and stably flow the cleaning liquid F into the second tank chamber C2, thereby making the second tank chamber C2 The cleaning solution F maintains a steady state. Similarly, when the cleaning liquid F enters the second flow path P2 via the second flow path inlet E2, the cleaning liquid F entering the second flow path P2 via the second flow path inlet E2 can flow down to the second flow path P2. Two shunt plates 120. When the cleaning liquid F flows down to the second diverter plate 120, the cleaning liquid F can flow through the second diverter plate 120 through the second diverting hole 1200 on the second diverter plate 120, so that the cleaning liquid F is diverted by the second diverting hole 1200. And passing through the second gap G2 evenly into the third tank chamber C3, whereby the second manifold 20 can uniformly and stably flow the cleaning liquid F into the third tank chamber C3, thereby making the third tank chamber C3 The cleaning solution F maintains a steady state. By the way, the process of the cleaning liquid F passing through the third gap G3 to the fourth tank chamber C4 and the cleaning liquid F passing through the first gap G1 to the second tank chamber C2 or the cleaning liquid F passing through the second gap G2 The process to the third tank chamber C3 is similar and will not be described again here. Finally, the cleaning liquid F entering the fourth tank chamber C4 flows out through the water outlet hole 1121.
當欲清洗平板構件2時，可將平版構件2依序放置於第四槽室C4、第三槽室C3、第二槽室C2、第一槽室C1，即將平版構件2依序經由第四槽室C4、第三槽室C3、第二槽室C2、第一槽室C1清洗，而當平板構件2依上述經由第四槽室C4、第三槽室C3、第二槽室C2、第一槽室C1的順序清洗時，平板構件2在進入各槽室之前的潔淨程度，依序是平板構件2進入第四槽室C4之前的潔淨程度小於平板構件2進入第三槽室C3之前的潔淨程度，平板構件2進入第三槽室C3之前的潔淨程度小於平板構件2進入第二槽室C2之前的潔淨程度，且平板構件2進入第二槽室C2之前的潔淨程度小於平板構件2進入第一槽室C1之前的潔淨程度。When the plate member 2 is to be cleaned, the lithographic member 2 can be sequentially placed in the fourth tank chamber C4, the third tank chamber C3, the second tank chamber C2, and the first tank chamber C1, that is, the lithographic member 2 is sequentially passed through the fourth chamber. The tank chamber C4, the third tank chamber C3, the second tank chamber C2, and the first tank chamber C1 are cleaned, and when the plate member 2 passes through the fourth tank chamber C4, the third tank chamber C3, and the second tank chamber C2, When the cleaning of a tank chamber C1 is sequential, the degree of cleanliness of the plate member 2 before entering each of the tank chambers is, in order, the degree of cleanliness before the sheet member 2 enters the fourth tank chamber C4 is less than before the sheet member 2 enters the third tank chamber C3. The degree of cleanliness, the degree of cleanliness of the plate member 2 before entering the third groove chamber C3 is less than the degree of cleanliness before the plate member 2 enters the second groove chamber C2, and the degree of cleanliness before the plate member 2 enters the second groove chamber C2 is less than that of the plate member 2 The degree of cleanliness before the first tank chamber C1.
值得一提的是，隨著清洗液F由入水孔1111持續注入第一槽室C1，清洗液F持續地由第一槽室C1溢出，使得清洗液F依序流經第一槽室C1、第一流道P1、第二槽室C2、第二流道P2、第三槽室C3、第三流道P3與第四槽室C4，加之上述平板構件2在進入各槽室之前的潔淨程度，使得第一槽室C1內清洗液F的一微粒濃度小於第二槽室C2內清洗液F的一微粒濃度，第二槽室C2內清洗液F的該微粒濃度小於第三槽室C3內清洗液F的一微粒濃度，第三槽室C3內清洗液F的該微粒濃度小於第四槽室內清洗液F的一微粒濃度，即第一槽室C1至第四槽室C4內清洗液F之該些微粒濃度依序遞減。因此當欲清洗平板構件2時，將平版構件2依序於第四槽室C4、第三槽室C3、第二槽室C2與第一槽室C1內清洗便可達到較佳之一清洗效果。此外，本發明另可以包含一循環過濾系統，連接於入水孔1111及出水孔1121，由出水孔1121排出第四槽室C4之清洗液F可經過循環過濾系統淨化之後，再送至入水孔1111，以減少清洗液F之消耗。另外，由於各槽室溢出之清洗液F係流經對應之流道以及間隙由下而上地注入下一個槽室，因此溢出之清洗液不會直接落在下一個槽室的液面上，使得各槽室內液面並不會產生過大的波動，進而維持平板構件2之平整度。It is worth mentioning that as the cleaning liquid F is continuously injected into the first tank chamber C1 through the water inlet hole 1111, the cleaning liquid F continuously overflows from the first tank chamber C1, so that the cleaning liquid F sequentially flows through the first tank chamber C1. The first flow path P1, the second flow chamber C2, the second flow path P2, the third groove chamber C3, the third flow path P3, and the fourth groove chamber C4, together with the cleanliness of the above-mentioned plate member 2 before entering each of the groove chambers, The concentration of a fine particle of the cleaning liquid F in the first tank chamber C1 is smaller than the concentration of a fine particle in the cleaning liquid F in the second tank chamber C2, and the concentration of the fine particles in the cleaning liquid F in the second tank chamber C2 is smaller than that in the third tank chamber C3. a particle concentration of the liquid F, the particle concentration of the cleaning liquid F in the third tank chamber C3 is smaller than a particle concentration of the cleaning liquid F in the fourth tank chamber, that is, the cleaning liquid F in the first tank chamber C1 to the fourth tank chamber C4 The particle concentrations are sequentially decreasing. Therefore, when the plate member 2 is to be cleaned, the lithographic member 2 is sequentially cleaned in the fourth tank chamber C4, the third tank chamber C3, the second tank chamber C2, and the first tank chamber C1 to achieve a better cleaning effect. In addition, the present invention may further comprise a circulation filtration system connected to the water inlet hole 1111 and the water outlet hole 1121, and the cleaning liquid F discharged from the water outlet hole 1121 to the fourth tank chamber C4 may be purified by the circulation filtration system and then sent to the water inlet hole 1111. To reduce the consumption of cleaning solution F. In addition, since the cleaning liquid F overflowing from each of the tank chambers flows through the corresponding flow passage and the gap is injected from the bottom to the next tank chamber, the overflowing cleaning liquid does not directly fall on the liquid surface of the next tank chamber, so that The liquid level in each tank does not cause excessive fluctuations, thereby maintaining the flatness of the plate member 2.
以下說明本發明自動化系統1如何利用移載機構13將卡匣結構12以及平板構件2選擇性地設置於第一槽室C1、第二槽室C2、第三槽室C3或第四槽室C4。舉例來說，於上述清洗過程中，平版構件2需要依序放置於第四槽室C4、第三槽室C3、第二槽室C2、第一槽室C1內，請參閱第1圖、第7圖及第8圖，第7圖為第1圖所示自動化系統1的側視圖，第8圖為本發明實施例自動化系統1處於一縮回狀態之示意圖。如第1圖、第7圖及第8圖所示，首先該控制晶片控制第一基座1310與第二基座1330定位於對應第四槽室C4之一第四槽位，且控制第一驅動件1311與第二驅動件1331沿伸出方向D3分別伸出於第一基座1310與第二基座1330，再將平板構件2放置於卡匣結構12內並將卡匣結構12固持於第一驅動件1311與第二驅動件1331(如第7圖所示)，接著該控制晶片控制第一驅動件1311與第二驅動件1331沿縮回方向D4分別縮回於第一基座1310與第二基座1330，使乘載著平板構件2之卡匣結構12進入第四槽室C4，進而清洗平板構件2。當平板構件2於第四槽室C4內清洗完畢後，該控制晶片控制第一驅動件1311與第二驅動件1331沿伸出方向D3分別伸出於第一基座1310與第二基座1330，使乘載著平板構件2之卡匣結構12離開第四槽室C4。當欲將平板構件2切換至第三槽室C3進行下一階段清洗時，該控制晶片控制第一基座1310與第二基座1330沿第一方向D1由對應第四槽室C4之一第四槽位移動至對應第三槽室C3之一第三槽位，接著該控制晶片控制第一驅動件1311與第二驅動件1331沿縮回方向D4分別縮回於第一基座1310與第二基座1330，使乘載著平板構件2之卡匣結構12進入第三槽室C3，進而可於第三槽室C3內對平板構件2進行下一階段清洗。以此類推，當平板構件2由於第三槽室C3內清洗完畢後，而欲將平板構件2切換至第二槽室C2進行下一階段清洗，以及當平板構件2於第二槽室C2內清洗完畢後，而欲將平板構件2切換至第一槽室C1進行下一階段清洗，該控制晶片控制移載機構13之作動過程與上述該控制晶片控制移載機構13之作動過程相似，於此不再贅述。The following describes how the automation system 1 of the present invention selectively sets the cassette structure 12 and the plate member 2 to the first chamber C1, the second chamber C2, the third chamber C3 or the fourth chamber C4 by means of the transfer mechanism 13. . For example, in the above cleaning process, the lithographic member 2 needs to be sequentially placed in the fourth tank chamber C4, the third tank chamber C3, the second tank chamber C2, and the first tank chamber C1, see Fig. 1, 7 and 8 are a side view of the automation system 1 shown in Fig. 1. Fig. 8 is a schematic view showing the automation system 1 in a retracted state according to an embodiment of the present invention. As shown in FIG. 1 , FIG. 7 and FIG. 8 , the control wafer first controls the first pedestal 1310 and the second pedestal 1330 to be positioned in a fourth slot corresponding to the fourth slot chamber C4 , and controls the first The driving member 1311 and the second driving member 1331 respectively protrude from the first base 1310 and the second base 1330 in the extending direction D3, and then place the flat member 2 in the cassette structure 12 and hold the cassette structure 12 on The first driving member 1311 and the second driving member 1331 (as shown in FIG. 7), and then the control wafer controls the first driving member 1311 and the second driving member 1331 to be respectively retracted to the first pedestal 1310 in the retracting direction D4. With the second pedestal 1330, the cassette structure 12 on which the plate member 2 is loaded enters the fourth chamber C4, and the plate member 2 is further cleaned. After the cleaning of the flat member 2 in the fourth chamber C4, the control wafer controls the first driving member 1311 and the second driving member 1331 to protrude from the first base 1310 and the second base 1330 respectively in the extending direction D3. The cassette structure 12 carrying the plate member 2 is separated from the fourth chamber C4. When the panel member 2 is to be switched to the third chamber C3 for the next stage cleaning, the control wafer controls the first pedestal 1310 and the second pedestal 1330 to be in the first direction D1 by one of the corresponding fourth chambers C4. The four slots move to a third slot corresponding to the third slot chamber C3, and then the control wafer controls the first driving member 1311 and the second driving member 1331 to retract back to the first base 1310 and the first direction respectively in the retracting direction D4. The two bases 1330 allow the cassette structure 12 carrying the plate member 2 to enter the third chamber C3, and the plate member 2 can be cleaned in the next stage in the third chamber C3. By the way, when the plate member 2 is cleaned in the third tank chamber C3, the plate member 2 is to be switched to the second tank chamber C2 for the next stage cleaning, and when the plate member 2 is in the second tank chamber C2. After the cleaning is completed, the plate member 2 is switched to the first chamber C1 for the next stage cleaning, and the operation process of the control wafer control transfer mechanism 13 is similar to the operation of the control wafer control transfer mechanism 13 described above. This will not be repeated here.
最後當平板構件2於第一槽室C1內完成最後階段清洗後，該控制晶片控制第一驅動件1311及第二驅動件1331沿伸出方向D3分別伸出於第一基座1310與第二基座1330，以使乘載平板構件2的卡匣結構12離開第一槽室C1，此時則可由卡匣結構12由第一驅動件1311及第二驅動件1331取下，並將平板構件2取出，以便對平板構件2進行下一階段製程。於此實施例中，第一驅動裝置131與第二驅動裝置133可分別為一氣壓缸機構，第一基座1310與第二基座1330可分別為一氣壓缸座，且第一驅動件1311與第二驅動件1331可分別為一氣壓頂桿，然而本發明並不侷限於此。 相較於先前技術，本發明自動化系統利用移載機構將平板構件於對應各槽室之各槽位間移動，且本發明自動化系統另利用移載機構的第一驅動件及第二驅動件驅動該卡匣結構進入或離開對應之槽室，因此本發明之自動化系統不僅使清洗平板構件的整體作業程序更加精簡，更使生產線上整體作業空間更為有效地利用。以上所述僅為本發明之較佳實施例，凡依本發明申請專利範圍所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。Finally, after the plate member 2 completes the final stage cleaning in the first chamber C1, the control wafer controls the first driving member 1311 and the second driving member 1331 to protrude from the first base 1310 and the second respectively in the extending direction D3. The base 1330 is configured to move the cassette structure 12 of the board member 2 away from the first chamber C1, and at this time, the first driving member 1311 and the second driving member 1331 can be removed from the cassette structure 12, and the plate member is removed. 2 is taken out to carry out the next stage process for the plate member 2. In this embodiment, the first driving device 131 and the second driving device 133 are respectively a pneumatic cylinder mechanism, and the first base 1310 and the second base 1330 are respectively a pneumatic cylinder block, and the first driving member 1311 The second driving member 1331 may be a pneumatic ram, respectively, but the invention is not limited thereto. Compared with the prior art, the automation system of the present invention uses a transfer mechanism to move the flat member between the slots of the corresponding slot chambers, and the automation system of the present invention further drives the first drive member and the second drive member of the transfer mechanism. The cassette structure enters or leaves the corresponding slot chamber, so that the automated system of the present invention not only simplifies the overall operating procedure of the cleaning plate member, but also makes the overall working space on the production line more efficient. The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.
1‧‧‧自動化系統
10‧‧‧底座
11‧‧‧槽體
110‧‧‧底壁
1101‧‧‧第一側
1102‧‧‧第二側
111‧‧‧第一側壁
1111‧‧‧入水孔
112‧‧‧第二側壁
1121‧‧‧出水孔
113‧‧‧第一間隔壁
1131‧‧‧第一間隔壁上端
1132‧‧‧第一間隔壁下端
114‧‧‧第二間隔壁
1141‧‧‧第二間隔壁上端
1142‧‧‧第二間隔壁下端
115‧‧‧第一流道側壁
1151‧‧‧第一流道側壁上端
1152‧‧‧第一流道側壁下端
116‧‧‧第三間隔壁
1161‧‧‧第三間隔壁上端
1162‧‧‧第三間隔壁下端
117‧‧‧第二流道側壁
1171‧‧‧第二流道側壁上端
1172‧‧‧第二流道側壁下端
118‧‧‧第三流道側壁
1181‧‧‧第三流道側壁上端
1182‧‧‧第三流道側壁下端
119‧‧‧第一分流板
1190‧‧‧第一分流孔洞
120‧‧‧第二分流板
1200‧‧‧第二分流孔洞
121‧‧‧第三分流板
1210‧‧‧第三分流孔洞
122‧‧‧波浪結構
12‧‧‧卡匣結構
13‧‧‧移載機構
130‧‧‧第一軌道
131‧‧‧第一驅動裝置
1310‧‧‧第一基座
1311‧‧‧第一驅動件
132‧‧‧第二軌道
133‧‧‧第二驅動裝置
1330‧‧‧第二基座
1331‧‧‧第二驅動件
2‧‧‧平板構件
C1‧‧‧第一槽室
C2‧‧‧第二槽室
C3‧‧‧第三槽室
C4‧‧‧第四槽室
D1‧‧‧第一方向
D2‧‧‧第二方向
D3‧‧‧伸出方向
D4‧‧‧縮回方向
E1‧‧‧第一流道入口
E2‧‧‧第二流道入口
E3‧‧‧第三流道入口
F‧‧‧清洗液
G1‧‧‧第一間隙
G2‧‧‧第二間隙
G3‧‧‧第三間隙
H1‧‧‧第一壁高
H2‧‧‧第二壁高
H3‧‧‧第三壁高
L1‧‧‧第一板高
L2‧‧‧第二板高
L3‧‧‧第三板高
P1‧‧‧第一流道
P2‧‧‧第二流道
P3‧‧‧第三流道
S1‧‧‧第一軸向
S2‧‧‧第二軸向1‧‧‧Automation system
10‧‧‧Base
11‧‧‧
110‧‧‧ bottom wall
1101‧‧‧ first side
1102‧‧‧ second side
111‧‧‧First side wall
1111‧‧‧Water inlet
112‧‧‧ second side wall
1121‧‧‧ water outlet
113‧‧‧First partition wall
1131‧‧‧The upper end of the first partition
1132‧‧‧The lower end of the first partition
114‧‧‧Second partition
1141‧‧‧The upper end of the second partition
1142‧‧‧lower second partition wall
115‧‧‧First runner side wall
1151‧‧‧The upper end of the first runner side wall
1152‧‧‧Lower end of the first runner side wall
116‧‧‧ Third partition wall
1161‧‧‧The upper end of the third partition
1162‧‧‧The lower end of the third partition
117‧‧‧Second runner side wall
1171‧‧‧The upper end of the second runner side wall
1172‧‧‧Lower end of the second runner side wall
118‧‧‧ third runner side wall
1181‧‧‧The upper end of the third runner side wall
1182‧‧‧Lower end of the third runner side wall
119‧‧‧First splitter
1190‧‧‧First diversion hole
120‧‧‧Second splitter
1200‧‧‧Second diversion hole
121‧‧‧ third splitter
1210‧‧‧ third diversion hole
122‧‧‧ Wave structure
12‧‧‧Card structure
13‧‧‧Transportation agency
130‧‧‧First track
131‧‧‧First drive
1310‧‧‧First base
1311‧‧‧First drive
132‧‧‧second track
133‧‧‧Second drive
1330‧‧‧Second base
1331‧‧‧second drive
2‧‧‧Table components
C1‧‧‧ first chamber
C2‧‧‧Second trough room
C3‧‧‧ third chamber
C4‧‧‧4th chamber
D1‧‧‧ first direction
D2‧‧‧ second direction
D3‧‧‧Outward direction
D4‧‧‧ retraction direction
E1‧‧‧ first runner entrance
E2‧‧‧Second runner entrance
E3‧‧‧ third runner entrance
F‧‧‧ cleaning solution
G1‧‧‧ first gap
G2‧‧‧Second gap
G3‧‧‧ third gap
H1‧‧‧ first wall height
H2‧‧‧ second wall height
H3‧‧‧ third wall height
L1‧‧‧ first board high
L2‧‧‧ second board height
L3‧‧‧ third board height
P1‧‧‧ first runner
P2‧‧‧Second runner
P3‧‧‧ third runner
S1‧‧‧first axial direction
S2‧‧‧second axial
第1圖及第2圖為本發明實施例自動化系統於不同視角之外觀示意圖。 第3圖為本發明實施例自動化系統之上視圖。 第4圖為本發明實施例槽體之外觀示意圖。 第5圖為本發明實施例槽體之上視圖。 第6圖為本發明實施例於第5圖中槽體沿A-A線段之剖面示意圖。 第7圖第1圖所示自動化系統的側視圖。 第8圖為本發明實施例自動化系統處於一縮回狀態之示意圖。1 and 2 are schematic views showing the appearance of an automated system at different viewing angles according to an embodiment of the present invention. Figure 3 is a top view of an automated system in accordance with an embodiment of the present invention. Figure 4 is a schematic view showing the appearance of a tank body according to an embodiment of the present invention. Figure 5 is a top plan view of the tank body of the embodiment of the present invention. Figure 6 is a cross-sectional view of the trough body along the line A-A in Figure 5 of the embodiment of the present invention. Figure 7 is a side view of the automation system shown in Figure 1. Figure 8 is a schematic diagram of the automation system in a retracted state according to an embodiment of the present invention.
1‧‧‧自動化系統 1‧‧‧Automation system
10‧‧‧底座 10‧‧‧Base
11‧‧‧槽體 11‧‧‧
12‧‧‧卡匣結構 12‧‧‧Card structure
13‧‧‧移載機構 13‧‧‧Transportation agency
130‧‧‧第一軌道 130‧‧‧First track
131‧‧‧第一驅動裝置 131‧‧‧First drive
1310‧‧‧第一基座 1310‧‧‧First base
1311‧‧‧第一驅動件 1311‧‧‧First drive
132‧‧‧第二軌道 132‧‧‧second track
133‧‧‧第二驅動裝置 133‧‧‧Second drive
1330‧‧‧第二基座 1330‧‧‧Second base
1331‧‧‧第二驅動件 1331‧‧‧second drive
2‧‧‧平板構件 2‧‧‧Table components
C1‧‧‧第一槽室 C1‧‧‧ first chamber
C2‧‧‧第二槽室 C2‧‧‧Second trough room
C3‧‧‧第三槽室 C3‧‧‧ third chamber
C4‧‧‧第四槽室 C4‧‧‧4th chamber
D1‧‧‧第一方向 D1‧‧‧ first direction
D2‧‧‧第二方向 D2‧‧‧ second direction
D3‧‧‧伸出方向 D3‧‧‧Outward direction
D4‧‧‧縮回方向 D4‧‧‧ retraction direction
S1‧‧‧第一軸向 S1‧‧‧first axial direction
S2‧‧‧第二軸向 S2‧‧‧second axial
Claims (18)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562197105P | 2015-07-27 | 2015-07-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201703888A true TW201703888A (en) | 2017-02-01 |
| TWI571321B TWI571321B (en) | 2017-02-21 |
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Family Applications (12)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104135695A TWI571320B (en) | 2015-07-27 | 2015-10-30 | Basin for washing a plate member |
| TW104217353U TWM515418U (en) | 2015-07-27 | 2015-10-30 | Basin for washing a plate member |
| TW104138864A TW201704129A (en) | 2015-07-27 | 2015-11-24 | Liquid recycling system capable of reducing liquid turbulence |
| TW104218819U TWM519645U (en) | 2015-07-27 | 2015-11-24 | Liquid recycling system capable of reducing liquid turbulence |
| TW104140900A TWI571321B (en) | 2015-07-27 | 2015-12-07 | Automation system for washing a plate member |
| TW104219574U TWM522082U (en) | 2015-07-27 | 2015-12-07 | Automation system for washing a plate member |
| TW105200045U TWM521064U (en) | 2015-07-27 | 2016-01-04 | Cassette body capable of reducing liquid turbulence when soaking into a liquid |
| TW105200012U TWM523187U (en) | 2015-07-27 | 2016-01-04 | Cassette body for holding a plate member |
| TW105100047A TWI574895B (en) | 2015-07-27 | 2016-01-04 | Cassette body for holding a plate member |
| TW105200022U TWM520515U (en) | 2015-07-27 | 2016-01-04 | Cassette body for holding a plate member |
| TW105100094A TWI561452B (en) | 2015-07-27 | 2016-01-04 | Cassette body capable of reducing liquid turbulence when soaking into a liquid |
| TW105100030A TWI572533B (en) | 2015-07-27 | 2016-01-04 | Cassette body for holding a plate member |
Family Applications Before (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104135695A TWI571320B (en) | 2015-07-27 | 2015-10-30 | Basin for washing a plate member |
| TW104217353U TWM515418U (en) | 2015-07-27 | 2015-10-30 | Basin for washing a plate member |
| TW104138864A TW201704129A (en) | 2015-07-27 | 2015-11-24 | Liquid recycling system capable of reducing liquid turbulence |
| TW104218819U TWM519645U (en) | 2015-07-27 | 2015-11-24 | Liquid recycling system capable of reducing liquid turbulence |
Family Applications After (7)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104219574U TWM522082U (en) | 2015-07-27 | 2015-12-07 | Automation system for washing a plate member |
| TW105200045U TWM521064U (en) | 2015-07-27 | 2016-01-04 | Cassette body capable of reducing liquid turbulence when soaking into a liquid |
| TW105200012U TWM523187U (en) | 2015-07-27 | 2016-01-04 | Cassette body for holding a plate member |
| TW105100047A TWI574895B (en) | 2015-07-27 | 2016-01-04 | Cassette body for holding a plate member |
| TW105200022U TWM520515U (en) | 2015-07-27 | 2016-01-04 | Cassette body for holding a plate member |
| TW105100094A TWI561452B (en) | 2015-07-27 | 2016-01-04 | Cassette body capable of reducing liquid turbulence when soaking into a liquid |
| TW105100030A TWI572533B (en) | 2015-07-27 | 2016-01-04 | Cassette body for holding a plate member |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN106391623B (en) |
| TW (12) | TWI571320B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI571320B (en) * | 2015-07-27 | 2017-02-21 | 盟立自動化股份有限公司 | Basin for washing a plate member |
| CN107479060B (en) * | 2017-08-17 | 2019-09-27 | 京东方科技集团股份有限公司 | Cassette cleaning equipment |
| KR102414340B1 (en) * | 2017-09-08 | 2022-06-29 | 에이씨엠 리서치 (상하이) 인코포레이티드 | Method and apparatus for cleaning semiconductor wafers |
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| JPH08141527A (en) * | 1994-11-21 | 1996-06-04 | Otsuka Giken Kogyo Kk | Ultrasonic washing apparatus |
| US20020026952A1 (en) * | 1997-12-12 | 2002-03-07 | Naohiko Fujino | Method of and device for cleaning silicon wafer, cleaned silicon wafer, and cleaned semiconductor element |
| JP4590700B2 (en) * | 2000-07-14 | 2010-12-01 | ソニー株式会社 | Substrate cleaning method and substrate cleaning apparatus |
| JP3978393B2 (en) * | 2002-12-02 | 2007-09-19 | 株式会社カイジョー | Substrate processing equipment |
| US7363777B2 (en) * | 2004-03-05 | 2008-04-29 | Corning Incorporated | Closed cassette and method for heat treating glass sheets |
| KR100939621B1 (en) * | 2005-06-25 | 2010-02-02 | 엘지디스플레이 주식회사 | cassette |
| US8042359B2 (en) * | 2006-05-18 | 2011-10-25 | Corning Incorporated | Methods and apparatus for heat treating glass sheets |
| US8215323B2 (en) * | 2006-07-26 | 2012-07-10 | Premark Feg L.L.C. | Drive systems for conveyor-type warewashers |
| WO2009110548A1 (en) * | 2008-03-07 | 2009-09-11 | 三井・デュポンフロロケミカル株式会社 | Method and system for washing electronic component |
| TWI354586B (en) * | 2008-08-29 | 2011-12-21 | Zhen Ding Technology Co Ltd | Cleaning apparatus and cleaning system including t |
| TW201010804A (en) * | 2008-09-10 | 2010-03-16 | Singwei Technologies Co Ltd | Apparatus for recycling noble metals |
| US7905963B2 (en) * | 2008-11-28 | 2011-03-15 | Mitsubishi Materials Corporation | Apparatus and method for washing polycrystalline silicon |
| CN201367470Y (en) * | 2009-03-05 | 2009-12-23 | 沈阳铝镁设计研究院 | Energy-saving type aluminium electrolysis bath |
| JP5681412B2 (en) * | 2010-08-27 | 2015-03-11 | 川崎重工業株式会社 | Plate member storage rack, plate member transfer equipment, and plate member storage method |
| TWM403509U (en) * | 2010-09-03 | 2011-05-11 | Chang-Ying Li | Improved structure of electrochemical application equipment |
| CN202021177U (en) * | 2010-12-30 | 2011-11-02 | 光为绿色新能源有限公司 | Multi-stage circulation cleaning equipment for solar silicon wafer |
| US8739356B2 (en) * | 2011-01-31 | 2014-06-03 | Mark Hausmann | Cleaning system for transparent tank |
| CN202058714U (en) * | 2011-04-06 | 2011-11-30 | 南京中电熊猫液晶显示科技有限公司 | Cassette correction system |
| CN202139295U (en) * | 2011-05-16 | 2012-02-08 | 东莞怡富电路板厂 | Water circulation device in immersion tin process |
| CN102231943B (en) * | 2011-06-24 | 2012-10-10 | 高德（无锡）电子有限公司 | Horizontal-line multi-washing serial washing overflow structure |
| CN102642716B (en) * | 2012-04-11 | 2014-04-02 | 深圳市华星光电技术有限公司 | Picking and placing device of glass substrate |
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| CN203292440U (en) * | 2012-10-19 | 2013-11-20 | 中冶南方工程技术有限公司 | Continuous casting submerged nozzle capable of reducing molten steel impact |
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| TWI571320B (en) * | 2015-07-27 | 2017-02-21 | 盟立自動化股份有限公司 | Basin for washing a plate member |
-
2015
- 2015-10-30 TW TW104135695A patent/TWI571320B/en active
- 2015-10-30 TW TW104217353U patent/TWM515418U/en unknown
- 2015-11-24 TW TW104138864A patent/TW201704129A/en unknown
- 2015-11-24 TW TW104218819U patent/TWM519645U/en not_active IP Right Cessation
- 2015-11-25 CN CN201510833225.XA patent/CN106391623B/en active Active
- 2015-11-25 CN CN201520953155.7U patent/CN205362162U/en not_active Withdrawn - After Issue
- 2015-12-07 TW TW104140900A patent/TWI571321B/en active
- 2015-12-07 TW TW104219574U patent/TWM522082U/en unknown
-
2016
- 2016-01-04 TW TW105200045U patent/TWM521064U/en unknown
- 2016-01-04 TW TW105200012U patent/TWM523187U/en not_active IP Right Cessation
- 2016-01-04 TW TW105100047A patent/TWI574895B/en not_active IP Right Cessation
- 2016-01-04 TW TW105200022U patent/TWM520515U/en unknown
- 2016-01-04 TW TW105100094A patent/TWI561452B/en active
- 2016-01-04 TW TW105100030A patent/TWI572533B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TWM523187U (en) | 2016-06-01 |
| TW201703887A (en) | 2017-02-01 |
| CN106391623B (en) | 2018-09-18 |
| TW201704116A (en) | 2017-02-01 |
| TW201704103A (en) | 2017-02-01 |
| TWI561452B (en) | 2016-12-11 |
| TWI571320B (en) | 2017-02-21 |
| TWI572533B (en) | 2017-03-01 |
| CN205362162U (en) | 2016-07-06 |
| TWM520515U (en) | 2016-04-21 |
| TWM515418U (en) | 2016-01-11 |
| TWM522082U (en) | 2016-05-21 |
| CN106391623A (en) | 2017-02-15 |
| TWI571321B (en) | 2017-02-21 |
| TW201704129A (en) | 2017-02-01 |
| TWM521064U (en) | 2016-05-01 |
| TWM519645U (en) | 2016-04-01 |
| TW201704130A (en) | 2017-02-01 |
| TWI574895B (en) | 2017-03-21 |
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