TW201703189A - Object holding device, exposure device, method of manufacturing flat panel display, and component manufacturing method - Google Patents

Abstract

The object holding device includes: a holding face (60) having a holding surface for holding the substrate; a pipe portion (50) having a pipe for controlling a gas between the holding surface and the substrate; and a holding face portion (60); and a base The portion (40) is provided with a piping portion (50). Further, in the duct portion (50), the duct extends in the first direction, and a plurality of the ducts are disposed in the second direction intersecting the first direction.

Description

Object holding device, exposure device, method of manufacturing flat panel display, and component manufacturing method

The present invention relates to an object holding device, an exposure device, a method of manufacturing a flat panel display, and a component manufacturing method, and more particularly to an object holding device including a holding member that holds an object, and an object to be held by the object holding device An exposure apparatus for exposure, a flat panel display using the above exposure apparatus, and a method of manufacturing an element.

In the lithography step of manufacturing an electronic component (micro component) such as a liquid crystal display element, a semiconductor element (integrated circuit, etc.), the following exposure apparatus is used, that is, an energy beam is used to form a reticle or a reticle ( Hereinafter, the pattern collectively referred to as "photomask" is transferred to a glass plate or wafer (hereinafter collectively referred to as "substrate").

In such an exposure apparatus, the substrate holder provided in the substrate stage apparatus performs surface correction on the substrate mounting surface by vacuum suction of the substrate, for example, so as not to form wrinkles or irregularities (for example, refer to the patent). Document 1).

Here, in recent years, the substrate to be exposed has a tendency to be thinner, and it is difficult to planarly correct the substrate due to irregularities, grooves, or through holes formed in the substrate mounting surface of the substrate holder.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2004-273702

According to a first aspect of the present invention, there is provided an object holding device comprising: a holding portion having a holding surface for holding an object; and a gas flow path portion having a flow path for controlling a gas between the holding surface and the object, and mounting a holding portion; and a base portion on which the gas flow path portion is placed; the flow path extending in the first direction in the gas flow path portion and disposed in a second direction intersecting the first direction Multiple.

According to a second aspect of the present invention, there is provided an exposure apparatus comprising: the object holding device according to the first aspect; and a pattern forming device that forms a predetermined pattern on the object held by the object holding device using an energy beam.

According to a third aspect of the present invention, a method of manufacturing a flat panel display includes: an operation of exposing a substrate used in a flat panel display using an exposure apparatus according to a second aspect; and an operation of developing the exposed substrate.

According to a fourth aspect of the present invention, there is provided a method of manufacturing a device comprising: an operation of exposing an object using an exposure apparatus according to the second aspect, and an operation of developing an object to be exposed.

10‧‧‧Liquid exposure device

20‧‧‧Substrate stage device

30‧‧‧Sheet holder

40‧‧‧ base

50‧‧‧Pipeline Department

60‧‧‧ Keeping the face

P‧‧‧Substrate

Fig. 1 is a view schematically showing the configuration of a liquid crystal exposure apparatus according to an embodiment.

2 is a view showing a substrate holder of a substrate stage device of the liquid crystal exposure apparatus of FIG. 1. Stereo view.

Figure 3 is an exploded view of the substrate holder of Figure 2.

Fig. 4 is a view showing a modification of the substrate holder.

5(a) and 5(b) are views showing a loading and unloading bracket device (a side view and a front view, respectively) of the substrate stage device.

6(a) to 6(c) are diagrams for explaining the exchange operation of the substrate on the substrate holder (the first to the third).

7(a) and 7(b) are diagrams for explaining the exchange operation of the substrate on the substrate holder (fourth and fifth).

8(a) and 8(b) are views showing a holder cleaning device included in the substrate stage device (a side view and a front view, respectively).

9(a) and 9(b) are views for explaining a cleaning operation (the first) of the substrate holder using the holder cleaning device (a side view and a front view, respectively).

10(a) and 10(b) are views for explaining the cleaning operation (the second) of the substrate holder using the holder cleaning device (the side view and the front view, respectively).

11(a) and 11(b) are views for explaining the cleaning operation (the third) of the substrate holder using the holder cleaning device (the side view and the front view, respectively).

Fig. 12 is a view for explaining a cleaning operation (fourth) of the substrate holder using the holder cleaning device.

Fig. 13 is a view for explaining a cleaning operation (the fifth) of the substrate holder using the holder cleaning device.

Figure 14 is a view for explaining a cleaning action of a substrate holder using a holder cleaning device ( Figure 6).

Fig. 15 is a view showing a modification (part 1) of the holder cleaning device.

Fig. 16 is a view showing a modification (part 2) of the holder cleaning device.

Fig. 17 is a view showing a modification (part 3) of the holder cleaning device.

Fig. 18 is a view showing a modification (fourth) of the holder cleaning device.

Hereinafter, an embodiment will be described with reference to Figs. 1 to 14 .

Fig. 1 schematically shows the configuration of a liquid crystal exposure apparatus 10 according to an embodiment. The liquid crystal exposure apparatus 10 is a step-and-scan type projection exposure apparatus, which is a rectangular (square) glass substrate P (hereinafter referred to as a substrate P) used in, for example, a liquid crystal display device (flat panel display). ) as an object of exposure.

The liquid crystal exposure apparatus 10 includes an illumination system 12, a photomask stage device 14 that holds a mask M in which a pattern such as a circuit pattern is formed, and a projection optical system 16 that coats the surface (the surface facing the +Z side in FIG. 1). The substrate stage device 20 in which the substrate P of the resist (inductive agent) is held, and the control systems and the like. Hereinafter, the direction in which the exposure mask M and the substrate P are scanned with respect to the projection optical system 16 as the X-axis direction, the direction orthogonal to the X-axis in the horizontal plane is the Y-axis direction, and the X-axis and the Y-axis are positive. The direction of intersection is described as the Z-axis direction.

The illumination system 12 is constructed in the same manner as the illumination system disclosed in, for example, the specification of U.S. Patent No. 5,729,331. The illumination system 12 emits light emitted from a light source (for example, a mercury lamp) (not shown) via an unillustrated mirror, a dichroic mirror, a shutter, a wavelength selective filter, various lenses, etc., as illumination light for exposure (illumination) Light) IL is irradiated to the mask M. As illumination light IL is, for example, light such as i-ray (wavelength 365 nm), g-ray (wavelength 436 nm), or h-ray (wavelength 405 nm) (or synthetic light of the above-described i-ray, g-ray, or h-ray).

The mask stage device 14 holds the mask M by vacuum suction, for example. The mask stage device 14 is driven at a predetermined long stroke at least in the scanning direction (X-axis direction) by, for example, a mask stage driving system (not shown) including a linear motor. The position information of the mask stage device 14 is obtained, for example, by a mask stage measuring system (not shown) including a linear encoder system.

The projection optical system 16 is disposed below the mask stage device 14. The projection optical system 16 is a so-called multi-lens type projection optical system having the same configuration as that of the projection optical system disclosed in, for example, the specification of the U.S. Patent No. 6,552,775, for example, and includes a plurality of optical systems that form both sides of the erect positive image.

In the liquid crystal exposure device 10, when the mask M located in a predetermined illumination region is illuminated by the illumination light IL from the illumination system 12, the illumination light passing through the mask M is transmitted through the projection optical system 16. A projection image (an image of a partial pattern) of the pattern of the mask M in the illumination region is formed on the exposure region on the substrate P. Moreover, with respect to the illumination area (illumination light IL), the mask M relatively moves in the scanning direction, and relative to the exposure area (illumination light IL), the substrate P relatively moves in the scanning direction, thereby performing one exposure on the substrate P Scanning exposure of the irradiation area, the pattern formed on the mask M (the entire pattern corresponding to the scanning range of the mask M) is transferred to the exposure irradiation area. Here, the illumination area on the mask M and the exposure area (irradiation area of the illumination light) on the substrate P are optically conjugated to each other by the projection optical system 16.

The substrate stage device 20 includes a platen 22, a substrate stage 24, a self-weight supporting device 26, and a substrate holder 30.

The platen 22 is configured such that the upper surface (+Z plane) is parallel to the XY plane. It is formed in a plan view (viewed from the +Z side) and is a rectangular plate-shaped member, and is provided on the floor F via a vibration-proof device (not shown). The substrate stage 24 is formed of a box-shaped member having a rectangular shape in plan view. The self-weight support device 26 is placed on the platen 22 in a non-contact state to support the self-weight of the substrate table 24 from below. The substrate holder 30 is integrally fixed to the upper surface of the substrate stage 24. Further, although not shown, the substrate stage device 20 includes a substrate stage drive system including, for example, a linear motor, and the substrate stage 24 (and the substrate holder 30) in the X-axis and Y-axis directions (along the XY plane). Driving with a predetermined long stroke and micro-driving in 6 degrees of freedom (X-axis, Y-axis, Z-axis, θx, θy, and θz); and substrate stage measurement system, etc., including, for example, an optical interferometer system The positional information in the above-described six-degree-of-freedom direction of the substrate holder 30 is obtained.

The substrate holder 30 is composed of a box-shaped member having a rectangular shape in a plan view as a whole, and the substrate P is placed on the upper surface (the surface on the +Z side). The aspect ratio of the upper surface of the substrate holder 30 is substantially the same as that of the substrate P, but the lengths of the long sides and the short sides of the upper surface of the substrate holder 30 are set to be slightly shorter than the lengths of the long sides and the short sides of the substrate P, respectively. In a state where the substrate P is placed on the upper surface of the substrate holder 30, the vicinity of the end portions of the four sides of the substrate P protrudes outward from the substrate holder 30. This is because the resist applied to the surface of the substrate P may adhere to the back side in the vicinity of the end portion of the substrate P, and the resist is not attached to the substrate holder 30.

As can be seen from FIGS. 2 and 3 , the substrate holder 30 includes the base portion 40 , the conduit portion 50 , and the holding surface portion 60 . The base portion 40, the conduit portion 50, and the holding surface portion 60 are integrally formed in a rectangular plate shape in plan view. In the substrate holder 30, the tube portion 50 is placed (laminated) on the base portion 40, and the holding surface portion 60 is placed (layered) on the tube portion 50, thereby having a three-layer structure as a whole. In the present embodiment, the base portion 40, the conduit portion 50, and the holding surface portion 60 are fixed to each other by, for example, an adhesive. However, the base portion 40, the conduit portion 50, and the holding surface portion 60 are not limited thereto. For example, they may be fastened to each other by bolts or the like. And, protect The holding surface portion 60 and the pipe portion 50 can also be fixed to each other by vacuum suction. Further, the holding surface portion 60 and the duct portion 50 may be configured to be detachable and exchangeable.

The base portion 40 as the lowermost layer is formed thicker than the pipe portion 50 and the holding surface portion 60. The structure of the base portion 40 is not particularly limited, but is preferably lightweight and high in rigidity (especially high rigidity in the thickness direction). The base portion 40 of the present embodiment has a so-called sandwich structure, that is, for example, CFRP is attached to the upper surface, the lower surface, and the respective side surfaces of a plate-shaped member (not shown) of a honeycomb structure formed of an aluminum alloy. (carbon-fiber-reinforced plastic, carbon fiber reinforced plastic) made of plate-like members, lightweight and high rigidity, and easy to manufacture.

The pipe portion 50 as the intermediate layer is provided with a plurality of corner pipes 52 having a rectangular YZ cross section extending in the X-axis direction (for example, 13 in FIGS. 2 and 3). In addition, the number of the angle tubes 52 is not particularly limited. The dimension of the longitudinal direction (X-axis direction) of the angle tube 52 is set to be substantially the same as the dimension of the base portion 40 in the X-axis direction. In the present embodiment, a gap narrower than the width direction (Y-axis direction) of the angle tube 52 is formed between adjacent ones of the diagonal tubes 52, but there is no gap between adjacent ones of the diagonal tubes 52.

Both ends of the longitudinal direction of each of the angle tubes 52 are closed by a cover member (not shown). Further, a joint for a gas pipe (not shown) is attached to one of the cover members attached to one of the both end portions in the longitudinal direction of the angle tube 52. Further, in the present embodiment, the joint (not shown) is attached to the end portions of all the corner pipes 52. However, the present invention is not limited thereto, and for example, it may be attached to only one of the plurality of corner pipes 52.

The upper surface of the angle tube 52 (in this embodiment, all the angle tubes 52) to which the above-mentioned joint is attached is formed in a plurality of corner tubes 52, and a through hole 58 is formed at a predetermined position (see Fig. 3). In addition, in FIG. 3, the through-hole 58 is larger than the actual figure. Moreover, the substrate holder shown in FIG. In the case of 30, for example, one or two through holes 58 are formed for each of the corner pipes 52. However, the number of the through holes 58 formed in one of the corner pipes 52 is not particularly limited.

The uppermost holding surface portion 60 is a portion that holds the substrate P (see FIG. 1) and has a plurality of flat plates 62. The flat plate 62 is formed, for example, of black granite (gabstone) or ceramics, and has a thickness of, for example, about 5 mm to 10 mm. The entire surface of the flat plate 62 (the surface facing the +Z side in Figs. 2 and 3) is finished to be very flat. Further, in the present embodiment, for example, the 15 flat plates 62 are laid on the pipe portion 50 (the plurality of corner pipes 52) substantially without any gap (the interval of the gap can be substantially ignored), whereby the holding surface portion 60 is formed, but the flat plate The number of blocks of 62 is not particularly limited, and may be, for example, 14 or less (for example, one block) or 16 or more blocks.

A plurality of (for example, 15 in the present embodiment) gas injection and/or vacuum suction through holes 68 are formed in the holding surface portion 60. The positions of the plurality of through holes 68 are formed at positions corresponding to the plurality of through holes 58 formed in the duct portion 50, that is, at the holding surface portion 60 (the plurality of flat plates 62) overlapping the duct portion 50 ( In a state in which the plurality of corner pipes 52) are provided (see FIG. 2), the through hole 58 and the through hole 68 overlap each other in the vertical direction (a position in which the XY plane coincides). The through hole 58 is formed by, for example, mechanical machining using a drill or the like. In addition, in FIGS. 2 and 3, the through hole 68 is larger than actually shown. Further, in the present embodiment, one through hole 68 is formed for each of the flat plates 62. However, the present invention is not limited thereto. For example, a plurality of through holes 68 may be formed in one flat plate 62, and may be formed in the angle tube according to the same. The positional relationship of the through holes 58 of 52 includes a flat plate 62 in which the through holes 68 are not formed in the plurality of flat plates 62. Among them, the plurality of through holes 68 are preferably formed so as to cover the entire surface of the upper surface (substrate mounting surface) of the substrate holder 30 at substantially equal intervals.

Moreover, in the present embodiment, the holding surface 60 is arranged by arranging a plurality of flat plates 62 Since the columns are formed by laying, it is preferable that there is no step difference between the flat plates 62. In the assembly of the substrate holder 30, for example, on a flat member such as the platen 22 (see FIG. 1), a plurality of flat plates 62 are provided on one surface (the side on which the substrate mounting surface functions as a substrate after assembly) The plurality of flat plates 62 and the plurality of angle tubes 52 are fixed by, for example, an adhesive agent in a state of being arranged downward and placed. Thereby, one surface of the plurality of flat plates 62 can be respectively molded on the surface of the pressure plate 22 without any step. Further, the order of assembly of the substrate holder 30 is not limited thereto. For example, the surface of the platen 22 may be formed by arranging and assembling a plurality of angle tubes 52 constituting the line portion 50 on the platen 22. After the plane, a plurality of flat plates 62 constituting the holding surface portion 60 are arranged on the pipe portion 50 (a plane imitating the surface of the platen 22). Alternatively, the plurality of angle tubes 52 constituting the line portion 50 may be assembled without being smoothly (not formed into a single plane by the plurality of angle tubes 52), and then an adhesive may be applied to the line portion 50 (the plurality of angle tubes 52) And a plurality of flat plates 62 are arranged on the pipe portion 50 (adhesive), thereby forming a flat surface. Further, the assembly procedure of the substrate holder 30 is performed in the order of holding the face portion 60, the conduit portion 50, and the base portion 40, that is, the upper layer side of the substrate holder 30 (sequentially from the upper layer side). Although the case has been described, it is not limited thereto, and it may be assembled by sequentially stacking the members on the upper layer side from the lower layer side.

The joint (not shown) attached to the plurality of corner pipes 52 constituting the pipe portion 50 can be switched (selected) to the outside of the substrate holder 30, for example, via a pipe member such as a pipe body. A vacuum device and a pressurized gas supply device (not shown). The vacuum device supplies the suction force to the angle tube 52 by attracting the air inside the angle tube 52. The substrate holder 30 sucks the air between the upper surface of the holding surface portion 60 and the substrate P (see FIG. 1) placed on the holding surface portion 60 via the through holes 58 and 68 by the vacuum suction force. Based on this The plate P is adsorbed and held on the holding surface 60, and substantially the entire surface is surface-corrected along the upper surface of the face 60 (plurality of the flat plates 62). In the piping unit 50, the gas flow is formed by routing a plurality of angle tubes 52. However, the configuration of the piping unit 50 is not limited thereto, and can be appropriately changed. For example, a groove may be formed on the surface of the plate-shaped member, and another plate-like member (cover) may be superposed on the plate-shaped member, thereby forming the pipe portion 50 (gas flow path). In this case, the pipe portion 50 is composed of two plate members. Further, in this case, the base portion 40 may be used as the other plate-like member (cover), and the holding surface portion 60 may be used as the other plate-shaped member (cover). In this case, the conduit portion 50 can be formed by one plate member.

Further, a pressurized gas (for example, compressed air) is supplied from the inside of the angle tube 52 from the pressurized gas supply device. The substrate holder 30 discharges (discharges) the pressurized gas through the through holes 58 and 68 to the lower surface of the substrate P (see FIG. 1) placed on the holding surface portion 60. Thereby, the substrate P is placed in a state in which the entire surface is separated (floated) with respect to the upper surface of the holding surface portion 60.

The switching of the supply of the vacuum suction force and the supply of the pressurized gas is appropriately performed by, for example, a valve or the like and by a main control device (not shown). The main control device can arbitrarily switch the vacuum suction of the substrate P to the substrate holder 30 and the substrate P to be non-contacted to the substrate by appropriately switching the supply of the vacuum attractive force to the substrate holder 30 and the supply of the pressurized gas. Holder 30.

Further, the main control device may generate a time difference by the timing of discharging the pressurized gas by the plurality of through holes 68 formed in the holding surface portion 60, or may appropriately exchange the through holes 68 for vacuum suction and the discharge of the pressurized gas. The grounding state of the substrate P is optimized by the position of the hole 68 or by appropriately changing the air pressure by suction and exhaust (for example, the back surface of the substrate P) No air retention occurs between the upper surface of the substrate holder 30. Alternatively, the vacuum device may be coupled to a portion of the plurality of angle tubes 52 and the pressurized gas supply device coupled to the remaining angle tubes 52 to which the vacuum device is not attached. In this case, in the substrate holder 30, the portion where the substrate P is adsorbed and held is distinguished from the portion where the substrate P is non-contact-supported, and the control is easy.

Here, in the present embodiment, the conduit portion 50 is constituted by a plurality of members (corner tubes 52). However, as long as the pressurized gas or the vacuum suction force can be supplied to substantially the entire surface of the upper surface of the holding surface portion 60, the tube The structure of the road portion 50 can be appropriately changed. For example, the structure of the pipe portion 50A of the substrate holder 30A shown in Fig. 4 can be an integral structure. The pipe portion 50A is an interlayer structure in which a plurality of strip-shaped plate members 54c (longitudinal ribs) extending in the X-axis direction and extending in the X-axis direction, for example, are separated by a predetermined interval in the Y-axis direction. It is disposed between one of the pair of thin plates 54a, 54b formed by CFRP. In the substrate holder 30A, both end portions of the tubes formed by the plate members 54a to 54c are also closed by a cover member (not shown). Further, a through hole may be formed in the plate member 54c to connect one of the adjacent pipes to the pipe. In this case, it is not necessary to install a joint for the gas piping for all of the plurality of pipes. In this case, the CFRP may be subjected to a film treatment in order to prevent static electricity from being generated by the CFRP. Further, the material forming the pipe portion 50 (the angle pipe 52) is not limited to CFPR, and may be a metal material such as aluminum or stainless steel. Further, as a material for forming the piping portion 50, a material having a coefficient of linear expansion different from at least one of the material forming the base portion 40 and the material forming the holding surface portion 60 is preferably used. Thereby, the force acting in the arrangement direction (the Y-axis direction in FIGS. 2 and 3) of the plurality of flow paths forming the conduit portion 50 can be dispersed.

Further, as shown in FIG. 5(a), the substrate stage device 20 includes a pair (not shown) because one of them is superimposed on the inside of the paper, and the carrier device 70a is carried out to carry out the substrate P from the substrate holder 30. (refer to FIG. 1); and a pair (see FIG. 5(b)) carried into the bracket device 70b, The operation for loading the substrate P into the substrate holder 30. The pair of carry-out carriage devices 70a are disposed at a predetermined interval in the Y-axis direction on the +X side of the substrate holder 30, and the pair of loading tray devices 70b are disposed at a predetermined interval in the Y-axis direction on the -X side of the substrate holder 30.

The configuration of the pair of loading tray devices 70b is substantially the same except for the arrangement, and therefore, a loading tray device 70b will be described below. The loading tray device 70b includes a holding pad 72b, a Z actuator 76z, and an X actuator 76x. The holding pad 72b can be partially inserted into the slit 32b (not shown in FIGS. 2 and 3) formed on the upper surface of the substrate holder 30 (holding the face portion 60 (see FIG. 2 and the like)). The holding pad 72b can suck and hold the vicinity of the end portion on the -X side of the substrate P (see FIG. 1) from the lower surface side by the vacuum suction force supplied from a vacuum device (not shown).

The holding pad 72b is attached to the X actuator 76x via a shaft 74 extending in the Z-axis direction, and is driven by the X actuator 76x in a predetermined stroke in the X-axis direction. Further, the X actuator 76x (i.e., the holding pad 72b) is driven by a predetermined stroke in the Z-axis direction by the Z actuator 76z attached to the substrate stage 24.

The configuration of each of the pair of carry-out tray devices 70a is substantially the same as that of the loading tray device 70b except for the difference in arrangement and function. That is, the carry-out carriage device 70a includes a holding pad 72a that can be partially inserted into the slit 32a (not shown in FIGS. 2 and 3) formed on the upper surface of the substrate holder 30 for supporting the holding pad 72a. The X actuator 76x that drives the shaft 74 in the X-axis direction, and the Z actuator 76z that drives the X actuator 76x (i.e., the holding pad 72a) in the Z-axis direction, is capable of adsorbing and holding the substrate from the lower surface side. P (refer to Fig. 1) near the end of the +X side.

Next, the exchange operation of the substrate P on the substrate holder 30 using the carry-out carriage device 70a and the loading tray device 70b will be described with reference to Figs. 6(a) to 7(b). Bright. The following substrate exchange operation is performed under the management of a main control device (not shown).

FIG 6 (a), the holding completion of exposure of _one substrate P substrate holder 30 for unloading the substrate P _1, is positioned at the predetermined substrate exchange position. The substrate holder 30 from the substrate mounting surface of the pressurized gas below _a surface of the substrate P is ejected, the floating substrate P _1. At this time, the pair of suction devices 70a near the unloading carriage holding the substrate P + X side end of _1. The main control device drives the holding pads 72a of the pair of carry-out carriage devices 70a in a +X direction with a predetermined stroke (for example, about 50 mm to 100 mm). Thereby, the vicinity of the end portion on the +X side of the substrate P ₁ protrudes from the vicinity of the end portion of the substrate holder 30 on the +X side. Then, to the substrate exchange position located above the substrate holder 30, the following ₁ after exposure of the substrate P ₂ P substrate by the substrate transfer robot hand 36 with the conveyance.

Next, (b) the substrate P near the + X side of the end portion ₁₆ as shown in FIG, and not the pair of holding-out portion of the carriage means 70a on the substrate carry-out suction holding means 34. One pair of carriage unloading means 70a releasing of _holding the substrate P is attracted. Then, above the substrate holder 30, the P conveyed to the vicinity of the end portion of the _substrate above the substrate P ₂ -X side of the apparatus by one pair of brackets 70b adsorption loading remains.

Then, as shown in FIG 6 (c), the main control unit 34 by the substrate carry-out device to drive the + X direction, the movement of the substrate P ₁ + X direction. The substrate P ₁ moves the upper surface of the substrate holder 30 and the upper surface of the guide beam 38 disposed on the +X side of the substrate stage device 20 as a guiding surface, substantially parallel to the horizontal plane, from the substrate holder 30 The guide beam 38 is transferred. Beam 38 has an air bearing guide, the substrate P moves in the _one pair of discharge below the surface of _a substrate P of pressurized gas, whereby the non-contact support the substrate P _1. Also, the substrate holder 30 is also pressurized by the gas discharge surface of the substrate under P _1, and functions equally with the air bearing.

Further, the unloading of the substrate P ₁ in parallel operation, the robot 36 at a high acceleration moves to the + X side, thereby fixing the upper substrate 30 from the retracted support. At this time, in order to reduce the friction between the robot 36 and the substrate P ₂ , the robot 36 discharges pressurized gas to the lower surface of the substrate P ₁ . When the robot 36 is retracted from above the substrate holder 30, the substrate P ₂ is sucked and held by the pair of loading tray devices 70b in the vicinity of the end portion on the -X side, and thus remains on the substrate holder 30.

The substrate P _{2 that} has lost the support from the lower side of the robot 36 moves downward (drops) in the direction of gravity due to its own weight, and land on the substrate holder 30 as shown in FIG. 7(a). Further, the main control device also lowers and drives the pair of holding pads 72b carried into the carriage device 70b. At this time, the substrate P ₂ slowly moves at an acceleration smaller than the gravitational acceleration by the air resistance between the substrate P ₂ and the upper surface of the substrate holder 30. Also, the substrate holder 30 after the unloading of _a substrate P also continued to discharge the pressurized gas from the upper surface, thereby mitigating the impact when the land to the substrate P on the substrate holder 30 with _two of the.

Further, since the pressurized gas is ejected from the substrate holder 30, the substrate P _{2 is} landed on the substrate holder 30, and between the substrate P ₂ and the upper surface of the substrate holder 30 (substrate mounting surface). A minute gap is formed by the static pressure of the pressurized gas. The main control device holds the pair of loading tray devices 70b in a state in which the micro gaps are formed (the substrate P _{2 is} non-contactly supported by the substrate holder 30) based on the output of the substrate position measuring system (not shown). 72b independently minute driving the X-axis direction, thereby aligning the substrate ₂ of P.

After the alignment operation is completed, as shown in FIG. 7(b), the substrate holder 30 stops the ejection of the pressurized gas, and the substrate P ₂ is vacuum-adsorbed and held. The holding pads 72b of the pair of loading tray devices 70b are housed in the slits 32b of the substrate holder 30 (see Fig. 5(a)).

Next, the cleaning device of the substrate holder 30 will be described. A substrate holder held by a plurality of pins supporting the substrate P from the bottom (a so-called top pin type substrate holding) In the case where the dirt adhering to the upper surface of the substrate holder falls between the plurality of pins, the possibility of directly adhering to the back surface of the substrate P is low. On the other hand, in the substrate holder 30 of the present embodiment, the holding surface portion 60 functioning as the substrate mounting surface is formed flat by a plurality of flat plates 62, and the dirt is directly attached to the substrate. The possibility of face is high.

Therefore, as shown in FIGS. 8(a) and 8(b), the substrate stage device 20 of the present embodiment includes a cleaning device 80 for cleaning the upper surface of the substrate holder 30 (substrate mounting). Face cleaner 90. The cleaning device 80 has a pair of support blocks 82a spaced apart in the X-axis direction on the +Y side and the -Y side of the substrate holder 30, respectively. The pair of support blocks 82a are attached to the side surface of the substrate holder 30 via an angular steel material 82b having an L-shaped YZ cross section. Further, a pair of support blocks 82a are provided with guide bars 84a extending in the X-axis direction. In the guide bar 84a, a slider 84b (for example, a linear bushing) that is freely movable in the X-axis direction along the guide bar 84a is attached.

A plate-like base member 86 extending in the -X direction is attached to the slider 84b. The base member 86 is disposed in parallel with each other, and one of the pair of link members 88 in the longitudinal direction of each of the intermediate portions is rotatably supported in the Y-axis direction.

The cleaner 90 is formed of a member having a rectangular XZ cross section extending in the Y-axis direction, and the length of the Y-axis direction is set such that the end portion on the ±Y side protrudes outward from the end portion of the substrate holder 30 on the ±Y side. The length in the Y-axis direction of the upper surface of the substrate holder 30 (holding surface portion 60 (see FIGS. 2 and 3)) is slightly longer. The cleaner 90 is formed of, for example, a porous body made of PVA (polyvinyl alcohol). The cleaner 90 is inserted between the upper end portion of the pair of link members 88 disposed on the +Y side of the substrate holder 30 and the vicinity of the upper end portion of the pair of link members 88 disposed on the -Y side of the substrate holder 30. And the shaft member rotatably supported in the Y-axis direction is supported by the link member 88. In addition, the cleaner 90 may not be directly mounted to the link member 88, for example, for exchange, position adjustment It is easy to install via other components.

The cleaner 90 is disposed such that its lower surface is parallel to the upper surface of the substrate holder 30. If the link members 88 are rotated about the Y-axis direction with respect to the base member 86, the posture is maintained in the XZ plane (cleaning) The lower surface of the device 90 is rotated in the Y-axis direction while being maintained in parallel with the upper surface of the substrate holder 30. Further, a tapered recess 92 is formed in the vicinity of both end portions of the upper surface of the cleaner 90. The function of the recess 92 will be described later.

An auxiliary plate member 96 having a slit groove 94 that opens upward (+Z side) is attached to the vicinity of the lower end portion of the pair of link members 88. The pair of link members 88 are rotatably attached to the auxiliary plate member 96 in the direction of the Y axis.

9(a) and 9(b) show a state in which the loading carriage device 70b and the cleaning device 80 are combined. In a state where the slider 84b (and the base member 86) is located on the most-X side of the movable range, the cleaner 90 and the slit groove 94 formed in the auxiliary plate member 96 do not become obstacles to the substrate exchange operation. It is disposed on the outer side (-X side) of the substrate holder 30. The range of rotation of the cleaner 90 is limited by the limit pin 82c attached to the angle steel 82b.

Next, the operation of the cleaning device 80 will be described. In the present embodiment, the cleaning operation of the substrate holder 30 is performed in a state where the substrate holder 30 is positioned at a predetermined cleaning position. The cleaning position is not particularly limited, and for example, it may be the same as the substrate exchange position. When the substrate holder 30 is placed in the cleaning position, the actuator is fixed above the substrate holder 30 (for example, the top surface) as shown in FIGS. 9( a ) and 9 ( b ). 98. The actuators 98 are provided in a pair in the Y-axis direction corresponding to the recesses 92 of the cleaner 90 described above.

9(a) and 9(b), the main control device (not shown) connects the shaft 74 of the carriage device 70b to - as shown in Figs. 10(a) and 10(b). Z direction drive, The control pin 78 attached to the shaft 74 is fitted to the slit groove 94 formed in the auxiliary plate member 96. When the shaft 74 is driven in the -X direction while the control pin 78 is fitted into the slit groove 94, the auxiliary plate member 96 is moved in the -X direction. Thereby, as shown in FIGS. 11(a) and 11(b), the cleaner 90 is rotated via the pair of link members 88, and the lower surface of the cleaner 90 is in contact with the upper surface of the substrate holder 30 (opposing direction). .

Then, the main control device drives the actuator 98 as shown in FIG. 12, and the ball 98a of the actuator 98 is inserted into the recess 92 of the cleaner 90. Thereby, the relative movement of the cleaner 90 relative to the actuator 98 in the XY plane is limited. Further, the shaft 74 of the loading tray device 70b is driven in the +Z direction, whereby the control pin 78 is detached from the slit groove 94.

In this state, the main control device drives the substrate holder 30 in the -X direction in a long stroke as shown in FIG. The moving speed of the substrate holder 30 at this time is not particularly limited, but is preferably, for example, a speed that is slower than the moving speed of the substrate holder 30 during the scanning exposure operation. Thereby, the cleaner 90 and the substrate holder 30 relatively move in the X-axis direction. Moreover, the base member 86 supporting the cleaner 90 via the link member 88 integrally moves along the guide bar 84a with the slider 84b. FIG. 14 shows a state in which the cleaning of the surface of the substrate holder 30 is completed. The dirt adhering to the surface of the substrate holder 30 is removed by the cleaner 90 by the cleaning operation described above.

Further, the material of the cleaner 90 can be appropriately changed, and for example, it can be stone, metal, synthetic resin or the like. Further, the cleaner 90 may be an air bearing that discharges pressurized gas in a non-contact manner with respect to the substrate holder 30, or a drum type cleaner 90A may be used as in the cleaning device 80A shown in FIG. In this case, the frictional resistance of the cleaner 90A and the substrate holder 30 is lowered, and the cleaner 90A and the substrate holder 30 can be smoothly moved relative to each other.

Moreover, a high-pressure nozzle can be installed in the cleaner 90 to blow off dirt, and Vacuum suction is performed. Further, the brush can be attached to the cleaner 90 to move while cleaning the substrate holder 30. Further, the surface of the substrate holder 30 may be wiped while discharging water or vapor from the cleaner 90. Moreover, it is also possible to combine these.

Further, in the above embodiment, the substrate holder 30 is moved relative to the positionally fixed cleaner 90 to clean the substrate holder 30. However, as shown in Fig. 16, the X driver 98A may be fitted to the substrate holder 30. The actuator 98 in the state of the cleaner 90 is moved in the X-axis direction with respect to the substrate holder 30, thereby cleaning the substrate holder 30. Further, as shown in FIG. 17, the hook 36A may be attached to the robot hand 36 for substrate transfer, and the robot 90 may relatively move the cleaner 90 with respect to the substrate holder 30. In this case, the hook 36A may be brought into spherical contact with the fastening portion of the cleaner 90 to suppress generation of dust, or non-contact fastening using an air bearing or a magnet. Further, as in the cleaning device 80B shown in Fig. 18, the slider 84b can be driven with respect to the substrate holder 30 by the X driving device 84c spanned between the pair of support blocks 82a. As the X drive device, a belt drive device using a linear motor or a rotary motor, a traction drive device for a metal wire, a rack and pinion drive device, and the like can be used.

According to the substrate holder 30 of the present embodiment described above, since most of the substrate mounting surface (the upper surface of the substrate holder 30) is a flat surface, for example, the substrate P is fixed compared to the conventional pin-type substrate holder. Thinning can also be used for plane correction. Further, since the unevenness is minimized, the reflectance or the amount of reflection is substantially constant, and uneven transfer due to exposure is less likely to occur. Therefore, high-precision exposure is possible.

Further, the base member 40 having a honeycomb structure, the pipe portion 50 composed of a plurality of corner pipes 52, and the three-layer structure substrate holder 30 formed of the stone or CFRP holding surface portion 60 are lightweight and highly rigid, and the substrate is lightweight and highly rigid. The surface of the holder 30 is excellent in flatness. Moreover, the substrate is solid The holder 30 functions as an air bearing, so that the substrate P can be completely floated on the substrate holder 30. Therefore, the substrate holder 30 can be made to function as a surface guide for sliding movement of the substrate P.

Further, since the holding surface portion 60 whose upper surface functions as the substrate mounting surface is formed by, for example, black granite (gabstone) or a flat plate 62 such as ceramics, the surface has high rigidity, and even if it is repeatedly brought into contact with the substrate P, wear is small. Moreover, the reflectance is low, and even if it is worn, the reflectance may be less likely to change. Moreover, since it is a brittle material, even if the surface is damaged, the surface is not convex like a metal material. Further, since the surface is hard, it is easy to carry out the feeding processing with a small amount of cutting by grinding or polishing, and as a result, the flatness is easily improved. Further, since the heat capacity is large and the temperature changes are sluggish, it is less likely to cause rapid deformation such as deformation of the substrate P. Further, in the case of a stone or a porous ceramic, since there are minute pores, it is less likely to cause a ringing effect between the substrates P.

Further, since the pipe portion 50 formed of the plurality of angle tubes 52 is disposed as an intermediate layer between the base portion 40 and the holding surface portion 60, the production of the gas piping path and the flatness adjustment of the substrate mounting surface can be easily performed. Further, since the joint for piping is disposed on the side surface of the substrate holder 30, the rigidity of the base portion 40 can be suppressed from being lowered, for example, compared with the case where the gas is supplied from the lower surface of the substrate holder 30 to the piping portion 50 via the base portion 40. And the configuration of the base portion 40 becomes simple, and assembly or maintenance becomes easy.

Further, in the present embodiment, when the substrate P is placed on the substrate holder 30, the substrate P is dropped by its own weight. At this time, with respect to the substrate P, the force (air resistance) which is prevented from falling due to its own weight acts due to the air resistance between the back surface of the substrate P and the surface of the substrate holder 30. Further, in the present embodiment, the surface of the substrate holder 30 is substantially flat, and thus the base The air between the back surface of the board P and the surface of the substrate holder 30 does not escape, and the above air resistance can be surely applied to the substrate P. Therefore, the substrate P can be slowly landed on the substrate holder 30.

Further, the configuration of the above embodiment can be changed as appropriate. For example, in the substrate holder 30 of the above-described embodiment, the through holes 58 are formed in all of the plurality of corner tubes 52 included in the line portion 50, and the (closed) angle tube 52 in which the through holes 58 are not formed may be prepared. The angle tube 52 is deformed by supplying the pressurized gas to the sealed angle tube 52 (or vacuuming the gas in the angle tube 52), thereby controlling the surface of the substrate holder 30 (holding the face 60). Flatness. In this case, the upper surface of the substrate holder 30 can be made to have a high-precision plane without depending on the processing of the holding surface portion 60.

Further, in the above-described embodiment, the plurality of flat plates 62 forming the holding surface portion 60 are mechanically formed with a plurality of through holes 68. However, as long as the pressurized gas supplied from the pipe portion 50 can be ejected or from the pipe portion 50 The vacuum attraction of the supply is not limited to the gas attraction. For example, the flat plate 62 may be formed of a porous member, and the pressurized gas may be ejected and the gas may be attracted through the micropores of the porous member. Further, in the substrate holder 30 of the above-described embodiment, the area of the base portion 40, the conduit portion 50, and the holding surface portion 60 in plan view is set to be substantially the same. However, the overlapping positions are not limited thereto, and the areas are not limited thereto. Can be different from each other. Further, the substrate holder 30 of the above embodiment performs both the discharge of the pressurized gas and the suction of the gas. However, the present invention is not limited thereto, and only one of them may be performed.

Further, in the above-described embodiment, the duct portion 50 is formed by a plurality of angle tubes 52. However, the present invention is not limited thereto, and a groove may be formed on the surface of the plate member, and the base portion 40 may be overlapped or the face may be held on the plate member. 60, thereby forming the piping portion 50 (the flow path of the gas). In this case, the base portion 40 or the holding surface portion 60 may also be in a face portion facing the plate-like member forming the pipe portion 50. A groove is formed at a position corresponding to the groove.

Further, the wavelength of the light source used in the illumination system 12 and the illumination light IL irradiated from the light source is not particularly limited, and may be, for example, an ArF excimer laser light (wavelength: 193 nm) or a KrF excimer laser light (wavelength: 248 nm). Vacuum or ultraviolet light such as light or F2 laser light (wavelength 157 nm).

Further, in the above embodiment, the equal magnification system is used as the projection optical system 16, but the present invention is not limited thereto, and a reduction system or an amplification system may be used.

Further, the use as an exposure apparatus is not limited to an exposure apparatus for liquid crystal for transferring a liquid crystal display element pattern to a prismatic glass sheet, and can be widely applied to, for example, an organic EL (Electro-Luminescence) panel manufacturing. An exposure apparatus, an exposure apparatus for semiconductor manufacturing, and an exposure apparatus for manufacturing a thin film magnetic head, a micromachine, and a DNA wafer. Further, not only a micro component such as a semiconductor element but also a photomask or a reticle used for manufacturing a photo-exposure device, an EUV exposure device, an X-ray exposure device, an electron beam exposure device, or the like, and transfer of a circuit pattern can be applied. An exposure device to a glass substrate or a germanium wafer.

Further, the object to be exposed is not limited to a glass plate, and may be another object such as a wafer, a ceramic substrate, a film member, or a blank mask. In the case where the object to be exposed is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and for example, it may include a film-like member having a flexible sheet member. Further, the exposure apparatus of the present embodiment is particularly effective when the substrate having a length of one side or a diagonal length of 500 mm or more is an object to be exposed. Further, when the substrate to be exposed is in the form of a flexible sheet, the sheet may be formed into a roll shape.

Electronic components such as liquid crystal display elements (or semiconductor elements) are subjected to the following steps And manufacturing, that is, performing the function of the component, the step of performance design, the step of fabricating the photomask (or the reticle) based on the step of fabricating the reticle (or reticle), by the above embodiments The exposure apparatus and the exposure method thereof transfer the pattern of the mask (the reticle) to the lithography step of the glass substrate, and the development step of developing the exposed glass substrate by etching the portion other than the portion where the resist remains The etching step of removing the exposed member removes the resist removal step, the component assembly step, the inspection step, and the like which are performed without etching. In this case, in the lithography step, the exposure method is performed by using the exposure apparatus of the above-described embodiment, and the element pattern is formed on the glass substrate, so that an element having a high degree of integration can be manufactured with high productivity.

[Industrial availability]

As explained above, the object holding device of the present invention is suitable for holding an object. Moreover, the exposure apparatus of the present invention is suitable for exposing an object. Moreover, the method of manufacturing a flat panel display of the present invention is suitable for the manufacture of a flat panel display. Moreover, the component manufacturing method of the present invention is suitable for the manufacture of microcomponents.

30‧‧‧Sheet holder

40‧‧‧ base

50‧‧‧Pipeline Department

52‧‧‧Corner tube

60‧‧‧ Keeping the face

62‧‧‧ tablet

Claims (21)

An object holding device includes: a holding portion having a holding surface for holding an object; and a gas flow path portion having a flow path for controlling a gas between the holding surface and the object, and the holding portion; and a base portion; The gas flow path portion is placed, and the flow path is extended in the first direction in the gas flow path portion, and is disposed in a plurality in the second direction intersecting the first direction. The object holding device according to claim 1, wherein the holding portion includes a plurality of holding members including the holding surface. The object holding device according to claim 1 or 2, wherein the gas flow path portion includes a plurality of flow path members including the flow path. The object holding device according to claim 3, wherein the gas flow path portion is formed by arranging the flow paths in the second direction. The object holding device according to any one of claims 1 to 4, wherein the holding portion or the base portion is provided to cover the flow path. The object holding device according to any one of claims 1 to 5, wherein the holding portion has at least one first through hole, and the flow path communicates with the first through hole. The object holding device according to claim 6, wherein the flow path member has at least a second through hole through which the gas passes, and the flow path communicates with the first through hole and passes through the first and second Through hole control The above gas between the holding surface and the object is made. The object holding device according to any one of claims 1 to 7, wherein the gas flow path portion has a supply path for supplying the gas between the holding surface and the object, and suction for attracting the gas. At least one of the roads. The object holding device according to claim 8, wherein the gas flow path portion passes the gas through the supply path and the suction path in the first direction. The object holding device according to any one of claims 1 to 9, wherein the base portion has a blank space layer in which a plurality of blank spaces are formed. The object holding device according to claim 10, wherein the base portion is configured to sandwich the blank space layer by a first member on one surface side of the blank space layer and a second member on the other surface side. The object holding device according to any one of claims 1 to 11, wherein the base portion, the holding portion, and the gas flow path portion are formed in a plate shape and overlap each other to be laminated. The object holding device according to any one of claims 1 to 12, wherein the holding portion is formed of stone or ceramic. An object holding device comprising: a holding portion having a holding surface for holding an object; a gas flow path portion having a flow path for controlling a gas between the holding surface and the object, and the holding portion; and a base portion; The gas flow path portion is provided. The object holding device according to any one of claims 1 to 14, further comprising a driving device that holds the one of the outer peripheral portions of the object held by the holding surface to drive the object. The object holding device of claim 15, further comprising a cleaning device, comprising: a cleaning member that is movable between a facing position facing the holding surface and a spaced apart position from the mounting surface; The cleaning member is cleaned by relatively moving the cleaning member relative to the holding portion, and the cleaning member is driven between the opposing position and the spaced position by the driving device. An exposure apparatus comprising: the object holding device according to any one of claims 1 to 16; and a pattern forming device that forms an established pattern with the object held by the object holding device using an energy beam. The exposure apparatus of claim 17, wherein the object system is used for a substrate of a flat panel display. The exposure apparatus of claim 18, wherein at least one side of the substrate has a length or a diagonal length of 500 mm or more. A method of manufacturing a flat panel display, comprising: exposing the substrate using an exposure apparatus according to claim 18 or 19; and developing the exposed substrate. A component manufacturing method comprising: An action of exposing the object by using an exposure device as set forth in claim 17; and an action of developing the exposed object.