TW201704506A - 使用可變節距編碼孔徑之陰影遮罩對準技術 - Google Patents
使用可變節距編碼孔徑之陰影遮罩對準技術 Download PDFInfo
- Publication number
- TW201704506A TW201704506A TW105104805A TW105104805A TW201704506A TW 201704506 A TW201704506 A TW 201704506A TW 105104805 A TW105104805 A TW 105104805A TW 105104805 A TW105104805 A TW 105104805A TW 201704506 A TW201704506 A TW 201704506A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- grid
- shadow mask
- light
- bars
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
- C23C16/042—Coating on selected surface areas, e.g. using masks using masks
-
- H10P72/57—
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/812,076 US9580792B2 (en) | 2010-06-04 | 2015-07-29 | Shadow mask alignment using variable pitch coded apertures |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201704506A true TW201704506A (zh) | 2017-02-01 |
Family
ID=57885006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105104805A TW201704506A (zh) | 2015-07-29 | 2016-02-18 | 使用可變節距編碼孔徑之陰影遮罩對準技術 |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN106399932B (fr) |
| TW (1) | TW201704506A (fr) |
| WO (1) | WO2017019126A1 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7220030B2 (ja) * | 2018-07-25 | 2023-02-09 | 株式会社ジャパンディスプレイ | マスクユニットの製造装置 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4211489A (en) * | 1978-01-16 | 1980-07-08 | Rca Corporation | Photomask alignment system |
| JPS59220922A (ja) * | 1983-05-31 | 1984-12-12 | Toshiba Corp | 位置合わせ方法 |
| US20040086639A1 (en) * | 2002-09-24 | 2004-05-06 | Grantham Daniel Harrison | Patterned thin-film deposition using collimating heated mask asembly |
| US20050006223A1 (en) * | 2003-05-07 | 2005-01-13 | Robert Nichols | Sputter deposition masking and methods |
| JP2008293798A (ja) * | 2007-05-24 | 2008-12-04 | Toyota Industries Corp | 有機el素子の製造方法 |
| US7657999B2 (en) * | 2007-10-08 | 2010-02-09 | Advantech Global, Ltd | Method of forming an electrical circuit with overlaying integration layer |
| US9122172B2 (en) * | 2010-06-04 | 2015-09-01 | Advantech Global, Ltd | Reflection shadow mask alignment using coded apertures |
| WO2011153016A1 (fr) * | 2010-06-04 | 2011-12-08 | Advantech Global, Ltd. | Alignement de masque perforé à l'aide d'ouvertures codées |
| CN103019052B (zh) * | 2011-09-23 | 2015-10-21 | 中芯国际集成电路制造(北京)有限公司 | 光刻对准标记以及包含其的掩模板和半导体晶片 |
-
2016
- 2016-01-29 WO PCT/US2016/015545 patent/WO2017019126A1/fr not_active Ceased
- 2016-02-18 TW TW105104805A patent/TW201704506A/zh unknown
- 2016-03-01 CN CN201610114573.6A patent/CN106399932B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN106399932B (zh) | 2020-07-03 |
| WO2017019126A1 (fr) | 2017-02-02 |
| CN106399932A (zh) | 2017-02-15 |
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