TW201638264A - Cutting sheet and method for manufacturing semiconductor wafer - Google Patents

Abstract

The present invention relates to a method of manufacturing a dicing sheet and a semiconductor wafer. Wherein, the dicing sheet of the present invention has the substrate 3 and the intermediate layer 2 formed on one side thereof, and the dicing sheet 10 of the adhesive layer 1 formed on the intermediate layer 2, and the adhesive layer 1 contains the intramolecular layer A compound having an energy ray-curable double bond, the storage modulus G' at 23 ° C before curing of the adhesive layer 1 is larger than the storage modulus G' of the intermediate layer 2 at 23 ° C, and hardening for the adhesive layer 1 When the front dicing sheet 10 is subjected to a 180° peeling adhesion test based on JISZ0237:2000, the measured adhesive force is 2000 mN/25 mm or more, and the adhesive layer 1 is hardened before 23 ° C. The loss factor tan δ is 0.23 or more. By the dicing sheet 10, the laminated body obtained by adhering the dicing sheet 10 to the semiconductor wafer 30 is hard to be partially peeled off even if it is left to stand for a set time.

Description

Cutting sheet and method for manufacturing semiconductor wafer

The present invention relates to a dicing sheet, in particular, a dicing sheet for fixing a semiconductor wafer when a semiconductor wafer is cut into a plurality of circuits for each semiconductor wafer; and the present invention relates to the use of the dicing sheet A method of manufacturing a semiconductor wafer. In particular, the dicing sheet of the present invention is suitable for use in fixing and cutting a semiconductor wafer having a projecting electrode on its surface, such as a semiconductor wafer having a ruthenium perforated electrode (TSV).

After the surface of the semiconductor wafer is formed into a circuit, a back surface polishing process for the wafer is performed, and a back surface polishing process for adjusting the thickness of the wafer and a cutting process for cutting the wafer into a plurality of set wafer sizes are performed. Further, in the case of performing the back surface polishing process, it is sometimes necessary to carry out a processing such as a back surface etching treatment with heat generation, and a process such as depositing a metal film on the back surface at a high temperature. The semiconductor wafer (semiconductor wafer) cut into a plurality of wafer sizes is taken up and transferred to the next process.

Recently, with the spread of IC cards, the constituent semiconductor wafers have become thinner and thinner. Therefore, wafers having a thickness of about 350 μm are required to be thinned to 50 to 100 μm or less.

In addition, in order to cope with the increase in capacity and high performance of electronic circuits, a laminated circuit for forming a volume layer of a semiconductor wafer is being developed. Although this product In the layer circuit, the conductive connection of the original semiconductor wafer is generally carried out by wire bonding, and recently due to miniaturization. The necessity of high performance does not involve wire bonding, but develops an efficient method, such as providing an electrode (through electrode) penetrating to the back surface on the surface of the semiconductor wafer forming circuit, and electrically connecting directly between the upper and lower wafers. Methods.

In the method for manufacturing the perforated electrode wafer, for example, a through hole may be prepared by a plasma at a position where the semiconductor wafer is provided, and a copper conductor may be injected into the through hole to be etched. The surface of the semiconductor wafer forms a circuit and a via electrode. The semiconductor wafer forming the circuit and the via electrode is cut by a dicing sheet forming an adhesive layer on the substrate film, thereby obtaining an individual perforated electrode wafer.

As described above, the patent document discloses that in the cutting process for obtaining a perforated electrode wafer, the adhesive layer formed on the base film is pressed against the protruding perforated electrode to be deformed, and protruded from the electrode. A recess of a similarly shaped adhesive layer is disposed in the electrode, and the semiconductor wafer forming the perforated electrode is pasted. A method of fixing to a dicing sheet, followed by dicing, thereby obtaining an individual perforated electrode wafer (Patent Documents 1, 2). However, in the dicing sheet described in Patent Documents 1 and 2, if a perforated electrode is placed in the adhesive layer, a residue of the adhesive may be generated in a narrow range between the perforated electrodes, and the residue may contaminate the surface of the wafer. This leads to low reliability of semiconductor wafers. In the methods of Patent Documents 1 and 2, there is a method of reducing the residue of the residue. However, in the dicing sheets described in Patent Documents 1 and 2, in order to insert the perforation, it is not possible to completely eliminate the residue. The electrode must be lowered in elasticity when cutting, so that the chip is easily chipped due to vibration during cutting.

In order to solve the above problem, Patent Document 3 describes a dicing sheet which is cut and topped as a residue which does not leave a residue of the adhesive layer between the protruding electrodes (perforated electrodes), and which is not damaged. The adhesive layer consists of an adhesive layer having a thickness of 8 to 30 μm formed on the intermediate layer and a thickness of 8 to 30 μm formed on the intermediate layer, and the adhesive layer contains a compound containing an energy ray hardening double bond in the molecule, and is adhered. The storage modulus G' at 23 ° C before the adhesion layer hardens exceeds 4 times the storage modulus G' of the intermediate layer at 23 ° C. A wafer formed of three rows and three columns in a row of three rows and three columns of a columnar electrode having a height of 15 μm and a diameter of 15 μm is formed at a pitch of 40 μm pitch (Pitch). In the center electrode of the shaped electrode, the portion of the electrode having a height of 7.5 μm or less does not contact the adhesive layer.

Further, a dicing sheet containing an intermediate layer formed of a cured product containing urethane is also described in Patent Document 4, in association with the invention described in Patent Document 3.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2006-202926

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2010-135494

[Patent Document 3] Japanese Patent Laid-Open No. 2013-098408

[Patent Document 4] Japanese Patent Laid-Open No. 2013-197390

As shown in Patent Documents 3 and 4 shown in FIG. 2, when the semiconductor wafer 30 is pasted, the adhesive layer 21 does not follow the projection between the protruding electrodes 31. The dicing sheet 20 traced on the peripheral edge 30A of the region (electrode forming region) where the emergent electrode 31 is formed, through the dicing sheet 20, the residue of the adhesive layer 21 does not remain between the protruding electrodes 31, and It is suppressed that residue remains on the peripheral edge 30A of the electrode formation region due to polymerization incompleteness. Further, the adhesive layer 21 is adhered to the semiconductor wafer 30 on the peripheral edge 30A of the electrode formation region, since the adhesive layer does not become excessively soft, and water can be prevented from intruding during cutting, and the cutting property is excellent. It also prevents the occurrence of chip cracking. In addition, by adhering the adhesive layer 21 to the energy line, the adhesion can be controlled, and in addition to easy picking up of the wafer, damage to the wafer can be prevented.

Similarly, in the dicing sheet 20 described in Patent Documents 3 and 4, although the dicing sheet 20 has excellent characteristics, the dicing sheet 20 is recently adhered to the layered body obtained by the semiconductor wafer 30, and is set until the cutting process starts. When the period is stationary, the peripheral edge 30A of the electrode formation region is traced, and it is found that the adhesive layer 21 which is originally adhered to the semiconductor wafer 30 is completely adhered to the semiconductor wafer 30, and partial peeling may occur on the semiconductor wafer 30 ( In the patent specification of the present invention, this phenomenon is also referred to as "partial peeling". Specifically, the portion shown as the peripheral edge 30A of the electrode formation region in FIG. 3 is a portion where the adhesive layer 21 is partially peeled off from the semiconductor wafer 30, that is, a portion where partial peeling occurs, based on the partial peeling. When the degree of peeling of the adhesive layer 21 is large, that is, when the area where partial peeling occurs is wide, the cutting process by the above laminated body affects the stability of the cutting operation.

The present invention has been made in view of the above problems, and an object thereof is to provide a substrate obtained by adhering a dicing sheet to a semiconductor wafer for a set period of time. Specifically, it is not easy to cause the same partially peeled dicing sheet as described above, and a method of manufacturing a semiconductor wafer by using the dicing sheet.

In order to achieve the above object, the present invention provides the following contents.

(1) A dicing sheet according to the present invention comprises a substrate and an intermediate layer formed on one surface thereof, and a dicing sheet of an adhesive layer formed on the intermediate layer, wherein the adhesive layer contains a molecule a compound containing an energy ray-curable double bond, wherein the storage modulus G' at 23 ° C before curing of the adhesive layer is larger than the storage modulus G' at 23 ° C of the intermediate layer, and the bonding is performed The dicing sheet before hardening of the agent layer is based on JIS Z0237:2000. When the 180° peeling adhesion test is performed on the 矽 mirror wafer, the measured adhesion force is 2000 mN/25 mm or more, and the above adhesive layer is hardened before The loss factor tan δ at 23 ° C is 0.23 or more.

(2) The dicing sheet according to the above (1), wherein the compound having an energy ray-curable double bond in the molecule contains energy capable of binding an energy ray polymerizable group on a main chain or a side chain of the polymer. Wire hardening type adhesive polymer.

(3) The dicing sheet according to the above (1) or (2), wherein the intermediate layer has a storage modulus G' at 23 ° C of 1 × 10 ⁴ Pa or more and less than 1 × 10 ⁵ Pa.

(4) The dicing sheet according to any one of the above (1) to (3), wherein the storage modulus G' at 23 ° C before the curing of the adhesive layer is 3 × 10 ⁵ Pa or more.

(5) The dicing sheet according to any one of (1) to (4), wherein the adhesive layer has a reactive functional group-containing acrylic polymer and a crosslinking agent, and the acrylic polymer 100 The mass part contains 5 parts by mass or more of a crosslinking agent.

(6) The dicing sheet according to (5) above, characterized in that: The crosslinking agent is an isocyanate crosslinking agent.

(7) The dicing sheet according to any one of (1) to (6), wherein the dicing sheet is used for adhering to a wafer provided with a protruding electrode.

(8) The dicing sheet according to the above (7), wherein the protruding electrode is a perforated electrode.

(9) The dicing sheet according to the above (7) or (8), wherein the thickness of the intermediate layer is 0.5 times or more and 1.5 times or less the height of the protruding electrode.

(10) The dicing sheet according to any one of (1) to (9), wherein the storage modulus G' at 23 ° C before the curing of the adhesive layer is higher than the storage of the intermediate layer at 23 ° C The modulus G' is 4 times larger.

The dicing sheet according to any one of the above aspects, wherein the thickness of the adhesive layer is 5 μm or more and 50 μm or less.

The dicing sheet according to any one of the above aspects, wherein the intermediate layer has a thickness of 5 μm or more and 50 μm or less.

(13) A method of producing a semiconductor wafer according to the present invention, comprising the process of adhering the dicing sheet according to any one of (1) to (12) above, on an electrode forming surface of a semiconductor wafer having a protruding electrode And a manufacturing process of the plurality of semiconductor wafers in which the semiconductor wafers are cut for each circuit, and a process of drawing the semiconductor wafers.

The present invention provides a dicing sheet and a semiconductor wafer manufacturing method using the dicing sheet, wherein the laminated body obtained after the dicing sheet is adhered to the semiconductor wafer is less likely to occur even if it is allowed to stand for a set period of time Part of the stripping.

10, 20‧‧‧ cutting pieces

1, 21‧‧‧ adhesive layer

2‧‧‧Intermediate

3‧‧‧Substrate

30‧‧‧Semiconductor Wafer

30A‧‧‧The periphery of the electrode formation area

30A’‧‧‧ Part of the partial peeling

31‧‧‧ protruding electrode

Fig. 1 is a schematic cross-sectional view showing a dicing sheet according to an embodiment of the present invention.

Fig. 2 is a cross-sectional view showing the state in which the dicing sheets described in Patent Nos. 3 and 4 are adhered to a semiconductor wafer in a conceptual form.

[Fig. 3] A cross-sectional view showing a partially peeled cut piece in a conceptual form.

Hereinafter, embodiments of the present invention will be described.

1 is a schematic cross-sectional view of an adhesive sheet according to an embodiment of the present invention, and a dicing sheet 10 according to an embodiment of the present invention has a substrate 3 and an intermediate layer 2 formed on one surface thereof, and The adhesive layer 1 formed on the intermediate layer 2.

(adhesive layer 1)

Before the adhesive layer 1 is hardened (before the irradiation energy line), the storage modulus G' at 23 ° C is larger than the storage modulus G' of the intermediate layer 2 at 23 ° C, and the same, due to the low elasticity of coverage The adhesive layer 1 having a higher elasticity in the form of the intermediate layer 2 of the modulus can appropriately suppress the tracking of the adhesive layer 1 between the protruding electrodes, and at the same time prevent the formation of an adhesive between the protruding electrodes. The residue of layer 1 and the damage of the wafer during the take-up. Further, in the laminated body of the adhesive layer 1 and the intermediate layer 2, since the adhesive layer 1 enhances the low elasticity of the intermediate layer 2, the cutting time can be suppressed compared to the case where only one low elastic modulus layer exists. The vibration of the circle is less prone to chip cracking. From the viewpoint of being able to obtain the above effects more stably, the adhesive layer 1 is hard Before storage, the storage modulus G' at 23 ° C is preferably 4 times larger than the storage modulus G' of the intermediate layer 2 at 23 ° C, preferably the storage modulus G' of the intermediate layer 2 at 23 ° C. It is 5 times larger, more preferably 10 times larger than the storage modulus G' of the intermediate layer 2 at 23 ° C, and the special layer is 20 times larger than the storage modulus G' of the intermediate layer 2 at 23 ° C.

Before the curing of the adhesive layer 1, the storage modulus G' at 23 ° C is preferably 3 × 10 ⁵ Pa or more, more preferably 3.5 × 10 ⁵ Pa or more and 1 × 10 ⁷ Pa or less. Before the adhesive layer 1 is cured, if the storage modulus G' at 23 ° C is within the above range, the tracking effect between the protruding electrodes for suppressing the adhesive can be made more reliable.

For the dicing sheet in the state before the irradiation of the energy ray, the adhesion measured at the 180° tear-off adhesion test of the ruthenium wafer is based on JIS Z0237:2000 (also referred to as "pre-irradiation adhesion" in the patent specification of the present invention. ") is 2000mN / 25mm or more. In the patent specification of the present invention, the conditions for measuring the adhesive force before irradiation are as follows: the surface of the adhesive layer 1 of the dicing sheet is adhered to the enamel mirror wafer by a rubber roller with a load of 2 kgf, and the dicing sheet is adhered to the enamel. On the mirror wafer, the environment was maintained at 23 ° C and 50% relative humidity for 20 minutes. After 20 minutes, the 180 ° peel adhesion test was performed based on JIS Z0237:2000.

The adhesion force before irradiation is 2000 mN/25 mm or more, which makes partial peeling difficult to occur. From the viewpoint of stably reducing the possibility of partial peeling, the adhesive force before irradiation is preferably 2200 mN/25 mm or more, preferably 2300 mN/25 mm. More preferably, it is 2500 mN / 25 mm or more. From the viewpoint of reducing the possibility of partial peeling, the upper limit of the adhesive force before irradiation is not set. From the viewpoint of improving handling and manufacturing stability, the adhesion force before irradiation It is preferably 10000 mN/25 mm or less, preferably 8000 mN/25 mm or less.

Before the adhesive layer 1 is cured, the loss factor tan δ at 23 ° C is 0.23 or more, and since the loss factor tan δ is 0.23 or more, the deformation of the adhesive layer 1 is facilitated. Therefore, it is easier to suppress the deformation of the orthodontic adhesive 1, and partial peeling becomes difficult. From the viewpoint of more stably reducing the possibility of occurrence of partial peeling, the loss factor tan δ is preferably 0.25 or more, more preferably 0.3 or more, and still more preferably 0.38 or more. From the viewpoint of suppressing the occurrence of partial peeling, the upper limit of the above-described loss factor tan δ is not set, and from the viewpoint of handleability and productivity, the loss factor tan δ is preferably 0.7 or less, more preferably 0.65 or less.

The thickness of the adhesive layer 1 is preferably 5 μm or more and 50 μm or less. If the thickness of the adhesive layer 1 is within the above range, the cutting property is improved and the occurrence of chip cracking is suppressed. Further, the tracking of the adhesive layer 1 between the protruding electrodes can be appropriately suppressed, and the protruding electrode can be prevented. The residue of the adhesive layer 1 occurs, or the wafer is damaged during the ejection. Further, it is also possible to maintain the dicing traceability of the periphery of the region (electrode formation region) where the protruding electrodes described later will be formed. The thickness of the adhesive layer 1 is preferably 5 μm or more and 40 μm or less, and more preferably 5 μm or more and 30 μm or less.

The adhesive layer 1 contains a compound having an energy ray-curable double bond in the molecule and a component formed of a substance for exhibiting adhesion (hereinafter also referred to as "energy ray-curable bonding component").

The adhesive layer 1 is formed by an energy ray-curable bonding component and an adhesive composition which is blended with a photopolymerization initiator as required. Further, in the above-mentioned adhesive composition, in order to improve various properties, other components than the above may be contained as needed, and a crosslinking agent is preferable for other components.

Hereinafter, the energy ray-curable adhesive component will be specifically described by taking an acrylic adhesive as an example.

The acrylic adhesive contains an acrylic polymer (A), an energy ray-curable compound (B), and an energy ray-curable compound in order to impart sufficient adhesiveness and film forming property (sheet formation property) to the adhesive composition. B) The energy ray polymerizable group is contained, and when it is irradiated with an energy ray such as an ultraviolet ray or an electron beam, it is polymerized and hardened, and has a function of lowering the adhesion of the adhesive composition. Further, an energy ray-curable adhesive polymer (hereinafter also referred to as a component) formed by combining energy-polymerizable groups in a main chain or a side chain by utilizing the properties of the above components (A) and (B) "(AB)") is better. The energy ray-curable adhesive polymer (AB) has both adhesive properties and energy ray hardenability.

As the acrylic polymer (A), a well-known acrylic polymer can be utilized. The polystyrene-equivalent weight average molecular weight (Mw) of the acrylic polymer (A) is preferably 10,000 to 2,000,000, more preferably 100,000 to 1,500,000. Further, the glass transition temperature (Tg) of the acrylic polymer (A) is preferably from -70 to 30 ° C, more preferably from -60 to 20 ° C.

As the monomer constituting the acrylic polymer (A), a (meth) acrylate monomer or a derivative thereof can be exemplified, and specific examples thereof are methyl (meth) acrylate and ethyl (meth) acrylate, ( An alkyl (meth) acrylate having an alkyl carbon number of from 1 to 18, such as propyl methacrylate, butyl (meth) acrylate or 2-ethylhexyl (meth) acrylate; tricycloalkane (meth)acrylic acid, diphenylethylenedione (meth) acrylate, isodecyl (meth) acrylate, dicyclopentyl (meth) acrylate, dicyclopentenyl (meth) acrylate (meth) acrylate having a cyclic structure such as dicyclopentenyloxy (meth)acrylic acid or quinone imine (meth) acrylate; hydroxymethyl (meth) acrylate a hydroxyl group-containing (meth) acrylate such as ester, 2-hydroxyethyl (meth)acrylate or 2-hydroxypropyl (meth)acrylate; acrylic acid, methacrylic acid, methylene succinic acid, glycidol acrylic acid Ester, glycidyl methacrylate, and the like. Further, vinyl acetate, acrylonitrile, styrene or the like may be copolymerized. The above-mentioned components may be used singly or in combination of two or more. In addition, "(meth)acrylic acid" in the specification of the present invention means all of acrylic acid and methacrylic acid, and the same applies to other similar terms.

Further, the acrylic polymer (A) of the present invention preferably has a reactive functional group, and the reactive functional group and the binder composition constituting the adhesive layer 1 of the present invention are added with a crosslinking functional group reactive functional group. After the reaction, a three-dimensional network structure is formed, and the adhesive layer 1 is more easily adjusted to a set range under the environment of 23 ° C. The reactive functional group of the acrylic polymer (A) may, for example, be a carboxyl group, an amine group, an epoxy group or a hydroxyl group. However, from the viewpoint of easily reacting with the crosslinking agent, it is preferred to select a hydroxyl group. The reactive functional group can be incorporated into the acrylic polymer (A) by constituting the acrylic polymer (A) with a monomer having a reactive functional group such as a hydroxyl group-containing (meth) acrylate or acrylic acid.

The monomer constituting the acrylic polymer (A) preferably contains 5 to 30% by mass of the monomer having a reactive functional group, and more preferably 10 to 30% by mass. If the combination ratio of the monomer having a reactive functional group is in this range, the acrylic polymer (A) can be efficiently crosslinked by the crosslinking agent, and the adhesive layer 1 can be more easily stored at 23 ° C. The modulus G' is adjusted to the set range. Further, the reactive functional group (for example, hydroxyl group) equivalent of the acrylic polymer (A) is preferably 0.17 to 2.0 times the equivalent of the reactive functional group (for example, isocyanate group) of the crosslinking agent, and the acrylic polymer (A) The relationship between the reactive functional group equivalent and the reactive functional group equivalent of the crosslinking agent is carried out in the above range, and the adhesive layer 1 is further improved at 23 ° C. It is easy to adjust the storage modulus G' to the set range.

The energy ray-curable compound (B) is a compound which is cured by irradiation with an energy ray such as an ultraviolet ray or an electron beam. The energy ray-curable compound can be exemplified by a low molecular weight compound having an energy ray polymerizable group (monofunctional, polyfunctional). Monomers and oligopolymers, specific examples are trimethylolpropane triacrylate, tetrakis tetraacrylate, pentaerythritol triacrylate, dipentaerythritol monohydroxy penta, dipentaerythritol hexaacrylic acid, 1,4-butanediol diacrylate Acrylate such as 1,6-hexanediol diacrylate; acrylate containing a cyclic fatty amine structure such as dicyclopentadiene diacrylate dimethyl or isobornyl acrylate; polyethylene glycol diacrylate An acrylate compound such as a low-polyester acrylate, a urethane acrylate oligomer, an epoxy-modified acrylate, a polyether acrylate, or an itaconic acid oligomer. Such a compound has an energy ray-curable double bond in the molecule, and usually has a molecular weight of 100 to 30,000, preferably about 300 to 10,000.

In general, when the component (A) (including the energy ray-curable adhesive polymer (AB) described later) is 100 parts by mass, the ratio of the low molecular weight compound having an energy ray polymerizable group is 0 to 200 parts by mass is more preferable, more preferably 1 to 100 parts by mass, and particularly preferably 1 to 30 parts by mass. The low molecular weight compound having an energy ray polymerizable group, by which it has a low molecular weight, softens the adhesive layer 1 before the energy ray hardening. As a result, the adhesive layer 1 is easily traced between the protruding electrodes, which causes a problem that the adhesive residue is likely to be generated between the protruding electrodes, and therefore, a low molecular weight compound having an energy ray polymerizable group is used. The amount of use is preferably limited to a small amount.

The energy ray-curable adhesive polymer (AB) has the properties of the above components (A) and (B), and is bonded to the energy-chain polymerizable on the main chain or the side chain of the polymer. Formed as a base, as described above, it is preferable to limit the amount of use of the low molecular weight compound having an energy ray polymerizable group to a small amount, in which case the hardening of the adhesive layer 1 by irradiation of the energy ray is performed. There is a possibility that the effect of the residual adhesive layer 1 on the adhesive body is not sufficient, and therefore, the energy ray-curable adhesive polymer (AB) is used for the adhesive layer 1 The adhesive layer 1 before the irradiation of the energy ray is not softened, and the adhesive layer 1 can be sufficiently hardened by the irradiation of the energy ray. In addition, since the energy ray-curable adhesive polymer (AB) has an energy ray polymerizable group in the molecule and may have a reactive functional group, the probability that one of the molecules binds to another molecule is high. After the energy beam is irradiated to cure the adhesive layer 1, the possibility that the low molecular component does not remain in the three-dimensional network structure remains low. Therefore, it is possible to suppress the generation of residue due to the low molecular component remaining without the three-dimensional network structure.

The main structure of the energy ray-curable adhesive polymer is not particularly limited, and is preferably an acrylic copolymer which is widely used as an adhesive.

An energy ray polymerizable group bonded to a main chain or a side chain of an energy ray-curable adhesive polymer, for example, a group containing an energy ray-curable carbon-carbon double bond, and specifically (meth) acrylonitrile group Wait. The energy ray polymerizable group may also be bonded to the energy ray-curable adhesive polymer through an alkylene group, an oxyalkylene group or a polyoxyalkylene group.

The energy ray-curable adhesive polymer (AB) to which the energy ray polymerizable group is bonded has a weight average molecular weight (Mw) of preferably 10,000 to 2,000,000, more preferably 100,000 to 1,500,000. Further, the glass transition temperature (Tg) of the energy ray-curable adhesive polymer (AB) is preferably from -70 to 30 ° C, more preferably from -60 to 20 ° C.

An energy ray-curable adhesive polymer (AB), for example, containing a hydroxyl group, An acrylic acid-bonding polymer having a functional group such as a carboxyl group, an amine group, a substituted amino group or an epoxy group, and a substituent reactive with the functional group, and having 1 to 5 energy-line polymerizable carbon-carbon double bonds per molecule It is obtained after the reaction of the polymerizable group-containing compound. The acrylic adhesive polymer is a (meth) acrylate monomer having a functional group such as a hydroxyl group, a carboxyl group, an amine group, a substituted amine group or an epoxy group, or a derivative thereof and a component (A) constituting the aforementioned. The copolymer formed by the monomer is preferred. The polymerizable group-containing compound may, for example, be (meth)acryloyloxyethyl isocyanate, methyl-isopropyl-α,α-dimethylbenzyl isocyanate or (meth)acryloyl isocyanate. Allyl isocyanate, glycidyl (meth) acrylate, (meth) acrylic acid, and the like.

As described above, the acrylic adhesive containing the acrylic polymer (A), the energy ray-curable compound (B), or the energy ray-curable adhesive polymer (AB) is cured by energy ray irradiation. As the energy line, specifically, an ultraviolet ray, an electron beam, or the like can be exemplified.

Examples of the photopolymerization initiator include a photoinitiator such as a benzoin compound, a methylphenylketone compound, an acylphosphine oxide compound, a dichlorotitanocene compound, a thioxanthone compound, a peroxy compound, and the like, and an amine and an anthracene. Such as photo-sensitive agents, etc., specifically 1-hydroxycyclohexyl phenyl ketone, benzoin, benzoin dimethyl ether, benzoin ethyl ether, benzoin isopropyl ether, diphenylethylenedione thioether, tetramethylamine thioformamidine , azobisisobutyronitrile, bibenzyl, hydrazine, β-fluorene, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, and the like. In the case of the energy ray, when the ultraviolet ray is used, the irradiation time and the irradiation amount can be reduced by using the photoinitiator.

The content of the photopolymerization initiator is theoretically determined by the amount of unsaturated bonds present in the binder layer 1 (the amount of energy-line-hardening double bonds), or the reactivity thereof and the photopolymerization initiator used. But in the complex mixture class It is often difficult to determine this. In general, the content of the photopolymerization initiator is preferably 0.1 to 10 parts by mass, more preferably 1 to 10 parts by mass, based on 100 parts by mass of the energy ray-curable compound (B). ~5 parts by mass. When the content of the photopolymerization initiator is less than the above range, satisfactory elution cannot be obtained due to insufficient photopolymerization; if it exceeds the above range, residues which cannot contribute to photopolymerization are generated, and adhesion is caused. The hardenability of the agent layer 1 becomes insufficient.

The crosslinking agent may, for example, be an organic polyvalent isocyanate compound, an organic polyvalent epoxy compound, an organic polyamine compound or the like, and among them, an organic polyvalent isocyanate compound (isocyanate crosslinking agent) is preferred.

In the case of the organic polyvalent isocyanate compound, an aromatic polyisocyanate compound, an aliphatic polyisocyanate compound, an alicyclic polyisocyanate compound, and a trimer of these organic polyisocyanate compounds, and the organic polyisocyanate compound and the polyol compound can be exemplified. The terminal isocyanate polyurethane prepolymer obtained by the reaction, and the like.

Specific examples of the organic polyisocyanate compound are: 2,4-toluene isocyanate, 2,6-toluene isocyanate, 1,3-benzenediisocyanate, 1,4-dimethylbenzene diisocyanate, diphenylmethane-4, 4'- Diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4, 4' - Diisocyanate, dicyclohexyl-2, 4'-diisocyanate, toluene diisocyanate trimethylolpropane adduct and lysine diisocyanate.

Specific examples of the organic polyvalent epoxy compound are: 1,3-bis(N,N'-diglycidylaminomethyl)cyclohexane, N,N,N',N'-tetraglycidyl-m-phenylene Dimethylamine, ethylene glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, Trimethylolpropane diglycidyl ether, diglycidyl aniline, diglycidylamine, and the like.

Specific examples of the organic polyamine compound are: N,N'-diphenylmethane-4, 4'-bis(1-aziridinecarboxamide), hydroxymethylpropane-tri-beta-azacyclopropylpropionic acid And tetramethylolethane-tris-β-azacyclopropylpropionic acid, and N,N'-toluene-2,4-bis(1-aziridineacyl)triethylene melamine.

When the crosslinking agent is 100 parts by mass of the acrylic polymer (A) (including the energy ray-curable adhesive polymer (AB)), the ratio is preferably 5 parts by mass or more, more preferably 8 to 35 parts by mass. Specially good 12 to 30 parts by mass. The mixing amount of the crosslinking agent is matched in the above range, and the storage modulus G' of the adhesive layer 1 at 23 ° C is more easily adjusted to a desired range.

Further, as the other components, in addition to the crosslinking agent, a dye, a pigment, a deterioration preventing agent, an antistatic agent, a flame retardant, a polyoxymethylene compound, a chain transfer agent, or the like may be added.

It is also preferable that the adhesive layer 1 has a polymer having a branched structure, that is, a polymerizable branched polymer, and the polymerizable branched polymer has a function of improving the peeling property (capability) of the dicing sheet, and is agglomerated for the polymerized branched polymer. The bulk structure (specifically, the molecular weight, the degree of branching structure, the number of energy-line hardening double bonds contained in a single molecule, etc.) is not limited, and a method for obtaining such a polymerizable branched polymer, for example, intramolecular A monomer having two or more energy ray-curable double bonds and a monomer having an active hydrogen group and one energy ray-curable double bond in the molecule are polymerized with a monomer having one energy ray-curable double bond in the molecule. The obtained branched polymer and the active hydrogen group are reacted, and a functional group capable of forming a bond and a compound having at least one energy ray-curable double bond in the molecule are reacted.

The polystyrene-equivalent weight average molecular weight (Mw) of the polymerizable branched polymer from the viewpoint of appropriately suppressing the interaction with the acrylic polymer (A) (including the energy ray-curable adhesive polymer (AB)) It is preferably 1,000 or more and 100,000 or less, more preferably 3,000 or more and 30,000 or less. In the polymerizable branched polymer, the number of energy ray polymerizable groups in a single molecule is not limited.

Further, in the patent specification of the present invention, the so-called polystyrene-equivalent weight average molecular weight (Mw) value means that tetrahydrofuran (THF) is used as a solvent, and is subjected to gel permeation chromatography (GPC) and measured in terms of polystyrene. The value. Specifically, a GPC measuring instrument ("HLC-8220GPC" manufactured by TOSOH CORPORATION) was used, and it was carried out according to the following conditions.

Column: TSKgelGMHXL→TSKgelGMHXL→TSKgel2000HXL

Measuring temperature: 40 ° C

Flow rate: 1ml/min

Detector: differential refractor

(middle layer 2)

The intermediate layer 2 can be, for example, a resin composition such as various adhesives disclosed in the related art. In the case of such an adhesive, although there is no limitation, for example, an adhesive such as rubber, acrylic, urethane, polyfluorene or polyvinyl ether can be used. Further, an energy ray hardening type or a heat foaming type or water expansion type adhesive may be used. For the energy line hardening (ultraviolet curing, electron beam hardening, etc.) type of adhesive, it is particularly preferable to use an ultraviolet curing type adhesive.

In the case where the material constituting the intermediate layer 2 is an acrylic material, the same material as the acrylic adhesive exemplified as the material for constituting the adhesive layer 1 may be used, and the acrylic constituting the adhesive layer 1 may be used. Adhesive containing If the acrylic polymer (A) is contained in the fraction, the energy ray may not contain hardening properties.

When the material constituting the intermediate layer 2 is a urethane-based material, the material is preferably composed of the urethane-containing cured product described in Patent Document 4. The urethane-containing hardening system is an urethane oligo polymer and/or an urethane (meth) acrylate oligo polymer, and an energy ray-hardening monomer compound added as needed. Hardening of the wire hardening is also good.

The specific value of the storage modulus G' of the intermediate layer 2 at 23 ° C is not particularly limited as long as it satisfies the relationship between the adhesive layer 1 and the storage modulus G' at 23 ° C. The storage modulus G' of the intermediate layer 2 at 23 ° C is preferably 1 × 10 ⁴ Pa or more, less than 1 × 10 ⁵ Pa, more preferably 1 × 10 ⁴ Pa or more, and 9 × 10 ⁴ Pa or less. Department least ^{1 × 10 4 Pa, 8 ×} 10 4 Pa or less. By adjusting the storage modulus G' of the intermediate layer 2 at 23 ° C to be within this range, the traceability effect of the dicing sheet on the periphery of the lift electrode forming region can be more surely obtained. If the storage modulus G' of the intermediate layer 2 at 23 ° C is too low, the adhesive layer 1 will be traced between the protruding electrodes, and the possibility of causing the residue of the adhesive layer 1 between the protruding electrodes will be improve. Further, in the case where the intermediate layer 2 has a property of being hardened by irradiation with an energy ray, the storage modulus G' of the intermediate layer 2 at 23 ° C is the storage modulus before the irradiation of the energy ray.

Further, the thickness of the intermediate layer 2 is preferably 5 μm or more and 50 μm or less, and when the thickness of the intermediate layer 2 is in the above range, the intermediate layer 2 can be more easily modified in accordance with the modification of the adhesive layer 1. The intermediate layer 2 is preferably 10 μm or more and 40 μm or less, more preferably 15 μm or more and 35 μm or less, and particularly preferably 20 μm or more and 30 μm or less.

The thickness of the intermediate layer 2 is preferably 0.5 times or more and 1.5 times or less the height of the protruding electrodes, and is preferably 1.0 times or more and 1.5 times or less. Intermediate layer 2 The specific thickness is selected in the above-described ideal range, and it is preferably determined from the height of the protruding electrode of the wafer to be applied. By the thickness of the intermediate layer 2 being within the above range, the dicing sheet between the protruding electrodes is non-tracking, and the dicing sheet traceability in the periphery of the electrode forming region is excellent, the cutting property can be improved, and the occurrence of chip cracking can be suppressed. .

(Substrate 3)

The substrate 3 is not particularly limited, and for example, a polyethylene film such as a low density polyethylene (LDPE) film, a linear low density polyethylene (LLDPE) film, a high density polyethylene (HDPE) film, or the like can be used; Film, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer film, poly(ethylene terephthalate) film, polybutylene terephthalate Ester film, polyurethane film, polyimide film, ethylene-vinyl acetate copolymer film, ionomer resin film, ethylene. (Meth)acrylic copolymer film, ethylene. A film composed of a (meth) acrylate copolymer film, a polystyrene film, a polycarbonate film, a fluororesin film, a hydride or a modified product thereof. Further, the above-mentioned crosslinked film or copolymer film can also be used. The base material 3 described above may be a single film or a composite film of two or more types.

Further, in the case of the energy rays used for curing the adhesive layer 1 and/or the intermediate layer 2, in the case of using ultraviolet rays, the substrate 3 is preferably made of a material having transparency to ultraviolet rays. Further, in the case of the energy ray, in the case of using an electron beam, it is not necessary to have light permeability to the substrate 3. In the case where the adhesion surface is required to have visibility, the substrate 3 is preferably in a transparent state, and the substrate 3 may be dyed.

Further, the upper surface of the substrate 3, that is, the intermediate layer 2 is formed on the side of the substrate 3 On the surface, in order to improve the adhesion to the intermediate layer 2, corona treatment or formation of a primer layer may be performed. Further, the reverse side of the intermediate layer 2 may be subjected to various coating processes, and the dicing sheet according to an embodiment of the present invention is formed by forming the intermediate layer 2 on one side of the substrate 3 as described above, on the intermediate layer 2 The adhesive layer 1 is formed. The thickness of the substrate 3 is preferably from 20 to 200 μm, more preferably from 25 to 110 μm, still more preferably from 50 to 90 μm. If the thickness of the substrate 3 is large, the bending strength of the substrate 3 will become large, and the peeling angle between the wafer and the dicing sheet at the time of the topping will be difficult to be increased, and thus the force required for the plucking may be increased, and the drawing may be performed. Sexual decline. When the thickness of the substrate 3 is small, film formation may become difficult due to the material.

The method of forming the intermediate layer 2 on the surface of the substrate 3, applying the composition for the intermediate layer constituting the intermediate layer 2, and forming the intermediate layer 2 on the release sheet to form the intermediate layer 2, which is applicable to the substrate 3 It is also possible to transfer the surface on the surface of the substrate 3 by directly coating the composition for the intermediate layer to form the intermediate layer 2. The method of forming the adhesive layer 1 on the intermediate layer 2 can be carried out in the same manner as the method of forming the intermediate layer 2 on the adhesive composition substrate 3, and as described above, the present invention can be obtained. A dicing sheet according to an embodiment.

Further, in the dicing sheet according to the embodiment of the present invention, in order to protect the adhesive layer 1 before use, a release sheet may be laminated. The release sheet is not particularly limited, and for example, a film formed of a resin such as poly(ethylene terephthalate), polypropylene, or polyethylene, or a foamed film of the above components, or a cellophane, coated paper, or layer may be used. The pressure paper is equal to the polyether oxide, fluorine, long-chain alkyl urethane or the like in the paper, and is peeled off by a release agent.

A dicing sheet according to an embodiment of the present invention has It is preferable to use it when the electrode formation surface of the semiconductor wafer of the protruding electrode is pasted. As the protruding electrode, a cylindrical electrode, a spherical electrode, or the like can be exemplified. The dicing sheet according to an embodiment of the present invention is particularly suitable for a perforated electrode wafer which is more and more commonly used recently, and the dicing sheet bonding method for the semiconductor wafer is not particularly limited.

Next, a semiconductor wafer is cut into a plurality of semiconductor wafers by a cutting method such as a dicing blade to manufacture a semiconductor wafer. The cutting depth at this time is the thickness of the semiconductor wafer, the adhesive layer 1 and the intermediate layer 2. The sum of the thicknesses, plus the depth of the cutter's wear.

After the dicing, the dicing sheet according to an embodiment of the present invention is expanded as necessary, and the pitch of each semiconductor wafer is separated, and the semiconductor wafer is lifted by a usual method such as a suction collet to form a semiconductor wafer. In addition, after the adhesive layer 1 is irradiated, it is preferable to perform expansion and topping with a low adhesive force.

Similarly, the dicing sheet according to the embodiment of the present invention includes a process of adhering the electrode to the electrode forming surface of the semiconductor wafer having the protruding electrode, and cutting the semiconductor wafer into a plurality of circuits. A semiconductor wafer can be fabricated by a process for fabricating a semiconductor wafer and a process for ejecting a semiconductor wafer. In such a manufacturing method, problems such as partial peeling of the dicing sheet are less likely to occur, so that semiconductor wafer dicing can be performed stably (with few defects such as chip cracking). Therefore, by the above-described manufacturing method, it is possible to stably manufacture a semiconductor wafer of excellent quality.

The embodiments described above are described in order to facilitate understanding of the present invention, and are not intended to limit the present invention. Therefore, each element disclosed in the above embodiment belongs to all design changes of the technical scope of the present invention. Or equivalents thereof are also included.

For example, between the adhesive layer 1 and the intermediate layer 2, other layers may exist, and as the properties of the elastomer of the layer, in the case of the intermediate properties of the adhesive layer 1 and the intermediate layer 2, it is more stable. Reduce the possibility of partial peeling.

Further, the adhesive layer 1 and the intermediate layer 2 do not have a clear boundary, and the composition of the adhesive layer 1 is preferably continuously changed from the composition of the intermediate layer 2, and in the case of having such a configuration, it is possible to To steadily reduce the possibility of partial peeling. In this case, specifically, the layers of the adhesive layer 1 and the intermediate layer 2 are all provided with an acrylic adhesive, and the opposite surface of the substrate 3 of the dicing sheet 10 is irradiated with an electron beam. In this case, the polymerization adjacent to the irradiation surface is preferentially performed, and a region corresponding to the adhesive layer 1 can be formed.

[Examples]

Hereinafter, the present invention will be specifically described by way of Examples and the like, but the scope of the present invention is not limited by these Examples and the like.

(Example 1)

[Manufacture of Adhesive Composition A]

Acrylic adhesive polymer obtained by reacting butyl acrylate/methyl methacrylate/2-hydroxyethyl acrylate=62/10/28 (mass ratio), and acrylic acid of the acrylic adhesive polymer The 2-hydroxyethyl ester unit is reacted with 80 mol of acryloyloxyethyl isocyanate (MOI) per 100 mol of the obtained energy ray-curable adhesive polymer (polystyrene-equivalent weight average molecular weight (Mw): 100,000 parts by mass of a photopolymerization initiator (α-hydroxycyclohexyl phenyl ketone ("IRUGACURE 184", manufactured by BASF Corporation)), 3 parts by mass, and a crosslinking agent (Alkyl isocyanate compound (TOYOCHEM CO., LTD. "BHS-8515")) 8 parts by mass (in terms of solid content), and a polymerized branched polymer ("OD-007", manufactured by NISSAN CHEMICAL INDUSTRIES LTD., polystyrene-equivalent weight average molecular weight (Mw): 14,000) 0.15 parts by mass, after being mixed in a solvent, the adhesive composition A was obtained.

[Manufacture of composition for intermediate layer]

The reaction was carried out by reacting 2-ethylhexyl acrylate/2-hydroxyethyl acrylate = 95/5 (mass ratio) to obtain an acrylic polymer (polystyrene-equivalent weight average molecular weight (Mw): 900,000). 100 parts by mass of the above acrylic polymer and 0.5 parts by mass (in terms of solid content) of a crosslinking agent (alkyl sulfonium isocyanate compound ("BHS-8515")) are mixed in a solvent, The composition for the intermediate layer can be obtained.

[Manufacture of dicing sheet]

Coating on a release film ("SP-PET381031 (PF)", manufactured by Lintec Corporation). The above intermediate layer composition was dried (drying conditions: 100 ° C, 1 minute) to obtain an intermediate layer (thickness: 20 μm) formed on the release film. Next, the intermediate layer and the substrate (ethylene methacrylic copolymer film, thickness: 80 μm) were pasted, and the release film was peeled off on the intermediate layer, and the intermediate layer was transferred onto the substrate.

In addition, it was coated on a release film ("SP-PET381031 (PF)", manufactured by Lintec Corporation). The above adhesive composition was dried (drying conditions: 100 ° C, 1 minute) to obtain an adhesive layer (thickness: 10 μm) formed on the release film.

Thereafter, the substrate-attached intermediate layer and the release film-attached adhesive layer were applied to each other to obtain a dicing sheet.

(Example 2)

Butyl allylate / methyl methacrylate / 2-hydroxyethyl acrylate = 62/10/28 (mass ratio) reaction obtained acrylic adhesive polymer, 2-hydroxyethyl acrylate unit with the acrylic adhesive polymer per 100 moles and 80 moles of acryloyloxy The isocyanate (MOI) is reacted to obtain an energy ray-curable adhesive polymer (polystyrene-equivalent weight average molecular weight (Mw): 600,000), 100 parts by mass, and a photopolymerization initiator (α-hydroxycyclohexylphenyl) Ketone ("IRUGACURE 184", manufactured by BASF Corporation)) 8 parts by mass of a crosslinking agent (alkyl sulfonium isocyanate compound ("BHS-8515" manufactured by TOYOCHEM CO., LTD.)) 8 parts by mass (converted in solid content) And a polymerizable branched polymer ("OD-007", manufactured by NISSAN CHEMICAL INDUSTRIES LTD., polystyrene-equivalent weight average molecular weight (Mw): 14,000)) 0.15 parts by mass in a solvent, and an adhesive can be obtained. Composition B.

A dicing sheet was obtained by performing the same operation as in Example 1 except that the obtained adhesive composition B was used.

(Example 3)

100 parts by mass of an acrylic polymer A and a photopolymerization initiator (α-hydroxycyclohexyl phenyl ketone ("IRUGACURE 184", manufactured by BASF Corporation)), 3 parts by mass, a crosslinking agent (alkyl sulfonium isocyanate compound ( 10 parts by mass (converted to solid content), and a polymerized branched polymer ("OD-007", manufactured by NISSAN CHEMICAL INDUSTRIES LTD., polystyrene-converted weight average), manufactured by TOYOCHEM CO., LTD., "BHS-8515") Molecular weight (Mw): 14,000) 0.15 parts by mass is mixed in a solvent to obtain an adhesive composition C.

A dicing sheet was obtained by performing the same operation as in Example 1 except that the obtained adhesive composition C was used.

(Example 4)

100 parts by mass of acrylic polymer A, photopolymerization initiator (α-hydroxycyclohexane) Phenyl phenyl ketone ("IRUGACURE 184", manufactured by BASF Corporation)) 3 parts by mass, and a crosslinking agent (alkyl sulfonium isocyanate compound ("BHS-8515", manufactured by TOYOCHEM CO., Ltd.)) The binder composition D can be obtained by mixing the parts (solid content conversion) in a solvent.

A dicing sheet was obtained by performing the same operation as in Example 1 except that the obtained adhesive composition D was used.

(Example 5)

A dicing sheet was obtained by performing the same operation as in Example 1 except that the thickness of the intermediate layer was carried out at 30 μm.

(Example 6)

A dicing sheet was obtained by performing the same operation as in Example 1 except that the thickness of the adhesive layer was carried out at 30 μm.

(Example 7)

Acrylic adhesive polymer obtained by reacting 2-ethylhexyl acrylate/2-hydroxyethyl acrylate=80/20 (mass ratio), and 2-hydroxyethyl acrylate of the acrylic adhesive polymer An energy ray-curable adhesive polymer obtained by reacting 100 mils per 100 moles with 80 moles of acryloyloxyethyl isocyanate (MOI) (polystyrene-equivalent weight average molecular weight (Mw): 1 million) 100 mass a photopolymerization initiator (α-hydroxycyclohexyl phenyl ketone ("IRUGACURE 184", manufactured by BASF Corporation)), 3 parts by mass, and a crosslinking agent (alkyl sulfonium isocyanate compound (TOYOCHEM CO., LTD) . "BHS-8515")) 10 parts by mass (converted in solid content) is mixed in a solvent to obtain an adhesive composition E.

A dicing sheet was obtained in the same manner as in Example 1 except that the obtained adhesive composition E was used.

(Test example 1)

In the adhesive composition A prepared in the measurement example of the storage modulus G' and the loss factor tan δ, each D was coated. Drying (drying conditions: 100 ° C, 1 minute) was carried out on a release film ("SP-PET 381031 (PF)" manufactured by Lintec Corporation) to obtain an adhesive layer (thickness: 25 μm) formed on the release film. The adhesive layer was peeled off on the release film and overlapped to have a total thickness of about 1 mm to prepare a test sample relating to the adhesive layer. The same operation was also applied to the composition for the intermediate layer prepared in the examples, and a test sample having a total thickness of about 1 mm in relation to the intermediate layer was produced.

The obtained test sample was perforated with a disk having a diameter of 8 mm, and embedded in a parallel piece, and then measured by the following conditions using an adhesive measuring instrument ("ARES" manufactured by RHEOMETRIC Co., Ltd.). The adhesive layer was determined from the obtained data. The storage modulus G' value at 23 ° C with the intermediate layer, and the loss factor tan δ value at 23 ° C of the adhesive layer, as a result, the storage modulus G' of the adhesive layer at 23 ° C for the intermediate layer 23 ° C The ratio of the storage modulus G' at the time is shown in Table 1, for example.

Measuring temperature: -30~120°C

Heating rate: 3 ° C / min

Measuring frequency: 1Hz

(Test Example 2) Measurement of adhesion before irradiation

The adhesive layer which was formed after peeling off the release sheet on the dicing sheet manufactured in the example was adhered to the enamel wafer by a rubber roller with a load of 2 kgf, and the dicing sheet was adhered to the enamel wafer at 23 ° C and a relative humidity of 50. After 20 minutes in % environment, the 180° peeling adhesion test was performed based on JIS Z0237:2000. The results are shown in Table 1.

(Test Example 3) Confirming the presence or absence of partial peeling

The adhesive layer which was formed after peeling off the peeling sheet manufactured in the example was used for a wafer having a diameter of 28 μm, a pitch of 35 μm, and a height of 12 μm in two rows and five columns using a pasting device (Lintec). Made by Corporation, "RAD-3510F/12") The conditions for pasting and pasting equipment are as follows:

Pressure range: 15μm

Protruding amount: 150μm

Adhesion stress: 0.35MPa

Adhesive speed: 5mm/sec

Adhesion temperature: 23 ° C

The adhesion state of the adhesive layer around the unevenness is observed on the side surface of the dicing sheet substrate, specifically, the air bubbles generated between the dicing sheet and the wafer are observed. After standing at 23 ° C for 24 hours in an environment of 50%, the adhesion state of the adhesive layer around the unevenness on the side surface of the substrate of the dicing sheet was observed again, and the presence or absence of partial peeling was evaluated based on the change of the bubble phenomenon. When there was no change, the evaluation was good (indicated by "A" in Table 1), and when the bubbles became large or the bubbles were connected, the evaluation was poor (indicated by "B" in Table 1).

In the dicing sheets manufactured in Examples 1 and 4 to 6 of the present invention, the storage layer G' of the adhesive layer before hardening at 23 ° C is larger than the storage modulus G' of the intermediate layer at 23 ° C, and the loss is large. The coefficient tan δ is 0.23 or more, and the bonding force before irradiation is 2000 mN/25 mm or more. In the case of using such a dicing sheet, partial peeling could not be confirmed, and in the case of using the dicing sheets produced in Examples 2, 3 and 7 as comparative examples, partial peeling was confirmed.

[Industrial availability]

The dicing sheet according to the present invention is suitably used as a dicing sheet of a semiconductor wafer having irregularities such as a via electrode (TSV).

Claims (13)

A semiconductor dicing sheet having a substrate and an interlayer formed on one surface thereof and an adhesive layer formed on the intermediate layer, wherein the adhesive layer contains a compound having an energy ray-curable double bond in the molecule; The storage modulus G' at 23 ° C before the adhesive layer is hardened is larger than the storage modulus G' of the intermediate layer in the environment of 23 ° C; for the above-mentioned dicing sheet before the curing of the adhesive layer, JIS Z0237:2000 is the benchmark for the adhesion test of the 180° peeling of the mirror wafer. The measured adhesion is 2000mN/25mm or more; the loss factor tanδ of the adhesive layer before curing at 23°C 0.23 or more. The dicing sheet according to claim 1, wherein the compound having the energy ray-curable double bond in the molecule is an energy ray-curable type comprising a polymer chain or a side chain bonded to an energy ray polymerizable group. Adhesive polymer. The dicing sheet according to claim 1 or 2, wherein the intermediate layer has a storage modulus G' of 1 × 10 ⁴ Pa or more and less than 1 × 10 ⁵ Pa at 23 ° C. The dicing sheet according to claim 1 or 2, wherein the storage layer G' at a temperature of 23 ° C before the curing of the adhesive layer is 3 × 10 ⁵ Pa. The dicing sheet according to claim 1 or 2, wherein the adhesive layer contains an acrylic polymer having a reactive functional group and a crosslinking agent, and when the acrylic polymer has 100 parts by mass, a crosslinking agent is contained. 5 parts by mass or more. The dicing sheet according to claim 5, wherein the crosslinking agent is an isocyanate crosslinking agent. The dicing sheet according to claim 1 or 2, wherein the dicing sheet is used for adhering to a wafer on which a protruding electrode is formed. The dicing sheet according to claim 7, wherein the protruding electrode is a perforated electrode. The dicing sheet according to the seventh aspect of the invention, wherein the thickness of the intermediate layer is 0.5 times or more and 1.5 times or less the height of the protruding electrode. The dicing sheet according to claim 1 or 2, wherein the storage modulus G' at 23 ° C before the curing of the adhesive layer is more than 4 times the storage modulus G ′ at 23 ° C of the intermediate layer Big. The dicing sheet according to claim 1 or 2, wherein the thickness of the adhesive layer is 5 μm or more and 50 μm or less. The dicing sheet according to claim 1 or 2, wherein the intermediate layer has a thickness of 5 μm or more and 50 μm or less. A method of manufacturing a semiconductor wafer, comprising: affixing a dicing sheet according to item 1 or 2 to a surface formed on an electrode of a semiconductor wafer having a protruding electrode; The circuits are individually diced into a plurality of processes to form a semiconductor wafer and to process the semiconductor wafer.