TWI677389B - Multi-point diamond cutter - Google Patents

Abstract

The multi-point diamond cutter of the present invention can reduce the number of tool replacements even if the sharp point is worn due to the scribe.

The corner of the base 11 of the diamond cutter 10 forms an inclined surface from both sides of the base, and the two ends of the ridge line are used as sharp points. Scribing is performed so that any sharp point of the diamond cutter 10 contacts the substrate and does not rotate. When the sharp point is worn by the scoring, the diamond cutter 10 is rotated to perform the scoring using another sharp point. In this way, multiple sharp points can be used in one diamond cutter, and the frequency of diamond cutter replacement can be reduced.

Description

Multi-point diamond cutter

The present invention relates to a multi-point diamond cutter for scoring a brittle material substrate such as a glass substrate or a silicon wafer with diamond sharp points.

In the past, in order to scribe a glass substrate or a silicon wafer, a tool using a diamond wheel with a scribe wheel or a single crystal diamond was used. For glass substrates, a scoring tool that rotates relative to the substrate is mainly used. However, from the perspective of improving the strength of the substrate after scoring, the sharp points of diamonds with fixed blades are also discussed. Patent Documents 1 and 2 propose sharp point cutters for scoring a substrate having a high hardness, such as a sapphire wafer or an alumina wafer. In these patent documents, a tool provided with a tangent point on a ridgeline of a pyramid or a tool having a cone at the front end is used. In addition, Patent Document 3 proposes a scoring device using a glass scriber having a conical tip for scoring a glass plate.

Patent Document 1: Japanese Patent Application Laid-Open No. 2003-183040

Patent Document 2: Japanese Patent Laid-Open No. 2005-079529

Patent Document 3: Japanese Patent Application Publication No. 2013-043787

When scoring is performed using a conventional fixed-blade tool, the sharp point must be changed due to abrasion of the sharp point. The apex of a vertex or cone tool that can be used is 2 Or up to four. Therefore, the tool must be changed when the sharp points at two or four points are changed, and there is a problem that the replacement frequency is high. In addition, in the scoring performed by the tool, the sharp point must be brought into contact with the substrate at an appropriate angle. However, in the conventional tool, it is necessary to rotate the tool in the axial direction when changing the sharp point, and it is not easy to adjust the contact angle with high accuracy.

The present invention has been made in view of such conventional problems, and an object thereof is to provide a diamond cutter that can easily change the position of the sharp point and reduce the frequency of replacement even if the sharp point used for scoring is worn.

In order to solve this problem, the multi-point diamond cutter of the present invention includes: a polygonal base; and at least one corner of the base having first and second inclination formed from both sides of the base toward the other side. A surface and a ridgeline where the first and second inclined surfaces intersect; at least a portion including the ridgeline is formed of diamond (diamond), and both ends of the ridgeline are used as sharp points.

Here, it may have a top surface which is ground from the outer peripheral surface of the base toward both ends of the ridgeline.

In order to solve this problem, a multipoint diamond cutter according to the present invention includes a polygonal base, and at least one corner of the base having a first inclined surface and a second inclined surface formed from one side surface of the base. A third inclined surface and a fourth inclined surface formed from the other surface of the base, a first edge line that intersects the first inclined surface and the third inclined surface and is parallel to the surface of the base, and the second inclined surface The second ridgeline whose surface intersects with the fourth inclined surface and is parallel to the surface of the base; at least the part including the first and second ridgelines is formed of diamond (diamond), and is formed by the outer side of the first and second ridgelines. Both ends serve as sharp points.

Here, the first and second edges may be provided from the outer peripheral surface of the base. The top surface of both ends of the wire is ground.

Here, the inclined surfaces may be formed by laser processing.

Alternatively, the top surfaces may be formed by machining.

According to the present invention having such a feature, a plurality of sharp points can be provided around the diamond cutter. Therefore, the following effect can be obtained: even if a sharp point is worn, a new sharp point can be used by changing the fixed angle of the diamond cutter, and the frequency of replacing the diamond cutter can be reduced. Furthermore, since the sharp point can be changed while the mounting angle of the tool with respect to the substrate is maintained constant, the contact angle of the sharp point can be easily adjusted.

10, 30, 50, 60‧‧‧ multi-point diamond cutters

11, 31, 51, 61‧‧‧ base

11a, 11b, 61a, 61b ‧‧‧ side

12, 32, 52, 62‧‧‧through holes

13, 33, 43‧‧‧ polished surface

13a ~ 13d, 14a ~ 14d, 33a ~ 33f, 34a ~ 34f, 62a, 62b, 63a, 63b, 65a, 65b, 66a, 66b, 68a, 68b, 69a, 69b, 71a, 71b, 72a, 72b Inclined surface

15a ~ 15d, 35a ~ 35f, 64a, 64b, 67a, 67b, 70a, 70b, 73a, 73b

16 ~ 19, 21a, 21b, 22a, 22b, 23a, 23b, 24a, 24b, 36 ~ 41, 51a ~ 56b, 74a ~ 77b‧‧‧ Top surface

P1 ~ P12‧‧‧ sharp points

FIG. 1 is a side view and a front view of a multi-point diamond cutter according to a first embodiment of the present invention.

Fig. 2 is a side view and a front view of a multi-point diamond cutter according to a modification of the first embodiment.

Fig. 3 is a side view showing an engraving using a diamond cutter according to the first embodiment of the present invention and an enlarged view thereof.

Fig. 4 is a front view showing a scribe using a diamond cutter according to the first embodiment of the present invention.

Fig. 5 is a side view showing an engraving using a diamond cutter according to the first embodiment of the present invention and an enlarged view thereof.

6 is a side view and a front view of a diamond cutter according to a second embodiment of the present invention.

Fig. 7 is a side view and a front view of a diamond cutter according to a modification of the second embodiment of the present invention.

8 is a side view and a front view of a diamond cutter according to a third embodiment of the present invention.

FIG. 9 is an enlarged side view and a front view of a main part of a diamond cutter according to a third embodiment of the present invention.

Next, a first embodiment of the present invention will be described. FIG. 1 is a side view and a front view showing an example of a multi-point diamond cutter (hereinafter, simply referred to as a diamond cutter) 10 according to this embodiment. The diamond cutter 10 is based on a polygonal plate formed of any number of sides with a certain thickness and rotational symmetry. In this embodiment, a single-crystal diamond is used to form a plate of a certain thickness and has a square base 11 having a through-hole 12 in the center. As shown in FIG. 1, the base 11 is ground in a V shape from both sides of the four corner portions. That is, the first inclined surface 13 a is formed by cutting from one side surface 11 a toward the outer peripheral surface of the base to a thickness of 1/2 or more of the base 11. At this time, it is preferable to cut so that the included angle between the first inclined surface 13a and the two adjacent outer peripheral surfaces 16, 19 of the base 11 are equal to each other. Similarly, the first inclined surfaces 13b to 13d are also formed for the other corners from the same side surface 11a. Next, from the other side surface 11b of the base 11, the two adjacent outer peripheral surfaces 16, 19 of the base 11 are cut in the same manner to about 1/2 of the thickness of the base 11 to form a second inclination of a trapezoid. Surfaces 14a ~ 14d. The above-mentioned inclined surface can be easily formed by laser processing. In addition, mechanical polishing may be performed after laser processing, so that the portion forming the ridge line becomes a more precise polishing surface. According to this, a pair of the first and second inclined surfaces 13a and 14a intersect at one of the same corners and is formed in the middle of the thickness direction of the base 11, preferably in a central position as shown in FIG. 1 (b), parallel to the base. Edges 15a of the sides 11a, 11b of the seat and perpendicular to the diagonal of the base in side view. In the same way, the first and second inclined surfaces 13b and 14b, 13c and 14c, 13d and 14d intersect each other in the thickness direction of the base 11 and preferably at a central position, and are parallel to the side surfaces 11a of the base, The ridgelines 15b, 15c, and 15d of 11b, and four ridgelines perpendicular to the diagonal of the base are formed at the corners of the base 11. Here, the outer peripheral surface of the four sides of the base 11 becomes the top surfaces 16, 17, 18, and 19. Here, the so-called top surface is in contact with and shared by the first and second inclined surfaces forming the ridgeline. A face at one end of the ridge. The two ends of a ridgeline 15a that is in contact with the top surfaces 16, 19, that is, the intersections of the first inclined surface 13a, the second inclined surface 14a, and the top surfaces 16, 19 are set as sharp points P1, P2. The angle α between the top surface and the ridge line in the sharp points P1 and P2 is about 135 °. The same is true for the other 6 inclined surfaces, the points at which both ends of the ridge lines 15b to 15d meet the top surface, that is, the first inclined surface 13b to 13d, the second inclined surface 14b to 14d, and the top surface 16 to The intersections of 19 are set as sharp points P3 ~ P8. As described above, the two ends of the ridge lines 15a to 15d are set as the sharp points P1 to P8, so that the diamond cutter 10 having an octagonal shape when viewed from the side as shown in FIG. point.

Next, a diamond cutter 20 according to a modification of the first embodiment will be described. FIG. 2 is a side view and a front view of the modification, and the same parts as those in the first embodiment are denoted by the same reference numerals. In this modification, after forming the first inclined surfaces 13 a to 13 d and the second inclined surfaces 14 a to 14 d, as shown in FIG. 2, the ridgelines 15 a to 15 d are further polished from the respective end portions toward the outer peripheral surface. A surface different from the outer peripheral surface of the four sides of the base 11 is formed as a top surface. That is, the smaller polished surface of the triangle shown in FIG. 2 (b) becomes the top surface 21a, 21b, 22a, 22b, 23a, 23b, 24a, 24b. The angle α between the top surface and the ridge line is larger than that of the first embodiment. 135 ° large. Therefore, in this case, the top surface can be processed with high accuracy by machining, and the position of the sharp point can be precisely processed. In addition, the minimum angle between the top surface and the ridge line can be adjusted to a value greater than 135 ° according to the type or thickness of the brittle material substrate of the object to be scored.

The case where the diamond cutter 10 or 20 of this embodiment is used for scoring will be described with reference to FIGS. 3 to 5. When scoring, as shown in FIG. 3 (a), a sharp point P1 of the diamond cutter 10 (or 20) is brought into contact with the substrate 25, and the diamond cutter 10 is directed toward the ridge line in the sharp point P1, which is the arrow shown in the figure. Move in direction A to score. Since the diamond cutter 10 is not rotated, the scribe can be performed at the same sharp point. At this time, as shown in the enlarged view around the sharp point P1 in FIG. 3 (b), The angle θ between the ridgeline and the brittle material substrate is preferably 2 to 10 °, and more preferably 3 to 7 °, so that the diamond cutter 10 contacts. FIG. 4 is a diagram showing a state of scoring when viewed from the direction of arrow A. FIG. As shown in the figure, since the wheel train is processed by processing a thin plate-shaped base, even if there are parts 26 and the like on the substrate 25, the diamond cutter can be moved to the narrow gap between the parts for engraving. Draw.

When the sharp point P1 of the contact substrate 25 is deteriorated due to abrasion, as shown in FIG. 5, the diamond cutter 10 is rotated around the through hole 12 as a center, and the adjacent sharp point P2 is brought into contact with the substrate 25 and the same applies. Scribing is performed in the direction of the ridgeline at the sharp point P2, that is, in the direction of arrow B. FIG. 5 (b) is an enlarged view showing the periphery of the sharp point P2. At this time, the rotation angle is determined according to the angle between the ridgeline and the brittle material substrate. That is, the angle θ between the ridge line and the brittle material substrate is made equal to the case where the sharp point P2 is used for scoring and the case where the sharp point P1 is used. If this action is repeated, even if the sharp point is deteriorated due to abrasion, it can be scored with a new sharp point number of sharp points formed around the circular plate. In addition, even if the diamond cutter 10 is rotated, since the angle at which the ridge line at the tip of the lower blade contacts the substrate does not change when viewed from the side of the diamond cutter 10, it is easy to adjust the contact angle of the sharp point with respect to the substrate.

In addition, when the diamond cutter 10 is used in the same direction, when the sharp point P1 is worn, the diamond cutter 10 is sequentially rotated by 90 ° and the sharp points P3, P5, and P7 are sequentially used. When all four sharp points are worn, The diamond cutter 10 is reversed. Then, the cusps P2, P4, P6, and P8 are sequentially contacted in such a manner that the angle θ between the ridge line and the brittle material substrate is constant, and the position of the cusp is changed for a total of 4 times after the reversal. If performed in this manner, the cusp can be changed by changing the position of the sharp point 8 times in total. In the case of using the diamond cutter 20, it is also possible to change the sharp point 8 times in the same manner for scoring.

Next, a second embodiment of the present invention will be described using FIG. 6. First In the diamond cutter 30 of the second embodiment, a through-hole 32 is provided in the center of the hexagonal base 31 made of a single crystal diamond, and it is polished in a V shape from both sides of the corner of the base 31 in the same manner as in the first embodiment. The first inclined surfaces 33a to 33f and the second inclined surfaces 34a to 34f are formed. Accordingly, edge lines 35a to 35f are formed between the inclined surfaces 33a and 34a, 33b and 34b,.... Both ends of each ridge line 35a to 35f become sharp points P1 to P12. The above-mentioned inclined surface can be easily formed by laser processing. In addition, it is also possible to perform mechanical polishing after laser processing to form a precise inclined surface at the portion where the ridges are formed. Here, the side surfaces of the base 31 become the top surfaces 36 to 41. Further, the two ends of the ridge lines 35a to 35f can be used as sharp points to form sharp points at 12 points. In this case, the angle between the top surface and the ridgeline is 150 °.

Next, a diamond cutter 50 according to a modification of the second embodiment will be described. FIG. 7 is a front view and a side view of the modification, and the same portions as those in the second embodiment are denoted by the same reference numerals. In this embodiment, as in the modified example of the first embodiment described above, as shown in FIG. 7, further polishing is performed from the sides of both end portions of the ridge lines 35 a to 35 f to form a four-way connection with the base 11. A different surface on the outer peripheral surface is used as the top surface. In this case, the grinding surface with a small triangle from the sides of both ends of the ridge lines 35a to 35f toward the cusps P1 to P12 becomes the top surfaces 51a, 51b, 52a, 52b ... 56a, 56b, and the angle between the top surface and the ridge line α is larger than 150 ° in the second embodiment. Therefore, the positions of the sharp points P1 to P12 are changed, and the ridgeline is slightly shortened. In this case, a small top surface can be processed with high accuracy by grinding, and the position of the sharp point can be processed precisely. In addition, the angle between the top surface and the ridgeline can be made larger than 150 °, and can be adjusted to an appropriate angle suitable for the substrate.

This diamond cutter 30 or 50 is also scribed so that one sharp point P1 contacts the substrate 25 during the scribe. When the sharp point is abraded, as in the first embodiment, it is rotated along an axis (not shown) inserted in the through hole of the diamond cutter 30 or 50, and the adjacent sharp points are brought into contact with each other. Scratching. In this case, too, ridges and brittle material substrates The included angle θ is constant. By repeating this operation, it is possible to perform scoring with a total of 12 sharp points.

Next, a third embodiment of the present invention will be described with reference to FIGS. 8 and 9. Similarly to the first embodiment, the diamond cutter 60 of this embodiment has a through-hole 62 at the center of a square-shaped plate-shaped base 61 made of single crystal diamond and having a constant thickness. In this embodiment, the first and second inclined surfaces 62a, 62b are formed from the side surface 61a, which forms one of the corners of the base 61, toward the outer peripheral surface. At this time, the first and second inclined surfaces are each polished so that the diagonal lines of the polygon with respect to the base 61 are inclined from the vertical, for example, 5 °, and cross each other. Similarly, third and fourth inclined surfaces 63a and 63b are formed from the other side surface 61b. Further, the intersection line of the first and third inclined surfaces is set as the first ridgeline 64a, and the intersection line of the second and fourth inclined surfaces 62b and 63b is set as the second ridgeline 64b. The two edge lines 64 a and 64 b are preferably provided in parallel with the side surfaces 61 a and 61 b of the base 61. The first ridge line 64a and the second ridge line 64b are formed so as to be inclined, for example, about 5 ° with respect to the ridge line 35a in the first and second embodiments. Therefore, the angle between the first ridgeline and the second ridgeline is, for example, about 170 °.

In addition, the first and second inclined surfaces 65a, 65b are formed from one side surface of the base 61, and the third and fourth inclined surfaces 66a, 66a, and In 66b, the intersection of the inclined surfaces 65a and 66a is used as the first edge line 67a, and the intersection of the inclined surfaces 65b and 66b is used as the second edge line 67b. For the other corners, the first to fourth inclined surfaces 68a, 68b, 69a, and 69b are respectively formed in the same manner, and the intersection of the inclined surfaces is used as the first edge line 70a and the second edge line 70b. For the remaining corners, first to fourth inclined surfaces 71a, 71b, 72a, and 72b are also formed, and the intersection of the inclined surfaces is used as the first edge line 73a and the second edge line 73b.

Next, as shown in FIGS. 8 (b) and 9 (b), the first ridgeline 64 a and the second ridgeline 64 b are polished from the outer peripheral surface of the base 61 to form the top surfaces 74 a and 74 b. Accordingly, the first and the first 3 The inclined surfaces 62a, 63a and the top surface 74a form an apex, and this is taken as a sharp point P1. Similarly, a vertex can be formed by the 2nd, 4th inclined surfaces 62b, 63b, and the top surface 74b polished from the side, and this can be set as the cusp P2. Accordingly, two sharp points can be formed on one corner of the base 61.

A corner adjacent to the corner is also polished from the outer peripheral surface of the base 61 toward the first edge line 67a and the second edge line 67b to form the top surfaces 75a and 75b. This makes it possible to form a vertex between the first and third inclined surfaces 65a, 66a and the top surface 75a, and use this as the sharp point P3. Similarly, the apex can be formed by the second and fourth inclined surfaces 65b, 66b and the top surface 75b polished from the side, and the apex P4 can be used.

Further, the outer peripheral surface of the base 61 is polished toward the ridge lines 70a, 70b to form the top surfaces 76a, 76b. This makes it possible to form a vertex between the first and third inclined surfaces 68a, 69a and the top surface 76a, and use this as the sharp point P5. Similarly, a vertex can be formed by the 2nd, 4th inclined surfaces 68b, 69b, and the top surface 76b polished from the side, and it can be set as the cusp P6.

Further, it is polished from the outer peripheral surface of the base 61 toward the ridge lines 73a, 73b to form the top surfaces 77a, 77b. This makes it possible to form a vertex between the first and third inclined surfaces 62a, 63a and the top surface 77a, and use this as the sharp point P7. Similarly, a vertex can be formed by the 2nd, 4th inclined surfaces 62b, 63b, and the top surface 77b polished from the side, and it can be set as the cusp P8. In this embodiment, since the top surface and the two inclined surfaces constituting each of the sharp points are independent of each other and do not constitute other sharp points, precise grinding can be performed without affecting the other sharp points. In this way, eight sharp points P1 to P8 can be formed around the base.

In addition, in the third embodiment, although the ends of the two ridgelines formed by the first, third, second, and fourth inclined surfaces are further polished from the side to form a triangular top surface, the base may also be formed. The outer peripheral surface of 61 remains as the top surface, and the inclined surfaces 62a and 63a The vertices formed by the inclined surfaces 62b and 63b and the outer peripheral surface serve as sharp points, respectively. The same applies to the sharp points of other corners.

When the diamond cutter 60 is used for scribing, a sharp point P1 is also brought into contact with the substrate for scribing. When worn in this position, the diamond cutter 60 is rotated to use adjacent sharp points. At this time, the angle θ between the ridgeline and the brittle material substrate is made constant during the scoring. According to this, it is possible to change the position of the sharp point eight times to perform scoring. In addition, when the sharp point P1 is worn, the diamond cutter can be rotated 90 ° successively to use the sharp points P3, P5, and P7. When all four sharp points are worn, the diamond cutter is reversed, and the ridge and brittleness are The included angle θ of the material substrate is adjusted in a certain manner, and four sharp points P2, P4, P6, and P8 are used, and a total of eight sharp points are used.

In each of the above-mentioned embodiments, although there are 8 or 12 sharp points around the periphery, it is only necessary to set sharp points at at least one corner, and it is not necessary to provide inclined surfaces and sharp points at all corners. However, it is preferable to provide as many sharp points as possible on the outer peripheral portion within a range where adjacent sharp points do not interfere with each other. Therefore, when the sharp points are worn, the sharp points can be replaced only by rotating the diamond cutter, and the frequency of replacing the diamond cutter can be reduced. In addition, the shape of the base is not limited to a quadrangle and a hexagon, and may be any polygon.

In addition, in the above-mentioned embodiment, although the entire pedestal is composed of a single crystal diamond, since the surface portion in contact with the substrate of the brittle material only needs to be a diamond, the pedestal formed by using a cemented carbide or sintered diamond can be used A polycrystalline diamond layer is formed on the outer peripheral surface and the surface of the ridgeline, which is further precisely ground to form sharp points. In addition, it is also possible to use a single crystal or polycrystalline diamond doped with impurities such as boron and having conductivity. By using a diamond having conductivity, it is possible to easily form an inclined surface or a through hole by electric discharge machining.

In addition, in the above-mentioned embodiment, although the diamond cutter is directed toward the ridgeline of each sharp point Scribing is performed in a moving manner, but it can also be moved toward the top surface of each sharp point to perform the scribing.

The multi-point diamond cutter of the present invention can be used for a scoring device for scoring a substrate of a brittle material, and can be effectively used especially for high-hardness scoring objects that have more wear on the diamond cutter.

Claims (6)

A multi-point diamond cutter comprising: a polygonal plate-shaped base having two opposite side surfaces and a plurality of outer peripheral surfaces; and at least one corner of the base facing from one side of the base toward an adjacent side Two of the first inclined surface formed by the outer peripheral surface and a second inclined surface formed from the other side surface of the base toward two adjacent outer peripheral surfaces; and the first inclined surface and the second inclined surface The intersection line is the ridge line; at least the part containing the ridge line is formed by diamonds; the two ends of the ridge line are used as sharp points. For example, the multi-point diamond cutter of item 1 of the patent application scope has a grinding surface which is ground from the outer peripheral surface toward both ends of the ridgeline. A multi-point diamond cutter, comprising: a polygonal plate-shaped base having two opposite sides and a plurality of outer peripheral surfaces; at least one corner of the base formed from one side of the base and facing each other An intersecting first inclined surface and a second inclined surface, and a third inclined surface and a fourth inclined surface formed from the other side surface of the base and crossing each other; and a first intersecting surface between the first inclined surface and the third inclined surface 1 edge line, and the second edge line where the second inclined surface and the fourth inclined surface intersect; at least the part including the first and second edge lines is formed by diamonds; and the two ends outside the first and second edge lines are taken as Sharp point. For example, the multi-point diamond cutter of item 3 of the patent application scope has a grinding surface ground from the outer peripheral surface of the base toward both ends of the first and second edge lines. For example, the multi-point diamond cutter according to any one of claims 1 to 4, wherein the inclined surfaces are formed by laser processing. For example, the multi-point diamond tool of item 2 or 4 of the patent application scope, wherein each grinding surface is formed by machining.