TW201635356A - Adhesive tape for cutting and method for manufacturing semiconductor wafer - Google Patents

Abstract

It is an object of the invention to provide an adhesive tape for dicing which has good adhesion to an element substrate on which a plurality of semiconductor elements are formed, and a method of manufacturing a semiconductor wafer using the same. The adhesive tape (1) is formed by forming a plurality of semiconductor elements, each of which is formed by sealing a resin substrate sealed with a resin, or an element substrate on which a lens material is formed on each semiconductor element, and is used for cutting into a plurality of semiconductor wafers. The adhesive tape (1) includes a base material (2) and an adhesive layer (3) which is laminated on the base material (2) and contains a curable naphthene-based adhesive and a curing agent.

Description

Adhesive tape for cutting and method for manufacturing semiconductor wafer

The present invention relates to a dicing adhesive tape for dicing an element substrate, and a method of manufacturing a semiconductor wafer using a dicing adhesive tape.

In the past, an adhesive tape having an adhesive layer made of an acrylic resin has been known as an adhesive tape for dicing used for producing a semiconductor wafer having an LED (light emitting diode) or the like (see Patent Document 1).

In addition, as a method of producing a semiconductor wafer using a dicing adhesive tape, a method of splicing an adhesive tape on a substrate side of a semiconductor element substrate on which a plurality of semiconductor elements are formed and cutting the semiconductor element substrate by a dicing machine is known (refer to the patent document) 2).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2013-38408

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2005-93503

However, recently, when cutting a semiconductor element substrate to produce a semiconductor wafer, it is proposed not to seal the semiconductor element sealing resin or form the lens element side of the semiconductor element, and to adhere it to the substrate side of the semiconductor element substrate. Tape, the technology for cutting.

When the adhesive tape is attached from the side where the sealing resin and the lens material are formed on the semiconductor element substrate, the adhesive force is insufficient, and the semiconductor wafer is scattered or the like.

An object of the present invention is to provide an adhesive tape for dicing which has good adhesion to an element substrate on which a plurality of semiconductor elements are formed, and a method of manufacturing a semiconductor wafer using the same.

According to the related object, the adhesive tape for dicing of the present invention is formed by forming a plurality of semiconductor elements, each of which is formed by a resin substrate sealed by a sealing resin, or an element substrate on which a lens material is formed on each semiconductor element, and is divided into a plurality of semiconductor wafers. The adhesive tape for dicing used in the present invention is characterized in that it comprises a base material and an adhesive layer which is laminated on the base material and contains a curable naphthene-based adhesive and a curing agent.

Here, the element substrate may be attached to the sealing resin side or the lens material side which is formed of a siloxane resin having one or both of a methyl group and a phenyl group as a functional group. Also, the feature can be The pressure-sensitive adhesive layer contains a peroxide-curable siloxane-based adhesive and an initiator made of a peroxide. Furthermore, the content of the initiator may be in the range of 0.01 to 15 parts by weight based on 100 parts by weight of the peroxide-curable siloxane-based adhesive. Further, the adhesive layer may be an additive reaction type siloxane-based adhesive, a crosslinking agent, or a catalyst. In addition, the content of the crosslinking agent may be in the range of 0.05 part by weight to 10 parts by weight based on 100 parts by weight of the addition reaction type oxyalkylene-based pressure-sensitive adhesive.

Furthermore, the present invention is understood to be a method of manufacturing a semiconductor wafer, and the method for fabricating a semiconductor wafer of the present invention comprises: a coating process of covering a plurality of semiconductor elements formed on a substrate by a germanium oxide resin. In the above-mentioned component substrate, the above-mentioned element substrate is attached to the above-mentioned elemental substrate, and the adhesive tape is provided with a base material and an adhesive layer containing a curable naphthene-based adhesive and a curing agent. In the cutting process, the element substrate to which the adhesive tape is attached is cut into a plurality of semiconductor wafers, and the peeling process is performed by peeling off the adhesive tape from the plurality of semiconductor wafers.

According to the present invention, it is possible to provide a dicing adhesive tape which has good adhesion to an element substrate which forms a plurality of semiconductor elements sealed by a sealing resin, and a method of manufacturing a semiconductor wafer using the same.

1‧‧‧Adhesive tape

2‧‧‧Substrate

3‧‧‧Adhesive layer

Fig. 1 is a view showing an example of a structure to which an adhesive tape of the present embodiment is applied.

[Fig. 2] (a) to (d) are views showing a first manufacturing example of a semiconductor wafer using the adhesive tape of the present embodiment.

[Fig. 3] (a) to (d) are views showing a second example of manufacturing of a semiconductor wafer using the adhesive tape of the present embodiment.

Hereinafter, embodiments of the present invention will be described in detail.

[Structure of Adhesive Tape]

Fig. 1 is a view showing an example of a structure to which the adhesive tape 1 of the present embodiment is applied. The adhesive tape 1 of the present embodiment is used for forming a semiconductor element substrate in which a plurality of semiconductor elements sealed by a resin is sealed, or a semiconductor element substrate in which a lens material is formed on each semiconductor element. Specifically, the adhesive tape 1 of the present embodiment is attached to the semiconductor element substrate from the side of the sealing resin made of a siloxane resin or the side of the lens material formed of a siloxane resin. Cutting. Further, the method of using the adhesive tape 1 will be described in detail later.

As shown in Fig. 1, the adhesive tape 1 of the present embodiment has a structure in which a base material 2 and an adhesive layer 3 are laminated.

Furthermore, although illustration is omitted, the adhesive tape 1 is attached to the substrate 2 and the adhesive. Between the layers 3, an anchor coat layer is provided as needed. Further, a surface treatment may be applied to the surface of the substrate 2 (the surface opposite to the surface facing the adhesive layer 3). Further, a surface of the adhesive layer 3 (a surface opposite to the surface facing the substrate 2) may be provided with a release liner.

<Substrate>

The material of the base material 2 used for the adhesive tape 1 of the present embodiment is not particularly limited, and for example, metal, plastic, or the like can be used. Specifically, as the substrate 2, for example, a metal foil such as stainless steel or soft aluminum, or polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, or poly can be used. A resin film of phenyl sulfide, biaxially oriented polypropylene, polyimine, guanamine, polycyclic olefin, or fluorine resin. Further, for the substrate 2, for example, a composite film of a laminated aluminum foil and a resin film, a composite film in which a metal oxide film such as alumina or cerium oxide is formed on the surface of the resin film, and the like are used. A composite film laminated with a resin film may also be used.

Among them, as the substrate 2, a material containing polyethylene terephthalate as a main component is preferably used.

<Adhesive layer>

The pressure-sensitive adhesive layer 3 of the present embodiment comprises a curable naphthenic-based pressure-sensitive adhesive and a curing agent for curing the siloxane-based pressure-sensitive adhesive. Moreover, the adhesive layer 3 may contain a coloring agent etc. as needed.

The thickness of the adhesive layer 3 is preferably in the range of 5 μm to 50 μm, and more preferably in the range of 20 μm to 40 μm. When the thickness of the adhesive layer 3 is less than 5 μm, the adhesive strength of the adhesive tape 1 is likely to be lowered because the silicone-based adhesive contained in the adhesive layer 3 is thinned. On the other hand, when the thickness of the adhesive layer 3 is thicker than 50 μm, aggregation of the adhesive layer 3 is likely to occur, and when the adhesive tape 1 is used, it is easy to adhere the adhesive to the adhesive when the adhesive tape 1 is peeled off. Adhesive residue occurred.

Here, in the adhesive layer 3 of the present embodiment, as the curable naphthenic adhesive, a peroxide-curable siloxane-based adhesive or an addition-reactive siloxane-based adhesive can be used.

Hereinafter, the state of using the peroxide-curable siloxane-based adhesive is used as the first embodiment of the adhesive layer 3, and the state of using the addition-reactive type oxyalkylene-based adhesive is used as the second form of the adhesive layer 3. , in order to explain.

[First form]

The adhesive layer 3 of the first embodiment comprises a peroxide-curable siloxane-based adhesive and an initiator (curing agent) composed of a peroxide.

(Peroxide hardening type siloxane adhesive)

The peroxide-curable siloxane-based adhesive is, for example, an adhesive mainly comprising an organic polyoxy siloxane such as polydimethyl siloxane and an organic polyoxy siloxane mixture of an organic polyoxyalkylene copolymer resin. .

The peroxide-curable siloxane-based adhesive is not particularly limited, and for example, KR-100, KR-101-10, KR-130 manufactured by Shin-Etsu Chemical Co., Ltd., and YR3340 manufactured by Momentive Performance Materials Co., Ltd. can be used. , YR3286, PSA610-SM, XR37-B6722, SH4280 manufactured by Dow Corning Toray Co., Ltd., etc.

(additive (modifier))

The peroxide-curable siloxane-based adhesive may be used as an additive and may include a modifier. As an additive (modifier) used for the peroxide-curable siloxane-based adhesive, an organic polysiloxane such as polydimethyl siloxane or an organic polyoxyalkylene copolymer resin or an organic polyfluorene is used. Oxyalkane mixture. The additive (modifier) is not particularly limited, and for example, SD-7292, BY15-701A, SD-7226, SE-1886A/B, and Shin-Etsu Chemical Co., Ltd., manufactured by Dow Corning Toray Co., Ltd., can be used. X-92-128, X-41-3003, etc.

Further, even for a peroxide-curable siloxane-based adhesive, an organic polysiloxane having a polydimethyl siloxane or the like is mixed with an organic polyoxyalkylene copolymer resin and an organic polyoxane mixture. The addition reaction type naphthenic type adhesive can also obtain the same modification effect as when the above-mentioned additive (modifier) is used. The addition-reactive type oxyalkylene-based adhesive is not particularly limited, and for example, KR-3700, KR-3701, X-40-3237-1, and X-40-3240 manufactured by Shin-Etsu Chemical Co., Ltd., X-40-3291-1, X-40-3229, X-40-3270, X-40-3306, TSR1512, TSR1516, XR37-B9204, manufactured by Momentive Performance Materials, SD4580, SD4584, SD4585, SD4586, SD4587, SD4560, SD4570, SD4600PFC, SD4593, DC7651ADHESIVE, etc., manufactured by Dow Corning Toray Co., Ltd.

(initiator)

As the initiator derived from a peroxide, an organic peroxide is used. The organic peroxide used for the initiator is not particularly limited, and examples thereof include benzamidine peroxide, dicumyl peroxide, and 2,5-dimethyl-2,5-di(tert-butyl). Peroxy)hexane (2,5-dimethyl-2,5-di-(tert-butyl peroxy)hexane), 1,1'-di(tert-butylperoxy)-3,3,5-three Methylcyclohexane (1,1'-di-(tert-butylperoxy)-3,3,5-trimethylcyclohexane), 1,3-bis-(t-butylperoxy)-diisopropylbenzene (1, 3-di-(tert-butylperoxy)-diisopropylbenzene, etc., as a sales item, NYPER K40 by Nippon Oil Co., Ltd., etc. are mentioned.

(content)

Here, the content of the initiator (organic peroxide) in the adhesive layer 3 of the first embodiment is 0.01 part by weight to 15 parts by weight with respect to 100 parts by mass of the peroxide-curable siloxane-based adhesive. The range is preferably from 0.05 parts by weight to 10 parts by weight, and more preferably from 0.05 parts by weight to 3.5 parts by weight. In addition, the content of the additive (modifier) of the adhesive layer 3 of the first embodiment is preferably in the range of from 0 to 50 parts by weight based on 100 parts by weight of the peroxide-curable siloxane-based adhesive. , 0 weight The range of ~30 weight parts is better.

When the content of the peroxide-curable siloxane-based adhesive relative to the initiator and the modifier is in the above range, the adhesive force and the holding force of the adhesive layer 3 can be used as the adhesive tape 1 for dicing. , set to the ideal range.

On the other hand, when the peroxide-curable siloxane-based adhesive is excessively low in the amount of the initiator, the peroxide-curable siloxane-based adhesive in the adhesive layer 3 is not sufficiently cured. Get the desired adhesion status. Moreover, when the peroxide-curable siloxane-based adhesive is not sufficiently cured, aggregation failure is likely to occur in the adhesive layer 3. As a result, after the adhesive tape 1 is used for dicing the semiconductor element substrate, when the adhesive tape 1 is peeled off from the obtained semiconductor wafer, the adhesive remains easily.

When the peroxide-curable siloxane-based adhesive is excessively high in the amount of the initiator, the curing reaction of the peroxide-curable siloxane-based adhesive is excessively performed, and the adhesive layer 3 is hardened, and the adhesive tape is adhesive. The adhesion of 1 is easy to reduce. Then, when the adhesive tape 1 is used for dicing, when the semiconductor element substrate is cut, the semiconductor wafer which is a cut piece is peeled off from the adhesive tape 1 and is easily scattered.

[Second form]

Next, the adhesive layer 3 of the second embodiment is a siloxane-based adhesive, and includes an addition-reactive type oxyalkylene-based adhesive, and contains a crosslinking agent and a catalyst as a curing agent. Moreover, the adhesive layer of the second form 3, which may be configured to include a reaction control material for suppressing the rapid addition reaction of the addition reaction type siloxane-based adhesive.

(Additional reaction type alkoxyline adhesive)

The addition-reactive type oxyalkylene-based adhesive is an adhesive mainly comprising an organic polyoxoxane such as polydimethyl siloxane having at least two fluorene-bonded alkenyl groups in one molecule. In addition, examples of the molecular structure of the organopolyoxane contained in the addition-reactive type oxyalkylene-based adhesive include a linear, branched, and branched network having a part of a chain.

Moreover, examples of the alkenyl group contained in the organopolyoxane contained in the addition reaction type oxyalkylene-based adhesive include vinyl, propenyl, butenyl, pentenyl, hexenyl, and especially vinyl. It is better.

The addition-reactive type oxane-based adhesive is not particularly limited, and examples thereof include KR3700, KR3701, X-40-3237-1, X-40-3240, and X-40 manufactured by Shin-Etsu Chemical Co., Ltd. -3291-1, X-40-3229, X-40-3270, X-40-3306, TSR1512, TSR1516, XR37-B9204 manufactured by Momentive Performance Materials, SD4580, SD4584, SD4585 manufactured by Dow Corning Toray Co., Ltd. , SD4586, SD4587, SD4560, SD4570, SD4600PFC, SD4593, DC7651ADHESIVE and so on.

(additive (modifier))

The addition reaction type siloxane-based adhesive is used as an additive and may include a modifier. Additive for use as an addition reaction type oxyalkylene adhesive (Modifier) A mixture of an organic polysiloxane such as polydimethylsiloxane and an organic polyoxyalkylene copolymer resin or an organic polyoxyalkylene is used. The additive (modifier) is not particularly limited, and for example, SD-7292, BY15-701A, SD-7226, SE1886A/B, manufactured by Dow Corning Toray Co., Ltd., and Shin-Etsu Chemical Co., Ltd. can be used. X-92-128, X-41-3003, etc.

Further, even in the case of an addition reaction type decane-based adhesive, a mixture of an organic polysiloxane having a polydimethylsiloxane or the like and an organic polyoxane copolymer resin and an organic polyoxane mixture is mixed. The peroxide-curable siloxane-based adhesive can also obtain the same modification effect as when the above-mentioned additive (modifier) is used. The peroxide-curable siloxane-based adhesive is not particularly limited, and for example, KR-100, KR-101-10, KR-130 manufactured by Shin-Etsu Chemical Co., Ltd., and YR3340 manufactured by Momentive Performance Materials Co., Ltd. can be used. , YR3286, PSA610-SM, XR37-B6722, SH4280 manufactured by Dow Corning Toray Co., Ltd., etc.

(crosslinking agent)

In the reaction of the addition reaction type siloxane-based adhesive, as the crosslinking agent, an organic polyoxyalkylene having at least two ruthenium atoms bonded to a hydrogen atom in one molecule is used.

The molecular structure of the organopolyoxane used for the crosslinking agent is, for example, a linear chain, a branched chain, a branched chain, or a network.

Crosslinking as a reaction for an addition reaction type decane-based adhesive The agent is not particularly limited, and examples thereof include X-92-122 manufactured by Shin-Etsu Chemical Co., Ltd., and BY24-741 manufactured by Dow Corning Toray Co., Ltd.

(catalyst)

In the reaction of the addition reaction type oxane-based adhesive, a catalyst for promoting hardening by an addition reaction (hydrazine hydrogenation) of an addition reaction type siloxane-based adhesive and a crosslinking agent is used.

As the catalyst, a known catalyst for hydrogenation reaction such as a platinum-based catalyst, a ruthenium-based catalyst, or a palladium-based catalyst is used. Among these catalysts, especially platinum fine powder, platinum black, supported platinum ruthenium oxide micropowder, supported platinum activated carbon, chloroplatinic acid, chloroplatinic acid in ethanol solution, platinum olefin complex, platinum olefin oxide A platinum-based catalyst such as a complex compound is preferred because it has a good reaction rate.

The catalyst used for the reaction of the addition-reactive type oxyalkylene-based adhesive is not particularly limited, and examples thereof include CAT-PL-50T manufactured by Shin-Etsu Chemical Co., Ltd. and Dow Corning Toray Co., Ltd. SRX-212Cat, NC-25, etc.

(reaction control agent)

The reaction control agent to be used in the adhesive layer 3 of the second embodiment is not particularly limited, and examples thereof include CAT-PLR-2 manufactured by Shin-Etsu Chemical Co., Ltd. and Dow Corning Toray Co., Ltd. BY24-808 and so on.

(content)

Here, the content of the crosslinking agent in the pressure-sensitive adhesive layer 3 of the second embodiment is preferably in the range of 0.05 part by weight to 10 parts by weight based on 100 parts by weight of the addition reaction type oxyalkylene-based pressure-sensitive adhesive, and 0.1 part by weight. The range of parts to 7 weights is more preferable, and the range of 0.1 parts by weight to 2 parts by weight is more preferable.

In addition, the content of the additive (modifier) of the adhesive layer 3 of the second embodiment is preferably in the range of from 0 to 50 parts by weight based on 100 parts by weight of the addition reaction type azide-based adhesive. The range from 0 weight to 30 weight is better.

When the content of the addition-reactive type naphthenic-based adhesive relative to the crosslinking agent and the modifying agent is in the above range, the adhesive force and the holding force of the adhesive layer 3 can be used as the adhesive tape 1 for cutting. , set to the ideal range.

On the other hand, when the content of the addition reaction type siloxane-based adhesive is excessively low with respect to the crosslinking agent, the crosslinking reaction in the pressure-sensitive adhesive layer 3 is not sufficiently performed, and the desired adhesive force cannot be obtained. . In addition, when the crosslinking reaction of the addition reaction type oxyalkylene-based pressure-sensitive adhesive is not sufficiently performed, aggregation failure is likely to occur in the pressure-sensitive adhesive layer 3. As a result, after the adhesive tape 1 is used for dicing the semiconductor element substrate, when the adhesive tape 1 is peeled off from the obtained semiconductor wafer, the adhesive remains easily.

Further, when the content of the addition-reactive type oxane-based adhesive relative to the crosslinking agent is excessively high, the crosslinking reaction of the addition-reactive type siloxane-based adhesive proceeds excessively, and the adhesive layer 3 becomes hard. The adhesive force of the adhesive tape 1 is easily lowered. Then, when the adhesive tape 1 is used for cutting, when the semiconductor element substrate is cut, the cut piece is a semiconductor wafer from the adhesive tape. 1 peeling and easy to fly.

In addition, the content of the catalyst in the adhesive layer 3 of the second embodiment is not particularly limited, and may be, for example, about 0.01 part by weight to 5 parts by weight with respect to 100 parts by weight of the addition reaction type decane-based adhesive. .

<Adhesive coating>

As described above, in the adhesive tape 1 of the present embodiment, depending on the manufacturing conditions of the adhesive tape 1 and the use conditions of the adhesive tape 1 after the production, the type of the base material is provided between the base material 2 and the adhesive layer 3. A tackifying coating or a surface treatment such as corona treatment may be used. Thereby, the adhesion between the substrate 2 and the adhesive layer 3 can be improved.

<surface treatment>

The surface treatment of the surface of the base material 2 (the surface opposite to the surface facing the adhesive layer 3) may be subjected to a surface treatment such as a peeling-improving treatment. The treatment agent used for the surface treatment of the substrate 2 is not particularly limited, and for example, a long-chain alkylethylene monomer copolymer, a fluorinated alkylethylene monomer copolymer, a polyvinyl alcohol urethane, or an amino alcohol can be used. A non-oxyalkylene-based release treatment agent such as an acid resin. For example, PIROIRU 1050, PIROIRU 1200, and the like manufactured by One Society of Oils and Fats Co., Ltd., may be mentioned.

<release film>

Also, on the surface of the adhesive layer 3 (opposite to the surface opposite to the substrate 2) On the side of the side), it is also possible to provide a release film. As the release film, a film of paper, polyethylene, polypropylene, polyethylene terephthalate or the like may be used to improve the release property of the siloxane-based adhesive contained in the adhesive layer 3. Stripping handler. The material used for the release treatment of the release film is not particularly limited, and for example, a material such as fluorononone, a long-chain alkylethylene monomer copolymer, or an amino alkyd resin can be used.

<thickness of adhesive tape>

The thickness of the entire adhesive tape 1 having the structure as described above is preferably in the range of 20 μm to 200 μm.

In the case where the thickness of the adhesive tape 1 is thinner than 20 μm, when the adhesive tape 1 is used for dicing the semiconductor element substrate, it is difficult to peel the formed semiconductor wafer from the adhesive tape 1.

In the case where the thickness of the adhesive tape 1 is thicker than 200 μm, when the adhesive tape 1 is attached from the sealing resin side of the semiconductor element substrate, the adhesive tape 1 hardly follows the unevenness of the sealing resin. As a result, the bonding area of the adhesive tape 1 and the sealing resin becomes small, and the semiconductor wafer is easily scattered when it is cut.

[Method of manufacturing adhesive tape]

Next, a method of manufacturing the adhesive tape 1 of the present embodiment will be described.

Furthermore, the adhesive tape 1 having the adhesive layer 3 containing the peroxide-curable siloxane-based adhesive of the first aspect described above has The adhesive tape 1 of the adhesive layer 3 of the addition type type oxyalkylene-based adhesive of the form 2 can be manufactured by the same manufacturing method.

When the pressure-sensitive adhesive tape 1 is produced, first, a hardening type siloxane-based adhesive and a curing agent are dissolved in an organic solvent such as toluene or ethyl acetate to obtain an adhesive solution. Next, the adhesive solution is applied to the surface of the substrate 2 on which the surface treatment and the adhesion-promoting coating layer are formed, using a comma coater or the like, as necessary, to a predetermined thickness.

Then, the substrate 2 to which the adhesive solution is applied is heated at a temperature of 60 ° C to 160 ° C for several minutes to several tens of minutes to harden the adhesive solution to form the adhesive layer 3 .

According to the above process, as shown in FIG. 1, the adhesive tape 1 in which the adhesive layer 3 is laminated on the base material 2 can be obtained.

[How to use adhesive tape]

As described above, the adhesive tape 1 of the present embodiment is used for cutting a semiconductor element substrate. Here, the semiconductor element substrate refers to a semiconductor element such as a plurality of LEDs (Light Emitting Diodes) formed on a substrate such as a resin. Further, in such a semiconductor element substrate, in order to change from the external environment such as temperature and humidity, a semiconductor element is usually obtained, and a sealing resin is provided so as to cover the semiconductor element. Further, in such a semiconductor element substrate, in order to efficiently extract light emitted from a semiconductor element such as an LED, a lens material is provided on each semiconductor element.

Used to cut the semiconductor element substrate to obtain a plurality of As a method of a conductor wafer, for example, the following method is known.

First, an adhesive tape for dicing is attached from the substrate side of the semiconductor element substrate, and the adhesive tape is cut from the side on which the semiconductor element is formed on the side opposite to the side to which the adhesive tape is attached by a cutter or the like. Then, a plurality of semiconductor wafers are obtained by stripping the formed semiconductor wafers from the adhesive tape.

However, when the adhesive tape for dicing is attached from the substrate side of the semiconductor element substrate, and the semiconductor element substrate is cut, the cut surface (the side surface of the substrate of the semiconductor wafer) is notched, and the cut surface becomes thick. And other topics.

Therefore, in recent years, in order to solve such a problem, it is proposed that the semiconductor element substrate is formed on the side of the semiconductor element from the side of the substrate, that is, the sealing resin for sealing the peninsular element and the side on which the lens material is formed. A method of cutting a semiconductor element by attaching an adhesive tape for cutting.

Here, as an adhesive tape for dicing used for cutting a semiconductor element substrate, for example, an adhesive layer made of an acrylic resin is used.

However, when the semiconductor element substrate is diced by attaching such a conventional adhesive tape from the side (the sealing resin side, the lens material side) of the semiconductor element substrate on which the semiconductor element is formed, for example, sealing the resin and the adhesive tape When the adhesion and the adhesion between the lens material and the adhesive tape are insufficient, there is a problem that the semiconductor wafer is scattered during the cutting.

Conventionally, as a sealing resin for a semiconductor element, an epoxy resin having excellent electrical properties and heat resistance is used, but an epoxy resin is used. There is a problem that it is easy to change color when used for short-wavelength LEDs and high-output LEDs.

Therefore, in recent years, there have been many cases in which a silicone resin is used as a sealing resin for a semiconductor element such as an LED.

The decyl alkane resin which is a sealing resin for a semiconductor element is a fluorene containing a methyl group and a phenyl group, or a fluorene-containing resin which is a functional group and contains a methyl group. An oxyalkylene resin, a fluorene oxide resin containing both a methyl group and a phenyl group, and a phenylene oxide resin containing a phenyl group. As a functional group, a siloxane containing either a methyl group or a phenyl group or a phenyl group has a light transmittance of 88% or more for a light having a wavelength of 400 nm to 800 nm and a refractive index of 1.41 or more. Therefore, when a sealing resin for a semiconductor element such as an LED is used, light emitted from the semiconductor element can be efficiently taken out to the outside of the package, and light extraction efficiency can be improved.

Even when it is used in such a decane resin, a siloxane containing a phenyl group as a functional group is used, and light from a semiconductor element can be further improved as compared with the case of using a siloxane containing only a methyl group. Light extraction efficiency.

The methyl group-containing decane resin is not particularly limited, and examples thereof include KER-2300, KER-2460, KER-2500N, KER-2600, KER-2700, and KER-2900 manufactured by Shin-Etsu Chemical Co., Ltd. , X-32-2528, MOMENTIVE PERFORMANCE MATERIALS company's IVS4312, IVS4312, XE14-C2042, IVS4542, IVS4546, IVS4622, IVS4632, IVS4742, IVS4752 IVSG3445, IVSG0810, IVSG5778, XE13-C2479, IVSM4500, OE-6351, OE-6336, OE-6301, etc. manufactured by Dow Corning Toray Co., Ltd.

The oxime resin containing both a methyl group and a phenyl group is not particularly limited, and examples thereof include KER-6075, KER-6150, and KER-6020 manufactured by Shin-Etsu Chemical Co., Ltd.

The phenyl group-containing decane resin is not particularly limited, and examples thereof include KER-6110, KER-6000, KER-6200, ASP-1111, ASP-1060, and ASP-1120 manufactured by Shin-Etsu Chemical Co., Ltd. ASP-1050P, XE14-C2508 manufactured by MOMENTIVE PERFORMANCE MATERIALS, OE-6520, OE-6550, OE-6631, OE-6636, OE-6635, OE-6630, etc. manufactured by Dow Corning Toray Co., Ltd.

Further, as described above, in the semiconductor element substrate, the lens material made of the above-described siloxane resin is provided on each semiconductor element for the purpose of improving the extraction efficiency of light emitted from the semiconductor element. The method of providing the lens material on the semiconductor element is, for example, a sealing resin made of the above-described siloxane resin and covering each semiconductor element, and formed into a lens shape, and formed of the above-described siloxane resin. The lens material is further attached to a sealing resin for sealing each semiconductor element.

However, the siloxane chain has a property of high release property, for example, compared with an epoxy resin or the like. Therefore, the semiconductor element substrate using the siloxane resin as the sealing resin and the semiconductor element substrate forming the lens material made of the decane resin are formed from the side where the sealing resin or the lens material is formed. When an adhesive tape such as an acrylic resin is attached, the adhesion of the sealing resin or the lens material, that is, the silicone resin and the adhesive tape, tends to be small. As a result, when the semiconductor element substrate is cut, problems such as scattering of the semiconductor wafer described above are more likely to occur.

On the other hand, the adhesive tape 1 of the present embodiment is configured by including a curable naphthene-based adhesive and a curing agent in the adhesive layer 3, and is formed to be sealed even when the semiconductor element substrate is cut. In the case where the side of the resin or the lens material is attached and used, it is possible to maintain a good adhesion force with the sealing resin of the semiconductor element substrate. Then, when the semiconductor element substrate is diced, the occurrence of scattering or the like of the semiconductor wafer can be suppressed as compared with the conventional adhesive tape.

Hereinafter, the method of using the adhesive tape 1 of the present embodiment and the method of manufacturing the semiconductor wafer using the adhesive tape 1 of the present embodiment will be described in detail.

Here, a first example of manufacturing a semiconductor wafer in which a semiconductor element substrate of a plurality of semiconductor elements is sealed by a sealing resin is collectively described will be described. 2(a) to 2(d) are views showing a first example of manufacturing of a semiconductor wafer using the adhesive tape of the present embodiment.

In the present embodiment, first, a plurality of semiconductor elements 102 are stacked on a substrate 101 made of a resin material to form a semiconductor element substrate 100. In addition, the semiconductor element 102 is, for example, an LED element, and is formed by, for example, a plurality of semiconductor layers in which a light-emitting layer that emits light by energization is laminated, and an electrode is formed on the upper portion.

Next, it will be formed on the substrate 101 of the semiconductor element substrate 100. The plurality of semiconductor elements 102 are collectively sealed by a sealing resin 103 made of a decyl alkane resin (sealing process). Further, in this example, the plurality of semiconductor elements 102 are collectively sealed by the sealing resin 103. However, the respective semiconductor elements 102 may be individually sealed by the sealing resin 103. Further, in this example, the sealing process corresponds to a coating process in which the semiconductor element 102 is covered with a siloxane resin.

Next, as shown in FIG. 2(a), the adhesive tape 1 of the adhesive tape 1 and the sealing resin 103 of the semiconductor element substrate 100 are opposed to each other, and the adhesive tape 1 and the semiconductor element substrate 100 are bonded together (attach engineering) ).

Next, as shown in FIGS. 2(b) and 2(c), in the state in which the adhesive tape 1 and the sealing resin 103 of the semiconductor element substrate 100 are bonded together, along the line to cut X, by a cutter or the like. The semiconductor element substrate 100 is cut (cutting process). In this example, the semiconductor element substrate 100 to which the adhesive tape 1 is attached is cut from the substrate 101 side. Further, as shown in FIG. 2(c), in this example, so-called full cutting of all the semiconductor element substrates 100 is performed.

Next, by peeling (pick-up) the semiconductor wafer 200 formed by cutting the semiconductor element substrate 100 from the adhesive tape 1, as shown in FIG. 2(d), the individualized semiconductor wafer 200 can be obtained (peeling process) .

Next, a second manufacturing example in which a semiconductor wafer is formed by dividing a semiconductor element substrate in which a lens material is formed in each of a plurality of semiconductor elements, and a semiconductor wafer, will be described. 3(a) to 3(d) are views showing a second example of manufacturing of a semiconductor wafer using the adhesive tape of the present embodiment. Here, the description of the same items as the first manufacturing example shown in FIGS. 2(a) to 2(d) will be omitted.

In the second manufacturing example of the semiconductor wafer, as shown in FIG. 3(a), a lens material 104 made of a siloxane resin is formed on the semiconductor element 102 formed on the substrate 101 of the semiconductor element substrate 100 (lens). Forming the project). Further, in this example, the lens forming process corresponds to a coating process in which the semiconductor element 102 is covered with a siloxane resin.

The method of forming the lens material 104 includes a method in which a sealing resin covering the respective semiconductor elements 102, which is formed of a siloxane resin, is molded into a lens shape, as a method of the lens material 104, and sealing of the semiconductor elements 102 is covered. A method of attaching the lens material 104 made of a siloxane resin to the resin.

Here, the method of forming the lens material 104 into a lens shape by forming the sealing resin covering the semiconductor element 102 is not particularly limited, and examples thereof include compression molding, injection molding, transfer molding, and printing molding.

In addition, the method of attaching the lens material 104 to the sealing resin covering each semiconductor element 102 is not particularly limited, and examples thereof include a dispensing method and the like.

Next, as shown in FIG. 3(a), the adhesive tape 1 and the semiconductor element substrate 100 are bonded to each other with the adhesive layer 3 of the adhesive tape 1 facing the respective lens materials 104 formed on the semiconductor element substrate 100. Attached to the project).

Then, as shown in FIGS. 3(b) and 3(c), in the state in which the adhesive tape 1 and the lens material 104 of the semiconductor element substrate 100 are bonded together, the cutting line X is cut along the cutting line X by a cutter or the like. Broken semiconductor device substrate 100 Cheng). In this example, the line to cut X is set in a region between the lens members 104 formed on the adjacent semiconductor elements 102.

Next, by peeling (pick-up) the semiconductor wafer 200 formed by cutting the semiconductor element substrate 100 from the adhesive tape 1, as shown in FIG. 3(d), individualized and separately formed lens materials 104 can be formed. Semiconductor wafer 200 (peeling engineering).

As described above, in the adhesive tape 1 of the present embodiment, the adhesive layer 3 is composed of a curable naphthene-based adhesive and a curing agent. By the way, when the adhesive tape 1 is used for dicing, the semiconductor element substrate 100 and the adhesive tape can be maintained even in the case of being attached from the sealing resin 103 of the semiconductor element substrate 100 or the side on which the lens material 104 is formed. The next force of 1.

In particular, in recent years, as the sealing resin 103 for sealing the semiconductor element 102 and the lens material 104 provided on the semiconductor element 102, a highly deodorizing siloxane resin is used. On the other hand, the adhesive tape 1 of the present embodiment has the above-described structure, and has a good adhesive force even for the sealing resin 103 and the lens material 104 which are made of a siloxane resin.

As a result, in the adhesive tape 1 of the present embodiment, when the semiconductor element substrate 100 is diced, scattering of the semiconductor wafer 200 can be suppressed.

In particular, as shown in FIGS. 3(a) to 3(d), the lens member 104 is generally formed of a spherical surface and an aspherical surface. When the adhesive tape 1 is attached from the lens member 104 side, the adhesive surface of the adhesive tape 1 is curved. . In general, when the adhesive surface of the adhesive tape 1 is a curved surface, the adhesive force of the adhesive tape 1 and the adhesive surface tends to be low as compared with the case where the adhesive surface is flat. In contrast, this is Since the adhesive tape 1 of the embodiment has a good adhesive force with respect to the silicone resin constituting the lens material 104, even in the case where the adhesive tape 1 is attached from the lens material 104 side of the curved surface, the semiconductor wafer 200 can be suppressed. Flying.

Further, the curable naphthene-based adhesive contained in the adhesive layer 3 of the pressure-sensitive adhesive tape 1 of the present embodiment has a good adhesion to the sealing resin 103 and the lens material 104 as described above. Highly isolated nature. As a result, in the present embodiment, when the semiconductor wafer 200 obtained by cutting the semiconductor element substrate 100 is peeled off from the adhesive tape 1, it is possible to suppress the occurrence of so-called adhesive residue adhering to the semiconductor wafer 200 with the adhesive.

In general, for example, an adhesive tape made of an acrylic adhesive is used for cutting a semiconductor element substrate, and when the adhesive tape after the cutting is peeled off from the adhesive tape, it is necessary to irradiate the adhesive tape with ultraviolet rays in advance. The adhesion of the adhesive layer is lost. On the other hand, in the case of the adhesive tape 1 of the present embodiment, the semiconductor wafer 200 can be peeled off from the adhesive tape 1 without performing the irradiation of ultraviolet rays.

Therefore, the use of the adhesive tape 1 of the present embodiment for dicing the semiconductor element substrate 100 can simplify the manufacturing process of the semiconductor wafer 200.

In addition, the method described in FIGS. 2(a) to 2(d) and FIGS. 3(a) to 3(d) is an example of a method of manufacturing a semiconductor wafer using the adhesive tape 1, and the method of using the adhesive tape 1 is not Limited to the aforementioned method. That is, the adhesive tape 1 of the present embodiment is attached to each other as long as it is cut. The semiconductor element substrate in which a plurality of semiconductor elements are sealed by a sealing resin or a plurality of semiconductor elements each forming a lens material can be used without being limited to the above method.

[Examples]

Next, the present invention will be more specifically described using examples and comparative examples. Furthermore, the invention is not limited to the following examples.

The inventors of the present invention used the first embodiment of the peroxide-curable siloxane-based adhesive as the adhesive layer 3, and the second embodiment of the additive-type oxyalkylene-based adhesive as the adhesive layer 3, respectively. In the form, the amount of the curing agent (initiator, crosslinking agent) was changed, and the pressure-sensitive adhesive tape 1 was produced, and the adhesive tape 1 produced was evaluated.

Hereinafter, each embodiment and each comparative example will be described in detail.

1. Production of adhesive tape 1 (Examples 1 to 4)

A toluene-soluble peroxide-curable siloxane-based adhesive (KR101-1 manufactured by Shin-Etsu Chemical Co., Ltd.) and an initiator derived from methyl benzhydroxide (NYPER K40, manufactured by Nippon Oil Co., Ltd.), adjust the adhesive solution. Further, the contents of the peroxide-curable siloxane-based adhesive and the initiator were adjusted as shown in Table 1.

Next, the adhesive solution was applied onto a substrate 2 made of a polyethylene terephthalate (PET) film having a thickness of 75 μm, and then heated at a temperature of 160 ° C for 3 minutes to form a thickness. 30μm adhesion The agent layer 3 was obtained as an adhesive tape 1 having a total thickness of 105 μm.

(Examples 5 to 8)

In addition to toluene, an addition reaction type decane-based adhesive composed of an organopolysiloxane having a vinyl fluorenyl group in the molecule (X-40-3237-1 manufactured by Shin-Etsu Chemical Co., Ltd.) and a platinum metal-based contact Medium (CAT-PL-50T manufactured by Shin-Etsu Chemical Co., Ltd.), cross-linking agent made of organopolysiloxane with a hydrazine-based group in the molecule (X-92-122, manufactured by Shin-Etsu Chemical Co., Ltd.), adjusted for adhesion Solution solution. Further, the contents of the addition reaction type siloxane-based adhesive, catalyst, and crosslinking agent were adjusted as shown in Table 1.

Next, the adhesive solution was applied onto a substrate 2 made of a PET film having a thickness of 75 μm, and then heated at a temperature of 120 degrees for 3 minutes to form an adhesive layer 3 having a thickness of 30 μm to obtain a total thickness. 105μm adhesive tape 1.

(Comparative Example 1)

The adhesive tape 1 was obtained in the same manner as in the first to fourth embodiments except that the content of the initiator of the adhesive layer 3 was changed to zero.

(Comparative Example 2)

The adhesive tape 1 was obtained in the same manner as in the fifth to eighth embodiments except that the content of the crosslinking agent in the adhesive layer 3 was changed to zero.

(Comparative Example 3)

The adhesive tape 1 was obtained in the same manner as in Examples 1 to 8 except that an acrylic adhesive was used as the adhesive layer 3.

2. Evaluation method

Next, the evaluation method of the adhesive tape 1 will be described.

(1) Adhesion test for grinding SUS

The adhesive tape 1 produced by the above method was subjected to a polishing SUS adhesion test (peel adhesion test) in accordance with the method described in JIS Z 0237 (2000).

Specifically, the adhesive tape 1 was attached to a stainless steel plate (SUS304) polished with water-sand paper, and a roller having a mass of 2000 g was subjected to a round-trip at a speed of 5 mm/s for pressure bonding. Next, after standing for 20 to 40 minutes, the stainless steel plate was peeled off at a speed of 5 mm/s in the 180° direction using a tensile tester, and the adhesion to the ground SUS plate was measured.

(2) Retention test

A holding force test was performed on the adhesive tape 1 produced.

Specifically, the adhesive tape 1 was attached to a stainless steel plate (SUS304) polished with water-sand paper, and the amount of deviation (mm) when held at 40 ° C for 24 hours in a state where the predetermined weight was attached was measured. Here, as the adhesive tape for dicing, the amount of deviation measured in the holding force test is preferably 25 mm or less.

Also, after 24 hours, the adhesive tape 1 peeled off from the stainless steel plate. In the next measurement, the elapsed time (minutes) until the peeling of the adhesive tape 1 was started. Further, in Table 1, the indication of the enthalpy of the holding force test indicates that the adhesive tape 1 was dropped from the stainless steel plate 24 hours before the lapse of 24 hours.

(3) Adhesion test for decane resin

For the adhesive tape 1 produced, the adhesion test of the decane resin was carried out in accordance with the above-mentioned adhesion test method.

Specifically, the adhesive tape 1 was attached to a plate (test piece) coated with a siloxane resin, and a roller having a mass of 2000 g was subjected to a round-trip at a speed of 5 mm/s to perform pressure bonding. Next, after standing for 20 to 40 minutes, the sheet coated with the siloxane resin was peeled off at a speed of 5 mm/s in the 180° direction using a tensile tester, and the adhesion to the siloxane resin was measured.

Further, in the present test, a decyl alkane resin for an LED sealing agent was used as the siloxane resin applied to the plate to which the adhesive tape 1 was attached.

Specifically, as the decane resin A, a decyl alkane resin (KER-2500N manufactured by Shin-Etsu Chemical Co., Ltd.) containing a methyl group as a lanthanane material for an LED device was used.

The test piece was produced as follows. That is, the A agent of the KER-2500N and the B agent were mixed at a mixing ratio of 1:1 to prepare a mixed solution. Next, the mixed solution was applied to a stainless steel plate (SUS304), heated at 100 ° C for 1 hour, and then heated at 150 ° C for 2 hours to be hardened. Thereby, a test piece in which the decane resin A was formed on the stainless steel plate was obtained.

Further, as the decane resin B, a decyl alkane resin containing a phenylene oxide material for a LED device, which is a phenylene group, is used. KER-6110).

The test piece was produced as follows. That is, the A agent of the KER-6110 and the B agent were mixed at a mixing ratio of 3:7 to prepare a mixed solution. Next, the mixed solution was applied to a stainless steel plate (SUS304), heated at 100 ° C for two hours, and then heated at 150 ° C for 5 hours to be hardened. Thereby, a test piece in which a decane resin B was formed on a stainless steel plate was obtained.

3. Evaluation results

The evaluation results of the adhesive tapes 1 of Examples 1 to 8 and Comparative Examples 1 to 3 are disclosed in Table 1.

As shown in Table 1, when the adhesive layer 3 is composed of a curable naphthalene-based adhesive and a curing agent (Examples 1 to 8), It was confirmed that the adhesive tape 1 adhered to the SUS plate, the holding power, the adhesion to the siloxane resin A, and the adhesion to the siloxane resin B were all in a desired range.

The adhesive tape 1 including the curable naphthene-based adhesive and the curing agent to form the adhesive layer 3 can be used, and it can be attached as a sealing resin from the semiconductor element substrate or a side on which the lens material is formed. Adhesive tape for cutting used for cutting.

Next, in Examples 1 to 8, it was confirmed that when a peroxide-curable siloxane-based adhesive was used as the oxyalkylene-based adhesive (Examples 1 to 4), When the content of the initiator of the oxide is 0.05 parts by weight to 10 parts by weight with respect to 100 parts by weight of the peroxide-curable siloxane-based adhesive (Examples 1 to 3), the adhesive tape 1 The retention is better.

Furthermore, when the content of the initiator is 0.05 parts by weight to 3.5 parts by weight based on 100 parts by weight of the peroxide-curable siloxane-based adhesive (Example 1 and Example 2), the adhesive tape 1 is The adhesion of the decane resin A and the adhesion to the siloxane resin B are better.

Therefore, when a peroxide-curable siloxane-based adhesive is used as the oxyalkylene-based adhesive, the content of the initiator derived from the peroxide is determined relative to the peroxide-curable siloxane. The weight of 100 parts of the adhesive is preferably in the range of 0.05 parts by weight to 10 parts by weight, and more preferably in the range of 0.05 parts by weight to 3.5 parts by weight.

Further, in Examples 1 to 8, it was confirmed that when an addition reaction type decane-based adhesive is used as the oxyalkylene-based pressure-sensitive adhesive (Examples 5 to 8), the content of the crosslinking agent is 0.1 part by weight to 7 parts by weight based on 100 parts by weight of the addition reaction type oxyalkylene-based pressure-sensitive adhesive (Examples 5 to 7) The adhesion of the adhesive tape 1 to the SUS plate, the adhesion to the decane resin A, and the adhesion to the siloxane resin B are higher, and it is 0.1 part by weight to 2 parts by weight (Example 5, implementation) Example 6), the adhesion of the adhesive tape 1 to the SUS plate, the adhesion to the siloxane resin A, and the adhesion to the siloxane resin B were higher.

Therefore, when the addition reaction type siloxane-based adhesive is used as the oxyalkylene-based pressure-sensitive adhesive, the content of the crosslinking agent is 0.1% based on 100 parts by weight of the addition reaction type siloxane-based pressure-sensitive adhesive. The range of the weight portion to the 7-weight portion is more preferable, and the range of the 0.1-weight portion to the 2-weight portion is more preferable.

On the other hand, when the adhesive layer 3 did not contain a hardener (initiator or a crosslinking agent) (Comparative Example 1 and Comparative Example 2), it was confirmed that the holding force of the adhesive tape 1 was remarkably low. This is presumably because the silicone layer adhesive is not cured when the adhesive layer 3 does not contain a hardener.

When the adhesive tape 1 is used as the adhesive tape for dicing, it is predicted that the adhesive tape 1 is likely to be peeled off when the adhesive tape 1 is peeled off from the obtained semiconductor wafer after the adhesive tape 1 is used for dicing the semiconductor element substrate.

In addition, when the adhesive layer 3 was used as the adhesive layer 3 (Comparative Example 3), it was confirmed that the adhesive tape 1 had good adhesion to the polishing SUS plate and the holding force was good, but the sealing was performed as a semiconductor element. The adhesion of the decane resin A used for the resin and the adhesion to the siloxane resin B were remarkably low.

When the adhesive tape 1 is used as a dicing adhesive tape and is attached from the sealing resin side of the semiconductor element substrate, it is expected that the semiconductor element substrate and the semiconductor wafer are easily peeled off from the adhesive tape 1 when dicing is performed, which is liable to occur. The scattering of semiconductor wafers.

1‧‧‧Adhesive tape

2‧‧‧Substrate

3‧‧‧Adhesive layer

Claims (7)

An adhesive tape for dicing, which is a dicing used for forming a plurality of semiconductor elements, each of which is sealed by a sealing resin, or an element substrate on which a lens material is formed on each semiconductor element, and is divided into a plurality of semiconductor wafers. An adhesive tape comprising: a substrate; and an adhesive layer laminated on the substrate, comprising a curable naphthenic adhesive and a curing agent. The adhesive tape for dicing according to the first aspect of the invention, wherein the above-mentioned element substrate is formed of a silicone resin having one or both of a methyl group and a phenyl group as a functional group. The side or the aforementioned lens material side is attached and used. The adhesive tape for dicing according to the first or second aspect of the invention, wherein the adhesive layer comprises a peroxide-curable siloxane-based adhesive and an initiator derived from a peroxide. . The adhesive tape for dicing according to the third aspect of the invention, wherein the content of the initiator is 0.01 part by weight to 15 parts by weight based on 100 parts by weight of the peroxide-curable siloxane-based adhesive. The scope of the department. For example, the adhesive tape for cutting described in claim 1 or 2, wherein The pressure-sensitive adhesive layer contains an addition reaction type siloxane-based adhesive, a crosslinking agent, and a catalyst. The adhesive tape for dicing according to the fifth aspect of the invention, wherein the content of the crosslinking agent is 0.05 part by weight to 10 parts by weight based on 100 parts by weight of the addition reaction type siloxane-based adhesive. The scope of the department. A method for manufacturing a semiconductor wafer, comprising: coating a plurality of semiconductor elements in which a plurality of semiconductor elements are formed on an element substrate formed on a substrate by a siloxane resin; and attaching a substrate to be provided with a substrate and hardening The adhesive tape of the adhesive layer of the type of the oxyalkylene-based adhesive and the hardener is attached to the element substrate from the side of the siloxane resin; the cutting process is performed by attaching the component substrate to the adhesive tape. Cutting into a plurality of semiconductor wafers; and stripping engineering, the adhesive tape is peeled off from the plurality of semiconductor wafers.