TW201623170A - Cutting method and processing device of brittle material substrate - Google Patents

Abstract

The present invention is to inhibit the decrease of processing quality when a plurality of markings is formed by the narrower spacing or crossing during cutting of the glass substrate. The method comprises the first step and the second step. The first step is to make one face of the scribing wheel press onto one face of the surface of glass substrate for moving by the specific load to form the cutting groove along the cutting default line. The second step is to exert the cutting force to the cutting groove formed in the first step to cut off the glass substrate. Moreover, the pressing load of the scribing wheel on the glass substrate in the first step will not generate the ribbing pattern when the groove is formed in the first step, and form the load with the size of perpendicular cracks right beneath the groove.

Description

Breaking method and processing device for brittle material substrate

The present invention relates to a method for breaking a brittle material substrate, and more particularly to a method for breaking a brittle material substrate along a predetermined line. Further, the present invention relates to a processing apparatus for a brittle material substrate.

In the manufacturing process of the liquid crystal display panel, after the mother substrate is formed with crossed scribe lines, a breaking force is applied to the mother substrate, and a plurality of unit substrates are divided along the scribe line.

When the scribe line is formed on the mother substrate, for example, methods as disclosed in Patent Document 1 and Patent Document 2 are used. In the methods shown in these documents, first, a scribing wheel is used to form a scribe line on the surface of the glass substrate. Thereafter, a breaking force is applied to the glass substrate, whereby the cutting is performed along the scribe line.

In particular, in Patent Document 2, processing is performed so as to have rib lines in the scribe line (breaking groove). Generally, rib-like lines are formed directly under the grooves, and the vertical cracks extend from the front end of the rib-like lines in the thickness direction of the substrate. By forming the rib lines in the scribe lines, the mother substrate can be broken with a relatively small force.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2012-6780

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2008-308380

As shown in Patent Document 2, when the glass substrate is divided, when the slit groove is formed, the scoring wheel is pressed against the glass by a relatively large pressing force to form a rib pattern. Substrate. Thereby, a deep crack is formed in the thickness direction of the glass substrate, and when it is broken, the glass substrate can be favorably cut off without causing a lateral crack.

However, in recent years, it has been required to separate a very small unit substrate from a mother substrate. In this case, it is necessary to form a plurality of scribe lines at a narrower interval or to cross scribe at a narrower interval. In such a situation, the stress generated by the scribing formed first may adversely affect the scribing formed later. Specifically, there is a problem in that quality deterioration (horizontal cracks, chips, peeling, burrs, and the like) or a defective end surface is not perpendicular to the surface of the portion where the scribe lines intersect.

An object of the present invention is to suppress deterioration of processing quality when a brittle material substrate such as a glass substrate is cut by forming a plurality of scribe lines or forming cross scribes at a narrow interval.

The breaking method of the brittle material substrate according to one aspect of the present invention includes the first step and the second step of dividing the brittle material substrate along the predetermined line. In the first step, the cutter blade is moved while being pressed against the surface of the brittle material substrate with a specific load, and a slit groove is formed along the predetermined line. In the second step, a breaking force is applied to the dividing groove formed in the first step to break the brittle material substrate. Further, in the first step, the load on the brittle material substrate by the dicing blade is a load in which the rib-like grooves are not formed when the grooves are formed in the first step, and the vertical cracks are formed directly under the grooves.

Here, the pressing force of the dicing blade to the brittle material substrate is set to be relatively small, and the dicing blade is moved, whereby the dividing groove is formed along the predetermined line of the breaking of the surface of the brittle material substrate. By forming the slit groove in this manner, it is not easy to accumulate stress along the inside of the brittle material substrate of the groove. Therefore, when the other grooves are formed close to the groove for the first formation, or the grooves are formed, the chips are less likely to be generated. Again, for the same reason, the income after the break The perpendicularity of the end surface of the brittle material substrate becomes good.

Further, the "ribbed grain" in the present invention means a crack which is continuously formed in the breaking direction by the plastic deformation region formed by pressing the cutting blade against the surface of the substrate and moving. A plurality of curved (rib-like) stripes extending in the thickness direction of the substrate at the end surface (cross-section) of the substrate were observed and formed in the thickness direction of the substrate. A vertical crack in which a curved stripe is not observed is formed from the front end of the ribbed grain (the end portion on the inner side of the substrate) in the thickness direction of the substrate.

In the breaking method of the brittle material substrate according to another aspect of the present invention, in the first step, the dicing blade is pressed against the brittle material substrate with a load of 10 N or less and 1 N or more.

By processing the dicing blade against the brittle material substrate with such a small pressure against the load, it is possible to form the grooves and vertical cracks required for the break, without causing ribs on the inside of the brittle material substrate.

In the breaking method of the brittle material substrate according to still another aspect of the present invention, in the first step, the dicing blade is pressed against the brittle material substrate by a load of 6 N or less and 1 N or more.

Here, it is possible to more reliably form the grooves and vertical cracks required for the formation of the components without causing ribs on the inside of the brittle material substrate.

In the method for dividing a brittle material substrate according to still another aspect of the present invention, in the first step, the glass substrate having a thickness of 0.1 mm or more and 1 mm or less is formed to have a depth from the surface of 3% or more of the thickness of the substrate. A groove of plastic deformation zone of 15% or less.

Here, the depth of the plastic deformation region formed in the first step is shallower than in the previous processing method. Therefore, the stress accumulated in the inside of the brittle material substrate during the processing in the first step can be reduced, and the deterioration of the processing quality can be suppressed.

In a method of dividing a brittle material substrate according to still another aspect of the present invention, in the second step, the dividing grooves formed in the first step are directed downward, and the sides of the grooves supporting the surface of the brittle material substrate are supported. Or using an elastomer (for example, an elastic sheet such as a rubber sheet disposed on a platform containing a hard material such as metal or ceramic) to support the surface of the brittle material substrate The body is pressed against the back surface of the brittle material substrate which forms part of the groove from above, and is divided.

According to such a breaking method, the perpendicularity of the fracture end surface of the brittle material substrate obtained after the separation can be made good.

In a method of breaking a brittle material substrate according to still another aspect of the present invention, the brittle material substrate is glass.

A processing apparatus for a brittle material substrate according to an aspect of the present invention forms a partitioning groove and a vertical crack on a surface of a brittle material substrate along a predetermined line. The device includes a platform on which a substrate of a brittle material is placed, a cutting blade for breaking a brittle material substrate, a cutter pressing mechanism, and a moving mechanism. The cutter is freely arranged above the platform. The cutter pressing mechanism presses the cutter to a surface of the brittle material substrate with a specific load. The moving mechanism relatively moves the cutting blade and the platform along the predetermined dividing line, and forms a dividing groove on the brittle material substrate. Further, the dicing blade pressing mechanism presses the dicing blade against the brittle material substrate without causing a rib-like pattern to be formed in the slit groove and forming a vertical crack on the inner side of the groove (the inner side of the substrate).

In a processing apparatus for a brittle material substrate according to another aspect of the present invention, a cutting blade has a scribing wheel having an outer peripheral portion which is formed by intersecting a bottom portion of two truncated cones of a common rotating shaft to form a circumferential ridge. line. The scribing wheel has a plurality of notches and protrusions alternately formed in the circumferential direction along the circumferential ridge line.

In the apparatus for processing a brittle material substrate according to still another aspect of the present invention, the notch of the scoring wheel is formed along the entire circumference of the circumferential ridge line at a distance of 10 μm or more and 50 μm or less (preferably 10 μm or more and 40 μm or less). Further, the depth of the notch is 0.5 μm or more and 5.0 μm or less (preferably 1.0 μm or more and 3.0 μm or less).

Further, the type in which the length of the notch in the circumferential direction is shorter than the length in the circumferential direction of the protrusion, and the type in which the length in the circumferential direction of the protrusion is longer, the length in the circumferential direction of the notch is larger than the circumferential direction of the protrusion. In a type of scriber having a relatively short length, there is a tendency for vertical cracks to form relatively deep, assuming the circumferential direction of the gap In the type of scriber having a length longer than the length of the protrusion in the circumferential direction, there is a tendency that the strength of the end face of the substrate after the division is relatively high.

In the above invention, when the brittle material substrate is separated, especially when a plurality of slit grooves (scribe lines) are formed at a narrow interval, or when intersecting grooves (scribe lines) are formed (Cross scribe), it is possible to suppress a decrease in processing quality.

1‧‧‧ scoring device

2‧‧‧ platform

3‧‧‧Scratch

3a‧‧‧Circumferential ridge

3b‧‧‧The outer periphery

3c‧‧‧ gap

3d‧‧‧ prominence

3e‧‧‧through holes

4‧‧‧ Pressing mechanism

5‧‧‧Mobile agencies

10‧‧‧Scratch

15‧‧‧rail

16‧‧‧Ball screw

17‧‧‧Guide bars

18‧‧‧Motor

19‧‧‧CCD camera

22‧‧‧Distribution platform

A‧‧‧ length

B‧‧‧ Length

H‧‧‧depth

C‧‧‧French table

F‧‧‧ breaking force

G‧‧‧glass substrate

L‧‧‧breaking slot

P‧‧‧ spacing

R‧‧‧Rotary axis

X‧‧‧X direction

Y‧‧‧Y direction

Z‧‧‧Z direction

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic block diagram of a processing apparatus according to an embodiment of the present invention.

Figure 2 is a side elevational view of a scribe wheel in accordance with an embodiment of the present invention.

Figure 3 is a front view of the scoring wheel.

Figure 4 is a partial enlarged view of Figure 3.

Fig. 5 is a schematic view showing a breaking step.

Fig. 6 is a photomicrograph showing a comparison method of a breaking method according to an embodiment of the present invention and a previous breaking method.

[scratching device]

Fig. 1 shows an apparatus for forming a slit groove for a glass substrate (an example of a brittle material substrate). The scribing device 1 includes a stage 2, a scribing wheel 3, a pressing mechanism 4, and a moving mechanism 5.

The stage 2 is provided with a glass substrate G placed thereon, and the glass substrate G placed thereon is fixed by a vacuum suction member. The platform 2 is capable of horizontal rotation.

The scoring wheel 3 is mounted to the scribing head 10. The scribing wheel 3 rolls in a state of being pressed against the glass substrate G, and forms a dividing groove and a vertical crack in the glass substrate G. As shown in FIGS. 2 and 3, the scribing wheel 3 has an outer peripheral edge portion 3b which intersects the bottoms of the two truncated cones C sharing the rotation axis R to form a circumferential ridge line 3a, and a plurality of notches 3c and protrusions 3d. It is formed in the circumferential direction along the circumferential ridge 3a. Further, a through hole is formed in a central portion of the scribing wheel 3 3e.

As shown in an enlarged view in Fig. 4, the notch 3c of the scribing wheel 3 is formed along the entire circumference of the circumferential ridge line 3a by a distance P of 10 μm or more and 50 μm or less (preferably 10 μm or more and 40 μm or less). The depth h of the notch 3c is preferably 0.5 μm or more and 5.0 μm or less (particularly preferably 1.0 μm or more and 3.0 μm or less). Further, in the scribing wheel shown in Fig. 4, the length a of the notch 3c in the circumferential direction is formed to be shorter than the circumferential length b of the projection 3d.

The pressing mechanism 4 includes, for example, a cylinder or a hydraulic cylinder, and is provided in the scribing head 10. By the pressing mechanism 4, the load on the glass substrate G by the scribing wheel 3 can be adjusted. As the pressing mechanism 4, a servo motor can also be used.

The moving mechanism 5 is a mechanism for relatively moving the platform 2 and the scribing head 10 in the X direction and the Y direction. Further, the X direction is the left-right direction of FIG. 1, and the Y direction is orthogonal to the X direction and perpendicular to the paper surface of FIG.

The moving mechanism 5 has a pair of guide rails 15, a ball screw 16, a guide rod 17, and a motor 18. The pair of guide rails 15 are arranged to extend in the Y direction and are arranged in parallel with each other, and the platform 2 is supported to be movable in the Y direction. The ball screw 16 moves the platform 2 along a pair of guide rails 15. The guide rod 17 is mounted above the platform 2 in the X direction. In the guide rod 17, a scribing head 10 is slidably provided in the X direction. The motor 18 slides the scoring head 10 along the guide bar 17. Further, above the guide bar 17, a pair of CCD (Charge Coupled Device) cameras 19 that recognize the alignment marks of the glass substrate G formed on the stage 2 are disposed.

[Method of breaking glass substrate]

Here, as an example, a method of forming a plurality of unit substrates by dividing the mother substrate into the dividing grooves in the X and Y directions on the mother substrate and dividing the mother substrate into the dividing grooves will be described.

First, the glass substrate G which becomes a mother substrate is mounted on the stage 2. The alignment mark formed on the glass substrate G is observed by the CCD camera 19, and the position of the glass substrate G on the stage 2 is adjusted.

Then, the scribing head 10 is moved to the scribing start position by the moving mechanism 5, and the scoring wheel 3 is pressed against the surface of the glass substrate G by a specific load by the pressing mechanism 4. At this time, the pressing load is set so as not to form a rib pattern inside the glass substrate G when the slit groove is formed, and a load of a vertical crack is formed directly under the groove. Further, in this example, the scribing start position is a position from the end edge of the glass substrate G to the inside.

Then, the moving mechanism 5 is driven to move the glass substrate G or the stage 2, for example, in a plurality of predetermined breaking lines in the X direction. When the process of forming the grooves by the plurality of predetermined lines in the X direction is completed, the grooves are formed in the same manner in the plurality of predetermined lines in the Y direction. Further, in this example, the end position of each scribe is the position from the edge of the glass substrate G to the inside as in the start position.

After forming the breaking groove along all the predetermined dividing lines as described above, as shown in FIG. 5, the surface on which the glass substrate is formed with the dividing groove L side faces downward and is placed on the breaking platform 22. Then, a specific breaking force F is applied to the upper side, that is, the surface opposite to the surface on which the dividing groove L is formed. Thereby, the glass substrate G is divided along the dividing groove L.

[Experimental example]

Fig. 6 is a view showing an experimental example using a method according to an embodiment of the present invention and a prior method. The "low permeability scribe" in Fig. 6 indicates a method according to an embodiment of the present invention, and "normal scribe" indicates the previous method.

<condition>

The experimental conditions are as follows.

(1) Glass substrate

Low permeability scoring and usual scoring are as follows.

Material: alkali-free glass

Thickness: 0.5mm

(2) The scoring wheel is pressed against the load

Low permeability scribe: 3N

Usually scored: 16N

(3) spacing between lines (cross scribe)

Low permeability scribe and usually scored 3mm

Processing was carried out according to the above conditions, and the results were as follows.

<Results of the formation steps of the separation groove>

In the low-permeability scribing, the depth of the plastic deformation region (groove) formed by the scoring wheel 3 was 10 μm, and a vertical crack was formed directly below the plastic deformation region, and no rib-like pattern was observed. Vertical cracks extend from the surface of the substrate to a depth of 25 μm.

In the usual scribing, ribbed streaks are observed below the grooves formed by the scoring wheel 3. Also, the vertical cracks extend deeper from the ribbed lines to the lower side. If the observation surface and the intersection portion are enlarged, in the low-permeability scribe, no defects such as fragments are formed at the intersection portion, but in the normal scribe, fragments appear at the intersection portion.

<Results of the breaking step>

If the "separation perpendicularity" of the fractured end face is observed, it can be seen that in the low-permeability scoring, the division is performed substantially vertically, but in the normal scribing, the portion close to the upper surface is obliquely cut, and is not perpendicular. Ground the ground.

[to sum up]

From the above experimental results, it is understood that the following conditions are preferable in order to suppress deterioration of the processing quality of the division.

The pressing load of the scoring wheel is preferably 10 N or less and 1 N or more, and more preferably 6 N or less and 1 N or more.

(2) For a glass substrate having a thickness of 0.1 mm or more and 1.0 mm or less, it is preferable to form a pressing load to the extent that the depth from the surface of the glass substrate is 3% or more and 15% or less of the thickness of the substrate. In this case, rib-like grooves are not generated, and vertical cracks are formed directly under the plastic deformation region, so that the breaking can be easily performed in the breaking step.

[Other Embodiments]

The present invention is not limited to the above embodiments, and various changes or modifications can be made without departing from the scope of the invention.

In the above embodiment, the scoring wheel is used as the cutting blade for scoring, but other cutting blades may be used. Further, the specifications of the scoring wheel are not limited to the above embodiment.

Although the glass substrate has been described as an example of the brittle material substrate, the brittle material substrate to which the present invention is applied is not limited to the glass substrate.

Claims (9)

A method for breaking a brittle material substrate, which comprises breaking a brittle material substrate along a predetermined line, and comprising: a first step of moving a side of the cutting blade to a surface of the brittle material substrate with a specific load, And forming a dividing groove along the predetermined dividing line; and a second step of applying a breaking force to the dividing groove formed in the first step to break the brittle material substrate; and cutting in the first step The pressing load of the blade on the brittle material substrate is a load that does not cause ribs when the grooves are formed in the first step, and forms a vertical crack directly under the grooves. The breaking method of the brittle material substrate according to claim 1, wherein in the first step, the dicing blade is pressed against the brittle material substrate by a load of 10 N or less and 1 N or more. The breaking method of the brittle material substrate according to claim 2, wherein in the first step, the dicing blade is pressed against the brittle material substrate by a load of 6 N or less and 1 N or more. The method for breaking a brittle material substrate according to any one of claims 1 to 3, wherein in the first step, the substrate having a thickness of 0.1 mm or more and 1.0 mm or less is formed to include a substrate having a depth from the surface. A groove of a plastic deformation region having a thickness of 3% or more and 15% or less. The method for dividing a brittle material substrate according to any one of claims 1 to 3, wherein in the second step, the slit groove formed in the first step is directed downward to support the groove on the surface of the brittle material substrate On both sides, the entire surface of the brittle material substrate is supported by an elastic body, and the back surface of the brittle material substrate on which the groove is formed is pressed from above to be separated. A method for breaking a substrate of a brittle material according to any one of claims 1 to 3, wherein the brittleness The material substrate is glass. A processing device for a brittle material substrate, which comprises a dividing groove and a vertical crack on a surface of a brittle material substrate along a predetermined dividing line, and comprises: a platform for mounting a brittle material substrate; and a brittle material cutting for cutting a knife that is freely disposed above the platform; a cutter pressing mechanism that presses the cutter to a surface of the brittle material substrate with a specific load; and a moving mechanism that breaks the cutter and the platform The predetermined line is relatively moved to form a breaking groove in the brittle material substrate, and the cutting blade pressing mechanism is configured to generate a rib-like pattern in the breaking groove and to form a vertical crack in the groove directly under the groove. The above cutting blade is pressed against the brittle material substrate. The processing apparatus for a brittle material substrate according to claim 7, wherein the cutting blade has a scribing wheel having an outer peripheral edge portion, and the outer peripheral edge portion is formed by intersecting a bottom portion of two truncated cones of a common rotating shaft to form a circumferential ridge line. The scoring wheel has a plurality of notches and protrusions alternately formed in the circumferential direction along the circumferential ridge line. The apparatus for processing a brittle material substrate according to claim 8, wherein the notch of the scoring wheel is formed at a distance of 10 μm or more and 50 μm or less along the entire circumference of the circumferential ridge line, and has a depth of 0.5 μm or more and 5.0 μm or less.