TW201623173A - Scribe line forming method and scribe line forming device - Google Patents

Abstract

The present invention provides a scribe line forming method and a scribe line forming device, which can use a laser scribe line with high precision to form a segmenting crack, even for a film-like glass substrate. The scribe line forming method of the present invention is to use laser to heat the surface of a glass substrate M absorbed on the absorption station 1 along a predetermined scribe line, and the heating area is then cooled down rapidly by using a coolant, the starting point at the head portion formed on the predetermined scribe line is enabled to progress by the thermal stress generated inside the glass substrate M, hence a segmenting crack S is formed along the predetermined scribe line on the surface of the glass substrate W; the attached surface of the absorption station 1 is formed by a porous plate 3 whose pore diameter is 1~10[mu]m, the porosity is 10~40%; the glass substrate M is then attached to a resin sheet 20, using the resin sheet 20 as the lower side, the glass substrate M is absorbed and held on the absorption station 1. Under aforementioned condition, laser line scribing is performed to form the crack S along the predetermined scribe line.

Description

Scribing method and scribing device

The present invention relates to a scribing method for processing a crack (crack) for breaking a thin glass substrate including an alkali-free glass or the like, and a scribing device. More particularly, the present invention relates to a scribing method and a scribing apparatus for scribing a thin glass substrate for a flat panel display (FPD) such as a liquid crystal display or a plasma display.

In the prior art, there has been known a technique in which a laser scribing method is used, for example, a crack (crack) for breaking a glass substrate along a predetermined line is cut as in Patent Document 1, or as in Patent Document 2. The complete cutting process (full cut processing) is a method in which a laser scribing method performs scanning while irradiating a laser beam to cause a thermal stress distribution on a substrate to perform scribing.

The laser scribing method has hitherto mounted and fixed a glass substrate on a suction stage having a plurality of suction holes, and uses a CO ₂ laser or a YAG (Yttrium Aluminum Garnet) laser. The vicinity of the surface of the glass substrate is scanned and heated along a predetermined line of the scribe line, and the refrigerant is ejected from the nozzle of the cooling mechanism to the heating area. Thereby, the compressive stress is generated by the heating performed first, and the tensile stress is generated by the subsequent quenching, and the initial crack (starting point) is generated by the thermal stress distribution generated by the compressive stress and the tensile stress. As a result, cracks are formed on the surface of the glass substrate, or the cracks are allowed to penetrate the entire thickness to perform full-cut processing.

The adsorption stage for adsorbing and holding a glass substrate at the time of scribing is formed of a metal plate having a plurality of suction holes formed by machining in a metal plate, and has a use When a porous plate such as a ceramic having a plurality of pores is formed, when the laser scribing is performed, the adsorption stage sucks the suction air to hold the glass substrate. However, in recent years, the thinning of the glass substrate has been progressed due to the weight reduction or thinning of the image display device such as a smart phone. Therefore, for example, a film-shaped glass substrate of 0.2 mm or less is required, and if the thin wall is adsorbed by the adsorption stage, The glass substrate causes the following problems and it is difficult to perform laser scribing.

The pore diameter of the suction hole of the prior metal table is generally about 1 to 2 mm, and the pore diameter of the pore of the porous stage is less than 1 to 2 mm, and is formed by about 50 to 60 μm. When the glass substrate is adsorbed to the opening of the suction hole or the air hole to perform laser scribing, there is no contact between the portion having the opening 21 and the flat portion 22 having no opening 21 as shown in FIG. The change in heat dissipation caused by the adsorption stage 23 causes a difference in thermal stress in the glass substrate M. The difference in thermal stress is more pronounced in a thin glass substrate of 0.2 mm or less, so that thermal stress cannot be uniformly generated over the entire length of the predetermined line of the scribe line, and the crack is incomplete or uneven, and the laser cannot be accurately performed. Dash.

Further, in order to cope with the above problem of heat dissipation, Patent Document 3 discloses a method in which air is blown from below the glass substrate to float the glass substrate, and the glass substrate is held in a non-contact manner on the adsorption stage. Perform laser scribing.

However, in the method of Patent Document 3, since the glass substrate is floated by blowing air from below, it is unstable compared with the method of adsorbing and holding the glass substrate in a state of being in close contact with the adsorption stage. In particular, a thin glass substrate of 0.2 mm or less is bent upward or has a wave-like phenomenon, so that it is difficult to maintain horizontally. Moreover, sometimes the air leaks upward from the gap of the broken crack during the scribing process, causing the glass substrate to vibrate and the cross-sections to contact each other, thereby causing a gap in the cross-section or an irregular crack extension. Lead to the production of non-conforming products.

Therefore, Patent Document 4 discloses a method in which a glass substrate (glass film) is attached to a resin sheet, and the resin sheet is floated together with the glass substrate by blowing air from the lower side of the resin sheet to perform laser irradiation. Dash.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] International Publication No. WO2003/008352

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2001-170786

[Patent Document 3] Japanese Patent Laid-Open Publication No. 2007-246298

[Patent Document 4] International Publication No. WO2012/011445

According to the method of Patent Document 4, the resin sheet is used to prevent air from leaking upward during the scribing process, and the above problem caused by air leakage can be solved. However, since the resin sheet holding the glass substrate is floated by the air from the lower side to perform laser scribing, and the resin sheet has flexibility, there is a problem that the glass substrate is unstable in terms of horizontal retention. In particular, a thin glass substrate of 0.2 mm or less, even if it is slightly bent, the thermal stress generated by heating or cooling is alleviated, and has a significant influence on the success of the laser scribing, so it is difficult to be thinner. This method is used for the glass substrate.

Therefore, an object of the present invention is to provide a scribing method and a scribing apparatus which are capable of utilizing a laser beam scribing precision and a topographic component to break cracks even when the thickness is 0.2 mm or less.

In order to achieve the above object, the following technical means are employed in the present invention. That is, the present invention is characterized in that a scribing method is provided in which a surface of a glass substrate adsorbed to a suction stage is heated by a laser along a predetermined line of scribe lines, and the heating area is quenched by a refrigerant. Using the thermal stress generated in the glass substrate to advance the starting point formed at the beginning of the predetermined line of the scribe line, thereby generating a crack for breaking along the predetermined line of the scribe line on the surface of the glass substrate; a porous plate having pores having a pore diameter of 1 to 10 μm and a porosity of 10 to 40% forms an adsorption surface of the adsorption stage, and the glass is The glass substrate is attached to the resin sheet, and the glass substrate is adsorbed and held on the porous adsorption stage with the resin sheet as a lower side, and laser scribing is performed in this state, thereby following the line of the scribe line. The above crack is formed.

The resin sheet is preferably formed of a soft material capable of withstanding a temperature rise of the glass caused by irradiation of a laser and having a thickness of 50 to 200 μm.

Further, the present invention is also characterized in that a scribing apparatus is provided which heats a surface of a glass substrate adsorbed to an adsorption stage along a predetermined line of a scribe line by using a laser, and quenches the heating area by a refrigerant. By using the thermal stress generated in the glass substrate, the starting point formed at the beginning of the predetermined line of the scribe line is advanced, and a crack for breaking along the predetermined line of the scribe line is generated on the surface of the glass substrate; The adsorption surface of the stage is formed of a porous plate having pores having a pore diameter of 1 to 10 μm and a porosity of 10 to 40%, and the glass substrate is formed as follows, that is, attached to the resin sheet, and The resin sheet is adsorbed and held on the porous adsorption stage in a state of being on the lower side.

According to the present invention, since the pore diameter of the porous adsorption stage is as small as 1 to 10 μm, the difference between the opening of the pore and the portion of the opening having no pore opening becomes smaller, and the inside of the glass substrate during the laser scanning is performed. The difference in thermal stress generated is almost non-existent. Thereby, thermal stress can be uniformly generated over the entire length of the line to be scribed, and cracks can be formed neatly without unevenness.

Further, in the present invention, by interposing the resin sheet between the adsorption stage and the glass substrate, there is an effect that the glass substrate is compared with the case where the adsorption stage directly sucks the glass substrate. The degree of freedom in the force of the thermal stress generated by the laser scribing and the crack to the right and left by the crack is increased, and the formation of the crack can be promoted, and the crack can be surely formed even in the case of a thin glass substrate.

1‧‧‧Adsorption station

3‧‧‧Porous board

4‧‧‧ frame material

5‧‧‧ chamber

6‧‧‧ Track

7‧‧‧ Screw shaft

8‧‧‧Rotary drive department

9‧‧‧Support column

10‧‧‧ beams

11‧‧ ‧Bridge

12‧‧‧ Guides

13‧‧‧Laser Department

14‧‧‧Refrigerant spray nozzle

15‧‧‧ Scribe head

16‧‧‧Cutting wheel

17‧‧‧ Scribe head

18‧‧‧Motor

20‧‧‧resin tablets

21‧‧‧ openings

22‧‧‧ Flat Department

23‧‧‧Adsorption station

A‧‧‧ marking device

M‧‧‧ glass substrate

P‧‧‧ suction pump

S‧‧‧ crack

X‧‧‧ direction

Figure 1 is a schematic representation of an embodiment of a scribing apparatus used in the method of the present invention. view.

Fig. 2 is a cross-sectional view showing the adsorption stage in the present invention.

Fig. 3 is a perspective view showing a state in which a glass substrate is interposed between resin sheets and adsorbed on the adsorption stage of Fig. 2;

4(a) and 4(b) are explanatory views showing the effects of the state of Fig. 3.

Fig. 5a is a table showing the results of laser scribing experiments in the case where the resin sheet is not attached to the glass substrate.

Fig. 5b is a table showing the results of laser scribing experiments in the case where a resin sheet is attached to a glass substrate.

Fig. 6 is an explanatory view showing a prior problem in the case where a glass substrate is adsorbed to a suction stage to perform laser scribing.

Hereinafter, the details of the present invention will be described based on an embodiment shown in the drawings. In the present embodiment, as the glass substrate to be scribed, a film-like alkali-free glass plate having a thickness of 0.03 to 0.2 mm is used.

Fig. 1 shows a scribing apparatus A used in the method of the present invention, and the scribing apparatus A includes a suction stage 1 on which a glass substrate M is placed and adsorbed.

As shown in Fig. 2, the adsorption surface of the adsorption stage 1 is formed of a porous plate 3 such as ceramic or carbon having a plurality of pores. The porous plate 3 is held by the frame member 4, and is formed by suctioning the chamber 5 formed below by the suction pump P, thereby generating a suction force at the opening of the air hole, thereby adsorbing and holding the glass substrate M.

Preferably, the pore diameter of the porous plate 3 is 1 to 10 μm, and the porosity is 10 to 40%. In the present embodiment, the pore diameter is 5 μm, and the porosity is 35%.

Further, the adsorption stage 1 is movable in the Y direction (the front and rear directions in FIG. 1) along the horizontal rail 6, and is driven by a screw shaft 7 that is rotated by a motor (not shown). Further, the adsorption stage 1 can be rotated in a horizontal plane by the rotation driving unit 8 of the built-in motor.

The bridge portion 11 is provided so as to straddle the adsorption stage 1, and the bridge portion 11 includes support columns 9, 9 provided on both sides of the adsorption stage 1, and beams (horizontal bars) extending horizontally in the X direction. 10. The beam 10 is provided with a guide 12 extending horizontally in the X direction. A guide head 15 is attached to the guide member 12. The scribing head 15 includes a laser irradiation unit 13 for performing laser scribing, and a refrigerant injection nozzle 14 for quenching the heating portion immediately after the laser irradiation.

Further, the guide member 12 is provided with a scribing head 17 which holds the cutting wheel 16 for processing the starting point (initial crack) at the beginning of the predetermined line of the scribe line of the glass substrate M. ). The scribing heads 15 and 17 can be moved in the X direction along the guide 12 by a moving mechanism (not shown) that uses the motor 18 as a driving source.

The laser irradiated from the laser irradiation unit 13 may use a CO ₂ laser or a YAG laser or the like.

Next, the scribing method of the present invention using the above apparatus will be described.

First, the glass substrate M is attached to the resin sheet 20, and the resin sheet 20 is placed on the lower side, and is adsorbed and held on the adsorption stage 1 having the porous sheet 3. The resin sheet 20 is preferably one which can withstand the temperature rise of the glass caused by the irradiation of the laser, and is selected from a soft material such as a polymer resin such as polyethylene, polyvinyl chloride, polypropylene, or polyester. And the thickness is 50~200μm.

Further, before the laser scribing, the starting point (initial crack) is processed by the cutter wheel 16 before the surface of the glass substrate M becomes the front end of the predetermined line. The processing of the starting point is formed at a position slightly inward from the end edge of the glass substrate M by lowering the cutting wheel 16 toward the surface of the glass substrate M. As the cutting wheel 16 for processing the starting point, for example, it is preferable to use a grooved cutting wheel in which grooves (cuts) and cutting edges are alternately formed along the circumferential ridge line.

Then, as shown in FIG. 3, the laser beam is scanned from the laser irradiation unit 13 along the predetermined line of the scribe line to start heating, and the refrigerant is ejected from the refrigerant injection nozzle 14 to the heating area. Thereby, the compressive stress generated by the heating performed first and the tensile stress generated on the surface of the glass substrate M by the subsequent rapid cooling are used along the stroke. The line predetermined line forms a splitting slit S starting from the starting point. At this time, since the glass substrate M (the resin sheet 20 is interposed) is adsorbed to the adsorption stage 1, the tensile stress is not relieved by the bending of the glass substrate M, and the tensile stress generated on the surface of the glass substrate M is specialized. Used to form the crack S.

When the laser scribing line is performed, since the pore diameter of the porous plate 3 of the adsorption stage 1 is as small as 5 μm, the difference in heat dissipation between the opening portion of the pore hole and the portion having no pore opening portion becomes small, and the laser scanning is performed. The difference in thermal stress generated in the glass substrate M during the process hardly exists. Thereby, thermal stress can be uniformly generated over the entire length of the line to be scribed, and the crack S can be formed neatly without unevenness.

In particular, by interposing the resin sheet 20 between the adsorption stage 1 and the glass substrate M, the following effects can be obtained.

4(a) shows that the resin sheet 20 is placed between the adsorption stage 1 and the glass substrate M, and FIG. 4(b) is a method in which the glass substrate M is directly adsorbed to the adsorption stage 1.

In FIG. 4(a), the resin sheet 20 is strongly sucked and held as indicated by the downward arrow due to the adsorption force of the adsorption stage 1, and in this state, the glass substrate M is heated by laser scribing. And cooling, thereby forming a crack S on the glass substrate M by thermal stress. At this time, the crack S is used as a boundary, and the force to be split to the left and right as indicated by the arrow acts on the glass substrate M. However, since the resin sheet 20 is interposed between the glass substrate M and the adsorption stage 1, the In the case where the glass substrate M of 4(b) is directly sucked, the degree of freedom of deformation of the glass substrate M in the direction in which the crack S is split toward the crack S is increased, thereby contributing to the formation of the crack S.

5 is a view showing a case where the glass substrate M is directly adsorbed to the adsorption stage 1 having the porous plate 3 having a pore diameter of 5 μm ( FIG. 5 a ), and a case where the resin sheet 20 is interposed to adsorb the glass substrate M ( FIG. 5b) A table of experimental results of laser scribing. The inventors and the like performed experiments by changing the output of the laser and the scanning speed, and setting the thickness of the glass substrate M to 0.145 mm, 0.1 mm, and 0.07 mm. The glass substrate M is made of an alkali-free glass and a laser having a frequency of 25 kHz is used. Furthermore, the parts indicated by hatching in the figure indicate normal terrain. A cracked area.

As a result of the experiment, in the case of Fig. 5a, the portion of the normal region indicated by the hatching is small, especially when the thickness is 0.07 mm, the crack is hardly formed normally, whereas in the case of Fig. 5b, In all the experiments including the glass substrate of the thinnest 0.07 mm, cracks were formed normally over a wide range. The reason for this is considered to be that the degree of freedom in deformation of the glass substrate M in the direction in which the crack S is cracked during the laser scribing is high, and cracking of the crack S is facilitated.

Further, in the present embodiment, the crack S formed by the laser scribing is not completely broken, but the depth of 80 to 95% of the entire thickness of the glass substrate M is used as a target value, but cracks may also be caused. S penetrates the entire thickness and is completely broken.

The present invention has been described with reference to the preferred embodiments of the present invention. The present invention is not limited to the embodiments described above, and may be modified or changed as appropriate without departing from the scope of the invention.

[Industrial availability]

The invention is mainly used for forming a laser scribing line for breaking cracks on a thin glass substrate having a thickness of 0.03 to 0.2 mm.

1‧‧‧Adsorption station

20‧‧‧resin tablets

M‧‧‧ glass substrate

S‧‧‧ crack

Claims (4)

A scribing method characterized in that a surface of a glass substrate adsorbed to an adsorption stage is heated by a laser along a predetermined line of scribe lines, and the heating area is rapidly cooled by a refrigerant, thereby utilizing the inside of the glass substrate The generated thermal stress progresses at a starting point formed at the beginning of the predetermined line of the scribe line, thereby generating a crack for breaking along the predetermined line of the scribe line on the surface of the glass substrate; and having a pore diameter of 1~ a porous plate having a pore size of 10 μm and a porosity of 10 to 40% forms an adsorption surface of the adsorption stage; the glass substrate is attached to a resin sheet, and the resin sheet is used as a lower side, and the glass substrate is adsorbed and held in the porous sheet On the adsorption stage, the laser scribing is performed in this state, whereby the crack is formed along the predetermined line of the scribe line. The method according to claim 1, wherein the material of the resin sheet is selected from the group consisting of polyethylene, polyvinyl chloride, polypropylene, and polyester polymer resins, and has a thickness of 50 to 200 μm. The method of claim 1 or 2, wherein the glass substrate has a thickness of 0.03 to 0.2 mm. A scribing device that heats a surface of a glass substrate adsorbed to an adsorption stage by using a laser along a predetermined line of scribe lines, and quenches the heated area by a refrigerant, thereby utilizing heat generated in the glass substrate The stress progresses the starting point formed at the beginning of the predetermined line of the scribe line, thereby generating a crack for breaking along the predetermined line of the scribe line on the surface of the glass substrate; and the adsorption surface of the adsorption stage has a pore diameter a porous plate of 1 to 10 μm and a porosity of 10 to 40%, The glass substrate is formed by being attached to a resin sheet and adsorbed and held on the porous adsorption stage in a state in which the resin sheet is on the lower side.