TW201628812A - Workpiece adsorption plate, workpiece cutting device, workpiece cutting method, and manufacturing method of workpiece adsorption plate - Google Patents

Abstract

The shapes of the workpiece sucking plate and the tabular workpiece are deformed correspondingly, and are closely adhered and firmly hold. The sucking surface part 32 is divided into an inner area 32a that faces the inside and an outer area 32b that faces the outside, and the hardness of the inner area 32a is lower than the hardness of the outer area 32b.

Description

Workpiece adsorption plate, workpiece cutting device, workpiece cutting method, and manufacturing method of workpiece adsorption plate

The present invention relates to a workpiece suction plate that adsorbs a flat workpiece when the flat workpiece is cut and singulated, a cutting device and a cutting method of the flat workpiece using the workpiece suction plate, and a method of manufacturing the workpiece adsorption plate improvement of.

Conventionally, when a plurality of package-like electronic components (corresponding to a plurality of products, hereinafter referred to as packages) are cut out from a molded substrate which is one of the flat workpieces, the formed substrate is cut by a blade. In the cutting process of such a flat workpiece, in order to maintain the cutting accuracy high, it is necessary to firmly fix the workpiece at the time of cutting. Therefore, the flat workpiece has been adsorbed and fixed to the workpiece adsorption plate at the time of the cutting process.

Patent Document 1: Japanese Patent Laid-Open Publication No. 2004-330417

Patent Document 2: Japanese Laid-Open Patent Publication No. 09-251948

Patent Document 3: Japanese Laid-Open Patent Publication No. 05-84682

Patent Document 4: Japanese Laid-Open Patent Publication No. 2013-169638

With the recent miniaturization of electronic devices, the demand for miniaturization of packages has also increased, and it is desired to further improve the cutting precision of flat-shaped workpieces to achieve miniaturization of packages.

In the conventional workpiece cutting method, by sucking a flat workpiece to the workpiece suction The attachment of the workpiece at the time of cutting is performed on the attachment plate to improve the cutting accuracy. However, when a relatively large bending is generated on the flat workpiece, the state in which the bending is sufficiently corrected, that is, the workpiece having the curved state is corrected to be sufficiently flat and adhered to the workpiece suction plate, and this is fixed. The phenomenon is a problem in that improvement in cutting accuracy and improvement in work efficiency are required.

Further, it is also conceivable to enhance the force for correcting the flat workpiece by increasing the force that attracts the flat workpiece to the workpiece suction plate. In this case, although the flat workpiece having a large curvature can be corrected into a flat shape, the restoring force to return to the original curved shape of the flat workpiece becomes large. Therefore, when a certain amount of gap is formed between the flat workpiece and the workpiece suction plate due to various forces applied to the flat workpiece during the cutting, the suction of the flat workpiece is insufficient, and the worst is In this case, the adsorption is released. Thereby, the flat workpiece returns to the original curved shape, and the subsequent cutting process cannot be performed.

Therefore, an object of the present invention is to provide a workpiece suction plate, a workpiece cutting device, a workpiece cutting method, and a workpiece suction plate manufacturing method capable of firmly fixing and holding a planar workpiece during cutting processing regardless of variations in shape thereof .

The above-mentioned conventional problems are further examined in detail. In the conventional cutting method, deformation such as bending of a flat workpiece is corrected by suction so as to be in close contact with and adsorbed and fixed to the workpiece suction plate. The adsorption of the workpiece is carried out by air suction of the flat workpiece through the adsorption holes provided on the workpiece suction plate. However, if the bending of the flat workpiece is large, the amount of air leaking from the outside into the adsorption hole through the gap formed between the deformed flat workpiece and the workpiece suction plate is increased, and as a result, the attraction force by the suction air is generated. The curvature of the flat workpiece cannot be sufficiently corrected to fall against the workpiece suction plate.

Therefore, in the present invention, the workpiece suction plate that adsorbs and supports the flat workpiece when the flat workpiece is cut and singulated is provided with a suction surface that adsorbs the flat workpiece, and the adsorption surface is divided. The inner domain on the inner side in the plane direction and the outer domain on the outer side in the plane direction, and the hardness of the inner domain is made lower than the hardness of the outer domain.

Further, the workpiece cutting device includes: the workpiece suction plate of the present invention described above; and a cutting means for cutting the flat workpiece adsorbed on the adsorption plate to form a single piece.

Further, in the workpiece cutting method, the method includes a preparation step of preparing a workpiece adsorption plate having an adsorption region having an inner region and an outer region surrounding the inner region in a lateral direction, and the inner region a hardness lower than a hardness of the outer region; a holding step of adsorbing and holding the flat workpiece on the adsorption surface of the workpiece adsorption plate; and a cutting step of cutting off the adsorption and holding of the workpiece adsorption plate The flat workpiece is singulated.

Further, in the method of manufacturing the workpiece suction plate of the present invention, the workpiece suction plate includes: an adsorption surface portion that adsorbs and supports the flat plate-shaped workpiece when the flat-shaped workpiece is cut to be singulated; and is attached to the The bottom plate on the surface is adsorbed, and the hardness of the inner region in the surface direction of the adsorption surface portion is lower than the hardness of the outer region of the adsorption surface portion surrounding the inner region in the outer surface in the surface direction, and the method for manufacturing the workpiece adsorption plate The method includes: preparing a step of preparing an outer mold and an inner mold, the outer mold having a shape corresponding to the adsorption surface a mold inner surface, the inner mold being composed of a thin and thick frame having a peripheral shape corresponding to a peripheral shape of the inner region; and a resin filling step of forming the inner mold along an inner domain of the outer mold a state in which the periphery of the region is embedded in the outer mold, and a region is formed toward an outer region of the outer mold between the inner circumference of the outer mold and the outer circumference of the inner mold to have a height dimension equal to the height dimension of the suction surface Filling the first resin material that becomes the outer domain after hardening, and forming a region toward the inner region of the outer mold, and having a hardness equal to a height dimension equal to a height dimension of the adsorption surface is harder than the first portion a resin material and hardened to become a second resin material of the inner region; an inner mold removal step, when the first resin material and the second resin material are hardened to such an extent that they do not mix with each other, from the outer mold Pulling out the inner mold to make the first resin material and the second resin material in close contact; and a bottom plate bonding step, in the outer mold after the inner mold is pulled out, by using the bottom plate And the first resin material and the Two abutting the resin material for bonding.

In the present invention, when the flat workpiece is fixed, the deformation (bending) of the workpiece is not corrected, but the surface shape of the workpiece suction plate is deformed following the shape of the deformed flat workpiece, thereby improving the workpiece suction plate and the flat shape. The closeness between the workpieces.

In addition, when the hardness of the entire suction plate of the workpiece is lowered (softened) so as to be sufficiently deformed, the mechanical strength of the workpiece suction plate is lowered, and the flat workpiece cannot be firmly fixed, so that the sheet is singulated. In the wafer (package or the like) of the processed workpiece, the rate of occurrence of defective products such as cutting offset (especially the outer peripheral portion of the flat workpiece), curling, and defective burrs is improved.

Therefore, in the present invention, the adsorption surface portion of the workpiece suction plate is divided into an inner region on the inner side in the plane direction and an outer region on the outer side in the plane direction, and the hardness of the inner region is lower than The hardness of the outer region suppresses deformation in the outer region to maintain the strength of the workpiece suction plate, and the inner region can be deformed following the shape of the flat workpiece. Thereby, the inner region can be closely attached to the flat workpiece while the flat workpiece is firmly held by the outer region.

Further, in another invention of the present invention, the hardness of the outer region is made lower than the hardness of the inner region.

According to the present invention, the flat-shaped workpiece can be firmly held in an intimate state without being affected by the shape change of the workpiece. Therefore, the above-described problem of the substrate cutting can be solved, and the excellent effect of cutting the flat workpiece can be efficiently performed. .

Moreover, according to the present invention, it is possible to provide an excellent effect of the substrate cutting method capable of improving the productivity of the product by efficiently cutting the flat workpiece.

1‧‧‧Formed substrate

1a‧‧‧Substrate surface

1b‧‧‧Resin surface

1c‧‧‧block domain

1c’‧‧‧Product Area

1d‧‧‧End material domain

1e‧‧‧ alignment mark

1f‧‧‧ outer periphery of the formed substrate (outer periphery of the end material domain)

The inner circumference of the 1g‧‧‧ end material domain (outer periphery of the block domain)

2‧‧‧Substrate

2a‧‧‧Substrate surface

2b‧‧‧Mold face

3‧‧‧Resin molded body

4a‧‧‧Virtual cut line (long side direction)

4b‧‧‧Virtual cut line (short side direction)

5‧‧‧Packaged electronic parts (package)

5a‧‧‧Substrate surface

5b‧‧‧Mold face

6‧‧‧Parts Department

7‧‧‧Resin Department

9‧‧‧Workpiece cutting device

9a‧‧‧ front surface of the device

9b‧‧‧The rear surface of the device

10‧‧‧Links

11‧‧‧Substrate Arrangement Department

12‧‧‧Substrate cutting mechanism

13‧‧‧Substrate supply station

14‧‧‧Substrate rotation arrangement

15a‧‧‧First substrate mounting means

15b‧‧‧Second substrate mounting means

16a‧‧‧First reciprocating means

16b‧‧‧Second reciprocating means

17a‧‧‧The first cutting table

17b‧‧‧Second cut-off

18‧‧‧Rotating mechanism

19‧‧‧ installation table

20‧‧‧Loading surface

21‧‧‧Workpiece adsorption plate

21'‧‧‧Workpiece adsorption plate

21a‧‧‧through holes

22‧‧‧rail members

23‧‧‧Sliding members

24‧‧‧Substrate placement

25‧‧‧Sheet cutting position

26a‧‧‧The moving area of the first cutting table 17a

26b‧‧‧Moving area of the second cutting table 17b

27a‧‧‧Alignment mechanism

27b‧‧‧Alignment mechanism

28‧‧‧First cut-off means

29‧‧‧Second cutting means

30‧‧‧Cleaning Department

31‧‧‧floor

31a‧‧‧ base

31b‧‧‧Loading Department

32‧‧‧Sucking the face

32’‧‧·Sucking face

32a‧‧‧ 内域

32b‧‧‧Outland

32c‧‧‧lower domain

32d‧‧‧Upper domain

33a‧‧‧The outer periphery of the outer domain

33b‧‧‧The inner periphery of the outer domain (outer periphery of the inner domain)

34‧‧‧Attracting institutions

34a‧‧‧Attraction

34b‧‧‧Attraction device

41‧‧‧Substrate Loading Department

42‧‧‧Exporting components

43‧‧‧Package Supply Department

44‧‧‧Package Inspection Department

45‧‧‧Check camera

46‧‧‧Package screening

47‧‧‧Quality goods tray

48‧‧‧Dishware tray

50‧‧‧External model

50’‧‧‧metal mold

50a‧‧‧Outland formation area

50b‧‧‧Inner domain formation area

51‧‧‧Inner model

52‧‧‧ chamber

60A‧‧‧First resin material

60B‧‧‧Second resin material

60C‧‧‧ Third resin material

60D‧‧‧fourth resin material

61‧‧‧vacuum dryer

62‧‧‧ bubbles

63‧‧‧ oven

64‧‧ ‧ demarcation

A‧‧‧Substrate loading unit

B‧‧‧cutting unit

C‧‧‧Package inspection unit

D‧‧‧Package storage unit

E‧‧‧Control Department

H‧‧‧depth dimensions of the chamber

R‧‧‧ Height dimension of the mounting section

R’‧‧‧ Filling height dimensions of the first and second resin materials

S‧‧‧ height dimension of the inner mold

t‧‧‧Adsorption height of the face

T'‧‧‧ Filling height dimensions of the first and second resin materials

U‧‧‧ Height dimension of the upper domain

U’‧‧‧ fill height dimension of third resin material

V‧‧‧ Height dimension of the lower domain

V’‧‧‧ fill height dimension of the fourth resin material

w‧‧‧Outland frame

Fig. 1 is a plan view showing a schematic configuration of a workpiece cutting device according to an embodiment of the present invention.

Fig. 2 is a plan view showing a schematic configuration of a cutting unit according to an embodiment of the present invention.

Fig. 3 is a perspective view showing a main part of a cutting unit according to an embodiment of the present invention.

Fig. 4 is a cross-sectional view showing a main part of a cutting unit according to an embodiment of the present invention.

Fig. 5 is a plan view showing a first state of the formed substrate in the middle of cutting.

Fig. 6 is a plan view showing a second state of the formed substrate in the middle of cutting.

Fig. 7 is a plan view showing a third state of the formed substrate (product region) in the middle of cutting.

Fig. 8 is a plan view showing a fourth state of the formed substrate (product region) in the middle of cutting.

Fig. 9 is a view showing a method of cutting a substrate after molding using the workpiece cutting device of the present invention; Flow chart of the steps.

Fig. 10 (a) is a perspective view showing a schematic configuration of a substrate after cutting by a workpiece cutting device according to an embodiment of the present invention, and (b) is a package-like electronic component (package) which is cut out from a substrate after molding. A perspective view of the general structure of ).

Fig. 11 is a plan view further showing the configuration of the substrate after molding.

Fig. 12 is a cross-sectional view showing the configuration of a workpiece suction plate according to an embodiment of the present invention.

Fig. 13 is a perspective view showing a configuration of a workpiece suction plate of the embodiment.

Fig. 14 is a side view showing the bent state of the substrate after molding, respectively.

Fig. 15 is a cross-sectional view showing a state in which the substrate is held after molding using the workpiece suction plate of the embodiment.

Fig. 16 is a partial cross-sectional perspective view showing the configuration of an outer mold and an inner mold which are used when manufacturing the workpiece suction plate of the embodiment.

Fig. 17 is a cross-sectional view showing each preliminary step of the method of manufacturing the workpiece suction plate of the embodiment.

Fig. 18 is a cross-sectional view showing each of the later steps of the method of manufacturing the workpiece suction plate of the embodiment.

19 is a cross-sectional view showing the configuration of a workpiece suction plate according to a modification of the present invention.

Fig. 20 is a cross-sectional view showing main steps of a method of manufacturing a workpiece suction plate of a modification, respectively.

21 is a view for explaining a positional relationship between a product region in a substrate after molding and a boundary between an inner region and an outer region in the adsorption surface portion, wherein (a) shows a state immediately before the formed substrate is adsorbed to the adsorption surface, and (b) shows The state after adsorption.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the present embodiment, the present invention is implemented in a workpiece cutting device that cuts a post-molded substrate as an example of a flat workpiece.

FIG. 1 is a view showing a workpiece cutting device 9 according to the present invention. FIG. 2 is a view showing the cutting unit B provided in the workpiece cutting device 9 shown in FIG. 1. 3 and 4 are views showing a main part of the cutting unit B shown in Fig. 2. 5, 6, 7, and 8 are views showing a state of the substrate 1 after molding in the middle of cutting. FIG. 9 is a flowchart showing a method of cutting the substrate 1 after molding using the workpiece cutting device 9 according to the present invention. Fig. 10 (a) is a view showing the molded substrate 1 cut by the cutting device 9. (b) of FIG. 10 is a view showing a package-like electronic component (hereinafter, simply referred to as package) 5 as a product formed by cutting the molded substrate 1 shown in FIG. 10( a ). Fig. 11 is a plan view of the substrate 1 after molding. Further, since the package 5 cut into a plurality of pieces from the formed substrate has a minute shape as compared with the formed substrate 1, the package 5 is shown enlarged in FIG. 10(b).

As shown in Fig. 10 (a) and Fig. 11, the molded substrate 1 as an example of a flat workpiece has a substrate 2 and a resin molded body 3 (sealing resin). The substrate 2 includes a plurality of block domains 1c arranged in an array and an end material region 1d provided around the block region 1c. The end material domain 1d is an unwanted portion that is ultimately discarded. A plurality of package-like electronic components (hereinafter simply referred to as packages) 5 corresponding to a plurality of products are formed in each of the block domains 1c. Hereinafter, the plurality of block domains 1c arranged in the substrate 2 are referred to as the product region 1c' of the formed substrate 1. As shown in FIG. 11, an alignment mark 1e is formed in a part of the end material field 1d. The alignment mark 1e is formed on the end material domain 1d by a method such as printing or imprinting.

The substrate 2 includes a mold surface 2b on the substrate surface 2a and a surface on the opposite side thereof, and the resin molded body 3 is provided on the mold surface 2b side of the substrate 2 (see FIG. 14). The virtual cutting lines 4a and 4b can be set on the side of the substrate surface 1a of the substrate 1 after molding. The virtual cutting line 4a is a cutting line that is virtually parallel to the long side of the rectangular molded substrate 1, and the cutting line 4b is a cutting line that is set in parallel with the short side and virtually set. As shown in FIG. 10( b ), the package 5 cut into a plurality of pieces from the formed substrate 1 has a substrate portion 6 and a resin portion (sealing resin) 7 . The package 5 includes a mold surface 5b on the substrate surface 5a and a surface on the opposite side thereof, and the resin portion 7 is provided on the mold surface 5b side of the substrate portion 6. As will be described later, each of the packages 5 is formed by cutting the formed substrate 1 using the workpiece cutting device 9 according to the present invention.

Next, the configuration of the workpiece cutting device 9 according to the present invention will be described. As shown in Fig. 1, the workpiece cutting device 9 includes a substrate loading unit A for loading and molding the substrate 1, and a cutting unit B for cutting (separating) the molded substrate 1 transferred from the substrate loading unit A into individual packages. 5; the package inspection unit C performs visual inspection on each package 5 cut by the cutting unit B to screen qualified products and defective products; and packages the storage unit D, and checks the package 5 selected by the package inspection unit C as a good product and The defective product is separately accommodated in the tray; and the control unit E.

The workpiece cutting device 9 is configured to transfer the formed substrate 1 loaded in the substrate loading unit A to the cutting unit B, and cut into the respective packages 5. Then, the package inspection unit C inspects and filters the cut packages. 5. The package 5 is housed as a good product and a defective product by the package storage unit D, and the control unit E controls a series of processes of the units A, B, C, and D.

The workpiece cutting device 9 is configured such that each of the above-described units A, B, C, and D can be detachably coupled to each other in this order. In addition, the workpiece cutting device 9 can be configured as For example, each of the units A, B, C, and D is detachably connected by the connecting tool 10.

Next, the cutting unit B will be described. As shown in FIG. 2, the cutting unit B has a substrate arranging mechanism portion 11 and a substrate cutting mechanism portion 12. The substrate array mechanism portion 11 includes a substrate supply stage 13 and supplies the molded substrate 1 from the substrate loading unit A. The substrate rotation alignment means 14 engages the molded substrate 1 supplied to the substrate supply table 13 and rotates it. The required angle (for example, 90 degrees) is set so that the formed substrate 1 is arranged in the desired direction on the side of the substrate cutting mechanism portion 12.

In the cutting unit B having the above configuration, first, the substrate 1 to be formed is supplied from the substrate loading unit A to the substrate supply table 13, and then the substrate 1 is lifted and lifted from the substrate supply table 13, and the substrate 1 is lifted and lifted. This is rotated at a desired angle, whereby the formed substrate 1 is aligned in a desired direction and supplied to the substrate cutting mechanism portion 12 side.

Next, the configuration of the substrate cutting mechanism unit 12 will be described. The workpiece cutting device 9 is a two-stage system. As shown in FIG. 2, the substrate cutting mechanism unit 12 is configured to include two lines for cutting the substrate (single substrate) (to be a production line in the device). The singulation line is arranged in a parallel state in the Y direction, and the arrangement position thereof substantially coincides with the movement regions 26a and 26b of the first and second cutting tables 17a and 17b which will be described later.

Further, in the example shown in Fig. 2, the moving area 26a of the first cutting table 17a is disposed on the left side of the front side, and the moving area 26b of the second cutting table 17b is disposed on the right side of the front side.

Further, in the substrate cutting mechanism portion 12, the first and second substrate placing means 15a, 15b are provided in the moving regions 26a, 26b of the respective first and second cutting tables 17a, 17b, and the first and the first The first and second reciprocating means 16a, 16b that are guided by the two substrate placing means 15a, 15b to reciprocate in the Y direction.

Therefore, in the moving region 26a, the first substrate mounting means 15a can be reciprocated by the first reciprocating means 16a. In the moving region 26b, the second substrate mounting means 15b can be moved by the second reciprocating means 16b. Reciprocating movement. Further, regarding the constituent parts related to the moving regions 26a and 26b in the substrate cutting mechanism portion 12, the first use "a" is used as a mark, and the second use "b" is used as a mark.

The first and second substrate mounting means 15a and 15b have the first and second cutting stages on which the substrate 1 is placed after the molding surface 1a is in the lower surface (or the substrate surface 1b is in the upper surface). The cutting rotary table 17a, 17b is cut. As shown in FIGS. 12 and 13, the first and second cutting tables 17a and 17b are provided with a workpiece suction plate 21 that sucks and holds the formed substrate 1. The workpiece suction plate 21 is attached to the upper surfaces (substrate mounting surfaces) of the first and second cutting tables 17a and 17b. The workpiece suction plate 21 includes a bottom plate 31 and an adsorption surface portion 32. The bottom plate 31 is provided with a base portion 31a and a mounting portion 31b. The base portion 31a has a rectangular plate shape. The mounting portion 31b has a rectangular plate shape smaller than the base portion 31a and equal to or larger than the shape of the substrate 1 after molding, and is disposed in a central position on the upper surface of the base portion 31a so as to be aligned on four sides. The base portion 31a and the mounting portion 31b are made of a metal such as aluminum or copper, and are integrally formed.

The adsorption surface portion 32 has a rectangular plate shape having a size equal to that of the mounting portion 31b, and is laminated on the upper surface of the mounting portion 31b so as to align the shapes. The adsorption surface portion 32 is adhered to the mounting portion 31b of the bottom plate 31. The adsorption surface portion 32 is a component for adsorbing and fixing the molded substrate 1 on the surface, and has a height dimension t (for example, about 2.0 mm) capable of holding the substrate 1 after molding.

Hereinafter, description will be made with reference to Fig. 21 based on Figs. 12 and 13 . Figure 21 is exaggeratedly depicted. The adsorption surface portion 32 includes an inner region 32a on the inner side in the plane direction and an outer region 32b surrounding the inner region 32a on the outer side in the plane direction. The outer domain 32b and the inner domain 32a have a shape in which the substrate 1 is formed The following shapes are accurate.

which is,

. The outer peripheral edge 33a of the outer region 32b has a size equal to or slightly larger than the outer peripheral edge (outer peripheral edge 1b of the end material region 1d) 1f of the formed substrate 1.

. The inner periphery of the outer region 32b (the outer periphery of the inner region 32a) 33b has a rectangular shape slightly smaller than the inner periphery of the end material region 1d (the outer periphery of the product region 1c' (see FIGS. 7 and 8)) 1g.

Thereby, the outer region 32b has a frame shape having an inner circumferential shape equal to the end material region 1d and having a size equal to or slightly larger than the end material region 1d, and the inner region 32a is provided with the product region 1c' A rectangular shape that is slightly smaller than the outer shape. The extent to which the inner domain 32a is smaller than the product domain 1c' will be described later with reference to Fig. 21 .

Both the inner domain 32a and the outer domain 32b are composed of a soft resin, but their hardness is different. That is, the hardness of the inner domain 32a is lower than the hardness of the outer domain 32b. Specifically, the inner region 32a is composed of a low-hardness rubber material (for example, ruthenium rubber) having a hardness of 50 to 40, and the outer region 32b is made of a high-hardness rubber material having a hardness of 70 to 60 (for example, ruthenium rubber). ) constitutes. When the outer region 32b is made of a high-hardness rubber material having a hardness A of 70, the friction between the formed substrate 1 and the outer region 32b in the vicinity of the outer peripheral portion when the outer peripheral portion of the substrate 1 is cut and formed is cut. Too small to maintain the formed substrate 1 . In addition, when the inner region 32a is formed of a low-hardness rubber material having a hardness lower than the hardness A of 40, the deformation of the substrate 1 after the molding is further deformed, but the state in which the position is maintained with high precision cannot be maintained. For the above reasons, the hardness of the inner and outer domains 32a and 32b is set.

Further, the workpiece suction plate 21 is provided with a plurality of through holes 21a for suction. The through hole 21a is provided to penetrate the bottom plate 31 and the adsorption surface portion 32 in the thickness direction of the workpiece suction plate 21, The surface back surface of the workpiece suction plate 21 is communicated. The through hole 21a is disposed on the workpiece suction plate 21 at a predetermined density regardless of the formation region of the inner region 32a and the formation region of the outer region 32b. An adsorption mechanism 34 is provided in the first and second cutting tables 17a and 17b. The adsorption mechanism 34 includes a suction hole portion 34a that communicates with the through hole 21a and a suction device 34b such as a vacuum pump. The suction mechanism 34 sucks the formed substrate 1 that is adsorbed on the adsorption surface portion 32 by the suction device 34b via the through hole 21a and the suction hole portion 34a. An opening and closing valve (not shown) is provided in the pipe between the suction device 34b and the suction hole portion 34a. A large-capacity decompression box can also be used as the suction device 34b.

As shown in FIGS. 3 and 4, a rotation mechanism 18 that rotates the cutting tables 17a and 17b is provided on the lower end sides of the first and second cutting tables 17a and 17b. The rotating mechanism 18 is placed on the stage mounting table 19, and is arranged in the order from the lower side to the upper side in the Z direction by the stage mounting table 19, the rotating mechanism 18, and the first and second cutting stages 17a and 17b. .

First, the molded substrate 1 arranged by the substrate rotation alignment means 14 (see FIGS. 1 and 2) is supplied to the stage set on the first and second cutting stages 17a and 17b by the rotation mechanism 18 having the above-described configuration. On the surface 20, the formed substrate 1 is adsorbed and fixed to the first and second cutting stages 17a and 17b (the stage mounting surface 20) on the side of the die surface 1a by the suction mechanism 34 (see FIG. 12). Then, the rotating mechanism 18 can be rotated in a predetermined direction by a predetermined angle.

Further, in the first and second reciprocating means 16a, 16b, a main body (setting table) of the first and second reciprocating means 16a, 16b is provided; and the two rail members 22 are reciprocated in the first and second directions. The body of the means 16a, 16b is disposed in the direction of the reciprocating movement (Y direction) on the side surfaces of the first and second substrate placing means 15a, 15b of the second reciprocating means; the sliding member (slider) 23 in the rail member 22 Sliding upward to guide the first and second substrate placing means 15a, 15b; and a reciprocating driving mechanism (not shown) such as a ball screw for sliding the sliding member 23 in the Y direction Reciprocating.

With the above configuration, the first and second cutting tables 17a and 17b can be cut at the substrate mounting position 24 and the substrate by the first and second reciprocating means 16a and 16b in the respective moving regions 26a and 26b. The break position 25 (i.e., within the moving regions 26a, 26b of the first and second cutting tables 17a, 17b) reciprocates (see Figs. 1 and 2). Further, of course, the first and second substrate placing means 15a, 15b are configured such that the sliding member 23 and the first and second cutting tables 17a, 17b can be integrally reciprocally slid.

Next, the alignment mechanism in the workpiece cutting device 9 of the present embodiment will be described. By the alignment mechanisms 27a and 27b, the substrate surface 1a of the formed substrate 1 set on the first and second cutting stages 17a and 17b is aligned to the first and second cutting stages 17a and 17b. The substrate mounting position 24 side of the moving regions 26a and 26b is set to set a desired virtual cutting line on the substrate surface 1a.

Further, in the present invention, it is also possible to provide an alignment mechanism 27 for separately supplying the formed substrate 1 (two sheets) set on the two cutting tables (the first and second cutting stages 17a, 17b). Composition.

Next, the cutting means in the workpiece cutting device 9 of the present embodiment will be described. In the substrate cutting position side 25 of the moving regions 26a and 26b of the first and second cutting tables 17a and 17b, a cutting means having a blade (rotation cutting blade), that is, a first cutting means 28 and The second cutting means 29. The first cutting means 28 and the second cutting means 29 are configured to be independently reciprocally movable in the X direction or the Y direction. Further, generally, as shown in the example, the first cutting means 28 and the second cutting means 29 are provided in a state in which the blade sides are opposed to each other.

When the formed substrate 1 is cut by the first and second cutting means 28, 29, The first and second cutting means 28, 29 can be moved relative to the first and second cutting stages 17a, 17b (the formed substrate 1) to cut the formed substrate 1.

Further, regarding the cutting by the first and second cutting means 28, 29 (blades), generally, the positions of the blades of the first and second cutting means 28, 29 and the virtual state of the substrate 1 after molding are made. The positions of the cutting lines 4a, 4b, 4c, 4d are identical, and the first and second cutting means 28, 29 (blades) are moved downward to the first and second cutting tables 17a, 17b (substrate 1 after forming) On the side, the first and second cutting stages 17a and 17b (the formed substrate 1) are moved in the direction of the virtual cutting line in the moving direction, thereby cutting the formed substrate 1.

Further, the first and second cutting means 28, 29 are respectively provided with a machining liquid ejecting means (not shown) for ejecting the machining liquid to the blade to remove the cut when the post-molding substrate 1 is cut. Chip breaking (chip cutting). Therefore, in the state where the machining liquid is ejected to each of the first cutting means (blade) 28 and the second cutting means (blade) 29, the first and second cutting means 28, 29 are used to cut off the placement. The formed substrate 1 on the cutting table 17a (or the second cutting table 17b) can form the respective packages 5 from the formed substrate 1 (see FIG. 10).

As shown in FIGS. 1 and 2, a cleaning portion 30 is provided at an intermediate portion between the substrate cutting position 25 and the substrate mounting position 24 in the moving regions 26a and 26b of the first and second cutting tables 17a and 17b. The cleaning unit 30 cleans and dries the respective packages 5 by ejecting the cleaning liquid to the respective packages 5 that are cut.

Further, a container (not shown) for accommodating the cutting debris is provided at a position below the moving region 26a of the first cutting table 17a and the moving region 26b of the second table 17b.

Therefore, the first and second cutting stages 17a and 17b of the respective packages 5 cut by the first and second cutting means 28 and 29 are placed from the substrate cutting position 25 to the substrate mounting position. When moving back 24, the respective packages 5 can be cleaned and dried by the cleaning unit 30 in a state where the respective packages 5 are placed on the first and second cutting tables 17a and 17b.

Here, the relationship between the cutting step and the alignment step in the present embodiment will be briefly described. For example, first, at the substrate mounting position 24 in the workpiece cutting device 9 (cutting unit B), the first alignment mark 1e formed on the formed substrate 1 is aligned by the alignment mechanism 27a (27b) ( Referring to Fig. 11), the cutting position in the substrate 1 after forming is determined as the alignment information of the substrate.

Next, the formed substrate 1 is moved to the substrate cutting position 25, and the cutting position of the formed substrate 1 is cut based on the alignment information of the substrate, thereby removing the end material region 1d from the formed substrate 1 to form Block domain 1c (block domain group 1c') (the so-called island cut shown in Figs. 5 and 6 is performed).

Next, based on the alignment information of the block domain, the cut position of the block domain 1c can be cut to form the respective packages 5 (the formation of the so-called single sheets shown in FIGS. 7 and 8 is performed).

Next, a cutting method of the formed substrate 1 using the workpiece cutting device 9 will be described with reference to the flowchart of Fig. 9 . First, the workpiece suction plate 21 of the present invention having the adsorption surface portion 32 having the hardness of the inner region 32a lower than the hardness of the outer region 32b is prepared (preparation step S1). Thereafter, the substrate assembly unit 11 (substrate supply stage 13) in the cutting unit B is supplied from the substrate loading unit A, and the formed substrate 1 is set, and the formed substrate 1 is arranged in the desired direction by the substrate rotation alignment means 14. Thereafter, the aligned molded substrate 1 is placed on the workpiece suction plate 21 on the mounting surface 20 of the first cutting table 17a (or the second cutting table 17b) existing at the substrate mounting position 24.

At this time, the orientation of the formed substrate 1 was fixed in the same manner as follows. In other words, deformation of the substrate or the like which is formed during the cutting process may be caused by deformation such as bending during production. The curved portion has a convex curvature and a concave curvature. As shown in Fig. 14 (a), the surface side (the side of the mold surface 2b) of the central portion of the substrate 2 is convexly convex and the back side (the side of the substrate surface 2a) is concave. As shown in FIG. 14(b), the concave curved portion of the substrate 2 has a convex shape on the back side (the side of the substrate surface 2a) and a concave surface on the surface side (the side of the mold surface 2b). When the molded substrate 1 is mounted on the workpiece suction plate 21, after the direction in which the curved substrate is judged to be convex and convex, the surface of the substrate after the formed substrate 1 is in contact with the workpiece suction plate, The formed substrate 1 is mounted on the workpiece suction plate 21 after molding.

Specifically, the formed substrate 1 having the convex curvature is formed so that the end surface of the formed substrate 1 is formed after the direction in which the center portion is convex (the side of the mold surface 2b) abuts on the workpiece suction plate 21 The domain 1d is opposed to the outer region 32b of the adsorption face portion 32, and the product region 1c' is opposed to the inner region 32a to mount the formed substrate 1 on the workpiece suction plate 21. In the formed substrate 1 having the concave curvature, the end surface of the formed substrate 1 is adsorbed and adsorbed, respectively, after the direction of the back surface side (the substrate surface 2a side) where the center portion is convex is in contact with the workpiece suction plate 21. The outer region 32b of the face portion 32 is opposed to each other, and the product region 1c' is opposed to the inner region 32a to mount the formed substrate 1 on the workpiece suction plate 21. The product region 1c' is composed of a plurality of block domains 1c which are arranged side by side in addition to the end material region 1d in the substrate 1 after molding (see Figs. 7 and 8).

As shown in FIG. 15, in the above-described substrate arrangement, for example, the molded substrate 1 having concave curvature is attached to the workpiece suction plate 21, whereby the molded substrate 1 is suction-held by the workpiece suction plate 21. Specifically, the inner region 32a which is softer than the outer region 32b is deformed (trapped), the inner region 32a adsorbs the central portion on the back side (the substrate surface 2a side), and the outer region 32b adsorbs the outer peripheral portion on the back side of the formed substrate 1 . Further, by driving the suction device 34b substantially simultaneously, the formed substrate 1 on the workpiece suction plate 21 is sucked through the suction hole portion 34a and the through hole 21a, whereby the formed substrate 1 is formed. It is fixed to the adsorption surface portion 32 without deforming the substrate 1 after molding (keeping step S2).

When the suction and holding of the substrate 1 after the above forming is performed, in the workpiece cutting device 9, the adsorption surface portion 32 is divided into an inner region 32a opposed to the product region 1c' and an outer region 32b opposed to the end material region 1d. The inner region 32a is composed of a low-hardness rubber material having a hardness of 50 to 40, and the outer region 32b is composed of a high-hardness rubber material having a hardness of 70 to 60. Thus, as shown in Figure 15, The inner substrate 32a having a hardness lower than the hardness of the outer region 32b is concavely deformed to absorb the bending of the formed substrate 1 without deforming the formed substrate 1 to cause the formed substrate 1 to be in close contact with the inner region 32a. further,. The outer peripheral portion of the formed substrate 1 is maintained by the outer region 32b having a higher hardness than the inner region 32a. Thereby, the formed substrate 1 can be firmly and firmly held on the workpiece suction plate 21.

Thereby, even if the flat-shaped workpiece (the formed substrate 1) having a large curvature is held, it can be held with high precision to perform the cutting process. In addition, even when an operation of subdividing the flat workpiece (the formed substrate 1) into a minute shape (package-like electronic component or the like) is performed, the processing accuracy of the processed product after cutting can be maintained high.

Further, in the substrate 1 after molding, there is also a substrate which cannot be cut from the surface side (the surface of the mold surface 2b) of the substrate 2. In the formed substrate 1, the formed substrate 1 which is convexly curved on the formed substrate 1 is selectively picked out and mounted on the workpiece suction plate 21 by the above method.

After performing the above-described processing, as shown in FIGS. 1 and 2, the first and second cutting stages 17a and 17b on which the formed substrate 1 is placed are moved to the substrate cutting device 25. Receiving step S3) of the rear substrate.

In this state, the position of the formed substrate 1 on the first and second cutting stages 17a, 17b and the position of each block field 1c in the formed substrate 1 before cutting are measured by the alignment mechanisms 27a, 27b. . In the alignment process, the position of the alignment mark 1e (refer to FIG. 11) formed on the end body region 1d of the formed substrate 1 is detected, and based on the position information of the detected alignment mark 1e, the first is determined. The position of the formed substrate 1 in the second cutting stages 17a, 17b and the position of each block field 1c (alignment step S4). Hereinafter, the position information of the formed substrate 1 and the position information of the block domain 1c determined by the alignment step S4 are referred to as alignment information.

Next, the first and second cutting tables 17a, 17b are rotated at a desired angle (angle of 90 degrees), and in this state, as shown in FIG. 5, the substrate 1 is formed on the substrate 1 in the longitudinal direction. The cut line 4a is cut by the first and second cutting means 28, 29 along the set virtual cutting line 4a. Further, the virtual cut line 4a is set based on the position information (alignment information) of the formed substrate 1 and the block field 1c which are determined by the alignment mechanisms 27a and 27b.

The first and second cutting tables 17a and 17b of the molded substrate 1 on which the dummy cutting line 4a cut along the longitudinal direction is placed are rotated in opposite directions at a desired angle, and returned to the original position. In the state, as shown in FIG. 6, after the virtual cutting line 4b in the short-side direction is set on the substrate 1 after molding, the first and second cutting means 28, 29 are further cut along the set virtual cutting line 4b. The formed substrate 1 is broken. Further, similarly to the virtual cut line 4a, the virtual cut line 4b is set based on the position information (alignment information) of the formed substrate 1 and the block field 1c which are determined by the alignment mechanisms 27a and 27b.

According to the above processing, the formed substrate 1 is separated into a product region 1c' (a plurality of block domains 1c) and an end material region 1d provided at the outer periphery of the block region 1c. At this time, the product domain 1c' is formed. The plurality of block domains 1c are also arranged to be separated from each other. After the substrate separation is completed, the separated end material domains 1d are removed from the respective block domains 1c. Thereby, as shown in FIG. 7, the formed substrate 1 is cut and separated into a plurality of block domains 1c (block domain incision step S5).

Next, the first and second cutting tables 17a, 17b are rotated at a desired angle (angle of 90 degrees), and in this state, as shown in Fig. 7, the product area 1c' is set along the longitudinal direction thereof. After the virtual cutting line 4c, the product region 1c' (block region 1c) is cut into a strip shape along the set virtual cutting line 4c using the first and second cutting means 28, 29.

Further, the first and second cutting tables 17a and 17b on which the product domain 1c' (block domain 1c) cut along the virtual cutting line 4c is placed are rotated in opposite directions at a desired angle to return to The original position, in this state, as shown in Fig. 8, after the virtual cut line 4d in the short-side direction of the product field 1c' is set, the first and second cutting means 28, 29 are used to set the virtual cut. The broken line 4d further cuts off each block domain 1c. Thereby, a plurality of packages 5 are formed on the mounting surface 20 of the first and second cutting stages 17a and 17b (block area cutting step S6). The cutting step is constituted by a block domain incision step S5 and a block domain cutting step S6.

Next, the first and second cutting stages 17a and 17b on which the respective packages 5 (the cut substrate 1c) are placed are moved from the substrate cutting position 25 to the substrate mounting position 24 (see FIGS. 1 and 2). At this time, the package 5 placed on the first and second cutting stages 17a and 17b is cleaned and dried by the cleaning unit 30 (washing step S7 and drying step S8). Further, at the substrate mounting position 24, the package 5 (cut off the cleaning) placed on the first and second cutting stages 17a and 17b is engaged and transferred to the package inspection unit 1C (the transfer step S9 of the package).

Further, in the present embodiment, a rectangular (for example, rectangular) cutting table and a rectangular (for example, rectangular) shaped substrate are described as an example, but in the present invention, In the description, a cutting table of various shapes and a shaped substrate of various shapes can be used.

As shown in FIG. 1, the substrate loading unit A is provided with a substrate loading portion 41 for loading the formed substrate 1, and an ejection member 42 for ejecting the molded substrate 1 from the substrate loading portion 41. Therefore, by pushing out the molded substrate 1 from the substrate loading portion 41 by the push-out member 42, the formed substrate 1 can be supplied to the substrate array mechanism portion 11 (substrate supply table 13) in the cutting unit B.

Further, the package inspection unit C is provided with a package supply unit 43 for supplying the respective packages 5 cut by the cutting unit B, and a package inspection unit 44 for inspecting the respective packages 5 from the package supply unit 43; The camera 45 inspects each package 5 in the package inspection unit 44, and the package screening means 46, and filters the package 5 inspected by the package inspection unit 44 and the inspection camera 45 into a good product and a defective product, and transfers the package 5 to the package storage unit D. Therefore, in the package inspection unit C, the package inspection unit 44 inspects each package 5 supplied from the cutting unit B to the package supply unit 43 by the inspection camera 45, so that it can be selected as a good product by the package screening means 46. And the defective product is transferred to the package housing unit D.

As shown in FIG. 1, the package storage unit D is provided with a good product tray 47 for accommodating a good product and a defective product tray 48 for accommodating a defective product. Therefore, in the package storage unit D, the package 5 inspected by the package inspection unit C as a good product can be stored in the good product tray 47 by the package screening means 46, and the package 5 inspected as a defective product can be accommodated by the package screening means 46. In the defective product tray 48.

Since the area of each of the block domains 1c cut out from the substrate 1 after molding is much smaller than the area of the entire substrate 1 after molding, the force for bending the respective block domains 1c is smaller than the force for bending the substrate 1 after molding, and The gap between the first and second cutting stages 17a, 17b and the lower surface of the resin molded body 3 of the block domain 1c can be made smaller than the same gap in the packaged substrate 1. small. Therefore, the attraction force to each block domain 1c can be effectively increased as compared with the configuration of attracting the entire substrate 1 after molding. Further, when the block domain 1c is adsorbed and fixed to the first and second cutting tables 17a and 17b, the adsorption fixing force for each of the block domains 1c can be effectively increased.

Further, since the adsorption fixing force to each of the block domains 1c can be effectively increased, it is possible to effectively prevent the package 5 cut and separated from each of the block domains 1c from being subjected to the cutting by the first and second cutting means 28 and 29. The problem of cutting off the force and flying out to the surroundings.

Further, in addition to being able to effectively improve the dimensional accuracy of the package 5, it is possible to prevent the package 5 from flying out of the cut portion at the time of cutting, thereby preventing damage of the first and second cutting means 28, 29 (broken blade, etc.). Longevity is achieved, which increases product productivity.

Further, according to the present invention, the following effects can be obtained. In other words, according to the substrate cutting method using the workpiece cutting device 9, the step of cutting out the package 5 from the formed substrate 1 is divided into a block cutting step S5 and a block cutting step S6, whereby the cutting is started. At the time of the block domain cutting step S6 of the package 5, the substrate 1 is separated into the respective block domains 1c, whereby the influence of the substrate bending during the cutting of the package 5 can be minimized.

However, in order to respond to the miniaturization of the package 5 which has been improved with the recent miniaturization of the electronic device, it is necessary to further improve the cutting accuracy of the package. In the present invention, by improving the shape of the workpiece suction plate 21 in the above manner, the adsorption holding precision of the formed substrate 1 by the workpiece suction plate 21 which is performed in the receiving step S3 of the formed substrate is further improved, thereby The cutting accuracy of the package is better.

Further, in the above-described embodiment, the configuration in which the substrate 1 after molding is cut by using the first and second cutting means 28 and 29 (two blades) is exemplified, but a single cutting means (blade) is used. The present invention can also be employed in the configuration. Cut off by a single cut In the case of forming the substrate 1 after the molding, the positional deviation in the block region 1c after the cutting can be suppressed. Therefore, by carrying out the present invention in this configuration, a more excellent effect can be obtained.

In addition, in the above-described embodiment, the structure in which the resin molded body side of the substrate 1 is formed is attached and lowered, and the substrate body side of the substrate 1 is formed to face downward. The present invention can also be applied to the configuration in which adsorption fixation is carried out.

Next, a method of manufacturing the workpiece suction plate 21 will be described with reference to Figs. 16 and 17 . Figure 16 (a) is a partial cross-sectional perspective view of the outer mold 50 for forming the workpiece suction plate 21, and Figure 16 (b) is a partial cross-sectional perspective view of the inner mold 51 for forming the workpiece suction plate 21, Figure 17 And FIG. 18 is a view showing a manufacturing step of the workpiece suction plate 21.

The outer mold 50 is provided with a bottomed chamber 52 having an inner shape capable of producing a shape of the suction surface portion 32. The depth dimension H of the chamber 52 is a size (H=t+r) in which the height dimension t (see FIG. 12) of the adsorption surface portion 32 and the height dimension r (refer to FIG. 12) of the mounting portion 31b of the bottom plate 31 are added together. . The inner mold 51 is composed of a bottomless thin frame having an outer peripheral shape corresponding to the shape of the outer peripheral edge 33b of the inner region 32a of the suction surface portion 32. The height dimension s of the inner mold 51 is the same as the depth dimension H of the chamber 52.

Hereinafter, a method of manufacturing the workpiece suction plate 21 using the above-described outer mold 50 and inner mold 51 will be described. First, the outer mold 50 and the inner mold 51 shown in Figs. 16(a) and 16(b) are prepared (preparation step S20).

Next, the inner mold 51 is accommodated along the periphery of the inner region forming region 50a of the prepared outer mold 50. Thereby, the outer region forming region 50b is further formed between the inner circumference of the outer mold 50 and the outer circumference of the inner mold 51. In this state, the first composition of the lanthanide room temperature curable liquid resin is used. The resin material 60A and the second resin material 60B are filled into the chamber 52 of the outer mold 50 (resin filling step S21).

Here, in the outer region forming region 50b, the second resin material 60B which becomes the outer region 32b after being filled and hardened is filled, and the hardness after filling and hardening in the inner region forming region 50a is lower than that of the second resin material 60B and becomes the inner region 32a after hardening. A resin material 60A. Specifically, the second resin material 60B composed of a lanthanum-based room temperature curable liquid resin having a hard A hardness of 70 to 60 after hardening is filled in the outer region forming region 50b, and the hardness A is 50 after hardening. The first resin material 60A composed of the lanthanide room temperature curable liquid resin of ~40 is filled in the inner domain forming region 50a. At this time, the filling amounts of the first and second resin materials 60A and 60B are set such that the filling height dimension t of the first and second resin materials 60A and 60B slightly exceeds the height dimension t of the adsorption surface portion 32 to be formed. Further, the first and second resin materials 60A and 60B are not limited to the fluorene-based resin, and a fluorine-based resin may be used.

Next, the outer mold 50 with the inner mold filled with the first and second resin materials 60A and 60B is placed in a vacuum dryer 61 with a dry rotary pump, and allowed to stand at normal temperature and about 100 kPa for 20 minutes. The bubbles 62 located inside the first and second resin materials 60A, 60B are thus removed (degassing step S22).

After the end of the degassing step, the outer mold 50 with the inner mold is taken out from the vacuum dryer 61. Further, wait until the first and second resin materials 60A, 60B are hardened to such an extent that they do not mix with each other, and at the time of hardening to this extent, the inner mold 51 is taken out from the outer mold 50 to make the first resin material 60A and the second resin The material 60B is in close contact (the inner mold is unplugged in step S23).

Further, after the primer is applied to the surface of the placing portion 31b of the bottom plate 31, the mounting portion 31b is inserted into the chamber 52 of the outer mold 50 in the front. Carrying out the bottom plate The insertion of 31 is performed until the base portion 31a comes into contact with the upper end of the outer mold 50, and the placing portion 31b abuts against the first and second resin materials 60A, 60B (the bottom plate insertion step S24).

When the bottom plate 31 is brought into contact with the first and second resin materials 60A and 60B in the outer mold 50, the first and second resin materials 60A and 60B inside the chamber 52 are placed by the placing portion 31b of the bottom plate 31. The pressure is applied, whereby the first and second resin materials 60A, 60B enter into the through holes 21a located in the bottom plate 31, and overflow to the back surface of the bottom plate 31. In this state, the outer mold 50 and the bottom plate 31 are placed at normal temperature for 24 hours, thereby completely curing the first and second resin materials 60A and 60B (hardening step S25).

Further, assuming that the thermosetting liquid resin is used, the resin is hardened on the bottom plate 31 which is expanded by heating, and there is a possibility that bending or distortion occurs in the adsorption surface portion 32 when it is cooled to the normal temperature of the bottom plate 31. In the present embodiment, such a problem is avoided by using a room temperature curable liquid resin, and the workpiece suction plate 21 having the adsorption surface portion 32 having high dimensional accuracy can be manufactured.

Next, after the first and second resin materials 60A, 60B are completely hardened, the outer mold 50 and the bottom plate 31 are placed in an oven 63, and heated at 100 ° C for 1 hour, thereby making the first and second resin materials 60A, 60B are completely hardened into the inner domain 32a and the outer domain 32b, and adhere to the formed inner domain 32a and outer domain 32b, and further, the inner coating agent is firmly adhered by hardening the primer applied to the mounting portion 31b of the bottom plate 31. The domains 32a and 32b and the placing portion 31b (bottom plate bonding step S26). Further, the adhesion between the inner and outer domains 32a and 32b and the bottom plate 31 may be sufficient, and the natural adhesion due to the hardening of the first and second resin materials 60A and 60B may be employed. At this time, the coating and sticking step S26 of the primer is not required.

Thereafter, the mutually adhered bottom plate 31 and the inner and outer domains 32a, 32b are taken out from the oven 63. After the natural cooling, the first and second resin materials 60A and 60B reaching the back surface of the bottom plate 31 are removed, and the outer mold 50 is removed from the molded body (work suction plate 21) (release step S27). Finally, the first and second resin materials 60A and 60B hardened inside the through hole 21a are removed by drilling through the through hole 21a of the bottom plate 21, and the perforation is continuously performed on the adsorption surface portion 32. Thus, the through hole 21a is also formed in the inner and outer domains 32a and 32b of the adsorption surface portion 32 (through hole forming step S28). Thus, the workpiece suction plate 21 of the present embodiment can be obtained.

As described above, in the method of manufacturing the workpiece suction plate 21 of the present invention, the suction surface 32 is formed using the inner mold 51 and the outer mold 50 corresponding to the inner and outer domains 32a and 32b, so that it is easy to produce a suction surface of a desired shape. 32. It is also easy to position the bottom surface 31 of the suction surface portion 32. Thereby, the large workpiece suction plate 21 can be manufactured at an inexpensive manufacturing cost.

In the above-described embodiment, the shape of the adsorption surface portion 32 and the bottom plate 31 is rectangular. However, other shapes may be adopted depending on the shape of the flat workpiece (the formed substrate 1) which is held and held by the workpiece suction plate 21. Further, the amount of the first and second resin materials 60A, 60B supplied to the outer mold 10 is slightly smaller than the above-described amount (that is, the liquid level of the first and second resin materials 60A, 60B exceeds the surface of the bottom plate 31). The amount of the first and second resin materials 60A, 60B immersed in the through hole 21a of the bottom plate 31

The carbon powder may be added to the first and second resin materials 60A and 60B before the first and second resin materials 60A and 60B are supplied to the outer mold 10, whereby the adsorption surface portion 32 is made electrically conductive. Since the workpiece suction plate 21 having such a suction surface portion 32 can discharge static electricity generated when the flat workpiece (the substrate 1 after molding) is attached or detached, it is possible to prevent static electricity from coming to the electronic components inside the flat workpiece. damage. Further, by using the first and second resin materials 60A, 60B to which a transparent resin or pigment is added, a workpiece having a transparent adsorption surface portion 32 can be produced. The adsorption plate 21 or the workpiece suction plate 21 having the adsorption surface portion 32 colored to a desired color.

In the workpiece suction plate 21 of the above-described embodiment, the adsorption surface portion 32 is divided into the inner region 32a on the inner side in the planar direction and the outer region 32b on the outer side, and the hardness of the inner region 32a is lower than the hardness of the outer region 32b. On the other hand, in the adsorption surface portion 32, the hardness of the outer region 32b may be lower than the hardness of the inner region 32a. Hereinafter, the use and effects of the workpiece suction plate 21' having such a configuration will be described.

As described above, in the substrate 1 after molding, the cutting process may not be performed from the surface side (the side of the die surface 2b) of the substrate 2. However, the curvature remaining in the substrate 1 after molding has a convex curvature and a concave curvature, and as shown in FIG. 14( a ), the surface side (the side of the mold surface 2 b ) of the central portion of the substrate 2 is convexly convex and the back surface The side (the side of the substrate surface 2a) is concave, and the concave curvature is as shown in Fig. 14 (b), and the back side (the side of the substrate surface 2a) of the central portion of the substrate 2 is convex and convex (surface 2b) Side) is concave.

The molded substrate 1 which cannot be cut from the front surface side (the mold surface 2b side) of the substrate 2 may have a lower hardness in the inner region 32a as long as it is convexly bent in the substrate 2. The workpiece suction plate 21 having the hardness of the outer region 32b is firmly held in a state in which the substrate 1 is molded. However, in a state in which the substrate 2 is concavely curved, the surface side (the mold surface 2b side) having the concave portion at the central portion of the substrate 2 is disposed on the workpiece suction plate 21, and it is difficult to sufficiently adsorb the concave surface side. On the inner domain 32a. Therefore, the cutting process cannot be performed in a state where the formed substrate 1 is firmly held on the workpiece suction plate 21.

In response to such a situation, a modification of the workpiece suction plate 21' in which the hardness of the outer region 32b is lower than the hardness of the inner region 32a is employed. According to this modification, the formed substrate 1 on which the concave curvature is generated on the substrate 2 can be firmly held. In the workpiece suction plate 21', the hardness of the outer domain 32b is configured. Below the hardness of the inner domain 32a. Thereby, the outer region 32b which is softer than the inner region 32a is deformed (trapped), the outer region 32b adsorbs the outer peripheral portion of the formed substrate 1, and the inner region 32a adsorbs the central portion of the substrate 1 which is convex upward. Thereby, the formed substrate 1 is fixed to the adsorption surface portion 32 without being largely deformed. The configuration in which the hardness of the outer region 32b is lower than the hardness of the inner region 32a is performed for any of the convex bending shown in FIG. 14(a) and the concave bending shown in FIG. 14(b). The central portion is effective in the case where the formed substrate 1 is attached to the workpiece suction plate 21 in an upwardly convex manner.

In the above-described embodiment, the adsorption surface portion 32 is divided into the inner region 32a on the inner side in the planar direction and the outer region 32b on the outer side, and the hardness of the inner region 32a is made lower than the hardness of the outer region 32b. In the modified example, the hardness of the outer region 32b is made lower than the hardness of the inner region 32a. On the other hand, as shown in FIG. 19, the adsorption surface part 32' may be provided in which the adsorption surface part 32' is divided into the lower layer area 32c and the outer side (flat shape) of the inner side (floor side) in the height direction (thickness direction). The upper layer region 32d of the workpiece abutting surface side is configured such that the hardness of the upper layer region 32d is lower than the hardness of the lower layer region 32c (the lower layer region 32c - the Xiao A hardness is 70 to 60, and the upper layer region 32d = the Xiao A hardness is 50~40). Even in such a configuration, it is possible to closely adhere to the flat workpiece by deforming the upper layer 32d in accordance with the shape of the flat workpiece, and firmly hold the flat workpiece by the lower layer 32c (after forming Substrate 1).

A method of manufacturing the workpiece suction plate 21' including the above-described adsorption surface portion 32' will be described with reference to Fig. 20 . First, after preparing the metal mold 50' having the same shape as the outer mold 50 shown in Fig. 16(a), the third resin material composed of the lanthanum room temperature curable liquid resin to be the upper layer region 32d is formed. 60C is filled into the chamber 52 of the outer mold 50' (first resin filling step S31). Specifically, it will be hardened at room temperature by a lanthanide system having a hardness of 50 to 40 after hardening. The third resin material 60C composed of a chemical liquid resin is filled in the metal mold 50'. At this time, the filling amount of the third resin material 60C is set in such a manner that the filling height dimension U' of the third resin material 60C is the same as the height dimension U (see Fig. 19) of the formed upper layer region 32d.

Next, the outer mold 50' filled with the third resin material 60C is housed in a vacuum dryer 61 with a dry rotary pump, and allowed to stand at normal temperature and about 100 kPa for 20 minutes, thereby removing the third resin material. The inner bubble 62 of 60C (first degassing step S32).

After the end of the degassing, the outer mold 50' is taken out from the vacuum dryer 61. Further, it is waited until the third resin material 60C is hardened to such an extent that it is not mixed with other liquid resin materials, and when it is hardened to such an extent, it is a room temperature hardening liquid which becomes a sturdy A hardness of 50 to 40 after hardening. The fourth resin material 60D composed of a resin is further filled into the upper surface of the third resin material 60C in the metal mold 50' (second resin filling step S33). At this time, the filling amount of the fourth resin material 60D is set in such a manner that the filling height V' of the fourth resin material 60D is the same as the height dimension V (see Fig. 19) of the formed lower layer region 32d.

Next, the outer mold 50' filled with the fourth resin material 60D is again housed in a vacuum dryer 61 with a dry rotary pump, and left to stand at normal temperature and about 100 kPa for 20 minutes, thereby removing the fourth resin material. The inner bubble 62 of 60D (second degassing step S34).

Since the subsequent steps are the same as the bottom plate insertion step S24, the hardening step S25, the bottom plate adhesion step S26, the demolding step S27, and the through hole forming step S28 shown in FIG. 18, the description thereof will be omitted.

21(a) and (b), the positional relationship between the product domain 1c' corresponding to the plurality of packages 5 and the boundary between the inner domain 32a and the outer domain 32b (hereinafter referred to as "demarcation") in the substrate 1 after molding will be described. . As shown in Figs. 21(a) and (b), the total width of the product domain 1c' is set to 100%. In the case where the boundary 64 between the inner domain 32a and the outer domain 32b is located 5 to 10% from the periphery of the product domain 1c'. The boundary 64 is preferably located at a position of 7.5% from the periphery of the product domain 1c' to the inside.

The position of the boundary 64 is too close to the periphery of the product domain 1c' (the boundary 64 is located at a position less than 5% from the periphery) and the position of the boundary 64 is too far from the periphery of the product domain 1c' (the boundary 64 is located at a distance from the periphery) In any of the cases where the position exceeds 10%, the outer peripheral portion of the formed substrate 1 may not be sufficiently adsorbed.

In the above description, the flat workpiece as the object to be cut is described as an example of the formed substrate. The present invention is not limited thereto, and a semiconductor wafer such as a germanium wafer or a compound semiconductor wafer, a ceramic substrate, or a glass substrate may be selected as a flat workpiece. These substrates are substrates in which a plurality of circuit elements such as integrated circuits or functional elements such as MEMS are formed. In these cases, each of the wafer-shaped members that are cut is equivalent to a product. The flat workpiece may also be a glass plate used as a cover for various electronic machines.

In addition, the present invention can be applied to a case where a molded article formed by molding a translucent resin is cut to produce a plurality of optical components (for example, lenses) corresponding to a plurality of products. At this time, the molded article corresponds to a flat workpiece. The flat workpiece may include irregularities as in the case of a plurality of optical elements including a plurality of convex lenses, in addition to the case of a flat plate. The molded article of the flat workpiece may be a molded article in which a plurality of products are produced by cutting the molded article formed separately. The molded article as a flat workpiece has nothing to do with the product to be manufactured.

The present invention is not limited to the above-described embodiments, and may be arbitrarily and appropriately changed and selected as needed within the scope of the gist of the invention.

1‧‧‧Formed substrate

2‧‧‧Substrate

2a‧‧‧Substrate surface

2b‧‧‧Mold face

3‧‧‧Resin molded body

17a‧‧‧The first cutting table

17b‧‧‧Second cut-off

21‧‧‧Workpiece adsorption plate

31‧‧‧floor

31a‧‧‧ base

31b‧‧‧Loading Department

32‧‧‧Sucking the face

32’‧‧·Sucking face

32a‧‧‧ 内域

32b‧‧‧Outland

Claims (10)

A workpiece suction plate that adsorbs and supports the flat workpiece when the flat workpiece is cut and singulated, and includes an adsorption surface that adsorbs the flat workpiece, and divides the adsorption surface into an inner region in a plane direction inner side And surrounding the outer region of the inner region in the outer side in the plane direction, and making the hardness of the inner region lower than the hardness of the outer region. The workpiece adsorption plate according to claim 1, wherein the inner region is composed of a low-hardness rubber material having a hardness of 50 to 40, and the outer region is a hardness of 70 to 60. Made of hardness rubber material. The workpiece suction plate according to the first or second aspect of the invention, wherein the flat workpiece is a formed substrate having a product region in which a plurality of products are formed and an end material region disposed around the product region, wherein The outer region is a region at least opposite to the end material region when the flat workpiece is adsorbed and held on the adsorption plate, and the inner region is at least opposite to the product region when the flat workpiece is adsorbed and held on the adsorption plate. Area. A workpiece suction plate that adsorbs and supports the flat-shaped workpiece when the flat workpiece is cut and diced, wherein the workpiece suction plate is provided with an adsorption surface that adsorbs the flat workpiece, and divides the adsorption surface into a surface direction The inner inner region and the outer surface in the outer surface of the inner region surround the outer region of the inner region, and the hardness of the outer region is lower than the hardness of the inner region. A workpiece cutting device characterized by comprising: The workpiece suction plate according to the first or fourth aspect of the invention, and the cutting means, the flat plate-shaped workpiece adsorbed on the adsorption plate is cut and singulated. A workpiece cutting method, comprising: a preparation step of preparing a workpiece adsorption plate, wherein the workpiece adsorption plate has an adsorption surface having an inner region and an outer region surrounding the inner region in a lateral direction, and the inner region has a low hardness a hardness in the outer region; a holding step of adsorbing and holding the flat workpiece on the adsorption surface of the workpiece suction plate; and a cutting step of cutting the flat workpiece held by the workpiece adsorption plate to perform a single Slice. The workpiece cutting method according to claim 6, wherein in the preparation step, the inner region is prepared as a low-hardness rubber material having a hardness of 50 to 40 in the inner region. A workpiece adsorption plate composed of a high-hardness rubber material having a hardness of 70 to 60 in the outer region. The workpiece cutting method according to the sixth or seventh aspect, wherein the flat workpiece is a formed substrate having a product region in which a plurality of products are formed and an end material region disposed around the product region. The outer region is a portion at least opposite to the end material region when the flat workpiece is adsorbed and held on the workpiece suction plate, and the inner region is at least the foregoing when the flat workpiece is adsorbed and held on the workpiece adsorption plate. The relative parts of the product domain. A method for manufacturing a workpiece adsorption plate, wherein the workpiece adsorption plate has: adsorbing a face, when When the flat workpiece is cut and singulated, the flat workpiece is adsorbed and supported; and the bottom surface of the suction surface is attached, and the inner surface of the suction surface in the surface direction is harder than the outer surface. The hardness of the outer region of the adsorption surface portion of the inner region is characterized by comprising: a preparation step of preparing an outer mold and an inner mold, the outer mold having an inner surface of a shape corresponding to the adsorption surface portion, wherein the inner mold has a thin-walled frame having an outer peripheral shape corresponding to the outer peripheral shape of the inner region; and a resin filling step in which the inner mold is placed in the outer mold along the periphery of the inner region forming region of the outer mold The outer region forming region of the outer mold between the inner circumference of the outer mold and the outer circumference of the inner mold is filled with the first resin material which becomes the outer region after being hardened to a height dimension equal to the height dimension of the adsorption surface portion, and is the aforementioned outer mold The inner domain forming region is harder than the first resin material and hardened with a height dimension equal to the height dimension of the adsorbing surface a second resin material which becomes the inner region; the inner mold removing step, when the first resin material and the second resin material are hardened to such an extent that they do not mix with each other, the inner mold is pulled out from the outer mold so that The first resin material and the second resin material are in close contact with each other; and the bottom plate bonding step is performed by the bottom plate and the first resin material and the second resin material in the outer mold after the inner mold is pulled out Then glue it together. The method for producing a workpiece adsorption plate according to the invention of claim 9, wherein in the resin filling step, a high-hardness rubber material having a hardness of 70 to 60 after hardening is filled as the first resin material. Into the outer region forming region, and as the second resin material, a low-hardness rubber material having a hardness of 50 to 40 after hardening is filled in front. The inner domain is formed in the region.