TW201603159A - Increasing production capacity of die sorting apparatus - Google Patents

Abstract

An increasing production capacity of die sorting apparatus includes a wafer table; a carrier neighbored to the wafer table; a first vision guiding being on a top of the wafer table, and moving back and forth between the wafer table and the carrier; and multiple pins installed below the wafer table. As thereinberfore, the pins is able to eject multiple dies to increase efficacy of sorting dies.

Description

Grain selection device for increasing productivity

The present invention is a die-removing device for increasing productivity, which provides a die-selecting device capable of ejecting a plurality of dies.

The existing thimble machine has a wafer ring, a thimble cover, a thimble seat, a thimble and a visual positioning module.

The wafer ring is provided for a wafer having a plurality of dies.

The thimble cover is disposed below the wafer ring, the ejector cap is movable under the wafer ring, or the wafer ring is movable over the ejector cap.

The thimble seat is located below the ejector cap.

The thimble is disposed on the ejector pin, and the thimble is coupled to a power source. The power source is a pneumatic driving structure, a motor driving structure, a power driven diagonal block or a cam structure, and the power source provides a thimble and a power to Allow the thimble to pass through the ejector cap.

A vision positioning module is disposed above the wafer ring to capture an image of the die located in the wafer ring and provide the ejector pin to enable the ejector pin to eject the desired die. Another device is used for suction.

In the early years, the visual positioning module was a low number of paintings, such as one million to three million paintings. Therefore, the visual positioning module can only capture the image of the grain, but cannot capture the mapping map of the die. The image of the feature is the information on the quality, classification, or location of the grain.

Even today, manufacturers of thimble machines still use the above-mentioned low-drawing visual positioning module, so the ejector can only eject the die specified by a program, and cannot be based on The feature map pops out the required grains.

In addition, if the manufacturer designs a machine capable of ejecting a plurality of crystal grains, the functions of the ejected crystal grains are all the same, and sometimes it is impossible to discriminate the crystal grains having defects.

Furthermore, if the two different efficiencies of the dies are too close, the ejector pin cannot be ejected according to the image provided by the low-numbered visual positioning module, so how to change the shortcomings of the aforementioned design becomes discussed. The title.

In view of the above disadvantages, it is an object of the present invention to provide a die-removing apparatus for increasing productivity by applying a plurality of ejector pins to eject a plurality of crystal grains, thereby detecting the efficiency of the crystal grains.

In order to achieve the above object, the technical means of the present invention is to provide a die-removing device for improving productivity, which is to select at least one die, which comprises: a wafer capable of providing a plurality of dies a wafer carrier; a carrier capable of receiving the die, disposed adjacent to the wafer table; a first visual positioning unit capable of capturing the die, disposed above the wafer table; a plurality of suction units are disposed above the wafer table and reciprocally move between the wafer table and the carrier; and a plurality of thimbles are disposed below the wafer table.

As described above, the present invention utilizes a plurality of thimbles to allow the ejector pins to eject a plurality of dies at a time, thereby improving the efficiency of the dicing process.

In addition, the first visual positioning unit of the present invention is a high-numbered image capturing device, so that the image of the die can be captured and provided to the ejector pin respectively, whereby the ejector pin can sequentially or simultaneously eject differently used dies or It is a two-phase adjacent and differently effective grain or a plurality of grains having the same effect.

In summary, the present invention applies a high number of visual positioning units and a plurality of ejector pins to achieve improved efficiency in detecting the crystal grains.

10‧‧‧ Wafer

11‧‧‧ Vehicles

12‧‧‧First visual positioning unit

13‧‧‧Second visual positioning unit

14‧‧‧ suction unit

15‧‧‧ thimble

16‧‧‧Power source

2‧‧‧ wafer

20‧‧‧ grain

1 is a schematic view showing the operation of the die selection device for increasing productivity in the present invention.

The embodiments of the present invention are described below by way of specific embodiments, and those skilled in the art can readily understand the other advantages and advantages of the present invention.

Referring to FIG. 1 , the present invention is a die-removing device for improving productivity, which has a wafer table 10 , a carrier 11 , a first visual positioning unit 12 , and a second visual positioning unit 13 . A plurality of suction units 14 , a plurality of thimbles 15 and a plurality of power sources 16 .

Wafer table 10 is provided for wafer 2 having a plurality of dies 20 that are capable of providing a lateral movement or a back and forth movement.

The carrier 11 is disposed adjacent to the wafer table 10, and the carrier 11 can provide a lateral movement or a forward and backward movement.

The first visual positioning unit 12 is disposed above the wafer table 10. The first visual positioning module 12 is capable of vertically capturing and aligning one side of the wafer table 10 with the die 20, and the first visual module 12 is The mark on the other side of the die 20 can be imaged to improve the accuracy of the positioning of the die 20.

The second visual positioning unit 13 is disposed above the carrier 11 , and the second visual positioning module 13 is capable of vertically capturing the image and the surface of the alignment carrier 11 and the die 20 , and the second visual positioning module 13 is capable of The mark on the other side of the imaging die 20 is shown.

The first visual positioning unit 12 and the second visual positioning unit 13 are respectively a high-resolution image capturing device. For example, the high number of paintings is between 3 million and 20 million, and the first visual positioning is performed. Unit 12 is capable of further reading the feature map of die 20.

The suction unit 14 is disposed above the wafer table 10 and reciprocates between the wafer table 10 and the carrier 11 .

The ejector pin 15 is disposed under the wafer table 10, and each ejector pin 15 is coupled to each of the power sources 16. The power source 16 is a pneumatic driving structure, a motor driving structure, a power driven diagonal block or a cam structure.

As shown in FIG. 1, a wafer 2 having a plurality of dies 20 is disposed on the wafer table 10, Since the wafer table 10 can provide a lateral movement or a forward and backward movement, the wafer table 10 can be arbitrarily moved above the ejector pin 15, or the ejector pin 15 can be arbitrarily moved under the wafer table 10, thereby causing the ejector pin 15 to be ejected. Below the die 20.

The first visual positioning module 12 is capable of vertically imaging and one side of the wafer table 10 and the die 20 so that the ejector pin 15 can eject the die 20 to be ejected, and each of the suction units 14 can be positioned according to the first vision. The image captured by the module 12 sequentially picks up a single die 20, or the plurality of pick-up cells 14 draw a plurality of die 20 at a time.

In addition, the first visual positioning module 12 can capture the feature map of the die 20 located in the wafer table 10, and transmit the image to the ejector pin 15. The ejector pin 15 sequentially pops up according to the information of the feature map. The die 20, or a plurality of die 20 to be drawn at a time.

Furthermore, the power source 16 can drive the plurality of ejector pins 15 at a time, or the power source 16 can drive the ejector pins 15 in sequence, or the power source 16 can drive at least two thimbles 15 at a time, and the manner in which the power source 16 drives the thimble 15 is Depending on the grain process.

Furthermore, when the ejector pin 15 is in operation, the ejector pin 15 can be simultaneously ejected by the power source 16 at the same time; or the power source 16 is driven to drive the ejector pin 15 to be set out; or the power source 16 is driven to drive the ejector pin 15 in order. Out; or the power source 16 is ejector pins 15 respectively.

Secondly, the power source 16 is a motor driving structure, and combined with at least one cylinder or at least one control electromagnetic coil, the power source 16 drives the set ejector pin 15 to eject.

The suction unit 14 that picks up the die 20 leaves the wafer table 10 and moves to the carrier 11 . The second visual positioning module 13 is the image pickup device 11 and the die 20 located in the suction unit 14 to make the suction unit 14 . The die 20 can be surely placed on a predetermined position on the carrier 11.

If further explained, the first visual positioning module 12 captures the feature map of the die 20 located on the wafer table 10, and transmits the image to the suction unit 14 and the ejector pin 15, respectively, according to the image of the feature map. Ejecting the die 20 to be sucked out, the ejecting mode can be ejected one by one or one or more ejects as described above, and the suction unit 14 absorbs the die that has been ejected according to the image of the feature map. 20.

In summary, the present invention applies a plurality of thimble designs to enable the thimble to Multiple dies are ejected at a time, thereby overcoming the defects of the existing single thimble and improving the efficiency of the selected dies.

In addition, the application of the visual positioning module is to improve the accuracy of the grain positioning.

Furthermore, each thimble is coupled with a respective power source, so that each power source is less prone to interference when power is supplied to each ejector pin, and if one of the power sources generates a faulty condition, the remaining power sources are still available. Power is applied to the thimble to allow the grain process to continue.

The specific embodiments described above are only used to exemplify the features and functions of the present invention, and are not intended to limit the scope of the present invention, and may be used without departing from the spirit and scope of the invention. Equivalent changes and modifications made to the disclosure of the invention are still covered by the scope of the following claims.

10‧‧‧ Wafer

11‧‧‧ Vehicles

12‧‧‧First visual positioning unit

13‧‧‧Second visual positioning unit

14‧‧‧ suction unit

15‧‧‧ thimble

16‧‧‧Power source

2‧‧‧ wafer

20‧‧‧ grain

Claims (10)

A grain-recovering device for improving productivity, which is used for selecting at least one die, and the die-cleaning device for improving productivity includes: a wafer table capable of providing a wafer having a plurality of crystal grains; a carrier capable of receiving the die, disposed adjacent to the wafer stage; a first visual positioning unit capable of capturing the die, disposed above the wafer table; and a plurality of suction units And being disposed above the wafer table and reciprocating between the wafer table and the carrier; and a plurality of thimbles disposed below the wafer table. The chip selection device for increasing productivity as described in claim 1, wherein each thimble is coupled to a power source; the die has a feature map, and the first visual positioning module captures the feature map. The grain picking device for increasing productivity as described in claim 2, wherein the power source is a pneumatic driving structure, a motor driving structure, a power driven diagonal block or a cam structure. The grain picking device for increasing productivity as described in claim 3, wherein the thimble is ejected in whole, in part, individually or sequentially by the power source. The grain picking device for increasing productivity as described in claim 2, wherein the power source is a motor driving structure, and combined with at least one cylinder or at least one control electromagnetic coil, the power source is driven to be set. The thimble is ejected. The method for improving productivity of the die selection device according to claim 1, wherein the first visual positioning module is capable of vertically taking an image and a side of the alignment wafer table and the die. The grain inspection device for increasing productivity as described in claim 6 wherein the first visual module is capable of capturing the other side of the die. The method for improving productivity of the die selection device according to claim 1, further comprising a second visual positioning unit, wherein the second visual positioning unit is disposed above the carrier, the second visual positioning module The group is capable of capturing the other side of the die. The method for improving productivity of the die selection device according to claim 8, wherein the second visual positioning module is capable of vertically taking and aligning one side of the carrier with the die. The grain picking apparatus for increasing productivity as described in claim 1, wherein the wafer stage is capable of providing a lateral movement or a forward and backward movement; the carrier is capable of providing a lateral movement or a forward and backward movement.