CN104600009B - Chip measuring sorting system and method - Google Patents

Abstract

The invention provides a chip measurement and sorting system and method. The system provided by the present invention includes: an adjacent sorting device and a measuring device, the measuring device is provided with a first object holder, and the sorting device is provided with a second object holder; a bearing device adjacent to the positioning access device, carrying The device is provided with a first carrying platform, and the positioning access device is provided with a second carrying platform for carrying and positioning standard tools; the carrying device is also adjacent to the sorting device, and a reclaiming arm is arranged between them; The access device is also arranged adjacent to the tool rack assembly, with a second mechanical arm disposed between them. Standard tools are stored in the tool rack assembly, which are respectively connected to the central control system of the above-mentioned devices. The system provided by the invention solves the problem of low production efficiency and high production cost due to the need to repeatedly perform machine setting and wafer scanning operations for chip measurement and sorting in the prior art.

Description

Chip measurement and sorting system and method

technical field

The invention relates to semiconductor manufacturing technology, in particular to a chip measurement and sorting system and method.

Background technique

After the semiconductor wafer is thinned and diced on the back side, thousands of independent chips are formed, which usually need to be sorted according to the characteristics of each chip in the wafer. For example, the sorting of LED chips is usually based on the LED The photoelectric characteristics of the chip, that is, it is necessary to classify thousands of chips in the wafer according to different photoelectric characteristics, and discard the damaged or abnormal chips. This process is called sorting.

At present, before sorting LED chips, all LED chips in the wafer are measured one by one to obtain the photoelectric characteristics of each chip; specifically, the measurement and sorting of the wafer usually includes the following steps: The photoelectric characteristics of each chip on the screen and scan to generate the coordinate information of the wafer; according to the measured photoelectric characteristics and coordinate information, the corresponding wafer file of the wafer is generated; the wafer file is sent to the sorting device, and the sorting device After reading in the obtained wafer files, the sorting and rearranging operations are performed according to the preset sorting rules, and the obtained rearranged LED chips have consistent photoelectric characteristics, thus completing the sorting. In the actual production process, please refer to Fig. 1, which is a schematic diagram of the chip measurement and sorting method in the prior art. When the wafer is measured and sorted, machine setting and wafer scanning are required, and most All processes require manual operations by operators.

However, the measurement and sorting of chips in the prior art requires repeated operations of machine setting and wafer scanning, resulting in low production efficiency and high production costs.

Contents of the invention

The present invention provides a chip measurement and sorting system and method to solve the problem of low production efficiency and low production efficiency due to the need to repeatedly perform machine setting and wafer scanning operations for chip measurement and sorting in the prior art. high cost issue.

The invention provides a measurement and sorting system for chips, a measuring device, a sorting device, a carrying device, a positioning access device, a tool rack assembly, a first mechanical arm, a second mechanical arm, a reclaiming rotary arm and a central control system ;

The measuring device is provided with a first object holder, and the sorting device is provided with a second object holder, and a central ring with the same diameter is provided in the first object holder and the second object holder, and is used to combine the same specifications. The wafer fixing assembly is fixed in the central ring, and the measuring device is used to scan and obtain the coordinate information of the wafer fixed in the wafer fixing assembly, and measure and record each The photoelectric characteristics of the chip; the sorting device is arranged adjacent to the measuring device, and is used to sort out the chips measured by the measuring device according to preset rules;

The carrying device is arranged adjacent to the positioning access device, wherein the carrying device is provided with a first carrying platform, the positioning access device is provided with a second carrying platform, and the first carrying platform and The second carrying platform is used for carrying and positioning standard tooling, and the second carrying platform is also used for temporarily storing the wafer fixing assembly;

The carrier device is also arranged adjacent to the sorting device, and the reclaiming arm is arranged between the carrier device and the sorting device, and is used for disposing of the wafer in the sorting device. When sorting the chips, arrange the chips picked out by the sorting device into the standard tools on the first carrying platform according to preset rules through the pick-up arm;

The first mechanical arm is arranged at the central position of the measuring device, the sorting device, the carrying device and the positioning access device, and is used to grab and move the first storage seat, the second Wafer fixing components on two storage seats or the second carrying platform, and grabbing and moving the standard tools on the first carrying platform or the second carrying platform;

The positioning access device is also arranged adjacent to the tool rack assembly, the standard tool is stored in the tool rack assembly, and the second mechanical arm is arranged between the positioning access device and the tool rack assembly. Between the tool rack components, it is used to grab standard tools from the tool rack components and place them on the second carrying platform of the positioning access device;

The central control system is connected with the measuring device, the sorting device, the carrying device, the positioning access device, the first mechanical arm, the second mechanical arm and the reclaiming rotary arm respectively. The connection is used to control the various devices and components connected to it to perform corresponding operations, and is also used to analyze, process and access the data measured by the measuring device.

The present invention also provides a chip measurement and sorting method, which uses the chip measurement and sorting system for measurement and analysis, and the method includes:

Scanning the position of the first wafer to generate coordinate information of the first wafer, and measuring the photoelectric properties of the first wafer through the measurement module to generate first measurement information, wherein the The coordinate information includes coordinate information of each chip in the first wafer;

The first wafer is moved and fixed on the second storage seat by the first robot arm, and the first wafer is sorted by the sorting device and the reclaiming rotary arm and sorting the chips in the first wafer into different standard tools according to a preset sorting rule.

It can be seen from the above technical solutions that the chip measurement and sorting system and method provided by the present invention, through the reasonable layout of the measuring device, sorting device, carrying device, positioning access device and tool rack assembly, and through the measurement device The first and second storage seats compatible with wafer fixing components of the same specification are installed in the sorting device, and with the program control of the central control system, the sorting of the chips in the wafer is only performed once. Setting and scanning operations, chip sorting is performed through the chip measurement and sorting system provided in this embodiment, which solves the problem of measuring and sorting chips in the prior art, due to the need to repeatedly perform machine setting and wafer scanning Operation, which leads to low production efficiency and high production cost, correspondingly reduces process steps, improves work efficiency to a large extent, and reduces hardware costs and labor costs in the process.

Description of drawings

FIG. 1 is a schematic diagram of a method for measuring and sorting chips in the prior art;

2 is a schematic structural diagram of a chip measurement and sorting system provided by an embodiment of the present invention;

Fig. 3 is a top view of the first fixed supporter in the chip measurement and sorting system provided by the embodiment shown in Fig. 2;

Fig. 4 is a partial structural schematic diagram of the measuring device in the chip measuring and sorting system provided by the embodiment shown in Fig. 2;

FIG. 5 is a top view of the second fixed supporter 230 in the chip measurement and sorting system provided by the embodiment shown in FIG. 2;

6 is a layout diagram of a wafer structure in an embodiment of the present invention;

FIG. 7 is a front view of the tool rack assembly in the chip measurement and sorting system provided by the embodiment shown in FIG. 2;

Fig. 8 is a top view of the tool rack assembly in the embodiment shown in Fig. 7;

FIG. 9 is a flow chart of a chip measurement and sorting method provided by an embodiment of the present invention;

FIG. 10 is a flow chart of another chip measurement and sorting method provided by an embodiment of the present invention;

FIG. 11 is a schematic diagram of a chip measurement and sorting method provided by an embodiment of the present invention.

detailed description

In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

In the following specific embodiments of the present invention, the specific structure of the chip measurement and sorting system proposed by the present invention and the connection relationship and working mode of each device in the working state are described through a more detailed implementation. The embodiment The accompanying drawings are only schematic diagrams, which are used to express the inventive intent of the present invention. The implementation of the present invention is not limited to the specific structures in the following drawings, and the embodiments of the present invention specifically take the measurement and sorting method of LED chips as an example. It should be noted that the objects to be sorted by using the chip measurement and sorting system provided in the following embodiments of the present invention may also be other semiconductor chips. Through the specific description of the structure and working mode of the chip measurement and sorting system provided by the embodiment of the present invention, those skilled in the art can easily understand the differences and advantages between the present invention and the prior art.

FIG. 2 is a schematic structural diagram of a chip measurement and sorting system provided by an embodiment of the present invention. As shown in Figure 2, the chip measurement and sorting system provided in this embodiment is used to measure and sort semiconductor wafers. The embodiments of the present invention are specifically described by taking the measurement and sorting of LED chips as an example. The chip measurement and sorting system includes: a measuring device 100, a sorting device 200, a carrying device 300, a positioning access device 400, a tool frame assembly 500, a first robotic arm 600, a second robotic arm 700, and a retrieving rotary The arm 800 and the central control system (not shown in the figure), the structure of each device and component in the system will be described in detail below.

In this embodiment, the measuring device 100 is provided with a first storage seat 110, the sorting device 200 is provided with a second storage seat 210, and the first storage seat 110 and the second storage seat 210 are provided with a central ring with the same diameter. , used to fix the wafer fixing assembly with the same specifications in the center ring, the wafer fixing assembly is specifically arranged on a wafer expansion ring 001, the measuring device 100 is used to scan and obtain the wafer fixed in the wafer fixing assembly The coordinate information of each chip in the circle, and measure and record the photoelectric characteristics of each chip in the wafer; the sorting device 200 is set adjacent to the measuring device 100, and is used to sort the chips measured by the measuring device 100 according to preset rules Sorting out; the carrying device 300 is adjacent to the positioning access device 400, wherein the carrying device 300 is provided with a first carrying platform 310, the positioning access device 400 is provided with a second carrying platform 410, and the first carrying platform 310 And the second carrying platform 410 is used for carrying and positioning the standard tools, and the second carrying platform 410 is also used for temporarily storing the wafer fixing assembly. It should be noted that, firstly, in the system provided by this embodiment, the arrangement of the first object holder 110 and the second object holder 210 can be compatible with the wafer fixing components used by the measuring device 100 and the sorting device 200, therefore , when obtaining the coordinate information of the wafer, with the program setting of the central control system, it is only necessary to perform machine setting and wafer scanning once, and there is no need to perform this operation repeatedly, that is, the scanning before measurement is used when performing the sorting operation As a result, the process steps of sorting can be reduced, and the work efficiency has been greatly improved; secondly, when multiple wafers are sorted in batches, while wafer A is sorted, the wafer A can be sorted. Wafer B is being measured. At this time, one of the wafers can be temporarily stored on the second carrying platform 410 of the positioning access device 400 to exchange the working position of the wafer.

The carrying device 300 is also arranged adjacent to the sorting device 200, and a retrieving arm 800 is arranged between the carrying device 300 and the sorting device 200, for when the sorting device 200 sorts the chips in the wafer, through The picking arm 800 arranges the chips picked out by the sorting device 200 into the standard tooling on the first carrying platform 310 according to preset rules. The standard tools on the first carrying platform 310 are first selected from the tool rack assembly 500 by the positioning access device 400, and the photoelectric characteristics of the chips arranged in each standard tool are the same, and finally the chips with different characteristics are arranged on the in different standard fixtures.

In a specific implementation, the first mechanical arm 600 can be set at the central position of the measuring device 100, the sorting device 200, the carrying device 300 and the positioning access device 400, for grabbing and moving the first storage seat 110, the second The wafer fixing assembly on the object holder 210 or the second carrying platform 410 , and grabbing and moving the standard tool on the first carrying platform 310 or the second carrying platform 410 . As shown in Figure 2, the above-mentioned devices are located in the first area of the system, and the first area is divided into quadrants. , third and fourth quadrants to satisfy the positional relationship of the above-mentioned devices; it should be noted that the embodiments of the present invention are not limited to the specific positions of the devices in Fig. 2, as long as the positional relationship of the above-mentioned devices can be satisfied , and realize the same processing method, all of which can be used as the position setting method of each device in the chip measurement and sorting system provided by the present invention.

In this embodiment, the positioning access device 400 is also arranged adjacent to the tool rack assembly 500, the standard tool is stored in the tool rack assembly 500, and the second mechanical arm 700 is arranged between the positioning access device 400 and the tool rack Between the components 500, it is used to grab the standard tool from the tool rack component 500 and place it on the second carrying platform 410 of the positioning access device 400; then the standard tool is moved to the second platform by the first mechanical arm 600 A carrying platform 310 for subsequent sorting work. In addition, the central control system in this embodiment is respectively connected with the above-mentioned measuring device 100, sorting device 200, carrying device 300, positioning access device 400, first robotic arm 600, second robotic arm 700, and reclaiming rotary arm 800 , used to control the devices and components connected to it to perform corresponding operations, and also used to analyze, process and access the data measured by the measuring device 100 . It can be understood that the various devices and movable components in this embodiment, including the first robot arm 600, the second robot arm 700 and the reclaiming rotary arm 800, are all controlled by the central control system to perform corresponding operations. The control system can be installed in the vicinity of the above-mentioned devices, or it can be installed in another work area under the condition of satisfying the above-mentioned connection relationship, such as a control computer, through manual operation of the operator or a preset program The device is controlled.

The chip measurement and sorting system provided in this embodiment, through the reasonable layout of the measuring device, sorting device, carrying device, positioning access device and tool rack assembly, and by setting the measuring device and the sorting device Compatible with the first and second storage seats of the wafer fixing components of the same specification, combined with the program control of the central control system, the sorting of the chips in the wafer can only be performed once for machine setting and scanning operations. The chip measurement and sorting system provided in this embodiment performs chip sorting, which solves the problem of low production efficiency due to the need to repeatedly perform machine setting and wafer scanning operations for chip measurement and sorting in the prior art And the problem of high production cost, the process steps are reduced accordingly, the work efficiency is improved to a large extent, and the hardware cost and labor cost in the processing process are reduced. Further, while reducing the number of scanning operations in this embodiment, the number of acquisitions of wafer coordinate information is reduced, and when there are many wafers and a large amount of data, the risks of material mixing, data loss, and reading errors are reduced. Hazard rate is conducive to improving the accuracy of measurement sorting.

The specific structure of each device in the chip measurement and sorting system shown in FIG. 2 is described below through some specific examples, so as to explain the specific implementation manner of each device performing corresponding operations. Fig. 3 is a top view of the first fixed supporter in the chip measurement and sorting system provided by the embodiment shown in Fig. 2, and Fig. 4 is a view of the measuring device in the chip measurement and sorting system provided by the embodiment shown in Fig. 2 Partial structure schematic diagram, please refer to Fig. 2 to Fig. 4, also be provided with first drive module 120, chip measurement module 130, light source acquisition module 140 (not shown in Fig. 2) and first image receiving module (Fig. not shown). The first drive module 120 is connected to the bottom of the first storage base 110, so that the first storage base 110 is driven by the first drive module 120 to perform horizontal, vertical and rotational movements; the measuring device 100 is fixed with a first fixed support The device 150 is specifically arranged at the bottom of the central ring of the first storage seat 110, wherein the top of the first fixed supporter 150 is provided with a plurality of symmetrically distributed vacuum suctions surrounding the edge of the first fixed supporter 150. Hole 151. Specifically, the first drive module 120 may include, for example, a first horizontal slide rail, a first longitudinal slide rail, and a first driver, and the first driver may have the function of making the first storage seat 110 rotate around the central axis; Yes, the first fixed supporter 150 is fixed, that is to say, while the first storage seat 110 is moving, the position of the first fixed supporter 150 remains unchanged, that is, through the movement of the first storage seat 110 The motion changes the die located above the first stationary holder 150, and measurements are taken on each die in the wafer in turn.

As shown in Figure 2, the chip measurement module 130 includes at least two probe arms 131 and the probe 132 (only shown in Figure 4) that is arranged on the front end of each probe arm 131, the probe arm 131 is used When the working state of the chip measurement module 130 changes, move horizontally, move up and down or rotate around the bottom end of the probe arm 131; the chip measurement module 130 is used to move a plurality of probes 132 to the first fixed supporter 150, the chip above the first fixed supporter 150 is measured; the specific measurement method can be: when performing loading and unloading operations or in a standby state, the probe arm 131 moves away from the first storage seat 110 The position of the first storage seat 110 will not be blocked. When measuring, the probe arm 131 moves to the top of the first fixed supporter 150, so that the end of the probe 132 is located on the first fixed supporter. Above the supporter 150 , as shown in FIG. 4 , the probe 132 and the light source collection module 140 are located above the wafer 002 , and at this point, the preparation for measuring the chip has been completed. Since it is usually necessary to measure the electrical characteristics of the chip when it is powered on, a current source is also provided in the chip measurement module 130 to provide current to the chip to be tested. The magnitude of the current provided can be a constant value or a variable value to drive the The chip emits light. As shown in FIG. 4 , the light source acquisition module 140 is arranged above the first fixed supporter 150, and is used to simultaneously obtain the chip's information when the chip measurement module 130 measures the chip above the first fixed supporter 150. Optical information. The first image receiving module is arranged on the top of the first object seat 110, and comprises a microscope and an image sensor, and the microscope is used to display the enlarged image when receiving the image of the wafer, and the image sensor can be, for example, a charge coupled device (Charge Coupled Device). Device, referred to as: CCD) image sensor or complementary metal-oxide-semiconductor (Complementary Metal-Oxide-Semiconductor, referred to as: CMOS) image sensor, used to extract the image information of the wafer, that is, to measure the position information of the wafer .

Similar to the structure of the measurement device 100 described above, FIG. 5 is a top view of the second fixed supporter in the chip measurement and sorting system provided by the embodiment shown in FIG. and a second image receiving module (not shown); the second drive module 220 is connected to the bottom of the second object holder 210, so that the second object holder 210 is driven horizontally, vertically and rotated by the second drive module 220 Movement; the sorting device 200 is fixed with a second fixed supporter 230, which is specifically arranged at the bottom of the center ring of the second storage seat 210, wherein the top of the second fixed supporter 230 is provided with a plurality of Two fixed supporters 230 edges, and symmetrically distributed vacuum suction holes 231, the center of the second fixed supporter 230 is also provided with a thimble through hole 232, which is used to drive the thimble inside it under the drive of the second drive module 220 Eject the preset distance. Specifically, the second driving module 220 may include, for example, a second horizontal slide rail, a second longitudinal slide rail and a second driver, and the second driver may have a function of making the second storage base 210 rotate around the central axis.

It should be noted that the second transverse slide rail in this embodiment can be set as an integral structure with the first transverse slide rail in the above-mentioned embodiment, and the second fixed supporter 230 is also fixed, that is to say, the second While the object holder 210 is moving, the position of the second fixed supporter 230 remains unchanged, that is, through the movement of the second object holder 210, the chips positioned above the second fixed holder 230 are changed, and the chips in the wafer are sequentially aligned. Each chip is sorted, and when the thimble inside the second fixed supporter 230 is ejected, the chip above it is sorted out.

In this embodiment, the second image receiving module is arranged above the second object seat 210 and includes a microscope and an image sensor, and the microscope is used to display the enlarged processed image when receiving the image of the wafer. The image sensor can be, for example, a CCD Image sensor or CMOS image sensor for extracting image information of the wafer. The function of the second image receiving module is similar to that of the above-mentioned first image receiving module, and specifically measures the position information of the wafer. Optionally, the sorting device 200 in this embodiment is also used to scan and obtain the wafer fixing assembly The coordinate information of the fixed wafer in the central control system is also used to analyze, process and access the data measured by the sorting device 200 . In a specific implementation, it is usually necessary to perform a sorting operation on the chips in a batch of wafers, and the function of measuring the coordinate position is also set in the sorting device 200, which is beneficial to improving the productivity of sorting and further improving work efficiency.

It should be noted that, to scan the wafer and obtain the position information of the wafer, it is first necessary to scan the marking points of the wafer, as shown in FIG. 6 , which is a layout diagram of a wafer structure in an embodiment of the present invention. Figure 6 only shows a part of the wafer 002, the repeated unit in the figure is the chip 002a in the wafer 002, and the special mark that is obviously different from the shape of the chip is the mark point 003, such as a "+" mark or a "╔" mark , the marking point 003 is usually set as a shape that is obviously easy to recognize by the human eye, as well as the above-mentioned first image receiving device and the second image receiving device; in a specific implementation, any one of the marking points 003 can be selected as the initial marking point, then The wafer is scanned by recording the image and coordinates of the initial marking point to generate relative coordinate information of each chip on the wafer 002 . Usually, in the front-end processing of the wafer, several marking points are reserved on it for subsequent related measurement.

Further, both the edges of the first storage base 110 and the second storage base 210 can be provided with vacuum suction holes or locking mechanisms for fixing the wafer fixing assembly, wherein the wafer fixing assembly is provided with an expansion valve for fixing the wafer. The fixed lock of the ring 001, the adhesive film for fixing the wafer is adhered on the wafer expansion ring 001; the wafer fixed on the wafer fixing component is the chips separated from each other after being cut and split, and these chips are adhered to the The adhesive films are not easy to fall off, and there is a certain distance from each other, and the adhesive films are stretched tightly on the wafer expansion ring 001 to facilitate processing. Similarly, the edges of the first carrying platform 310 are all provided with vacuum suction holes or locking mechanisms for fixing standard tooling, where an adhesive film for storing chips is attached to the standard tooling, and it is ultimately necessary to have different photoelectric The chips with specific characteristics are sorted into different standard tools, and the chips can also be adhered to the adhesive film of the standard tool when sorting out, so as to facilitate the storage of the sorted chips; the edges of the second carrying platform 410 are all set There are positioning claws for fixing and storing wafer holder assemblies or standard tools.

Specifically, the front end of the reclaiming arm 800 is provided with a vacuum nozzle, which is used to push out the thimble in the thimble through hole in the center of the second fixed supporter 230 when the reclaiming arm 800 moves to the sorting device 200, Puncture the viscous film on the wafer fixing assembly and eject the chip to be sorted, so that the vacuum nozzle contacts and absorbs the ejected chip, thereby moving the chip to the standard tool placed on the first carrier platform 310; wherein, the first The carrying platform 310 is also used to move the unit cells by a preset distance in the horizontal or vertical direction after each retrieving operation performed by the retrieving arm 800, so that the chips selected by the retrieving arm 800 each time are adhered to the standard on the adhesive film of the tool. The reclaiming arm 800 also needs to be equipped with a driver, and the moving range of the reclaiming arm 800 shown in FIG. 2 is 90 degrees.

Similar to the measuring device 100 and the sorting device 200 described above, the carrying device 300 is also provided with a third driving module 320 and a third image receiving module; the third driving module 320 is connected to the bottom of the first carrying platform 310, so that the first The carrying platform 310 is driven by the third driving module 320 to move horizontally, vertically and rotationally; wherein, the edge of the first carrying platform 310 is provided with a locking mechanism for fixing standard tooling. Specifically, the third drive module 320 may include, for example, a third horizontal slide rail, a third vertical slide rail, and a third driver, and the third driver may have a function of making the third storage seat rotate around the central axis. The third image receiving module in this embodiment is arranged above the first carrying platform 310, the third image receiving module includes a microscope and an image sensor, and the microscope is used to display an enlarged processed image when receiving the image of the wafer, the image The sensor can also be a CCD image sensor or a CMOS image sensor, which is used to extract the image information of the wafer. When the pick-up arm 800 places the chip on the standard tool on the first carrying platform 310, the third image receiving device The arrangement of chips can be displayed in real time, so as to avoid misarrangement and missing arrangement.

As shown in FIG. 2 , in the chip measurement and sorting system provided by various embodiments of the present invention, a shading device 900 may also be provided between the measuring device 100 and the sorting device 200, and the shading device 900 includes a shading baffle and a baffle. Plate drive module, the top of the shading baffle is located below the level of the first storage seat 110 and the second storage seat 210, the baffle drive module is connected with the central control system, and is used for when the measuring device 100 and/or the sorting device 200 are in In the working state, the shading baffle is raised to isolate the measuring device 100 and the sorting device 200 . Specifically, the baffle driving module specifically includes a slide rail and a driver for the shading baffle to go up and down, and when the shading baffle is lowered, its top is located below the level of the storage seats of the measuring device 100 and the sorting device 200, and It will not affect the movement of the storage seat in the measuring device 100 and the sorting device 200, the picking and placing of wafers and other operations; when the shading baffle rises, the measuring device 100 and the sorting device 200 can be isolated from each other, so that the light cannot mutual transmission, thereby avoiding adverse effects caused by mutual interference of the light sources when the measuring device 100 and the sorting device 200 work at the same time.

Furthermore, the first mechanical arm 600 is located at the center of the above four devices, and it is necessary to grasp and process the components on the first storage base 110, the second storage base 210, the first loading platform 310 and the second loading platform 410. Placement operation, as shown in FIG. 2 , the first robotic arm 600 that satisfies the above actions can be configured with a first arm drive module, which is used to make the first robotic arm 600 rotate 360 degrees and move up and down to move to the measuring device 100, Above the sorting device 200, the carrying device 300 or the positioning access device 400, the front end of the first robotic arm 600 is provided with a vacuum chuck, which is used to firmly grab the wafer fixing component or standard through vacuum adsorption; similarly, the second The mechanical arm 700 can be configured with a second arm driving module, which is used to make the second mechanical arm 700 rotate and move up and down, so as to move to the inside of the tool holder assembly 500 and position the top of the access device 400. The second mechanical arm 700 The front end is equipped with a vacuum suction cup, which is used to firmly grasp the standard tool by vacuum adsorption. It should be noted that the above-mentioned wafer fixing group grabbed by the robotic arm is set in a detachable manner, and needs to be moved between the first object holder 110, the second object holder 210, and the second carrier platform 410. The frame assembly 500 , the second carrying platform 410 and the first carrying platform 310 move among them.

FIG. 7 is a front view of the tool rack assembly 500 in the chip measurement and sorting system provided by the embodiment shown in FIG. 2 , and FIG. 8 is a top view of the tool rack assembly 500 in the embodiment shown in FIG. 7 . In a specific implementation, a fourth drive module may be provided at the bottom of the tool rack assembly 500 for moving the tool rack assembly 500 left and right and up and down. Similarly, the fourth drive module may also include a And the slide rail that moves up and down and drives it, as shown in Figure 7, there are multiple groups of "non" font tool storage positions 510 in the tool frame assembly 500, and the standard tool 004 adhered with the adhesive film is arranged and placed In the tool storage position 510, the adhesive film attached to the standard tool 004 can be blank, or there can be no more than a limited number of adhesive films attached, and the chip coordinate information is recorded by the central control system. Adhesive film for chips.

FIG. 9 is a flow chart of a chip measurement and sorting method provided by an embodiment of the present invention. The method shown in FIG. 9 is used in the case of sorting chips in a semiconductor wafer, and is specifically performed by the chip measurement and sorting system provided in the above-mentioned embodiment of the present invention. The method provided in this embodiment includes the following steps:

S110, scan the position of the first wafer to generate coordinate information of the first wafer, and use the measurement module to measure the photoelectric performance of the first wafer to generate first measurement information, wherein the coordinate information includes Coordinate information for each chip.

In this embodiment, the measurement and sorting of LED chips is also taken as an example for illustration. The standard for sorting LED chips is their optoelectronic performance. , the wafer is cut and split to form core particles that are separated from each other. These core particles are adhered to the adhesive film so as not to fall off, and there is a certain distance from each other. The adhesive film is stretched tightly on a circular wafer expansion ring 001 Furthermore, the fixed lock on the wafer fixing assembly fixes the wafer expansion ring 001 on it, so that the first storage seat 110 and the second storage base 210 in the measurement and sorting system of subsequent chips can pass through The wafer fixing component fixes the wafers to be sorted on the operating table.

It should be noted that, based on the consideration of improving production capacity, the operation of scanning the first wafer to generate coordinate information in S110 can be performed by the measuring device 100 or the sorting device 200. Since both devices are equipped with an image receiving module, it can Image information of the first wafer is acquired. Specifically, the first wafer is placed on the first object seat 110 of the measuring device 100 or the second object seat 210 of the sorting device 200 through the wafer fixing assembly, and a vacuum action is performed to firmly absorb the wafer The assembly is fixed, so that the first image receiving module corresponding to the first object holder 110 or the second image receiving module corresponding to the second object holder 210 performs horizontal calibration and scanning on the first wafer.

S120, using the first mechanical arm to move and fix the first wafer on the second object holder, using the sorting device and the reclaiming arm to sort the first wafer, and sorting the second wafer according to the preset sorting rules Chips within a wafer are sorted into different standard tools.

In this embodiment, when the first wafer is placed on the second storage seat 210 of the sorting device 200 and ready to perform the sorting operation, the pick-up arm 800, according to the coordinate information of the wafer acquired by the central control system, The sorting operation is performed according to the artificially set sorting rules. When all the chips satisfying the same sorting rule in the first wafer are picked out, the standard tooling on the first carrying platform 310 will be picked up by the first robotic arm 600 Move to the second carrying platform 410, and then send it into the tool rack assembly 500 by the second robot arm 700 after alignment, and exchange for another standard tool to continue the work until the separation of all chips on the first wafer is completed. select.

The chip measurement and sorting method provided in this embodiment is executed by the chip measurement and sorting system provided in any of the above-mentioned embodiments of the present invention. Therefore, the implementation and beneficial effects are similar to the above-mentioned embodiments, and will not be repeated here. .

Optionally, in a possible implementation of the above-mentioned embodiment, the specific way of sorting only a single wafer is that the above S110 can be replaced by: fixing the first wafer on the first holding seat , scanning the position of the first wafer by the measuring device, acquiring the initial marking point of the first wafer to generate the coordinate information of the first wafer, and measuring the photoelectric performance of the first wafer to generate the first measurement information.

In this embodiment, only the chips in the first wafer are sorted, and the production capacity is not involved. The first wafer can be directly placed on the first storage seat 110, and the measurement device 100 executes the acquisition of position information. And the operation of generating the first measurement information reduces the number of times the first robot arm 600 moves the first wafer as much as possible.

In actual production, it is usually necessary to sort a large number of wafers. The specific implementation method is different from the above-mentioned sorting of single wafers. As shown in FIG. 10, it is another method provided by the embodiment of the present invention. A flow chart of the measurement and sorting method for a chip, on the basis of the method shown in the above-mentioned Figure 9, S110 includes:

S111, fix the first wafer on the second object holder, scan the position of the first wafer through the sorting device, acquire the initial marking point of the first wafer and generate the coordinate information of the first wafer, wherein the The coordinate information includes coordinate information of each chip in the first wafer.

S112, using the first mechanical arm to move and fix the first wafer on the first holder, and using the measurement module to measure the photoelectric properties of the first wafer, generate first measurement information, and fix the second wafer on the On the second object seat, scan the position of the second wafer, obtain the initial marking point of the second wafer and generate the coordinate information of the second wafer, wherein the coordinate information includes the coordinates of each chip in the second wafer information.

In this embodiment, after the coordinate information of the first wafer is obtained by the sorting device 200, the first robotic arm 600 is rotated from the positioning access device 400 to the sorting device 200, and the wafer fixing assembly is grasped by vacuum suction and moved To the first object seat 110 of the measurement device 100, the first object seat 110 starts the vacuum suction hole or the locking mechanism to fix the wafer fixing assembly. At this time, the first image receiving module located on the first object seat 110 can scan and find the initial marking point in the first wafer, and share the coordinate information obtained in the sorting device 200 .

It should be noted that, during the process of measuring the first wafer and scanning the position of the second wafer, the probe arm 131 rotates/moves from the initial position to the measurement position, and at the same time, the movable shading shutter is raised, The chips in the first wafer are measured according to preset parameters. It is worth mentioning that in the structure of the traditional measurement device, the wafer is adhered in the adhesive film and will not be stretched by the expansion ring. Adhesive film. In contrast, in the system provided by the above-mentioned embodiments of the present invention, based on the flow design of measurement and sorting, the compatibility of the measuring device 100 and the sorting device 200 with respect to the production tools must also be taken into account, and the measuring device 100 The first object holder 110 is designed to have the same structure as the second object holder 210 in the sorting device 200, therefore, the second object holder 210 can use the second fixed supporter 230 to support the bottom of the chip to match the wafer expansion ring 001 as Production tools, thereby reducing the waste of manpower and materials caused by the replacement of tools in the existing process from wafer measurement to sorting. Please refer to above-mentioned Fig. 3 and Fig. 5, the first fixed supporter 150 of measuring device 100 only has the vacuum suction hole 151 that surrounds a circle, when probe arm 131 wants to carry out measurement operation to certain chip, vacuum suction hole 151 absorbs and fixes the viscous film in a part of the area where the chip is located to prevent the chip from being moved during measurement, so that the probe 132 can accurately contact the chip surface. At the same time, the optical information of each chip is obtained by the light source collection module 140, and the first measurement information corresponding to the first wafer is formed by combining the coordinate information of each chip and the electrical information measured above.

The method provided in this embodiment further includes before S120: S113, using the first robot arm to move and fix the first wafer or the second wafer on the second carrier platform, so that the second wafer is moved and fixed on the second carrier platform. On a shelf. In this embodiment, multiple wafers need to be measured and sorted at the same time, that is, while the measurement device 100 is measuring the first wafer, a second wafer can be placed and sorted on the device 200 to complete the scanning. and get location information. The specific implementation is, for example, after the measurement device 100 finishes measuring the first wafer, the shading baffle falls, and the first robot arm 600 grabs and moves to the positioning access device 400 for buffering, and then grabs the second wafer. The second wafer is sent to the measuring device 100 to perform the measurement action, so that the first wafer is picked up again and sent to the sorting device 200, and the sorting operation is performed after scanning in the same manner as above to find the initial mark point.

Correspondingly, the method provided in this embodiment further includes: S130, measure the photoelectric properties of the second wafer by the measurement module, and generate second measurement information. It should be noted that this embodiment does not limit the execution steps of S120 and S130. FIG. 10 specifically shows that S120 is before S130. In specific implementations, they are usually executed simultaneously to increase production capacity.

S140, using the first mechanical arm to move and fix the second wafer on the second object holder, performing a sorting operation on the second wafer through the sorting device and the reclaiming rotary arm, and sorting the second wafer according to a preset sorting rule The chips in the two wafers are sorted into different standard tools.

In the specific implementation of this embodiment, after S112, it also includes: sending the coordinate information and the first measurement information of the first wafer to the central control system; correspondingly, the specific method of the sorting operation in S140 is: the central control system according to The coordinate information and the first measurement information of the first wafer are used to control the sorting device and the pick-up arm to sort the first wafer.

In this embodiment, whether it is sorting the first wafer or the sorting of the second wafer, it is necessary to select a standard tool in advance. In a specific implementation, a plurality of standard tools adhered with adhesive films are stored in the tool rack assembly 500, and each standard tool has an independent code so as to be identified and recorded by the sorting device 200, so as to be sorted according to the According to the measurement results of chip selection, the tool rack assembly 500 can move back and forth or up and down, so that the second mechanical arm 700 can extract the required standard tool and send it to the second carrying platform 410 of the positioning access device 400, and then the second carrying The platform 410 positions the standard tool to ensure the accuracy of the position when it is sent to the first carrying platform 310, and then the first robot arm 600 moves the standard tool to the first carrying platform 310 of the carrying device 300 . Similar to the above-mentioned steps, when the sorting operation of the first wafer is finished, a third wafer can be added and placed on the sorting device 200 for scanning to obtain position information. Let me repeat.

It should be noted that since the measurement process is usually complicated and the time required for measuring different parameters is also different, generally speaking, the time required for the measurement of the same wafer is slightly longer than the time required for sorting, so , in the chip measurement and sorting method provided in the embodiment, the time spent on loading and unloading each wafer, wafer scanning, and interface operations are all placed in the sorting device. In terms of operating time , realizing the matching between the measuring device and the sorting device, thereby maximally ensuring the production efficiency of the chip measuring and sorting method provided by the embodiment of the present invention.

Fig. 11 is a schematic diagram of a chip measurement and sorting method provided by an embodiment of the present invention. Compared with the operation process in the prior art shown in Fig. 1, it is obvious that using the chip measurement and sorting system provided by the embodiment of the present invention Finally, the steps of manual operation are greatly reduced, and at the same time, the consumption of materials caused in these redundant steps is reduced.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, rather than limiting them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: It is still possible to modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the various embodiments of the present invention. scope.

Claims (14)

1. A measuring and sorting system for chips, characterized in that it comprises: a measuring device, a sorting device, a carrying device, a positioning access device, a frame assembly, a first mechanical arm, a second mechanical arm, and a retrieving rotary arm and central control system; The measuring device is provided with a first object holder, and the sorting device is provided with a second object holder, and a central ring with the same diameter is provided in the first object holder and the second object holder, and is used to combine the same specifications. The wafer fixing assembly is fixed in the central ring, and the measuring device is used to scan and obtain the coordinate information of the wafer fixed in the wafer fixing assembly, and measure and record each The photoelectric characteristics of the chip; the sorting device is arranged adjacent to the measuring device, and is used to sort out the chips measured by the measuring device according to preset rules; The carrying device is arranged adjacent to the positioning access device, wherein the carrying device is provided with a first carrying platform, the positioning access device is provided with a second carrying platform, and the first carrying platform and The second carrying platform is used for carrying and positioning standard tooling, and the second carrying platform is also used for temporarily storing the wafer fixing assembly; The carrier device is also arranged adjacent to the sorting device, and the reclaiming arm is arranged between the carrier device and the sorting device, and is used for disposing of the wafer in the sorting device. When sorting the chips, arrange the chips picked out by the sorting device into the standard tools on the first carrying platform according to preset rules through the pick-up arm; The first mechanical arm is arranged at the central position of the measuring device, the sorting device, the carrying device and the positioning access device, and is used to grab and move the first storage seat, the second Wafer fixing components on two storage seats or the second carrying platform, and grabbing and moving the standard tools on the first carrying platform or the second carrying platform; The positioning access device is also arranged adjacent to the tool rack assembly, the standard tool is stored in the tool rack assembly, and the second mechanical arm is arranged between the positioning access device and the tool rack assembly. Between the tool rack components, it is used to grab standard tools from the tool rack components and place them on the second carrying platform of the positioning access device; The central control system is connected with the measuring device, the sorting device, the carrying device, the positioning access device, the first mechanical arm, the second mechanical arm and the reclaiming rotary arm respectively. The connection is used to control the various devices and components connected to it to perform corresponding operations, and is also used to analyze, process and access the data measured by the measuring device. 2. The measurement and sorting system of chips according to claim 1, wherein the measurement device is also provided with a first drive module, a chip measurement module, a light source acquisition module and a first image receiving module; The first drive module is connected to the bottom of the first storage base, so that the first storage base is driven by the first drive module to perform lateral, longitudinal and rotational movements; the measuring device is fixed with The first fixed supporter is specifically arranged at the bottom of the central ring of the first storage seat, wherein the top of the first fixed supporter is provided with a plurality of rings surrounding the edge of the first fixed supporter, And symmetrically distributed vacuum suction holes; The chip measurement module includes at least two probe arms and a probe arranged at the front end of each probe arm, wherein the probe arm is used for changing the working state of the chip measurement module. , move horizontally, move up and down or rotate around the bottom end of the probe arm; when the chip measurement module is used to move a plurality of the probes above the first fixed supporter, the The chip above the first fixed supporter is measured; the chip measurement module is provided with a current source for providing current to the chip to be tested; The light source acquisition module is arranged above the first fixed supporter, and is used to obtain the optical information of the chip when the chip measurement module measures the chip above the first fixed supporter; The first image receiving module is arranged above the first object seat, and includes a microscope and an image sensor, the microscope is used to display an enlarged image when receiving the image of the wafer, and the image sensor uses for extracting image information of the wafer. 3. The chip measurement and sorting system according to claim 1, wherein a second drive module and a second image receiving module are also arranged in the sorting device; The second drive module is connected to the bottom of the second object storage seat, so that the second object storage seat is driven by the second drive module to perform lateral, longitudinal and rotational movements; There is a second fixed supporter, which is specifically arranged at the bottom of the central ring of the second storage seat, wherein the top of the second fixed supporter is provided with a plurality of , and symmetrically distributed vacuum suction holes, the center of the second fixed supporter is also provided with a thimble through hole, which is used to push the inner thimble out of a preset distance under the drive of the second drive module; The second image receiving module is arranged above the second object seat and includes a microscope and an image sensor, the microscope is used to display an enlarged processed image when receiving the image of the wafer, and the image sensor is used for Image information of the wafer is extracted. 4. The chip measurement and sorting system according to claim 3, characterized in that, the edges of the first object holder and the second object holder are provided with vacuum suction holes or locking mechanisms for fixing the The wafer fixing assembly, wherein, the wafer fixing assembly is provided with a fixing lock for fixing the wafer expansion ring, and an adhesive film for fixing the wafer is adhered to the wafer expansion ring; The edge of the first carrying platform is provided with a vacuum suction hole or a locking mechanism for fixing the standard tool, wherein an adhesive film for storing chips is attached to the standard tool; The edges of the second carrying platform are provided with positioning claws for fixing and storing the wafer fixing assembly or the standard tooling. 5. The chip measurement and sorting system according to claim 4, characterized in that, the front end of the reclaiming arm is provided with a vacuum nozzle for moving the reclaiming arm to the sorting device. At this time, the thimble is pushed out in cooperation with the thimble through hole in the center of the second fixed supporter, pierces the viscous film on the wafer fixing assembly and ejects the chips to be sorted, so that the vacuum nozzle contacts and absorbs the chips to be sorted. the ejected chip, thereby moving the chip to the standard tool placed on the first carrying platform; Wherein, the first carrying platform is also used to move the unit cells of a predetermined distance in the horizontal or vertical direction after each reclaiming operation of the reclaiming arm, so that the reclaiming arm selects The chips were all adhered to the adhesive film of the standard tool. 6. The chip measurement and sorting system according to any one of claims 1 to 5, characterized in that, a light-shielding device is arranged between the measuring device and the sorting device, and the light-shielding device includes a light-shielding shield plate and a baffle drive module, the top of the shading baffle is located below the level of the first storage seat and the second storage seat, the baffle drive module is connected with the central control system for When the measuring device and/or the sorting device are in working condition, the shading baffle is raised to isolate the measuring device and the sorting device. 7. The chip measurement and sorting system according to any one of claims 1 to 5, wherein a third drive module and a third image receiving module are also arranged in the carrying device; The third driving module is connected to the bottom of the first carrying platform, so that the first carrying platform is driven by the third driving module to perform lateral, longitudinal and rotational movements; wherein, the first carrying platform The edge is provided with a locking mechanism for fixing the standard tool; The third image receiving module is arranged above the first carrying platform, the third image receiving module includes a microscope and an image sensor, and the microscope is used to display the image of the enlarged process when receiving the image of the wafer. image, the image sensor is used to extract the image information of the wafer. 8. The chip measurement and sorting system according to any one of claims 1 to 5, wherein the first robotic arm is configured with a first arm drive module for enabling the first robotic arm to perform 360-degree rotation and up and down movement to move above the measuring device, the sorting device, the carrying device or the positioning access device, the front end of the first mechanical arm is provided with a vacuum suction cup for firmly grasping the wafer holding assembly or the standard by vacuum suction; and/or, The second mechanical arm is configured with a second arm driving module, which is used to make the second mechanical arm rotate and move up and down, so as to move to the inside of the tool rack assembly and above the positioning access device, The front end of the second mechanical arm is provided with a vacuum suction cup for stably grasping the standard tool by vacuum adsorption. 9. The chip measurement and sorting system according to any one of claims 1 to 5, wherein the sorting device is also used to scan and acquire the coordinates of the wafer fixed in the wafer fixing assembly information, the central control system is also used to analyze, process and access the data measured by the sorting device. 10. The chip measurement and sorting system according to any one of claims 1 to 5, characterized in that, a fourth drive module is provided at the bottom of the tool rack assembly for making the tool rack assembly Move left and right and move up and down, wherein, there are multiple sets of "non"-shaped tool storage positions in the tool rack assembly, and the standard tools are specifically stored in the tool storage positions. 11. A chip measurement and sorting method, characterized in that the chip measurement and sorting system according to any one of claims 1 to 10 is used for measurement and analysis, said method comprising: Scanning the position of the first wafer to generate coordinate information of the first wafer, and measuring the photoelectric properties of the first wafer through the measurement module to generate first measurement information, wherein the coordinate information including coordinate information of each chip in the first wafer; The first wafer is moved and fixed on the second storage seat by the first robot arm, and the first wafer is sorted by the sorting device and the reclaiming rotary arm and sorting the chips in the first wafer into different standard tools according to a preset sorting rule. 12. The method according to claim 11, wherein the scanning of the position of the first wafer generates the coordinate information of each chip in the first wafer, and the measuring module is used to measure the coordinate information of each chip in the first wafer. Measuring the optoelectronic properties of the first wafer to generate the first measurement information, including: Fixing the first wafer on the first object seat, scanning the position of the first wafer by the measuring device, and obtaining initial marking points of the first wafer to generate the first wafer coordinate information of the first wafer, and measure the photoelectric properties of the first wafer to generate first measurement information. 13. The method according to claim 11, wherein the position scanning of the first wafer generates the coordinate information of the first wafer, and the first wafer is measured by the measurement module. Circle to measure the photoelectric performance and generate the first measurement information, including: Fixing the first wafer on the second object holder, scanning the position of the first wafer through the sorting device, acquiring the initial marking points of the first wafer and generating the first wafer Coordinate information of the circle; moving and fixing the first wafer on the first object holder by the first robot arm, measuring the photoelectric properties of the first wafer by the measurement module, and generating first measurement information, and fixing the second wafer on the second object holder, scanning the position of the second wafer, acquiring the initial marking point of the second wafer and generating the coordinate information of the second wafer, Wherein, the coordinate information includes coordinate information of each chip in the second wafer; Before moving and fixing the first wafer on the second storage seat by the first mechanical arm, it also includes: The first wafer or the second wafer is moved and fixed on the second carrying platform by the first robotic arm, so that the second wafer is moved and fixed on the first object seat; Then described method also comprises: measuring the photoelectric properties of the second wafer through the measurement module to generate second measurement information; The second wafer is moved and fixed on the second storage seat by the first robot arm, and the second wafer is sorted by the sorting device and the reclaiming rotary arm and sorting the chips in the second wafer into different standard tools according to a preset sorting rule. 14. The method according to any one of claims 11 to 13, wherein the position scanning of the first wafer is performed to generate the coordinate information of the first wafer, and the measurement module is used to measure the The measurement of the optoelectronic performance of the first wafer, after generating the first measurement information, also includes: sending the coordinate information of the first wafer and the first measurement information to the central control system; Then the sorting operation of the first wafer through the sorting device and the reclaiming rotary arm includes: The central control system controls the sorting device and the reclaiming arm to sort the first wafer according to the coordinate information of the first wafer and the first measurement information.