TW201601901A - Composite body, laminated body, electronic device, and the like - Google Patents

Abstract

An object of the present invention is to provide a composite body or the like which can suppress crack propagation to an effective region of a glass sheet when bending deformation or cutting of an end portion. The present invention relates to a composite characterized in that it comprises a glass piece and a specific resin layer; the resin layer has a thickness of 1 to 100 μm, and a Young's modulus in a specific region is 100 MPa or more, and is relative to the above The 180° peeling peel strength of the glass piece is 1 N/25 mm or more; further, the glass piece has a specific sacrificial groove.

Description

Composite body, laminated body, electronic device, and the like

The present invention relates to a composite body having a resin layer on a glass sheet, a laminate in which a second glass sheet is laminated on a resin of the composite, and an electronic device in which a glass piece is formed on a composite or a laminated glass sheet. Technical field.

In recent years, electronic devices (electronic devices) such as solar cells (PV (Photovoltaic)), liquid crystal panels (LCD), and organic EL panels (OLED (Organic Light Emitting Diode)) It is being thinned and lightened. As one of methods for realizing thinning or weight reduction of the electronic device, thinning of a substrate for an electronic device is underway.

Moreover, it is also expected to be practical to use a flexible electronic device by using a glass substrate (glass plate) of a thin plate.

However, the glass piece also has a case where the strength is insufficient and cracks (cracks) are generated at the time of bending deformation.

On the other hand, for example, Patent Document 1 proposes a composite in which a resin layer is bonded to a glass sheet. In the case of such a composite, even if the composite is bent and deformed to cause tensile stress on the surface of the glass sheet adjacent to the resin layer, the tensile stress can be reduced by the resin layer, thereby suppressing cracking of the glass piece.

Prior technical literature Patent literature

Patent Document 1: International Publication No. 2012/166343

However, according to the study by the inventors of the present invention, even in the case of a composite, there is a case where a sufficient strength improving effect cannot be obtained at or near the end portion of the glass sheet.

The combination of the resin layer and the glass sheet improves the strength in the plane of the glass sheet. However, the resin layer is not formed at the end of the main surface of the glass sheet, and the end portion is exposed. Therefore, even in the case of a composite, the strength of the end portion of the glass piece or its vicinity cannot be sufficiently improved. Further, since the end portion of the glass piece is exposed, it is easy to generate pieces or the like which are the starting points of the crack when the operation or the like is performed. Further, although the processing method (cutting method) is largely affected, the strength of the glass sheet at the end portion or its vicinity is lower than the in-plane.

Therefore, if the composite is bent and deformed, cracks are likely to occur at or near the end portion of the glass piece. If a crack is generated at or near the end, the crack spreads to the inside of the glass sheet depending on the stress received. If the crack spreads to the effective area in the plane of the glass sheet, it becomes a defect.

Although chamfering is performed to prevent such a crack at the end portion or the vicinity thereof, it is difficult to sufficiently prevent cracks at the end portion or the vicinity thereof even if chamfering is performed.

Moreover, in the case where the glass piece is thin, it is difficult to perform chamfering itself.

It is an object of the present invention to address the problems of this prior art. That is, an object of the present invention is to provide a composite body and a laminate, and an electronic device using the composite or laminate, wherein the composite layer is formed by bonding a resin layer to a glass sheet, and the laminate system is followed by the composite layer. When the glass piece is formed, cracks are generated at or near the end portion of the glass piece by bending deformation or cutting of the end portion, and the crack can be prevented from expanding to the effective area in the glass surface.

In order to achieve such an object, the gist of the present invention relates to the following <1> to <9>.

<1> A composite comprising a glass sheet and a resin layer on one side of the glass sheet; the resin layer having a thickness of 1 to 100 μm and a distance from the glass sheet along the normal direction thereof The Young's modulus in the region of the interface of 0 to 0.5 μm is 100 MPa or more, and the peeling strength with respect to 180° peeling of the glass sheet is 1 N/25 mm or more; further, the glass sheet is at least adhered to the resin layer The face has a sacrificial groove extending along the end of the glass sheet.

<2> The composite according to the above <1>, wherein the glass piece has two of the sacrificial grooves extending in the same direction and an effective area between the two sacrificial grooves, and further has a second inner side of the effective area The effective region and the inner side of the effective region and the second sacrificial groove extending along the end of the second effective region on the outer side of the second effective region.

<3> The composite according to the above <1> or <2>, which has a groove that does not penetrate the glass piece as the sacrificial groove.

The composite according to any one of the above items <1> to <3>, which has a through groove penetrating through the glass sheet as the sacrificial groove.

<5> A laminate in which the second glass sheet is bonded to the resin layer of the composite according to any one of the above <1> to <4>.

<6> An electronic device having an element on the surface of the glass piece of the composite according to any one of the above <1> to <4> or the glass piece of the laminated body of the above <5>.

<7> A method for producing a composite characterized in that a sacrificial groove extending along an end portion of a glass piece is formed, and a peeling strength of 180° peeling is 1 N/25 mm on a surface of the glass piece on which a sacrificial groove is formed. The above-mentioned adhesive force forms a resin layer having a thickness of 1 to 100 μm, and a Young's modulus of a region in which the distance between the normal direction of the resin layer and the interface of the glass sheet is 0 to 0.5 μm is 100 MPa or more.

<8> A method for producing a laminate, which is a resin layer in which a second glass sheet is laminated and then a composite obtained by the production method of the above <7>.

<9> A method for producing an electronic device, which is a glass sheet forming member of a composite body obtained by the production method of the above <7> or a laminate obtained by the production method of the above <8> .

According to the present invention, in the laminate in which the glass sheet is followed by the resin layer and the laminate in which the composite volume layer is formed, the glass sheet has a resin layer and a specific sacrificial groove, whereby even bending deformation or end is performed. Cracks may be generated at or near the end portions of the glass sheets by cutting or the like, and at least the bonding surface with the resin layer may suppress crack propagation to the effective region inside the glass sheet.

Therefore, according to the present invention, an appropriate composite body and a laminated body which do not have the defects of the crack of the glass piece, and an electronic device which forms the element with the composite body or the laminated body can be obtained.

10, 10a, 10b, 10c, 33, 40‧‧‧ complex

12, 35‧‧ ‧ glass piece

14, 36‧‧‧ resin layer

16, 20, 24a, 24b, 26a, 26b, 38‧‧‧ sacrificial slots

30‧‧‧Processed substrate

30R‧‧‧Reprocessed substrate reel

32‧‧‧resist layer forming device

34‧‧‧Processed substrate

34R‧‧‧Processed substrate roll

50‧‧‧Layered body

52‧‧‧2nd glass piece

42a, 42b, 42c, 42d, 42e, 42f‧‧‧2nd sacrificial trough

a~f‧‧‧2nd effective area

A‧‧‧ end

1(A) and 1(B) are conceptual views showing an example of a composite of the present invention, and Fig. 1(A) is a side view, and Fig. 1(B) is a plan view.

2(A) to 2(C) are conceptual views showing other examples of the composite of the present invention.

3(A) and (B) are conceptual views for explaining other examples of the composite of the present invention.

Fig. 4 is a side view conceptually showing an example of a laminate of the present invention.

Fig. 5 is a plan view conceptually showing another example of the composite of the present invention.

Hereinafter, the composite, the laminate, the electronic device, and the like of the present invention will be described in detail based on preferred examples shown in the accompanying drawings. In addition, in the present specification, "% by weight" and "% by mass", "parts by weight" and "parts by mass" are respectively synonymous.

1(A) and (B) conceptually represent the hair manufactured by the manufacturing method of the present invention An example of a complex of the Ming. 1(A) is a side view (view of the surface of the autonomous surface), and FIG. 1(B) is a plan view (viewed from a direction orthogonal to the main surface). In addition, FIG. 1(B) is a view of the composite body 10 viewed from the upper side (the resin layer 14 side) of FIG. 1(A).

As shown in FIGS. 1(A) and (B), the composite 10 has a glass sheet 12 and a resin layer 14 formed on one surface (one main surface (surface)) of the glass sheet 12. Further, four sacrificial grooves 16 extending along the end portion of the glass piece 12 are formed on the surface of the glass sheet 12 opposed to the resin layer 14.

As the glass which becomes the glass piece 12 of the board|substrate (substrate) of the composite 10, the well-known various glass can be utilized. Specifically, soda lime glass, alkali-free glass, etc. are illustrated. Further, the glass sheet 12 can be produced by a known method such as a float method, a melting method, or a re-drawing method.

The thickness of the glass piece 12 may be a thickness corresponding to the use of the composite 10 (the laminated body 50).

Here, as an example, the composite 10 of the present invention is used for the manufacture of electronic devices such as a solar cell (PV), a liquid crystal panel (LCD), and an organic EL panel (OLED). These electronic devices are required to be thinned or lightened. In order to reduce the thickness or weight of the electronic device, it is advantageous that the glass piece 12 is thinner.

Further, as will be described hereinafter, the composite body 10 of the present invention can suppress the crack generated at the end portion or its vicinity from being expanded into the surface even when the glass sheet 12 is thin. region. That is, the composite 10 of the present invention can be preferably used for applications requiring flexibility such as a substrate of a flexible OLED.

In consideration of the above, the thickness of the glass piece 12 is preferably 100 μm or less, more preferably 75 μm or less, and still more preferably 50 μm or less.

Further, the thickness of the glass sheet 12 may be equal to or greater than the thickness of the composite 10 as long as it is sufficient to ensure the required strength.

Specifically, the thickness of the glass piece 12 is preferably 1 μm or more, and more preferably 10 μm or more.

The glass sheet 12 may also form a tree for the purpose of improving the adhesion of the resin layer 14 or the like. The surface of the resin layer 14 is surface-treated before the lipid layer 14 is applied.

As the surface treatment, a primer treatment, an ozone treatment, a plasma etching treatment, or the like can be exemplified. As the primer, a decane coupling agent can be exemplified. Examples of the decane coupling agent include amino decanes, epoxy decanes, alkoxy decanes, and decazanes.

In the composite body 10 of the present invention, in the vicinity of the opposite side of the glass layer 12 and the resin layer 14 (the surface of the resin layer 14), in the vicinity of the four sides of the rectangular glass piece 12, the same as each side. Four sacrificial grooves 16 are formed extending in the direction, that is, along the ends of the glass piece 12. Therefore, in Fig. 1(A), the two sacrificial grooves 16 shown extend in a direction perpendicular to the plane of the paper, and the remaining two sacrificial grooves (not shown) extend in the lateral direction of the sheet.

The sacrificial groove 16 is formed in a groove on the outer side of the effective region of the glass piece 12 which is appropriately set according to the use of the composite 10. That is, in FIG. 1(B), the outer side of the four sacrificial grooves 16 of the glass piece 12 is an ineffective area, and an effective area is set inside the area surrounded by the four sacrificial grooves 16.

The effective region is, for example, a formation region of an element (device) in the manufacture of an electronic device using the composite 10 as a mother board. Therefore, a plurality of elements corresponding to one electronic device are formed independently of each other in the effective area.

The composite 10 of the present invention comprises: a glass piece 12; a sacrificial groove 16 formed in the glass piece 12; and a resin layer 14 formed on the glass piece 12 by a peeling strength of 180° peeling force of 1 N/25 mm or more. At least the surface of the sacrificial groove 16 is formed to have a thickness of 1 to 100 μm, and a Young's modulus in a region where the distance between the normal direction and the interface of the glass piece 12 is 0 to 0.5 μm is 100 MPa or more.

When the composite body 10 of the present invention has the sacrificial groove 16 and the resin layer 14, in the case of bending deformation or the case of being cut, cracks (cracks) occur even at or near the end portion of the glass piece 12. The expansion of the crack (advance) can also be suppressed by the sacrificial groove 16. Therefore, even if a crack occurs at the end portion or the vicinity thereof, the composite 10 can suppress the crack from spreading to the effective region of the glass piece 12 and become a defect.

As described above, the composite body formed by forming the resin layer 14 on the surface of the glass sheet 12 can prevent cracks from occurring in the glass sheet 12 due to bending deformation of the composite body or the like.

However, there is a case where the resin layer 14 is not formed near the end portion of the main surface of the glass sheet 12, and the strength of the end portion of the glass sheet 12 or its vicinity is lower than the in-plane.

Therefore, when the composite is bent and deformed, the end portion is cut, and cracks are likely to occur at or near the end portion. If a crack is generated at or near the end, the crack spreads to the inside of the glass sheet depending on the stress received. If the crack spreads to the effective area in the plane of the glass sheet, it becomes a defect.

On the other hand, the composite body 10 of the present invention has the resin layer 14 having a specific rigidity and thickness, and is formed on the main surface of the glass sheet 12 with a specific adhesive force, and is opposed to the resin layer 14 in the glass sheet 12. The face (which is next to the surface of the resin layer 14) has a sacrificial groove 16 on the outer side of the effective area.

Therefore, when the composite body 10 is bent and deformed so that the resin layer 14 side is convex, even if a crack is generated at the end portion or the vicinity thereof and the crack spreads toward the inner surface side, the sacrificial groove 16 can be utilized. The suppression of the propagation of the crack generated and the suppression of the expansion of the crack generated by the resin layer 14 suppress the propagation of the crack at the position of the sacrificial groove 16 (the expansion of the crack can be cut by the sacrificial groove 16). Therefore, the composite body 10 of the present invention can suppress the crack at the end portion or its vicinity from expanding to the effective region of the glass sheet 12 to become a defect.

As described above, the sacrificial grooves 16 are formed on the outer side of the effective area of the glass sheet 12.

Further, in the composite 10 shown in FIGS. 1(A) and (B), all the sacrificial grooves 16 corresponding to the four sides of the glass piece 12 are formed to extend along the entire region of the glass piece 12 (formed in a lattice shape). In addition to this, various configurations can be utilized. For example, the sacrificial groove may be formed in a rectangular shape surrounding the effective area. Alternatively, a sacrificial groove extending along the entire area of the glass sheet 12 and a sacrificial groove at the end where the other sacrificial groove intersects may be mixed.

Further, in terms of setting the effective area wider, the formation position of the sacrificial groove 16 is preferably close to the end of the glass piece 12.

The width of the sacrificial groove 16 may be appropriately set in accordance with the thickness of the glass piece 12, the size of the main surface, the material to be formed, and the like to suppress the spread of the crack.

According to the study by the inventors of the present invention, the width of the sacrificial groove 16 is preferably 100 μm or less, more preferably 10 μm or less. Further, as long as the sacrificial groove 16 has a width (opening) of an atomic order or more, a sufficient effect can be obtained. Specifically, the width of the sacrificial groove 16 may be 1 nm or more.

By setting the width of the sacrificial groove 16 to the above range, it is preferable to suppress the crack growth of the glass piece 12, and it is preferable to prevent cracking of the glass piece 12 starting from the sacrificial groove 16 and the like.

The depth of the sacrificial groove 16 may be appropriately set to a width that suppresses the expansion of the crack depending on the thickness of the glass piece 12, the material to be formed, the required strength, and the like.

According to the study by the inventors of the present invention, the depth of the sacrificial groove 16 is preferably 5 μm or more, and more preferably 10 μm or more.

By setting the depth of the sacrificial groove 16 to 5 μm or more, it is preferable to suppress the crack growth of the glass piece 12 and the like.

Furthermore, there is no upper limit to the depth of the sacrificial groove. That is, as in the sacrificial groove 20 of the composite 10a conceptually shown in FIG. 2(A), the sacrificial groove may be a through groove penetrating the glass piece 12.

In general, the components constituting the electronic device are formed on the surface of the glass sheet 12. Therefore, as in the sacrificial groove 16 shown in Fig. 1(A), the gas barrier effect by the glass piece 12 for the element constituting the electronic device can be obtained by the sacrificial groove 16 which does not penetrate the glass piece 12.

On the other hand, as in the sacrificial groove 20 shown in FIG. 2(A), the sacrificial groove formed by penetrating the glass piece 12 is not only bent and deformed so that the side of the resin layer 14 is convex, and Even if the composite body 10a is bent and deformed so that the resin layer 14 side is concave, cracks are generated at the end portion or the vicinity thereof, and the cracks spread toward the inner surface side, and the crack propagation can be suppressed at the position of the sacrificial groove 20.

Further, the sacrificial groove can be configured in various forms.

2(B) and (C) are forms in which the sacrificial grooves of the depth of the glass sheet 12 are not formed on both surfaces of the glass sheet 12.

2(B) shows a form in which the sacrificial groove 24a is formed on one surface of the glass piece 12, the sacrificial groove 24b is formed on the other side of the glass piece 12, and the sacrificial grooves extending in the depth direction are not connected to each other. The position of the sacrificial slot is slightly staggered.

Fig. 2(C) shows a form in which the sacrificial groove 26a is formed on one surface of the glass piece 12, and the sacrificial groove 26b is formed on the other surface of the glass piece 12, and the sacrificial groove 26a and the sacrificial groove 26b are formed when the glass piece 12 is viewed from above. The same location. Wherein, the depth of each groove is set to be shallow so that the sacrificial groove 26a and the sacrificial groove 26b are not connected.

Further, as the sacrificial groove, a groove and a through groove that do not penetrate the glass piece 12 may be mixed.

Furthermore, the surface of the glass sheet 12 on the side where the resin layer 14 is not formed is the electronic device of the present invention, in the case where the resin layer 14 is formed only on one side of the glass sheet 12, with or without a sacrificial groove. The surface on which the element is formed is usually covered with an interlayer insulating film, a protective film, or the like in a state of being an electronic device.

The composite 10 shown in Figs. 1(A) and (B) is formed with a sacrificial groove 16 corresponding to all four sides of the rectangular glass piece 12.

However, in the composite of the present invention, the sacrificial groove may be formed at least corresponding to one side of the glass piece 12 and extending along the side (end portion) in the same direction as the side. In other words, the composite body (layered body) of the present invention may have one or more sacrificial grooves extending along the end portion of the glass piece. As long as there are one or more sacrificial grooves extending along the end portions of the glass sheets, it is possible to prevent cracks generated from the end portions or the vicinity thereof from expanding toward the inner side of the sacrificial grooves (on the side opposite to the end portion where the cracks are generated).

Further, the sacrificial grooves do not necessarily need to be parallel to the ends (edges) of the glass sheets.

In the composite of the present invention, the sacrificial grooves preferably correspond at least to the pair of glass sheets 12. It is formed on both sides (one opposite side) and extends in the same direction as the side.

For example, when the composite body 10 is used for the purpose of bending only in the longitudinal direction (the upper and lower directions in FIG. 1(B)) (the apex is extended in the short side direction and curved), it may have only the following figure. In the upper and lower directions of 1 (B) (in FIG. 1(A), two sacrificial grooves 16 extending in a direction orthogonal to the plane of the paper). On the other hand, when the composite body 10 is used for the purpose of bending only in the short-side direction (the lateral direction of FIG. 1), it is also possible to have only two sacrificial grooves 16 extending in the lateral direction in FIG. 1(B). .

Moreover, the composite of the present invention can also be used for the production of an electronic device using a so-called roll-to-roll (hereinafter referred to as RtoR).

RtoR is a manufacturing method in which a long substrate to be processed is wound into a roll, and the substrate to be processed is sent out from the roll, and is transported while being transported in the longitudinal direction to perform a specific process, and the process is terminated. The substrate is wound into a roll shape. For example, as shown in FIG. 3(A), the substrate to be processed 30R obtained by winding a long substrate to be processed 30 into a roll shape is sent out from the substrate 30 to be processed. In the side direction (the direction of the arrow in FIG. 3(A)), the resist layer forming device 32 continuously applies and dries the resist liquid (or further heat treatment) to form a resist layer, and The substrate 34 on which the treatment for forming the resist layer is completed is wound into a roll shape to form a substrate roll 34R in which the treatment is completed.

As shown conceptually in Fig. 3(B), the composite 33 of the present invention having a length corresponding to such RtoR is oriented in the width direction of the opposing faces of the glass sheet 35 and the resin layer 36 (orthogonal to the longitudinal direction) The two outer sides of the effective area on the upper side have a sacrificial groove 38 extending in the longitudinal direction.

In RtoR, a stress which is stretched in the longitudinal direction is applied to the wound composite. However, since the two outer sides in the width direction of the effective region have the sacrificial grooves 38 extending in the longitudinal direction, even if cracks are generated at or near the end portions of the glass sheets due to the stress, and the inner surface is expanded, sacrifice can be sacrificed. The expansion at the groove 38 is suppressed, so that the crack can be suppressed from reaching the effective region existing inside the sacrificial groove 38.

Furthermore, when the composite of the present invention is used in the case of manufacturing using RtoR, In the case where there are known effective regions in the longitudinal direction, in addition to the formation of the sacrificial grooves 38 on both sides in the width direction, the sacrificial grooves extending in the width direction may be formed at intervals in the longitudinal direction corresponding to the respective effective regions. The grooves form a sacrificial groove in such a manner as to surround each effective area.

In the composite body 10 of the present invention, the method of forming the sacrificial grooves can be carried out by a known method of forming grooves in various sheets of glass.

As a method of forming the sacrificial groove, as an example, various methods of forming a scribe line using a glass cutter such as a wheel cutter, a method of forming a scribe line by a laser beam, and the like can be used to cut the scribe line of the glass. method.

Here, the higher the strength of the sacrificial groove (the wall of the sacrificial groove), the better the effect of the expansion stop of the crack generated by the sacrificial groove can be obtained. That is, the smaller the number of fragments or minute cracks of the sacrificial groove, the higher the effect of suppressing the crack growth by the sacrificial groove.

Therefore, the sacrificial grooves are preferably formed by a method of obtaining a less-strength and higher-strength sacrificial groove such as chips or minute cracks.

As an example, the method described in International Publication No. 2003/013816 can be exemplified. The sacrificial groove is formed by continuously irradiating the laser beam along a sacrificial groove to be formed to form a laser beam spot below the softening point of the glass sheet 12, while following the sacrifice of the laser beam spot to be formed. The trough is cooled, and the side of the laser beam spot near the cooling position is set to the maximum energy intensity to form a sacrificial groove.

As another method, a method of forming a sacrificial groove by using a laser beam of an ultrashort pulse having a short pulse width, a method of forming a sacrificial groove by melting a glass piece by a laser beam, and the like can be exemplified.

A resin layer 14 is formed on the surface (main surface) of the glass piece 12.

As described above, the sacrificial grooves are formed at least on the opposite side of the glass sheet 12 from the resin layer 14. In other words, the resin layer 14 is formed at least on the formation surface of the sacrificial groove of the glass piece 12.

Furthermore, the composite system shown in FIGS. 1(A) and (B) and the like is provided only on one side of the glass sheet 12. There is a resin layer 14, but in the composite of the present invention, the resin layer 14 may be provided on both sides of the glass sheet 12. In this case, a sacrificial groove is formed on both sides of the glass piece 12.

The resin layer 14 is a layer (film) containing various resin materials. Further, in the composite body shown in Fig. 1 (A) and (B), the resin layer 14 is formed in one layer, but the resin layer 14 can have a plurality of layers as long as the total thickness is 1 to 100 μm. form. Further, when the resin layer 14 is formed of a plurality of layers, all of the layers may be formed of the same material, or a layer containing different materials may be mixed. Further, when the resin layer 14 is formed in a plurality of layers, the thickness of each layer may be the same or different.

Further, the composite system shown in FIGS. 1(A) and (B) and the like has the resin layer 14 formed on the entire surface of the glass sheet 12, but as long as it has a sufficient area corresponding to the size or shape of the composite to be produced, The resin layer 14 may not be formed on the entire surface of the glass sheet 12.

However, in the composite of the present invention, even when the resin layer 14 does not cover the entire surface of the glass sheet 12, the resin layer 14 is necessarily formed to cover the sacrificial grooves, thereby suppressing crack propagation to the effective region and becoming defect.

Here, in the composite body 10 of the present invention, the thickness of the resin layer 14 is 1 to 100 μm, and the Young's modulus in the region where the distance between the normal direction and the interface of the glass sheet 12 is 0 to 0.5 μm is More than 100MPa. Further, the resin layer 14 is adhered to the surface of the glass piece 12 with a peeling strength of 180° peeling of 1 N/25 mm or more.

As described above, the composite body 10 of the present invention has the resin layer 14 formed by the sacrificial groove of the glass sheet 12, and the composite body 10 is bent and deformed when the resin layer 14 is convex, even in the glass sheet 12. Cracks are generated in the end portion or in the vicinity thereof, and the crack spreads toward the inner surface side. Further, since the resin layer 14 suppresses the expansion of the crack, the sacrificial groove 16 is further provided, whereby the crack propagation can be suppressed.

When the thickness of the resin layer 14 is less than 1 μm, the effect of having the resin layer 14 cannot be obtained, and there is a problem that cracks generated at or near the end portion of the glass sheet 12 extend beyond the sacrificial groove to the inner surface. , or the resin layer 14 is also cracked from the end or its vicinity The travel of the grain is simultaneously broken and separated.

In addition, when the thickness of the resin layer 14 exceeds 100 μm, there is a problem that the composite 10 having good flexibility cannot be obtained, or it is difficult to cope with thinning or weight reduction.

Moreover, the thickness of the resin layer 14 is preferably 10 to 50 μm in terms of the composite 10 having better expansion and stopping effect by the use of the sacrificial groove and having good flexibility.

The distance between the normal direction of the resin layer 14 (the direction orthogonal to the interface) and the distance from the interface of the glass piece 12 is 0 to 0.5 μm (that is, the area of the glass piece 12 side having a thickness of 0.5 μm or less). The modulus (hereinafter, also referred to simply as "the Young's modulus of the resin layer 14") is 100 MPa or more.

When the Young's modulus of the resin layer 14 is less than 100 MPa, there is a problem that a crack generated at or near the end of the glass piece 12 spreads over the sacrificial groove to the inner surface, or the resin layer 14 also The progress of the crack from the end portion or its vicinity is simultaneously broken and separated.

The Young's modulus of the resin layer 14 is preferably 1000 MPa or more in terms of improving the effect of suppressing the crack generated by the sacrificial groove.

The upper limit of the Young's modulus of the resin layer 14 is not limited. Here, the Young's modulus of the resin layer 14 is preferably 50,000 MPa or less, and more preferably 10,000 MPa or less, in consideration of not reducing flexibility (not improving bending rigidity).

The Young's modulus of the resin layer 14 may be measured by a method in accordance with JIS K 7127 (1999).

Further, when the resin layer 14 (the region having a thickness of 0.5 μm or less on the side of the glass piece 12) contains a plurality of (n) layers, the Young's modulus E (Young's modulus E) of the resin layer 14 is utilized. Equation (1) can be calculated.

E=Σ(E _k ×I _k )/I‧‧‧(1)

E _k : Young's modulus of the material of the kth layer

I _k : the second moment of the section of the kth layer

k: an integer from 1 to n

I: the second moment of the section in the region of the glass sheet 12 in the resin layer 14 having a thickness of 0 to 0.5 μm

According to the formula (1), even in the case where the resin layer 14 is followed by the glass sheet 12 by the adhesive and the adhesive is softer than the resin layer 14, as long as the thickness of the adhesive layer is sufficiently thin (for example, When the thickness is 100 nm or less, the Young's modulus of the resin layer 14 is also 100 MPa or more.

In the manufacturing method of the present invention, the resin layer 14 is adhered to the glass sheet 12 by a peeling strength of 180° peeling force of 1 N/25 mm or more (hereinafter, simply referred to as “adhesion force of the resin layer 14”).

If the adhesion force of the resin layer 14 is less than 1 N/25 mm, there is a problem that a crack generated at or near the end portion of the glass piece 12 spreads over the sacrificial groove to the inner surface or around the sacrificial groove. The peeling of the resin layer 14 is produced.

The adhesion of the resin layer 14 is preferably 3 N/25 mm or more, and more preferably 5 N/25 mm or more, in terms of obtaining the effect of expanding the crack generated by the sacrificial groove.

Further, the upper limit of the adhesion of the resin layer 14 is not limited.

Further, the adhesion force of the resin layer 14 (peel strength of 180° peeling) may be measured in accordance with JIS K 6854 (1999).

The resin layer 14 may contain various known resin materials (polymer materials). For example, it may be any of a thermoplastic resin and a thermosetting resin.

Examples of the thermosetting resin include polyimine (PI), epoxy (EP), and the like.

As the thermoplastic resin, polydecylamine (PA), polyamidoximine (PAI), polyetheretherketone (PEEK), polybenzimidazole (PBI), and polyethylene terephthalate (PET) can be exemplified. , polyethylene naphthalate (PEN), polyether oxime (PES), cyclic polyolefin (COP), polycarbonate (PC), polyvinyl chloride (PVC), polyethylene (PE), polypropylene (PP), acrylic acid (PMMA), urethane (PU), and the like.

Further, the resin layer 14 may contain a photocurable resin, or may be a copolymer or a mixture.

The manufacturing steps of the electronic device using the composite 10 (the laminated body 50) include the case of the step accompanying the heat treatment. Therefore, the heat resistant temperature (temperature at which continuous use) of the resin material forming the resin layer 14 is preferably 100 ° C or higher.

Examples of the resin having a heat resistance temperature of 100 ° C or higher include polyimine (PI), epoxy (EP), polyamine (PA), polyamidimide (PAI), and polyether ether ketone (PEEK). , polybenzimidazole (PBI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyether oxime (PES), cyclic polyolefin (COP), polycarbonate (PC), polyvinyl chloride (PVC), acrylic acid (PMMA), urethane (PU), and the like.

The resin layer 14 may be formed only of a resin material, or may contain a filler or the like.

Examples of the filler include non-fibrous fillers such as fibers, plates, scalys, granules, indefinite shapes, and crushed products.

Specific examples thereof include glass fibers, PAN (Polyacrylonitrile) or pitch-based carbon fibers, stainless steel fibers, metal fibers such as aluminum fibers or brass fibers, organic fibers such as aromatic polyamide fibers, and gypsum fibers. , ceramic fiber, asbestos fiber, zirconia fiber, alumina fiber, cerium oxide fiber, titanium oxide fiber, strontium carbide fiber, rock wool, potassium titanate whisker, barium titanate whisker, aluminum borate whisker, nitriding矽 whiskers, mica, talc, kaolinite, cerium oxide, calcium carbonate, glass beads, glass flakes, glass microspheres, clay, molybdenum disulfide, ash, titanium oxide, zinc oxide, calcium polyphosphate, metal powder , metal foil, metal strip, metal oxide, carbon powder, graphite, carbon flakes, scaly carbon, carbon nanotubes, etc. Specific examples of the metal powder, the metal foil, and the metal species of the metal strip include silver, nickel, copper, zinc, aluminum, stainless steel, iron, brass, chromium, tin, and the like. The type of the glass fiber or the carbon fiber is not particularly limited as long as it is generally used for reinforcing the resin, and for example, it can be chopped strand or ground from a long fiber type or a short fiber type. Select and use in fibers and the like. Further, the resin layer 14 may also include a woven fabric impregnated with a resin, a nonwoven fabric, or the like.

Further, the resin forming the resin layer 14 may be infiltrated into the sacrificial groove to completely fill the sacrificial groove, or may be infiltrated into the sacrificial groove to partially fill one of the sacrificial grooves, or may not penetrate into the sacrificial groove at all.

The resin layer 14 may be formed by a known method corresponding to the material for forming the resin layer 14.

For example, the resin layer 14 may be formed by applying a liquid composition (coating material) containing a component which is a component of the resin layer 14 to the surface of the glass sheet 12 on which the sacrificial groove is formed and hardened.

Alternatively, the resin layer 14 may be formed by attaching a resin film (resin sheet) serving as the resin layer 14 to the surface of the glass sheet 12 on which the sacrificial grooves are formed. The resin film to be the resin layer 14 may be subjected to a known method corresponding to the material for forming the resin layer 14 by pressure bonding, thermocompression bonding, pressure reduction heating, pressure bonding or the like.

Further, when the resin film is attached to the glass sheet 12 to form the resin layer 14, the resin film may be attached to the glass sheet 12 by using an adhesive as needed. Further, in this case, the adhesive layer is also regarded as a part of the resin layer 14, and as the resin layer 14 including a plurality of layers including the adhesive layer, it is necessary to satisfy conditions such as Young's modulus.

Further, in the resin layer 14, a layer (film) including a precursor of a resin material serving as the resin layer 14 may be formed on the surface of the glass sheet 12, and heat treatment, electron beam irradiation, and ultraviolet irradiation may be applied to the layer including the precursor. The treatment is carried out to thereby form the resin layer 14 containing the target resin material. Furthermore, in the method of forming the resin layer 14, the layer containing the precursor may be formed by applying, drying (or further curing) the liquid composition on the surface of the glass sheet 12, or may be formed. The film is attached to the surface of the glass sheet 12 (and an adhesive may be used as needed).

An example of a laminate of the present invention is conceptually shown in FIG.

The laminated body 50 of the present invention shown in FIG. 4 is formed by laminating the second glass sheet 52 and then adhering to the resin layer 14 including the composite 10 of the glass sheet 12 and the resin layer 14. That is, the laminated body 50 is a laminated body of the composite 10.

In the laminated body 50, the glass of the second glass piece 52 can be produced by a known method by using various known glasses in the same manner as the above-mentioned glass piece 12.

In the case where the laminated body 50 to be produced is used for the purpose of performing a heating step such as heat treatment, the second glass sheet 52 preferably contains a material having a small difference from the linear expansion coefficient of the glass sheet 12, More preferably, it contains the same material as the glass piece 12.

The thickness of the second glass piece 52 may be a thickness corresponding to the use of the laminated body 50 to be produced. Therefore, the thickness of the second glass piece 52 can be the same as that of the glass piece 12, and can be thinner or thicker than the glass piece 12.

As an example, the laminated body 50 is used for manufacturing an electronic device such as a PV, an LCD, or an OLED in which the composite 10 (glass piece 12) is used as a substrate (a substrate (element substrate) in which components are formed). At this time, the second glass piece 52 supports the composite 10 in which the element can be formed on the glass piece 12, and functions as a support substrate (carrier substrate) that can be appropriately operated. Therefore, at this time, the thickness of the second glass piece 52 is preferably 0.2 to 1 mm, more preferably 0.4 to 0.7 mm.

In the laminated body 50, a method of adhering the second glass piece 52 to the resin layer 14 of the composite 10 can be carried out by various known methods in accordance with the material for forming the resin layer 14.

As an example, a method using an adhesive, a method using pressure bonding, a method using thermocompression bonding, a method using pressure reduction under pressure reduction, and the like can be exemplified.

In addition, the second glass sheet 52 may be subjected to surface treatment before laminating the resin layer 14 for the purpose of improving adhesion or the like. As the surface treatment of the second glass piece 52, various surface treatments exemplified above in the description of the glass piece 12 can be exemplified.

In the case where the laminated body 50 is used for manufacturing an OLED or the like, when the second glass piece 52 is used as a supporting substrate, the second glass piece 52 is finally peeled off from the resin layer 14.

Therefore, in this case, the resin layer 14 and the second glass sheet 52 can also be sufficiently ensured. Then, the force can be followed by peeling off the resin layer 14 and the second glass sheet 52 as needed.

The composite 10 (the laminate 50 shown in Fig. 4) shown in Figs. 1(A) and (B) is formed with a sacrificial groove 16 on the outer side of the effective region corresponding to the effective region set on the inner surface of the glass sheet 12. .

The composite of the present invention may be disposed in an effective region of the inner surface of the glass sheet 12, and further set a plurality or a plurality of second effective regions corresponding to the formation regions of the respective electronic devices (the elements thereof), and corresponding to the first At least one of the 2 effective regions forms a second sacrificial groove on the surface on which the sacrificial grooves 16 are formed.

A plan view of an example thereof is shown in Fig. 5 .

Similarly to the composite 10, the composite 40 shown in FIG. 5 is formed by laminating a resin layer 14 on a glass sheet 12. Further, similarly to the composite 10, a sacrificial groove 16 is formed on the outer surface of the glass sheet 12 opposite to the resin layer 14 on the outer side of the effective region.

In the composite body 40, six second effective regions a to f indicated by a one-dot chain line are set in the effective region surrounded by the sacrificial groove 16.

The second effective area is an area corresponding to one electronic device. That is, in the manufacture of the electronic device, an element that becomes one electronic device is formed in the second effective region. Therefore, the composite 40 is cut after the element is formed in the second effective area a to f, for example, at a cutting line indicated by a two-dot chain line.

Further, in the composite 40, the second sacrificial grooves 42a to 42f surrounding the second effective region are formed on the outer surface of the glass sheet 12 opposite to the resin layer 14 so as to correspond to the respective second effective regions a to f. Further, the second sacrificial grooves 42a to 42f are formed between the cutting line and the second effective region.

The second sacrificial grooves 42a to 42f are basically the same as the sacrificial grooves 16 except for the second effective region set in the effective region.

That is, the composite of the present invention preferably has two sacrificial grooves extending in the same direction and an effective area between the two sacrificial grooves, and further has an inner side of the effective area. The second effective region and the inner side of the effective region and the second sacrificial groove extending along the end of the second effective region on the outer side of the second effective region.

As described above, the resin layer 14 has a specific rigidity and thickness, and is adhered to the glass sheet 12 with a specific adhesive force. Further, in a state where the composite 40 is cut at the cutting line, the original second effective region becomes an effective region in each of the composites after the cutting. Further, a second sacrificial groove extending along an end portion of the second effective region is formed on the outer side of the second effective region.

Therefore, in the state in which the composite body 40 is cut at the cutting line (two-point chain line) to form each electronic device, the glass sheet 12 and the resin are cut after the substrate (element substrate) of the electronic device is cut. The composite of layer 14 also forms a composite of the present invention in which a sacrificial groove is formed on the outer side of the effective region.

Therefore, cracks occur in the end portion of the glass sheet 12 or in the vicinity thereof, and the cracks expand in the inward direction, even in the step after the cutting, the step after the cutting, or the bending of the resin layer 14 in the use of the electronic device. It is also possible to suppress the crack propagation in the sacrificial groove (original second sacrificial groove), thereby suppressing the crack from reaching the effective region (the original second effective region).

The composite 40 shown in Fig. 5 surrounds each of the second effective regions by a rectangular sacrificial groove.

However, in the composite of the present invention, the second sacrificial groove corresponding to the second effective region is also required to extend at least along one side of the second effective region and extend along the side (end portion) in the same direction as the side. It can be formed. In other words, the second sacrificial groove may have one or more extending along the end of the second effective region. As long as there is one or more second sacrificial grooves extending along the end portion of the second effective region, it is possible to prevent cracks generated from the end portion of the composite after the cutting or the vicinity thereof from expanding further inside the second sacrificial groove.

Further, the second sacrificial groove does not necessarily need to be parallel to the end (edge) of the second effective region.

In the composite of the present invention, the second sacrificial groove corresponding to the second effective region is preferably formed so as to correspond to at least two opposite sides (one opposite side) of the second effective region.

For example, when the element formed in the second effective region a is used for the purpose of bending and deforming only in the vertical direction in FIG. 5, the second sacrifice formed corresponding to the second effective region a The livestock tank 42a may be formed only in two in the vertical direction in FIG. 5 and in the horizontal direction in FIG. 5 via the second effective region a.

Further, when the element formed in the second effective region c is used for the purpose of bending and deforming only in the lateral direction in FIG. 5, the second sacrificial groove 42c formed corresponding to the second effective region c may be provided only. It is formed in two in the horizontal direction in FIG. 5 and in the vertical direction in FIG. 5 via the second effective region c.

In the composite of the present invention, when the second effective region is set and the second sacrificial groove is formed corresponding to the second effective region, as shown in FIG. 5, all of the second effective regions can be surrounded by the rectangular sacrificial grooves. . Alternatively, the second sacrificial grooves may be formed along only one of the opposite sides of the entire second effective region. Alternatively, a second effective region surrounded by the rectangular second sacrificial groove and a second effective region in which the second sacrificial groove is formed only along one of the opposite sides may be mixed.

Further, in the composite of the present invention, when the second effective region is set, it is preferable to form the second sacrificial groove corresponding to all the second effective regions.

However, in the case where the second effective region is set in the composite of the present invention, the second sacrificial groove may not be formed at all, or the second effective region in which the second sacrificial groove is formed may be mixed and the second sacrifice may not be formed. The second effective area of the slot.

Further, as in the example shown in FIG. 5, even if the second sacrificial grooves are extended and the second sacrificial grooves do not enter the second effective region, the second sacrifice can be made similarly to the sacrificial grooves 16. The groove is formed to extend along the entire area of the glass sheet 12.

In other words, the second sacrificial groove can be formed in a lattice shape similarly to the sacrificial groove 16. At this time, one of the second sacrificial grooves corresponds to a plurality of second effective regions.

As shown in FIG. 5, the composite body 40 having the second sacrificial grooves may be formed by laminating a second glass sheet and then adhering to the resin layer 14 to form a laminate of the present invention.

At this time, an element is usually formed on the surface of the glass piece 12 in the state of the laminated body. Thereafter, the second glass piece is peeled off from the composite 40 (resin layer 14). When the stripping is carried out, The bonded body 40 is bent and deformed by the resin layer 14 being convex. However, the resin layer 14 in the composite 40 has a specific rigidity and thickness, and is followed by a specific adhesive force to the glass sheet 12, and a sacrificial groove 16 is formed on the outer side of the effective region, so that even at the end of the glass sheet 12 or Cracks are generated in the vicinity thereof and spread in the inward direction, and the expansion of the cracks can be suppressed by the sacrificial grooves 16, so that the cracks can be suppressed from reaching the effective region. Further, the laminated body 50 shown in Fig. 4 is also similar in this effect.

After the second glass piece 52 is peeled off from the composite 40, it is cut at a cutting line (two-point chain line) to form each electronic device. Here, in the state in which each electronic device is used, as described above, the substrate of the electronic device is also a composite of the present invention. Therefore, even when the electronic device is used, the resin layer 14 is bent and deformed to cause cracks at the end portion of the glass piece 12 or in the vicinity thereof, and the crack propagates in the inner surface direction, thereby suppressing the crack propagation in the sacrificial groove. Thereby, it is possible to suppress the crack from reaching the effective area.

The electronic device of the present invention is formed by forming a component of the glass piece 12 of the composite or laminated body of the present invention.

As the electronic device of the present invention, an LCD, an OLED, a PV, a thin film secondary battery, an electronic paper, or the like can be exemplified.

The following electronic device will be described by taking the composite 10 as an example, but the composite 40 or the laminated body 50 is also the same.

Further, in the composite 40, the elements shown below are formed in the respective second effective regions a to f. Further, as described above, the composite body 10 and the laminated body 50 are usually formed as a mother board, and a plurality of components or a plurality of components serving as electronic devices are formed independently of each other in the effective region.

In the following electronic device, each element (each layer (each film) of the constituent elements) may be formed by a known method.

An LCD (Liquid Crystal Display) as an electronic device of the present invention has a TFT (Thin-Film Transistor) substrate, a CF (Color Filter) substrate, and It is composed of a liquid crystal layer or the like.

The TFT substrate is formed by patterning a TFT element (thin film transistor element) or the like on the glass piece 12 of the composite body 10. The CF substrate is formed by patterning a color filter element on the glass sheet 12 of the other composite 10. The liquid crystal layer is formed between the TFT substrate and the CF substrate.

As an example, an OLED (organic EL panel) as an electronic device of the present invention includes a composite 10, a transparent electrode, an organic layer, a reflective electrode, a sealing plate, and the like.

A transparent electrode is formed on the glass piece 12 of the composite body 10, an organic layer is formed thereon, and a reflective electrode is formed thereon to constitute a bottom emission type organic EL element. The organic layer includes at least a light-emitting layer, and optionally includes a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer. For example, the organic layer sequentially includes a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer from the anode side. Further, the organic EL element may also be of a top emission type.

As an example, a PV (solar cell) as an electronic device of the present invention includes a composite 10, a transparent electrode, a tantalum layer, a reflective electrode, a sealing plate, and the like.

A transparent electrode is formed on the glass piece 12 of the composite 10, a ruthenium layer is formed thereon, and a reflective electrode is formed thereon to form a 太阳-type solar cell element, and a sealing plate is disposed on the reflective electrode. The tantalum layer includes, for example, a p-layer (a layer doped into a p-type), an i-layer (a light-absorbing layer), an n-layer (a layer doped into an n-type), and the like from the anode side.

Further, PV may be a compound type, a dye-sensitized type, a quantum dot type or the like.

As an example, a thin film secondary battery as an electronic device of the present invention includes a composite 10, a transparent electrode, an electrolyte layer, a current collector layer, a sealing layer, a sealing plate, and the like.

Forming a transparent electrode on the glass piece 12 of the composite body 10, forming an electrolyte layer thereon, forming a current collecting layer thereon, forming a sealing layer thereon to form a film secondary battery element, and arranging a sealing plate on the sealing layer .

Further, the thin film secondary battery element is of a lithium ion type, but may be a nickel hydrogen type, a polymer type, a ceramic electrolyte type or the like.

As an example, the electronic paper as the electronic device of the present invention comprises a composite 10, a TFT layer, a layer containing an electrically engineered medium (for example, a microcapsule), a transparent electrode, a front surface plate, and the like.

A TFT layer is formed on the glass piece 12 of the composite body 10, a layer containing an electrically engineered medium is formed thereon, and a transparent electrode is formed thereon to constitute an electronic paper element, and a front surface plate is disposed on the transparent electrode.

The electronic paper element may be any of a microcapsule type, an in plane type, a torsion type, a particle moving type, an electron jet type, and a polymer mesh type.

In the above, the composite, the laminate, the electronic device, and the method for producing the same according to the present invention have been described in detail. However, the present invention is not limited to the above examples, and various modifications may be made without departing from the spirit of the invention. change.

Example

Hereinafter, specific embodiments of the present invention will be described, and the present invention will be described in more detail.

[Example 1]

As the glass piece, an alkali-free glass plate (AN100 manufactured by Asahi Glass Co., Ltd.) having a thickness of 100 μm and 150 × 100 mm was prepared.

First, as a pretreatment, after purifying the glass piece by pure water washing and UV (ultraviolet) cleaning, in order to improve the adhesion, the isopropanol was applied by spin coating (for 10 seconds at 2000 rpm). A 0.1% by weight solution of aminopropyltrimethoxydecane (KBM903) as a solvent was dried at 80 ° C for 10 minutes to carry out treatment with a glass plate of a decane coupling agent.

A sacrificial groove having a width of 1 μm and a depth of 10 μm parallel to the long side was formed at a position of 5 mm inside the long side of one of the pretreated glass sheets. Furthermore, the sacrificial channel is formed by a CO ₂ laser.

On the other hand, a polyamic acid solution for coating was prepared by the following method.

P-phenylenediamine (10.8 g, 0.1 mol) was dissolved in N,N-dimethylacetamide (198.6 g) Medium and stirred at room temperature. 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) (29.4 g, 0.1 mol) was added thereto over 1 minute, and stirred at room temperature for 2 hours, and obtained to have the following formula (2-1) and/or a polylysine solution having a polyamine acid in a repeating unit represented by the formula (2-2) and having a solid content concentration of 20% by mass.

The polyaminic acid solution was applied to the formation surface of the sacrificial groove of the glass piece by a spin coating method (2000 rpm) to form a coating film. Thereafter, the film was heated in the air at 60 ° C for 10 minutes, and further heated at 120 ° C for 10 minutes in the air to dry the coating film to form a film of polylysine on the surface of the glass piece.

Further, the mixture was heated at 350 ° C for 1 hour in the atmosphere to thereby carry out hydrazine imidization, and the surface of the glass sheet formed on the sacrificial groove was formed to have a polyimine and a thickness of 25 μm. A composite of resin layers.

The adhesive force of the resin layer (peeling strength of 180° peeling) was measured by a universal testing machine (manufactured by Shimadzu Corporation). As a result, the adhesive force of the resin layer was 12 N/25 mm.

Further, the Young's modulus of the resin layer is measured in accordance with JIS K 7127 (1999) (the normal direction thereof) The Young's modulus of the region from the interface of the glass sheet is 0 to 0.5 μm. As a result, the resin layer 14 has a Young's modulus of 5 GPa. Further, the Young's modulus was measured by peeling off the resin layer from the produced composite. When the resin layer is not peeled off from the composite, the glass sheet is dissolved by hydrofluoric acid to obtain a resin layer for measurement.

After the end surface of the composite body produced as described above was polished by sandpaper, the composite layer was bent at two points on the resin layer side in the normal direction of the sacrificial groove until cracks occurred at the end portions of the glass sheet.

After the crack is generated, it is confirmed that the crack is extended more than 5 mm toward the inner side of the sacrificial groove. As a result, it was not confirmed that the crack was extended to the inner surface side of the sacrificial groove by 5 mm or more (no damage).

[Embodiment 2]

A composite was produced in the same manner as in Example 1 except that the resin layer was changed to a thickness of 20 μm including PES (polyethersulfonic acid).

The formation of the resin layer containing PES was carried out as follows. First, PES (manufactured by Sumitomo Chemical Co., Ltd., 5003P) was dissolved in N-methylpyrrolidone at 20% by mass to prepare a PES solution. The PES solution was applied to a glass piece by a spin coating method (2000 rpm) to form a coating film. Thereafter, the film was dried at 130 ° C for 1 hour in the atmosphere to form a film of PES. Further, in this example, the decane coupling agent treatment of the glass piece was not performed.

The adhesion force and Young's modulus of the resin layer were measured in the same manner as in Example 1 at the time of producing the composite. As a result, the subsequent force was 5.4 N/25 mm, and the Young's modulus was 2.4 GPa.

The composite was bent at two points in the same manner as in Example 1, and the crack was confirmed. As a result, cracks (without damage) of 5 mm or more from the sacrificial groove were not confirmed.

[Comparative Example 1]

A composite was produced in the same manner as in Example 1 except that the concentration of the solid content of the polyaminic acid solution was 10% by mass, and the thickness of the resin layer was 0.5 μm.

The adhesion force and Young's modulus of the resin layer were measured in the same manner as in Example 1 at the time of producing the composite. As a result, the force was 10 N/25 mm or more, but the resin layer was broken, so that an accurate value could not be measured. Also, the Young's modulus is 5 GPa.

In the same manner as in the first embodiment, the composite was bent at two points, and the crack was confirmed. As a result, it was confirmed that cracks (broken) of 5 mm or more were spread from the sacrificial grooves.

[Comparative Example 2]

A composite was produced in the same manner as in Example 1 except that the resin layer was changed to a thickness of 16 μm including a polyoxynoxy resin.

The formation of the resin layer containing the polyoxyxylene resin is carried out as follows. Polyether oxime (KNS-320A manufactured by Shin-Etsu Silicones Co., Ltd.) is a non-solvent addition reaction type release paper by a spin coating method (2000 rpm). It is an organic alkenyl polysiloxane and an organic hydrogen polyoxyalkylene. Mixture) 100 parts by mass of a mixture of 2 parts by mass of a platinum-based catalyst (CAT-PL-56 manufactured by Shin-Etsu Silicones Co., Ltd.) was applied to a glass piece to form a coating film. Thereafter, the film was dried at 180 ° C for 30 minutes in the air to dry the coating film to form a film of a polyoxyn resin. Further, in this example, the decane coupling agent treatment of the glass piece was not performed.

The adhesion force and Young's modulus of the resin layer were measured in the same manner as in Example 1 at the time of producing the composite. As a result, the subsequent force was 2.7 N/25 mm, and the Young's modulus was 0.003 GPa.

In the same manner as in the first embodiment, the composite was bent at two points, and the crack was confirmed. As a result, it was confirmed that cracks (broken) of 5 mm or more were spread from the sacrificial grooves. Further, elongation of the resin layer also occurs.

[Comparative Example 3]

A composite was produced in the same manner as in Example 1 except that the decane coupling agent treatment of the glass piece was not carried out.

The adhesion force and Young's modulus of the resin layer were measured in the same manner as in Example 1 at the time of producing the composite. As a result, the subsequent force is 0.1 N/25 mm, and the Young's modulus is 5. MPa.

In the same manner as in the first embodiment, the composite was bent at two points, and the crack was confirmed. As a result, it was confirmed that cracks (broken) of 5 mm or more were spread from the sacrificial grooves. Moreover, the bulging of the resin layer also occurs.

[Comparative Example 4]

The glass piece in which the resin layer was not formed was bent at two points in the same manner as in Example 1 to confirm the crack.

As a result, it was confirmed that cracks (broken) of 5 mm or more were spread from the sacrificial grooves. Also, the scattering of glass fragments occurred.

[Comparative Example 5]

A composite was produced in the same manner as in Example 1 except that the sacrificial grooves were not formed in the glass piece. Therefore, the adhesive force of the resin layer was 12 N/25 mm, and the Young's modulus was 5 MPa.

In the same manner as in Example 1, the composite was bent at two points, and cracks were confirmed. As a result, cracks which occurred from the end portions of the glass sheets and spread to the other end portions were confirmed.

The above results are summarized in the table below.

Only Comparative Example 5 has no sacrificial slots

As shown in the above embodiment, the thickness of the resin layer is 1~ according to the sacrificial groove. 100 μm, the force (180° peeling peel strength) is 1N/25mm or more, and the Young's modulus is 100MPa or more. Even if cracks occur at the end of the glass sheet due to the two-point bending, the sacrificial groove can be suppressed. Since the crack is expanded (cut), it is possible to manufacture a high-quality composite which is not propagated to the inner side of the sacrificial groove by a crack of 5 mm or more.

On the other hand, in Comparative Example 1 in which the resin layer was thin, Comparative Example 2 in which the Young's modulus of the resin layer was low, Comparative Example 3 in which the adhesion of the resin layer was low, and Comparative Example 4 in which the resin layer was not provided, The crack generated by the two-point bending is expanded to generate a crack of 5 mm or more toward the inner side of the sacrificial groove. Moreover, in the comparative example 5 which does not have a sacrificial groove, when a crack generate|occur|produces, the crack expansion does not stop, and the crack which spreads from one end part of the glass piece to the other end part arises. Further, in Comparative Example 1 in which the resin layer was thin, the resin layer was broken, and in Comparative Example 2 in which the Young's modulus of the resin layer was low, the resin layer was elongated, and in Comparative Example 3 in which the adhesion strength of the resin layer was low. The resin layer was embossed, and in Comparative Example 4 which did not have a resin layer, the fragments of the glass scattered.

The effects of the present invention are known from the above results.

The present invention has been described in detail with reference to the specific embodiments thereof, and it is understood that various changes or modifications may be made without departing from the spirit and scope of the invention.

The present application is based on Japanese Patent Application No. Hei. No. Hei. No. Hei.

[Industrial availability]

It can be preferably utilized in the manufacture of various electronic devices and the like.

10‧‧‧Compound

12‧‧‧Stainless glass

14‧‧‧ resin layer

16‧‧‧sacrificial slot

A‧‧‧ end

Claims (9)

A composite body comprising: a glass sheet and a resin layer on one side of the glass sheet; the resin layer has a thickness of 1 to 100 μm, and the interface between the resin sheet and the glass sheet is 0 along the normal direction thereof. The Young's modulus in the region of ~0.5 μm is 100 MPa or more, and the peeling strength with respect to 180° peeling of the glass sheet is 1 N/25 mm or more; further, the glass sheet has at least the edge along with the resin layer. A sacrificial groove extending from the end of the glass sheet. The composite of claim 1, wherein the glass piece has two effective regions between the sacrificial grooves and the two sacrificial grooves extending in the same direction, and further has a second effective region on the inner side of the effective region, and the above The second sacrificial groove extending along the inner side of the effective region and extending beyond the end of the second effective region on the outer side of the second effective region. A composite according to claim 1 or 2, which has a groove which does not penetrate the glass sheet as the sacrificial groove. The composite according to any one of claims 1 to 3, which has a through groove penetrating through the glass sheet as the sacrificial groove. A laminate in which a second glass sheet is bonded to a resin layer of the composite according to any one of claims 1 to 4. An electronic device having an element on a surface of a glass sheet of a composite according to any one of claims 1 to 4 or a glass sheet of a laminate according to claim 5 having an element. A manufacturing method of a composite body, characterized in that a sacrificial groove extending along an end portion of a glass piece is formed, and a peeling strength of 180° peeling is formed on a surface of the glass piece on which a sacrificial groove is formed. A resin layer having a thickness of 1 to 100 μm is formed by an adhesion force of 1 N/25 mm or more, and a Young's modulus of a region in which a distance between a normal direction of the resin layer and the interface of the glass sheet is 0 to 0.5 μm is 100 MPa or more . A method of producing a laminate in which a second glass sheet is laminated and then a resin layer of a composite obtained by the production method of claim 7. A method of manufacturing an electronic device, which is characterized in that a glass piece of a composite obtained by the manufacturing method of claim 7 or a laminated body obtained by the manufacturing method of claim 8 is used.