CN103042803B - The manufacture method of electronic installation - Google Patents

Abstract

The present invention relates to a method of manufacturing an electronic device, which is a method of manufacturing an electronic device including a peelable glass substrate and a member for an electronic device, comprising: a surface treatment step, a curable resin composition layer forming step, a lamination step, a curing step, Cutting process, member forming process and separation process.

Description

Electronic device manufacturing method

technical field

The present invention relates to a method of manufacturing an electronic device.

Background technique

In recent years, devices (electronic devices) such as solar cells (PV), liquid crystal panels (LCD), and organic EL panels (OLED) have become thinner and lighter in weight, and the glass substrates used in these devices are also becoming thinner. If the strength of the glass substrate is insufficient due to thinning, the handling properties of the glass substrate will decrease in the manufacturing process of the device.

Therefore, a method of thinning the glass substrate by chemical etching after forming device components (for example, thin film transistors) on a glass substrate thicker than the final thickness has been widely used. However, in this method, for example, when the thickness of one glass substrate is reduced from 0.7 mm to 0.2 mm or 0.1 mm, most of the material of the original glass substrate will be removed with an etching solution. It is not preferable from the viewpoint of use efficiency.

In addition, in the above-mentioned thinning method of the glass substrate by chemical etching, when there are minute flaws on the surface of the glass substrate, microscopic pits (etch pits) may be formed starting from the flaws due to the etching process, which may become an optical defect. the defect situation.

Recently, in order to deal with the above-mentioned problems, the following method has been proposed: prepare a laminated body in which a glass substrate and a reinforcing plate are stacked, form components for electronic devices such as a display device on the glass substrate of the laminated body, and then separate the reinforcing plate from the glass substrate ( For example, refer to Patent Document 1). The reinforcing plate has a support body and a resin layer fixed to the support body, and the resin layer is closely bonded to the glass substrate in a detachable manner. The reinforcement plate separated from the glass substrate in which the interface between the resin layer and the glass substrate of the laminate is peeled can be laminated on a new glass substrate and reused as a laminate.

prior art literature

patent documents

Patent Document 1: International Publication No. 07/018028 Pamphlet

Contents of the invention

The problem to be solved by the invention

On the one hand, in recent years, along with demands for higher performance of electronic devices, components for electronic devices have been further miniaturized, and the steps to be performed have become more complicated. Even in this situation, it is necessary to manufacture electronic devices having excellent performance with high productivity.

When the inventors of the present invention manufactured an electronic device using the laminate described in Patent Document 1, they found that the performance of the obtained electronic device was sometimes poor. For example, when an OLED panel is manufactured, display unevenness may occur in the driving region of the panel.

As a result of studying the above-mentioned reasons, the present inventors have found that the resin layer in the laminate described in Patent Document 1 has thickness unevenness (in particular, a convex portion at the peripheral portion), which impairs the flatness of the glass substrate. As a result, It will reduce the manufacturing yield of electronic devices.

(A) of FIG. 8 shows a cross-sectional view of a carrier substrate with a resin layer 28 having a carrier substrate 14 and a resin layer 18 used when producing the laminate described in Patent Document 1. As shown in FIG. A glass substrate is laminated on the exposed surface of the resin layer 18 in the carrier substrate 28 with a resin layer to form a laminate. As shown in FIG. 8(A) , the resin layer 18 formed by the method described in Patent Document 1 has thickness unevenness. This thickness unevenness is particularly noticeable near the outer peripheral edge of the resin layer 18 , forming the convex portion 80 . When the glass substrate 82 is laminated on the resin layer 18 having such uneven thickness, the center portion of the glass substrate 82 is concave and generally curved, thereby impairing the flatness of the glass substrate 82 (see FIG. 8(B) ). Since the flatness of the glass substrate 82 is damaged, components for electronic devices arranged on the glass substrate 82 may be shifted in position, and as a result, performance of the electronic device may be lowered.

In addition, as shown in FIG. 8(B) , when a glass substrate 82 is laminated on such a carrier substrate 28 with a resin layer, a gap 84 is formed between the glass substrate 82 and the resin layer 18 . The laminated body is subjected to a manufacturing process of an electronic device member, and functional layers such as a conductive layer are formed on the exposed surface of the glass substrate 82 . At this time, various solutions such as a resist solution are used.

When there are voids 84 in the laminate, various solutions enter the voids due to capillary action. The material that has entered the voids 84 is difficult to remove even by washing, and tends to remain as impurities after drying. This impurity becomes a contamination source for contaminating components for an electronic device due to heat treatment or the like, and thus causes a decrease in the performance of the electronic device, resulting in a decrease in yield.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a method for manufacturing an electronic device with excellent productivity using a carrier substrate with a resin layer excellent in flatness.

solutions to problems

The inventors of the present invention conducted intensive studies to solve the above-mentioned problems, and completed the present invention.

That is, the first embodiment of the present invention is a method of manufacturing an electronic device, which is a method of manufacturing an electronic device including a peelable glass substrate and a member for an electronic device, and includes: a surface treatment step of treating a glass substrate having a first glass substrate with a release agent. The above-mentioned first main surface of the glass substrate of the first main surface and the second main surface obtains a peelable glass substrate having a surface showing easy peelability; the step of forming a curable resin composition layer is easy to display on the aforementioned peelable glass substrate. Coating the curable resin composition on the peelable surface to form an uncured curable resin composition layer; the lamination process will have a carrier with a smaller external dimension than that of the aforementioned uncured curable resin composition layer The substrate is laminated on the aforementioned uncured curable resin composition layer in such a manner that a peripheral region not in contact with the aforementioned carrier substrate is left in the aforementioned uncured curable resin composition layer to obtain a pre-cured laminate; curing step , curing the aforementioned uncured curable resin composition layer in the pre-cured laminate to obtain a cured laminate with a resin layer; cutting process, cutting along the outer periphery of the aforementioned carrier substrate in the aforementioned cured laminate The aforementioned resin layer and the aforementioned peelable glass substrate; a member forming step of forming a member for an electronic device on the second main surface of the aforementioned peelable glass substrate to obtain a laminate with a member for an electronic device; and a step of separating the The laminated body of the member for electronic devices isolate|separates the electronic device which has the said peelable glass substrate and the said member for electronic devices.

In the first embodiment, it is preferable to further include a defoaming step of performing a defoaming treatment of the uncured curable resin composition layer after the lamination step and before the curing step.

In the first embodiment, it is preferable that the release agent contains a compound having a methylsilyl group or a fluoroalkyl group.

In the first embodiment, it is preferable that the release agent contains silicone oil or a fluorine-based compound.

In the first embodiment, it is preferable that the resin layer contains a silicone resin.

In the first embodiment, it is preferable that the aforementioned resin layer is an addition reaction type formed by a combination of an organoalkenylpolysiloxane having an alkenyl group and an organohydrogenpolysiloxane having a hydrogen atom bonded to a silicon atom. Cured silicone.

Preferably, the molar ratio of the hydrogen atom bonded to the silicon atom of the organohydrogenpolysiloxane to the alkenyl group of the organoalkenylpolysiloxane is 0.5-2.

In the first embodiment, it is preferable that the resin layer contains 5% by mass or less of non-curable organopolysiloxane.

In the first embodiment, preferably, in the cutting step, the main surface of the carrier substrate in the cured laminate is supported by a stage, and the outer periphery of the carrier substrate is brought into contact with a position determination block provided on the stage. catch.

In the first embodiment, preferably, in the cutting step, a cut line is formed on the surface of the peelable glass substrate in the cured laminate, and then the peelable glass substrate in the cured laminate is cut along the cut line. Cut together with the respective outer peripheral portions of the resin layers.

The effect of the invention

According to the present invention, it is possible to provide a method for manufacturing an electronic device with excellent productivity using a carrier substrate with a resin layer having excellent flatness.

Description of drawings

FIG. 1 is a flowchart showing manufacturing steps of an embodiment of a method of manufacturing an electronic device according to the present invention.

(A) to (G) of FIG. 2 are schematic cross-sectional views illustrating one embodiment of the method for manufacturing an electronic device according to the present invention in order of steps.

(A) of FIG. 3 is a top view of the uncured laminate obtained in the lamination step. (B) of FIG. 3 is a partial cross-sectional view showing the state of the carrier substrate before lamination. (C) of FIG. 3 is a partial cross-sectional view showing a state after carrier substrates are stacked.

FIG. 4 is a plan view showing a part of the cured laminate mounted on a stage through perspective.

Fig. 5 is a partially broken cross-sectional view showing a cured laminate and a processing head placed on a stage.

Fig. 6 is a cross-sectional view showing a cured laminate and pinching jigs placed on another stage.

7 is a flow chart showing manufacturing steps of another embodiment of the method of manufacturing an electronic device according to the present invention.

(A) of FIG. 8 is a cross-sectional view of a conventional carrier substrate with a resin layer. (B) of FIG. 8 is a partial cross-sectional view of an end portion of a conventional laminated body.

Explanation of reference signs

10 Peelable glass substrate

12 uncured curable resin composition layers

14 carrier substrate

16 Laminates before curing

18 resin layers

20 Laminates after curing

22Laminated body after cutting

24 Components for electronic devices

26 Laminates with components for electronic devices

28 Carrier substrate with resin layer

30 electronic devices

32 gaps

50, 70 carrier

51~53 position determination block

54, 55 moving blocks

60 processing heads

62 cutter

64 brackets

66 cutting lines

68 cracks

72 clamping fixture

80 Convex

82 glass substrate

84 gaps

detailed description

Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. The present invention is not limited to the following embodiments, and various modifications and substitutions can be made to the following embodiments without departing from the scope of the present invention.

As a result of studying the problems of the invention of Patent Document 1, the present inventors found that irregularities appear on the surface of the resin layer due to the influence of coating the curable resin composition and the influence of the surface tension of the air interface.

And found that by making the resin layer in an uncured state contact with the glass substrate showing predetermined peelability, impart flatness, and then make it hardened, can obtain a laminated body with a resin layer having predetermined flatness, as a result, can Suppresses performance degradation of electronic devices.

Hereinafter, the manufacturing method of the electronic device will be described in order of each process.

In addition, in the present invention, the peel strength of the interface between the resin layer and the layer of the carrier substrate in the cured laminate described later is higher than the peel strength of the interface between the layer of the glass substrate and the resin layer, and is hereinafter also referred to as the resin layer. Fixed to the carrier substrate, the resin layer and the glass substrate are releasably bonded.

[First Embodiment]

FIG. 1 is a flowchart showing manufacturing steps in one embodiment of a method of manufacturing an electronic device according to the present invention. As shown in FIG. 1 , the method of manufacturing an electronic device includes a surface treatment step S102, a curable resin composition layer forming step S104, a lamination step S106, a curing step S108, a cutting step S110, a member forming step S112, and a separation step S114.

In addition, FIG. 2 is a schematic cross-sectional view sequentially showing each manufacturing process in the manufacturing method of the electronic device of the present invention.

Hereinafter, the materials used in each process and the order thereof will be described in detail with reference to FIG. 2 . First, the surface treatment step S102 will be described in detail.

[Surface treatment process]

The surface treatment step S102 is a step of treating the first main surface of the glass substrate having the first main surface and the second main surface with a release agent to obtain a releasable glass substrate having a surface showing easy releasability. By implementing this process S102, the peelable glass substrate 10 (refer FIG. 2(A)) which adhere|attached to the resin layer mentioned later so that peeling is possible can be obtained. Here, the peelable glass substrate 10 means the glass substrate which has the surface 10a which shows easy peelability with respect to the resin layer mentioned later. In addition, the ease of peeling of the surface of the peelable glass substrate refers to the interface between the carrier substrate and the resin layer and the resin layer when an external force is applied to peel the peelable glass substrate from the cured laminate described later. The property of peeling at the interface between the peelable glass substrate and the resin layer without peeling inside.

First, the glass substrate and release agent used in this process are demonstrated in detail, and the procedure of this process S102 is demonstrated in detail after that.

(Glass base board)

The glass substrate is a plate substrate having a first main surface and a second main surface, and the first main surface is surface-treated with a release agent. The surface-treated first main surface exhibiting easy peelability is releasably adhered to the resin layer described later, and the electronic device member is provided on the second main surface opposite to the adhesive side of the resin layer.

The kind of glass substrate may be a common kind, For example, the glass substrate for display devices, such as LCD and OLED, etc. are mentioned. The glass substrate is excellent in chemical resistance and moisture permeability resistance, and has a low heat shrinkage rate. As an index of thermal contraction rate, the coefficient of linear expansion stipulated in JIS R3102 (amended in 1995) is used.

If the coefficient of linear expansion of the glass substrate is large, since the member forming step S112 is often accompanied by heat treatment, various disadvantages are likely to occur. For example, when TFTs are formed on a glass substrate, if the heated glass substrate on which the TFTs are formed is cooled, the positional displacement of the TFTs may become excessive due to thermal contraction of the glass substrate.

The glass substrate can be obtained by melting glass raw materials and molding molten glass into a plate shape. Such a molding method may be a general molding method, for example, a float method, a fusion method, a slit down-draw method, a fourcault process, a mechanical blower method (Labbers process), etc. can be used. In addition, especially thin glass substrates are formed by a method (flat drawing method) in which glass once formed into a plate shape is heated to a temperature at which it can be formed, and stretched to become thinner by means of stretching or the like.

The glass of the glass substrate is not particularly limited, but is preferably an alkali-free borosilicate glass, borosilicate glass, soda lime glass, high silica glass, or other oxide-based glass mainly composed of silicon oxide. As the oxide-based glass, glass having a silicon oxide content of 40 to 90% by mass in terms of oxides is preferable.

As the glass of the glass substrate, glass suitable for the type of member for an electronic device and its manufacturing process can be used. For example, glass substrates for liquid crystal panels are likely to affect liquid crystals due to the elution of alkali metal components, so they are formed of glass (alkali-free glass) that does not substantially contain alkali metal components (of which alkaline earth metal components are usually included). In this way, the glass of the glass substrate can be appropriately selected based on the type of device to be applied and its manufacturing process.

The thickness of the glass substrate is not particularly limited, but is usually preferably 0.8 mm or less, more preferably 0.3 mm or less, and still more preferably 0.15 mm or less from the viewpoint of thinning and/or reducing the glass substrate. When exceeding 0.8 mm, the thinning and/or weight reduction of a glass substrate cannot be satisfied. When it is 0.3 mm or less, favorable flexibility can be given to a glass substrate. In the case of 0.15 mm or less, the glass substrate can be wound up into a roll shape. In addition, the thickness of the glass substrate is preferably 0.03 mm or more for reasons such as easy manufacture of the glass substrate and easy handling of the glass substrate.

In addition, the glass substrate may be formed of two or more layers. In this case, the materials forming the respective layers may be the same material or different materials. In addition, in this case, "the thickness of a glass substrate" means the total thickness of all layers.

In addition, other layered materials may be laminated on one surface of the glass substrate. For example, in order to increase the strength of the glass substrate, a resin layer or the like may be laminated, or an inorganic thin film layer such as indium tin oxide or silicon oxide may be laminated.

(stripping agent)

A known release agent can be used as the release agent, and examples thereof include silicone-based compounds (eg, silicone oil, etc.), silylation agents (eg, hexamethyldisilazane, etc.), fluorine-based compounds (eg, fluororesin, etc.), and the like. The release agent can be used in the form of an emulsion type, a solvent type, or a solvent-free type. From the perspective _{of peeling} force, safety, cost, etc., as one _of the suitable examples, any _of the following: a) or fluoroalkyl (-C _m F _2m+1 ) (m is preferably an integer of 1 to 6) compound, as other suitable examples, silicone-based compounds or fluorine-based compounds are listed, especially preferably silicone oil.

The type of silicone oil is not particularly limited, and examples include straight-chain silicone oils such as dimethyl silicone oil, methylphenyl silicone oil, and methylhydrogen silicone oil. Modified silicone oils with groups, amino groups, carboxyl groups, polyether groups, halogen groups, etc. Specific examples of linear silicone oils include methylhydrogenpolysiloxane, dimethylpolysiloxane, methylphenylpolysiloxane, and diphenylpolysiloxane. In increasing order, the highest heat resistance is diphenylpolysiloxane. These silicone oils are generally used for hydrophobic treatment of the surfaces of substrates such as glass substrates and primer-treated metal substrates.

The silicone oil preferably has a kinematic viscosity at 25° C. of 5000 mm ² /s or less, more preferably 500 mm ² /s or less, from the viewpoint of the efficiency of the treatment for bonding the silicone oil to the surface to be treated of the glass substrate. The lower limit of the kinematic viscosity is not particularly limited, but it is preferably 0.5 mm ² /s or more in consideration of handling and cost.

Among the above-mentioned silicone oils, linear silicone oils are preferable because they have good releasability from the resin layer, and dimethylpolysiloxanes are preferable because they impart high releasability. Also in the case where releasability is required and especially heat resistance is required, methylphenylpolysiloxane or diphenylpolysiloxane is preferable.

The type of fluorine compound is not particularly limited, and perfluoroalkylammonium salts, perfluoroalkylsulfonamides, perfluoroalkylsulfonates (such as sodium perfluoroalkylsulfonate), perfluoroalkylammonium Substituted alkyl potassium salt, perfluoroalkyl carboxylate, perfluoroalkyl ethylene oxide adduct, perfluoroalkyltrimethylammonium salt, perfluoroalkyl sulfamate, perfluoroalkyl Fluoroalkyl phosphates, perfluoroalkyl compounds, perfluoroalkyl betaines, perfluoroalkyl halogen compounds, and the like. In addition, examples of compounds containing a fluoroalkyl group (C _m F _2m+1 ) include compounds having a fluoroalkyl group among the exemplary compounds of the above-mentioned fluorine-based compounds. The upper limit of m is not particularly limited in terms of peeling performance, but it is preferable that m is an integer of 1 to 6 from the viewpoint of more excellent handling safety.

(sequence of processes)

The treatment method of the surface of a glass substrate can select the most suitable method suitably according to the release agent to be used. Usually, the treatment is performed by applying (for example, coating) a release agent to the surface of the first main surface of the glass substrate.

For example, when using silicone oil, the method of applying silicone oil to the surface of a glass substrate is mentioned. Among them, after applying the silicone oil, it is preferable to perform a treatment for bonding the silicone oil to the surface to be treated of the glass substrate. The treatment of bonding silicone oil to the surface to be treated is a treatment of cutting molecular chains of silicone oil, and the cut fragments are bonded to the surface to be treated (hereinafter referred to as low molecular weight of silicone oil).

The method of applying the silicone oil may be a general method. For example, it can be appropriately selected from spray coating, die coating, spin coating, dip coating, roll coating, bar coating, screen printing, gravure coating, etc. according to the type of silicone oil, coating amount, etc. .

As the coating liquid, it is desirable to use a solution obtained by diluting silicone oil to 5% by mass or less with a solvent such as hexane, heptane, xylene, or isoparaffin. When it exceeds 5% by mass, the treatment time for molecular weight reduction becomes too long.

The solvent contained in the coating liquid can be removed by methods such as heating or drying under reduced pressure as necessary. It can also be removed by heating in the low molecular weight step.

The amount of silicone oil applied is preferably 0.1 to 10 μg/cm ² . When it is 0.1 μg/cm ² or more, the detachability is more excellent, so it is preferable, and when it is 10 μg/cm ² or less, the applicability of the coating liquid and the low-molecular-weight processing property are more excellent, so it is preferable.

As a method of reducing the molecular weight of silicone oil, general methods can be used, for example, there is a method of cleaving the siloxane bond of silicone oil by photolysis or thermal decomposition. In the photolysis, ultraviolet rays irradiated from low-pressure mercury lamps, xenon arc lamps, and the like can be used in combination with ozone generated by irradiation of ultraviolet rays in the atmosphere. Thermal decomposition can be carried out in a batch furnace, a conveyor furnace, etc., and plasma, arc discharge, etc. can also be used.

Once the siloxane bond of the silicone oil or the bond between the silicon atom and the carbon atom is severed, the active points generated will react with active groups such as hydroxyl groups on the treated surface. As a result, the density of hydrophobic functional groups such as methyl groups on the surface to be treated increases, and the density of hydrophilic polar groups decreases, resulting in imparting easy peelability to the surface to be treated.

In addition, the surface of the glass substrate to be surface-treated is preferably a sufficiently clean surface, and is preferably a surface immediately after washing. As a cleaning method, a general method used for cleaning glass surfaces and resin surfaces can be used.

Ideally, the surface not to be subjected to surface treatment is protected in advance with a protective film such as a mask.

Moreover, when using a silylation agent, such as hexamethyldisilylamine, it is preferable to make the vapor|steam of a silylation agent contact the surface of a glass substrate. In addition, the glass substrate may be brought into contact with the vapor of the silylation agent while heating the glass substrate.

The higher the vapor concentration of the silylation agent, that is, the closer to the saturation concentration, the shorter the treatment time, which is preferable.

The contact time of a silylation agent and a glass substrate can be shortened as long as the function of a peelable glass substrate is not impaired.

From the viewpoint of further suppressing the uneven thickness of the resin layer obtained in the curing step S108 described later, the surface roughness Ra of the easily peelable surface of the peelable glass substrate produced by the above procedure is preferably 2.0 nm or less, More preferably, it is 1.0 nm or less, and still more preferably, it is 0.5 nm or less. The lower limit is not particularly limited, but is particularly preferably 0 nm.

In addition, the measurement of the surface roughness Ra can be performed using an atomic force microscope (manufactured by Pacific Nanotechnology, NanoScope IIIa; ScanRate1.0Hz, SampleLines256, Off-lineModifyFlattenorder-2, Planefitorder-2, etc.) based on JISB0601 (2001).

From the viewpoint that the peeling of the interface between the peelable glass substrate and the resin layer proceeds more easily, the water contact angle of the surface showing easy peelability of the peelable glass substrate is preferably 90° or more, more preferably 90 to 120°, and even more preferably 90~110°.

In addition, the measurement of the water contact angle can be performed using a contact angle meter (manufactured by KURUSS, DROPSHAPEANALYSISSYSTEMDSA10Mk2, etc.).

[Curable resin composition layer formation process]

The curable resin composition layer forming step S104 is to apply a curable resin composition on the surface showing easy peelability of the peelable glass substrate obtained in the above surface treatment step S102 to form an uncured curable resin composition layer. process. More specifically, as shown in FIG. 2(B), an uncured curable resin composition layer 12 is formed on the peelable surface 10 a of the peelable glass substrate 10 .

The uncured curable resin composition layer was brought into contact with the surface showing releasability of the releasable glass substrate without leaving a gap. Therefore, when the curable resin composition layer is cured in curing step S108 described later, a resin layer on which the flat surface of the peelable glass substrate is transferred can be obtained, and deformation of the peelable glass substrate can be suppressed.

First, the curable resin composition used in this process is demonstrated in detail, and the procedure of this process S104 is demonstrated in detail after that.

(curable resin composition)

The curable resin composition used in this process S104 is a composition which can form a resin layer (adhesive resin layer) in the hardening process S108 mentioned later.

As the curable resin contained in the curable resin composition, as long as the cured film has adhesiveness that can be releasably adhered to the object, known curable resins (such as thermosetting compositions, photosensitive resins, etc.) can be used. curable compositions, etc.). For example, curable acrylic resin, curable urethane resin, curable silicone, etc. are mentioned. It is also possible to mix several curable resins. Among them, curable silicone is particularly preferable. This is because a silicone resin obtained by curing a curable silicone is excellent in heat resistance and releasability. In addition, if curable silicone is used, it will be easily fixed to the glass substrate through a condensation reaction with silanol groups on the surface of the glass substrate described later.

As the curable resin composition, a curable silicone resin composition is preferable (a curable silicone resin composition used for a release paper is particularly preferable). Since the resin layer formed using this curable silicone resin composition adheres closely to the surface of a glass substrate and the free surface has excellent peelability, it is preferable.

Such curable silicones used as silicone resins for release paper can be classified into condensation reaction type silicones, addition reaction type silicones, ultraviolet curing type silicones, and electron beam curing type silicones according to their curing mechanism. Use either. Among these, addition reaction type silicones are particularly preferable. This is because the easiness of progress of the curing reaction, the degree of releasability at the time of forming the resin layer is good, and the heat resistance is also high.

The addition reaction type silicone resin composition contains a main ingredient and a crosslinking agent, and is a curable composition that is cured in the presence of a catalyst such as a platinum-based catalyst. Curing of the addition reaction type silicone resin composition is accelerated by heat treatment. The main agent in the addition reaction type silicone resin composition is preferably an organopolysiloxane (ie, an organoalkenyl polysiloxane) having an alkenyl group (vinyl group, etc.) bonded to a silicon atom. Among them, straight Chain), alkenyl, etc. become crosslinking points. The crosslinking agent in the addition reaction type silicone resin composition is preferably an organopolysiloxane (ie, an organohydrogenpolysiloxane) having a hydrogen atom (hydrosilyl group) bonded to a silicon atom. Among them, preferably straight chain), hydrosilyl groups, etc. become crosslinking points.

The addition reaction type silicone resin composition is cured by the addition reaction of the main agent and the crosslinking point of the crosslinking agent.

In addition, from the viewpoint that the heat resistance derived from the crosslinked structure is more excellent, the molar ratio of the hydrogen atom bonded to the silicon atom of the organohydrogenpolysiloxane to the alkenyl group of the organoalkenyl polysiloxane is preferably 0.5 ~2.

In addition, the curable silicone resin composition used for forming a release layer such as a release paper has a solvent type, an emulsion type, and a solvent-free type in the form, and any type can be used. Among these, a solvent-free type is particularly preferable. This is because it is excellent in terms of productivity, safety, and environmental characteristics. In addition, since it does not contain a solvent that generates foam during curing when forming a resin layer described later, that is, heat curing, ultraviolet curing, or electron beam curing, air bubbles are less likely to remain in the resin layer.

In addition, as a curable silicone resin composition used to form a release layer such as a release paper, specifically, as a commercially available product name or model number, KNS-320A, KS-847 (both SHIN-ETSUSILICONECO. , LTD.), TPR6700 (manufactured by MomentivePerformanceMaterialsJapanLLC), combination of vinyl silicone "8500" (manufactured by Arakawa Chemical Industry Co., Ltd.) and methyl hydrogen polysiloxane "12031" (manufactured by Arakawa Chemical Industry Co., Ltd.), vinyl silicon Combination of ketone "11364" (manufactured by Arakawa Chemical Industry Co., Ltd.) and methyl hydrogen polysiloxane "12031" (manufactured by Arakawa Chemical Industry Co., Ltd.), vinyl silicone "11365" (manufactured by Arakawa Chemical Industry Co., Ltd.) and methyl hydrogen A combination of polysiloxane "12031" (manufactured by Arakawa Chemical Industry Co., Ltd.) and the like.

In addition, KNS-320A, KS-847, and TPR6700 are curable silicone resin compositions containing a main ingredient and a crosslinking agent in advance.

(sequence of processes)

The method of coating a curable resin composition on the surface showing easy peelability of a peelable glass substrate is not specifically limited, A well-known method can be employ|adopted. For example, examples of the coating method include spray coating, die coating, spin coating, dip coating, roll coating, bar coating, screen printing, gravure coating and the like. It can be suitably selected from such methods according to the kind of curable resin composition.

In addition, the coating amount of the curable resin composition is not particularly limited, but is preferably 1 to 100 g/m ² , more preferably 5 to 20 g/m ² , from the viewpoint that an appropriate thickness of the resin layer can be obtained.

In addition, when a solvent is contained in the curable resin composition, if necessary, heat treatment to such an extent that the curable resin is not cured may be performed to volatilize the solvent.

The thickness of the uncured curable resin composition layer obtained by applying the curable resin composition on the peelable glass substrate is not particularly limited, and can be appropriately adjusted to obtain a resin layer having an appropriate thickness described later.

The external dimensions of the formed uncured curable resin composition layer are the same as or smaller than the external dimensions of the peelable glass substrate.

[Stacking process]

The lamination step S106 is to use the uncured curable resin obtained in the above-mentioned curable resin composition layer forming step S104 with the carrier substrate having an outer dimension smaller than that of the uncured curable resin composition layer. A step of laminating the composition layer on the uncured curable resin composition layer so as to leave a peripheral region not in contact with the carrier substrate to obtain a pre-cured laminate (laminate before curing treatment). In other words, the carrier substrate is laminated on the uncured curable resin composition layer so that the uncured curable resin composition layer is exposed on the outer periphery of the carrier substrate.

More specifically, as shown in (C) of FIG. 2 , through this step S106 , the carrier substrate 14 , which has a smaller external dimension than the uncured curable resin composition layer 12 , is combined with the uncured curable resin. The layer 12 is laminated on the uncured curable resin composition layer 12 so that the peripheral region 12a not in contact with the carrier substrate 14 is formed to obtain the pre-cured laminate 16 . (A) of FIG. 3 is a plan view of the laminated body 16 before curing, and as shown in the figure, the peripheral region 12 a of the uncured curable resin composition layer 12 is not in contact with the carrier substrate 14 .

Usually, on the exposed surface of the uncured curable resin composition layer 12 , due to the influence of the surface tension, a convex portion is likely to be generated near the peripheral portion (see FIG. 3(B) ). When the carrier substrate 14 is laminated, if it comes into contact with such a protrusion, a void 32 or the like may occur between the carrier substrate 14 and the uncured curable resin composition layer 12. As a result, the carrier substrate 14 and the The case of the region where the uncured curable resin composition layer 12 does not contact ((C) of FIG. 3 ). When such a region exists, the adhesiveness of the resin layer obtained in the curing step S108 to the carrier substrate 14 may decrease. In addition, the thickness of the resin layer may vary, which may also cause surface irregularities on the exposed surface of the carrier substrate with the resin layer. Furthermore, impurities entering the voids 32 may become a source of contamination of components for electronic devices, and may cause a decrease in the yield of electronic devices.

Therefore, by using the carrier substrate 14 having an outer dimension smaller than that of the uncured curable resin composition layer 12, the carrier substrate 14 can be brought into contact with the uncured curable resin composition layer 12 without contacting the convex surface. ministry contacts. As a result, the generation of regions where the carrier substrate 14 does not come into contact with the uncured curable resin composition layer 12 is further suppressed, the adhesiveness of the resin layer to the carrier substrate 14 is further improved, and the uneven thickness of the resin layer is further suppressed.

First, the carrier substrate used in this step will be described in detail, and then the procedure of the step S106 will be described in detail.

(carrier substrate)

The carrier substrate is a substrate that prevents deformation, damage, breakage, etc. of the peelable glass substrate during the production of the electronic device member in the member forming step S112 (process of manufacturing the electronic device member) described later.

As the carrier substrate, for example, a metal plate such as a glass plate, a plastic plate, or a SUS plate, or the like can be used. In the case where the member forming step S112 is accompanied by heat treatment, the carrier substrate is preferably formed of a material having a small difference in coefficient of linear expansion with the peelable glass substrate, more preferably formed of the same material as the peelable glass substrate, and the carrier substrate is preferably glass. plate. It is especially preferable that the carrier substrate is a glass plate formed of the same glass material as the peelable glass substrate.

The carrier substrate may be thicker or thinner than the peelable glass substrate. It is preferable to select the thickness of the carrier substrate based on the thickness of the peelable glass substrate, the thickness of the resin layer, and the thickness of the laminated body after cutting which will be described later. For example, in the current member forming process, member forming processes (such as cleaning, film formation, Exposure development, inspection, etc.), when the sum of the thickness of the peelable glass substrate and the thickness of the resin layer is 0.1mm, the thickness of the carrier substrate is 0.4mm. The thickness of the carrier substrate is usually preferably 0.2 to 5.0 mm.

When the carrier substrate is a glass plate, the thickness of the glass plate is preferably 0.08 mm or more for reasons such as ease of handling and resistance to breakage. In addition, the thickness of the glass plate is preferably 1.0 mm or less for the reason that it is desired to have rigidity such that it does not break and moderately bends when the member for electronic devices is peeled off after formation.

The difference between the average coefficient of linear expansion at 25 to 300°C (hereinafter referred to as "average coefficient of linear expansion") between the peelable glass substrate and the carrier substrate is preferably 500×10 ^-7 /°C or less, more preferably 300×10 ^{- 7} /°C or less, more preferably 200×10 ^-7 /°C or less. If the difference is too large, there is a possibility that the laminated body may be significantly warped during heating and cooling in the member forming step S112. When the material of the peelable glass substrate is the same as that of the carrier substrate, occurrence of such problems can be suppressed.

(sequence of processes)

The method of laminating the carrier substrate on the uncured curable resin composition layer is not particularly limited, and known methods can be employed.

For example, the method of superimposing a carrier substrate on the surface of the uncured curable resin composition layer under normal-pressure environment is mentioned. In addition, after the carrier substrate is overlaid on the surface of the uncured curable resin composition layer as needed, the carrier substrate can be pressed and bonded to the uncured curable resin composition layer using a roller or a press. Since air bubbles mixed between the uncured curable resin composition layer and the layer of the carrier substrate can be relatively easily removed by pressing with a roll or a press, it is preferable.

It is more preferable to press-bond by a vacuum lamination method or a vacuum press method, because it is possible to suppress the mixing of air bubbles and ensure good adhesion. Press-bonding under vacuum has the advantage that even if minute air bubbles remain, bubble growth will not be caused by heating, and deformation defects of the carrier substrate will not be easily caused.

When laminating the carrier substrate, it is preferable to sufficiently wash the surface of the carrier substrate in contact with the uncured curable resin composition layer, and to laminate in an environment with a high degree of cleanliness. The higher the degree of cleanliness, the better the flatness of the carrier substrate, which is preferable.

The pre-cured laminate obtained through the above steps contains a layer of a peelable glass substrate, a layer of an uncured curable resin composition, and a layer of a carrier substrate in this order.

In this embodiment, the outer dimensions of the uncured curable resin composition layer are larger than the outer dimensions of the carrier substrate. The ratio of the area A of the uncured curable resin composition layer in contact with the carrier substrate to the total area B of the uncured curable resin composition layer (area A/total area B) is preferably 0.98 or less, more preferably Preferably it is 0.95 or less. As long as it is within the above range, the occurrence of thickness unevenness of the resin layer can be further suppressed. The lower limit is not particularly limited, but is preferably 0.75 or more, more preferably 0.80 or more, from the viewpoint of productivity and the like.

In addition, the length from the outer peripheral edge of the carrier substrate to the outer peripheral edge of the uncured curable resin composition layer is preferably 10 mm or more, more preferably 15 mm or more. As long as it exists in the said range, generation|occurrence|production of thickness unevenness of a resin layer can be suppressed further. The upper limit is not particularly limited, but is preferably 100 mm or less from the viewpoint of productivity and the like.

[Curing process]

The curing step S108 is to implement a curing treatment on the pre-cured laminate obtained in the above lamination step S106, to cure the uncured curable resin composition layer in the pre-cured laminate to obtain a cured laminate having a resin layer (implemented The process of curing the laminated body). More specifically, as shown in FIG. 2(D), by performing this step, the uncured curable resin composition layer 12 is cured to obtain a resin layer 18, and a layer having a peelable glass substrate 10 in this order and Cured laminate 20 of layers of resin layer 18 and carrier substrate 14 .

Hereinafter, the sequence of the steps carried out in this step will be described in detail, and then the configuration of the obtained laminate will be described in detail.

(sequence of processes)

The curing treatment performed in this step can be appropriately selected according to the type of curable resin to be used, and usually heat treatment or exposure treatment is performed.

When the curable resin contained in the curable resin composition layer is thermosetting, the layer can be cured by subjecting the uncured curable resin composition layer to heat treatment. The conditions of the heat treatment can be suitably selected from the most suitable conditions according to the type of thermosetting resin to be used. Among them, from the viewpoint of the curing speed of the curable resin and the heat resistance of the formed resin layer, etc., heating at 150 to 300°C (preferably 180 to 250°C) for 10 to 120 minutes (preferably 30 to 60 minutes) Handling is preferred.

When the curable resin contained in the curable resin composition layer is a photocurable resin, the layer can be cured by subjecting the uncured curable resin composition layer to exposure treatment. The type of light to be irradiated at the time of exposure processing can be appropriately selected according to the type of photocurable resin, and examples thereof include ultraviolet light, visible light, infrared light, and the like. In addition, from the viewpoint of the curing speed of the curable resin and the light resistance of the formed resin layer, it is preferable that the irradiation time during the exposure treatment is 0.1 to 10 minutes (preferably 0.5 to 5 minutes).

(resin layer)

Next, the resin layer in the laminated body after hardening is demonstrated in full detail.

The thickness of the resin layer is not particularly limited, but is preferably 1 to 100 μm, more preferably 5 to 30 μm, and even more preferably 7 to 20 μm. This is because, when the thickness of the resin layer is within such a range, the adhesion between the resin layer and the carrier substrate becomes sufficient. In addition, even if air bubbles or impurities are contained between the resin layer and the carrier substrate, the occurrence of deformation defects in the peelable glass substrate can be suppressed. In addition, if the thickness of the resin layer is too thick, time and materials are required for formation, which is not economical.

In addition, the resin layer may be formed of two or more layers. In this case, "the thickness of the resin layer" means the total thickness of all layers.

In addition, when the resin layer is formed of two or more layers, the types of resins forming the respective layers may be different.

The resin layer is preferably formed of a material having a glass transition point lower than room temperature (about 25° C.) or having no glass transition point. This is because the peelable glass substrate can be peeled more easily, and the close contact with the peelable glass substrate becomes sufficient.

The type of resin forming the resin layer is not particularly limited, and varies depending on the type of resin contained in the curable resin composition. For example, acrylic resin, polyolefin resin, polyurethane resin, or silicone resin is mentioned. Among them, as described above, silicone resins are preferable.

In addition, the resin layer may contain non-curable organopolysiloxane as needed, and its content is specifically 5% by mass or less (0 to 5% by mass), preferably 0.01 to 1% by mass. When the non-curable organopolysiloxane is contained in the resin layer, the peeling of the interface between the peelable glass substrate and the resin layer in the separation step S114 described later will proceed more efficiently.

The method of making the resin layer contain the non-curable organopolysiloxane is not particularly limited, and a method of adding it to the above-mentioned curable resin composition is exemplified.

In addition, examples of the non-curable organopolysiloxane include silicone oils that do not contain an Si-H bond, specifically polydimethylsiloxane-based or polymethylphenylsiloxane-based silicone oils, and the like. .

(Laminate after curing)

The cured laminate obtained through the above curing step has a layer of a peelable glass substrate, a resin layer, and a layer of a carrier substrate in this order.

In the resulting cured laminate, the resin layer was fixed (adhered) to the carrier substrate, and also adhered to the peelable glass substrate so as to be peelable. The resin layer prevents the positional displacement of the peelable glass substrate until the operation of separating the peelable glass substrate and the carrier substrate with the resin layer is performed in the separation step S114 described later.

The surface in contact with the resin layer of the peelable glass substrate and the surface of the resin layer are adhered so as to be peelable. In this invention, the property which can peel off easily of this peelable glass substrate is called easy peelability.

In the present invention, the aforementioned fixation and (releasable) adhesion are different in peel strength (that is, stress required for peeling), and fixation means greater peel strength than adhesion. Specifically, the peel strength of the interface between the resin layer and the layer of the carrier substrate in the laminated body after curing is higher than the peel strength of the interface between the layer of the peelable glass substrate and the resin layer.

In addition, peelable adhesion means that, while being peelable, peeling can be performed without peeling of the fixing surface. Specifically, when an operation of separating the peelable glass substrate and the carrier substrate is performed in the laminated body after curing, the bonded surface is peeled, and the fixed surface is not peeled. Therefore, when the operation of separating the cured laminate into the peelable glass substrate and the carrier substrate is performed, the cured laminate is separated into two of the peelable glass substrate and the carrier substrate with the resin layer.

As described above, since the uncured curable resin composition layer is reacted and cured in a state in which the layer of the curable resin composition is in contact with the surface of the carrier substrate, the formed resin layer is firmly adhered to the surface of the carrier substrate. On the other hand, the uncured curable resin composition layer is also cured by reaction in the state of being in contact with the peelable glass substrate, but due to the easy peelability (non-adhesion) of the peelable glass substrate surface, the formed resin layer is relatively weak. The peelable glass substrate is tightly bonded to the peelable glass substrate with a weak bonding force such as a bonding force derived from the van der Waals force between solid molecules.

[Cutting process]

The cutting step S110 is a step of cutting the resin layer and the peelable glass substrate along the outer peripheral edge of the carrier substrate in the cured laminate obtained in the curing step S108. In other words, it is a step of cutting the respective outer peripheral portions of the resin layer and the peelable glass substrate in the cured laminate, and aligning the respective outer peripheral edges of the carrier substrate, the resin layer, and the peelable glass substrate. More specifically, as shown in FIG. 2(E), in this step, the resin layer 18 and the peelable glass substrate 10 are cut along the outer peripheral edge of the carrier substrate 14 to obtain a cut laminated body 22 (cutting process is performed). stacks).

Hereinafter, the procedure of this step S110 will be described in detail.

The method of cutting the resin layer and the peelable glass substrate is not particularly limited, and a known method can be employed. For example, the cutting method described based on FIGS. 4 to 6 is preferable from the viewpoint of operability and the like.

4 is a plan view showing a part of the cured laminate placed on the stage in perspective, FIG. 5 is a partially broken cross-sectional view showing the cured laminate placed on the stage and a processing head, and FIG. 6 It is a cross-sectional view showing the cured laminate and the clamping jig placed on another stage.

As shown in FIG. 4 , the main surface of the carrier substrate 14 of the cured laminate 20 is supported by the stage 50 , and the outer peripheral edge of the carrier substrate abuts on the positioning blocks 51 to 53 provided on the stage 50 .

In FIG. 4 , the exposed surface of the carrier substrate 14 is supported by the upper surface of the stage 50 , and two sides 14 a and 14 b perpendicular to each other of the rectangular carrier substrate 14 are in contact with the positioning blocks 51 to 53 . Thereafter, the moving blocks 54 , 55 approach and abut against the remaining sides 14 c , 14 d of the carrier substrate 14 .

As shown in FIG. 4 , when the outer peripheral edge of the carrier substrate 14 comes into contact with the position determination blocks 51 to 53 , the position matching accuracy between the outer peripheral edge of the carrier substrate 14 and the stage 50 becomes good. Therefore, the outer periphery of the carrier substrate 14 can be precisely aligned with the outer periphery of the resin layer 18 and the peelable glass substrate 10 .

In addition, the inside of the plurality of adsorption holes provided on the upper surface of the stage 50 is decompressed with a vacuum pump or the like, and the carrier substrate 14 is adsorbed on the upper surface of the stage 50 . A resin film or the like may be provided on the upper surface of the stage 50 in order to protect the carrier substrate 14 .

Next, the imaging device images the cured laminate 20 on the stage 50 . The captured images are sent to a computer. The computer performs image processing on the received image to detect the positional relationship between the outer peripheral edge of the carrier substrate 14 and the stage 50 .

Next, the computer relatively moves the processing head 60 for processing the cured laminate 20 with respect to the stage 50 based on the result of the image processing. The movement trajectory of the processing head 60 is controlled so as to coincide with the outer peripheral edge of the carrier substrate 14 in plan view (see FIG. 5 ).

In addition, in this embodiment, the computer uses the result of image processing to control the movement trajectory of the processing head, but instead of this, it may use information on the shape and size of the carrier substrate stored in advance in a storage medium such as a hard disk. In this case, no imaging device is required.

The processing head 60 shown in FIG. 5 is configured according to the type, thickness, and the like of the peelable glass substrate 10 . For example, the processing head 60 forms the cutting line 66 on the surface of the peelable glass substrate 10, and is comprised with the cutter 62 grade|etc.,.

The cutter 62 is, for example, disc-shaped, and its outer peripheral portion is formed of diamond, superalloy, or the like, and is rotatably supported by a holder 64 . When the outer peripheral portion of the cutter 62 is pressed against the surface of the peelable glass substrate 10, when the bracket 64 is relatively moved in the in-plane direction of the peelable glass substrate 10, the cutter 62 is rotated while cutting the peelable glass substrate 10. A cutting line 66 is formed on the surface.

Four cutting lines 66 are provided corresponding to the four sides 14 a , 14 b , 14 c , and 14 d of the rectangular carrier substrate 14 , and are formed so as to overlap with corresponding sides of the carrier substrate 14 in plan view. Each cutting line 66 extends from one side of the peelable glass substrate 10 to the other side so as to divide the surface of the peelable glass substrate 10 .

In addition, the processing head 60 of this embodiment shown in FIG. 5 is constituted by a cutter 62 and the like, but it may also be a tip scriber (pointscriber) whose tip is conical and formed of diamond, and slides into the cutting line. It may be constituted by a laser light source or the like. The laser light source irradiates spot light on the surface of the peelable glass substrate 10 . The point light scans on the surface of the peelable glass substrate 10 to form the cutting line 66 by thermal stress.

After the cutting line 66 is formed by the processing head 60, the vacuum pump stops, the suction hole is opened to the atmosphere, and the suction is released. Next, the moving blocks 54 , 55 are separated from the carrier substrate 14 , and the carrier substrate 14 is separated from the position determination blocks 51 to 53 . Thereafter, the cured laminated body 20 is lifted above the stage 50 and transferred over another stage 70 . Next, the cured laminate 20 is lowered and placed on the stage 70 (see FIG. 6 ).

Next, as shown in FIG. 6 , the pressure in the plurality of suction holes provided on the upper surface of the stage 70 is reduced by using a vacuum pump or the like, and the carrier substrate 14 is adsorbed on the upper surface of the stage 70 . In this state, one cutting line 66 is exposed outside the stage 70 .

Next, the portion outside the one cutting line 66 is pinched by the pinching jig 72 in the plate thickness direction. In this state, when the clamping jig 72 is rotated downward, a bending stress is applied to the peelable glass substrate 10 and the resin layer 18, so the crack 68 extends in the thickness direction with the single cutting line 66 as the starting point, and the peelability The glass substrate 10 and the resin layer 18 are cut together (see FIG. 6 ).

Next, the suction of the carrier substrate 14 on the stage 50 is released, and the cured laminate 20 is moved in parallel or rotated by 90°, and then sucked again. Thereafter, the peelable glass substrate 10 and the resin layer 18 are cut along another one cutting line 66 . This operation is repeated, and the peelable glass substrate 10 and the resin layer 18 are cut along the four cutting lines 66 .

In addition, in this embodiment, in order to cut|disconnect, the laminated body after hardening was transferred from the stage 50 to another stage 70, However, You may perform cutting|disconnection after moving parallelly or rotating 90 degrees on the same stage 50. In addition, chamfering may be performed on the cut portion as needed.

[Part formation process]

The member forming step S112 is a step of forming an electronic device member on the second main surface of the peelable glass substrate in the cut laminate obtained in the cutting step S110 to obtain a laminate with the electronic device member.

More specifically, as shown in FIG. 2(F), the electronic device member 24 is formed on the second main surface 10b of the peelable glass substrate 10 to obtain a laminate 26 with the electronic device member.

First, the electronic device member used in this process will be described in detail, and then the sequence of the steps will be described in detail.

(Components for Electronic Devices (Functional Components))

The electronic device member is a member constituting at least a part of the electronic device formed on the second main surface of the peelable glass substrate in the cut laminate. More specifically, examples of members for electronic devices include members used in electronic components such as panels for display devices, solar cells, thin-film secondary batteries, and semiconductor wafers on which circuits are formed. Examples of panels for display devices include organic EL panels, plasma display panels, field emission panels, and the like.

For example, as a solar cell member, in the silicon type, transparent electrodes such as tin oxide for the positive electrode, silicon layers represented by p-layer/i-layer/n-layer, and metals for the negative electrode, etc., and others include compound-type , dye-sensitized type, quantum dot type and other corresponding components.

In addition, as a member for a thin-film secondary battery, transparent electrodes such as metals or metal oxides for the positive electrode and the negative electrode, lithium compounds for the electrolyte layer, metals for the collector layer, and resins for the encapsulation layer, etc., are listed in the lithium ion type. Other examples include various members corresponding to nickel hydrogen type, polymer type, ceramic electrolyte type, and the like.

In addition, as members for electronic components, metals for conductive parts, silicon oxide and silicon nitride for insulating parts can be mentioned in CCD and CMOS, and various sensors such as pressure sensors and acceleration sensors, rigid printed circuit boards, etc. , flexible printed circuit boards, rigid flexible printed circuit boards, and other corresponding components.

(sequence of processes)

The manufacturing method of the above-mentioned laminated body with electronic device members is not particularly limited, and the second main surface of the peelable glass substrate of the laminated body is cut by a conventionally known method according to the type of constituent members of the electronic device member. A component for an electronic device is formed on it.

In addition, the member for an electronic device may not be all of the members finally formed on the second main surface of the peelable glass substrate (hereinafter referred to as "all members"), but may be a part of all members (hereinafter referred to as "partial members"). The peelable glass substrate with partial members peeled from the resin layer may be formed into a peelable glass substrate with all members (corresponding to an electronic device described later) in a subsequent process.

Alternatively, an electronic device may be produced by assembling a laminate with all the members, and then peeling off the carrier substrate with the resin layer from the laminate with all the members. Furthermore, an electronic device may be assembled using two laminates with all the components, and then the two carrier substrates with resin layers may be peeled off from the laminate with all the components to manufacture an electronic device.

For example, in the case of manufacturing an OLED, in order to form an organic EL structure on the surface (corresponding to the second main surface of the peelable glass substrate) of the laminated body opposite to the resin layer side of the peelable glass substrate after cutting Formation of transparent electrodes, further deposition of hole injection layer, hole transport layer, light emitting layer, electron transport layer, etc. on the surface of the transparent electrode, formation of back electrode, packaging with packaging board, etc. Various layer formation and processing . Specific examples of these layer formation and treatments include film formation treatment, vapor deposition treatment, bonding treatment of a package board, and the like.

In addition, for example, the manufacturing method of TFT-LCD has the following various steps: TFT forming step, on the second main surface of the peelable glass substrate of the laminated body after cutting, using a resist solution, by CVD method and sputtering patterning on a metal film and a metal oxide film formed by a general film-forming method such as a method to form a thin-film transistor (TFT); , using a resist solution in pattern formation to form a color filter (CF); and a lamination process of combining the laminate with TFT obtained in the TFT formation process and the laminate with CF obtained in the CF formation process with TFT and The relative way of CF is laminated by encapsulant (seal); etc.

In the TFT formation step and the CF formation step, TFTs and CFs are formed on the second main surface of the peelable glass substrate using well-known photolithography techniques, etching techniques, and the like. In this case, a resist solution can be used as the coating solution for pattern formation.

Moreover, before forming TFT and CF, you may wash|clean the 2nd main surface of a peelable glass substrate as needed. As a washing method, well-known dry washing and wet washing can be used.

In the bonding step, for example, a liquid crystal material is injected between the laminated body with TFT and the laminated body with CF, and they are laminated. As a method of injecting the liquid crystal material, there are, for example, a reduced-pressure injection method and a dropping injection method.

[Separation process]

The separation step S114 is to remove the carrier substrate with the resin layer including the resin layer and the carrier substrate from the laminated body of the member with the electronic device obtained in the above-mentioned member forming step S112, using the interface between the releasable glass substrate and the resin layer as the peeling surface. , A step of obtaining an electronic device having a peelable glass substrate and a member for an electronic device. More specifically, as shown in FIG. 2(G), through this step S114, the laminated body 26 with electronic device components is separated and removed from the carrier substrate 28 with a resin layer to obtain a laminate including a peelable glass substrate 10 and electronic components. The electronic device 30 of the device member 24 .

When the electronic device member on the peelable glass substrate at the time of peeling is part of the formation of all necessary constituent members, the remaining constituent members may be formed on the peelable glass substrate after separation.

The method of peeling a peelable glass substrate and a resin layer is not specifically limited. Specifically, for example, a sharp knife-shaped object may be inserted at the interface between the peelable glass substrate and the resin layer to give an opportunity for peeling, and then, for example, a mixed fluid of water and compressed air may be blown to perform peeling. Preferably, in the laminated body with the electronic device member, the carrier substrate is on the upper side and the electronic device member is on the lower side. , First, the cutting tool is inserted into the interface between the peelable glass substrate and the resin layer. Thereafter, the side of the carrier substrate is sucked by a plurality of vacuum suction pads, and the vacuum suction pads are sequentially raised from the vicinity of the position where the cutting tool is inserted. In this way, an air layer is formed at the interface between the peelable glass substrate and the resin layer, and the air layer spreads over the entire interface, so that the carrier substrate with the resin layer can be easily peeled off.

In addition, when removing the carrier substrate with the resin layer from the laminated body with electronic device components, it is possible to suppress static electricity that may affect the electronic device by blowing with an ionizer and controlling humidity. Alternatively, a static-dissipating circuit and a protection circuit may be incorporated in the electronic device to conduct conduction from the terminal portion to the outside of the laminated body.

The electronic device obtained through the above steps is suitable for the manufacture of small display devices used in mobile terminals such as cellular phones and PDAs. The display device is mainly LCD or OLED, and the LCD includes TN type, STN type, FE type, TFT type, MIM type, IPS type, VA type and the like. Basically, it can be applied to any display device of a passive drive type or an active drive type.

[Second Embodiment]

7 is a flowchart showing manufacturing steps in another embodiment of the method of manufacturing an electronic device according to the present invention. As shown in FIG. 7, the manufacturing method of an electronic device includes a surface treatment step S102, a curable resin composition layer forming step S104, a lamination step S106, a defoaming step S116, a curing step S108, a cutting step S110, a member forming step S112, and Separation process S114.

Each process shown in FIG. 7 is in the same order as the process shown in FIG. 1 except that the degassing process S116 is provided, and the same reference numerals are used in the same process, and their descriptions are omitted. Step S116 will be described.

[Degassing process]

The defoaming process S116 is a process of performing defoaming treatment of the uncured curable resin composition layer after the lamination process S106 and before the hardening process S108. By providing this step S116, air bubbles and volatile components can be removed from the uncured curable resin composition layer, and the adhesiveness between the obtained resin layer and the carrier substrate can be further strengthened.

The treatment method of the degassing step can be appropriately selected according to the material of the uncured curable resin composition layer used, for example, degassing under reduced pressure using a vacuum pump, centrifugal degassing using centrifugal force , Ultrasonic defoaming using an ultrasonic defoaming device, etc. From the viewpoint of productivity and the like, vacuum degassing is preferably performed under reduced pressure, and as the condition, degassing is preferably performed at 1000 Pa or less (preferably 100 Pa or less) for about 1 to 30 minutes.

Example

Hereinafter, the present invention will be specifically described by way of examples and the like, but the present invention is not limited by these examples.

In the following Examples 1 and 4 to 6, and Comparative Examples 1 to 2, as a glass substrate for a peelable glass substrate, a glass plate (length 760 mm, width 640 mm, plate thickness 0.3 mm) formed by alkali-free borosilicate glass was used. , coefficient of linear expansion 38×10 ^-7 /°C, product name "AN100" manufactured by Asahi Glass Co., Ltd.). In addition, as the carrier substrate, a glass plate made of the same alkali-free borosilicate glass (length 720 mm, width 600 mm, plate thickness 0.7 mm, linear expansion coefficient 38×10 ^-7 /°C, trade name "AN100" manufactured by Asahi Glass Co., Ltd. ").

(Example 1)

A glass substrate used as a peelable glass substrate is cleaned with pure water or UV to clean its surface. Thereafter, a mask was applied to the second main surface which is one side of the glass substrate, and then a heptane solution having a silicone oil content of 1% by mass was sprayed on the opposite first main surface and dried. As the silicone oil, dimethyl polysiloxane (manufactured by Dow Corning Corporation, SH200, kinematic viscosity of 190 to 210 mm ² /s) was used. Next, heat processing was performed at 350 degreeC for 5 minutes in order to reduce the molecular weight of a silicone oil, and the peelable glass substrate was obtained.

Then, when the water contact angle of the first main surface of the peelable glass substrate was measured using a contact angle meter (manufactured by KRUSS, DROPSHAPEANALYSIS SYSTEM DSA10Mk2), it was 100°.

In addition, when the average surface roughness Ra of the first main surface of the peelable glass substrate was measured using an atomic force microscope (manufactured by Pacific Nanotechnology, NanoScopeIIIa; ScanRate1.0Hz, SampleLines256, Off-lineModifyFlattenorder-2, Planefitorder-2), the result was 0.5 nm. The average surface roughness Ra was calculated from the measured values around the measurement range of 10 μm.

Next, on the first main surface of the peelable glass substrate, linear organoalkenylpolysiloxane (vinyl silicone, manufactured by Arakawa Chemical Industry Co., Ltd. ), and a mixture of methyl hydrogen polysiloxane (manufactured by Arakawa Chemical Industry Co., Ltd., 12031) and a platinum-based catalyst (manufactured by Arakawa Chemical Industry Co., Ltd., CAT12070) having a hydrosilyl group in the molecule, with a length of 750 mm, A rectangular shape with a width of 630 mm was applied, and an uncured curable silicone-containing layer was provided on a peelable glass substrate (coating amount: 35 g/m ² ). Here, the mixing ratio of the linear organoalkenylpolysiloxane and the methylhydrogenpolysiloxane was adjusted so that the molar ratio of the vinyl group to the hydrosilyl group became 1:1. In addition, the platinum-based catalyst was 5 parts by mass relative to 100 parts by mass of the total of the linear organoalkenylpolysiloxane and the methylhydrogenpolysiloxane.

Next, the surface (first main surface) of the carrier substrate having a plate thickness of 0.4 mm on the side in contact with the silicone resin was washed with pure water, and then cleaned by UV washing. Thereafter, the first main surface of the carrier substrate and the uncured curable silicone-containing layer were bonded together by vacuum pressing at room temperature, and left at 30 Pa for 5 minutes to carry out the uncured curable silicone-containing layer. The defoaming treatment of the layer gave the laminated body A0 before curing. At this time, the carrier substrate was laminated on the uncured curable silicone-containing layer so that a peripheral region not in contact with the carrier substrate was left in the uncured curable silicone-containing layer. However, the length from the outer peripheral edge of the carrier substrate to the outer peripheral edge of the uncured curable resin composition layer is about 15 mm or more. The ratio of the area A of the uncured curable resin composition layer in contact with the carrier substrate to the total area B of the uncured curable resin composition layer (area A/total area B) was 0.91.

Next, this was heated and cured in air at 250° C. for 30 minutes to obtain a cured laminate A1 including a cured silicone resin layer having a thickness of 10 μm.

Next, the carrier substrate of the laminated body A1 after curing is fixed on a platform equipped with a position determining jig, and the second layer of the peelable glass substrate is placed on the second side of the peelable glass substrate in a manner that overlaps with one side of the outer periphery of the carrier substrate from the upper surface of the platform. 2. Cut the cut line with a diamond wheel cutter on the main surface, and then clamp the outside of the cut line of the peelable glass substrate with a clamping jig and cut it off. Similarly, the outer side of the peelable glass that overlaps with the remaining three sides of the outer peripheral edge of the carrier substrate is cut, and then the cut section of the peelable glass substrate is ground and chamfered with a whetstone having a curved surface to obtain a cut laminate A2 .

Next, the surface (second main surface) opposite to the silicone resin contact surface of the peelable glass substrate in the laminated body A2 after cutting is vacuum-adsorbed on the platform, and on this basis, the four corners of the peelable glass substrate A stainless steel blade with a thickness of 0.1 mm was inserted at the interface between the releasable glass substrate and the silicone resin layer at one corner, and a peeling opportunity was provided at the interface between the releasable glass substrate and the silicone resin layer. Next, the surface of the carrier substrate was adsorbed by 24 vacuum suction pads, and thereafter, the pads were raised sequentially from the suction pads close to the corners of the inserted cutting tools. Here, the cutting tool is inserted while blowing an antistatic fluid from an ionizer (manufactured by KEYENCE CORPORATION) to the interface. Next, the vacuum adsorption pad was pulled up while continuously blowing the static-eliminating fluid from the ionizer toward the formed gap. As a result, the carrier substrate having the silicone resin layer formed on the first main surface (carrier substrate with resin layer) can be peeled off on the stage. At this time, no adhesion of the silicone resin was observed visually on the surface (first main surface) of the peelable glass substrate that was in close contact with the silicone resin layer. Also, from this result, it was confirmed that the peel strength at the interface between the resin layer and the carrier substrate layer was higher than the peel strength at the interface between the peelable glass substrate layer and the resin layer.

(Example 2)

A post-cut laminate B2 was obtained by the same method as in Example 1 except that a glass plate made of soda lime glass was used as the carrier substrate and the glass substrate. In addition, the sizes of the carrier substrate and glass substrate used were the same as those of the carrier substrate and glass substrate used in Example 1.

Next, the carrier substrate with the resin layer was peeled from the laminated body B2 after cutting by the same method as Example 1, and the soda-lime glass substrate B3 (peelable glass substrate) was obtained. At this time, no adhesion of the silicone resin was visually observed on the surface (first main surface) of the soda lime glass substrate B3 closely bonded to the silicone resin layer.

(Example 3)

A post-cut laminate C2 was obtained by the same method as in Example 1 except that a glass plate formed of a chemically strengthened glass plate was used as the carrier substrate and the glass substrate. In addition, the sizes of the carrier substrate and glass substrate used were the same as those of the carrier substrate and glass substrate used in Example 1.

Next, by the method similar to Example 1, the carrier substrate with a resin layer was peeled from the cut laminated body C2, and the chemically strengthened glass substrate C3 (peelable glass substrate) was obtained. At this time, no adhesion of the silicone resin was visually observed on the surface (first main surface) of the glass substrate C3 closely adhered to the silicone resin layer.

(Example 4)

The first main surface of the glass substrate, that is, the surface on the side in contact with the silicone resin, is cleaned with pure water, followed by UV cleaning, and then magnetron sputtering (heating temperature 300°C, film forming pressure 5mTorr, power density 0.5W/cm ² ) form a 10nm-thick indium tin oxide film (sheet resistance 300Ω/□), and then spray silicone oil on the indium tin oxide film with a content of 1% by mass The heptane solution was dried, and the laminated body D2 after cutting was obtained by the same method as Example 1.

Next, by the same method as in Example 1, the carrier substrate with the resin layer was peeled from the cut laminate D2 to obtain a glass substrate D3 (peelable glass substrate) in which a thin film layer of indium tin oxide was formed on the first main surface. At this time, no adhesion of the silicone resin was visually observed on the surface (first main surface) of the glass substrate D3 closely adhered to the silicone resin layer.

(Example 5)

In this example, an OLED was fabricated using the cut laminate A2 obtained in Example 1.

More specifically, on the second main surface of the peelable glass substrate of the laminated body A2 after cutting, molybdenum was formed into a film by the sputtering method, and a gate electrode was formed by etching using the photolithography method. Next, silicon nitride, intrinsic amorphous silicon, and n-type amorphous silicon are further deposited in this order on the second main surface side of the peelable glass substrate on which the gate electrode is provided by plasma CVD, and then, by Molybdenum is formed into a film by sputtering, and a gate insulating film, a semiconductor element portion, and source/drain electrodes are formed by etching using photolithography. Next, silicon nitride was further formed into a passivation layer on the second main surface side of the peelable glass substrate by plasma CVD, and indium tin oxide was formed by sputtering. Etching to form pixel electrodes.

Next, on the second main surface side of the peelable glass substrate, 4,4',4"-tris(3-methylphenylphenylamino)triphenylamine is further sequentially deposited as holes by vapor deposition. Injection layer, bis[(N-naphthyl)-N-phenyl]benzidine as hole transport layer, mixed with 2,6-bis[4-[N -(4-methoxyphenyl)-N-phenyl]aminostyryl]naphthalene-1,5-dinitrile (BSN-BCN) 40% by volume was used as the light emitting layer, and Alq ₃ was used as the electron transport layer. Then, on the second main surface side of the peelable glass substrate, aluminum is formed into a film by sputtering, and a counter electrode is formed by etching using photolithography. Next, on the second main surface of the peelable glass substrate with the counter electrode On the other side, another glass substrate is bonded via an ultraviolet curing adhesive layer for encapsulation. The laminated body A2 after cutting, which has an organic EL structure on a peelable glass substrate obtained by the above procedure, is equivalent to that of the tape carrier substrate. Panel for a display device (panel A2) (laminated body with a member for an electronic device).

Next, the package side of panel A2 was vacuum-adsorbed on the platform, and on this basis, a stainless steel cutting tool with a thickness of 0.1 mm was inserted at the interface between the peelable glass substrate and the silicone resin layer at the corner of panel A2, and the The carrier substrate with the resin layer was separated to obtain an OLED panel (equivalent to an electronic device. Hereinafter referred to as panel A).

When the produced panel A was connected to an IC driver and driven, no display unevenness was observed in the driving region.

(Example 6)

In this example, an LCD was fabricated using the cut laminate A2 obtained in Example 1.

Prepare two cut laminates A2, first, molybdenum is formed into a film by sputtering on the second main surface of the peelable glass substrate of one cut laminate A2, and a gate is formed by etching using photolithography. electrode. Next, silicon nitride, intrinsic amorphous silicon, and n-type amorphous silicon are further deposited in this order on the second main surface side of the peelable glass substrate on which the gate electrode is provided by plasma CVD, and then, by Molybdenum is formed into a film by sputtering, and a gate insulating film, a semiconductor element portion, and source/drain electrodes are formed by etching using photolithography. Next, silicon nitride was further formed into a passivation layer on the second main surface side of the peelable glass substrate by plasma CVD, and then indium tin oxide was formed by sputtering. Etching to form pixel electrodes. Next, on the second main surface of the peelable glass substrate on which the pixel electrodes were formed, a polyimide resin solution was applied by a roll coating method, thermally cured to form an alignment layer, and polished. The obtained cut laminated body A2 is called cut laminated body A2-1.

Next, on the second main surface of the peelable glass substrate of the other cut laminated body A2, chromium was formed into a film by the sputtering method, and a light shielding layer was formed by etching using the photolithography method. Next, on the second main surface side of the peelable glass substrate provided with the light-shielding layer, a color resist was further applied by a die coating method, and a color filter layer was formed by photolithography and thermosetting. Next, on the second main surface side of the peelable glass substrate, indium tin oxide was further formed into a film by a sputtering method to form a counter electrode. Next, on the second main surface of the peelable glass substrate provided with the counter electrode, an ultraviolet curable resin solution was applied by a die coating method, and columnar spacers were formed by photolithography and thermosetting. Next, on the second main surface of the peelable glass substrate on which the columnar spacers were formed, a polyimide resin liquid was applied by a roll coating method, and an alignment layer was formed by thermosetting, followed by polishing. Next, on the second main surface side of the peelable glass substrate, the resin liquid for encapsulation was drawn into a frame shape by the dispenser method, and the liquid crystal was dripped in the frame by the dispenser method, and then the above-mentioned cut laminated body A2-1 was used, The 2nd main surface side of the peelable glass substrate of the laminated body A2 after two cuts was bonded together, and the laminated body which has an LCD panel was obtained by ultraviolet curing and thermosetting. Hereinafter, the laminated body which has an LCD panel here is called laminated body B2 with a panel.

Next, in the same manner as in Example 1, the carrier substrate with resin layers on both sides was peeled off from the laminate with panels B2 to obtain an LCD panel B (equivalent to in electronic devices).

When the produced LCD panel B was connected to an IC driver and driven, no display unevenness was observed in the driving region.

(comparative example 1)

In the same manner as in Example 1, the first main surface of the carrier substrate was cleaned with pure water washing and UV washing.

Next, the mixed solution of the linear organoalkenylpolysiloxane having a vinyl group at the terminal, the methylhydrogenpolysiloxane having a hydrosilyl group in the molecule, and a platinum-based catalyst in Example 1 A mixture of 99.5 parts by mass and 0.5 parts by mass of silicone oil (manufactured by Dow Corning Corporation, SH200) was applied on the first main surface of the carrier substrate by screen printing. Next, this was heat-cured at 250° C. for 30 minutes in the air to form a cured silicone resin layer having a thickness of 10 μm.

Next, the first main surface of the glass substrate is cleaned by washing with pure water and UV, and then it is adhered to the silicone resin layer formed on the first main surface of the carrier substrate by vacuum pressing at room temperature, A laminated body P1 was obtained.

Next, an OLED was fabricated on the glass substrate of the laminate P1 in the same procedure as in Example 5, and then the carrier substrate with the resin layer was peeled off to obtain an OLED panel (hereinafter referred to as panel P).

When the manufactured panel P was connected to an IC driver and driven, display unevenness was confirmed in the drive region, and defective portions existed in portions corresponding to the vicinity of the ends of the laminated body P1.

(comparative example 2)

In the same manner as in Comparative Example 1, two laminates P1 were obtained.

Next, according to the procedure similar to Example 6, the laminated body which has an LCD panel was obtained using the laminated body P1 of 2 sheets. Furthermore, the carrier substrate with the resin layer on both surfaces was peeled off from the obtained laminated body, and the LCD panel (henceforth panel Q) was obtained.

When the produced panel Q was connected to an IC driver and driven, display unevenness was confirmed in the driving region, and defective portions existed in portions corresponding to the vicinity of the ends of the laminated body P1.

As shown in Examples 5 and 6 above, according to the method of manufacturing an electronic device of the present invention, an electronic device having excellent performance can be manufactured with good yield.

On the other hand, in the conventional method described in Patent Document 1, as shown in the above-mentioned Comparative Examples 1 and 2, the performance of the obtained electronic device may decrease. In Comparative Examples 1 and 2, display unevenness was observed near the end portion (peripheral portion) of the electronic device. This is considered to be caused by, as described above, in the resin layer obtained by the curing treatment (especially near the outer periphery of the resin layer), due to uneven thickness, a void is generated between the glass substrate and the resin layer, and impurities enter the void. The performance of the electronic device is reduced.

This application is based on Japanese patent application 2011-225239 for which it applied on October 12, 2011, The content is taken in here as a reference.

Claims (10)

1. a manufacture method for electronic installation, it is the manufacture method of the electronic installation comprising fissility glass substrate and use for electronic equipment component,

This manufacture method possesses:

Surface treatment procedure, has described 1st interarea of the glass substrate of the 1st interarea and the 2nd interarea, obtains the fissility glass substrate with the surface showing easy fissility with remover process;

Cured resin composition layer formation process, the surface of the easy fissility of display of described fissility glass substrate is coated with hardening resin composition, forms uncured cured resin composition layer;

Lamination process, to there is the carrier substrate of the appearance and size less than the appearance and size of described uncured cured resin composition layer, to reserve the mode of the peripheral edge margin do not contacted with described carrier substrate in described uncured cured resin composition layer, be layered in described uncured cured resin composition layer, obtain solidifying front duplexer;

Curing process, makes the described uncured cured resin composition layer solidification before described solidification in duplexer, obtains having duplexer after the solidification of resin bed;

Cut off operation, the outer peripheral edge of the described carrier substrate after described solidification in duplexer, cuts off described resin bed and described fissility glass substrate;

Component formation process, described 2nd interarea of described fissility glass substrate forms use for electronic equipment component, obtains the duplexer of electronic device component; With

Separation circuit, is separated the electronic installation with described fissility glass substrate and described use for electronic equipment component from the duplexer of described electronic device component.

2. the manufacture method of electronic installation according to claim 1, wherein, after described lamination process and before described curing process, also possesses the bubble removal step of the deaeration process carrying out described uncured cured resin composition layer.

3. the manufacture method of electronic installation according to claim 1 and 2, wherein, described remover contains the compound with methyl silicane base or fluoro-alkyl.

4. the manufacture method of electronic installation according to claim 1 and 2, wherein, described remover contains silicone oil or fluorine based compound.

5. the manufacture method of electronic installation according to claim 1 and 2, wherein, described resin bed contains silicone resin.

6. the manufacture method of electronic installation according to claim 1 and 2, wherein, described resin bed is by having the olefinic organic based polysiloxane of thiazolinyl and having the solidfied material with the addition reaction-type silicone be combined to form of the organic hydrogen polysiloxanes of the hydrogen atom of silicon atom bonding.

7. the manufacture method of electronic installation according to claim 6, wherein, described organic hydrogen polysiloxanes be 0.5 ~ 2 with the mol ratio of the hydrogen atom of silicon atom bonding and the thiazolinyl of described olefinic organic based polysiloxane.

8. the manufacture method of electronic installation according to claim 1 and 2, wherein, described resin bed contains the organopolysiloxane of the non-curable of below 5 quality %.

9. the manufacture method of electronic installation according to claim 1 and 2, wherein, in described cut-out operation, support the interarea of the carrier substrate after described solidification in duplexer with microscope carrier, and make the periphery of described carrier substrate determine that block abuts with the position be arranged on described microscope carrier.

10. the manufacture method of electronic installation according to claim 1 and 2, wherein, in described cut-out operation, the surface of the fissility glass substrate after described solidification in duplexer forms line of cut, then along this line of cut, the fissility glass substrate in duplexer after described solidification and resin bed peripheral part separately are together cut off.