TW201543033A - 檢測試片之製造方法 - Google Patents
檢測試片之製造方法 Download PDFInfo
- Publication number
- TW201543033A TW201543033A TW103115712A TW103115712A TW201543033A TW 201543033 A TW201543033 A TW 201543033A TW 103115712 A TW103115712 A TW 103115712A TW 103115712 A TW103115712 A TW 103115712A TW 201543033 A TW201543033 A TW 201543033A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- metal
- layer
- test strip
- electroless plating
- Prior art date
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 73
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- 238000000034 method Methods 0.000 claims abstract description 27
- 238000000059 patterning Methods 0.000 claims abstract description 9
- 238000007772 electroless plating Methods 0.000 claims description 27
- 150000002500 ions Chemical class 0.000 claims description 22
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- 229910021645 metal ion Inorganic materials 0.000 claims description 13
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 12
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 7
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- 230000000873 masking effect Effects 0.000 claims description 6
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- 229910052763 palladium Inorganic materials 0.000 claims description 6
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- 238000011161 development Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 claims description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 4
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 4
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- 239000010949 copper Substances 0.000 claims description 3
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- 229910052799 carbon Inorganic materials 0.000 description 6
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 5
- 238000004166 bioassay Methods 0.000 description 5
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- 206010012601 diabetes mellitus Diseases 0.000 description 4
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- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 2
- AJPJDKMHJJGVTQ-UHFFFAOYSA-M sodium dihydrogen phosphate Chemical compound [Na+].OP(O)([O-])=O AJPJDKMHJJGVTQ-UHFFFAOYSA-M 0.000 description 2
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- BAERPNBPLZWCES-UHFFFAOYSA-N (2-hydroxy-1-phosphonoethyl)phosphonic acid Chemical compound OCC(P(O)(O)=O)P(O)(O)=O BAERPNBPLZWCES-UHFFFAOYSA-N 0.000 description 1
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- TVWHNULVHGKJHS-UHFFFAOYSA-N Uric acid Natural products N1C(=O)NC(=O)C2NC(=O)NC21 TVWHNULVHGKJHS-UHFFFAOYSA-N 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
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- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
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- QAOWNCQODCNURD-UHFFFAOYSA-M hydrogensulfate Chemical group OS([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-M 0.000 description 1
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- 230000000926 neurological effect Effects 0.000 description 1
- 229910000159 nickel phosphate Inorganic materials 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
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- WBHQBSYUUJJSRZ-UHFFFAOYSA-M sodium bisulfate Chemical compound [Na+].OS([O-])(=O)=O WBHQBSYUUJJSRZ-UHFFFAOYSA-M 0.000 description 1
- 229910000342 sodium bisulfate Inorganic materials 0.000 description 1
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- 229940116269 uric acid Drugs 0.000 description 1
- 208000019553 vascular disease Diseases 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/28—Electrolytic cell components
- G01N27/30—Electrodes, e.g. test electrodes; Half-cells
- G01N27/327—Biochemical electrodes, e.g. electrical or mechanical details for in vitro measurements
- G01N27/3271—Amperometric enzyme electrodes for analytes in body fluids, e.g. glucose in blood
- G01N27/3272—Test elements therefor, i.e. disposable laminated substrates with electrodes, reagent and channels
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/26—Roughening, e.g. by etching using organic liquids
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Inorganic Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Biochemistry (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Electrochemistry (AREA)
- Molecular Biology (AREA)
- Hematology (AREA)
- Biophysics (AREA)
- Chemically Coating (AREA)
Abstract
本發明中檢測試片之製造方法包含下列步驟：提供一基板；形成遮蔽層於該基板其中一表面；進行圖案化製程，將該遮蔽層形成圖案化，而於該基板表面形成覆蓋有遮蔽層之區段以及未覆蓋有遮蔽層之裸露區段；形成一離子引體於該基板之裸露區段表面；進行第一次化學鍍覆，於上述之離子引體表面形成第一金屬層；剝離遮蔽層，將該基板表面之遮蔽層移除；以及進行第二次化學鍍覆，於上述之第一金屬層表面形成第二金屬層，藉以形成線路金屬圖案總成。利用形成有線路金屬圖案總成的基板，製得一檢測試片。
Description
本發明係有關一種檢測試片之製造方法，特別是指一種簡便製造具有金屬電極的檢測試片之製造方法。
隨著醫療科技的進步，國人平均壽命不斷的延長，使得慢性病逐漸取代急性傳染病，成為國人主要死因之一。其中，又以糖尿病為國人罹患率最高的慢性病。
糖尿病若無法及早診斷、早期治療，糖尿病將引發諸多併發症，例如：視網膜病變、神經與血管病變和腎病，甚至引發瞎眼、截肢、高血壓、中風甚而死亡。是以，如何長期、定期追蹤管理患者的血糖、血壓，控制糖尿病病情，進而預防或延緩其他併發症的發生，便成為十分重要的課題。
為了提升患者自我監測血糖的便利性，目前已發展出許多簡易型血糖檢測裝置，供患者定期自行檢測血糖濃度。然而，血糖檢測裝置並需搭配生物檢測片一起使用，才能進行血糖濃度的測定。故，生物檢測片的成本、耗損、檢測精準度、量測時間等便成為相當重要的產品指標。
而目前普遍使用的碳墨式生物檢測片由下至上依序堆疊有基板、導電銀膠層、導電碳墨層、保護層及生物材料層。然而，導電碳墨層的存在會壓縮導電銀膠層的厚度，致使碳墨式生物檢測片容易有導電度不均勻或過低等問題產生，進而難以將
檢測誤差值控制於±15%以內。且碳墨式生物檢測片開封後易受潮，造成檢測誤差值變大，影響檢測準確性。
故近年來，為因應檢測檢體量減少的市場需求，電極面積亦必須隨之減少，如何在電極面積縮小後依然維持一定的電流響應遂成為電極材料設計的重要課題，其中金屬電極的應用提供了一個有效的解決方式。
依據目前製造具有金屬電極的生化感測試片的方法，有以下幾種。1、使用金屬塊材以及表面處理來製造。2、於基板上形成金屬薄膜後，以雷雕金屬技術，用雷射蝕刻並定義電極圖案，其優點是技術成熟，而缺點是金屬浪費，還有雷射時間會隨圖案複雜度而增加。3、如印刷電路版或半導體黃光製程的技術，需底片或光罩等來定義電極圖案，製造成本相對昂貴，製程繁瑣，需要塗佈光阻、微影製程、烘烤、蝕刻或舉離等的步驟，且同樣存在金屬浪費的問題。
由上述說明可知，目前電化學生物感測試片導電電極的製法無法兼具快速、便宜及高品質等優點，仍有必要再提出更經濟且簡單的製造方法。
有鑒於此，本發明主要提供一種簡便製造具有金屬電極的檢測試片之製造方法，為其主要目的者。
為達上揭目的，本發明中檢測試片之製造方法包含下列步驟：提供一基板；形成遮蔽層於該基板其中一表面；進行圖案化製程，將該遮蔽層形成圖案化，而於該基板表面形成覆蓋有遮蔽層之區段以及未覆蓋有遮蔽層之裸露區段；形成一離子引體於該基板之裸露區段表面；進行第一次化學鍍覆，於上述之離子引體表面形成第一金屬層；剝離遮蔽層，將該基板表面之遮蔽
層移除；以及進行第二次化學鍍覆，於上述之第一金屬層表面形成第二金屬層，藉以形成線路金屬圖案總成。利用形成有線路金屬圖案總成的基板，製得一檢測試片。
依據上述主要結構特徵，所述基板具有一改質表面，而該遮蔽層則設置於該改質表面之上。
依據上述主要結構特徵，所述基板表面藉由鹼性藥水軟化材料鍵結而形成一改質表面。
依據上述主要結構特徵，所述遮蔽層係由壓合乾膜方式或印刷濕膜方式設置於該基板其中一表面。
依據上述主要結構特徵，所述圖案化製程係由負片製程進行曝光、顯影而成。
依據上述主要結構特徵，所述基板浸置於一活性金屬離子之液體中，令金屬離子吸附至該裸露區段之表面而形成離子引體。
依據上述主要結構特徵，所述活性金屬離子係為鈀離子或第8族金屬離子。
依據上述主要結構特徵，所述第一次化學鍍覆係將該基板置於一化學鍍液中，以化學方式於該離子引體上形成該第一金屬層，其中該化學鍍液中包含有用以形成該第一金屬層之一待鍍金屬的化合物，其中該待鍍金屬為鎳。
依據上述主要結構特徵，所述第二次化學鍍覆係將該基板置於一化學鍍液中，以化學方式於該第一金屬層上形成該第二金屬層，其中該化學鍍液中包含有用以形成該第二金屬層之一待鍍金屬的化合物，其中該待鍍金屬為金、銀、銅、鎳、鈦、鈀的至少其中之一。
10‧‧‧基板
11‧‧‧裸露區段
12‧‧‧改質表面
20‧‧‧遮蔽層
31‧‧‧光罩
40‧‧‧離子引體
50‧‧‧第一金屬層
60‧‧‧第二金屬層
第一圖係為本發明中製造方法之流程示意圖。
第二圖(A)~(G)係為本發明中製造方法之結構示意圖。
第三圖係為本發明中檢測試片之放大示意圖。
第四圖係為本發明中檢測試片之另一放大示意圖。
如第一圖及第二圖(A)~(G)所示，本發明之製造方法包含下列步驟：
提供一基板10，該基板10係為聚對苯二甲酸乙二酯(polyethylene terephthalate；PET)。
形成遮蔽層20於該基板10其中一表面；其中，該遮蔽層20可利用壓合乾膜方式或印刷濕膜方式設置於該基板10其中一表面。
進行圖案化製程，將該遮蔽層20形成圖案化；其中，可由負片製程進行曝光、顯影而進行圖案化，如第二圖(B)所示，提供一光罩31放置於該遮蔽層20上方，進行曝光、顯影後，而將特定區段之遮蔽層剝除，最後，如第二圖(C)所示，於該基板10表面形成覆蓋有遮蔽層20之區段以及未覆蓋有遮蔽層之裸露區段11。
如第二圖(D)所示，形成一離子引體40於該基板之裸露區段11表面，其係將基板10浸置於一活性金屬離子之液體中，令金屬離子吸附至該裸露區段11之表面而形成離子引體40，而該活性金屬離子可以為鈀離子或第8族金屬離子。
進行第一次化學鍍覆，於上述之離子引體40表面形成第一金屬層50，如第二圖(E)所示；其中，該第一次化學鍍覆係將該基板置於一化學鍍液中，以化學方式於該離子引體上形成該
第一金屬層，其中該化學鍍液中包含有用以形成該第一金屬層之一待鍍金屬的化合物，例如可以為硫酸鎳、丁二酸、次磷酸二氫鈉、醋酸、乳酸或者為硫酸鎳及次磷酸二氫鈉及氫氧化鈉及醋酸之組成物，亦或者為硫酸鎳及丁二酸及乳酸之組成物，其中該待鍍金屬為鎳。
剝離遮蔽層20，將該基板10表面之遮蔽層20移除，請同時參閱第二圖(F)所示，例如可利用鹼性藥水或酸性藥水除去遮蔽層20與其上方不要離子引體40及第一金屬層50。
進行第二次化學鍍覆，如第二圖(G)所示，於上述之第一金屬層50表面形成第二金屬層60；其中，該第二次化學鍍覆係將該基板置於一化學鍍液中，以化學方式於該第一金屬層上形成該第二金屬層，其中該化學鍍液中包含有用以形成該第二金屬層之一待鍍金屬的化合物，其中該待鍍金屬可以為金、銀、銅、鎳、鈦、鈀的至少其中之一。例如待鍍金屬若為金，上述之化學鍍液可以為錯合劑及亞硫酸鹽及金鹽之組成物，或者為羥基亞乙基二膦酸及金鹽之組成物
由本發明所完成之檢測試片如第三圖所示，該基板10最外側之該第二金屬層60係覆蓋於該第一金屬層50之上表面，及覆蓋於該離子引體40及第一金屬層50之側表面，且利用上述之離子引體40、第一、第二金屬層50、60形成一線路金屬圖案總成，而製得一檢測試片。而本發明之檢測試片基本上為一載具，所以凡是液狀的都可以作檢測，可包含：血糖、膽固醇、尿酸、流感、禽流感、腸病毒、農藥殘留、飲料塑化劑或一些重金屬殘留的快篩，取決點在於酵素或檢測液選擇與晶片線路設計。
其中，本發明利用多次化學鍍覆方式分別於該基板上先以第一金屬層定義出線路金屬圖案總成之位置區域，再以第
二金屬層直接附著於該位置區域而形成線路金屬圖案總成，降低第二金屬層之浪費，尤其是第二金屬層常使用較昂貴且高導電的材質所製成，例如金材質，故可降低成本，且利用化學鍍覆方式亦可簡化製程。再者，本發明所述之線路金屬圖案總成，其離子引體介於該基板與該第一金屬層之間，可兩者結合更為緊密，以及第一金屬層介於該離子引體與該第二金屬層之間，進而更容易使活性安定之第二金屬層(例如金或鈀)經由化學鍍複置換於第一金屬層上，且以第二金屬層(例如金或鈀)作為電極較先前以碳或銀所製造的電極所測得之數據較為準確。
上述製程中亦可於形成遮蔽層之後，將該基板放置於一預浸劑中，讓該基板表面具有電位差，有助於一離子引體附著，而該預浸劑可以為硫酸氫鈉或者為硫酸氫與硫酸之組成物。而於形成一離子引體於該基板之裸露區段表面之後亦可進一步將基板浸漬於一還原劑中，以將離子引體金屬化而還原為金屬引體，例如將鈀離子或第8族金屬離子進行金屬化而還原為鈀金屬或第8族金屬，而該還原劑可以為氟硼酸或二甲胺硼烷。
另外，該基板10具有一改質表面12，如第四圖之另一實施例所示，而該遮蔽層(圖未示)則設置於該改質表面12之上，以供後續設置離子引體40於該改質表面12之上，由該改質表面12可增加該基板與該離子引體40之附著；當然，如圖所示之實施例中，該改質表面12可具有複數凹凸結構。其中，該改質表面可由該基板表面進行化學或物理方式而成，例如該基板表面藉由一表面改質劑進行表面改質而形成一改質表面，其中該表面改質劑可以為二乙二醇單丁醚或者為二乙二醇單丁醚與乙二醇之組合物。而上述基板進行改質後亦可進行一清潔步驟，對基板表面進行清潔，其中清潔步驟可以一整孔劑對該基板表面進行清
潔，該整孔劑可以為硫酸或者為乙二醛與乙二醛與乙二醇之組合物。
綜上所述，本發明提供檢測試片一較佳可行之製造方法，爰依法提呈發明專利之申請；本發明之技術內容及技術特點已揭示如上，然而熟悉本項技術之人士仍可能基於本發明之揭示而作各種不背離本案發明精神之替換及修飾。因此，本發明之保護範圍應不限於實施例所揭示者，而應包括各種不背離本發明之替換及修飾，並為以下之申請專利範圍所涵蓋。
Claims (10)
- 一種檢測試片之製造方法，包含下列步驟：提供一基板；形成遮蔽層於該基板其中一表面；進行圖案化製程，將該遮蔽層形成圖案化，而於該基板表面形成覆蓋有遮蔽層之區段以及未覆蓋有遮蔽層之裸露區段；形成一離子引體於該基板之裸露區段表面；進行第一次化學鍍覆，於上述之離子引體表面形成第一金屬層；剝離遮蔽層，將該基板表面之遮蔽層移除；以及進行第二次化學鍍覆，於上述之第一金屬層表面形成第二金屬層。
- 如請求項1所述檢測試片之製造方法，其中，該基板具有一改質表面，而該遮蔽層則設置於該改質表面之上。
- 如請求項2所述檢測試片之製造方法，其中，該基板表面藉由一表面改質劑進行表面改質而形成一改質表面。
- 如請求項1所述檢測試片之製造方法，其中，該遮蔽層係由壓合乾膜方式或印刷濕膜方式設置於該基板其中一表面。
- 如請求項1所述檢測試片之製造方法，其中，該圖案化製程係由負片製程進行曝光、顯影而成。
- 如請求項1至5其中任一項所述檢測試片之製造方法，其中，該基板浸置於一活性金屬離子之液體中，令金屬離子吸附至該裸露區段之表面而形成離子引體。
- 如請求項6所述檢測試片之製造方法，其中，該活性金屬離子係為鈀離子或第8族金屬離子。
- 如請求項1至5其中任一項所述檢測試片之製造方法，其中，該第一次化學鍍覆係將該基板置於一化學鍍液中，以化學方式於該離子引體上形成該第一金屬層，其中該化學鍍液中包含有用以 形成該第一金屬層之一待鍍金屬的化合物，其中該待鍍金屬為鎳。
- 如請求項1至5其中任一項所述檢測試片之製造方法，其中，該第二次化學鍍覆係將該基板置於一化學鍍液中，以化學方式於該第一金屬層上形成該第二金屬層，其中該化學鍍液中包含有用以形成該第二金屬層之一待鍍金屬的化合物，其中該待鍍金屬為金、銀、銅、鎳、鈦、鈀的至少其中之一。
- 如請求項1至5其中任一項所述檢測試片之製造方法，其中，該基板係為聚對苯二甲酸乙二酯(polyethylene terephthalate；PET)。
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