TW201526728A - The flexible printed circuit board - Google Patents
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- TW201526728A TW201526728A TW102148600A TW102148600A TW201526728A TW 201526728 A TW201526728 A TW 201526728A TW 102148600 A TW102148600 A TW 102148600A TW 102148600 A TW102148600 A TW 102148600A TW 201526728 A TW201526728 A TW 201526728A
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- 239000000758 substrate Substances 0.000 claims abstract description 84
- 229920000642 polymer Polymers 0.000 claims abstract description 33
- 239000002861 polymer material Substances 0.000 claims description 21
- 239000004020 conductor Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 18
- 238000005530 etching Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 35
- 229910052802 copper Inorganic materials 0.000 description 21
- 239000010949 copper Substances 0.000 description 21
- 239000011889 copper foil Substances 0.000 description 14
- 238000007747 plating Methods 0.000 description 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 8
- 229920001940 conductive polymer Polymers 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005253 cladding Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000144 PEDOT:PSS Polymers 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000006188 syrup Substances 0.000 description 1
- 235000020357 syrup Nutrition 0.000 description 1
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Abstract
Description
本發明涉及一種可撓式電路板及其製作方法。The invention relates to a flexible circuit board and a manufacturing method thereof.
目前，多層軟板或軟硬結合板的多層板壓合、外層鑽孔之後，必須使用鍍銅的製程工藝，來使外層的銅箔與內層的銅箔線路導通。但對於局部露出內層的多層軟板的軟硬結合板而言，因為裸露出來的內層軟板表面的PI或LCP等高分子聚合物材料，其材料表面與電鍍工藝中的化銅層的結合力較弱，故在化學鍍銅製程中，容易產生藥水攻入化銅層底部，而產生隆起的水泡，甚至有部分化銅層會剝落而污染其他製程槽液的現象。At present, after the multi-layer board of the multi-layer soft board or the soft-hard board is pressed and the outer layer is drilled, a copper plating process must be used to make the copper foil of the outer layer and the copper line of the inner layer conductive. However, for the soft and hard bonding board of the multilayer soft board partially exposed to the inner layer, the surface of the material and the surface of the copper layer in the electroplating process are formed by the polymer material such as PI or LCP which is exposed on the surface of the inner soft board. The bonding force is weak, so in the electroless copper plating process, it is easy to produce the syrup to break into the bottom of the copper layer, and the blistering blisters may occur, and even a part of the copper layer may peel off and contaminate other process liquids.
有鑒於此，有必要提供一種可解決上述問題的可撓式電路板的製作方法。In view of the above, it is necessary to provide a method of fabricating a flexible circuit board that can solve the above problems.
有鑒於此，還有必要提供一種可解決上述問題的可撓式電路板。In view of this, it is also necessary to provide a flexible circuit board that can solve the above problems.
一種可撓式電路板，包括軟性電路基板，所述軟性電路板包括一基底層、形成於基底層的第一導電線路層、形成於第一導電線路層的第一覆蓋層；硬性電路基板，所述硬性電路板包括第一硬性基板，所述第一硬性基板部分壓合於所述第一覆蓋層，且所述軟性電路基板覆蓋有第一硬性基板的區域為硬性區域，所述軟性電路基板未被硬性基板覆蓋的區域為軟性區域；及高分子材料層，所述高分子材料層形成於所述軟性區域的第一覆蓋層上。A flexible circuit board comprising a flexible circuit board, the flexible circuit board comprising a base layer, a first conductive circuit layer formed on the base layer, a first cover layer formed on the first conductive circuit layer, and a rigid circuit substrate The rigid circuit board includes a first rigid substrate, the first rigid substrate is partially pressed against the first cover layer, and a region of the flexible circuit substrate covered with the first rigid substrate is a hard region, and the flexible circuit The region where the substrate is not covered by the rigid substrate is a soft region; and the polymer material layer is formed on the first cover layer of the soft region.
一種可撓式電路板的製作方法，包括步驟：提供一多層基板，所述多層電路基板包括基底層、形成於所述基底層上的第一導電線路層、形成於第一導電線路層上的第一覆蓋層及壓合於第一覆蓋層部分區域的第一硬性基板，其中，第一覆蓋層上覆蓋有所述第一硬性電路板的區域為硬性區域，所述第一覆蓋層未第一硬性電路板覆蓋的區域為軟性區域；在所述軟性區域對應的第一覆蓋層上形成一高分子導電層；在所述高分子導電層上形成一導體層；蝕刻掉覆蓋於所述高分子導電層上的導體層；及去除高分子導電層中導電材料的導電性，形成一高分子材料層，從而形成可撓式電路板。A manufacturing method of a flexible circuit board, comprising the steps of: providing a multi-layer substrate, the multi-layer circuit substrate comprising a base layer, a first conductive circuit layer formed on the base layer, formed on the first conductive circuit layer a first cover layer and a first rigid substrate press-bonded to the first cover layer portion, wherein the first cover layer is covered with the first rigid circuit board as a hard region, and the first cover layer is not a region covered by the first rigid circuit board is a soft region; a polymer conductive layer is formed on the first cover layer corresponding to the soft region; a conductor layer is formed on the polymer conductive layer; a conductor layer on the polymer conductive layer; and removing conductivity of the conductive material in the polymer conductive layer to form a polymer material layer to form a flexible circuit board.
與先前技術相比，本實施例中提供一種高分子導電層，所述高分子導電層中的高分子材料與所述化學鍍銅過程中的鈀粒子有良好的結合力，同時與第一覆蓋層和第二覆蓋層的絕緣材料也有良好的結合力，而將所述高分子導電層形成於軟性區域的第一覆蓋層和第二覆蓋層上，再進行化學鍍銅製程，則可以避免直接在第一覆蓋層和第二覆蓋層上進行化學鍍銅時出現藥水泡或者剝落而污染其他製程槽液。本發明所述可撓式電路板還可以適用於剛撓結合的電路板。Compared with the prior art, the present embodiment provides a polymer conductive layer, and the polymer material in the polymer conductive layer has a good bonding force with the palladium particles in the electroless copper plating process, and simultaneously with the first cover. The insulating material of the layer and the second covering layer also has a good bonding force, and the polymer conductive layer is formed on the first covering layer and the second covering layer of the soft region, and then the electroless copper plating process is performed, thereby avoiding direct When electroless copper plating is performed on the first cover layer and the second cover layer, blistering or peeling occurs to contaminate other process baths. The flexible circuit board of the present invention can also be applied to a rigid-flex circuit board.
圖1係本實施例提供的多層電路基板的剖面示意圖。1 is a schematic cross-sectional view of a multilayer circuit substrate provided by the embodiment.
圖2係在圖1中軟性區域的第一覆蓋層和第二覆蓋層上形成高分子導電層的剖面示意圖。2 is a schematic cross-sectional view showing the formation of a polymer conductive layer on the first cover layer and the second cover layer of the soft region of FIG. 1.
圖3係在圖2中多層電路基板上形成化銅層的剖面示意圖。3 is a schematic cross-sectional view showing the formation of a copper layer on the multilayer circuit substrate of FIG. 2.
圖4係在圖3中的化銅層上形成導體層的剖面示意圖。4 is a schematic cross-sectional view showing the formation of a conductor layer on the copper layer of FIG.
圖5係蝕刻圖4中的導體層形成第三導電線路層和第四導電線路層並露出所述高分子導電層的剖面示意圖。5 is a schematic cross-sectional view showing the etching of the conductor layer of FIG. 4 to form a third conductive wiring layer and a fourth conductive wiring layer and exposing the polymer conductive layer.
圖6係取出圖5中高分子導電層的導電性並形成高分子材料層的剖面示意圖。Fig. 6 is a schematic cross-sectional view showing the electrical conductivity of the polymer conductive layer of Fig. 5 taken out to form a polymer material layer.
本發明實施例提供一種可撓式電路板10的製作方法，包括步驟：Embodiments of the present invention provide a method for fabricating a flexible circuit board 10, including the steps of:
第一步，請參閱圖1，提供一多層電路基板11。In the first step, referring to FIG. 1, a multilayer circuit substrate 11 is provided.
本實施例中，所述多層電路基板11包括軟性電路板12和硬性電路基板13，所述軟性電路基板12包括基底層110、設置於基底層110相對兩側的第一導電線路層111和第二導電線路層112、以及分別形成該第一導電線路層111和第二導電線路層112上的第一覆蓋層121和第二覆蓋層122。所述硬性電路基板13包括第一硬性基板131和第二硬性基板132，所述第一硬性基板131和第二硬性基板132分別覆蓋於所述第一覆蓋層121和第二覆蓋層122，所述第一硬性基板131包括第三銅箔層123，且所述第三銅箔層123形成於所述第一硬性基板131遠離第一覆蓋層121一側，所述第二硬性基板132包括第四銅箔層124，且所述第四銅箔層124形成於所述第二硬性基板132遠離第二覆蓋層122一側。In this embodiment, the multi-layer circuit substrate 11 includes a flexible circuit board 12 including a base layer 110, first conductive circuit layers 111 disposed on opposite sides of the base layer 110, and a flexible circuit board 13 The second conductive wiring layer 112 and the first cladding layer 121 and the second cladding layer 122 on the first conductive wiring layer 111 and the second conductive wiring layer 112, respectively. The rigid circuit substrate 13 includes a first rigid substrate 131 and a second rigid substrate 132. The first rigid substrate 131 and the second rigid substrate 132 respectively cover the first cover layer 121 and the second cover layer 122. The first rigid substrate 131 includes a third copper foil layer 123, and the third copper foil layer 123 is formed on a side of the first rigid substrate 131 away from the first cover layer 121, and the second rigid substrate 132 includes a first The fourth copper foil layer 124 is formed on the side of the second rigid substrate 132 away from the second cover layer 122.
所述第一硬性基板131和第二硬性基板132覆蓋於所述軟性電路基板12，且所述第一覆蓋層121和第二覆蓋層122未覆蓋所述硬性電路基板13的區域為軟性區域101，所述第一覆蓋層121和第二覆蓋層122覆蓋有所述硬性電路基板13的區域為硬性區域102。The first rigid substrate 131 and the second rigid substrate 132 cover the flexible circuit substrate 12, and the regions where the first cover layer 121 and the second cover layer 122 do not cover the rigid circuit substrate 13 are soft regions 101. The region where the first cover layer 121 and the second cover layer 122 are covered with the rigid circuit substrate 13 is a hard region 102.
所述多層電路基板11還包括一通孔，所述通孔依次貫穿第一硬性基板131、軟性電路基板12及第二硬性基板132。The multilayer circuit substrate 11 further includes a through hole that sequentially penetrates through the first rigid substrate 131, the flexible circuit substrate 12, and the second rigid substrate 132.
可以理解，本實施例僅為本發明一個較優的實施例，所述多層電路基板11還可以包括多層導電線路層。It can be understood that the embodiment is only a preferred embodiment of the present invention, and the multilayer circuit substrate 11 may further include a plurality of layers of conductive lines.
第二步，請參閱圖2，在所述軟性區域101的第一覆蓋層121和第二覆蓋層122上形成一高分子導電層140。In the second step, referring to FIG. 2, a polymer conductive layer 140 is formed on the first cover layer 121 and the second cover layer 122 of the flexible region 101.
將導電高分子材料塗布於所述第一覆蓋層121和第二覆蓋層122，形成高分子導電層140。A conductive polymer material is applied to the first cover layer 121 and the second cover layer 122 to form a polymer conductive layer 140.
本實施例中，所述第一覆蓋層121和第二覆蓋層122的材料為高分子聚合物材料。所述導電高分子材料可以採用德國賀氏公司的PEDOT：PSS、AGFA公司的transparent conductive inkjet ink:IJ-1005或者其他導電高分子聚合物材料。In this embodiment, the materials of the first cover layer 121 and the second cover layer 122 are high molecular polymer materials. The conductive polymer material may be PEDOT:PSS of Heshi Company of Germany, transparent conductive inkjet ink of IAG Company: IJ-1005 or other conductive high molecular polymer materials.
第三步，請參閱圖3及圖4，在所述多層電路基板11上形成一導體層142。In the third step, referring to FIG. 3 and FIG. 4, a conductor layer 142 is formed on the multilayer circuit substrate 11.
在所述第三銅箔層123、第四銅箔層124、高分子導電層140及通孔125孔壁上進行化學鍍銅處理，形成一化銅層141。所述化學鍍銅處理通常也叫沉銅，是一種氧化還原反應，即先通過活化劑處理在第一覆蓋層121、第二覆蓋層122、通孔125孔壁和高分子導電層140上覆蓋一層活性的金屬鈀粒子，然後，以鈀粒子將銅離子還原為銅。Electroless copper plating is performed on the third copper foil layer 123, the fourth copper foil layer 124, the polymer conductive layer 140, and the via hole 125 to form a copper layer 141. The electroless copper plating process, also called copper sinking, is a redox reaction, that is, first covering the first cap layer 121, the second cap layer 122, the via hole 125, and the polymer conductive layer 140 by an activator treatment. A layer of active metal palladium particles is then reduced to copper by palladium particles.
然後在所述化銅層141上進行電鍍，從而在所述第三銅箔層123、第四銅箔層124及高分子導電層140上形成導體層142，並在通孔125孔壁形成連續的導體層142以構成一導通孔126。Electroplating is then performed on the copper layer 141 to form a conductor layer 142 on the third copper foil layer 123, the fourth copper foil layer 124, and the polymer conductive layer 140, and form a continuous wall in the via hole 125. The conductor layer 142 is configured to form a via hole 126.
可以理解，在多層電路基板11中形成一所述導通孔126，用以連通所述軟性電路基板12和第一硬性基板131和第二硬性基板132。It can be understood that a via hole 126 is formed in the multilayer circuit substrate 11 for communicating the flexible circuit substrate 12 and the first rigid substrate 131 and the second rigid substrate 132.
第四步，請參閱圖5，蝕刻掉覆蓋於所述高分子導電層140上的導體層142，並形成第三導電線路層133和第四導電線路層134。In the fourth step, referring to FIG. 5, the conductor layer 142 covering the polymer conductive layer 140 is etched away, and the third conductive wiring layer 133 and the fourth conductive wiring layer 134 are formed.
採用微影製程技術蝕刻所述導體層142形成第三導電線路層133和第四導電線路層134。本實施例中，將所述第三銅箔層123、第四銅箔層124及形成於所述第三銅箔層123和第四銅箔層124上的導體層142一起經過幹膜、曝光、顯影、蝕刻及剝膜過程之後得到第三導電線路層133和第四導電線路層134。同時，將覆蓋於所述高分子導電層140上的導體層142全部蝕刻掉。The conductor layer 142 is etched using a lithography process to form a third conductive wiring layer 133 and a fourth conductive wiring layer 134. In this embodiment, the third copper foil layer 123, the fourth copper foil layer 124, and the conductor layer 142 formed on the third copper foil layer 123 and the fourth copper foil layer 124 are dried and exposed. The third conductive wiring layer 133 and the fourth conductive wiring layer 134 are obtained after the development, etching, and stripping processes. At the same time, the conductor layer 142 covering the polymer conductive layer 140 is completely etched away.
第五步，請參閱圖6，去除高分子導電層140中導電材料的導電性，形成一高分子材料層150，從而形成可撓式電路板10。In the fifth step, referring to FIG. 6, the conductivity of the conductive material in the polymer conductive layer 140 is removed to form a polymer material layer 150, thereby forming the flexible circuit board 10.
本實施例中，通過蝕刻液處理，將所述高分子導電層140中的導電性去除，其具體過程為：將上述形成有遮蔽劑層的高分子導電層140浸入蝕刻液中，所述蝕刻液用於消除高分子導電層140中的導電材料的導電性，形成高分子材料層150。本實施例中，所述蝕刻液為德國廠商Heraeus推出的導電性高分子蝕刻液Clevios。In this embodiment, the conductivity in the polymer conductive layer 140 is removed by an etching solution process, wherein the polymer conductive layer 140 having the mask layer formed thereon is immersed in an etching solution, and the etching is performed. The liquid is used to eliminate the conductivity of the conductive material in the polymer conductive layer 140 to form the polymer material layer 150. In this embodiment, the etching solution is a conductive polymer etching solution Clevios introduced by the German manufacturer Heraeus.
需要說明的是，在最後製作過程中以蝕刻液將高分子導電層140的導電性去除，形成一不導電的高分子材料層150，如此，可以避免高分子導電層140對可撓式電路板後續製程造成影響，相當於以高分子材料層150代替第一覆蓋層121和第二覆蓋層122。It should be noted that, in the final fabrication process, the conductivity of the polymer conductive layer 140 is removed by an etching solution to form a non-conductive polymer material layer 150. Thus, the polymer conductive layer 140 can be prevented from being applied to the flexible circuit board. The subsequent process affects, which is equivalent to replacing the first cover layer 121 and the second cover layer 122 with the polymer material layer 150.
請參閱圖6，本實施例中還提供一種可撓式電路板10，其包括軟性電路基板12和硬性電路基板13，所述軟性電路基板12包括基底層110、設置於基底層110相對兩側的第一導電線路層111和第二導電線路層112、分別形成於所述第一導電線路層111和第二導電線路層112上的第一覆蓋層121和第二覆蓋層122及高分子材料層150。所述硬性電路基板13包括第一硬性基板131和第二硬性基板132，所述第一硬性基板131包括形成於所述第一硬性基板131遠離第一覆蓋層121一側的第三導電線路層133，所述第二硬性基板132包括形成於所述第二硬性基板132遠離第二覆蓋層122一側的第四導電線路層134。所述第一硬性基板131和第二硬性基板132分別覆蓋於所述第一覆蓋層121和第二覆蓋層122，且所述第一覆蓋層121和第二覆蓋層122未覆蓋所述硬性電路板13的區域為軟性區域101，所述第一覆蓋層121和第二覆蓋層122覆蓋有所述硬性電路基板13的區域為硬性區域102，所述高分子材料層150形成於所述軟性區域101的第一覆蓋層121和第二覆蓋層122上。Referring to FIG. 6 , a flexible circuit board 10 is further provided in the embodiment, which includes a flexible circuit substrate 12 and a rigid circuit substrate 13 . The flexible circuit substrate 12 includes a base layer 110 disposed on opposite sides of the base layer 110 . The first conductive circuit layer 111 and the second conductive circuit layer 112, the first cover layer 121 and the second cover layer 122 and the polymer material respectively formed on the first conductive circuit layer 111 and the second conductive circuit layer 112 Layer 150. The rigid circuit substrate 13 includes a first rigid substrate 131 and a second rigid substrate 132. The first rigid substrate 131 includes a third conductive circuit layer formed on a side of the first rigid substrate 131 away from the first cover layer 121. 133. The second rigid substrate 132 includes a fourth conductive circuit layer 134 formed on a side of the second rigid substrate 132 away from the second cover layer 122. The first rigid substrate 131 and the second rigid substrate 132 respectively cover the first cover layer 121 and the second cover layer 122, and the first cover layer 121 and the second cover layer 122 do not cover the rigid circuit The area of the board 13 is a flexible area 101, and the area of the first cover layer 121 and the second cover layer 122 covered with the rigid circuit board 13 is a hard area 102, and the polymer material layer 150 is formed in the soft area. The first cover layer 121 and the second cover layer 122 of 101 are on.
所述可撓式電路板10還包括一導通孔126，所述導通孔126依次貫穿第一硬性基板131、軟性電路基板12及第二硬性基板132，所述導通孔126用以導通所述第一硬性基板131的第三導電線路133、第二硬性基板132的第四導電線路134和軟性電路基板12。The flexible circuit board 10 further includes a via hole 126. The via hole 126 sequentially penetrates the first rigid substrate 131, the flexible circuit substrate 12, and the second rigid substrate 132. The via hole 126 is used to turn on the first The third conductive line 133 of the rigid substrate 131, the fourth conductive line 134 of the second rigid substrate 132, and the flexible circuit substrate 12.
需要說明的是，本實施例中提供的可撓式電路板10可以是軟硬結合板也可以是軟性電路板，即高分子材料層可以適用於軟硬結合板，亦適用於軟性電路板。It should be noted that the flexible circuit board 10 provided in this embodiment may be a soft and hard bonding board or a flexible circuit board, that is, the polymer material layer may be applied to a soft and hard bonding board, and is also applicable to a flexible circuit board.
與先前技術相比，本實施例中提供一種高分子導電層140，所述高分子導電層140中的高分子材料與所述化學鍍銅過程中的鈀粒子有良好的結合力，同時與第一覆蓋層121和第二覆蓋層122的絕緣材料也有良好的結合力，而將所述高分子導電層140形成於軟性區域101的第一覆蓋層121和第二覆蓋層122上，再進行化學鍍銅制程，則可以避免直接在第一覆蓋層121和第二覆蓋層122上進行化學鍍銅時出現藥水泡或者剝落而污染其他制程槽液。Compared with the prior art, in this embodiment, a polymer conductive layer 140 is provided, and the polymer material in the polymer conductive layer 140 has a good bonding force with the palladium particles in the electroless copper plating process, and at the same time The insulating material of a cap layer 121 and the second cap layer 122 also has a good bonding force, and the polymer conductive layer 140 is formed on the first cap layer 121 and the second cap layer 122 of the soft region 101, and then chemically In the copper plating process, it is possible to avoid the occurrence of blistering or peeling of the chemical plating copper directly on the first covering layer 121 and the second covering layer 122 to contaminate other process baths.
綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士，於爰依本發明精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍內。In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be covered by the following claims.
10‧‧‧可撓式電路板10‧‧‧Flexible circuit board
11‧‧‧多層電路基板11‧‧‧Multilayer circuit board
12‧‧‧軟性電路基板12‧‧‧Soft circuit board
13‧‧‧硬性電路基板13‧‧‧hard circuit board
110‧‧‧基底層110‧‧‧ basal layer
111‧‧‧第一導電線路層111‧‧‧First conductive circuit layer
112‧‧‧第二導電線路層112‧‧‧Second conductive circuit layer
121‧‧‧第一覆蓋層121‧‧‧First cover
122‧‧‧第二覆蓋層122‧‧‧second cover
123‧‧‧第三銅箔層123‧‧‧ third copper foil layer
124‧‧‧第四銅箔層124‧‧‧fourth copper foil layer
125‧‧‧通孔125‧‧‧through hole
126‧‧‧導通孔126‧‧‧through holes
101‧‧‧軟性區域101‧‧‧Soft area
102‧‧‧硬性區域102‧‧‧hard areas
131‧‧‧第一硬性基板131‧‧‧First rigid substrate
132‧‧‧第二硬性基板132‧‧‧Second hard substrate
133‧‧‧第三導電線路層133‧‧‧ Third conductive circuit layer
134‧‧‧第四導電線路層134‧‧‧fourth conductive layer
140‧‧‧高分子導電層140‧‧‧ polymer conductive layer
141‧‧‧化銅層141‧‧‧ copper layer
142‧‧‧導體層142‧‧‧ conductor layer
150‧‧‧高分子材料層150‧‧‧ polymer material layer
無no
10‧‧‧可撓式電路板 10‧‧‧Flexible circuit board
12‧‧‧軟性電路基板 12‧‧‧Soft circuit board
13‧‧‧硬性電路基板 13‧‧‧hard circuit board
110‧‧‧基底層 110‧‧‧ basal layer
111‧‧‧第一導電線路層 111‧‧‧First conductive circuit layer
112‧‧‧第二導電線路層 112‧‧‧Second conductive circuit layer
121‧‧‧第一覆蓋層 121‧‧‧First cover
122‧‧‧第二覆蓋層 122‧‧‧second cover
126‧‧‧導通孔 126‧‧‧through holes
131‧‧‧第一硬性基板 131‧‧‧First rigid substrate
132‧‧‧第二硬性基板 132‧‧‧Second hard substrate
133‧‧‧第三導電線路層 133‧‧‧ Third conductive circuit layer
134‧‧‧第四導電線路層 134‧‧‧fourth conductive layer
150‧‧‧高分子材料層 150‧‧‧ polymer material layer
Claims (6)
軟性電路基板，所述軟性電路板包括一基底層、形成於基底層的第一導電線路層、形成於第一導電線路層的第一覆蓋層；
硬性電路基板，所述硬性電路板包括第一硬性基板，所述第一硬性基板部分壓合於所述第一覆蓋層，且所述軟性電路基板覆蓋有第一硬性基板的區域為硬性區域，所述軟性電路基板未被硬性基板覆蓋的區域為軟性區域；及
高分子材料層，所述高分子材料層形成於所述軟性區域的第一覆蓋層上。A flexible circuit board comprising a flexible circuit board, the flexible circuit board comprising a base layer, a first conductive circuit layer formed on the base layer, and a first cover layer formed on the first conductive circuit layer;
a rigid circuit board, the rigid circuit board includes a first rigid substrate, the first rigid substrate is partially pressed against the first cover layer, and a region of the flexible circuit substrate covered with the first rigid substrate is a hard region. The soft circuit substrate is not covered by the rigid substrate; the polymer material layer is formed on the first cover layer of the soft region.
提供一多層基板，所述多層電路基板包括基底層、形成於所述基底層上的第一導電線路層、形成於第一導電線路層上的第一覆蓋層及壓合於第一覆蓋層部分區域的第一硬性基板，其中，第一覆蓋層上覆蓋有所述第一硬性電路板的區域為硬性區域，所述第一覆蓋層未第一硬性電路板覆蓋的區域為軟性區域；
在所述軟性區域對應的第一覆蓋層上形成一高分子導電層；
在所述高分子導電層上形成一導體層；
蝕刻掉覆蓋於所述高分子導電層上的導體層；及
去除高分子導電層中導電材料的導電性，形成一高分子材料層，從而形成可撓式電路板。
A method for manufacturing a flexible circuit board, comprising the steps of:
Providing a multilayer substrate, the multilayer circuit substrate comprising a base layer, a first conductive circuit layer formed on the base layer, a first cover layer formed on the first conductive circuit layer, and being pressed against the first cover layer a first rigid substrate, wherein a region of the first cover layer covered with the first rigid circuit board is a hard region, and a region of the first cover layer not covered by the first rigid circuit board is a soft region;
Forming a polymer conductive layer on the first cover layer corresponding to the soft region;
Forming a conductor layer on the polymer conductive layer;
Etching off the conductor layer covering the polymer conductive layer; and removing the conductivity of the conductive material in the polymer conductive layer to form a polymer material layer, thereby forming a flexible circuit board.
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| TWI669041B (en) * | 2016-10-14 | 2019-08-11 | 德商德國艾托特克公司 | Printed circuit board and methods for producing the same |
| CN111003682A (en) * | 2018-10-08 | 2020-04-14 | 凤凰先驱股份有限公司 | Electronic package and method of making the same |
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| KR102494343B1 (en) * | 2016-01-11 | 2023-02-01 | 삼성전기주식회사 | Printed circuit board |
| KR102776272B1 (en) * | 2019-03-04 | 2025-03-07 | 삼성전기주식회사 | Printed Circuit Board and manufacturing method for the same |
| CN110798768B (en) * | 2019-10-31 | 2024-09-10 | 华为技术有限公司 | Wireless headphones |
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| TWI361208B (en) * | 2007-08-07 | 2012-04-01 | Univ Nat Defense | Process for forming a metal pattern on a substrate |
| TWI357293B (en) * | 2008-01-23 | 2012-01-21 | Unimicron Technology Corp | Flex-rigid circuit board and method for fabricatin |
| US8431833B2 (en) * | 2008-12-29 | 2013-04-30 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
| CN101736328A (en) * | 2009-12-14 | 2010-06-16 | 安捷利（番禺）电子实业有限公司 | Pretreatment solution and process of electroless copper plating of flexible printed circuit board |
| CN102469700B (en) * | 2010-11-12 | 2014-07-09 | 北大方正集团有限公司 | Method for manufacturing circuit board and circuit board |
| CN102209442B (en) * | 2010-11-16 | 2012-11-14 | 博罗县精汇电子科技有限公司 | Technology of producing soft-hard combination multilayer circuit board with copper foil covering method |
| CN102595806A (en) * | 2012-02-20 | 2012-07-18 | 深圳崇达多层线路板有限公司 | Method for manufacturing rigid-flexible combined circuit board capable of protecting inner-layer soft board |
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| TWI669041B (en) * | 2016-10-14 | 2019-08-11 | 德商德國艾托特克公司 | Printed circuit board and methods for producing the same |
| CN111003682A (en) * | 2018-10-08 | 2020-04-14 | 凤凰先驱股份有限公司 | Electronic package and method of making the same |
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| CN104735899A (en) | 2015-06-24 |
| TWI507098B (en) | 2015-11-01 |
| CN104735899B (en) | 2017-08-22 |
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