TW201505137A - Electronic package module and manufacturing method thereof - Google Patents

Abstract

The invention provides an electronic package module and a manufacturing method thereof. First, a tape is adhered to a predetermined area on a circuit substrate, and electronic components are disposed outside the predetermined area, and then a molding block is formed to cover the entire circuit substrate, and then the tape is combined with the same. The upper mold block is removed to complete selective sealing, and then an electromagnetic shielding layer is formed on the mold block and the photovoltaic element is disposed in a predetermined area to protect the electronic component from electromagnetic interference and to prevent the photoelectric element from being subjected to the molded block. Covering affects operation.

Description

Electronic package module and manufacturing method thereof

The invention relates to an electronic package module and a manufacturing method thereof, in particular to a selective electronic package module and a manufacturing method thereof.

At present, an electronic package module generally includes a circuit board and a plurality of electronic components mounted on the circuit board. These electronic components are, for example, a chip package or a passive component. In addition, most electronic packaging modules generally include a molding compound for encapsulating the above electronic components to protect the electronic components.

However, some electronic components, particularly photovoltaic components, such as a complementary metal oxide semiconductor image sensor (CMOS Image Sensor, CIS, hereinafter referred to as CMOS image sensor), charge coupled device (Charge-Coupled Device, CCD) The image sensing component or the light emitting component such as a light emitting diode (LED) should not be covered by the molding block to prevent the photoelectric component from being affected by the coating of the molding block, so as to balance the two The need to develop a "partially sealed" technology.

Conventional "partially encapsulated" techniques are mostly achieved by using a mold, such as first covering a photovoltaic element with a mask-like mold, and then injecting the mold to form a mold block, however, affected by fluid viscosity. The filled molding material is likely to form pores or voids in the cavity or between the components of the circuit board. Vapours may be accumulated in the pores or pores, and the moisture may cause explosion in the subsequent hot process. The problem of popcorn (reduced product yield); in addition, after the mold is used to complete the mold, the mold must be removed, and Usually in order to remove the mold, the mold design must reserve a draft angle. The angle between the mold and the board is usually about 70 degrees; this will make the PCB board use lower, and again, whenever encountered Different mold shapes, not only must the mold be redesigned, but if the required shape is irregular, the difficulty and cost of mold development will be greatly increased.

Therefore, there is a need in the industry for a module packaging method that is simple and convenient and can be adapted to different shape requirements, and can be applied to new technologies of partial or selective molding.

The invention provides an electronic package module and a manufacturing method thereof, which can selectively mold electronic components.

The manufacturing method of the electronic package module of the present invention comprises: providing a circuit substrate comprising an assembly plane, a ground pad, and a predetermined area, wherein the predetermined area is located on the assembly plane and the ground pad is adjacent to the predetermined area; the tape is adhered in the predetermined area; The electronic component is disposed outside the predetermined area on the circuit substrate; a molding block is formed on the assembly plane, wherein the molding block covers the tape and the electronic component; and the tape and the molding block at the predetermined area and above the grounding pad are removed.

According to a preferred embodiment of the present invention, in a predetermined area, a complete tape can be adhered to the entire circuit substrate, and then the complete tape above the ground pad is removed by using a laser slot, and then removed. The complete tape outside the predetermined area can be used to adhere the tape to the predetermined area.

In accordance with a preferred embodiment of the present invention, a method of removing the mold block can include utilizing a laser slotted mold block to surround a ground pad around a predetermined area on a circuit substrate.

In accordance with a preferred embodiment of the present invention, the method of removing the mold block can include trimming the mold block above the predetermined area with a laser.

According to a preferred embodiment of the present invention, in the step of removing the tape on the predetermined area, the tape may be peeled off by heating.

According to a preferred embodiment of the present invention, the adhesive tape can be a photo-degradable film (UV) Tape), and in the step of removing the tape on the predetermined area, the tape can be detached by ultraviolet irradiation.

The manufacturing method of the electronic package module of the present invention may further comprise disposing the photovoltaic element in a predetermined area. According to an embodiment, after the tape is removed, the mask layer is formed in a predetermined area, and the entire surface is formed into an electromagnetic shielding layer. And electrically connecting with the ground pad, and then removing the mask layer, and then arranging the photovoltaic element in a predetermined area; according to another embodiment, after using the laser to form a mold block located above the ground pad, The surface layer forms an electromagnetic shielding layer, electrically connects the electromagnetic shielding layer to the ground pad, removes the tape in the predetermined area, and then sets the photoelectric element in the predetermined area.

According to a preferred embodiment of the present invention, the side ground pad may be further included, wherein the electromagnetic shielding layer is electrically connected to the side ground pad.

According to the above method, the electronic package module of the present invention may comprise a circuit substrate comprising an assembly plane, a ground pad and a predetermined area, wherein the predetermined area and the ground pad are located on the assembly plane; and the electronic component is disposed on the assembly plane outside the predetermined area; The mold block, the surface of the side surface of each of the mold blocks facing the predetermined area and the assembly plane may be between 85 degrees and 90 degrees; the electromagnetic shielding layer covers the mold block And electrically connected to the ground pad; the photoelectric element is disposed on the assembly plane in the predetermined area; the side ground pad is located on the side of the circuit substrate, wherein the electromagnetic shielding layer is electrically connected to the side ground pad.

With the above configuration, the manufacturing method of the electronic package module of the present invention can be selectively molded without the complicated mold or complicated steps, and the mold block and the metal coating are formed only for the area to be molded. Coating) in order to simultaneously protect against electromagnetic interference (EMI) and to prevent the optoelectronic components from being coated by the molding block to affect the operation.

For a better understanding of the techniques, methods and efficacies of the present invention, reference should be made to the detailed description and drawings of the invention, The drawings and the annexed drawings are for the purpose of illustration and description only

101, 102‧‧‧Predetermined area

11, 31‧‧‧ circuit substrate

111, 311, 511‧‧‧ grounding mat

112, 312‧‧‧ side grounding mat

12‧‧‧ Assembly plane

13, 33, 53‧ ‧ tape

15, 35, 55‧ ‧ die block

18‧‧‧ mask layer

19, 39, 59‧‧ ‧ electromagnetic shielding

21, 41, 61‧‧‧ Electronic components

22, 42, 62‧‧‧Optoelectronic components

37, 57‧‧‧ ink

‧‧‧‧ angle

1A-1E are detailed exploded views of a method for fabricating an electronic package module according to an embodiment of the present invention; and FIG. 2 is a schematic diagram of an electronic package module manufacturing method applied to an irregular predetermined area according to an embodiment of the present invention; 3E is a detailed step sectional view of one embodiment of forming a photovoltaic element in a predetermined region; FIGS. 4A-4D are detailed step sectional views of another embodiment of forming a photovoltaic element in a predetermined region; FIG. 5 is an electronic package mold of the present invention; The group manufacturing method includes a cross-sectional view of an embodiment of a side ground pad; and FIGS. 6A-6I are detailed cross-sectional views of an embodiment of the method for manufacturing the electronic package module of the present invention applied to a two-sided substrate package.

Please refer to FIGS. 1A-1E, wherein FIGS. 1A, 1C and 1E are structural cross-sectional views showing a manufacturing process of the electronic package module of the embodiment. 1B and 1D are top plan views showing the manufacturing process of the electronic package module of this embodiment.

In this embodiment, reference may be made first to FIGS. 1A and 1B. The electronic package module manufacturing method of the present invention can first prepare a circuit substrate 11 having an assembly plane 12, a predetermined area 101 at the assembly plane 12, and a ground pad 111. This embodiment is described by taking the ground pad 111 around the predetermined area 101 as an example. In a preferred embodiment, the width of the ground pad 111 may be 200 μm, but not limited thereto, the position and shape of the ground pad 111. The size can be designed according to the design requirements.

First, in order to adhere the tape to the predetermined area, an appropriate size tape may be directly adhered to the predetermined area 101, or a large piece of the entire tape may be adhered to the circuit substrate 11 first, and then the tape may be slotted by the laser. At the edge of the predetermined area, the tape outside the predetermined area 101 is removed later to achieve the purpose of adhering the tape 13 in the predetermined area 101.

The electronic component 21 is mounted on the assembly plane 12 and located outside the predetermined area 101, and the assembly method can be performed by Surface Mount Technology (SMT), and the electronic component 21 can be an element other than the photovoltaic component, for example, Various main and passive components are not limited thereto. The photoelectric components described herein generally refer to various components that are not suitable for being covered by the mold block, such as image sensing components such as CMOS image sensors and CCDs, and light-emitting diodes. Other illuminating elements, even other elements that are also unsuitable for being covered by the mold block, such as connectors, sockets, joints, etc., can also be placed in predetermined areas using the concepts of the present invention; in addition, can be adapted to be molded The block wrapper is called an electronic component.

In addition, referring to FIG. 2, it is an embodiment of the manufacturing method of the electronic package module of the present invention, wherein the predetermined area 102 shown in FIG. 2 is an irregular predetermined area, that is, the predetermined area 102 is an irregular shape, so the so-called The predetermined area has no limitation on the number, the size of the area, and the shape. The shapes of the drawings are merely illustrative of the present invention and are not limited thereto. The predetermined area is mainly framed according to the position of the photoelectric element which is not suitable to be covered by the mold block 15 in the subsequent process. Therefore, it should be noted that the detailed implementations described hereinafter can be applied to the predetermined areas 101 and 102.

Referring to FIGS. 1A and 1B, after the foregoing steps are completed, a mold block 15 is formed on the entire circuit substrate 11, wherein the mold block 15 is covered on the circuit substrate 11 together with the tape 13, and the mold block 15 is further covered. The electronic component 21 other than the predetermined area 101 and the ground pad 111. The mold block 15 can be formed by a general transfer molding or a press molding method, and the adhesive tape 13 can be partially covered or not adjacent to the ground pad 111, but is not limited thereto.

Referring to 1C and 1D, after the molding block 15 is formed, the molding block 15 around the predetermined area 101 can be slotted by laser, that is, the groove is cut along the range of the ground pad 111. In the embodiment, the groove width is about 100 μm. The ground pad 111 is a metal layer, and the main material of the mold block 15 usually contains a resin. Therefore, the ground pad 111 can be used as the laser cutting end end by using the ground pad 111 and the mold block 15 to different degrees of laser absorption. The invention is not limited to this concept as long as it can be achieved It is only necessary to cut the mold block 15 while leaving the circuit substrate 11. For example, the mold block 15 may be grooved by external cutting. It should be emphasized that the present invention adopts laser cutting, and the mold block does not need to reserve a draft angle (for example, about 20 degrees), so that the side wall of the mold block 15 facing the predetermined area 101 and the assembly plane 12 after the slotting is performed. The angle α formed may be between 85 and 90 degrees, which is closer to 90 degrees than the draft angle of a conventional plastic seal.

When the selected tape is a film, for example, a thickness of 20 to 50 micrometers (micrometer, μm), at this time, as long as the tape 13 is removed, it is possible to leave only the mold block 15 at a position other than a predetermined area on the circuit substrate 11. The tape 13 can be a pyrolytic tape or a UV tape. The pyrolyzed tape can be removed by heating. In a preferred embodiment, the environment can be heated to about 175 ° C, and any The tape can be removed by the suction device, and the photo-degradable film can be removed by ultraviolet light irradiation, but the present invention is not limited to the two tapes.

In another example of the present invention, when the selected tape is a thick film, for example, having a thickness of 0.2 millimeters (mm), the laser can be utilized after the completion of the use of the laser to sew the mold block 15 above the predetermined area. The molding block 15 on the predetermined area 101 (i.e., the molding block 15 on the tape 13) is further trimmed, that is, the molding block 15 on the predetermined area 101 is removed, and then the tape 13 is removed. It is achieved that only the mold block 15 remains at a position other than the predetermined area 101 on the circuit substrate 11.

In another example of the present invention, the electromagnetic shielding layer 19 is further covered and electrically connected to the ground pad 111 for the molding block 15 other than the predetermined region 101, and the process of the photovoltaic element 22 is disposed in the predetermined region 101.

3A-3E, a flow chart and a cross-sectional view of one embodiment of forming a photovoltaic element 22 in a predetermined region 101 in accordance with the present invention. In this embodiment, after the tape 13 is removed in the foregoing embodiment (as shown in FIG. 3A), a mask layer 18 (FIG. 3B) is disposed on the assembly plane 12 in the predetermined area 101, and the material of the mask layer 18 is provided. There is no particular limitation as long as the subsequent removal can be facilitated, and then an electromagnetic shielding layer 19 (see FIG. 3C) can be formed over the entire surface, and the metal shielding layer 19 can be sprayed with metal (spray). Coating, electroless plating, or sputtering, but not limited thereto, as long as the electromagnetic shielding layer 19 and the ground pad 111 are electrically connected, so as long as the cover is removed The cover layer 18 can achieve the purpose of covering the electromagnetic shielding layer 19 and electrically connecting the ground shielding pad 19 to the molding block 15 other than the predetermined area 101 ( FIG. 3D ), thereby generating a metal shielding effect on the electronic component 21 . Then, the photovoltaic element 22 is disposed in the predetermined region 101 (as shown in FIG. 3E), and the photovoltaic element 22 can be disposed by the surface adhesion technology (SMT), and not limited thereto, according to which the photovoltaic element 22 can be not molded. The block coating further protects the electronic component 21 from electromagnetic disturbance (EMI).

Another example of the present invention, please refer to FIGS. 4A-4D, which are a flow chart and a cross-sectional view of another embodiment of forming a photovoltaic element 22 in a predetermined region 101 of the present invention. In this embodiment, after the foregoing embodiment uses the laser to slot the molding block 15 around the predetermined area 101 (as shown in FIG. 4A), a layer of electromagnetic shielding layer 19 is formed directly (FIG. 4B). The metal shielding layer 19 is formed in the same manner as the foregoing example, and the electromagnetic shielding layer 19 is electrically connected to the grounding pad 111. Then, as long as the tape 13 is removed, the molding for the predetermined area 101 can be achieved. The block 15 covers the electromagnetic shielding layer 19 and electrically connects it to the ground pad 111 (as shown in FIG. 4C), thereby generating a metal shielding effect on the electronic component 21, and then disposing the photovoltaic element 22 in the predetermined region 101 (as shown in FIG. 4D), the photovoltaic element 22 is disposed in the same manner as the foregoing example, and accordingly, the present embodiment can save more steps, time, and raw materials in the process than the foregoing embodiment. It should be noted that the embodiment of FIGS. 4A-4B directly forms the electromagnetic shielding layer 19. In practical applications, if the distance between the molding blocks 15 and the height of the molding block 15 itself are affected, the metal shielding layer 19 is not The grounding pad 111 is electrically connected to protect the electromagnetic component 22 from the electromagnetic interference of the electronic component 21 after the tape 13 is removed, as shown in FIGS. 3A-3E.

In addition, in order to further increase the effectiveness of shielding electromagnetic interference, please refer to FIG. 5 , which is a cross-sectional view of an embodiment of a method for manufacturing an electronic package module including a side ground pad 112 according to the present invention. All of the foregoing embodiments of the present invention may further include a side ground pad 112. The time point and the number of formations on the side of the circuit substrate 11 are not particularly limited as long as the electromagnetic shielding layer 19 is also electrically connected to the side ground pad 112.

Applying the above process, the present invention can provide an embodiment of a method for manufacturing a double-sided electronic package module, and the details of most of the steps can be referred to the foregoing process. Referring to FIGS. 6A-6I, in FIG. 6A, the electronic component 41 is disposed outside a predetermined area of the first surface of the circuit substrate 31, the tape 33 is attached to the predetermined area, the ground pad 311 is surrounded by the predetermined area, and the side of the substrate 31 is A side ground pad 312 is formed, wherein the electronic component 41 belongs to a lower height, and thus the tape 33 adhered to the first surface of the circuit substrate 31 can be made thicker than the electronic component 41.

Next, a mold block 35 is formed on the first surface of the wiring substrate 31. Since the tape 33 is thick, the height of the mold block 35 can be just aligned with the tape 33, so that the mold block 35 can completely cover the electronic component 41, as shown in Fig. 6B. Further, since the height of the mold block 35 is exactly the same as that of the tape 33, when the electromagnetic shielding layer 39 is to be formed later, the step of removing the mold block on the tape can be omitted and the sputtering can be directly performed.

Next, the mold block 35 formed on the first surface of the circuit substrate 31 is grooved as shown in FIG. 6C, and in order to facilitate the subsequent formation of the electromagnetic shielding layer 39, the groove can be opened wider to facilitate sputtering.

Next, sputtering is performed on the film block 35 which is grooved on the first surface of the circuit substrate 31, and then covered with an ink layer 37 as shown in Fig. 6D. Ink 37 is mainly used to protect the cleaning of the covered area in the process, to avoid the contamination of dust and other impurities. The ink 37 can be washed away with a chemical solvent to take away the material on the surface of the ink, leaving a clean covered surface. .

Referring to FIG. 6E again, the circuit substrate 31 is turned over to start packaging the second surface of the circuit substrate 31. First, the tape 53 is adhered to a predetermined area, the predetermined area of the side is opposite to the first surface, the periphery is a predetermined area, and the central portion is an unscheduled area, so the ground pad 511 is surrounded by the predetermined area on the inner side, and the side of the electron The element 61 has a high height, so a thinner tape 53 can be used. It should be noted that, in this embodiment, all the differences on both sides of the circuit substrate 31 are taken as an example to fully describe all the preferred ones. The applicable level is not intended to limit the present invention. The height of the electronic component is not related to the inner and outer positions of the predetermined area, and the combination of the height of the electronic component and the thickness of the tape is also convenient for the process, and may be required according to the situation. change.

After the electronic component 61 is disposed outside the predetermined range of the second surface of the circuit substrate, the mold block 55 can be formed as shown in FIG. 6F. The tape 53 is then removed along with the mold block 55 thereon, and an ink 57 is additionally formed on a predetermined area of the second surface, as shown in Fig. 6G. Then, the entire circuit substrate may be sputtered or first cut to form an individual single module and then sputtered so that the top outer surface of the individual module forms an electromagnetic shielding layer 59, as shown in FIG. 6H. .

Next, the inks 37, 57 are washed away, and the tape 33 is removed, and the circuit substrate 31 on which both sides of the substrate have been selectively molded and each of which has a complete electromagnetic shielding layer 39, 59 is obtained. Then, as long as the photovoltaic elements 42 and 62 are disposed at predetermined regions, the package can be completed, as shown in FIG. 6I.

It should be emphasized that the embodiment of the two-sided package is not intended to limit the present invention. If the predetermined areas of both sides are at the center, a complete electromagnetic shielding layer may be directly formed on both sides, that is, no additional ink 37 is required. The electromagnetic shielding layer 59 can directly form both sides of the substrate to the electromagnetic shielding layer 39 directly after the steps of FIG. 6C to save the process.

In summary, the present invention can provide a method for manufacturing an electronic package module, which uses a first adhesive tape on a circuit substrate and a line to remove a mold block formed thereon, thereby forming a partial mold on the circuit substrate. The purpose of the block, wherein the method forms a partial mold block whose angle with the substrate can be closer to a right angle. Thereafter, the photovoltaic element not covered by the mold block may be disposed on a predetermined area of the moldless block, and an electromagnetic shielding layer is formed on the mold block to further protect the electromagnetic interference and prevent the photoelectric element from being molded. The coating of the block affects the operation, and the invention can be applied to the selective encapsulation of the two-sided electronic module, and the dual-sided electronic module selective packaging is completed at a low cost and a compact process.

11‧‧‧Line substrate

111‧‧‧Grounding mat

12‧‧‧ Assembly plane

15‧‧‧Mold block

19‧‧‧Electromagnetic shielding

21‧‧‧Electronic components

22‧‧‧Optoelectronic components

Claims (10)

An electronic package module includes: a circuit substrate including a first assembly plane, at least one first ground pad, and a first predetermined area, wherein the first predetermined area and the first ground pads are located in the first assembly a plane; at least one electronic component disposed on the first assembly plane outside the first predetermined area; at least one first molding block covering the electronic components, each first molding block facing the first The angle between the sidewall of the predetermined area and the first assembly plane is between 85 degrees and 90 degrees; a first electromagnetic shielding layer covers the mold block and is electrically connected to the ground pads. The electronic package module of claim 1, further comprising: a second assembly plane, at least one second ground pad, and a second predetermined area, wherein the second predetermined area and the second ground pads are located at the second An assembly plane; the electronic components are disposed on the second assembly plane outside the second predetermined area; at least one second mold block encasing the electronic components, each second mold block facing the first The angle between the sidewall of the second predetermined area and the second assembly plane is between 85 degrees and 90 degrees; a second electromagnetic shielding layer covering the second molding block and the second grounding pad Electrical connection. The electronic package module of claim 1, wherein the circuit substrate further comprises at least one ground pad on a side of the circuit substrate, wherein the first electromagnetic shielding layer is electrically connected to the side ground pads. A method of manufacturing an electronic package module, comprising: Providing a circuit substrate including a first assembly plane, at least one first ground pad, and a first predetermined area, wherein the first predetermined area and the first ground pads are located in the first assembly plane; Adhesively bonding a first adhesive tape to the first assembly area; and forming a first mold block on the first assembly surface, wherein the first mold is formed on the first assembly area And sealing the first tape and the electronic components; removing the first molding block located at the first predetermined area; and removing the first tape. The manufacturing method of claim 4, further comprising the steps of: providing the circuit substrate, comprising: a second assembly plane, at least one second ground pad, and a second predetermined area, wherein the second predetermined area and the second predetermined area a second grounding pad is located on the second assembly plane; a second tape is adhered in the second predetermined area; the electronic components are disposed on the second assembly plane outside the second predetermined area; Forming a second mold block on the plane, wherein the second mold block covers the second tape and the electronic components; removing the second mold block located at the second predetermined area; and removing the second mold block tape. The manufacturing method of claim 4, wherein before the first tape is pasted in the first predetermined area, the method further comprises the steps of: attaching a complete first tape to the entire surface of the circuit substrate; a complete first tape over the first ground pad; and removing the complete first tape outside the first predetermined area. The manufacturing method of claim 4, wherein the step of removing the first tape In the middle, the first tape is peeled off by heating. The manufacturing method according to claim 4, wherein the first adhesive tape is a photo-decomposing film, and in the step of removing the first adhesive tape, the first adhesive tape is irradiated with ultraviolet rays. The manufacturing method according to claim 4, further comprising the step of disposing at least one photovoltaic element in the first predetermined area. The manufacturing method of claim 4, wherein after the removing the first tape, further comprising the steps of: forming a first mask layer in the first predetermined region; forming a first electromagnetic shielding layer, and The first ground pads are electrically connected; and the first mask layer is removed.